Development of TEC System For Commercial Cooling Applications

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Modern Applied Science April, 2009

Development of TEC System for Commercial Cooling Applications

Wael Salah, Soib Taib & Anwar Al-Mofleh


School of Electrical and Electronic Engineering
Universiti Sains Malaysia, Engineering Campus
14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
Tel: 60-4-5995-999 ext. 6073, Fax: 60-4-594-1023 E-mail: wael_sal@eng.usm.my

Abstract
This paper represents the possibility of using the TEC-Thermo Electric Coolers in cooling applications. Such
application with small area away connected is possible with the use solar energy as power source. Factors affecting the
performance of TE will discussed also. The effect of Heat Sink Extender (HSE) for TEC assembling will be considered.
TEC performance is tested for different modules. The assembling for best performance of TEC and the supply
requirements using PV as a power source is presented for potential commercialization.
Keywords: TEC, Cooling, TE performance, Heat Sink Extender, Photovoltaic
1. Introduction
A thermoelectric (TE) cooler, is a semiconductor-based electronic component that functions as a small heat pump. By
applying a low-voltage DC power source to a TE module, heat will be moved through the module from one side to the
other. One module face will be cooled while the opposite face simultaneously is heated. Thermoelectric modules as
shown in Figure 1 are solid-state heat pumps that operate on the Peltier effect.
The widely availability of Thermoelectric cooling (TEC) modules, making them a potential equipments to be apply for
the thermal run away in electronics circuits. The TEC modules, which have a maximum rated operating temperature of
200 °C makes thermoelectric cooling a possible option in the thermal management of high temperature electronic
packaging.
1.1 Advantages of a thermoelectric unit over a compressor
Thermoelectric modules have no moving parts and do not require the use of chlorofluorocarbons. Therefore they are
inherently reliable and are virtually maintenance free. They can be operated in any orientation and are ideal for cooling
devices that may be sensitive to mechanical vibration. Their compact size also makes them ideal for applications that
are size or weight limited where even the smallest compressor would have excess capacity. Their ability to heat and cool
lends them to applications where both heating and cooling is necessary or where precise temperature control is critical.
1.2 TEC Operation
Electrons can travel freely in the copper conductors but not so freely in the semiconductor. As the electrons leave the
copper and enter the hot-side of the p-type, they must fill a "hole" in order to move through the p-type. When the
electrons fill a hole, they drop down to a lower energy level and release heat in the process. Essentially the holes in the
p-type are moving from the cold side to the hot side. Then, as the electrons move from the p-type into the copper
conductor on the cold side, the electrons are bumped back to a higher energy level and absorb heat in the process. Next,
the electrons move freely through the copper until they reach the cold side of the n-type semiconductor. The electrons
bump up an energy level when they move into the n-type in order to move through the semiconductor then heat is
absorbed, then the electrons leave the hot-side of the n-type and move freely in the copper and drop down to a lower
energy level and release heat in the process.
1.3 TEC reliability
Thermoelectric systems are highly reliable provided they are installed and used in an appropriate manner. The specific
reliability of thermoelectric coolers tends to be difficult to define because failure rates are highly dependent upon the
particular application. Thermoelectric modules that are at steady state (constant power, heat load, temperature, etc.) can
have mean time between failures (MTBFs) in excess of 200,000 hours.
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1.4 Cool by nature


