db85fl Techprodspec03

Intel® Desktop Board
DB85FL
Technical Product Specification
October 2013
Part Number: G89973-003
The Intel Desktop Board DB85FL may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DB85FL Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board DB85FL Technical Product May 2013
Specification
-002 Specification Clarification July 2013
-003 Specification Clarification October 2013
This product specification applies to only the standard Intel® Desktop Board with BIOS identifier
FLB8510H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,

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GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel® desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright  2013, Intel Corporation. All rights reserved.
Board Identification Information
Basic Desktop Board DB85FL Identification Information
AA Revision BIOS Revision Notes
G89861 FLB8510H.86A 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The B85 chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers

Intel B85 Express Chipset C1 SR13C
Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel® Desktop Board DH8FL.
Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications
July 2013 Spec Clarification • Deleted references to ENERGY STAR
• Deleted the Note in Section 3.9.3 Power Button Menu regarding
Fast Boot
October 2013 Spec Clarification Updated Section 1.3.1.2 to correct the maximum supported
resolution for DVI-I
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://www.intel.com/content/www/us/en/motherboards/desktop-
motherboards/motherboards.html?wapkw=desktop+boards for the latest
documentation.
iii
Intel Desktop Board DB85FL Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel® Desktop
Board DB85FL.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DB85FL and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on Intel Desktop Board DB85FL
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and Power-On Self-Test
(POST) codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Board Identification Information ..................................................................iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Processor Graphics Subsystem ................................................ 17
1.4 System Memory ............................................................................... 20
1.4.1 Memory Configurations .......................................................... 21
1.5 Intel® B85 Express Chipset ................................................................ 23
1.5.1 Direct Media Interface (DMI) .................................................. 23
1.5.2 USB ..................................................................................... 23
1.5.3 SATA Interfaces .................................................................... 24
1.6 Real-Time Clock Subsystem ............................................................... 24
1.7 Super I/O Controller ......................................................................... 25
1.8 Audio Subsystem .............................................................................. 25
1.8.1 Audio Subsystem Software ..................................................... 25
1.8.2 Audio Subsystem Components ................................................ 26
1.9 LAN Subsystem ................................................................................ 27
1.9.1 Intel® I217V Gigabit Ethernet Controller................................... 27
1.9.2 LAN Subsystem Software ....................................................... 28
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.10 Hardware Management Subsystem ..................................................... 29
1.10.1 Hardware Monitoring ............................................................. 29
1.10.2 Fan Monitoring ...................................................................... 29
1.10.3 Chassis Intrusion and Detection .............................................. 29
1.10.4 Thermal Monitoring ............................................................... 30
1.11 Intel® Security and Manageability Technologies .................................... 31
1.11.5 Intel® Management Engine (Intel® ME) Software and Drivers ...... 32
1.12 Power Management .......................................................................... 33
1.12.1 Software Support (ACPI) ........................................................ 33
1.12.2 Hardware Support ................................................................. 35
vii
2 Technical Reference
2.1 Memory Resources ........................................................................... 39
2.1.1 Addressable Memory.............................................................. 39
2.2 Connectors and Headers .................................................................... 40
2.2.1 Back Panel Connectors ........................................................... 41
2.2.2 Component-side Connectors and Headers................................. 42
2.3 BIOS Security Jumper ....................................................................... 51
2.4 Mechanical Considerations ................................................................. 53
2.4.1 Form Factor .......................................................................... 53
2.5 Electrical Considerations .................................................................... 54
2.5.1 Power Supply Considerations .................................................. 54
2.5.2 Fan Header Current Capability ................................................ 55
2.5.3 Add-in Board Considerations ................................................... 55
2.6 Thermal Considerations ..................................................................... 55
2.7 Reliability ........................................................................................ 58
2.8 Environmental .................................................................................. 58
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 59
3.2 BIOS Flash Memory Organization ........................................................ 60
3.3 Resource Configuration ..................................................................... 61
3.3.1 PCI Express Autoconfiguration ................................................ 61
3.4 System Management BIOS (SMBIOS) ................................................. 61
3.5 Legacy USB Support ......................................................................... 61
3.6 BIOS Updates .................................................................................. 62
3.6.1 Language Support ................................................................. 62
3.6.2 Custom Splash Screen ........................................................... 63
3.7 BIOS Recovery ................................................................................. 63
3.8 Boot Options .................................................................................... 64
3.8.1 Optical Drive Boot ................................................................. 64
3.8.2 Network Boot........................................................................ 64
3.8.3 Booting Without Attached Devices ........................................... 64
3.8.4 Changing the Default Boot Device During POST......................... 64
3.9 Adjusting Boot Speed ........................................................................ 65
3.9.1 Peripheral Selection and Configuration ..................................... 65
3.9.2 BIOS Boot Optimizations ........................................................ 65
3.9.3 Power Button Menu ............................................................... 66
3.10 Hard Disk Drive Password Security Feature .......................................... 66
3.11 BIOS Security Features ..................................................................... 67
3.12 BIOS Performance Features ............................................................... 68
4 BIOS Error Codes and Messages
4.1 BIOS Error Codes ............................................................................. 69
4.1.1 BIOS Beep Codes .................................................................. 69
4.1.2 Front-panel Power LED Blink Codes ......................................... 70
4.2 BIOS Error Messages ........................................................................ 70
viii
Contents
5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 71
5.1.1 Safety Standards................................................................... 71
5.1.2 European Union Declaration of Conformity Statement ................ 72
5.1.3 Product Ecology Statements ................................................... 73
5.1.4 China RoHS .......................................................................... 74
5.1.5 EMC Regulations ................................................................... 75
5.1.6 e-Standby and ErP Compliance ............................................... 77
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 78
5.2 Battery Disposal Information.............................................................. 79
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and DIMM Configuration............................................ 22
4. Back Panel Audio Connectors ............................................................. 26
5. LAN Connector LED Locations ............................................................. 28
6. Thermal Sensors and Fan Headers ...................................................... 30
7. Location of the Enhanced Standby Power LED ...................................... 38
8. Back Panel Connectors ...................................................................... 41
9. Component-side Connectors and Headers ............................................ 42
10. Connection Diagram for Front Panel Connector ..................................... 48
11. Connection Diagram for the Front Panel Dual-Port USB 2.0 Connectors ... 50
12. Connection Diagram for the Front Panel USB 3.0 Connector ................... 50
13. Location of the Jumper ...................................................................... 51
14. Board Dimensions ............................................................................. 53
15. Localized High Temperature Zones ..................................................... 56
16. Intel Visual BIOS Screen ................................................................... 59
17. Intel Desktop Board DB85FL China RoHS Material Self Declaration Table . 74
Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. DVI Port Status Conditions................................................................. 17
4. HDMI Port Status Conditions .............................................................. 18
5. Supported Memory Configurations ...................................................... 20
6. Audio Jack Support ........................................................................... 25
7. LAN Connector LED States ................................................................. 29
8. Effects of Pressing the Power Switch ................................................... 33
9. Power States and Targeted System Power ........................................... 34
10. Wake-up Devices and Events ............................................................. 34
11. Component-side Connectors and Headers Shown in Figure 9.................. 43
12. Front Panel Audio Connector for Intel HD Audio .................................... 44
13. Front Panel Audio Connector for AC ’97 Audio ...................................... 44
ix
14. Dual-Port Front Panel USB 2.0 Header................................................. 44

