Programming Manual

TPSys® Version 2.4

MY Series and TP Series
MYDATA Component Placement Machines
English

P-020-0024-EN

®
For a fast changing world
MYDATA automation AB Preface

Programming Manual

TPSys Version 2.4

MY Series and TP Series

of

MYDATA Component Placement Machines

English

P-020-0024-EN Programming Manual Rev. 0000 2004-01 i

Preface MYDATA automation AB

This document is intended for MYDATA component placement machines. These machines can be run with
MYDATA SYS program version 2.9 or MYDATA TPSys program version 1.x and 2.x. This document applies to the
MYDATA TPSys version 2.4.
This document describes a standard machine and optional equipment available for the machine and magazines.
Depending on your system you may lack some of the features described.

This system uses the ms unit for time. Length is measured in mm, but inch can be selected.

National special characters and some non-letter/non-figure characters cannot be entered into the system, for
instance in board names and layout names. However, this version of TPSys allows the following characters to be
used: " ’ ‘ \ $ ; ^ @
In this document angle brackets <> are used to indicate certain key names contrary to a sequence of key strokes.
Example: <Del> = the Del(ete) key, Del = the D, e, l key sequence.
Hardware and software mentioned in this document are subjected to continuous development and improvement.
Consequently, there may be minor discrepancies between the information in the document and the performance or
design of the product. Specifications, dimensions and other statements mentioned in this document are subject to
changes without prior notice.
Federal Communications Commission (FCC)
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his own expense.

IMPORTANT

Read the Safety chapter before starting the machine.

MYDATA and its suppliers shall not be liable for any damages related to this software or hardware, or for any other damages whatsoever caused of
the use of or inability to use any MYDATA product. This is applicable even if MYDATA has been advised of the damage risk. Under any
circumstances, MYDATA’s entire liability shall be limited to replace such defective software or hardware which was originally purchased from
MYDATA.
MYSpeed, SYS2.9, TEX, TMFlex, TRAYWagon Magazine, TUBEFork and YWagon are trademarks, and TPSys, Agilis, HYDRA SpeedMount,
MYLink and TM8 are registered trademarks of MYDATA automation AB. The MY... and TP... pick and place machine names are either trademarks
or registered trademarks of MYDATA automation AB. DOS is a trademark of Microsoft Corporation. Other trademarks mentioned in this document
are trademarks or registered trademarks of their respective owners.

Printed in Sweden.

MYDATA automation AB, Adolfsbergsvägen 11, S-168 66 Bromma, Sweden.

Phone: +46 8 475 55 00 – Fax: +46 8 475 55 01 – Internet: www.mydata.se

This document or parts of it may not be reproduced without the written permission of MYDATA
automation AB. Infringements will be prosecuted. All rights reserved.

Copyright © MYDATA automation AB, Sweden, 1990 – 2004.

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MYDATA automation AB Preface

Contents
New Features in TPSys 2.4 ............................................................................ vii
About This Manual ........................................................................................ viii
1. Safety ............................................................................................................ 1 - 1
Emergency Stop Buttons ......................................................................... 1-3
Emergency Movement of Machine Elements ......................................... 1-4
Warning Signs .......................................................................................... 1-5
MY9 and MY12 Warning Signs ........................................................... 1-6
MY15 and MY19 Warning Signs ......................................................... 1-7
TP9-2U Warning Signs ....................................................................... 1 - 10
Type Plate ................................................................................................. 1 - 13
Warnings in the Manual .......................................................................... 1 - 14
Noise ......................................................................................................... 1 - 14

2. Getting Started ............................................................................................. 2 - 1

Allowed Characters .................................................................................. 2-2
Programming Methods ............................................................................ 2-2
Manual Insertion/Removal of Tools/Components .................................. 2-2
Training Boards and Layouts .................................................................. 2-3
Boards To Be Programmed ................................................................. 2-3
Layouts To Be Programmed ............................................................... 2-4
Programming PCB ................................................................................... 2-5
Having at Hand when Programming ................................................. 2-5
Creating a New Layout ....................................................................... 2-6
Adding a New PCB to the Layout ....................................................... 2-8
Programming the PCB Header Information ..................................... 2 - 11
Adding Components to the PCB ......................................................... 2 - 20
Programming Panel – Method 1 ............................................................. 2 - 27
Programming the PCB ........................................................................ 2 - 28
Creating a Layout for the Panel ......................................................... 2 - 29
Adding a New Panel to the Layout ..................................................... 2 - 31
Programming the Panel Header Information ................................... 2 - 34
Inserting the PCBs into the Panel ..................................................... 2 - 35
Programming Panel – Method 2 ............................................................. 2 - 38
Creating a Layout for the Panel ......................................................... 2 - 39
Adding a New Panel to the Layout ..................................................... 2 - 40
Programming the Panel Header Information ................................... 2 - 41
Inserting New PCB into the Panel ..................................................... 2 - 42
Programming the PCB ........................................................................ 2 - 44
Programming the Additional PCBs .................................................... 2 - 45
Creating Layout ....................................................................................... 2 - 46
Creating a New Layout ....................................................................... 2 - 47
Adding Boards to the Layout .............................................................. 2 - 49
Identical and Almost Identical Boards .................................................... 2 - 53
Training Boards ....................................................................................... 2 - 54

3. Basic Systems and Features ........................................................................ 3-1

Machine Functions and Coordinates ...................................................... 3-2
Vision Systems ......................................................................................... 3-5
Cameras in the Vision System ............................................................ 3-6
Fiducial Marks .......................................................................................... 3-7
Coordinate Systems ............................................................................. 3-8
Defining Fiducial Marks ..................................................................... 3 - 13
Locating Boards ................................................................................... 3 - 21
Angles ........................................................................................................ 3 - 24
Centering .................................................................................................. 3 - 26
Mechanical Centering – Single Mount Head ..................................... 3 - 26
Optical Centering – Single Mount Head ............................................ 3 - 26
Optical Centering – HYDRA Unit ...................................................... 3 - 27
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Preface MYDATA automation AB

Verification ............................................................................................... 3 - 28
Package Verification ............................................................................ 3 - 28
Electrical Verification .......................................................................... 3 - 28
Rejected Components .......................................................................... 3 - 29
Rotating Diodes Picked Back to Front ............................................... 3 - 29
Electrical Verifier ..................................................................................... 3 - 30
Centering Level .................................................................................... 3 - 30
Orientation – Polarized Capacitors .................................................... 3 - 32
Orientation – Diodes in 2-pole Packages ............................................ 3 - 33
Orientation – Diodes in SOT23 Package ............................................ 3 - 34
Orientation – Transistors in SOT23 Package .................................... 3 - 38
Orientation – Transistors in SOT89 Package .................................... 3 - 40
Verification Data .................................................................................. 3 - 42
Standard Mount and Glue Tools ............................................................. 3 - 45
Spring Tools ......................................................................................... 3 - 47
HYDRA Mount Tools ............................................................................... 3 - 48
HYDRA Speedmount ATE ....................................................................... 3 - 49
ATE Software ....................................................................................... 3 - 49
HYDRA Tools ....................................................................................... 3 - 49
HYDRA Tool Tubes ............................................................................. 3 - 50
HYDRA Tool Bank .............................................................................. 3 - 50
Disk Formatting ....................................................................................... 3 - 52
Digitizer .................................................................................................... 3 - 53
TPSys Barcode Reader ............................................................................. 3 - 55
Configuration ....................................................................................... 3 - 55
Off-Line Usage ..................................................................................... 3 - 55

4. Component List ............................................................................................ 4 - 1

Component List Editor ............................................................................ 4 - 2
Magazine Search .................................................................................. 4 - 8

5. Package List .................................................................................................. 5 - 1

Package List Editor .................................................................................. 5-2
Accelerations ............................................................................................. 5 - 10
Optical Centering ..................................................................................... 5 - 14
BGA Packages ...................................................................................... 5 - 22
Test Centering ..................................................................................... 5 - 24
Packag types ............................................................................................. 5 - 26
Package ................................................................................................ 5 - 28
Three pole package .............................................................................. 5 - 30
Two symmetric lead groups ................................................................ 5 - 32
Four symmetric lead groups ............................................................... 5 - 34
Two plus two symmetric lead groups ................................................. 5 - 36
Four lead groups on two sides ............................................................. 5 - 40
BGA package ........................................................................................ 5 - 44
Generic BGA package .......................................................................... 5 - 48
Outline package ................................................................................... 5 - 58
Generic ................................................................................................. 5 - 60
Programming Example, Generic ........................................................ 5 - 64
Selecting Package Type ....................................................................... 5 - 66
Lead Types ........................................................................................... 5 - 67
Max cross-wise deviation ..................................................................... 5 - 68
Max length-wise deviation .................................................................. 5 - 68
Max length-wise deformation ............................................................. 5 - 69
Centering Phases ...................................................................................... 5 - 70
Guidelines for Programmable Illumination ....................................... 5 - 77
Glue Dots .................................................................................................. 5 - 78

6. Magazine Lists .............................................................................................. 6 - 1

Removable Feeder List Editor ................................................................. 6-4
Tape and Vibratory Magazine List .......................................................... 6-7
Tape Magazine Contents ..................................................................... 6 - 11
The Agilis Magazine ............................................................................ 6 - 14
Vibratory Magazine Contents ............................................................. 6 - 16

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MYDATA automation AB Preface

Y-Wagon Magazine List ........................................................................... 6 - 17

Locating Trays on the Assembly Table .............................................. 6 - 23
Y-Wagon Position List ......................................................................... 6 - 25
The Structure of the Y-Wagon Magazine List ................................... 6 - 29
Tray Wagon Magazine List ...................................................................... 6 - 30
Locating Trays on the Tray Wagon .................................................... 6 - 31
Tray Wagon Position List ................................................................... 6 - 32
The Structure of the Tray Wagon Magazine List .............................. 6 - 33
Pallet Magazine List ................................................................................ 6 - 34
Locating Trays on the Pallets ............................................................. 6 - 35
Pallet List ............................................................................................. 6 - 36
Pallet Position List .............................................................................. 6 - 39
The Structure of the Tray Pallet Magazine List ............................... 6 - 41
Tray Type List .......................................................................................... 6 - 42
HYDRA Preparation ................................................................................ 6 - 49
Preparing a Layout for HYDRA ......................................................... 6 - 50
HYDRA Preparation Editor ................................................................ 6 - 51
Edit HYDRA Preparation Values ....................................................... 6 - 57
Modified Preparation Values .............................................................. 6 - 58
HYDRA Preparation Printout ............................................................ 6 - 59
HYDRA Preparation Parameters ....................................................... 6 - 60

7. Mount Lists ................................................................................................... 7 - 1

Terminology .............................................................................................. 7-2
The Purpose of the Mount Lists .............................................................. 7-3
PCB, Panel and Layout ............................................................................ 7-3
PCB ...................................................................................................... 7-4
Panel ..................................................................................................... 7-5
Layout .................................................................................................. 7-6
Mount List Structure Diagram ............................................................... 7-7
Layout List Editor .................................................................................... 7-8
Layout Editor ........................................................................................... 7 - 10
Layout Header Information ................................................................ 7 - 12
Panel Editor .............................................................................................. 7 - 14
Inserting a Single PCB into a Panel ................................................... 7 - 18
Inserting a Matrix of PCBs into a Panel ............................................ 7 - 19
Panel Header Information .................................................................. 7 - 21
PCB Editor ............................................................................................... 7 - 24
Component Positioning ....................................................................... 7 - 32
PCB Header Information .................................................................... 7 - 37
Board Level Measurement .................................................................. 7 - 39
Panel List .................................................................................................. 7 - 40
PCB List .................................................................................................... 7 - 42

8. Miscellaneous Lists ...................................................................................... 8-1

Fiducial Mark List .................................................................................... 8-2
Glue Dot List ............................................................................................ 8-8
Verifying a Glue Dot ............................................................................ 8 - 12
User List ................................................................................................... 8 - 13
User List Editor ................................................................................... 8 - 14
Security On/Off .................................................................................... 8 - 19
Log On/Off ........................................................................................... 8 - 19

Appendix A – Packages .................................................................................... A - 1

How To Program a New Package ............................................................ A - 2
Autoteach .................................................................................................. A - 3
Teach Types ......................................................................................... A - 5
Autoteach of BGA Packages ............................................................... A - 7
Autoteach of Leaded Devices .............................................................. A - 10
Autoteach of Chip and Outline Packages ........................................... A - 14
Error Messages for Autoteach ............................................................ A - 15
Package Survey ........................................................................................ A - 16
0201 to 2412 ......................................................................................... A - 17
Resistor network .................................................................................. A - 19

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Preface MYDATA automation AB

BGA, CBGA, LBGA, MBGA, PBGA .................................................. A - 21

CBGA, CCGA ...................................................................................... A - 23
M3216 to M8345 ................................................................................. A - 25
MELF, Micro-MELF, Mini-MELF, Maxi-MELF .............................. A - 28
PLCC ................................................................................................... A - 30
CQFP, FQFP, LQFP, MQFP, PQFP, TQFP ..................................... A - 32
SO, SSOP ............................................................................................ A - 34
SOD ..................................................................................................... A - 37
SOJ, LSOJ ........................................................................................... A - 39
SOT, SC ............................................................................................... A - 41
TO ........................................................................................................ A - 44
TSOP, TSSOP ..................................................................................... A - 46
PLCC Socket ....................................................................................... A - 48

Appendix B – Menu Reference Guide ............................................................ B-1

Shortcuts .................................................................................................. B-2
Hot Menu ................................................................................................. B-4
Main Menu ............................................................................................... B-5
Production ........................................................................................... B-5
Magazine ............................................................................................. B-8
Editor ................................................................................................... B - 12
Print .................................................................................................... B - 14
Utility .................................................................................................. B - 16
Exit ...................................................................................................... B - 21
About... ................................................................................................ B - 22
Switches ................................................................................................... B - 26
1001 Test switches .............................................................................. B - 29
1002 Assembly switches ..................................................................... B - 32
1003 Bad board search ....................................................................... B - 38
1004 Conveyor switches ..................................................................... B - 39

Appendix C – About the Documentation ....................................................... C-1

Operator's Manual ................................................................................... C-2
Programming Manual ............................................................................. C-2
Machine Manual ...................................................................................... C-3
Maintenance Guide ................................................................................. C-3
Software Manual ..................................................................................... C-4
Spare Parts Catalog ................................................................................. C-4
Supplementary software ......................................................................... C-5
CAD Conversion ................................................................................. C-5
MYSpeed .............................................................................................. C-5
MYLabel .............................................................................................. C-5

Index ................................................................................................................... I - 1
Questionnaire .................................................................................................. Q - 1

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MYDATA automation AB Preface

New Features in TPSys 2.4

Main features added to TPSys version 2.4 are:
Hardware Support for the Agilis Linear Magazines

Automatic location of fiducial marks on inserted magazines

Autoteach Illumination and vision data for packages

Chip and outline packages

Interactive add and remove

Miscellaneous Bar code handling of trays and tray positions

Look before pick for components in trays

Different pitch in X and Y direction for generic BGAs

Change package for all components with specified package

WWW access from TPSys machine

HYDRA Pick from TM-flex and vibratory magazines

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Preface MYDATA automation AB

About This Manual

MYDATA strives to provide documentation that is complete,
accurate, informative and friendly. Your feedback is welcome! Please
mail, or fax, the questionnaire that you find at the end of the manual
to us. You can also e-mail your comments to: docs@mydata.se

For clarity, the manual uses several conventions to present

information of special importance.

Lists of items, points to consider, or procedures that do not need to

be performed in a specific order appear in bullet or hyphenated
format:

• Item 1
• Item 2
or

– Item 1
– Item2

Procedures that must be performed in a specific order appear in

numbered steps:

1. Perform this step first

2. Perform this step second
Specific keyboard keys are depicted in <- brackets, for example
<Esc>. If more than one key should be pressed simultaneously, the
notation appears as <Key1> + <Key2>, for example <Ctrl> +
<F1>.

Screen prompts, menu and window names and appear in bold type.
Where you need to access a menu, command or submenu, the syntax
is Menu>Submenu.

For example Editor>Component mean: You open the Editor

pull-down menu and select Component.

Fields within editors or boxes appear in italics. For example: Name

Program code appears in standard Courier font, for example:

Login: tpsys
$ go

A pointing finger denotes important information.

This is a warning to alert you to potentially harmful consequences.

This icon means that an emergency stop button shall be pressed

down or the power turned off.

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MYDATA automation AB Safety

Safety
Before starting the machine, it is necessary that the operator,
foreman and any other personnel involved in the machine operation,
maintenance or service understand and follow these points:

• This machine is designed to pick components from their packaging

and place them onto printed circuit boards, and to apply adhesive.
The machine must be used exclusively for these two purposes and
nothing else.

• The machine must be operated by trained personnel only.

• All personnel involved in machine operation must understand the
use of the emergency stop buttons and how to manually move
machine elements in case of emergency. See the sections entitled
Emergency Stop Buttons and Emergency Movement of Machine
Elements in this chapter.

• Anyone operating this machine must obey all warning signs. See
the Warning Signs section in this chapter.

• At least one manual that describes the warning signs of the

particular machine type must always be kept, for instance if the
machine is upgraded with a later TPSys version.

• Apart from the daily maintenance described in the Operator's

Manual, the machine is to be serviced by authorized maintenance
engineers only.

• Excess component tape from the tape magazines shall be cut from
the front of the machine when it is not in operation.

• Tools shall be inserted or removed from the rear of the machine

when the tool bank is located on the rear of the Y wagon. For
machines where the tool bank is located somewhere else, tools can
be changed from the front of the machine. When inserting or
removing tools to or from the tool bank, the emergency stop button
shall be pressed down.

• An emergency stop button shall be pressed down when a tool or

component is manually inserted or removed from the X wagon of
the machine.

• If there is a risk that any unauthorized personnel might alter the

system settings and thus the behaviour of the machine, then the
logon facility for individual access rights has to be used.

• Ensure that all covers and shields are intact, mounted and closed
while the machine is in operation.

• Do not disable or disengage any safety switch or sensor.

• Do not configure or modify MYDATA machines or devices without
consulting MYDATA. The machines, devices or the interfaces
between them might be unsafe.

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Safety MYDATA automation AB

• Do not use chemicals or other substances which may have any

influence on the operator or other personnel involved in the
machine operation.

• Handle the monitors carefully. They contain glass electron tubes

evacuated from air which may implode if damaged.

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MYDATA automation AB Safety

Emergency Stop Buttons

All MYDATA placement machines have emergency stop buttons that
are red and stop all machine movements immediately when pressed
down.

All MY machines have two emergency stop buttons located at the

front of the machine frame. These emergency stop buttons are
released by being turned clockwise.

The TP9-2U machine has one emergency stop button located at the
front of the machine frame. This emergency stop button is released
by being pulled up.

Important
An emergency stop button must always be pressed down when hands,
fingers, tools or other objects are within a shielded area or in the risk
area of movable machine elements such as Y wagon or Tray Wagon
Magazine.

Emergency stop buttons on all MYDATA optional devices, such as

tray elevators and conveyor systems, have the same function, that is
to switch all motors off and release movable machine elements.

Activating a stop system in an optional device, for instance opening

a TEX Tray Exchanger door, stops only the optional device. The
placement machine is not stopped by such an action.

Restart
To restart a machine after an emergency stop button has been
released, enter a command on the keyboard.

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Safety MYDATA automation AB

Emergency Movement of Machine Elements

MY9, MY12, MY15 and MY19

On the MY machines, the X wagon, Y wagon, and Tray Wagon can be
moved manually after pressing both the emergency stop buttons
down, provided that the power is on.

If an accident has occurred and an emergency movement of a

machine element is required, use the following procedure:
Learn this by heart!
1. Press both the emergency stop buttons down.

2. Leave the power on.

3. Move the machine element away by hand.

TP9-2U
On the TP9-2U machine, the X wagon, Y wagon, and Tray Wagon
can be moved manually after pressing the emergency stop button
down, provided that the power is on.

If an accident has occurred and an emergency movement of a

machine element is required, use the following procedure:
Learn this by heart!

1. Press the emergency stop button down.

2. Leave the power on.

3. Move the machine element away by hand.

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MYDATA automation AB Safety

Warning Signs
The warning signs on the machine must be observed as this machine
contains fast moving parts and high voltage.

The machine has warning signs placed as shown on the following

pages. The figure numerals refer to the following descriptions.

Note that at least one manual that describes the warning signs of the
particular machine type must always be kept, for instance if the
machine is upgraded with a later TPSys version.

Optional devices have the warning signs shown in their manuals

except for the TEX unit which has the warning signs detailed in the
TEX Tray Exchanger section in Chapter 5 of the Operator's Manual.

All signs must be kept clean and readable.

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Safety MYDATA automation AB

MY9 and MY12 Warning Signs

ONLY MYDATA APPROVED

EQUIPMENT MAY BE
CONNECTED HERE

Figure 1-1. MY9 and MY12 warning signs

MY9 and MY12 have the same set of warning signs. Figure 1-1 shows
the MY12 machine.

Number and position of each sign type is described in the following

text. If a sign is missing, it must be replaced immediately. Part
numbers are printed on the signs, but can also be read from this
description.

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MYDATA automation AB Safety

MY15 and MY19 Warning Signs

ONLY MYDATA APPROVED

EQUIPMENT MAY BE
CONNECTED HERE

Figure 1-2. MY15 and MY19 warning signs

MY15 and MY19 have the same set of warning signs. Figure 1-2
shows the MY15 machine.

Number and position of each sign type is described in the following

text. If a sign is missing, it must be replaced immediately. Part
numbers are printed on the signs, but can also be read from the
following description.

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Safety MYDATA automation AB

Sign 1 (D-010-0051-ENA/ENE America/Europe) warns of the fast

X-wagon movement. No hands, fingers, or other objects are allowed
beyond the glass shield.

This sign is applied as follows:

MY9, MY12
– 2 signs on the glass shield.

MY15, MY19
– 4 signs on the glass shield.

Sign 2 (D-010-0052-ENA/ENE America/Europe) warns of the

optional Tray Wagon Magazine movements.

This sign is applied as follows:

– 2 signs on the Tray Wagon Magazine (optional).

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MYDATA automation AB Safety

Sign 3 (K-049-0073) warns of electric shock. Units on which this sign

is placed contain dangerous voltage levels. Power must be switched
off before opening the unit. Only authorized service personnel are
allowed to operate the machine when such a unit is open.

This sign is applied as follows:

– 1 sign at the mains switch.
– 1 sign on the power supply unit at the rear of the machine.

Sign 4 (D-049-0047-EN) alerts that only MYDATA approved

equipment is allowed to be connected to the power supply unit outlet.

This sign is applied as follows:

– 1 sign on the power supply unit at the rear of the machine.

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Safety MYDATA automation AB

TP9-2U Warning Signs

ONLY MYDATA APPROVED

EQUIPMENT MAY BE
CONNECTED HERE

Figure 1-3. TP9-2U warning signs

Number and position of each sign type is described in the following

text. If a sign is missing, it must be replaced immediately. Part
numbers are printed on the signs, but can also be read from the
following description.

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MYDATA automation AB Safety

Sign 1 (D-010-0051-ENA/ENE America/Europe) warns of the fast

X-wagon movement. No hands, fingers, or other objects are allowed
beyond the glass shield.

This sign is applied as follows:

– 3 signs on the glass shield.

Sign 2 (D-010-0052-ENA/ENE America/Europe) warns of the

Y wagon and the optional Tray Wagon Magazine movements.

This sign is applied as follows:

– 2 signs on the Y-wagon base plate (front and rear).
– 2 signs on the Tray Wagon Magazine (optional).

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Safety MYDATA automation AB

Sign 3 (D-010-0053-ENA/ENE America/Europe) warns of the fast

X-wagon movement. Do not open any part of the cover while the
machine is in operation, or start the machine if any part of the cover
has been removed. Only authorized service personnel are allowed to
open covers and expose moving parts.

This sign is applied as follows:

– 5 signs on the rear of the X-wagon covers.

Sign 4 (K-049-0073) warns of electric shock. Units on which this sign

is placed contain dangerous voltage levels. Power must be switched
off before opening the unit. Only authorized service personnel are
allowed to operate the machine when such a unit is open.

This sign is applied as follows:

– 1 sign at the mains switch.
– 1 sign on the power supply unit at the rear of the machine.

Sign 5 (D-049-0047-EN) alerts that only MYDATA approved

equipment is allowed to be connected to the power supply unit outlet.

This sign is applied as follows:

– 1 sign on the power supply unit at the rear of the machine.

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MYDATA automation AB Safety

Type Plate
The type plate shows the name and address of the manufacturer, the
machine type and serial number, and manufacturing year and
country. An example of a type plate is shown below.

MYDATA automation AB
Adolfsbergsvägen 11
S-168 66 Bromma

Type: MY19
Serial no: 19036
Date: 1999-06-16
Voltage 3 x 208V / 120V AC
+/- 10%
50/60Hz
Power: 3 x 2.2 kVA

Made in Sweden

Figure 1-4. Machine type plate

On the MY machines, the type plate is found on the rightmost

machine stand (see '5' in Figure 1-1 and Figure 1-2).

On the TP9-2U machine, the type plate is found at the rear of the
machine (see '6' in Figure 1-3).

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Safety MYDATA automation AB

Warnings in the Manual

Throughout the manual this symbol is used to call your attention to
commands that starts machine movements. The symbol refers to the
warning signs, which must be obeyed to eliminate the risk of injury.

If there are instructions accompanying this symbol, they must be

followed.

Also, to avoid damage, this symbol means that the operator must be
observant of the following:

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

Noise
For all the MY machines, the equivalent continuous sound pressure
level is measured in accordance with EU directive 89/392/EEC to be
62dB(A).

For the TP9-2U machine, the machine noise is less than 70dB(A).

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MYDATA automation AB Getting Started

Getting Started
This chapter is intended to be a training guide for programming
layouts, PCBs and panels.

A number of training boards, described on page 2-3, are used to show

the programming procedure.

You can perform the programming described in this chapter with an

operator’s knowledge of the MYDATA placement machines. To
proceed programming after accomplishing this chapter, you will need
further information about the system and the features included in
TPSys. The following chapters in this manual contain that
information, which is divided into the following main parts:

• Basic information about the system in Chapter 3 including:

– Fiducial marks
– Coordinate systems
– Board location
– Angles
– Centering and verification
– Mount tools
– Digitizer
– Barcode reader

• Component information in Chapter 4.

• Package information in Chapter 5 and in Appendix A.
• Magazine information in Chapter 6.
• Assembly information in Chapter 7 which also includes:
– Terminology for boards, panels and layouts.
– Mount list structure diagram for the main editors in TPSys.

• Fiducial marks, glue application and user privileges are described

in Chapter 8.

• A TPSys menu reference guide in Appendix B.

You can look up this information whenever needed during
programming work.

A good advice is to copy the mount list structure diagram in

Chapter 7 and have it available when programming, until you
have learned the structure of the mount editors.

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Getting Started MYDATA automation AB

Allowed Characters
When entering for instance layout, panel, and PCB names or
comment text into editors, all alphabetical and numeral characters
are allowed to be used.

National special characters are, however, not included in the

provided keyboard. These characters can, of that reason, not be used.

This version of TPSys allows a number of non-letter/non-figure

characters. These are specified in the preface text on page ii.

Programming Methods
There are three different methods of programming boards:

• Importing mount data from a CAD system. This feature is not

described in this manual. A description is found in the
CADConversion, User's Manual provided with the MYDATA
CADConversion software package.

• Using the position camera in the machine to position the

components on the board. This method is described in this chapter.

• Entering position values from the key board. This is carried out in
the same way as above, but the position values are keyed in rather
than being measured by the camera system.

Manual Insertion/Removal of Tools/Components

An emergency stop button shall be pressed down when a tool or
component is manually inserted or removed from the X wagon of the
machine.

In addition to the safety instructions found in the Safety chapter,

follow any safety information displayed on the screen.

You have to read the Safety chapter before operating this

machine.

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Training Boards and Layouts

A number of PCBs to be programmed and a number of layouts for
assembling the PCBs are used as training examples in this chapter.
These examples are described below and the boards are available for
copying on page 2-54.

Boards To Be Programmed
The following PCBs, included in a TV set, are to be programmed:

PCB Board type Qty. Bare board

TV1 Video board1BB1
TV2 Audio board2BB2 or panel BB2x2
TV3R RGB-Red1BB3 or panel BB3x3
TV3G RGB-Green1BB3 or panel BB3x3
TV3B RGB-Blue1BB3 or panel BB3x3

TV1
TV1 is the video board which is mounted on a bare board named BB1
see Figure 2-1.

BB1 TV1 F2

C3 C2 C1

F1 F3

Figure 2-1. Printed circuit board TV1

TV2
TV2 is the audio board. Two identical audio boards are required as
the television set has stereo sound. These PCBs are mounted on two
BB2 boards, or on one panel named BB2x2 that includes two BB2
boards (see Figure 2-2).
BB2x2 F2
BB2 TV2 F2 BB2 TV2 F2

C1 C1
C2 C2

F1 F1

F1

Figure 2-2. Two TV2 boards as a panel

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Getting Started MYDATA automation AB

TV3R, TV3G and TV3B

TV3R, TV3G and TV3B are the television color boards for red, green
and blue. One of each board is required. These PCBs are mounted on
three BB3 boards, or on one panel, BB3x3 which includes three BB3
boards, see Figure 2-3.

BB3x3 F2
BB3 F2 BB3 F2 BB3 F2
C1 C1 C1
C2 R C2 R C2 R
C3 B C3 B C3 B
C4 G C4 G C4 G

TV3R TV3G TV3B

F1 F1 F1

F1

Figure 2-3. TV3R, TV3G and TV3B as a panel

These PCBs are equipped differently. A capacitor in position C2

makes a TV3R board, in position C3 a TV3G board and in position C4
a TV3B board.

Layouts To Be Programmed
The following layouts are to be programmed in this chapter. The
layouts contain the following boards:

TV1
TV1 Assembling video board TV1

TV1

TV2-P2
TV2 TV2 Assembling two audio boards on panel TV2-P2

TV2-P2
TV3RGB-P3
TV3R TV3G TV3B Assembling three color boards TV3R, TV3G and TV3B on panel
TV3RGB-P3.
TV3RGB-P3

TV-ALL
TV1 Assembling a complete set of boards:

– one video board TV1

TV2 TV2 – two audio boards on panel TV2-P2
– three color boards on panel TV3RGB-P3
TV3R TV3G TV3B

TV-ALL

The TV-ALL layout can be assembled on a machine with a Manual

load sysem, or an in-line system equiped with a Manual load adapter.

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Programming PCB
The following assumes that the system does not contain any
previously programmed boards. The screen will therefore only show
what you have programmed.

First you are going to program the TV1 video board that looks like
this:

BB1 TV1 F2

C3 C2 C1

F1 F3

Figure 2-4. Video board TV1

This board is programmed in the following steps:

• Creating a new layout (page 2-6).

• Adding a new PCB to the layout (page 2-8).
• Programming the PCB header information (page 2-11).
• Adding components to the PCB (page 2-20).

Having at Hand when Programming

Have the following at hand when programming:

– A bare board (see page 2-54) to put into the machine.

– An extra board to measure and refer to.
– A table of the board coordinates or a ruler.
– Component location drawing.
– Parts list and any board documentation.

If your system is equipped with a digitizer, then you will notice that
it speeds up the component programming considerably.

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Getting Started MYDATA automation AB

Creating a New Layout

Start the system and log on as described in Chapter 2 of the
Operator’s Manual.

1. Open the Layout List Editor by selecting Layouts in the Editor

menu.
TV1
TV1
2. Create a new layout by pressing <Ins>.
3. Enter the layout name, "TV1" as shown in Figure 2-5.

* LAYOUT LIST EDITOR *

Layouts
Enter Edit layout
Ins Insert new
Del Delete
F6 HYDRA preparation
F9 Copy

Layout Information
Name:
Insert New Layout
Name: TV1

Bill 13:00

Figure 2-5. Entering a new layout

4. Save the new layout by pressing <Enter>.

5. Open the Layout Editor for editing the new layout by pressing
<Enter>. You are asked whether you want to load the layout or
not.

6. Load the new layout by selecting Yes.

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MYDATA automation AB Getting Started

7. Enter the comment text by pressing <F2> and typing the

following text, that reflects the object and the name of the bare
board:

Layout, bare board BB1

You can type comment text on a number of lines, but only the
first line is visible in the various editors.

8. Save the layout header modification, either by pressing

<Enter> repeatedly or by pressing <Esc> and accepting to save
the modification in the following box:

Save modifications?
Yes No

The Layout Editor, which now contains the layout with the
comment text, looks like this:

* LAYOUT EDITOR *
Boards
Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV1
Comment: Layout, bare board BB1

Bill 13:06

Figure 2-6. The new layout

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Getting Started MYDATA automation AB

Adding a New PCB to the Layout

F2 The layout that has been created is still empty. In this section you are
TV1
going to create and add a PCB (TV1) to the layout.

9. Add a new board by pressing <Ins> and selecting PCB since the
C3 C2 C1

F1 F3
TV1 board is a PCB.

10. Enter the PCB name on the first line in the Insert PCB box:
Insert PCB
Name: TV1
Comment: * UNKNOWN PCB *
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

... and press <Enter>.

You are asked if you want to select a PCB from the PCB List
since the entered name was not found in the system:

PCB ’TV1’ unknown

Select from list?
Yes No

11. Select No because the PCB entered does not exist yet.

Insert PCB
Name: TV1
Comment:
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:
Press <F1> for camera

12. Put the PCB into the machine, if not already done.
The PCB position in the machine is now to be located by means
of the positioning camera.

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

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13. Press <F1> and center the cross hairs on fiducial mark 1:

Set position for fiducial mark 1

Ready
Cancel

15.032mm/ 15.071mm Bill 13:12

Figure 2-7. Centering fiducial mark F1

14. Confirm the position by selecting Ready. You are asked to

position fiducial mark 2:

Insert PCB
Name: TV1
Comment:
Fiducial mark 1: 15.032mm/ 15.071mm
2: 15.032mm/ 15.071mm
3:
Press <F1> for camera

15. Press <F1> again and repeat the centering procedure for
fiducial mark 2:

Set position for fiducial mark 2

Ready
Cancel

205.062mm/ 105.154mm Bill 13:18

Figure 2-8. Centering fiducial mark F2

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Getting Started MYDATA automation AB

After the board is located, you are returned to the Layout Editor, in
which the new board is shown:

* LAYOUT EDITOR *
Boards
1: TV1 (PCB) Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV1
Comment: Layout, bare board BB1
Board Position
Type: PCB
Name: TV1
Comment:
Fiducial mark 1: 15.032mm/ 15.071mm
2: 205.062mm/ 105.154mm
3:

Bill 13:12

Figure 2-9. The new PCB in the layout

In this stage the new PCB contains only a name. There is no header
information and no mount information programmed for it.

Next step is to program the PCB header information.

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Programming the PCB Header Information

The PCB header information for the TV1 board is shown in
Figure 2-10.

90 F2
BB1

TV1

A
25

B C
0 F1 F3

0 20 30 40 190

Figure 2-10. TV1 header information

Character key for the figure:

A Bad board mark label position.
B Board level measuring point for mount tools.
C Board level measuring point for glue tools.
F1 Fiducial mark 1, round.
F2 Fiducial mark 2, square.
F3 Fiducial mark 3, square.

A description of creating fiducial marks and setting coordinate values

is found in the Fiducial Marks section in Chapter 3. The same board,
that is TV1, is also used as an example in Chapter 3.

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Getting Started MYDATA automation AB

This description starts from the Layout Editor (page 2-10).

16. Open the PCB Editor by pressing <Enter>:

* PCB EDITOR *
Items Enter Edit item F4 PCB size
Ins Insert new F6 Find position
Del Delete Shift+F6 Reset digitizer
F2 PCB header F7 Change groups
F8 Replace component
PCB Header Information
Name: TV1

Bill 13:30

Figure 2-11. PCB Editor

17. Open the header information box by pressing <F2>:

* PCB EDITOR *
Items Enter Save and exit
Esc Exit

PCB Header Information

Name: TV1
Comment: PCB, bare board BB1
Level measurement tools:
No. of fiducial marks: 2
Mark 1 ID: pos.: 0.000mm/ 0.000mm
2 ID: pos.: 0.000mm/ 0.000mm
3 ID: pos.:
Bad board mark pos.: 0.000mm/ 0.000mm
Mount tool test pos.: 0.000mm/ 0.000mm
Glue tool test pos.: 0.000mm/ 0.000mm

Bill 13:36

Figure 2-12. PCB header information

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18. Type the following PCB comment text and press <Enter>:
Comment: PCB, bare board BB1

19. Enter the number of fiducial marks, which is 3 for the TV1
board:
No. of fiducial marks: 3

20. Type any letter in the first fiducial mark name field:
Mark 1 ID: x pos.: 0.000mm/ 0.000mm

21. Press <Enter> to open the fiducial mark window for selecting
or creating a fiducial mark. The following box is shown:

Fiducial mark type ’x’ unknown

Select from list?
Yes No

22. Accept to select from the list.

23. Create a new fiducial mark by pressing <Ins> in the fiducial
mark window and entering the name Ro-1.0 since the fiducial
mark is round with a diameter of 1.0mm. Then teach the new
fiducial mark.

This procedure is described in the Fiducial Marks section in

Chapter 3.

24. Press <Enter> to return to the PCB Editor when the Ro-1.0
fiducial mark is highlighted.

25. Let the origin of the board coordinate system coincide with
fiducial mark 1, that is the default X/Y coordinate values are not
changed:
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm

The system must be told where you have positioned the origin of
the board coordinate system in the machine. Otherwise, it
cannot calculate the coordinate values to the other fiducial
marks and to the components.

To enter the position of fiducial mark 1 in the machine, use the

camera as described in the following step (see also Chapter 3).

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Getting Started MYDATA automation AB

The system may ask you to 26. Center fiducial mark 1 when the coordinate values of fiducial
insert a board into the mark 1 is highlighted by pressing <F1> and using the trackball
machine. or joystick to center the cross hairs on fiducial mark 1 like this ...

Center cross hairs on fiducial mark 1

Ready
Cancel

0.000mm/ 0.000mm Bill 13:42

Figure 2-13. Centering fiducial mark F1

... then press <Enter> when Ready is highlighted.

27. Verify fiducial mark 1 by selecting Yes in the following box:

Autosearch fiducial mark?

Yes No

If an existing fiducial mark, perhaps from an earlier processed

board type, has been selected, then it is necessary to verify the
fiducial mark in this step.

This fiducial mark has previously been learned by the system

but you can verify that the system recognizes it anyway.

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28. Measure the board angle by selecting Yes in the following box:

Measure board angle?

Yes No

It is necessary for the system to know the angle of the board in

the machine before centering the remaining fiducial marks.

Two marks on the board are required for this measurement. Use
F1 and F3 since these are located along the X axis on the board,
see Figure 2-10 on page 2-11.

If there are not two fiducial marks on the X or Y axis of the

board, two other marks can be selected.

This procedure is described in the Defining Fiducial Marks

section in Chapter 3.

29. Center fiducial mark 1 again, since it also is used as the first
alignment mark when measuring the angle of the board ...

Center cross hairs on first alignment mark

Ready
Cancel

15.102mm/ 15.021mm Bill 13:48

Figure 2-14. Centering the first alignment mark

... then confirm the position by selecting Ready.

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Getting Started MYDATA automation AB

30. Move to the second alignment mark, F3, and center this
alignment mark as well:

Center cross hairs on second alignment mark

Ready
Cancel

205.065mm/ 14.793mm Bill 13:54

Figure 2-15. Centering the second alignment mark

31. Confirm the measured board angle by selecting Yes in the

following box:

Board angle: 0.07°

Yes No

You will return to the PCB Editor.

32. Open the fiducial mark window again by typing a letter in the
second fiducial mark name field, pressing <Enter>, and accept
selecting from the list.

33. Create a new fiducial mark by pressing <Ins> in the fiducial

mark window and entering the name Sq-1.0 since the fiducial
mark is square with 1.0mm sides. Then teach the new fiducial
mark.

34. Press <Enter> to return to the PCB Editor when the Sq-1.0
fiducial mark is highlighted. The fiducial mark is now inserted:
2 ID: Sq-1.0 pos.: 0.000mm/ 0.000mm

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35. Center the second fiducial mark in the same way as the first
fiducial mark:
You can type approximate
values before pressing <F1>
to save machine movement
time. Center cross hairs on fiducial mark 2
Ready
The trackball speed can be Cancel

increased by five times if you

press the left and the right
trackball buttons
simultaneously.

190.011mm/ 90.135mm Bill 14:00

Figure 2-16. Centering fiducial mark F2

You may be asked if you want Fiducial mark 2 is now complete:

to make an automatic fiducial
mark search. 2 ID: Sq-1.0 pos.: 190.011mm/ 90.135mm

36. The third fiducial mark, F3, has the same shape as the second
one. In the fiducial mark name field, type the fiducial mark
name Sq-1.0 and press <Enter>. Or, type the first letter (or
letters) of the name, press <Enter>, and select Sq-1.0 from the
list in the fiducial mark window.
3 ID: Sq-1.0 pos.: 0.000mm/ 0.000mm

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Getting Started MYDATA automation AB

37. Center the third fiducial mark in the same way as the previous
fiducial marks:
Use approximate values.

Center cross hairs on fiducial mark 3

Ready
Cancel

190.073mm/ 0.064mm Bill 14:06

Figure 2-17. Centering fiducial mark F3

You may be asked if you want Fiducial mark 3 is now complete:

to make an automatic fiducial
mark search. 3 ID: Sq-1.0 pos.: 190.000mm/ 0.064mm

38. Enter the position of bad board mark labels, if used.

Low contrast labels are positioned where the board contrast is
high (many visible leads), and vice versa. This feature is further
described in the 1003 Bad board search switches in Appendix B.

