Ipad 4 Schematic

Apple iPad 4 LTE A1459
Quad-Band GSM/EDGE
W-CDMA/HSPA+ (850 / 900 / 1900/ 2100 MHz)
LTE (700 / 1700 MHz)
Sample Report
Product Description
The Cellular Apple iPad 4 A1459 tablet, which Apple officially
calls the “iPad with Retina Display,” is the company’s fourth-
generation model in this family. It features a 9.7-in. LED-backlit
TFT-LCD Retina Display with QXGA (2048 x 1536) resolution,
16M colors, and multitouch capacitive touchscreen with Gorilla
Glass overlay. It runs the iOS 6.0 operating system on a dual-
core 1.4 GHz Apple A6X SoC with quad-core graphics and 1
GB RAM. It also features 32 GB of internal memory (16 GB
and 64 GB models also available) but lacks a memory card
slot for external storage. There are also two cameras: a rear-
facing 5 MP BSI CMOS “iSight” camera with autofocus, LED
flash, and HD (1080p) video capability; and a front-facing 1.2
MP “Facetime HD” camera with HD (720p) video capability.
Connectivity is provided by WiFi 802.11a/b/g/n, Bluetooth 4.0,
GPS, microUSB 2.0, and a USB “Lightning” port (in place
of the previous Dock Connector port). Sensors include an
accelerometer, gyroscope, compass, and ambient light sensor.
The iPad 4 A1459 is powered by a large-capacity 3.7 V, 11,560
mAh Li-Polymer battery that supplies a listed 10 hours of use
Learn more... time and 720 hours of standby.
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses
are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes
that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any
information in this document, and shall bear no liability whatsoever for the use of the information.
Copyright © 2014, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion
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© 2014, TechInsights
Deep Dive Teardown

Deep Dive Teardown
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Description Integrated Circuit Metrics

Product Type Tablet IC Die Count** 85
Brand Apple IC Package Count** 64
Product Name & Model # iPad 4 LTE A1459
Cost Metrics
Official Release Date 11/16/2012
Weight (grams) 662 Retail Price $729.00
Product Dimensions (mm) 242 x 186 x 9.4 Total Manufacturing Cost* $326.27
Electronics Cost** $216.29
Product Features
Manufacturing Cost Breakdown
Operating System iOS 6.0
Integrated Circuits $117.09 35.9%
Quad-Band GSM/EDGE; Quad-Band W-CDMA/ Modules, Discretes & Connectors $17.73 5.4%
Communications HSPA+; LTE (700 MHz-Band XVII/1700 MHz-
Band IV) Substrates $12.35 3.8%
WiFi 802.11n, Bluetooth 4.0, GPS, Component Insertion $8.14 2.5%
Connectivity
microUSB 2.0, "Lightning" Port Card Test $0.65 0.2%
Use Time: 10 hours Battery Subsystem $20.27 6.2%
Battery Life
Standby: 720 hours Display / Touchscreen Subsystem $112.73 34.6%
Dual-Core 1.4 GHz A6X SoC w/ Quad-Core
Processor Camera Subsystems $16.31 5.0%
Graphics & 1 GB RAM
Multitouch Capacitive Touchscreen; Home Non-Electronic Parts $17.75 5.4%
Interface
Key; Up/Down Keys; Mute Key Final Assembly & Test $3.25 1.0%
Internal: 32 GB Total $326.27 100.0%
Storage
External: N/A
*Excluding Supporting Materials' Cost
Accelerometer; Gyroscope; Compass;
Sensors **Including Subsystems
Ambient Light
Key Subsystems
Battery 3.7 V, 11,560 mAh, Li-Polymer
Display 9.7" TFT-LCD; 2048 x 1536 Pixels (264 ppi); 16,777,216 Colors; Gorilla Glass
Main Camera 5.0 MP BSI CMOS, Autofocus, LED Flash, "iSight" HD Video (1080p)
Secondary Camera 1.2 MP BSI CMOS, "Facetime HD" Video (720p)
Front Page Product Overview Block Diagram Product Packaging Exterior Features Major Components Component Arrangement Teardown Antenna Subsystems Main Board Other Substrates Costs and Metrics Overview & Discussion
Deep Dive Teardown
38 - Analog Devices Applications Processor
GPS Antenna #AD7149
Capacitance Sensor Controller
Main
25 - Infineon Antenna Rx Diversity
#BGM1032N7 Antenna
GPS / GLONASS Front-End Module
32 - Murata
33 - Murata #SWUA ?
#D06 ? Diversity Rx Antenna Switch
RF Antenna Switch w/ SAW Filters
DUPL
28 - Skyworks 30 - TriQuint 29 - Avago 31 - Skyworks 27 - Skyworks

#SKY77497 #TQM666084 #AFEM-7814 #SKY77352 #SKY77729
W-CDMA Bands II & V PA W-CDMA Band VIII PA W-CDMA Band I & LTE Band IV PA Quad-Band GSM PA LTE Band XVII PA
22 - Qualcomm
#RTR8600
GSM / CDMA / W-CDMA / LTE RxD
Transceiver + GPS Baseband Processor
Estimated block diagram based on observation of this specific product

implementation, manufacturer’s data sheets where available, and best
engineering judgment. Certain details of the interface circuitry are not
reflected in this block diagram. Partitioning and connectivity are speculative.
Page 1 Page 2 Page 3
Deep Dive Teardown
WiFi / BT Antenna
3 - Apple / Dialog Semi To Battery
#343S0622-A1 / D2018
Power Management
18 - USI
15 - TI To Touchscreen
#CD3240B0
#339S0175 Touchscreen Line Driver ?
WiFi 802.11a/b/g/n / Bluetooth / FM Radio Vibrator
Lightning
23 - Winbond 17 - Broadcom
#W25Q16DWBYIG #BCM5973A1
26 - Qualcomm Serial Flash Memory - 2 MB
#PM8018 8 - NXP Semiconductor Touchscreen Controller
Power Management #CBTL1608A1
Display Port Multiplexer ?
16 - Broadcom To Touchscreen
21 - Qualcomm #BCM5974
Transceiver #MDM9615M 1 - Apple Touchscreen Controller
Multimode Baseband #A6X / APL5598
Processor Dual-Core Applications Processor (CPU)
w/ Memory w/ Quad-Core GPU To Display
M
14 - SK Hynix
SI
#H9TCNNN4KDBMUR-NGM
14 -Memory
Multichip SK Hynix
-
Capacitance Sensor Controller #H9TCNNN4KDBMUR-NGM
512 MB Mobile DDR2-S4 SDRAM
Multichip Memory -
512 MB Mobile DDR2-S4 SDRAM
46 - AMS
#TSL2583
Ambient Light Sensor Camera
35 - STMicroelectronics
45 - OmniVision #L3G4200DH
#OV2C3BH ? 3-Axis MEMS Gyroscope
1.2 MP BSI CMOS Image Sensor
Camera
47 - OmniVision #LIS331DLH
#OV5650 3-Axis MEMS Accelerometer
5 MP BSI CMOS Image Sensor
Microphone
5 - Apple / Cirrus Logic
#338S1116 / CLI1586A1 37 - AKM Semiconductor
Audio CODEC #AK8975B
Headset 3-Axis Electronic Compass
Speaker
4 - Apple / Cirrus Logic 2 - SanDisk
#338S1077 / CS35L19 #SDMALBB4 032G
Audio Amplifier Multichip Memory - 32 GB MLC iNAND
Flash, Memory Controller
Speaker
4 - Apple / Cirrus Logic
#338S1077 / CS35L19 Estimated block diagram based on observation of this specific product
Audio Amplifier implementation, manufacturer’s data sheets where available, and best
Deep Dive Teardown
To Power Management
To Touchscreen Line Driver and Touchscreen Controller
To Applications Processor
Display Touchscreen
40 - Seiko Instruments 41 - Seiko Instruments
#S-8244 #S-8211
Secondary Battery Protection Battery Protection IC
44 - TI
#BQ7541 Battery
Battery Fuel Gauge
50 - Samsung
#S6CG246X01
50 - Samsung
TFT-LCD Display Row Driver
#S6CG246X01
50 - Samsung
#S6CG246X01
50 - Samsung
#S6CG246X01
53 - Parade Technologies
#DP635
Display Port Timing Controller
49 - Samsung
#S6C24A1X01
52 - Integrated Memory Logic 49 - Samsung
TFT-LCD Display Column Driver
#Iml7990 #S6C24A1X01
Programmable Gamma Buffer 49
TFT-LCD Display- Samsung
Column Driver
#S6C24A1X01
49
TFT-LCD Display - Samsung
Column Driver
#S6C24A1X01
49
Column Driver
51 - RichTek #S6C24A1X01
#RT9966GQW ? 49
Column Driver
Power Management #S6C24A1X01 Estimated block diagram based on observation of this specific product
TFT-LCD Display Column Driver implementation, manufacturer’s data sheets where available, and best
Deep Dive Teardown
Total Estimated
Cost of Supporting Materials: $5.20
Packaging - $0.90
Documentation - $0.10
SIM Card Extractor - $0.05
AC Adapter - $2.40
USB / Lightning Cable - $1.75
Supporting Materials Label
Deep Dive Teardown
Supporting Materials Label
Deep Dive Teardown
Front
Camera
Ambient
Light Sensor
Capacitive
Touchscreen Home Key
Top Bottom Backlights
Deep Dive Teardown
On/Off &
Sleep/Wake Key
Rear
Camera
Microphone
Micro SIM Card Tray
Micro SIM Card Release 3.5 mm Headset Jack
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Side 1 Side 2
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Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8
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Main
Antenna Element
Length Width Height
50.0 mm 35.0 mm 0.2 mm
RF Proximity Sensor
Connection to Interconnect Board
This is an image of the opposite

