Electroless Cu-Ni Coating-Carbon Fiber - 2001
Electroless Cu-Ni Coating-Carbon Fiber - 2001
Electroless Cu-Ni Coating-Carbon Fiber - 2001
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Abstract
EMI shielding effectiveness of copper- and nickel-coated carbon fiber-reinforced ABS composites was investigated. The coaxial
transmission line method was used to measure the EMI shielding effectiveness of the metal-coated carbon fibers/ABS composites.
The carbon fibers were coated with copper or nickel using the cementation and electroless deposition techniques. Measurements
of fiber length distribution in the composites indicated that the length of copper-coated carbon fibers was shorter than that of
nickel-coated carbon fibers after composite fabrication. As a result, their composites also showed poor EMI shielding
effectiveness. Among the metal-coated carbon fibers/ABS composites studied in this investigation, electroless nickel-coated carbon
fibers/ABS composites showed the best EMI shielding capability due to longer fiber length distribution and excellent bonding
between nickel coating and the fibers. The metal coatings, deposited using the cementation technique, tended to detach from the
fibers during the compounding process, and consequently, poor EMI shielding effectiveness was obtained for their composites.
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S.-S. Tzeng, F.-Y. Chang / Materials Science and Engineering A302 (2001) 258–267 259
metal coatings and different deposition techniques on tural parameters and electrical resistivity of these two
the EMI shielding effectiveness of metal-coated carbon types of fibers measured in our laboratory.
fiber-reinforced polymer matrix composites. In the
present investigation, two metal coatings, copper and 2.2. Metalization of carbon fibers
nickel, will be deposited on the carbon fibers respec-
tively using both cementation and electroless tech- Nickel and copper coated carbon fibers were used in
niques. The EMI shielding effectiveness of these this study in order to increase the conductivity of
metal-coated carbon fiber-reinforced polymer matrix carbon fibers, and consequently the EMI shielding ef-
composites will be measured and compared. fectiveness of their composites. Two deposition meth-
ods, electroless plating and cementation technique, were
adopted.
2. Experimental The electroless nickel coatings were deposited on
carbon fibers of 12 cm long using alkaline bath contain-
2.1. Materials ing nickel sulfate as the source of nickel and sodium
hypophosphite as the reducing agent. Table 2 lists the
Two types of PAN-based carbon fibers were used in bath composition and deposition conditions (tempera-
this study. They were TORAYCA T300C and T700SC, ture and pH value). Before deposition, the sizing of
manufactured by Toray Industries, Inc. in Japan. The carbon fibers was removed by immersing them into the
T300C fibers have a crosssection of kidney shape with acetone solution for 40 min, and they were then cata-
an average diameter of 7.2090.10 mm and the T700SC lyzed. A two-step pretreatment, sensitization and acti-
fibers have a circular cross-section with an average vation, was used for catalyzing the carbon fibers. The
diameter of 7.2490.42 mm. Table 1 shows the struc- sensitizer and activator were stannous chloride/hydro-
chloric acid (20 g l − 1 SnCl2·2H2O and 40 ml l − 1 HCl)
Table 1 and palladium chloride/hydrochloric acid (0.25 g l − 1
Structural parameters and electrical resistivity of carbon fibers PdCl2 and 2.5 ml l − 1 HCl) solutions, respectively.
Ultrasonic vibration was applied during the catalyza-
Fiber type d002 (A, ) Lc (A, )a Electrical resistivity (mVm)
tion treatment to facilitate uniform activation through-
T300C 3.53 17 16.01 9 0.85 out the entire surface of the carbon fibers. For the
T700C 3.52 17 15.73 9 0.81 electroless copper plating, the deposition bath contains
copper sulfate as the source of nickel, formaldehyde as
a
The stacking height Lc of the (002) layer planes was calculated
the reducing agent, sodium potassium tartrate as the
using Scherrer Formula and was calibrated for instrumental broaden-
ing using silicon as the standard. chelating agent, and sodium hydroxide as the buffering
agent. Table 3 lists the bath composition and deposi-
Table 2 tion conditions (temperature and pH value). Same fiber
Formulations and operation conditions of electroless nickel plating pre-treatments were used as that of electroless nickel
batha plating.
