AD82587D EliteSemiconductor
AD82587D EliteSemiconductor
AD82587D EliteSemiconductor
Features
2
16/18/20/24-bit input with I S, Left-alignment Anti-pop design
Short circuit and over-temperature protection
and Right-alignment data format 2
I C control interface with selectable device address
PSNR & DR(A-weighting)
Internal PLL
Loudspeaker: 97dB (PSNR), 105dB (DR) @ 24V
LV Under-voltage shutdown and HV Under-voltage
Multiple sampling frequencies (Fs)
detection
32kHz / 44.1kHz / 48kHz and
64kHz / 88.2kHz / 96kHz and Power saving mode
128kHz/176.4kHz/192kHz Dynamic temperature control
System clock = 64x, 128x, 256x, 384x, 512x, 768x,
1024x Fs Applications
256x~1024x Fs for 32kHz / 44.1kHz / 48kHz TV audio
128x~512x Fs for 64kHz / 88.2kHz / 96kHz Boom-box, CD and DVD receiver, docking system
64x~256x Fs for 128kHz /176.4kHz/192kHz Powered speaker
Supply voltage Wireless audio
3.3V for digital circuit
10V~26V for loudspeaker driver Description
Loudspeaker output power for Stereo@ 24V
AD82587D is a digital audio amplifier capable of
10W x 2ch into 8Ω @ 0.16% THD+N
driving a pair of 8Ω,20W or a single 4Ω,40W speaker,
15W x 2ch into 8Ω @ 0.18% THD+N
both which operate with play music at a 24V supply
20W x 2ch into 8Ω @ 0.24% THD+N
without external heat-sink or fan requirement.
Loudspeaker output power for Mono@ 24V
20W x 1ch into 4Ω @ 0.17% THD+N 2
Using I C digital control interface, the user can control
30W x 1ch into 4Ω @ 0.2% THD+N
AD82587D’s input format selection, mute and volume
40W x 1ch into 4Ω @ 0.24% THD+N
control functions. AD82587D has many built-in
Sounds processing including:
protection circuits to safeguard AD82587D from
Volume control (+24dB~-103dB, 0.125dB/step)
connection errors.
Dynamic range control
Power clipping
Channel mixing
User programmed noise gate with hysteresis window
DC-blocking high-pass filter
ORDERING INFORMATION
VDDRB
VDDLB
GNDR
GNDL
N.C.
N.C.
N.C.
N.C.
RB
RA
LA
LB
48 AD82587D
47
46
45
44
43
42
41
40
39
38
37
PD 1 24 VDDLA
VDDLA 1 36 VDDRA
ERROR 2 23 NC
N.C. 2 35 N.C.
SDATA 3 22 LA
N.C. 3 34 N.C.
N.C. 4 33 N.C. LRCIN 4 21 GNDL
N.C. 5 32 N.C. SDA 5 20 LB
PLL 6
AD82587D 31 N.C. SCL 6 19 VDDLB
MCLK 7 30 N.C. RESET 7 18 VDDRB
CLK_OUT 8 E-LQFP-48L 29 N.C.
VSS 8 17 RB
DGND 9 28 N.C.
VDD GNDR
DVDD 10 DVDD
9 16
27
DEF 11 26 DGND SA0 10 15 RA
SDATA 12 25 SDA MCLK 11 14 NC
13
14
15
16
17
18
19
20
21
22
23
24
BCLK 12 13 VDDRA
E-TSSOP-24L
ERROR
RESET
PD
MONO
LRCIN
BCLK
N.C.
SCL
N.C.
SA0
SA1
N.C.
