Pcm1795 32-Bit, 192-Khz Sampling, Advanced Segment, Stereo Audio Digital-To-Analog Converter
Pcm1795 32-Bit, 192-Khz Sampling, Advanced Segment, Stereo Audio Digital-To-Analog Converter
Pcm1795 32-Bit, 192-Khz Sampling, Advanced Segment, Stereo Audio Digital-To-Analog Converter
PCM1795
SLES248A – MAY 2009 – REVISED MARCH 2015
MDI
Function Control
MS
Function
Control I/F
IOUTR-
Current VOUTR
Segment
DAC
2 Applications MSEL
IOUTR+
VCC1
DGND
AGND2
AGND3R
VCC2R
VDD
AGND3L
VCC2L
SCK
• HDTV Receivers
• Car Audio Systems
• Digital Multitrack Recorders
• Other Applications Requiring 32-Bit Audio
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PCM1795
SLES248A – MAY 2009 – REVISED MARCH 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 21
2 Applications ........................................................... 1 7.5 Programming........................................................... 21
3 Description ............................................................. 1 7.6 Register Maps ......................................................... 27
4 Revision History..................................................... 2 8 Application and Implementation ........................ 37
8.1 Application Information............................................ 37
5 Pin Configuration and Functions ......................... 3
8.2 Typical Applications ................................................ 37
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ..................................... 5 9 Power Supply Recommendations...................... 57
6.2 ESD Ratings.............................................................. 5 10 Layout................................................................... 57
6.3 Recommended Operating Conditions....................... 5 10.1 Layout Guidelines ................................................. 57
6.4 Thermal Information .................................................. 6 10.2 Layout Example .................................................... 58
6.5 Electrical Characteristics........................................... 6 11 Device and Documentation Support ................. 59
6.6 Timing Requirements ................................................ 9 11.1 Device Support...................................................... 59
6.7 Typical Characteristics ............................................ 10 11.2 Trademarks ........................................................... 59
7 Detailed Description ............................................ 17 11.3 Electrostatic Discharge Caution ............................ 59
7.1 Overview ................................................................. 17 11.4 Glossary ................................................................ 59
7.2 Functional Block Diagram ....................................... 17 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 18 Information ........................................................... 59
4 Revision History
Changes from Original (May 2009) to Revision A Page
• Added Pin Configuration and Functions section, ESD Rating table, Recommended Operating Conditions table,
Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section ..................................................................................................................... 1
DB Package
28-Pin SSOP
(Top View)
ZEROL 1 28 VCC2L
ZEROR 2 27 AGND3L
MSEL 3 26 IOUTL-
LRCK 4 25 IOUTL+
DATA 5 24 AGND2
BCK 6 23 VCC1
SCL 7 22 VCOML
DGND 8 21 VCOMR
VDD 9 20 IREF
MS 10 19 AGND1
MDI 11 18 IOUTR-
MC 12 17 IOUTR+
MDO 13 16 AGND3R
RST 14 15 VCC2R
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
AGND1 19 — Analog ground (internal bias)
AGND2 24 — Analog ground (internal bias)
AGND3L 27 — Analog ground (left channel DACFF)
AGND3R 16 — Analog ground (right channel DACFF)
BCK 6 Input Bit clock input (1)
DATA 5 Input Serial audio data input (1)
DGND 8 — Digital ground
IOUTL+ 25 Output Left channel analog current output+
IOUTL– 26 Output Left channel analog current output–
IOUTR+ 17 Output Right channel analog current output+
IOUTR– 18 Output Right channel analog current output–
IREF 20 — Output current reference bias pin
LRCK 4 Input Left and right clock (fS) input (1)
MC 12 Input Mode control clock input (1)
MDI 11 Input Mode control data input (1)
Input or
MDO 13 Mode control read-back data output (2)
Output
Input or
MS 10 Mode control chip-select input (3); active low
Output
MSEL 3 Input I2C/SPI select (1); active low SPI select
6 Specifications
6.1 Absolute Maximum Ratings (1)
Over operating free-air temperature range, unless otherwise noted.
