DATA SHEET

Part No. AN30888A

Package Code No. SSOP016-P-0225E

Publication date: December 2010 Ver. AEB 1

AN30888A

Contents
„ Overview ……………………………………………………………………………………………………………. 3
„ Features ……………………………………………………………………………………………………………. 3
„ Applications ……………………………………….……………………………………………………………….. 3
„ Package ……………………………………………………………………………………………………………. 3
„ Type ……………………………………………….………………………………………………………………… 3
„ Application Circuit Example (Block Diagram) ………………………………………………………………….. 4
„ Pin Descriptions ………………………….………………………………………………………………………... 7
„ Absolute Maximum Ratings ……………………………………………………………………………………… 8
„ Operating Supply Voltage Range ……………………………………………………………………………….. 8
„ Allowable Voltage Range …………………………………………………………………………………………. 9
„ Electrical Characteristics …………………………………………………………………………………………. 10
„ Electrical Characteristics (Reference values for design) ……………………………………………………… 11
„ Control Pin Mode Table ………………………………………………………………………………………….. 12
„ Electrical Characteristics Test Procedures …………………………………………………………………….. 13
„ Technical Data …………………………………………………………………………………………………….. 16
y I/O block circuit diagrams and pin function descriptions …………………………………………………….. 16
y Functions and properties descriptions …………………………………………………………………………. 19
y PD ⎯ Ta diagram …………………………………………………………………………………………………. 29
„ Usage Notes ………………………………………………………………………………………………………. 30
y Special attention and precaution in using ……………………………………………………………………… 30

Ver. AEB 2
AN30888A

AN30888A
High Brightness LED Driver IC
„ Overview
AN30888A is a Boost/Buck-Boost/Buck DCDC controller that drives an external power NMOS switch.
It is suitable for driving high brightness LED for LED lighting applications.

„ Features
y Battery operation : 3 V to 20 V
y Output current range : 0 A to a few Amperes depending on rating of external NMOS and mode of operation
y Current mode control architecture
y LED dimming function available by using PWM signal
y 30 mV / 200 mV reference voltage
y Low standby current
y Configurable as either Boost/Buck-Boost/ Buck mode converter
y Built-in various protection circuit : Under voltage lock out
Over voltage protection
Soft start function

„ Applications
y LED lighting module
y LED lantern applications
y White LED backlighting for LCD panel
y White LED flash light driving applications
y General LED back lighting

„ Package
y 16 pin Plastic Shrink Small Outline Package (SSOP Type)

„ Type
y Bi–CMOS IC

Ver. AEB 3
AN30888A

„ Application Circuit Example (Block Diagram)

y Boost Mode

L D
VOUT

2.2 μF

16 VREG
1 μF

VIN 4
BGR VREG

VIN 1.262 V 3.65 V

14 11 SW IPK
ENB EN
UVLO

6 CS ILED
CONTROL VFB

PWM 12 RCS

GNDP
9
R1
5 Reference
VFB_SEL
voltage
8 OVP

R2
1
GND

Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on
the design of mass production set.
y Use external resistor with ±1% accuracy at CS pin.
y Use ceramic type capacitor (Typ. 1 μF, Min. 0.5 μF) at VREG pin.
y Use schottky diode at VOUT.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.

Ver. AEB 4
AN30888A

„ Application Circuit Example (Block Diagram) (continued)

y Buck-Boost Mode

L D
VOUT

2.2 μF

16 VREG
1 μF

VIN 4
BGR VREG
VIN 1.262 V 3.65 V

14 11 SW IPK
ENB EN
UVLO

6 CS ILED
CONTROL VFB
RCS
PWM 12

9 GNDP

5 Reference
VFB_SEL
voltage
R1
8 OVP
R2
1
GND

Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on
the design of mass production set.
y Use external resistor with ±1% accuracy at CS pin.
y Use ceramic type capacitor (Typ. 1 μF, Min. 0.5 μF) at VREG pin.
y Use schottky diode at VOUT.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.

