Architecture of Embedded Systems: Chapter
Architecture of Embedded Systems: Chapter
Architecture of Embedded Systems: Chapter
CHAPTER- 2
ARCHITECTURE OF
EMBEDDED SYSTEMS
.
Contents:
2.1 Elements of Embedded system
2.4: Memory
2.5: Sensors
2.6: Actuators
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Chpt-2: Architecture of Embedded System 2.
Embedded
firmware
Memory (Software)
Communication
interface
Input
port core Output port
sensors
Other
supporting
ICs and
subsystems
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Chpt-2: Architecture of Embedded System 3.
1. System core: This can be a single chip controller consisting of ALU, control
unit, instruction decoder etc. The core connects to every other unit of the
system.
The system core can be a Microprocessor, a Microcontroller, Field
Programmable Gate Array (FPGA), Digital Signal Processor (DSP),
Application Specific Integrated Circuit (ASIC) or Application Specific
Standard Product (ASSP).
3. Memory: Memory is a fixed memory, used to store the program files and
temporary data.
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Chpt-2: Architecture of Embedded System 4.
2.3: Core of Embedded system:
The embedded systems are Domain and Application Specific. They are
built around a central core.
1. General purpose and domain specific processors:
They are:
a. Microprocessor
b. Microcontroller
c. Digital Signal Processor
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I. General purpose and domain specific processors:
i. Microprocessors: Microprocessor is a CPU which does the arithmetic
and logical operations. A CPU consists of ALU, Control unit and
Registers. A microprocessor requires memory, timer, interrupt control
etc. As extra hardware is required, a microprocessor based systems are
bulky.
Microprocessor Microcontroller
1. Standalone. The Ram, Rom 1. Single chip. The Ram, Rom and
and other ICs are separately other units are integrated on a
connected. single chip.
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Chpt-2: Architecture of Embedded System 6.
d. I/O unit: This acts as an interface between the outside world and
DSP to capture inputs and deliver processed signals as output. The
DSP finds application in audio video signal processing by employing
real time calculations, Sum of Product calculations, Fast Fourier
Transform (FFT), Discrete Fourier Transform (DFT) etc.
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Chpt-2: Architecture of Embedded System 7.
ASIC occupies a small area in a total system and hence it is possible
design smaller systems with higher capabilities and more functionality. The
developers of such chips will not reveal the inner circuit detail to the public.
Ex: Chip used in a voice recorder for satellites etc.
v. Programmable logic devices (PLDs):
PLDs provide specific function in an embedded system. Logic
devices can be embedded system. Logic devices can be classified into 2
categories. i.e. fixed and programmable. The circuit in a fixed logic device are
permanent and they perform one function. These circuits which are once
manufactured cannot be reconfigured. Whereas, with programmable logic
devices designers use inexpensive software tools to quickly develop, simulate
and test their designs.
CLPDs and FPGAs:
The 2 major types of programmable logic devices are Field
Programmable Gate Array (FPGA) and Complex Programmable Logic Devices
(CPLDs).
FPGAs offer the highest amount of logic density, more features and
highest performance. An example for FPGA is Xilinx Vertex. FPGAs are used in
data processing and storage, instrumentation, telecommunication and DSP.
CPLDs offer smaller amount of logic up to 10,000 gates. An example for
CPLD is Xilinx Cool Runner which requires less power, inexpensive and useful
for mobile phones and digital organisers.
Advantages of PLD:
a. Offers flexibility.
b. Ready to be shipped.
c. Allows to program.
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Chpt-2: Architecture of Embedded System 8.
2.4: Memory:
Different types of memory used in embedded system applications are:
I. Read Only Memory (ROM):
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The DRAM stores data in the form of charges. They are made of
MOSFET which works as a gate and capacitor which acts as a bit storage unit.
The advantage of DRAM is that since it stores the information as a charge, it gets
leaked off with time and hence it is required to refresh periodically. This refresh
operation is done periodically in millisecond interval.