MIN MAX UNIT
VCC1, VCC2L, VCC2R –0.3 6.5 V
Supply voltage
VDD –0.3 4 V
Supply voltage
VCC1, VCC2L, VCC2R –0.1 0.1 V
differences
Ground voltage
AGND1, AGND2, AGND3L, AGND3R, DGND –0.1 0.1 V
differences
(2)
LRCK, DATA, BCK, SCK, MSEL, RST, MS , MDI, MC,
–0.3 6.5 V
Digital input voltage MDO (2), ZEROL (2), ZEROR (2)
ZEROL (3), ZEROR (3), MDO (3), MS (3)
–0.3 (VDD + 0.3) < 4 V
Analog input voltage –0.3 (VCC + 0.3) < 6.5 V
Input current (any pins except supplies) –10 10 mA
Ambient temperature under bias –40 125 °C
Junction temperature 150 °C
Package temperature (IR reflow, peak) 260 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input mode or I2C mode.
(3) Output mode except for I2C mode.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
(3) Dynamic performance and dc accuracy are specified at the output of the measurement circuit as shown in Figure 55.
(4) Dynamic performance and dc accuracy are specified at the output of the post-amplifier as shown in Figure 54.
t(D-HD) t(SDA-F)
t(BUF) t(D-SU) t(SDA-R) t(P-SU)
SDA
SCL
0 0.0005
Frequency Response Passband Ripple
-20 Sharp Roll-Off 0.0004 Sharp Roll-Off
0.0003
-40
0.0002
Amplitude (dB)
Amplitude (dB)
-60 0.0001
-80 0
-100 -0.0001
-0.0002
-120
-0.0003
-140
-0.0004
-160 -0.0005
0 1 2 3 4 0 0.1 0.2 0.3 0.4 0.5
Frequency (´ fS) Frequency (´ fS)
Figure 2. Amplitude vs Frequency Figure 3. Amplitude vs Frequency
0 0
Frequency Response
-20 Slow Roll-Off -2
-4
-40
-6
Amplitude (dB)
Amplitude (dB)
-60 -8
-80 -10
-100 -12
-14
-120
-16
-140 Transition Characteristics
-18 Slow Roll-Off
-160 -20
0 1 2 3 4 0 0.1 0.2 0.3 0.4 0.5 0.6
Frequency (´ fS) Frequency (´ fS)
Figure 4. Amplitude vs Frequency Figure 5. Amplitude vs Frequency
0 0.5
fS = 32 kHz fS = 32 kHz
-1 0.4
-2 0.3
De-Emphasis Level (dB)
0 0.5
fS = 44.1 kHz fS = 44.1 kHz
-1 0.4
-2 0.3
De-Emphasis Level (dB)
0 0.5
fS = 48 kHz fS = 48 kHz
-1 0.4
-2 0.3
De-Emphasis Level (dB)
-3 0.2
-4 0.1
-5 0
-6 -0.1
-7 -0.2
-8 -0.3
-9 -0.4
-10 -0.5
0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20 22
Frequency (kHz) Frequency (kHz)
Figure 10. De-Emphasis Level vs Frequency Figure 11. De-Emphasis Error vs Frequency
0.01 126
Total Harmonic Distortion + Noise (%)
fS = 192 kHz
fS = 96 kHz
124
fS = 48 kHz
118
0.0001 116
4.50 4.75 5.00 5.25 5.50 4.50 4.75 5.00 5.25 5.50
Supply Voltage (V) Supply Voltage (V)
Figure 12. THD+N vs Supply Voltage Figure 13. Dynamic Range vs Supply Voltage
126 122
fS = 48 kHz fS = 96 kHz
fS = 96 kHz
Signal-to-Noise Ratio (dB)
124 120
Channel Separation (dB)
122 118
fS = 192 kHz fS = 48 kHz fS = 192 kHz
120 116
118 114
116 112
4.50 4.75 5.00 5.25 5.50 4.50 4.75 5.00 5.25 5.50
Supply Voltage (V) Supply Voltage (V)
Figure 14. SNR vs Supply Voltage Figure 15. Channel Separation vs Supply Voltage
0.01 126
Total Harmonic Distortion + Noise (%)
fS = 96 kHz
124
fS = 48 kHz fS = 96 kHz
118
0.0001 116
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Free-Air Temperature (°C) Free-Air Temperature (°C)