The cementation technique [14] is a simple method,
Chemical Formula Amount (g l−1)
which was borrowed from extractive metallurgy. The
Sodium hypophosphite NaH2PO2·H2O 20 principle of the cementation reaction is the displace-
Nickel sulfate NiSO4·6H2O 40 ment of a noble metal ion from a salt solution by a
Sodium citrate NaC6H5O7·2H2O 100 more reactive metal. Before deposition, the sizing of
Ammonium chloride NH4Cl 50 carbon fibers was removed by two different methods:
Ammonium hydroxide NH4OH pH adjustment
(1) immersing them into the acetone solution for 40
a
Bath temperature: 7090°C; pH value: 79; time: 110 min. min; or (2) heating under a nitrogen atmosphere to
700°C for 15 min. After removal of the sizing, they
Table 3 were then dipped in a known amount of glacial acetic
Formulations and operation conditions of electroless copper plating acid to activate the fiber surface for improving the
batha wettability of the carbon fiber surface with the metal to
Chemical Formula Amount
be coated. Nickel sulfate (NiSO4·6H2O, 70 g l − 1) and
copper sulfate (CuSO4·5H2O, 50 g l − 1) solutions were
Copper sulfate CuSO4·5H2O 20 g l−1 used, respectively in the deposition of nickel and cop-
Formaldehyde HCHO 5 ml l−1 per. Copper and nickel were deposited onto the carbon
Sodium potassium NaKC4H4O6·4H2O 25 g l−1
fiber from the corresponding salt solutions using two
tartrate
Sodium hydroxide NaOH pH adjustment
different displacing agents (Mg and Zn), which were in
the form of powders. All the depositions were carried
a
Bath temperature: 5070°C; pH value: 1113; time: 110 min. out at 90°C for 10 min.
260 S.-S. Tzeng, F.-Y. Chang / Materials Science and Engineering A302 (2001) 258–267
parameters (d002 and Lc) and electrical resistivity as 3 shows the SEM micrographs of electroless copper-
indicated in Table 1. However, the difference in surface coated T300C (Fig. 3a and b) and T700SC (Fig. 3(c)
condition will affect the adhesion between the fiber and and (d)) carbon fibers. Unlike the nickel, copper poorly
the metal coating as will be discussed later. Fig. 2 wets carbon [22]. Compared with the electroless nickel
shows the SEM micrographs of electroless nickel coated coating which shows good adhesion with carbon fiber
carbon fibers. The electroless nickel films could be surface, debonding was observed in electroless copper
deposited on the surface of both T300C and T700SC coating as indicated in Fig. 3. Also, the degree of
fibers with good adhesion as indicated in Fig. 2(a) and bonding is worse for T700SC carbon fibers with smooth
(c). It could be seen in Fig. 2(a) that the electroless surface and circular cross section when compared with
nickel layer was deposited following the contour of that for T300C carbon fibers, which show rough surface
non-circular cross section of T300C carbon fibers. It is and surface striation and have a non-circular cross-sec-
shown in Fig. 2(b) that reasonable uniformity of coat- tion. For T700SC fibers, the coating could be torn
ing thickness in the fiber bundle could be obtained. Fig. apart from the fiber easily as shown in Fig. 3(d),
whereas only debonding was observed for T300SC
fibers as shown in Fig. 3(b). Poor bonding was also
found for copper-coated carbon fibers using both elec-
troless plating and the cementation technique [13]. As
will be discussed later, the degree of bonding plays an
important role in the EMI shielding effectiveness of
metal-coated carbon fibers reinforced polymer matrix
composites.
Table 4 shows the result of deposition by the cemen-
tation technique for different types of carbon fibers and
different methods of removing sizing, and using differ-
ent displacing agents. It was found that deposition was
not successful when the sizing was removed by acetone.
However, metal coating could be formed when the
sizing was removed by heat treatment at 700°C under a
nitrogen atmosphere. It seems that heat treatment at
700°C not only removed the sizing, but also activated
the surface of carbon fibers. Table 4 also indicated a
strong influence of surface condition on the deposition.
