WTX Power Supply DG 10

WTX
Power Supply
Design Guidelines
February 19, 1999
Version 1.0
WTX Power Supply Design Guidelines, Version 1.0
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Copyright  1998 Intel Corporation. All rights reserved.
Version 0.3, June 1998

† Third-party brands and names are the property of their respective owners.
Revision History
Revision 0.4 Initial releas

Revision 0.9 Reformatted, updated electrical data, added additional mechanical detail and cable info
Page 2 of 40
CONTENTS
1. Scope .................................................................................................................. 6
1.1 Power Distribution Structure..............................................................................................6
2. Reference Documents ....................................................................................... 8
3. Electrical Specification...................................................................................... 9
3.1 AC Input Requirements.....................................................................................................9
3.1.1 Input Overcurrent Protection ................................................................................9
3.1.2 Inrush Current Limiting .........................................................................................9
3.1.3 Input Undervoltage ...............................................................................................9
3.1.4 Immunity ..............................................................................................................10
3.1.5 Catastrophic Failure Protection.............................................................................12
3.2 DC Output Requirements..................................................................................................13
3.2.1 DC Voltage Regulation .........................................................................................13
3.2.2 Remote Sensing...................................................................................................13
3.3 Typical Power Distribution.................................................................................................14
3.3.1 Power Limit ..........................................................................................................15
3.3.2 Efficiency .............................................................................................................15
3.3.3 Output Ripple/Noise .............................................................................................17
3.3.4 Output Transient Response ..................................................................................17
3.3.5 Closed Loop Stability............................................................................................18
3.3.6 Capacitive Load ...................................................................................................18
3.3.7 Output Power Sequencing ....................................................................................18
3.3.8 Voltage Hold-up Time...........................................................................................18
3.4 Timing / Housekeeping / Control .......................................................................................19
3.4.1 Power Good Signal, PS-OK..................................................................................20
3.4.2 Sleep State (SLEEP#) ..........................................................................................20
3.4.3 Remote On/Off Control (PS-ON#) ........................................................................21
3.4.4 Power On Time ....................................................................................................21
3.4.5 Rise-time..............................................................................................................21
3.4.6 Overshoot At Turn-On/Turn-Off............................................................................22
3.4.7 Reset After Shutdown...........................................................................................22
3.4.8 Standby/Auxiliary Voltages...................................................................................22
3.4.9 Standby Voltage Turn-Off.....................................................................................22
3.4.10 Fan Control Override............................................................................................23
3.4.11 Fan Monitor..........................................................................................................23
3.5 Output Protection..............................................................................................................24
3.5.1 Overvoltage Protection.........................................................................................24
3.5.2 Short Circuit Protection ........................................................................................24
3.5.3 No Load Operation ...............................................................................................24
3.5.4 Overcurrent Protection .........................................................................................24
4. Mechanical Requirements ................................................................................. 25
Page 3 of 40
4.1 Physical Dimensions/Markings..........................................................................................25

4.1.1 Warning Label......................................................................................................25
4.2 Fan Requirements ............................................................................................................29
4.3 AC Connector Requirements ............................................................................................29
4.4 DC Connector Requirements ............................................................................................29
4.4.1 Primary 2x12 connector, P1 ................................................................................29
4.4.2 Primary 2x11 connector, P2 .................................................................................30
4.4.3 Primary 2x4 connector, P3 ...................................................................................30
4.4.4 Primary 2x3 connectors, P4 and P5......................................................................30
4.4.5 HDD PERIPHERAL CONNECTORS ....................................................................31
4.4.6 FDD PERIPHERAL CONNECTORS ....................................................................31
4.5 Power Supply Wiring Recommendations ..........................................................................32
4.5.1 Suggested wire size/colours .................................................................................34
5. Environmental Requirements............................................................................ 36
5.1 Temperature .....................................................................................................................36
5.2 Humidity ...........................................................................................................................36
5.3 Altitude .............................................................................................................................36
5.4 Mechanical Shock.............................................................................................................36
5.5 Random Vibration .............................................................................................................36
5.6 Thermal Shock (Shipping) ................................................................................................37
5.7 Ecological Requirements ..................................................................................................37
5.8 Catastrophic Failure..........................................................................................................37
5.9 Acoustics ..........................................................................................................................37
6. Electromagnetic Compatibility ......................................................................... 38
6.1 EMI...................................................................................................................................38
6.2 Input Line Current Harmonic Content................................................................................38
6.3 Magnetic Leakage Fields ..................................................................................................38
7. Reliability ............................................................................................................ 39
7.1 Component Derating.........................................................................................................39
7.2 Mean Time Between Failures (MTBF)...............................................................................39
8. Safety Requirements.......................................................................................... 40
8.1 North America...................................................................................................................40
8.2 International......................................................................................................................40
Page 4 of 40
Table of Figures
Figure 1. WTX Power Distribution Summary - 240VA .................................................................................. 7
Figure 2. Power Sequencing........................................................................................................................... 19
Figure 3. Power Supply Timing ..................................................................................................................... 19
Figure 4. Fan Monitor Circuit ........................................................................................................................ 23
Figure 5. Single Fan WTX Power Supply Form Factor................................................................................... 26
Figure 6 - Dual Fan WTX Power Supply Form Factor ................................................................................... 27
Figure 7. Single Fan (ONLY) Side Cable Exit Option.................................................................................... 28
Figure 8. Dual Fan (ONLY) Underside Cable Exit Option. ............................................................................ 28
Figure 9. Single and Dual Fan Rear Cable Exit Option. ................................................................................. 28
Figure 10. P1, 2x12 Power Connector ............................................................................................................ 29
Figure 11. P2, 2x11 Power/Signal Connector ................................................................................................. 30
Figure 12. P3, 2x4 Power Connector .............................................................................................................. 30
Figure 13. P4 and P5, 2x3 Power Connector ................................................................................................. 30
Figure 14. Suggested Wire Lengths................................................................................................................ 32
Figure 15. Suggested wire lengths for HDD/FDD connectors ......................................................................... 33
Table of Tables
Table 1. AC Input Line Requirements............................................................................................................ 9
Table 2. Line Voltage Transient Limits.......................................................................................................... 10
Table 3. DC Output Voltage Regulation........................................................................................................ 13
Table 4. Typical Power Distribution for a 460W Configuration..................................................................... 14
Table 5. Typical Power Distribution for a 610W Configuration...................................................................... 14
Table 6. Typical Power Distribution for a 800 W Configuration..................................................................... 15
Table 7. Energy Star Load Conditions............................................................................................................ 16
Table 8. Y2k Energy Star Load Conditions .................................................................................................... 16
Table 9. DC Output Noise/Ripple................................................................................................................... 17
Table 10. Maximum Individual Load Steps.................................................................................................... 17
Table 11. Capacitive Load.............................................................................................................................. 18
Table 12. PS-OK Signal Characteristics......................................................................................................... 20
Table 13. SLEEP#/PS-ON# Relationship ...................................................................................................... 20
Table 14. Remote On/Off and Sleep Signal Characteristics ............................................................................ 21
Table 15. Over Voltage Protection ................................................................................................................. 24
Table 16. Harmonic Limits, Class D .............................................................................................................. 38
Page 5 of 40
1. Scope
This document provides a reference for the definition and specification of the WTX Power Supply that
is compliant with the WTX Workstation System Specification and the WTX Chassis Design Guide. It
is provided as a convenience only and is not intended to replace or supplement the user’s independent
design and validation activity.
This document includes the following information:
• Physical form factors