The coordinate values for the TV1 board (Figure 2-10 on

R2 page 2-11) are 20 and 25, which are typed with a space in
between like this:
Bad board mark pos.: 20 25
Y
Press <Enter> to complete the position:
X
Bad board mark pos.: 20.000mm/ 25.000mm

You can also press <F1> and use the camera to enter the
position of bad board marks.

Bad board marks are not used on PCBs, but if the position is
specified it can be used if the PCB is included in panels.

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MYDATA automation AB Getting Started

Study the ’Board Level Measurement’ section in Chapter 7 before

entering the following test positions.

39. Enter the coordinate values for the board level test position for
mount tools.

These values are 30 and 0 for this board, which are entered in
the same way as the previous fields:
Mount tool test pos.: 30.000mm/ 0.000mm

40. Enter the coordinate values for the board level test position for
glue tools

These values are 40 and 0 for this board:

Glue tool test pos.: 40.000mm/ 0.000mm

The PCB header information is now complete. The PCB board looks
like this:

90 F2
BB1
A = Bad board marks.
TV1
B = Board level measuring
point for mount tools.

C = Board level measuring

point for glue tools.
A
25

B C
0 F1 F3

0 20 30 40 190

Figure 2-18. TV1 header information

... and the header information looks like this (press <F2> to view it):

PCB Header Information

Name: TV1
Comment: PCB, bare board BB1
No. of fiducial marks: 3
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 190.011mm/ 90.135mm
3 ID: Ro-1.0 pos.: 190.073mm/ 0.064mm
Bad board mark pos.: 20.000mm/ 25.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

Press <Esc> to hide the header information again.

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Getting Started MYDATA automation AB

Adding Components to the PCB

The PCB component information for the TV1 board comprises three
items shown in Figure 2-19.

BB1 F2

C3 C2 C1

F1 F3

Figure 2-19. TV1 assembly

A detailed description of positioning components is found in the

Component Positioning section in Chapter 7. The same board, that is
TV1 is used as an example also in Chapter 7.

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MYDATA automation AB Getting Started

This description starts from the PCB Editor (after the previous
action):

* PCB EDITOR *
Items Enter Edit item F4 PCB size
Ins Insert new F6 Find position
Del Delete Shift+F6 Reset digitizer
F2 PCB header F7 Change groups
F8 Replace component
PCB Header Information
Name: TV1

Bill 13:42

Figure 2-20. PCB Editor with the TV1 board

41. Enter the first item in the PCB parts list, which is capacitor C1,
component name 000149.

Press <Ins>, type ’C1’ and press <Enter>:

Insert New
Location: C1
Component:

Package:
Angle: 0.00°
Position: 0.000mm/ 0.000mm

42. Enter the component name ’000149’ on the Component line.

Or, you can type ’00’ (the first characters of the component
name) and press <Enter>. The component name ’00’ does not
exist in the system:

Component ’00’ unknown

Select from list?
Yes No

Accept to select from the component list, which is opened by

selecting Yes.

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Getting Started MYDATA automation AB

The component list is opened and the component that closest

matches the characters entered is highlighted:

* SELECT COMPONENT *
Components
Enter Select component
000149 Ins Insert new
000254
000255
000501
000502 Name: 000149
000503 Comment: 100pF
000511 Barcode: 123456
000513 Package: 1206-06
000514 Mount: Yes
000517 Magazine type: Tape
000518 Feeder type: 8mm
000519 Glue: Yes
000520 Reject position: Closest reject bin
000521 Polarized: No
000522 Test 1 Test 2
000523 Type: Capacitance low V ---
000524 Angle: 90.00° ---
74HC161 Value: 100pF ±20% ---
74HC365 Default load data
MAX452CSA Tape angle: 90.00° Vib. angle: 0.00°
MB150PF Step length: 4mm
Bill 13:48

Figure 2-21. Selecting component from list

The component list is described in Chapter 4.

43. Select component 000149 in the list and press <Enter>. The
selected component is added to the PCB:

Insert New
Location: C1
Component: 000149
100pF
Package: 1206-07
Angle: 0.00°
Position: 0.000mm/ 0.000mm

The comment text (100pF) and package type is read from the
component list.

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MYDATA automation AB Getting Started

44. Enter the component angle and center position, which can be
done either by typing the values or by using the camera.

To use the camera, press <F1> when Position is highlighted and

position the cross hairs on the center of the component place
when Current lead: Center is indicated in the upper left corner of
the screen:
Use digitizer, if available.

You can also type F2/F3 Toggle lead

approximate values before Angle resolution: 5.00°
Current lead: Center Ctrl+F3 Toggle component
pressing <F1> to save Ready outline
PgUp/PgDn Previous/next
machine movement time. Cancel
F4/F5 Mount/glue
+ and - Rotate component
The trackball speed can be Ctrl+T
F6
Hide text
Toggle mounted/glued
increased by five times if you
press the left and right
trackball buttons
simultaneously.

Only relevant options in the

screen menu is shown
(Figure 2-22 and the following
figures show all options).

D 1: C1 (000149) Delta pos.: 3.732mm/ 49.163mm

0.00° Angle: 4.34°
85.143mm/ 45.211mm Bill 14:24

Figure 2-22. Positioning the component center

Press <F2> or <F3> if anything else than Center is indicated

as Current lead.

The component placement angle resolution can be changed by

typing a new value as Angle resolution.

Check if the component X/Y coordinates, displayed in the bottom

left corner of the screen, are likely.

You can use a graphic component outline when positioning

components, see the Component Positioning section in
Chapter 7.

All entries in the positioning window (Figure 2-22 are described

in the Component Positioning section in Chapter 7).

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Getting Started MYDATA automation AB

45. Enter the position of lead 1 by pressing <F2> or <F3> and

centering the cross hairs on the position of lead 1 when Current
lead: Lead 1 is indicated:
If the component angle is
correct, then the camera
automatically moves to the F2/F3 Toggle lead
Angle resolution: 5.00°
correct position. Current lead: Lead 1 Ctrl+F3 Toggle component
Ready outline
PgUp/PgDn Previous/next
The leads for the toggling Cancel
F4/F5 Mount/glue
feature are specified in the + and - Rotate component
Toggle leads field in the Ctrl+T
F6
Hide text
Toggle mounted/glued
Package List, described in
Chapter 5.

D 1: C1 (000149) Delta pos.: 3.732mm/ 50.364mm

0.00° Angle: 4.24°
85.143mm/ 46.412mm Bill 14:30

Figure 2-23. Positioning component lead 1

46. Enter the position of lead 2.

Press <F2> or <F3> again and center the cross hairs on the
position of lead 2 when Current lead: Lead 2 is indicated:

F2/F3 Toggle lead

Angle resolution: 5.00° Ctrl+F3 Toggle component
Current lead: Lead 1 outline
Ready PgUp/PgDn Previous/next
Cancel F4/F5 Mount/glue
+ and - Rotate component
Ctrl+T Hide text
F6 Toggle mounted/glued

D 1: C1 (000149) Delta pos.: 3.732mm/ 47.964mm

0.00° Angle: 4.44°
85.143mm/ 44.013mm
Bill 14:36

Figure 2-24. Positioning component lead 2

When ready, confirm the positions and angle by pressing

<Enter> when Ready is highlighted.

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The PCB Editor with the new component is shown:

* PCB EDITOR *
Items Enter Edit item F4 PCB size
1: C1, 000149 Ins Insert new F6 Find position
Del Delete Shift+F6 Reset digitizer
F2 PCB header F7 Change groups
F8 Replace component

PCB Header Information

Name: TV1

Location: C1
Component: 000149
Comment: 100pF
Package: 1206-07
Group: 0 Turn before Z down: No
Save electric value: No
Mount: Yes Glue: Yes Only Z: No
Angle: 0.00° pos.: 40.052mm/ 25.363mm
Local fiducial marks: 0
Mark 1 ID: pos.:
2 ID: pos.:
3 ID: pos.:
Bill 13:52

Figure 2-25. The PCB with the first component

If you press <F1> in the above window, you will return to the
previous positioning window, in which you can:
Adds status D. – apply glue for the component by pressing <F5>.

Adds status M. – mount the component by pressing <F4>.

– toggle the mount/glue status by pressing <Space>.

Also, you can press <F1> again to activate the trackball and
joystick and adjust the component position.

D 1: C1, 000149. If letter D is shown leftmost on the component line in the PCB
Editor Items box, then glue has either been applied or the glue
status has been changed with the <Space> bar in the
positioning window, or in the PCB Editor window.
M 1: C1, 000149. Letter M in the same position indicates that the component
either has been mounted or the mount status has been changed
with the <Space> bar in the positioning window, or in the PCB
Editor window.

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Getting Started MYDATA automation AB

47. Program the remaining two items, that is capacitor C2 mounted

in 90° and capacitor C3 mounted in 0° by repeating the
procedure described in this section.

The PCB Editor will look like this when all the components for
the board are programmed:

* PCB EDITOR *
Items Enter Edit item F4 PCB size
1: C1, 000149 Ins Insert new F6 Find position
2: C2, 000254 Del Delete Shift+F6 Reset digitizer
3: C3, 000255 F2 PCB header F7 Change groups
F8 Replace component

PCB Header Information

Name: TV1

Location: C1
Component: 000149
Comment: 100pF
Package: 1206-07
Group: 0 Turn before Z down: No
Save electric value: No
Mount: Yes Glue: Yes Only Z: No
Angle: 0.00° pos.: 40.052mm/ 25.363mm
Local fiducial marks: 0
Mark 1 ID: pos.:
2 ID: pos.:
3 ID: pos.:
Bill 13:58

Figure 2-26. The PCB with all the components

48. Return to the TPSys main window by pressing <Esc>

repeatedly.

An information box in the main window indicates the name of

the loaded layout:

Current layout
TV1
Layout, bare board BB1

The board programming is now completed.

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Programming Panel – Method 1

There are two methods of programming panels:

Method 1 – for similar PCBs

This method means that a panel is created and PCBs, programmed
as described in the previous section, are inserted and positioned.

This method is easy to use and the best way of keeping the PCB and
panel information separated. Also, there is a feature which makes it
very easy to create a matrix of PCBs on the panel by simply entering
the number of rows, columns and spacing.

Method 1 is described in this section.

Method 2 – for different PCB types

This method means that PCBs are programmed in the same
procedure as the panel. This method is intended for panels that
include not yet programmed PCBs of different types.

Method 2 is described on page 2-38.

Panel TV2-P2
Panel TV2-P2 which will be programmed in this section, contains
two TV2 type PCBs. It looks like this:

BB2x2 F2
BB2 TV2 BB2
F2 TV2 F2

C1 C1
C2 C2

F1 F1

F1

Figure 2-27. Two TV2 audio boards as panel

This board is programmed in the following steps:

• Programming the PCB (page 2-28).

• Creating a layout for the panel (page 2-29).
• Adding a new panel to the layout (page 2-40).
• Programming the panel header information (page 2-41).
• Inserting the PCBs into the panel (page 2-35).
See page 2-5 for things to have at hand when programming.

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Programming the PCB

1. Program the PCB in the same way as the TV1 board was
programmed, see page 2-6 through page 2-19.
Enter the layout name TV2 and the following comment text:

Layout Header
Name: TV2
Comment: Layout, bare board BB2

Enter the PCB header information shown in the box below.

2. This time, and in the following examples, you can just select the
previously created fiducial marks Ro-1.0 and Sq-1.0.

PCB Header Information

Name: TV2
Comment: PCB, bare board BB2
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 80.012mm/ 50.031mm
3 ID: pos.:
Bad board mark pos.: 20.000mm/ 25.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

The board looks like this:

50 F2
A = Bad board marks.
BB2 TV2
B = Board level measuring
point for mount tools.
A
C = Board level measuring C1
point for glue tools. 25
C2

B C
0 F1

0 20 30 40 80

Figure 2-28. TV2 header information

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Creating a Layout for the Panel

3. Open the Mount List by selecting the Layouts option in the
TV2 TV2 Editor menu.

TV2-P2 4. Create a new layout by pressing <Ins>.

5. Enter the name TV2-P2 as shown in Figure 2-29.

* LAYOUT LIST EDITOR *

Layouts Enter Edit layout
TV1 Ins Insert new
TV2 Del Delete
F6 HYDRA preparation
F9 Copy

Layout Information
Name:
Insert New Layout
Name: TV2-P2

Bill 14:04

Figure 2-29. Creating a new layout

6. Save the new layout by pressing <Enter>.

7. Open the Layout Editor for editing the new layout by pressing
<Enter>. You are asked whether you want to load the layout or
not.

8. Load the new layout by selecting Yes.

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9. Enter the comment text by pressing <F2> and typing the

following text, that reflects the object and the name of the bare
board:

Layout, bare board BB2x2

You can type comment text on a number of lines, but only the
first line is visible in the various editors.

10. Save the layout header modification, either by pressing

<Enter> repeatedly or by pressing <Esc> and accepting to save
the modification in the following box:

Save modifications?
Yes No

The layout with the comment text looks now like this in the
Layout Editor:

* LAYOUT EDITOR *
Boards
Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV2-P2
Comment: Layout, bare board BB2x2

Bill 14:10

Figure 2-30. The new layout

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Adding a New Panel to the Layout

F2
The layout that has been created is still empty. In this section you are
TV2 F2
TV2 F2

going to create and add the TV2-P2 panel to the layout.

C1 C1
C2 C2

F1 F1

F1

TV2-P2 11. Add a new board by pressing <Ins> and selecting Panel since
the TV2-P2 is a panel:

Insert New
PCB
Panel

12. Enter the panel name on the first line in the Insert panel box:

Insert panel
Name: TV2-P2
Comment: * UNKNOWN PANEL *
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

... and press <Enter>.

You are asked if you want to select a panel from the Panel List
since the entered name was not found in the system:

Panel ’TV2-P2’ unknown

Select from list?
Yes No

Reply No as the new panel does not exist, but is to be created.

Insert panel
Name: TV2-P2
Comment:
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:
Press <F1> for camera

13. Put the panel into the machine, if not already done.
The panel position in the machine is now to be located by means
of the positioning camera.

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

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14. Press <F1> and center the cross hairs on the panel fiducial
mark 1:

Set position for fiducial mark 1

Ready
Cancel

15.052mm/ 15.012mm Bill 15:06

Figure 2-31. Centering fiducial mark F1

15. Confirm the position by selecting Ready. You are asked to

position fiducial mark 2:

Insert panel
Name: TV2-P2
Comment:
Fiducial mark 1: 15.052mm/ 15.012mm
2: 15.052mm/ 15.012mm
3:
Press <F1> for camera

16. Press <F1> again and repeat the centering procedure for the
panel fiducial mark 2:

Set position for fiducial mark 2

Ready
Cancel

215.074mm/ 85.061mm Bill 15:12

Figure 2-32. Centering fiducial mark F2

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After the board is located, you are returned to the Layout Editor, in
which the new board is shown:

* LAYOUT EDITOR *
Boards
1: TV3RGB-P3 (Panel) Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV2-P2
Comment: Layout, bare board BB2x2
Board Position
Type: Panel
Name: TV2-P2
Comment:
Fiducial mark 1: 15.052mm/ 15.012mm
2: 215.074mm/ 85.061mm
3:

Bill 14:16

Figure 2-33. The new PCB in the layout

In this stage the new panel contains only a name. There is no header
information and no PCBs included in it.

Next step is to program the panel header information.

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Programming the Panel Header Information

17. Program the panel header information in the same way as the
previous PCB header information was programmed, see
page 2-11 through page 2-19. The PCB Editor is in this case the
Panel Editor.

Use the two F1 fiducial marks (see Figure 2-34) on the PCBs as
alignment marks when measuring the board angle.

The board and the panel header information looks like this:

A = Bad board marks. 70 BB2x2 F2

BB2 F2 BB2 F2
B = Board level measuring
point for mount tools.
TV2 TV2
C1 C1
C = Board level measuring C2 C2
point for glue tools.
F1 F1
A
0 F1 B C

0 30 40 100 200

Figure 2-34. TV2-P2 panel header information

Panel Header
Information
Name: TV2-P2
Comment: Panel, bare board BB2x2
Level measurement tools:
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 200.026mm/ 70.057mm
3 ID: pos.:
Bad board mark pos.: 100.000mm/ 25.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

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Inserting the PCBs into the Panel

This description starts from the Panel Editor, which looks like this
after entering the panel header information:

* PANEL EDITOR *
PCBs
Enter Edit PCB
Ins Insert new
Del Delete
F1 PCB position
F2 Panel header
information
F4 Panel size

Panel Header Information

Name: TV2-P2
Comment: Layout, bare board BB2x2

Bill 14:22

Figure 2-35. Panel Editor with the TV2-P2

18. Insert a PCB into the panel by pressing <Ins>. The following
dialog box is shown:

Insert PCB(s)
PCB name:
Comment: * UNKNOWN PCB *
Rows: 1
Columns: 1
Total: 1
First new board
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

Column/row step:

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19. Type the PCB name, TV2 on the PCB name line and press
<Enter>. Or, type a few characters of the name, press
<Enter>, and select from the PCB List. The text in the
Comment line is read from the PCB List:

Insert PCB(s)
PCB name: TV2
Comment: PCB, bare board BB2
Rows: 1
Columns: 1
Total: 1
First new board
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

Column/row step:

20. Set Rows to 1 and Columns to 2, since the panel has one row and
two columns, see Figure 2-34 on page 2-34:

Insert PCB(s)
PCB name: TV2
Comment: PCB, bare board BB2
Rows: 1
Columns: 2
Total: 2
First new board
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

Column/row step:

The total number of boards is indicated by the system when

<Enter> is pressed for the Columns entry.

Further information about how to create a matrix of PCBs on a

panel is found in the Panel Editor section in Chapter 7.

21. Put the panel into the machine, if not already done.
22. Locate fiducial mark 1 of the first PCB as follows:
F1 on board 1. When the Fiducial mark 1 entry is highlighted, press <F1> and
center the cross hairs on fiducial mark 1 of the first of the TV2
Further information is found in boards included in the panel. Then press <Enter> when Ready
Chapter 7.
is highlighted.

23. Locate fiducial mark 2 of the same PCB as follows:

F2 on board 1. When the second fiducial mark entry is highlighted, press <F1>
and center fiducial mark 2 of the same TV2 board.

24. Locate fiducial mark 1 of the other PCB as follows:

F1 on board 2. When the Column/row step entry is highlighted, press <F1>
and center fiducial mark 1 of the second TV2 board.

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The panel programming is now completed and the Panel Editor

shows both the PCBs:

* PANEL EDITOR *
PCBs
1: TV2 Enter Edit PCB
2: TV2 Ins Insert new
Del Delete
F1 PCB position
F2 Panel header
information
F4 Panel size

Panel Header Information

Name: TV2-P2
Comment: Panel, bare board BB2x2
PCB Position Information
PCB name: TV2
Comment: PCB, bare board BB2

Fiducial mark 1: 10.044mm/ 10.091mm

2: 90.028mm/ 60.055mm
3:

Bill 14:28

Figure 2-36. Two TV2 boards on the panel

Ensure you teach the fiducials on the first board. On a panel

with many identical PCBs it is easy to select fiducial mark from
a neighboring PCB.

25. Return to the TPSys main window by pressing <Esc>

repeatedly.

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Programming Panel – Method 2

In this section you will program the PCBs and the panel in the same
procedure (method 2).

Method 1 and method 2 are both described on page 2-27.

Panel TV3RGB-P3, containing the three color boards TV3R, TV3G

and TV3B, is used in this exercise. It looks like this:

BB3x3 F2

BB3 F2 BB3 F2 BB3 F2

C1 C1 C1
C2 R C2 R C2 R
C3 B C3 B C3 B
C4 G C4 G C4 G

TV3R TV3G TV3B

F1 F1 F1

F1

Figure 2-37. TV3R, TV3G and TV3B as a panel

This panel is programmed in the following steps:

• Creating a layout for the panel (page 2-39).

• Adding a new panel to the layout (page 2-40).
• Programming the panel header information (page 2-41).
• Inserting new PCB into the panel (page 2-42).
• Programming the PCB (page 2-44).
• Programming the additional PCBs (page 2-45).
See page 2-5 for things to have at hand when programming.

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Creating a Layout for the Panel

1. Create and load a new layout in the same way as the previous
TV3R TV3G TV3B
layout was created and loaded, see page 2-29 through page 2-30.
Enter the following layout information:
TV3RGB-P3
Name: TV3RGB-P3

Comment: Layout, bare board BB3x3

The new layout will look like this in the Layout Editor:

* LAYOUT EDITOR *
Boards
Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV3RGB-P3
Comment: Layout, bare board BB3x3

Bill 14:34

Figure 2-38. The new TV3RGB-P3 layout

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Adding a New Panel to the Layout

F2 F2 F2
F2
2. Add a new panel to the layout in the same way as the previous
C1
C2 R
C1
C2 R
C1
C2 R
layout was added, see page 2-31 through page 2-33.
C3 B C3 B C3 B
C4 G C4 G C4 G

TV3R
F1
TV3G
F1
TV3B
F1
Enter the following panel information:
F1

TV3RGB-P3 Name: TV3RGB-P3

The new panel will look now like this in the Layout Editor:

* LAYOUT EDITOR *
Boards
1: TV3RGB-P3 (Panel) Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV3RGB-P3
Comment: Layout, bare board BB3x3
Board Position
Type: Panel
Name: TV3RGB-P3
Comment:
Fiducial mark 1: 15.064mm/ 15.037mm
2: 225.048mm/ 95.062mm
3:

Bill 14:40

Figure 2-39. The new TV3RGB-P3 panel

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MYDATA automation AB Getting Started

Programming the Panel Header Information

3. Open the Panel Editor by pressing <Enter>.
4. Program the panel header information in the same way as the
previous PCB header information was programmed, see
page 2-11 through page 2-19. The PCB Editor is in this case the
Panel Editor.

Use the fiducial marks F1 on the outermost PCBs as alignment

marks.

The board and the panel header information looks like this:

80 BB3x3 F2
A = Bad board marks.
BB3 F2 BB3 F2 BB3 F2
B = Board level measuring C1 C1 C1
point for mount tools. C2 R C2 R C2 R
C3 B C3 B C3 B
C = Board level measuring
C4 G C4 G C4 G
point for glue tools.
TV3R TV3G TV3B
F1 F1 F1
A
0 F1 B C

0 20 50 70 210

Figure 2-40. TV3RGB-P3 panel header information

Panel Header Information

Name: TV3RGB-P3
Comment: Panel, bare board BB3x3
Level measurement tools:
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 210.032mm/ 80.017mm
3 ID: pos.:
Bad board mark pos.: 70.000mm/ 0.000mm
Mount tool test pos.: 20.000mm/ 0.000mm
Glue tool test pos.: 50.000mm/ 0.000mm

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Inserting New PCB into the Panel

This description starts from the Panel Editor, which looks like this
after entering the panel header information:

* PANEL EDITOR *
PCBs
Enter Edit PCB
Ins Insert new
Del Delete
F1 PCB position
F2 Panel header
information
F4 Panel size

Panel Header Information

Name: TV3RGB-P3
Comment: Layout, bare board BB3x3

Bill 14:46

Figure 2-41. The TV3RGB-P3 panel

5. Insert a new PCB into the panel by pressing <Ins>. The

following dialog box is shown:

Insert PCB(s)
PCB name: TV3R
Comment: * UNKNOWN PCB *
Rows: 1
Columns: 1
Total: 1
First new board
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

Column/row step:

6. Type the PCB name, TV3R on the PCB name line and press
<Enter>. The text in the Comment line indicates that the PCB
is not found in the system, so it is no idea to select from the list.

7. Set Rows to 1 and Columns to 1, sinceyou are inserting on PCB

at this time.

8. Put the panel into the machine, if not already done.

9. Press <F1> and center the cross hairs on fiducial mark 1 (F1)
and fiducial mark 2 (F2) of the TV3R board (see Figure 2-40 on
page 2-41).

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MYDATA automation AB Getting Started

The TV3R board is now inserted in the panel:

* PANEL EDITOR *
PCBs
1: TV3R Enter Edit PCB
Ins Insert new
Del Delete
F1 PCB position
F2 Panel header
information
F4 Panel size

Panel Header Information

Name: TV3RGB-P3
Comment: Panel, bare board BB3x3
PCB Position Information
PCB name: TV3R
Comment:

Fiducial mark 1: 15.022mm/ 15.093mm

2: 65.028mm/ 75.051mm
3:

Bill 14:52

Figure 2-42. TV3R inserted into the panel

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Getting Started MYDATA automation AB

Programming the PCB

10. Open the PCB Editor by pressing <Enter> in the Panel Editor:

* PCB EDITOR *
Items Enter Edit item F4 PCB size
Ins Insert new F6 Find position
Del Delete Shift+F6 Reset digitizer
F2 PCB header F7 Change groups
F8 Replace component
PCB Header Information
Name: TV3R
Comment:

Bill 14:58

Figure 2-43. Editing the TV3R board

11. Program the header information in the same way as the TV1
board was programmed, see page 2-11 through page 2-19.

12. Add components to the PCB in the same way as the components
was added to the TV1 board, see page 2-20 through page 2-26.

The TV3R board is now completed and the two remaining TV3G
and TV3B boards are to be inserted and programmed, see the
next section.

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Programming the Additional PCBs

13. Insert and program the TV3G and TV3B boards in the same way
as the TV3R board (only a capacitor differs between the boards).

Or, you can use any of the methods described in the section on
page 2-53.

If the TV3R, TV3G and TV3B boards had been identical, the
same board could have been inserted three times. But they are
not, so you have to create three different boards and insert them
into the panel.

When the three boards are programmed the Panel Editor will
look like this:

* PANEL EDITOR *
PCBs
1: TV3R Enter Edit PCB
2: TV3G Ins Insert new
3: TV3B Del Delete
F1 PCB position
F2 Panel header
information
F4 Panel size

Panel Header Information

Name: TV3RGB-P3
Comment: Panel, bare board BB3x3
PCB Position Information
PCB name: TV3B
Comment: PCB, bare board BB3

Fiducial mark 1: 155.033mm/ 15.082mm

2: 205.019mm/ 75.034mm
3:

Bill 15:04

Figure 2-44. All PCBs inserted into the panel

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Getting Started MYDATA automation AB

Creating Layout
The purpose of this section is to show how to create a layout
containing previously programmed PCBs and panels.

The layout to be programmed contains a complete set of boards for

TV1 the TV set described on page 2-3 that is a mixture of the PCBs and
panels created in the previous examples in this chapter.
TV2 TV2 These are:

The TV-ALL layout containing:

TV3R TV3G TV3B
– TV1 a video board
TV-ALL – TV2-P2 two audio boards as a panel
– TV3RGB-P3 three color boards as a panel

The TV-ALL layout can be assembled on a machine with a Manual

load sysem, or an in-line system equiped with a Manual load adapter.

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MYDATA automation AB Getting Started

Creating a New Layout

1. Open the Layout List Editor by selecting Layouts in the Editor
menu.
2. Create a new layout by pressing <Ins>.
3. Enter the layout name, TV-ALL as shown in Figure 2-45.

* LAYOUT LIST EDITOR *

Layouts
Enter Edit layout
Ins Insert new
Del Delete
F6 HYDRA preparation
F9 Copy

Layout Information
Name:
Insert New Layout
Name: TV-ALL

Bill 15:10

Figure 2-45. Entering a new layout

4. Save the new layout by pressing <Enter>.

5. Open the Layout Editor for editing the new layout by pressing
<Enter>. You are asked whether you want to load the layout or
not.

6. Load the new layout by selecting Yes.

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Getting Started MYDATA automation AB

7. Enter the comment text by pressing <F2> and typing the

following text, that reflects the object and the name of the bare
board:

Bare boards BB1, BB2x2, BB3x3

You can type comment text on a number of lines, but only the
first line is visible in the various editors.

8. Save the layout header modification, either by pressing

<Enter> repeatedly or by pressing <Esc> and accepting to save
the modification in the following box:

Save modifications?
Yes No

The Layout Editor, which now contains the layout with the
comment text, looks like this:

* LAYOUT EDITOR *
Boards
Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV-ALL
Comment: Bare boards BB1, BB2x2, BB3x3

Bill 15:16

Figure 2-46. The new layout

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Adding Boards to the Layout

The layout that has been created is still empty. In this section you are
going to add a PCB (TV1 and two panels (TV2-P2 and TV3RGB-P3)
to the layout.

Adding the TV1 board (PCB)

9. Add the first board by pressing <Ins> and selecting PCB since
the TV1 board is a PCB.

10. Enter the PCB name on the first line in the Insert PCB box:

Insert PCB
Name: TV1
Comment: * UNKNOWN PCB *
Fiducial mark 1: 0.000mm/ 0.000mm
2: 0.000mm/ 0.000mm
3:

... and press <Enter>. Or, just enter 'T' and press <Enter>:

PCB ’TV1’ unknown

Select from list?
Yes No

Select Yes choose the TV1 board from the list and press
<Enter>.

The comment text, PCB, bare board BB1, is read from the PCB
List:

Insert PCB
Name: TV1
Comment: PCB, bare board BB1
Fiducial mark 1: 0.000mm/ 0.000mm
2: 190.039mm/ 90.013mm
3: 190.061mm/ 0.023mm
Press <F1> for camera

11. Put the boards included in the layout into the machine, that is
the TV1 board (PCB), the TV2-P2 board (panel) and the
TV3RGB-P3 board (panel).

The PCB position in the machine is now to be located by means

of the positioning camera.

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

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12. Press <F1> and center the cross hairs on fiducial mark 1:

Set position for fiducial mark 1

Ready
Cancel

15.032mm/ 15.073mm Bill 16:02

13:12

Figure 2-47. Centering fiducial mark F1

13. Confirm the position by selecting Ready. You are asked to

position fiducial mark 2:

Insert PCB
Name: TV1
Comment: PCB, bare board BB1
Fiducial mark 1: 0.000mm/ 0.000mm
2: 190.039mm/ 90.013mm
3: 190.061mm/ 0.023mm
Press <F1> for camera

14. Press <F1> again and repeat the centering procedure for
fiducial mark 2 (and fiducial mark 3):

Set position for fiducial mark 2

Ready
Cancel

205.062mm/ 105.151mm Bill 16:04

Figure 2-48. Centering fiducial mark F2

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After the board is located, you are returned to the Layout Editor,
in which the new board is shown:

* LAYOUT EDITOR *
Boards
1: TV1 (PCB) Enter Edit board
Ins Insert new
Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV-ALL
Comment: Bare boards BB1, BB2x2, BB3x3
Board Position
Type: PCB
Name: TV1
Comment: PCB, bare board BB1
Fiducial mark 1: 15.032mm/ 15.073mm
2: 205.062mm/ 105.151mm
3: 205.093mm/ 15.027mm

Bill 15:22

Figure 2-49. The first PCB in the layout

Adding the TV2-P2 board (panel)

15. Add the second board by pressing <Ins> and selecting Panel
since the TV2-P2 board is a panel.

16. Enter the panel name on the first line in the Insert panel box and
press <Enter> (or select from the list):

Insert panel
Name: TV2-P2
Comment: Panel, bare board BB2x2
Fiducial mark 1: 0.000mm/ 0.000mm
2: 200.057mm/ 70.042mm
3:

If two similar boards are inserted in the same layout, then you
do not need to select the second board name since the system
suggest the same board again. The second fiducial mark for this
board is estimated as well.

If more than two similar boards are inserted, then the system
assumes that the following boards are lined up and moves
automatically to the positions of the following fiducial marks.

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17. Center the panel fiducial marks in the same way as the PCB
fiducial marks was centered for the TV1 board.

If positions that means overlapping boards are detected, then

the system informs about that.

Adding the TV3RGB-P3 board (panel)

18. Add the second board by pressing <Ins> and selecting Panel
since the TV3RGB-P3 board is a panel as well.

19. Enter the panel name on the first line in the Insert panel box and
press <Enter> (or select from the list).

20. Center the panel fiducial marks in the same way as the previous
fiducial marks.

If positions that means overlapping boards are detected, then

the system shows a warning.

The complete layout

The layout containing all the boards for the TV set is now completed
and it looks like this:

* LAYOUT EDITOR *
Boards
1: TV1 (PCB) Enter Edit board
2: TV2-P2 (Panel) Ins Insert new
3: TV3RGB-P3 (Panel) Del Delete
F1 Board position
F2 Layout header
information

Layout Header
Name: TV-ALL
Comment: Bare boards BB1, BB2x2, BB3x3
Board Position
Type: PCB
Name: TV1
Comment: PCB, bare board BB1
Fiducial mark 1: 15.032mm/ 15.073mm
2: 205.062mm/ 105.151mm
3: 205.093mm/ 15.027mm

Bill 15:28

Figure 2-50. The complete TV-ALL layout

Return to the TPSys main window by pressing <Esc> repeatedly.

The created layout can now be assembled, see Chapter 3 in the

Operator's Manual.

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Identical and Almost Identical Boards

If a panel contains identical PCBs, then you can add a matrix of PCBs
by simply entering the number of rows, columns and spacing. This
feature is very convenient for panels that contain a large number of
identical PCBs.

If there are almost identical PCBs, then you as follow:

Make copies of the PCB and modify what differs.

To copy a PCB, select the PCBs option in the Editor menu, select
PCB to copy from, and press <F9>.

Panels can be also be copied and modified in the same way by

selecting the Panels option in the Editor menu.

Entire layouts can also be copied and modified in the same way by
selecting the Layouts option in the Editor menu.
Example: The TV3RGB-P3 panel is created by copying the TV3R board to
TV3G and to TV3B, modifying the boards, and inserting the three
board types into the panel.

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Training Boards
The following pages contain the training boards used in this chapter.
You can copy these boards (scale 1:1), cut them out and put them on
top of a board in the machine and thus be able to follow the
programming procedure described in this chapter.

TV1

F3
F2

TV1

C3 C2 C1

F1

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TV2

F2

F2
TV2

C1
C2

F1
F2

TV2
C1
C2

F1

F1

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TV3R, TV3G and TV3B

F2
TV3B

F2

G
R

B
C1

C2

C3

C4

F1
TV3G
F2

G
R

B
C1

C2

C3

C4

F1

TV3R
F2

G
R

B
C1

C2

C3

C4

F1

F1

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Basic Systems and Features

MYDATA component placement machines are able to apply adhesive
for components that are to be wave soldered, pick components from
magazines, perform optical centering, mechanical and electrical
verification, and place the components onto printed circuit boards.

If the machine is equipped with conveyor, mounted printed circuit

assemblies are replaced by new bare boards automatically.

The assembly process is controlled by software that takes

information from numerous lists within the system. These lists
contain information about the components, their packages, the
magazine in which the components can be found, and where the
components are to be placed.

When programming, all component positions refer to two or three

fiducial marks on the board. Prior to assembly each board is located
using an optical fiducial mark search feature. Thus, the exact
location and alignment of the board on the assembly table is not
important.

Components are centered optically, or mechanically, and verified in

accordance with the options set during programming. These
operations are performed during component transportation from the
magazine to the board.

The machine is entirely processor controlled. The operator controls

all functions with keyboard, machine keypad, trackball and joystick.
Two or three monitors display menus, current processes and
messages.

Data, such as the Linux operating system, the TPSys mount

software, package, component and magazine lists, operating data,
and system parameters is stored on an internal hard disk.

Printouts of most of the TPSys information can be obtained.

Some of the TPSys features can be run off-line.

Assembly and magazine information can be shared by many

MYDATA machines provided that the TPSys network option is
available for the machines (there is a unique magic word for each
machine that can include this feature). The network is also used for
backups, CAD imports, exchange of various files, and for
communication with other software such as MYPlan.

For information about basic system operation, for instance keyboard,

machine keypad, joystick, monitor, menus, messages, and disk
drives, see Chapter 2 of the Operator’s Manual.

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Machine Functions and Coordinates

Theta
C C

Assembly table
Magazine

Figure 3-1. The five main movement functions

Components are mounted using five movement functions:

X movement is the • The mount tool is moved to the magazine pick-up position with the
longitudinal movement of the X movement (the X coordinate of the machine).
machine.
The mount tool is located on a wagon which moves in the
longitudinal X direction of the machine. This means that the
pick-up positions, that is the positions at which components are
taken from the magazines, must be located along this line.
Z movement is the vertical • The mount tool is lowered towards a component with a vertical
movement of the tool. Z movement. When the tool nozzle reaches the component, the
air is evacuated (by means of a vacuum pump) in the mount tool
nozzle, making it hold the component.
• The mount tool is raised with the Z movement, see Figure 3-2.
• The component is moved along the X line to a position
corresponding to the component location on the printed circuit
board. The following procedures are performed during that
movement:

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Figure 3-2. Picking a component

– If optical centering is used, the vision system will use a camera

to locate the alignment, rotation and outline of the component
on the mount tool.
C movement is the – If mechanical centering is used, two centering jaws (one on each
symmetrical movement of the side of the component, see Figure 3-3) move symmetrically in a
centering jaws. C movement towards each other, until they are both in contact
with the component, which is moved to the middle of the tool
(centering and aligning). In this position the external dimension
and, for certain components, electrical data are measured. The
centering jaws then retract.
The assembly process continues if the component was not
rejected at the verification. A rejected component is manually
removed, put back, or ejected into a bin for rejected components.
Theta movement is the – The tool with the component is rotated 90 degrees by the Theta
rotation of the tool. movement to be centered a second time.
Depending on package criteria, there may be additional
centering phases.

Theta
C C C C

-90°

Figure 3-3. Mechanical centering and verifying

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Theta

Figure 3-4. Rotating and mounting

• The component is rotated by the Theta movement to the angle

at which it is to be mounted (see Figure 3-4).
Y movement is the movement • The assembly table moves in a Y movement (the Y coordinate of
of the assembly table. the machine) to a position corresponding to the component
location on the printed circuit board.
• The Z movement lowers the mount tool with the component. The
component is pressed against the board with the force set. The air
pressure in the mount tool nozzle is increased to quickly release
the component. The tool is then raised.

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Vision Systems
There are two main purposes for the machine vision in TPSys:
Locating fiducial marks and inspecting components.

Locating fiducials and other objects

• PCB fiducials – The location of the PCB must be determined with
very high accuracy to be able to place the components at the right
positions. If the PCB is not located then all components will be
mounted with an offset from there nominal position. The X-wagon
camera is used for locating the fiducials of the PCB.

• Magazine fiducials – The X-wagon camera locates magazines and

trays to ensure successful picking of components.

• Tray and Pallet Corners – The X-wagon camera locates the pallet
corners to ensure successful picking of components in a tray.

• Bad board mark – The X-wagon camera is used when locating the
bad board fiducials. The fiducial tells if a PCB in a panel is to be
mounted or not.

• Feeder positions – The X-wagon camera locates feeder positions in

tape and vibrtory magazines. This to ensure successful picking of
components.

• Pre pick-inspctin – The X-wagon camera is optionally used to

locate components exact position in a traybefore picking.

Inspecting components
When a tool has picked a component the vision system inspects the
rotation and alignment of the component on the mount tool. This is
done by locating all the solder balls, or the leads, of the component.
The system also checks that all solder balls or leads are present and
undamaged. If a lead is not detected it might be missing, damaged or
it might be the wrong component. In these cases the component will
not be mounted. Polarity can also be inspected if the component is
non-symmetric or if it has an index mark.

Calibrating the machine:

The different cameras in the system are also used to calibrate the
machine, such as calibrating the X- and Y-wagon.

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Cameras in the Vision System

The MYDATA Vision System have different subsystems with specific
features and applications. These systems are:

– Positioning Vision System (PVS)

– Standard Vision System (SVS)

– Dual Vision System (DVS)

– Linescan Vision System (LVS)

– HYDRA Vision System (HVS)

Positioning Vision System

This system uses a downward looking camera mounted on the
X wagon, the X-wagon camera, to inspect and locate PCBs and
feeders. It is also used for PCB programming.

Standard Vision System

The Standard Vision System (SVS) uses an upward looking camera
for centering and inspection of components. The system is primarily
used for centering and inspection of fine-pitch components.

Dual Vision System

The Dual Vision System (DVS) combines the Standard Vision System
with a high resolution camera, which enables it to align components
ranging from large QFPs to Flip-chips. The system is also equipped
with an advanced programmable lightning to further improve the
alignment of difficult components.

Linescan Vision System

The Linescan Vision System uses a camera that scans the
components on the move. This camera is the fastest and is primarily
used for high speed mounting of large components. The Linescan
camera is also used by the HYDRA mount head.

HYDRA Vision System

The HYDRA Vision System uses an upward looking camera that
examines each component on the HYDRA while it is moved from the
magazine to the board.

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Fiducial Marks
Fiducial marks are two or three arbitrarily shaped marks used to
F2 ascertain the position of the PCB with respect to the machine
X/Y coordinates.

Fiducial marks should be positioned as far from each other as

possible (diagonally near the corners of the board), as this facilitates
higher assembly accuracy.

Avoid positioning three fiducial marks in line. Only two of these

marks will be used by the system.

Fiducial marks with text, for instance F1 and F2 in the figure, are
easy to identify when displayed on the screen.
F1
Fiducial marks should be included in the etched artwork that also
contains the land patterns for the components. Corners of the board,
drilled via holes, or other marks not included in the etched artwork,
should not be used as fiducial marks, as any deviations will affect the
assembly accuracy.

Drilled via holes should not be used as fiducial marks, even if they
have been drilled very precisely, because the machine measures the
board level at the same position as a fiducial mark if the board origin
is positioned on a fiducial mark and no other location has been
defined for the board level measurement.
Printed circuit boards without fiducial marks can also be assembled
if other marks are selected as fiducial marks. However, in this case,
it may be difficult to use automatic fiducial mark search for board
location.

Before the fiducial marks can be described, it is necessary to know

about the three coordinate systems to which the fiducial marks are
related. These coordinate systems are described on page 3-8.