Ver. AEB 5
AN30888A

„ Application Circuit Example (Block Diagram) (continued)

y Buck Mode

16 VREG
1 μF
D 2.2 μF

L
VIN 4
BGR VREG

VIN 1.262 V 3.65 V

14 11 SW
ENB EN
UVLO
IPK
ILED
6 CS
CONTROL VFB
VOUT
RCS
PWM 12

9 GNDP

5 Reference
VFB_SEL
voltage
8 OVP
1
GND

Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on
the design of mass production set.
y Use external resistor with ±1% accuracy at CS pin.
y Use ceramic type capacitor (Typ. 1 μF, Min. 0.5 μF) at VREG pin.
y Use schottky diode at VOUT.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.

Ver. AEB 6
AN30888A

„ Pin Descriptions
Pin No. Pin name Type Description
1 GND Ground Ground
2 N.C. — —
3 N.C. — —
4 VIN Power Supply Power Supply of IC
5 VFB_SEL Input Feedback voltage select
6 CS Input Current Sense
7 N.C. — —
8 OVP Input Over Voltage Protection input pin for Boost mode; Connect to GND for Buck mode
9 GNDP Ground Power Ground
10 N.C. — —
11 SW Output External NMOS Transistor Gate Drive
12 PWM Input PWM Dimming Control
13 N.C. — —
14 ENB Input Standby On/Off Control
15 N.C. — —
16 VREG Output Regulator Output

Ver. AEB 7
AN30888A

„ Absolute Maximum Ratings

Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.

A No. Parameter Symbol Rating Unit Notes

1 Supply voltage VDD 21 V *1
2 GND pin current IGND — A —
3 Power dissipation PD 135 mW *2
4 Operating ambient temperature Topr –25 to +85 °C *3
5 Storage temperature Tstg –55 to +125 °C *3

Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink.
When using this IC, refer to the • PD-Ta diagram in the „ Technical Data standard and design the heat radiation with sufficient margin so that
the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.

„ Operating Supply Voltage Range

Parameter Symbol Range Unit Notes
Supply voltage range VIN 3.0 to 20 V *1
Supply voltage range (Boost Mode/Buck-Boost
VIN1 3.0 to 12 V *1
Mode)
Supply voltage range (Buck Mode) VIN2 3.0 to 20 V *1

Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.

Ver. AEB 8
AN30888A

„ Allowable Voltage Range

Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within
these limit ranges.
y Voltage values, unless otherwise specified, are with respect to GND.
y VIN is voltage for VIN pin.
y Do not apply external currents or voltages to any pin not specifically mentioned.

Pin No. Pin name Rating Unit Note

4 VIN – 0.3 to 20 V *1
5 VFB_SEL – 0.3 to 5.5 V —
6 CS – 0.3 to VREG V *2
8 OVP – 0.3 to VREG V *2
11 SW – 0.3 to VREG V *2
12 PWM – 0.3 to 5.5 V *2
14 ENB – 0.3 to VIN V *1
16 VREG – 0.3 to 4.3 V *2

Notes) *1 :VIN must not exceed 20 V.

*2 :VREG must not exceed 4.3 V.

Ver. AEB 9
AN30888A

„ Electrical Characteristics at VIN = 6 V, ENB = 6 V, PWM = VREG

Note) Ta = 25°C±2°C unless otherwise specified.

B Limits
Parameter Symbol Conditions Unit Notes
No. Min Typ Max
Circuit Current Consumption
1 Standby Current ISTB ENB = 0 V — — 10 μA —
ENB = VIN
2 Operating Quiescent Current ICC — — 1 mA —
No load condition
ENABLE (ENB), VFB_SEL and PWM Control Function
3 ENB High Input Logic VENBH — 3 — VIN V —
4 ENB Low Input Logic VENBL — 0 — 0.3 V —
0.7 ×
5 VFB_SEL High Input Logic VVFBSELH — — 5 V —
VREG
0.3 ×
6 VFB_SEL Low Input Logic VVFBSELL — 0 — V —
VREG
0.7 ×
7 PWM High input Logic VPWMH — — 5 V —
VREG
0.3 ×
8 PWM Low input Logic VPWML — 0 — V —
VREG
Input Pin Current Consumption
9 Enable Pin Current IENB ENB = 6 V — — 25 μA —
Output Driver

SW output High logic; 0.7 × VREG +

10 SW High Output Logic VSWH — V —
MOSFET ON condition VREG 0.2

SW output Low logic;

11 SW Low Output Logic VSWL – 0.2 — 0.2 V —
MOSFET OFF condition

Under Voltage Lock Out (UVLO)

VIN Falling SW OFF;
12 Under Voltage protection on value VUVLOON 1.9 2.1 2.3 V —
VREG = no load
VIN Rising SW ON –
13 Under voltage protection Hysteresis VUVLOHYS VIN Falling SW OFF; 0.1 0.3 0.5 V —
VREG = no load

Ver. AEB 10
AN30888A

„ Electrical Characteristics (Reference values for design) at VIN = 6 V

Note) Ta = 25°C±2°C unless otherwise specified.
The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection.
If a problem does occur related to these characteristics, we will respond in good faith to user concerns.