Deposition on T700SC carbon fibers with a smooth
surface was not successful, whereas continuous coating
could be deposited on T300C carbon fibers, which show
surface striations as indicated in Fig. 1(a). For the
effect of reducing agent used in this study, Zn was
found to yield the better results. Non-continuous coat-
ing could be observed when using Mg as reducing agent
presumably due to the high reactivity of Mg. Fig. 4
shows the SEM micrographs of nickel-coated carbon
fibers by the cementation technique using Zn as the
reducing agent. As compared with electroless nickel
coating, which was deposited uniformly on the T300C
carbon fibers following the contour of the fiber surface
(Fig. 2a and b), poor bonding and non-uniform coating
were observed for cementation nickel on the same type
of fibers as shown in Fig. 4(a). Also, unlike the electro-
less nickel coating, which could be coated uniformly on
the individual fiber inside the fiber bundle, connection
of fibers by the coating was observed as shown in Fig.
4(b). Fig. 5(a) and (b) show the SEM micrographs of
copper-coated carbon fibers by the cementation tech-
nique using Zn and Mg as the reducing agent, respec-
Fig. 2. SEM micrographs of electroless nickel-coated carbon fibers: tively. As shown in Fig. 5(a), the morphology of
(a), (b) T300C and (c) T700SC. cementation copper coatings using Zn as the reducing
262 S.-S. Tzeng, F.-Y. Chang / Materials Science and Engineering A302 (2001) 258–267
Fig. 3. SEM micrographs of electroless copper-coated carbon fibers: (a), (b) T300C and (c), (d) T700SC.
Table 4
Results of deposition using cementation techniquea
Mg × × × × × ×
Zn × × × × × ×
a
Note: indicates continuous coating, × indicates not coated, and indicates non-continuous coating.
agent is similar to that of cementation nickel. However, (111) peak was obtained in the pattern (a) of Fig. 6 for
a morphology of massive crystallites with facet was electroless nickel coating.
observed when using Mg as the reducing agent. A
massive crystallite structure without facet was observed 3.2. Conducti6ity of metal coating and EMI shielding
by Pai et al. [15] using Zn as the reducing agent. effecti6eness of composites
Fig. 6 shows the X-ray diffraction patterns of metal-
coated carbon fibers using the electroless and cementa- As discussed previously in the X-ray diffraction re-
tion deposition techniques. Besides the electroless nickel sults, crystalline nickel coatings were obtained using the
coating, crystalline metals were obtained by the cemen- cementation method, whereas amorphous or microcrys-
tation technique and electroless copper deposition. It is talline Ni –P alloy was deposited by the electroless
well established that the electroless nickel deposits using technique. Table 5 shows the measurement results of
sodium hypophosphite as a reducing agent are binary electrical resistivity of T700SC carbon fibers before and
alloys of nickel and phosphorus [23]. It was also re- after electroless nickel deposition. If we consider that
ported that the deposits plated from alkaline solution the fiber and Ni –P coating are two resistors in parallel,
had a lower phosphorus content and were crystalline, a resistivity of 1.4 mVm was calculated for the Ni –P
whereas the deposits from acid solution had a higher coating itself. This value is consistent with that (0.6 –1.4
phosphorus content and were known as amorphous or mVm) reported in the literature on Ni –P film with high
microcrystalline [24 – 26]. Therefore, a broad nickel phosphorus content [27]. It is obvious that the resistiv-
S.-S. Tzeng, F.-Y. Chang / Materials Science and Engineering A302 (2001) 258–267 263
Evidence of this could also be observed in the fracture posites as shown in the curve (d) and (f) of Fig. 7 in
surfaces of their composites as shown in Fig. 9. In Fig. spite of the lower electrical conductivity of electroless
9(a), the good bonding of the electroless nickel coating Ni –P coating as discussed previously. It was also noted
