Ucc 2897 A
Ucc 2897 A
Ucc 2897 A
UCC2897A
SLUS829F – AUGUST 2008 – REVISED NOVEMBER 2017
Device Information(1)
2 Applications
PART NUMBER PACKAGE BODY SIZE (NOM)
• High-Efficiency DC-to-DC Power Supplies TSSOP (20) 6.60 mm x 6.60 mm
• Server Power, 48-V Telecom, Datacom, and 42-V UCC2897A
VQFN (20) 4.15 mm x 4.15 mm
Automotive Applications
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
SECONDARY
12 SS/SD FB 11
SIDE E/A
CSS
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
UCC2897A
SLUS829F – AUGUST 2008 – REVISED NOVEMBER 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 13
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 27
3 Description ............................................................. 1 9 Application and Implementation ........................ 28
4 Revision History..................................................... 2 9.1 Application Information............................................ 28
9.2 Typical Application ................................................. 28
5 Device Options....................................................... 3
6 Pin Configuration and Functions ......................... 3 10 Power Supply Recommendations ..................... 34
7 Specifications......................................................... 5 11 Layout................................................................... 34
11.1 Layout Guidelines ................................................. 34
7.1 Absolute Maximum Ratings ...................................... 5
11.2 Layout Example .................................................... 34
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5 12 Device and Documentation Support ................. 36
7.4 Thermal Information .................................................. 6 12.1 Documentation Support ....................................... 36
7.5 Electrical Characteristics........................................... 6 12.2 Receiving Notification of Documentation Updates 36
7.6 Timing Requirements ............................................... 7 12.3 Community Resources.......................................... 36
7.7 Typical Characteristics .............................................. 9 12.4 Trademarks ........................................................... 36
12.5 Electrostatic Discharge Caution ............................ 36
8 Detailed Description ............................................ 12
12.6 Glossary ................................................................ 37
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12 13 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
Changes from Revision E (April 2015) to Revision F Page
• Changed Equation 1 From; tDEL2 = 11.1 × 10–2 To: tDEL2 = 11.1 × 10–12 .............................................................................. 13
• Changed Equation 15 From: QG(main) x QG(aux) To: QG(main) + QG(aux) .................................................................................... 31
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
• Changed Thermal Resistance Information table to new Thermal Information layout and updated PW and RGP
package data .......................................................................................................................................................................... 3
• Added RON and ROFF, RDEL test conditions to DMAX parameter in the PWM section of the Electrical Characteristics table... 7
• Changed Oscillator equations in Step 1 for RON and ROFF ................................................................................................... 30
5 Device Options
(1) The PW package is available taped and reeled. Add R suffix to the device type (for example: UCC2897APWR) to order quantities of
2,000 devices per reel. Bulk quantities are 70 units per tube. The RGP package is available in two options of tape and reel. The RGPT
is orderable in small reels of 250 (for example: UCC2897ARGPT); the RGPR contains 3000 pieces per reel (for example:
UCC2897ARGPR).
(2) The TSSOP-20 (PW) and QFN-20 (RGP) package uses Pb-free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C
to 260°C peak reflow temperature and compatible with either lead-free, tin, or lead soldering operations.
PW Package
20-Pin TSSOP
Top View
VIN 1 20 N/C
N/C 2 19 LINEOV
RDEL 3 18 LINEUV
RON 4 17 VDD
ROFF 5 16 PVDD
VREF 6 15 OUT
SYNC 7 14 AUX
GND 8 13 PGND
CS 9 12 SS/SD
RSLOPE 10 11 FB
RGP Package
20-Pin VQFN
Bottom View
SYNC
ROFF
VREF
RON
GND
1 2 3 4 5
RDEL 20 6 CS
NC 19 7 RSLOPE
VIN 18 8 FB
NC 17 9 SS/SD
LINEOV 16 10 PGND
15 14 13 12 11
VDD
PVDD
LINEUV
AUX
OUT
Pin Functions
PIN
NO. I/O DESCRIPTION
NAME
TSSOP VQFN
This output drives the auxiliary-clamp MOSFET which turns on when the main
AUX 14 11 O PWM-switching device turns off. The AUX pin directly drives the auxiliary switch
with a 2-A source turn-on current and a 2-A sink turn-off current.