Reference values
B No. Parameter Symbol Conditions Unit Notes
Min Typ Max
Reference Voltage Control
VFB_SEL = High
14 VFB Reference Voltage 1 VVFB1 OVP = 0 V 196 202 208 mV —
(Buck mode)
VFB_SEL = Low
15 VFB Reference Voltage 2 VVFB2 OVP = 0 V 24 32 40 mV —
(Buck mode)
Over Voltage Protection (Boost Mode Only)
Over Voltage Protection
16 VOVP R1 = 470 kΩ, R2 = 30 kΩ 18 21 24 V —
Threshold
Output Driver
17 Driver Off Time TOFF Fix off time at SW pin 0.5 1 2 μs —
18 Maximum Operating Frequency FMax — — — 1.5 MHz —
Regulator Voltage (VREG)
4 V ≤ VIN ≤ 20 V
19 VREG Output Voltage VREG No Load Condition, 3.45 3.65 3.85 V —
CVREG = 1 μF
Efficiency
VIN = 6 V
1 LED of VF = 3.7 V
20 Efficiency Eff ILED = 400 mA — 90 — % —
VFB_SEL = High
OVP = 0 V (Buck mode)

Ver. AEB 11
AN30888A

„ Control Pin Mode Table

Note) See parameters B No. 3, 4, 5, 6, 7 and 8 in the Electrical Characteristics for control voltage ranges.

Pin voltage
Pin No. Description Remarks
Low High
5 VFB_SEL ON/OFF VFB = 32 mV VFB = 202 mV Feedback voltage selection
12 PWM ON/OFF PWM OFF PWM ON When PWM is not used, the pin is left floating
14 ENB ON/OFF STANDBY OPERATING Standby / Operating mode control

Ver. AEB 12
AN30888A

„ Electrical Characteristics Test Procedures

Input Output Switch

C
Parameter
No. Pin Pin
Conditions Conditions S1 S2 S3 S4 S5 S6
No. No.
Circuit Current Consumption
14 ENB = 0 V
12 PWM = 0 V
5 VFB_SEL = 0 V Standby current
1 Standby Current 4 5 5 5 2 2 1
8 OVP = 0 V consumption
6 CS = 0 V
11 SW = Hi-Z
14 ENB = VIN
12 PWM = 0 V
Operating Quiescent 5 VFB_SEL = 0 V
2 4 Current consumption 2 5 5 2 2 1
Current 8 OVP = 0 V
6 CS = 0 V
11 SW = Hi-Z
ENABLE (ENB), VFB_SEL and PWM Control Function
14 ENB = 0.30 V
12 PWM = Hi-Z
5 VFB_SEL = 3.65 V
3 ENB High Input Logic 16 Output DC voltage 3 1 2 2 2 1
8 OVP = 0 V
6 CS = 0 V
11 SW = Hi-Z
14 ENB = 3.0 V
12 PWM = Hi-Z
5 VFB_SEL = 3.65 V
4 ENB Low Input Logic 16 Output DC voltage 4 1 2 2 2 1
8 OVP = 0 V
6 CS = 0 V
11 SW = Hi-Z
14 ENB = VIN
12 PWM = Hi-Z
VFB_SEL High Input 5 VFB_SEL = 0.70× VREG Output DC voltage /
5 11 2 1 3 2 3 1
Logic 8 OVP = 0 V 1 MHz
6 CS = 100 mV
11 SW = Hi-Z
14 ENB = VIN
12 PWM = Hi-Z
VFB_SEL Low Input 5 VFB_SEL = 0.30 × VREG Output DC voltage /
6 11 2 1 4 2 3 1
Logic 8 OVP = 0 V 1 MHz
6 CS = 100 mV
11 SW = Hi-Z
14 ENB = VIN
12 PWM = 0.70 × VREG
5 VFB_SEL = 3.65 V Output DC voltage /
7 PWM High input Logic 11 2 3 2 2 2 1
8 OVP = 0 V 1 MHz
6 CS = 0 V
11 SW = Hi-Z