side of the antenna with the
outer plastic layer scraped away.
Note: The Main Antenna is the only flex antenna that has
two metal layers, which have a concentric pattern creating a
capacitive RF Proximity Sensor used to detect the presence
Grid = 1 cm
of a hand nearby. A hand would change the capacitance and
therefore trigger the reduction of the RF power transmitted.
Main Antenna Diversity Antenna WiFi & Bluetooth Antenna GPS Antenna
Deep Dive Teardown
Rx Diversity
Antenna Element
Length Width Height
20.5 mm 46.2 mm 0.2 mm
Grid = 1 cm
Deep Dive Teardown
WiFi/Bluetooth
Antenna Element
Length Width Height
30.0 mm 11.0 mm 0.2 mm
Grid = 1 cm
Deep Dive Teardown
GPS
Antenna Element
Length Width Height
21.4 mm 23.6 mm 0.2 mm
Grid = 1 cm
Deep Dive Teardown
Battery Pack Estimated Cost
Battery Camera Display / Touchscreen
Deep Dive Teardown
Battery Pack
Pack Brand Apple
Pack Part Number A1389
Pack Voltage 3.7
Cell Type Lithium Polymer
Pack Rating (mAHrs) 11560
Pack Size (mm) 198 x 126 x 4
Vol. Energy Density (mWHrs/cc) 428.6
Pack Weight (grams) 209.0
Wt. Energy Density (mWHrs/g) 204.7
Cell Brand ATL
Cell(s) $11.76
Electronic Parts $1.70
Non-electronic Parts $0.09
Estimated Costs
Assembly $0.54
Test $0.10
Markup $6.08
Estimated Pack Price $20.27
41 - Seiko Instruments 44 - TI
#S-8211 #BQ7541
Battery Protection IC Battery Fuel Gauge
Grid = 1 cm 40 - Seiko Instruments

#S-8244
Secondary Battery Protection
Battery Pack Estimated Cost
Deep Dive Teardown
Secondary Camera
Brand Unknown
Part Number Unknown
Subsystem Size (mm) 15.8 x 10.6 x 3.9
Camera Size (mm) 15.8 x 10.6 x 3.7
Subsystem Weight (grams) 0.6
Camera Weight (grams) 0.5
Type CMOS
Resolution 1 MP
46 - AMS Optical Size 1/5
#TSL2583 Lens Elements 4
Ambient Light Sensor Optical Zoom 1
Grid = 1 cm Non-Electronic Parts $1.07
Estimated Costs Assembly $0.18
Test $0.10
Markup $1.67
Estimated Module Price $5.55
45 - OmniVision
#OV2C3BH ?
1.2 MP BSI CMOS Image Sensor
Grid = 1 cm
Front Rear
Deep Dive Teardown
Main Camera
Brand Unknown
Part Number MFC3612
Subsystem Size (mm) 8.6 x 8.5 x 5.3
Camera Size (mm) 8.5 x 8.5 x 6.8
Subsystem Weight (grams) 0.9
Camera Weight (grams) 1.4
Type CMOS
Resolution 5 MP
Optical Size 1/3.2
Lens Elements 5
Optical Zoom 1
Grid = 1 cm
Non-Electronic Parts $1.36
Estimated Costs Assembly $0.28
Test $0.15
Markup $3.23
47 - OmniVision
#OV5650
5 MP BSI CMOS Image Sensor
48 - Rohm
#Unknown
Grid = 1 cm Autofocus VCM Driver
Front Rear
Deep Dive Teardown
50 - Samsung
#S6CG246X01
49 - Samsung
#S6C24A1X01
TFT-LCD Display Column Driver
Touchscreen
51 - RichTek 56 - Rohm
#RT9966GQW ? #BR24T16-W
Power Management (3-Die Pkg.) Serial EEPROM Memory - 2 KB
52 - Integrated Memory Logic 53 - Parade Technologies

#iML7990 #DP635
Programmable Gamma Buffer Display Port Timing Controller
54 - Ricoh 55 - TI
#RP111L071D #TPS62260
500 mA / 0.7 V LDO Regulator 600 mA Step-Down DC-DC Converter
IC Identification Estimated Cost
Deep Dive Teardown
Display / Touchscreen Module

Brand Samsung
Part Number LQ097L1JY11
Module Dimensions 238.2 x 182.7 x 3.69
Weight (grams) 240.60
View Size (mm) 197.104 x 147.828
Type TFT
Panel Metrics Colors 16777216
Rows / Columns 1536 / 2048
Backlighting Scheme 84 White LEDs
Panel(s) $12.12
Circuit Assembly $1.87
Estimated Costs Non-Electronic Parts $11.40
Final Assembly $0.28
Test $0.35
Markup $39.57
Note: The Display / Touchscreen cost includes

the Cover Glass. The original report was posted
with the Display and Touchscreen as separate
subsystems; the Cover Glass was originally
categorized as part of the Main Non-Electronics.
The original overall cost will differ from this
revised report.
Per today’s teardown techniques we now group

the Display, Touchscreen, and Cover Glass as
one subsystem.
IC Identification Estimated Cost
Deep Dive Teardown
WiFi/Bluetooth Antenna
Home Button Board

Touchscreen Interconnect Flex
Docking Flex
Display
Speaker
Battery
Grid = 1 cm
Side 1 Side 1 IC Identification Side 1 X-Ray & Die Photos Side 2 Side 2 IC Identification Side 2 X-Ray & Die Photos Cross-Section
Deep Dive Teardown
13 - TI 10 - NXP Semiconductor 1 - Apple 6 - TI

#SN74AUP1G08 #74LVC1G32 #A6X / APL5598 #SN74AVCH4T245
Single 2-Input Positive AND Gate Single 2-Input OR Gate Dual-Core Applications Processor 4-Bit Dual-Supply Bus Transceiver
(CPU) w/ Quad-Core GPU
4 - Apple / Cirrus Logic 7 - TI 5 - Apple / Cirrus Logic

#338S1077 / CS35L19 #TPS61045 #338S1116 / CLI1586A1
Audio Amplifier Adjustable LCD Boost Converter Audio CODEC
8 - NXP Semiconductor 3 - Apple / Dialog Semiconductor 2 - SanDisk 9 - TI

#CBTL1608A1 #343S0622-A1 / D2018 #SDMALBB4 032G #SN74LVC1T45
Display Port Multiplexer ? Power Management Multichip Memory - 32 GB MLC iNAND Single-Bit Bus Transceiver
Flash, Memory Controller (5-Die Pkg.)
12 - NXP Semiconductor 11 - NXP Semiconductor

#74LVC1G126 #74LVC1G125G
Grid = 1 cm Bus Buffer / Line Driver Tri-State Buffer
Deep Dive Teardown
2 - SanDisk 2.2 - SanDisk

#SDMALBB4 032G #EHL9-64G
Multichip Memory - 32 GB MLC iNAND Flash, Memory Controller (5-Die Pkg.) MLC iNAND Flash Memory - 8 GB
Pkg Size: 17 x 12 mm Die Size: 15.87 x 7.83 mm
2.1 - SanDisk
#ANOBIT
Memory Controller
Die Size: 5.6 x 2.81 mm
Deep Dive Teardown
Radio Board
Grid = 1 cm
Deep Dive Teardown
14 - SK Hynix 15 - TI 16 - Broadcom
#H9TCNNN4KDBMUR-NGM #CD3240B0 #BCM5974
Multichip Memory - 512 MB Mobile DDR2-S4 SDRAM (2-Die Pkg.) Touchscreen Line Driver ? Touchscreen Controller
18 - USI 17 - Broadcom 19 - Silego

