TFA9843J: 1. General Description

TFA9843J
2-channel audio amplifier (SE: 1 W to 20 W or BTL: 4 W to

40 W)
Rev. 02 — 19 January 2004 Preliminary data
1. General description
The TFA9843J contains two identical audio power amplifiers. The TFA9843J can be
used as two Single-Ended (SE) channels with a fixed gain of 26 dB or one
Bridge-Tied Load (BTL) channel with a fixed gain of 32 dB.
The TFA9843J comes in a 9-pin DIL-bent-SIL (DBS7P) power package. The

TFA9843J is pin compatible with the TFA9842J and TFA9841J.
The TFA9843J contains a unique protection circuit that is solely based on multiple
temperature measurements inside the chip. This gives maximum output power for all
supply voltages and load conditions with no unnecessary audio holes. Almost any
supply voltage and load impedance combination can be made as long as thermal
boundary conditions (number of channels used, external heatsink and ambient
temperature) allow it.
2. Features
■ SE: 1 W to 20 W; BTL: 4 W to 40 W operation possibility
■ Soft clipping
■ Standby and mute mode
■ No on/off switching plops
■ Low standby current
■ High supply voltage ripple rejection
■ Outputs short-circuit protected to ground, supply and across the load
■ Thermally protected
■ Pin compatible with the TFA9842J and TFA9841J.
3. Applications
■ Television
■ PC speakers
■ Boom box
■ Mini and micro audio receivers.
Philips Semiconductors TFA9843J
2-channel audio amplifier (2 x SE or 1 x BTL)
4. Quick reference data

Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage operating 9 18 26 V
no signal - - 28 V
Iq quiescent supply current VCC = 18 V; RL = ∞ - 60 100 mA
Istb standby supply current - - 10 µA
Po SE output power THD = 10 %; RL = 4 Ω; VCC = 18 V 7 8.5 - W
THD = 10 %; RL = 4 Ω; VCC = 22 V - 14 - W
BTL output power THD = 10 %; RL = 8 Ω; VCC = 18 V 16 18 - W
THD = 10 %; RL = 8 Ω; VCC = 22 V - 29 - W
THD total harmonic distortion SE; Po = 1 W - 0.1 0.5 %
BTL; Po = 1 W - 0.05 0.5 %
Gv voltage gain SE 25 26 27 dB
BTL 31 32 33 dB
SVRR supply voltage ripple SE; f = 1 kHz - 60 - dB
rejection BTL; f = 1 kHz - 65 - dB
5. Ordering information
Table 2: Ordering information
Type number Package
Name Description Version
TFA9843J DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); SOT523 -1
exposed die pad
9397 750 12587 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data Rev. 02 — 19 January 2004 2 of 21

6. Block diagram
VCC
4 8
IN1+ OUT1+
60 kΩ
1 2
IN2+ OUT2−
60 kΩ
SHORT-CIRCUIT
3 AND
CIV
VREF TEMPERATURE
PROTECTION
VCC
7 STANDBY
MODE MUTE
ON
6
TFA9843J SVR
0.5VCC
5
MDB023
GND
Fig 1. Block diagram.
7. Pinning information
7.1 Pinning
IN2+ 1
OUT2− 2
CIV 3
IN1+ 4
GND 5 TFA9843J
SVR 6
MODE 7
OUT1+ 8
VCC 9
MDB024
Fig 2. Pin configuration.

7.2 Pin description

Table 3: Pin description
Symbol Pin Description
IN2+ 1 input 2
OUT2− 2 inverted loudspeaker terminal 2
CIV 3 common input voltage decoupling
IN1+ 4 input 1
GND 5 ground
SVR 6 half supply voltage decoupling (ripple rejection)
MODE 7 mode selection input (standby, mute and operating)
OUT1+ 8 non inverted loudspeaker terminal 1
VCC 9 supply voltage
8. Functional description
8.1 Input configuration