• Cooling requirements
• Connector configuration
• Electrical requirements
• Pertinent signal timing specification
It also provides power supply examples, although actual power requirements shall vary depending
upon specific system configurations.
The WTX specification is a new board set and system form factor developed for the mid-range
workstation market segment to support current and future Intel -based 32 and 64-bit processor
technologies. The power requirements for these systems are predicted to vary between approximately
350 W and 850 W depending upon system peripheral and I/O configuration, number of processors,
chip-sets, and memory configurations.
In order to support these systems and the broad range of power requirements, two (2) new form
factors have been defined (although an existing PS/2 can be utilized for lower system configurations).
In addition to these new form factors, new connector configurations have been defined that
specifically address the higher load demands of elements such as AGP-Pro.
1.1 Power Distribution Structure

The WTX Power Supply distribution structure is illustrated in Figure 1. This structure is based upon
the board and system configurations found in mid-range workstations whereby the basic system
configuration (number of peripheral bays, PCI, and graphics) are constant across processor and chip-
set platforms. The range of power requirements for the latter components is the basis for the WTX
power supply structure through the addition of one or more +12 VDC outputs to support increased
power needs (high end processors and larger memory cards). This approach provides the ability to
comply with output power limitation requirements (240 VA) when necessitated by system
requirements.
Page 6 of 40
IA64
12VCPU#2 BUS POD #2
CPU #1
DUAL FAN POWER

IA64
12VCPU BUS POD #1
SUPPLY CPU #2
(upto 850W)
IA32
VRM
CPU #1 core
IA32
VRM
CPU #2 core
SINGLE FAN
POWER
SUPPLY RDRAM
(upto 500W) (16 RIMMS)
upto 4
MEM DC-DC
(12V:2.5V/3.3V)
SDRAM
12VDIG RAIL (16 DIMMS)
3.3VSB RAIL (up to 3A)
5VSB RAIL (up to .70A)
12VIO BUS
3.3V+12V<=110W
AGP-Pro 3.3V upto 100W
110W 12V upto 110W
3.3VIO BUS
Misc I/O, M/B etc
BUS REGs
3.3/12V:<1.8V
I/O PCI 6 slots - support

-12VIO RAIL +3.3V 25W ea
+5V 25W ea
+12V 6W ea
5VIO BUS -12V 1.2W ea
Peripherals
HARD multiple 1"/1.6" drives
DRIVES + (est 20/28W)
BAYS mulitple media bays

(CD-ROM, DVD etc)
WTX powerdist.vsd
rev 06 - JD.02/01/99
Figure 1. WTX Power Distribution Summary - 240VA
Page 7 of 40
2. Reference Documents
The latest revision in effect of the following documents forms a part of this document to the extent specified:
AB13-94-146 EACEM European Association of Consumer Electronics Manufacturers. Hazardous
Substance List / Certification.
ANSI C62.41-1991: IEEE Recommended Practice on Surge Voltages in Low-Voltage AC Circuits.
ANSI C62.45-1992: IEEE Guide on Surge Testing for Equipment Connected to Low-Voltage AC Power
Circuits.
ANSI C63.4, 1992 American National Standard for Methods of Measurement of Radio-Noise Emissions
from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40
GHz for EMI testing.
CFR 47, Part 15, Subpart B FCC Rules.
rd
CISPR 22:1997 3 edition and EN Limits and Methods of Measurements of Radio Interference Characteristics of
55022:1998 Information Technology Equipment, Class B.
CSA C22.2 No.234, Level 3 Safety of Component Power Supplies. Intended for use with Electronic Data
Processing Equipment and Office Machines.
EN60 950: plus A1,A2, A3, A4 Safety of Information Technology Equipment including business equipment.
EN55022:1998 Electromagnetic Compatibility/Generic Immunity Standard.
EN61000-3-2 Limits for Harmonic Current Emission, Class D.
EMKO-TSE(74-SEC)207/94 Nordic National Requirement in addition to EN60950.
IEC 61000-4 Electromagnetic Compatibility for industrial-process Measurement & Control
equipment.
Part - 2 ESD Requirements.
Part - 3 Immunity to Radiated Electromagnetic Fields.
Part - 4 Electrical Fast Transients/Burst Requirements.
Part - 5 Surge Immunity Requirements
Part - 6 Radio Frequency Common Mode Test Standard
Part - 8 Power Frequency Magnetic Field Test Standard
Part - 11 Voltage Dips and Interruptions Test Standard
IEC 950 plus A1, A2, A3, A4 Safety of Information Technology Equipment including Business Equipment.
IEC Publication 417 International Graphic Symbol Standard.
ISO Standard 7000 Graphic Symbols for use on Equipment.
Japan Electric Association Guidelines for the Suppression of Harmonics in Appliances and General use
Equipment.
MIL-STD-217F: Reliability Predictions for Electronic Equipment.
MIL-STD-105K: Quality Control.
MIL-C-5541: Chemical Conversion Coatings on Aluminum and Aluminum Alloys.
UL 1950/CAN/CSA CSA C22.2 Safety of, Information Technology Equipment including Electrical Business
No. 950-95 without D3 Deviation: Equipment.
3rd edition
Page 8 of 40
3. Electrical Specification
The electrical requirements that follow must be met over the environmental ranges specified in Section
5 unless otherwise noted.
3.1 AC Input Requirements

The power supply shall be capable of supplying full rated output power over two (2) input voltage
ranges that are switch-selectable and rated 100-127 VAC and 200-240 VAC RMS nominal. The
power supply shall employ automatic input line selection, active power factor correction and in
addition, automatically recover from AC power loss. The input voltage, current, and frequency
requirements for continuous operation are stated below. (Note that nominal voltages for test purposes
are considered to be within ±1.0 V of nominal.) The power supply must be able to start up under
peak loading at 90 VAC.
Table 1. AC Input Line Requirements
Parameter Min Nom Max Unit
Vin (115 VAC) 90 115 135 VACrms
Vin (230 VAC) 180 230 265 VACrms
Vin Frequency 47 -- 63 Hz
Iin (115 VAC) 11.5 Arms
Iin (230 VAC) 5.8 Arms
3.1.1 Input Overcurrent Protection

The power supply shall incorporate primary fusing for input Overcurrent Protection. The Fuse must
be a slow-blow type or equivalent to prevent nuisance trips.
3.1.2 Inrush Current Limiting

Maximum inrush current from power-on (with power on at any point on the AC Sine) includes, but is
not limited to, three (3) line cycles. It shall be limited to a level below the surge rating of the input
line cord, AC switch if present, bridge rectifier, fuse, PFC components and EMI filter components.
Repetitive ON/OFF cycling of the AC input voltage should not damage the power supply or cause the
input fuse to blow.
3.1.3 Input Undervoltage

The power supply shall contain protection circuitry such that the application of an input voltage
below the minimum specified in Table 1. shall not cause damage to the power supply unit.
Page 9 of 40
3.1.4 Immunity
3.1.4.1 Slow Transients
The DC output(s) shall not exceed the limits specified in Section 3.2.1 as a result of the input power
line noise defined in Table 2 under any load condition per IEC 61000-4-11.
Table 2. Line Voltage Transient Limits

AC Line slow transients:
Duration Sag / Operating AC Voltage Line Performance Criteria
Surge Frequency
0 to 500 msec 10% Rated AC Voltages 50/60 Hz No loss of function or
performance
0 to 15 15% Mid-point of Rated AC 50/60 Hz No loss of function or
minutes Voltages performance
0 to ½ AC 30% Mid-point of Rated AC 50/60 Hz No loss of function or
cycle Voltages performance
0 to 5 AC 50% Mid-point of Rated AC 50/60 Hz Loss of function acceptable, self-
cycles sag only Voltages recoverable
3.1.4.2 Surge Voltages

Input Surge Withstand Capability (Line Transients). The power supply shall meet the IEC 61000-4-5
Level 1; Level 2, and Level 3 criteria for surge withstand capabilities, complying with the following
conditions and exceptions. The power supply must meet the surge withstand test for the conditions of
operation specified in Section 5.
The peak value of the injected unipolar waveform shall be 2.0 kV measured at the input of the power
supply for the common and normal modes of transient surge injection.
The surge withstand test must not produce:
• Damage to the power supply
• Disruption of the normal operation of the power supply
• Output voltage deviations exceeding the limits of Section 3.2.1
3.1.4.2.1 Surge Immunity, IEC 61000-4-5