15. Internal Mono Speaker Header ........................................................... 44
16. Front Panel USB 3.0 Connector........................................................... 45
17. SATA Connectors .............................................................................. 45
18. S/PDIF Header ................................................................................. 45
19. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 46
20. Chassis Intrusion Header ................................................................... 46
21. TPM Header ..................................................................................... 46
22. Processor Core Power Connector ........................................................ 47
23. Main Power Connector ....................................................................... 47
24. Front Panel Connector ....................................................................... 48
25. States for a One-Color Power LED....................................................... 49
26. States for a Two-Color Power LED....................................................... 49
27. Alternate Front Panel Power/Sleep LED Header..................................... 49
28. BIOS Setup Security Jumper Settings ................................................. 52
29. Fan Header Current Capability ............................................................ 55
30. Thermal Considerations for Components.............................................. 57
31. Environmental Specifications .............................................................. 58
32. Intel Visual BIOS Setup Display Areas ................................................. 60
33. BIOS Setup Program Function Keys .................................................... 60
34. AccepDrives/Media Types for BIOS Recovery........................................ 63
35. Boot Device Menu Options ................................................................. 64
36. Master Key and User Hard Drive Password Functions ............................ 66
37. Supervisor and User Password Functions ............................................. 68
38. BIOS Beep Codes ............................................................................. 69
39. Front-panel Power LED Blink Codes ..................................................... 70
40. BIOS Error Messages ........................................................................ 70
41. Safety Standards .............................................................................. 71
42. EMC Regulations ............................................................................... 75
43. Regulatory Compliance Marks ............................................................ 78
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary

Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor • 4th generation Intel® Core™ processor with up to 95 W TDP in an LGA1150
socket
― One PCI Express* x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing
― External graphics interface controller
Graphics • Integrated graphics support for processors with Intel HD Graphics:
― High Definition Multimedia Interface* (HDMI*) v1.4a
― DVI-I v1.0
• Support for a PCI Express 3.0 x16 add-in graphics card
Memory • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz to DDR3 1600 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Chipset Intel® B85 Express Chipset consisting of the Intel® B85 Express Platform
Controller Hub (PCH)
continued
11
Table 1. Feature Summary (continued)

Peripheral • USB 3.0 ports:
Interfaces ― Two USB 3.0 ports are implemented with stacked back panel connectors
― Two front panel USB 3.0 ports are implemented through one internal
connector
• USB 2.0 ports:
― Four ports are implemented with stacked back panel connectors
― Four front panel ports are implemented through two dual-port internal
connectors
• Serial ATA (SATA) ports:
― Four SATA 6.0 Gb/s ports
― Two SATA 3.0 Gb/s ports
Audio 8-channel (5.1 + 2) Intel High Definition Audio via the Realtek* ALC662s-VD
audio codec
LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I217V Gigabit
Ethernet Controller
Expansion • One PCI Express x16 3.0/2.x/1.x add-in card connector
Capabilities • Two PCI Express x1 2.x/1.x add-in card connectors
®
Intel Visual BIOS • Intel® BIOS resident in SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available • Support for PCI Express* Revision 3.0
PC Technology • Suspend to RAM support
• Wake on PCI Express, LAN, front panel, and USB ports
Super I/O Control Nuvoton NCT6683 I/O controller for hardware management support
Hardware Monitor • Hardware monitoring through the Nuvoton I/O controller
Subsystem • Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
• Fan speed control
®
Intel Security and • Intel® Small Business Technology (Intel® SBT)
Manageability • Intel® Anti-Theft (Intel® AT)
Technologies • Intel® Virtualization Technology (Intel® VT)
• Intel® Virtualization for Directed I/O (Intel® VT-d)
12
Product Description
1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DB85FL.
Figure 1. Major Board Components
13
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1

Item/callout
from Figure 1 Description
A PCI Express x1 add-in card connector
B PCI Express x16 add-in card connector
C Battery
D PCI Express x1 add-in card connector
E Back panel connectors
F Processor core power connector (2 x 2)
G LGA1150 processor socket
H Processor fan header
I DIMM 3 (Channel A DIMM 0)
J DIMM 1 (Channel A DIMM 1)
K DIMM 4 (Channel B DIMM 0)
L DIMM 2 (Channel B DIMM 1)
M Front fan header
N Trusted Platform Module header
O Power supervisor LED
P Enhanced standby power LED
Q Main power connector (2 x 12)
R BIOS security jumper
S Piezoelectric speaker
T Front panel USB 3.0 connector
U Intel B85 Express Chipset
V Chassis intrusion header
W Front panel header
X Alternate front panel power/sleep LED header
Y SATA 3.0 Gb/s connectors
Z SATA 6.0 Gb/s connectors
AA Front panel dual-port USB 2.0 connectors
BB Rear chassis fan header
CC S/PDIF out header
DD Front panel audio connector
14
Product Description
1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
15
1.2 Online Support

To find information about… Visit this World Wide Web site:
Intel Desktop Board DB85FL http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel http://ark.intel.com
Desktop Board DB85FL
Supported processors http://processormatch.intel.com

Chipset information https://www-
ssl.intel.com/content/www/us/en/chipsets/performance-
chipsets/chipsets.html
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.3 Processor
The board supports 4th generation Intel Core processors. Other processors may be
supported in the future. This board supports processors with a maximum wattage of
95 W Thermal Design Power (TDP). The processors listed above are only supported
when falling within the wattage requirements of Intel Desktop Board DB85FL. See the
Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:

Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 54 for information on power supply requirements for this board.
16
Product Description
1.3.1 Processor Graphics Subsystem