could be observed at the pull-out portion of the fibers. that although the ENCF/ABS composites has a lower
However, detachment of nickel coating from the fibers fiber volume fraction (12 –14%) compared with that
was found when using the cementation technique as (20%) of CF/ABS composites, a higher EMI SE value
shown in Fig. 9(c). The striations of the original fiber was obtained for ENCF/ABS composites due to the
surface could be seen clearly. As a result of good much higher electrical conductivity of electroless nickel-
bonding, the ENCF/ABS composites showed much bet- coated carbon fibers considering the relatively similar
fiber length distribution of both composites. On the
ter EMI shielding effectiveness than CNCF/ABS com-
other hand, the EMI shielding effectiveness of CNCF/
ABS composites was slightly lower than that of CF/
ABS composites. In addition to the higher fiber volume
fraction of CF/ABS composites and the detachment of
nickel coating from the fibers when using the cementa-
tion technique, that the number of longer fibers (400 –
700 mm) in CF/ABS composites (Fig. 8e) is more than
that in CNCF/ABS composites (Fig. 8c) may also
contribute to this result. Similar results were also ob-
tained for copper-coated CF/ABS composites. The
ECCF/ABS composites showed better EMI shielding
effectiveness than CCCF/ABS composites as shown in
curve (b) and (c) in Fig. 7 presumably due to the better
adhesion of copper coating by the electroless technique
as indicated in Fig. 9(b) and Fig. 9(d). Electroless
copper coatings on the pull-out fibers could be seen in
the fracture surface of ECCF/ABS composites as indi-
cated by the arrow sign in Fig. 9(b). On the other hand,
most of the cementation copper coatings were peeled
off and the striations of the original fiber surface were
revealed as indicated in Fig. 9(d). The fiber length
distribution of ECCF/ABS composites was also slightly
longer than that of CCCF/ABS composites as shown in
Fig. 8(a) and Fig. 8(b). It has been reported [13] that
the ultimate tensile strength of electroless copper-coated
carbon fibers is much higher than that of cementation
copper-coated carbon fibers. Also, the tensile fracture
of both electroless and cementation copper-coated car-
bon fibers showed delamination of the coating, which
suggested poor bonding between coating and the fiber.
As a result, the copper coating tended to be peeled off
during the compounding process, especially for cemen-
tation copper coatings as shown in Fig. 9(b) and Fig.
9(d).
Among the metal-coated CF/ABS composite samples
used in this study, ENCF/ABS composites performed
best in EMI shielding effectiveness. In fact, the EMI
shielding effectiveness of other samples was even worse
than that of CF/ABS composites without metal coat-
ings based on the same weight percentage of fibers. As
previously discussed, in addition to the good adhesion
between nickel coating and the fiber, the fiber length
distribution of ENCF/ABS composites, which was
Fig. 8. The fiber length distributions of various metal-coated carbon
fibers reinforced ABS composites: (a) CCCF/ABS composites, (b)
comparable to that of CF/ABS composite samples, is
ECCF/ABS composites, (c) CNCF/ABS composites, (d) ENCF/ABS also an important factor. On the other hand, it is
composites, and (e) CF/ABS composites. interesting to note that a copper coating, regardless of
266 S.-S. Tzeng, F.-Y. Chang / Materials Science and Engineering A302 (2001) 258–267
Fig. 9. Fracture surfaces of various metal-coated carbon fibers reinforced ABS composites: (a) ENCF/ABS composites, (b) ECCF/ABS
composites, (c) CNCF/ABS composites, (d) CCCF/ABS composites, and (e) CF/ABS composites.
per-coated carbon fibers/ABS composites showed poor [4] P.B. Jana, A.K. Mallick, J. Elastomers Plastics 26 (1994) 58.
EMI shielding effectiveness due to a shorter fiber length [5] W.-Y. Chian, Y.-S. Chiang, J. Appl. Polym. Sci. 46 (1992) 673.