The input cut-off frequency is:
1
f i ( cut – off ) = ----------------------------- (1)
2π ( R i × C i )
Single-ended application: Ri = 60 kΩ and Ci = 220 nF:
1
f i ( cut – off ) = ----------------------------------------------------------------
3 –9
- = 12 Hz (2)
2π ( 60 × 10 × 220 × 10 )
Bridge-tied load application: Ri = 30 kΩ and Ci = 470 nF:
1
f i ( cut – off ) = ----------------------------------------------------------------
3 –9
- = 11 Hz (3)
2π ( 30 × 10 × 470 × 10 )
As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not
necessary; so the switch-on delay during charging of the input capacitors can be
minimized. This results in a good low frequency response and good switch-on
behavior.
8.2 Power amplifier

The power amplifier is a Bridge-Tied Load (BTL) or Single-Ended (SE) amplifier with
an all-NPN output stage, capable of delivering a peak output current of 4 A.
Using the TFA9843J as a BTL amplifier offers the following advantages:
• Lower peak value of the supply current

• Ripple frequency on the supply voltage is twice the signal frequency

• No expensive DC-blocking capacitor

• Good low frequency performance.
8.2.1 Output power measurement
The output power as a function of the supply voltage is measured on the output pins
at THD = 10 %; see Figure 11. The maximum output power is limited by the supply
voltage of 26 V and the maximum available output current is 4 A repetitive peak
current. A minimum load (SE) of 3 Ω is required for supply voltages > 22 V; see
Figure 5. A minimum load (BTL) of 6 Ω is required for supply voltages > 22 V; see
Figure 6.
8.2.2 Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom,
compared to the average power output, for transferring the loudest parts without
distortion. At VCC = 18 V and Po = 5 W (SE with RL = 4 Ω) or Po = 10 W (BTL with
RL = 8 Ω) at THD = 0.2 % (see Figure 7), the Average Listening Level (ALL) music
power without any distortion yields:
3
5 × 10
P o ( ALL, SE ) = ----------------- = 315 mW (4)
15.85
3
10 × 10
P o ( ALL, BTL ) = -------------------- = 630 mW (5)
15.85
The power dissipation can be derived from Figure 13 (SE) or Figure 14 (BTL) for 0 dB
respectively 12 dB headroom (see Table 4).
Table 4: Power rating as function of headroom

Headroom Power output (THD = 0.2 %) Power dissipation (PD);
SE BTL both channels driven
0 dB Po = 5 W Po = 10 W 8.4 W
12 dB Po(ALL) = 315 mW Po(ALL) = 630 mW 4.2 W
For the average listening level a power dissipation of 4.2 W can be used for a
heatsink calculation.
8.3 Mode selection

The TFA9843J has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE (see Table 5 and Figure 3).
Table 5: Mode selection

VMODE Amplifiers 1 and 2
0 to 0.8 V standby
4.5 V to (VCC − 3.5 V) mute
(VCC − 2.0 V) to VCC on

Standby — In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when VMODE < 0.8 V, or when pin MODE is
grounded.
Mute — In this mode the amplifier is DC-biased but not operational (no audio output).
This allows the input coupling capacitors to be charged to avoid pop-noise. The
device is in mute mode when 4.5 V < VMODE < (VCC − 3.5 V).
On — In this mode the amplifier is operating normally. The operating mode is
activated at VMODE > (VCC − 2.0 V).
standby all mute 1/2 on
0.8 4.5 VCC−3.5 VCC−2.0 VCC
VMODE (V)
MCE502
Fig 3. Mode selection.
8.4 Supply voltage ripple rejection

The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor
of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 17 illustrates the
SVRR as function of the frequency. A larger capacitor value on pin SVR improves the
ripple rejection behavior at the lower frequencies.
8.5 Built-in protection circuits

The TFA9843J contains two types of temperature sensors; one measures local
temperatures of the power stages and one measures the global chip temperature. At
a local temperature of the power stage of approximately 185 oC or a global
temperature of approximately 150 oC this detection circuit switches off the power
stages for 2 ms. High impedance of the outputs is the result. After this time period the
power stages switch on automatically and the detection will take place again; still a
too high temperature switches off the power stages immediately. This protects the
TFA9843J against shorts to ground, to the supply voltage, across the load and too
high chip temperatures.
The protection will only be activated when necessary, so even during a short-circuit
condition, a certain amount of (pulsed) current will still be flowing through the short,
just as much as the power stage can handle without exceeding the critical
temperature level.