Pin Description
E-LQFP E-TSSOP
NAME TYPE DESCRIPTION CHARACTERISTICS
48L 24L
VDDLA 1 24 P Left channel supply A
N.C. 2 NA NC
N.C. 3 NA NC
N.C. 4 NA NC
N.C. 5 NA NC
PLL 6 NA I PLL enable, low active Schmitt trigger TTL input buffer
MCLK 7 11 I Master clock input Schmitt trigger TTL input buffer
CLK_OUT 8 NA O Clock output from PLL TTL output buffer
DGND 9 NA P Digital Ground
DVDD 10 NA P Digital Power
DEF 11 NA I Default volume setting Schmitt trigger TTL input buffer
SDATA 12 3 I Serial audio data input Schmitt trigger TTL input buffer
N.C. 13 NA NC
MONO 14 NA I MONO mode enable, high active Schmitt trigger TTL input buffer
LRCIN 15 4 I Left/Right clock input (Fs) Schmitt trigger TTL input buffer
BCLK 16 12 I Bit clock input (64Fs) Schmitt trigger TTL input buffer
PD 17 1 I Power down, low active Schmitt trigger TTL input buffer
ERROR 18 2 O Error status, low active Open-drain output
Reset
MCLK
SDA
SCL
SA0
SA1
PD
PLL
MONO
Available Package
Package Type Device No. θ ja(℃/W) Ψ jt(℃/W) θ jt(℃/W) Exposed Thermal Pad
Note 1.1: The thermal pad is located at the bottom of the package. To optimize thermal performance,
soldering the thermal pad to the PCB’s ground plane is suggested.
Note 1.2: θ ja is measured on a room temperature (TA=25℃), natural convection environment test board, which
is constructed with a thermally efficient, 4-layers PCB (2S2P). The measurement is tested using the
JEDEC51-5 thermal measurement standard.
Note 1.3: θ jt represents the heat resistance for the heat flow between the chip and the package’s top surface.
Note 1.4: Ψ jt represents the heat resistance for the heat flow between the chip and the package’s top surface
center.
Marking Information
AD82587D ESMT
Line 1 : LOGO
AD82587D ESMT
Tracking Code AD82587D
Line 2 : Product no. Date Code Tracking Code
Line 3 : Tracking Code
PIN1 DOT PIN1 DOT
Line 4 : Date Code
E-LQFP 48L E-TSSOP-24L
Logic
6/45
470F Pin
-
PD Power Down Normal
+
Revision: 1.6
VDDRB
GNDR
VDDLA
VDDRA
RB
GNDL
RA
LA
VDDLB
LB
PLL
MCLK
(Note 5) (Note 6) (Note 3) (Note 4)
CLK_OUT
LA
DGND 470pF BEA D 22H 100nF 1nF 10nF
0.1F ≧3A 3A
220nF
DVDD 10 10
470nF
DEF 10 10
220nF
Speaker
AD82587D BEA D 22H
470pF ≧3A 3A 100nF 1nF 10nF
LB
(Note 3)
SDATA 3.3V
DVDD
0.1F
DGND (Note 5) (Note 6) (Note 3) (Note 4)
3.3V
RA
ERROR 100nF 1nF 10nF
MONO
22H
LRCIN
470pF BEA D
Reset
BCLK
SCL
3A
SA1
SA0
220nF
PD
Speaker
1M 1M BEA D 22H
470pF ≧3A 3A 100nF 1nF 10nF
1F 1F RB
(Note 3)
Note 3: When concerning about short-circuit protection or performance, it is suggested using
the choke with its IDC larger than 5A.
ESMT
Note 4: These capacitors should be placed as close to speaker jack as possible, and their
values should be determined according to EMI test results.
Note 5: The snubber circuit can be removed while the PVDD <=20V.
Note 6: The bead (option component) can be removed if the system EMI test result is good
enough.
AD82587D
7/45
Logic
470F Pin 0 1
-
PD Power Down Normal
+
LA
RA
RB
Revision: 1.6
PLL Enable External
VDDRB
VDDLA
GNDR
VDDRA
RB
GNDL
VDDLB
LA
RA
LB
PLL
MCLK (Note 9) (Note 8)
CLK_OUT (Note 7)
LA
DGND 22H 1nF
470pF
0.1F 3A
DVDD 10
470nF
DEF 10
Speaker
AD82587D 22H
470pF 3A 1nF
LB
(Note 7)
SDATA 3.3V
DVDD
0.1F
(Note 9) (Note 8)
Reset
BCLK
4.7K 4.7K 3A
SCL
SA0
SA1
PD 10
SDA
470nF
3.3V 3.3V 10
Speaker
1M 1M 22H
470pF 3A 1nF
RB
1F 1F
(Note 7)
Note 7: When concerning about short-circuit protection or performance, it is suggested using
the choke with its IDC larger than 5A.