#339S0175 #BCM5973A1 #SLG59M301V
WiFi 802.11a/b/g/n / Bluetooth / FM Radio (4-Die Pkg.) Touchscreen Controller 4 A Load Switch
*Broadcom BCM4334 inside

Grid = 1 cm
Deep Dive Teardown
14 - SK Hynix 14.1 - SK Hynix

#H9TCNNN4KDBMUR-NGM #H5LR2D23AFR
Multichip Memory - 512 MB Mobile DDR2-S4 SDRAM (2-Die Pkg.) Mobile DDR2-S4 SDRAM Memory - 256 MB
Pkg Size: 11 x 11 mm Die Size: 7.75 x 4.94 mm
Image 1 Image 2 Image 3
Deep Dive Teardown
18.3 - Skyworks 18.2 - Skyworks 18 - USI
#457B12 #458A01 #339S0175
RF Power Amplifier RF LNA WiFi 802.11a/b/g/n / Bluetooth / FM Radio (4-Die Pkg.)
Die Size: 1.5 x 0.75 mm Die Size: 1.4 x 0.65 mm Pkg Size: 10.4 x 6.6 mm
18.4 - TriQuint 18.1 - Broadcom

#W2056B #BCM4334
RF Power Amplifier / LNA WiFi 802.11a/b/g/n / Bluetooth / FM Radio
Die Size: 1.45 x 1.45 mm Die Size: 4.66 x 4.1 mm
Deep Dive Teardown
18.3 - Skyworks 18.2 - Skyworks 18 - USI
#457B12 #458A01 #339S0175
RF Power Amplifier RF LNA WiFi 802.11a/b/g/n / Bluetooth / FM Radio (4-Die Pkg.)
Die Size: 1.5 x 0.75 mm Die Size: 1.4 x 0.65 mm Pkg Size: 10.4 x 6.6 mm
18.4 - TriQuint 18.1 - Broadcom

#W2056B #BCM4334
RF Power Amplifier / LNA WiFi 802.11a/b/g/n / Bluetooth / FM Radio
Die Size: 1.45 x 1.45 mm Die Size: 4.66 x 4.1 mm
Deep Dive Teardown
Deep Dive Teardown
21 – Qualcomm* 20 - TI 22 - Qualcomm
#MDM9615M #TPD4E101 #RTR8600
Multimode Baseband Processor w/ Memory (2-Die Pkg.) 4-Ch. ESD Protection GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS
23 - Winbond 24 - Murata ? 25 - Infineon

#W25Q16DWBYIG #2S7 EA ? #BGM1032N7
Serial Flash Memory - 2 MB Dual SPDT Antenna GPS / GLONASS Front-End Module
Switch ? (2-Die Pkg.)
Grid = 1 cm * Die and Xrays images are available.
Side 1 Side 2
Radio Boad Interconnect Board Side Key Flex
Deep Dive Teardown
26 - Qualcomm 28 – Skyworks* 27 – Skyworks* 30 – TriQuint* 34 - Maxim

#PM8018 #SKY77497 #SKY77729 #TQM666084 #Unknown
Power Management W-CDMA Bands II & V LTE Band XVII Power W-CDMA Band VIII DC-DC Converter ?
Power Amplifier (2-Die Pkg.) Amplifier (2-Die Pkg.) Power Amplifier
29 – Avago* 32 – Murata* 31 – Skyworks*

#AFEM-7814 #SWUA ? #SKY77352 33 – Murata*
W-CDMA Band I & LTE Band IV Diversity Rx Antenna Switch Quad-Band GSM Power #D06 ?
Power Amplifier (3-Die Pkg.) w/ SAW Filters (2-Die Pkg.) Amplifier (2-Die Pkg.) RF Antenna Switch
Grid = 1 cm * Die and Xrays images are available.
Side 1 Side 2
Deep Dive Teardown
#L3G4200DH
3-Axis MEMS Gyroscope (2-Die Pkg.)
#LIS331DLH
3-Axis MEMS Accelerometer (2-Die Pkg.)
Grid = 1 cm
Side 1 Side 2
Deep Dive Teardown
37 - AKM Semiconductor
#AK8975B
3-Axis Electronic Compass
38 - Analog Devices
#AD7149
Capacitance Sensor Controller
Note: This Capacitance Sensor Controller notifies the