Environmental friendly cooling could be obtained by the use of TEC because there is no chlorofluorocarbons (CFCs)
and also no need for refills. Once the thermoelectric cooling is implemented then there will be no worries that the
cooling system has a negative impact on the environment as compared to the traditional cooling system.
1.5 TEC Installation
The two wires attached at the side of TEC is known as hot side if the red/black wire is connected to positive
voltage/ground respectively. Usually, the red wire is positive and the black wire is ground. The hot side and cold side of
TEC can be swapped if the red/black wire polarity is swapped.
2. TEC Cooling Design
2.1 TEC Proper fit consideration
The proper fit between the heat side of TEC and the heat sink affect the performance of TEC, good thermal conduction
will lead to better performance, although good thermal isolation between heat and cold side will give better
performance. Figure 2 shows a single TEC module with the heat side attached to a heat sink and the cool side is free to
air. Figure 3 shows the temperature measured direct form TEC cold side. This shows two states of measurements ie. the
data measured good thermal conduction of heat sink and hot side of TEC and the other one with bad thermal conduction.
The proper fit of TEC will improve its performance, especially when heat sink compound is added.
2.2 Thermal isolation
Selecting a proper heat sink is very important when a thermoelectric cooling system is designed. Usually, temperature
of a heat sink rises 10ºC above the ambient temperature after TEC is applied with a proper voltage and the cold side of
TEC is without any heat load. The different TEC has a different operating voltage. Heat pump power is proportional to
voltage power. The bigger the heat sink on hot side of TEC the better the performance of TEC.
For the best performance to be achieved for the TEC module, a good thermal isolation between hot and cold side is
important since the distance between the two sides is so critical. To overcome such problem the extension of heat sink
could be used for several purposes. One is to increase the distance from the heat sink plate to the cold sink plate. This
allows for thicker insulation and longer assembly bolts. As a result, heat conducting from the heat sink plate back to the
cold sink plate is reduced. Another purpose involves temperature control. In certain control schemes, the TE system
operates until a thermostat trips off.
With a Heat Sink Extender in use, there will be a larger thermal resistance exist between the heated and cold sink. As a
result, the cold space does not heat back up as quickly as compared with a systems that do not employ HSEs. Figure 4
shows the TEC module attached to a heat sink with extender. Probably the most important use of an extender is when
the extender serves as a thermal junction. In many applications, a TE system is used to cool an insulated box. The cold
sink and heat sink are separated by the thickness of the box’s insulation. The extender, therefore, is used to thermally
join the TE module to either the cold sink or the heat sink.
Table 1 shows the data taken using single module with HSE. A comparison with the above test without HSE shows that
the temperature at cold side it higher; i.e. less cool but still convenient. On the other hand less heat at the hot side of the
TEC module that attached to HSE. As shown in Table 1 the temperature at cold side is higher compared to without HSE.
But the temperature at the cooled side also is lower referring to tests without HSE.
3. Cooling Applications
The precious section shows that the effect of good heat isolation is quite sensitive to the TEC performance. The small
size and simplicity make TE the best choice to be applied for cooling application. One of the main application that can
be considered is the cooling of away connected electronics, such as in the telecommunication cabinets. This cooling
arrangement can be easily supplied from a PV panel with a DC-DC converter. The input power to the DC-DC converter
will be supplied from an input solar panel of 72W power rating. The use of PV as a power source for the converter
make it reliable for outdoor cooling applications.
Figure 5 shows a developed prototype for TEC cooling. This prototype uses 4 TECs of 15x15x3 mm size that attached
to the four sides of the cooling box. This prototype is tested using the developed converter and draw a current of 2 to 5
amps. And the measured outlet temperature is 17 to 15 °C referring to ambient temperature of around 23 to 21 °C.
Figure 6 shows the TEC modules attached to heat sink (30x17x4 cm), then the spaces have to be filled by Teflon thin
sheets. The cold side of TEC modules are attached to an aluminum sheet. Then the sheet is attached to testing a cabinet.
The experiment is conducted to test the TEC function as shown in Figure 7. The TEC was connected in parallel
combination and it’s required about 12A current , which provided by a DC converter.
A sample of solar fridge prototype unit is developed using four TEC as shown in Figure 8. The prototype with a 12 in x
8 in x 6 dimension capable to function in both cooling and heating operation. The unit takes about 30 minutes to reach

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Modern Applied Science April, 2009

the minimum temperature of 18 °C within the compartment. This invention uses sunlight which is captured by an array
of solar panel of 70W. The coling is being preseved by a quality insulation, thus food and drinks cooled quickly even at
high outside temperature.
The operation is controlled manually by switch which is located at the back of the unit.
Conclusion
The TEC cooling technique is found to be free of some problems attached to traditional cooling techniques such as
noise, size and vibration. In addition it has no side effect on the environment with zero emission of CO2 gas. The paper
had discussed the use of the TEC-Thermo Electric Coolers in the off-grid mode where solar energy is used as power
source. The TE performance found to be affected by many factors such as the usage of HSE and TEC proper fit
assembling. The prototype TEC fridge has the potential for commercialization.
References
C. Lertsatitthanakorn (2003), Cooling Performance of Thermoelectric Water Cooler, Naresuan University Journal:
11(2), pp: 1-9.
Jianzhong, Z., Tiemin, W., Xueming, L., Guanghui, T. (1998), Application of the thermoelectric cooler in the
seventeenth Chinese retrievable satellite, Proceedings of the 5th International Conference on Solid-State and Integrated
Circuit Technology, pp: 865 - 868.
MAGALAND TECHNOLOGY, INC., (2007). Thermoelectric Cooling Modules Application Note. Available:
www.magaland.com (August, 2007).
Moores, K.A., Joshi, Y.K., Miller, G.. (1999). Performance assessment of thermoelectric coolers for use in high
temperature electronics applications, Eighteenth International Conference on Thermoelectrics, pp:31 – 34.
Optimizing TEC Drive Current Application Note (2006). Available: www.ilxlightwave.com.
Optimizing TEC Drive Current Application Note (2006). Available: www.ilxlightwave.com.
Paul G. Lau, Todd M. Ritzer and Richard J. Buist, (2005). Thermodynamic Optimization of Heat/Cold Sink Extenders
in Thermoelectric Cooling Assemblies. TE Technology, Inc., Michigan 49686 USA.
Supercool AB (2005). Available: www.supercool.com.
Supercool AB. (2007). Available: www.supercool.com (Nov., 2007).
TE Technology Inc, (2007). Available: www.tetech.com/techinfo (June, 2007).
Thermoelectric Handbook (2006). Available: www.melcor.com (May, 2006).

Table 1. TEC with HSE


Amps Cold side Hot side (HSE)
0 23 23
0.5 20 24
1 18 25
1.5 15 25
2 12 26
2.5 6 27
3 1 28
3.5 -3 30

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Figure 1. TEC Module

TEC Heat Side coduction

25

20

15

10 bad conduction
5 Good conduction

0
0 1 2 3 4
-5

-10

Figure 2. TEC direct measured temperature at cold side

Figure 3. TEC module with the heat sink

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Modern Applied Science April, 2009

Figure 4. Heat sink with extender

Figure 5. A developed TEC cooling prototype

Figure 6. TEC modules attached to heat sink

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Figure 7. TEC modules attached to test cabinet

Figure 8. Mini solar and heater

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