ASSEMBLY

Peelable Solder Masks

For Today’s Challenges
by Sven E. Kramer,
Lackwerke Peters

Compared with the manual appli-

cation of heat-resistant masking
tapes, peelable solder masks offer
significant technical and economic
advantages. They are a considera-
bly less time- and cost-consuming
application than adhesive tapes,
for example, and there are no dif-
ficult-to-remove adhesive residues.
They also offer automatable and
reproducible register-true applica-
tion by screen printing, and even
difficult areas, such as gold-plated Figure 1 – Example of a typical peelable solder mask application
rotary contacts, can be covered and
protected without any problems.
Depending on the ink type they are
also suitable for multiple solder-
ing, reflow soldering and Lead-free
soldering.

When manufacturing printed wir-

ing boards and assemblies, it is
often necessary to cover certain
areas prior to soldering operations Table 1 - Summary of generally recommended screen printing parameters
in order to avoid them being wet-
ted with solder. Such areas may be
Gold contacts, Gold-plated rotary
contacts multipoint connectors,
Carbon conductive touch-key con-
tacts or even larger areas for which
selective soldering and multiple
M A T E R I A L S

soldering is necessary (e.g. mixed

assembly). Table 2 - Basic physical characteristics of a Lead-free soldering compatible
peelable solder mask
This covering can either be carried
out out with heat-resistant tape Requirements Levelling
or by using peelable solder masks • very high temperature stabil-
which are usually applied by screen Economic solder masking is ity when used in reflow solder-
printing to offer a very simple yet only possible with peelable sol- ing/Lead-free soldering
cost-competitive coverage com- der masks. In practice, very high • good peelability before and
pared to tapes. However, the field and even partly contradictory after thermal stress (also out
A C C E S S O R Y

of application and requirements demands are made on peelable of plated-through holes with a
has grown enormously, with the solder masks, e.g.: maximum diameter of 3mm)
latest challenge being compatibil- • high tear resistance
ity with Lead-free soldering proc- • solder resistance (wave sol- • no change in the resistance of
esses and their increased process- dering, reflow soldering) Lead/ Carbon-conductive inks when
ing temperatures. Lead-free covered with peelable solder
• resistance to plating and/or masks
After soldering, the masks are immersion processes (e.g. Gold) • thixotropic adjustment to
peeled off manually. • resistance to vertical Hot-Air achieve high definition and en-

OnBoard Technology November 2006 - page 42 www.Onboard-Technology.com

 ASSEMBLY
able tenting of plated-through ered. For small areas, e. g. con- the blades can be slightly round-
holes tact fingers, tip-contact areas ed, enabling a thicker ink film to
• no discolouration of base ma- and others, 17 T and 18 T (in be achieved. The squeegee angle
terial accordance with new nomencla- should be set to approx. 75 de-
• no corrosion of metallic Cop- ture 12-140 up to 18-250) poly- grees and as low a printing speed
per/storability of coated printed ester fabrics have proven best. as possible observed. To achieve
wiring boards. In order to obtain a thick ink a satisfactory coating thick-
film these fabrics require an ad- ness in one print, if possible the
These requirements cannot be ditional thick screen emulsion. screen fabric must be very well
met by one peelable solder mask For large areas, or if the coating filled before commencing print-
alone. Therefore various ink nearly covers the entire board, ing. If this is not achievable with
types are available for specific it is advisable to use coarse- standard metal pre-squeegees,
fields of application. meshed 12 T polyester fabrics, the use of a rubber squeegee is
in which case an extremely high recommended.
stencil build-up can be dispensed
Processing with. A sufficient screen tension Printing machines
of at least 18 Newton should be
Peelable solder masks are typi- observed. Peelable solder masks can
cally processed while observing be processed manually or in
the following (see Table 1): Screen coating semi- or fully automatic screen
printing machines. In order to
Ink film thickness The thickness of the screen coat- achieve a thick ink coating, the
Basically, all peelable solder ing also has a major influence on squeegee pressure should be
masks need to be applied very the film thickness and definition as low as possible. When tent-
thickly in order to meet all the that can be achieved. A stencil ing plated-through holes the
different kinds of requirements. build-up of approx. 200 - 400 µm squeegee pressure of the print-
Due to their paste-like flow be- is required. Since only coarse- ing machine should be adjusted
haviour and thixotropic adjust- meshed screens are suitable for just enough to avoid pressing
ment this is achieved fairly easy. printing peelable solder masks, the ink through the holes, thus
When coating plain surfaces, i.e. it is obvious that only highly vis- causing soiling of the back of
areas of the printed circuit board cous screen emulsions/thick film the printed circuit board and/
without plated-through holes, stencils can be used. Coating or of the screen printing table.
one should aim for a minimum with standard screen emulsions
coating thickness of between 250 is usually very time-consum- Figure 2 – 500 µm layer of a highly
µm and 300 µm. For the tenting ing and cost-intensive and thus thixotropic screen emulsion / copy
plated-through holes and HAL this procedure is increasingly on layer
applications a minimum coat- the decline. However, with new
ing thickness of between 300 and highly thixotropic copy lay-
µm and 400 µm is required. The ers/emulsions thicknesses of up
general rule is: the higher the to 600 µm can be achieved very
coating thickness, the higher easy and fast.
the reliability.
M A T E R I A L S