system to back off on the RF power when it senses
the presence of a hand via the RF Proximity Sensor.
Grid = 1 cm
Side 1 Side 2
Deep Dive Teardown
Volume
Grid = 1 cm
Side 1 Side 2
Deep Dive Teardown
39 - AKM Semiconductor ?
Mute #AK5836 ?
Hall Effect Sensor
Interconnect Board
On/Off &
Grid = 1 cm Sleep/Wake
Note: Additional Substrate images were made available in the original report.
Side 1 Side 2
Deep Dive Teardown
Substrates
Min. Min.
ThruVia ThruVia BlindVia BlindVia
Assembly Area Trace Trace Thickness Routing Estimated
Manufacturer Core Material Mfg. Technology Layers Land Dia Hole Dia Land Dia Hole Dia
Name (cm²) Pitch Width (mm) Density Costs
(mm) (mm) (mm) (mm)
(mm) (mm)
Docking Flex Unknown Polyimide 4 Layer flex w/vias 4 6.6 0.40 0.20 0.40 0.20 0.3 41.6 $ 1.66
Home Button Board Unknown FR4 2 Layer conventional FR4 / HF 2 1.6 0.40 0.20 0.50 0.20 0.2 16.4 $ 0.02
Interconnect Board Multek Hong Kong FR4 10 Layer buildup FR4 / HF 10 9.1 0.20 0.10 0.50 0.25 0.30 0.10 0.8 32.6 $ 0.85
Interconnect Flex Nippon Mektron Polyimide 4 Layer flex w/vias 4 13.5 0.15 0.08 0.30 0.15 0.3 5.5 $ 3.39
Main Board AT&S FR4 10 Layer buildup FR4 / HF 10 39.0 0.20 0.10 0.50 0.25 0.25 0.10 0.8 75.5 $ 3.63
Microphone Flex Unknown Polyimide 2 Layer flex w/vias 3 1.8 0.15 0.08 0.30 0.10 0.2 12.0 $ 0.37
Radio Board Ibiden FR4 10 Layer buildup FR4 / HF 10 13.0 0.15 0.08 0.25 0.10 0.7 69.3 $ 1.21
Side Key Flex Multi-Fineline Electronix Polyimide 2 Layer flex w/vias 2 2.6 0.20 0.10 0.50 0.20 0.1 18.2 $ 0.42
SIM Card Flex Unknown Polyimide 2 Layer flex w/vias 3 3.9 0.20 0.10 0.50 0.25 0.2 9.2 $ 0.81
Substrates Integrated Circuits Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Assembly Metrics Electronic Costs Breakdown Vendor IC Cost Distribution Non-Electronic Cost Estimate Final Ass’y Labor & Test Cost Cost Summary
Deep Dive Teardown
Package Info Die Info Estimated Costs
Location
Pkg Length Width Height Length Width
Pkg Ref. # Brand Name Part Number Pkg Description Form Pin Count Die Ref # Die Qty Brand Name Part Number Description Each Total
Qty (mm) (mm) (mm) (mm) (mm)
1 1 Apple A6X / APL5598 Dual-Core Applications Processor (CPU) w/ Quad-Core GPU BGA (UF) 1089 16.90 16.90 1.20 1.1 1 Apple A6X / APL5598 Dual-Core Applications Processor (CPU) w/ Quad-Core GPU 12.30 10.80 $ 39.540 $ 39.540
2.1 1 SanDisk ANOBIT Memory Controller 5.60 2.81 $ 0.950 $ 0.950
2 1 SanDisk SDMALBB4 032G Multichip Memory - 32 GB MLC iNAND Flash, Memory Controller BGA Stacked 5 (UF) 60 17.00 12.00 1.06
2.2 4 SanDisk EHL9-64G MLC iNAND Flash Memory - 8 GB 15.87 7.83 $ 3.510 $ 14.040
3 1 Apple 343S0622-A1 / D2018 Power Management Flip Chip, Solder (UF) 296 8.94 5.55 1.10 3.1 1 Dialog Semiconductor 343S0622-A1 / D2018 Power Management 8.94 5.55 $ 3.320 $ 3.320
4 2 Apple 338S1077 / CS35L19 Audio Amplifier Flip Chip, Solder (UF) 42 3.20 2.73 0.80 4.1 1 Cirrus Logic 338S1077 / CS35L19 Audio Amplifier 3.20 2.73 $ 0.600 $ 1.200
5 1 Apple 338S1116 / CLI1586A1 Audio CODEC Flip Chip, Solder (UF) 100 4.30 4.30 0.80 5.1 1 Cirrus Logic 338S1116 / CLI1586A1 Audio CODEC 4.30 4.30 $ 1.510 $ 1.510
6 1 TI SN74AVCH4T245 4-Bit Dual-Supply Bus Transceiver QFN 16 2.60 1.80 0.90 6.1 1 TI SN74AVCH4T245 4-Bit Dual-Supply Bus Transceiver 1.28 1.15 $ 0.160 $ 0.160
Main Board, Side 1
7 1 TI TPS61045 Adjustable LCD Boost Converter DFN 8 3.00 3.00 1.10 7.1 1 TI TPS61045 Adjustable LCD Boost Converter 1.41 1.17 $ 0.140 $ 0.140
8 1 NXP Semiconductor CBTL1608A1 Display Port Multiplexer ? Flip Chip, Solder (UF) 36 2.10 2.09 0.80 8.1 1 NXP Semiconductor CBTL1608A1 Display Port Multiplexer ? 2.10 2.09 $ 0.330 $ 0.330
9 1 TI SN74LVC1T45 Single-Bit Bus Transceiver Flip Chip, Solder (UF) 6 1.40 0.91 0.90 9.1 1 TI SN74LVC1T45 Single-Bit Bus Transceiver 1.40 0.91 $ 0.100 $ 0.100
10 1 NXP Semiconductor 74LVC1G32 Single 2-Input OR Gate DFN 6 1.00 1.00 0.90 10.1 1 NXP Semiconductor 74LVC1G32 Single 2-Input OR Gate 0.51 0.34 $ 0.040 $ 0.040
11 1 NXP Semiconductor 74LVC1G125G Tri-State Buffer DFN 6 1.40 1.00 0.90 11.1 1 NXP Semiconductor 74LVC1G125G Tri-State Buffer 0.56 0.38 $ 0.040 $ 0.040
12 1 NXP Semiconductor 74LVC1G126 Bus Buffer / Line Driver DFN 6 1.40 1.00 0.90 12.1 1 NXP Semiconductor 74LVC1G126 Bus Buffer / Line Driver 0.56 0.38 $ 0.040 $ 0.040
13 1 TI SN74AUP1G08 Single 2-Input Positive AND Gate BGA 6 1.00 1.00 0.90 13.1 1 TI SN74AUP1G08 Single 2-Input Positive AND Gate 0.56 0.38 $ 0.040 $ 0.040
14 2 SK Hynix H9TCNNN4KDBMUR-NGM Multichip Memory - 512 MB Mobile DDR2-S4 SDRAM BGA Stacked 2 (UF) 225 11.00 11.00 0.70 14.1 2 SK Hynix H5LR2D23AFR Mobile DDR2-S4 SDRAM Memory - 256 MB 7.75 4.94 $ 1.210 $ 4.840
15 1 TI CD3240B0 Touchscreen Line Driver ? BGA (UF) 121 6.00 6.00 0.50 15.1 1 TI CD3240B0 Touchscreen Line Driver ? 3.25 3.19 $ 1.080 $ 1.080
16 1 Broadcom BCM5974 Touchscreen Controller BGA (UF) 81 5.00 5.00 0.57 16.1 1 Broadcom BCM5974 Touchscreen Controller 3.25 3.19 $ 1.230 $ 1.230
17 1 Broadcom BCM5973A1 Touchscreen Controller BGA (UF) 119 7.00 7.00 0.56 17.1 1 Broadcom BCM5973A1 Touchscreen Controller 4.83 4.34 $ 2.180 $ 2.180
Main Board, Side 2 18.1 1 Broadcom BCM4334 WiFi 802.11a/b/g/n / Bluetooth / FM Radio 4.66 4.10 $ 3.960 $ 3.960
18.2 1 Skyworks 458A01 RF LNA 1.40 0.65 $ 0.200 $ 0.200
18 1 USI 339S0175 WiFi 802.11a/b/g/n / Bluetooth / FM Radio MCP - 4 Chips (UF) 52 10.40 6.60 0.75
18.3 1 Skyworks 457B12 RF Power Amplifier 1.50 0.75 $ 0.260 $ 0.260
18.4 1 TriQuint W2056B RF Power Amplifier / LNA 1.45 1.45 $ 0.460 $ 0.460
19 1 Silego SLG59M301V 4 A Load Switch DFN 8 2.00 1.50 1.10 19.1 1 Silego SLG59M301V 4 A Load Switch 1.59 0.98 $ 0.120 $ 0.120
20 1 TI TPD4E101 4-Ch. ESD Protection DFN 4 0.80 0.80 0.35 20.1 1 TI TPD4E101 4-Ch. ESD Protection 0.35 0.35 $ 0.030 $ 0.030
21.1 1 Micron M100ACD ? Mobile DDR SDRAM Memory - 128 MB ? 7.57 3.66 $ 0.780 $ 0.780
21 1 Qualcomm MDM9615M Multimode Baseband Processor w/ Memory BGA Stacked 2 (UF) 383 9.00 9.00 0.95
21.2 1 Qualcomm HG11-N3877 Multimode Baseband Processor 7.28 5.80 $ 21.490 $ 21.490
Radio Board, Side 1 22 1 Qualcomm RTR8600 GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS BGA (UF) 196 7.80 6.20 0.90 22.1 1 Qualcomm HG11-VF535-220 GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS 6.59 3.99 $ 3.910 $ 3.910
23 1 Winbond W25Q16DWBYIG Serial Flash Memory - 2 MB Flip Chip, Solder (UF) 8 2.70 1.76 0.80 23.1 1 Winbond W25Q16DWBYIG Serial Flash Memory - 2 MB 2.70 1.76 $ 0.160 $ 0.160
24 1 Murata ? 2S7 EA ? Dual SPDT Antenna Switch ? MCP - 2 Chips (UF) 10 1.50 1.10 0.80 24.1 2 Murata ? 25SJ ? SPDT Antenna Switch 0.33 0.33 $ 0.050 $ 0.100
25 1 Infineon BGM1032N7 GPS / GLONASS Front-End Module DFN 6 2.26 1.68 0.90 25.1 1 Infineon BGM1032N7 GPS / GLONASS Front-End Module 1.00 0.53 $ 0.210 $ 0.210
26 1 Qualcomm PM8018 Power Management Flip Chip, Solder (UF) 106 4.46 3.90 0.80 26.1 1 Qualcomm HG11-VU756-210 Power Management 4.46 3.90 $ 1.190 $ 1.190
27.1 1 Skyworks 31087 01 Bias Control 0.70 0.40 $ 0.030 $ 0.030
27 1 Skyworks SKY77729 LTE Band XVII Power Amplifier MCP - 2 Chips 10 3.00 3.00 0.95
27.2 1 Skyworks 94031_34 RF Power Amplifier 1.00 0.90 $ 0.210 $ 0.210
28.1 1 Skyworks RP1629_1 Bias Control 0.71 0.31 $ 0.070 $ 0.070
28 1 Skyworks SKY77497 W-CDMA Bands II & V Power Amplifier QFN Stacked 2 30 6.00 4.50 0.95
29.1 1 Avago 4DT7A Bias Control 0.77 0.57 $ 0.190 $ 0.190
29 1 Avago AFEM-7814 W-CDMA Band I & LTE Band IV Power Amplifier MCP - 3 Chips 30 6.00 4.50 0.81 29.2 1 Avago PBS1 RF Power Amplifier 0.95 0.88 $ 0.990 $ 0.990
Radio Board, Side 2 29.3 1 Avago PBS3 RF Power Amplifier 0.87 0.72 $ 0.730 $ 0.730
30 1 TriQuint TQM666084 W-CDMA Band VIII Power Amplifier QFN 14 4.50 3.50 1.00 30.1 1 TriQuint TQM666084 W-CDMA Band VIII Power Amplifier 1.53 0.99 $ 0.980 $ 0.980
31.1 1 Skyworks 31531 02 Power Amplifier Controller 0.98 0.98 $ 0.120 $ 0.120
31 1 Skyworks SKY77352 Quad-Band GSM Power Amplifier MCP - 2 Chips 14 5.00 3.50 1.00
32.1 1 Peregrine C9941_1 RF Antenna Switch 1.21 1.16 $ 1.020 $ 1.020
32 1 Murata SWUA ? Diversity Rx Antenna Switch w/ SAW Filters MCP - 2 Chips 24 4.50 4.20 1.40
32.2 1 Murata XM0825SX RF Switch ? 1.20 0.80 $ 0.380 $ 0.380
33 1 Murata D06 ? RF Antenna Switch QFN 20 3.00 3.00 1.10 33.1 1 Peregrine C9930_2 RF Antenna Switch 1.98 1.25 $ 0.880 $ 0.880
34 1 Maxim Unknown DC-DC Converter ? Flip Chip, Solder 9 1.57 1.56 0.90 34.1 1 Maxim Unknown DC-DC Converter 1.57 1.56 $ 0.170 $ 0.170
35.1 1 STMicroelectronics V654A Gyroscope Processor 2.56 2.56 $ 0.430 $ 0.430