Figure 16. THD+N vs Free-Air Temperature Figure 17. Dynamic Range vs Free-Air Temperature
126 122
124 120
Channel Separation (dB)
fS = 192 kHz
122 118
fS = 192 kHz fS = 48 kHz
120 116
118 114
116 112
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Free-Air Temperature (°C) Free-Air Temperature (°C)
Figure 18. SNR vs Free-Air Temperature Figure 19. Channel Separation vs Free-Air Temperature
0 0
-60-dB Output Spectrum -60-dB Output Spectrum
-20 BW = 20 kHz -20 BW = 100 kHz
PCM Mode PCM Mode
-40 fS = 48 kHz -40 fS = 96 kHz
32768 Point 8 Average 32768 Point 8 Average
Amplitude (dB)
Amplitude (dB)
-120 -120
-140 -140
-160 -160
0 2 4 6 8 10 12 14 16 18 20 0 10 20 30 40 50 60 70 80 90 100
Frequency (kHz) Frequency (kHz)
Figure 20. Amplitude vs Frequency Figure 21. Amplitude vs Frequency
(Measurement Circuit: Figure 53) (Measurement Circuit: Figure 53)
Amplitude (dB)
-136 TA = +25°C -136 TA = +25°C
-140 VDD = 3.3 V -140 VDD = 3.3 V
VCC = 5 V VCC = 5 V
-144 -144
-148 -148
-152 -152
-156 -156
-160 -160
100 1k 10 k 100 1k 10 k
Frequency (Hz) Frequency (Hz)
Figure 22. Amplitude vs Frequency Figure 23. Amplitude vs Frequency
(Measurement Circuit: Figure 53) (Measurement Circuit: Figure 53)
10 0
PCM Mode
Total Harmonic Distortion + Noise (%)
-120
0.001
-140
0.0001 -160
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 0 2 4 6 8 10 12 14 16 18 20
Input Level (dBFS) Frequency (kHz)
Figure 24. THD+N vs Input Level Figure 25. Amplitude vs Frequency
(Measurement Circuit: Figure 53) (Measurement Circuit: Figure 54)
0 0
DSD Filter-1 DSD Filter-1
Low Bandwidth High Bandwidth
-1 -10 fC = 185 kHz
Gain = -6.6 dB
-2 -20
Gain (dB)
Gain (dB)
-3 -30
-4 -40
-5 -50
-6 -60
0 50 100 150 200 0 500 k 1M 1.5 M
Frequency (kHz) Frequency (Hz)
(1)
Figure 26. Gain vs Frequency Figure 27. Gain vs Frequency
0 0
DSD Filter-2 DSD Filter-2
Low Bandwidth High Bandwidth
-1 -10 fC = 90 kHz
Gain = 0.3 dB
-2 -20
Gain (dB)
Gain (dB)
-3 -30
-4 -40
-5 -50
-6 -60
0 50 100 150 200 0 500 k 1M 1.5 M
Frequency (kHz) Frequency (Hz)
Figure 28. Gain vs Frequency Figure 29. Gain vs Frequency
0 0
DSD Filter-3 DSD Filter-3
Low Bandwidth High Bandwidth
-1 -10 fC = 85 kHz
Gain = -1.5 dB
-2 -20
Gain (dB)
Gain (dB)
-3 -30
-4 -40
-5 -50
-6 -60
0 50 100 150 200 0 500 k 1M 1.5 M
Frequency (kHz) Frequency (Hz)
Figure 30. Gain vs Frequency Figure 31. Gain vs Frequency
(1) This gain is in comparison to PCM 0 dB, when the DSD input signal efficiency is 50%.
Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: PCM1795
PCM1795
SLES248A – MAY 2009 – REVISED MARCH 2015 www.ti.com
Gain (dB)
Gain (dB)
-3 -30
-4 -40
-5 -50
-6 -60
0 50 100 150 200 0 500 k 1M 1.5 M
Frequency (kHz) Frequency (Hz)
Figure 32. Gain vs Frequency Figure 33. Gain vs Frequency
7 Detailed Description
7.1 Overview
The PCM1795 is a 32-bit, 192 kHz, differential current output stereo DAC that comes in a 28-pin SSOP package.
