Quectel EG91 Series Hardware Design V2.0

EG91 Series
Hardware Design
LTE Standard Module Series
Version: 2.0
Date: 2021-07-01
Status: Released
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Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives

and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.
About the Document
Revision History
Version Date Author Description
Barret XIONG/
1.0 2017-03-22 Initial
Rex WANG
1. Added band B28A.
2. Updated the description of UMTS and GSM
features in Table 2.
3. Updated the functional diagram in Figure 1.
4. Updated module operating frequencies in
Table 21.
5. Updated current consumption in Table 26.
6. Updated RF output power in Table 27.
Barret XIONG/
1.1 2018-01-23 7. Updated the conducted RF receiving
Rex WANG
sensitivity in Table 28.
8. Updated the GPRS multi-slot classes in
Table 33.
9. Added thermal consideration in Chapter 5.8
10. Added a GND pad in each of the four corners
of the module’s footprint in Chapter 6.2.
11. Updated storage information in Chapter 7.1.
12. Added packaging information in Chapter 7.3.
1. Added the description of EG91-NA.
2. Updated the functional diagram in Figure 1.
3. Updated pin assignment in Figure 2.
4. Updated GNSS function in Table 1.
Barret XIONG/ 5. Updated GNSS Features in Table 2.
1.2 2018-03-14
Rex WANG 6. Updated reference circuit of USB interface
in Figure 21.
7. Added description of GNSS receiver in
Chapter 4.
8. Updated pin definition of RF antenna in
Table 21.
9. Updated module operating frequencies in
Table 22.
10. Added description of GNSS antenna
interface in Chapter 5.2.
11. Updated antenna requirements in Table 25.
12. Updated RF output power in Table 32.
1. Added new variants EG91-NS, EG91-V,
EG91-EC and related contents.
2. Opened pin 24 as ADC0 and added related
contents.
3. Updated functional diagram (Figure 1)
4. Updated pin assignment (Figure 2)
5. Updated GNSS features (Table 2)
6. Added USB_BOOT interface information
Barret XIONG/ (Chapter 3.18)
1.3 2019-02-03
Rex WANG 7. Updated storage information (Chapter 8.1)
8. Updated module operating frequencies
(Table 23)
9. Updated antenna requirements (Table 26)
10. Added current consumption of EG91-NS,
EG91-V and EG91-EC (Table 32, 33 and 34)
11. Added conducted RF receiving sensitivity of
EG91-NS, EG91-V and EG91-EC (Table 40,
41 and 42)
1. Modified module name EG91-EC to
EG91-EX, and EG91-V to EG91-VX
Barret XIONG/ 2. Added newly supported 9.x of Android USB
1.4 2019-03-29
Rex WANG serial driver (Table 2)
3. Modified the reflow temperature range as .
238ºC to 245ºC (Chapter 8.2)
1. Updated comment of RF antenna (Table 4)
2. Updated EG91-EX current consumption
Barret XIONG/
1.5 2019-05-24 (Table 36)
Rex WANG
3. Updated EG91-EX conducted RF receiving
sensitivity (Table 44)
1. Updated supported protocols (Table 2).
2. Updated timing of turning on module (Figure
12).
Barret XIONG/ 3. DFOTA is developed.
1.6 2019-07-05
Rex WANG 4. Updated description of USB_BOOT
interface and timing sequence for entering
emergency download mode (Chapter 3.18
and Figure 29).
1. Added ThreadX variant EG91-NAX and

updated related contents (Table 1 and 4,
Chapter 2.2, 2.3, 3.2 and 5).
2. Added related notes of SPI interface not
supported on ThreadX modules (Chapter
3.1, 3.3 and 3.13).
Barret XIONG/ 3. Added current consumption of EG91-NAX
1.7 2019-08-09
Rex WANG (Table 37).
4. Updated EG91-NA conducted RF receiving
sensitivity (Table 41).
5. Updated EG91-NS conducted RF receiving
6. Added EG91-NAX conducted RF receiving
1. Removed related information of ThreadX
OS.
2. Updated the supported USB serial drivers
(Table 2)
Barret XIONG/ 3. Updated the notes for GNSS performance
1.8 2019-11-07
Rex WANG (Chapter 4.2).
4. Updated the AT command be used to disable
the receive diversity (Chapter 5.1.3).
5. Updated the current consumption of
LTE-FDD B13 (Table 43).
1. Removed related information of EG91-NS
module according to product promotion
strategy.
2. Added EG91-AUX and related information
(Table 1, 39 and 48).
3. Added EG91-NAXD and related information
(Table 1, 37 and 47).
4. Updated pin assignment (Top View) (Figure
2)
Barret XIONG/ 5. Updated the AT command for the operation
1.9 2020-10-21
Rex WANG of ANT_MAIN and ANT_DIV (Chapter
5.1.3).
6. Added EG91-EX/-NA/-VX/-NAX/-NAXD/-AUX
bottom dimensons (Figure 43).
7. Added the note about the standard that the
package warpage level of the module
conforms to (Chapter 7.1).
8. Updated top view of the module (Figure 45).
9. Added EG91-EX/-NA/-VX/-NAX/-NAXD/-AUX
bottom view (Figure 47).
10. Updated module storage information

(Chapter 8.1).
11. Updated the cooling down slope of reflow
soldering thermal profile;
Added a note to clarify the precautions if a
conformal coating is necessary for the module
(Chapter 8.2).
1. Added the related information of EG91-NAL
Barret XIONG/ in the whole document.
2.0 2021-07-01
Rex WANG 2. Added the note of BOOT_CONFIG (Chapter
3.3&3.7.1)
Contents
Safety Information ....................................................................................................................................... 3

About the Document ................................................................................................................................... 4
Contents ....................................................................................................................................................... 8
Table Index ................................................................................................................................................. 10
Figure Index ............................................................................................................................................... 12
1 Introduction ........................................................................................................................................ 14
2 Product Concept ................................................................................................................................ 15

2.1. General Description ................................................................................................................. 15
2.2. Key Features ........................................................................................................................... 16
2.3. Functional Diagram ................................................................................................................. 19
2.4. Evaluation Board ..................................................................................................................... 20
3 Application Interfaces ....................................................................................................................... 21

3.2. Pin Assignment ........................................................................................................................ 22
3.3. Pin Description......................................................................................................................... 23
3.4. Operating Modes ..................................................................................................................... 30
3.5. Power Saving........................................................................................................................... 30
3.5.1. Sleep Mode .................................................................................................................... 30
3.5.2. Airplane Mode ................................................................................................................ 33
3.6. Power Supply........................................................................................................................... 34
3.6.1. Power Supply Pins ......................................................................................................... 34
3.6.2. Decrease Voltage Drop .................................................................................................. 34
3.6.3. Reference Design for Power Supply .............................................................................. 36
3.6.4. Monitor the Power Supply .............................................................................................. 36
3.7. Power-on/off Scenarios ........................................................................................................... 36
3.7.1. Turn on Module Using the PWRKEY ............................................................................. 36
3.7.2. Turn off Module .............................................................................................................. 38
3.8. Reset the Module..................................................................................................................... 40
3.9. (U)SIM Interfaces..................................................................................................................... 41
3.10. USB Interface .......................................................................................................................... 44
3.11. UART Interfaces ...................................................................................................................... 45
3.12. PCM and I2C Interfaces .......................................................................................................... 47
3.13. SPI Interface ............................................................................................................................ 50
3.14. Network Status Indication ........................................................................................................ 51
3.15. STATUS ................................................................................................................................... 52
3.16. ADC Interface .......................................................................................................................... 52
3.17. Behaviors of RI ........................................................................................................................ 53
3.18. USB_BOOT Interface .............................................................................................................. 54
4 GNSS Receiver ................................................................................................................................... 56

4.2. GNSS Performance ................................................................................................................. 56
4.3. Layout Guidelines .................................................................................................................... 57
5 Antenna Interfaces............................................................................................................................. 58
5.1. Main/Rx-diversity Antenna Interfaces...................................................................................... 58
5.1.1. Pin Definition .................................................................................................................. 58
5.1.2. Operating Frequency ..................................................................................................... 59
5.1.3. Reference Design of RF Antenna Interface ................................................................... 60
5.2. GNSS Antenna Interface ......................................................................................................... 61
5.3. Reference Design of RF Layout .............................................................................................. 62
5.4. Antenna Installation ................................................................................................................. 64
5.4.1. Antenna Requirement .................................................................................................... 64
5.4.2. Recommended RF Connector for Antenna Installation ................................................. 65
6 Reliability,Radio and Electrical Characteristics ............................................................................. 67

6.1. Absolute Maximum Ratings ..................................................................................................... 67
6.2. Power Supply Ratings ............................................................................................................. 67
6.3. Operating and Storage Temperatures .................................................................................... 68
6.4. Current Consumption .............................................................................................................. 68
6.5. RF Output Power ..................................................................................................................... 81
6.6. RF Receiving Sensitivity .......................................................................................................... 82
6.7. Electrostatic Discharge ............................................................................................................ 86
6.8. Thermal Consideration ............................................................................................................ 87
7 Mechanical Dimensions .................................................................................................................... 89

7.1. Mechanical Dimensions of the Module.................................................................................... 89
7.2. Recommended Footprint ......................................................................................................... 92
7.3. Top and Bottom Views of the Module ..................................................................................... 93
8 Storage, Manufacturing and Packaging .......................................................................................... 95

8.1. Storage .................................................................................................................................... 95
8.2. Manufacturing and Soldering .................................................................................................. 96
8.3. Packaging ................................................................................................................................ 97
9 Appendix References ...................................................................................................................... 100
Table Index
Table 1: Frequency Bands of EG91 Series Module ................................................................................... 15

Table 2: Key Features of EG91 Series Module.......................................................................................... 16
Table 3: Definition of I/O Parameters ......................................................................................................... 23
Table 4: Pin Description ............................................................................................................................. 24
Table 5: Overview of Operating Modes ...................................................................................................... 30
Table 6: Pin Definition of VBAT and GND .................................................................................................. 34
Table 7: Pin Definition of PWRKEY ............................................................................................................ 37
Table 8: Pin Definition of RESET_N........................................................................................................... 40
Table 9: Pin Definition of (U)SIM Interfaces ............................................................................................... 41
Table 10: Pin Definition of USB Interface ................................................................................................... 44
Table 11: Pin Definition of Main UART Interfaces ...................................................................................... 45
Table 12: Pin Definition of Debug UART Interface..................................................................................... 46
Table 13: Pin Definition of PCM and I2C Interfaces .................................................................................. 49
Table 14: Pin Definition of SPI Interface .................................................................................................... 50
Table 15: Pin Definition of Network Status Indicator .................................................................................. 51
Table 16: Working State of Network Status Indicator ................................................................................ 51
Table 17: Pin Definition of STATUS............................................................................................................ 52
Table 18: Pin Definition of ADC Interface ................................................................................................... 52
Table 19: Characteristics of ADC Interface ................................................................................................ 53
Table 20: Default Behaviors of RI .............................................................................................................. 53
Table 21: Pin Definition of USB_BOOT Interface ...................................................................................... 54
Table 22: GNSS Performance .................................................................................................................... 56
Table 23: Pin Definition of RF Antenna ...................................................................................................... 58
Table 24: Module Operating Frequencies .................................................................................................. 59
Table 25: Pin Definition of GNSS Antenna Interface ................................................................................. 61
Table 26: GNSS Frequency ....................................................................................................................... 61
Table 27: Antenna Requirements ............................................................................................................... 64
Table 28: Absolute Maximum Ratings ........................................................................................................ 67
Table 29: Power Supply Ratings ................................................................................................................ 67
Table 30: Operating and Storage Temperatures ........................................................................................ 68
Table 31: EG91-AUX Current Consumption .............................................................................................. 68
Table 32: EG91-E Current Consumption ................................................................................................... 72
Table 33: EG91-EX Current Consumption ................................................................................................. 74
Table 34: EG91-NA Current Consumption ................................................................................................. 76
Table 35: EG91-NAL Current Consumption ............................................................................................... 77
Table 36: EG91-NAX Current Consumption .............................................................................................. 77
Table 37: EG91-NAXD Current Consumption............................................................................................ 79
Table 38: EG91-VX Current Consumption ................................................................................................. 80
Table 39: GNSS Current Consumption of EG91 Series Module ............................................................... 80
Table 40: RF Output Power ........................................................................................................................ 81
Table 41: EG91-AUX Conducted RF Receiving Sensitivity ....................................................................... 82
Table 42: EG91-E Conducted RF Receiving Sensitivity ............................................................................ 83
Table 43: EG91-EX Conducted RF Receiving Sensitivity.......................................................................... 83