This pin senses the peak current utilized for current-mode control and for current-
CS 9 6 I limiting functions. The peak signal is applied to this pin before pulse-by-pulse
current limiting activates and is approximately 0.5 V.
This pin brings the error signal from an external optocoupler or error amplifier into
the PWM-control circuitry. Often, there is a resistor tied from FB to VREF, and an
FB 11 8 I
optocoupler pulls the control pin closer to GND to reduce the pulse width of the
OUT output driving the main-power switch of the converter.
This pin serves as the fundamental-analog ground for the PWM-control circuitry.
GND 8 5
This pin is connected to PGND directly at the device.
The LINEOV pin is an input pin of voltage comparator with programmable
LINEOV 19 16 I
hysteresis and 1.27-V threshold, providing LINE overvoltage or other functions.
This pin provides a means to accurately enable/disable the power converter stage
by monitoring the bulk input voltage or another parameter. When the circuit initially
starts (or restarts from a disabled condition), a rising input on LINEUV enables the
LINEUV 18 15 I outputs when the threshold of 1.27 V is crossed. After the circuit is enabled, a
falling LINEUV signal disables the outputs when the same threshold is reached.
The hysteresis between the two levels is programmed using an internal current
source.
This output pin drives the main PWM switching element MOSFET in an active-
clamp controller. The OUT pin directly drives an N-channel device with a 2-A
OUT 15 12 O
source turnon-current and a 2-A sink turnoff-current. TI recommends connecting a
10-kΩ resistor from this pin to PGND pin.
The PGND should serve as the current return for the high-current output drivers
PGND 13 10 OUT and AUX. Ideally, the current path from the outputs to the switching devices,
and back would be as short as possible, and enclose a minimal-loop area.
The PVDD pin is the supply pin for the power devices. It is separated internally
PVDD 16 13 I
from the VDD pin.
A resistor connected from this pin to GND programs an internal current source that
RSLOPE 10 7 I
sets the slope-compensation ramp for the current-mode control-circuitry.
A resistor from this pin to GND programs the turn-on delay of the two gate-drive
RTDEL 3 20 I outputs to accommodate the resonant transitions of the active-clamp power
converter.
A resistor connected from this pin to GND programs an internal-current source that
ROFF 5 2 I
discharges the internal timing-capacitor.
A resistor connected from this pin to GND programs an internal-current source that
RON 4 1 I
charges the internal timing-capacitor.
A capacitor from SS/SD to ground is charged by an internal-current source of
SS/SD 12 9 I IRON to program the soft-start interval for the controller. During a fault condition
this capacitor is discharged by a current source equal to IRON.
The SYNC pin serves as a bidirectional-synchronization input for the internal
oscillator. The synchronization function is implemented such that the user-
SYNC 7 4 I programmable maximum duty-cycle (set by RON and ROFF) remains accurate
during synchronized operation. This pin is left open when not in use. The external
capacitance is minimized. No capacitors are connected to this pin.
