DiskOnModule
DiskOnModule
Standard II DJ Series
Rev. A.0 June 2007
DiskOnModule
TABLE OF CONTENTS
1. PRODUCT DESCRIPTION ......................................................................................................... 1
1.1 PRODUCT OVERVIEW .............................................................................................................................................................. 1
1.2 PRODUCT FEATURES............................................................................................................................................................... 1
1.3 SYSTEM REQUIREMENT........................................................................................................................................................... 1
2. SPECIFICATION......................................................................................................................... 2
2.1 PHYSICAL SPECIFICATIONS ..................................................................................................................................................... 2
2.1.1 Overlook ..........................................................................................................................................................2
2.1.2 Dimension ........................................................................................................................................................3
2.1.3 Weight..............................................................................................................................................................4
2.2 ELECTRONIC SPECIFICATIONS ................................................................................................................................................ 4
2.2.1 Product Definition ............................................................................................................................................4
2.2.1 Operating Voltage ............................................................................................................................................5
2.2.2 Capacity and Block Size information ...............................................................................................................5
2.2.3 Power Consumption ........................................................................................................................................5
2.3 PERFORMANCE SPECIFICATIONS ............................................................................................................................................ 5
2.3.1 Modes ..............................................................................................................................................................5
2.3.2 Seek Time .......................................................................................................................................................5
2.3.3 Mount Time ......................................................................................................................................................5
2.3.4 Data Transfer Time by Channel mode.............................................................................................................5
2.3.5 Data Retention .................................................................................................................................................5
2.3.6 Wear-leveling ...................................................................................................................................................5
2.3.7 Bad Block Management ..................................................................................................................................5
2.4 ENVIRONMENTAL SPECIFICATIONS ......................................................................................................................................... 5
2.4.1 Temperature ....................................................................................................................................................5
2.4.2 Humidity ...........................................................................................................................................................6
2.4.3 Vibration ..........................................................................................................................................................6
2.5 RELIABILITY SPECIFICATIONS ................................................................................................................................................. 6
2.5.1 ECC/EDC (Error Correction Code/Error Detection Code)...............................................................................6
2.5.2 Read and Write/Erase Cycle ...........................................................................................................................6
2.5.3 MTBF (Mean Time Between Failure) ..............................................................................................................6
2.5.4 Power Cycle ....................................................................................................................................................6
2.6 COMPLIANCE SPECIFICATIONS ............................................................................................................................................... 6
3. FUNCTION ................................................................................................................................. 7
3.1 SWITCH SETTING ..................................................................................................................................................................... 7
3.1.2 WRITE PROTECT SWITCH .................................................................................................................................................... 7
3.2 PIN SIGNAL ASSIGNMENT ....................................................................................................................................................... 7
3.3 STANDARD-II CAPACITY AND CYLINDER, HEAD, SECTOR ..................................................................................................... 8
Rev. A.0 June 2007
DiskOnModule
4. OPERATION SPECIFICATION................................................................................................... 8
4.1 ABSOLUTE M AXIMUM RATINGS............................................................................................................................................... 8
5. ORDERING INFORMATION ....................................................................................................... 9
6. CONTACT INFORMATION ....................................................................................................... 10
Rev. A.0 June 2007
DiskOnModule
LIST OF FIGURES
Figure 1: DiskOnModule Overlook Diagram ........................................................................................................2
Figure 2: DOM Dimensions ..................................................................................................................................3
Figure 3: DiskOnModule Block Diagram ..............................................................................................................4
Figure 4: Master/Slave Function Switch ..............................................................................................................7
Figure 5: Write Protect Switch .………………………………………………………………………………………….7
Figure 6: Signal Connector …..………………………………………………………………………………………….8
Rev. A.0 June 2007
DiskOnModule
LIST OF TABLES
Table 1: DiskOnModule Physical Dimension .......................................................................................................4
Table 2 ATA connector pin definitions ..................................................................................................................7
Table 3: DiskOnModule Ordering Information ......................................................................................................9
Rev. A.0 June 2007
DiskOnModule
1. Product Description
1.1 Product Overview
PQI’s DiskOnModule (DOM) is the storage device based on NAND flash memory technology. This product complies
with 40 PIN IDE (ATA) standard interface and is suitable for data storage media and code storage device for embedded
system and boot disk. By using DiskOnModule, it is possible to operate good performance for the systems, which
have IDE interface.