Table 44: EG91-NA Conducted RF Receiving Sensitivity.......................................................................... 84
Table 45: EG91-NAL Conducted RF Receiving Sensitivity........................................................................ 84
Table 46: EG91-NAX Conducted RF Receiving Sensitivity ....................................................................... 85
Table 47: EG91-NAXD Conducted RF Receiving Sensitivity .................................................................... 85
Table 48: EG91-VX Conducted RF Receiving Sensitivity.......................................................................... 86
Table 49: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %) ........................ 86
Table 50: Recommended Thermal Profile Parameters .............................................................................. 97
Table 51: Related Documents .................................................................................................................. 100
Table 52: Terms and Abbreviations .......................................................................................................... 100
Figure Index
Figure 1: Functional Diagram ................................................................................................................... 19

Figure 2: Pin Assignment (Top View) ......................................................................................................... 22
Figure 3: Sleep Mode Application via UART .............................................................................................. 31
Figure 4: Sleep Mode Application with USB Remote Wakeup .................................................................. 31
Figure 5: Sleep Mode Application with RI .................................................................................................. 32
Figure 6: Sleep Mode Application without Suspend Function ................................................................... 33
Figure 7: Power Supply Limits during Burst Transmission ........................................................................ 35
Figure 8: Star Structure of Power Supply .................................................................................................. 35
Figure 9: Reference Circuit of Power Supply............................................................................................. 36
Figure 10: Turn on the Module Using Driving Circuit ................................................................................. 37
Figure 11: Turn on the Module Using A Button .......................................................................................... 37
Figure 12: Power-up Timing ....................................................................................................................... 38
Figure 13: Power-down Timing .................................................................................................................. 39
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit ......................................................... 40
Figure 15: Reference Circuit of RESET_N by Using A Button .................................................................. 40
Figure 16: Timing of Resetting the Module ................................................................................................ 41
Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 42
Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 43
Figure 19: Reference Circuit of USB Interface .......................................................................................... 44
Figure 20: Reference Circuit with Translator Chip ..................................................................................... 46
Figure 21: Reference Circuit with Transistor Circuit .................................................................................. 47
Figure 22: Primary Mode Timing ................................................................................................................ 48
Figure 23: Auxiliary Mode Timing ............................................................................................................... 48
Figure 24: Reference Circuit of PCM Application with Audio Codec ......................................................... 49
Figure 25: Reference Circuit of SPI Interface with Peripherals ................................................................. 50
Figure 26: Reference Circuit of Network Status Indication ........................................................................ 51
Figure 27: Reference Circuit of STATUS ................................................................................................... 52
Figure 28: Reference Circuit of USB_BOOT Interface .............................................................................. 54
Figure 29: Emergency Download Mode Timing ......................................................................................... 55
Figure 30: Reference Circuit of RF Antenna Interface ............................................................................... 60
Figure 31: Reference Circuit of GNSS Antenna ........................................................................................ 61
Figure 32: Microstrip Design on a 2-layer PCB ......................................................................................... 62
Figure 33: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 62
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 63
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 63
Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 65
Figure 37: Mechanicals of U.FL-LP Connectors ........................................................................................ 65
Figure 38: Space Factor of Mated Connector (Unit: mm).......................................................................... 66
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) .......................................... 87
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)......................... 88
Figure 41: Module Top and Side Dimensions ............................................................................................ 89
Figure 42: EG91-E Bottom Dimensions (Top View)................................................................................... 90

Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX Bottom Dimensions (Top View) ............................ 91
Figure 44: Recommended Footprint (Top View) ........................................................................................ 92
Figure 45: Top View of the Module............................................................................................................. 93
Figure 46: EG91-E Bottom View ................................................................................................................ 93
Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX Bottom View ......................................................... 94
Figure 48: Recommended Reflow Soldering Thermal Profile ................................................................... 96
Figure 49: Tape Dimensions ...................................................................................................................... 98
Figure 50: Reel Dimensions ....................................................................................................................... 98
Figure 51: Tape and Reel Directions .......................................................................................................... 99
1 Introduction
This document defines the EG91 series module and describes its air interface and hardware interface
which are connected with your applications.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EG91 series module. With application note and
user guide, you can use EG91 series module to design and set up mobile applications easily.
2 Product Concept
2.1. General Description
EG91 series module is an embedded 4G wireless communication module with receive diversity. It
supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD,
DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice
functionality 1 to meet your specific application demands. The following table shows the frequency bands
of EG91 series module.
Table 1: Frequency Bands of EG91 Series Module
LTE Bands WCDMA 2

Module GSM GNSS
(with Rx-diversity) (with Rx-diversity)
GPS,
FDD: GLONASS,
3
850/900/1800/
EG91-AUX B1/B2/B3/B4/B5/B7/B8/ B1/B2/B5/B8 BeiDou,
1900 MHz
B28/B66 Galileo,
QZSS
FDD:
EG91-E B1/B8 900/1800 MHz -
B1/B3/B7/B8/B20/B28A
EG91-EX FDD:B1/B3/B7/B8/B20/B28 B1/B8 900/1800 MHz
EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 -

GPS,
EG91-NAL FDD: B2/B4/B5/B12/B13 - - GLONASS,
FDD: BeiDou,
EG91-NAX B2/B4/B5 -
B2/B4/B5/B12/B13/B25/B26 Galileo,
FDD: QZSS
EG91-NAXD B2/B4/B5 -
B2/B4/B5/B12/B13/B25/B26
EG91-VX FDD: B4/B13 - -
1 EG91 series module contains Data + Voice version and Data-only version. Data + Voice version supports voice and
data functions, while Data-only version only supports data function.
2 GNSS function is optional.
3 EG91-AUX does not support Rx-diversity.
With a compact profile of 29.0 mm × 25.0 mm × 2.3 mm, EG91 series module can meet almost all
requirements for M2M applications such as automotive, smart metering, tracking system, security, router,
wireless POS, mobile computing device, PDA phone, tablet PC, etc.
EG91 series module is an SMD type module which can be embedded into applications through its 106
LGA pins.
EG91 series module is integrated with internet service protocols like TCP, UDP and PPP. Extended AT
commands have been developed for you to use these internet service protocols easily.
2.2. Key Features
The following table describes the detailed features of EG91 series module.
Table 2: Key Features of EG91 Series Module
Feature Details
⚫ Supply voltage: 3.3–4.3 V

Power Supply
⚫ Typical supply voltage: 3.8 V
⚫ Class 4 (33 dBm ±2 dB) for GSM850
⚫ Class 4 (33 dBm ±2 dB) for EGSM900
⚫ Class 1 (30 dBm ±2 dB) for DCS1800
⚫ Class 1 (30 dBm ±2 dB) for PCS1900
⚫ Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
Transmitting Power
⚫ Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
⚫ Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
⚫ Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
⚫ Class 3 (24 dBm +1/-3 dB) for WCDMA bands
⚫ Class 3 (23 dBm ±2 dB) for LTE-FDD bands
⚫ Support up to non-CA Cat 1 FDD
LTE Features ⚫ Support 1.4/3/5/10/15/20 MHz RF bandwidth
⚫ LTE-FDD: Max. 10 Mbps (DL), Max. 5 Mbps (UL)
⚫ Support 3GPP Rel-8 DC-HSDPA, HSPA+, HSDPA, HSUPA and
WCDMA
⚫ Support QPSK, 16QAM and 64QAM modulation
UMTS Features
⚫ DC-HSDPA: Max. 42 Mbps (DL)
⚫ HSUPA: Max. 5.76 Mbps (UL)
⚫ WCDMA: Max. 384 kbps (DL), Max. 384 kbps (UL)
R99:
GSM Features
⚫ CSD: 9.6 kbps
GPRS:
⚫ Support GPRS multi-slot class 33 (33 by default)
⚫ Coding scheme: CS-1, CS-2, CS-3 and CS-4
⚫ Max. 107 kbps (DL), Max. 85.6 kbps (UL)
EDGE:
⚫ Support EDGE multi-slot class 33 (33 by default)
⚫ Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
⚫ Downlink coding schemes: MCS 1-9
⚫ Uplink coding schemes: MCS 1-9
⚫ Max. 296 kbps (DL)/Max. 236.8 kbps (UL)
⚫ Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/
Internet Protocol Features NITZ/MMS/SMTP/SSL/MQTT/FILE/CMUX/SMTPS protocols
⚫ Support PAP and CHAP protocols for PPP connections
⚫ Text and PDU modes
⚫ Point-to-point MO and MT
SMS
⚫ SMS cell broadcast
⚫ SMS storage: ME by default
(U)SIM Interfaces ⚫ Support 1.8 V and 3.0 V (U)SIM cards
⚫ Support one digital audio interface: PCM interface

⚫ GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features ⚫ WCDMA: AMR/AMR-WB
⚫ LTE: AMR/AMR-WB
⚫ Support echo cancellation and noise suppression
⚫ Used for audio function with external codec
⚫ Support 16-bit linear data format
PCM Interface ⚫ Support long frame synchronization and short frame synchronization
⚫ Support master and slave mode, but must be the master in long frame
synchronization
⚫ Compliant with USB 2.0 specification (slave only); the data transfer
rate can reach up to 480 Mbps
⚫ Used for AT command communication, data transmission, GNSS
USB Interface NMEA sentences output, software debugging, firmware upgrade and
voice over USB
⚫ Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6–5.4,
Android 4.x–11.x, etc.
Main UART:
⚫ Used for AT command communication and data transmission
⚫ Baud rates reach up to 921600 bps, 115200 bps by default
UART Interface ⚫ Support RTS and CTS hardware flow control
Debug UART:
⚫ Used for Linux console and log output
⚫ 115200 bps baud rate
⚫ Provides a duplex, synchronous and serial communication link with the

peripheral devices.
SPI Interface
⚫ Dedicated to one-to-one connection, without chip selection.
⚫ 1.8 V operation voltage with clock rates up to 50 MHz.
Rx-diversity ⚫ Support LTE/WCDMA Rx-diversity
⚫ Protocol: NMEA 0183

GNSS Features
⚫ Data update rate: 1 Hz by default
⚫ Compliant with 3GPP TS 27.007 and 3GPP TS 27.005
AT Commands
⚫ Quectel enhanced AT commands
Network Indication ⚫ NETLIGHT pin for network activity status indication
⚫ Main antenna interface (ANT_MAIN),

Antenna Interfaces ⚫ Rx-diversity antenna (ANT_DIV) 4
⚫ GNSS antenna (ANT_GNSS) 5
⚫ Size: (29.0 ±0.15) mm × (25.0 ±0.15) mm × (2.3 ±0.2) mm
Physical Characteristics ⚫ Package: LGA
⚫ Weight: approx. 3.8 g
⚫ Operating temperature range: -35 °C to +75 °C 6
Temperature Range ⚫ Extended temperature range: -40 °C to +85 °C 7
⚫ Storage temperature range: -40 °C to +90 °C

⚫ USB interface
Firmware Upgrade
⚫ DFOTA
RoHS ⚫ All hardware components are fully compliant with EU RoHS directive

5 GNSS antenna interface is only supported on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX.
6 Within operating temperature range, the module is 3GPP compliant.
7 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data
transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio
network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the
temperature returns to normal operating temperature levels, the module will meet 3GPP specifications again.
2.3. Functional Diagram
The following figure shows a block diagram of EG91 series module and illustrates the major functional
parts.
⚫ Power management
⚫ Baseband
⚫ DDR + NAND flash
⚫ Radio frequency
⚫ Peripheral interfaces
ANT_MAIN ANT_GNSS ANT_DIV
PAM SAW Switch
Duplexer LNA
SAW
VBAT_RF
PA SAW
PRx DRx
GPS
Tx
NAND
Transceiver DDR2
SDRAM
IQ Control
VBAT_BB
PMIC
Control
PWRKEY
RESET_N
Baseband
STATUS
NETLIGHT 19.2M
XO
VDD_EXT USB (U)SIM1 (U)SIM2 PCM I2C SPI UART GPIOs
8
Figure 1: Functional Diagram
8GNSS antenna is supported on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX. Rx-diversity antenna is supported on