The VDD pin is the power supply for the device. There should be a 1-μF capacitor
directly from VDD to PGND. The capacitor value should be at least 10-times larger
than that on VREF. PGND and GND are connected externally and directly from
VDD 17 14 I
PGND pin to GND pin. (To make a full design of capacitance on VDD pin, please
refer to, Application Note: Understanding and Designing an Active Clamp Current
Mode Controlled Converter (SLUA535), section 7.3)
This pin is connected to the input-power rail directly. Inside the device, a high-
VIN 1 18 I voltage start-up device is utilized to provide the start-up current for the controller
until a bootstrap-type bias rail becomes available.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Line input voltage 120
VDD Supply voltage 16.5 V
Analog inputs, FB, CS, SYNC, LINEOV, LINEUV –0.3 (VREF+ 0.3)
IO_SOURCE Output source current (peak) OUT AUX 2.5
A
IO_SINK Output sink current (peak) OUT AUX –2.5
TJ Operating junction temperature range –55 150
°C
Tsol Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds 300
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(5) Maximum pulse width needs to be less than DMAX, which is a function of RON and ROFF. For more information on DMAX, see detailed
description for ROFF in .
50% 50%
OUT
t
AUX
50% 50% t
(P--channel)
tDEL1 tDEL2
Figure 1. Output Timing Diagram
14 2.5
12
UVLO On
VUVLO -- UVLO Voltage Thresholds -- V
2.0
1.5
8
UVLO Off
6
1.0
UVLO Hysteresis
4
0.5
2
0 0
--50 --25 0 25 50 75 100 125 0 2 4 6 8 10 12 14 16
TJ -- Junction Temperature -- °C VDD -- Supply Voltage -- V
Figure 2. UVLO Voltage Thresholds vs. Junction Figure 3. Quiescent Current vs. Supply Voltage
Temperature
10 20
VIN = 36 V
--10
10
--20
--30
JFET Source Current 5
--40
0
--50 --50 --25 0 25 50 75 100 125
0 2 4 6 8 10 12 14 16
TJ -- Junction Temperature -- °C
VDD -- Supply Voltage -- V
15
1.28 Softstart Discharge Current
VTH -- Line Thresholds -- V
10
1.26 5
1.24
--5
--10
1.22
--15 Softstart Charge Current
1.20 --20
--50 --25 0 25 50 75 100 125 --50 --25 0 25 50 75 100 125
TJ -- Junction Temperature -- °C TJ -- Junction Temperature -- °C
Figure 6. Line UV/OV Voltage Threshold vs. Junction Figure 7. Softstart Currents vs. Temperature
Temperature
0.58
0.56
0.52
0.50 100 K
0.48
0.46
10 K
0.44
0.42
0.40 1K
--50 --25 0 25 50 75 100 125
10 100 1000
TJ -- Junction Temperature -- °C RON = ROFF -- Timing Resistance -- kΩ
Figure 8. Soft Start/Shutdown Threshold Voltage vs. Figure 9. Switching Frequency vs. Programming Resistance
Junction Temperature
275 74
RON = ROFF = 75 kΩ RON = ROFF = 75 kΩ
270
73
265
fSW -- Switching Frequency -- kHz
71
255
250 70
245
69
240
68
235
230 67
225 66
--50 --25 0 25 50 75 100 125 --50 --25 0 25 50 75 100 125
TJ -- Junction Temperature -- °C TJ -- Junction Temperature -- °C
Figure 10. Oscillator Frequency vs. Junction Temperature Figure 11. Maximum Duty Cycle vs. Junction Temperature
1.4 2.50
VSYNC -- Synchronization Threshold Voltage -- V
VCS -- Current Sense Threshold Voltage -- V