Ver. AEB 13
AN30888A

„ Electrical Characteristics Test Procedures (continued)

Input Output Switch

C
Parameter
No. Pin Pin
Conditions Conditions S1 S2 S3 S4 S5 S6
No. No.
14 ENB = VIN
12 PWM = 0.30 × VREG
5 VFB_SEL = 3.65 V Output DC voltage /
8 PWM Low input Logic 11 2 4 2 2 2 1
8 OVP = 0 V 1 MHz
6 CS = 0 V
11 SW = Hi-Z
Input Pin Current Consumption
14 ENB = VIN
12 PWM = Hi-Z
5 VFB_SEL = 0 V
9 Enable Pin Current 14 Current Consumption 2 1 5 2 2 1
8 OVP = 0 V
6 CS = 0 V
11 SW = Hi-Z
Output Driver
14 ENB = VIN
12 PWM = 3.65 V
5 VFB_SEL = 3.65 V Output DC voltage /
10 SW High Output Logic 11 2 2 2 2 2 2
8 OVP = 0 V 1 MHz
6 CS = 0 V
11 SW = 0 A
14 ENB = VIN
12 PWM = 0 V
5 VFB_SEL = 3.65 V Output DC voltage /
11 SW Low Output Logic 11 2 5 2 2 2 2
8 OVP = 0 V 1 MHz
6 CS = 0 V
11 SW = 0 A

Ver. AEB 14
AN30888A

„ Electrical Characteristics Test Procedures (continued)

Input Output Switch

C
Parameter
No. Pin Pin
Conditions Conditions S1 S2 S3 S4 S5 S6
No. No.
Under voltage Lock Out (UVLO)
14 ENB = VIN
12 PWM = Hi-Z
Under voltage protection 5 VFB_SEL = 3.65 V Output DC voltage /
12 11 2 1 2 2 2 1
on value 8 OVP = 0 V 1 MHz
6 CS = 0 V
11 SW = Hi-Z
14 ENB = VIN
12 PWM = Hi-Z
Under voltage protection 5 VFB_SEL = 3.65 V Output DC voltage /
13 11 2 1 2 2 2 1
Hysteresis 8 OVP = 0 V 1 MHz
6 CS = 0 V
11 SW = Hi-Z

Ver. AEB 15
AN30888A

„ Technical Data
y I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Waveform and
Pin No. Internal circuit Impedance Description
voltage

1 GND — — Signal Ground

2 — — — No connection

3 — — — No connection

VIN
DC
4 — Z : Low
(3 V to 20 V)
Power Supply of IC

VREG
16

VFB_SEL VFB_SEL
DC 200
5 5 Z : Hi-Z
(0 V to 5 V)
Feedback voltage select pin

VREG
16

CS
DC
6 CS Z : Hi-Z
(0 V to 250 mV) 500
6 Current Sense Pin

Ver. AEB 16
AN30888A

„ Technical Data (continued)

y I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Waveform and
Pin No. Internal circuit Impedance Description
voltage

7 — — — No connection

VREG
16

OVP
OVP 1k
8
DC Over Voltage Protection input
8 Z : Hi-Z
(0 V to 1.26 V) pin for Boost and Buck-Boost
1k mode
Connect to GND for Buck
mode

9 GNDP — — Power Ground

10 — — — No connection

VREG
16

SW SW
Pulse 11
11 Z : Hi-Z
(0 V to 3.65 V) External NMOS Transistor
Gate Driving Pulse

VREG VREG

167k
PWM
Pulse PWM
3k
12 12
Z : 170 kΩ
(0 V to 5 V)
PWM Dimming Control

Ver. AEB 17
AN30888A

„ Technical Data (continued)

y I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Waveform and
Pin No. Internal circuit Impedance Description
voltage

13 — — — No connection

ENB
14
2k
DC ENB
200k
14 (3 V to 20 V) Z : 402 kΩ
Standby On/Off Control Pin
2k
200k 20k

15 — — — No connection

VIN
4

VREG
DC
16 Z : Hi-Z
(Typ. 3.65 V)
Regulator Output Pin

VREG 550
16
550
550

Ver. AEB 18
AN30888A
(V =
−
*)Nout
VIN
F
LEDs

„ Technical Data (continued) -

=
−
Vout
)*(N
VIN
VFLEDs

y Functions and properties descriptions

(1) Overview

AN30888A is a constant current LED driver. The IC works as a Boost /Buck-Boost/ Buck mode DCDC controller with external
MOSFET.
Operating input voltages ranges from 3 V to 20 V. The mode of operation depends on the number of LEDs to be driven and the supply
voltage level.