The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
The board supports integrated graphics for processors with Intel HD Graphics.
1.3.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:
• 3D Features
 DirectX* 11.1 support
 OpenGL* 4.0 support
• Video
 Next Generation Intel® Clear Video Technology HD support is a collection of
video playback and enhancement features that improve the end user’s viewing
experience
 Encode/transcode HD content
 Playback of high definition content including Blu-ray* disc
 Superior image quality with sharper, more colorful images
 Playback of Blu-ray disc S3D content using HDMI (1.4a spec compliant
with 3D)
 DirectX* Video Acceleration (DXVA) support for accelerating video processing
 Full AVC/VC1/MPEG2 HW Decode
 Intel® HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync Video is enabled by an appropriate software application.
 Blu-ray Stereoscopic 3D (S3D) via HDMI 1.4a
1.3.1.2 Digital Visual Interface (DVI-I)

The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 1920 x 1200 @ 60Hz. The DVI port is compliant with the
DVI 1.0 specification. DVI analog output can also be converted to VGA using a DVI-
VGA converter.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in Table 3.
Table 3. DVI Port Status Conditions

DVI Digital (DVI-D) DVI Analog (DVI-A)
PCI Express x16 Connector Status Port Status Port Status (Note 1)
No add-in card installed Enabled Enabled
(Note 2) (Note 2)
PCI Express x16 add-in card installed Enabled Enabled
Notes:
1. DVI analog output can also be converted to VGA with a DVI-VGA converter.
2. May require BIOS setup menu changes.
17
1.3.1.3 High Definition Multimedia Interface* (HDMI*)

The High-Definition Multimedia Interface (HDMI) is provided for transmitting
uncompressed digital audio and video signals to television sets, projectors and other
video displays. It can carry high quality multi-channel audio data and all standard and
high-definition consumer electronics video formats. The HDMI display interface
connecting the processor and display devices utilizes transition minimized differential
signaling (TMDS) to carry audiovisual information through the same HDMI cable. The
processor HDMI interface is designed according to the High-Definition Multimedia
Interface Specification with 3D, 4K, Deep Color, and x.v.Color.
The maximum supported resolution is 4096 x 2304 @ 24Hz or 2560 x 1600 @ 60Hz.
The HDMI interface supports the HDMI 1.4a specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
HDMI port will behave as described in Table 4.
Table 4. HDMI Port Status Conditions

PCI Express x16 Connector Status HDMI Port Status
No add-in card installed Enabled
(Note)
PCI Express x16 add-in card installed Enabled
Note: May require BIOS setup menu changes.
1.3.1.4 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized
copy or interception between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI and DVI).
18
Product Description
1.3.1.5 Integrated Audio Provided by the HDMI Interface

The HDMI interface from the PCH supports audio. The processor supports two High
Definition audio streams on two digital ports simultaneously.
The following specific audio technologies are supported by the PCH:
• AC-3 - Dolby* Digital
• Dolby Digital Plus
• DTS-HD*
• LPCM, 192 kHz/24 bit, 8 Channel
• Dolby TrueHD, DTS-HD Master Audio* (Lossless Blu-ray Disc Audio Format)
1.3.1.6 Multiple Display Configurations

The following multiple display configuration modes are supported (with appropriate
driver software):
• Single Display is a mode with one display port activated to display the output to
one display device.
• Intel® Display Clone is a mode with up to three display ports activated to drive the
display content of same color depth setting but potentially different refresh rate
and resolution settings to all the active display devices connected.
• Extended Desktop is a mode with up to three display ports activated to drive the
content with potentially different color depth, refresh rate, and resolution settings
on each of the active display devices connected.
1.3.1.7 PCI Express Graphics

th
4 generation Intel Core processors support PCI Express 3.0, 2.x, and 1.x:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
19
1.4 System Memory

The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 39 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1333 MHz to DDR3 1600 MHz SDRAM DIMMs
• XMP version 1.3 performance profile support for memory speeds up to 1600 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 5 lists the supported DIMM configurations.

Table 5. Supported Memory Configurations
DIMM SDRAM SDRAM Organization Number of SDRAM
Capacity Configuration (Note) Density Front-side/Back-side Devices
1024 MB SS 1 Gbit 128 M x8/empty 8
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).

Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
20
Product Description
1.4.1 Memory Configurations

th
4 generation Intel Core processors support the following types of memory
organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
21
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory in the blue DIMM sockets if
installing only two DIMMs on your board.
22
Product Description
1.5 Intel® B85 Express Chipset

Intel B85 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and USB, SATA, LPC, LAN, and PCI Express. The Intel B85
Express Chipset is a centralized controller for the board’s I/O paths.

The Intel B85 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
the PCH. This high-speed interface integrates advanced priority-based servicing
allowing for concurrent traffic and true isochronous transfer capabilities.
1.5.2 USB
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to
480 Mb/s. All ports are high-speed, full-speed, and low-speed capable.
The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host
controller which supports USB 3.0 ports. This controller allows data transfers up to
5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS),
and low-speed (LS) traffic on the bus.
The Intel B85 Express Chipset provides the USB controller for the USB 2.0/3.0 ports.
The port arrangement is as follows:
• USB 3.0 ports:
 Two USB 3.0 ports are implemented with stacked back panel connectors
 Two front panel USB 3.0 ports are implemented through one internal connector
• USB 2.0 ports:
 Four ports are implemented with stacked back panel connectors
 Four front panel ports are implemented through two dual-port internal
connectors
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.

The location of the USB connectors on the back panel Figure 8, page 41
The location of the front panel USB headers Figure 9, page 42
23
1.5.3 SATA Interfaces

The board provides six SATA connectors, through the PCH, which support one device
each:
• Four SATA 6.0 Gb/s interfaces through the Intel B85 Express Chipset with SATA
ACHI support (blue)
• Two SATA 3.0 Gb/s interfaces through the Intel B85 Express Chipset with SATA
ACHI support (black)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for four ports and 3.0 Gb/s for two ports. A point-to-point interface is used
for host-to-device connections.
The PCH supports the Serial ATA Specification, Revision 3.0. The PCH also supports
several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
For more information, see: http://www.serialata.org/.

The location of the SATA connectors Figure 9, page 42
1.5.3.1 Intel® Rapid Storage Technology

The PCH supports Intel® Rapid Storage Technology, providing AHCI functionality.
1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSTBY applied via the power supply 5 VSTBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the Power-On Self-Test (POST).
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
24
Product Description
1.7 Super I/O Controller

The I/O controller provides the following features:
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
The BIOS Setup program provides configuration options for the I/O controller.
1.8 Audio Subsystem

The board supports Intel HD Audio via the Realtek ALC662s-VD audio codec. The
audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port.
• Digital-to-Analog Converters (DAC) with 95 dB SNR (A-weighting) and Analog-to-
Digital Converters (ADC) with 90 dB SNR (A-weighting).
• Six DAC channels support 16/20/24-bit PCM format for 5.1 channel sound
playback, plus two channels of concurrent independent stereo sound output
(multiple streaming) through the front panel output.
• Two stereo ADCs support 16/20-bit PCM format, multiple stereo recording
• Microphone Acoustic Echo Cancellation (AEC), Noise Suppression (NS), and Beam
Forming (BF) technology for voice applications.
• Windows 7 Ultimate and Windows 8 Pro certification.
Table 6 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Support

Line-out
Micro- Head- (Front Line-in Mic-in
Audio Jack phone phones Speakers) (Surround) (Center/Sub)
Front panel - Green Default
Front panel - Pink Default
Back panel - Blue Default
(ctrl panel)
Back panel - Green (ctrl panel) Default
(ctrl panel)
Back panel - Pink Default
(ctrl panel)
1.8.1 Audio Subsystem Software

The latest audio software and drivers are available from Intel’s World Wide Web site.