The PCM1795 device is software controlled through I2C or SPI, and utilizes the advanced segment DAC
architecture from TI in order to perform with a Stereo Dynamic Range of 123 dB (126 dB Mono) and SNR of 123
dB (126 dB Mono) with a THD of 0.0005%. The balanced current outputs allow the user to customize the analog
performance externally.
The PCM1795 device will use the SCK input as its system clock and automatically detect the sampling rate of
the digital audio input and has a high tolerance for clock jitter. The PCM1795 device supports both PCM and
DSD formats for audio input along with the TDMA or time-division-multiplexed command and audio-data format.
The internal filter can be bypassed to allow for an external digital filter to be used.
IOUTL-
LRCK
MDI
MC IOUTR-
Function
MS Control I/F
Current VOUTR
Segment
DAC
IOUTR+
MSEL
VCC1
DGND
AGND2
AGND3R
VCC2R
VDD
AGND3L
VCC2L
SCK
LRCK 1.4 V
BCK 1.4 V
t(BCY) t(BL)
DATA 1.4 V
t(DS) t(DH)
1/fS
BCK
DATA 14 15 16 1 2 15 16 1 2 15 16
MSB LSB
DATA 22 23 24 1 2 23 24 1 2 23 24
MSB LSB
Audio Data Word = 32-Bit, BCK ³ 64 fS
DATA 30 31 32 1 2 31 32 1 2 31 32
MSB LSB
Figure 35. Audio Data Input Format: Standard Data Format (Right-Justified), Left Channel = High, Right
Channel = Low
1/fS
BCK
DATA 1 2 23 24 1 2 23 24 1 2
MSB LSB
Figure 36. Audio Data Input Format: Left-Justified Data Format, Left Channel = High, Right Channel =
Low
1/fS
LRCK
Left Channel Right Channel
BCK
DATA 1 2 23 24 1 2 23 24 1 2
MSB LSB
Audio Data Word = 32-Bit, BCK ³ 64 fS
DATA 1 2 31 32 1 2 31 32 1 2
MSB LSB
2
Figure 37. Audio Data Input Format: I S Data Format, Left Channel = Low, Right Channel = High
(1) VOUTN is the output of U1, VOUTP is the output of U2, and VOUT is the output of U3 in the measurement circuit of Figure 53.
-1
IOUTN
Output Current (mA)
-2
-3
-4
-5
IOUTP
-6
80000000 (-FS) 000000 (BPZ) 7FFFFFFF (+FS)
Input Code (Hex)
7.5 Programming
(1) This system clock rate is not supported in I2C fast mode.
(2) This system clock rate is not supported for the given sampling frequency.
t(SCKH)
High
2V
System Clock
(SCK)
0.8 V
Low
t(SCKL)
t(SCY)
Internal Reset
System Clock
t(RST)
Reset Reset Removal
Internal Reset
MS
MC
MDI R/W A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
t(MHH)
MS 1.4 V
t(MSS)
t(MCH) t(MCL)
t(MSH)
MC 1.4 V
t(MCY)
LSB
MDI 1.4 V
t(MDS) t(MOS)
t(MDH)
SDA
SCL St 17 8 9 18 9 18 9 9 Sp
Transmitter M M M S M S M S S M
Data Type St Slave Address W ACK DATA ACK DATA ACK ACK Sp
Read Operation
Transmitter M M M S S M S M M M
Data Type St Slave Address R ACK DATA ACK DATA ACK NACK Sp
Transmitter M M M S M S M S M S S M
Data Type St Slave Address W ACK Register Address ACK Write Data 1 ACK Write Data 2 ACK NACK Sp
Transmitter M M M S M S M M M S S M M M
Data Type St Slave Address W ACK Register Address ACK Sr Slave Address R ACK Data ACK NACK Sp
SCL
Noise
SDA
When these conditions occur at the same time, the data are recognized as low.
Case 2:
1. t(SCK) > 120 ns
2. t(S–HD) or t(RS–HD) < t(SCK) × 5
3. Spike noise exists on both SCL and SDA during the hold time.
SCL
Noise
SDA
When these conditions occur at the same time, the PCM1795 fails to detect a start condition.