In general, please adhere to the following:

If total LED voltage drop is more than supply voltage, boost mode is adopted. If LED voltage drop is less than the supply voltage, buck
mode is adopted . If supply voltage is close to the total LED voltage drop, the Buck-Boost mode can be used. Please note that the
different mode of operation should be manually configured.

Output LED current can be designed ranges from 0 A and to a few amperes depending on the mode of operation, the external MOSFET
characteristic and feasible RCS value used. The control architecture uses current mode fix off time control. The VFB reference voltage
determines LED current by setting VFB_SEL pin with values of 32 mV or 202 mV under buck mode. By applying VFB voltage of 32
mV, user can achieve higher efficiency with lower power dissipation in RCS resistor. Applying 202 mV VFB voltage achieves better LED
current accuracy.

(2) Standby enable function

AN30888A enters standby mode when ENB pin is pulled low. During standby, the IC draws a small current of value less than 10 μA
from the power supply. This helps to achieve longer battery usage time. During Boost mode operation, although external MOSFET
cannot be turned on at standby condition, there is still a DC current path between the input and the LEDs through the inductor and
schottky diode. Thus it is important to make sure that during boost mode, the minimum forward voltage of the LED array must exceed
the maximum input voltage to ensure the LEDs remain off during standby mode.

Ver. AEB 19
AN30888A
(V =
−
*)Nout
VIN
F
LEDs

„ Technical Data (continued) -

=
−
Vout
)*(N
VIN
VFLEDs

y Functions and properties descriptions (continued)

(3) Internal regulator

An internal 3.65 V regulator is used as the power supply for internal core circuit of this IC.
This regulated voltage, VREG will be provided when VIN is approximately in the range of 4 V to 20V. For VIN lower than 4 V, regulator
will act as a VIN voltage follower, with output voltage close to VIN. The amount of drop voltage from VIN during VIN follower mode
depends on load current of the regulator and also tolerance of the IC. In general, the regulator output voltage will be approximately 0.3 V
lower than VIN during this mode of operation.
This regulator requires a capacitor of 1 μF to be connected to VREG pin. This capacitor helps to provide a stable regulated voltage to the
IC. The regulator has a current ability of approximately 15 mA. However, it is not designed to provide as external power supply voltage.
Hence an external load exceeding approximately 0.5 mA to the VREG pin is not allowed.

(4) Output setting consideration

The output voltage, VOUT is set using the following equations for both boost and buck mode:
VOUT = (VF × NLEDs + VD) ……………………………………………… Eq[1] (Boost mode)

VOUT = (VIN – VF × NLEDs) ……………………………………………… Eq[2] (Buck mode)

VOUT = (VF × NLEDs + VD+VIN) ………………………………………… Eq[3] (Buck-Boost mode)

VIN : Battery or Input power supply voltage
VF : LED forward drop voltage
NLEDs : Number of LEDs stacked in series
VD : Schottky diode forward drop voltage

For Boost mode or Buck-Boost mode operation, VOUT setting should be lesser than Drain–Source breakdown voltage of external
MOSFET as mention in (11). Also VOUT should be lesser than OVP protection threshold as mentioned in (9).

For Buck mode operation, VOUT setting should give sufficient voltage for external MOSFET to operate properly at the required output
current setting.

Ver. AEB 20
AN30888A

„ Technical Data (continued)

y Functions and properties descriptions (continued)

(5) Feedback voltage VFB at CS pin

The VFB voltage is generated internally in the IC and output at CS pin. This voltage allows users to fix the input peak current, IPK as well
as the LED output current, ILED. This voltage will change according to the setting at VFB_SEL pin.