Obtaining audio software and drivers Section 1.2, page 16
25
1.8.2 Audio Subsystem Components

The audio subsystem includes the following components:
• Intel B85 Express Chipset
• Realtek ALC662s-VD audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x
5-pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• 3-port analog audio input/output stack on the back panel
• Mono speaker header (1 x 2-pin header) (yellow)
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Line-in (Surround)
B Line-out (Front Speakers)
C Mic-in (Center/Sub)
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.

The locations of the front panel audio header and S/PDIF audio header Figure 9, page 42
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 44
The back panel audio connectors Section 2.2.1, page 41
1.8.2.1 S/PDIF Header

The S/PDIF header allows connections to optical dongles for digital audio output.
26
Product Description
1.8.2.2 Internal Mono Speaker Header

The internal mono speaker header allows connection to an internal, low-power PC
speaker for basic system sound capability. The subsystem is capable of driving a
speaker load of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
1.9 LAN Subsystem

The LAN subsystem consists of the following:
• Intel I217V Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel B85 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• ACPI technology support
• LAN wake capabilities
• LAN subsystem software

LAN software and drivers http://downloadcenter.intel.com
1.9.1 Intel® I217V Gigabit Ethernet Controller

The Intel I217V Gigabit Ethernet Controller supports the following features:
Network Features:
• Compliant with the 1 Gb/s Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications
• Multi-speed operation: 10/100/1000 Mb/s
• Full-duplex operation at 10/100/1000 Mb/s; Half-duplex operation at 10/100 Mb/s
• Flow control support compliant with the 802.3X specification as well as the specific
operation of asymmetrical flow control defined by 802.3z
• VLAN support compliant with the 802.3q specification
• MAC address filters: perfect match unicast filters, multicast hash filtering,
broadcast filter, and promiscuous mode
Performance Features:
• Configurable receive and transmit data FIFO, programmable in 1 KB increments
• TCP segmentation capability compatible with Windows NT 5.x off-loading features
• Fragmented UDP checksum offload for packet reassembly
• IPv4 and IPv6 checksum offload support (receive, transmit, and TCP segmentation
offload)
• Split header support to eliminate payload copy from user space to host space
• Receive Side Scaling (RSS) with two hardware receive queues
• Supports 9018 bytes of jumbo packets
• Packet buffer size
27
• LinkSec offload compliant with 802.3ae specification

• TimeSync offload compliant with 802.1as specification
Power Management Features:
• Magic Packet* wake-up enable with unique MAC address
• ACPI register set and power down functionality supporting D0 and D3 states
• Full wake up support (APM, ACPI)
• MAC power down at Sx, DMoff with and without WoL
• Auto connect battery saver at S0 no link and Sx no link
• Energy Efficient Ethernet (EEE) support
• Latency Tolerance Reporting (LTR)
• Optimized Buffer Flash/Fill (OBFF) support
• ARP and ND proxy support through LAN Connected Device proxy
• Wake on LAN (WoL) from Deep Sx
• Provides lower power usage to meet ENERGY STAR 5.2 and ErP specifications
1.9.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers http://downloadcenter.intel.com
1.9.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
28
Product Description
Table 7 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 7. LAN Connector LED States

LED LED Color LED State Condition
Off LAN link is not established.
Link Green On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mb/s data rate is selected.
Data Rate Green/Yellow Green 100 Mb/s data rate is selected.
Yellow 1000 Mb/s data rate is selected.
1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Nuvoton NCT6683
device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, VSM, +VCCP, and PCH VCC
• SMBus interface
1.10.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.

The functions of the fan headers Section 1.12.2.2, page 36
1.10.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.

The location of the chassis intrusion header Figure 9, page 42
29
1.10.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Voltage regulator thermal sensor
B Thermal diode, located on the processor die
C Processor fan header
D DIMM thermal sensor
E Front chassis fan header
F Thermal diode, located on the Intel B85 PCH
G Rear chassis fan header
Figure 6. Thermal Sensors and Fan Headers
30
Product Description
1.11 Intel® Security and Manageability

Technologies
Intel® Security and Manageability Technologies provide tools and resources to help
small business owners and IT organizations protect and manage their assets in a
business or institutional environment.
NOTE
Software with security and/or manageability capability is required to take advantage of
Intel platform security and/or management technologies.
1.11.1 Intel® Small Business Technology

Intel® Small Business Technology (Intel® SBT) provides small businesses with security
and productivity capabilities to help keep their PCs up-to-date, protected and running
well. Intel SBT is the firmware component of Intel® Small Business Advantage (Intel®
SBA) and includes this hardware functionality:
• Local Maintenance Timer – Enables applications to “wake-up” the host platform
when it is powered down or in a sleep state.
• Local Software Monitor – Provides a common reporting mechanism to monitor
applications running on the host operating system.

Intel Small Business Advantage http://www.intel.com/go/SBA
1.11.2 Intel® Virtualization Technology

Intel Virtualization Technology (Intel® VT) is a hardware-assisted technology that,
®
when combined with software-based virtualization solutions, provides maximum

system utilization by consolidating multiple environments into a single server or PC.
NOTE
A processor with Intel VT does not guarantee that virtualization will work on your
system. Intel VT requires a computer system with a chipset, BIOS, enabling software
and/or operating system, device drivers, and applications designed for this feature.

Intel Virtualization Technology http://www.intel.com/technology/virtualization/technology.
htm
31
1.11.3 Intel® Virtualization Technology for Directed I/O

Intel® Virtualization Technology for Directed I/O (Intel® VT-d) allows addresses in
incoming I/O device memory transactions to be remapped to different host addresses.
This provides Virtual Machine Monitor (VMM) software with:
• Improved reliability and security through device isolation using hardware assisted
remapping.
• Improved I/O performance and availability by direct assignment of devices.