1.2 2.45
2.40
1.0
2.35
0.8
2.30
Hiccup Mode
0.6
2.25
0.2 2.15
2.10
0 --50 --25 0 25 50 75 100 125
--50 --25 0 25 50 75 100 125
TJ -- Junction Temperature -- °C TJ -- Junction Temperature -- °C
Figure 12. Current Sense Threshold Voltage vs. Junction Figure 13. Synchronization Threshold Voltage vs. Junction
Temperature Temperature
600
t DEL2
10 300
200
5
100
0
0 0 10 20 30 40 50 60 70
--50 --25 0 25 50 75 100 125
RDEL -- Delay Resistance -- kΩ
TJ -- Junction Temperature -- °C
Figure 14. Out And AUX Rise And Fall Time vs. Junction Figure 15. Delay Time vs. Delay Resistance
Temperature
250 800
RDEL = 10 kΩ RDEL = 50 kΩ
700
200
600
tDEL -- Delay Time -- ns
100 300
200
50 AUX to OUT
100
0 0
--50 --25 0 25 50 75 100 125 --50 --25 0 25 50 75 100 125
TJ -- Junction Temperature -- °C TJ -- Junction Temperature -- °C
Figure 16. Delay Time vs. Junction Temperature Figure 17. Delay Time vs. Junction Temperature
5.3
No Load
10 mA Load
5.2
VREF -- Reference Voltage -- V
5.1
5.0
4.9
4.8
4.7
--50 --25 0 25 50 75 100 125
TJ -- Junction Temperature -- °C
8 Detailed Description
8.1 Overview
The UCC2897A is a peak current mode active clamp PWM controller. It provides simple interface to program the
critical timings such as soft start, gate turn on delay, switching period, maximum operating duty cycle, and slope
compensation. Features includes a high voltage JFET circuit, UVLO protection, line under/over voltage
protection, pulse skipping, and synchronization. The UCC2897A also has the logic and the drive capability for a
P-channel auxiliary switch. The VDD supply is generated from a bootstrap circuit connected to a bias winding.
VIN 1
2.5 V
N/C 2 VREF
IRDEL
20 N/C
VREF
0.05 x IRDEL
RDEL 3
2.5 V CLOCK 0.05 x IRDEL 19 LINEOV
ICHG Start
LineOV
1.27 V
End
RTON 4 LineU 18 LINEUV
1 - DMAX V 1.27
2.5 V V 13V / 8V
IDSCHG VDD
CT
VREF
RTOFF 5 OUT PWM 17 VDD
SYNC OFF
VDD
IRDEL 16 PVDD
OUT
6 REF
VREF S Q Turn-on Delay 15 OUT
GEN
RD Q VREF GND
IRDEL
SYNC 7 14 AUX
+
0.5 V GND
Turn-on Delay
GND 8 13 PGND
VREF VREF
0.43 x ICHG
5 x ISLOPE
CS 99 12 SS/SD
CT 1 - DMAX 4xR 0.43 x ICHG
R VDD
ISLOPE VREF
LineUV UVLO & SS Enable
LineOV
RSLOPE 10 11 FB
8.3.1.1 RDEL
This pin is internally connected to an approximately 2.5-V DC source. A resistor (RDEL) to GND sets the turn-on
delay for both gate drive signals of the UCC2987A controller. The delay time is identical for both switching
transitions between OUT turning off and AUX turning on, as well as when AUX is turning off and OUT is turning
on. The delay time is defined in Equation 1.
tDEL1 = tDEL2 = 11.1 × 10–12 ×RDEL + 15 × 10 –9 seconds (1)
For proper selection of the delay time refer to the various references describing the design of active-clamp
power-converters.
8.3.1.2 RON
This pin is internally connected to an approximately 2.5-V DC source. A resistor (RON) to GND (pin 6) sets the
charge current of the internal-timing capacitor. The RON pin, in conjunction with the ROFF pin (pin 3), sets the
operating frequency and maximum-operating duty cycle.