35 1 STMicroelectronics L3G4200DH 3-Axis MEMS Gyroscope QFN Stacked 2 16 4.00 4.00 1.00
35.2 1 STMicroelectronics GK10A MEMS Sensor 3.10 3.00 $ 2.930 $ 2.930
Interconnect Board, Side 1
36.1 1 STMicroelectronics V583A Accelerometer Processor 2.19 1.52 $ 0.240 $ 0.240
36 1 STMicroelectronics LIS331DLH 3-Axis MEMS Accelerometer QFN Stacked 2 16 3.00 3.00 0.98
36.2 1 STMicroelectronics CSL12B MEMS Sensor 2.10 1.94 $ 1.380 $ 1.380
37 1 AKM Semiconductor AK8975B 3-Axis Electronic Compass Flip Chip, Solder 14 2.00 2.00 0.80 37.1 1 AKM Semiconductor AK8975B 3-Axis Electronic Compass 2.00 2.00 $ 0.470 $ 0.470
38 1 Analog Devices AD7149 Capacitance Sensor Controller Flip Chip, Solder (UF) 25 2.20 2.00 0.80 38.1 1 Analog Devices AD7149 Capacitance Sensor Controller 2.20 2.00 $ 0.410 $ 0.410
Side Key Flex, Side 2 39 1 AKM Semiconductor ? AK5836 ? Hall Effect Sensor SOP 4 2.11 1.20 0.80 39.1 1 AKM Semiconductor ? AK5836 ? Hall Effect Sensor 0.76 0.71 $ 0.050 $ 0.050
Totals 41 3489 60 $117.09
(UF) = Underfilled
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Deep Dive Teardown
Note: The ICs listed below are for reference only.

Their costs are integrated into the cost of the individual subsystems.
Estimated
Package Info Die Info
Costs
Location
Pkg Length Width Height Length Width
Pkg Ref. # Brand Name Part Number Pkg Description Form Pin Count Die Ref # Die Qty Brand Name Part Number Description Each Total
Qty (mm) (mm) (mm) (mm) (mm)
40 1 Seiko Instruments S-8244 Secondary Battery Protection DFN 8 2.10 1.90 0.90 40.1 1 Seiko Instruments S-8244 Secondary Battery Protection 1.24 1.18 $ 0.120 $ 0.120
Battery Pack: Battery Board 41 1 Seiko Instruments S-8211 Battery Protection IC DFN 6 1.50 1.50 0.90 41.1 1 Seiko Instruments S-8211 Battery Protection IC 1.14 0.78 $ 0.080 $ 0.080
44 1 TI BQ7541 Battery Fuel Gauge DFN 12 4.00 2.50 0.90 44.1 1 TI BQ7541 Battery Fuel Gauge 2.39 1.92 $ 0.320 $ 0.320
45 1 OmniVision OV2C3BH ? 1.2 MP BSI CMOS Image Sensor Other - Surface Mount 16 5.90 5.40 1.10 45.1 1 OmniVision OV2C3BH ? 1.2 MP BSI CMOS Image Sensor 4.32 4.15 $ 2.010 $ 2.010
Secondary Camera: Secondary Camera Flex
46 1 AMS TSL2583 Ambient Light Sensor DFN 6 1.90 1.90 0.80 46.1 1 AMS TSL2583 Ambient Light Sensor 1.65 1.10 $ 0.140 $ 0.140
47 1 OmniVision OV5650 5 MP BSI CMOS Image Sensor Other - Surface Mount 31 8.60 8.50 1.00 47.1 1 OmniVision OV5650 5 MP BSI CMOS Image Sensor 6.54 6.06 $ 4.520 $ 4.520
Main Camera: Main Camera Flex
48 1 Rohm Unknown Autofocus VCM Driver Flip Chip, Solder 6 1.30 0.95 0.80 48.1 1 Rohm Unknown Autofocus VCM Driver 1.30 0.95 $ 0.110 $ 0.110
49 6 Samsung S6C24A1X01 TFT-LCD Display Column Driver Flip Chip, Adhesive 1225 20.90 1.30 0.22 49.1 1 Samsung S6C24A1X01 TFT-LCD Display Column Driver 20.90 1.30 $ 1.510 $ 9.060
Display / Touchscreen Module:
50 4 Samsung S6CG246X01 TFT-LCD Display Row Driver Flip Chip, Adhesive 668 14.30 0.80 0.12 50.1 1 Samsung S6CG246X01 TFT-LCD Display Row Driver 14.30 0.80 $ 0.690 $ 2.760
51.1 1 RichTek Unknown MOSFET ? 0.59 0.51 $ 0.030 $ 0.030

51 1 RichTek RT9966GQW ? Power Management MCP - 3 Chips 28 5.00 4.00 0.70 51.2 1 RichTek RT436D2 DC-DC Converter ? 1.65 0.75 $ 0.100 $ 0.100
51.3 1 RichTek RT248F DC-DC Converter ? 2.49 1.74 $ 0.350 $ 0.350
52 1 Integrated Memory Logic iML7990 Programmable Gamma Buffer QFN 32 5.00 5.00 0.80 52.1 1 Integrated Memory Logic iML7990 Programmable Gamma Buffer 2.98 2.95 $ 0.650 $ 0.650
Display / Touchscreen Module: Display Board
53 1 Parade Technologies DP635 Display Port Timing Controller BGA 119 12.00 5.00 1.00 53.1 1 Parade Technologies DP635 Display Port Timing Controller 4.83 3.01 $ 1.440 $ 1.440
54 1 Ricoh RP111L071D 500 mA / 0.7 V LDO Regulator DFN 6 1.20 1.20 0.70 54.1 1 Ricoh RP111L071D 500 mA / 0.7 V LDO Regulator 0.73 0.56 $ 0.050 $ 0.050
55 1 TI TPS62260 600 mA Step-Down DC-DC Converter DFN 6 2.00 2.00 0.80 55.1 1 TI TPS62260 600 mA Step-Down DC-DC Converter 1.44 0.85 $ 0.090 $ 0.090
56 1 Rohm BR24T16-W Serial EEPROM Memory - 2 KB DFN 8 3.00 2.00 0.80 56.1 1 Rohm BR24T16-W Serial EEPROM Memory - 2 KB 1.17 0.77 $ 0.100 $ 0.100
Totals 23 10306 25 $21.93
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Deep Dive Teardown
Estimated
Package
Costs
Location Qty Brand Name Part Number Description
Pin Length Width
Each Total
Count (mm) (mm)
1 Unknown Unknown Shielding: Large 1 38.50 18.20 $ 0.040 $ 0.040
1 Unknown A238L Crystal: Ceramic 2 2.00 1.10 $ 0.200 $ 0.200
Main Board, Side 1 1 Unknown T240 Crystal: Ceramic 4 2.00 1.50 $ 0.200 $ 0.200
1 Unknown Unknown Speaker: Dual Assembly w/ Acoustic Chamber 6 74.00 16.00 $ 1.600 $ 1.600
1 Unknown 821-1728 Antenna: Film - WiFi/Bluetooth w/ Coax Cable 1 30.00 11.00 $ 0.200 $ 0.200