Case 3:
1. t(SCK) < 50 ns
2. t(SP) > t(SCK)
3. Spike noise exists on SCL just after SCL goes low.
4. Spike noise exists on SDA just before SCL goes low.
SCL
SDA
Noise
When these conditions occur at the same time, the PCM1795 erroneously detects a start or stop condition.
(1) When in DSD mode, DMF[1:0] is defined as DSD filter (analog FIR) performance selection.
(2) When in DSD mode, OS[1:0] is defined as DSD filter (analog FIR) operating rate selection.
Register 17 R/W 0 0 1 0 0 0 1 ATR7 ATR6 ATR5 ATR4 ATR3 ATR2 ATR1 ATR0
The ATLD bit is used to enable loading of the attenuation data contained in registers 16 and 17. When ATLD =
0, the attenuation settings remain at the previously programmed levels, ignoring new data loaded from registers
16 and 17. When ATLD = 1, attenuation data written to registers 16 and 17 is loaded normally.
The FMT[2:0] bits are used to select the data format for the serial audio interface.
For the external digital filter interface mode (DFTH mode), this register is operated as shown in Application for
External Digital Filter Interface.
The DMF[1:0] bits are used to select the sampling frequency used by the digital de-emphasis function when it is
enabled by setting the DME bit. The de-emphasis curves are shown in Typical Characteristics.
For the DSD mode, analog FIR filter performance can be selected using this register. A register map and filter
response plots are shown in Application For DSD Format (DSD Mode) Interface.
The DME bit is used to enable or disable the de-emphasis function for both channels.
The MUTE bit is used to enable or disable the soft mute function for both channels.
Soft mute is operated as a 256-step attenuator. The speed for each step to –∞ dB (mute) is determined by the
attenuation rate selected in the ATS register.
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
Register 19 R/W 0 0 1 0 0 1 1 REV ATS1 ATS0 OPE RSV DMFS FLT INZD
The REV bit is used to invert the output phase for both channels.
The ATS[1:0] bits are used to select the rate at which the attenuator is decremented/incremented during level
transitions.
The OPE bit is used to enable or disable the analog output for both channels. Disabling the analog outputs
forces them to the bipolar zero level (BPZ) even if audio data are present on the input.
The DFMS bit is used to enable stereo operation in DF bypass mode. In the DF bypass mode, when DFMS is
set to '0', the pin for the input data are DATA (pin 5) only; therefore, the PCM1795 operates as a monaural DAC.
When DFMS is set to '1', the PCM1795 can operate as a stereo DAC with inputs of the left channel and right
channel data on ZEROL (pin 1) and ZEROR (pin 2), respectively.
The FLT bit is used to select the digital filter roll-off characteristic. The filter responses for these selections are
shown in Typical Characteristics.
The INZD bit is used to enable or disable the zero detect mute function. Setting INZD to '1' forces muted analog
outputs to hold a bipolar zero level when the PCM1795 detects a zero condition in both channels. The infinite
zero detect mute function is not available in the DSD mode.
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
Register 20 R/W 0 0 1 0 1 0 0 RSV SRST DSD DFTH MONO CHSL OS1 OS0
The SRST bit is used to reset the PCM1795 to the initial system condition.
The DSD bit is used to enable or disable the DSD interface mode.
The DFTH bit is used to enable or disable the external digital filter interface mode.
The MONO function is used to change operation mode from the normal stereo mode to the monaural mode.
When the monaural mode is selected, both DACs operate in a balanced mode for one channel of audio input
data. Channel selection is available for left-channel or right-channel data, determined by the CHSL bit.
The OS bits are used to change the oversampling rate of ΔΣ modulation. Use of this function enables the
designer to stabilize the conditions at the post low-pass filter for different sampling rates. As an application
example, programming to set 128 times in 44.1-kHz operation, 64 times in 96-kHz operation, or 32 times in 192-
kHz operation allows the use of only a single type (cut-off frequency) of post low-pass filter. The 128-fS
oversampling rate is not available at sampling rates above 100 kHz. If the 128-fS oversampling rate is selected, a
system clock of more than 256 fS is required.