EG91-E/-EX/-NA/-NAL/-NAX/-NAXD/-VX, and is not supported on EG91-AUX.
2.4. Evaluation Board
Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 series module.
The evaluation tool kit includes the evaluation board (UMTS&LTE EVB), a USB to RS-232 converter
cable, an earphone, antennas and other peripherals. For more details, see document [1].
3 Application Interfaces
EG91 series module is equipped with 106 LGA pins that can be connected to your cellular application
platforms. Sub-interfaces included in these pads are described in detail in the following chapters:
⚫ Power supply
⚫ (U)SIM interfaces
⚫ USB interface
⚫ UART interfaces
⚫ PCM and I2C interfaces
⚫ SPI interface
⚫ Network status indication
⚫ ADC interface
⚫ USB_BOOT interface
3.2. Pin Assignment
The following figure shows the pin assignment of EG91 series module.
(EG91-EX/-NA/-NAL-NAX/-NAXD/-VX)
RESERVED (EG91-E)/ANT_DIV
ANT_MAIN
VBAT_RF
VBAT_RF
GND
GND
GND
GND
GND
GND
GND
NC
NC
103 106
55
53
50
62
61
60
59
58
54
52
51
56
57
ANT_DIV (EG91-E)/ANT_GNSS
(EG91-AUX/-EX/-NA/-NAL/-NAX/
NC 1 49 -NAXD/-VX)
NC 2 48 GND
82 81 80 79
GND 3 47 USIM_GND
PCM_CLK 4 102 101 100 99 46 USIM1_CLK
PCM_SYNC 5 45 USIM1_DATA
63 83 USIM2_PRESENCE 98 78
PCM_DIN 6 44 USIM1_RST
PCM_DOUT 7 43 USIM1_VDD
64 84 USIM2_CLK 97 77
USB_VBUS 8 42 USIM1_PRESENCE
USB_DP 9 65 85 USIM2_RST 96 76 41 I2C_SDA

USB_DM 10 40 I2C_SCL
66 86 USIM2_DATA 95 75 USB_BOOT
NC 11 39 RI
67 87 USIM2_VDD 94 74
NC 12 38 DCD
NC 13 68 88 93 73 37 RTS
NC 14 36 CTS
89 90 91 92
PWRKEY 15 35 TXD
NC 16 34 RXD
69 70 71 72
RESET_N 17 33 VBAT_BB
W_DISABLE# 18 32 VBAT_BB
19
20
21
25
26
29
30
22
23
24
27
28
31
104 105
RESERVED
DBG_TXD
SPI_CLK
SPI_MISO
NETLIGHT
DBG_RXD
DTR
AP_READY
ST ATUS
SPI_MOSI
ADC0
GND
VDD_EXT
POWER USB UART (U)SIM PCM SPI ANT GND NC RESERVED OTHERS
Figure 2: Pin Assignment (Top View)
NOTE
1. PWRKEY output voltage is 0.8 V because of the diode drop in the baseband chipset.
2. Keep all RESERVED pins and unused pins unconnected.
3. GND pins should be connected to ground in the design.
4. Pin 49 is defined as ANT_GNSS on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX, while it is defined
as ANT_DIV on EG91-E.
5. Pin 56 is RESERVED on EG91-E, while it is defined as ANT_DIV on EG91-EX/-NA/-NAL/-NAX/
-NAXD/-VX. Rx-diversity antenna is not supported on EG91-AUX.
3.3. Pin Description
The following tables show the pin definition and description of EG91 series module.
Table 3: Definition of I/O Parameters
Type Description
AI Analog Input
AO Analog Output
AIO Analog Input/Output
DI Digital Input
DO Digital Output
DIO Digital Input/Output
OD Open Drain
PI Power Input
PO Power Output
Table 4: Pin Description
Power Supply
Pin DC
Pin Name I/O Description Comment
No. Characteristics
Power supply for the Vmax = 4.3 V It must be provided with
VBAT_BB 32, 33 PI module’s baseband Vmin = 3.3 V sufficient current up to
part Vnom = 3.8 V 0.8 A.
It must be provided with
Vmax = 4.3 V
Power supply for the sufficient current up to
VBAT_RF 52, 53 PI Vmin = 3.3 V
module’s RF part 1.8 A in a burst
Vnom = 3.8 V
transmission.
Power supply for
Provide 1.8 V for Vnom = 1.8 V external GPIO’s pull up
VDD_EXT 29 PO
external circuit IOmax = 50 mA circuits.
If unused, keep it open.
GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67–74, 79–82, 89–91, 100–106
Power-on/off
Pin DC
No. Characteristics
The output voltage is
Turn on/off the 0.8 V because of the
PWRKEY 15 DI VIH = 0.8 V
module diode drop in the
baseband chipset.
Require pull-up resistor
VIHmax = 2.1 V
to 1.8 V internally.
RESET_N 17 DI Reset the module VIHmin = 1.3 V
Active low.
VILmax = 0.5 V
Status Indication
Pin DC
No. Characteristics
Indicate the
STATUS 20 DO module’s operation
status VOHmin = 1.35 V 1.8 V power domain.
Indicate the VOLmax = 0.45 V If unused, keep it open.
NETLIGHT 21 DO module’s network
activity status
USB Interface
Pin DC
No. Characteristics
Vmax = 5.25 V
USB connection Typical value: 5.0 V
USB_VBUS 8 AI Vmin = 3.0 V
detec If unused, keep it open.
Vnom = 5.0 V
USB differential
USB_DP 9 AIO USB 2.0 compliant
data (+)
Require differential
USB differential
USB_DM 10 AIO impedance of 90 Ω.
data (-)
(U)SIM Interfaces
Pin DC
No. Characteristics
Specified ground for Connect to ground of
USIM_GND 47
(U)SIM card (U)SIM card connector.
IOmax = 50 mA
For 1.8 V (U)SIM:

Vmax = 1.9 V Either 1.8 V or 3.0 V is
(U)SIM1 card power
USIM1_VDD 43 PO Vmin = 1.7 V supported by the module
supply
automatically.
For 3.0 V (U)SIM:
Vmax = 3.05 V
Vmin = 2.7 V
For 1.8 V (U)SIM:
VILmax = 0.6 V
VIHmin = 1.2 V
VOLmax = 0.45 V
VOHmin = 1.35 V
USIM1_DATA 45 DIO (U)SIM1 card data
For 3.0 V (U)SIM:
VILmax = 1.0 V
VIHmin = 1.95 V
VOLmax = 0.45 V
VOHmin = 2.55 V
USIM1_CLK 46 DO (U)SIM1 card clock For 1.8 V (U)SIM:

VOLmax = 0.45 V
VOHmin = 1.35 V
USIM1_RST 44 DO (U)SIM1 card reset For 3.0 V (U)SIM:

VOLmax = 0.45 V
VOHmin = 2.55 V
VILmin = -0.3 V
USIM1_ (U)SIM1 card VILmax = 0.6 V 1.8 V power domain.
42 DI
PRESENCE insertion detection VIHmin = 1.2 V If unused, keep it open.
VIHmax = 2.0 V
For 1.8 V (U)SIM:

Vmax = 1.9 V
Vmin = 1.7 V
Either 1.8 V or 3.0 V is
(U)SIM2 card power supported by the module
USIM2_VDD 87 PO For 3.0 V (U)SIM:
supply automatically.
Vmax = 3.05 V
Vmin = 2.7 V
IOmax = 50 mA
For 1.8 V (U)SIM:
VILmax = 0.6 V
VIHmin = 1.2 V
VOLmax = 0.45 V
VOHmin = 1.35 V
For 3.0 V (U)SIM:
VILmax = 1.0 V
VIHmin = 1.95 V
VOLmax = 0.45 V
VOHmin = 2.55 V
For 1.8 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 1.35 V
USIM2_CLK 84 DO (U)SIM2 card clock
For 3.0 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 2.55 V
For 1.8 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 1.35 V
USIM2_RST 85 DO (U)SIM2 card reset
For 3.0 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 2.55 V
VILmin = -0.3 V
USIM2_ (U)SIM2 card VILmax = 0.6 V 1.8 V power domain.
83 DI
PRESENCE insertion detection VIHmin = 1.2 V If unused, keep it open.
VIHmax = 2.0 V
Main UART Interface
Pin DC
No. Characteristics
RI 39 DO Ring indication VOLmax = 0.45 V 1.8 V power domain.
DCD 38 DO Data carrier detect VOHmin = 1.35 V If unused, keep it open.
CTS 36 DO Clear to send
RTS 37 DI Request to send

VILmin = -0.3 V
1.8 V power domain.
VILmax = 0.6 V
Pulled up by default.
Data terminal ready VIHmin = 1.2 V
DTR 30 DI Low level wakes up the
Sleep mode control VIHmax = 2.0 V
module.
VOLmax = 0.45 V
TXD 35 DO Transmit
VOHmin = 1.35 V
VILmin = -0.3 V 1.8 V power domain.
VILmax = 0.6 V If unused, keep it open.
RXD 34 DI Receive
VIHmin = 1.2 V
VIHmax = 2.0 V
Debug UART Interface
Pin DC
No. Characteristics
Debug UART VOLmax = 0.45 V
DBG_TXD 23 DO
transmit VOHmin = 1.35 V
VILmin = -0.3 V 1.8 V power domain.
Debug UART VILmax = 0.6 V If unused, keep it open.
DBG_RXD 22 DI
receive VIHmin = 1.2 V
VIHmax = 2.0 V
PCM Interface
Pin DC
No. Characteristics
VILmin = -0.3 V
VILmax = 0.6 V
PCM_DIN 6 DI PCM data input
VIHmin = 1.2 V 1.8 V power domain.
VIHmax = 2.0 V If unused, keep it open.
VOLmax = 0.45 V
PCM_DOUT 7 DO PCM data output
VOHmin = 1.35 V
PCM data frame VOLmax = 0.45 V 1.8 V power domain. In
PCM_SYNC 5 DIO
sync VOHmin = 1.35 V master mode, it is an
VILmin = -0.3 V output signal. In slave
VILmax = 0.6 V mode, it is an input
PCM_CLK 4 DIO PCM data clock
VIHmin = 1.2 V signal.
VIHmax = 2.0 V If unused, keep it open.
I2C Interface
Pin DC
No. Characteristics
I2C serial clock (for
I2C_SCL 40 OD An external pull-up to
external codec)
1.8 V is required.
I2C serial data
I2C_SDA 41 OD If unused, keep it open.
(for external codec)
ADC Interface
Pin DC
No. Characteristics
General-purpose Voltage range:
ADC0 24 AI If unused, keep it open.
ADC interface 0.3 V to VBAT_BB
SPI Interface
Pin DC
No. Characteristics
SPI_CLK 26 DO SPI clock

VOLmax = 0.45 V
SPI master-out VOHmin = 1.35 V
SPI_MOSI 27 DO
slave-in 1.8 V power domain.
VILmin = -0.3 V If unused, keep it open.
SPI master-in VILmax = 0.6 V
SPI_MISO 28 DI
slave-out VIHmin = 1.2 V
VIHmax = 2.0 V
RF Interfaces
Pin DC
No. Characteristics
9
GNSS antenna 50 Ω impedance.
ANT_GNSS 49 AI
interface If unused, keep it open.
10
Diversity antenna 50 Ω impedance.
ANT_DIV 56 AI
interface If unused, keep it open.
9 Pin 49 is defined as ANT_GNSS on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX, while it is defined as ANT_DIV on

EG91-E.
10 Pin 56 is RESERVED on EG91-E, while is defined as ANT_DIV on EG91-EX/-NA/-NAL/-NAX/-NAXD/-VX. Rx-diversity
antenna is not supported on EG91-AUX.
Main antenna
ANT_MAIN 60 AIO 50 Ω impedance.
Interface
Other Pins
Pin DC
No. Characteristics
1.8 V power domain.
VILmin = -0.3 V Pull-up by default.
Airplane mode VILmax = 0.6 V At low voltage level,
W_DISABLE# 18 DI
control VIHmin = 1.2 V module can enter
VIHmax = 2.0 V airplane mode.
VILmin = -0.3 V
Application VILmax = 0.6 V 1.8 V power domain.
AP_READY 19 DI
processor ready VIHmin = 1.2 V If unused, keep it open.
VIHmax = 2.0 V
VILmin = -0.3 V
Force the module to 1.8 V power domain.
VILmax = 0.6 V
USB_BOOT 75 DI enter emergency It is recommended to
VIHmin = 1.2 V
download mode reserve the test points.
VIHmax = 2.0 V
NC and RESERVED Pins
Pin DC
No. Characteristics
Keep these pins
NC 1, 2, 11–14, 16, 51, 57, 63–66, 76–78, 88, 92–99
unconnected.
Keep these pins
unconnected.
RESERVED 25, 56
Pin 56 is only reserved
on EG91-E.
NOTE
1. Keep all RESERVED pins and unused pins unconnected.

