LM1117 800-Ma, Low-Dropout Linear Regulator: 1 Features 3 Description
LM1117 800-Ma, Low-Dropout Linear Regulator: 1 Features 3 Description
LM1117 800-Ma, Low-Dropout Linear Regulator: 1 Features 3 Description
LM1117
SNOS412O – FEBRUARY 2000 – REVISED JUNE 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM1117
SNOS412O – FEBRUARY 2000 – REVISED JUNE 2020 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.4 Device Functional Modes........................................ 14
2 Applications ........................................................... 1 9 Application and Implementation ........................ 15
3 Description ............................................................. 1 9.1 Application Information............................................ 15
4 Revision History..................................................... 2 9.2 Typical Application .................................................. 15
9.3 System Examples ................................................... 17
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 4 10 Power Supply Recommendations ..................... 18
7 Specifications......................................................... 5 11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
7.1 Absolute Maximum Ratings ...................................... 5
11.2 Layout Example .................................................... 22
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5 12 Device and Documentation Support ................. 23
7.4 Thermal Information .................................................. 5 12.1 Documentation Support ........................................ 23
7.5 LM1117 Electrical Characteristics............................. 5 12.2 Receiving Notification of Documentation Updates 23
7.6 LM1117I Electrical Characteristics............................ 8 12.3 Support Resources ............................................... 23
7.7 Typical Characteristics ............................................ 10 12.4 Trademarks ........................................................... 23
12.5 Electrostatic Discharge Caution ............................ 23
8 Detailed Description ............................................ 12
12.6 Glossary ................................................................ 23
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12 13 Mechanical, Packaging, and Orderable
8.3 Feature Description................................................. 12
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
• Removed LM1117-N-2.85 option after part became inactive................................................................................................. 1
• Removed TO-263 Pinout Side View image ........................................................................................................................... 4
DCY Package
4-Pin SOT KTT Package
Top View 3-Pin TO-263
Top View
NGN Package
8-Pin WSON
Top View
VIN 2 7 VOUT
VOUT
VIN 3 6 VOUT
VIN 4 5 VOUT
Pin Functions
PIN
I/O DESCRIPTION
NAME TO-252 WSON SOT-223 TO-263 TO-220
Adjust pin for adjustable output option. Ground pin for fixed
ADJ/GND 1 1 1 1 1 —
output option.
VIN 3 2, 3, 4 3 3 3 I Input voltage pin for the regulator
5, 6, 7,
VOUT 2 , TAB 2, 4 2, TAB 2, TAB O Output voltage pin for the regulator
TAB
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Maximum Input Voltage (VIN to GND) 20 V
(2)
Power Dissipation Internally Limited
Junction Temperature (TJ) (2) 150 °C
Storage Temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000
V may actually have higher performance.
(1) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
LM1117-5.0 TJ = 25°C 5 V
0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤ over the junction temperature range
12 V 4.9 5.1
0°C to 125°C
(3) Load and line regulation are measured at constant junction room temperature.
6 Submit Documentation Feedback Copyright © 2000–2020, Texas Instruments Incorporated
(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.
(5) The minimum output current required to maintain regulation.
TJ = 25°C
LM1117I-ADJ 0.035%
IOUT = 10 mA, 1.5 V ≤ VIN – VOUT ≤ over the junction
13.75 V temperature range 0.3%
–40°C to 125°C
TJ = 25°C 1
ΔVOUT Line Regulation (3) LM1117I-3.3 over the junction mV
IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V temperature range 10
–40°C to 125°C
TJ = 25°C 1
LM1117I-5.0 over the junction mV
IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V temperature range 15
–40°C to 125°C
TJ = 25°C 0.2%
LM1117I-ADJ
VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800 over the junction
mA temperature range 0.5%
–40°C to 125°C
TJ = 25°C 1
(3) LM1117I-3.3 over the junction
ΔVOUT Load Regulation mV
VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA temperature range 15
–40°C to 125°C
TJ = 25°C 1
LM1117I-5.0 over the junction mV
VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA temperature range 20
–40°C to 125°C
(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.
(5) The minimum output current required to maintain regulation.
8 Detailed Description
8.1 Overview
The LM1117 adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust
terminal. As shown in Figure 10, this voltage is applied across resistor R1 to generate a constant current I1. The
current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60µA)
compared with the I1 and very constant with line and load changes, the error can be ignored. The constant
current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
When the adjustable regulator is used (Figure 12), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with
0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL.
If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω (1+R2/R1) or in this case, it
is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to
provide remote ground sensing and improve load regulation.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Figure 14. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection
Figure 16. Fixed Output Regulator Figure 17. Adjusting Output of Fixed Regulators
Figure 18. Regulator With Reference Figure 19. 5-V Logic Regulator With Electronic
Shutdown*
11 Layout
The case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 22. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board
The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all
possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to 125°C.
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be
calculated:
IIN = IL + IG (2)
PD = (VIN-VOUT)I L + VINIG (3)
Figure 23 shows the voltages and currents which are present in the circuit.