With small form factor, the applicable appliance can add or install IDE storage device on its Mother Board or Complete
set.
Application Fields;
Industrial PC and Thin Client
Game and Telecommunication Machine
Ticketing, Examining, testing machine
Army, Health and Production Equipment and Machine
1.2 Product Features
Small form factor with IDE (ATA) Standard Interface connector
Memory Capacities: 128MB ~ 4GB
High performance and reliability
Noiseless and stable installation to system
Operating voltage 3.3V or 5.0V operation
Standard IDE (ATA) Interface
Master and Slave Switch
Write Protection Switch
Operating as Boot Disk
Data Storage Device to 4GB
Code Storage Device for Embeded Operating System
1.3 System Requirement
- The Host system which is connected to DiskOnModule should meet system requirements at minimum;
1.3.1 Power Requirement
Voltage: DC +3.3V ± 5% or DC +5.0V ± 10%
1.3.2 Operating System
Windows 2000/XP
Linux
DOS
WinXP Embedded
WinCE
1.3.3 Interface
IDE (ATA) Standard Interface
Rev. A.0 1/10 June 2007
DiskOnModule
2. Specification
2.1 Physical Specifications
2.1.1 Overlook
The overlook views of DiskOnModule are illustrated in Figure 1.
Write Protect Switch Power Connector Master/Slave Switch
Figure 1: DiskOnModule Overlook Diagram
Rev. A.0 2/10 June 2007
DiskOnModule
2.1.2 Dimension
The Dimensions of DiskOnModule are illustrated in Figure 2 and described in Table 1.
DJ0XXXX46XX0 (40 PIN)
Figure 2: DOM Dimensions
Rev. A.0 3/10 June 2007
DiskOnModule
Table 1: DiskOnModule Physical Dimension
Length 27.2 ± 0.2 mm
Width 59.2 ± 0.2 mm
Thickness 6.2 ± 0.2mm
2.1.3 Weight
DiskOnModule Weight: < 12g
Power Cable Weight: < 11g
2.2 Electronic Specifications
2.2.1 Product Definition
DiskOnModule is designed to operate and work as Data or Code Storage device by NAND Flash Memory and its
Controller through IDE (ATA) Standard Interface to Host Systems.
Vcc F L A SH
Regulator Master/Slave
Controller
External Option
DAT A
Hvcc BUFFER
ATA(IDE)
Interface X`tal
Flash memory bus
DD0 to DD15
CS0, CS1
RESET
DA0 to DA2
DIOR
DIOW
INTRQ DATA
IORDY FLASH
ARRAY
DMACK
DMARQ
DASP , PDIAG Control signal
Figure 3: DiskOnModule Block Diagram
Rev. A.0 4/10 June 2007
DiskOnModule
2.2.1 Operating Voltage
Voltage DC +3.3V ± 5% or DC +5.0V ± 10%
2.2.2 Capacity and Block Size information
Capacity: 128MB ~ 4GB
Sector Size: 512B
2.2.3 Power Consumption
DC Information
Test Item 3.3V 5.0V
Write Current 45mA 48mA
Read Current 43mA 45mA
Sleep Current 0.6mA 0.8mA
※ Testing Platform;
- Mother-Board: GA-K8U-939, CPU: K8 2.0G, System Memory: DDR 512MB,
Operating System: DOS 6.22, Test Program: RWALL10 & DOMSV31
2.3 Performance Specifications
2.3.1 Modes
PIO mode 4
Ultra DMA 2
Setting to Ultra DMA 0 or 1 also available as following to Customer’s request
2.3.2 Seek Time
DiskOnModule has no seek time by being based on Flash Memory technology.
2.3.3 Mount Time
The Mount Time for initializing and mounting DiskOnModule is different by depending on Operating System and
testing Platform.