In DSD mode, these bits are used to select the speed of the bit clock for DSD data coming into the analog FIR
filter.
The DZ bits are used to enable or disable the output zero flags and to select the zero pattern in DSD mode.
The PCMZ bit is used to enable or disable the output zero flags in PCM mode and the external DF mode.
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
Register 22 R 0 0 1 0 1 1 0 RSV RSV RSV RSV RSV RSV ZFGR ZFGL
These bits show zero conditions. The status is the same as that of the zero flags at ZEROL (pin 1) and ZEROR
(pin 2). See Zero Detect.
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
Register 23 R 0 0 1 0 1 1 1 RSV RSV RSV ID4 ID3 ID2 ID1 ID0
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
PCM1796
8 DGND VCOMR 21 RF
0.1 mF 10 kW
9 VDD IREF 20
–
10 MS AGND1 19
+
Differential-
11 MDI IOUTR– 18 CF to-Single
Converter VOUT
Controller 12 MC IOUTR+ 17 RF With Right Channel
0.1 mF Low-Pass
13 MDO AGND3R 16 Filter
+ –
14 RST VCC2R 15 5V
10 mF +
10 mF
+
3.3 V
Figure 52. Typical Application Circuit for Standard PCM Audio Operation
C1
2700 pF
R1
820 W
VCC
VCC
C11
0.1 mF R5 C3 C15
C17 200 W 8200 pF 0.1 mF
7 22 pF C19
5 R3 R7 22 pF
2 8 7
IOUT- – 220 W 180 W 5
6 2 8 R9
– 100 W
3 6
+ C5
U1
27000 pF 3
4 NE5534 + U3
C12 4 NE5534
0.1 mF R4 R8 C16
220 W R6 180 W 0.1 mF
200 W C4
VEE
8200 pF
VEE
C2
2700 pF
R2
820 W
VCC
C13
0.1 mF
C18
7 22 pF
5
2 8
IOUT+ –
6
3
+ U2
4 NE5534
C14
0.1 mF
VEE
C1
2200 pF
R1
820 W
VCC
VCC
C11
0.1 mF R5 C5 C15
C17 150 W 8200 pF 0.1 mF
7 22 pF C19
5 R3 R8 R10 22 pF
2 8 7
IOUT- – 91 W 75 W 120 W 5
6 2 8 R7
– 100W
3 6
+ C3 C4
U1
22000 pF 27000 pF 3
4 NE5534 + U3
C12 4 NE5534
0.1 mF R4 R9 R11 C16
91 W 75 W R6 120 W 0.1 mF
150 W C6
VEE
8200 pF
VEE
C2
2200 pF
R2
820 W
VCC
C13
0.1 mF
C18
7 22 pF
5
2 8
IOUT+ –
6
3
+ U2
4 NE5534
C14
0.1 mF
VEE
3
1
2
IOUTR- (Pin 18) IOUT-
(1)
OUT-
Circuit
Balanced Out
IOUTR+ (Pin 17) IOUT+
0.0005 0
Passband Ripple
0.0004 Sharp Roll-Off -2
0.0003 -4
0.0002 -6
Amplitude (dB)
Amplitude (dB)
0.0001 -8
0 -10
-0.0001 -12
-0.0002 -14
-0.0003 -16
Transition Characteristics
-0.0004 -18 Slow Roll-Off
-0.0005 -20
0 0.1 0.2 0.3 0.4 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6
Frequency (´ fS) Frequency (´ fS)
Figure 56. Amplitude vs Frequency Figure 57. Amplitude vs Frequency
1 ZEROL
2 ZEROR
3 MSEL
DATA 5 DATA
BCK 6 BCK
SCK 7 SCK
DFMS = 1
DATA_L 1 ZEROL
DATA_R 2 ZEROR
3 MSEL
5 DATA
BCK 6 BCK
SCK 7 SCK
Figure 58. Connection Diagram for External Digital Filter (Internal DF Bypass Mode) Application
8.2.2.2.2 Pin Assignment When Using the External Digital Filter Interface
• LRCK (pin 4): WDCK as word clock input
• BCK (pin 6): Bit clock for audio data
• DATA (pin 5): Monaural audio data input when the DFMS bit is not set to 1
• ZEROL (pin 1): DATAL as left channel audio data input when the DFMS bit is set to 1
• ZEROR (pin 2): DATAR as right channel audio data input when the DFMS bit is set to 1
WDCK
BCK
MSB LSB
Audio Data Word = 32-Bit
MSB LSB
Audio Data Word = 24-Bit
MSB LSB
Figure 59. Audio Data Input Format for External Digital Filter (Internal DF Bypass Mode) Application
WDCK 1.4 V
BCK 1.4 V
t(BCY) t(BL)
DATA
DATAL 1.4 V
DATAR
t(DS) t(DH)
Figure 60. Audio Interface Timing for External Digital Filter (Internal DF Bypass Mode) Application
The effective oversampling rate is determined by the oversampling performed by both the external digital filter
and the ΔΣ modulator. For example, if the external digital filter is 8× oversampling, and OS[1:0] = 00 is selected,
then the ΔΣ modulator oversamples by 8×, resulting in an effective oversampling rate of 64×. The 16× WDCK
oversampling rate is not available above a 100-kHz sampling rate. If the oversampling rate selected is 16×
WDCK, the system clock frequency must be over 256 fS.