Main Board, Side 2
1 Murata Unknown Filter: SAW 5 1.00 0.92 $ 0.070 $ 0.070

Radio Board, Side 1

1 Sawtek Unknown Crystal: Ceramic 4 2.60 2.10 $ 0.200 $ 0.200
1 Unknown 821-1546-A Antenna: Film - Rx Diversity w/ Support & Cable 1 20.50 46.20 $ 0.250 $ 0.250
1 Shanghai Amphenol Airwave (SAA) 821-1565-A Antenna: Film - Main w/ Support & Cable (RF Prox.) 1 50.00 35.00 $ 0.350 $ 0.350
Radio Board, Side 2 1 Murata Unknown Filter: SAW 5 1.00 0.90 $ 0.070 $ 0.070
1 Murata Unknown Filter: SAW - Duplexer 9 1.75 1.39 $ 0.290 $ 0.290
1 Tyco Electronics 821-1598-A Antenna: Film - GPS w/ Cable 1 21.40 23.60 $ 0.200 $ 0.200
Home Button Board, Side 1 1 Unknown Unknown Switch: SMT - Home Button 4 3.90 3.80 $ 0.070 $ 0.070
Side Key Flex, Side 1 2 Unknown Unknown Switch: SMT - Volume 4 3.20 2.80 $ 0.070 $ 0.140
1 Unknown Unknown Switch: SMT - On/Off & Sleep/Wake 4 3.20 2.80 $ 0.070 $ 0.070
Side Key Flex, Side 2
1 Unknown Unknown Switch: SMT - Slide - Mute 6 8.00 2.20 $ 0.100 $ 0.100
Microphone Flex, Side 1 1 Knowles SPK0833LM4H-B Microphone: MEMS 4 3.90 2.90 $ 0.270 $ 0.270
TOTALS 30 102 $4.98
Deep Dive Teardown
Package Estimated Costs

Location Qty Functional Description
Length Width
Form Top Marking Pin Count Each Total
(mm) (mm)
1 Small Active Diode, SMT BF t28 2 2.60 1.60 $0.015 $0.015
Main Board, Side 1 2 Small Active Diode, SMT JH 2 1.40 1.00 $0.015 $0.030
1 Small Active Diode, SMT SD 2 2.00 1.50 $0.015 $0.015
4 Small Active MOSFET - Flip Chip 58874 34047 6 1.40 0.97 $0.090 $0.360
Main Board, Side 2 4 Small Active Diode, SMT 2 1.00 0.60 $0.015 $0.060
8 Small Active Diode, SMT 2 0.60 0.30 $0.015 $0.119
Interconnect Board, Side 1 2 Small Active Diode, SMT V 2 0.50 0.30 $0.015 $0.030
Interconnect Flex, Side 1 7 Small Active Diode, SMT 2 0.60 0.30 $0.015 $0.104
TOTALS 29 74 $0.73
Deep Dive Teardown
Estimated
Package
Costs
Location Qty Functional Description
Form Pin Count Each Total
3 Coil SMT, Small 2 $0.050 $0.150

1 Coil SMT, Small 2 $0.080 $0.080
10 Coil SMT, Small 2 $0.050 $0.500
Main Board, Side 1
1 Coil SMT, Small 2 $0.050 $0.050
2 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.100
356 Small Passive Cap, Res, Ferrite 2 $0.004 $1.424

12 Small Passive Cap, Res, Ferrite Array 4 $0.007 $0.089
Main Board, Side 2
8 Small Passive Cap, Res, Ferrite Array 10 $0.007 $0.059
1 Filter Ceramic, Small 6 $0.065 $0.065
39 Small Passive Coil, Inductor 2 $0.008 $0.312

Radio Board, Side 1

5 Coil SMT, Small 2 $0.050 $0.250
Radio Board, Side 2
2 Filter Ceramic, Small 2 $0.065 $0.130


Interconnect Board, Side 2 5 Small Passive Cap, Res, Ferrite Array 4 $0.007 $0.037
Home Button Board, Side 1 1 Small Passive Cap, Res, Ferrite 2 $0.004 $0.004
Docking Flex, Side 1 1 Small Passive Cap, Res, Ferrite 2 $0.004 $0.004
Side Key Flex, Side 2 1 Small Passive Cap, Res, Ferrite 2 $0.004 $0.004
Microphone Flex, Side 1 4 Small Passive Cap, Res, Ferrite 2 $0.004 $0.016
TOTALS 1271 2644 $6.69
Deep Dive Teardown
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
Docking Flex, Side 1 1 Port: Lightning 10 14.50 8.50 $0.500 $0.500
Docking Flex, Side 2 1 Bd to Bd: Main Board 50 13.20 3.70 $0.270 $0.270
Home Button Board, Side 1 1 Cable: Flex - Home Button Board to Main Board 6 107.50 11.76 $0.620 $0.620
Interconnect Board, Side 1 1 Bd to Bd: Main Camera 32 7.80 1.30 $0.180 $0.180
1 Connector: ZIF - Microphone Flex 6 4.35 3.20 $0.092 $0.092

Interconnect Board, Side 2 1 Bd to Bd: RF Proximity Sensor / Main Antenna 10 4.40 2.40 $0.070 $0.070
1 Bd to Bd: Secondary Camera 18 5.00 1.60 $0.110 $0.110
Interconnect Flex, Side 1 1 Jack: Headphone 5 14.60 15.80 $0.150 $0.150
1 Connector: ZIF - Home Button Flex 6 4.30 3.20 $0.092 $0.092

1 Connector: Speaker 6 8.91 5.10 $0.080 $0.080
1 Connector: Antenna Coax - WiFi/Bluetooth 2 2.56 1.65 $0.040 $0.040
Main Board, Side 1 1 Connector: Battery Module 5 19.00 9.20 $0.120 $0.120
1 Bd to Bd: Docking Flex 50 12.00 2.20 $0.270 $0.270
4 Connector: ZIF - Touchscreen/Interconnect Flex 37 12.80 4.10 $0.309 $1.236
1 Connector: ZIF - Display 51 17.10 4.00 $0.407 $0.407
1 Cable: Flex - Main to Radio Board 42 13.30 16.00 $0.350 $0.350

Main Board, Side 2
1 Connector: External Test Antenna 2 2.00 2.00 $0.070 $0.070
Radio Board, Side 1 1 Connector: ZIF - SIM Card Flex 6 4.20 3.30 $0.092 $0.092
3 Connector: External Test Antenna 2 2.00 2.00 $0.070 $0.210