No unsafe operation must be allowed under any condition. No user noticeable performance
degradation for 1 kV Differential Mode (DM) or 2 kV Common Mode (CM) must be allowed.
However, automatic or manual recovery cycles are allowed for other conditions. The Surge Immunity
specification must meet performance criteria B in the end-product.
3.1.4.2.2 Electrical Fast Transient/Burst, IEC 61000-4-4

No unsafe operation must be allowed under any condition. No user noticeable performance
degradation up to 1 kV is allowed. However, automatic or manual recovery cycles are allowed for
other conditions. The electrical fast transient/burst must meet performance criteria B in the end-
product.
Page 10 of 40
3.1.4.2.3 Ring Wave, ANSI C62.45-1992

The crest value of the first half-peak of the injected oscillatory wave is 3.0 kV open circuit with 200
and 500 Ampere short circuit currents for the common and the normal modes of transient surge
injection. The peak value of the injected unipolar wave form shall be 2.0 kV measured at the input of
the power supply for the common, and the normal modes of transient surge injection.
3.1.4.2.4 Electrostatic Discharge, IEC 61000-4-2

In addition to EN61000-4-2 the following ESD tests must be conducted. Each surface area of the unit
under test is subjected to twenty- (20) successive static discharges, at each of the following voltages: 2
kV, 3 kV, 4 kV, 5 kV, 6 kV, 8 kV, 10 kV, 15 kV, and 25 kV.
Performance Criteria:
All power supply outputs shall continue to operate within the parameters of this specification, without
glitches or interruption, while the supply is operating as defined and subjected to 2 kV through 15 kV
ESD pulses. The direct ESD event shall not cause any out of regulation conditions such as overshoot
or undershoot. The power system shall withstand these shocks without nuisance trips of the
Overvoltage Protection, Overcurrent Protection or the remote +5 VDC shutdown circuitry.
The power supply, while operating as defined, shall not have a component failure when subjected to
any discharge voltages up to and including 25 kV. Component failure is defined as any malfunction
of the power supply, which causes component degradation or failure requiring component replacement
to correct the problem. Must meet performance criteria B for discharges within IEC 61000-4-2
limits.
3.1.4.2.5 Radiated Immunity, IEC 61000-4-3

Frequency Electric Field Strength Performance Criteria
80 MHz to 1000 MHz, 80% AM (1 kHz) 3 V/m B
3.1.4.2.6 Immunity to Conducted Disturbances, IEC 61000-4-6

.15 to 80 MHz, 80% AM (1 kHz) 3V A
3.1.4.2.7 Power Frequency Magnetic Field, IEC 61000-4-8

50 Hz 1 A/m A
Page 11 of 40
3.1.4.2.8 Voltage Dips & Interruptions, IEC 61000-4-11

Level Performance Criteria
>95% reduction for 0.5 periods B
30% reduction for 25 periods (dips) C
>95% reduction for 250 periods (interrupts) C
3.1.5 Catastrophic Failure Protection

The primary circuit design and the components specified in the specification must be designed so that
should if a component failure occurs, the power supply shall not exhibit any of the following physical
factors:
• Flame
• Excessive smoke
• Charred PCB
• Fused PCB conductor
• Startling noise
• Emission of molten material
Page 12 of 40
3.2 DC Output Requirements
3.2.1 DC Voltage Regulation

The DC output voltages shall remain regulated within the ranges shown in Table 3. when measured
at the load end of the output connectors under all line, load, and environmental conditions. The
voltage regulation limits shall be maintained under continuous operation for a period of time equal to
or greater than the MTBF specified in Section 7.2 at any steady state temperature and operating
conditions specified in Section 5.
Table 3. DC Output Voltage Regulation
Parameter Range Min. Nom. Max. Unit
1
+12IO VDC ±5% +11.40 +12.00 +12.60 Volts
+ 5 VDC ±4% +4.80 +5.00 +5.20 Volts
+3.3VDC ±4% +3.17 +3.30 +3.43 Volts
-12 VDC ± 10 % -10.80 -12.00 -13.20 Volts
2
+12DIG VDC ±5% +11.04 +12.00 +12.60 Volts
2
+12CPU VDC ±5% +11.04 +12.00 +12.60 Volts
2
+12CPU2 VDC ±5% +11.04 +12.00 +12.60 Volts
+ 3.3 VAUX ±5% +3.14 +3.30 +3.47 Volts
+ 5 VSB ±5% +4.75 +5.00 +5.25 Volts
Note:
1. At +12V surge, regulation can go to ±10%.
2. This output provides power to DCDC converters.
3.2.2 Remote Sensing

The 3.3 V and 5 V outputs shall have provisions for remote sensing to compensate for various system
cable, connector & PCB trace drops.
The 5 V sense shall be connected to pin 1 of P1 with the 5 V sense returned to pin 12.
The 3.3 V sense shall be connected to pin 2 of P1 with the 3.3 V sense returned to pin 13.
The 12 VDIG outputs may also utilize remote sensing in systems utilizing more powerful processors or
memory configurations. Pins 4 and 8 of P3 are reserved for this consideration.
In all instances, the power supply should draw no more than 10 mA through the remote sense line to
keep DC off set voltages to a minimum.
Page 13 of 40
3.3 Typical Power Distribution

Although power requirements depend upon specific system options and implementation, this section
identifies several configurations reflective of the range of WTX mid-range power levels.
Table 4. Typical Power Distribution for a 460W Configuration

Output Min. Max. Peak Ripple & Notes:
voltage current current Current Noise
(amps) (amps) (amps)
+3.3 V DC 0.0 45.0 50 mVPP Max continuous +5 V and +3.3 V
output power is 200 W
+5 V DC 1.0 27.0 50 mVPP
-12 V DC 0.3 0.6 120 mVPP
+12 VIODC 0.0 16.0 18.2 120 mVPP Max continuous +5 V, +3.3 V and +12
VIO output power is 300 W.
+12 VDIGDC 0.0 18.0 120 mVPP
+5 VSB* 0.0 0.72 50 mVPP
+3.3 VAUX 0.0 3.0 50 mVPP
Note: Refer to the 460W-WTX PSU Design Guide located at the following URL: www.wtx.org
Table 5. Typical Power Distribution for a 610W Configuration

+5 V DC 1.0 25.0 50 mVPP
-12 V DC 0.3 0.6 120 mVPP
+12 VDIGDC 0.0 14.0 120 mVPP
+12 VCPUDC 0.0 18.0 120 mVPP
+5 VSB* 0.0 0.72 50 mVPP
+3.3 VAUX 0.0 3.0 50 mVPP
Page 14 of 40
Table 6. Typical Power Distribution for a 800 W Configuration

+5 V DC 1.0 25.0 50 mVPP
-12 V DC 0.3 0.6 120 mVPP
+12 VDIGDC 0.0 18.0 120 mVPP
+12 VCPUDC 0.0 16.0 120 mVPP
+12 VCPU2DC 0.0 16.0 120 mVPP
+5 VSB* 0.0 0.72 50 mVPP
+3.3 VAUX 0.0 3.0 50 mVPP
3.3.1 Power Limit

Under short circuit or overload conditions, no output shall exceed 240 VA under any conditions
including single component fault conditions per IEC60 950 Specification requirements.
3.3.2 Efficiency
The efficiency of the power supply shall be met over the AC input range defined in Table 1. under the
load conditions defined in Section 3.3, and the temperature and operating conditions defined in Section
5. The minimum efficiencies for these typical configurations are;
• Single fan 400 W - 460 W output range 68% minimum