8.3.1.3 ROFF
This pin is internally connected to an approximately 2.5-V DC source. A resistor (ROFF) to GND (pin 6) sets the
discharge current of the internal-timing capacitor. The RON and ROFF pins set the switching period (TSW) and
maximum-operating duty cycle (DMAX) according to the following equations:
æSö
t ON = 36.1´ 10-12 ´ RON ´ ç ÷ - tDEL (s ) sec onds
èWø (2)
æSö
t OFF = 15 ´ 10-12 ´ ROFF ´ ç ÷ + tDEL (s ) + 170 ´ 10-9 ´ (s ) sec onds
èWø (3)
TSW = tON + tOFF (4)
t ON
DMAX =
t ON + t OFF (5)
8.3.1.4 VREF
The internal 5-V bias rail of the controller is connected to this pin. The internal bias-regulator requires a high-
quality ceramic-bypass capacitor (CVREF) to GND for noise filtering and to provide compensation to the regulator
circuitry. The recommended CVREF value is 0.22 μF and X7R capacitors are recommended. The minimum-bypass
capacitor value is 0.022 μF limited by stability considerations of the bias regulator, while the maximum is
approximately 22 μF. The capacitance on VREF and VDD should be in a minimum ratio of 1:10.
The VREF pin is internally current-limited and supplies approximately 5 mA to external circuits. The 5-V bias is
available only when the undervoltage lock-out (UVLO) circuit enables the operation of UCC2897A controller. The
VREF-bias profile may not be monotonic before VDD reaches 5 V.
For the detailed functional description of the undervoltage lock-out (UVLO) circuit refer to the section of this
datasheet.
8.3.1.6 GND
This pin provides a reference potential for all small-signal control and programming circuitry inside the
UCC2897A. Ground layout is critical for correct operation. High-current surges from the MOSFET drivers conduct
through PVDD, OUT, AUX, and PGND. To localize these surges, PVDD must bypass directly to PGND. PGND
current must be electrically, capacitively, and inductively isolated from GND with only one short trace connecting
PGND to GND, located to best minimize noise into GND.
8.3.1.7 CS
CS is a direct input to the PWM and current-limit comparators of the UCC2897A controller. The CS pin never
connects directly across the current-sense resistor (RCS) of the power converter. A small, customary R-C filter
between the current-sense resistor and the CS pin is necessary to accommodate the proper operation of the
onboard slope-compensation circuit and in order to protect the interna- discharge transistor connected to the CS
pin (RF1, CF).
Slope compensation is achieved across RF by a linearly-increasing current flowing out of the CS pin. The slop-
compensation current is only present during the on-time of the gate-drive signal of the main-power switch (OUT)
of the converter. The internal-pulldown transistor of the CS pin is activated during the discharge time of the
timing capacitor. This time interval is (1 – DMAX) × TSW long and represents the specified off-time of the main-
power switch.
8.3.1.9 FB
FB and SS/SD interact. The one with the lower-voltage value takes control on the duty cycle, refer to SS/SD
description. This pin is an input for the control voltage of the pulse-width modulator of the UCC2897A.The control
voltage is generated by an external-error amplifier by comparing the output voltage of the converter to a voltage
reference and employing the compensation for the voltage-regulation loop. Usually, the error amplifier is located
on the secondary side of the isolated-power converter and the output voltage is sent across the isolation
boundary by an optocoupler. Thus, the FB pin is usually driven by the optocoupler. An external-pullup resistor to
the VREF pin (pin 4) is also required for proper operation as part of the feedback circuitry.
The control voltage is internally buffered and connected to the PWM comparator through a voltage divider to
make it compatible to the signal level of the current-sense circuit. The useful voltage range of the FB pin is
between approximately 2.5 V and 4.5 V. Control voltages below the 2.5-V threshold result in zero-duty cycle
(pulse skipping) while voltages above 4.5 V result in full-duty-cycle (DMAX) operation.
8.3.1.10 SS/SD
A capacitor (CSS) connected between this pin and GND (pin 6) programs the soft-start time of the power
converter. The soft-start capacitor is charged by a precise, internal DC-current source which is programmed by
the RON resistor connected to pin 2. The soft-start current is defined in Equation 7.
V 1
ISS = 0.43 ´ IRON = 0.43 ´ REF ´
2 RON (7)
This DC current charges CSS from 0 V to approximately 5 V. Internal to the UCC2897A, the soft-start capacitor
voltage is buffered and ORed with the control voltage present at the FB pin (pin 9). The lower of the two voltages
manipulates the PWM engine of the controller through the voltage divider described with regards to the FB pin.