ESMT
Note 8: These capacitors should be placed as close to speaker jack as possible, and their
values should be determined according to EMI test results.
Note 9: The snubber circuit can be removed while the PVDD <=20V.
AD82587D
Revision: 1.6
LB
LA
RA
RB
GNDR
VDDLA
VDDRA
VDDLB
RA
LA
LB
10
Speaker
DGND 470pF BEAD 220nF
3.3V ≧3A
10 10H
100nF
ERROR
6A 1nF
MONO
10nF
LRCIN
Reset
BCLK
4.7K 4.7K
SCL
SA0
SA1
10
PD SDA BEAD (Note 10)
470pF ≧3A
3.3V 3.3V RB
1M 1M
3.3V
1F 1F
ESMT
Note 10: When concerning about short-circuit protection or performance, it is suggested using
the choke with its IDC larger than 10A.
Note 11: These capacitors should be placed as close to speaker jack as possible, and their
values should be determined according to EMI test results.
ESMT AD82587D
Electrical Characteristics and Specifications for Loudspeaker
Stereo output with 24V supply voltage
o
Condition: TA=25 C, DVDD=3.3V, VDDL=VDDR=24V, FS=48kHz, Load=8 with passive LC lowpass filter
(L=22μ H with RDC=0.12Ω , C=470nF); Input is 1kHz sinewave. Volume is 0dB unless otherwise specified.
2
THD+N (%)
1
0.5
10kHz
0.2
1kHz
0.1
20Hz
0.05
0.02
0.01
1m 2m 5m 10m 20m 50m 100m 200m 500m 1 2 5 10 20 50 100
Output Power (W)
1
0.5W
0.5
0.2
0.1
0.05
0.02
0.01
20 50 100 200 500 1k 2k 5k 10k 20k
Frequency (Hz)
Cross-talk (Stereo)
+0
24V, 8Ω
-20 Stereo
PO=1W
Non-shield Choke
-40
Cross-talk (dBr)
-60
-80
-100
-120
20 50 100 200 500 1k 2k 5k 10k 20k
Frequency (Hz)
+0.4 +0.4
+0.2 +0.2
dBr
+0 +0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 -0.8
-1 -1
20 50 100 200 500 1k 2k 5k 10k 20k
Frequency (Hz)
100
90
80
12V
70
15V
Efficiency(%)
60
18V
50 24V
40
30
20
10
0
0 10 20 30 40 50 60 70
2CH Output Power(W)
100
90
80
70 Power saving mode enable
Efficiency(%)
Quaternary to Ternary
60 W/O power saving mode
switching level: 30
50
40
30
20
24V, 8Ω
10 Stereo
0
0 10 20 30 40 50 60 70
2CH Output Power(W)
2
THD+N (%)
1
0.5
10kHz
0.2
0.1 1kHz
20Hz
0.05
0.02
0.01
1m 2m 5m 10m 20m 50m 100m 200m 500m 1 2 5 10 20 50 100
Output Power (W)
1 2W
1W
0.5
0.2
0.1
0.05
0.02
0.01
20 50 100 200 500 1k 2k 5k 10k 20k
Frequency (Hz)
+0.4 +0.4
+0.2 +0.2
dBr
+0 +0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 -0.8
-1 -1
20 50 100 200 500 1k 2k 5k 10k 20k
Frequency (Hz)
100
90
80
70 12V
15V
Efficiency(%)
60
18V
50 24V
40
30
20
10
0
0 10 20 30 40 50 60 70
Output Power(W)
100
90
80
70 Power saving mode enable
Quaternary to Ternary
Efficiency(%)
0
0 10 20 30 40 50 60
Output Power(W)
BCLK
BCLK
BCLK
MCLK t HIGH
t LR
BCLK
t BCC
SDATA MSB MSB
tDS tDH
I2C Timing
-103 dB -103 dB
time time
t arg et ( dB ) original ( dB )
(10 80
10 80
) x512x(1/ 96K )
The volume level will be decreased to -∞dB in several LRCIN cycles. Once the fade-out procedure is
finished, AD82587D will turn off the power stages, clock signals (for digital circuits) and current (for analog
circuits). After PD pin is pulled low, AD82587D requires Tfade to finish the forementioned work before
entering power down state. Users can not program AD82587D during power down state. Also, all settings in
the registers will remain intact unless DVDD is removed.