2. BOOT_CONFIG pins (SPI_CLK, USB_BOOT, PCM_CLK, PCM_SYNC) cannot be pulled up before
startup.
3.4. Operating Modes
The table below briefly outlines the operating modes to be mentioned in the following chapters.
Table 5: Overview of Operating Modes
Mode Details
Software is active. The module has registered on network, and it is

Idle
Normal ready to send and receive data.
Operation Network is connected. In this mode, the power consumption is decided
Talk/Data
by network setting and data transfer rate.
Airplane AT+CFUN=4 or W_DISABLE# pin can set the module to enter airplane mode. In this
Mode case, RF function will be invalid.
Minimum
AT+CFUN=0 can set the module to a minimum functionality mode without removing the
Functionality
power supply. In this case, both RF function and (U)SIM card will be invalid.
Mode
In this mode, the current consumption of the module will be reduced to the minimal
Sleep Mode level. During this mode, the module can still receive paging message, SMS, voice call
and TCP/UDP data from the network normally.
In this mode, the power management unit shuts down the power supply. Software is
Power Down
goes inactive. The serial interface is not accessible. Operating voltage (connected to
Mode
VBAT_RF and VBAT_BB) remains applied.
For details of the above AT command, see document [3].
3.5. Power Saving
3.5.1. Sleep Mode
EG91 series module is able to reduce its current consumption to a minimum value during the sleep mode.
The following sub-chapters describe the power saving procedures of EG91 series module.
3.5.1.1. UART Application
If the host communicates with the module via UART interface, the following preconditions can let the
module enter sleep mode.
⚫ Execute AT+QSCLK=1 to enable sleep mode.

⚫ Drive DTR to high level.
The following figure shows the connection between the module and the host.
Module Host
RXD TXD
TXD RXD
RI EINT
DTR GPIO
AP_READY GPIO
GND GND
Figure 3: Sleep Mode Application via UART
Driving the host DTR to low level will wake up the module.
⚫ When EG91 series module has a URC to report, RI signal will wake up the host. See Chapter 3.17
for details about RI behavior.
⚫ AP_READY will detect the sleep state of host (can be configured to high level or low level detection).
See AT+QCFG="apready" for details.
3.5.1.2. USB Application with USB Remote Wakeup Function
If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions
must be met to let the module enter sleep mode.

⚫ Ensure the DTR is held at high level or keep it open.
⚫ The host’s USB bus, which is connected with the module’s USB interface, enters suspend state.
Module Host
USB_VBUS VDD
USB_DP USB_DP
USB_DM USB_DM
AP_READY GPIO
GND GND
Figure 4: Sleep Mode Application with USB Remote Wakeup
⚫ Sending data to EG91 series module through USB will wake up the module.
⚫ When EG91 series module has a URC to report, the module will send remote wakeup signals via
USB bus to wake up the host.
3.5.1.3. USB Application with USB Suspend/Resume and RI Function
If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is
needed to wake up the host.
There are three preconditions to let the module enter sleep mode.

⚫ The host’s USB bus, which is connected with the module’s USB interface, enters suspended state.
Module Host
USB_VBUS VDD
USB_DP USB_DP
USB_DM USB_DM
AP_READY GPIO
RI EINT
GND GND
Figure 5: Sleep Mode Application with RI
⚫ Sending data to EG91 series module through USB will wake up the module.
⚫ When module has a URC to report, RI signal will wake up the host.
3.5.1.4. USB Application without USB Suspend Function
If the host does not support USB suspend function, USB_VBUS should be disconnected with an external
control circuit to let the module enter sleep mode.

⚫ Disconnect USB_VBUS.
Module Host
GPIO
Power
USB_VBUS Switch VDD
USB_DP USB_DP
USB_DM USB_DM
RI EINT
AP_READY GPIO
GND GND
Figure 6: Sleep Mode Application without Suspend Function
Switching on the power switch to supply power to USB_VBUS will wake up the module.
NOTE
1. Pay attention to the level match shown in dotted line between the module and the host. Refer to
document [2] for more details about EG91 series module power management application.
2. For details of AT+QSCLK, see document [3].
3. For details of AT+QCFG, see document [5] .
3.5.2. Airplane Mode
When the module enters airplane mode, the RF function will be disabled, and all AT commands related to
it will be inaccessible. This mode can be set via the following ways.
Hardware:
The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane
mode.
Software:
AT+CFUN=<fun> provides the choice of the functionality level through setting <fun> as 0, 1 or 4.
⚫ AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.
⚫ AT+CFUN=1: Full functionality mode (by default).
⚫ AT+CFUN=4: Airplane mode. RF function is disabled.
NOTE
1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by
AT+QCFG="airplanecontrol".
2. The execution of AT+CFUN will not affect GNSS function.
3.6. Power Supply
3.6.1. Power Supply Pins
EG91 series module provides four VBAT pins for connection with an external power supply. There are two
separate voltage domains for VBAT.
⚫ Two VBAT_RF pins for module’s RF part.

⚫ Two VBAT_BB pins for module’s baseband part.
The following table shows the details of VBAT pins and ground pins.
Table 6: Pin Definition of VBAT and GND
Pin Name Pin No. Description Min. Typ. Max. Unit
Power supply for the

VBAT_RF 52, 53 3.3 3.8 4.3 V
module’s RF part.
Power supply for the
VBAT_BB 32, 33 3.3 3.8 4.3 V
module’s baseband part.
3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67–74,
GND - 0 - V
79–82, 89–91, 100–106
3.6.2. Decrease Voltage Drop
The power supply range of the module is from 3.3 V to 4.3 V. Please make sure that the input voltage will
never drop below 3.3 V. The following figure shows the voltage drop during burst transmission in 2G
network. The voltage drop will be less in 3G and 4G networks.
Burst Burst
Transmission Transmission
VBAT Ripple
Drop
Figure 7: Power Supply Limits during Burst Transmission
To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be
used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low
ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC
array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an
external application has to be a single voltage source and can be expanded to two sub paths with star
structure. The width of VBAT_BB trace should be no less than 1 mm, and the width of VBAT_RF trace
should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be.
In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS
diode with low reverse stand-off voltage VRWM (4.5 V), low clamping voltage VC and high reverse peak
pulse current IPP should be used. The following figure shows the star structure of the power supply.
VBAT
VBAT_RF
VBAT_BB
+ +
D1 C1 C2 C3 C4 C5 C6 C7 C8
WS4.5D3HV 100 μF 100 nF 33 pF 10 pF 100 μF 100 nF 33 pF 10 pF
Module
Figure 8: Star Structure of Power Supply
3.6.3. Reference Design for Power Supply
Power design for the module is very important, as the performance of the module largely depends on the
power source. The power supply should be able to provide sufficient current up to 2 A at least. If the
voltage drop between the input and output is not too high, it is suggested that an LDO should be used to
supply power for the module. If there is a big voltage difference between the input source and the desired
output (VBAT), a buck converter is preferred to be used as the power supply.
The following figure shows a reference design for +5 V input power source. The typical output of the
power supply is about 3.8 V and the maximum load current is 3 A.
MIC29302WU
DC_IN VBAT
2 4
IN OUT
GND
ADJ
EN
100K
1%
1
51K
5
4.7K 470R
470 μF 100 nF
470 μF 100 nF
47K
VBAT_EN 47K 1%
Figure 9: Reference Circuit of Power Supply
NOTE
To avoid damaging internal flash, do not switch off the power supply when the module works normally.
Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off.
3.6.4. Monitor the Power Supply
AT+CBC can be used to monitor the VBAT_BB voltage value. For more details, refer to document [3].
3.7. Power-on/off Scenarios
3.7.1. Turn on Module Using the PWRKEY
The following table shows the pin definition of PWRKEY.
Table 7: Pin Definition of PWRKEY
Pin Name Pin No. Description Comment
The output voltage is 0.8 V because of

PWRKEY 15 Turn on/off the module
the diode drop in the baseband chipset.
When EG91 series module is in power down mode, it can be turned on to normal mode by driving the
PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to
control the PWRKEY. After STATUS pin outputting a high level, PWRKEY pin can be released. A simple
reference circuit is illustrated in the following figure.
PWRKEY
≥ 500 ms
4.7K
10 nF
Turn-on pulse
47K
Figure 10: Turn on the Module Using Driving Circuit
Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike
may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the
button for ESD protection. A reference circuit is shown in the following figure.
S1
PWRKEY
TVS
Close to S1
Figure 11: Turn on the Module Using A Button
The power-up scenario is illustrated in the following figure.
NOTE 1
VBAT ≥ 500 ms
VIH = 0. 8 V
PWRKEY VIL ≤ 0.5 V

About 100 ms
VDD_EXT
≥ 100 ms. After this time, the BOOT_CONFIG
pins can be set to high level by external circuit.
BOOT_CONFIG &
USB_BOOT Pins
RESET_N
≥ 10 s
STATUS
(DO)
≥ 12 s
UART I nactive Active
≥ 13 s
USB I nactive Active
Figure 12: Power-up Timing
NOTE
1. Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less
than 30 ms.
2. PWRKEY can be pulled down directly to GND with a recommended 10 kΩ resistor if the module
needs to be powered on automatically and shutdown is not needed.
3. BOOT_CONFIG pins (SPI_CLK, USB_BOOT, PCM_CLK, PCM_SYNC) cannot be pulled up
before startup.
3.7.2. Turn off Module
Either of the following methods can be used to turn off the module normally:
⚫ Use the PWRKEY pin.

⚫ Use AT+QPOWD command.
3.7.2.1. Turn off Module Using the PWRKEY Pin
Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-off
procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure.
VBAT
≥ 650 ms ≥ 30 s
PWRKEY
STATUS
Module Running Power-down procedure OFF

Status
Figure 13: Power-down Timing
3.7.2.2. Turn off Module Using AT Command
It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module
via PWRKEY pin.
See document [3] for details about the AT+QPOWD.
NOTE
1. To avoid damaging internal flash, do not switch off the power supply when the module works
normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be
cut off.
2. When turning off module with the AT command, keep PWRKEY at high level after the execution of
the command. Otherwise, the module will be turned on again after being shut down.
3.8. Reset the Module
The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a
low level voltage for 150–460 ms.
Table 8: Pin Definition of RESET_N
Pin Name Pin No. Description Comment
Require pull-up resistor to 1.8 V internally.