[6] M.S. Ahmad, A.M. Zihilif, E. Martuscelli, G. Ragosta, E.
distribution after composite fabrication. Among the Scafora, Polym. Compos. 13 (1992) 53.
metal-coated carbon fibers/ABS composites studied in [7] C.-Y. Huang, J.-F. Pai, Eur. Polym. J. 34 (1998) 261.
this investigation, electroless nickel-coated carbon [8] C.-Y. Huang, J.-F. Pai, J. Appl. Polym. Sci. 63 (1997) 115.
fibers/ABS composites showed the best EMI shielding [9] G. Lu, X. Li, H. Jiang, Comp. Sci. Tech. 56 (1996) 193.
capability. In spite of the lower electrical conductivity [10] R. Warren, C.H. Anderson, M. Carlsson, J. Mater. Sci. 13
of electroless Ni – P coating compared with that of (1978) 178.
[11] J.S. Brinen, Surf. Interf. Anal. 10 (1987) 29.
cementation nickel, EMI shielding effectiveness of the [12] S. Abraham, B.C. Pai, K.G. Satyanarayana, V.K. Vaidyan, J.
electroless nickel-coated carbon fibers/ABS composites Mater. Sci. 25 (1990) 2839.
is better due to excellent bonding between the electro- [13] S. Abraham, B.C. Pai, K.G. Satyanarayana, V.K. Vaidyan, J.
less nickel coating and the fibers. The bonding between Mater. Sci. 27 (1992) 3479.
metal coating and the fibers is not satisfactory when the [14] A.G. Kulkarni, B.C. Pai, N. Balasubramanian, J. Mater. Sci. 14
(1979) 592.
cementation method was used to deposit a metal layer.
[15] B.C. Pai, A.G. Kulkarni, N. Balasubramanian, J. Mater. Sci.
As a result, the metal coating tended to detach during Letter 15 (1980) 1860.
compounding process, and consequently, poor EMI [16] L.B. Coleman, Rev. Sci. Instrum. 46 (1975) 1125.
shielding effectiveness was obtained for their [17] M. Koedam, Philips Tech. Rev. 27 (1966) 208.
composites. [18] S.-S. Tzeng, R.J. Diefendorf, in: Extended Abstracts of 19th
Biennial Conference on Carbon, American Carbon Society,
1989, p. 298.
[19] A.J. Perry, B. Ineichen, B. Eliasson, J. Mater. Sci. 9 (1974) 1376.
Acknowledgements [20] K.-J. Chen, Ph.D Dissertation, Rensselaer Polytechnic Institute,
1984.
The financial supports from the National Science [21] W.-Y. Chiang, Y.-S. Chiang, J. Appl. Polym. Sci. 46 (1992) 673.
Council of the Republic of China under the contracts [22] D.A. Mortimer, M. Nicholas, J. Mater. Sci. 5 (1970) 149.
No. NSC 83-0405-E-036-001T and No. NSC 84-2216- [23] G.O. Mallory, J.B. Hajdu, Electroless Plating: Fundamental and
Applications, American Electroplaters and Surface Finishers So-
E-036-020 are highly acknowledged.
ciety, 1992.
[24] S.L. Chow, N.E. Hedgecock, M. Schiensinger, J. Rezek, J. Elect.
Chem. Soc. 119 (1972) 1614.
References [25] K. Sugita, N. Ueno, J. Elect. Chem. Soc. 131 (1984) 111.
[26] S.H. Park, D.N. Lee, J. Mater. Sci. 23 (1988) 1643.
[1] C.-C.M. Ma, A.T. Hu, D.K. Chen, Polym. Polym. Compos. 1 [27] T. Osaka, M. Usuda, I. Koiwa, H. Sawai, Jpn. J. Appl. Phys. 27
(1993) 93. (1988) 1885.
[2] P.B. Jana, A.K. Mallick, S.K. De, IEEE Trans. Electromagnetic [28] T.-W. Chiou, The Effects of Processing Cycles on the Properties
Compatibility 34 (1992) 478. of the ABS Conductive Composites, MS Thesis, Tatung Univer-
[3] P.K. Pramanik, D. Khastgir, T.N. Saha, J. Elastomers Plastics sity, 1994.
23 (1991) 345. [29] C.-Y. Huang, T.-W. Chiou, Eur. Polym. J. 34 (1998) 37.