Intel Virtualization Technology for http://www.intel.com/technology/itj/2006/v10i3/2-io/4-
Directed I/O virtualization-techniques.htm
1.11.4 Intel® Anti-Theft Technology

Intel® Anti-Theft (Intel® AT) provides local, tamper-resistant defense that works like a
poison pill that disables the computer and access to its data even if the operating
system (OS) is reimaged, a new hard drive is installed, or the computer is
disconnected from the network.
NOTE
No computer system can provide absolute security under all conditions. Intel AT
requires the computer system to have an Intel AT-enabled chipset, BIOS, firmware
release, software, and an Intel AT-capable Service Provider/ISV application and service
subscription. The detection (triggers), response (actions), and recovery mechanisms
only work after the Intel AT functionality has been activated and configured. Certain
functionality may not be offered by some ISVs or service providers and may not be
available in all countries. Intel assumes no liability for lost or stolen data and/or
systems or any other damages resulting thereof.

Intel Anti-Theft http://antitheft.intel.com/welcome.aspx
1.11.5 Intel® Management Engine (Intel® ME) Software

and Drivers
Intel ME software and drivers are available from Intel’s World Wide Web site.

Obtaining Intel ME software and drivers Section 1.2 on page 16
32
Product Description
1.12 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support
1.12.1 Software Support (ACPI)

ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 10 on page 34)
• Support for a front panel power and sleep mode switch
Table 8 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 8. Effects of Pressing the Power Switch

If the system is in this …and the power switch is
state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than six seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than six seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 9 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
33
Table 9. Power States and Targeted System Power

Processor Targeted System
Global States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
(Note 2)
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W
state RAM. Context except for
saved to RAM. wake-up logic.
(Note 2)
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W
state disk. Context except for
saved to disk. wake-up logic.
(Note 2)
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
1.12.1.2 Wake-up Devices and Events

Table 10 lists the devices or specific events that can wake the computer from specific
states.
Table 10. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
(Note 1)
Power switch S3, S4, S5
(Note 1)
RTC alarm S3, S4, S5
(Notes 1 and 2)
LAN S3, S4, S5
USB S3
(Note 1)
WAKE# S3, S4, S5
Notes:
1. S4 implies operating system support only.
2. Wake on LAN is only supported from sleep (S3) or hibernate (S4) in Windows 8.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
34
Product Description
1.12.2 Hardware Support

CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PCI Express WAKE# signal support
• Wake from S5
• Power Supervisor
• +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

The location of the main power connector Figure 9, page 42
The signal names of the main power connector Table 23, page 47
35
1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state
• The fans are off when the board is off or in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the SIO
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• The fan headers are controlled by Pulse Width Modulation

The location of the fan headers Figure 9, page 42
The location of the fan headers and sensors for thermal monitoring Figure 6, page 30
1.12.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Table 10 on page 34 lists the
devices and events that can wake the computer from the S3 state. Depending on the
LAN implementation, the board supports LAN wake capabilities with ACPI in the
following ways:
• The PCI Express WAKE# signal
• By Ping
• Magic Packet
• The onboard LAN subsystem
1.12.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must
be capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing Instantly Available PC technology can damage the
power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
36
Product Description
its last known wake state. Table 10 on page 34 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI Express add-in cards and drivers.
1.12.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.12.2.6 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.
1.12.2.7 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.
1.12.2.8 Power Supervisor

The Power Supervisor actively monitors the input voltages from the power supply and
protects the board and any attached peripherals from electrical overstress and possible
physical damage. The Power Supervisor will activate if it detects the power supply
voltage rails have deviated outside the current ATX power supply specification and safe
operating levels.
If the Power Supervisor detects an out of spec voltage, the following will happen:
1. The board will be powered down immediately to protect circuits from electrical
overstress and possible physical damage.
2. A red warning LED (see Figure 1) on the board will activate as a visual cue.
3. During the next power on, a message will be displayed on the screen to notify the
user that the power supply voltage rails have deviated outside the current ATX
power supply specification and safe operating levels.
4. A message will be added to the BIOS Event Log for each event that takes place
until the BIOS Event Log is cleared.
37
1.12.2.9 Enhanced Standby Power LED

The enhanced standby power LED is lit when the board has +5 V standby voltage
applied to it. It also blinks as soon as the BIOS has started executing code, once the
power button has been pressed and before video has been initialized. Figure 7 shows
the location of the LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Enhanced Standby Power LED
38
2 Technical Reference
2.1 Memory Resources

2.1.1 Addressable Memory
The board utilizes 32 GB of addressable system memory. Typically the address space
that is allocated for add-in cards, PCI Express configuration space, BIOS (SPI Flash
device), and chipset overhead resides above the top of DRAM (total system memory).
On a system that has 32 GB of system memory installed, it is not possible to use all of
the installed memory due to system address space being allocated for other system
critical functions. These functions include the following:
• BIOS/SPI Flash device (96 Mb)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards
(256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. All installed system memory can
be used when there is no overlap of system addresses.
39
2.2 Connectors and Headers

CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• Component-side connectors and headers (see page 42)
40
Technical Reference
2.2.1 Back Panel Connectors

Figure 8 shows the location of the back panel connectors for the board.
Item Description
A USB 2.0 connectors
B HDMI connector
C DVI-I connector
D USB 3.0 connectors
E LAN port
F USB 2.0 connectors
G Line–in (surround)
H Line-out (front speakers)
I Mic–in (center/sub)
Figure 8. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
41
2.2.2 Component-side Connectors and Headers

Figure 9 shows the locations of the component-side connectors and headers.
Figure 9. Component-side Connectors and Headers
42
Technical Reference
Table 11 lists the component-side connectors and headers identified in Figure 9.
Table 11. Component-side Connectors and Headers Shown in Figure 9

Item/callout
from Figure 9 Description
A PCI Express x1 add-in card connector
B PCI Express x16 add-in card connector
C PCI Express x1 add-in card connector
D Processor core power connector (2 x 2)
E Processor fan header
F Front fan header
G TPM header
H Main power connector (2 x 12)
I Front panel USB 3.0 connector
J Chassis intrusion header
K Front panel header
L Alternate front panel power/sleep LED header
M SATA 3.0 Gb/s connectors
N SATA 6.0 Gb/s connectors
O Front panel dual-port USB 2.0 connector
P Front panel dual-port USB 2.0 connector
Q Rear chassis fan header
R S/PDIF out header
S Front panel audio connector
43
2.2.2.1 Signal Tables for the Connectors and Headers
Table 12. Front Panel Audio Connector for Intel HD Audio

Pin Signal Name Pin Signal Name
1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 13. Front Panel Audio Connector for AC ’97 Audio

