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    Hot Solder Dip Prevents Rust

    Uploaded by

    Daoud Miourigh
    Hot solder dipping is a process that involves submerging metal components into a bath of molten tin/lead alloy above 370°F. This creates a thin layer of intermetallic alloy between the component and solder, followed by a layer of pure solder. The solder coating provides benefits like easier soldering, preventing rust and oxidation, and greater wear/corrosion resistance. While it is less precise than electroplating, dip soldering is a common technique used in circuit board manufacturing and small-scale electronics production.

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    Hot Solder Dip Prevents Rust

    Uploaded by

    Daoud Miourigh
    57 views4 pages
    Hot solder dipping is a process that involves submerging metal components into a bath of molten tin/lead alloy above 370°F. This creates a thin layer of intermetallic alloy between the component and solder, followed by a layer of pure solder. The solder coating provides benefits like easier soldering, preventing rust and oxidation, and greater wear/corrosion resistance. While it is less precise than electroplating, dip soldering is a common technique used in circuit board manufacturing and small-scale electronics production.

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    Hot solder dipping is a process that involves submerging metal components into a bath of molten tin/lead alloy above 370°F. This creates a thin layer of intermetallic alloy between the component and solder, followed by a layer of pure solder. The solder coating provides benefits like easier soldering, preventing rust and oxidation, and greater wear/corrosion resistance. While it is less precise than electroplating, dip soldering is a common technique used in circuit board manufacturing and small-scale electronics production.

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Download as docx, pdf, or txt
    57 views4 pages

    Hot Solder Dip Prevents Rust

    Uploaded by

    Daoud Miourigh
    Hot solder dipping is a process that involves submerging metal components into a bath of molten tin/lead alloy above 370°F. This creates a thin layer of intermetallic alloy between the component and solder, followed by a layer of pure solder. The solder coating provides benefits like easier soldering, preventing rust and oxidation, and greater wear/corrosion resistance. While it is less precise than electroplating, dip soldering is a common technique used in circuit board manufacturing and small-scale electronics production.

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    © All Rights Reserved
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    What Is Hot Solder Dipping?

    Hot solder dip is the process of immersing a part into a bath of a molten tin/lead alloy at a
    temperature greater than at 370°F (188°C). The coating that's produced consists of a very thin
    intermetallic layer that first forms at the interface of the base material and the tin (for example,
    when dipping copper or copper alloys, a copper/tin alloy is formed) followed by a layer of pure
    solder. Note: no intermetallics of lead form, only those of tin and the base metal.

    Hot Solder Dipping Has Significant Benefits

    Easier To Solder

    Solder coatings are easier to solder than those of pure tin, since the lower melting point of the
    solder allows for a variety of heating methods.

    Restores Solderability

    Solder by its very nature is solderable, which makes it a desirable finish for electronic component
    assembly.

    Prevents Rusting

    For steel, the hot solder coating prevents the base material from rusting.

    Prevents Oxidizing

    For copper and copper alloys, the hot solder coating prevents the base material from oxidizing.

    Wear & Corrosion Resistant

    A solder layer provides greater wear and corrosion resistance than that of most base materials.

    Hot Solder Dipping Prevents Whisker Growth

    The presence of lead is the only proven strategy for preventing the formation of whiskers.

    Hot Solder Dip Meets ASTM A1074-11 Specifications

    Hi-Tech Plating & Tinning processes to ASTM A1074-11 and all MIL specs.  For your convenience,
    you can download the ASTM A1074-11 Specifications here.

    Soldalum For Aluminum

    Soldalum is a registered process for applying hot solder dip to aluminum without blistering
    occurring. It is used on critical aluminum components where whiskers and blisters are not an
    option. Soldalum also increases shelf life. Please specify Soldalum when you send us a quote.

    Hot Solder Coating Versus Electroplated Coatings

    The hot solder dip process is an alternative to electroplating, and provides specific benefits over
    electroplating:

     Less porous than electroplating.


     More ductile than electroplating.
     Virtually stress-free.
     More economical than electroplating.
     Better corrosion resistance than electroplating.
     Penetrates and coats inside walls of many "through" holes.

    Hot Solder Dip Disadvantages.


    The thickness of a coating provided by Hot Solder Dipping is not as well controlled when compared
    to that provided by electroplating methods. Hot solder dipping should not be used when tight
    tolerances are required or when the base part has fine details that could be obscured by a thicker
    plating layer.

    Call The Tinning Company Today


    The Tinning Company will work with you to ensure that the right type of plating is selected for your
    application. Put our expertise - and our world-class quality and service - to work for you toda

    Hot Solder Dipping Has Significant Benefits


     

     Easier To Solder

    Solder coatings are easier to solder than those of pure tin, since the lower melting point of the
    solder allows for a variety of heating methods.

     Restores Solderability

    Solder by its very nature is solderable, which makes it a desirable finish for electronic component
    assembly.

     Prevents Rusting

    For steel, the hot solder coating prevents the base material from rusting.

     Prevents Oxidizing

    For copper and copper alloys, the hot solder coating prevents the base material from oxidizing.

     Wear & Corrosion Resistant

    A solder layer provides greater wear and corrosion resistance than that of most base materials.

    Hot Solder Dipping Prevents Whisker Growth


    The presence of lead is the only proven strategy for preventing the formation of whiskers.

    Hot Solder Dip Meets ASTM A1074-11 Specifications


    Hi-Tech Plating & Tinning processes to ASTM A1074-11 and all MIL specs.  For your convenience,
    you can download the ASTM A1074-11 Specifications here.

    Soldalum For Aluminum


    Soldalum is a registered process for applying hot solder dip to aluminum without blistering
    occurring. It is used on critical aluminum components where whiskers and blisters are not an
    option. Soldalum also increases shelf life. Please specify Soldalum when you send us a quote.

    Hot Solder Coating Versus Electroplated Coatings


    The hot solder dip process is an alternative to electroplating, and provides specific benefits over
    electroplating:

     Less porous than electroplating.


     More ductile than electroplating.
     Virtually stress-free.
     More economical than electroplating.
     Better corrosion resistance than electroplating.
     Penetrates and coats inside walls of many "through" holes.

    Hot Solder Dip Disadvantages.


    The thickness of a coating provided by Hot Solder Dipping is not as well controlled when compared
    to that provided by electroplating methods. Hot solder dipping should not be used when tight
    tolerances are required or when the base part has fine details that could be obscured by a thicker
    plating layer.

    Call The Tinning Company Today


    The Tinning Company will work with you to ensure that the right type of plating is selected for your
    application. Put our expertise - and our world-class quality and service - to work for you toda

    Dip soldering is a small-scale soldering process by which electronic components are soldered to


    a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed
    metallic areas of the board (those not protected with solder mask), creating a reliable mechanical
    and electrical connection.
    Dip soldering is used for both through-hole printed circuit assemblies, and surface mount. It is
    one of the cheapest methods to solder and is extensively used in the small scale industries of
    developing countries .
    Dip soldering is the manual equivalent of automated wave soldering. The apparatus required is
    just a small tank containing molten solder. A PCB with mounted components is dipped manually
    into the tank so that the molten solder sticks to the exposed metallic areas of the board

    . Dip solder process[edit]


    Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus,
    all components surfaces are coated with filler metal. Solders have low surface tension and high
    wetting capability. There are many types of solders, each used for different applications:

     Lead–silver is used for strength at higher-than-room temperature.


     Tin–lead is used as a general-purpose solder
     Tin–zinc is used for aluminium
     Cadmium–silver is used for strength at high temperatures
     Zinc–aluminium is used for aluminium and corrosion resistance
     Tin–silver and tin–bismuth are used for electronics.
    Because of the toxicity of lead, lead-free solders are being developed and more widely used. The
    molten bath can be any suitable filler metal, but the selection is usually confined to the lower
    melting point elements. The most common dip soldering operations use zinc-aluminum and tin-
    lead solders.

     Solder pot metal: cast iron or steel, electrically heated.


     Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free
    alloys)
     Solder composition: 60% Sn, 40% Pb or eutectic allo

    Dip soldering is a manufacturing process where a technician dips objects into a


    bath of molten solder to fix parts together. The most common application of this
    technique is in the production of circuit boards, where it can be a fast and
    efficient method. The heat of the solder can potentially damage parts of the
    project, and the technician has to make sure all the components can take the heat
    before dipping; usually the project is all metal to avoid this problem

    With circuit board production, the solder will stick to the exposed mental


    components and will not adhere to areas without metal or areas treated with a
    chemical to resist solder. Dip soldering may be a hand operation, with a
    technician personally dipping the product, and it is also possible to partially
    automate it. A machine can grip the circuit board, dip it at the right angle, and
    keep it in the solder for the correct period of time before pulling it out.
    The dip soldering process is similar to wave soldering, a mass production
    process people use to make chips. With wave soldering, it is all automated, and
    the chips pass under a steady flow of melted solder material, rather than being
    dipped. This process costs more money to implement and allows people to
    produce more projects per day, making it suitable for large scale facilities where
    people need to cut down on manufacturing time.
    For small-scale soldering, dip soldering can be a useful technique. People do not
    need very much equipment to set it up, simply a container large enough to dip
    projects, with appropriate tools for melting the solder so it will be usable. Many
    companies manufacture the necessary supplies, and people can also make their
    own. For automated setups, slightly larger investments are needed to purchase a
    machine capable of handling the process.

    People may learn this and other techniques on the job or while in a training
    program to prepare for a professional career. There are a number of types of
    solder available, and the technician has to be able to choose the correct mixture
    and make other decisions during the process to make sure the final product will
    perform properly. People usually inspect the project after dip soldering to see if
    any manual adjustments are necessary, such as cleaning excess solder off a
    contact or discarding an item with damage like pockmarks or distortions from
    the soldering process.

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