TD62307P/F

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TD62307P,TD62307F
7CH LOW SATURATION SINK DRIVER

The TD62307P, TD62307F are comprised of seven NPN low

saturation drivers.
All units feature integral clamp diodes for switching inductive
loads and protective diodes against a negative input voltage.
Applications include relay, hammer, lamp and LED driver.

FEATURES
l Low saturation output VCE (sat) = 0.6 V (Max.)
@IOUT = 120 mA
l Output rating (single output) 20 V (Min.) / 150 mA (Max.)
l Inputs compatible with 5~15 V PMOS, CMOS
l Input protective diodes against a negative input voltage
l Package type−P : DIP−16 pin
l Package type−F : SOP−16 pin

Weight
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)

PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER)

Note: The input and output parasitic diodes cannot be

used as clamp diodes.

1 2001-06-28
 TD62307P/F
MAXIMUM RATINGS (Ta = 25°C)

CHARACTERISTIC SYMBOL RATING UNIT

Supply Voltage VCC −0.5~20 V

−0.5~VCC
Output Sustaining Voltage VCE (SUS) V
+0.5
Output Current IOUT 150 mA / ch
Input Voltage VIN −37~20 V
Input Current IIN 1.5 mA
Clamp Diode Reverse Voltage VR 20 V
Clamp Diode Forward Current IF 120 mA
P 1.0
Power Dissipation PD W
F 0.625 (Note)
P −30~75
Operating Temperature Topr °C
F −40~85
Storage Temperature Tstg −55~150 °C

Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

RECOMMENDED OPERATING CONDITIONS

(Ta = −40~85°C for Type−F and Ta = −30~75°C for Type−P)

CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT

Supply Voltage VCC ― 4.75 ― 18 V

DC 1 Circuit 0 ― 120
Output Current IOUT Tpw = 25 ms, Duty = 10% mA / ch
0 ― 100
7 Circuits
Input Voltage VIN ― −35 ― VCC V
Clamp Diode Reverse Voltage VR ― ― ― 18 V
Clamp Diode Forward Current IF ― ― ― 120 mA
P ― ― ― 0.44
Power Dissipation PD W
F (Note) ― ― 0.325

Note: On Glass Epoxy PCB (30 ´ 30 ´ 1.6 mm Cu 50%)

2 2001-06-28
 TD62307P/F
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
TEST
CHARACTERISTIC SYMBOL CIR− TEST CONDITION MIN TYP. MAX UNIT
CUIT
P VCC = 18 V Ta = 75°C ― ― 100
Output Leakage Current ICEX 1 µA
VOUT = 18 V
F Ta = 85°C ― ― 100
VCC = 5 V, IIN = 0.2 mA
Output Saturation Voltage VCE (sat) 2 ― 0.45 0.6 V
IOUT = 120 mA
VCC = 5 V, VOUT = 2 V
DC Forward Current Transfer Ratio hFE 2 1000 ― ― ―
IOUT = 120 mA
VIN = 5 V, IOUT = 120 mA ― 0.16 0.23
Output On IIN (ON) 3 mA
Input Current VIN = 15 V, IOUT = 120 mA ― 0.66 0.94
Output Off IIN (OFF) 4 VIN =−35 V ― ― −10 µA
Clamp Diode Forward Voltage VF 5 IF = 120 mA ― 1.25 1.6 V
VCC = VIN = 5 V ― 4.0 6.0 mA /
Output On ICC (ON) 6
Supply Current VCC = VIN = 15 V ― 14.0 22 Gate

Output Off ICC (OFF) 6 VCC = 18 V, VIN = 0 V ― ― 10 µA

Turn−On Delay tON VCC = 18 V, RL = 150 Ω ― 0.1 ― µs
7
Turn−Off Delay tOFF CL = 15 pF ― 0.8 ― µs

TEST CIRCUIT
1. ICEX 2. hFE, VCE (sat)

3. IIN (ON) 4. IIN (OFF)

3 2001-06-28
 TD62307P/F
5. VF 6. ICC

7. tON, tOFF

Note 1: Pulse Width 50 µs, Duty Cycle 10%

Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance

PRECAUTIONS for USING

This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
short−circuit between outputs, air contamination fault, or fault by improper grounding.

4 2001-06-28
 TD62307P/F

5 2001-06-28
 TD62307P/F
PACKAGE DIMENSIONS
DIP16−P−300−2.54A Unit: mm

Weight: 1.11 g (Typ.)

6 2001-06-28
 TD62307P/F
PACKAGE DIMENSIONS
SOP16−P−225−1.27 Unit: mm

Weight: 0.16 g (Typ.)

7 2001-06-28
 TD62307P/F

RESTRICTIONS ON PRODUCT USE 000707EBA

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.

· The products described in this document are subject to the foreign exchange and foreign trade laws.

· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.

· The information contained herein is subject to change without notice.

8 2001-06-28