1 MIC 2 AUD_GND
3 MIC_BIAS 4 PRESENCE#
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 14. Dual-Port Front Panel USB 2.0 Header

1 +5 V DC 2 +5 V DC
3 D− 4 D−
5 D+ 6 D+
7 Ground 8 Ground
9 KEY (no pin) 10 No Connect
Notes: The +5 V DC power on the USB headers is fused.
The Serial POST pin is reserved for compatibility with future POST debug cards
Table 15. Internal Mono Speaker Header

Pin Signal Name
1 −
2 +
44
Technical Reference
Table 16. Front Panel USB 3.0 Connector

Pin Signal Name Description
1 Vbus Power
2 IntA_P1_SSRX− USB 3 ICC Port1 SuperSpeed Rx−
3 IntA_P1_SSRX+ USB 3 ICC Port1 SuperSpeed Rx+
4 GND Ground
5 IntA_P1_SSTX− USB 3 ICC Port1 SuperSpeed Tx−
6 IntA_P1_SSTX+ USB 3 ICC Port1 SuperSpeed Tx+
7 GND Ground
8 IntA_P1_D− USB 3 ICC Port1 D− (USB 2 Signal D−)
9 IntA_P1_D+ USB 3 ICC Port1 D+ (USB 2 Signal D+)
10 ID Over Current Protection
11 IntA_P2_D+ USB 3 ICC Port2 D+ (USB 2 Signal D+)
12 IntA_P2_D− USB 3 ICC Port2 D− (USB 2 Signal D−)
13 GND Ground
14 IntA_P2_SSTX+ USB 3 ICC Port2 SuperSpeed Tx+
15 IntA_P2_SSTX− USB 3 ICC Port2 SuperSpeed Tx−
16 GND Ground
17 IntA_P2_SSRX+ USB 3 ICC Port2 SuperSpeed Rx+
18 IntA_P2_SSRX− USB 3 ICC Port2 SuperSpeed Rx+
19 Vbus Power
20 Key (no pin) No connect
Table 17. SATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 18. S/PDIF Header

Pin Signal Name
1 Ground
2 S/PDIF out
3 Key (no pin)
4 +5 V DC
45
Table 19. Processor, Front, and Rear Chassis

(4-Pin) Fan Headers
Pin Signal Name
1 Ground (Note)
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.
Table 20. Chassis Intrusion Header

Pin Signal Name
1 Intruder#
2 Ground
Table 21. TPM Header

1 PCICLK 2 GND
3 FRAME 4 Key (no pin)
5 PCIRST 6 N/C
7 LAD3 8 LAD2
9 VCC3 10 LAD1
11 LAD0 12 GND
13 N/C 14 N/C
15 3VSB 16 SERIRQ
17 GND 18 CLKRUN
19 PWRDWN 20 N/C
2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:
• One PCI Express x16 (3.0/2.x/1.x)
• Two PCI Express x1 (2.x/1.x)
46
Technical Reference
2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable to the main
power connector, leaving pins 11, 12, 23, and 24 unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 22. Processor Core Power Connector

1 Ground 2 Ground
3 +12 V 4 +12 V
Table 23. Main Power Connector

1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 2 x 12 connector detect (Note) 24 Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Power supply considerations Section 2.5.1 on page 54
47
2.2.2.4 Front Panel Connector

This section describes the functions of the front panel connector. Table 24 lists the
signal names of the front panel connector. Figure 10 is a connection diagram for the
front panel connector.
Table 24. Front Panel Connector

Pin Signal Name Description Pin Signal Name Description
1 HDD_POWER_LED Pull-up resistor 2 POWER_LED_MAIN [Out] Front panel LED
(750 Ω) to +5 V (main color)
3 HDD_LED# [Out] Hard disk 4 POWER_LED_ALT [Out] Front panel LED
activity LED (alt color)
5 GROUND Ground 6 POWER_SWITCH# [In] Power switch
7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground
9 +5 V_DC Power 10 Key No pin
Figure 10. Connection Diagram for Front Panel Connector
2.2.2.4.1 Hard Drive Activity LED

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.
2.2.2.4.2 Reset Switch
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
48
Technical Reference
2.2.2.4.3 Power/Sleep LED

Pins 2 and 4 can be connected to a one- or two-color LED. Table 25 shows the
possible states for a one-color LED. Table 26 shows the possible states for a two-color
LED.
Table 25. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running
Table 26. States for a Two-Color Power LED

LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 25 and Table 26 are suggested colors only. Actual LED colors
are chassis-specific.
2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.5 Alternate Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 27. Alternate Front Panel Power/Sleep LED Header

Pin Signal Name Description
1 POWER_LED_MAIN [Out] Front panel LED (main color)
2 Key (no pin)
3 POWER_LED_ALT [Out] Front panel LED (alt color)
49
2.2.2.6 Front Panel Connectors

Figure 11 and Figure 12 are connection diagrams for the front panel USB connectors.
NOTE
• The +5 V DC power on the USB connector is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for
high-speed USB devices.
Figure 11. Connection Diagram for the Front Panel Dual-Port

USB 2.0 Connectors
Figure 12. Connection Diagram for the Front Panel

USB 3.0 Connector
50
Technical Reference
2.3 BIOS Security Jumper

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 13 shows the location of the jumper. The 3-pin jumper determines the BIOS
Security program’s mode. Table 28 describes the jumper settings for the three
modes: normal, lockdown, and configuration.
Figure 13. Location of the Jumper
51
Table 28. BIOS Setup Security Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and passwords
for booting.
Lockdown 2-3 The BIOS uses current configuration information and passwords
for booting, except:
• All POST Hotkeys are suppressed (prompts are not displayed
and keys are not accepted. For example, F2 for Setup, F10 for
the Boot Menu).
• Power Button Menu is not available (see Section 3.9.3 Power
Button Menu).
BIOS updates are not available except for automatic Recovery
due to flash corruption.
Configuration None BIOS Recovery Update process if a matching *.bio file is found.
Mode Recovery Update can be cancelled by pressing the Esc key.
If the Recovery Update was cancelled or a matching *.bio file
was not found, a Config Menu will be displayed. The Config Menu
consists of the following (followed by the Power Button Menu
selections):
[1] Suppress this menu until the BIOS Security Jumper is
replaced.
[2] Clear BIOS User and Supervisor Passwords.
[3] Reset Intel AMT to default factory settings.
[4] Clear Trusted Platform Module.
See Section 3.9.3 Power Button Menu.
52
Technical Reference
2.4 Mechanical Considerations

2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
Figure 14. Board Dimensions
53
2.5 Electrical Considerations

2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.

