DDR4 Module Part Numbering System

The part numbering system is available at www.micron.com/numbering

DDR4 SDRAM modules

MT A 36 A SF 2G 72 P Z - 2G3 A 1
Micron Technology Printed Circuit
Board Revision
Product Family
A = DDR4 SDRAM Die Revision (up to 2 characters)

Number of Die DDR4 SDRAM Module Speed

Module Component Clock Data Module
Voltage Speed Speed Grade/ Component Freq. Rate Module Configuration
A = 1.2V Grade Part Mark Speed Bin (MHz) (MT/s) Bandwidth SPD (CL-nRCD-nRP)
-2G1 -093E DDR4-2133 1067 2133 PC4-2133 15-15-15
Module Options -2S1 -093H DDR4-2133 1067 2133 PC4-2133 18-15-15
TF = FBGA w/out Temp Sensor -2G3 -083 DDR4-2400 1200 2400 PC4-2400 17-17-17
TS = Dual-Die w/out Temp Sensor -2G4 -083E DDR4-2400 1200 2400 PC4-2400 16-16-16
TQ = Quad-Die w/out Temp Sensor -2S3 -083H DDR4-2400 1200 2400 PC4-2400 20-18-18
SF = FBGA w/Temp Sensor -2S4 -083J DDR4-2400 1200 2400 PC4-2400 19-17-17
SS = Dual-Die w/Temp Sensor -2G6 -075 DDR4-2666 1333 2666 PC4-2666 19-19-19
SQ = Quad-Die w/Temp Sensor -2S6 -075H DDR4-2666 1333 2666 PC4-2666 22-19-19
SE = Octal-Die w/Temp Sensor -2G7 -075E DDR4-2666 1333 2666 PC4-2666 18-18-18
DF = VLP w/Temp Sensor -2G9 -068 DDR4-2933 1467 2933 PC4-2933 21-21-21
DS = VLP Dual-Die w/Temp Sensor -2S9 -068H DDR4-2933 1467 2933 PC4-2933 24-21-21
DQ = VLP Quad-Die w/Temp Sensor -3G2 -062E DDR4-3200 1600 3200 PC4-3200 22-22-22
LF = 4U height with temp sensor -3S2 -062H DDR4-3200 1600 3200 PC4-3200 26-22-22
LS = 4U height Dual-Die with temp sensor SPD = serial presence-detect pin (module only)
LQ = 4U height Quad-Die with temp sensor
LE = 4U height Octal-Die with temp sensor Package Codes
HF = 2U height with temp sensor Pb-Free
HS = 2U height Dual-Die with temp sensor Devices Package Descriptions
HQ = 2U height Quad-Die with temp sensor Z Commercial temp; halogen-free; single-, dual-, quad- or octal-rank DIMM
HE = 2U height Octal-Die with temp sensor DZ Commercial temp; halogen-free; select dual-, quad- or octal-rank DIMM
SZF = FBGA w/Temp Sensor and Heat Spreader DZM Commercial temp; Reduced Standby; halogen-free; select dual-, quad- or octal-rank DIMM
SZS = Dual-Die w/Temp Sensor and Heat Spreader IZ Industrial temp, halogen-free; single-, dual- or quad-rank DIMM
SZQ = Quad-Die w/Temp Sensor and Heat Spreader TZ Industrial temp, halogen-free; select dual- or quad-rank DIMM
SZE = Octal-Die w/Temp Sensor and Heat Spreader ZM Commercial temp; Reduced Standby; halogen-free; single-, dual-, quad- or octal-rank DIMM
DZF = VLP w/Temp Sensor and Heat Spreader
DZS = VLP Dual-Die w/Temp Sensor and Heat Spreader Module Type
DZQ = VLP Quad-Die w/Temp Sensor and Heat Spreader A = 288-pin UDIMM (unbuffered)
H = 260-pin SODIMM
Module Configuration L = 288-pin LRDIMM
Depth, Width LS = 288-pin 3DS (M/S) LRDIMM
Blank = Megabits P = 288-pin RDIMM
G = Gigabits PS = 288-pin 3DS (M/S) RDIMM
AK = 288-pin miniUDIMM (unbuffered)
PK = 288-pin miniRDIMM

Rev. 05-Dec-2018

© 2016 Micron Technology, Inc.

Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are estimates only.
DDR3 Module Part Numbering System
The part numbering system is available at www.micron.com/numbering

DDR3 SDRAM modules

MT 36 K SF 2G 72 P Z - 1G6 E 1
Micron Technology MB Vendor/Revision*
*Applies to LRDIMM modules only
Number of Die Printed Circuit
Board Revision
Voltage Die Revision
J = 1.5V
K = 1.35V DDR3 SDRAM Module Speed
M = 1.35V reduced standby Module Component JEDEC Clock Data Module
Speed Speed Grade/ Component Freq. Rate Module Configuration
Module Options Grade Part Mark Speed Grade (MHz) (MT/s) Bandwidth SPD (CL-nRCD-nRP)
TF = FBGA -80B -25 DDR3-800 400 800 PC3-6400 6-6-6
TS = DDP (dual die in package) -80C -25E DDR3-800 400 800 PC3-6400 5-5-5
SF = FBGA with temp sensor -1G0 -187 DDR3-1066 533 1066 PC3-8500 8-8-8
SS = DDP with temp sensor -1G1 -187E DDR3-1066 533 1066 PC3-8500 7-7-7
BF = VLP (17.9mm) with temp sensor -1G2 -187F DDR3-1066 533 1066 PC3-8500 6-6-6
BS = VLP (17.9mm) DDP with temp sensor -1G3 -15 DDR3-1333 667 1333 PC3-10600 10-10-10
DF = VLP (18.75mm) with temp sensor -1G4 -15E DDR3-1333 667 1333 PC3-10600 9-9-9
DS = VLP (18.75mm) DDP with temp sensor -1G5 -15F DDR3-1333 667 1333 PC3-10600 8-8-8
GF = 1.5U height FBGA with temp sensor -1GA** -125 DDR3-1333 667 1333 PC3-10600 11-11-11
GS = 1.5U height DDP with temp sensor -1G6 -125 DDR3-1600 800 1600 PC3-12800 11-11-11
HF = 2U height with temp sensor -1G7 -125E DDR3-1600 800 1600 PC3-12800 10-10-10
LF = 4U height with temp sensor -1G8 -125F DDR3-1600 800 1600 PC3-12800 9-9-9
SZF = FBGA with temp sensor and heat spreader -1G9 -107 DDR3-1866 933 1866 PC3-14900 13-13-13
SZS = DDP with temp sensor and heat spreader -1GB -107E DDR3-1866 933 1866 PC3-14900 12-12-12
SZQ = QDP with temp sensor and heat spreader -1GC -107F DDR3-1866 933 1866 PC3-14900 11-11-11
BZF = VLP (17.9mm) with temp sensor and heat spreader -2G1 -093 DDR3-2133 1067 2133 PC3-17000 14-14-14
BZS = VLP (17.9mm) DDP with temp sensor and heat spreader -2G2 -093E DDR3-2133 1067 2133 PC3-17000 13-13-13
DYS = VLP (18.75mm) DDP with temp sensor and alternate heat spreader -2G3 -093F DDR3-2133 1067 2133 PC3-17000 12-12-12
DZF = VLP (18.75mm) with temp sensor and heat spreader ** -1GA = -1333 SPD with -125 tested DRAM
DZS = VLP (18.75mm) DDP with temp sensor and heat spreader SPD = serial presence-detect pin (module only)
DZQ = VLP (18.75mm) QDP with temp sensor and heat spreader
Package Codes
Module Configuration Pb-Free
Depth, Width Devices Package Descriptions
Blank = Megabits Y Commercial temp; single-, dual- or quad-rank DIMM
G = Gigabits Z Halogen-free; commercial temp; single-, dual-, quad- or octal-rank DIMM
IZ Halogen-free; Industrial temp, commercial temp; single-, dual- or
Module Type quad-rank DIMM
Blank = 240-pin registered DIMM TZ Halogen-free; Industrial temp; select dual- and quad-rank DIMM
A = 240-pin unbuffered DIMM DY Commercial temp; select dual- or quad-rank DIMM
H = 204-pin SODIMM DZ Halogen-free; commercial temp; select dual-, quad- or octal-rank DIMM
HS = 204-pin SODIMM (R/C G: standard layout)
HR = 204-pin SODIMM (R/C H: reverse layout)
P = 240-pin parity RDIMM
L = 240-pin LRDIMM
AK = 244-pin unbuffered miniDIMM
PK = 244-pin parity miniRDIMM

Rev. 27-Nov-2018

© 2018 Micron Technology, Inc.

Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are estimates
only.
DDR2 Module Part Numbering System
The part numbering system is available at www.micron.com/numbering

DDR2 SDRAM modules

MT 36 H TF 1G 72 P Z - 80E C 1
Micron Technology AMB Vendor Rev*

Number of Die AMB Vendor*

E = Intel
Voltage D = IDT
H = 1.8V N = NEC *Applies to FBDIMM modules only
G = 1.5V
R = 1.55V Printed Circuit Board
Revision Designator
Module Options
TF = FBGA Die Revision
TS = DDP (dual die in package)
TZS = Heatspreader DDP DDR2 SDRAM Module Speed
VF = VLP (very low profile) Module Component JEDEC Clock Data Module
VS = VLP DDP Speed Speed Grade/ Component Frequency Rate Module Configuration
VZS = VLP Heatspreader DDP Grade Part Mark Speed Grade (MHz) (MT/s) Bandwidth SPD (CL-tRCD-nRP)
-40E -5E DDR2-400 200 400 PC2-3200 3-3-3
Module Configuration -53E -37E DDR2-533 267 533 PC2-4200 4-4-4
Depth, Width -667 -3 DDR2-667 333 667 PC2-5300 5-5-5
Blank = Megabits -80E -25E DDR2-800 400 800 PC2-6400 5-5-5
G = Gigabits -800 -25 DDR2-800 400 800 PC2-6400 6-6-6
-1GA -187E DDR2-1066 533 1066 PC2-8500 7-7-7
Module Type
Blank = 240-pin registered DIMM SPD = serial presence-detect pin (module only)
A = 240-pin unbuffered DIMM Package Codes
F = 240-pin fully buffered DIMM
H = 200-pin SODIMM Pb-Free
P = 240-pin Parity RDIMM Devices Package Descriptions
PK = 244-pin Parity MiniRDIMM Y Commercial temp; single- or dual-rank DIMM
RH = 200-pin SORDIMM Z. Halogen-free; commercial temp; single- or dual-rank DIMM
DY Commercial temp; select dual-rank
DZ Halogen-free; commercial temp; select dual- or quad-rank DIMM
IY Industrial temp; select single and dual-rank DIMM
TY Industrial temp; select dual and quad-rank DIMM
IZ Halogen-free; industrial temp; select single and dual-rank DIMM
TZ Halogen-free; industrial temp; select dual and quad-rank DIMM

Rev. 27-Nov-2018
© 2018 Micron Technology, Inc.
Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are
estimates only.
DDR/SDRAM Module Part Numbering System
The part numbering system is available at www.micron.com/numbering

DDR/SDRAM modules

MT 36 V DDF 256 72 Y - 40B J 2

Micron Technology Printed Circuit Board
Revision Designator
Number of Die
Die Revision Designator
Voltage
L = 3.3V (SDRAM) DDR Module Speed
V = 2.5V (DDR SDRAM) Module Component JEDEC Clock Data Module
Speed Speed Grade/ Component Frequency Rate Module Configuration
Module Options Grade Part Mark Speed Grade (MHz) (MT/s) Bandwidth SPD (CL-nRCD-nRP)
DDF = DDR FBGA -335 -6T DDR333 TSOP 167 333 PC2700 2.5-3-3
DDT = DDR TSOP -335 -6 DDR333 FBGA 167 333 PC2700 2.5-3-3**
DVF = DDR FBGA VLP -40B -5B DDR400* 200 400 PC3200 3-3-3
SDF = SDRAM FBGA
SDT = SDRAM TSOP SPD = serial presence-detect pin (module only)
*DDR400 nominal voltage is 2.6V
Module Configuration **Data valid window is 150ps greater than -6T
Depth, Width
Blank = Megabits Package Codes
G = Gigabits Lead-
Plated Pb-Free
Module Type* Devices Devices Package Descriptions
Blank = 168-pin/184-pin/240-pin registered DIMM G Y Commercial temp; single- or dual-rank DIMM
A = 168-pin/184-pin/240-pin unbuffered DIMM DG DY Commercial temp; select dual-rank
H = 144-pin/200-pin SODIMM I IY Industrial temp DIMM
PH = 144-pin/200-pin unbuffered SODIMM with PLLs T TY Industrial temp; select dual-rank DIMM
U = 100-pin unbuffered DIMM
*All SDRAM and DDR DIMMs have serial-presence detect.

SDR Modules DDR Modules

Module Allowable Module Allowable
Speed Component Speed t t Speed Component Speed
CL- RCD- RP
-133 -6A, -75, -7E 3-3-3 -335 -6, -6T, -5B
-13E -7E 2-2-2 -40B -5B

Rev. 05-Dec-2018
© 2018 Micron Technology, Inc.
Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are
estimates only.
DDR4 NVDIMM Part Numbering System
The part numbering system is available at www.micron.com/numbering

DDR4 SDRAM Nonvolatile modules

MT A 18 A SF 2G 72 XF 1 Z - 2G9 WP 1 AB
Micron Technology Controller Type (JEDEC compliant)

Product Family Printed Circuit Board Revision

A = DDR4
Design ID Designator (Die Rev.)
Number of DRAM Die
DDR4/DDR3 SDRAM Module Speed
Voltage DRAM Module Component JEDEC Clock Data Module
A = 1.2V Technology Speed Speed Grade/ Component Freq. Rate Module Configuration
Grade Part Mark Speed Grade (MHz) (MT/s) Bandwidth SPD (CL-nRCD-nRP)
Module Options DDR4 -1G6 -125E DDR4-1600 800 1600 PC4-1600 11-11-11
SF = FBGA with temp sensor SDRAM -1G9 -107E DDR4-1866 933 1866 PC4-1866 13-13-13
SS = DDP with temp sensor -1S9 -107H DDR4-1866 933 1866 PC4-1866 14-13-13
SQ = QDP with temp sensor -2G1 -093E DDR4-2133 1067 2133 PC4-2133 15-15-15
SZF = FBGA with temp sensor and heat spreader -2S1 -093H DDR4-2133 1067 2133 PC4-2133 16-15-15
SZS = DDP with temp sensor and heat spreader -2G3 -083 DDR4-2400 1200 2400 PC4-2400 17-17-17
SZQ = QDP with temp sensor and heat spreader -2G4 -083E DDR4-2400 1200 2400 PC4-2400 16-16-16
DZF = VLP (22mm) with temp sensor and heat spreader -2G6 -075 DDR4-2666 1333 2666 PC4-2666 19-19-19
-2G9 -068 DDR4-2933 1467 2933 PC4-2933 21-21-21
Module Configuration -3G2 -062E DDR4-3200 1600 3200 PC4-3200 22-22-22
Depth, Width SPD = serial presence-detect pin (module only)
Blank = Megabits
G = Gigabits Package Codes
Pb-Free
Module Type Devices Package Descriptions
DDR4: PF = 288-pin parity NAND Based NVRDIMM (Save-N, with Pullup Resistor) Z Halogen-free; commercial temp; single-, dual-, quad- or octal-rank DIMM
DDR4: XF = 288-pin parity NAND Based NVRDIMM (Save-N, No Pullup Resister) DZ Halogen-free; commercial temp; select dual-, quad- or octal-rank DIMM
DDR4: LF = 288-pin NAND Based NVLRDIMM IZ Halogen-free; Industrial temp, commercial temp; single-, dual- or quad-rank DIMM
TZ Halogen-free; Industrial temp; select dual- and quad-rank DIMM

Flash Type
          1 = Initial version of module
          2–9  = Subsequent version of module with different Flash memory

Rev. 11-Dec-2018

© 2018 Micron Technology, Inc.

Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are estimates only.