Squeegee
The vast majority of peelable
solder mask applications are Practical experience has shown
carried out by screen printing. that rubber squeegee blades with
Some printed wiring board man- a shore-A hardness of 60 - 65 are
ufacturers (or their customers) ideal. If the definition allows,
prefer to apply peelable solder
masks with selective dispensing Table 3 – Typical drying conditions for a peelable solder mask with high
devices, which allow very high thermal resistance (Lead-free compatible) considering various applications
accuracy with regard to regis-
A C C E S S O R Y

ter-true application in the case

of extremely tight printing tol-
erances or clearances.

Screens

Choice of screen fabric depends

on the size of the areas on the
printed circuit board to be cov-

www.Onboard-Technology.com OnBoard Technology November 2006 - page 43

ASSEMBLY
In principle, the higher the tem-
perature chosen within the indi-
cated limits, the more complete
the degree of cross-linking and
the associated tear resistance;
i.e. brief yet high curing tem-
peratures give the best results
when it comes to the later peel-
ing of the solder masks, particu-
larly when they are peeled out of
plated-through holes.
Figure 3 - Example of a test panel coated with peelable solder mask after
exposure to horizontal hot-air-levelling When determining the curing
temperature and/or during proc-
ess control, care should be taken
to make sure that the inks are
not cured too much, since over-
curing leads to embrittlement of
the ink coating and subsequent-
ly to a loss of peelability on ac-
count of the poor elasticity.

In addition, it should be consid-

ered to which thermal stresses
the peelable solder mask is to be
Figure 4 - Model temperature profile for Lead-free reflow soldering (ZVEI) subjected after thermal curing,
such as chip adhesive curing,
reflow soldering or tempering
processes.

Influences of stress applied on

peelable solder masks

Hot-air levelling

Generally, hot-air levelling is a

critical application for any peela-
ble solder mask, due to the fact
that both thermal and mechanical
(i.e. impact of air knives) stress
are applied. This requires both a
M A T E R I A L S

Figure 5 – Peelability testing of a peelable solder mask after reflow very good adhesion (to withstand
soldering according to ZVEI profile (thickness 400 µm, curing 10 min, the air pressure) as well as high
130°C [266°F]) temperature stability.

In practice, push-stroke flooding To make it easier to subsequently An acceptable level of process

with a right-angled, sharp-edged peel off the solder mask, printing safety can only be achieved with
elastomeric squeegee has proven a “pull tab” is also recommended. vertical hot-air levelling equip-
helpful in achieving thick, bub- Where possible, neighbouring ment. Generally, horizontal op-
ble-free ink coatings with good masked areas should be linked by erating hot-air levelling units
definition in only one print. This strips of peelable. This additional cannot be used, because the
A C C E S S O R Y

leads to an optimum filling of the and elementary support does not re- mechanical stress applied by the
screen mesh. Subsequent printing quire much effort and is a welcome rollers at the in- and outlet of
should be effected with as low a and cost-saving service for the user the machines is too high. In case
squeegee pressure as possible, as of the printed circuit boards. of processes using leaded solder
the peelable mask should only be there are a few exceptions which
gently dislodged from the screen Thermal curing surprisingly do work, however,
fabric; if the process conditions al- in case of Lead-free solder the
low, push-stroke flooding should Peelable solder masks dry solely stress applied is definitely too
also be used for printing. through the application of heat. high.