Entering coordinate values from keyboard

TPSys usually shows X/Y coordinates like this:

0.000mm/ 0.000mm

When entering new values, simply enter the X and Y values

separated by a space. If you, for example, want the X coordinate to be
25mm and the Y coordinate 35mm, type:

25 35

If you fail to type the values from the numerical section of the
keyboard, the Num Lock is probably off.

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Coordinate Systems
Three coordinate systems on different levels are used to assemble
PCBs and panels (a panel is a board containing more than one PCB):

• PCB coordinates – for positioning components.

• Panel coordinates – for locating included PCBs.
• Machine coordinates – for locating boards (and for many other
purposes).

Further descriptions of PCBs, panels and layouts are found in the

PCB, Panel and Layout section in Chapter 7.

PCB coordinates
The PCB coordinate system is used to position components on
printed circuit boards.
The origin of the PCB coordinate system can be selected either inside
or outside the board outline by defining the position of fiducial
mark 1. Thus, you can use the same origin as used in the design data
of the board, if any. Figure 3-5 shows an example of a board on which
the origin corresponds to fiducial mark 1.

F2

F1
0

Figure 3-5. Coordinate origin at fiducial mark 1

To get the origin at fiducial mark 1, set the X/Y values to 0/0 in the
PCB header information box (shown on page 3-10):
Mark 1 ID: pos.: 0.000mm/ 0.000mm

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MYDATA automation AB Basic Systems and Features

If the X/Y values are changed to:

Mark 1 ID: pos.: 15.000mm/ 20.000mm

the origin of the PCB coordinate system is positioned outside the

board as shown in Figure 3-6.

F2

F1
20

0
0 15

Figure 3-6. Coordinate origin outside the board

All components are positioned with reference to the PCB coordinate

system. If a component is positioned near the edge of the board, the
coordinates of the component will be as shown in Figure 3-7. Note
that the coordinates are calculated to the middle of the component.

F2 F2

30 50

F1 F1
0

0 0
-3 0 12

Figure 3-7. Component coordinates

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Fiducial mark 2 and, if applicable, mark 3 are assigned their

coordinates in the same way as components, by keyboard entry or by
using the position vision system.

Figure 3-8 shows a PCB named TV2 mounted on a bare board named
BB2. The coordinates in the figure correspond to the following PCB
header information for the board:

PCB Header Information

Name: TV2
Comment: PCB, bare board BB2
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 80.000mm/ 50.000mm
3 ID: pos.:
Bad board mark pos.: 20.000mm/ 25.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

55
BB2
A = Position of bad board 50 F2
marks. TV2
B = Board level measuring
point for mount tools.
A
C = Board level measuring
point for glue tools. 25

B C
0 F1
-5

-5 0 20 30 40 80 85

Figure 3-8. Coordinates on the TV2 board

Panel coordinates
The panel coordinate system is used to define the positions of the
PCBs included in the panel.

The fiducial marks on the PCBs are used for this positioning.

Figure 3-9 shows an example of the previous board, shown here as a

panel containing two TV2 boards.

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A = Position of bad board 75

F2
70 BB2x2
marks.
60 F2 F2
BB2 BB2
B = Board level measuring TV2 TV2
point for mount tools.

C = Board level measuring

point for glue tools.
10 R1 F1
A
0 F1 B C
-5
200
-5 0 10 30 40 90 100 110 190 205

Figure 3-9. Panel coordinate system

The coordinates in the figure correspond to the following panel

header information for the TV2-P2 board:

Panel Header Information

Name: TV2-P2
Comment: Panel, bare board BB2x2
Level measurement tools:
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 200.000mm/ 70.000mm
3 ID: pos.:
Bad board mark pos.: 100.000mm/ 25.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

The coordinates of the first included PCB look like this in the Panel
List:

PCB Position Information

PCB name: TV2
Comment: PCB, bare board BB2

Fiducial mark 1: 10.000mm/ 10.000mm

2: 90.000mm/ 60.000mm
3:

... and for the second included PCB like this:

PCB Position Information

PCB name: TV2
Comment: PCB, bare board BB2

Fiducial mark 1: 110.000mm/ 10.000mm

2: 190.000mm/ 60.000mm
3:

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Machine coordinates
The machine coordinate system is used to locate the boards on the
assembly table. The machine coordinate system is illustrated in
Figure 3-1 on page 3-2.
A board location is performed by storing the coordinate values of the
fiducial marks. These values are stored after the fiducial marks are
found and centered by means of the camera. The board location
procedure is performed prior to each assembly start. The coordinate
values of the last board assembled are stored by the system. If more
than one board was assembled in the same layout, the coordinate
values for all the boards are stored. When the assemblies are
completed and replaced with new bare boards to be assembled, the
machine starts searching for the fiducial marks at the same positions
where they where found last time.

The machine coordinate values are shown at the bottom left of the
screen when the machine is in board location mode, that is after
selecting the Locate Boards (Manual) option in the Production
menu. The board shown in Figure 3-11 looks like this on the screen:

Center cross hairs on fiducial mark 1

Ready
Cancel

15.634mm/ 135.881mm Brian 11:23

Figure 3-10. Machine coordinates

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Defining Fiducial Marks

Before any component can be positioned on a printed circuit board,
fiducial marks must be defined to create the PCB coordinate system.

To define the board fiducial marks means:

– Entering the type of fiducial marks and teaching the machine to

recognize the marks on the board (a necessity for automatic
fiducial mark search).

– Entering the values of the fiducial mark coordinates.

A board named TV1 is referred to in the following description. It has

three fiducial marks and looks like this:

BB1 F2
TV1

F1 F3

Figure 3-11. Printed circuit board TV1

Create layout, board and fiducial mark

• Open the Layout List Editor (described in Chapter 7).
• Insert a new layout. Select the new layout, press <Enter> and
accept to load the new layout.

• In the Layout Editor, insert a new PCB, enter the name TV1 and
skip the rest of header information in the popup box shown.

• Open the PCB Editor by selecting the new PCB in the Layout
Editor and pressing <Enter>.

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• In the PCB Editor, press <F2> and enter comment text and
number of fiducial marks (3) into the PCB Header Information
box:

PCB Header Information

Name: TV1
Comment: PCB, bare board BB1
Level measurement tools:
No. of fiducial marks: 3
Mark 1 ID: R pos.: 0.000mm/ 0.000mm
2 ID: pos.: 0.000mm/ 0.000mm
3 ID: pos.:
Bad board mark pos.: 0.000mm/ 0.000mm
Mount tool test pos.: 0.000mm/ 0.000mm
Glue tool test pos.: 0.000mm/ 0.000mm

• To add the first fiducial mark F1, named Ro-1.0 because it is a

round mark with a diameter of 1.0mm, enter a character of the
fiducial mark name, for instance 'R' and press <Enter> (see the
figure above).

• Accept to select from the Fiducial Mark List, which contains

available fiducial marks. The name that most closely matches the
characters entered is highlighted. This feature is intended for
searching and selecting taught fiducial marks directly from the
Mount List. The Fiducial Mark List is further described in
Chapter 8.

• Press <Ins> and type the name and user comment text:
Select the fiducial mark that
has most data in common with Create New Fiducial Mark Type
the new mark before pressing Name: Ro-1.0
<Ins>. Current data will be
Comment: Round 1.0mm
applied to the new mark.

• Press <Enter> to save the new fiducial mark.

Teaching the fiducial mark

• The system can learn to recognize fiducial marks after recording
the shapes using the vision system. To record the new fiducial
mark, place the board on the assembly table, make sure the Ro-1.0
is highlighted and press <F7>.

• Center the fiducial mark using the trackball or joystick as shown

in Figure 3-12 Fiducial mark Ro-1.0 is marked F1 on the board.

• Confirm the centering by pressing <Enter> when Ready is

highlighted.

A yellow rectangle, the search area, appears in the image and you
are asked to adjust its size, see Figure 3-13. If text, conductors or
any other surrounding parts of the board artwork is included in the
search area, the size can be controlled with the joystick or trackball
to cover only the fiducial mark. Confirm the size by pressing
<Enter>. The result is shown on the screen.
The verify area is taught in the same way as the teach area.

If the teaching fails, then the fiducial mark data may need to be
modified, see the Fiducial Mark List section in Chapter 8.

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Teach mark Ro-1.0 Center on mark

Ready
Cancel

15.102mm/ 15.027mm Brian 11:28

Figure 3-12. Teaching fiducial mark F1

View of teach result

Brian 11:32

Figure 3-13. Fiducial mark and teach area

• Press any key to return to the Fiducial Mark List window.

• Press <F8> if you want to test the mark by using the fiducial
mark search or <Esc> to exit the test mode.

• Press <Enter> when Ro-1.0 is highlighted to select this fiducial

mark and to return to the PCB Editor.

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Defining the first fiducial mark

If the design data for the circuit board is available, the first fiducial
mark coordinates can be typed into the PCB header information box.
If there is no design data available for the board, define the fiducial
mark as described below.

The origin of the board coordinate system is intended to coincide

with fiducial mark 1 as shown in Figure 3-5 on page 3-8. So, the
X/Y coordinates of the first fiducial mark is left unchanged, but you
must position them on the assembly table. The system needs this
position to be able to calculate the coordinate values of the remaining
fiducial marks:

PCB Header Information

Name: TV1
Comment: PCB, bare board BB1
Level measurement tools:
No. of fiducial marks: 3
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: pos.: 0.000mm/ 0.000mm
3 ID: pos.:
Bad board mark pos.: 0.000mm/ 0.000mm
Mount tool test pos.: 0.000mm/ 0.000mm
Glue tool test pos.: 0.000mm/ 0.000mm
Press <F1> for camera

If you enter approximate 1. Press <F1> to enter the position using the camera. Center the
values before pressing <F1>, cross hairs on the fiducial mark as shown in Figure 3-14.
the camera will be moved to
the indicated position, and you
will need to carry out only fine
adjustments using the Center cross hairs on fiducial mark 1
trackball or joystick. Ready
Cancel

0.000mm/ 0.000mm Brian 11:33

Figure 3-14. Centering fiducial mark F1

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2. Press <Enter> when Ready is highlighted.

3. Select Yes if you want this fiducial mark to be verified by the
vision system, otherwise No.

Autosearch fiducial mark?

Yes No

Measuring the board angle on the assembly table

To be able to calculate correct coordinate values for the fiducial
marks the system must first calculate the angle in which the board is
oriented on the assembly table while the fiducial marks are defined.
A This angle affects the coordinate values, see 'A' in the figure.

Two marks along the length line (or width line) of the board are used
to calculate the board angle. If there are no fiducial marks along the
X or Y axes, then use traces, mounting pads or other parts of the
board artwork. The only requirement is that the selected marks must
be located along the length or width line of the board artwork, and
the distance between them should be as big as possible to achieve the
highest accuracy, see 'B' in the figure.
B
The following dialog box, displayed directly after centering fiducial
mark 1, asks whether the board angle is to be measured or not:

Measure board angle?

Yes No

• Select Yes to calculate the board angle.

Use the F1 and F3 fiducial marks as they are located along the
length line of the TV1 board. It is also possible to use fiducial
marks F2 and F3 to measure the angle. However, the distance
between them is less than that between F1 and F3, which would
decrease the accuracy.

It is not necessary to indicate whether a length or breadth line has

been selected, the system is able to decide it due to the positions of
the marks.

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Basic Systems and Features MYDATA automation AB

Center cross hairs on first alignment mark

Ready
Cancel

15.103mm/ 15.027mm Brian 11:34

Figure 3-15. Centering the first alignment

• Center the cross hairs on fiducial mark F1, see Figure 3-15 and
confirm the first alignment mark by pressing <Enter> when
Ready is highlighted.

• Move to fiducial mark F3 and repeat the procedure for the second
alignment mark, see Figure 3-16.

Center cross hairs on second alignment mark

Ready
Cancel

205.064mm/ 14.792mm Brian 11:40

Figure 3-16. Centering the second alignment mark

The alignment of the board is displayed as follows:

Board angle: 0.07°

Yes No

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MYDATA automation AB Basic Systems and Features

Defining the second fiducial mark.

Fiducial mark F2 is defined in the same way as F1, except for the
alignment measurement, which has already been done:

• Enter the name of the second fiducial mark, see page 3-13. Use the
name Sq-1.0 as the mark is a square with a side of 1.0mm.

• Teach the second fiducial mark, see page 3-14.

• Enter the coordinates of fiducial mark 2, see page 3-16. Center
fiducial mark F2 as shown in Figure 3-17.

Center cross hairs on fiducial mark 2

Ready
Cancel

190.013mm/ 90.136mm Brian 11:48

Figure 3-17. Centering fiducial mark F2

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Basic Systems and Features MYDATA automation AB

Defining the third fiducial mark.

Fiducial mark F3 is defined in the same way as the others. The F3
fiducial mark has the same shape as F2 already taught.

• Enter the name Sq-1.0 for the third fiducial mark.

• Press <F1> and center fiducial mark F3, see Figure 3-18.

Center cross hairs on fiducial mark 3

Ready
Cancel

190.073mm/ 0.065mm Brian 11:52

Figure 3-18. Centering fiducial mark F3

When the three fiducial marks are defined, the PCB header
information box shows the following:

PCB Header Information

Name: TV1
Comment: PCB, bare board BB1
Level measurement tools:
No. of fiducial marks: 3
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 190.013mm/ 90.136mm
3 ID: Sq-1.0 pos.: 190.073mm/ 0.065mm
Bad board mark pos.: 0.000mm/ 0.000mm
Mount tool test pos.: 0.000mm/ 0.000mm
Glue tool test pos.: 0.000mm/ 0.000mm

Now, you can test automatic fiducial mark search on the board by
selecting the Locate Boards (Auto) option in the Production menu.

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MYDATA automation AB Basic Systems and Features

Locating Boards
When the fiducial marks have been defined, it does not matter how
the boards are placed on the assembly table. The system calculates
the component positions and angles in relation to the fiducial marks.
However, the system must be told where the board is positioned on
the assembly table. So, each board must be located prior to assembly.

IMPORTANT

Fiducial marks must be centered in the correct order. If the

marks are swapped on a board with fiducial marks diagonally, all
components will be mounted back to front.

See the PCB number displayed at the top left of the screen (see
Figure 3-19).

Manual board location

Rotate the TV1 board by 90 degrees on the assembly table. Then
select the Locate Boards (Manual) option in the Production
F2

F3

menu. Center fiducial mark F1 as shown in Figure 3-19 and the

fiducial marks F2 and F3 in the same way.

Locate PCB fiducial mark 1 (Ro-1.0), Del Mark board non-present

PCB 1
Board not present
Ready
Cancel
F1

105.106mm/ 15.024mm Brian 11:58

Figure 3-19. Manual board location

A graphic overlay of the fiducial mark is shown on the screen when

locating boards manually.

Now the system has located the board position and angle and will
mount all the components correctly.

For further information about manual location of boards, see Board

Location and Manual Fiducial Mark Search in Chapter 8 of the
Operator’s Manual.

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Basic Systems and Features MYDATA automation AB

Automatic location
When the machine has learned the fiducial marks, location can be
carried out automatically, that is the system searches for the fiducial
marks and centers the cross hairs on them. Each board is then
assumed to be positioned within a couple of mm from the previous
position.

You can test this feature as follows:

• Perform an automatic fiducial mark search by selecting the

Locate Boards (Auto) option in the Production menu.

• Move the TV1 board 1mm approximately on the assembly table.

F2

F3

• Select the Locate Boards (Auto) option in the Production

menu.

The automatic fiducial mark search will now search for the three
fiducial marks and center them.
1 mm
This procedure is performed on each board prior to assembly.

For further information about automatic location of boards, see

Board Location and Automatic Fiducial Mark Search in Chapter 8 of
the Operator’s Manual.
F1

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MYDATA automation AB Basic Systems and Features

Fiducial mark deviations

If a fiducial mark coordinate deviation exceeds permitted values, the
system asks whether the board is to be accepted or not.

For further information about fiducial mark deviations, see Board

Location and Fiducial Mark Deviation in Chapter 8 of the Operator’s
Manual.

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Basic Systems and Features MYDATA automation AB

Angles
This system relates all angles to the machine. This applies to all
angles for components, PCBs, magazines, centering and verification.
The relationship between the machine and the angles is shown in
Figure 3-20 (top view).

X wagon

Assembly table Magazine

Figure 3-20. Machine angles

A component is oriented in 0° when lead 1 (and the mark, if any) is

pointing towards 0° in the alignment system of the machine and/or
lead 1 is in the top left quadrant. The angles shown in Figure 3-21
apply to bipolar components.

1
1 1
1
0° 90° 180° 270°

Figure 3-21. Bipolar component angles

Symmetrical components that are not polarized, for instance

resistors, can be verified and mounted in 180° to their programmed
angles.

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MYDATA automation AB Basic Systems and Features

Angles for other unmarked components are given in the same way as
for bipolar components. Figure 3-22 shows examples of a tripolar
diode and transistor package.

1
1
1 1

0° 90° 180° 270°

Figure 3-22. Unmarked tripolar component angles

0° Marked components are aligned as indicated by the marking. The

1
figure shows a simple IC ...
270/-90° 90°

180°

0° ... and a multipolar IC.

270/-90° 90°

180°

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Basic Systems and Features MYDATA automation AB

Centering
The purpose of the centering feature is to adjust the component
position and angle on the mount tool nozzle (mechanical centering),
or to detect the component position and angle on the mount tool
nozzle (optical centering). The centering procedure is performed
while components are moved from the magazine to the board.

Mechanical Centering – Single Mount Head

Mechanical centering means that the centering jaws move towards
each other until the component is centered on the mount tool nozzle.

A basic description of mechanical centering is found in the Machine

Functions and Coordinates section on page 3-2.

Theta

C C C C

-90°

Figure 3-23. Mechanical centering

Optical Centering – Single Mount Head

The optical vision system examine the component and calculates the
components position and alignment while it is held by the mount tool
nozzle. Then the system calculates the mount tool position and
alignment for making a correct component placement. Bent leads, if
any, are taken into consideration.

Components with leads bent more than specified are rejected.

Depending on the type of lead group, a package larger than the

camera field of view can be examined from two images (dual shot).
This is automatically handled by the system.

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MYDATA automation AB Basic Systems and Features

The following optical cameras are used:

• The Standard Vision Camera (SVC) is used for large components

like QFPs and BGAs.

• The High Resolution Camera (HRC) for small components like

Flip Chip.

• The Linescan Camera (LSC) for scanning components on the

move, passing the camera. This camera is the fastest one (up to
three times faster than the Standard Vision Camera), and is used
for high speed mounting and of large components. The Linescan
camera is also used by the HYDRA. for scanning components on
the move.

The cameras all have a programmable light units that can control the
light intensity and pattern for different packages. Which camera is to
be used for a certain package is specified in the Package List. If more
than one camera is used, the system selects the camera with the
highest mounting speed.

The camera design includes a programmable illumination unit that

can control the light intensity and pattern for different packages.

Details on how to program the lightning of the different cameras is

detailed in Chapter 5.

Optical Centering – HYDRA Unit

After the components are picked from the magazine, a HYDRA
Vision System (HVS) with a separate HYDRA Camera (HC) or the
Linescan camera (LSC), examines each component while the
components are moved from the magazine to the board.

Then, the system calculates the mount tool positions and alignments
for making correct component placements.

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Basic Systems and Features MYDATA automation AB

Verification
Verification is performed during the centering phase, see Figure 3-23
on page 3-26. Mechanical and electrical verification can be used by
the system.

Package Verification
Package verification means that a picked components package data
is measured andverified. The result is compared to the dimensions,
lead types, permissible variations and such as specified in the
Package List.

Optical centering is used to examine the component outline and

external dimensions. This outline is then compared to the component
body dimensions and the lead shapes as specified in the Package List.

During mechanical centering the centering jaws measure the

external dimensions of the component package. The component
dimensions are then compared to the dimensions specified in the
Package List.

Components that do not meet the specifications above are rejected,

see below.

Electrical Verification
Electrical verification is performed using the single mount head.
Electrical verification means that electrodes on the centering jaws
measure electrical data on the component during the mechanical
centering. The result is then compared to the values and tolerances
specified in the Component List. The electrical verifier is described
on page 3-30.

Components that do not meet the specifications are rejected, see

below.

To avoid placing diodes and transistors back to front, these

components can also be verified prior to placing and diodes can also
be rotated to correct polarity if picked back to front. This is further
described on page 3-29.

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Electrical verification when using the HYDRA

When a HYDRA is used no electrical verification is performed. The
single mount head can be used to perform electrical verification
before the HYDRA is used. A preset number of components are
picked by the single mount head, verified with the centering jaws,
and placed on the board before the HYDRA unit starts mounting
components. The number of components to be tested is preset with
the 0002 No. of successful test before HYDRA parameter in the 1001
Test switches parameter group found by selecting the Mount/Glue
Switches in the Production menu.

Logging measured values

Values measured during electrical verification can be logged and
stored in the event log. This optional feature makes it possible to
trace component values, but also to provide measured component
values to assembled PCBs.

This feature is further described under Save electric value in the PCB
Editor section in Chapter 7.

Rejected Components
If a component does not meet the values specified when verified it is
rejected. It can be put, for instance, into a bin for rejected
components. If a specified number of components are rejected (3 by
default), no further components are picked from that particular
feeder until the magazine has been removed from the machine for
component replacement, or after selecting the Reset Magazine
Errors option in the Magazine menu.

Rotating Diodes Picked Back to Front

Diodes picked back to front from magazines are treated as defect
components at the electrical verification due to wrong polarity. If
such a diode is picked with a mount tool, for which the Z hold
compensation parameter in the 0023 Tool manager parameter group
is set to anything else than 0mm, then the diode can be turned to the
correct polarity. This feature is controlled by the following two
parameters:

0021.0241 Turn if el. test failed

Yes – The diode is turned to the correct polarity.
No – The diode is rejected.

0021.0242 Warn when turning

Yes – A warning is shown prior to turning the diode to correct
polarity, provided the 0021.0241 Turn if el. test failed
parameter is set to Yes.
No – No warning message is shown.

Turning diodes will reduce the performance if the diodes are picked
from magazines located close to the assembly table.

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Basic Systems and Features MYDATA automation AB

Electrical Verifier
During electrical verification it is essential that polarized
components are correctly positioned between the jaw electrodes. It is
also important that components are positioned at the correct level as
the electrodes are designed to provide various touch points for
different component lead configurations and measurements on
various levels.

The level can be set to a Level value between 1 and 12 in the Package
List.

Note that Level only indicates a level. The component position

referred to this level is indicated as Position in the Package List.

The Level is described in the following section. Further information

about the Position is found in Chapter 5.

Centering Level
The twelve centering levels are shown in Figure 3-24. The base level
is set by the 0021.0221 Base level parameter.

7
6
4
1
11
2
9
10
3
5

7
6
4
1 11
2 9
10 3
5

Figure 3-24. Centering levels

The M and E letters in the following list indicate verifications that

can be performed during the mechanical centering:

M = Mechanical verification.
E = Electrical verification.

The component orientation during centering and verification is

described in the next section.

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MYDATA automation AB Basic Systems and Features

Number 1 – Offset 0
ME; Standard 2-pole packages, such as 0805, 1206, 1812 and diodes
housed in the SOT-23JEDEC package.

Number 2 – Offset 5.35mm below base level

ME; Transistors housed in the SOT-23JEDEC package.

Number 3 – Offset 9.65mm below base level

ME; Transistors housed in the SOT-23JEDEC package. Reverse
polarity to level number 2.

Number 4 – Offset 1.00mm above base level

M; QFP64, QFP80, and QFP100 packages.

Number 5 – Offset 13.5mm below base level

M; SO20 – SO28 packages.

Number 6 – Offset 3.00mm above base level

M; QFP64, QFP80, QFP100, and QFP120 packages.

Number 7 – Offset 5.00mm above base level

M; QFP120 package.

Number 8 – Offset 0
Not used.

Number 9 – Offset 6.60mm below base level

ME; Transistors housed in the SOT89 package.

Number 10 – Offset 8.40mm below base level

ME; Transistors housed in the SOT-89JEDEC package. Reverse
polarity to level number 9.

Number 11 – Offset 0.60mm below base level

ME; Same as level number 1, that is standard 2-pole packages such
as 0805, 1206 and 1812.

Number 12 – Offset 0
Not used.

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Basic Systems and Features MYDATA automation AB

Orientation – Polarized Capacitors

Polarized capacitors in standard 2-pole packages, such as 0805, 1206
1
and 1812 should be set to:

Centering level:Number 1 or 11.

2 Cathode:Lead 1.
Anode: Lead 2.

Centering phases:
1. Centering and mechanical/electrical verification in 90°.
2. Mechanical verification in 0°.

Capacitance test indicated in the Component List:

Name: 123456
Comment:
Barcode:
Package: 1206-06
Mount: Yes
Magazine type: Tape
Feeder type: 8mm
Glue: Yes
Reject position: Reject bin 1
Polarized: Yes
Test 1 Test 2
Type: Capacitance pol. ---
Angle: 90.00° ---
Value: 1µF +-20% ---
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
Angle: 90.00° Level: 11
Position: Upper
2 1 Force: Middle
Dimension: 3.2mm Min.: 3mm Max.: 3.4mm
Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
1 Angle: 0.00° Level: 1
Position: Upper
Force: Middle
Dimension: 1.6mm Min.: 1.4mm Max.: 1.8mm
2 Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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MYDATA automation AB Basic Systems and Features

Orientation – Diodes in 2-pole Packages

Diodes in standard 2-pole packages, such as 0805, 1206 and 1812
1
should be set to:

Centering level:Number 1 or 11.

2 Cathode:Lead 1.
Anode: Lead 2.

Centering phases:
1. Centering and mechanical/electrical verification in 90°.
2. Centering and mechanical verification in 0°.

Forward voltage drop test and reverse leakage current test indicated
in the Component List:

Name: 123456
Comment:
Barcode:
Package: 1206-06
Mount: Yes
Magazine type: Tape
Feeder type: 8mm
Glue: Yes
Reject position: Reject bin 1
Polarized: Yes
Test 1 Test 2
Type: Diode voltage Diode rev. current
Angle: 90.00° 90.00°
Value: 0.75V +-5% 5µA
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
Angle: 90.00° Level: 11
Position: Upper
2 1 Force: Middle
Dimension: 3.2mm Min.: 3mm Max.: 3.4mm
Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
1 Angle: 0.00° Level: 1
Position: Upper
Force: Middle
Dimension: 1.6mm Min.: 1.4mm Max.: 1.8mm
2 Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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Basic Systems and Features MYDATA automation AB

Orientation – Diodes in SOT23 Package

Diodes housed in the SOT23 package should be set to:
1
SOT- 3 Centering level:Number 1.
23 Lead numbers:See the figure.
2
Centering phases:See below.

Single diode, anode to lead 3

Centering phases:
1. Centering and mechanical verification in 90°.
2. Centering and mechanical/electrical verification in 180°.

Forward and reverse diode test indicated in the Component List:

1 Name: 123456
Comment:
3 Barcode:
Package: SOT-23JEDEC
2 Mount: Yes
Magazine type: Tape
Feeder type: 8mm
1 Glue: Yes
Reject position: Reject bin 1
3 Polarized: Yes
Test 1 Test 2
2
Type: Diode voltage Diode rev. current
Angle: 90.00° 180.00°
Value: 0.75V +-5% 5µA
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
2 1
Angle: 90.00° Level: 1
Position: Upper
Force: Middle
Dimension: 2.9mm Min.: 2.8mm Max.: 3.04mm
3
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
2
Angle: 180.00° Level: 1
Position: Upper
3 Force: Middle
1 Dimension: 2.35mm Min.: 2.1mm Max.: 2.64mm
Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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MYDATA automation AB Basic Systems and Features

Single diode, cathode to lead 3

Centering phases:
1. Centering and mechanical verification in 90°.
2. Centering and mechanical/electrical verification in 0°.

Forward and reverse diode test indicated in the Component List:

1 Name: 123456
Comment:
3 Barcode:
Package: SOT-23JEDEC
2 Mount: Yes
Magazine type: Tape
Feeder type: 8mm
1 Glue: Yes
Reject position: Reject bin 1
3 Polarized: Yes
Test 1 Test 2
2
Type: Diode voltage Diode rev. current
Angle: 0.00° 0.00°
Value: 0.75V +-5% 5µA
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above).

2 1 The same package as the previous one with the anode to lead 3.

Centering phase 2:

1 The same package as the previous one can be used also in the second
3
centering phase, because the angle indicated in the Component List
overrides the angle indicated in the Package List.
2

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Basic Systems and Features MYDATA automation AB

Dual serial diodes

Centering phases:
1. Centering and mechanical verification in 90°.
2. Centering and mechanical/electrical verification in 180°.
3. Centering and mechanical/electrical verification in 0°.

Forward test on each diode indicated in the Component List:

Name: 123456
1 Comment:
Barcode:
3
Package: SOT-23JEDEC
2 Mount: Yes
Magazine type: Tape
Feeder type: 8mm
1 Glue: Yes
Reject position: Reject bin 1
3 Polarized: Yes
Test 1 Test 2
2 Type: Diode voltage Diode voltage
Angle: 180.00° 0.00°
Value: 0.75V +-5% 0.75V +-5%
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
Angle: 90.00° Level: 1
2 1 Position: Upper
Force: Middle
Dimension: 2.9mm Min.: 2.8mm Max.: 3.04mm
3 Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
Angle: 180.00° Level: 1
2
Position: Upper
3 Force: Middle
1
Dimension: 2.35mm Min.: 2.1mm Max.: 2.64mm
Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 3:

Method: Mechanical
Angle: 0.00° Level: 1
1
Position: Upper
3 Force: Middle
2
Dimension: 2.35mm Min.: 2.1mm Max.: 2.64mm
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DV Illumination ---------- LS Illumination ----

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Dual parallel diodes

Centering phases:
1. Centering and mechanical verification in 90°.
2. Centering and mechanical verification in 180°.

Dual diodes, connected in parallel, cannot be verified electrically.

Mechanical verification only can be performed:

Name: 123456
1 Comment:
Barcode:
3
Package: SOT-23JEDEC
2 Mount: Yes
Magazine type: Tape
Feeder type: 8mm
1 Glue: Yes
Reject position: Reject bin 1
3 Polarized: Yes
Test 1 Test 2
2 Type: --- ---
Angle: --- ---
Value: --- ---
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
2 1
Angle: 90.00° Level: 1
Position: Upper
Force: Middle
3
Dimension: 2.9mm Min.: 2.8mm Max.: 3.04mm
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
2
Angle: 180.00° Level: 1
Position: Upper
3 Force: Middle
1 Dimension: 2.35mm Min.: 2.1mm Max.: 2.64mm
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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Basic Systems and Features MYDATA automation AB

Orientation – Transistors in SOT23 Package

Transistors housed in the SOT23 package should be set to:
1
SOT- 3 Centering level:Number 1 and 2, or number 1 and 3, see below
23 Lead numbers:See the figure
2

Centering phases:
1. Centering and mechanical verification in 90°.
2. Centering and mechanical/electrical verification in 180°.

Emitter to lead 1 - PNP or NPN

Centering levels:
Number 1. Centering and mechanical verification in 90°
Number 2. Centering and mechanical/electrical verification in 180°

Select transistor type PNP or NPN in the Component List:

E Name: 123456
1
PNP Comment:
C Barcode:
3
Package: SOT-23-E1JEDEC
2 B
Mount: Yes
Magazine type: Tape
Feeder type: 8mm
E Glue: Yes
1
NPN Reject position: Reject bin 1
C
3 Polarized: Yes
Test 1 Test 2
2 Type: PNP transistor ---
B
Angle: 90.00° ---
Value: 200hfe +-20% ---
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
Angle: 90.00° Level: 1
2 1 Position: Upper
B E Force: Middle
C Dimension: 2.9mm Min.: 2.8mm Max.: 3.04mm
3 Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
Angle: 180.00° Level: 1
B
2 Position: Upper
Force: Middle
3
C Dimension: 2.35mm Min.: 2.1mm Max.: 2.64mm
1 Verify mechanical: Yes Verify electrical: Yes
E
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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MYDATA automation AB Basic Systems and Features

Base to lead 1 – PNP or NPN

Centering levels:
Number 1. Centering and mechanical verification in 90°.
Number 3. Centering and mechanical/electrical verification in 180°.

Select transistor type PNP or NPN in the Component List:

B Name: 123456
1 Comment:
Barcode:
C
3
Package: SOT-23-B1JEDEC
2 PNP Mount: Yes
E
Magazine type: Tape
Feeder type: 8mm
B Glue: Yes
1
Reject position: Reject bin 1
C
3 Polarized: Yes
Test 1 Test 2
2 NPN
E Type: NPN transistor ---
Angle: 180.00° ---
Value: 300hfe +-20% ---
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
Angle: 90.00° Level: 1
2 1
Position: Upper
E B
Force: Middle
C Dimension: 2.9mm Min.: 2.8mm Max.: 3.04mm
3
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
E Angle: 180.00° Level: 3
2
Position: Upper
3 C Force: Middle
Dimension: 2.35mm Min.: 2.1mm Max.: 2.64mm
1
B Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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Basic Systems and Features MYDATA automation AB

Orientation – Transistors in SOT89 Package

SOT89
Transistors housed in the SOT89 package should be set to:
1

2 4 Centering level:Number 1 and 9, or number 1 and 10, see below.

Lead numbers:See the figure.
3

Centering phases:
1. Centering and mechanical verification in 0°.
2. Centering and mechanical/electrical verification in 90°.

Emitter to lead 1 - PNP or NPN

Centering levels:
Number 1. Centering and mechanical verification in 90°.
Number 9. Centering and mechanical/electrical verification in 180°.

Select transistor type PNP or NPN in the Component List:

E Name: 123456
1
PNP Comment:
C Barcode:
2 4
Package: SOT-89-B1JEDEC
3 Mount: Yes
B
Magazine type: Tape
Feeder type: 12mm
E Glue: Yes
1
NPN Reject position: Reject bin 1
C
2 4 Polarized: Yes
Test 1 Test 2
3 B Type: PNP transistor ---
Angle: 90.00° ---
Value: 200hfe +-20% ---
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
3 2 1
Angle: 90.00° Level: 1
B E Position: Upper
Force: Middle
C
4
Dimension: 4.5mm Min.: 4.4mm Max.: 4.6mm
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
B
Angle: 180.00° Level: 9
3
Position: Upper
4 2 Force: Middle
C
Dimension: 4mm Min.: 3.94mm Max.: 4.25mm
1
E Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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MYDATA automation AB Basic Systems and Features

Base to lead 1 – PNP or NPN

Centering levels:
Number 1. Centering and mechanical verification in 90°.
Number 10. Centering and mechanical/electrical verification in 180°.

Select transistor type PNP or NPN in the Component List:

B Name: 123456
1 Comment:
Barcode:
2 C
4
Package: SOT-89-B1JEDEC
3 PNP Mount: Yes
E
Magazine type: Tape
Feeder type: 12mm
B Glue: Yes
1
Reject position: Reject bin 1
2 C
4 Polarized: Yes
Test 1 Test 2
3 NPN
E Type: NPN transistor ---
Angle: 90.00° ---
Value: 300hfe +-20% ---
Default load data
Tape angle: 90.00° Vib. angle: 0.00°
Step length: 4mm

Centering phase 1 – Component orientation (viewed from above) and

information indicated in the Package List:

Method: Mechanical
Angle: 90.00° Level: 1
3 2 1
Position: Upper
E B
Force: Middle
C Dimension: 4.5mm Min.: 4.4mm Max.: 4.6mm
4
Verify mechanical: Yes Verify electrical: No
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

Centering phase 2:

Method: Mechanical
E Angle: 90.00° Level: 1
3
C Position: Upper
4 2
Force: Middle
1 Dimension: 4mm Min.: 3.94mm Max.: 4.25mm
B
Verify mechanical: Yes Verify electrical: Yes
OVC light level: ---%

---- DVC Illumination ---------- LSC Illumination ----

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Basic Systems and Features MYDATA automation AB

Verification Data
Test data for electrical verification, set in the Component List:

None
Resistance
Capacitance
Capacitance low
VCapacitance pol.
Diode voltage
Diode rev. current
Zener diode
NPN transistor
PNP transistor

Maximum test voltage is 20VDC for any test option.

Resistance
Resistance range and accuracy at ±4mA test current:
0W – 30W ±0.3W
30W – 4kW ±1%

Resistance range and accuracy at ±16mA test current:

4kW – 1MW ±1%
1MW – 40MW ±5%

Capacitance
Capacity range and accuracy at ±16V test voltage:
50pF – 500pF ±5%
500pF – 250nF ±3%

Note that ceramic capacitors often have a voltage dependent

capacitance that sometimes is specified at 1V.

Capacitance low V
Capacity range and accuracy at ±2V test voltage:
50pF – 500pF ±5%
500pF – 800nF ±3%

Note that ceramic capacitors often have a voltage dependent

capacitance that sometimes is specified at 1V.

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Capacitance pol.
Capacity range and accuracy with unipolar test current of 4mA (for
C > 1mF) or 500mA (for C < 1mF):
50nF – 1mF ±3%
1mF – 4.7mF ±3%
4.7mF – 1000mF ±10%

The maximum voltage across the capacitor is:

3500
C < 1mF: U = ------------
-
C C (nF)
28
C > 1mF: U = ------
C C (mF)
The verification voltage does never exceed 25V.

The lower tolerance set in the Value field in the Component List
determines if the capacitance is more or less than 1mF.

Results may differ from the manufacturers data sheet for capacitors
with a high voltage dependency in their capacitance. Capacitors with
a very high voltage dependency in their capacitance can cause
unreliable results, and can therefore not be handled by the
verifier.This situation can be dealt with partly by using the “Cap. low
V” measuring method or by adjusting the programmed nominal
capacitance value according to the measured results.

Diode voltage
Forward voltage drop range and accuracy at 4mA current:
0.1V – 19V ±3%

Diode rev. current

Reverse leakage current range and accuracy at 16VDC:
100nA – 50mA ±3%

This test ignores the tolerance indicated, for instance 200nA ±30%
means 200nA.

Zener diode
Forward voltage drop range and accuracy at 4mA current:
0.1V – 19V ±3%

NPN transistor
Current gain range and accuracy at Ic = 5mA and Uce = 10V:
50hfe – 1000hfe ±5%

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Basic Systems and Features MYDATA automation AB

PNP transistor
Current gain range and accuracy at Ic = 5mA and Uce = 10V:
50hfe – 1000hfe ±5%

Units
CapacitancepF, nF, mF, F
CurrentnA, mA, mA, A
Current gainhfe
ResistanceW, kW, MW
VoltagemV, mV, V

Tolerances
Default tolerance is ±5%.

You can enter any other tolerance by typing it, for instance '5+–3%'
gives 5 ±3%, and '5+5%–10%' gives 5 +5% –10%. The latter can also
be entered as '5–10%” as ±5% is the default tolerance.

Omitted '+' or '–' sign is interpreted as a positive tolerance. So,

'5 5%–10%' is equal to '5+5%–10%.'

Also, by omitting the percent sign (%), you can enter plus and minus
values, for instance '5 3–2' gives 5 +60% –40% because 3 is 60% of 5,
and 2 is 40% of 5.

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MYDATA automation AB Basic Systems and Features

Standard Mount and Glue Tools

Standard mount tools consist of a tube mounted in a cylindrical
upper section, and are available with spring loaded or stiff tubes.

Figure 3-25. Examples of stiff tools

Figure 3-26. Examples of spring tools

Tools for adhesive application have the same cylindrical upper

section, but a solid shaft instead of a hollow tube.

Which mount tool to use is determined by the components size, form,

weight and the centering method.

Please see the table on page 3-46 and in Appendix A.

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Basic Systems and Features MYDATA automation AB

Placement and application tools are numbered by a code consisting

of a letter and two figures. The letters are A, B, C and D, and the
numbers are 1, 2, 3 and 4. There are three pins indicating the code
and the position of each tool in the machine. Coding can be seen in
Figure 3-27.

2
1 3
4

A12 A13 B14

A
B D
C
C23 C24 D34

Figure 3-27. Standard mount and glue tool

Tool usage is indicated in the following table:

Pos.* Tool Type Description Usage examples

1 A12 D/d = 1.4/0.8 Insulating plastic adapter. 0603, 0805, SOT23.
2 A13 D/d = 1.5/1.2 Pure steel tube. 1206, 1812, SOT89.
3 A14S D/d = 2.6/2.0 Spring tool with insulating SO-8, SO-16, SOMC.
plastic adapter.
4 A23 D/d = 5.0/3.0 Stiff tube with rubber ring. SO-18, SO-28, FP80.
4 A23S D/d = 9.5/6.0 Spring tube with rubber ring. SO-18, SO-28, FP80.
5 A24 D/d = 7.0/5.0 Stiff tube with rubber ring. LCC, PLCC.
5 A24S D/d = 9.5/6.0 Spring tube with rubber ring. LCC, PLCC.
6 A34 Radius 0.75 Insulating plastic adapter. MINIMELF diam. 1.5mm
7 B12 Shaft diam. 0.8 Small glue shaft. 0805, 1206.
8 B13 Shaft diam. 1.5 Medium glue shaft. 1812, MINIMELF.
9 B14 Shaft diam. 3.0 Large glue shaft. SO-14, SO-28.
10 B23 Radius 1.25 Insulating plastic adapter. MELF diam. 2.5mm
11 B24 Radius 1.15 Insulating plastic adapter. MELF diam. 2.3mm
12 B34 Radius 1.0 Insulating plastic adapter. MELF diam. 2.0mm
13 C12 Shaft diam. 0.5 Mini glue shaft. 0603, 0805.
14 C13 Shaft diam. 2.2 Large glue shaft. SO-8, SO-14, SO-16.
15 C14 D/d = 0.6/0.25 Insulating plastic adapter. 0201, 0402 .
16 C23 D/d = 10.0/7.0 Rubber nozzle. Big and heavy
components, optical
centering only.
16 C23S D/d = 9.5/7.0 Spring tube with rubber nozzle. Big and heavy
components, optical
centering only.

* The tool position in the tool bank.