RESET_N 17 Reset the module Active low.
The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button
can be used to control the RESET_N.
RESET_N
150–460 ms
4.7K
Reset pulse
47K
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit
S2
RESET_N
TVS
Close to S2
Figure 15: Reference Circuit of RESET_N by Using A Button
The reset scenario is illustrated in the following figure.
VBA T
460 ms
150 ms
RESET_N VIH 1.3 V
VIL 0.5 V
Module
Running Resetting Restart
Status
Figure 16: Timing of Resetting the Module
NOTE
1. Use RESET_N only when turning off the module by AT+QPOWD and PWRKEY pin are failed.
2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.
3.9. (U)SIM Interfaces
EG91 series module provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The
(U)SIM1 and (U)SIM2 cards can be switched by AT+QDSIM. For more details, refer to document [3].
The (U)SIM interfaces circuitry meet ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM
cards are supported.
Table 9: Pin Definition of (U)SIM Interfaces
Pin Name Pin No. I/O Description Comment
Connect to ground of
USIM_GND 47 Specified ground for (U)SIM card
(U)SIM card connector.
USIM1_VDD 43 PO (U)SIM1 card power supply supported by the module
automatically.
USIM1_ 1.8 V power domain.

42 DI (U)SIM1 card insertion detection
PRESENCE If unused, keep it open.
supported by the module
USIM2_VDD 87 PO (U)SIM2 card power supply
automatically.
USIM2_ 1.8 V power domain.

83 DI (U)SIM2 card insertion detection
PRESENCE If unused, keep it open.
EG91 series module supports (U)SIM card hot-plug via USIM_PRESENCE (USIM1_PRESENCE/USIM2
_PRESENCE) pin, and both high and low level detection are supported. The function is disabled by
default, and see AT+QSIMDET in document [3] for more details.
The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
VDD_EXT USIM_VDD
51K 15K
USIM_GND 100 nF (U)SIM Card Connector
USIM_VDD
VCC GND
USIM_RST 0R
RST VPP
Module USIM_CLK
CLK IO
USIM_PRESENCE 0R
USIM_DATA 0R
GND
33 pF 33 pF 33 pF
GND GND
Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector
If (U)SIM card detection function is not needed, keep USIM_PRESENCE unconnected. A reference circuit
of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
USIM_VDD
15K
USIM_GND 100 nF
(U)SIM Card Connector
USIM_VDD
VCC GND
USIM_RST 0R
RST VPP
Module USIM_CLK
CLK IO
0R
USIM_DATA 0R
33 pF 33 pF 33 pF
GND GND
Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector
To enhance the reliability and availability of the (U)SIM cards in your applications, please follow the
criteria below in the (U)SIM circuit design:
⚫ Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length
as less than 200 mm as possible.
⚫ Keep (U)SIM card signals away from RF and VBAT traces.
⚫ Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1 μF, and place it as
close to (U)SIM card connector as possible. If the ground is complete on your PCB, USIM_GND can
be connected to PCB ground directly.
⚫ To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
⚫ To offer good ESD protection, it is recommended to add a TVS diode array whose parasitic
capacitance should not be more than 15 pF. The 0 Ω resistors should be added in series between the
module and the (U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering
interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the
(U)SIM card connector.
⚫ The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace
and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.
3.10. USB Interface
EG91 series module contains one integrated Universal Serial Bus (USB) interface which complies with
the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes.
The USB interface acts as slave only, and is used for AT command communication, data transmission,
GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB.
The following table shows the pin definition of USB interface.
Table 10: Pin Definition of USB Interface
USB_DP 9 AIO USB differential data (+) USB 2.0 compliant

Require differential
USB_DM 10 AIO USB differential data (-) impedance of 90 Ω.
USB_VBUS 8 AI USB connection detect Typical: 5.0 V
GND 3 Ground
For more details about USB 2.0 specifications, visit http://www.usb.org/home.
The USB interface is recommended to be reserved for firmware upgrade in your design. The following
figure shows a reference circuit of USB interface.
Test Points
Minimize these stubs
Module MCU
R3 NM_0R
VDD R4 NM_0R
USB_VBUS ESD Array
L1 USB_DM
USB_DM
USB_DP USB_DP
Close to Module GND

GND
Figure 19: Reference Circuit of USB Interface
A common mode choke L1 is recommended to be added in series between the module and your MCU to
suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series
between the module and the test points to facilitate debugging, and the resistors are not mounted by
default. To ensure the integrity of USB data trace signal, L1 & R3 & R4 components must be placed close
to the module, and also these resistors should be placed close to each other. The extra stubs of trace
must be as short as possible.
To meet USB 2.0 specification, the following principles should be complied with when design the USB
interface.
⚫ It is important to route the USB signal traces as differential pairs with ground surrounded. The
impedance of USB differential trace is 90 Ω.
⚫ Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer of the PCB, and surround the traces with
ground on that layer and with ground planes above and below.
⚫ Junction capacitance of the ESD protection device might cause influences on USB data lines, so pay
attention to the selection of the device. Typically, the stray capacitance should be less than 2 pF.
⚫ Keep the ESD protection devices as close to the USB connector as possible.
3.11. UART Interfaces
The module provides two UART interfaces: the main UART interface and the debug UART interface. The
following shows their features.
⚫ The main UART interface supports 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps,
230400 bps, 460800 bps and 921600 bps baud rates, and the default is 115200 bps. It supports RTS
and CTS hardware flow control, and is used for AT command communication and data transmission.
⚫ The debug UART interface supports 115200 bps baud rate. It is used for Linux console and log
output.
The following tables show the pin definition of the two UART interfaces.
Table 11: Pin Definition of Main UART Interfaces
RI 39 DO Ring indication
1.8 V power domain
DCD 38 DO Data carrier detect
CTS 36 DO Clear to send
RTS 37 DI Request to send
Data terminal ready

DTR 30 DI
Sleep mode control
TXD 35 DO Transmit
RXD 34 DI Receive
Table 12: Pin Definition of Debug UART Interface
DBG_TXD 23 DO Debug UART transmit

1.8 V power domain.
DBG_RXD 22 DI Debug UART receive
The module provides 1.8 V UART interfaces. A voltage-level translator should be used if your application
is equipped with a 3.3 V UART interface. A voltage-level translator TXS0108EPWR provided by Texas
Instruments is recommended. The following figure shows a reference design.
VDD_EXT VCCA VCCB VDD_MCU

0.1 μF
10K
0.1 μF
OE GND
120K
RI A1 B1 RI_MCU
DCD A2 B2 DCD_MCU
CTS A3 Translator B3 CTS_MCU
RTS A4 B4 RTS_MCU
DTR A5 B5 DTR_MCU
TXD A6 B6 RXD_MCU
RXD A7 B7 TXD_MCU
51K 51K
A8 B8
Figure 20: Reference Circuit with Translator Chip
Visit http://www.ti.com for more information.
Another example with transistor translation circuit is shown as below. For the design of circuits shown in
dotted lines, see that shown in solid lines, but please pay attention to the direction of connection.
4.7K
VDD_EXT VDD_EXT
1 nF
MCU/ARM Module
10K
TXD RXD
RXD TXD
1 nF
10K
VDD_EXT
VCC_MCU 4.7K
RTS RTS
CTS CTS
GPIO DTR
EINT RI
GPIO DCD
GND GND
Figure 21: Reference Circuit with Transistor Circuit
NOTE
1. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps.
2. Please note that the CTS and RTS pins of the hardware flow control for the UART port are directly
connected, and pay attention to the input and output directions.
3.12. PCM and I2C Interfaces
EG91 series module provides one Pulse Code Modulation (PCM) digital interface for audio design, which
supports the following modes and one I2C interface:
⚫ Primary mode (short frame synchronization, works as both master and slave)
⚫ Auxiliary mode (long frame synchronization, works as master only)
In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports
256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz
PCM_CLK at 16 kHz PCM_SYNC.
In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the
rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates
with a 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC.
EG91 series module supports 16-bit linear data format. The following figures show the primary mode’s
timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary mode’s
timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK.
125 μs
P CM _CLK 1 2 255 256
P CM _S YNC
MS B LS B MS B
P CM _DOUT
MS B LS B MS B
P CM _DIN
Figure 22: Primary Mode Timing
125 μs
P CM _CLK 1 2 31 32
P CM _S YNC
MS B LS B
P CM _DOUT
MS B LS B
P CM _DIN
Figure 23: Auxiliary Mode Timing
The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio
codec design.
Table 13: Pin Definition of PCM and I2C Interfaces
PCM_DIN 6 DI PCM data input

1.8 V power domain.
PCM_DOUT 7 DO PCM data output
PCM_SYNC 5 DIO PCM data frame sync 1.8 V power domain. In master
mode, it is an output signal. In slave
mode, it is an input signal.
PCM_CLK 4 DIO PCM data clock
I2C serial clock (for
I2C_SCL 40 OD
external codec) Require an external pull-up to 1.8 V
I2C serial data If unused, keep it open.
I2C_SDA 41 OD
(for external codec)
Clock and mode can be configured by AT command, and the default configuration is master mode using
short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. See document [3]
about AT+QDAI command for details.
The following figure shows a reference design of PCM interface with external codec IC.
MICBIAS
INP
PCM_CLK BCLK BIAS
INN
PCM_SYNC LRCK
PCM_DOUT DAC
PCM_DIN ADC
LOUTP
I2C_SCL SCL
I2C_SDA SDA LOUTN
4.7K
4.7K
Module Codec
1.8 V
Figure 24: Reference Circuit of PCM Application with Audio Codec
NOTE
1. It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuit on the PCM traces, especially for

PCM_CLK.
2. EG91 series works as a master device pertaining to I2C interface.
3.13. SPI Interface
SPI interface of EG91 series module works as the master only. It provides a duplex, synchronous and
serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without
chip selection. Its operation voltage is 1.8 V with clock rates up to 50 MHz.
The following table shows the pin definition of SPI interface.
Table 14: Pin Definition of SPI Interface
SPI_CLK 26 DO SPI clock

1.8 V power domain.
SPI_MOSI 27 DO SPI master-out slave-in
SPI_MISO 28 DI SPI master-in slave-out
The following figure shows a reference design of SPI interface with peripherals.
SPI_CLK SPI_CLK
SPI_MOSI SPI_MOSI
SPI_MISO SPI_MISO
Module Peripherals
Figure 25: Reference Circuit of SPI Interface with Peripherals
NOTE
EG91 series provides 1.8 V SPI interface. A voltage-level translator should be used between the module
and the host if your application is equipped with a 3.3 V processor or device interface.
3.14. Network Status Indication
The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status
indication LED.
The following tables describe the pin definition and logic level changes of NETLIGHT in different network
status.
Table 15: Pin Definition of Network Status Indicator
NETLIGHT 21 DO Indicate the module’s network activity status 1.8 V power domain
Table 16: Working State of Network Status Indicator
Pin Name Logic Level Changes Network Status
Flicker slowly (200 ms High/1800 ms Low) Network searching
Flicker slowly (1800 ms High/200 ms Low) Idle

NETLIGHT
Flicker quickly (125 ms High/125 ms Low) Data transfer is ongoing
Always High Voice calling
A reference circuit is shown in the following figure.
VBAT
Module
2.2K
4.7K
NETLIGHT
47K
Figure 26: Reference Circuit of Network Status Indication
3.15. STATUS
The STATUS pin is set as the module’s operation status indicator. It will output high level when the
module is powered on. The following table describes the pin definition of STATUS.
Table 17: Pin Definition of STATUS
1.8 V power domain.

STATUS 20 DO Indicate the module’s operation status
The following figure shows the reference circuit of STATUS.
VBAT
Module
2.2K
4.7K
STATUS
47K
Figure 27: Reference Circuit of STATUS
3.16. ADC Interface
The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 can be used to read
the voltage value on ADC0 pin. For more details about the command, see document [3].
To improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by ground.
Table 18: Pin Definition of ADC Interface
If unused, keep this pin

ADC0 24 AI General-purpose ADC interface
open.
The following table describes the characteristics of ADC interface.
Table 19: Characteristics of ADC Interface
Parameter Min. Typ. Max. Unit
ADC0 Voltage Range 0.3 VBAT_BB V
ADC Resolution 15 bits
NOTE
1. It is prohibited to supply any voltage to ADC pins when ADC pins are not powered by VBAT.
2. It is recommended to use resistor divider circuit for ADC application.
3.17. Behaviors of RI
AT+QCFG="risignaltype","physical" can be used to configure RI behavior. See document [3] for

details.
No matter on which port URC is presented, URC will trigger the behavior of RI pin.
NOTE
URC can be outputted from UART port, USB AT port and USB modem port through configuration via
AT+QURCCFG. The default port is USB AT port.
The default behaviors of the RI are shown as below, and can be changed by AT+QCFG="urc/ri/ring".
See document [3] for details.
Table 20: Default Behaviors of RI
State Response
Idle RI keeps at high level
URC RI outputs 120 ms low pulse when a new URC returns
3.18. USB_BOOT Interface
EG91 series module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before
VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In
this mode, the module supports firmware upgrade over USB interface.
Table 21: Pin Definition of USB_BOOT Interface
1.8 V power domain.