9. Limiting values
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage operating −0.3 +26 V
no signal −0.3 +28 V
VI input voltage −0.3 VCC + 0.3 V
IORM repetitive peak output current - 4 A
Tstg storage temperature non-operating −55 +150 °C
Tamb ambient temperature operating −40 +85 °C
Ptot total power dissipation - 35 W
VCC(sc) supply voltage to guarantee short-circuit - 24 V
protection
10. Thermal characteristics

Table 7: Thermal characteristics
Symbol Parameter Conditions Value Unit
Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W
Rth(j-c) thermal resistance from junction to case both channels driven 2.0 K/W
11. Static characteristics

Table 8: Static characteristics
VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; VMODE = VCC; Vi = 0 V; measured in test circuit Figure 20; unless otherwise specified.
VCC supply voltage operating [1] 9 18 26 V
Iq quiescent supply current RL = ∞ [2] - 60 100 mA
Istb standby supply current VMODE = 0 - - 10 µA
VO DC output voltage [3] - 9 - V
∆VOUT differential output voltage offset BTL mode [4] - - 190 mV
VMODE mode selection input voltage on mode VCC − 2.0 - VCC V
mute mode 4.5 - VCC − 3.5 V
standby mode 0 - 0.8 V
IMODE input current on pin MODE 0 < VMODE < (VCC − 3.5) - - 20 µA
[1] A minimum load (BTL) of 6 Ω is allowed at supply voltages > 22 V.

[2] With a load connected at the outputs the quiescent supply current will increase.
[3] The DC output voltage with respect to ground is approximately 0.5VCC.
[4] ∆VOUT = VOUT1+ − VOUT2−

12. Dynamic characteristics

Table 9: Dynamic characteristics SE
VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE = VCC; measured in test circuit Figure 19; unless otherwise specified.
Po output power THD = 10 %; RL = 4 Ω 7 8.5 - W
THD = 0.5 % RL = 4 Ω - 6.5 - W
VCC = 22 V; - 14 - W
THD = 10 %; RL = 4 Ω
THD total harmonic distortion Po = 1 W - 0.1 0.5 %
Gv SE voltage gain 25 26 27 dB
Zi input impedance 40 60 - kΩ
Vn(o) noise output voltage [1] - 150 - µV
SVRR supply voltage ripple fripple = 1 kHz [2] - 60 - dB
rejection fripple = 100 Hz to 20 kHz [2] - 60 - dB
Vo(mute) output voltage in mute mode [3] - - 150 µV
αcs channel separation Rsource = 0 Ω 50 60 - dB
|Gv| channel unbalance - - 1 dB
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance
Rsource = 0 Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range
from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which
is applied to the positive supply rail.
[3] Output voltage in mute mode (VMODE = 7 V) and an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, so including noise.
Table 10: Dynamic characteristics BTL

VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = VCC; measured in test circuit Figure 20; unless otherwise specified.
Po output power THD = 10 %; RL = 8 Ω 16 18 - W
THD = 0.5 %; RL = 8 Ω - 14 W
VCC = 22 V; - 29 - W
THD = 10 %; RL = 8 Ω
THD total harmonic distortion Po = 1 W - 0.05 0.5 %
Gv BTL voltage gain 31 32 33 dB
Zi input impedance 20 30 - kΩ
Vn(o) noise output voltage [1] - 200 - µV
SVRR supply voltage ripple fripple = 1 kHz [2] - 65 - dB
rejection fripple = 100 Hz to 20 kHz [2] - 65 - dB
Vo(mute) output voltage in mute mode [3] - - 250 µV
αcs channel separation Rsource = 0 Ω 50 65 - dB
|Gv| channel unbalance - - 1 dB
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance
Rsource = 0 Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range
from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which
is applied to the positive supply rail.