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Spring Tools
Spring tools, see Figure 3-26, provide a higher mounting speed, and
are needed to get full Linescan Vision System performance.

Limitations
The toolbody on some spring tools (A23S, A24S and C23S) is wide,
therefore it will not fit in toolbanks that have holes for the stiff tool.

The code pin configuration for these spring tools are the same as the
corresponding stiff tools (for instance code pin configuration for A23S
is the same as for A23).

Therefore it is only possible to use either a spring loaded tool or a stiff

tool in a certain machine, not both.

Risk for collision

Due to the wide toolbody on A23S, A24S and C23S they can collide
with higher previously mounted components. If mounting is made
close to the edge of a board, the toolbody may collide with conveyor
rails.

To avoid collision with a higher component:

– Increase the group number for the mount position with the low
component. The low component will thereby be mounted before
the higher ones.

To avoid collision with the conveyor rails:

Conveyor rails are higher than 5mm above board level. It is therefore
not possible to mount components too close to the edge of the board.
Components with a dimension less than 10mm need to increase the
standard board edge clearance of 3mm.

– Board edge clearance = 3 + (10–Component dimension)/2.

Example: Component dimension 6mm gives a Board edge
clearance of 5mm (that is 3+(10–6)/2).

Figure 3-28. Spring tool limitations

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Basic Systems and Features MYDATA automation AB

HYDRA Mount Tools

The HYDRA unit is a speed placement unit with eight mount tools.

The mount tools are connected to an air pump and to a vacuum pump
via individual valves. A negative pressure for holding components
and an over-pressure to quickly release components can thus be
provided individually through the eight mount tools.

The eight HYDRA mount tools can be moved downwards and

upwards in common or individually. Eight components can thus be
picked from a magazine either simultaneously or individually and
then be placed individually.

The HYDRA unit can pick components from the Agilis, TM8, TM8F,
TM12, TM16 and TM1216 magazine types.

The HYDRA mount tools consist either of a plain tube (H00) or a

tube with a changeable nozzle (H01 – H04), see the figure.

These tools can be used for the following components (further

components may have been added after issuing this manual):

• H00 (plain tube) for the 0603 – 1210 components range and
smaller SOIC components.

• H01 (white) for the 0402 – 1206-06 component range.

• H02 (yellow) for the same components as H00.
H00 H01 H02 H03 H04 H06
• H03 (red) for the 1206 – 2512 chip components and for SC-59, SO8,
SO14, SOT89, SOT223, SSOP20, SSOP24, SSOP28, and M3216 –
M7343 components.

• H04 (blue) for the 0603 – 1206 chip components, MELF3514,

SOD-80 and SOT-23 components. This tool has a rubber tip
designed to handle round as well as high capacitors.

• H06 (brown) for 0201 – 0402 package range.

Mount tools must be kept free from dirt and foreign particles to
prevent the tubes from being clogged up.

Tool replacement is detailed in the Machine Manual and has to be

carried out by service personnel.

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HYDRA Speedmount ATE

HYDRA Speedmount ATE, Automatic Tool Exchanger, is a system
for changing HYDRA tools automatically. The optimal tool for each
type of component extends the component range that can be picked
with the HYDRA unit and increases the flexibility of the machine.

ATE Software
The ATE software in TPSys, enables the ATE feature and contains
functions, such as:

• Detection of missing tools in the HYDRA tool bank.

• Detection of tools that are not properly pushed onto the tool tubes.
• Location of HYDRA tool banks with fiducial marks, which makes
a tool bank installation fast and accurate.

• Disabling of a slot in the tool bank in case of pick error.

• Preparation of assemblies by optimizing the feeder locations and
contents, either for maximum assembling speed or for minimum
changeover time.

• Optimization of the tool usage to get maximum assembling speed,

taking both feeder locations and PCB data into account.

HYDRA Tools
HYDRA tools are nozzles attached to tool tubes and used to pick
components from the magazine feeders and place them onto a PCB.
Tools that are not in use are stored in the HYDRA tool bank. There
are, at present, four types of HYDRA tools available (see page 3-48).

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HYDRA Tool Tubes

The HYDRA tool tubes are attached to the HYDRA unit. The
HYDRA unit moves to the HYDRA tool bank where the tool tubes
leave the current tools before picking up new ones.

Each tool is held in place on the tool tube by two O-rings. This
ensures that the tool is always properly aligned and can be replaced
without re-calibrating the HYDRA unit.

Figure 3-29. HYDRA tool tube

HYDRA Tool Bank

The HYDRA tools are stored in the HYDRA tool bank when not in
use. When tools are to be exchanged, the HYDRA unit moves to the
bank and the tools are exchanged. Each tool resides in an own
position in the tool bank and are temporarily attached to the tool
tubes on the HYDRA unit.

The first tool tube (position 1 in the HYDRA unit) fetches a tool from
one of the two tool slots with index number 1 in the tool bank, see
Figure 3-30. The second tool tube (position 2 in the HYDRA unit)
fetches from one of the slots marked 2 and so on.

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There are two types of HYDRA tool banks:

• Standard type for 500 T2 conveyor and 288, 468 and ML 3 – 6

tables, see Figure 3-30.

Figure 3-30. Standard tool bank

A HYDRA tool bank can hold up to 16 tools in two rows by eight tool
positions, see Figure 3-31.

Slot Position

Row

Figure 3-31. Tool bank positions, slots and rows

The rows are called Front (marked 'F') and Back (marked 'B')
corresponding to their Y positions in the tool bank. Front is the row
facing the operator. A slot has two tool positions for one tool each,
front and back.

HYDRA tool bank installation and replacement is detailed in the

Machine Manual and has to be carried out by service personnel.
Operations is detailed in Chapter 7 of the Operators Manual.

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Basic Systems and Features MYDATA automation AB

Disk Formatting
Disks can be DOS formatted by TPSys in the machine disk drive by
selecting the Format DOS Diskette option in the Utility menu.

The following dialog box lets you select which disk drive you want to
use:

Which diskette drive do you want to use?

A: B: Cancel

A: Select this drive letter for 3.5" 1.44MB floppy disks, which is
the standard disk type in the machine.

B: This drive letter may be used if the machine has an old 5.25"
1.2MB disk drive.

Select the desired disk drive and press <Enter>.

The following information box reminds you to insert a 3.5" HD disk

in the selected disk drive:

Please make sure that a diskette is inserted

OK

When the disk is inserted, press <Enter>.

The disk is now DOS formatted.

After the formatting is completed, you can format another disk by

selecting Yes in the following dialog box:

Do you want to format another diskette?

Yes No

Otherwise select No to exit the formatting mode.

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MYDATA automation AB Basic Systems and Features

Digitizer
A digitizer is a very useful device when programming boards because
it moves the camera quickly to positions very close to the final
positions. Only fine corrections need be carried out after positioning
with the digitizer.

The digitizer can be used for making all positions, except for defining
fiducial marks. You can, for instance, use it to position components,
bad board marks, glue tool test points, and mount tool test points.

Figure 3-32 shows the PCB Editor, in which you can position a
component by simply pointing out the component position on the
board drawing.

* PCB EDITOR *
Items
Enter Edit item F2 PCB header
1: C1, 000149 Ins Insert new F4 PCB size
2: C2, 000254 Del Delete Shift+F6 Reset digitizer
3: C3, 000501 F1 View position F7 Change groups
F8 Replace component
PCB Header Information
Name: TV2
Comment: PCB, bare board BB2

Location: C1
Component: 000149
Comment: 100pF
Package: 1206-07
Group: 0 Turn before Z down: No
Save electric value: No
Mount: Yes Glue: Yes Only Z: No
Angle: 0.00° pos.: 40.052mm/ 25.363mm
Local fiducial marks: 0
Mark 1 ID: pos.:
2 ID: pos.:
3 ID: pos.:
Press <F1> for camera
Bill 12:04

Figure 3-32. Component positioning using digitizer

The digitizer is used as follows:

• Put a PCB or panel board drawing on the digitizer surface and fix
it with tape or the like.

• In TPSys, go to a situation where a positioning is to be done on the

board, like in Figure 3-32.

• Press the stylus tip anywhere on the digitizer surface.

To be able to convert digitizer coordinates to board coordinates,
the system asks you to point out the board fiducial mark 1 on the
PCB drawing:

Digitize fiducial mark No. 1 ((of 2)

OK

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Basic Systems and Features MYDATA automation AB

• Point out fiducial mark 1 by pressing the stylus tip on the first
fiducial mark.

Make sure it really is fiducial mark 1 you are pointing out.

You are now asked to point out fiducial mark 2:

Digitize fiducial mark No. 2 ((of 2)

OK

• Point out fiducial mark 2 by pressing the stylus tip on the second
fiducial mark.

After digitizing the fiducial marks, you can use the digitizer to
move the camera to any position on the PCB.

• Position the component by pressing the stylus tip on the

component outline.

The system will move to the selected position. You can then use the
camera to finally position the component in the usual way.

You can, at any time, adjust the fiducial marks by pressing

F6
<Shift>+<F6> and again point out the fiducial marks in the same
way as described above.

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TPSys Barcode Reader

A TPSys barcode reader (optional) can be used to read component
names, removable feeder and magazine data when programming
boards and components.

Barcode scanning is a convenient and fast way of entering

information such as component names, magazines, quantities, and
component orientations into the system without typing or selecting
from different lists.

For further information about the TPSys barcode reader, such as

how to use it and labels required, see the Barcode Readers section in
Chapter 5 of the Operator's Manual.

Configuration
The barcode reader is configured for TPSys by scanning the following
three barcodes:
Code 128.

9600, 7, E, 2.

Aiming and reading beam

setting.

Scan these barcodes from top to bottom (the downmost code must be
read as the last code).

Off-Line Usage
It is possible to use stand-alone data servers so that more operations
can be carried out simultaneously. It is for instance possible to scan
data for one layout while another is being assembled in the machine.

The barcode option must have been purchased for at least one of the
machines on the network.

MYLabel
There is also a MYLabel facility available from MYDATA. MYLabel
is an efficient tool for reading component names and keeping order
of remaining component quantities. The MYLabel facility is run on a
separate Windows 95/98/NT system.

For further information about MYLabel, contact MYDATA.

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MYDATA automation AB Component List

Component List
To be able to mount a PCB, four mandatory main lists (or list groups)
are required:

• Component List
Contains part numbers and component name and data. Assigns a
package to the component.

• Package List
Contains data specific to the component package, such as length,
width, height, number of leads, mount tool, placement precision,
centering forces and optical centering data.

• Magazine Lists (group)

Lists that inform the system about in which magazine and type of
magazine (tape, vibrator, or tray) the components can be found
and where the magazines are located. The lists include also such
information as component angles and quantities.

• Mount Lists (group)

Mount lists on different levels for PCBs, panels, and layouts,
indicating which components are to be mounted and where they
are to be placed

PACKAGE LIST COMPONENT LIST MOUNT LISTS MAGAZINE LISTS

Package data Where components are to Where components are to
Component data be found
be placed

MOUNTING

This chapter describes the Component List, one of the main lists
necessary for mounting a board.

The other mandatory lists or list groups are described in Chapter 5,

Chapter 6 and Chapter 7.

Additional lists for such features as fiducial marks, adhesive

application and user access are found in Chapter 8.

Special characters
National special characters and some non-letter/non-figure
characters cannot be entered into the system, for instance in board
names and layout names.

The following special characters are, however, allowed to be used:

"'`\$;^@

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Component List MYDATA automation AB

Component List Editor

The Component List contains component names and data. The
component names may correspond to market names, for instance
BCX56, but company defined names or numbers can be used as well.

The Component List is opened by selecting the Components option

in the Editor menu.

The Component List Editor is shown in Figure 4-1.

Function keys in the Component List Editor:

Edit component
By pressing <Enter> the highlighted component can be modified.

Enter

Insert new
A new component is added to the Component List by pressing <Ins>
Ins
and entering a new name. The new component gets the same data as
the component that is highlighted when the <Ins> key is pressed.

Delete
The highlighted component can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Search magazines
By pressing <F6>, the system searches through the magazines for
F6
the highlighted component. This feature is described on page 4-8.

Replace package
F9
By pressing <F9> the following pop-up window appears:

Change Package For All Components

From 1206-12
To 1206-16

Enter a package that shall be replaced in the first field. Then enter
the package that replaces it in the second field. Press <Enter> to see
all components that have the "old" package. Confirm the change of
package on all these components by pressing <Enter>.

Exit
Press <Esc> if you want to exit the Component List Editor and
Esc
return to the main window.

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MYDATA automation AB Component List

* COMPONENT LIST EDITOR *

Components
Enter Edit component F6 Search magazines
000149
Ins Insert new F9 Replace package
000254
Del Delete
000255
000501 Name: 000149
000502 Comment: 100pF
000503 Barcode: 123456
000511 Package: 1206-06
000513 Mount: Yes
000514 Magazine type: Tape
000517 Feeder type: 8mm
000518 Glue: Yes
000519 Reject position: Closest reject bin
000520 Polarized: No
000521 Test 1 Test 2
000522 Type: Capacitance low V ---
000523 Angle: 90.00° ---
74HC161 Value: 100pF ±20% ---
74HC365 Default load data
MAX452CSA Tape angle: 90.00° Vib. angle: 0.00°
MB150PF Step length: 4mm

Brian 12:32

Figure 4-1. Component List Editor

Entries in the Component List Editor:

Components
This box contains the component part numbers. Use the arrow keys
or <PgUp>, <PgDn>, <Home>, or <End> to select component.

You can search for a component in the list by simply entering the first
characters of the component name.

Name
Component designation, which must be a unique name or number for
each component.

Comment
Optional text, for instance component type or component value.

Barcode
A barcode reader can be used to select components from the
Component List when, for instance, loading magazines. The barcodes
can be different from the component names. Figure 4-1 shows
barcode 123456 which is linked to the component name 00149.

The barcode feature is further detailed in the Barcode Readers

section in Chapter 5 of the Operator’s Manual.

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Package
This name must be included in Package name, referring to the Package List.
the Package List.
You can search for a package from the Package List by simply
entering the first characters of the package name and pressing
<Enter>, or by pressing <Enter> at an empty field.

Mount
Yes – The component is mounted.
No – The component is not mounted.

To toggle between Yes and No press <Space>.

The 2001.0002 Mount switch, found under Mount/Glue Switches

in the Production menu overrides this field. If it is set to No no
components are mounted even if Mount is set to Yes.

The function of the Mount field can be inverted by setting the 0005
Invert meaning of comp. mount/glue flags switch, found under
Switches in the Production menu, to Yes.

The 2001.0002 Mount and 0005 Invert meaning of comp. mount/glue

flags switches are detailed in the Mount and Glue Switches section in
Chapter 8 of the Operator's Manual.

Magazine type
Select the appropriate magazine type for the component from the
popup menu shown by pressing <Space>:

Unknown
Tape
Vibratory
Tray

Unknown Undefined magazine type

Tape Tape magazine, see the next field.
Vibratory Vibratory magazine
Tray Any type of tray magazine

This information is used for HYDRA preparation. It is also used for

optional software packages, for instance MYDATA MYSpeed.

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MYDATA automation AB Component List

Feeder type
If the magazine type in the previous field is Tape then the feeder type
for the component can be selected from the popup menu shown by
pressing <Space>:

8mm
FP8mm
12mm
16mm
24mm
32mm
44mm
56mm
ST32mm
Custom

FP8mm Fine Pitch magazine

ST32mm Surf Tape magazine (no hardware available)
Custom Other feeder than the listed ones.

This feeder information is used for HYDRA preparation and for

optional software packages, for instance MYDATA MYPlan.

Glue
Yes – Adhesive is dispensed for the component.
No – Adhesive is not dispensed.

To toggle between Yes and No press <Space>.

The 2001.0001 Glue switch, found under Mount/Glue Switches in

the Production menu overrides this field. If 2001.0001 Glue is set
to No no adhesive is dispensed even if this field is set to Yes.

The 2001.0001 Glue switch is detailed in the Mount and Glue

Switches section in Chapter 8 of the Operator’s Manual.

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Component List MYDATA automation AB

Reject position
Specifies where rejected components are to be put if they do not meet
the specifications at mechanical or electrical verification.

Press <Space> and choose an option from the popup menu shown:

Manual
Reject bin 1
Reject bin 2
Reject bin 3
Reject bin 4
Put back
Closest reject bin

Manual
Manual removal.

Reject bin 1
Put into bin 1.

Put back
Put back, for instance into a component tray.

Closest reject bin

Put into the bin closest to the current X position.

Polarized
Yes – The component is polarized, for instance diodes.
No – The component is not polarized, for instance resistors.

To toggle between Yes and No press <Space>.

This field is used to let the machine gain some speed during electrical
verification. If this field is set to Yes the indicated test angle is used.
If it is set to No the machine is allowed to mount the component 180°
off the indicated test angle.

Test 1, Test 2 Type

Type of electrical verification. Press <Space> and choose type from
the popup menu shown:

None
Resistance
Capacitance
Capacitance low V
Capacitance pol.
Diode voltage
Diode rev. current
Zener diode
NPN transistor
PNP transistor

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None
No verification

Resistance
Resistors, resistance (Ohm)

Capacitance
Capacitors, capacitance (F)

Capacitance low V
Low voltage capacitors, capacitance (F)

Capacitance pol.
Polarized capacitors, capacitance (F)

Diode voltage
Diodes, forward voltage drop (V)

Diode rev. current

Diodes, reverse leakage current (A)

Zener diode
Zener diodes, forward voltage drop (V)

NPN transistor
NPN-transistors, current gain (hfe)

PNP transistor
PNP-transistors, current gain (hfe)

Electrical verification is further described in Chapter 3.

Angle
0° Component orientation during centering and verification.
1
Any test angle is allowed, but there must be a matching centering
270/-90° 90° angle in the Package List for the component. If not, the system will
complain when mounting.
180° Electrical verification is further detailed in Chapter 3.

Value
Nominal component value and tolerance.

Component units and tolerances are further detailed in the

Verification Data section in Chapter 3.

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Component List MYDATA automation AB

Magazine Search
By pressing <F6> in the Component List Editor (page 4-3), the
system searches through the magazines for the highlighted
component.

If the component is found in one or several magazines included in the

magazine list, then the locations are listed like this:

Location
* TM8B-15879/3
E TM8B-15879/4
TM8B-14606/1

The list shows magazine names and feeder numbers

(magazine/feeder).
* An asterisk (*) in front of the magazine name indicates that the
magazine is inserted in the machine.
E Letter E indicates that the magazine is inserted but the component
is not available, which can be caused by an empty feeder.

If you select a magazine from the list, the machine picks a component
from the selected magazine and moves it to the manual leave position
where you can take the component. For components found on a
pallet, the pallet is made available but the component is not picked.

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Package List
To be able to mount a PCB, four mandatory main lists (or list groups)
are required:

• Component List
Contains part numbers and component name and data. Assigns a
package to the component.

• Package List
Contains data specific to the component package, such as length,
width, height, number of leads, mount tool, placement precision,
centering forces and optical centering data.

• Magazine Lists (group)

Lists that inform the system about in which magazine and type of
magazine (tape, vibrator, or tray) the components can be found
and where the magazines are located. The lists include also such
information as component angles and quantities.

• Mount Lists (group)

Mount lists on different levels for PCBs, panels, and layouts,
indicating which components are to be mounted and where they
are to be placed.

PACKAGE LIST COMPONENT LIST MOUNT LISTS MAGAZINE LISTS

Package data Component data Where components are to Where components are to
be placed be found

MOUNTING

This chapter describes the Package List, one of the main lists
necessary for mounting a board.

The other mandatory lists or list groups are described in Chapter 4,

Chapter 6 and Chapter 7.

Additional lists for such features as fiducial marks, adhesive

application and user access are found in Chapter 8.

Special characters
National special characters and some non-letter/non-figure
characters cannot be entered into the system, for instance in board
names and layout names.

The following special characters are, however, allowed to be used:

"'`\$;^@

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Package List MYDATA automation AB

Package List Editor

The Package List is opened by selecting the Packages option in the
Editor menu.

The Package List Editor is shown in Figure 5-1.

Examples of packages preprogrammed and included in TPSys are

specified in Appendix A – Packages. This appendix contains also a
description on how to program new packages.

Function keys in the Package List Editor:

Edit package
By pressing <Enter> the highlighted package can be modified.

Enter

Insert new
A new package can be added to the Package List by pressing <Ins>
Ins
and entering a new name. The new package gets the same data as the
package that is highlighted when the <Ins> key is pressed.

Delete
The highlighted package can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Edit accelerations
Accelerations data for the highlighted package is displayed and can
F3
be modified, see page 5-10.

Test centering
Test if TPSys is able to center the package with current centering
F4
parameters, see page 5-24.

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MYDATA automation AB Package List

* PACKAGE LIST EDITOR *

Packages
1206-06 Enter Edit package F5 Autoteach
1206-12 Ins Insert new F6 Edit optical cent.
1206-16 data
1210-07 Del Delete F7 Edit lead groups
1210-12 F3 Edit accelerations F8 Edit centering phases
1505-10 F4 Test centering F9 Edit glue data
1805-07
1812-07
1812-12 Package: 1206-06
1812-20 Body length: 3.2mm Body width: 1.6mm
1825-10 Length overall: 3.2mm Width overall: 1.6mm
218-18 Height overall: 0.698mm
AL-CAP min.: 0.5mm max.: 0.9mm
BGA-13*13-P Mount tool: A13 Alternate tool: NOTOOL
BGA-14*14-C Pick wait time: 0ms Place wait time: 0ms
BGA-15*15-P Place force offset: 0mN Tool to top offset: 0mm
BGA-19*19-PE Vacuum test: Yes Hold until ready: No
M3216-16 Toggle leads: 1,2
M3528-19 HYDRA tools: H00
M3819-16 HYDRA angle: 90 Pick in center: Yes
Brian 12:36

Figure 5-1. Package List Editor

Autoteach
Create new package data by automatic analysis of a components
F5
image, see Appendix A – Packages.

Edit optical cent. data

Optical centering data of the highlighted package is displayed and
F6
can be modified by pressing <F6>, see page 5-14.

Edit lead groups

Lead group data of the highlighted package is displayed and can be
F7
modified by pressing <F7>, see page 5-26.

Edit centering phases

Mechanical centering data and mechanical/electrical verification
F8
data is displayed and can be modified by pressing <F8>.
Illumination for optical centering can also be set by pressing <F8>.
The centering phases window is described on page 5-70.

Edit glue data

Glue data, such as number of glue dots and sizes, is displayed and can
F9
be modified by pressing <F9>, see page 5-78.

Exit
Press <Esc> if you want to exit the Package List and return to the
Esc
main window.

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Package List MYDATA automation AB

Entries in the Package List Editor:

Packages
This box contains available programmed packages. You can use the
arrow keys or <PgUp>, <PgDn>, <Home>, or <End> to select
package.

You can also search for a package in the list by simply entering the
first characters of the package name.

Package
The package name, which must be a unique name or number for each
package.

Body length
Nominal package body length measured in the Y coordinate of the
machine with the component oriented in 0°.

Body width
Nominal package body width measured in the X coordinate of the
machine with the component oriented in 0°.

Length overall
Nominal component overall length, leads included, measured in the
Y coordinate of the machine with the component oriented in 0°.

Width overall
Nominal component overall width, leads included, measured in the
X coordinate of the machine with the component oriented in 0°.

Height overall
The total height of the package above the board surface. Nominal,
maximum, and minimum height is stated.

A small difference between the nominal height and the maximum

height will make the machine mount faster, especially if the HYDRA
unit is used.

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MYDATA automation AB Package List

Mount tool
Choose an appropriate standard mount tool with regard to the shape,
size, and weight of the component. If you press <Space>, a list of
installed tools are shown in a popup menu.

Standard mount tools are described in the Standard Mount and Glue
Tools section in Chapter 3.

Alternate tool
You can select an alternate standard tool, if any, for the package in
this field. If you press <Space>, a list of installed standard tools are
shown in a popup menu. The NOTOOL option means that no
alternate tool is allowed to be used by the machine.
The purpose of this feature is to save time by reducing tool changes.
For example, if current package is mounted using the A12 tool and
the next package to be mount has the A12 tool as an alternate tool,
no tool change will be done.

Pick wait time

Wait time before a component is picked from the magazine. Heavy
components require more time to obtain sufficient vacuum in the
mount tool. This time is added to the time defined in the 0022.0012
Vacuum wait times Vacuum on at pick parameter found under the
Parameters option in the Editor menu.

The pick wait time can be set from 0 to ±32 seconds in ms increments
('+' increases the time, '–' decreases the time).

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Package List MYDATA automation AB

Place wait time

Wait time before the mount tool is lifted from the component after it
has been placed. This time is added to the time defined in the 22.0013
Vacuum wait times; Vacuum off at place parameter.

The place wait time can be set from 0 to ±32 seconds in ms

increments ('+' increases the time, '–' decreases the time).

Place force offset

The vertical placement force used on the component when placing it.
This force is added to the force defined in the 0021.0311 Place force
with indicator or 0021.0312 Place force without indicator parameters
depending on what type of tool is used. The default force is dependent
on the Z-unit type.

The place force can be set from 0 to ±32 Newton in mN increments

('+' increases the force, '–' decreases the force).

Tool to top offset

Defines the difference between the package body center height level
and the surrounding highest level.

The offset value shall be set to zero if the component top is plane, or
if the body center is the highest part of the package.

Vacuum test
Yes – The mount tool vacuum test is on.
No – The mount tool vacuum test is off.

To toggle between Yes and No press <Space>.

The 1001.0006 Test of Z vacuum switch, found in the Switches

option in the Production menu overrides this field. If the 1001.0006
Test of Z vacuum switch is set to No, then the vacuum in the mount
tool is not sensed even if this field is set to Yes.

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Hold until ready

This funtionis only used primarily with mechanical centering. It i
used for large, sensitive, components needing exta careful handling.
It is a function tha willslow the machine down.
Yes – If optical centering is used, this setting will mean that there
is no theta movement while the X wagon moves. With
mechanical centering, the centering jaws assist in holding
the component from a magazine or a tray to the mounting
position.
No – The centering jaws do not hold the component during the
X movement. This is the default setting.

To toggle between Yes and No press <Space>.

Toggle leads

Natural leads for this

package are 1, 8, 9, and 16.

At programming, the indicated leads can be optically positioned on

the land pattern. By toggling a key, the cross hairs are moved from
lead to lead in the indicated sequence.

Leads with the greatest distance between each other (diagonal leads)
should be indicated.

A maximum of eight leads can be indicated.

When entering lead numbers, separate the numbers with commas.

This entry is not valid for BGA packages. For BGA packages, the
toggle leads are automatically generated by TPSys and cannot be
changed.

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Package List MYDATA automation AB

HYDRA tools
If a HYDRA tool is specified, components in this package will be
included in the HYDRA preparation and are thus suggested to be
mounted using the HYDRA unit. The HYDRA preparation is detailed
in Chapter 6. Examples of preprogrammed HYDRA mountable
packages are found in Appendix A – Packages in this manual.

The HYDRA unit can pick components from the Agilis, TM8, TM8F,
TM12, TM16, TM1216, TMFlex, and vibratory magazine types.

The HYDRA mount tools consist either of a plain tube (H00) or a

tube with a changeable nozzle (H01 – H06), see the figure.

H00 H01 H02 H03 H04 H06

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MYDATA automation AB Package List

By pressing <Ins> in this field, the mount tools shown in the popup
Ins
menu (see the figure) can be selected for the package. Only non
selected tools are shown in the menu.

H00
H01
H02
H03
H04
H06

If more than one tool is chosen for a package, and the HYDRA is
configured with these tools, then the system will select the most
adequate tool with respect to the assembly speed.

By pressing <Del> selected tools can be unselected. Only selected

Del
tools are shown in the menu.

Pressing <Space> clears all tools from the field and sets None
meaning that this package will not be mounted by using the HYDRA
unit.

HYDRA angle
Defines the component angle at the optical HYDRA centering
0 performed while the component is moved from the magazine to the
90 board. Examples of angles for the HYDRA mountable
180 preprogrammed packages are found in Appendix A – Packages. Use
270
90° for components with lead type CHIP.

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Package List MYDATA automation AB

Accelerations
By pressing <F3> in the main Package List Editor (page 5-3), a box
containing accelerations data is shown, see Figure 5-2.

Press <Esc> if you want to return to the main Package List Editor
Esc
(page 5-3).

Entries in the Accelerations editor:

Package
The package name.

Mount precision
The mount precision, which can be lowered for packages mounted on
large land patterns. Lower precision means faster mounting.

Press <Space> and choose mount precision:

NORMAL
HIGH
LOW

NORMAL Standard precision.

HIGH Higher precision, slower mounting.
LOW Lower precision, faster mounting.

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* PACKAGE LIST EDITOR *

Packages
1206-06
1206-12
1206-16
1210-07 Accelerations
1210-12 Package: 1206-06
1505-10 Mount precision:
1805-07
1812-07 Acceleration codes
1812-12 X:
1812-20 Y:
1825-10 Tape:
218-18 Theta:
AL-CAP Z:
BGA-13*13-P HYDRA theta:
BGA-14*14-C HYDRA Z:
BGA-15*15-P
BGA-19*19-PE Z slow up
M3216-16 Distance: 0mm
M3528-19 Speed: 1ms
M3819-16
Brian 12:38

Figure 5-2. Accelerations editor

Acceleration codes Theta

Acceleration of the Theta movement (standard mount tool rotation).
Large and heavy components may need slow Theta acceleration to
avoid slipping on the tool.

Press <Space> and choose acceleration:

HIGHEST
HIGH
LOW
LOWEST

HIGHEST Highest acceleration.

HIGH High acceleration.
LOW Low acceleration.
LOWEST Lowest acceleration.

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Package List MYDATA automation AB

Acceleration codes Y
Acceleration of the Y movement (Y wagon). Works in the same way
as Acceleration Codes Theta.

This feature makes it possible to reduce the Y-wagon acceleration

after the component has been placed.

Acceleration codes X
Acceleration of the X movement (longitudinal). Works in the same
way as Acceleration Codes Theta.

Acceleration codes Z
Acceleration of the Z movement (vertical). Works in the same way as
Acceleration Codes Theta.

Acceleration codes Tape

Acceleration of the component tape. Works in the same way as
Acceleration Codes Theta.

HYDRA theta
Acceleration of the HYDRA theta movement (HYDRA mount tool
rotation). Works in the same way as Acceleration Codes Theta.

HYDRA Z
Acceleration of the HYDRA Z movement (vertical). Works in the
same way as Acceleration Codes Theta.

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Distance
The distance for slowly moving the Z tool up after placing a
component. If the tool moved at maximum acceleration there is a
small risk that the board may spring back and flip the component
away. The speed of the movement is set by Speed below.

Minimum value:0mm
Maximum value:3mm

Speed
Sets the maximum speed for the Z tool movement after placing
component. The tool will move at this speed within the distance from
the board as set by Distance above. After this the Z tool will move up
at maximum acceleration.

Minimum value:15nm/s
Maximum value:1m/s.

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Package List MYDATA automation AB

Optical Centering
By pressing <F6> in the main Package List Editor (page 5-3), a box
containing optical centering data is shown, see Figure 5-3.

Vision centering of components is done in two steps:

– Coarse search. The coarse location and rotation of the
component in the acquired image is detected.
– Fine search. The vision system calculate the position and
rotation of the component relative to the picking tool. This is
done by detecting the position of each lead or the whole
component outline. The information is also compared to the
package data base. This to verify that it is the correct
component, there are no bent leads, or if the component has the
correct orientation.

Optical centering data for BGA packages is found on page 5-22.

Function keys in the optical centering window:

Press <Esc> if you want to return to the main Package List Editor
Esc
(page 5-3).

Entries in the optical centering box:

Use best fit

Yes – If one or more leads are bent, the system calculates an
alignment to the best fit on the land pattern. The component
is mounted provided the leads, after the adjustment, can be
positioned within specified areas, otherwise it is rejected.
The areas are specified by the Max cross-wise deviation and
Max length-wise deviation entries, see page 5-68.

No – The leads must be within specified areas without best fit

alignment, otherwise the part is rejected. This is the default
setting.

To toggle between Yes and No press <Space>.

Use sub pixel

Yes – The vision system works in a high-resolution mode, which
means a higher centering accuracy and, consequently, a
slightly longer centering time. It requires a sharp contrast
between the lead edges and the background. Gullwing leads
normally show sharp edges. This option is used for all SO,
SOT and QFP packages.

No – The vision system works in standard mode. This option is

used for all BGA, CHIP, MELF packages and packages with
J-Bend leads.

To toggle between Yes and No press <Space>.

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* PACKAGE LIST EDITOR *

Packages
PLCC100opt
PLCC18 Use best fit: No
PLCC20 Use sub pixel: Yes
PLCC28 Coarse search method: Standard
PLCC44 Coarse search noise: 1000
PLCC52 Coarse search contrast: 30
PLCC68 Fine search noise: 1000
PLCC84 Fine search contrast: 30
PLCC84opt Index type: None
QFP132 Index area offset: 0.000mm/ 0.000mm
QFP160 Index area size: 5mm
QFP196 Corner contrast: 15%
QFP208 Corner variance: 10%
QFP240 Mark contrast: 15%
QFP256 Usable cameras: Standard, Linescan
QFP304 Unusable cameras: None
QFP80 Usable HYDRA cameras: Linescan
SO-14 Linescan illum. for HYDRA: Full
SO-14G HYDRA camera light levels: Max
SO-16
Brian 12:40

Figure 5-3. Optical centering

Coarse search method

This field controls which method that shall be used to locate the
component in the coarse search step.

Press <Space> for a list of options.

Standard
Centered
Outline
Multiple Leads

A preliminary component position is calculated by searching for a

limited amount of component features, such as individual leads, the
start or end of a group of leads, the component body outline or body
corners.

Standard
Locates the component by searching for the outermost leads
in three corners of the component. If the component lacks
leads the corners of the component will be located instead.

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Package List MYDATA automation AB

Centered
The component is assumed to be centered in relation to the
picking tools rotational center. No image processing is done
to calculate the coarse position. Centering the component on
the picking toll can be done using mechanical centering
phases before the optical inspection.

Outline
Coarse search is done by detecting only the components
outline. This method can be used for BGAs and flip-chips
that are rectangular and have enough contrast between the
background and the component body.

Multiple Leads
This method works as the standard method but instead of
locating individual leads at the corners of the component
this method searches for a group of leads, forming a pattern,
at each corner. Leaded components (for instance QFPs)
where the tool can be seen in the background can be
centered more robustly using this method.

Whatever the coarse search algorithms selected, the final component

position is calculated by using the whole of the features defined in the
mathematical model, that is all the leads/bumps or the whole package
outline.

Coarse search noise

Specifies how much the image intensity can vary around an object,
for it to be considered as a lead/corner by the vision system.

If the variation around an object is larger than the coarse search

noise, the object will not be considered as a lead/corner. A lower value
puts higher demands on an even background. By lowering the value,
false hits on for example the tool, index marks or wirering can be
avoided. If the value is set too low though, the vision system may
reject real leads/corners.

If the coarse search noise is exceeded for all image points, the
component search fails and an error message is shown.

See Appendix A for recommendations on how to set this value for

different package types.

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Coarse search contrast

Specifies how much the image intensity may differ between a
lead/corner, and the surrounding background.

If the difference is lower than the coarse search contrast, the object
will not be considered as a lead/corner. A higher value therefore puts
a higher demand on contrast. By increasing this value, false hits on
for example the tool, index marks, or wirering can be avoided. A too
high value may lead to the vision system rejecting real leads/corners.

If the coarse search contrast is not achieved for any image point in
the coarse search step the component search fails and an error
message is shown.

See Appendix A for recommendations on how to set this value for

different package types.

Fine search noise

This field specify how much the image intensity is allowed to vary
around an image object for it to be considered as a correct lead.

If the image intensity variation is larger than the fine search noise
the object will not be considered as a correct lead/corner. A lower
value puts a higher demand on how even the background around a
lead must be.

If the fine search noise is exceeded for a lead in the fine search step
the component search fails and an error message is shown.

See Appendix A for recommendations on how to set this value for

different package types.

Fine search contrast

Here it is specified how much the image intensity may differ between
a lead/corner and the background surrounding it.

If the contrast between the lead and the background around it is

lower than specified, the object will not be considered as a correct
lead/corner. Therefore a higher value puts a higher demand on the
contrast.

If a lead in the fine search step has a contrast lower than specified,
the component search fails and an error message is shown.

See Appendix A for recommendations on how to set this value for

different package types.

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Package List MYDATA automation AB

Index type
Indicates the shape of an orientation index located underneath the
package. This index can be used by the optical centering system to
verify the orientation of the component.

Press <Space> and choose appropriate index type from the popup
menu shown:

None
Corner
No corner
Mark

None No index search.

Corner Corner ('A' in the figure).
No corner Cut corner (B).
Mark Hollow, recess or other mark (C and D).

Index area offset

The distance between the center of the component and the center of
the index ('X' and 'Y' in the figure).

The component oriented in 0° and the measurements in X and

Y coordinates of the machine.

Index area size

The side length of a square search area. The search area is marked 'S'
in the figure.

Example: 5mm (5mm x 5mm search area).

Corner contrast
The ratio between the component body contrast and the background
contrast when searching for corner or cut corner. The default value
is 15%.

A lower value means easier to find the index, but also easier to
confuse the component with the background.

Corner variance
Accepted contrast variance when searching for corner or cut corner.
Default value is 10%.

A higher value means easier to find the index, but also easier to
confuse the component with the background.

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Mark contrast
The ratio between the component body contrast and the index mark
contrast when searching for a dot or a recess. Default value is 15%.

A lower value means easier to find the index mark, but also easier to
confuse the mark with the component body.

Usable cameras
Different camera types are available for the MYDATA placement
machines (see the Centering section in Chapter 3).

You can select different camera options from a menu containing both
camera groups and specific camera types of two reasons:

– The first reason is that some packages require certain camera

types for optical centering.

– The second reason is that several camera types can be selected

for a package because the same Package List is intended to be
shared in networks by many machines with different camera
types.

Press <Ins> in this field to get the popup menu with the camera
Ins
options.

From the menu, you can select one or several camera options. All the
Standard options are described below.
High res.
Linescan Standard
SVC
HRC All standard cameras, that is SVC, OVC1 – 5 and EVC1 – 3
LSC (see below).
OVC1
OVC2 High res.
OVC3
OVC4 The HRC camera (see below). For the time being, this option
OVC5 is the same as the HRC option, but this option is prepared
EVC1 for additional high resolution cameras in the future.
EVC2
EVC3 Linescan
The LSC camera (see below). For the time being, this option
is the same as the LSC option, but this option is prepared for
additional Linescan cameras in the future.

SVC
Standard Vision Camera for big packages, for instance QFP
and BGA. Maximum package size is:
39.0x39.0mm (1.53"x1.53") at any mount angle,
51.9x51.9mm (2.04"x2.04") at dual shot mode.

HRC
High Resolution Camera for small packages, for instance
flip-chip and chip-scale BGA. Maximum package size is:
11.0x11.0mm (0.43"x0.43") at any mount angle,
15.0x15.0mm (0.59"x0.59") at dual shot mode.

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LSC
Linescan Camera for scanning components on the move,
passing the camera. This camera is the fastest one (up to
three times faster than SVC), used for high speed mounting
and for big packages. Maximum package size is 56.0mm x
56.0mm (2.2" x 2.2"). Finest pith is 0.3mm for BGA and
0.2mm for QFP.

OVC1 – 5
Original Vision Camera 1 – 5.

Older camera types for the same package size as SVC. These
cameras are replaced by SVC.

EVC1 – 3
Extended Vision Camera 1 – 3.

Camera types for even bigger package size than what the
SVC type can handle.

To delete camera types, press <Del> and remove camera types by

Del
selecting from the list shown.

Pressing <Space> clears all cameras from the field and sets None
meaning that no optical centering will be performed for this package.

If more than one camera type is selected for a package and also
installed in the currently used machine, then the system will use the
camera with the highest mounting speed.

If none of the camera types selected for the package is installed in the
currently used machine, then the following message will pop up:

No usable optical centering cameras defined for XXX.

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Unusable cameras
Cameras selected in this field will not be used for the current
package.

The purpose of this field is to be able to unselect certain cameras

from a group of cameras, for instance a camera that has too small
field of view for the current package.

The following example allows the SVC, OVC5 and EVC1 – 3 camera
types to be used:

Usable cameras: Standard

Unusable cameras: OVC1, OVC2, OVC3, OVC4

You can add camera types to the list and remove types from the list
in the same way as described for the previous field.

Usable HYDRA cameras

All packages that can be centered with the HYDRA Camera
previously can be centered using a Line Scan Camera.

Press <Ins> in this field to get a popup menu with the camera
Ins
options.

Linescan illum. for HYDRA

Defines the types of illuminations that can be used to center a
package type using the Line Scan Camera and the HYDRA unit.

Press <Ins> in this field to get a popup menu with the camera
Ins
options.

From the menu, you can select one or several options.

Full Use all the LED groups of the LSC illumination unit.
Full
Front Front Use the front LED group of the LSC illumination unit.
Ambient AmbientUse the ambient LED group of the LSC illumination unit.

Only packages sharing at least one common illumination type will be

centered in a single mount cycle.

HYDRA camera light levels

Defines the illumination levels that can be used to center a package
type using the HYDRA Camera.

Press <Ins> in this field to get a popup menu with the camera
Ins
options.

It can be Min, Max or both of them.

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BGA Packages
In the optical centering window (page 5-15) make the settings
described below for BGAs with CBGA, PBGA and CGA lead types.
See page 5-44 for more information on this lead type.