OnBoard Technology November 2006 - page 44 www.Onboard-Technology.com

 ASSEMBLY
Wave soldering required), various products can dependent of curing conditions
be suitable. or thickness, applied standard
During wave soldering a com- materials formulated for leaded
paratively short temperature Reflow soldering solder generally showed insuf-
stress is applied. Therefore it ficient peelablity. Only materials
is usually not necessary to use In terms of thermal stress ap- especially formulated for Lead-
peelable solder masks with the plied to a peelable solder mask, free applications were able to
highest possible thermal resist- reflow soldering is certainly the withstand this process.
ance. Due to other critical fac- most demanding soldering proc-
tors, however (e.g. mechanical ess, especially in case of Lead- Combinations of soldering proc-
stability using turbulent solder free processes. It is not so much esses
waves or a very high definition the applied temperature but the
total duration of thermal stress When several soldering proc-
6 applied to the material. The esses or thermal steps are com-
model reflow soldering temper- bined (e.g. chip adhesive curing
ature profile in Figure 4 (ZVEI plus additional (double) reflow
“Lead-substitution task force”, soldering plus additional wave
Germany) was applied to test soldering) the total amount of
the thermal resistance of vari- thermal stress needs to be con-
ous peelable solder masks. In- sidered. Generally, types with

Table 4 – Peel strength of a peelable solder mask on various substrates

Table 5 – Potential problems related to peelable solder mask processing

M A T E R I A L S

9
A C C E S S O R Y

10

www.Onboard-Technology.com OnBoard Technology November 2006 - page 45

ASSEMBLY
the highest level of thermal re- When considering the use of stances rather than products
sistance should be chosen and peelable solder masks for the containing dyes, which could
curing should be carried out as protection of certain areas of leach.
quickly as possible (and at the a printed wiring board during
lowest possible temperature) to plating or immersion finishes,
ensure complete peelablity. the potential leaching of the Troubleshooting
mask also has to be considered.
Chemical processes The leaching of ink constituents The application and processing of
into the process is of course also peelable solder masks are gener-
When utilising peelable solder potentially critical. Factors to be ally very reliable. If, despite this,
masks in plating or immersion observed in this respect are: mistakes are made, the resultant
finishes, much longer curing costs can of course be unpleas-
times and curing temperature • chemistry of the used baths antly high, since errors are usu-
are required compared to solder- • process parameters (e.g. pH, ally only noticeable on the final
ing operations in order to achieve temperatures, dwell times) printed circuit board. Whenever
a sufficient level of adhesion and • level of acceptable leach- a peelable solder mask shows
thereby exclude the risk of sub- ing (e.g. potential influence on insufficient peelability, it is of-
surface migration. Very impor- bonding, metal turnover). ten because one of the following
tant in view of adhesion is also A higher level of curing leads to mistakes has been made:
the used substrate. The example an improved embedding of lower • the ink coating was applied
of a peelable solder mask in Ta- molecular weight ink constitu- too thinly
ble 4, typically used for chemical ents and therefore reduces the • the curing temperature was
processes, shows the different risk of leaching. Furthermore, too high and/or curing time was
levels of adhesion achieved by peelable solder masks should too long or
various substrates dependent on be used that contain insoluble • an unsuitable ink type was
the curing conditions. pigments as colour-giving sub- used.