0.0005 0
Passband Ripple
0.0004 Sharp Roll-Off -2
0.0003 -4
0.0002 -6
Amplitude (dB)
Amplitude (dB)
0.0001 -8
0 -10
-0.0001 -12
-0.0002 -14
-0.0003 -16
Transition Characteristics
-0.0004 -18 Slow Roll-Off
-0.0005 -20
0 0.1 0.2 0.3 0.4 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6
Frequency (´ fS) Frequency (´ fS)
Figure 61. Amplitude vs Frequency Figure 62. Amplitude vs Frequency
1 ZEROL
2 ZEROR
3 MSEL
DATA_R 4 LRCK
DATA_L 5 DATA
6 BCK
8.2.3.2.1 Features
This mode is used for interfacing directly to a DSD decoder, which is found in Super Audio CD™ (SACD)
applications.
The DSD mode is accessed by programming the following bit in the corresponding control register.
• DSD = 1 (register 20)
The DSD mode provides a low-pass filtering function. The filtering is provided using an analog FIR filter structure.
Four FIR responses are available and are selected by the DMF[1:0] bits of control register 18.
The DSD bit must be set before inputting DSD data; otherwise, the PCM1795 erroneously detects the TDMCA
mode and commands are not accepted through the serial control interface.
DBCK
DSDL,
D0 D1 D2 D3 D4
DSDR
t(BCH) t(BCL)
DBCK 1.4 V
t(BCY)
DSDL,
1.4 V
DSDR
t(DS) t(DH)
(1) 2.8224 MHz × 4. (2.8224 MHz = 64 × 44.1 kHz. This value is specified as a sampling rate of DSD.
Plots for the four analog finite impulse response (FIR) filter responses are shown in Analog FIR Filter
Performance in DSD Mode .
The OS bit in the DSD mode is used to select the operating rate of the analog FIR. The OS bits must be set
before setting the DSD bit to '1'.