CBGA lead types

For CBGA packages, which have a ceramic body lighter than the
leads, make the following initial settings:

Use best fit: No

Use sub pixel: No
Coarse search method: Outline
Coarse search noise: 500
Use best
Coarse fit:contrast: 10
search Use sub pixel:
Coarse search
Finenoise:
search500noise: 500 Coarse search 10
Fine search contrast: 10 contrast:
Fine search noise: 500 type: None
Index Fine search contrast: 10
Index
Indextype:
areaNone
offset: 0.000mm/ 0.000mm
Index area Index
offset: 0.000mm/
area 0.000mm
size: 5mm
Index area size:contrast:
Corner 5mm 15%
Corner contrast: 15 %
Corner variance: 10% Corner variance: 10 %
Mark contrast: 15 %
Mark contrast: 15%
Usable cameras:
Usable Standard
cameras: Standard, Linescan
Unusable Unusable
cameras: None
cameras: None
Usable HYDRA cameras: Linescan
Linescan illum. for HYDRA: Full
HYDRA camera light levels: Max

PBGA lead types

For PBGA packages, which have a plastic body darker than the leads,
make the following initial settings:

Use best fit: No

Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 500
Use best
Coarse fit:contrast: 25
search Use sub pixel:
Coarse search
Finenoise:
search500noise: 500 Coarse search 10
Fine search contrast: 25 contrast:
Fine search noise: 500 type: None
Index Fine search contrast: 10
Index
Indextype:
areaNone
offset: 0.000mm/ 0.000mm
Index area Index
offset: 0.000mm/
area 0.000mm
size: 5mm
Index area size:contrast:
Corner 5mm 15%
Corner contrast: 15 %
Corner variance: 10% Corner variance: 10 %
Mark contrast: 15 %
Mark contrast: 15%
Usable cameras:
Usable Standard
cameras: Standard, Linescan
Unusable Unusable
cameras: None
cameras: None
Usable HYDRA cameras: Linescan
Linescan illum. for HYDRA: Full
HYDRA camera light levels: Max

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For CCGAs choose PBGA lead type and by using only front light
illumination create contrast between the columns and the ceramic
body. Use Outline coarse search to locate the component.

Use best fit: No

Use sub pixel: No
Coarse search method: Outline
Coarse search noise: 500
Use best
Coarse fit:contrast: 40
search Use sub pixel:
Coarse search
Finenoise:
search500noise: 1500 Coarse search 10
Fine search contrast: 10 contrast:
Fine search noise: 500 type: None
Index Fine search contrast: 10
Index
Indextype:
areaNone
offset: 0.000mm/ 0.000mm
Index area Index
offset: 0.000mm/
area 0.000mm
size: 5mm
Index area size:contrast:
Corner 5mm 15%
Corner contrast: 15 %
Corner variance: 10% Corner variance: 10 %
Mark contrast: 15 %
Mark contrast: 15%
Usable cameras:
Usable Standard
cameras: Standard, Linescan
Unusable Unusable
cameras: None
cameras: None
Usable HYDRA cameras: Linescan
Linescan illum. for HYDRA: Full
HYDRA camera light levels: Max

CGA lead types

For BGA packages with CGA lead types, that is with leads that
appear darker than the body, make the following initial settings:

Use best fit: No

Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 500
Use best
Coarse fit:contrast: 25
search Use sub pixel:
Coarse search
Finenoise:
search500noise: 500 Coarse search 10
Fine search contrast: 25 contrast:
Fine search noise: 500 type: None
Index Fine search contrast: 10
Index
Indextype:
areaNone
offset: 0.000mm/ 0.000mm
Index area Index
offset: 0.000mm/
area 0.000mm
size: 5mm
Index area size:contrast:
Corner 5mm 15%
Corner contrast: 15 %
Corner variance: 10% Corner variance: 10 %
Mark contrast: 15 %
Mark contrast: 15%
Usable cameras:
Usable Standard
cameras: Standard, Linescan
Unusable Unusable
cameras: None
cameras: None
Usable HYDRA cameras: Linescan
Linescan illum. for HYDRA: Full
HYDRA camera light levels: Max

Corner contrast, Corner variance and Mark contrast

Start with the default values shown above. Then, if necessary, adjust
these values. See the description in the previous section.

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Test Centering
There are a lot of parameters that can be set and adjusted in
connection with centering of packages. Test centering does a test of
the actual centering data, making it easier to find the best
parameters for the chosen package.

Press <F4> in the main Package List Editor (page 5-3), and a box
containing test data is shown, see Figure 5-4.

Function keys in the test centering window:

Press <Esc> if you want to return to the main Package List Editor
Esc
(page 5-3).

* TEST CENTERING PACKAGE 1206-06 *

Packages
1206-06
1206-12
1206-16
1210-07
1210-12
1505-10
1805-07
1812-07 Pick Up Component
1812-12 Package height: 0.698mm
1812-20 Tool: A13
1825-10
218-18 Pick from: Y wagon (90°)
AL-CAP Feeder/Tray: ---
BGA-13*13-P
BGA-14*14-C
BGA-15*15-P
BGA-19*19-PE
M3216-16
M3528-19
M3819-16
Brian 12:42

Figure 5-4. Test centering

Entries in the test centering box:

Package height
Height specified in package list editor. Cannot be changed in this
view.

Tool
Tool specified in package list editor. Cannot be changed in this view.

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Pick from
Specify where the package can be picked. Press <Space> to toggle
between Y wagon (0°), Y wagon (90°), Tray wagon (0°), Tray wagon
(90°)., Feeder/Tray

Feeder/Tray
This field is only available if Feeder/Tray was chosen above. Feeders
or trays where the package is presently loaded. Press <Space> for
list of all available feeders to choose from.
--- in the field indicates that the package is not loaded.

Press <Enter> and the component is picked, centered and either put
back or discarded.

If Y wagon (0°), Y wagon (90°), Tray wagon (0°), or Tray wagon (90°)
is chosen in Pick from you must locate the package by using the
camera. Three corners of the package must be indicated.

This window appears if the centering is successful:

Package successfully centered

OK

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Packag types
By pressing <F7>in the main Package List Editor (page 5-3), a
window containing lead type data, is opened.

The following packag types are defined:

Two pole package

Example: 1206-06.
See page 5-28.

Three pole package

Example: SOT-23.
See page 5-30.

Two symmetric lead groups

Example: SO14.
See page 5-32.

Four symmetric lead groups

Example: LQFP208-0.50.
See page 5-34.

Two plus two symmetric lead groups

Example: MQFP80-16x24-0.80-2.7.
See page 5-36.

Four lead groups on two sides

Example: SOJ26-FOUR-LEAD-GROUPS.
See page 5-40.

BGA package, Generic BGA

Example: BGA169-13x13-1.0.
Staggered or filled lead patterns, see page 5-44.
Any regular pitch lead patterns see page 5-48.

Outline package
See page 5-58.

Generic
Any other package.
Example: SOT-223.
See page 5-60.

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The following descriptions will only deal with the programming of

lead types. For any other information, such as nomenclature, tools
and other programming hints, please refer to Appendix A – Packages.

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Package List MYDATA automation AB

Package
This package type is used for standard 2-pole packages where the
leads are located symmetrical with respect to the package center.

Example: 0805, 1206, 1812.

The package type box is shown in Figure 5-5.

Function keys in the package type window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the package type box:

Lead type
The lead type of the package. Press <Space> in this field to get a
popup menu with the available options further detailed on page 5-67.

CHIP
SMALL-CHIP

Width over leads

The distance between the leads (a). Lead 1 in 0 degrees.

Lead width
The width of the leads (b).

Lead length
The length of the leads (c).

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Esc Exit
F7 Change package type

Package 1206-06
Two symmetric leads with lead 1 in zero degrees

Lead type: CHIP

Width over leads: 3.2mm
Lead width: 1.6mm
Lead length: 0.5mm

No. of image points: 40

Image points distribution: Standard

Max cross-wise deviation:

Max length-wise deviation:

Brian 12:44

Figure 5-5. Two pole package

No. of image points

Number of image points around the component outline. The defined
number of points is used by the optical centering system to identify
the component size, position and alignment.

You can set a number between 10 and 120 points. The more points
Standard distribution. the more accuracy but slower centering, and vice versa. A minimum
value of 40 is recommended to be able to calculate each chip side
angle accurately.

Image points distribution

This field determines how the image points are distributed around
the outline of a chip component. The input can be toggled between
Standard and Leads only.

Leads only is used for components with an irregular shaped or

Leads only distribution. colored body, that is difficult for the vision system to detect.

Max cross-wise deviation, Max length-wise deviation

Max cross-wise deviation. The distance between the correct component outline and the current
component geometric mean outline. Note that the component size
tolerance must be included in this value. The value is not allowed to
be 0.

Max length-wise deviation.

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Three pole package

This package type is used for 3-pole packages with two leads in a first
group and one lead in a second group. These groups are located
symmetrical with respect to the package center.

Example: SOT-23.
The package type box is shown in Figure 5-6.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the package type box:

Lead type
The lead type of the current package. Press <Space> in this field to
get a popup menu with the available options further detailed on
page 5-67.

J-BEND
FLAT
GULLWING
LEADLESS
I-LEAD

Width over leads

The total width over the leads. The component oriented in 0° and the
1
measurement in the X coordinate of the machine.
3
2

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Esc Exit
F7 Change package type

Package SOT-23
Three pole package

Lead type: GULLWING

Width over leads: 2.31mm
C-C distance lead 1 and 2: 1.9mm
Lead width: 0.4mm
Lead length: 0.6mm
Max cross-wise deviation: 0.25mm
Max length-wise deviation: 0.25mm
Max length-wise deformation: 0mm

Brian 12:48

Figure 5-6. Three pole package

C-C distance lead 1 and 2

The distance between the center of lead 1 and the center of lead 2.
1
3
2

Lead width
The width of the leads.
1
3
2

Lead length
The length of the leads measured from the package body to the lead
1 tip.
3
2

Max cross-wise deviation

See the description on page 5-68.

Max length-wise deviation

See the description on page 5-68.

Max length-wise deformation

See the description on page 5-69.

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Two symmetric lead groups

This package type is used for packages with two symmetric lead
goups numbered counter-clockwise.

Example: SO14.

The package type box is shown in Figure 5-7.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the package type box:

Number of leads
The total number of leads in both groups, which must be an even
number, for instance 14 for the SOT14 package.

Lead type
The lead type of the current package. Press <Space> in this field to
get a popup menu with the available options further detailed on
page 5-67.

J-BEND
FLAT
GULLWING
LEADLESS
I-LEAD

Width over leads

Total package width including the leads. The component oriented in
0° and the measurement in the X coordinate of the machine.

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Esc Exit
F7 Change package type

Package SO-14
Two symmetric lead groups

Number of leads: 14
Lead type: GULLWING
Width over leads: 6.198mm
Lead pitch: 1.27mm
Lead length: 1mm
Lead width: 0.42mm
Max cross-wise deviation: 0.2mm
Max length-wise deviation: 1mm
Max length-wise deformation: 0.1mm

Brian 12:50

Figure 5-7. Two symmetric lead groups

Lead pitch
The distance between the centers of the leads.

Lead length
The length of the leads measured from the package body to the lead
tip.

Lead width
The width of the leads.

Max cross-wise deviation

See the description on page 5-68.

Max length-wise deviation

See the description on page 5-68.

Max length-wise deformation

See the description on page 5-69.

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Four symmetric lead groups

This package type is used for packages with four symmetric lead
groups of the same type and numbered counter-clockwise.

Example: LQFP208-0.50.

The package type box is shown in Figure 5-8.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the package type box:

Number of leads
The total number of leads in the four groups, which must be a
multiple of 4, for instance 208 for the LQFP208-0.50 package.

Lead number of upper lead in left group

Defines the lead number of the uppermost lead in the left lead group,
indicated with an arrow in the figure.

Lead type
The lead type of the current package. Press <Space> in this field to
get a popup menu with the available options further detailed on
page 5-67.

J-BEND
FLAT
GULLWING
LEADLESS
I-LEAD

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Esc Exit
F7 Change package type

Package LQFP208-0.50
Four symmetric lead groups

Number of leads: 208

Lead number of upper
lead in left group: 1
Lead type: GULLWING
Width over leads: 30mm
Lead pitch: 0.5mm
Lead length: 1mm
Lead width: 0.22mm
Max cross-wise deviation: 0.25mm
Max length-wise deviation: 0.25mm
Max length-wise deformation: 0mm

Brian 12:54

Figure 5-8. Four symmetric lead groups

Width over leads

Total package width including the leads. The component oriented in
0° and the measurement in the X coordinate of the machine.

Lead pitch
The distance between the centers of the leads in the group.

Lead length
The length of the leads measured from the package body to the lead
tip.

Lead width
The width of the leads.

Max cross-wise deviation

See the description on page 5-68.

Max length-wise deviation

See the description on page 5-68.

Max length-wise deformation

See the description on page 5-69.

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Two plus two symmetric lead groups

This package type is used for rectangular packages with one lead
group on each side and symmetrical lead groups on opposite sides. All
leads are of the same type and numbered counter-clockwise.

Example: MQFP80-16x24-0.80-2.7.

The package type box is shown in Figure 5-9.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

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Esc Exit
F7 Change package type

Package MQFP80-16x24-0.80-2.7
Two plus two symmetric lead groups

Number of leads: 80
No. of leads in group 1: 24
Lead number of upper
lead in left group: 1
Lead type: GULLWING
Width over group 1 and 3: 18mm
Length over group 2 and 4: 24mm
Lead pitch: 0.8mm
Lead length: 2mm
Lead width: 0.4mm
Max cross-wise deviation: 0.2mm
Max length-wise deviation: 1mm
Max length-wise deformation: 0mm

Brian 12:58

Figure 5-9. Two plus two symmetric lead group

Entries in the package type box:

Number of leads
The total number of leads in the four groups, which must be an even
number, for instance 80 for the MQFP80 package.

No. of leads in group 1

Number of leads in lead group 1. The arrow in the figure points out
lead group 1.

Lead number of upper lead in left group

Defines the lead number of the uppermost lead in the left lead group,
indicated with an arrow in the figure.

Lead number 1 should be pointed out, as the component must be

oriented in 0°.

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Lead type
The lead type of the current package.

Press <Space> in this field to get a popup menu with the available
options further detailed on page 5-67.

J-BEND
FLAT
GULLWING
LEADLESS
I-LEAD

Width over group 1 and 3

Total package width across lead group 1 and 3, including the leads.
The component oriented in 0° and the measurement in the
X coordinate of the machine.

Length over group 2 and 4

Total package length across lead groups 2 and 4, including the leads.
The component oriented in 0° and the measurement in the
Y coordinate of the machine.

Lead pitch
The distance between the centers of the leads.

Lead length
The length of the leads measured from the package body to the lead
tip.

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Lead width
The width of the leads.

Max cross-wise deviation

See the description on page 5-68.

Max length-wise deviation

See the description on page 5-68.

Max length-wise deformation

See the description on page 5-69.

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Four lead groups on two sides

This package type is used for rectangular packages with four lead
groups, two groups on two sides each. All leads are of the same type
and numbered counter-clockwise.

Example: SOJ26-FOUR-LEAD-GROUPS.
The package type box is shown in Figure 5-10.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

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Esc Exit
F7 Change package type

Package SOJ26-FOUR-LEAD-GROUPS
Four lead groups on two sides

Number of leads: 20
Lead number of upper
lead in left group: 1
Lead type: J-BEND
Width over leads: 8.51mm
Lead pitch: 1.27mm
C-C distance last lead
in group 1 and first
lead in group 2: 5.08mm
Lead length: 0.5mm
Lead width: 0.5mm
Max cross-wise deviation: 0.65mm
Max length-wise deviation: 0.65mm
Max length-wise deformation: 0mm

Brian 13:04

Figure 5-10. Four lead groups on two sides

Entries in the package type box:

Number of leads
The total number of leads in the four groups, which must be a
multiple of 4.

Lead number of upper lead in left group

Defines the lead number of the uppermost lead in the left lead group,
indicated with an arrow in the figure.

Lead number 1 should be pointed out, as the component must be

oriented in 0°.

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Lead type
The lead type of the current package.

Press <Space> in this field to get a popup menu with the available
options further detailed on page 5-67.

J-BEND
FLAT
GULLWING
LEADLESS
I-LEAD

Width over leads

The total width over the leads. The component oriented in 0° and the
measurement in the X coordinate of the machine.

Lead pitch
The distance between the lead centers.

C-C distance last lead in group 1 and first lead in group 2

The distance between the centers of the adjacent leads in group 1 and
group 2.

Lead length
The length of the leads measured from the package body to the lead
tip.

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Lead width
The width of the leads.

Max cross-wise deviation

See the description on page 5-68.

Max length-wise deviation

See the description on page 5-68.

Max length-wise deformation

See the description on page 5-69.

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BGA package
This package type is used for square shaped packages with ball grid
array connection, which can be called for instance BGA (Ball Grid
Array), SGA (Solder Grid Array) and LGA (Land Grid Array).

Any package with circular shaped leads (bumps), such as CSP,

CS-BGA or FC, may be set up as a BGA package.
This package type handles predefined lead patterns according to
what is described below. For other BGA lead patterns a package may
be converted to, and further edited as, Generic BGA package
(page 5-48) or Generic package type (page 5-60).

The package type box is shown in Figure 5-11.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the package type box:

Leads per row, Leads per column

The number of leads, in filled rows and in filled columns respectively.

The package in this figure has 9 leads per row and 7 leads per column.

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Esc Exit
F7 Change package type

Package: BGA169-13x13-1.0

Leads per row: 13

Leads per column: 13
Staggered: No
Extra corner leads: 0

Leads per row in hole: 0

Leads per column in hole: 0

Lead type: PBGA

Lead pitch: 1.5mm
Lead diameter: 0.7mm
Max lead displacement: 0.2mm

Brian 13:06

Figure 5-11. BGA package

Staggered
No
Short Staggered means that every other position of a lead matrix is filled.
Long
Staggered can be set to No, Short or Long by pressing <Space> and
selecting an option from the list. The three options are described
below.

No is used when all positions of a lead matrix are filled, which looks
like this for a 9 x 9 lead matrix.

P indicates how to measure the Lead pitch value.

Short is used when every other row and column are one lead short,
forming a second matrix inside the first one. The figure shows a 5 x 5
lead matrix for which Staggered is Short. The two rectangles in the
figure indicate the matrixes mentioned.

P indicates how to measure the Lead pitch value.

Long is used when every other row and column are as long as the
previous one, forming a second matrix shifted by one position. The
figure shows a 5 x 5 lead matrix for which Staggered is Long. The two
rectangles in the figure indicate the matrixes mentioned.

P indicates how to measure the Lead pitch value.

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By combining Staggered with the settings for rows, columns and

holes, various grid patterns can be programmed. The following
figures illustrate some examples of this (grid nodes without leads are
marked with ‘+’):

Leads per row: 5

Leads per column: 4
Staggered: Short

Leads per row in hole: 3

Leads per column in hole: 2

Leads per row: 5

Leads per column: 4
Staggered: Short

Leads per row in hole: 2

Leads per column in hole: 3

Leads per row: 3

Leads per column: 3
Staggered: Long

Leads per row in hole: 1

Leads per column in hole: 1

Leads per row: 5

Leads per column: 3
Staggered: Long

Leads per row in hole: 3

Leads per column in hole: 1

Extra corner leads

This feature is used if a package has extra corner leads outside the
filled matrix, or no leads in the matrix corner nodes.

Extra corner leads can be set to –1, 0 or +1, by pressing <Space> and
-1 selecting an option from the list. The three options are used as
0 follows:
+1

–1 is used if there are no leads in the matrix corner nodes as shown

in the figure.

0 is used if there are no extra corner leads outside the filled matrix,
or omitted leads in the matrix corner.

+1 is used if there are extra corner leads outside the filled matrix as
shown in the figure.

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Leads per row in hole, Leads per column in hole

Number of leads in a row/column that is not filled. These fields are
set to 0 for a filled matrix.

The package in this figure is set to:

Leads per row: 5

Leads per column: 5

Lead type
Press <Space> in this field to get a popup menu with the available
options:

CBGA
PBGA
CGA

Select an option depending on the BGA type:

CBGA if a bright bump is surrounded by a darker ring on a
bright body (white ceramic BGAs only).
PBGA if the bump is brighter than the surrounding body
(mostly BGAs with dark body).
CGA if the bump is darker than the surrounding body.

Lead types are further detailed on page 5-67.

Lead pitch
P D Center-to-center distance between the leads in the rows and the
columns (‘P’ in the figure).

For staggered lead patterns the lead pitch is measured between two
P
leads in the same row or column, see page 5-45.

Note that this staggered lead pitch is twice as big as the staggered
lead pitch in the Generic BGA package (page 5-50) for the same
pattern. To be considered if converting between these package types.

Lead diameter
The diameter of the leads as seen by the vision system. The visible
part of the bump depends upon the chosen illumination setting.

The Linescan camera lacks Dark Field illumination. As a rule of

thumb, the diameter should be set to approximately 2/3 of the
physical bump diameter (D).

Max lead displacement

Maximum accepted distance deviation between the centers of the
leads. Entering zero turns the check off.

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Generic BGA package

This package type is used for any package type with ball grid array
connection, which can be called for instance BGA (Ball Grid Array),
SGA (Solder Grid Array) and LGA (Land Grid Array).

Any package with circular shaped leads (bumps), such as CSP,

CS-BGA or FC, may be set up as a BGA package. It is required that
the leads can be recognized as PBGA, CBGA or CGA (bright bump on
dark body, or vice versa), which is further described on page 5-47.
This package type is programmed graphically and any lead patterns
with a regular pitch can be programmed.

Packages with staggered lead patterns can be created in, or converted

to, BGA package (page 5-44) and then be further edited in this
package type editor.

For lead patterns with an irregular lead pitch the package can be
converted to, and further edited as, a Generic package type
(page 5-60).

The package type box is shown in Figure 5-12.

Function keys in this package window:

Edit pattern
By pressing <F1> the generic BGA editor is set in editing mode
F1
(page 5-50).

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

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F1 Edit pattern
F7 Change package type

10 6 2 Editing symmetry:
12 8 4 None
oooooooooooooo A View: Bottom
oooooooooooooo B Size: 14 x 14
oooooooooooooo C
oooooooooooooo D No. of leads: 196
oooooooooooooo E
oooooooooooooo F Position: – –
oooooooooooooo G Offset:
oooooooooooooo H -6.500mm/ 6.500mm
oooooooooooooo I
oooooooooooooo J Package: BGA169-14x14-1.0
oooooooooooooo K Generic BGA package
oooooooooooooo L Lead type: PBGA
oooooooooooooo M X-wise pitch: 1mm
oooooooooooooo N Y-wise pitch: 1mm
Lead diameter: 0.54mm
Max lead displacement: 0.2mm

Brian 13:12

Figure 5-12. Generic BGA package

Entries in the package type window:

Lead type
Press <Space> in this field to get a popup menu with the available
options:

CBGA
PBGA
CGA

Select an option depending on the BGA type:

CBGA if a bright bump is surrounded by a darker ring on a
bright body (white ceramic BGAs only).
PBGA if the bump is brighter than the surrounding body
(mostly BGAs with dark body).
CGA if the bump is darker than the surrounding body.

Lead types are further detailed on page 5-67.

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X-wise pitch, Y-wise pitch

P D Center-to-center distance between the leads in the rows and in the
columns.

For staggered lead patterns the X-wise pitch and/or Y-wise pitch is
P S
measured between two nodes in the pattern grid (S), no matter if
there are leads in the nodes or not.

Note that this staggered lead pitch is half of the staggered lead pitch
in the BGA package (page 5-47) for the same pattern. To be
considered if converting between these package types.

Lead diameter
The diameter of the leads as seen by the vision system. The visible
part of the bump depends upon the chosen illumination setting. As a
rule of thumb, the diameter should be set to approximately 66% of
the physical bump diameter (D).

Max lead displacement

Maximum accepted distance deviation between the centers of the
leads.

Entering zero turns the check off.

Editing mode
By pressing <F1> in the opening window, the generic BGA editor is
set in editing mode, see Figure 5-13.

Desired row letters can be omitted in the lead pattern, see page 5-57.

Function keys in the editing mode:

Help
By pressing <F8> the editing commands are shown, see page 5-54.
F8

Exit
Press <Esc> if you want to exit the editing mode and return to the
Esc
opening window (page 5-49).

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F8 Help

10 6 2 Editing symmetry:
12 8 4 None
oooooooooooooo A View: Bottom
oooooooooooooo B Size: 14 x 14
oooooooooooooo C
oooooooooooooo D No. of leads: 196
oooooooooooooo E
oooooooooooooo F Position: (A 1)
oooooooooooooo G Offset:
oooooooooooooo H -6.500mm/ 6.500mm
oooooooooooooo I
oooooooooooooo J Package: BGA169-14x14-1.0
oooooooooooooo K Generic BGA package
oooooooooooooo L Lead type: PBGA
oooooooooooooo M X-wise pitch: 1mm
oooooooooooooo N Y-wise pitch: 1mm
Lead diameter: 0.54mm
Max lead displacement: 0.2mm

Brian 13:14

Figure 5-13. Generic BGA package

Entries in the editing mode:

Editing symmetry
Shows the currently selected editing symmetry, that is None,
Horizontal, Vertical, Fourfold or Eightfold.

You can change the editing symmetry by pressing <F1>.

Editing symmetry is further described in the editing command

section, see page 5-54.

View
Shows the currently selected view, which can be either Bottom or
Top, that is bottom or top view of the component and PCB pattern.

You can mirror the view horizontally by pressing ‘h’ or vertically by

pressing ‘v.’ You can also rotate the pattern by pressing <F3> or
<F4>.

The view control is further described in the editing command section,

see page 5-54.

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Size
Number of rows and columns for the lead pattern. Note that even
rows and columns without leads are included.

You can add rows by pressing ‘I’ and columns by pressing ‘i.’

The size is further described in the editing command section, see

page 5-54.

No. of leads
Number of leads in the lead pattern.

This value is changed if you toggle the cursor position, or a selected

number of positions, between leads and empty nodes by pressing
<Space>.

Setting and clearing leads is further described in the editing

command section, see page 5-54.

Position
Indicates the cursor position in the pattern with a letter and a
number.

From column number 10, the column number is always read at the
last digit, for instance column 14 is the column under ‘4’ in 14.

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F8 Help

10 6 2 Editing symmetry:
12 8 4 None
.....oooo..... A View: Bottom
.....oooo..... B Size: 14 x 14
.....oooo..... C
....oooooo.... D No. of leads: 122
...oooooooo... E
oooooooooooooo F Position: (E 11)
ooooo....ooooo G Offset:
ooooo...oooooo H 3.500mm/ 2.500mm
oooooooooooooo I
.....ooooooooo J Package: BGA169-14x14-1.0
....oooooooooo K Generic BGA package
..oooooooooooo L Lead type: PBGA
....oooooooo.. M X-wise pitch: 1mm
....oooooooo.. N Y-wise pitch: 1mm
Lead diameter: 0.54mm
Max lead displacement: 0.2mm

Brian 13:16

Figure 5-14. Generic BGA package, editing mode

Offset
The current X and Y distances between the lead pattern origin and
the cursor. Figure 5-15 shows the offset values for the cursor position
illustrated in Figure 5-14 that has a lead pitch of 1mm.

+Y

14 11 1
A

+2.5 E

+X –X

N
+3.5

–Y

Figure 5-15. Generic BGA offset

In Figure 5-15, the pattern origin is located in the center of the lead
pattern, but it can be set at any position by pressing <F2>.

Lead pattern origin setting is further described in the editing

command section, see page 5-54.

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Editing commands
By pressing <F8> in the editing mode the following editing
command box is shown:

F1 Change editing symmetry

F2 Set offset
F3, F4 Rotate view
Space Toggle lead
Ins Set lead
Del Clear lead
Shift+Arrow keys Select
I Insert row
i Insert column
D Delete row
d Delete column
h Mirror view horizontally
v Mirror view vertically
OK

Command description:

Change editing symmetry

By pressing <F1> you can select the following editing symmetries:
F1

None
Horizontal
Vertical
Fourfold
Eightfold

• None
No editing symmetry.

• Horizontal
If you change a position in the lead pattern (at the arrow in the
figure), then the corresponding position in the other horizontal
half of the pattern will be changed automatically.

• Vertical
If you change a position in the lead pattern (at the arrow in the
figure), then the corresponding position in the other vertical half
of the pattern will be changed automatically.

• Fourfold
If you change a position in the lead pattern (at the arrow in the
figure), then the corresponding positions in the rest of the four
quadrants of the pattern will be changed automatically.

• Eightfold
If you change a position in the lead pattern (at the arrow in the
figure), then the corresponding positions in the rest of the eight
octants of the pattern will be changed automatically.

This option is only available if there are equal number of rows and
columns in the pattern.

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Set offset
By pressing <F2> you can either set the pattern origin offset from
F2
the current lead, or set the pattern origin to the center of the pattern.
The following dialog box is shown:

Set offset for lead ( (E 3.500mm/ 2.500mm

11)
<F2> Set origin to center

– If you want to set the pattern origin by entering the offset from
the current cursor position, then type the X/Y values in this box.

– If you want to set the pattern origin to the center of the pattern,
then press <F2> again.

Note that all rows and columns are included when the pattern
origin is calculated, leads as well as nodes without leads.

Figure 5-16 illustrates what happens if empty rows or columns

are included when setting the pattern origin to center by
pressing <F2>.

Figure 5-16. Set origin to center

In the left figure, origin is set to center. In the right figure all
empty rows and columns are removed and the origin, which will
be positioned in the middle of the component footprint on the
PCB, is incorrect positioned.

Rotate view
By pressing <F3> or <F4> the pattern is turned by 90° clockwise or
F3 F4
counter-clockwise.

Toggle lead
Toggles the cursor position, or a selected number of positions,
between leads and empty nodes.

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Set lead
Sets the cursor position, or a selected number of positions, to leads.
Ins

Clear lead
Clears the cursor position, or a selected number of positions, from
Del
leads.

Select
By pressing <Shift> + any of the arrow keys, a number of positions
are selected in the arrow direction. The selected positions can then
be:
– toggled between leads and empty nodes.
– set to leads.
– cleared from leads.

If Editing symmetry is selected to Horizontal, Vertical, Fourfold or

Eightfold, then positions cannot be selected across the symmetry
borders.

Insert row
The ‘I’ key inserts new rows at the cursor, which can be moved below
I the last row to be able to add new rows in the end of the pattern.

Insert column
The ‘i’ key inserts new columns at the cursor, which can be moved to
i the left of the first column to be able to add columns in the left end
of the pattern.

Delete row
The ‘D’ key deletes the row on which the cursor is placed.
D

Delete column
The ‘d’ key deletes the column in which the cursor is placed.
d

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Mirror view horizontally

The ‘h’ key flips the pattern horizontally, that is the left end becomes
h
the right end, and vice versa. The View field is changed between
Bottom and Top every time this action is performed.

This feature makes it possible to get a top view or bottom view of the
component and PCB pattern.

Mirror view vertically

The ‘v’ key makes the same as the previous option, but it flips the
v
pattern vertically, that is the upper end becomes the lower end, and
vice versa.

Parameters involved
Letters to be omitted as row letters can be entered in the following
parameter, found in the 0234 Desktop parameter group:

0234.0202 Not used characters in coordinates

If you enter ‘ace’ in this parameter, then the pattern rows will be:
B D F G ...

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Outline package
This package type is used only for centering using the outline of the
package. This package type may also be used for rectangular
packages other than flip-chips.
The package type box is shown in Figure 5-17.

Function keys in this package window:

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the package type box:

Length of substrate
The substrate total length measured in the Y coordinate of the
machine with the component oriented in 0°.

Width of substrate
The substrate total width measured in the X coordinate of the
machine with the component oriented in 0°.

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Esc Exit
F7 Change package type

Outline package TFL235

Length of substrate: 13
Width of substrate: 8
Edge point pitch: 1.1
Max edge unlinearity: 0

Brian 13:18

Figure 5-17. Outline package

Edge point pitch

The center-to-center spacing of imaginary measuring points along
the substrate sides, which are used to determine the position and
orientation of the component.

You can try with an average number of ten points along each
substrate side, that is two side lengths divided by twenty (in the
above example: 13.8mm plus 8mm divided by 20 equals 1.1mm).

Max edge unlinearity

Maximum accepted non-linearity for the measuring points along a
side. The measuring resolution is 70µm or better.

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Generic
This package type is used for packages for which the previous lead
configurations are not applicable.

Example: SOT-223.
A description of how to program a BGA package is found on
page 5-64.

The package type window is shown in Figure 5-18.

Function keys in the package type window:

Edit lead group

By pressing <Enter> the highlighted package type can be modified.

Enter

Insert new
A new package type is added to the package type list by pressing
Ins
<Ins>.

Delete
The highlighted package type is deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Change package type

To change to another package type, press <F7>. Package type
F7
selection is detailed on page 5-66 and the lead types are described on
page 5-67.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

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Enter Edit lead group

Lead Group List
1 Ins Insert new
2 Del Delete
3 F7 Change package type
4
5
6
7 Lead type: PBGA
8
Number of leads in group: 13
Number of first lead in group: 13
Offset X: 3.35mm
Offset Y:
Angle:
Length:
Width:
Pitch:
Max cross-wise deviation: 0.2mm
Max length-wise deviation:
Max length-wise deformation:

Brian 13:24

Figure 5-18. BGA package

Entries in the package type window:

Lead Group List

Number of lead groups on the package. A lead group is a row of
1 4 evenly spaced and shaped leads. The numbering sequence is shown
in the figure.
2 3 Each lead group is represented by a line in this box. Use the arrow
A four lead group component. keys to select lead group.

Lead type
The lead type of the current package.

Press <Space> in this field to get a popup menu with the available
options further detailed on page 5-67.

J-BEND
FLAT
GULLWING
LEADLESS
CBGA
PBGA
I-LEAD
CHIP
CGA
SMALL-CHIP

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Number of leads in group

Number of leads in the lead groups.
5 5

5 5

Number of first lead in group

The lead number which is selected as the first lead in the lead group.

The figure illustrates a package for which lead 9 is defined as the first
lead in lead group 3.

Offset X
The distance between the center of the component and the tip of the
lead previously defined as the first lead in the group.

The component oriented in 0° and the measurement in the

X coordinate of the machine.

Leads are by default defined as pointing outwards from the center of

the package body. Therefore even for J-Bend leads the tip of the lead
is considered to be the outer edge.

Image of Offset X for a PLCC

Offset Y
The distance between the center of the component and the center
line of the lead defined as the first lead in the group.

The component oriented in 0° and the measurement in the

Y coordinate of the machine.

Angle
The angle of the selected lead group.

Allowed angles are 0°, 90°, 180°, and –90° (270°).

The lead group angle is determined by the direction of ascending lead

numbers in the group.

The upper lead group in the figure has the group angle –90° as the
increasing lead numbers 26 – 28 and 1 – 4 point towards –90°.

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Length
The length of the leads measured from the package body to the lead
tip.

Width
The width of the leads.

Pitch
The c/c distance between the leads in the group.

Max cross-wise deviation

See the description on page 5-68.

Max length-wise deviation

See the description on page 5-68.

Max length-wise deformation

See the description on page 5-69.

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Programming Example, Generic

This section contains a description of how to program a BGA by using
generic programming. The example is a BGA71-9x9 that has a lead
pattern like in the figure.

The package is programmed in the following steps, further detailed

below:

BGA71-9x9 (bottom view). • Collecting package data.

• Choosing the most similar preprogrammed package.
• Editing the basic package data.
• Removing the single corner lead.

Collecting package data

Collect available basic package data from the data sheet regarding
the BGA to be programmed, for instance number of leads, rows,
columns, and lead pitch. Or, calculate the package data as follows:

1. Measure the lead bump diameter (‘D’ in the figure).

2. Measure the total width over as many leads as possible (W).
Measure from outside edge to outside edge of the leads.

3. Count the number of leads (NL) within the measured length (W).
4. Calculate the lead pitch from the following equation:

W – D-
---------------
NL – 1

5. Round off the calculated value as pitch normally is an even

multiple of 1/10mm or mil, for instance 1.00mm or 1.27mm.

Choosing the most similar preprogrammed package

6. In the Package List (see page 5-2), choose that package which is
most similar to the package to be programmed.

This figure shows the BGA81-9x9 package, which is the most

similar type to the new package in this example.

7. Press <Ins> and enter a name for the new package, which now
Preprogrammed BGA81-9x9. has inherited all data from the selected package.

Editing the basic package data

8. Edit, if necessary, the main package data, such as centering data
(<F6>), centering phases (<F8>) and glue data (<F9>).

9. Open the Edit lead groups window by pressing <F7>.

10. Edit, if necessary, the data according to the measurements
above.

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11. Set the Leads per row in hole and Leads per column in hole to 3
as three times three leads are omitted in the lead matrix.

Only the omitted lead in the corner is now left to program.

12. If Max lead displacement is to be used, then enter the value now.
Otherwise, it will need to be edited several times later.
3x3 leads omitted.

Removing the single corner lead

To be able to remove the corner lead, the current BGA lead group has
to be converted to Generic. TPSys will scan the lead matrix and
transform the result to a number of lead groups. To be able to
identify these lead groups the package has to be viewed from the top,
see the figure.
Bottom view.Top view.
13. In the lead group editor, press <F7> and select the Generic
group (see page 5-66).

Now, 12 lead groups will be identified, see Figure 5-19.

1
2
3
4 5
6 7 0Y
8 9
10
11
12

0
X

Figure 5-19. Identified lead groups (top view)

14. Adjust Number of leads in group and Offset X for the first lead in
lead group 1 as follows:

Number of leads in group: 8

Offset X: +1 lead distance

Number of leads in group has to be changed from 9 to 8 for lead

group 1 as the first lead is omitted.

Offset X for lead 1 in lead group 1 has to be changed by one lead

distance in positive X direction, see Figure 5-19, as the previous
lead 2 now is lead 1.

The new package is now completed. During the transformation from

BGA to Generic the Lead diameter was transformed to Length and
Width. And, so was the Max lead displacement transformed to Max
cross-wise deviation and Max length-wise deviation.

Any lead pattern can be programmed in this way.

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Selecting Package Type

To select another package type for a package, press <F7> in any of
F7
the package type windows (see the previous sections) and select
another package type in the following menu:

Package Types
Two pole package
Three pole package
Two symmetric lead groups
Four symmetric lead groups
Two plus two symmetric lead groups
Four lead groups on two sides
BGA package
Generic BGA
Outline package
Generic

Current package type information that does not match the new
package type is deleted when saving as a new package type.

Current package type information that matches the new package

type is converted when saving as a new package type.

When selecting Generic, all current package type information is

converted when saving as a new package type.

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Lead Types
An appropriate lead type is selected by pressing <Space> in the Lead
type field of a package type window (see the previous sections) and
selecting a lead type in the menu shown:

J-BEND
FLAT
GULLWING
LEADLESS
CBGA
PBGA
I-LEAD
CHIP
CGA
SMALL-CHIP

The lead types are described below.

Lead type Package Description

J-BEND For rectangular leads that reflect light unevenly, for
instance curved lead tips.

FLAT For rectangular leads that reflect light evenly.

Gullwing lead type works also for these types of
leads.
GULLWING At least 2 leads are required in each lead group. For
optical centering.

LEADLESS The leads are at the same level as the body and they
do not extend outside the package body.

CBGA Ball grid array on white ceramic body (Ceramic Ball

Grid Array). Also called SGA (Solder Grid Array)
and LGA (Land Grid Array). The body is brighter
than the leads.
PBGA The same package as CBGA but PBGA has a (plastic)
body darker than the leads.

I-LEAD Leads with non-circular or rectangular shape.

CHIP Chip components such as 0201 – 1210.

CGA Column Grid Array. Can also be used for BGA

packages. Used if the leads are darker than the
surrounding body.
SMALL-CHIP For use with the Hydra camera. If using an LSC or
DVC select CHIP lead type instead

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Max cross-wise deviation

The cross-wise deviation is defined in most of the package type
windows (see the previous sections).
This value indicates the maximum accepted cross-wise placing
deviation of the leads. ‘Cross-wise’ is related to the lead center lines.
The cross-wise deviation is marked ‘x’ in Figure 5-20. The lead edge
center must be placed within this distance.
Cross the lead center lines.
The shaded area in Figure 5-20 show the land pattern on the PCB,
with the lead contact area placed ideally centered on it.

Figure 5-20. Cross-wise and length-wise deviation

Max length-wise deviation

This value indicates the maximum accepted length-wise placing
deviation of the leads. ‘Length-wise’ is related to the lead center
lines. The length-wise deviation is marked ‘y’ in Figure 5-20. The
lead tip edge center, indicated black in the figure, must be placed
Along the lead center lines. within this distance.

The cross-wise and length-wise deviations demarcate the area in

which the lead tip center must be encircled.

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Max length-wise deformation

The length-wise deformation is defined in most of the package type
windows (in the previous sections).
Length-wise the lead group This value indicates the maximum accepted length-wise deformation
axis. of the leads, caused by cut or bent leads, see the upper part of
Figure 5-21. ‘Length-wise’ is related to the lead group axis.

Figure 5-21. Max length-wise deformation

Note that a deformation caused by a bent lead also affects the height
of the lead, which is shown in the lower part of the figure.

If length-wise deformation is set to ‘0’ then the feature is off, that is

no consideration will be taken to the deformation.

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Package List MYDATA automation AB

Centering Phases
By pressing <F8> in the main Package List Editor (page 5-3), a
centering phase window, containing information about mechanical
centering and mechanical/electrical verification, is opened.

The centering phases window is shown in Figure 5-22.

Function keys in the centering phases window:

Enter
By pressing <Enter> the highlighted centering phase can be
modified.
Enter

Ins
A new centering phase is added to the centering phase list by
Ins
pressing <Ins>. Maximum eight centering phases can be used.