• Dual fan 550 W - 620 W output range 70% minimum
• Dual fan 700 W - 850 W output range 71% minimum
Page 15 of 40
3.3.2.1 Energy Star requirements (until June 30th, 2000)

WTX power supplies used in “Energy Star” compliant systems must be a minimum of 55% efficient
and draw input power equal to or less than 15% of the rated output power when subject to the
conditions defined in Table 7.
Table 7. Energy Star Load Conditions
Output Load Conditions

+3.3 VAUX 1.0 A
+5 VSB 0.2 A
+12 VDIGDC [(POUT(RATED) x 0.0825 – 4.3)/12]A
All other outputs 0.0 A
SLEEP# Low state
PS-ON Low state
For example, when the 115 VAC input power of a 460 W WTX power supply is 69 W (as measured
by a true RMS watt-meter placed on the input AC line cord), the total DC output power shall not
exceed 37.9 W.
3.3.2.2 Energy Star Requirements (Effective July 1st, 2000)

WTX power supplies used in “Energy Star” compliant systems shall be a minimum of 50% efficient
and draw input power equal to or less than 10% of the rated output power when subject to the
conditions defined in Table 8.
Table 8. Y2k Energy Star Load Conditions
Output Load Conditions

+3.3 VAUX 1.0 A
+5 VSB 0.2 A
+12 VDIGDC [(POUT(RATED) x 0.05 – 4.3)/12]A
All other outputs 0.0 A
SLEEP# Low state
PS-ON Low state
For example, when the 115 VAC input power of a 460 W WTX power supply is 46 W (as measured
by a true RMS watt-meter placed on the input AC line cord), the total DC output power must not
exceed 23 W.
3.3.2.3 Standby Efficiency

The Standby supply efficiency should be a minimum of 40% with the AC input voltage at 230VAC at
50Hz, with the main outputs off and with PS-ON# high.
Page 16 of 40
3.3.3 Output Ripple/Noise

The following output ripple/noise requirements must be met throughout the load ranges specified in
Section 3.3, and under all input voltage conditions as specified in Section 3.1.
Ripple and noise are defined as periodic or random signals over a frequency band of 10 Hz to 20
MHz. Measurements shall be made with an oscilloscope with 20 MHz bandwidth. Outputs shall be
bypassed at the connector with a 0.1 µF ceramic disk capacitor and a 10 µF electrolytic capacitor to
simulate system loading.
Table 9. DC Output Noise/Ripple
Output Max.
+3.3 V DC 50 mVpp
+5 V DC 50 mVpp
-12 V DC 120 mVpp
+12 VIODC 120 mVpp
+12 VDIGDC 120 mVpp
+12 VCPUDC 120 mVpp
+12 VCPU2DC 120 mVpp
+5 VSB* 50 mVpp
+3.3 VAUX 50 mVpp
3.3.4 Output Transient Response

The output voltage must remain within the regulation limits of Table 3. (inclusive of
over/undershoot). For instantaneous load changes, limited to the maximum individual steps per Table
10, output capacitive loading per Table 11, over the AC input range is defined in section 3.1 and may
include simultaneous load steps on the +12IO VDC, +5 VDC, and +3.3 VDC outputs. All load
changes must occur in the same direction. The transient response measurements must be made with a
load changing repetition rate of 50 Hz to 10 kHz. The load slew rate must not be greater than 2.5
A/µs. The power supply must be stable under all transient conditions from any steady state load.
The conditions in Table 10 and Table 11 reflect typical WTX system configurations. System
developers must evaluate individual requirements to ensure performance expectations are met.
Table 10. Maximum Individual Load Steps

Output Max load step
+3.3 V DC 10 A
+5 V DC 6A
-12 V DC 10 A
+12 VIODC 14 A
+12 VDIGDC 14.5 A
+12 VCPUDC 14.5 A
+12 VCPU2DC 0.1 A
Page 17 of 40
3.3.5 Closed Loop Stability

The power supply must be unconditionally stable under all line/load/transient load conditions
including capacitive loads as specified in Table 11. A minimum of 45°phase and 10 dB-gain margin
are required. The power supply vendor must provide proof of the unit’s closed-loop stability with
local sensing through the submission of Bode plots. Closed-loop stability must be ensured at the
maximum and minimum loads as applicable.
3.3.6 Capacitive Load

The power supply must be able to power up and operate normally with the following capacitance
simultaneously present on the DC outputs:
Table 11. Capacitive Load
Output -12 +3.3 VDC +5 VDC +12IO VDC +12DIG VDC +12CPU# VDC 3.3 VAUX /
Voltage: VDC 5 VSB
Capacitive 350 6,000 10,000 1,000 1,000 2,000 350

load (µF):
3.3.7 Output Power Sequencing

The +5 V, 12 VDIG and 12 VCPU# (when applicable) output levels must be equal to or greater than the
3.3 V output at all times during power up and normal operation. The time between the +5 V, 12 VDIG
and 12 VCPU# outputs reaching their minimum in regulation level and the +3.3 V reaching its minimum
regulation level must be less than or equal to 20ms.
In addition, the +5 V output level must be equal to or greater than the 3.3 V output at all times during
power down. This may be implemented using a clamping diode between +5 V and +3.3 V outputs.
3.3.8 Voltage Hold-up Time

The power supply must maintain output regulations per Section 3.2.1 despite a loss of input power at
the low-end nominal range (Low = 115 or 230 VACRMS, 47 Hz) at maximum continuous output load
as applicable for a minimum of one input AC cycle.
Page 18 of 40
3.4 Timing / Housekeeping / Control

AC Power
5VSB
3.3VAUX
undefined
PS-ON#
undefined
SLEEP#
5V,3.3V,12VIO
& 12VCPU# 75mS max. ramp
12VDIG
75mS max. ramp
PS-OK
See figure 3
Figure 2. Power Sequencing
OFF
PS-ON#
ON ~
~
+5V, 3.3V 95%
and
12VDIG O/Ps 10%
T5
~
PS-OK
T3 T4
PW-OK Sense Level=95% of nominal T2
Figure 3. Power Supply Timing

Note: T2 is defined in Section 3.4.5
T3, T4, and T5 are defined in Table 12
Page 19 of 40
3.4.1 Power Good Signal, PS-OK

A “Power Good” signal, PS-OK, is asserted (i.e., high) by the power supply to indicate that the +3.3
VDC, +5 VDC, +12 VDIG and 12 VCPU# outputs exceed the under-voltage thresholds listed in Section
3.2.1. It also indicates that sufficient primary energy is stored by the converter to guarantee
continuous power operation within specification for at least the duration specified in “Hold Up Time”
Section 3.3.8. Conversely, when one of these output voltages falls below the under-voltage threshold,
or when the primary power has been removed too long to guarantee power supply operations beyond
that time, the POK is held low. The electrical and timing characteristics of the POK signal are given
in Figure 2 and in Figure 3. The voltage sequence and timing relationships are illustrated in Figure 2.
The PS-OK pin shall be pulled up to +5 V via a 5.1 kΩ resistor within the power supply.
Table 12. PS-OK Signal Characteristics
Signal Type: +5 VDC, TTL compatible
Logic level low: < 0.4 V while sinking 4 mA
Logic level high: Between 2.4 VDC and 5 VDC output while sourcing
200 µA
High state output 1 KΩ from output to common
impedance:
POK delay: 100 ms < T3 < 500 ms
POK rise time T5 ≤ 10ms
Power down warning: T4 > 1 ms
3.4.2 Sleep State (SLEEP#)