Radio Board, Side 2
3 Connector: Antenna Coax - Main, Rx Diversity, GPS 2 1.60 1.60 $0.040 $0.120
SIM Card Flex, Side 1 1 Socket: Micro SIM 6 18.10 17.40 $0.230 $0.230
TOTALS 28 473 $5.31
Deep Dive Teardown
Electronic Assembly Metrics by Assembly
(cm of routing per sq.cm of
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
General Area Assembly Name
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Docking Flex 6.6 4 26.4 41.6 3 62 0.5 9.4 20.7 1.80
Main Electronics Home Button Board 1.6 2 3.2 16.4 3 12 1.9 7.5 4.0 0.30
Main Electronics Interconnect Board 9.1 10 91.0 32.6 91 313 10.0 34.4 3.4 2.10
Main Electronics Interconnect Flex 13.5 4 54.0 5.5 8 19 0.6 1.4 2.4 1.30
Main Electronics Main Board 39.0 10 390.0 75.5 883 4670 22.6 119.7 5.3 34.80
Main Electronics Microphone Flex 1.8 3 5.4 12.0 5 12 2.8 6.7 2.4 0.10
Main Electronics Radio Board 13.0 10 130.0 69.3 399 1664 30.7 128.0 4.2 4.40
Main Electronics Side Key Flex 2.6 2 5.2 18.2 6 24 2.3 9.2 4.0 0.20
Main Electronics SIM Card Flex 3.9 3 11.7 9.2 1 6 0.3 1.5 6.0 0.70
Main Electronics Totals 91.1 48 716.9 1399 6782 15.4 74.4 4.8 45.70
Subsystem Electronics Battery Pack: Battery Board 10.4 8 83.2 18.2 69 163 6.6 15.7 2.4 3.70
Subsystem Electronics Secondary Camera: Secondary Camera Flex 1.7 2 3.4 53.1 3 40 1.8 23.5 13.3 0.20
Subsystem Electronics Main Camera: Main Camera Flex 1.7 2 3.4 81.6 4 71 2.4 41.8 17.8 0.50
Subsystem Electronics Display / Touchscreen Module: Backlight Flex - Bottom 10.4 2 20.8 12.1 42 84 4.0 8.1 2.0 0.50
Subsystem Electronics Display / Touchscreen Module: Backlight Flex - Top 14.4 2 28.8 10.3 42 84 2.9 5.8 2.0 0.70
Subsystem Electronics Display / Touchscreen Module: Display Board 20.3 10 203.0 30.0 153 629 7.5 27.3 4.1 5.40
Subsystem Electronics Totals 58.9 26 342.6 313 1071 5.3 18.2 3.4 11.00
System Totals 150.0 74 1059.5 1711 7779 11.4 51.9 4.5 56.70
Page 1 Page 2 Page 3 Page 4
Deep Dive Teardown
Electronics Costs by Assembly
Connector Components
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Components
Small Active
Substrates
Card Test
Insertion
Total
Main Electronics Docking Flex $ 2.53 $ - $ - $ - $ 0.00 $ 0.77 $ 1.66 $ 0.04 $ 0.05
Main Electronics Home Button Board $ 0.77 $ - $ 0.07 $ - $ 0.00 $ 0.62 $ 0.02 $ 0.03 $ 0.02
Main Electronics Interconnect Board $ 8.15 $ 5.86 $ - $ 0.03 $ 0.37 $ 0.45 $ 0.85 $ 0.55 $ 0.05
Main Electronics Interconnect Flex $ 3.72 $ - $ - $ 0.10 $ - $ 0.15 $ 3.39 $ 0.05 $ 0.02
Main Electronics Main Board $ 94.62 $ 75.78 $ 2.40 $ 0.60 $ 4.22 $ 2.66 $ 3.63 $ 5.07 $ 0.25
Main Electronics Microphone Flex $ 0.70 $ - $ 0.27 $ - $ 0.02 $ - $ 0.37 $ 0.02 $ 0.02
Main Electronics Radio Board $ 43.54 $ 35.40 $ 1.93 $ - $ 2.08 $ 0.42 $ 1.21 $ 2.31 $ 0.20
Main Electronics Side Key Flex $ 0.85 $ 0.05 $ 0.31 $ - $ 0.00 $ - $ 0.42 $ 0.05 $ 0.02
Main Electronics SIM Card Flex $ 1.07 $ - $ - $ - $ - $ 0.23 $ 0.81 $ 0.01 $ 0.02
Main Electronics Totals $ 155.95 $ 117.09 $ 4.98 $ 0.73 $ 6.69 $ 5.31 $ 12.36 $ 8.14 $ 0.65
Subsystem Electronics Battery Pack $ 2.25 $ 0.52 $ - $ 0.30 $ 0.35 $ 0.15 $ 0.38 $ 0.45 $ 0.10
Subsystem Electronics Display / Touchscreen Module $ 49.43 $ 14.63 $ 15.81 $ 4.34 $ 0.59 $ 4.68 $ 7.21 $ 1.83 $ 0.35
Subsystem Electronics Main Camera $ 5.96 $ 4.63 $ 0.65 $ - $ - $ 0.18 $ 0.28 $ 0.07 $ 0.15
Subsystem Electronics Secondary Camera $ 2.70 $ 2.15 $ - $ - $ - $ 0.11 $ 0.28 $ 0.06 $ 0.10
Subsystem Electronics Totals $ 60.34 $ 21.93 $ 16.46 $ 4.64 $ 0.94 $ 5.12 $ 8.15 $ 2.40 $ 0.70
System Totals $ 216.29 $ 139.02 $ 21.44 $ 5.37 $ 7.64 $ 10.42 $ 20.51 $ 10.55 $ 1.45
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
Deep Dive Teardown
Counts by Assembly
Small Active Components

Component Connections
Small Active Component
Connector Connections
Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Subsystem IOs
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Docking Flex 0 0 0 0 0 0 1 2 2 60 0 65
Main Electronics Home Button Board 0 0 1 4 0 0 1 2 1 6 0 15
Main Electronics Interconnect Board 4 71 0 0 2 4 81 172 4 66 0 404
Main Electronics Interconnect Flex 0 0 0 0 7 14 0 0 1 5 0 27
Main Electronics Main Board 21 2550 9 18 20 56 821 1734 12 312 0 5553
Main Electronics Microphone Flex 0 0 1 4 0 0 4 8 0 0 0 17
Main Electronics Radio Board 15 864 15 58 0 0 362 724 7 18 0 2063
Main Electronics Side Key Flex 1 4 4 18 0 0 1 2 0 0 0 30
Main Electronics SIM Card Flex 0 0 0 0 0 0 0 0 1 6 0 7
Main Electronics Totals 41 3489 30 102 29 74 1271 2644 28 473 0 8181
Subsystem Electronics Battery Pack 3 26 0 0 8 25 52 106 6 6 5 237
Subsystem Electronics Display / Touchscreen Module 16 10221 3 76 89 182 136 272 3 68 51 11116
Subsystem Electronics Main Camera 2 37 1 2 0 0 0 0 1 32 32 107
Subsystem Electronics Secondary Camera 2 22 0 0 0 0 0 0 1 18 18 61
Subsystem Electronics Touchscreen Module 0 0 1 74 0 0 0 0 0 0 74 149
Subsystem Electronics Totals 23 10306 5 152 97 207 188 378 11 124 180 11670
System Totals 64 13795 34 180 126 281 1459 3022 39 597 180 19777
Deep Dive Teardown
IC Metrics
Number of Package Connections
Die Area/Package Area Ratio
per sq.cm of Package Area

(die area / substrate area)
Substrate Tiling Density
Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
Main Electronics Interconnect Board 6 4 71 31.7 0.03 33.4 0.95 212.6 0 0
Main Electronics Main Board 30 21 2550 960.4 0.25 1023.0 0.94 249.3 1048576 33554432
Main Electronics Radio Board 23 15 864 135.0 0.1 284.2 0.48 304.0 131072 2048
Main Electronics Side Key Flex 1 1 4 0.5 0 2.5 0.21 158.0 0 0
Main Electronics Totals 60 41 3489 1127.7 1343.1 0.84 259.8 1179648 33556480
Subsystems Battery Pack 3 3 26 6.9 16.2 0.43 1.6 0 0
Subsystems Display / Touchscreen Module 18 16 10221 240.5 325.2 0.74 31.4 0 8
Subsystems Main Camera 2 2 37 40.9 74.3 0.55 0.5 0 0
Subsystems Secondary Camera 2 2 22 19.7 35.5 0.56 0.6 0 0
Subsystem Electronics Totals 25 23 10306 308.1 451.3 0.68 2283.8 0 8
System Totals 85 64 13795 1435.7 1794.4 0.80 768.8 1179648 33556488
Deep Dive Teardown
Estimated Cost
of Electronics
(Includes Subsystem Electronics)
$216.29
Passive Components Connector Components

4% 5%
Small Active Components

2%
Insertion
5%
Modular & Odd Substrates
Components 9%
10% Card Test
1%
Integrated Circuits
64%
Deep Dive Teardown
* Includes Subsystem Vendors & Associated Costs