Del
The highlighted centering phase is deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

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Centering phases * PACKAGE LIST EDITOR *

Enter Edit centering phase
1 Ins Insert new
2 Del Delete

Package: 1206-06
Method: Mechanical
Angle: 90.00° Level:
Position: Upper
Force: Middle
0805-10 Dimension: 3.2mm Min.: 3mm Max.: 3.4mm
1005-07 Verify mechanical: Yes
1206-06 Verify electrical: Yes
1206-12 OVC light level: ---%
1206-16
1210-07 ---- DVC Illumination ---------- LSC Illumination ----
1210-12 Light level: --- Light level: ---%
1505-10 Pattern: --- Pattern: ---
1805-07 Rel. Abs. Rel. Abs.
1812-07 Dark field: ---% ---% Ambient light: ---% ---%
1812-12 Ambient light: ---% ---% Front light: ---% ---%
1812-15 Front light: ---% ---%
Brian 13:36

Figure 5-22. Centering phases

Entries in the centering phase window:

Centering phases
Number of centering phases for the package.

Up to eight centering phases can be used. Use the arrow keys to select
centering phase.

Package
The selecte package.

Method
Choose centering method by pressing <Space>. The following
options are available:

Optical
Optical centering using the vision system.

Mechanical
Mechanical centering using the jaws.

Angle
0° The component angle during the centering phase.
1
The centering angle and electrical verification is further described in
270/-90° 90° Chapter 3.

180°

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Package List MYDATA automation AB

Level
Centering level is a value between 1 and 12 indicating a height level
on the centering jaws where components are mechanically centered
and electrically verified. Different height levels provide different
touch points between the component and the jaws for different lead
configurations and measurements.

Figure 5-23 shows ten of the twelve levels.

7
6
4
1
11
Level 2
9
10
3
5

Figure 5-23. Centering jaw levels

The centering level is further detailed in Chapter 3.

Position
The component position code indicates which part of the component
will be at the centering level.

Press <Space> and choose position code from the popup menu
shown:

Upper
Lower
Middle
1/4 From Bottom

Upper
1 The upper edge of the component (‘1’ in the figure).

Lower
2 The lower edge of the component (2).

Middle
3 The middle of the component (3).

1/4 From Bottom

4 A quarter way from the bottom of the package to prevent
1/4 burring/flashing interfering with the centering/measurement of
certain packages (4).

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Force
The force applied to the jaws when centering.

Press <Space> and choose centering force from the popup menu
shown:

High
Middle
Low
No

High
High centering force.

Middle
Medium centering force.

Low
Low centering force.

No
No centering force.

Dimension
The mechanical centering dimension with respect to the information
indicated in the Level and Position fields.

The component can be either centered overall, as shown in the left

part of the figure, or fitted into the jaw recesses so that centering can
be carried out unaffected by the body or other leads as shown in the
right part of the figure.

Nominal, minimum (Min.) and maximum (Max.) values can be

defined.

For optical centering the maximum value is compared to the

0053/0054/0055/0056.0461 Component dimension limit parameter. If
Max. is larger than the parameter value, then the system examines
the component from two dual shot images. This is, however, not
applicable to centering camera OVC1.

Verify mechanical
Yes – Components are verified mechanically and rejected if they
do not meet the tolerance requirements.

No – Components are not verified mechanically in this centering

phase.

To toggle between Yes and No, press <Space>.

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Verify electrical
Yes – Electrical verification is performed in this centering phase
provided that the verification is specified with a matching
angle, and that the verification has not been already
performed in a previous centering phase. Components are
rejected if they do not meet the tolerance requirements.

No – No electrical verification is performed in this centering

phase.

To toggle between Yes and No, press <Space>.

OVC light level

The luminance level in optical centering camera systems with only
one illumination group (OVC and EVC1 – 2).

Select illumination intensity by entering a number between 0% and

100%, where 0% stands for no illumination. The light is not changed
continuously but in 8 steps (including 0), each step corresponding to
approximately 14%.

The OVC light level field can only be changed when the Method field
is set to Optical.

The Package List can be shared by several machines in networks.

And, these machines can be equipped with different centering
cameras. Because of that, this field as well as the below fields for
programmable illumination should be set.

DVC Illumination, LSC Illumination

Current optical centering systems use cameras with several
illumination groups. This gives the possibility to optimize the
illumination of each package depending on the package shape, color
and other optical characteristics.

Illumination is set in the same way for both DVC and Linescan
cameras. First the overall light intensity is set using the fields called
Light level. The illumination of each group is then set by choosing an
illumination pattern or by defining the illumination manually for
each illumination group. DVC have three illumination groups: Dark
field, Ambient light, and Front light.

Linescan have two illumination groups: Ambient light and Front

light.

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Pattern
A number of predefined illumination patterns for different packages
can be selected from a popup menu shown by pressing <Space>
when this field is highlighted:

Generic
Standard
QFP
BGA
CBGA
MBGA
Flip Chip
Outline

Generic
The three relative light fields are accessed and a customized
pattern can be programmed.

Standard
Equivalent to the previous optical centering cameras with only
one illumination group.

QFP
For QFP and similar packages with typical lead types
GULLWING or J-BEND.

BGA
For BGA and similar packages. A typical package type is PBGA.

CBGA
Ceramic BGA. A typical package type is CBGA.

MBGA
Metallic BGA. A typical package type is CGA.

Flip Chip
For flip-chip packages with mirror-like surface. A typical
package type is PBGA.

Outline
For locating the outline of a component with package type
Outline package.

Guidelines for setting the best illumination pattern is found on

page 5-77.

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Package List MYDATA automation AB

Dark field – Rel.

The relative dark field level, that is the light level from the LED
group generating light with an oblique incidence to the package, see
Figure 5-24.

This field can only be edited when the Generic pattern is selected.
.

Dark field Dark field

Ambient light Ambient light

Front light

Figure 5-24. Programmable illumination

Ambient light – Rel.

The relative ambient light level, that is the luminance level from the
LED group generating the general background light, see Figure 5-24.

This field can only be edited when the Generic pattern is selected.

Front light – Rel.

The relative front ligt level, that is the light level from the LED group
generating light from the front with a normal incidence to the
package, see Figure 5-24.

This field can only be edited when the Generic pattern is selected.

Dark field, Ambient light, Front light – Abs.

The absolute light level, that is the actual light level generated by
each LED group calculated from the relative values multiplied with
the overall light level.

Example: If the OVC light level is set to 50% and the Front light –
Rel. is set to 10%, then the Front light – Abs. will be 5% (50%
multiplied by 10%).

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Guidelines for Programmable Illumination

The purpose of the programmable illumination is to bring out the
image of the leads and supress of the features such as wiring.

• The best lead information is often achieved by keeping the image

somewhat dark.

• Use a low front light level for packages with a glossy body.
• Try to get a homogeneous image of the leads. If the image of a lead
is bright except for a dark ‘hole’ in the center, then the front light
level is set too low.

• If the leads in the image seems too small, then increase the dark
field level.

• If BGA packages are to be centered by both LSCs and DVCs, try to

achieve an illumination with the DVC that is equivalent to the LSC
illumination. You can achieve this by using only ambient light.

The bump diameter should be the bump diameter shown with this
illumination, or about 2/3 of the real one.

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Glue Dots
By pressing <F9> in the main Package List Editor (page 5-3), a glue
dot window, containing information about the glue dots for the
selected package, is opened.

The Glue Dot Editor is shown in Figure 5-25.

Function keys in the Glue Dot Editor:

Edit glue data

By pressing <Enter> the highlighted glue dot can be modified.

Enter

Insert new
A new glue dot can be added to the glue dot list by pressing <Ins>
Ins
and selecting a glue dot from the Glue Dot List, which is opened by
entering the first characters of the glue dot name and pressing
<Enter>, or by simply pressing <Enter>.

Delete
Highlighted glue dot is deleted by pressing <Del> and confirming
Del
the deletion in a popup box.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
Package List Editor (page 5-3).

Entries in the Glue Dot Editor:

Glue Dot Data

This box contains dot numbers, dot names, and positions for the glue
dots of the selected package.

Use the arrow keys to select glue dot.

The Dot-0.8mm and Dot-1.5mm glue dots in Figure 5-25, are defined
in the Glue Dots section in Chapter 5.

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* PACKAGE LIST EDITOR *

Glue Dot Data
Enter Edit glue data
1: Dot-0.8mm @ -4.5mm/ 9mm
Ins Insert new
2: Dot-1.5mm @ 4.5mm/ 9mm
Del Delete
3: Dot-1.5mm @ -4.5mm/-9mm
4: Dot-0.8mm @ 4.5mm/-9mm

Glue dot position: -4.5mm/ 9mm

Glue dot type: Dot-0.8mm
Brian 13:38

Figure 5-25. Glue dots

Glue dot position

Shows the selected glue dot position in X/Y coordinates from the
center of the component to the center of the glue dots. The
component in 0 degrees.

Glue dot type

The selected glue dot name.

Example
Figure 5-26 shows the glue dots displayed in Figure 5-25, and the
component outline.

1 2
Dot-0.8mm
9

4.5 4.5 9
Dot-1.5mm
3 4

Figure 5-26. Glue dots in a component outline

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Magazine Lists
To be able to mount a PCB, four mandatory main lists (or list groups)
are required:

• Component List
Contains part numbers and component name and data. Assigns a
package to the component.

• Package List
Contains data specific to the component package, such as length,
width, height, number of leads, mount tool, placement precision,
centering forces and optical centering data.

• Magazine Lists (group)

Lists that inform the system about in which magazine and type of
magazine (tape, vibrator, or tray) the components can be found
and where the magazines are located. The lists include also such
information as component angles and quantities.

• Mount Lists (group)

Mount lists on different levels for PCBs, panels, and layouts,
indicating which components are to be mounted and where they
are to be placed

PACKAGE LIST COMPONENT LIST MOUNT LISTS MAGAZINE LISTS

Package data Where components are to Where components are to be
Component data found
be placed

MOUNTING

This chapter describes the Magazine Lists, one of the main list
groups necessary for mounting a board.

The other mandatory lists or list groups are described in Chapter 4,

Chapter 5 and Chapter 7.

Additional lists for such features as fiducial marks, adhesive

application and user access are found in Chapter 8.

Special characters
National special characters and some non-letter/non-figure
characters cannot be entered into the system, for instance in board
names and layout names.

The following special characters are, however, allowed to be used:

"'`\$;^@

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Magazine Lists MYDATA automation AB

Magazine types
There are several magazine types that can be used in the MYDATA
placement machines. Each of which has a magazine list in TPSys.
These magazine lists are involved in the programming work and are
thus described in this chapter.

We describe the following in this chapter:

• Removable feeders
The Agilis feeder is an intelligent, removable unit in which you can
load the component tape before inserting it into the magazine. The
feeders can easily be moved from one feeder position to another.

The Removable Feeder List Editor is described on page 6-4.

• Tape and Vibratory Magazines

Tape and vibratory magazines which are inserted into the
magazine positions of the machine. Tape magazines are either
Agilis magazines or TM magazines. The TM magazine is marked
'A' in Figure 6-1. Figure 6-2 shows Agilis linear (ALM) and
non-linear (AM) magazines.

The Tape and Vibratory Magazine List is described on page 6-7.

• Y-Wagon Magazine
Component trays placed onto the standard assembly table of the
Y wagon. The Y-Wagon Magazine is marked 'B' in Figure 6-1.

The Y-Wagon Magazine List is described on page 6-17.

• Tray Wagon Magazine

Component trays placed on a Tray Wagon Magazine, which has a
Y movement of its own. The Tray Wagon Magazine is marked 'C' in
Figure 6-1.

The Tray Wagon Magazine List is described on page 6-30.

• TEX Tray Exchanger

A separate tray magazine (see the figure) that is placed in front of
the machine is able to store 32 JEDEC trays, which are moved to
the machine pick line by means of two parallel and separately
controlled tray tracks.

The TEX occupies two ordinary magazine positions. Several TEX

units can be used in the same placement machine.

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Figure 6-1. Magazine types

The magazines shown in Figure 6-1 are applied to a type TP9-UFP

machine, but they can be used on all the MYDATA machine types.
The same applies to Aglis magazines.

Figure 6-2. Agilis magazines

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Removable Feeder List Editor

Selecting the Removable Feeders option in the Magazine menu
opens the Removable Feeder List Editor.

The Removable Feeder List Editor is shown in Figure 6-3.

Function Keys in the Removable Feeder List Editor:

Edit removable feeder

By pressing <Enter> the contents of the highlighted removable
feeder can be updated.
Enter

Delete
The highlighted feeder can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box, provided the feeder is not
inserted in a magazine that is inserted in a machine.

Clear component data

Pressing <F7> clears the contents of the highlighted feeder.
F7

Edit feeder header

By pressing <F2> the highlighted feeder header information in the
F2
Removable feeder header box can be edited.

Toggle sort order

By pressing <Space> the sort order in the Removable feeders list is
changed.

The default sort order is alphabetical, sorted by feeder name (see

Figure 6-3). By pressing <Space> once, the sort order is changed to
show all feeders inserted in magazines or machines first, also sorted
by name. Removable feeders not inserted in magazines or machines
come last.

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* REMOVABLE FEEDER LIST EDITOR *

Removable Feeders
*1: 1206 (537) Enter Edit removable feeder
2: (526) Del Delete
3: (539) F7 Clear component data
4: (538) F2 Edit feeder header
5: (505) Space Toggle sort order
6: (507)

Component: 1206
Package: 1206-05
Comment:
Batch ID:
Angle: 90.00°
Quantity: 0 Alarm: 0

Type:
Name:
Comment:
Step length:

Brian 13:52

Figure 6-3. Removable Feeder List Editor

Entries in the Removable Feeder List Editor:

Removable Feeders
This list shows the removable feeders in the machine system, and in
the machine network if shared databases are used. The magazines
they are inserted in are shown in brackets, if inserted in a machine.
No position number is shown for feeders registered but not inserted.

Feeder information box

The feeder information box in the lower right part of the Removable
Feeder Editor window contains data for the highlighted feeder.

Component
The name of the component in the highlighted feeder. The name is
referred to in the Component List.

You can change a component by selecting from the Component List,

which is opened by entering the first characters of the component
name and pressing <Enter>.

Package
The package type of the highlighted component.

Comment
User comment text read from the Component List.

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Batch ID
This field is intended for component batch number found on, for
instance, the tape reel, plastic tube, storage box or delivery note.

The batch number can either be typed into this field or read, using a
TPSys bar code reader.

Angle
0° The component angle in the feeder, see the figure.
1

270/-90° 90°
Quantity
The component quantity in the highlighted feeder.
180°
The quantity is to be updated when loading the removable feeder.
The value is then counted down each time a component is taken. The
remaining number of components is indicated in this field. The
quantity can either be typed into this field or read by using a TPSys
bar code reader.

Alarm
The component quantity level at which the operator is notified in the
Operator alerts box that the magazine feeder is low on components.
The quantity can be set in this window.

This feature can be enabled or disabled by setting the 84.0500 Alarm

on reels parameter to Yes or No. When disabled, this entry is not
shown in the magazine feeder window.

Type
The type of the highlighted removable feeder.

Name
The feeders name,for instance AF00167823.

Comment
User comment for the highlighted feeder.

Step length
The length of tape advanced per step is defined by this setting. The
step length is expressed in mm.

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MYDATA automation AB Magazine Lists

Tape and Vibratory Magazine List

The Tape and Vibratory Magazine List is opened by selecting the
Magazines option in the Magazine menu.

The Tape and Vibratory Magazine List Editor is shown in Figure 6-4.

Function keys in the Tape and Vibratory Magazine List Editor:

Edit feeder contents

By pressing <Enter> the contents of the highlighted magazine can
be updated, see page 6-11.
Enter
Delete magazine
The highlighted magazine can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box, provided the magazine is not
inserted in the machine. All magazine information is erased if the
magazine is deleted.

Locate magazine
By pressing <Ctrl>+<F1>, the X position of the highlighted
F1
Ctrl magazine is calibrated using automatic fiducial mark search. If the
automatic fiducial mark search fails, you can center the fiducial mark
manually. Further information is found in the Locate All Magazines
section under Magazine in Appendix B – Menu Reference Guide.

Edit magazine name/barcode

The highlighted magazine can be renamed and the bar code can be
F2
changed by pressing <F2> and typing a new name or reading a new
bar code (see below).

Vibrate magazine
To vibrate an inserted vibratory magazine, select magazine and press
F5
<F5>.

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* MAGAZINE LIST EDITOR *

Magazines
Enter Edit feeder contents
Audio (3)
Del Delete magazine
RGB (6)
Ctrl+F1 Locate magazine
TM8C-1234
F2 Edit magazine name/barcode
Video (8)
F5 Vibrate magazine
Ctrl+F5 Vibrate all magazines
Space Toggle sort order

Name: Video
Barcode: 5001
Fiducial mark:
Type: ALM8
Serial No.: 10511
No. of feeders: 16

Brian 13:54

Figure 6-4. Tape and vibrator Magazine List Editor

Vibrate all magazines

To vibrate all inserted vibratory magazines, press <Ctrl>+<F5>.
Ctrl F5

Toggle sort order

By pressing <Space> the sort order in the Magazines list is changed.

The default sort order is alphabetical (see Figure 6-4).

By pressing <Space> once, the sort order is changed to show all

magazines inserted in the machine, sorted by magazine positions.
These magazines are followed by magazines inserted in other
machines, sorted by machine and magazine positions.

By pressing <Space> again, the sort order is changed to show those

magazines which contain components included in the loaded layout.

Exit
Press <Esc> if you want to exit this window and return to the main
Esc
window.

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MYDATA automation AB Magazine Lists

Entries in the Magazine List Editor:

Magazines
This box shows the magazines in the machine system, and in the
machine network, if shared databases are used. The magazine
position numbers are shown in brackets, if inserted in the machine.
No position number is shown for magazines registered but not
inserted, see TM8C-1234 in Figure 6-4.

Figure 6-4 shows a machine with four registered magazines, three of

which are inserted.
() If shared databases are used, then the machine number is also shown
in brackets for magazines inserted in other machines, for instance
(tp9n491/8) if the magazine is inserted in magazine position 8 in a
TP9 machine with serial number 491.
* An asterisk (*) indicates that the magazine contains components
included in the currently loaded layout.

Magazine information box

The magazine information box in the lower part of the Magazine List
Editor window contains data for the highlighted magazine, which is
is read from the magazine and thus not editable, except for the
magazine name and the bar code which can be changed after pressing
<F2>.

Name
User name of the magazine. If no user name is assigned, this field
shows the magazine type followed by the serial number, for instance
TM8C-1234.

You can rename the highlighted magazine after pressing the <F2>
key.

Barcode
A bar code reader can be used, for example, to select magazine when
loading or refilling components. The bar codes, which are unique to
each TM8 magazine, are printed on the magazine bar code labels.
These unique codes can be linked to the user magazine names. In
Figure 6-4 the bar code 5001 is linked to the Video magazine.

Bar code reading is described in the Barcode Readers section in

Chapter 5 of the Operator’s Manual.

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Fiducial mark
Indicates if automatic magazine fiducial mark search is active or not.

Type
The magazine type, for instance VM for vibratory magazines, TM for
8mm tape magazines or ALM8 for Agilis Linear M8. The magazine
type is read from the magazine and cannot be changed in this box.

Serial No.
Shows the magazine serial number. The serial number is read from
the magazine and cannot be changed in this box.

No. of feeders
Shows the number of feeders in the magazine, for instance 16 for an
8mm tape magazine and 30 for a vibratory magazine. The feeder
number is read from the magazine and cannot be changed in this box.

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Tape Magazine Contents

By pressing <Enter> in the Tape and Vibratory Magazine List
Editor (page 6-8), a tape magazine contents window is opened.

The tape magazine contents window is shown in Figure 6-5.

Function keys in the tape magazine contents window:

Edit/insert component
By pressing <Enter> the highlighted feeder load information can be
changed or updated.
Enter
Clear component data
The highlighted component can be removed from the list by pressing
F7
<F7> and confirming the deletion in a popup box.

Adjust pick position

The feeder pick position can be calibrated by pressing <F1>. The
F1
procedure is described in the Manually Calibrating Pick Positions
section in Chapter 5 of the Operator's Manual.

For Agilis magazines, the feeder list will show only removable feeders
that are inserted in the magazine. The component name is shown in
brackets.

However, in this case the system will go directly to the feeder that
contains the highlighted component.

Locate magazine
By pressing <Ctrl>+<F1>, the X position of the current magazine
F1
Ctrl is calibrated using automatic fiducial mark search. The Y position is
adjusted mechanically, see Pick Line Adjustment – Agilis AM8 in
Chapter 5 of the Operators Manual for Agilis magazines and the
Machine Manual for TM magazines. If the automatic fiducial mark
search fails, you can center the fiducial mark manually. Further
information is found in the Locate All Magazines section under
Magazine in Appendix B – Menu Reference Guide.

Clear component data for all feeders

A magazine can be cleared from all components by pressing <F9>
F9
and confirming the deletion in a popup box.

Copy feeder contents

The magazine feeder contents can be copied from another magazine
F9
by pressing <Shift>+<F9> and typing the magazine name to copy
from in a popup box (or pressing <Tab> or <Enter> and selecting
magazine from a popup magazine list).

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* FEEDER CONTENTS FOR MAGAZINE Video *

Pos.: component
Enter Edit/insert component
* 1: 000149
F7 Clear component data
2: 000254
F9 Clear component data for all feeders
3: 000255
Shift+F9 Copy feeder contents
4: 000501
Ctrl+F1 Locate magazine
5: 000502
F1 Adjust pick position
6: 000503
Space Toggle component/comment/package
7:
8:
9:
10:
11:
12:
13: Component: 000149
14: Package: 1206-06
15: Comment: 100pF
16: Batch ID: 123456789
Angle: 0.00°
Quantity:1338 Alarm: 100

Step length: 1mm

Brian 13:56

Figure 6-5. Tape magazine contents

Toggle component/comment/package
By pressing <Space> the Pos.: component box, indicating component
names, is changed to Pos.: comment indicating component
comments. A second press on the <Space> bar changes to Pos.:
package indicating packages. A third press shows the component
names again.

Exit
Press <Esc> if you want to exit this window and return to the
Esc
Magazine List Editor (page 6-8).
Entries in the magazine contents window:

Pos.: component, Pos.: comment, Pos.: package

This box shows the components loaded in each magazine feeder. The
component names, component comments, or component packages
can be displayed by pressing <Space>.
* An asterisk (*) in the first position of a line indicates that the feeder
is loaded with a component included in the currently loaded layout.

Component
The name of the highlighted component in the feeder list. The
component name is referred to in the Component List.

You can search for a component from the Component List, which is
opened by entering the first characters of the component name and
pressing <Enter>, or by simply pressing <Enter>.

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Package
Package name set in the Component List.

Comment
User comment text read from the Component List.

Batch ID
This field is intended for component batch number found on, for
instance, the tape reel, plastic tube, storage box or delivery note.

The batch number can be either typed into this field or read using a
TPSys bar code reader.

The TPSys bar code reader is described in the Barcode Readers

section in Chapter 5 of the Operator's Manual.

Angle
0° The component angle in the feeder, see the figure.
1

270/-90° 90°
Quantity
The component quantity for the feeder.
180°
The quantity is to be updated when loading the magazine feeder. The
value is then counted down each time a component is taken from the
feeder. Remaining parts are thus indicated in this field.

The quantity can be either typed into this field or read using a TPSys
bar code reader.

The TPSys bar code reader is described in the Barcode Readers

section in Chapter 5 of the Operator's Manual.

Alarm
The component quantity level at which the operator is notified in the
Operator Alerts box that the magazine feeder is low on components.

This feature can be enabled or disabled by setting the 84.0500 Alarm

on reels parameter to Yes or No. When disabled, this entry is not
shown in the magazine feeder window.

Step length
The length of tape advanced per step is defined by this setting. The
step length is expressed in mm.

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Magazine Lists MYDATA automation AB

The Agilis Magazine

The Agilis magazine contents window has the same entries as the
tape magazine window, except for some entries related to removable
feeders detailed below

* FEEDER CONTENTS FOR MAGAZINE AM8-3013 *

Pos.: component (feeder)
Enter Edit removable feeder
9: (AF 0016777239)
Del Remove feeder
8: (AF 0016777241)
F8 Remove all feeders
F7 Clear component data
F9 Clear component data for all feeders
Ctrl+F1 Locate magazine
F1 Adjust pick position
F2 Edit feeder header
Space Toggle component/comment/package
Component: 0016777239
Package:
Comment:
Batch ID:
Angle: 90.00°
Quantity: 0 Alarm: --

Type: Agilis F8 4.7

Name:
Comment:
Step length: 1mm

Brian 13:58

Figure 6-6. Tape magazine contents

Remove all feeders

Removes all feeders from a magazine provided the magazine is not
F8
inserted in the machine.

Clear component data

Deletes component from feeder.
F7

Edit feeder header

By pressing <F2> the highlighted feeder header information in the
F2
Removable feeder header box can be edited.

Entries in the magazine contents window:

Type
The type of highlighted removable feeder.

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Name
The name of the highlighted removable feeder. The default name is
the serial number, but this can be changed.

Comment
User comment for the highlighted feeder.

Step length
Number of tape advancement per component feed expresse in mm.

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Magazine Lists MYDATA automation AB

Vibratory Magazine Contents

The vibratory magazine contents window has the same entries as the
tape magazine window, except for some vibratory related entries
detailed below.

Component: MB1501PF
Package:
Comment: PLL
Batch ID: 123456789
Angle: 0.00°
Quantity:13 Alarm: 5

Amplitude: 10
Duration: 1000
Frequency: 57

Amplitude
Vibrator amplitude value. The setting range is 0 – 127. This setting
affect all feeders in a group.

Duration
Vibration time in ms. The setting range is 0 – 6000ms (0 – 6 seconds).
This is set for each individual feeders

Frequency
Vibrator frequency in Hz. The setting range is 10 – 99Hz. This
setting affect all feeders in a group.

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Y-Wagon Magazine List

The Y-Wagon Magazine List is used for component trays placed on
the manual assembly table, see 'B' in Figure 6-1 on page 6-3.
A structure diagram of the The list is opened by selecting Magazine > Y Wagon Magazine >
Y-Wagon Magazine List is Trays.
found on page 6-29.
The second option, Tray Positions is used to define and store fixed
tray positions on the assembly table, see page 6-25.

The Y-Wagon Magazine List Editor is shown in Figure 6-7.

Function keys in the Y-Wagon Magazine List Editor:

Edit tray
By pressing <Enter> the highlighted tray can be modified.

Enter

Insert new
A new tray can be added to the tray list by pressing <Ins>, and then
Ins
select component and tray type. The new tray gets the same name as
the selected component plus an order number.

Delete
The highlighted tray can be deleted from the trays list by pressing
Del
<Del> and confirming the deletion in a popup box.

Locate position
The tray position on the assembly table can be located by positioning
F1
two tray corners, two components on the tray, or two fiducial marks.
To locate the tray, press <F7> when the Position field is highlighted,
see page 6-23.

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Magazine Lists MYDATA automation AB

* Y-WAGON MAGAZINE EDITOR *

Trays By Name
Enter Edit tray Space Toggle sort order
4 ABC111(my9n476)
Ins Insert new F6 Reload
- 1 ABC123
Del Delete F7 Remove from magazine
* 2 ABC123
F1 Locate position F8 Remove all from magazine
* 3ABC123(my12n123)
Tray Information
Name/barcode: ABC111
Component: QFP120
Package: ASIC-32
Comment:
Batch ID:
Component angle: 0.00º
Tray type: QFP120-3*8
Quantity: 14 Alarm: 5
Auto refill: Yes

Machine: my9n476
Position: * UNKNOWN *
First component location: ---
Lower left corner: 92.642mm/ 221.673mm
Upper right corner: 117.331mm/ 245.746mm

Brian 14:13

Figure 6-7. Y-Wagon Magazine List Editor

Toggle sort order

Toggle the sort order in the list.

Reload
The component quantity for the highlighted tray can be updated by
F6
pressing <F6> and confirming or changing in a dialog box, see
Quantity below.

Remove from magazine

Remove a tray (make not present) by highlighting it and press <F7>.
F7

Remove all from magazine

F8
Removes all trays from a magazine.

Exit
Press <Esc> if you want to exit this window and return to the Y
Esc
Wagon Magazine sub menu.

Press <Esc> twice to return to the main window.

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Entries in the Y-Wagon Magazine List Editor:

Trays By Name
This box contains defined trays. A tray is defined by pressing <Ins>,
selecting a component from the Component List and selecting a tray
from the Tray Type List. In the first position of the list, one of the
following characters can be shown:

* The tray is marked as present on the assembly table.

– The tray is marked as present but empty.
! A pick error has occurred.

No character in the first position indicates that the tray is

non-present on the assembly table. The system does not pick from
such a tray.

Figure 6-7 shows one non-present tray and three present trays, one
of which is empty. As a tray can be shared with other machines, the
serial number of the machine where it is loaded is displayed.

Tray Information
This box contains information about the highlighted tray.

Name/barcode
You can search for a component from the Component List, which is
opened by entering the first characters of the component name and
pressing <Enter>, or by simply pressing <Enter>.

New components can be defined and added to the Component List if

you choose to select from list.

Component
Component that is loaded in the tray.

Package
The components package type.

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Comment
User comment text read from the Component List.

Batch ID
This field is intended for component batch number found on, for
instance, the tray, storage box or delivery note.

The batch number can be either typed into this field or read using a
TPSys bar code reader.

The TPSys bar code reader is described in the Barcode Readers

section in Chapter 5 of the Operator's Manual.

Component angle
0° The component angle referred to the tray, see the figure.

270/-90° 90°

180° Tray type

Tray type referred to in the Tray Type List (page 6-42).

You can search for a tray from the Tray Type List, which is opened
by entering the first characters of the tray type name and pressing
<Enter>, or by simply pressing <Enter>. You have to open the Tray
Type List to define tray types, see page 6-42.

Quantity
The component quantity for the tray.
F6
To update the quantity, press <F6> and confirm or change the
quantity value in the dialog box:

Reload tray
Component: ABC123
Tray type: QFP208-3*8
Quantity: 24
Batch ID: 123456789

The quantity is counted down each time a component is picked from

the tray. So, the quantity field indicates always the remaining
number of components on the tray.

Maximum quantity is defined by the row and column numbers in the

Tray Type List.

If you set a less quantity than full tray, for instance 10 for a 3 x 8
tray, then the system starts picking after the missing components, in
this case from component number 15. The component numbers on
the tray are shown in Figure 6-28 on page 6-48.

You can also set negative numbers, which means the number of
missing components on the tray. If you set –3 for a 3 x 8 tray, then
the system will pick 21 components, starting from number 4.

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Alarm
The component quantity level at which the operator is notified in the
Operator Alerts box that the magazine is low on components.

Auto refill
Enables or disables messages when trays are out of components.

Yes – If the tray is marked as present (*), then a dialog box is

shown that calls the operator's attention to refill the tray.

No – No dialog box is shown.

To toggle between Yes and No press <Space>.

Position
A newly inserted tray has an unknown position indicated with the
text: * UNKNOWN *.

To locate the tray, you can either use the camera, or select a
pre-defined position from the Y-Wagon Position List.
Locate the tray using the To locate the tray using the camera, press <F1> and select two
camera ... corners, first and last component, or two fiducial marks for
positioning, see page 6-23.

The following text is displayed after the tray has been located on the
assembly table using the camera:

Position: * LOCATED *

... or select a pre-defined To make the use of trays more convenient and fast, defined tray
position. positions on the assembly table can be saved and stored in the
Y-Wagon Position List (page 6-25).

To use a pre-defined position from the Y-Wagon Position List, enter

a few characters of the position name and press <Enter>, or simply
press <Enter>:

Positions By Name
* UNKNOWN *
Point 1
Table corner

Choose position and press <Enter>.

... or using a bar code reader Scan the tray name barcode and then scan a tray position barcode
belonging to the machine in question.

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Magazine Lists MYDATA automation AB

Enter the tray angle on the assembly table by selecting the

appropriate option for the first component on the tray.

If the Table corner position was selected, then the position is shown
like this:

Position: Table corner

Lower left corner

The current X/Y coordinates of the lower left tray corner.

Upper right corner

The current X/Y coordinates of the upper right tray corner.

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Locating Trays on the Assembly Table

A tray on the assembly table is located manually by positioning two
tray corners, two components on the tray (if defined, see below), or
two fiducial marks (if defined, see below). This is carried out when
Position in the Y-Wagon Magazine Editor (page 6-18) is highlighted.

Press <F1> and choose whether you want to locate the tray by
F1
positioning corners, fiducial marks, or components:

Select Points To Use

Tray corners
First and last component position
Fiducial marks

The First and last component position option is shown only if the tray
is defined in the Tray Type List, see page 6-42.

The Fiducial marks option is shown only if Fiducial marks exist is set
to Yes in the Tray Type List, see page 6-43.

If a tray contains big components, then use the corners or fiducial

marks, if defined. But, if the components are small or the tray has
bad corners, then use first and last component.

The tray shown in the following figures is defined in the Tray Type
List on page 6-48.

Tray corners
Figure 6-8 shows the cross hairs on the lower left corner at the first
component (1), and on the upper right corner at the last component
(2).

2
ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

1 ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

Figure 6-8. Positioning two tray corners

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First and last component position

Figure 6-9 shows the cross hairs on the first component (1) and on
the last component (2).

The tray is located by centering the cross hairs on the center of the
components and on those leads which are defined in the Toggle leads
field in the Package List. Change leads by pressing the <F3> key.

When positioning the first component, the system does not know at
what angle the tray, and thus the component, is. This means that the
toggle-lead function may behave a bit strangely.

ABC
123
ABC
123
ABC
123
ABC
123
ABC
123
ABC
123
ABC
123
ABC
123 2
ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123 123 123 123

1 ABC
123
ABC
123
ABC
123
ABC
123
ABC
123
ABC
123
ABC
123
ABC
123

Figure 6-9. Positioning first and last component

Fiducial marks
Figure 6-10 shows the cross hairs on the first fiducial mark (1) and
on the second fiducial mark (2).

2
ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

1 123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

Figure 6-10. Positioning fiducial marks

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Y-Wagon Position List

To reduce the locating time for tray positions, a Y-Wagon Position
List feature lets you pre-define and store several tray positions,
which can be used directly with no camera location.
Define a point ... By defining a point somewhere on the Y-wagon assembly table and
place one of the tray corners at this point, the tray position is settled.
... put a tray corner at the
point ...

... and tell the system which The system must, however, get information about which corner you
corner. That's all. have placed at the defined point.

Figure 6-11 shows the lower left tray corner placed at the lower left
assembly table corner.

ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123

Figure 6-11. Tray at the lower left table corner

To be able to define a point on the assembly table and select a tray corner,
open the Y-Wagon Position List by selecting the Trays option in the
Magazine menu and then Tray Positions.
Bar code scanning ... Inserting pallet trays via the hand held barcode scanner is possible by
scanning the tray name followed by a scanning of a tray position barcode.

The Y-Wagon Position List window is shown in Figure 6-12.

Function keys in the Y-Wagon Position List window:

Edit tray position

By pressing <Enter> the highlighted position can be modified.

Enter

Insert new
A new position is created and added to the Positions By Name list
Ins
after pressing <Ins> and entering a new name.

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Magazine Lists MYDATA automation AB

* Y WAGON POSITION LIST *

Positions By Name
Enter Edit tray position
Point 1
Ins Insert new
Table corner
Del Delete

Position Information
Name: Table corner
Tray: Lower left
Corner at: 86.811mm/ 0.746mm

Brian 14:19

Figure 6-12. Y-Wagon Position List

Delete
The highlighted position is deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Exit
Press <Esc> if you want to exit this window and return to the Y
Esc
Wagon Magazine sub menu.

Press <Esc> twice to return to the main window.

Entries in the Y-Wagon Position List window:

Positions By Name
This box contains the user's names of pre-defined positions.

Position Information
This box contains information about the highlighted position.

Name
Position name, which must be a unique name or number for each
position.

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Tray
Indicates which tray corner to be placed on the defined position
point.

Press <Space> and choose the appropriate corner from the popup
menu shown:

Lower left
Upper left
Upper right
Lower right

Figure 6-13 shows the four corner options: Lower left (1), Upper left (2),
Upper right (3), and Lower right (4).

3 4

Figure 6-13. Tray corner at position point

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As shown in Figure 6-13 the lower left corner is always the lower left
corner, no matter how the tray is turned, and the upper left corner is
always the upper left corner, no matter how the tray is turned.

Tray angles are restricted to 0° (or 180°) and 90° (or –90°/270°).

Corner at
The coordinates of the position point on the assembly table.

Press <F1> and center the cross hairs on the selected position point.
F1
If you have a tray in the selected position, you can center the cross
hairs on the tray corner.

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The Structure of the Y-Wagon Magazine List

The structure of the Y-Wagon Magazine List is shown in Figure 6-14.

* PACKAGE LIST EDITOR *

Packages
* COMPONENT LIST EDITOR * Y-wagon assembly
QFP120 table
QFP196
QFP208 Components

ABC111
ABC123
ABC125

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123
ABC ABC ABC ABC ABC
1
2
* TRAY TYPE LIST EDITOR * * Y-WAGON MAGAZINE EDITOR *

3
123 123 123 123 123
ABC ABC ABC ABC ABC
Tray Types Tray Information 1
QFP120-8x3 Name/barc
ode

22
QFP144-8x3
QFP208-8x3 0° Component

23 24
Batch ID
24 Component
angle
Quantity
Position
* Y WAGON POSITION LIST *

Positions By Name First component location

Table corner Lower right

Figure 6-14. Y-Wagon Magazine List structure

Figure 6-14 shows the following example:

Component – Component – A tray that contains ABC123 type components in QFP208 packages.
Batch ID – Quantity. The component angle is 0° referred to the tray, and there are 24
components in a full tray.
Tray type – Position. The tray used is a QFP208-8x3 type tray and it is placed at the lower
right corner of the Y-wagon assembly table.

The first component is located at the upper left corner of the tray.
The tray angle is thus 90°.

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Tray Wagon Magazine List

The Tray Wagon Magazine List is used for trays placed on a Tray
Wagon Magazine, which has a Y movement of its own, see
Figure 6-15.

Figure 6-15. Tray Wagon Magazine

Installation and loading instructions for the Tray Wagon Magazine is

found in the Operator's Manual, Chapter 5.

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A structure diagram of the The Tray Wagon Magazine List is opened by selecting Magazine >
Tray Wagon Magazine List is Tray Wagon Magazine > Trays.
found on page 6-33.
The second option, Tray Positions is used to define and store fixed
tray positions on the Tray Wagon Magazine table, see page 6-32.
The Tray Wagon Magazine List has the same entries and
functionality as the Y-Wagon Magazine List. So, the description on
page 6-17 (to page 6-22) is applicable also to this list. However, the
trays are placed on the tray wagon table in this case, not on the
Y-Wagon assembly table.

Locating Trays on the Tray Wagon

A tray on the tray wagon is located manually by positioning two tray
corners, two components on the tray (if defined), or two fiducial
marks (if defined). This is carried out when Position in the Tray
Wagon Magazine Editor (see above) is highlighted.

Press <F1> and choose if you want to locate the tray by positioning
F1
corners, components, or fiducial marks in the same way as described
for the Y-Wagon Magazine on page 6-23.

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Tray Wagon Position List

To reduce the locating time for trays, a Tray Wagon Position List
feature lets you pre-define and store several tray positions. Hereby
there is no need to locate them with the aid of a camera.
Define a point ... By defining a point somewhere on the tray wagon table and place one
of the tray corners at this point, the tray position is settled.
... put a tray corner at the
point ...

... and tell the system which The system must, however, get information about which corner you
corner. That's all. have placed at the defined point.

Figure 6-16 shows the lower left tray corner placed at the lower left
tray wagon table corner.

ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123

Figure 6-16. Tray at the lower left table corner

To be able to define a point on the tray wagon table and select a tray
corner, open the Tray Wagon Position List by selecting the Tray
Wagon Magazine option in the Magazine menu and then Tray
Positions.
Bar code scanning ... Inserting pallet trays via the hand held barcode scanner is possible by
scanning the tray name followed by a scanning of a tray position barcode.

The Tray Wagon Position List has the same entries and functionality
as the Y-Wagon Position List. So, the description on page 6-25 (to
page 6-28) is applicable also to this list.

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The Structure of the Tray Wagon Magazine List

The structure of the Tray Wagon Magazine List is shown in
Figure 6-17.

* PACKAGE LIST EDITOR *

Packages
* COMPONENT LIST EDITOR * Tray wagon table
QFP120
QFP196
QFP208 Components

ABC111
ABC123
ABC125

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123
ABC ABC ABC ABC ABC
1
2
* TRAY TYPE LIST EDITOR * * TRAY WAGON MAGAZINE EDITOR *

3
123 123 123 123 123
ABC ABC ABC ABC ABC
Tray Types Tray Information 1
QFP120-8x3 Name/barc

22
QFP144-8x3 ode
QFP208-8x3 0° Component

23 24
Batch ID
24 Component
angle
Quantity
Position
* TRAY WAGON POSITION LIST *

Positions By Name First component location

Table corner Lower right

Figure 6-17. Tray Wagon Magazine List structure

Figure 6-17 shows the following example:

Component – Component – A tray that contains ABC123 type components in QFP208 packages.
Batch ID – Quantity. The component angle is 0° referred to the tray, and there are 24
components in a full tray.
Tray type – Position. The tray used is a QFP208-8x3 type tray and it is placed at the lower
right corner of the tray wagon table.

The first component is located at the upper left corner of the tray.
The tray angle is thus 90°.

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Pallet Magazine List

The Pallet Magazine List is used by the TEX Tray Exchanger
(Figure 6-18). This unit handles and stores component trays placed
on pallets.

Figure 6-18. TEX Tray Exchanger

Further information about the unit and how to handle it is found in

the Operator's Manual.
A structure diagram of the The Pallet Magazine List is opened by selecting Pallet Magazine >
Pallet Magazine List is found Magazine > Trays.
on page 6-41.
The other options in the submenu is used as follows:
• Pallets is used to define pallets, see page 6-36.
• Trays opens the Pallet Magazine List Editor, see below.
• Tray Positions is used for defining and storing defined tray
positions, see page 6-39.