The power supply DC outputs (with the exception of the +3.3 VAUX, +5 VSB and +12 VDIG) must be
disabled with an active low, TTL compatible signal (“SLEEP#”). The default signal (high 3.3V or
unconnected) must keep the outputs enabled. The SLEEP# pin must be pulled up to +3.3 VAUX via a
10kΩ resistor within the power supply.
In addition, this signal shall cause one (of the two) fans in a dual fan power supply to be turned off
(only applicable to the two (2) fan form factor). Selection of the active fan shall be at the discretion
of the power supply vendor.
During this state the +12 VDIG load current must be per Table 7. (or Table 8, effective July 1st, 2000)
max.
Table 13. SLEEP#/PS-ON# Relationship

PS-ON# SLEEP# Power Supply / System Function
0 0 Main PSU Off
12 VDIG, 3.3 VAUX and 5 VSB only present
0 1 PSU on - System running normally
1 1 PSU Off - System off
3.3 VAUX and 5 VSB only present
1 0 Invalid state
Page 20 of 40
3.4.3 Remote On/Off Control (PS-ON#)

The power supply DC outputs (with the exception of +3.3VAUX and +5VSB) must be enabled with an
active-low, TTL-compatible signal (“PS-ON#”). The PS-ON# pin must be pulled up to +3.3VAUX via
a 10 kΩ resistor within the power supply.
• The +3.3VAUX and 5VSB must be on whenever the AC power is present.
• When PS-ON# is pulled to TTL low, the DC outputs are to be enabled.
• When PS-ON# is pulled to TTL high (3.3VAUX), or open circuited, the DC outputs are to be
disabled.
• The DC output enable circuit shall be SELV compliant.
In application, the PS-ON# signal may be activated either by electronic means or by a mechanical
switch. Provision for de-bouncing the mechanical switch must be included in the PS-ON# circuitry to
prevent the power supply from oscillating on and off at startup.
Table 14. Remote On/Off and Sleep Signal Characteristics

MIN MAX
Vil, Input Low Voltage 0.1V 0.8V
Iil, Input Low Current, Vin = 0.4V -0.4mA
Vih, Input High Voltage, Iin = -200uA 2.0V
Vih open circuit, Iin = 0 3.47V
3.4.4 Power On Time

The power on time is defined as the time the PS-ON# is pulled low to when the +3.3V, +5V, 12VDIG
and 12VCPU# outputs are within the regulation ranges specified in section 3.2.1. The power on time
must be less than 500 mS.
The 3.3VAUX and 5VSB must have a power on time of 2 seconds maximum after application of valid
AC voltages.
3.4.5 Rise-time
The output voltages must rise from <=10% of nominal to within the regulation ranges specified in
Section 3.2.1 within 0.1 to 70 ms. (0.1 ms ≤ T2 ≤ 70 ms).
Page 21 of 40
3.4.6 Overshoot At Turn-On/Turn-Off

The output voltage overshoot, upon the application or removal of the input voltage under the
conditions specified in section 3.1, must be less than 10% above the nominal voltage. There must be
a smooth and continuous ramp of each DC output voltage from 10% to 90% of its final set point
within the regulation band, while loaded as specified in Section 3.2. A smooth turn-on requires that
during the 10% to 90% portion of the rise time the slope of the turn-on waveform must be positive
and have a value of between 0 V/msec. and (Vout Nominal)/2 msec. Additionally, for any 5 ms
segment of the 10% to 90% rise-time waveform, a straight line drawn between the end points of the
waveform segment must have a slope ≥ (Vout Nominal)/20 ms. No voltage of opposite polarity must
be present on any output during turn-on, or turn-off.
3.4.7 Reset After Shutdown

If the power supply latches into a shutdown state due to a faulty condition on its outputs, the power
supply must return to normal operation only after the fault has been removed and the PS-ON, or AC
input, has been cycled OFF and ON with a minimum OFF time of 1 second.
3.4.8 Standby/Auxiliary Voltages

The +5VSB and +3.3VAUX are “standby” supply output voltages that are active whenever AC power is
present. It provides a power source for circuits that must remain operational when the five main DC
output rails are in a disabled state. Example uses include soft power control, wake-on-LAN, wake-
on-modem, intrusion detection or suspend (sleep) state activities. +3.3VAUX is required for compliance
to ACPI.
The +3.3VAUX output must be capable of delivering a minimum of 3 A at 3.3 Vdc ±5% for external
circuits that includes 3.3VAUX support for up to six- (6) PCI slots.
The +5VSB output must be capable of delivering a minimum of 720 mA at 5 Vdc ±5% for external
circuits.
Overcurrent protection is required on both +3.3VAUX and +5VSB outputs to ensure that the power
supply is not damaged if external circuits draw excessive currents.
3.4.9 Standby Voltage Turn-Off

Following the removal of AC power, the 3.3VAUX and 5VSB (standby voltages) output must remain at
its steady state value until such time as it begins to decrease in voltage. The decrease must be
monotonic in nature dropping to 0.0 volts. There must be no other perturbations of this voltage at or
following removal of AC power.
Page 22 of 40
3.4.10 Fan Control Override

The power supply fan control is a request signal and must not be used as a direct control for the fan.
The power supply must receive an active low TTL signal to the FanC pin (pin 20) of P2. This pin is
then pulled to the 3.3VAUX internal to the power supply via a 10 kΩ resistor. This signal over-rides the
power supply internal thermal control circuit thereby causing the power supply fan(s) to operate at
maximum speed. When running, the voltage across the fan must not be lower than 6 V under any
condition.
It is expected that during the "sleep state" (para 3.4.2), one power supply fan must assume a minimum
speed operation (6 V across the fan). In a two (2) fan power supply, the second fan must turn off
(<1V across the fan); the inactive fan shall be determined by the power supply manufacturer. During
a Remote Off state (para 3.4.3), the power supply fans should be off. The power supply must comply
with the fan requirements of para 4.2.
3.4.11 Fan Monitor

The power supply must provide an open collector, at 2 pulse per revolutions tachometer signal from
the power supply fan to the system via the Fan M pin (pin 2 of P2). In a dual fan power supply, this
signal may come from either one of the fans. In all instances, the signal stops cycling, in either a high
or low level, during a lock rotor state on any power supply fan.
This signal allows the system to monitor the power supply for fan speed or failures. Implementation
of this signal permits the system to gracefully power down in the case of a critical fan failure.
The motherboard uses between a 1 kΩ to 10 kΩ pull-up resistors for this signal and connects to a
high impedance gate as illustrated in Figure 4.
If this signal is not implemented within the system, it should not impact power supply operation.
+3.3VAUXDC
MOTHERBOARD
MONITORING
CIRCUIT
TO PIN 9 OF P2
CONNECTOR
Figure 4. Fan Monitor Circuit
Page 23 of 40
3.5 Output Protection
3.5.1 Overvoltage Protection

The overvoltage sense circuitry and reference resides in packages that are separate and distinct from
the regulator control circuitry and reference. No single point fault shall be able to cause a sustained
overvoltage condition on any or all outputs. The supply must then provide latch-mode Overvoltage
Protection as defined below.
Table 15. Over Voltage Protection
Parameter Min. Nom. Max. Unit
+3.3 VDC 3.76 4.2 4.3 V
+5 VDC 5.74 6.3 7.0 V
+12 VIODC - - 15.6 V
+12 VDIGDC 13.4 15.0 15.6 V
+12 VCPUDC 13.4 15.0 15.6 V
+12 VCPU2DC 13.4 15.0 15.6 V
+3.3 VAUX 3.76 4.2 4.3 V
3.5.2 Short Circuit Protection

An output short circuit is defined as any output impedance of less than 0.005 ohms. The power
supply must shutdown and latch off for shorting +3.3V, +5V, +12IOV, +12VDIG or either of the
+12VCPU rails to return or any other rail (other than rails of equal voltage). Shorts between main
output rails and standby outputs (3.3VAUX and 5VSB) must not cause damage to the power supply.
The power supply must either shutdown and/or latch off for shorting on the –12V rails. The 3.3VAUX
and 5VSB must be capable of being shorted indefinitely but when the short is removed, the P/S shall
recover automatically by cycling the PS-ON#. The power supply must then be capable of
withstanding a continuous short-circuit to the output without damage or over-stress of the unit
(components, PCB traces, and connectors) under the input conditions specified in Section 3.1 above.
The maximum short-circuit energy in any output must not exceed 240 VA.
3.5.3 No Load Operation