2.3.4 Data Transfer Time by Channel mode
Mode Single Dual Mode
Condition Sequential Read Sequential Write Sequential Read Sequential Write
Speed 10MB/s 5MB/s 20MB/s 10MB/s
※ Test Platform: GIGA 8I945GME Intel:945+ICH7 3.0GHz DDR:400
Testing Software: HD Bench 3.4 Testing OS: Windows XP
The value is various bases on the testing platform.
2.3.5 Data Retention
10years without requiring power support
2.3.6 Wear-leveling
Dynamic Wear-Leveling for same level of Write/Erase Cycle
2.3.7 Bad Block Management
The Bad Blocks of Flash Memory will be replaced into new ones by controller.
2.4 Environmental Specifications
2.4.1 Temperature
Operating Temperature: 0℃ to +70℃, Non Operating Temperature: -40℃ to +85℃ (Industrial type)
Operating Temperature: -40℃ to +85℃, Non Operating Temperature: -55℃ to +95℃ (Wide Temperature type)
Rev. A.0 5/10 June 2007
DiskOnModule
2.4.2 Humidity
Operating Humidity: 10% to 95%
Non-Operating Humidity: 10% to 95% (with no condensation relative humidity)
2.4.3 Vibration
Random Vibration (Operation) : Testing Specification
Frequency (Hz) PSD (G2/Hz) Acceleration (Grms) Dwell Time (Min)
10 0.01 30min per axis
100 0.08 6Grms (X‧Y‧Z)
500 0.08
Sine Vibration (Non-Operation) : Testing Specification
Testing Specification
Frequency（Hz） Acceleration（G） Dwell Time（min）
10~500 Hz 15 G 30min per axis
(X‧Y‧Z)
2.4.4 Bare Drop Testing
Testing Conditions: 75cm height
Testing Orientation: (Free fell) Front/Rear/Right/Left/Top/Bottom side
Testing Result: Pass
2.5 Reliability Specifications
2.5.1 ECC/EDC (Error Correction Code/Error Detection Code)
Built-in Reed Solomon 4bytes/sector correction and 5bytes/sector detection.
2.5.2 Read and Write/Erase Cycle
Read: No Limitation
Write/Erase: 5,000,000 times
(Estimated on reference to Doc No.SM070001)
2.5.3 MTBF (Mean Time Between Failure)
2,000,000 hours
(Estimated on reference to Doc No.SM070002)
2.5.4 Power Cycle
The Power Cycling is tested to 5000 loop. => “Pass”
2.6 Compliance Specifications
CE
FCC
※ Note: Please contact your closest PQI’s office for other certificate information.
Rev. A.0 6/10 June 2007
DiskOnModule
3. Function
3.1 Switch Setting
3.1.1 Master/Slave Switch
On case which the switch place “Master” side, then the DOM will be recognized as C: Drive in system and
operate as main storage device.
On case of placing in “Slave” side, the DOM will be recognized as slave disk and operate as slave storage device.
Slave Master
Figure 4: Master/Slave Function Switch
3.1.2 Write Protect Switch
On case which the switch place “Lock” side, then the data can not be written into DOM and can be read only.
On case of placing in “Unlock” side, the data can be written and read together.
Unlock Lock
Figure 5: Write Protect Switch
3.2 Pin Signal Assignment
The signals assigned for ATA applications are described in Table 2
Table 2 ATA connector pin definitions
Signal name Connector Conductor Connector Signal name
contact contact
RESET- 1 1 2 2 Ground
DD7 3 3 4 4 DD8
DD6 5 5 6 6 DD9
DD5 7 7 8 8 DD10
DD4 9 9 10 10 DD11
DD3 11 11 12 12 DD12
DD2 13 13 14 14 DD13
DD1 15 15 16 16 DD14
DD0 17 17 18 18 DD15
Ground 19 19 20 20 (keypin) or Vcc
DMARQ 21 21 22 22 Ground
DIOW- 23 23 24 24 Ground
DIOR- 25 25 26 26 Ground
IORDY 27 27 28 28 CSEL
DMACK- 29 29 30 30 Ground
INTRQ 31 31 32 32 reserved
DA1 33 33 34 34 PDIAG-
DA0 35 35 36 36 DA2
CS0- 37 37 38 38 CS1-
DASP- 39 39 40 40 Ground
Rev. A.0 7/10 June 2007
DiskOnModule
※ Notes:
1. All pins are in a single row, with a 2.54 mm (0.100”) pitch.
2. The comments on the mating sequence apply to the case of backplane blind mate connector only. In this case, the mating sequences are:
• - the pre-charge power pints and the other ground pins.