Force the module to enter Active high.
USB_BOOT 75 DI
emergency download mode It is recommended to
reserve test point.
The following figures show the reference circuit of USB_BOOT interface and timing sequence of entering
emergency download mode.
Module
VDD_EXT
Test point
4.7K
USB_BOOT
Close to test point
TVS
Figure 28: Reference Circuit of USB_BOOT Interface
NOTE 1
VBAT ≥ 500 ms
VH = 0.8 V
PWRKEY VIL ≤ 0.5 V

About 100 ms
VDD_EXT USB_BOOT can be pulled up to 1.8 V before

VDD_EXT Is powered up, and the module will
enter emergency download mode when it is
powered on.
USB_BOOT
RESET_N
Figure 29: Emergency Download Mode Timing
NOTE
1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time
between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms.
2. When using MCU to control module to enter the emergency download mode, follow the above timing
sequence. It is not recommended to pull up USB_BOOT to 1.8 V before powering up VBAT. Short the
test points as shown in Figure 28 can manually force the module to enter download mode.
4 GNSS Receiver
EG91 series module includes a fully integrated global navigation satellite system solution that supports
GPS, GLONASS, BeiDou, Galileo and QZSS.
EG91 series module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data
update rate via USB interface by default.
By default, EG91 series module GNSS engine is switched off. It has to be switched on via AT command.
For more details about GNSS engine technology and configurations, see document [4].
4.2. GNSS Performance
The following table shows GNSS performance of EG91 series module.
Table 22: GNSS Performance
Parameter Description Conditions Typ. Unit
Cold start Autonomous -146 dBm

Sensitivity
Reacquisition Autonomous -157 dBm
(GNSS)
Tracking Autonomous -157 dBm
Autonomous 34.6 s
Cold start
@ open sky
XTRA enabled 11.57 s
TTFF
(GNSS)
Autonomous 26.09 s
Warm start
@ open sky
XTRA enabled 3.7 s
Autonomous 1.8 s
Hot start
@ open sky
XTRA enabled 3.4 s
Accuracy Autonomous
CEP-50 < 2.5 m
(GNSS) @ open sky
NOTE
1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep
positioning for at least 3 minutes continuously).
2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock
within 3 minutes after loss of lock.
3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position
successfully within 3 minutes after executing cold start command.
4.3. Layout Guidelines
The following layout guidelines should be taken into account in your design.
⚫ Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna 11
⚫ Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be
kept away from the antennas.
⚫ Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar
isolation and protection.
⚫ Keep the characteristic impedance for ANT_GNSS trace as 50 Ω.
See Chapter 5 for GNSS antenna reference design and antenna installation information.
5 Antenna Interfaces
EG91 series module antenna interfaces include a main antenna interface and an Rx-diversity antenna
interface which is used to resist the fall of signals caused by high speed movement and multipath effect,
and a GNSS antenna interface which is only supported on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAL/
-VX. The impedance of the antenna port is 50 Ω.
5.1. Main/Rx-diversity Antenna Interfaces
5.1.1. Pin Definition
The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
Table 23: Pin Definition of RF Antenna
ANT_MAIN 60 AIO Main antenna Interface 50 Ω impedance
ANT_DIV 50 Ω impedance.
49 AI Diversity antenna interface
(EG91-E) If unused, keep it open.
ANT_DIV
50 Ω impedance.
(EG91-EX/-NA/-NAL/ 56 AI Receive diversity antenna pad
-NAX/-NAXD/-VX)
NOTE
1. Pin 49 is defined as ANT_GNSS on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX, while it is defined

as ANT_DIV on EG91-E.
2. Pin 56 is RESERVED on EG91-E, while it is defined as ANT_DIV on EG91-EX/-NA/-NAL/-NAX/
-NAXD/-VX. Rx-diversity antenna is not supported on EG91-AUX.
5.1.2. Operating Frequency
Table 24: Module Operating Frequencies
3GPP Band Transmit Receive Unit
GSM850 824–849 869–894 MHz
EGSM900 880–915 925–960 MHz
DCS1800 1710–1785 1805–1880 MHz
PCS1900 1850–1910 1930–1990 MHz
WCDMA B1 1920–1980 2110–2170 MHz
WCDMA B2 1850–1910 1930–1990 MHz
WCDMA B4 1710–1755 2110–2155 MHz
WCDMA B5 824–849 869–894 MHz
WCDMA B8 880–915 925–960 MHz
LTE-FDD B1 1920–1980 2110–2170 MHz
LTE FDD B2 1850–1910 1930–1990 MHz
LTE-FDD B3 1710–1785 1805–1880 MHz
LTE FDD B4 1710–1755 2110–2155 MHz
LTE FDD B5 824–849 869–894 MHz
LTE-FDD B7 2500–2570 2620–2690 MHz
LTE-FDD B8 880–915 925–960 MHz
LTE FDD B12 699–716 729–746 MHz
LTE FDD B13 777–787 746–756 MHz
LTE-FDD B20 832–862 791–821 MHz
LTE-FDD B25 1850–1915 1930–1995 MHz
LTE-FDD B26 814–849 859–894 MHz
LTE-FDD B28 703–748 758–803 MHz
LTE-FDD B66 1710–1780 2100–2200 MHz
5.1.3. Reference Design of RF Antenna Interface
A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching
circuit should be reserved for better RF performance. The capacitors are not mounted by default.
Main
Module antenna
R1 0R
ANT_MAIN
C1 C2
NM NM
Diversity
antenna
R2 0R
ANT_DIV
C3 C4
NM NM
Figure 30: Reference Circuit of RF Antenna Interface
NOTE
1. EG91-AUX does not support Rx-diversity.

2. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the
receiving sensitivity.
3. For the operation of ANT_MAIN and ANT_DIV, see AT+QCFG="divctl" in document [5].
4. Place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible.
5.2. GNSS Antenna Interface
The GNSS antenna interface is only supported on EG91-NA/-VX/-EX/-NAX/-NAXD/-AUX/-NAL. The

following tables show pin definition and frequency specification of GNSS antenna interface.
Table 25: Pin Definition of GNSS Antenna Interface
ANT_GNSS
49 AI GNSS antenna 50 Ω impedance
(EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX)
Table 26: GNSS Frequency
Type Frequency Unit
GPS 1575.42 ±1.023 MHz
GLONASS 1597.5–1605.8 MHz
Galileo 1575.42 ±2.046 MHz
BeiDou 1561.098 ±2.046 MHz
QZSS 1575.42 MHz
A reference design of GNSS antenna is shown as below.
VDD
0.1 μF GNSS
10R
Antenna
Module
47 nH
0R 100 pF
ANT_GNSS
NM NM
Figure 31: Reference Circuit of GNSS Antenna
NOTE
1. An external LDO can be selected to supply power according to the active antenna requirement.
2. If the module is designed with a passive antenna, then the VDD circuit is not needed.
5.3. Reference Design of RF Layout
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,
the height from the reference ground to the signal layer (H), and the spacing between RF traces and
grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic
impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB
structures.
Figure 32: Microstrip Design on a 2-layer PCB
Figure 33: Coplanar Waveguide Design on a 2-layer PCB
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, the following principles should be complied with in RF layout
design:
⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.
⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
⚫ The distance between the RF pins and the RF connector should be as short as possible, and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
⚫ There should be clearance under the signal pin of the antenna connector or solder joint.
⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W).
⚫ Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.
For more details about RF layout, refer to document [6].
5.4. Antenna Installation
5.4.1. Antenna Requirement
The following table shows the requirements on main antenna, Rx-diversity antenna 12 and GNSS
antenna.
Table 27: Antenna Requirements
Type Requirements
Frequency range: 1559–1609 MHz

Polarization: RHCP or linear
VSWR: < 2 (Typ.)
GNSS 2) Passive antenna gain: > 0 dBi
Active antenna noise figure: < 1.5 dB
Active antenna gain: > 0 dBi
Active antenna embedded LNA gain: < 17 dB
VSWR: ≤ 2
Efficiency : > 30 %
Max. input power: 50 W
Input impedance: 50 Ω
GSM/WCDMA/LTE
Cable insertion loss:
< 1 dB: LB (<1 GHz)
< 1.5 dB: MB (1–2.3 GHz)
< 2 dB: HB (> 2.3 GHz)
NOTE
It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of
active antenna may generate harmonics which will affect the GNSS performance.
5.4.2. Recommended RF Connector for Antenna Installation
If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector

provided by Hirose.
Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm)
U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
Figure 37: Mechanicals of U.FL-LP Connectors
The following figure describes the space factor of mated connector.
Figure 38: Space Factor of Mated Connector (Unit: mm)
For more details, visit http://www.hirose.com.
6 Reliability,Radio and Electrical

Characteristics
6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.
Table 28: Absolute Maximum Ratings
Parameter Min. Max. Unit
VBAT_RF/VBAT_BB -0.3 4.7 V
USB_VBUS -0.3 5.5 V
Peak Current of VBAT_BB 0 0.8 A
Peak Current of VBAT_RF 0 1.8 A
Voltage at Digital Pins -0.3 2.3 V
6.2. Power Supply Ratings
Table 29: Power Supply Ratings
Parameter Description Conditions Min. Typ. Max. Unit
The actual input voltages

VBAT_BB and must be kept between the
VBAT 3.3 3.8 4.3 V
VBAT_RF minimum and maximum
values.
Voltage drop during Maximum power control

400 mV
burst transmission level on EGSM900
Peak supply current
Maximum power control
IVBAT (during transmission 1.8 2.0 A
level on EGSM900
slot)
USB connection
USB_VBUS 3.0 5.0 5.25 V
detection
6.3. Operating and Storage Temperatures
The operating and storage temperatures are listed in the following table.
Table 30: Operating and Storage Temperatures
Parameter Min. Typ. Max. Unit
Operating Temperature Range 13 -35 +25 +75 ºC
14
Extended Temperature Range -40 +85 ºC
Storage Temperature Range -40 +90 ºC
6.4. Current Consumption
The values of current consumption are shown below.
Table 31: EG91-AUX Current Consumption
Description Conditions Typ. Unit
OFF state Power down 10 μA
Sleep state AT+CFUN=0 (USB disconnected) 1.1 mA
13 Within operating temperature range, the module is 3GPP compliant.