No damage or hazardous conditions must occur with all the DC output connectors disconnected from
the load. The power supply may latch into the shutdown state.
3.5.4 Overcurrent Protection

Overload currents applied to each tested output rail cause the output to trip before they reach or
exceed 240 VA. For testing purposes, the overload currents are ramped at a minimum rate of 10 A/s
starting from full load.
Page 24 of 40
4. Mechanical Requirements
4.1 Physical Dimensions/Markings

The power supply is enclosed and must meet the physical outline of one of two form factors shown in
Figure 5 and Figure 6 respectively. The form factor shall be selected based upon the power output
requirement for the system. It is anticipated, but not expected, than that the single form fan form
factor (Figure 5) satisfies the requirements for units with continuous output power not exceeding 500
W. The dual fan form factors (Figure 6) satisfy all power levels.
In order to provide for both tower and rack mount chassis configurations, two- (2) output cable exit
configurations are specified for each form factor, refer to Figure 7 thru Figure 9.
Note: Open exit areas must be minimized for the Single fan side exit option (Figure 7) and for the Dual fan underside exit option (Figure 8) to
minimize stray air intake. Stray air intake impedes system and/or power supply cooling performance. It is recommended that grommets be
utilized for this function.
In addition, each supply shall be marked as shown in the following section.
4.1.1 Warning Label
• A warning label stating the following “Do not remove this cover. Trained service personnel
only. No user serviceable components inside.” Must be in English, German, Spanish, French,
Chinese, and Japanese along with universal warning markings.
• Manufacturer’s Label
• Manufacturer's name, part number, and lot date code in user-readable text format.
• Nominal AC input operating voltages (100-127 VAC and 200-240 VAC) and current rating
certified by all agencies specified in Section 8.
• DC output voltages and current ratings.
Page 25 of 40
Note 1: Fan grill detail shown for

24.2 101.6 illustration only. Actual detail must be
43.25 63.5 Ø3.5 x 4.8 optimized for EMI, acoustic and
Ø3.5
airflow considerations.
Fan grill and AC receptacle position
6.0 shown for illustration only. Fan and
86.0 AC must be positioned within the area
AIR INLET GRILL,
55% MIN OPEN AREA shown. Fan detail and all screw heads
must be flush to the surface of the
power supply.
NOTE 2 Note 2: Optional location for cable exit
150.0 – see figures.
Ø3.5 x 4.8
BOTH SIDES
No. 6-32 UNC-2B
THREADED HOLES
BOTH SIDES
25.4
230.0
Ø3.5
BOTH SIDES
MODEL LABEL 131.29
6
138.0
NOTE 2
R25 (3x) 125 14 No. 6-32 UNC-2B
NOTE 1 THREADED HOLE (8x)
Unless otherwise specified all dimensions

64.0 74.0 are in mm. Tolerances:
xx. ±1
x.x ± 0.5
16.0 4 (2x) 90 6.0 Reference note: All 6-32 screws (8x) used
6.0 (2x) 114.0 R8
to mount the power supply shall be 3/8”
max length
Figure 5. Single Fan WTX Power Supply Form Factor
Page 26 of 40
Note 1: Fan grill details shown for

54.86 114.3 Ø3.5 x 4.8 illustration only. Actual details must be
24.2 87.8 87.8 optimized for EMI, acoustic and airflow
Ø3.5 considerations.
Fan grills and AC receptacle positions
shown for illustration only. Fans and AC
6.0
86.0
AIR INLET GRILL, must be positioned within the area shown.
55% MIN OPEN AREA Fan details and all screw heads must be
flush to the surface of the power supply.
Note 2: Optional location for cable exit –
NOTE 2 see figures.
224.0
Ø3.5 x 4.8
BOTH SIDES
No. 6-32 UNC-2B
THREADED HOLES
BOTH SIDES
25.4
230.0
Ø3.5
BOTH SIDES
MODEL LABEL 131.29
6
6.0 208.0 NOTE 2
6.0 161.5 max 6.0 Unless otherwise specified all
dimensions are in mm.
Tolerances:
64.0 74.0 86.0 xx. ±1
x.x ± 0.5
3.6 11 No. 6-32 UNC-2B Reference note: All 6-32 screws

2pl R25 THREADED HOLE (9x)
2pl NOTE 1 R39.4 REF
(8x) used to mount the power
supply shall be 3/8” max length
Figure 6 - Dual Fan WTX Power Supply Form Factor
Page 27 of 40
61 L
27.5 MAX
30 25+2,-0
27.5 MAX
25 MAX
Figure 7. Single Fan (ONLY) Side Cable Figure 8. Dual Fan (ONLY) Underside
Exit Option Cable Exit Option
.6
26
L, 50
AREA
20
Figure 9. Single and Dual Fan Rear Cable

Exit Option
Page 28 of 40
4.2 Fan Requirements

The power supply fans draw air from the workstation system enclosure and exhaust through a grill
located on the rear panel. It is recommended that a high-speed 80 mm ball bearing fan with thermal
fan speed control be used. The thermal fan speed control circuitry must sense the temperature of the
internal power supply heat sink, or incoming ambient air. For the dual fan power supply, this
circuitry can be either common to, or separate from, each fan.
The fan speed control and monitoring requirements are defined in sections 3.4.10 and 3.4.11,
respectively.
The intake and exhaust grills of the power supply must remain suitably free of obstructions to not
hinder airflow (i.e., no objects within 0.5” of the intake or exhaust areas). The opening must be
sufficiently protected to meet the safety requirements described in Section 8. The grill pattern must
have a minimum of 55% free area. A flush mount wire fan grill is used to maximize airflow and
minimize acoustic noise.
4.3 AC Connector Requirements

The AC input receptacle shall be an IEC 320 type or equivalent. The IEC 320 receptacle is
considered the mains disconnect.
4.4 DC Connector Requirements

Due to the range of power in WTX workstations, several connectors are used for power delivery, refer
to Figure 10 through Figure 13.
4.4.1 Primary 2x12 connector, P1

This connector provides the necessary 3.3 V and 5 V Pin 1 3.3 V Pin 13 3.3 V
power to the board set(s) including 3.3 VAUX and 5 VSB. 3.3 V 3.3 V
The board set(s) connector may be implemented with a 3.3 V 3.3 V
Molex 39-29-9242 or equivalent. 3.3 V 3.3 V
3.3 V 3.3 VAUX
This interfaces with the P1 power supply connector com. com.
Molex 39-01-2240 or equivalent. com. com.
com. com.
It is recommended that Molex HCS 44476-1111 terminal
com. com.
crimp (or equivalent) be used for this connector.
com. 5 VSB
5V 5V
5V 5V
Figure 10. P1, 2x12 Power Connector
Page 29 of 40

This connector provides the remaining power
voltages (12 VIO and –12 V) in addition to the Pin 1 5 VSENSE Pin 12 5 VSENSE RTN
3.3 VSENSE 3.3 VSENSE RTN
necessary control and monitoring signals to the
reserved reserved
board set(s).
com. com.
The board set(s) connector may be implemented com. 12 VIO
with a Molex 39-29-9222 or equivalent. 12 VIO 12 VIO
-12 V sleep
This interfaces with the P1 power supply connector 2
I C clk I2C data
Molex 39-01-2220 or equivalent. FanC FanM
PS-OK PS-on
reserved reserved
Figure 11. P2, 2x11 Power/Signal Connector