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):
TR(max) = TJ(max)-TA(max)
where
• TJ(max) is the maximum allowable junction temperature (125°C) which will be encountered in the application
• TA(max) is the maximum ambient temperature which will be encountered in the application (4)
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient
thermal resistance (RθJA) can be calculated:
RθJA = TR(max)/PD (5)
For the maximum allowable value for θJA, refer to the Thermal Information table.
As a design aid, Table 2 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area.
Figure 24 and Figure 25 reflects the same test results as what are in the Table 2
Figure 26 and Figure 27 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-
223 and TO-252 device. Figure 28 and Figure 29 shows the maximum allowable power dissipation vs. copper
area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be
used with SOT-223 and TO-252 packages.
The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance and
power dissipation for the WSON.
Figure 24. RθJA vs 1-oz Copper Area for SOT-223 Figure 25. RθJA vs 2-oz Copper Area for TO-252
Figure 26. Maximum Allowable Power Dissipation vs Figure 27. Maximum Allowable Power Dissipation vs
Ambient Temperature for SOT-223 Ambient Temperature for TO-252
Figure 28. Maximum Allowable Power Dissipation vs 1-oz Figure 29. Maximum Allowable Power Dissipation vs 2-oz
Copper Area for SOT-223 Copper Area for TO-252
Figure 30. Top View of the Thermal Test Pattern in Actual Scale
Figure 31. Bottom View of the Thermal Test Pattern in Actual Scale
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 11-Jan-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM1117DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-1.8
LM1117DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-2.5
LM1117DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-3.3
LM1117DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-5.0
LM1117DT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-ADJ
LM1117DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-1.8
LM1117DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-2.5
LM1117DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-3.3
LM1117DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-5.0
LM1117DTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-ADJ
LM1117IDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-3.3
LM1117IDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-5.0
LM1117IDT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-ADJ
LM1117IDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-3.3
LM1117IDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-5.0
LM1117IDTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-ADJ
LM1117ILD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1117IAD
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM1117IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B
LM1117IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B
LM1117IMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B
LM1117IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B
LM1117IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B
LM1117IMPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B
LM1117LD-1.8/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18
LM1117LD-2.5/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-25
LM1117LD-3.3/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-33
LM1117LD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ
LM1117LDX-1.8/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18
LM1117LDX-ADJ/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ
LM1117MP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A
LM1117MP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A
LM1117MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N05A
LM1117MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A
LM1117MP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A
LM1117MPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A
LM1117MPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM1117MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A
LM1117MPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-May-2020
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 12-May-2020
Pack Materials-Page 3
MECHANICAL DATA
NDE0003B
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MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
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MECHANICAL DATA
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
Gauge Plane
1 2 3
0,25 (0.010)
0,84 (0.033) 0°–10°
2,30 (0.091)
0,66 (0.026)
0,10 (0.004) M
4,60 (0.181) 0,75 (0.030) MIN
1,70 (0.067)
1,80 (0.071) MAX 1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
4202506/B 06/2002
4.1 B
A
3.9
PIN 1 ID
DETAIL A
PIN 1 ID
C
0.8 MAX
SEATING PLANE
0.05 0.08 C
0.00
2.2 0.05
EXPOSED SYMM
THERMAL PAD (0.2) TYP
6X 0.8
4
5
2X SYMM
9
2.4 3 0.05
SEE
DETAIL A
8
1
0.35
(0.25) 8X
0.25
(0.2) 0.6
(0.25) 8X 0.1 C A B
0.4
PIN 1 ID (0.15) 0.05 C
4214794/A 11/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
NGN0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(2.2)
8X (0.5) SYMM
1
8X (0.3) 8
SYMM 9
(3)
(1.25)
6X (0.8)
4 5
(R0.05) TYP
( 0.2) VIA
TYP (0.85)
(3.3)
EXPOSED EXPOSED
METAL METAL
4214794/A 11/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
NGN0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
0.59
SYMM METAL
8X (0.5) TYP
1
8X (0.3) 8
4X (1.31)
SYMM
9
(0.755)
6X (0.8)
5
4
(R0.05) TYP
4X (0.98)
(3.3)
EXPOSED PAD 9:
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214794/A 11/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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PACKAGE OUTLINE
NDP0003B SCALE 1.500
TO-252 - 2.55 mm max height
TRANSISTOR OUTLINE
10.42
9.40
6.22 1.27
B
5.97 0.88 A
(2.345)
2.285 (2.5)
2 5.46 6.73
4.57
4.96 6.35
3
0.88
3X 1.02 PKG
0.64 OPTIONAL
0.25 C A B 0.64
8 8
TOP & BOTTOM
1.14
0.89 C
2.55 MAX
SEATING PLANE
4.32 MIN
2 4
4219870/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-252.
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EXAMPLE BOARD LAYOUT
NDP0003B TO-252 - 2.55 mm max height
TRANSISTOR OUTLINE
4 SYMM
(4.57) (5.5)
(R0.05) TYP
(4.38) (2.285)
PKG
4219870/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
NDP0003B TO-252 - 2.55 mm max height
TRANSISTOR OUTLINE
(1.35) TYP
2X (2.15)
(0.26)
2X (1.3) (R0.05) TYP
(1.32) TYP
(4.57)
16X (1.12)
16X (1.15)
(4.38)
PKG
4219870/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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