The Pallet Magazine List has, with some exception, the same entries
and functionality as the Y-Wagon Magazine List. So, the description
on page 6-17 (to page 6-22) is applicable also to this list. However, the
trays are placed on pallets in this case, not on the Y-wagon assembly
table.

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Entries specific for the Pallet Magazine List are:

Pallet
Pallet referred to in the Pallet List (page 6-36). This pallet is used for
the highlighted tray and it is shown in brackets after the component
name in the trays list.

In the Pallet field, the highlighted tray can be assigned to a new pallet
(for instance a TEX pallet with a different bar code). You can search
for this pallet from the Pallet List, which is opened by entering the
first characters of the pallet name and pressing <Enter>, or by
simply pressing <Enter>.

Locating Trays on the Pallets

A tray on a pallet is located by positioning two tray corners, two
components on the tray (if defined), or two fiducial marks (if
defined). This is carried out when Position in the Pallet Magazine
List Editor (see above) is highlighted.

Press <F1> and choose if you want to locate the tray by positioning
F1
corners, components, fiducial marks, or scan barcodes in the same
way as described for the Y-Wagon Magazine on page 6-23.

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Pallet List
A structure diagram of the The purpose of the Pallet List is to assign individual names to pallets
Tray Pallet Magazine List is and store these names and position data. The system can then use
found on page 6-41. these pallet data for instance after removing the pallets for refilling
or changing over to other boards to assemble.

Pallets must be defined in the Pallet List to be used, see the Pallet
entry on page 6-35. The TEX unit automatically scans and enters
available pallets to the list. The pallets can then be renamed in the
Pallet List window.

The Pallet List is opened by selecting Pallet Magazine and Pallets

in the Magazine menu.

The Pallet List Editor is shown in Figure 6-19.

Function keys in the Pallet List Editor window:

Edit pallet
By pressing <Enter> the highlighted pallet can be modified.

Enter

Delete
The highlighted pallet is deleted from the pallets list by pressing
Del
<Del> and confirming the deletion in a popup box.

Toggle sort order

The pallet list can be sorted in alphabetic order or according to the
TEX unit and the slot position. Press <Space> to toggle the sort
order.

Exit
Press <Esc> if you want to exit this window and return to the Pallet
Esc
Magazine sub menu.

Press <Esc> twice to return to the main window.

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MYDATA automation AB Magazine Lists

* PALLET LIST EDITOR *

Pallets
Enter Edit pallet
TE-1 (7)
Del Delete
TE-2
Space Toggle sort order
TE-3 (1)
TE-4 (2)
TE-5
TE-6 (6)
TE-7
TE-8
XS-S1242 (TEX1/7/8)
XS-S1253 (TEX1/7/11)
XS-S1662 (TEX1/8/14)
XS-S1664
XS-S1666

Name: XS-S1242
Type: XS
Barcode: S1242

Brian 14:44

Figure 6-19. Pallet List

Entry in the Pallet List Editor:

Pallets
This box lists defined pallets in the system, and in the TPSys
network, if shared databases are used. The magazine position
numbers are shown in brackets. No position number is shown for
pallets defined but not inserted or scanned by the TEX unit.

New TE pallets are inserted by pressing <Ins>. New XS and XD

pallets are automatically inserted as they are scanned by the TEX
unit.

Figure 6-19 shows a machine with 13 defined pallets:

– Eight TE pallets, four of which are inserted.

– Five XS pallets, three of which are inserted and recognized by

TEX unit number 1.

The selected XS-S1242 (TEX1/7/8) pallet, is inserted in TEX unit

number 1, magazine position number 7, and TEX cassette slot
number 8.

If shared databases are used, then the machine number is also shown
in brackets for pallets inserted in other machines, for instance
(tp9n491/8) if the pallet is inserted in magazine position 8 in a TP9
machine with serial number 491.

Name
The selected pallet can be given a name after pressing <Enter>.

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Magazine Lists MYDATA automation AB

Type
Pallets are classified in three different types:

XS – Standard pallet for the TEX unit with two cassettes. This
type can only be inserted by the TEX unit.

XD – Double width pallet for the TEX unit with one cassette. This
type can only be inserted by the TEX unit.

TE – Pallet used in the Tray Elevator Magazine. This type can be

inserted in the Pallet List Editor.

The information in this field cannot be edited.

Barcode
Bar codes are generated automatically for XS and XD pallets as the
TEX unit scans the bar codes on the pallets.

Bar codes are not used for TE pallets.

The bar codes cannot be edited.

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Pallet Position List

To reduce the locating time for tray positions, a Pallet Position List
feature lets you pre-define and store several tray positions, which can
be used directly with no camera location.
Define a point ... By defining a point somewhere on the pallet and place one of the tray
corners at this point, the tray position is settled.
... put a tray corner at the
point ...

... and tell the system which The system must, however, get information about which corner you
corner. That's all. have placed at the defined point.

Figure 6-20 shows the lower left tray corner placed at the lower left
pallet corner.

ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123
ABC

ABC

ABC
123

123

123

Figure 6-20. Tray at the lower left pallet

To be able to define a point on the pallet and select a tray corner,

open the Pallet Position List by selecting the Pallet Magazine
option in the Magazine menu and then Tray Positions.

The Pallet Position List window is shown in Figure 6-21.

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Magazine Lists MYDATA automation AB

* PALLET POSITION LIST *

Positions By Name
Enter Edit tray position
Pallet corner
Ins Insert new
Del Delete

Position Information
Name: Pallet corner
Tray: Lower left
Corner at: 86.816mm/ 0.748mm

Brian 15:02

Figure 6-21. Pallet Position List

The Pallet Position List has the same entries and functionality as the
Y-Wagon Position List. So, the description on page 6-25 (to
page 6-28) is applicable also to this list.

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The Structure of the Tray Pallet Magazine List

The structure of the Tray Pallet Magazine List is shown in
Figure 6-22.

* PACKAGE LIST EDITOR *

Packages
* COMPONENT LIST EDITOR *
QFP120
QFP196 Components
QFP208
ABC111 Tray on pallet
ABC123
ABC125

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123
ABC ABC ABC ABC ABC
1
2
* TRAY TYPE LIST EDITOR * * PALLET MAGAZINE EDITOR *

3
Tray Types Tray Information

123 123 123 123 123

ABC ABC ABC ABC ABC
1
QFP120-8x3 Name/barc

22
QFP144-8x3 ode
QFP208-8x3 0° Component

23 24
Batch ID
24 Component
angle
Quantity
* PALLET LIST EDITOR * Position

Pallets

TE-1
TE-2 First component location
TE-3

* PALLET POSITION LIST *

Positions
By Name
Pallet corner
Lower right

Figure 6-22. Tray Pallet Magazine List structure

Figure 6-22 shows the following example:

Component – Component – A tray that contains ABC123 type components in QFP208 packages.
Batch ID – Quantity. The component angle is 0° referred to the tray, and there are 24
components in a full tray.
Tray type – Pallet – Position. The tray used is a QFP208-8x3 type tray which is placed on a pallet
named TE-2, at the lower right corner.

The first component is located at the upper left corner of the tray.
The tray angle is thus 90°.

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Magazine Lists MYDATA automation AB

Tray Type List

The purpose of the Tray Type List is to define various types of trays
that are used for the Y-Wagon Magazine, Tray Wagon Magazine, and
TEX Tray Exchanger.

The Tray Type List is opened by selecting the Tray Type option in
the Magazine menu

The Tray Type List Editor is shown in Figure 6-23.

Function keys in the Tray Type List Editor:

Edit tray type

By pressing <Enter> the highlighted tray type can be modified.

Enter

Insert new
A new tray type can be added to the tray types list by pressing <Ins>
Ins
and enter a new name.

Delete
The highlighted tray type can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Select magazine
The default viewing area of the camera is the Y wagon, used for the
F6
Y-Wagon Magazine. Changing the viewing area to the Tray Wagon
Magazine, the TEX or to the Tray Elevator Magazine is carried out
by pressing <F6> and selecting a magazine.

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* TRAY TYPE LIST EDITOR *

Tray Types
Enter Edit tray type
QFP-208 3*8
Ins Insert new
QFP-256 3*3
Del Delete
QFP-56 5*10
F6 Select magazine
QFP-80 5*10
F7 Select package angle

Tray Type Information

Tray type name: QFP-208 3*8
Typical package: QFP208
No. of rows: 3
No. of columns: 8
Width/length: 312.784mm/ 135.589mm
Lower left component pos.: 26.657mm/ 31.156mm
Column step/row step: 36.896mm/ 36.863mm
Fiducial marks exist: Yes
First fiducial mark pos.: 11.514mm/ 8.055mm
Second fiducial mark pos.: 304.488mm/ 128.356mm

Brian 15:22

Figure 6-23. Tray Type List Editor

Select package angle

If trays are to be located using First and last component position and
F7
the component angle on the tray is not 0°, then the current
component angle must be entered by pressing <F7> and using the
Toggle lead feature.

Exit
Press <Esc> if you want to exit this window and return to the Pallet
Esc
Magazine sub menu.

Press <Esc> twice to return to the main window.

Entries in the Tray Type List Editor:

Tray Types
This box contains the names of the defined tray types. Use the arrow
keys to select a tray type.

Tray Type Information

This box contains information about the highlighted tray type.

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Tray type name

Tray type name, which has to be a unique name or number.

You can search for a tray type in the list by simply entering the first
characters of the tray type name.

Typical package
Component package referred to in the Package List.

This field must contain a package if trays are to be located by using

the First and last component position method because the Toggle
leads field in the Package List must contain information about the
package leads to be centered.

You can search for a package from the Package List by entering the
first characters of the package name and pressing <Enter>, or by
simply pressing <Enter>.

No. of rows
Number of component rows on the tray. Rows are defined in the
Y coordinate of the machine when the components are oriented in 0°.
The tray in Figure 6-28 has 3 rows. Maximum 100 rows can be
defined.

No. of columns
Number of component columns on the tray. Columns are defined in
the X coordinate of the machine. The tray in Figure 6-28 has 8
columns. Maximum 100 columns can be defined.

Width/length
Width in the X coordinate of the machine and length in the
Y coordinate. Figure 6-28 shows a 316mm x 136mm tray.

You can enter these values either by typing them from the keyboard
or by measuring with the camera. If you prefer to use the camera,
then press <F1> and center the tray corners in the order indicated
on the screen. Figure 6-24 shows the lower left corner (1), the lower
right corner (2), and the upper left corner (3).

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3
ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

1 2
Figure 6-24. Tray width and length measuring

Lower left component pos.

The position of the lower left component on the tray. This applies to
component 1 in Figure 6-28.

The coordinate values are measured from the tray corner to the
center of the component, that is 28.5mm/31mm in Figure 6-28.

You can enter the first component coordinate values by typing or by

measuring with the camera. If you prefer to use the camera, then
press <F1> and center the first component, see Figure 6-25. If the
Typical package coincides with the current package, you can center
the cross hairs on defined leads by pressing <F3>.

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

Figure 6-25. Positioning the lower left component

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Magazine Lists MYDATA automation AB

Column step/row step

The center distance between columns and rows, that is 37mm and
37mm in Figure 6-28.

These values can be entered in the same way as the lower left
component, but on the upper right component if camera is used, see
Figure 6-26. The system calculates the spacing values.

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

Figure 6-26. Positioning the upper right corner

Fiducial marks exist

Yes – The tray has two marks that can be used as fiducial marks.
The example in Figure 6-28 has two fiducial marks named
'F1' and 'F2.'

No – No fiducial marks are to be used on the tray. The two

following lines are not used if No is set in this field.

First fiducial mark pos.

The X/Y coordinates of the first fiducial mark on the tray, if exist.

If the previous Fiducial marks exist field is set to Yes, then you can
enter the X/Y coordinates of the first fiducial mark by typing or by
measuring with the camera. If you prefer to use the camera, then
press <F1> and center the cross hairs on the first fiducial mark, see
'1' in Figure 6-27.

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Second fiducial mark pos.

The X/Y coordinates of the second fiducial mark on the tray, if exist.

Repeat the previous entering by typing or with the camera, but

center the second fiducial mark, see '2' in Figure 6-27.

2
ABC ABC ABC ABC ABC ABC ABC ABC
123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

1 123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

Figure 6-27. Positioning two fiducial mark

In Figure 6-28 you will find an example of a tray definition, and

below, the corresponding tray type information box.

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Magazine Lists MYDATA automation AB

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

ABC ABC ABC ABC ABC ABC ABC ABC

123 123 123 123 123 123 123 123

F2
136
22 23 24

37
1 2 3
31
F1
0
37
0 28.5 316

Figure 6-28. QFP-3*8 tray definition example

The following tray type information box applies to the QFP-3*8 tray
shown in Figure 6-28:

Tray Type Information

Tray type name: QFP-208 3*8
Typical package: QFP208
No. of rows: 3
No. of columns: 8
Width/length: 316.054mm/ 136.091mm
Lower left component pos.: 28.503mm/ 31.014mm
Column step/row step: 37.083mm/ 37.026mm
Fiducial marks exist: Yes
First fiducial mark pos.: 11.514mm/ 8.055mm
Second fiducial mark pos.: 304.488mm/ 128.356mm

Note that these values are examples. You cannot use them for
programming a QFP-3*8 tray.

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MYDATA automation AB Magazine Lists

HYDRA Preparation
The purpose of the HYDRA preparation is to compose the contents of
a Magazine Kit which is optimized for assembling a layout using the
HYDRA unit.

The magazine preparation is carried out by simply selecting an

option in the TPSys main menu and then selecting the desired
layout.

An optimized magazine load list for the desired layout is presented in

a HYDRA Preparation Editor window. This information can also be
printed out.

After preparation, a Magazine Kit can be created, modified and

printed out. This Magazine Kit is then applied into the Magazine List
prior to assembling the layout.

A HYDRA preparation does not consider current magazine contents.

A suggestion presented is based completely on an optimized use of
the HYDRA unit. You can, however, edit the Magazine Kit
information to meet the current magazine contents if you wish.

HYDRA preparation and Magazine Kit modification can be carried

out off-line.

The HYDRA preparation can include all magazines from which the
HYDRA unit can pick components, except VMF30, Agilis LM, and
TMFlex magazines.

We recommend that MYPlan software is used for optimization. This

software handle all combinations of magazines and pick heads. Using
MYPlan will generate an optimal kit-list for all components – not
only the HYDRA components.

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Magazine Lists MYDATA automation AB

Preparing a Layout for HYDRA

• To prepare a layout for assembling using the HYDRA unit, select
the HYDRA Preparation option in the Magazine menu.

• Select the desired layout for which the magazine list is to be

prepared.

The magazine optimization is then carried out.

A HYDRA preparation dialog box that displays the result of the

preparation is shown after the preparation is completed. In this box
(shown on page 6-52) you can make modifications, print the
optimized magazine load list, and create a Magazine Kit.

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HYDRA Preparation Editor

The HYDRA Preparation Editor shows the result of a HYDRA
preparation. It is opened automatically after a completed HYDRA
preparation.

The HYDRA Preparation Editor is shown in Figure 6-29.

Function keys in the HYDRA Preparation Editor:

Feeders to use
Number of available feeders for a component can be set by pressing
<Enter> and changing the Available feeders entry in the Component
box (Figure 6-29). As the number of available feeders is changed, a
Enter
new preparation is calculated automatically.

Available feeders is described on page 6-55.

Print preparation
You can print the suggested preparation by pressing <F1>. An
F1
example of a printout is found on page 6-59.

Optimum preparation
By pressing <F2> an optimum preparation is created in which no
F2
consideration is taken to manual feeder number modification, this
preparation will thus override any previous manual input.

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* HYDRA PREPARATION EDITOR *

Count/Feeders Components
3/2 000255 Enter Feeders to use F4 Edit values
2/2 000254 F1 Print preparation
2/1 000258 F2 Optimum preparation
1/1 000149 F3 Create magazine kit
1/1 000263
Layout
1/1 000282 Layout: TV1
1/1 002216 Comment: Layout, bare board BB1
1/1 002219 Components in layout: 15
1/1 002512 HYDRA components: 13
Wrong feeder type: 0
Skipped components: 0
Magazines used: 1
Feeders used: 11
Total No. of picks: 2
Components per pick: 6.5
Component
Component: 000255
Comment: 820pF
Comp. per layout: 3 Feeders to use: 2
Available feeders: 2
Brian 14:13

Figure 6-29. HYDRA Preparation Editor

Create magazine kit

By pressing <F3> and entering a new name, a Magazine Kit is
F3
created and opened in the Magazine Kit List editor, see the Magazine
Kit section in the Operators Manual, in which you can edit and print
and then apply it for assembling.

Edit values
In order to find the best kit, you can manipulate the preparation by
F4
pressing <F4> and changing preparation values, see page 6-57.

As the values are changed, a new preparation is calculated

automatically.

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Entries in the HYDRA Preparation Editor:

Count/Feeders Components
A list of components that can be mounted in the layout using the
HYDRA unit, that is components for which one or more HYDRA
tools have been defined in the Package List and also are set as
available in the preparation tool parameters (page 6-60).

Each component entry is divided into three parts:

First number. – The total number of this component in the layout (the same as
Comp. per layout in the Component box).

This number is the second sort criterion of this list (descending

sort order).
Second number. – The suggested number of feeders for this component (the same
as Feeders to use in the Component box).

This number is the first sort criterion of this list (descending

sort order).
Component name. – Component name, referred to in the Component List.

The component name is the third sort criterion of this list

(ascending alphanumeric sort order).

In the Layout box. Layout, Comment

Name and comment text for the selected layout.

Components in layout
The total number of components in the layout, HYDRA mountable as
well as not HYDRA mountable components.

HYDRA components
The total number of HYDRA mountable components in the layout.
Equals the total number of components indicated in the
Count/Feeders Components list.

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* HYDRA PREPARATION EDITOR *

Count/Feeders Components
3/2 000255 Enter Feeders to use F4 Edit values
2/2 000254 F1 Print preparation
2/1 000258 F2 Optimum preparation
1/1 000149 F3 Create magazine kit
1/1 000263
Layout
1/1 000282 Layout: TV1
1/1 002216 Comment: Layout, bare board BB1
1/1 002219 Components in layout: 15
1/1 002512 HYDRA components: 13
Wrong feeder type: 0
Skipped components: 0
Magazines used: 1
Feeders used: 11
Total No. of picks: 2
Components per pick: 6.5
Component
Component: 000255
Comment: 820pF
Comp. per layout: 3 Feeders to use: 2
Available feeders: 2
Brian 14:16

Figure 6-30. HYDRA Preparation Editor

Wrong feeder type

Number of feeders containing HYDRA mountable components
loaded in not HYDRA pickable feeders. HYDRA pickable feeders
have the following settings in the Component List:

Magazine type: Tape

Feeder type: 8mm, FP8mm, 12mm or 16mm.

Skipped components
Number of components which will not be mounted because they are
set to no mounting (described in the Mount and Glue Switches
section in Chapter 7).

Magazines used, Feeders used

Suggested number of magazines and feeders to be used for the
HYDRA mountable components in the layout.

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Total No. of picks

The total number of picks required for assembling the layout.

Components per pick

The average number of components per pick, that is the indicated
number of HYDRA components divided by the Total No. of picks.

In the Component box. Component, Comment

Component name and comment text referred to in the Component
List.

Comp. per layout

The number of the highlighted component in the layout, also
indicated in the Count/Feeders Components list.

Feeders to use
Number of feeders suggested for the component, also indicated in the
Count/Feeders Components list.

Available feeders
Number of feeders that can be used for the highlighted component.

This number can be changed by pressing <Enter> and typing a new

number.

If you have a board that contains eight components of the same type,
then TPSys may suggest eight feeders for this component type. If you
only have three reels of this component type, then change to 3 in this
field.

As the number of feeders is changed, a new preparation is calculated

automatically.

A modification in this field does not affect an optimum preparation

launched by pressing <F2>.

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* HYDRA PREPARATION EDITOR *

Count/Feeders Components
3/2 000255 Enter Feeders to use F4 Edit values
2/2 000254 F1 Print preparation
2/1 000258 F2 Optimum preparation
1/1 000149 F3 Create magazine kit
1/1 000263
Layout
1/1 000282 Layout: TV1
1/1 002216 Comment: Layout, bare board BB1
1/1 002219 Components in layout: 15
1/1 002512 HYDRA components: 13
Wrong feeder type: 0
Skipped components: 0
Magazines used: 1
Feeders used: 11
Total No. of picks: 2
Components per pick: 6.5
Component
Component: 000255
Comment: 820pF
Comp. per layout: 3 Feeders to use: 2
Available feeders: 2
Brian 14:19

Figure 6-31. HYDRA Preparation Editor

Example
Figure 6-31 shows an example in which 11 feeders in 1 magazine will
be used to mount 13 components (three 000255, two 000254, and one
of each of the other components in the layout).

To pick and place these 13 components the HYDRA unit has to make
two pick and place procedures, for instance one with 6 components
and one with 7 components (two picks from component 000255 and
000258).

Thirteen components in two pick procedures equals 6.5 components

per pick on average.

This example is also shown as a print-out on page 6-59.

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Edit HYDRA Preparation Values

By pressing <F4> in the HYDRA Preparation Editor, you can
change preparation values in order to find the best magazine kit.

The following preparation parameter box is shown:

Edit preparation values
Trade-off: Number of saved picks
for each extra feeder 15
Maximum computation time: 13
No. of available TM12 magazines: 0
No. of available TM16 magazines: 0
No. of available TM1216 magazines: 1

Entries in the preparation parameter box:

Trade-off: Number of saved picks for each extra feeder

This parameter determines whether extra feeders can be used or not.
The criteria for using additional feeders is how many picks each extra
feeder can save.

If an extra feeder saves at least as many picks for the layout as set in
this entry, then an extra feeder will be suggested. If not, no extra
feeder will be suggested.

A big value (over 25) is recommended for small batches where the
change-over time is most important.

A small value (0.1 – 5.0) is recommended for big batches where the
assembly speed is most important.

Maximum computation time

This parameter sets the time limit for calculating the HYDRA
preparation. If the best solution is not found when this time has
elapsed, then the best solution found is displayed.

No. of available TM12 magazines

No. of available TM16 magazines
No. of available TM1216 magazines
These parameters set the number of available TM12, TM16 and
TM1216 magazines.

The HYDRA preparation does not suggest more TM12 and TM16
magazines than available, unless necessary.

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Modified Preparation Values

The following popup box is shown when leaving the HYDRA
Preparation Editor, if at least one of the preparation values has been
modified:

Save changed preparation values?

Yes No

Yes – The modified values are saved and will be the current
preparation values the next time the HYDRA preparation is
launched (for any layout).

No – The modified values are not saved. The previous preparation

values will remain the next time the HYDRA preparation is
launched.

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HYDRA Preparation Printout

The following printout is an example of the preparation shown in
Figure 6-31 on page 6-56.

HYDRA magazine preparation

Layout: TV1
Components in layout: 15
HYDRA components: 13
Skipped components: 0
Feeders used: 1
Total number of picks: 2
Components per pick: 6.50

Magazine: TM8B-1
Slot: 3
Feeder: Component: Number of picks:
1 ---------- 0
2 ---------- 0
3 ---------- 0
4 ---------- 0
5 ---------- 0
6 000149 1
7 000254 1
8 000254 1
9 000255 1
10 000255 2
11 000258 2
12 000263 1
13 000282 1
14 002216 1
15 002219 1
16 002512 1
Speed: 5 components per pick

Component: Magazine: Feeders:

000149 TM8B-1 6
000254 TM8B-1 7,8
000255 TM8B-1 9,10
000258 TM8B-1 11
000263 TM8B-1 12
000282 TM8B-1 13
002216 TM8B-1 14
002219 TM8B-1 15
002512 TM8B-1 16

The first part of the printout applies to the layout. The second part
applies to the magazines and is first sorted by feeders and then by
components.

The magazine position number (Slot above) is determined by the

85.0104 Magazine position priority parameter.

The magazine name and position number can be changed in the

Magazine Kit Editor (see the Magazine Kit section in the Operators
Manual) prior to applying the Magazine Kit into the Magazine List.

The printout above is an example of the preparation described on

page 6-56 in which a first pick from feeder 6 – 11 and a second pick
from feeder 10 – 16 make the 13 components in two picks.

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HYDRA Preparation Parameters

The following parameters, involved in the HYDRA preparation, are
found in the 0172 HYDRA preparation parameter group:

– 0172.0101 Treat unknown feeder types as

In this parameter components with no specified feeder type can
be set to Unknown (default), 8mm, FP8mm, 12mm and 16mm.

– 0172.0103 Include skipped components

Sets whether components marked as skipped in the Component
List or PCB List are to be included in the preparation or not.

Available HYDRA tool types

– 0172.0301 H00
– 0172.0302 H01
– 0172.0303 H02
– 0172.0304 H03
– 0172.0305 H04
– 0172.0306 H05
– 0172.0307 H06
– 0172.0308 H07

These eight parameters set the HYDRA tools to be available or not

available for HYDRA preparation.

These parameters have no affect on the assembly process, they only

control the preparation result.

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Mount Lists
To be able to mount a PCB, four mandatory main lists (or list groups)
are required:

• Component List
Contains part numbers and component name and data. Assigns a
package to the component.

• Package List
Contains data specific to the component package, such as length,
width, height, number of leads, mount tool, placement precision,
centering forces and optical centering data.

• Magazine Lists (group)

Lists that inform the system about in which magazine and type of
magazine (tape, vibrator, or tray) the components can be found
and where the magazines are located. The lists include also such
information as component angles and quantities.

• Mount Lists (group)

Mount lists on different levels for PCBs, panels, and layouts,
indicating which components are to be mounted and where they
are to be placed.

PACKAGE LIST COMPONENT LIST MOUNT LISTS MAGAZINE LISTS

Package data Component data Where components are to Where components are to
be placed be found

MOUNTING

This chapter describes the Mount Lists, one of the main list groups
necessary for mounting a board.

The other mandatory lists or list groups are described in Chapter 4,

Chapter 5 and Chapter 6.

Additional lists for such features as fiducial marks, adhesive

application and user access are found in Chapter 8.

Special characters
National special characters and some non-letter/non-figure
characters cannot be entered into the system, for instance in board
names and layout names.

The following special characters are, however, allowed to be used:

"'`\$;^@

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Terminology
Industry terminology can sometimes be confusing and ambiguous. In
order to ensure good understanding, the following terms are
consistently used throughout this manual.

Bad board mark

Label for marking defective PCBs included in panels.

Board
PCB or panel, mounted or bare board.

Header information
Information about the board, such as size and fiducial
marks.

Mount information
Information about components and their positions on the
board.

Printed Circuit Board, PCB

A generic term for a mounted or bare board.

Panel
A board containing multiple PCBs, identical or different,
which are separated into individual boards after completing
the assembly process.

Layout
One or several boards that are assembled simultaneously on
the assembly table. PCBs and panels can be mixed.

Fiducial mark
Fiducial mark used to locate boards by means of the vision
system. At least two fiducial marks are required on each
board. The system can handle maximum three fiducial
marks on boards.

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The Purpose of the Mount Lists

The Mount Lists indicate which components are to be mounted and
where they are to be positioned.

The lists are used for PCBs, panels, and layouts.

PCB, Panel and Layout

PCB
Individual printed circuit board.

Panel
Board containing more than one PCB, identical or different, which
are separated after mounting and soldering.

Layout
All assembling is performed in layouts containing one or many
boards that are assembled simultaneously. PCBs and panels can be
mixed in a layout.

This chapter details the various lists that are required for mounting
PCBs and panels in layouts.

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PCB
A PCB must be assigned a unique name, either alphabetical or
numerical. The name is the keyword for all information about the
PCB.

The PCB in the following figure is named PCB1.

PCB1

Header information

Mount information

Figure 7-1. PCB1 information

The information about a PCB can be divided into two parts:

Header information
General information for the entire board, such as board dimensions,
number of fiducial marks, type and position of fiducial marks, and
location of bad board marks and mount tool test points.

Mount information
Information about which components are to be mounted and where
they are to be located, including for instance component names,
locations, alignments and mount order.

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Panel
The panel must be assigned a name, which becomes the keyword for
all information about the panel. The name does not need to be unique
and can be the same as the name of the included PCB. However,
there cannot be two panels with the same name.

The panel in the following figure is named PANEL1, and two PCBs
are included in it.

PANEL1

Header information

Included PCBs

PCB1 PCB2

Figure 7-2. PANEL1 with two PCBs

The information about a panel can be divided into two parts:

Header information
General information for the entire board, which is the same
information described for the PCB, that is for instance dimensions,
number of fiducial marks, type and position of fiducial marks, and
location of bad board marks and tool test points.

Included PCBs
The names of the included PCBs in the panel. These names link the
PCB information to the panel. A modification made on an individual
PCB will thus affect the PCB also when included in panels.

There is also information about the position of the PCBs in the panel.
This information is related to the panel fiducial marks.

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Layout
A layout must also be assigned a name, which becomes the keyword
for the boards included in the layout. The layout name need not be
unique and can be the same as the name of the included PCB or
panel. The same name is preferable when a layout contains a single
board. However, there cannot be two layouts with the same name.

All assembling is performed using layouts. A PCB or panel cannot be

assembled without being included in a layout.

The layout in the following figure is named LAYOUT1 and it

contains PANEL1 with the two PCBs.

LAYOUT1

Layout information

Included boards

PANEL1
PCB1 PCB2

Figure 7-3. Layout for a panel with two PCBs

The information about a layout can be divided into two parts:

Layout information
Name and general information about the layout.

The layout level is the highest level in the hierarchy of the Mount
Lists. See the structure diagram of the Mount Lists in Figure 7-4.

Included boards
The names of the included boards and panels in the layout. These
names link the board information to the layout. A modification made
to an individual PCB or panel will thus affect this board in all layouts
where included.

This part contains also information about the board positions on the
assembly table. This information is recorded by the system, and is
updated for each assembling.

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Mount List Structure Diagram

Figure 7-4 shows a Mount List structure diagram with the names of the various editors.

Editor
C Components
P Packages

L Layouts
A Panels
B PCBs
Main menu Main menu Main menu
Enter Enter Enter

Esc Esc Esc

* PANEL LIST EDITOR * * LAYOUT LIST EDITOR * * PCB LIST EDITOR *
Edit panel Edit layout Edit PCB
Insert new Insert new Insert new
Delete Delete Delete
Copy HYDRA preparation Copy
Copy
Enter Enter Enter

Esc
* LAYOUT EDITOR *
Edit board
Layouts Insert new
Delete
Board position PCBs
Layout header
Enter
Panels

Panel PCB
Esc
* PANEL EDITOR *
Edit PCB
Esc Insert new
Delete
PCB position
Panel header
information
Enter

Esc Esc
* PCB EDITOR *
Items
Edit item
1: C1, 000149 Insert new
2: C2, 000254 Delete Esc
3: C3, 000501 View position
4: C4, 000502 PCB header
PCB size
F1

Digitizer Esc
Optical positioning
(if loaded layout)

Figure 7-4. Structure diagram of the Mount Lists

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Layout List Editor

The Mount Lists have four editorial levels (see Figure 7-4):
Layout List Editor–Handling layouts
Layout Editor–Handling boards in layouts
Panel Editor–Handling PCBs in panels
PCB Editor–Placing components

This section describes the Layout List, which is the entry level of the
Mount Lists, opened by selecting the Layouts option in the Editor
menu:

Editor
C Components
P Packages
----------------
L Layouts
A Panels
B PCBs
----------------
R Parameters
----------------
F Fiducial Marks
G Glue Dots
U Users

The Layout List Editor is shown in Figure 7-6.

Function keys in the Layout List Editor:

Edit layout
By pressing <Enter> the highlighted layout can be modified in the
Layout Editor, see page 7-10. You will be asked whether you want to
load the layout or not, if not already loaded. You do not have to load
Enter
the layout unless you intend to mount components or use the camera
for instance to locate boards or position components.
Layout status. If you load a layout, you are reminded about stored layout status, if
exists for the loaded layout. Layout status is described in Chapter 8
of the Operator's Manual.
Management data. If you load a layout, you can also clear management data, if exists for
the loaded layout. Management data is described in Chapter 8 of the
Operator's Manual.

Insert new
A new layout can be created by pressing <Ins> and entering a new
Ins
name.

Delete
The highlighted layout can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box, which asks whether you want
to delete all panels and PCBs included in the layout. A loaded layout
cannot be deleted. Unload first by selecting the Unload Layout option
in the Production menu.

If you accept to delete the boards, no further check is performed to find

out whether the boards are included in other layouts or not.

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* LAYOUT LIST EDITOR *

Layouts
Enter Edit layout
TV-ALL
Ins Insert new
TV1
Del Delete
TV2
F6 HYDRA preparation
TV2-P2
F9 Copy
TV2-P2x2
TV2x2
TV3B Layout Information
TV3G Name: TV-ALL
TV3RGB-P3
Comment: Bare boards BB1, BB2x2, BB3x3
:
:
:
:
:
:
:
:
:

Brian 14:16

Figure 7-5. Layout List Editor

HYDRA preparation
Composes a magazine load list which is optimized for assembling the
F6
highlighted layout using the HYDRA unit. This feature is further
detailed in Chapter 6.

Copy
The highlighted layout can be copied by pressing <F9> and entering
F9
a new layout name. It is possible to copy panels and PCBs in the
layout so that they are no longer affected by subsequent changes to
the originals.

Exit
Press <Esc> if you want to exit the Layout List and return to the
Esc
main window.

Entries in the Layout List Editor:

Layouts
This box contains the layouts stored in the system and in the TPSys
network, if shared databases are used. Use the arrow keys, <PgUp>,
<PgDn>, <Home>, or <End> to select layout.

You can search for a layout in the list by simply entering the first
characters of the layout name.

Layout Information
Layout names and comment text of the highlighted layout.

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Layout Editor
The Layout Editor, which handles the boards included in layouts, is
opened by pressing <Enter> in the Layout List Editor (page 7-8), or
by selecting the Edit Layout option in the Production menu.

The Layout Editor is shown in Figure 7-6.

Function keys in the Layout Editor:

Edit board
By pressing <Enter> the highlighted board can be modified in:
– the Panel Editor if the board is a panel, see page 7-14.
Enter – the PCB Editor if the board is a PCB, see page 7-24.

Insert new
A new board can be inserted into the layout by pressing <Ins>,
Ins
selecting PCB or panel, and entering the name of a new board or
selecting an existing board from the list. If the board is present on the
assembly table, it can be located as well by centering the fiducial
marks using the camera.

Delete
The highlighted board can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Board position
A board on the assembly table can be located by pressing <F1> and
F1
centering the fiducial marks using the camera.

Layout header information

Comment text, barcode, conveyor width and conveyor board type is
F2
accessible after pressing <F2>, see page 7-12.

Exit
Press <Esc> if you want to exit the Layout Editor and return to the
Esc
Layout List Editor (page 7-8).

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* LAYOUT EDITOR *
Boards
Enter Edit board
1: TV1 (PCB)
Ins Insert new
2: TV2-P2 (Panel)
Del Delete
3: TV3RGB-P3 (Panel)
F1 Board position
F2 Layout header
information

Layout Header
Name: TV-ALL
Comment: Bare boards BB1, BB2x2, BB3x3
Board Position
Type: Panel
Name: TV2-P2
Comment: Panel, bare board BB2x2
Fiducial mark 1: 15.044mm/ 135.116mm
2: 215.091mm/ 205.137mm
3:

Brian 14:22

Figure 7-6. Layout Editor

Entries in the Layout Editor:

Boards
This box contains the names of the PCBs and panels included in the
selected layout.

Layout Header
This box contains name and the first comment text line of the
selected layout. The comment text is accessible after pressing <F2>.

Board Position
This box contains information about the highlighted board. The
information can be modified after pressing <F1>.

Type
Type of board, which can be PCB or Panel.

Name Comment
Name and the first line of the comment text of the board.

Fiducial mark 1, 2, 3
The latest location of the board on the assembly table, measured in
the machine coordinate system.

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Layout Header Information

Layout header information is accessible for editing after pressing
F2
<F2> in Layout editor.

* LAYOUT EDITOR *
Boards
1: TV1 (PCB) Enter Save and exit
2: TV2-P2 (Panel) Esc Exit
3: TV3RGB-P3 (Panel)

Layout Header
Name: TV-ALL
Comment: Bare boards BB1, BB2x2, BB3x3
:
:
:
:
:
:
:
:
:
Barcode:
Conveyor width: 0mm
Conveyor board type: Normal

Brian 14:28

Figure 7-7. Layout Header

Information regarding conveyor systems used may be entered in the

Layout Header fields. Board sizes, barcodes and conveyor width can
also be specified here.

Barcode
If you use the serial start function TPSys require a name of the
layout to load. Type, or scan the barcode, into this field.

The barcode name can differ from the name you have assigned to the
layout.

Conveyor width
If the machine is equipped with a conveyor, you can specify the
conveyor width here.

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Conveyor board type

This setting is only applicable for the T5 and T6 conveyors and will
control how the board is clamped. Specify the type of board or panel
that will be used on the conveyor. For instance if board is large and
heavy or small and thin. Choose from list. List is accessed by pressing
<Space>.

Normal
Small
Large
Special

A Large board is larger than 460 mm (18") or thicker than 5mm

(0.2"). Normal boards are approximately half the length of the large
board and not more than 5 mm (0.2" or 200mil) thick. Small boards
are smaller than 100x 100 mm (4"x4") maximum 2mm (0.08" or
80mil) thick. The Special option can be used for special boards like
ceramical boards.

The paramets for these types of boards are set in

parametergrop 0092.

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Panel Editor
The Panel Editor, which handles PCBs included in the panels, is
opened by pressing <Enter> in:

– Layout Editor, when panel (page 7-10), or

– Panel List Editor (page 7-40).

The Panel Editor is shown in Figure 7-8.

Function keys in the Panel Editor:

Edit PCB
By pressing <Enter> the highlighted PCB can be modified in the
PCB Editor, see page 7-24.
Enter

Insert new
New PCBs can be inserted into the panel after pressing <Ins>. Also,
Ins
a matrix of PCBs can be inserted by specifying the row/column
spacing, see page 7-18 and page 7-19.

Delete
The highlighted PCB can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

PCB position
After pressing <F1>, the highlighted PCB can be positioned on the
F1
panel by typing the coordinate values or, if the layout is loaded, by
using the camera (and digitizer, if used).
Camera usage requires
loaded layout.
Panel header information
The panel header information can be modified by pressing <F2>, see
F2
page 7-21.

Panel size
By pressing <F4> Lower left corner and Upper right corner positions
F4
can be entered to define the panel size (see Figure 7-9 on page 7-17).
Entered information is not used for placing components but might be
used by optional software packages.

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* PANEL EDITOR *
PCBs
Enter Edit PCB
*1: TV2
Ins Insert new
*2: TV2
Del Delete
F1 PCB position
F2 Panel header
information
F4 Panel size
F6 Fine tune PCB
position

Panel Header Information

Name: TV2-P2
Comment: Panel, bare board BB2x2
PCB Position Information
PCB name: TV2
Comment: PCB, bare board BB2

Fiducial mark 1: 10.000mm/ 10.000mm

2: 90.000mm/ 60.000mm
3:

Brian 14:34

Figure 7-8. Panel Editor

Fine tune PCB position

All PCB positions can be fine tuned by pressing <F6>, provided the
F6
layout is loaded. You can choose automatic fiducial mark search or
manual fiducial mark centering from the menu shown:
This option is available only if
the layout is loaded.
Locate all PCBs (auto)
Locate all PCBs (manual)

The Locate all PCBs (auto) option means automatic fiducial mark
search, which requires that the fiducial marks are defined, learned,
and stored in the Fiducial Mark List.

Set present status

Press <F8> if you want to set the present status of all boards in a
F8
panel or lay-out.

Set Present Status of All Boards

Present
Not present

The Present option means that the Not present tag is cleared. Fiducal
mark will be searched in the following assembly. Bad board tags are
also cleared and no Bad board search will be performed. Not present
means that the boards will be skipped in the following assembly. You
can toggle with the <Space> bar.

Exit
Press <Esc> if you want to exit the Panel Editor and return to the
Esc
Layout Editor (page 7-10).

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Entries in the Panel Editor:

PCBs
This box contains the names of the PCBs included in the selected
panel.
The status for each PCB in a loaded layout is indicated to the left of
the name. When loaded, a PCB can have the status of Present, Not
present or Bad.

* Present – A board which is successfully fiducial mark searched is

automatically tagged Present. If the fiducial mark search fail and
manual present search is on, the operator can set the board to
Present or Not present.

- Not present – If automatic fiducial mark search fails for the first
point searched on the board, it can be marked Not present if
automatic present search is on, or if the operator marks the board
as Not present during manual fiducial mark search.

! Bad – A board, which is found bad during Bad board search is,
tagged bad. Only possible for PCBs in panels.

The status can be toggled by pressing <Space>.

The status for PCBs is only showed and editable in the online TPSys,
that is when a layout has been loaded.

You can insert single PCBs or a matrix of PCBs into the selected
panel by performing the applicable procedure, see page 7-18 (single
PCB) and page 7-19 (matrix of PCBs).

Panel Header Information

This box shows the name and the comment text of the selected panel.
You can open the complete header information box by pressing
<F2>, see page 7-21.

PCB Position Information

This box contains information about the highlighted PCB. Only the
fiducial mark coordinates can be modified here.

PCB name Comment

Name and user comment text for the board.

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Fiducial mark 1, 2, 3
The X/Y coordinates of the PCB fiducial marks related to the panel
coordinate system.

The coordinate values can be modified after pressing <F1>, either

by typing the values or, if you have a panel on the assembly table, by
pressing <F1> and centering the PCB fiducial marks using the
camera.
If you intend to use the camera, note that the panel fiducial marks
Use digitizer, if available.
and the PCB fiducial marks must be defined. You will also be asked
Or, you can type approximate to locate the panel on the assembly table, if not already done.
values before pressing <F1>
to save machine movement
time. The information shown in Figure 7-8 applies to the left PCB in
Figure 7-9.