If the PD signal is removed during the fade-out procedure (above, right figure), AD82587D will still execute
the fade-in procedure. In addition, AD82587D will establish the analog circuits’ bias current and send the
clock signals to digital circuits. Afterwards, AD82587D will return to its normal status.
2
When using AD82587D without I C control interface, the operation is as follows.
Multiple edge
MCLK/FS Setting PWM Career
Fs MCLK Frequency evaluation for
Ratio for PLL Frequency
master clock
48kHz 256x 12.288MHz 4x 384kHz
44.1kHz 256x 11.289MHz 4x 352.8kHz
32kHz 256x 8.192MHz 4x 256kHz
Anti-pop design
AD82587D will generate appropriate control signals to suppress pop sounds during initial power on/off,
power down/up, mute, and volume level changes.
(i) When the internal junction temperature is higher than 160℃, power stages will be turned off and
AD82587D will return to normal operation once the temperature drops to 125℃. The temperature values
may vary around 10%.
(ii) The short-circuit protection circuit protects the output stage when the wires connected to loudspeakers
are shorted to each other or GND/VDD. For normal 24V operations, the current flowing through the
power stage will be less than 5Afor stereo configuration or less than 10A for mono configuration.
Otherwise, the short-circuit detectors may pull the ERROR pin to DGND, disabling the output stages.
When the over-temperature or short-circuit condition occurs, the open-drain ERROR pin will be pulled
low and latched into ERROR state. Once the over-temperature or short-circuit condition is removed,
AD82587D will exit ERROR state when one of the following conditions is met: (1) RESET pin is pulled
2
low, (2) PD pin is pulled low, (3) Master mute is enabled through the I C interface.
(iii) Once the DVDD voltage is lower than 2.7V, AD82587D will turn off its loudspeaker power stages and
cease the operation of digital processing circuits. When DVDD becomes larger than 2.8V, AD82587D
will return to normal operation.
(iv) If the master clock inputted into MCLK pin stops during the period for 500 ns or more, AD82587D detect
the stop of MCK. In this state, amplifier outputs are forced to Weak Low. If master clock is inputted
normally again, ERROR pin is set to low. AD82587D won’t leave ERROR state until one of the
following conditions: (1) Reset pin is pulled low, (2) PD pin is pulled low, (3) Programming master mute
2
via I C interface.
PD pin is set to low, when stop the clock inputted into MCLK, BCLK, and LRCIN during operation.
(v) If it will be in the state where PVDD power supply is OFF and DVDD power supply is ON, ERROR pin
is set to Low.
PVDD
t1 t8
DVDD
t2 t3 t12 t3
MCLK
BCLK
LRCIN
t4 t5 t13 t5
RESET
t6 t7
PD
t9 t10
I2C active
I2 C De-Mute
t 11 t 14 t 15
LA , LB ,
RA , RB
PVDD
DVDD
t4 t5
MCLK
BCLK, t3
LRCIN
t2
/RESET
t1
/PD
Don’t care
I2C
LA, LB,
RA, RB
Protocol
START and STOP condition
START is identified by a high to low transition of the SDA signal.. A START condition must precede
any command for data transfer. A STOP is identified by a low to high transition of the SDA signal. A
STOP condition terminates communication between AD82587D and the master device on the bus. In
both START and STOP, the SCL is stable in the high state.