For operation in boost mode/buck-boost mode, VFB will be inversely proportionally to supply voltage, VIN. When input supply voltage
decreases, VFB will increase. This ensure LED current remain accurate as supply voltage decreases.
When operating in buck mode, VFB voltage will remain at 202 mV or 32 mV depending on whether VFB_SEL pin is high or low.

The following are some figures of VFB voltage with respect to VIN. For detail information, please refer to graph and data table
information as the following.

For Boost mode and Buck-Boost mode :

VFB = 116 mV (When VFB_SEL = High ; VIN = 6 V)
VFB = 50 mV (When VFB_SEL = Low ; VIN = 6 V)
VFB = 198.3 mV (When VFB_SEL = High ; VIN = 3 V)
VFB = 88 mV (When VFB_SEL = Low ; VIN = 3 V)

For Buck mode :

VFB = 202 mV (When VFB_SEL = High, for all VIN level)
VFB = 32 mV (When VFB_SEL = Low, for all VIN level)

To improve overall efficiency VFB voltage can be set lower by switching VFB_SEL = Low. On the other hand accuracy can be improved
by using VFB_SEL = High mode.

Ver. AEB 21
AN30888A

„ Technical Data (continued)

y Functions and properties descriptions (continued)

(5) Feedback voltage VFB at CS pin (continued)

Boost mode/
BOOST MODE: VCS Voltage vs VIN Buck mode
Buck-Boost mode
220.0 VIN (V) VFB_SEL VFB_SEL VFB_SEL VFB_SEL
200.0 = High = Low = High = Low
180.0
160.0 VFB (mV) VFB (mV) VFB (mV) VFB (mV)
140.0
3 198.3 88.0 202 32
VCS(mV)

120.0 VFB_SEL="H"
100.0 VFB_SEL="L" 4 161.0 71.0 202 32
80.0
60.0
5 132.3 57.7 202 32
40.0 6 116.0 50.0 202 32
20.0
0.0 7 98.3 43.0 202 32
3 5 7 9 11
8 86.3 38.0 202 32
VIN(V)
9 77.3 34.0 202 32
BUCK MODE: VCS Voltage vs VIN 10 70.0 31.0 202 32
11 64.0 28.3 202 32
220.0
200.0 12 59.0 26.3 202 32
180.0
160.0 13 N.A N.A 202 32
140.0
14 N.A N.A 202 32
VCS(mV)

120.0 VFB_SEL="H"
100.0 VFB_SEL="L" 15 N.A N.A 202 32
80.0
60.0
40.0
20.0
0.0
3 5 7 9 11 13 15
VIN(V)

Ver. AEB 22
AN30888A
=
PKFB
2
*
-L
Eq[7]
IV
R
CS

„ Technical Data (continued) =

IR
-PK
CS

y Functions and properties descriptions (continued)

(6) Inductor selection

Inductor value, L is set by the required inductor ripple current desired.

The general trend for lower inductor value is a smaller inductor physical size, but a larger input ripple current. Similarly, an increase in
inductor value will decease input ripple current.
Users are advice to choose an inductor that can handle the peak current IPK, flowing across it without saturating. In addition, inductor
with lower series resistance are preferred to provide better operating efficiency.

The following equation gives a general guideline in selection inductor value based on 30% peak to peak ripple current across the
inductor.
(VOUT – VIN) × TOFF
L = ————————————— ……………………… Eq[4] (Boost mode，Buck-Boost mode)
0.3 × IIN

(VIN – VOUT) × TOFF

L = ————————————— ……………………… Eq[5] (Buck mode)
0.3 × ILED
VOUT = Output voltage
VIN = Input supply voltage
TOFF = Fixed off time design at 1 μs
ILED = LED output current
IINは，IIN is input current from supply voltage

Please note that the 0.3 factor can be altered if 30% peak to peak current is changed.
i.e, if percentage of peak to peak current needed is 40%, this factor will be 0.4.

Ver. AEB 23
AN30888A
=
*2PFB
-L
Eq[7]
IV
CS
R K

„ Technical Data (continued) -PK

=
IR
CS

y Functions and properties descriptions (continued)

(7) Setting output LED current and choosing current sense resistor RCS

The LED current in this IC can be set easily by selecting the appropriate RCS resistor to be used at CS pin of this chip.