[3] Output voltage in mute mode (VMODE = 7 V) and an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, so including noise.
mce486
107
Vo
(µV)
106
105
104
103
102
10
1
0 4 8 12 16 20
VMODE (V)
Vi = 50 mV; BTL; VCC = 18 V.

Fig 4. AC output voltage as function of mode voltage.
MCE485 MCE484
60 60
Po Po
(W) (W)
4Ω 6Ω
40 40
8Ω
2Ω 3Ω
20 20 RL = 2 Ω 16 Ω
4Ω
RL = 1 Ω
8Ω
0 0
8 12 16 20 24 28 8 12 16 20 24 28
VCC (V) VCC (V)
THD = 10 %. THD = 10 %.
Fig 5. Output power (one channel) as function of Fig 6. Output power (one channel) as function of
supply voltage for various SE loads. supply voltage for various BTL loads.

MCE488 MCE487
102 102
THD+N THD+N
(%) (%)
10 10
1 1
10−1 10−1
10−2 10−2
10−1 1 10 102 10−1 1 10 102
Po (W) Po (W)
VCC = 18 V; SE; f = 1 kHz; RL = 4 Ω. VCC = 18 V; BTL; f = 1 kHz; RL = 8 Ω.

Fig 7. Total harmonic distortion as function of output Fig 8. Total harmonic distortion as function of output
power. power.
MCE489 MCE490
10 10
THD+N
THD+N (%)
(%)
1 1
10−1 10−1
10−2 10−2
10 102 103 104 105 10 102 103 104 105
f (Hz) f (Hz)
VCC = 18 V; SE; Po = 1 W; RL = 4 Ω. VCC = 18 V; BTL; Po = 1 W; RL = 8 Ω.

Fig 9. Total harmonic distortion as function of Fig 10. Total harmonic distortion as function of
frequency. frequency.

MCE491 MCE492
50 50
Po Po
(W) (W)
40 40
30 30
20 20
10 10
0 0
8 12 16 20 24 28 8 12 16 20 24 28
VCC (V) VCC (V)
THD = 10 %; SE; RL = 4 Ω; f = 1 kHz. THD = 10 %; BTL; RL = 8 Ω; f = 1 kHz.

Fig 11. Output power as function of supply voltage. Fig 12. Output power as function of supply voltage.
MCE507 MCE508
10 10
PD PD
(W) (W)
8 8
6 6
4 4
2 2
0 0
0 4 8 12 16 20 0 4 8 12 16 20
Po (W) Po (W)
VCC = 18 V; SE; RL = 4 Ω. VCC = 18 V; BTL; RL = 8 Ω.

Fig 13. Total (worst case, both channels driven) power Fig 14. Total (worst case, both channels driven) power
dissipation as function of channel output power dissipation as function of channel output power
per channel. per channel.

MCE495 MCE496
0 0
αcs αcs
(dB) (dB)
−20 −20
−40 −40
−60 −60
−80 −80
−100 −100
10 102 103 104 105 10 102 103 104 105
f (Hz) f (Hz)
VCC = 18 V; SE; RL = 4 Ω. VCC = 18 V; BTL; RL = 8 Ω.

Fig 15. Channel separation as function of frequency Fig 16. Channel separation as function of frequency
(no bandpass filter applied). (no bandpass filter applied).
MCE497 MCE498
0 0
SVRR SVRR
(dB) (dB)
−20 −20
−40 −40
−60 −60
−80 −80
10 102 103 104 105 10 102 103 104 105
f (Hz) f (Hz)
VCC = 18 V; SE; Rsource = 0 Ω; Vripple = 300 mV (RMS); a VCC = 18 V; BTL; Rsource = 0 Ω; Vripple = 300 mV (RMS);
bandpass filter of 20 Hz to 22 kHz has been applied; a bandpass filter of 20 Hz to 22 kHz has been applied;
inputs short-circuited. inputs short-circuited.
Fig 17. Supply voltage ripple rejection as function of Fig 18. Supply voltage ripple rejection as function of
frequency. frequency.