Accordingly, the useful control range on the SS pin is similar to the control range of the FB pin and it is between
2.5 V and 4.5 V approximately. During line-undervoltage protection, the PWM follows this pin-capacitor discharge
to achieve soft-stop function
8.3.1.12 AUX
AUX is a high-current gate-drive output for the auxiliary switch to implement the active-clamp operation for the
power stage. The auxiliary output (AUX) of the UCC2897A drives a P-channel device as the clamp switch
therefore it requires an active-low operation (the switch is ON when the output is low).
8.3.1.13 OUT
This high-current output drives an external N-channel MOSFET. The UCC2897A controller uses an active-high
drive signal for the main switch of the converter.
Due to the high-speed and high-drive current capability of these outputs (AUX, OUT) the parasitic inductance of
the external-circuit components connected to these pins should be carefully minimized. A potential way of
avoiding unnecessary parasitic inductances in the gate-drive circuit is to place the controller in close proximity to
the MOSFETs and by ensuring that the outputs (AUX, OUT) and the gates of the MOSFET devices are
connected by wide overlapping traces. TI recommends connecting a 10-kΩ resistor from this pin to PGND pin to
reduce a possible parasitic effect from layout.
8.3.1.14 VDD
The VDD rail is the primary bias for the internal high-current gate drivers, the internal 5-V bias regulator and for
parts of the undervoltage-lockout circuit. To reduce switching noise on the bias rail, a good-quality ceramic
capacitor (CHF) must be placed very closely between the VDD pin and PGND (pin 11) to provide adequate
filtering. The recommended CHF value is 1-μF for most applications but the value might be affected by the
properties of the external-MOSFET transistors used in the power stage.
In addition to the low-impedance high-frequency filtering, the bias rail of the controller requires a larger value
energy-storage capacitor (CBIAS) connected parallel to CHF. The energy-storage capacitor must provide the hold-
up time to operate the UCC2897A (including gate-drive power requirements) during start up. In steady-state
operation the controller must be powered from a bootstrap winding off the power transformer or by an auxiliary-
bias supply. In case of an independent-auxiliary-bias supply, the energy storage is provided by the output
capacitance of the bias supply. The capacitor values are also determined by the capacitor values connected to
VREF. The capacitance on VREF and VDD should be in a minimum ratio of 1:10.
8.3.1.16 VIN
The UCC2897A controller is equipped with a high-voltage N-channel-JFET startup device to initiate operation
from the input-power source of the converter in applications where the input voltage does not exceed the 110-V
maximum rating of the startup transistor. In these applications, the VIN pin connects directly to the positive
terminal of the input-power source. The internal-JFET startup transistor provides charge-current for the energy-
storage capacitor (CBIAS) connected across the VDD (pin 14) and PGND (pin 11) terminals. Note that the startup
device turns off immediately when the voltage on the VDD pin exceeds approximately 12.7 V, the undervoltage-
lockout threshold of the controller for turn-on. The JFET is also disabled at all times when the high-current gate
drivers are switching to protect against excessive-power dissipation and current through the device. For
dependable start-up, VDD must not be loaded by more than 4 mA.
For more information on biasing the UCC2897A, refer to the and sections of this datasheet.
8.3.1.17 LINEOV
This input monitors the incoming-power source to provide an accurate-overvoltage protection with user-
programmable hysteresis for the power supply controlled by the controller. The circuit implementation of the
overvoltage-protection function is identical to the technique used for monitoring the input-power rail for
undervoltage lockout. The circuit implements an accurate threshold and hysteresis using only one pin. The input
voltage of the power supply is scaled to the precise 1.27-V threshold of the overvoltage-protection comparator by
an external-resistor divider (RIN3, RIN4 in ). Once the input threshold of the line monitor is exceeded, an internal-
current source gets connected to the LINEOV pin. The current generator is programmed by the RDEL resistor
connected to pin 1 of the controller. The actual current level is given in Equation 9.