For Boost Mode and Buck-Boost mode :

RCS resistor can be set in the following way :
First is to calculate input current IIN at the required operating condition :

IIN = (VOUT + VD) × (ILED / VIN) …………………………… Eq[6] (Boost mode，Buck-Boost mode)

VOUT = Output voltage

VD = Schottky diode forward drop voltage
ILED = Required LED current
VIN = Input supply voltage

After which the peak input current, IPK can be determine by adding IIN with half the peak to peak ripple current at the inductor.
(VOUT – VIN) × TOFF
IPK = IIN + ——————————— …………………… Eq[7] (Boost mode，Buck-Boost mode)
2L
TOFF = TOFF is fixed off time = 1 μs
L = Inductor value found in part (6) inductor selection
VOUT = Output voltage
VIN = Input supply voltage
IIN = IIN is input current found in Eq[6]

Lastly, RCS resistor can be determine by using :

VFB
RCS = ——— ……………………………………………… Eq[8] (Boost mode，Buck-Boost mode)
IPK
VFB is voltage at CS pin. Refer to data graphs for the VFB voltage at different input voltage condition.
IPK is peak current found in Eq[7]

Using numeric example of operating condition :

VIN = 6 V, VOUT = 10 V, ILED = 500 mA, TOFF = 1 μs, L = 16 μH, VD = 0.4 V, VFB = 0.1 V@VIN = 6 V

From Eq[6] : IIN = (10 + 0.4) × (0.5 / 6) = 0.8667 A

(10 – 6) × 1μ
From Eq[7] : IPK = 0.8667 + ——————— = 0.9971 A
2 × 16μ
0.1
From Eq[8] : RCS = ———— = 100.8 mΩ
0.9917

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„ Technical Data (continued)

y Functions and properties descriptions (continued)

(7) Setting output LED current and choosing current sense resistor RCS (continued)

For Buck Mode :

RCS resistor can be set in the following way :
First is to calculate the peak current IPK using Eq[9]. During buck mode, peak current sense correspond to the average output LED
current plus half of actual current ripple through the inductor.
(VIN – VOUT) × TOFF
IPK = ILED + ——————————— …………………… Eq[9] (Buck mode)
2L
VOUT = Output voltage
VIN = Input supply voltage
TOFF = TOFF = Fixed off time design at 1 μs
ILED = LED output current
L = Inductor value found in part (6) inductor selection

Lastly, RCS resistor can be determine by using :

VFB
RCS = ——— ……………………………………………… Eq[10] (Buck mode)
IPK
VFB is voltage at CS pin. Refer to data graphs for the VFB voltage at different input voltage condition.
IPK is peak current found in Eq[9] .

Using numeric example of operating condition :

VIN = 12 V, VOUT = 2 V, ILED = 500 mA, TOFF = 1 μs, L = 66 μH, VFB = 0.2 V
(12 – 2) × 1μ
From Eq[9] : IPK = 0.5 + —————— = 0.575 A
2 × 66μ
0.2
From Eq[10] : RCS = ———— = 348 mΩ
0.575

Please note that for component deviation such as inductor, diodes, etc, these deviation can cause the designed IPK to be higher or lower
than the calculated value.
Users may need to fine tune the value of RCS from the calculated values in order to obtain accurate ILED measurement.
Please take note of total impedance including parasitic impedance of PCB trace at CS pin to ground when designing the required RCS
value. This is especially important if the designed ILED is high as RCS value will be small and in turn making parasitic impedance
significant to the total impedance seen at CS pin

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„ Technical Data (continued)

y Functions and properties descriptions (continued)

(8) Soft start

Soft start circuit is incorporated into this IC to avoid high in-rush current during start-up.
After the device is enabled (ENB = High), the output inductor current and output voltage will rise slowly from initial condition. This
slow start-up time ensure smooth start-up as well as minimize in-rush current.

(9) Over Voltage Protection (OVP)

When operating in Boost mode or Buck-Boost mode, over voltage protection is needed to prevent damages to IC or external component
damages in cases of open LED condition.
OVP switches off external power MOSFET to prevent output from rising over a designed OVP voltage. Output voltage should be
limited to the rating of external component used. (for example Drain Source voltage rating of the external MOSFET or the output
capacitor)
OVP compares the internal reference voltage of 1.26 V with output voltage through resistor network.