This connector provides the 12 VDIG voltage to the board set(s) intended to support WTX memory
D2D (DC to DC converters), refer to WTX Memory D2D Design Guide www.wtx.org, and processor
VRMs (Voltage Regulation Modules).
The board set(s) connector may be implemented with
a Molex 39-29-9082 or equivalent. Pin 1 12 VDIG Pin 5 com
12 VDIG com.
This interfaces with the P1 power supply connector 12 VDIG com.
Molex 39-01-2080 or equivalent. 12 VDIG SENSE 12 VDIG SEN RTN
Figure 12. P3, 2x4 Power Connector
4.4.4 Primary 2x3 connectors, P4,P5

This connector provides the 12 VCPU voltage to the board set(s) or direct to the Power Pods to
support higher power processor converter requirements.
The board set(s) connector may be implemented with a Molex 39-29-9082 or equivalent. The Power
Pod input connector may be implemented with Molex 39-30-1060 or equivalent).
This interfaces with the P1 power supply connector
Pin 1 12 VCPU# Pin 4 com
Molex 39-01-2060 or equivalent.
12 VCPU# com.
12 VCPU# com.
Figure 13. P4/5, 2x3 Power Connector
Page 30 of 40
4.4.5 HDD PERIPHERAL CONNECTORS

AMP 1-480424-0 OR MOLEX 8981-04P or approved equivalent. Contacts should be AMP 61314-1
terminals or equivalent.
4.4.6 FDD PERIPHERAL CONNECTORS

Connectors should be AMP 171822-4 or approved equivalent.
Page 31 of 40
4.5 Power Supply Wiring Recommendations

Listed or recognized component appliance wiring material (AVLV2), CN, rated for a minimum of 80o
C, 300 Vdc must be used for all output wiring.
There is no specific requirement for lengths or coloring of wiring from the power supply. The length
is determined by the particular chassis motherboard combination. A suggested wire color- coding
used by many vendors is detailed in the following sections, but this color-coding is NOT required.
100 +/-10mm
(4")
pin 1 pin 13
P1 MOLEX
P1 39-01-2240
or equiv
pin 1 pin 12
P2 MOLEX
P2
39-01-2220
or equiv
pin 1 pin 5
P3 MOLEX
P3
39-01-2080
or equiv
305 +/-10mm (12")
P4
pin 1 pin 4
P4, P5 MOLEX
39-01-2060
P5
or equiv
200 +/-10mm (8")
Figure 14. Suggested Wire Lengths
Page 32 of 40
610 +/-10mm (24")
pin 1
pin 4
POWER SUPPLY
155 +- 15
pin 1
pin 4
16AWG
TWISTED 155 +- 15
18AWG
PAIRS pin 1
TWISTED
PAIRS pin 4
pin 1
pin 4
155 +- 15
pin 1
18AWG
Hard drive TWISTED pin 4
PAIRS
cage
Peripheral pin 1
bays
pin 4
155 +- 15
pin 1
pin 4
18AWG
(min wire size) 155 +- 15
TWISTED 18AWG pin1
pin4
PAIRS TWISTED
PAIRS
pin 1
pin 4
155 +- 15
pin1
18AWG pin4
TWISTED
PAIRS
Figure 15. Suggested wire lengths for HDD/FDD connectors
Page 33 of 40
4.5.1 Suggested wire size/colours

4.5.1.1 P1: suggest wire size/colours
Connector: Molex 39-01-2240, or equivalent
AWG Wire Colour Signal Pin Pin Signal Wire Colour AWG
18 ORANGE +3.3Vdc 1 13 +3.3Vdc ORANGE 18
18 ORANGE +3.3Vdc 5 17 +3.3VAUX BROWN 20
18 BLACK COM 6 18 COM BLACK 18
18 BLACK COM 10 22 +5VSB PURPLE 20
18 RED +5Vdc 11 23 +5Vdc RED 18
18 RED +5Vdc 12 24 +5Vdc RED 18

22 RED +5VSENSE 1 12 +5VSEN RTN BLACK 22
22 ORANGE +3.3VSENSE 2 13 +3.3VSEN RTN BLACK 22
RESERVED 3 14 RESERVED
18 BLACK COM 5 16 +12VIO YELLOW 18
18 YELLOW +12VIO 6 17 +12VIO YELLOW 18
18 BLUE -12V 7 18 SLEEP# WHITE 18
22 PURPLE Fan-C 9 20 Fan-M BROWN 22
22 GRAY PS-OK 10 21 PS-ON# GREEN 22
Page 34 of 40

18 BLACK COM 5 1 +12VDIG WHITE 18
4.5.1.4 P4/5: suggested wire size/colours

18 BLACK COM 4 1 +12VCPU# WHITE 18
4.5.1.5 HDD Peripheral connectors: suggested wire size/colours

Connector: AMP 1-480424-0 or Molex 8981-04P or equivalent
Contacts: AMP 61314-1 terminals or equivalent
Refer to Figure 15. Suggested wire lengths for HDD/FDD connectors. It is recommended for cable
lengths over 460mm (18”) that cables be twisted at 1.5 twists/inch, yellow with black and red with
black.
Pin Signal Wire Colour AWG
1 +12VIO YELLOW 16
2 COM BLACK 16
3 COM BLACK 16
4 +5Vdc RED 16
4.5.1.6 FDD Peripheral connectors: suggested wire size/colours

Connector: AMP 171822-4, or equivalent
Refer to Figure 15. Suggested wire lengths for HDD/FDD connectors. It is recommended for cable
lengths over 460mm (18”) that cables be twisted at 1.5 twists/inch, yellow with black and red with
black.
Pin Signal Wire Colour AWG

1 +5Vdc RED 18
2 COM BLACK 18
3 COM BLACK 18
4 +12VIO YELLOW 18
Page 35 of 40
5. Environmental Requirements
5.1 Temperature
Operating Ambient: +10° C min.
+50° C max.
(At full load; with a maximum rate of change between 5°C/10 minutes and 10°C/hr.)
Non-Operating Ambient: -40° C to +70° C
(Maximum rate of change is 20°C/hour.)
5.2 Humidity
Operating: To 85% relative humidity (non-condensing)
Non-Operating: To 95% relative humidity (non-condensing)
Note: 95% relative humidity. is achieved with a dry bulb temperature of 55°C and a wet bulb temperature of 54°C.
5.3 Altitude
Operating: to 10,000 ft
Non-Operating: to 50,000 ft
5.4 Mechanical Shock

Non-Operating: 50 G Trapezoidal Wave, Velocity change = 170 in. / sec.
Three- (3) drops in each of six- (6) directions are applied to
each of the samples.
5.5 Random Vibration

Non-Operating 0.01G² per Hz at 5 Hz, sloping to 0.02G² per Hz at 20 Hz, and
maintaining 0.02G² per Hz from 20 Hz to 500 Hz. The area
under the PSD curve is 3.13 gRMS. The duration shall be 10
minutes per axis for all three- (3) axes on all samples.
Page 36 of 40
5.6 Thermal Shock (Shipping)

Non-Operating: -40° C to +70° C, 50 cycles, 30°C/min. ≥ transition time ≥ 15°
C/min., duration of exposure to temperature extremes for each
half cycle shall be 30 minutes.
5.7 Ecological Requirements

The following materials must not be used during design and/or manufacturing of this product:
• Cadmium must not be used in painting or plating.
• No quaternary salt or PCB electrolytic capacitors shall be used.
• No CFC’s or HFC’s shall not be used in the design or manufacturing process.
• Mercury shall not be used.
5.8 Catastrophic Failure