13. Application information
13.1 Application diagrams
VCC
VCC 100 nF 1000 µF
9
220 nF
IN1+ 4 8 OUT1+
Vi 1000 µF +
RL
60 kΩ
− 4Ω
220 nF
IN2+ 1 2 OUT2−
1000 µF −
Vi RL
60 kΩ
+ 4Ω
SHORT-CIRCUIT
CIV 3 AND
TEMPERATURE
VREF
PROTECTION
VCC
STANDBY
MODE 7
MUTE
ON
MICRO- 0.5VCC 6 SVR

CONTROLLER TFA9843J
22 µF 150 µF
mce503
GND
Fig 19. SE application diagram.
Remark: Switching inductive loads, the output voltage can rise beyond the maximum
supply voltage of 28 V. At high supply voltage it is recommended to use (Schottky)
diodes to the supply voltage and ground.

VCC
VCC 100 nF 1000 µF
9
IN1+ 4 8 OUT1+
470 nF +
60 kΩ RL
− 8Ω
Vi
IN2+ 1 2 OUT2−
60 kΩ
SHORT-CIRCUIT
CIV 3 AND
TEMPERATURE
VREF
PROTECTION
VCC
STANDBY
MODE 7
MUTE
ON
MICRO- 0.5VCC 6 SVR

CONTROLLER TFA9843J
22 µF 150 µF
MDB026
GND
Fig 20. BTL application diagram.
Remark: Switching inductive loads, the output voltage can rise beyond the maximum
supply voltage of 28 V. At high supply voltage it is recommended to use (Schottky)
diodes to the supply voltage and ground.
13.2 Printed-circuit board

13.2.1 Layout and grounding
To obtain a high-level system performance, certain grounding techniques are
essential. The input reference grounds have to be tied with their respective source
grounds and must have separate tracks from the power ground tracks; this will
prevent the large (output) signal currents from interfering with the small AC input
signals. The small-signal ground tracks should be physically located as far as
possible from the power ground tracks. Supply and output tracks should be as wide
as possible for delivering maximum output power.

AUDIO POWER CS NIJMEGEN

PF / 3002 .naJ 72
TVA
TFA9843J
BTL1/2
1000 µF
100 nF
1000 µF
−SE1+
1000 µF
220
220 nF
nF
SVR
−SE2+
150 µF
SVR
CIV
MODE
22
µF SGND 10
+VP kΩ
CIV 10 kΩ
IN2+ IN1+ SB ON
MUTE
MCE506
Fig 21. Printed-circuit board layout (single-sided); components view.
13.2.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR, typical 100 nF, has to be placed as close as possible to the device. For
suppressing lower frequency noise and ripple signals, a large electrolytic capacitor,
e.g. 1000 µF or greater, must be placed close to the device.
The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
13.3 Thermal behavior and heatsink calculation

The measured maximum thermal resistance of the IC package, Rth(j-mb), is 2.0 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb(max) = 60 °C (example)
VCC = 18 V and RL = 4 Ω (SE)
Tj(max) = 150 °C (specification)
Rth(tot) is the total thermal resistance between the junction and the ambient including
the heatsink. This can be calculated using the maximum temperature increase
divided by the power dissipation:
Rth(tot) = (Tj(max) − Tamb(max))/PD


At VCC = 18 V and RL = 4 Ω (2 × SE) the measured worst-case sine-wave dissipation

is 8.4 W; see Figure 13. For Tj(max) = 150 °C the temperature raise, caused by the
power dissipation, is: 150 − 60 = 90 °C:
P × Rth(tot) = 90 °C
Rth(tot) = 90/8.4 = 10.7 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 10.7 − 2.0 = 8.7 K/W
This calculation is for an application at worst-case (stereo) sine-wave output signals.

