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    Adm485 13

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    mhasansharifi
    The document provides the dimensions for two integrated circuit packages: an 8-pin small outline integrated circuit package (SOIC) and an 8-pin mini small outline integrated circuit package (MSOP). Key dimensions such as length, width, pin locations, distances between pins, and tolerances are specified in both millimeters and inches. The packages are designed to comply with relevant JEDEC standards.

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Adm485 13

    Uploaded by

    mhasansharifi
    38 views1 page
    The document provides the dimensions for two integrated circuit packages: an 8-pin small outline integrated circuit package (SOIC) and an 8-pin mini small outline integrated circuit package (MSOP). Key dimensions such as length, width, pin locations, distances between pins, and tolerances are specified in both millimeters and inches. The packages are designed to comply with relevant JEDEC standards.

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    ADM485 13

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    The document provides the dimensions for two integrated circuit packages: an 8-pin small outline integrated circuit package (SOIC) and an 8-pin mini small outline integrated circuit package (MSOP). Key dimensions such as length, width, pin locations, distances between pins, and tolerances are specified in both millimeters and inches. The packages are designed to comply with relevant JEDEC standards.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    38 views1 page

    Adm485 13

    Uploaded by

    mhasansharifi
    The document provides the dimensions for two integrated circuit packages: an 8-pin small outline integrated circuit package (SOIC) and an 8-pin mini small outline integrated circuit package (MSOP). Key dimensions such as length, width, pin locations, distances between pins, and tolerances are specified in both millimeters and inches. The packages are designed to comply with relevant JEDEC standards.

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    ADM485

    OUTLINE DIMENSIONS
    5.00 (0.1968)
    4.80 (0.1890)

    8 5
    4.00 (0.1574) 6.20 (0.2441)
    3.80 (0.1497) 1 5.80 (0.2284)
    4

    1.27 (0.0500) 0.50 (0.0196)


    BSC 45°
    1.75 (0.0688) 0.25 (0.0099)
    0.25 (0.0098) 1.35 (0.0532)
    8°
    0.10 (0.0040) 0°
    COPLANARITY 0.51 (0.0201)
    0.10 1.27 (0.0500)
    0.31 (0.0122) 0.25 (0.0098)
    SEATING 0.40 (0.0157)
    PLANE 0.17 (0.0067)

    COMPLIANT TO JEDEC STANDARDS MS-012-A A


    CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

    012407-A
    (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
    REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

    Figure 31. 8-Lead Standard Small Outline Package [SOIC_N]


    Narrow Body (R-8)
    Dimensions shown in millimeters and (inches)

    3.20
    3.00
    2.80

    8 5 5.15
    3.20
    4.90
    3.00
    4.65
    2.80 1
    4

    PIN 1
    0.65 BSC
    0.95
    0.85 1.10 MAX
    0.75
    0.80
    0.15 0.38 8° 0.60
    0.23
    0.00 0.22 0° 0.40
    0.08
    COPLANARITY SEATING
    0.10 PLANE

    COMPLIANT TO JEDEC STANDARDS MO-187-AA

    Figure 32. 8-Lead Mini Small Outline Package [MSOP]


    (RM-8)
    Dimensions shown in millimeters

    Rev. F | Page 13 of 16

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