Due to improvements in 4th generation Intel Core processor power efficiency, the
requirements for the processor’s power supply have changed. More specifically, the
latest Power Supply Design Guide rev 1.3 has indicated a minimum current of 0.05A
on +12 V2DC and recommends 0A. This is to prevent Power Supply Unit (PSU)
protection from triggering during minimum loading.
Intel recommends that system integrators and builders check the latest list of tested
PSUs to find out which are capable of supporting the 4th generation Intel Core
processor. This list may be found at: http://www.intel.com/go/powersupplies/. From
the filters at the top right of the page, set 12V2 Min Load 0A to “Yes” to see which
PSUs are capable of supporting the processor’s new power requirements.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 V DC and +5 V DC power rails
• The current capability of the +5 VSTBY line
• All timing parameters
• All voltage tolerances
For example, for a high power system consisting of a supported 95 W processor (see
Section 1.3 on page 16 for a list of supported processors), 4 GB DDR3 RAM, one high
end video card, one hard disk drive, one optical drive, and all board peripherals
enabled, the minimum recommended power supply is 460 W.
For example, for a low power system consisting of a supported 45 W processor (see
Section 1.3 on page 16 for a list of supported processors), 2 GB DDR3 RAM, integrated
graphics, one SSD, one optical drive, and no extra onboard peripherals enabled, the
minimum recommended power supply is a 320 W.

Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb
/CS-026472.htm
Selecting a power supply capable of http://www.intel.com/go/powersupplies/
supporting the 4th generation Intel Core
processor
54
Technical Reference
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 29 lists the current capability of the fan headers.
Table 29. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board
(all three expansion slots filled) must not exceed the system’s power supply +5 V
maximum current or 14 A in total.
2.6 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional airflow
to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
55
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 15) can reach a temperature of up to 120 oC in
an open chassis.
Figure 15 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel B85 Express Chipset
Figure 15. Localized High Temperature Zones
56
Technical Reference
Table 30 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 30. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel B85 Express Chipset 104 oC
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 30. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature.

Processor datasheets and specification updates Section 1.2, page 16
Intel B85 Express Chipset http://www.intel.com/products/desktop/
chipsets/
57
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using a parts count
method. The calculation is based on the Telcordia SR-332, Issue 3; Bellcore Method 1
Case 3 with 50% electrical stress, 55 ºC component ambient and 25 ºC system
ambient. The MTBF prediction is used to estimate repair rates and spare parts
requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF
for the Intel Desktop Board DB85FL is 377,255 hours.
2.8 Environmental
Table 31 lists the environmental specifications for the board.
Table 31. Environmental Specifications

Parameter Specification
Temperature
(Note)
Non-Operating -20 °C to +70 °C
Operating 0 °C to +55 °C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.
58
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel Visual BIOS that is stored in the Serial Peripheral Interface
Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI
Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration
utility, LAN EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as FLB8510H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
POST memory test begins and before the operating system boot begins.
Figure 16. Intel Visual BIOS Screen
59
Table 32 lists the BIOS Setup program menu features.
Table 32. Intel Visual BIOS Setup Display Areas

Devices &
Home 1 Home 2 Home 3 Main Peripherals Cooling
Displays Environmental System, Displays Configures Real-time system
processor, monitoring desktop processor, advanced monitoring, adjust
graphics, display and board, memory, features fan speeds, set
memory, and attached SATA chassis, and configuration, available temperature set
configuration with devices processor event log, through the points, and define
quick launch to information date, and chipset and system voltage
tuning, UEFI time other discrete settings
apps, BIOS controllers
update, and
system profiles
continued
Table 32. Intel Visual BIOS Setup Display Areas (continued)

Performance Security Power Boot Exit
Displays and Sets passwords Configures power Selects boot Saves or discards
Configures Memory, and security management features options and changes to Setup
Graphics, Bus, and features and power supply boot display program options
Processor overrides controls options
Table 33 lists the function keys available for menu screens.
Table 33. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
Mouse Allows control of all options and slider controls in Intel Visual BIOS
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 96 Mb (12288 KB)
flash memory device.
60
Overview of BIOS Features
3.3 Resource Configuration

3.3.1 PCI Express Autoconfiguration
The BIOS can automatically configure PCI Express devices. PCI Express devices may
be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI
Express cards without having to configure the system. When a user turns on the
system after adding a PCI Express card, the BIOS automatically configures interrupts,
the I/O space, and other system resources. Any interrupts set to Available in Setup
are considered to be available for use by the add-in card.
3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
61
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel® Integrator
Toolkit version 5.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site (see Section 1.2 on page 16):
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
• Intel® F7 switch allows a user to select where the BIOS .bio file is located and
perform the update from that location/device. Similar to performing a BIOS
Recovery without removing the BIOS configuration jumper.
• Intel Visual BIOS Update Utility allows the user to select the BIOS .bio file from the
internet, USB device, hard disk drive, or other media.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm.
3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English.
62
3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit version 5
that is available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

Intel Integrator Toolkit http://www.intel.com/go/itk
3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 34 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 34. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the SATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/
cs-023360.htm
63
3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.
3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 35 lists the boot device menu
options.
Table 35. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu and boots from the selected device
<Esc> Exits the menu and boots according to the boot priority
defined through BIOS setup
64
3.9 Adjusting Boot Speed

These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimizing BIOS boot parameters
• Enabling the Fast Boot feature
3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” in less than
eight seconds that minimizes hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time:
• In the Boot menu, enable the settings for Fast Boot. This option will allow the BIOS
to skip through various stages of POST and boot quickly to the last detected boot
device.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce option ROM boot time by up to four seconds.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay
feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup
program).
65
3.9.3 Power Button Menu