In practice music signals will be applied, which decreases the maximum power
dissipation to approximately half of the sine-wave power dissipation (see
Section 8.2.2). This allows for the use of a smaller heatsink:
P × Rth(tot) = 90 °C
Rth(tot) = 90/4.2 = 21.4 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 21.4 − 2.0 = 19.4 K/W
MCE504 MCE505
150 150
RL = 2 Ω 4Ω 6Ω 8Ω RL = 1 Ω 2Ω 3Ω 4Ω
Tj Tj
(˚C) (˚C)
100 100
16 Ω 8Ω
50 50
0 0
8 12 16 20 24 28 8 12 16 20 24 28
VCC (V) VCC (V)
2 × SE loads; Tamb = 25 °C; external heatsink of 10 K/W; BTL loads; Tamb = 25 °C; external heatsink of 10 K/W;
music signals. music signals.
Fig 22. Junction temperature versus supply voltage. Fig 23. Junction temperature versus supply voltage.
14. Test information
14.1 Quality information

The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.

15. Package outline

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1
q1
non-concave
x
Eh
Dh
D
D1 view B: mounting base side
P A2
k
q2
E B
L3
L2
L1
L
1 9
Z e1 w M Q c v M
bp
e m e2
0 5 10 mm
DIMENSIONS (mm are the original dimensions) scale
UNIT A2(2) bp c D(1) D1(2) Dh E(1) Eh e e1 e2 k L L1 L2 L3 m P Q q q1 q2 v w x Z(1)
2.7 0.80 0.58 13.2 6.2 14.7 3 12.4 11.4 6.7 4.5 3.4 1.15 17.5 1.65
mm 3.5 3.5 2.54 1.27 5.08 2.8 4.85 3.8 0.8 0.3 0.02
2.3 0.65 0.48 12.8 5.8 14.3 2 11.0 10.0 5.5 3.7 3.1 0.85 16.3 3.6 1.10
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
00-07-03
SOT523-1
03-03-12
Fig 24. DBS9P package outline.

16. Soldering
16.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC

packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information

Table 11: Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Package Soldering method
Dipping Wave
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1]
PMFP[2] − not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.

17. Revision history
Table 12: Revision history

Rev Date CPCN Description
02 20040119 - Preliminary data (9397 750 12587)
Modifications:
• Minor editorial changes.
01 20030915 - Preliminary data (9397 750 10777)

18. Data sheet status
Level Data sheet status[1] Product status[2][3] Definition

I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions 20. Disclaimers

Short-form specification — The data in a short-form specification is Life support — These products are not designed for use in life support
extracted from a full data sheet with the same type number and title. For appliances, devices, or systems where malfunction of these products can
detailed information see the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
Limiting values definition — Limiting values given are in accordance with
at their own risk and agree to fully indemnify Philips Semiconductors for any
the Absolute Maximum Rating System (IEC 60134). Stress above one or
damages resulting from such application.
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any Right to make changes — Philips Semiconductors reserves the right to
other conditions above those given in the Characteristics sections of the make changes in the products - including circuits, standard cells, and/or
specification is not implied. Exposure to limiting values for extended periods software - described or contained herein in order to improve design and/or
may affect device reliability. performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Application information — Applications that are described herein for any
Change Notification (CPCN). Philips Semiconductors assumes no
of these products are for illustrative purposes only. Philips Semiconductors
responsibility or liability for the use of any of these products, conveys no
make no representation or warranty that such applications will be suitable for
licence or title under any patent, copyright, or mask work right to these
the specified use without further testing or modification.
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825

Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 4
8.1 Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
8.2 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4
8.2.1 Output power measurement . . . . . . . . . . . . . . . 5
8.2.2 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.4 Supply voltage ripple rejection . . . . . . . . . . . . . 6
8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
13 Application information. . . . . . . . . . . . . . . . . . 13
13.1 Application diagrams . . . . . . . . . . . . . . . . . . . 13
13.2 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 14
13.2.1 Layout and grounding . . . . . . . . . . . . . . . . . . . 14
13.2.2 Power supply decoupling . . . . . . . . . . . . . . . . 15
13.3 Thermal behavior and heatsink calculation . . 15
14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16
14.1 Quality information . . . . . . . . . . . . . . . . . . . . . 16
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.1 Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 18
16.2 Soldering by dipping or by solder wave . . . . . 18
16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18
16.4 Package related soldering information . . . . . . 18
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20
19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
© Koninklijke Philips Electronics N.V. 2004.

Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 19 January 2004 Document order number: 9397 750 12587

TFA9843J: 1. General Description

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TFA9843J: 1. General Description

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TFA9843J

2-channel audio amplifier (SE: 1 W to 20 W or BTL: 4 W to

The TFA9843J comes in a 9-pin DIL-bent-SIL (DBS7P) power package. The

4. Quick reference data

Preliminary data Rev. 02 — 19 January 2004 2 of 21

Fig 1. Block diagram.

Fig 2. Pin configuration.

Preliminary data Rev. 02 — 19 January 2004 3 of 21

7.2 Pin description

8.1 Input configuration

Single-ended application: Ri = 60 kΩ and Ci = 220 nF:

Bridge-tied load application: Ri = 30 kΩ and Ci = 470 nF:

8.2 Power amplifier

Using the TFA9843J as a BTL amplifier offers the following advantages:

• Lower peak value of the supply current

Preliminary data Rev. 02 — 19 January 2004 4 of 21

• No expensive DC-blocking capacitor

Table 4: Power rating as function of headroom

8.3 Mode selection

Table 5: Mode selection

Preliminary data Rev. 02 — 19 January 2004 5 of 21

standby all mute 1/2 on

0.8 4.5 VCC−3.5 VCC−2.0 VCC

Fig 3. Mode selection.

8.4 Supply voltage ripple rejection

8.5 Built-in protection circuits

Preliminary data Rev. 02 — 19 January 2004 6 of 21

10. Thermal characteristics

11. Static characteristics

[1] A minimum load (BTL) of 6 Ω is allowed at supply voltages > 22 V.

Preliminary data Rev. 02 — 19 January 2004 7 of 21

12. Dynamic characteristics

Table 10: Dynamic characteristics BTL

Preliminary data Rev. 02 — 19 January 2004 8 of 21

Vi = 50 mV; BTL; VCC = 18 V.

Preliminary data Rev. 02 — 19 January 2004 9 of 21

VCC = 18 V; SE; f = 1 kHz; RL = 4 Ω. VCC = 18 V; BTL; f = 1 kHz; RL = 8 Ω.

VCC = 18 V; SE; Po = 1 W; RL = 4 Ω. VCC = 18 V; BTL; Po = 1 W; RL = 8 Ω.

Preliminary data Rev. 02 — 19 January 2004 10 of 21

THD = 10 %; SE; RL = 4 Ω; f = 1 kHz. THD = 10 %; BTL; RL = 8 Ω; f = 1 kHz.

VCC = 18 V; SE; RL = 4 Ω. VCC = 18 V; BTL; RL = 8 Ω.

Preliminary data Rev. 02 — 19 January 2004 11 of 21

VCC = 18 V; SE; RL = 4 Ω. VCC = 18 V; BTL; RL = 8 Ω.

Preliminary data Rev. 02 — 19 January 2004 12 of 21

13. Application information

13.1 Application diagrams

MICRO- 0.5VCC 6 SVR

Fig 19. SE application diagram.

Preliminary data Rev. 02 — 19 January 2004 13 of 21

MICRO- 0.5VCC 6 SVR

Fig 20. BTL application diagram.

13.2 Printed-circuit board

Preliminary data Rev. 02 — 19 January 2004 14 of 21

AUDIO POWER CS NIJMEGEN

Fig 21. Printed-circuit board layout (single-sided); components view.

13.2.2 Power supply decoupling

13.3 Thermal behavior and heatsink calculation

Rth(tot) = (Tj(max) − Tamb(max))/PD

Preliminary data Rev. 02 — 19 January 2004 15 of 21