OVP threshold is set using the following equation:

1.262 V × (R1 ＋R2)
VOVP = —————————— …………………… Eq[11] (Boost mode，Buck-Boost mode)
R2
If R1 = 470 kΩ, R2 = 30 kΩ, OVP threshold will be designed at around 21 V.
When OVP is triggered, output voltage will be clamped at this threshold voltage (with hysteresis of around 1 V to 2 V) until the fault
(e.g open LED condition) has been removed.

When operating in buck mode, the OVP pin must be short to ground to disable this function as OVP function is not necessary in this
mode.

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„ Technical Data (continued)

y Functions and properties descriptions (continued)

(10) Under Voltage Lock Out (UVLO)

Under Voltage lock out prevents IC from operation at supply voltage lower than 2.1 V.
This function prevent IC from abnormal operation when supply voltage VIN drops below our recommended input range. When input
voltage is lower than this lock out value of 2.1 V, external MOSFET will be switched off. When input voltage rises to 2.4 V or more,
device operation starts again. This means a hysteresis voltage of about 0.3 V.

(11) Power MOSFET consideration

When selecting the power MOSFET, it is important to consider parameters such as gate-source, drain-source breakdown voltage, total
gate capacitance, ON resistance and the drain current rating.
When power is turned on for IC operating in boost mode, output voltage needed to drive LED will be reflected to Drain-Source voltage
of the power MOSFET. Thus it is recommended to select a MOSFET that can handle this output voltage. Alternatively, output and
Drain-Source voltage can be protected and clamped by OVP circuit as mentioned in point (9).
Gate capacitance of the MOSFET chosen should ideally to be smaller than 3 nF.

(12) PWM operation

PWM signal can be generated externally and input into PWM pin of this IC. This PWM signal will turn on and off the output driver,
giving an average output LED current that is proportional to the duty cycle of the PWM signal.

ILED(avg.) = ILED × Duty……………………………………… Eq[12] (Boost / Buck-Boost / Buck mode)

ILED(avg.) = The average output LED current after PWM is input

ILED = The nominal LED current set in part (7)
Duty = The ratio of on pulse time compared to total period time of the PWM signal.

A PWM frequency of 1 kHz or lower is recommended to minimize error due to rise and fall time of the converter output.

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„ Technical Data (continued)

y Functions and properties descriptions (continued)

(13) Maximum duty operation

Maximum Duty limitation is needed when operating in Boost or Buck- Boost mode. This prevents the output voltage from having
abnormal operation. For Buck mode, there is no need for maximum duty limit as SW pin is able to switch to 100% duty.
Please refer to the graph below for maximum duty vs VIN data for Boost and Buck-Boost mode operation.

Boost/Buck-boost mode
VIN (V) Duty Limit (%)
3.0 88.73
3.5 87.09
4.0 85.27
4.5 83.58
5.0 81.99
5.5 79.79
6.0 78.40
6.5 77.38
7.0 76.25
7.5 75.19
8.0 73.92
8.5 72.89
9.0 71.78
9.5 70.83
10.0 69.91
10.5 68.90
11.0 67.97
11.5 67.09
12.0 66.33

(14) Minimum duty operation

Parasitic circuit capacitance, inductance and external MOSFET gate drive current can create spike in the current sense, CS pin voltage at
the point when external MOSFET is switched on. In order to prevent this spike to terminate the ON time prematurely, an internal filter
of time constant, 100 ns is designed in chip. This time constant of 100 ns translates to a minimum duty of around 9% for all modes of
operation. To further reduce the spike in the CS voltage especially when operating in low ILED condition (example: RCS is more than 0.8
Ω or more), external RC filter can be used in between VFB node to CS pin which act as a low pass filter to filter spike noise from
entering CS pin. This RC filter time constant should be long enough to reduce the parasitic spike without significantly affecting the
shape of CS voltage.
The recommended RC value range from : R = 10 Ω to 1 kΩ and C = 100 pF to 500 pF depending on mode of operation and spike level.

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„ Technical Data (continued)

y PD ⎯ Ta diagram

Ver. AEB 29
AN30888A

„ Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment [LED Lighting Devices].
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book
for any special application.

2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.

3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.

4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-
bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.

5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-
VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.

6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

7. When using the LSI for new models, verify the safety including the long-term reliability for each product.

8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.

Ver. AEB 30
 Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20100202
 Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20100202