14 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data
transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio
network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the
temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again.
GSM DRX = 2 (USB disconnected) 2.0 mA
GSM DRX = 5 (USB suspend) 1.6 mA
WCDMA PF = 64 (USB disconnected) 1.8 mA
WCDMA PF = 64 (USB suspend) 2.1 mA
LTE-FDD PF = 64 (USB disconnected) 2.3 mA
LTE-FDD PF = 64 (USB suspend) 2.8 mA
GSM DRX = 5 (USB disconnected) 18 mA
GSM DRX = 5 (USB connected) 28 mA
WCDMA PF = 64 (USB disconnected) 17 mA

Idle state
WCDMA PF = 64 (USB connected) 28 mA
LTE-FDD PF = 64 (USB disconnected) 23 mA
LTE-FDD PF = 64 (USB connected) 34 mA
GSM850 4DL/1UL @ 32.48 dBm 217.9 mA
GSM850 3DL/2UL @ 31.89dBm 372.3 mA
GSM850 2DL/3UL @ 29.45 dBm 432.9 mA
GSM850 1DL/4UL @ 28.31 dBm 513.9 mA
EGSM900 4DL/1UL @ 33.17 dBm 235.1 mA

GPRS data transfer
EGSM900 3DL/2UL @ 32.16 dBm 387.7 mA
EGSM900 2DL/3UL @ 29.77 dBm 446.5 mA
EGSM900 1DL/4UL @ 28.59 dBm 540.0 mA
DCS1800 4DL/1UL @ 30.19 dBm 154.4 mA
DCS1800 3DL/2UL @ 29.23 dBm 258.0 mA
DCS1800 2DL/3UL @ 27.19 dBm 332.4 mA
DCS1800 1DL/4UL @ 26.14 dBm 419.1 mA
PCS1900 4DL/1UL @ 30.22 dBm 155.0 mA
PCS1900 3DL/2UL @ 29.48 dBm 259.5 mA
PCS1900 2DL/3UL @ 27.50 dBm 333.1 mA
PCS1900 1DL/4UL @ 26.44 dBm 416.8 mA
GSM850 4DL/1UL PCL = 8 @ 25.75 dBm 161.8 mA
EGSM900 4DL/1UL PCL = 8 @ 26.04 dBm 161.5 mA

EDGE data
transfer
DCS1800 4DL/1UL PCL = 2 @ 26.12 dBm 139.4 mA
PCS1900 4DL/1UL PCL = 2 @ 26.36 dBm 138.3 mA
WCDMA B1 HSDPA @ 22.30 dBm 609.6 mA
WCDMA data transfer WCDMA B1 HSUPA @ 21.50 dBm 640.5 mA
WCDMA B2 HSUPA @ 21.18 dBm 539.4 mA
LTE-FDD B1 @ 22.96 dBm 777.4 mA
LTE-FDD B2 @ 22.79 dBm 634.4 mA
LTE-FDD B3 @ 23.09 dBm 697.9 mA
LTE-FDD B4 @ 22.83 dBm 704.6 mA
LTE data transfer LTE-FDD B5 @ 23.05 dBm 657.1 mA
LTE-FDD B7 @ 22.71 dBm 765.3 mA
LTE-FDD B8 @ 22.80 dBm 635.3 mA
LTE-FDD B28 @ 22.84 dBm 670.0 mA
LTE-FDD B66 @ 22.73 dBm 725.9 mA
GSM850 PCL5 @32.57dBm 227.8 mA
EGSM900 PCL5 @33.21dBm 253.8 mA

GSM
voice call
DCS1800 PCL0 @30.24dBm 168.0 mA
PCS1900 PCL0 @30.33dBm 166.8 mA
WCDMA B1 @22.93dBm 656.2 mA

WCDMA voice call
Table 32: EG91-E Current Consumption
AT+CFUN=0 (USB disconnected) 1.1 mA
GSM DRX = 5 (USB suspended) 1.9 mA

Sleep state
WCDMA PF = 64 (USB suspended) 2.1 mA
LTE-FDD PF = 64 (USB suspended) 2.6 mA
GSM DRX = 5 (USB connected) 29.0 mA

Idle state
WCDMA PF = 64 (USB connected) 29.0 mA
LTE-FDD PF = 64 (USB connected) 29.0 mA
EGSM900 4DL/1UL @ 32.67 dBm 260 mA
EGSM900 3DL/2UL @ 32.59 dBm 463 mA
EGSM900 2DL/3UL @ 30.74 dBm 552 mA

GPRS data transfer
EGSM900 1DL/4UL @ 29.26 dBm 619 mA
DCS1800 4DL/1UL @ 29.2 dBm 165 mA
DCS1800 3DL/2UL @ 29.13 dBm 267 mA
DCS1800 2DL/3UL @ 29.01 dBm 406 mA
DCS1800 1DL/4UL @ 28.86 dBm 467 mA
EGSM900 4DL/1UL PCL = 8 @ 27.1 dBm 163 mA

EDGE data transfer
DCS1800 4DL/1UL PCL = 2 @ 25.54 dBm 136 mA
WCDMA B1 HSDPA CH10700 @ 22.29 dBm 507 mA
WCDMA B1 HSUPA CH10700 @ 21.79 dBm 516 mA

WCDMA data transfer
LTE-FDD B1 CH18300 @ 22.98 dBm 685 mA
LTE-FDD B3 CH19575 @ 23.23 dBm 698 mA
LTE-FDD B7 CH21100 @ 23.46 dBm 723 mA

LTE data transfer
LTE-FDD B8 CH21625 @ 23.35 dBm 655 mA
LTE-FDD B20 CH24300 @ 23.41 dBm 723 mA
LTE-FDD B28A CH27360 @ 23.16 dBm 660 mA
EGSM900 PCL = 5 @ 32.5 dBm 258 mA

GSM voice call
DCS1800 PCL = 0 @ 29.23 dBm 159 mA
WCDMA B1 CH10700 @ 23.06 dBm 555 mA

WCDMA voice call
WCDMA B8 CH3012 @ 23.45 dBm 535 mA
Table 33: EG91-EX Current Consumption
GSM DRX = 5 (USB suspend) 2.0 mA

Sleep state
GSM DRX = 5 (USB connected) 31.0 mA

Idle state
EGSM900 4DL/1UL @ 33.06 dBm 247.9 mA
EGSM900 3DL/2UL @ 32.93 dBm 450.8 mA
EGSM900 2DL/3UL @ 31.1 dBm 536.4 mA

GPRS data
transfer
EGSM900 1DL/4UL @ 29.78 dBm 618 mA
DCS1800 4DL/1UL @ 29.3 dBm 144 mA
DCS1800 3DL/2UL @ 29.3 dBm 253.4 mA
DCS1800 2DL/3UL @ 29.21 dBm 355.4 mA
DCS1800 1DL/4UL @ 29.07 dBm 455.7 mA

EDGE data
transfer
WCDMA B1 HSDPA @ 22.48 dBm 485 mA
WCDMA B1 HSUPA @ 21.9 dBm 458 mA

WCDMA data
transfer
LTE-FDD B1 @ 23.37 dBm 605 mA

LTE data
transfer
EGSM900 PCL = 5 @ 32.36 dBm 259 mA

GSM voice call
DCS1800 PCL = 0 @ 29.5 dBm 149 mA
WCDMA B1 @ 23.4 dBm 494 mA

WCDMA voice
call
Table 34: EG91-NA Current Consumption
WCDMA PF = 64 (USB suspended) 2.5 mA
Sleep state WCDMA PF = 512 (USB disconnected) 1.4 mA
LTE-FDD PF = 64 (USB suspended) 2.9 mA

Idle state

WCDMA data transfer
WCDMA B5 HSDPA CH4407 @ 23 dBm 518 mA
LTE-FDD B2 CH1100 @ 23.29 dBm 705 mA
LTE-FDD B4 CH2175 @ 23.19 dBm 693 mA
LTE data transfer LTE-FDD B5 CH2525 @ 23.39 dBm 601 mA
LTE-FDD B12 CH5060 @ 23.16 dBm 650 mA
LTE-FDD B13 CH5230 @ 23.36 dBm 602 mA
WCDMA B2 CH9938 @ 23.34 dBm 627 mA
WCDMA voice call WCDMA B4 CH1537 @ 23.47 dBm 591 mA
WCDMA B5 CH4357 @ 23.37 dBm 536 mA
Table 35: EG91-NAL Current Consumption
LTE-FDD PF=64 (USB disconnected) 2.47 mA

Sleep state
LTE-FDD PF=64 (USB suspend) 2.6 mA

Idle state
LTE-FDD PF=64 (USB active) 28.73 mA
LTE-FDD B2 @ 23.23dBm 668 mA

LTE data
transfer
Table 36: EG91-NAX Current Consumption

Idle state

WCDMA data
transfer

LTE data
transfer

WCDMA voice
call
Table 37: EG91-NAXD Current Consumption

Idle state

WCDMA data
transfer

LTE data
transfer
Table 38: EG91-VX Current Consumption
AT+CFUN=0 (USB disconnected) TBD mA
LTE-FDD PF = 64 (USB disconnected) TBD mA

Sleep state
LTE-FDD PF = 64 (USB suspended) TBD mA
LTE-FDD PF = 256 (USB disconnected) TBD mA

Idle state
LTE-FDD B4 CH2175 @ 23.36 dBm 715 mA

LTE data transfer
LTE-FDD B13 CH5230 @ 23.38 dBm 642 mA
Table 39: GNSS Current Consumption of EG91 Series Module
Cold start @ Passive antenna 54 mA

Searching
Hot start @ Passive antenna 54 mA
(AT+CFUN=0)
Lost state @ Passive antenna 53 mA
Tracking
Open sky @ Passive antenna 32 mA
(AT+CFUN=0)
6.5. RF Output Power
The following table shows the RF output power of EG91 series module.
Table 40: RF Output Power
Frequency Bands Max. Output Power Min. Output Power
GSM850 33 dBm ±2 dB 5 dBm ±5 dB
EGSM900 33 dBm ±2 dB 5 dBm ±5 dB
DCS1800 30 dBm ±2 dB 0 dBm ±5 dB
PCS1900 30 dBm ±2 dB 0 dBm ±5 dB
GSM850 (8-PSK) 27 dBm ±3 dB 5 dBm ±5 dB
EGSM900 (8-PSK) 27 dBm ±3 dB 5 dBm ±5 dB
DCS1800 (8-PSK) 26 dBm ±3 dB 0 dBm ±5 dB
PCS1900 (8-PSK) 26 dBm ±3 dB 0 dBm ±5 dB
WCDMA B1/B2/B4/B5/B8 24 dBm +1/-3 dB < -49 dBm
LTE-FDD B1/B2/B3/B4/B5/B7/
23 dBm ±2 dB < -39 dBm
B8/B12/B13/B20/B25/B26/B28/B66
NOTE
In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the
GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
6.6. RF Receiving Sensitivity
The following tables show the conducted RF receiving sensitivity of EG91 series module.
Table 41: EG91-AUX Conducted RF Receiving Sensitivity
Frequency Band Primary Diversity SIMO 3GPP
GSM850 -109.1 dBm N/A N/A -102 dBm
EGSM900 -109.7 dBm N/A N/A -102 dBm
DCS1800 -110.0 dBm N/A N/A -102 dBm
PCS1900 -109.4 dBm N/A N/A -102 dBm
WCDMA B1 -109.2 dBm N/A N/A -106.7 dBm
WCDMA B2 -109.8 dBm N/A N/A -104.7 dBm
WCDMA B5 -110 dBm N/A N/A -104.7 dBm
WCDMA B8 -110 dBm N/A N/A -103.7 dBm
LTE-FDD B1 (10 MHz) -97.2 dBm N/A N/A -96.3 dBm
Table 42: EG91-E Conducted RF Receiving Sensitivity
Receiving Sensitivity (Typ.)