Data validity
The SDA signal must be stable during the high period of the clock. The high or low change of SDA only
occurs when SCL signal is low. AD82587D samples the SDA signal at the rising edge of SCL signal.
Device addressing
The master generates 7-bit address to recognize slave devices. When AD82587D receives 7-bit
address matched with 0110x0y for E-LQFP 48L package (where x and y can be selected by external
SA0 and SA1 pins, respectively) and address matched with 0110x00 for E-TSSOP 24L package
th th
(where x can be selected by external SA0 pin), AD82587D will acknowledge at the 9 bit (the 8 bit is
for R/W bit). The bytes following the device identification address are for AD82587D internal
sub-addresses.
Data transferring
Each byte of SDA signaling must consist of 8 consecutive bits, and the byte is followed by an
acknowledge bit. Data is transferred with MSB first, as shown in the figure below. In both write and
read operations, AD82587D supports both single-byte and multi-byte transfers. Refer to the figure
below for detailed data-transferring protocol.
START ACK ACK ACK STOP
Byte DEV_ADDR SUB_ADDR DATAIN
Write
R/W
START ACK ACK ACK ACK STOP
Multi-Byte DEV_ADDR SUB_ADDR DATAIN DATAIN
Write
R/W
NO
Random START ACK ACK ACK ACK STOP
Address DEV_ADDR SUB_ADDR DEV_ADDR DATAIN
Read
R/W START R/W
NO
Sequential START ACK ACK ACK ACK ACK ACK STOP
Random DEV_ADDR SUB_ADDR DEV_ADDR DATAIN DATAIN
Read
R/W START R/W
DTC
control
L
Volume Power Power Interpolation
ASRC HPF SDM PWM
BCLK control Limt Clipping filter
LRCIN
L/R Ex- Power
SDATA DAII Stage
change Mixing
R
Volume Power Power Interpolation
ASRC HPF SDM PWM
control Limt Clipping filter
DTC
control
Address Register B[7] B[6] B[5] B[4] B[3] B[2] B[1] B[0]
0X00 SCTL1 IF[2] IF[1] IF[0] LREXC PWML_X PWMRX PwmMode NGE
0X02 SCTL 3 EN_CLKO HPB LV_UVSEL SW_RSTB MUTE CM1 CM2 CompSDMEn
0X03 MVOL MV[7] MV[6] MV[5] MV[4] MV[3] MV[2] MV[1] MV[0]
0X04 C1VOL C1V[7] C1V[6] C1V[5] C1V[4] C1V[3] C1V[2] C1V[1] C1V[0]
0X05 C2VOL C2V[7] C2V[6] C2V[5] C2V[4] C2V[3] C2V[2] C2V[1] C2V[0]
0X08 LAR LA[3] LA[2] LA[1] LA[0] LR[3] LR[2] LR[1] LR[0]
0X0A Reserved
0X11 ATM ATM[7] ATM[6] ATM[5] ATM[4] ATM[3] ATM[2] ATM[1] ATM[0]
0X12 ATB ATB[7] ATB[6] ATB[5] ATB [4] ATB [3] ATB [2] ATB [1] ATB [0]
0X14 PCM PCM[7] PCM[6] PCM[5] PCM[4] PCM[3] PCM[2] PCM[1] PCM[0]
0X15 PCB PCB[7] PCB[6] PCB[5] PCB [4] PCB [3] PCB [2] PCB [1] PCB [0]
DIS_ZD
0X16 NGG Reserved Reserved NG_GAIN[1] NG_GAIN[0]
_FADE
0X19 Reserved
0X1A NGALT NGALT[7] NGALT[6] NGALT[5] NGALT[4] NGALT[3] NGALT[2] NGALT[1] NGALT[0]
0X1B NGALM NGALM[7] NGALM[6] NGALM[5] NGALM[4] NGALM[3] NGALM[2] NGALM[1] NGALM[0]
0X1C NGALB NGALB[7] NGALB [6] NGALB [5] NGALB [4] NGALB [3] NGALB [2] NGALB [1] NGALB [0]
0X1D NGRLT NGRLT[7] NGRLT[6] NGRLT[5] NGRLT[4] NGRLT[3] NGRLT[2] NGRLT[1] NGRLT[0]
0X1E NGRLM NGRLM[7] NGRLM[6] NGRLM[5] NGRLM[4] NGRLM[3] NGRLM[2] NGRLM[1] NGRLM[0]
0X1F NGRLB NGRLB[7] NGRLB [6] NGRLB[5] NGRLB[4] NGRLB [3] NGRLB [2] NGRLB [1] NGRLB [0]