The power supply must be designed to fail without creating a startling noise or excessive smoke.
5.9 Acoustics
Acoustic requirements will be set by the final computer OEM system requirements.
Page 37 of 40
6. Electromagnetic Compatibility
6.1 EMI
The power supply must comply with CISPR 22, Class B for both conducted and radiated emissions
with a 4 dB margin. Tests shall be conducted using a shielded DC output cable to a shielded load.
The load must be adjusted as follows for three- (3) separate tests:
• No load on each output
• 50% load on each output
• 100% load on each output.
Tests are performed at 100 VAC/ 50 Hz, 120 VAC /60 Hz, and 220 VAC/ 50 Hz power.
6.2 Input Line Current Harmonic Content

The power supply shall meet the requirements of EN61000-3-2 Class D and the Guidelines for the
Suppression of Harmonics in Appliances; and General Use Equipment Class D, for harmonic line
current content at full rated power. See Table 16 for the harmonic limits.
Table 16. Harmonic Limits, Class D

Harmonic Order Maximum permissible harmonic Maximum permissible
N current per watt (mA/W) Harmonic current (Amps)
3 3.4 2.30
5 1.9 1.14
7 1.0 0.77
9 0.5 0.40
11 0.35 0.33
13 0.30 0.21
15≤n≤39 3.85/n 0.15X(15/n)

Note:
PFC: Apply Table 12 limits as shown for 230V operation and multiply limits by 230/100 for 100V operation for world-wide
requirements in both EU and Japan, respectively.
6.3 Magnetic Leakage Fields

The PFC choke magnetic leakage field shall not cause any interference with a high-resolution
computer monitor placed next to, or on top, of the end-use chassis. The end-system vendor
determines the final acceptable leakage field strengths. This is done during the system level testing
while in the end-use chassis.
Page 38 of 40
7. Reliability
7.1 Component Derating

The following component derating guidelines shall be followed:
• Semiconductor junction temperatures must not exceed 110°C with an ambient of 50°C. Any
exceptions are subject to final approval by the system designer.
• Inductor case temperatures shall not exceed safety agency requirements.
• Capacitor case temperatures shall not exceed 95% of rated temperature.
• Resistor wattage derating shall be > 30%.
• Component voltage and current derating shall be > 10% at 50°C. Any exceptions are subject to
final approval by the system designer.
• Magnetic saturation of inductors and transformers are not allowed under any line, load, startup,
or transient condition including 100% transients on the main outputs, 5VSB or 3.3VAUX.
7.2 Mean Time Between Failures (MTBF)

The MTBF of the power supply is calculated utilizing the Part-Stress Analysis method of
MIL-HDBK-217F using the quality factors listed in MIL-HDBK-217F. The calculated MTBF of the
power supply shall be greater than 100,000 hours under the following conditions:
• Full rated load
• 120V AC input
• Ground Benign
• 25°C ambient.
The calculated MTBF of the power supply must be greater than 30,000 hours under the following
conditions:
• Full rated load
• 120 VAC input
• Ground Benign
• 50 °C ambient.
Page 39 of 40
8. Safety Requirements
8.1 North America

The power supply must be certified by NRTL (Nationally Recognized Testing Laboratory) for use in
the USA and Canada under the following conditions:
• For use in Information Technology Equipment including Electrical Business Equipment per UL
1950/CAN/CSA C22.2 No. 950-95, 3rd Edition, without D3. The certification must include
external enclosure testing for the AC receptacle side of the power supply.
• Have a full complement of tests conducted as part of the certification, such as input current,
leakage current, hi-pot, temperature, energy discharge test, transformer output characterization
test (open circuit voltage, short circuit current and maximum VA output), and abnormal testing
(to include stalled fan tests and voltage select switch mismatch).
• The enclosure must meet fire enclosure mechanical test requirements per clauses 2.9.1 and 4.2
of the above standard.
• The Supplier must supply the complete certification Report including Test Record. Production
hi-pot testing must be included as a part of the certification and indicated as such in the
Certification report.
• There must not be unusual or difficult "Conditions of Acceptability" such as mandatory
additional cooling or power derating. The insulation system shall not have temperatures
exceeding their rating when tested in the end product.
• The Certification mark shall be affixed on each power supply.
• A list of the minimum temperature ratings of all AC mains-connected components and the
printed wiring board(s) shall be provided. The PSU must be evaluated for operator-accessible
secondary outputs (reinforced insulation), that meets the requirements for SELV and does not
exceed 240 VA continuous output under any condition of loading.
• The proper polarity between the AC Input receptacle and any Printed Wiring Boards
connections must be maintained. (i.e. brown=line, blue=neutral, green=earth/chassis).
• Failure of any single component in the fan speed control circuit shall not cause the internal
component temperatures to exceed the abnormal fault condition temperatures per IEC 60950.
8.2 International
The vendor must provide a complete CB certificate and test report to IEC60 950, 2nd Edition + A1,
A2, A3, & A4. The CB report must include ALL CB member country national deviations. The CB
report must include evaluation of EN60 950, + A1, A2, A3, A4 and EMKO-TSE (74-SEC) 207/94.
• All evaluations and certifications must be for reinforced insulation between primary and
secondary circuits.
• It is highly recommended that the CB report be issued by NEMKO, North America
Page 40 of 40

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WTX

February 19, 1999

IMPORTANT INFORMATION AND DISCLAIMERS

Version 0.3, June 1998

Revision 0.4 Initial releas

4.1 Physical Dimensions/Markings..........................................................................................25

• Physical form factors

1.1 Power Distribution Structure

DUAL FAN POWER

3.3VSB RAIL (up to 3A)

5VSB RAIL (up to .70A)

Misc I/O, M/B etc

I/O PCI 6 slots - support

BAYS mulitple media bays

Figure 1. WTX Power Distribution Summary - 240VA

3.1 AC Input Requirements

Iin (115 VAC) 11.5 Arms

Iin (230 VAC) 5.8 Arms

3.1.1 Input Overcurrent Protection

3.1.2 Inrush Current Limiting

3.1.3 Input Undervoltage

Table 2. Line Voltage Transient Limits

3.1.4.2 Surge Voltages

3.1.4.2.1 Surge Immunity, IEC 61000-4-5

3.1.4.2.2 Electrical Fast Transient/Burst, IEC 61000-4-4

3.1.4.2.3 Ring Wave, ANSI C62.45-1992

3.1.4.2.4 Electrostatic Discharge, IEC 61000-4-2

3.1.4.2.5 Radiated Immunity, IEC 61000-4-3

3.1.4.2.6 Immunity to Conducted Disturbances, IEC 61000-4-6

3.1.4.2.7 Power Frequency Magnetic Field, IEC 61000-4-8

3.1.4.2.8 Voltage Dips & Interruptions, IEC 61000-4-11

3.1.5 Catastrophic Failure Protection

3.2 DC Output Requirements

3.2.1 DC Voltage Regulation

3.2.2 Remote Sensing

3.3 Typical Power Distribution

Table 4. Typical Power Distribution for a 460W Configuration

Table 5. Typical Power Distribution for a 610W Configuration

Table 6. Typical Power Distribution for a 800 W Configuration

3.3.1 Power Limit

• Single fan 400 W - 460 W output range 68% minimum

3.3.2.1 Energy Star requirements (until June 30th, 2000)

Table 7. Energy Star Load Conditions

Output Load Conditions

3.3.2.2 Energy Star Requirements (Effective July 1st, 2000)

Table 8. Y2k Energy Star Load Conditions

Output Load Conditions

3.3.2.3 Standby Efficiency

3.3.3 Output Ripple/Noise

Table 9. DC Output Noise/Ripple

3.3.4 Output Transient Response

Table 10. Maximum Individual Load Steps

3.3.5 Closed Loop Stability

3.3.6 Capacitive Load

Capacitive 350 6,000 10,000 1,000 1,000 2,000 350

3.3.7 Output Power Sequencing

3.3.8 Voltage Hold-up Time

3.4 Timing / Housekeeping / Control

Figure 2. Power Sequencing

Figure 3. Power Supply Timing