Silicone-Free Thermal Interface

Material Introduced
W. L. Gore & Associates has introduced a new W. L. Gore & Associates
capability to the Gore Polarchip Thermal Inter- Hermann-Oberth-Str. 22
face Material family. The Polarchip SF3000 Sili- 85640 Putzbrunn - Germany
cone-Free Thermal Interface Material is a truly Tel. +49 91 44 6010
soft silicone-free thermal gap pad. The absence of Fax +49 89 46122448
silicone eliminates the problems of silicone out- servicefabrics_de@wlgore.com
gassing and silicone oil migration (“bleeding”), www.gore.com
making the gap pad ideal for silicone sensitive ap-
plications.
M A T E R I A L S

This highly compressible, thermally conductive

material is suited for filling the undesirable air
gaps between heat generating devices on PCBs
and the heat sinks, heat spreaders and metal
chassis used to dissipate the heat. The material
is a fluoropolymer composite that consists of an
expanded polytetrafluoroethylene (ePTFE) matrix
filled with boron nitride (BN) particles.
A C C E S S O R Y

The low elastic modulus of the ePTFE matrix

imparts softness, conformability and excellent
compressibility to the composite, while the high
thermal conductivity of the BN particles gives the
composite its good thermal transport characteris-
tics. The reinforcing nature of the ePTFE matrix
results in a composite that is physically robust,
easy to handle and does not require additional re-
inforcement.

OnBoard Technology November 2006 - page 46 www.Onboard-Technology.com

 ASSEMBLY
Wire Tacking System Fastens Jumpers
Without Gluey Mess
Jumper wires or ECOs and surface conductor repair sive. It is simply a case of peeling off the sheet and
are a fact of life in PCB modification and repair. In the pressing into place. They form a highly conformable,
past, technicians used messy quickset glues for at- high strength bond, and can be repositioned during
tachment. In answer to this CircuitMedic now offers and immediately after initial bonding without caus-
Flextac Wire Dots, a wire tacking system consisting of ing adhesive transfer or loss of bond strength.
pre-cut shapes of a thin, flexible polymer film mem-
brane coated on one side with a high performance, Unlike hot melt glues, epoxies, or quick-set cyanoac-
electronics grade permanent pressure sensitive adhe- rylate ‘super’ glues, Flextac Wire Dots apply instantly
to a clean PCB surface with no mess, no curing time,
no bonding to skin or clothes or difficult cleanup.
They also maintain their hold across a wide range of
process and operating temperatures, and will hold se-
curely after exposure to numerous chemicals includ-
ing most flux cleaning solutions/sprays, saponifiers,
“Freon” TF, mild acids and alkalis. Wires attached
with Flextac Wire Dots will hold securely through a
typical PCB hot water wash.

CircuitMedic
45 Research Drive, Haverhill
MA 01832 - USA
Tel. +1 978 3731600
Fax +1 978 3725700
k to us resins (on-board) 27/10/06 15:30 Page 1 mmc@mmc-marketing.com
www.CircuitMedic.com
C M Y CM MY CY CMY K

RESINS CONFORMAL COATINGS CLEANING THERMAL MANAGEMENT CONTACT LUBRICATION MAINTENANCE AND SERVICE AIDS
THE ELECTROLUBE RANGE OF HIGH PERFORMANCE CHEMICALS

www.electrolube.com

TALK TO US ABOUT

RESINS
Electrolube is at the forefront of resin technology, offering a
wide range of high performance polyurethane and epoxy resins
ELECTROLUBE

M A T E R I A L S

to protect and insulate circuits and components from the threats

presented by harsh and challenging environments, such as
moisture, vibration and thermal or physical shock.

• UL approved
• Potting/encapsulating
• Sealing and protection
A C C E S S O R Y

• Cable jointing
• Bespoke and ex-stock
formulations

Electrolube can offer products with UL, MIL and DEF STAN approval.

International Headquarters:
Kingsbury Park, Midland Road, Swadlincote, Derbyshire DE11 0AN United Kingdom
Tel: +44 (0) 1283 222111 E-mail: info@hkw.co.uk
Offices in Europe, South America and Australasia with our own manufacturing plants in both the UK and China.

www.Onboard-Technology.com OnBoard Technology November 2006 - page 47