Pkg. Brand Cost
Apple $45.57
Qualcomm $27.37
SanDisk $14.99
Samsung $11.82
OmniVision $6.53
STMicroelectronics $4.98
Other
USI $4.88 OmniVision STMicroelectronics
5% 4%
SK Hynix $4.84
Broadcom $3.41
Murata $2.38
Skyworks $2.19 Samsung
TI $1.96 9%
Avago $1.91 Other
SanDisk
20%
Parade Technologies $1.44 11%
TriQuint $0.98
Integrated Memory Logic $0.65
AKM Semiconductor $0.52
Qualcomm
RichTek $0.48 19%
NXP Semiconductor $0.45 Apple
Analog Devices $0.41 32%
Rohm $0.21
Infineon $0.21
Seiko Instruments $0.20
Maxim $0.17
Winbond $0.16
AMS $0.14
Silego $0.12
Ricoh $0.05 NOTE: Occasional inconsistencies in totals may be present due to rounding error.
Deep Dive Teardown
Part ID Weight Est'd Cost Est'd
Subsystem Qty Description Fabrication Process Material Dimensions (mm)
No. (grams) Each Extended Cost
1 1 Enclosure Cast + Machined + Anodized + Printed Aluminum 241.2 x 185.8 x 8.9 122.30 13.000 13.000
Enclosures 3 1 Bezel Molded Plastic + Adhesive 240 x 184 x 1 1.20 0.200 0.200
4 1 Antenna Well Molded + Pulls Plastic + Adhesive 120 x 16.5 x 8.6 4.80 0.270 0.270
5 59 Screw Machined Metal x 0.59 0.007 0.413
6 2 Strong Magnet + Spring Cast + Stamped + Assembled Metal 50 x 3.6 x 3 4.40 0.400 0.800
7 4 Weak Magnet Cast Metal 13 x 3.2 x 0.7 0.80 0.050 0.200
8 1 Micro SIM Holder Machined + Anodized Aluminum 20.6 x 16.8 x 1.9 0.30 0.200 0.200
9 1 Lightning Connector Support Cast + Machined + Anodized Aluminum 25.6 x 8 x 4.9 2.00 0.250 0.250
10 1 Micro SIM Holder Lever Cast Metal 12.6 x 2.7 x 3.2 0.05 0.100 0.100
11 4 Corner Plates Cast Metal x 6.40 0.100 0.400
12 1 Side Key Bracket Cast Metal 40.8 x 5 x 2.9 1.00 0.050 0.050
13 1 Bracket Cast Metal 18.2 x 4.8 x 0.9 0.05 0.030 0.030
14 1 Secondary Camera Bracket Stamped + Press Fit Metal 15.8 x 10.9 x 2.1 0.05 0.070 0.070
15 1 Power Button Molded + Extruded Plastic + Metal 12.3 x 3.7 x 2.8 0.05 0.100 0.100
16 1 Home Key Cover w/ Spring Molded + Painted + Printed + Stamped + Assembled Plastic + Metal + Adhesive 13.6 x 13.4 x 1.1 0.20 0.180 0.180
17 1 Home Key Bracket Cast + Painted Metal 36.1 x 7.9 x 1.9 1.30 0.100 0.100
18 1 Bracket Molded Plastic 21.2 x 7.4 x 1.7 0.05 0.020 0.020
19 1 Camera Lens Cover Molded + Stamped + Painted Plastic + Metal 10.9 x 8 x 1.3 0.05 0.080 0.080
20 1 Camera Bezel Molded Plastic 11.3 x 8.2 x 1.6 0.05 0.020 0.020
21 1 Apple Logo Molded Plastic 40 x 32 x 0.7 1.20 0.100 0.100
Miscellaneous 22 1 Magnet Bracket Molded Plastic 61.9 x 3.2 x 1.1 0.05 0.030 0.030
23 4 Magnet Brackets Molded Plastic 8 x 5.1 x 2.5 0.20 0.020 0.080
24 1 Bracket Molded Plastic 54.3 x 6.6 x 5.4 1.10 0.050 0.050
25 1 Bracket Stamped + Painted Aluminum 45.6 x 7 x 1.1 1.30 0.040 0.040
26 1 Mute Button Co-Molded + Painted Plastic + Aluminum 11.2 x 4.8 x 4.4 0.05 0.150 0.150
27 1 Side Keys Molded + Painted Plastic 20 x 3.7 x 1.7 0.05 0.050 0.050
28 1 Speaker Screen Die-Cut Plastic + Adhesive 41.6 x 14.9 x 0.04 0.01 0.010 0.010
29 4 Foam Die-Cut Foam + Adhesive x 0.04 0.005 0.020
30 19 Conductive Gasket Die-Cut Conductive Foam + Adhesive x 0.19 0.005 0.095
31 7 Grounding Tape Die-Cut Conductive Fabric + Adhesive x 0.07 0.020 0.140
32 4 Label Die-Cut + Printed Plastic + Adhesive x 0.04 0.010 0.040
33 37 Tape Die-Cut Plastic + Adhesive x 0.37 0.005 0.185
34 5 Gasket Die-Cut Foam + Adhesive x 0.05 0.005 0.025
35 4 Gasket Die-Cut Plastic + Adhesive x 0.04 0.010 0.040
36 8 Thermal Pad Die-Cut Thermal Elastomer x 0.08 0.020 0.160
37 1 Tape Die-Cut Plastic + Adhesive 203 x 7.7 x 0.03 1.00 0.010 0.010
38 2 Gasket Die-Cut Plastic + Adhesive 75 x 1 x 0.8 0.10 0.010 0.020
39 1 Gasket Die-Cut Plastic + Adhesive 222 x 165 x 0.05 0.80 0.020 0.020
Total 187 Estimated Cost $17.75
Deep Dive Teardown
Final Assembly & Test

Made in China
Number of parts 229
Est'd number of steps 779
Est'd time (seconds) 2959
Est'd final assembly cost $ 1.64
Est'd final test cost $ 1.60
Deep Dive Teardown
Estimated Cost Totals Note: An additional $5.20 estimated for accessories and
Main Electronic Assemblies $ 155.95 supporting materials
Battery Pack $ 20.27
Display / Touchscreen $ 112.73
Cost Total Notes:
Cameras $ 16.31
Non-Electronic Parts $ 17.75
Estimated final assembly cost includes labor only.
Final Assembly & Test $ 3.25 Total cost does not include Non-recurring, R&D, G&A, IP
Total $ 326.27 licensing fees/royalties, software, sales & marketing,
Note: Because the Touchscreen and Cover Glass were included in distribution.
the Display costs, there is a difference in the final cost from the
original report. Assumes fully scaled production.
Display / Touchscreen
35% Cameras
5%
Non-Electronic Parts
Battery Pack 5%
6% Final Assembly & Test
1%
Main Electronic Assemblies

48%
Deep Dive Teardown
COST ESTIMATION PROCESS

Overview and Discussion
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand
in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions
about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that
which strives to maintain comparability of the output of the model across product families and over time.
TechInsights' philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years,
we have developed an estimation process that, while necessarily lacking an insider's knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction
of unit costs in high-volume production environments. We do not claim that the model will produce the "right" answer for your firm's environment. However, TechInsights does give
customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify
the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-
materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type,
manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer
size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and
interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD
display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative
sources, LCD panel costs are taken from and referenced to these sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive
at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average
high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly
time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules,
electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under
evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the "right answer," which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the
TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type.
Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view
of OEM high volume cost-to-produce.
Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
Cost Estimation Process Metrics
Deep Dive Teardown
Metrics
Overview and Discussion
In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system
semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count,
and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products
are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking
purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either "raw" measured data or ratios of these measured data
sets.
Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes
packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the
major cost driver for most systems we examine.
Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board "projected" area (i.e. the simple board area and not the cumulative surface area of both sides of the board).
This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% -
20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-
factor IC packaging technologies. High density circuit boards are also often a supporting technology.
Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.
Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical
connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).
Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an
opportunity for failure. A high opportunity count means more complex and riskier electronics assembly.
Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the `average' terminal complexity of the
components and often provide a signature of integration level and/or "digital-ness" of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often
characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.
Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data
related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount
memory chips is more readily achieved than comparable silicon tiling of high pincount logic.
Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the
Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density
of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount
assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.
Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of
the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the
regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.
Cost Estimation Process Metrics

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What are the main components of the iPad 4?

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What are the key specifications of the iPad 4?

Apple iPad 4 LTE A1459

Deep Dive Teardown

Product Description Integrated Circuit Metrics

28 - Skyworks 30 - TriQuint 29 - Avago 31 - Skyworks 27 - Skyworks

Estimated block diagram based on observation of this specific product

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To Touchscreen Line Driver and Touchscreen Controller

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SIM Card Extractor - $0.05

USB / Lightning Cable - $1.75

Supporting Materials Label

Supporting Materials Label

Top Bottom Backlights

Micro SIM Card Tray

Micro SIM Card Release 3.5 mm Headset Jack

Top Bottom Backlights

Top Bottom Backlights

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8

This is an image of the opposite

Battery Pack Estimated Cost

Battery Camera Display / Touchscreen

Grid = 1 cm 40 - Seiko Instruments

Battery Pack Estimated Cost

Battery Camera Display / Touchscreen

Battery Camera Display / Touchscreen

Battery Camera Display / Touchscreen

52 - Integrated Memory Logic 53 - Parade Technologies

IC Identification Estimated Cost

Battery Camera Display / Touchscreen

Display / Touchscreen Module

Note: The Display / Touchscreen cost includes

Per today’s teardown techniques we now group

IC Identification Estimated Cost

Battery Camera Display / Touchscreen

Home Button Board

13 - TI 10 - NXP Semiconductor 1 - Apple 6 - TI

4 - Apple / Cirrus Logic 7 - TI 5 - Apple / Cirrus Logic

8 - NXP Semiconductor 3 - Apple / Dialog Semiconductor 2 - SanDisk 9 - TI

12 - NXP Semiconductor 11 - NXP Semiconductor

2 - SanDisk 2.2 - SanDisk

18 - USI 17 - Broadcom 19 - Silego

*Broadcom BCM4334 inside

14 - SK Hynix 14.1 - SK Hynix

Image 1 Image 2 Image 3

18.4 - TriQuint 18.1 - Broadcom

Image 1 Image 2 Image 3

18.4 - TriQuint 18.1 - Broadcom