• - the signal pins and the rest of the power pins.
Pin 1 Pin 39
Pin 2 Pin 40
Figure 6: Signal Connector
3.3 Standard-II Capacity and Cylinder, Head, Sector
The table show various capacities available for Standard-II series, if your platform does not support auto-detection
function or Standard-II series is not identified, we advice can following below Cylinders, Heads, Sectors number to
setting your platform.
Unformatted Disk No. of No. of No. of
Disk Total Sector
Capacity Cylinders Heads Sectors
128MB 480 16 32 245760
256MB 960 16 32 491520
512MB 975 16 63 982800
1GB 1950 16 63 1965600
2GB 3900 16 63 3931200
4GB 7801 16 63 7863408
4. Operation Specification
4.1 Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Power supply voltage VCC -0.3 ~ +5.6 V
Input voltage Vin -0.3 ~ +5.6 V
(Referenced to GND)
Rev. A.0 8/10 June 2007
DiskOnModule
Electric characteristics
Vcc=3.14V~5.5V
Value Measuring
Item Symbol Unit
Min. Standard Max. conditions
Input voltage VIH 2.0 - *1 V
(TTL level) VIL - - 0.7 V
VOH 2.2 - *2 V IOH=-2mA~ -24mA
Output voltage
VOL - - 0.4 V IOL=2mA~ 24mA
5. Ordering Information
Table 3: DiskOnModule Ordering Information
P/N Capacity (Max)
DJ0128M*146R*2 F*30 4GB
*
1：128M:128MB, 256M:256MB, 512M:512MB, 010G:1GB, 020G:2GB, 040G:4GB
*
2：R: Industrial type T: Wide Temperature type
*
3:：Flash Density
F:128MB, I:256MB, L:512MB, N:1GB, P:2GB
*
4：DJ0128M46RF0(WP): With Write Protect Switch
DJ0128M46RF0 : Without Write Protect Switch
Rev. A.0 9/10 June 2007
DiskOnModule
6. Contact Information
For further information, please contact the following PQI or representative which place you are located at.
TAIWAN‧POWER QUOTIENT INTERNATIONAL CO., LTD.
TEL: +886-2-82265288 Sales: sales@pqi.com.tw
USA‧PQI CORPORATION
TEL: +1-510-6517281 Sales: sales@pqimemory.com
Customer Service: support@pqimemory.com
THE NETHERLANDS‧PQIEUROPE B.V.
TEL: +31-73-6273555 Sales: info@pqieurope.com
Customer Service: rma@pqieurope.com
JAPAN‧PQI Japan Co., Ltd.
TEL: +81-3-58354545 E-Mail: info@pg-index.com
CHINA-Shanghai‧POWER QUOTIENT INTERNATIONAL (Shanghai) CO., LTD.
TEL: +86-21-64403280 FAX: +86-21-64403279
CHINA-Suzhou‧POWER QUOTIENT INTERNATIONAL(Suzhou) CO., LTD.
TEL: +86-512-62882999 FAX: +86-512-62883000
CHINA-Shenzhen‧POWER QUOTIENT INTERNATIONAL (Shenzhen) CO., LTD.
TEL: +86-755-83287509 FAX: +86-755-83287582
CHINA-Hong Kong‧POWER QUOTIENT INTERNATIONAL (H.K.) CO., LTD.
TEL: +852-27074118 E-Mail: sales@pqi.com.hk
KOREA‧POWER QUOTIENT INTERNATIONAL (KOREA) CO., LTD.
TEL: +82-2-7060781 E- mail: sales@pqi-korea.com
Rev. A.0 10/10 June 2007