SRAM DRAM
1. Made of six MOSFTEs. 1. Made of one MOSFET and a
Capacitor.
2.5: Sensors:
The sensors are the transducers which converts the physical quantity
into a corresponding voltage. i.e. whenever a sensor is exposed to
temperature, pressure, light etc, it produces a proportional electrical signal. A
sensor responds to the physical phenomenon.
It’s Role in embedded system:
In an embedded system, any changes in the environment are detected
by the sensors connected to the input
port of an embedded system. The sensor
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Chpt-2: Architecture of Embedded System 11.
captures the variations at the input and takes the necessary action.
For an example, in an ECG machine, the sensors consist of electrode
set, which are placed on the body of the patient to monitor the heart beat
status.
2.6: Actuators:
Actuators are the devices which are capable performing a physical
action. An actuator is a form of transducer device which converts the
electrical signal into physical action.
It’s Role in embedded system:
If an embedded system is designed for only monitoring, then there is
no need to include an actuator in the system. If the embedded system is
designed for controlling purposes, then the embedded system produces
the change in the controlling variable to
do the control using the actuators.
For example, in the case of
Automatic Air Cooler system, the sensors
sense the temperature, then captures
and process to the embedded system’s
processor. This value is compared with
the user’s set value and the cooling speed
is controlled.
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Chpt-2: Architecture of Embedded System 12.
a. Inter Integrated Circuit (I2C): It is a synchronous bidirectional
half duplex (i.e. it is bidirectional but one direction of data
movement at a time), two wire serial interface bus.
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Chpt-2: Architecture of Embedded System 13.
RS485 is the enhanced version of RS232 and it supports multi drop
communication with up to 32 transmitting devices and 32 receiving devices.
b. Universal Serial Bus (USB): USB is a wired high speed serial bus for data
communication. An USB host can support up to 127 connections
.
c. IEEE 1394 (Fire wire): It is a wired isochronous (blocks of data
asynchronously sent) high speed serial Communication bus. This protocol
is popularly known as fire wire.
e. Bluetooth (BT): Bluetooth is a low cost, low power, short range wireless
technology for data and voice communication. Bluetooth operates at 2.4
GHz of the radio frequency spectrum. It supports the data rate of 1 MB/s
and has a range of around 30 feet for data communication.
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Chpt-2: Architecture of Embedded System 14.
2.8: Timing circuits:
1. Reset circuit:
The reset device is required to reset the device if the voltage is below the
operating value. The reset will make the firmware to execute from the reset
vector (normally 0x0000 is the vector address). The reset signal to the
processor can be applied at the power on through an external passive circuit
consisting of a capacitor, resistor and a freewheeling diode.
The reset pulse width can be adjusted by varying the value of R and C.
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Chpt-2: Architecture of Embedded System 15.
3. Real time clock:
An RTC (Real time clock) is a component of embedded system
which keeps track of time. RTC holds information like current time
(in hours, minutes and seconds) in 12 hour or 24 hour format, date,
month, year, day of the week etc. and it supplies the timing
reference to the system. RTC is provided with a battery backup cell
for functioning in the absence of power.
For operating system based embedded devices a timing device
is essential for synchronising the operations of OS kernel. RTC
interrupts the OS kernel so as to the OS kernel can update the
system date and time. The RTC interrupt can be used as an alarm at
predefined intervals.
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Chpt-2: Architecture of Embedded System 16.
5. PCB and Passive components:
Printed Circuit Board (PCB) is the back bone of every embedded system. After
deciding upon the components and the circuit to be used, a schematic design
is to be created and a PCB is fabricated according to the schematic. PCB acts
as a platform for mounting all the necessary components as per the design of
the system.
Also, among the other subsystems, passive electronic components like
resistors, capacitors, PN-diodes are provided on-board.
These components are the co-workers of various chips contained in an
embedded system. The uses of such components are for providing ripple-free
voltage supply, spike suppressing etc.
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