The Power Button Menu can be accessed during power on if the user presses the
power button and holds it down until three short beep sounds are emitted by the
board piezoelectric speaker. The BIOS will display the following prompt and wait for a
keystroke:
[ESC] Normal Boot
[F2] Intel Visual BIOS
[F3] Disable Fast Boot
[F4] BIOS Recovery
[F7] Update BIOS
[F10] Enter Boot Menu
[F12] Network Boot
If an unrecognized key is pressed, the BIOS will beep and wait for another keystroke.
If one of the listed hotkeys is pressed, the BIOS will follow the indicated boot path.
Password requirements must still be honored.
If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and
reset the system.
3.10 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3. Valid
password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in
length.
The User hard disk drive password, when installed, will be required upon each power-
cycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.
Table 36 shows the effects of setting the Hard Disk Drive Passwords.
Table 36. Master Key and User Hard Drive Password Functions
Password Set Password During Boot
Neither None
Master only None
User only User only
Master and User Set Master or User
66
During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.
NOTE
As implemented on DB85FL, Hard Disk Drive Password Security is only supported on
SATA port 0. The passwords are stored on the hard disk drive so if the drive is
relocated to another SATA port or computer that does not support Hard Disk Drive
Password Security feature, the drive will not be accessible.
NOTE
Hard Disk Drive Password Security is not supported in PCH RAID mode. Secured hard
disk drives attached to the system when the system is in PCH RAID mode will not be
accessible due to the disabling of BIOS Hard Disk Drive Password support.
3.11 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
67
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
19 characters in length.
Table 37 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 37. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited
number of
options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited Enter Password user user
number of
options
Note: If no password is set, any user can change all Setup options.
NOTE
The BIOS complies with NIST Special Publication 800-147 BIOS Protection Guidelines /
Recommendations of the National Institute of Standards and Technology. Refer to
http://csrc.nist.gov/publications/nistpubs/800-147/NIST-SP800-147-April2011.pdf for
more information.
3.12 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements
when using 4th generation Intel Core processors in an LGA1150 socket.
• Processor maximum non-turbo ratio (processor multiplier can only be adjusted
down)
• Memory multiplier adjustment
• Memory voltage adjustment
• Memory latency adjustments
• Graphics multiplier adjustment
• Graphics voltage adjustment
68
4 BIOS Error Codes and Messages
4.1 BIOS Error Codes

The BIOS provides two types of Error Code indications during POST:
• Beep codes
• Blink codes
4.1.1 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s
speaker (Figure 1, S) to beep an error code describing the problem (see Table 38).
Table 38. BIOS Beep Codes

Type Pattern Frequency
F2 Setup/F10 Boot Menu One 0.5 second beep when BIOS is ready to 932 Hz
Prompt accept keyboard input.
BIOS update in progress None
Video error On-off (1.0 second each) two times, then 932 Hz
2.5-second pause (off), entire pattern repeats When no VGA option ROM is
(beeps and pause) once and the BIOS will found.
continue to boot.
Memory error On-off (1.0 second each) three times, then 932 Hz
2.5-second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
Thermal trip warning Alternate high and low beeps (1.0 second each) High beep 2000 Hz
for eight beeps, followed by system shut down. Low beep 1500 Hz
69
4.1.2 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error code describing the problem (see Table 39).
Table 39. Front-panel Power LED Blink Codes

Type Pattern Note
F2 Setup/F10 Boot Menu None
Prompt
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error On-off (1.0 second each) two times, then When no VGA option ROM is
2.5-second pause (off), entire pattern repeats found.
(blink and pause) until the system is powered
off.
Memory error On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.
4.2 BIOS Error Messages

The BIOS also displays error messages during POST. Table 40 lists the error
messages and provides a brief description of each.
Table 40. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
70
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop
Board DB85FL:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards

Intel Desktop Board DB85FL complies with the safety standards stated in Table 41
when correctly installed in a compatible host system.
Table 41. Safety Standards

Standard Title
CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (International)
71
5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DB85FL is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC
(ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC,

2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.
72
Regulatory Compliance and Battery Disposal Information
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,

2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.
5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
printed wiring board assembly and lithium battery.
73
5.1.4 China RoHS

Intel Desktop Board DB85FL is a China RoHS-compliant product.
The China Ministry of Information Industry (MII) stipulates that a material Self
Declaration Table (SDT) must be included in a product’s user documentation. The SDT
for Intel Desktop Board DB85FL is shown in Figure 17.
Figure 17. Intel Desktop Board DB85FL China RoHS Material

Self Declaration Table
74
5.1.5 EMC Regulations

Intel Desktop Board DB85FL complies with the EMC regulations stated in Table 42
when correctly installed in a compatible host system.
Table 42. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022 Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022 Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and
Methods of Measurement. (International)
VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.
(Japan)
KN-22, KN-24 Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)
FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
75
• Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.
Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.
Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.
76
5.1.6 e-Standby and ErP Compliance

Intel Desktop Board DB85FL allows for a compliant system built to meet the following
program requirements, including appropriate selection of an efficient power supply:
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive (ErP) Lot 6, Tier 2

Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable-
product-policy/ecodesign/index_en.htm
77
5.1.7 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DB85FL has the regulatory compliance marks shown in Table 43.
Table 43. Regulatory Compliance Marks

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Desktop Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to the European Union (EU) EMC directive,

Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio

Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent KCC (Korean Communications

Commission) certification number:
KCC-REM-CPU-DB85FL.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
78
5.2 Battery Disposal Information

CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
79
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
80
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
81
小心
如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保
規範來處理使用過的電池。
주의
배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야
하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다.
THẬN TRỌNG
Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể
thực hiện được. Việc thải bỏ pin đã sử dụng phải tuân theo các quy định của địa
phương về môi trường.
82
83
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Intel® Desktop Board

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,

Device Stepping S-Spec Numbers

Specification Changes or Clarifications

Specification Changes or Clarifications

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

5 Regulatory Compliance and Battery Disposal Information

14. Dual-Port Front Panel USB 2.0 Header................................................. 44

Table 1. Feature Summary

Table 1. Feature Summary (continued)

1.1.2 Board Layout

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

1.1.3 Block Diagram

Figure 2. Block Diagram

1.2 Online Support

Supported processors http://processormatch.intel.com

For information about… Refer to:

1.3.1 Processor Graphics Subsystem

1.3.1.1 Intel® High Definition (Intel® HD) Graphics

1.3.1.2 Digital Visual Interface (DVI-I)

Table 3. DVI Port Status Conditions

1.3.1.3 High Definition Multimedia Interface* (HDMI*)

Table 4. HDMI Port Status Conditions

1.3.1.4 High-bandwidth Digital Content Protection (HDCP)

1.3.1.5 Integrated Audio Provided by the HDMI Interface

1.3.1.6 Multiple Display Configurations

1.3.1.7 PCI Express Graphics

1.4 System Memory

Table 5 lists the supported DIMM configurations.

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1.4.1 Memory Configurations

For information about… Refer to:

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

1.5 Intel® B85 Express Chipset

For information about Refer to

1.5.1 Direct Media Interface (DMI)

For information about Refer to

1.5.3 SATA Interfaces

For information about Refer to

1.5.3.1 Intel® Rapid Storage Technology

1.6 Real-Time Clock Subsystem

1.7 Super I/O Controller

1.8 Audio Subsystem

Table 6. Audio Jack Support

1.8.1 Audio Subsystem Software

For information about Refer to

1.8.2 Audio Subsystem Components

Figure 4. Back Panel Audio Connectors

For information about Refer to

1.8.2.1 S/PDIF Header

1.8.2.2 Internal Mono Speaker Header

1.9 LAN Subsystem

For information about Refer to

1.9.1 Intel® I217V Gigabit Ethernet Controller