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    Course Name Ic Fabrication Course Description

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    Jeff Layco
    This course deals with the concepts involved in the fabrication and manufacturing of integrated circuits. It covers semiconductor principles, historical trends in IC manufacturing, microchip fabrication processes, and different IC packaging technologies. The course objectives are to provide an understanding of the semiconductor industry and how devices are designed and manufactured. Specific topics include semiconductor atomic structure, the planar fabrication process from crystal growth to wafer testing, and the latest IC technologies.

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    Course Name Ic Fabrication Course Description

    Uploaded by

    Jeff Layco
    82 views2 pages
    This course deals with the concepts involved in the fabrication and manufacturing of integrated circuits. It covers semiconductor principles, historical trends in IC manufacturing, microchip fabrication processes, and different IC packaging technologies. The course objectives are to provide an understanding of the semiconductor industry and how devices are designed and manufactured. Specific topics include semiconductor atomic structure, the planar fabrication process from crystal growth to wafer testing, and the latest IC technologies.

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    IC FABRICATION

    Original Title

    IC FABRICATION

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    This course deals with the concepts involved in the fabrication and manufacturing of integrated circuits. It covers semiconductor principles, historical trends in IC manufacturing, microchip fabrication processes, and different IC packaging technologies. The course objectives are to provide an understanding of the semiconductor industry and how devices are designed and manufactured. Specific topics include semiconductor atomic structure, the planar fabrication process from crystal growth to wafer testing, and the latest IC technologies.

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Download as docx, pdf, or txt
    82 views2 pages

    Course Name Ic Fabrication Course Description

    Uploaded by

    Jeff Layco
    This course deals with the concepts involved in the fabrication and manufacturing of integrated circuits. It covers semiconductor principles, historical trends in IC manufacturing, microchip fabrication processes, and different IC packaging technologies. The course objectives are to provide an understanding of the semiconductor industry and how devices are designed and manufactured. Specific topics include semiconductor atomic structure, the planar fabrication process from crystal growth to wafer testing, and the latest IC technologies.

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    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
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    Course Name IC FABRICATION

    This elective course deals with the concepts involved in the fabrication and
    Course Description manufacturing of discrete semiconductor device and integrated circuits (IC) toward
    analog and digital logic applications. It starts with semiconductor principles,
    historical account and trending on integrated circuit manufacturing, microchip
    fabrication processes and IC packaging. Also included are different IC packages of
    digital logic families such as TTL, I2L, ECL and the recent CMOS, NMOS and PMOS
    technologies and analog devices.
    Number of Contact Hours 3 units lecture
    per week
    Number of Contact Hours 3 hours lecture
    per Week
    Prerequisite Electronics Devices and Circuits
    Course Objectives After completing this course, the student must be able to:
    1. General:
    This course will give the student knowledge of the nature of work in the
    semiconductor industry and how semiconductor devices are designed and
    manufactured.

    Specific:
    1. Differentiate semiconductor with conductor and insulator by its atomic
    structure, quantum number and energy level.
    2. Differentiate extrinsic from intrinsic semiconductors.
    3. Relate Moore’s Law on trending in IC manufacturing.
    4. Integrate factors such as cost and power consumption on IC manufacturing
    5. Explain how planar process is done on microchip fabrication from crystal
    growth to wafer test and evaluation.
    6. Identify the latest technologies involve in IC fabrication for different IC
    packages.
    1. Principles of Semiconductor
    1.1 Atomic Structure
    1.2 Semiconductor, Conductor, Insulator
    Course Outline 1.3 Energy Level. Quantum Numbers
    1.4 Extrinsic and Intrinsic Semiconductor
    1.5 Structure of Crystal
    1.6 Crystal Defects
    1.7 Miller Indices
    2. Intro to IC Manufacturing
    2.1 Evolution of Semiconductor Manufacturing
    2.2 Moore’s Law
    2.3 Issues on Power Consumption
    2.4 IC Cost
    3. Microchip Fabrication Process: Planar Process
    3.1 Crystal Growth and Wafer Preparation
    3.2 Oxidation: Grove & Deals Model for Oxidation
    3.3 Photolithography/Photo masking
    3.4 Doping: Diffusion and Ion Implantation
    3.5 Chemical Vapor Deposition
    3.6 Physical Vapor Deposition: Evaporation and Sputtering
    3.7 Metallization
    3.8 Wafer Test and Evaluation/ Contamination Control
    4. IC Packaging
    a. IC Packages
    b. Digital Logic Families
    c. NMOS and PMOS Technologies
    d. Analog MOS Devices
    e. Memories
    Laboratory Equipment None

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