V 1
IHYST = REF ´ ´ 0.05
2 RDEL (9)
As this current flows through RIN4 of the input divider, the overvoltage-protection hysteresis is a function of IHYST
and RIN4 allowing accurate programming of the hysteresis of the line-monitoring circuit.
For more information on how to program the overvoltage protection, refer to the of this datasheet.
V ON
V IN
12.7V
10.0V 8V <VDD < 10V 8.0V
V DD Bootstrap bias
ENABLE
(See diagram on p.6)
SS/SD
SWITCHING UDG--03148
During initial power-up the JFET is on and charges the CBIAS and CHF capacitors connected to the VDD pin. The
undervoltage lockout-circuit of the controller monitors the VDD pin to ensure proper biasing before the operation
is enabled. When the VDD voltage reaches approximately 12.7 V (UVLO turnon threshold) the UVLO circuit
enables the rest of the controller. At that time, the JFET turns off and 5 V appears on the VREF terminal.
Switching waveforms might not appear at the gate-drive outputs unless all other conditions of proper operation
are met. These conditions are:
• The voltage on the CS pin is below the current limit threshold
• The control voltage is above the zero duty-cycle boundary (VFB > 2.5 V).
• The input voltage is in the valid operating range (VVON < VVIN < VVOFF.
– The line under or overvoltage protections are not activated.
VOFF
VIN
V CLAMP, MAX
VCLAMP
VSS
TSW
OUT
AUX
To eliminate this potential hazard the UCC2897A controller, discharge the clamp capacitor during power down
safely. The OUT and the AUX output continues switching while the soft-start capacitor CSS is being slowly
discharged. the function of soft stop is achieved because the AUX pulse-width gradually increases as the clamp
voltage decreases, while never applying the high voltage across the transformer for extended period of time.
VOVP
VOVH
VIN
VSS
OUT
AUX
D = 0 Boundary 2.5 V
FB
TSW
OUT
AUX
To overcome this problem, the UCC2897A family incorporates pulse skipping for both outputs in the controller.
As shown in Figure 22, when a pulse is skipped at the main output (OUT) because the feedback signal demands
zero duty-ratio, the corresponding output pulse on the AUX output is omitted as well. This operation prevents
reverse saturation of the power transformer and preserves the clamp-capacitor voltage level during pulse-
skipping operation.
SYNC
CT
DMAX
OUT
AUX
Figure 23. A Synchronization Waveform for SYNC Input, P-Channel
The most critical and unique feature of the oscillator is to limit the maximum-operating duty-cycle of the
converter, which is achieved by accurately controlling the charge and discharge intervals of the on-board timing
capacitor. The maximum on-time of the OUT pin, which is also the maximum duty-cycle of the active-clamp
converter, is limited by the charging-interval of the timing capacitor. While the capacitor is reset to the initial
voltage level, OUT is ensured to be off.
When synchronization is used, the rising edge of the signal terminates the charging period and initiates the
discharge of the timing capacitor. Once the timing-capacitor voltage reaches the predefined valley-voltage, a new
charge period starts automatically. This method of synchronization leaves the charge and discharge slopes of the
timing-waveform unaffected thus maintains the maximum duty-cycle of the converter, independent of the
operation mode.
Although the synchronization circuit is level sensitive, the actual synchronization event occurs at the rising-edge
of the waveform, allowing the synchronizing pulse-width to vary significantly while certain limitations are
observed. The minimum pulse-width should be sufficient to ensure reliable triggering of the internal-oscillator
circuitry, therefore it is greater than approximately 50 nanoseconds. The other limiting factor is to keep it shorter
than Equation 10.