Frequency Band 3GPP (SIMO)
Primary Diversity SIMO
DCS1800 -109.4 dBm N/A N/A -102 dBm
WCDMA B1 -109.5 dBm -110 dBm -112.5 dBm -106.7 dBm
WCDMA B8 -109.5 dBm -110 dBm -112.5 dBm -103.7 dBm
LTE-FDD B1 (10 MHz) -97.5 dBm -98.3 dBm -101.4 dBm -96.3 dBm
LTE-FDD B20 (10 MHz) -97 dBm -99 dBm -101.3 dBm -93.3 dBm
LTE-FDD B28A (10 MHz) -98.3 dBm -99 dBm -101.4 dBm -94.8 dBm
Table 43: EG91-EX Conducted RF Receiving Sensitivity

DCS1800 -109.8 dBm N/A N/A -102 dBm
WCDMA B1 -110 dBm -111 dBm -112.5 dBm -106.7 dBm
LTE-FDD B20 (10 MHz) -97 dBm -97.5 dBm -102.2 dBm -93.3 dBm
LTE-FDD B28 (10 MHz) -98.2 dBm -99.5 dBm -102 dBm -94.8 dBm
Table 44: EG91-NA Conducted RF Receiving Sensitivity

WCDMA B5 -111 dBm -111 dBm -113 dBm -104.7 dBm
LTE-FDD B12 (10 MHz) -99.5 dBm -100 dBm -102.5 dBm -93.3 dBm
Table 45: EG91-NAL Conducted RF Receiving Sensitivity

Table 46: EG91-NAX Conducted RF Receiving Sensitivity

Table 47: EG91-NAXD Conducted RF Receiving Sensitivity

Table 48: EG91-VX Conducted RF Receiving Sensitivity

6.7. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module’s electrostatic discharge characteristics.
Table 49: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %)
Tested Interfaces Contact Discharge Air Discharge Unit
VBAT, GND ±5 ±10 kV
All Antenna Interfaces ±4 ±8 kV
Other Interfaces ±0.5 ±1 kV
6.8. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
⚫ On your PCB design, please keep placement of the module away from heating sources, especially
high power components such as ARM processor, audio power amplifier, power supply, etc.
⚫ Do not place components on the opposite side of the PCB area where the module is mounted, in
order to facilitate adding of heatsink when necessary.
⚫ Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as
to ensure better heat dissipation performance.
⚫ The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
⚫ Make sure the ground pads of the module and PCB are fully connected.
⚫ According to your application demands, the heatsink can be mounted on the top of the module, or the
opposite side of the PCB area where the module is mounted, or both of them.
⚫ The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and you can choose one or both of them
according to their application structure.
Module Heatsink Heatsink
Thermal Pad
Shielding Cover
Application Board Application Board
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Thermal Pad
Module
Heatsink
Heatsink
Application Board
Shielding Cover Application Board
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
NOTE
1. The module offers the best performance when the internal BB chip stays below 105 °C. When the
maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115 °C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115 °C. Therefore,
the thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105 °C. You can execute AT+QTEMP and get the maximum BB chip
temperature from the first returned value.
2. For more details about thermal design, see document [7].
7 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
7.1. Mechanical Dimensions of the Module
25±0.15 2.30±0.2
Pin 1
29±0.15
Figure 41: Module Top and Side Dimensions
7.45 7.15
1.10 1.95 1.10
0.50
2.90
0.50
Pin 1
4.85
1.00
5.10
1.70 0.20
29±0.15
1.10 0.85
1.90
4.25 5.95
1.10
0.85
1.00
0.70 1.70 1.00

1.70 2.75
0.50
1.15 0.55
1.15
0.50
62x0.7 40x1.0 1.70

1.70
1.70
62x1.15 0.40
40x1.0
1.70 0.40
Figure 42: EG91-E Bottom Dimensions (Top View)
7.45 7.15
1.10 1.95 1.10
0.50
2.90
0.50
Pin 1
4.85
1.00
5.10
1.70 0.20
29±0.15
1.10 0.85
1.90
4.25 5.95
1.10
0.85
1.00
0.70 1.70 1.00

1.70 2.75
0.50
1.15 0.55
1.15
0.50
62x0.7 40x1.0 1.70

1.70
1.70
62x1.15 0.40
40x1.0
1.70 0.40
Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX Bottom Dimensions (Top View)
NOTE
The package warpage level of the module conforms to JEITA ED-7306 standard.
7.2. Recommended Footprint
7.45 7.15
1.10 1.95 1.10
0.50
2.90
0.50
Pin 1
4.85
1.00
5.10
1.70 0.20
29±0.15
1.10 0.85
1.90
4.25 5.95
1.10
0.85
1.00
0.70 1.70 1.00

1.70 2.75
0.50
1.15 0.55
1.15
0.50
62x0.7 40x1.0 1.70

1.70
1.70
62x1.15 0.40
40x1.0
1.70 0.40
Figure 44: Recommended Footprint (Top View)
NOTE
For easy maintenance of this module, please keep about 3 mm between the module and other
components on the motherboard.
7.3. Top and Bottom Views of the Module
Figure 45: Top View of the Module
Figure 46: EG91-E Bottom View
Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX Bottom View
NOTE
Images above are for illustration purpose only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel.
8 Storage, Manufacturing and

Packaging
8.1. Storage
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours 15 in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
⚫ The module is not stored in Recommended Storage Condition;
⚫ Violation of the third requirement above occurs;
⚫ Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫ Before module repairing.
5. If needed, the pre-baking should follow the requirements below:

⚫ The module should be baked for 8 hours at 120 ±5 °C;
⚫ All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
15 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start
the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to,
or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are
not ready for soldering.
NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the
drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness
of stencil for the module is recommended to be 0.13–0.15 mm. For more details, see document [8].
The peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow
temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended
that the module should be mounted only after reflow soldering for the other side of PCB has been
completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related
parameters are shown below.
Temp. (°C)
Reflow Zone
Max slope: Cooling down slope:
2 to 3 °C/s C -1.5 to -3 °C/s
246
235
217
B D
200
Soak Zone
150 A
100
Max slope: 1 to 3 °C/s
Figure 48: Recommended Reflow Soldering Thermal Profile
Table 50: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Reflow Zone
Max slope 2–3 °C/s
Reflow time (D: over 217 °C) 40–70 s
Max temperature 235 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle 1
NOTE
If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the
module.
8.3. Packaging
EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be
opened until the devices are ready to be soldered onto the application.
The reel is 330 mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in mm.
Figure 49: Tape Dimensions
48.5
Cover tape
13
Direction of feed
100
44.5+0.20
-0.00
Figure 50: Reel Dimensions
1083
Carrier tape Carrier tape

packing module unfolding
Figure 51: Tape and Reel Directions
9 Appendix References
Table 51: Related Documents
Document Name
[1] Quectel_UMTS&LTE_EVB_User_Guide
[2] Quectel_EC2x&EG9x_Power_Management_Application_Note
[3] Quectel_EG9x_AT_Commands_Manual
[4] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note
[5] Quectel_EC2x&EG2x&EG9x&EM05_Series_QCFG_AT_Commands_Manual
[6] Quectel_RF_Layout_Application_Note
[7] Quectel_LTE_Module_Thermal_Design_Guide
[8] Quectel_Module_Secondary_SMT_User_Guide
Table 52: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AMR Adaptive Multi-rate
bps Bits Per Second
CHAP Challenge Handshake Authentication Protocol
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear To Send
DC-HSDPA Dual-carrier High Speed Downlink Packet Access

DC-HSPA+ Dual-carrier High Speed Packet Access
DCS Data Coding Scheme
DFOTA Delta Firmware Upgrade Over-The-Air
DL Downlink
DTR Data Terminal Ready
DTX Discontinuous Transmission
EDGE Enhanced Data Rates for GSM Evolution
EFR Enhanced Full Rate
EGSM Enhanced GSM
ESD Electrostatic Discharge
FDD Frequency Division Duplex
FR Full Rate
FTP File Transfer Protocol
FTPS FTP over SSL
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
HR Half Rate
HSPA High Speed Packet Access
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
HTTP Hypertext Transfer Protocol
HTTPS Hypertext Transfer Protocol Secure
I/O Input/Output

Inom Nominal Current
LED Light Emitting Diode
LGA Land Grid Array
LNA Low Noise Amplifier
LTE Long Term Evolution
M2M Machine to Machine
ME Mobile Equipment
MIMO Multiple Input Multiple Output
MO Mobile Originated
MMS Multimedia Messaging Service
MS Mobile Station (GSM engine)
MCS Modulation and Coding Scheme
MQTT Message Queuing Telemetry Transport
MSL Moisture Sensitivity Level
MT Mobile Terminated
NITZ Network Identity and Time Zone
NTP Network Time Protocol
NMEA NMEA (National Marine Electronics Association) 0183 Interface Standard
PA Power Amplifier
PAM Pulse-Amplitude Modulation
PAP Password Authentication Protocol
PCB Printed Circuit Board
PCM Pulse Code Modulation
PDA Personal Digital Assistant
PDU Protocol Data Unit

PING Packet Internet Groper
PMIC Power Management IC
POS Point of Sale
PPP Point-to-Point Protocol
QAM Quadrature Amplitude Modulation
QPSK Quadrature Phase Shift Keying
RF Radio Frequency
RHCP Right Hand Circularly Polarized
RoHS Restriction of Hazardous Substances
RTS Request to Send
Rx Receive
SAW Surface Acoustic Wave
SPI Serial Peripheral Interface
SMD Surface Mount Device
SMTP Simple Mail Transfer Protocol
SMS Short Message Service
SSL Secure Sockets Layer
TCP Transmission Control Protocol
TDD Time Division Duplexing
TX Transmitting Direction
UART Universal Asynchronous Receiver/Transmitter.
UDP User Datagram Protocol
UL Uplink
UMTS Universal Mobile Telecommunications System
URC Unsolicited Result Code

(U)SIM (Universal) Subscriber Identity Module
USB Universal Serial Bus
Vmax Maximum Voltage
Vnom Nominal Voltage
Vmin Minimum Voltage
VIHmax Maximum High-evel Input Voltage
VIHmin Minimum High-evel Input Voltage
VILmax Maximum I Low-level Input Voltage
VILmin Minimum Low-level Input Voltage
VImax Absolute Maximum Input Voltage
VImin Absolute Minimum Input Voltage
VOHmin Minimum High-level Output Voltage
VOLmax Maximum Low-level Output Voltage
VOLmin Minimum Low-level Output Voltage
VSWR Voltage Standing Wave Ratio
WCDMA Wideband Code Division Multiple Access

Quectel EG91 Series Hardware Design V2.0

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Quectel EG91 Series Hardware Design V2.0

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Quectel EG91 Series Hardware Design V2.0

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EG91 Series

LTE Standard Module Series

Quectel Wireless Solutions Co., Ltd.

Or our local office. For more information, please visit:

For technical support, or to report documentation errors, please visit:

Wireless devices may cause interference on sensitive medical equipment, so

The cellular terminal or mobile contains a transceiver. When it is ON, it receives

In locations with explosive or potentially explosive atmospheres, obey all posted

About the Document

Version Date Author Description

1. Added ThreadX variant EG91-NAX and

10. Updated module storage information

Safety Information ....................................................................................................................................... 3

2 Product Concept ................................................................................................................................ 15

3 Application Interfaces ....................................................................................................................... 21

4 GNSS Receiver ................................................................................................................................... 56

4.1. General Description ................................................................................................................. 56

6 Reliability,Radio and Electrical Characteristics ............................................................................. 67

7 Mechanical Dimensions .................................................................................................................... 89

8 Storage, Manufacturing and Packaging .......................................................................................... 95

9 Appendix References ...................................................................................................................... 100

Table 1: Frequency Bands of EG91 Series Module ................................................................................... 15

Table 43: EG91-EX Conducted RF Receiving Sensitivity.......................................................................... 83

Figure 1: Functional Diagram ................................................................................................................... 19

Figure 42: EG91-E Bottom Dimensions (Top View)................................................................................... 90

2.1. General Description

Table 1: Frequency Bands of EG91 Series Module

LTE Bands WCDMA 2

EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 -

2.2. Key Features

Table 2: Key Features of EG91 Series Module

⚫ Supply voltage: 3.3–4.3 V

(U)SIM Interfaces ⚫ Support 1.8 V and 3.0 V (U)SIM cards

⚫ Support one digital audio interface: PCM interface

⚫ Provides a duplex, synchronous and serial communication link with the

Rx-diversity ⚫ Support LTE/WCDMA Rx-diversity

⚫ Protocol: NMEA 0183

Network Indication ⚫ NETLIGHT pin for network activity status indication

⚫ Main antenna interface (ANT_MAIN),

Temperature Range ⚫ Extended temperature range: -40 °C to +85 °C 7

⚫ Storage temperature range: -40 °C to +90 °C

4 EG91-AUX does not support Rx-diversity.

2.3. Functional Diagram

ANT_MAIN ANT_GNSS ANT_DIV

PAM SAW Switch

VDD_EXT USB (U)SIM1 (U)SIM2 PCM I2C SPI UART GPIOs

8GNSS antenna is supported on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-VX. Rx-diversity antenna is supported on

2.4. Evaluation Board

3.1. General Description

3.2. Pin Assignment

USB_DP 9 65 85 USIM2_RST 96 76 41 I2C_SDA

Figure 2: Pin Assignment (Top View)

3.3. Pin Description

Table 3: Definition of I/O Parameters

AIO Analog Input/Output

DIO Digital Input/Output

Table 4: Pin Description

For 1.8 V (U)SIM:

USIM1_CLK 46 DO (U)SIM1 card clock For 1.8 V (U)SIM: