Scribd Logo
Upload

Welcome to Scribd!

  • 136 views

    NC 559 Asm TF PDF

    Uploaded by

    roto44

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    NC 559 Asm TF PDF

    Uploaded by

    roto44
    136 views2 pages

    Original Title

    nc-559-asm-tf.pdf

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    136 views2 pages

    NC 559 Asm TF PDF

    Uploaded by

    roto44

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    You are on page 1of 2

    INVENTEC

    500 Main Street, Suite 18


    PO Box 989
    Deep River, CT 06417 USA

    Toll Free: 800.435.0317


    Phone: 860.526.8300

    NC-559-ASM-TF, No-Clean Tacky Flux


    Fax: 860.526.8243
    www.amtechsolder.com

    Product Data Sheet


    Product Highlights Compatible Alloys
    n ROL0 flux classification Alloy Temp °C Temp °F
    n Wide process window 63Sn/37Pb 183 361
    n Excellent wetting compatibility on most board 62Sn/36Pb/2Ag 179 354
    finishes 62.8Sn/36.8Pb/0.4Ag 179-183 354-361
    n Clear residue 60Sn/40Pb 183-191 361-376
    n High temperature compatible 43Sn/43Pb/14Bi 144-163 291-325
    42Sn/58Bi 138 280
    Application
    10Sn/88Pb/2Ag 268-290 514-554
    NC-559-ASM-TF is formulated for syringe, stencil
    printing, and rework applications on all PCB surface
    finishes. NC-559-ASM-TF may be used for BGA
    sphere attachment and reballing. NC-559-ASM-TF
    is also designed to work on all flip chip bumping
    and chip scale packaging sites.

    Test Results
    Test J-STD-004 or Test Requirement Result
    other requirements (as stated)
    Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
    Corrosion IPC-TM-650: 2.6.15 L: No corrosion
    Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5%
    Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop
    (no-clean)
    Surface Insulation Resistance 85 oC, IPC-TM-650: 2.6.3.7 L: 100 M (no-clean)
    85% RH @ 168 Hours
    Viscosity - Malcom @ 10 RPM/25 oC IPC-TM-650: 2.4.34.4 40-52
    (x103mPa/s)
    Visual IPC-TM-650: 3.4.2.5 Clear and free
    from precipitation
    Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant
    REACH Compliance Articles 33 and 67 of Regulation May contain up to 7%
    (EC) No 1907/2006 w/w of ethoxylated
    4-nonylphenol
    NC-559-ASM-TF, No-Clean Tacky Flux
    Cleaning Storage and Handling
    NC-559-ASM-TF is a no-clean tacky flux that can Tacky flux should be stored at room temperature
    be left on the board for many SMT assemblies. For (20-25 °C). Syringes and cartridges should be stored
    applications requiring cleaning, NC-559-ASM-TF vertically with the dispensing tip down. Properly
    can be cleaned using commercially available flux stored tacky flux has a 12 month shelf life.
    residue removers such INVENTEC Promoclean™ and
    Promosolv™ cleaning chemistries. Packaging
    10 & 30cc syringes
    75 & 150 gram jars
    170 & 340 gram cartridges

    Recommended Profile
    Profile for Sn63 and Sn62 Alloys
    This profile is designed to
    250°
    serve as a starting point for Topside Temperature of board
    to be @ 212 – 230°C maximum

    process optimization using


    200°
    NC-559-ASM-TF. To achieve 179-183°
    Liquidus temperature for Sn63 and Sn62 alloys
    Topside Temperature of board
    to be @ 170°C at finest
    better results with voiding or mil pitch in zone prior
    to reflow
    150°
    to reduce tombstoning, 140°
    Flux Activation Temperature
    Temp. (ºC)

    Time above liquidus should be

    consider using a longer 45 – 90 seconds depending on


    board density, size & population
    100°
    soaking zone, (140-180 °C) for Temperature Ramp
    @ < 3.0°C/Second

    60-90 seconds, with a rapid 50°


    Quick Ramp
    to 100°C

    pre-heat stage. If there is Pre-Heat Soak Reflow Cool


    evidence of solder de-wetting, 0°
    consider lowering the peak
    reflow temperature, or reduce
    the time above liquidus to <60
    seconds.

    Revised December 10, 2015

    You might also like