(1 – DMAX) × TSYNC
where
• TSYNC is the period of the synchronization frequency (10)
When a pulse wider than that of Equation 10 is connected to the SYNC input, the oscillator is unable to maintain
the maximum duty-cycle, originally set by the timing-resistor ratio (RON, ROFF). Furthermore, the timing-capacitor
waveform has a flat portion as highlighted by the vertical marker in the timing diagram. During this flat portion of
the waveform, both outputs are off, but this state is not compatible with the operation of active-clamp power
converters. Therefore, this operating mode is not recommended.
Note that both outputs of the UCC2897A controller are off if the synchronization signal stays continuously high.
When both UCC2897A outputs are synchronized by tying their SYNC pins together, they operate in-phase. It is
possible to set different maximum duty-cycle limits for both UCC2897A outputs and still synchronize them by a
simple connection between their respective SYNC terminals.
CCLAMP
QAUX
QMAIN
AUX
Bootstrap Bias 1
+VIN
LOAD
VIN
VDD
CIN
UCC2897A CBIAS
Synchronous
GND Rectifier
QMAIN
Control
--VIN
Bootstrap Bias 2
+VIN
LOAD
VIN
VDD
CIN
UCC2897A
CBIAS
QMAIN
Synchronous
GND Rectifier
Control
--VIN
This solution uses the regulated output voltage across the output inductor during the freewheeling period to
generate a quasi-regulated bias for the control circuits.
Both of the illustrated solutions provide reliable bias-power during normal operation. Note that in both cases, the
bias voltages are proportional to the output voltage. This nature of the bootstrap bias-supply causes the
converter to operate in a hiccup mode under significant overload or under short-circuit conditions as the
bootstrap winding is not able to hold the bias rail above the undervoltage lockout-threshold of the controller.
Another biasing solution, based on the active circuit, is shown on the previous page with components Q10, C18,
R19, D10 and D12. Such a circuit is used in the applications where the allowed biasing-capacitor size is limited
to optimize the board space utilization.
Line undervoltage
UVLO, JFET on
protection
Line overvoltage
Normal operation
protection
Pulse skipping
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
+VIN
RIN4 RIN3
UCC2897A
1 VIN N/C 20
ROFF
5 ROFF PVDD 16
CVREF
6 VREF OUT 15
ROT
7 SYNC AUX 14
CSS
RF
9.2.2.1 Oscillator
The two timing elements of the oscillator are calculated from fSW and DMAX by the Equation 11 and Equation 12.
t ON + tDEL
RON =
æsö
36.1´ 10-12 ´ ç ÷
èWø (11)
t OFF - tDEL - 170 ´ 10-9 ´ (s )
ROFF =
æsö
15 ´ 10-12 ´ ç ÷
èWø
where
• DMAX is a dimensionless number between 0 and 1. (12)
+VIN
Load
Bootstrap
Bias CCLAMP
VIN
VDD
QAUX Synchronous
Drive
AUX Rectifier
Connection Control
CIN
UCC2897A
QMAIN
OUT
CBIAS
CS
ROT
RCS
GND FB
Secondary--Side
Error Amplifier
--VIN and Isolation
100 3.35
90
VO U T - O u tpu t V o ltag e - V
3.33
Ð - Efficiency - %
80
3.31
70
3.29
60
3.27
50
Figure 30. UCC2897A-EVM Efficiency Figure 31. Line and Load Regulation
11 Layout
12.4 Trademarks
TrueDrive, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 2-Nov-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
UCC2897APW ACTIVE TSSOP PW 20 70 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 UCC2897A
& no Sb/Br)
UCC2897APWR ACTIVE TSSOP PW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 UCC2897A
& no Sb/Br)
UCC2897ARGPR ACTIVE QFN RGP 20 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 2897A
& no Sb/Br)
UCC2897ARGPT ACTIVE QFN RGP 20 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 2897A
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 2-Nov-2017
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Nov-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Nov-2017
Pack Materials-Page 2
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