0X20 DRC_ECT DRC_ECT[7] DRC_ECT[6] DRC_ECT[5] DRC_ECT[4] DRC_ECT[3] DRC_ECT[2] DRC_ECT[1] DRC_ECT[0]
0X21 DRC_ECB DRC_ECB[7] DRC_ECB[6] DRC_ECB[5] DRC_ECB[4] DRC_ECB[3] DRC_ECB[2] DRC_ECB[1] DRC_ECB[0]
0X23 RTM RTM[7] RTM[6] RTM[5] RTM[4] RTM[3] RTM[2] RTM[1] RTM[0]
0X24 RTB RTB[7] RTB[6] RTB[5] RTB [4] RTB [3] RTB [2] RTB [1] RTB [0]
AD82587D also provides MONO configuration via register bit 3 of address 0X07. The output configuration
(please refer to the page 8, Mono application circuit) shall be right connected before Mono configuration
enable. That’s possible to damage chips due to channel shoot-through if the wrong output configuration is
connected.
Normal Normal
Power - On PD = L
Operation Operation
PVDD
DVDD
MCLK
BCLK
LRCIN
RESET
PD
LA , LB ,
RA , RB
% 0.3
0.2
0.08
0.06
0.04
2 3 4 5 6 7 8 9 10 20
W
The following table shows the power clipping level’s numerical representation.
o
Release threshold is always 10 C smaller than attack threshold.
For example:
o o
DTC threshold (attack threshold) =130 C, the release threshold = 120 C.
o o
DTC threshold (attack threshold) =120 C, the release threshold = 110 C.
o
If junction temperature (Tj) exceeds 130 C, amplifier gain will be lowered to timing of 1dB/sec. If amplifier
o o
gain falls and junction temperature (Tj) turns into less than 130 C and larger than 120 C, the gain will not
o
increase or decrease. If amplifier gain falls and junction temperature (Tj) turns into less than 120 C,
amplifier gain will be raised to timing of 1dB/sec.
The following table shows the noise gate attack and release threshold level’s numerical representation.
DRC_EC
x2 [n] xrms[n]
Z-1
1-DRC_EC
The above figure illustrates the digital processing of calculating RMS signal power. In this processing, a DRC
energy coefficient is required, which can be programmed for different frequency range. Energy coefficient is
defined by 16-bit representation composed of registers controlled by I2C. The device addresses of DRC energy
coefficient are 0X20, and 0X21. The following table shows the DRC energy coefficient numerical representation.
The following table shows the attack and release threshold’s numerical representation.
Attack threshold
Release threshold
INPUT
Release threshold
Attack threshold
Δ gain2
GAIN
Δ gain1
Attack rate=Δ gain1/Δt1
Δ t1 Δ t2 Release rate=Δ
gain2/Δt2
Touch attack
threshold Under release
threshold
Attack threshold
Release threshold
OUTPUT
Release threshold
Attack threshold
D1
D
48 37 37 48
1 36 36 D2 1
E2 DETAIL A
E E1
12 25 25 12
13 24 24 13
c
TOP VIEW BOTTOM VIEW
A1
b e L
24 13
D2
E2 E E1 DETAIL A
PIN#1
MARK 1 12
c
TOP VIEW
D
A
A1
b e
L
SIDE VIEW
Important Notice
All rights reserved.
ESMT's products are not authorized for use in critical applications such as,
but not limited to, life support devices or system, where failure or abnormal
operation may directly affect human lives or cause physical injury or property
damage. If products described here are to be used for such kinds of
application, purchaser must do its own quality assurance testing appropriate
to such applications.