0.0005 0
Passband Ripple
0.0004 Sharp Roll-Off -2
0.0003 -4
0.0002 -6
Amplitude (dB)
Amplitude (dB)
0.0001 -8
0 -10
-0.0001 -12
-0.0002 -14
-0.0003 -16
Transition Characteristics
-0.0004 -18 Slow Roll-Off
-0.0005 -20
0 0.1 0.2 0.3 0.4 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6
Frequency (´ fS) Frequency (´ fS)
Figure 66. Amplitude vs Frequency Figure 67. Amplitude vs Frequency
DCO
DR DO
TI DSP Device ID = 1
Command
Pre-TDMCA Frame TDMCA Frame
Accept
LRCK
2 BCKs
BCK
Figure 69. LRCK and BCK Timing for Determination of TDMCA Mode
DCI
DCI
DCI
DCIi
DCOi
DCIi
DCOi
DCO
DCO
DCO
DCO
¼ ¼
IN IN
IN Device IN Device NO Device NO Device
IN/OUT ¼ IN/OUT
Device Device
OUT Device OUT Device NO Device NO Device
OUT OUT
DCOo
DCOo
¼ ¼
DCIo
DCIo
DCO
DCO
DCO
DCO
DCI
DCI
DCI
DCI
OUT Chain
DCII
LRCK
DCOI
BCK IN/OUT
Device
DI (DIX1700)
DCIO
DO
DCOO
Device ID = 1
LRCK DCI
IN Device
BCK (PCM1795)
DI DCO
DO
Device ID = 2
LRCK DCI
NO Device
BCK
DI DCO
DO
Device ID = 3
¼
DR DO Device ID = 2
TI DSP
LRCK DCI
OUT Device
BCK
DI DCO
DO
Device ID = 3
¼
Figure 71. IN Daisy-Chain and OUT Daisy-Chain Connection Example for a Multichip System
LRCK
BCK
Device ID = 1 DCO1
DCO1,
Device ID = 2
DCI2
DCO2,
Device ID = 3
DCI3
58 BCKs
DCO29,
Device ID = 30
DCI30
1/fS
LRCK
BCK
[For Initialization]
Don’t
DI CMD EMD EMD EMD EMD EMD Care CMD
32 Bits
DO CMD CMD CMD CMD CMD CMD
[For Operation]
Don’t
DI CMD Ch 1 Ch 2 Ch 3 Ch 4 Ch (n) Care CMD
DO CMD Ch 1 Ch 2 Ch 3 Ch 4 Ch (m)
7 Packets ´ 32 Bits
LRCK
BCK
Don’t
DI CMD Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Care CMD
DO CMD Ch 1 Ch 2
Figure 74. TDMCA Frame Example of Six-Channel DAC and Two-Channel ADC With Command Read
Command DID EMD DCS Device ID R/W Register ID Data Not Used
Extended Command RSVD EMD DCS Device ID R/W Register ID Data Not Used
BCK
DI Read Mode and Proper Register ID Write Data Retrieved, if Write Mode
1 BCK Early
DOEN
(Internal)
9 Packets ´ 32 Bits
LRCK
BCK
IN Daisy Chain
DCI1
DID = 1
DCO1
DCI2
DID = 2
DCO2
DCI3
DID = 3
DCO3
DCI4
DID = 4
DCO4
BCK
DCI
DID = 1
DCO
DCI
2 BCK Delay
DID = 2
DCO
¼
14 BCK Delay
DCI
DID = 8
DCO
Command Packet
LRCK
BCK
DI DID EMD
DCO1
DCO2
¼
Figure 81. DCO Output Timing With Skip Operation (for Command Packet 1)
LRCK
t(LB) t(BL)
BCK
DI
t(DOE)
DO
t(DS)
t(DH)
DCI
t(COE)
DCO
10 Layout
5V
+
1 ZeroL VCC2L 28
Signals to host 0.1 µF 10 µF
2 ZeroR AGND3L 27
3.3V +
8 DGND VcomR 21
10 KO
10 µF 0.1 µF 9 VDD Iref 20
10 MS AGND1 19
14 RST VCC2R 15 5V
+
0.1 µF 10 µF
11.2 Trademarks
System Two, Audio Precision are trademarks of Audio Precision, Inc.
SPI is a trademark of Motorola.
Pacific Microsonics is a trademark of Pacific Microsonics, Inc.
Super Audio CD is a trademark of Sony Corporation.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 6-Feb-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Dec-2019
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Dec-2019
Pack Materials-Page 2
PACKAGE OUTLINE
DB0028A SCALE 1.500
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
C
8.2
TYP
A 7.4
0.1 C SEATING
PIN 1 INDEX AREA
PLANE
26X 0.65
28
1
2X
10.5
8.45
9.9
NOTE 3
14
15
0.38
28X
0.22
5.6 0.15 C A B
B
5.0
NOTE 4
2 MAX
(0.15) TYP 0.25
SEE DETAIL A GAGE PLANE
DETAIL A
A 15
TYPICAL
4214853/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
www.ti.com
EXAMPLE BOARD LAYOUT
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
1 (R0.05) TYP
28X (0.45) 28
26X (0.65)
SYMM
14 15
(7)
4214853/B 03/2018
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
26X (0.65)
SYMM
14 15
(7)
4214853/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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