Upper right corner

BB2x2 F2

60 F2 F2
BB2 TV2 BB2 TV2

10 F1 F1

0 F1

0 10 90

Lower left corner

Figure 7-9. Panel header information

The text Lower left corner and Upper right corner in the figure is
explained under Panel size on page 7-14.

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Inserting a Single PCB into a Panel

This section describes how to insert a single new or existing PCB into
a panel.

1. In the Panel Editor, press <Ins>.

2. In the PCB name field, enter the name of a new PCB or an
existing PCB, or press <Enter> and select an existing PCB from
the list. The text * UNKNOWN PCB * is shown if you choose to
insert a new PCB.

3. Press <Enter> twice to accept 1 row and 1 column.

4. In the Fiducial mark 1 field, enter the X/Y coordinate values to
fiducial mark 1 on the PCB. These values are related to the
panel coordinate system.

You can either type the values or, if you have a panel on the
assembly table, press <F1> and center fiducial mark 1 on the
PCB using the camera.
Use digitizer, if available. If you intend to use the camera, note that the panel fiducial
marks and the PCB fiducial marks must be defined. You will also
Or, you can type approximate be asked to locate the panel on the assembly table, if not already
values before pressing <F1>
to save machine movement done.
time.
5. Repeat the coordinate setting for fiducial mark 2, and 3 if three
fiducial marks are used on the PCB.

6. Press <Enter> to skip over the Column/row step field.

You have now inserted a PCB into the panel and the complete
settings for the PCB looks like this:

Insert PCB(s)
PCB name: TV3R
Comment: * UNKNOWN PCB *
Rows: 1
Columns: 1
Total: 1
First new board
Fiducial mark 1: 10.000mm/ 10.000mm
2: 90.000mm/ 60.000mm
3:

Column/row step: 0.000mm/ 0.000mm

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Inserting a Matrix of PCBs into a Panel

This section describes how to insert a matrix, that is a number of new
or existing PCBs into a panel by using a feature for quick insertion of
boards arranged in a matrix pattern.

1. In the Panel Editor, press <Ins>.

2. Enter the PCB name in the same way as described for single
PCBs in the previous section.

3. Enter the number of rows, that is the number of PCB rows in the
panel, counted in the X axis of the machine. Figure 7-10 shows
an example of a two row panel.

4. Enter the number of columns, that is the number of PCB

columns in the panel, counted in the Y axis of the machine. The
example in Figure 7-10 has three columns.

The Total field shows automatically the number of PCBs on the

panel.

5. Set the coordinate values for fiducial mark 1 in the Fiducial

mark 1 field in the same way as described for a single PCB in the
previous section.

This fiducial mark is marked '1' in Figure 7-10.

6. Repeat the coordinate setting for fiducial mark 2, and 3 if three

fiducial marks are defined on the PCB.

Fiducial mark 2 is marked '2' in Figure 7-10.

7. Set the column spacing and the row spacing in the Column/row
step field either by typing the distances or by pressing <F1> and
using the camera.

If you use the camera, center fiducial mark 1 on the last board
when the following message is shown:

Center first fiducial mark on last board

Ready
Cancel

Fiducial mark 1 on the last board is marked '3' in Figure 7-10.

Fine tuning. You have now inserted six PCBs in the panel. You can check and
adjust the PCB positions by pressing <F6>, see page 7-15.

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F2

F2 F2 F2

1
F1 F1 F1

F2 F2 F2

3
F1 F1 F1

F1

Figure 7-10. PCB matrix in a panel

You can define PCB 1 in any corner of the panel, that is as board
number 1, 3, 4, or 6 in Figure 7-10 but you must always define the
last board in the opposite corner of the first board.

The complete settings for the matrix of PCBs looks like this:

Insert PCB(s)
PCB name: TV3R
Comment: * UNKNOWN PCB *
Rows: 2
Columns: 3
Total: 6
First new board
Fiducial mark 1: 10.000mm/ 100.000mm
2: 60.000mm/ 160.000mm
3:

Column/row step: 150.000mm/ 10.000mm

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Panel Header Information

By pressing <F2> in the Panel Editor (page 7-14) the panel header
information can be modified.

The panel header information box looks like this:

Panel Header Information

Name: TV2-P2
Comment: Panel, bare board BB2x2
Level measurement tools:
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 200.000mm/ 70.000mm
3 ID: pos.:
Bad board mark pos.: 100.000mm/ 0.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

The information in this box applies to the panel in Figure 7-11.

A = Bad board mark label. 75

70 BB2x2 F2

B = Board level measuring 60 BB2 F2 BB2 F2

point for mount tools. TV2 TV2

C = Board level measuring

point for glue tools.

10 R1 F1
A
0 F1 B C
-5
200
-5 0 10 30 40 90 100 110 190 205

Figure 7-11. Panel header information

Entries in the panel header information box:

Name
The panel name.

Comment
User comment text.

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No. of fiducial marks

Number of fiducial marks on the panel. Minimum 2 and maximum 3
fiducial marks.

Mark 1 ID, 2 ID, 3 ID

The names of the fiducial marks. Automatic fiducial mark search
requires the fiducial marks to be defined, learned, and stored in the
Fiducial Mark List.

pos.
The X/Y coordinates of the panel fiducial marks. These values are
related to the panel coordinate system.

You can set these coordinate values either by typing the values or, if
you have a panel on the assembly table, by pressing <F1> and
centering the panel fiducial marks using the camera.

If you type an approximate value before pressing <F1>, then you

will save machine movement time.

Bad board mark pos.

Bad board label for marking that there are at least one defective PCB
R2 on the panel.

These X/Y coordinates indicate the center of the bad board label, in
the panel coordinate system.
Y
Use a label with high contrast if you put it on an area with low
X contrast, and vice versa.

More information about bad board marks is found in the Switches

section, in Appendix B.

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Mount tool test pos.

The position where the board level is measured with mount tools.
These X/Y values are related to the panel coordinate system.

Board level measuring is further detailed on page 7-39.

Glue tool test pos.

The position where the board level is measured with glue tools. These
X/Y values are related to the panel coordinate system.

Note that adhesive will be applied on the defined position if the

adhesive dispensing is on. So, avoid using the same measuring
position for mount tools and glue tools, otherwise the mount tool tip
will be sticky.

Board level measuring is further detailed on page 7-39.

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PCB Editor
The PCB Editor, which handles the components and their positions,
is opened by pressing <Enter> in:
– Layout Editor, when PCB (page 7-10), or
– Panel Editor (page 7-14), or
– PCB List Editor (page 7-42).

The PCB Editor, with the actual layout loaded as current, is shown
in Figure 7-12.

Function keys in the PCB Editor:

Edit item
By pressing <Enter> the mount information of the highlighted item
can be modified.
Enter
Insert new
New items can be inserted by pressing <Ins> and typing the
Ins
component name, or selecting from the Component List.

Delete
The highlighted item can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

View position
By pressing <F1>, the highlighted item can be positioned on the
F1
board using the camera, see page 7-32.

This option is available only if

the layout is loaded. PCB header
The PCB header information can be modified after pressing <F2>,
F2
see page 7-37.

PCB size
By pressing <F4> Lower left corner and Upper right corner positions
F4
can be entered to define the PCB size (see Figure 7-18 on page 7-37).
Entered information is not used for placing components but might be
used by optional software packages.

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* PCB EDITOR *
Items
Enter Edit item F4 PCB size
D 1: C1, 000149
Ins Insert new F6 Find position
M 2: C2, 000254
Del Delete Shift+F6 Reset digitizer
S 3: C3, 000501
F2 PCB header F7 Change groups
4: C4, 000502
F8 Replace component

PCB Header Information

Name: TV2

Location: C1
Component: 000149
Comment: 100pF
Package: 1206-07
Group: 0 Turn before Z down: No
Save electric value: No
Mount: Yes Glue: Yes Only Z: No
Angle: 0.00° pos.: 40.051mm/ 25.362mm
Local fiducial marks: 0
Mark 1 ID: pos.:
2 ID: pos.:
3 ID: pos.:
Brian 14:40

Figure 7-12. PCB Editor

Find position
F6
Press <F6> to search for mount position. Choose information type:
Package, Component or Location. Enter the search value for one of
the types, press <Enter> and the PCB is searched for a position that
match the search criteria. The search starts from the position after
the one currently highlighted. If a position is found, the cursor is
moved to that position, but the search window is not closed. Pressing
Enter again will repeat the search. This can be repeated until no
more matching position is found. The search window is exited by
pressing <Esc>.

Reset digitizer
If you use a digitizer, the position of the PCB fiducial marks can be
F6
calibrated after pressing <Shift>+<F6>. The procedure is further
detailed in Chapter 3.

Change groups
By pressing <F7> all the placement group numbers can be changed
F7
by a value entered, see the description under Group below.

Replace component
By pressing <F8> a component type can be replaced by another
F8
component type in the current PCB, in all PCBs in the panel, in all
PCBs in the layout, or in all PCBs. A detailed description is found
under Component below.

Exit
Press <Esc> if you want to exit the PCB Editor and return to the
Esc
Layout Editor (page 7-10) or the Panel Editor (page 7-14).

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Entries in the PCB Editor:

Items
This box contains the items of the PCB.

The first position in the list can indicate the following status:
Column 1. D – Dispensed adhesive, see Glue below and the Component
Positioning section on page 7-32.

M – Mounted item, see Mount below and the Component Positioning

section on page 7-32.

S – Skipped item, that is an item which is not to be placed, see Mount

below.

D and M can be inserted or removed by pressing <Space> in the

positioning mode, see the Component Positioning section on
page 7-32.
Column 2. The second column contains the line number.
Column 3. The third column is intended for the item number, see Location
below.
Column 4. The fourth column contains the component name referred to in the
Component List, see Component below.

PCB Header Information

This box contains name and user comments of the selected PCB. You
can open the complete header information box by pressing <F2>, see
page 7-37.

Location
User text intended for the item numbers in the PCB parts list. This
text is shown in the Items box, for instance C1 and C2 in Figure 7-12.

Component
Component name referred to in the Component List.

You can search for a component from the Component List, which is
opened by entering the first characters of the component name and
pressing <Enter>, or by simply pressing <Enter>.
Component replacement. By pressing <F8> a component type can be replaced by another
component type. The names of the component to be replaced and the
replacement component are entered in the popup box shown:

Component Replacement
Component to replace: 000149
Replacement component: 050387

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To set the extent of the component type replacement, choose one of

the options in the next box shown (TV2, TV2-P2 and TV-ALL in the
box are examples):

Choose PCBs to change

Current PCB ( (TV2)
All PCBs in panel TV2-P2
All PCBs in layout TV-ALL
All PCBs

After selecting the desired option and pressing <Enter> the

replacement is accomplished.

Comment
Optional user text, for instance component type or component value,
read from the Component List.

Package
The component package, read from the Component List.

Group
All items can be assigned a group number between 0 and 255. This
group number sets the placement order for the items, that is items
with low group numbers are mounted prior to items with high group
numbers.

Pressing <F7> makes it possible to change all used group numbers

for all items by a value between –255 and 255. The value to be added
is entered in the popup box shown:

Select value to add to all group numbers: 1

(-255..255)

If you, for instance, enter '10,' then group number 0 becomes 10,
group number 1 becomes 11, and so on. If you enter a negative value,
all group numbers are decreased. You can change the group numbers
within the range used, that is between 0 and 255.

This feature makes it possible to place an item prior to all other

items. If, for instance, all items have group number 0 and you want
to place a particular item prior to all other items, then you can
increase all group numbers and then set the particular item to a
lower group number manually.

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Turn before Z down

This feature prevents a component from being lowered towards the
board until the final turning and positioning is completed. This field
should be set to Yes if there are high components close to the place
where the component is to be mounted.

Yes – The component is turned and positioned completely before

lowered towards the board.

No – The final turning and positioning is carried out while the

component is lowered towards the board.

To toggle between Yes and No press <Space>.

Save electric value

Values measured during electrical verification can be logged and
stored in the event log. This optional feature makes it possible to
trace component values, but also to provide measured component
values for assembled PCBs.

The measuring can be performed either once per component. or a

preset number of times. The latter, enhanced measuring, gives a
number of results that are calculated to mean value and standard
deviation. These calculated values are stored in the event log.

Yes – Electrical measurement is performed under the conditions

described in the Switches section in Appendix B for the
following switches:
0020 Measure component after test
0021 Use enhanced electric measure

No – No electrical measurement is performed.

To toggle between Yes and No press <Space>.

The event log, with the measured values, can be exported by selecting
the Export option in the TPSys Utility menu.

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Mount
Yes – The component is mounted.
No – The component is not mounted.

To toggle between Yes and No press <Space>.

Glue
Yes – Adhesive is dispensed for the component.
No – Adhesive is not dispensed.

To toggle between Yes and No press <Space>.

Only Z
Yes – This item will not be mounted by the HYDRA unit. Select
this option if it, for instance, is a big (high) pre-mounted
component close to this item.
No – The component can be mounted by the HYDRA unit.

To toggle between Yes and No press <Space>.

Angle
0° The angle in which the component is to be placed.
1

270/-90° 90°

180°

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pos.
X The PCB coordinates (X/Y) to the center of the component. The
values can be either typed into the field or inserted using camera
after pressing <F1> (see the Component Positioning section on
Y page 7-32).

You can use a digitizer to position the components. Or, you can type
approximate values before pressing <F1> to save machine
movement time.

Local fiducial marks

To be able to make extra position and angle calibrations for big fine
pitch components prior to placing, up to three local fiducial marks
can be used per package. The Local fiducial marks field can thus
indicate a number between 0 and 3.

The fiducial marks can be positioned anywhere in the component

outline, but the optimal accuracy for a single fiducial mark is at the
center of the component, see '1' in Figure 7-13.

The optimal accuracy for two fiducial marks is achieved with the
fiducial marks placed symmetrically with respect to the component
center, see '2' in the figure.

Three fiducial marks are also positioned symmetrically with respect

to the component center, see '3' in the figure.

The system learns and stores the local fiducial marks in the Fiducial
Mark List in the same way as board fiducial marks. The Fiducial
Mark List is described in Chapter 8.

1 2 3

Figure 7-13. Local fiducial marks

The 0004 Use local fiducial marks parameter found under the
Switches option in the Production menu must be set to Yes to be able
to use local automatic fiducial mark search.

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Mark 1 ID, 2 ID, 3 ID

The names of the local fiducial marks. Automatic fiducial mark
search requires the fiducial marks to be defined, learned, and stored
in the Fiducial Mark List.

pos.
The X/Y distance from the center of the component to the center of
the fiducial marks.

You can set the X/Y values either by typing the values from the
keyboard or, if you have a PCB on the assembly table, by pressing
<F1> and centering the fiducial marks using the camera.

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Component Positioning
By pressing <F1> in the PCB Editor (page 7-24) the highlighted
component can be positioned on the board using the camera as shown
in Figure 7-14.

Use digitizer, if available.

Angle resolution: 5.00° F2/F3 Toggle lead
Current lead: Center Ctrl+F3 Toggle component
You can type approximate Ready outline
values before pressing <F1> Cancel PgUp/PgDn
F4/F5
Previous/next
Mount/glue
to save machine movement + and - Rotate component
time. Ctrl+T
F6
Hide text
Toggle mounted/glued

The trackball speed can be

increased by five times if you
press the left and right
trackball buttons
simultaneously.

D 1: C1 (000149) Delta pos.: 3.731mm/ 49.168mm

0.00° Angle: 4.34°
85.141mm/ 45.212mm Brian 14:46

Figure 7-14. Positioning the component center

Position the cross hairs on the component center when Current lead
Center is indicated in the upper left corner of the screen. Figure 7-14
shows the position of a 1206-07 package.

Position the leads by pressing <F2> or <F3> and centering the

cross hairs on the land patterns. Each time the <F2> or <F3> key
is pressed the camera is moved to the previous or next of the leads
specified in the Package List. Current lead is indicated in the Current
lead line in the upper left corner of the screen.

Figure 7-15 shows the position of lead 1 for the 1206-07 package.
Changing an existing If you want to change the position of an existing component, the
component position. <F1> key on the keyboard or the Camera button on the machine
keypad must be pressed to activate the trackball and the joystick.
This is indicated by the following information box:

Press <F1>
or Camera
to adjust
position

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Angle resolution: 5.00° F2/F3 Toggle lead

Current lead: Lead 1 Ctrl+F3 Toggle component
Ready outline
Cancel PgUp/PgDn Previous/next
F4/F5 Mount/glue
+ and - Rotate component
Ctrl+T Hide text
F6 Toggle mounted/glued

D 1: C1 (000149) Delta pos.: 3.732mm/ 50.364mm

0.00° Angle: 4.24°
85.141mm/ 46.413mm
Brian 14:48

Figure 7-15. Positioning lead 1

Angle resolution
The component angle resolution, which can be changed by entering
a new value. Use the <up arrow> or <down arrow> to select the
Angle resolution field.

Current lead
Shows the current position when moving between the component
center and the specified leads (by pressing the <F2> or <F3> key).
The leads are indicated as Lead 1, Lead 2, and so on, and they are
specified in the Toggle leads field in the Package List.

D 1: C1 (000149)
This line indicates the current component, see the Items box on
page 7-25.

0.00°
The component angle.

85.14mm/ 46.41mm
Current camera position in the PCB coordinate system.

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Delta pos., Angle

This information is shown if you move the camera in the positioning
mode.
The Delta pos. field displays the distance from the viewing start
position to the current position in X/Y coordinates.
The Angle field displays the angle for the same movement.

Figure 7-16 illustrates the Delta information.

3.0

<F1> 53.75°

2.2
<F1>

Delta pos.: 0.000/ 0.000mm Delta pos.: 3.000/ 2.200mm

Angle: 0.00° Angle: 53.75°

Figure 7-16. Delta information

The viewing start position, where the <F1> key was pressed, is
marked <F1> in the figure. The left part of the figure shows the
viewing start position and the right part shows the angle and
coordinates after moving the cross hairs to the center of the
component.

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The following function keys are active in the positioning mode:

Toggle lead
The <F2> and <F3> keys move the camera either clockwise or
F2 F3
counter-clockwise between the leads specified in the Toggle leads
field, see Current lead above.

Toggle component outline

A graphic outline of the component can be displayed by pressing
F3
Ctrl <Ctrl>+<F3>. The graphic symbol is a rectangle with a dot for
each lead. Lead 1 is marked with a rectangle.

Note that the graphic symbol may differ somewhat from the actual
component size. So, use the cross hairs for positioning, not the
graphic symbol.

This figure illustrates an example of a graphic symbol with the cross

hairs in the center of the component.

Figure 7-17. Graphic component outline

Previous/next
You can change to the previous item by pressing the <PgUp>key, or
PgUp PgDn to the next item by pressing the <PgDn>key.

Mount/glue
Current component can be mounted, if available, by pressing <F4>.
F4
Letter M will be shown in the first position of the Items box, see
page 7-25 and page 7-33.

Adhesive can be applied, if available, for the current component by

F5
pressing <F5>. Letter D will be shown in the first position of the
Items box, see page 7-25 and page 7-33.

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Rotate component
When the cross hairs are in the center of the component, the
component angle can be changed by pressing the ‘+’ and ‘–’ keys as
follows:

Each press on the ‘+’ key changes the component angle clockwise by
+ 90°, that is from 0° to 90°, from 90° to 180°, and so on.

Each press on the ‘–’ key changes the component angle

– counter-clockwise by the angle shown in the Angle resolution field in
the upper left corner of the screen. Figure 7-15 on page 7-33 shows
5.00° which causes the angle to change 5°at each key press, that is
from 90° to 85°, from 85° to 80°, and so on.

Hide text
The screen text can be hidden to give a better view of the positioning.
Ctrl T Hide/show the text by pressing <Ctrl>+<T>.

Toggle mounted/glued
The mount and dispense status for the current component can be
changed without dispensing or mounting as follows:

Press <Space> to switch from blank to 'D' to 'M' and back to blank,
see the Items box on Figure 7-25.

Exit
Press <Esc> if you want to exit the positioning mode and return to
Esc
the main PCB Editor (page 7-25) without leaving the position field.
Otherwise, select Ready in the upper left menu.

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PCB Header Information

By pressing <F2> in the PCB Editor (page 7-25) the PCB header
information can be modified.

The PCB header information box looks like this:

PCB Header Information

Name: TV2
Comment: PCB, bare board BB2
Level measurement tools: All tools
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 80.000mm/ 50.000mm
3 ID: pos.:
Bad board mark pos.: 20.000mm/ 25.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm

The PCB header information in this box applies to the PCB in

Figure 7-18.

Upper right corner

A = Bad board mark label. 55
BB2
50 F2
B = Board level measuring TV2
point for mount tools.

C = Board level measuring

point for glue tools. A
25

B C
0 F1
-5

-5 0 20 30 40 80 85
Lower left corner

Figure 7-18. PCB header information

The text Lower left corner and Upper right corner in the figure is
explained under PCB size on page 7-24.
Entries in the PCB header information box:

Name
The PCB name.

Comment
User comment text.

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Level measurement tools

TPSys measures the board height before assembling. A list of allowed
tools to use when measuring the board level can be defined. See
further page 7-39.

No. of fiducial marks

Number of fiducial marks on the PCB. Minimum 2 and maximum 3
fiducial marks are allowed.

Mark 1 ID, 2 ID, 3 ID

The names of the fiducial marks. Automatic fiducial mark search
requires the fiducial marks to be defined, learned, and stored in the
Fiducial Mark List.

pos.
The X/Y coordinates of the PCB fiducial marks. These values are
related to the PCB coordinate system. You can set these coordinate
values either by typing the values or, if you have a PCB on the
assembly table, by pressing <F1> and centering the PCB fiducial
marks using the camera.

If you type an approximate value before pressing <F1>, then you

will save machine movement time.

Bad board mark pos.

Bad board label for marking defective PCBs included in panels.
R2 Marked PCBs will be skipped at assembling.

These X/Y coordinates indicate the center of the bad board label, in
the PCB coordinate system.
Y
Use a low contrast label if you put it on a high contrast area, for
X instance where there are many visible leaders, and vice versa. More
information about bad board marks is found in the Switches section,
in Appendix B.

Mount tool test pos.

The position where the board level is measured with mount tools.
These X/Y values are related to the PCB coordinate system. Board
level measuring is further detailed on page 7-39.

Glue tool test pos.

The position where the board level is measured with glue tools. These
X/Y values are related to the PCB coordinate system.

Note that adhesive will be applied on the defined position if the

adhesive dispensing is on. So, avoid using the same measuring
position for mount tools and glue tools, otherwise the mount tool tip
will be sticky.

Board level measuring is further detailed on page 7-39.

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Board Level Measurement

Place the board level measuring points on PCBs even though the
1 F2 PCBs are included in panels, because if you have placed the
measuring points on the panels (1) the PCBs cannot be assembled as
F2
individual PCBs, if removed from the panels.
2
If a panel is being programmed, then it is preferable to select a
measuring point at which the PCB is fixed to the panel (2), as the
board level is probably most representative in such a position. Avoid
free milled corners (3).

4 Do not select a measuring point at which a component will be

mounted (4). If you intend to after-mount components which was not
available at the first assembly, the component at the measuring point
may already be mounted.
3
Ensure that the position does not coincide with holes or recesses in
the board.

At assembly, an allowed tool will be used to do the measuring of the

All tools board level. If none of the accepted tools is available, the assembly
All indicator tools stops with a message on the message log.
A12
A13 If the board height is measured using any tool the optimizer thinks
A14
A23
is good, for instance the last tool used or the next tool to be used, then
A24 there may be problems. Maybe there is not space enough for a large
A34 tool. Some PCBs may require the low force that you can get only by
B12 using indicator tools or HYDRA tools.
B13
B14 In Level measurement tools (see PCB Header Information box on
B23
B24
page 7-37) the allowed tools are specified and can be chosen from a
B34 list.
C12
C13 The default value for this parameter is All tools. To get the list, press
C14 <Insert>.
C23
C24 The new parameter can be exported, imported and printed in the
C34
D12
same way as parameters.
D13
D14
D23
D24
D34
H00
H01
H02
H03
H04
H06

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Panel List
The Panel List contains all panels stored in the machine system, and
in the TPSys netwrk, if shared databases. No PCBs are included in
this list. All the panels are accessible and can be modified, deleted
and copied. New panels can be created as well.

You can open the Panel Editor from this window and position PCBs.
Furthermore, from the Panel Editor you can open the PCB Editor.
You have thus access to all the editors needed to create and modify
panels and included PCBs. See the structure diagram of the Mount
Lists on page 7-7.

If the layout is loaded, you can also use the camera to define panel
and PCB fiducial marks, define PCBs in panels, and to position
components on PCBs.

The Panel List is opened by selecting the Panels option in the

Editor menu

The Panel List Editor is shown in Figure 7-19.

Function keys in the Panel List Editor:

Edit panel
By pressing <Enter> the highlighted panel can be modified in the
Panel Editor, see page 7-14.
Enter
Insert new
A new panel can be created by pressing <Ins> and entering a new
Ins
name.

Delete
The highlighted panel can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Copy
The highlighted PCB can be copied by pressing <F9> and entering
F9
a new name. It is possible to copy the PCBs in the panel so that they
are no longer affected by subsequent changes to the originals.

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* PANEL LIST EDITOR *

Panels
TV2-P2 Enter Edit panel
TV3RGB-P3 Ins Insert new
Del Delete
F9 Copy

Name: TV2-P2
Comment: Panel, bare board BB2x2
Level measurement tools: All tools
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 200.000mm/ 70.000mm
3 ID: pos.:
Bad board mark pos.: 0.000mm/ 0.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm
Lower left corner: 0.000mm/ 0.000mm
Upper right corner: 0.000mm/ 0.000mm

Brian 14:52

Figure 7-19. Panel List Editor

Exit
Press <Esc> if you want to exit the Panel List Editor and return to
Esc
the main window.

Entries in the Panel List Editor:

Panels
This box contains all panels stored in the system, and in the TPSys
network, if shared databases are used. Use the arrow keys or
<PgUp>, <PgDn>, <Home>, or <End> to select panel. You can
search for a panel in the list by simply entering the first characters
of the panel name.

Panel information box

This box contains the panel header information of the highlighted
panel, that is name, comment text, and positions of fiducial marks,
bad board labels, and board level test points.

Except for the two last lines in the box, Lower left corner and Upper
right corner the information in this box is detailed in the Panel
Header Information section on page 7-21.

Lower left corner, Upper right corner

These lines indicate the panel size not used for component
placement, see the explanation under Panel size on page 7-14.

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PCB List
The PCB List contains all PCBs stored in the system, and in the
TPSys network, if shared databases are used. No panels are included
in this list.

All the PCBs are accessible and can be modified, deleted and copied.
New PCBs can be created as well.

You can open the PCB Editor from this window and make any
modifications on the PCBs. See the structure diagram of the Mount
Lists on page 7-7.

If the layout is loaded, you can also use the camera to, for instance,
define fiducial marks or position components.

The PCB List is opened by selecting the PCBs option in the Editor
menu.

The PCB List Editor is shown in Figure 7-20.

Function keys in the PCB List Editor:

Edit PCB
By pressing <Enter> the highlighted PCB can be modified in the
PCB Editor, see page 7-24.
Enter
Insert new
A new PCB can be created by pressing <Ins> and entering a new
Ins
name.

Delete
The highlighted PCB can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Copy
The highlighted PCB can be copied by pressing <F9> and entering
F9
a new name.

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* PCB LIST EDITOR *

PCBs
TV1 Enter Edit PCB
TV2 Ins Insert new
TV3B Del Delete
TV3G F9 Copy
TV3R

Name: TV1
Comment: PCB, bare board BB1
Level measurement tools: All tools
No. of fiducial marks: 2
Mark 1 ID: Ro-1.0 pos.: 0.000mm/ 0.000mm
2 ID: Sq-1.0 pos.: 200.000mm/ 70.000mm
3 ID: pos.:
Bad board mark pos.: 0.000mm/ 0.000mm
Mount tool test pos.: 30.000mm/ 0.000mm
Glue tool test pos.: 40.000mm/ 0.000mm
Lower left corner: 0.000mm/ 0.000mm
Upper right corner: 0.000mm/ 0.000mm

Brian 14:58

Figure 7-20. PCB List Editor

Exit
Press <Esc> if you want to exit the PCB List Editor and return to
Esc
the main window.

Entries in the PCB List Editor:

PCBs
This box contains all PCBs stored in the system, and in the TPSys
network, if shared databases are used. Use the arrow keys or
<PgUp>, <PgDn>, <Home>, or <End> to select PCB.

You can search for a PCB in the list by simply entering the first
characters of the PCB name.

PCB information box

This box contains the PCB header information of the highlighted
PCB, that is name, comment text, and positions of fiducial marks,
bad board labels, and board level test points.

Except for the two last lines in the box, Lower left corner and Upper
right corner the information in this box is detailed in the PCB Header
Information section on page 7-37.

Lower left corner, Upper right corner

These lines indicate the PCB size not used for component placement,
see the explanation under PCB size on page 7-24.

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Miscellaneous Lists
This chapter describes lists other than the four main lists. These are:

• Fiducial Mark List, page 8-2.

Name and data of defined fiducial marks are stored in this list used
for automatic fiducial mark search.

• Glue Dot List, page 8-8.

Names and data of defined glue dots are stored in this list used for
glue application.

• User List, page 8-13.

User names, privileges and passwords are stored in this list used
for logging on the system.

Special characters
National special characters and some non-letter/non-figure
characters cannot be entered into the system, for instance in board
names and layout names.

The following special characters are, however, allowed to be used:

"'`\$;^@

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Fiducial Mark List

The purpose of the Fiducial Mark List is to store data for fiducial
marks. This information is then used by the system to locate boards
automatically by recognizing and positioning fiducial marks. Also,
the list is a bank of recognizable fiducial marks that can be used to
locate other boards, provided the marks have exactly the same
shapes.

The Fiducial Mark List is opened by selecting the Fiducial Marks

option in the Editor menu.

The Fiducial Mark Editor is shown in Figure 8-1.

Function keys in the Fiducial Mark Editor:

Edit fiducial mark

By pressing <Enter> the highlighted fiducial mark can be modified.

Enter

Insert new
A new fiducial mark can be added to the list by pressing <Ins> and
Ins
typing a new name.

Delete
The highlighted fiducial mark can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

View
A graphic overlay of the highlighted fiducial mark is shown on the
F1
screen by pressing <F1>. This consists of edge points or a circle.

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* FIDUCIAL MARK EDITOR *

Fiducial Marks
Enter Edit fiducial mark F1 View
Ro-1.0
Ins Insert new F7 Teach
Sq-1.0
Del Delete F8 Verify
Fiducial Mark Information
Name: Ro-1.0
Camera ID:
Comment: Round 1.0mm
Generic mark taught: Yes
White on black: Yes
Symmetric mark: Yes
Teach area X size: 2.5mm
Y size: 2.5mm
Object filter size: 0.3mm
Verify area X size: 5mm
Y size: 5mm
Correlation: 80
Fiducial mark type: Circle
Diameter: 0.971
Diameter tolerance: 25
Circle contrast: 20

Brian 17:04

Figure 8-1. Fiducial Mark Editor

Teach
The system can learn to recognize the highlighted fiducial mark by
F7
pressing <F7>. Center the cross hairs on a fiducial mark using the
joystick or trackball and press <Enter>, see Figure 8-2 on page 8-5.

When the fiducial has been located a graphic box appears. This
defines the area in which the system will learn the fiducial. The box
shall be slightly bigger than the fiducial. The size of the box is
adjusted by using the joystick or the trackball. Confirm the size by
pressing <Enter>. Finally set the size of the area where the fiducial
is searched during board location. This is also done by adjusting the
size of a graphical box using the joystick or the trackball and
confirming with <Enter>.

Verify
The highlighted fiducial mark can be verified by pressing <F8>.
F8

Exit
Press <Esc> if you want to exit the Fiducial Mark Editor and return
Esc
to the main window.

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Entries in the Fiducial Mark Editor:

Fiducial Marks
This box contains all the fiducial marks stored in the system. Use the
arrow keys or <PgUp>, <PgDn>, <Home>, or <End> to select a
fiducial mark.

You can search for a fiducial mark in the list by simply entering the
first characters of the fiducial mark name.

Fiducial Mark Information

This box contains information about the highlighted fiducial mark.

Name
The fiducial mark name, which must be a unique name or number.

Comment
User comment text.

Fiducial mark type

Press <Space> to select either Generic or Circle.

Generic
Select this option if the fiducial mark shape is not circular. The
system will search for a fiducial mark with the same shape as the
mark learned.

Circle
Select this option if the fiducial mark is circular. The system will
always search for a circular fiducial mark, and the Diameter will be
updated with the detected fiducial mark diameter each time it is
found. The Diameter value is updated also in the fiducial mark
database.

Generic mark taught

This otionis only available for the Generic alternative above.
Yes – The system has learned the fiducial mark and is able to
recognize it.

No – The system has not learned the fiducial mark and is not able
to recognize it.

Yes or No is indicated by the system and cannot be changed from the

keyboard. No is changed to Yes after the system has learned the
fiducial mark.

Figure 8-2 shows how to center a fiducial mark in order to teach the
system to recognize and center the point automatically.

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Teach mark Ro-1.0

Center on mark
Ready
Cancel

15.107mm/ 15.024mm Brian 17:06

Figure 8-2. Teaching a fiducial mark

White on black
Yes – The fiducial mark is brighter than the background.
No – The fiducial mark is darker than the background.

To toggle between Yes and No press <Space>.

An example of the Yes option is shown in Figure 8-2 where the

fiducial mark is brighter than the background.

Symmetric mark
Yes – The geometric shape of the fiducial mark is symmetrical, for
instance rectangular. The mark center is calculated to be in
the geometrical center, not the position set during the
centering procedure (see Figure 8-2).
No – The geometric shape of the fiducial mark is asymmetrical,
for instance a leader corner. The mark center is the position
set during the centering procedure.
To toggle between Yes and No press <Space>.

Always try to use a symmetrical fiducial mark, and this option set to
Yes.

To avoid incorrect board and component positioning, do not set this

option to ‘No’ for symmetrical fiducial marks.

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Teach area X size/Y size

The size, in X/Y coordinates, of the area scanned when the system
learns a fiducial mark. This area is normally set using the joy-stick or
trackball. The values may also be entered directly into this field.

Object filter size

This is a pixel grid size used as a filter when the system learns the
fiducial marks.

Set 0.3mm for filled usual fiducial mark shapes. You can use this
value for the smallest points (0.8mm) as well as for the largest ones.

If the fiducial mark is not filled, then you may have to increase the
value to avoid detecting spots on the inner contour line, see the
figure.

If the fiducial mark has a symmetrical but unusual shape, then you
may have to increase the value to get the detected spots to be spread
on all the geometrical parts of the object. If the 'plus' fiducial mark in
the figure is for instance 1.5mm, try to set 1.0mm.

If you cannot see the definition spots on the screen, make sure the
0041.0022 Mark true edges parameter is set to Yes and the 0041.0023
Mark possible edges parameter is set to No.

Verify area X size/Y size

The size, in X/Y coordinates, of the area which will be scanned by the
vision system at automatic fiducial mark search.

A small value means that the automatic fiducial mark search is

carried out fast because only a small area is scanned, but, the
machine can only handle a small deviation from the previous
location. A big value gives the opposite effect. Maximum value is
7.5mm for both X and Y.

This area is normally set using the joy-stick or trackball. The values
may be entered directly into this field.

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Correlation
The percentage correlation between the learned and a searched
fiducial mark.

A lower value means that the system accepts greater deviations

between learned and searched fiducial marks (less critical).

A higher value means higher acceptance requirements (more

critical).

Default value: 80%.

Diameter
An approximate diameter can be entered when a Circle type fiducial
mark is created. When the system is learned to recognize the fiducial
mark, this value is updated to the detected diameter.

Used for Circle type fiducial marks only.

Diameter tolerance
Accepted tolerance for Diameter in percent.

Default value: 25%.

Used for Circle type fiducial marks only.

Circle contrast
The minimum contrast required between the fiducial mark surface
and the surrounding background.

Default value: 25.

Used for Circle type fiducial marks only.

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Glue Dot List

The purpose of the Glue Dot List is to store names and data for
defined glue dots used by the Package List Editor (there is a section
on glue dots in the Glue Dots description) in Chapter 5.

The Glue Dot List is also is a bank of defined glue dots that can be
used for new packages by simply entering the glue dot names.

The Glue Dot List is opened by selecting the Glue Dots option in the
Editor menu.

The Glue Dot Editor, containing five default glue dots provided with
TPSys, is shown in Figure 8-3.

Function keys in the Glue Dot Editor:

Edit glue dot

By pressing <Enter> the highlighted glue dot can be modified.

Enter

Insert new
A new glue dot can be added to the list by pressing <Ins> and typing
Ins
a new name.

Delete
The highlighted glue dot can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box.

Apply and view

The highlighted glue dot can be applied, viewed and measured by
F7
pressing <F7>, see page 8-12.

Exit
Press <Esc> if you want to exit the Glue Dot List Editor and return
Esc
to the main window.

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* GLUE DOT EDITOR *

Glue Dots
Enter Edit glue dot
Dot-0.5mm
Ins Insert new
Dot-0.8mm
Del Delete
Dot-1.5mm
F7 Apply and view
Dot-2.2mm
Dot-3.0mm

Glue Dot Information

Name: Dot-0.5mm
Comment:
Tool: C12
Dip depth in glue: 0mm
Wait time in glue: 64ms
Slow up dist. from glue: 1.2mm
Slow up force from glue: 5N
Slow up speed from glue: 80mm/s
Wait time b/a X run: 0ms
Wait time on PCB: 0ms
Slow up dist. from PCB: 1.2mm
Slow up force from PCB: 5N
Slow up speed from PCB: 80mm/s

Brian 17:10

Figure 8-3. Glue Dot Editor

Entries in the Glue Dot Editor:

Glue Dots
This box contains the names of the defined glue dots. Use the arrow
keys or <PgUp>, <PgDn>, <Home>, or <End> to select a glue
dot.

You can search for a glue dot in the list by simply entering the first
characters of the glue dot name.

This list contains the five default glue dots provided with TPSys.

Glue Dot Information

This box contains information about the highlighted glue dot.

Name
The glue dot name, which must be a unique name or number.

Comment
User comment text.

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Tool
Glue tool for application of adhesive.

The tool coding is detailed in Chapter 3.

If you press <Space> in this field, installed tools are shown in a

popup menu.

Dip depth in glue

The depth to which the tool is dipped into the glue. The figure shows
the depth schematically, in the reality the depth is measured after
the glue levelling arm.

This field is set to 0mm for the five default glue dots provided with
TPSys. The reason is that the depth is entirely dependent on the glue
characteristics.

If you have no experience of a particular glue, try first 0mm, test the
glue dot using the test feature described on page 8-12 and increase
the depth gradually until you find an appropriate depth.

Avoid using different glue dot types with different depths for the
same glue tool. Larger glue dots than expected for the smallest of
these dots will be the result.

If you want to be sure of the glue dot size after changing from a
higher to a lower depth value, clean the tool.

Wait time in glue

Wait time in the glue reservoir required for the glue to adhere to the
tool tip.

Slow up dist. from glue

A distance, from the start position in the glue, at which the force and
speed (see below) can be decreased to ensure that the glue remains
on the tool.

Slow up force from glue

The vertical maximum force used when the glue tool moves up the
first distance from the glue surface. The first distance is defined in
the previous Slow up dist. from glue field.

Slow up speed from glue

The vertical maximum speed used when the glue tool moves up the
first distance from the glue surface. The first distance is defined in
the Slow up dist. from glue field above.

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Wait time b/a X run

1 2 The wait time before and after the X-wagon movement, that is before
the X wagon starts moving (1), and after the X wagon has reached its
position (2).

Wait time on PCB

Wait time before the glue tool is lifted from the board surface when
applying glue.

Slow up dist. from PCB

A distance, from the start position at the PCB board surface, at which
the force and speed (see below) can be decreased to ensure that the
glue remains on the PCB surface.

Slow up force from PCB

The vertical maximum force used when the glue tool moves up the
first distance from the PCB surface. The first distance is defined in
the previous Slow up dist. from PCB field.

Slow up speed from PCB

The vertical maximum speed used when the glue tool moves up the
first distance from the PCB surface. The first distance is defined in
the Slow up dist. from PCB field above.

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Verifying a Glue Dot

By pressing <F7> in the Glue Dot Editor (page 8-9) a glue dot can be
F7
applied, viewed and measured.
Before applying the glue, you are asked to find a place to measure the
board level on:

Find a place to measure board level on

Ready
Cancel

Move the cross hairs to a place to measure the board level on and
press <Enter>.

Find a place where

to apply the glue
dot

45.106mm/ 15.023mm Brian 17:12

Figure 8-4. Verifying a glue dot

Move the cross hairs to an appropriate place to apply a glue dot, and
press <Enter> when the Ready option is highlighted.

A glue dot is applied, provided the machine has a glue station

inserted and indicated glue tool installed.

The glue dot can be measured by means of the cross hairs scales, see
Figure 8-4.

The glue dot testing mode is exited by selecting the Cancel option or
Esc
by pressing <Esc>.

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User List
In TPSys there is a user security feature in which passwords are used
to prevent from unauthorized data modification. User names,
passwords and individual data modification privileges are used for
this feature.

The user security is configured in a User List Editor, described

overleaf.

The user security feature can be enabled or disabled from the TPSys
main menu (description on page 8-19).

System locking
It is not possible to lock the system for all users by manipulating the
security feature. However, in a network system with shared User
database, the client system might be locked if manipulating the user
privilege levels and the log on/off feature in the client and server
systems. But, a locked client system can always be accessed again by
changing the User privilege level in the server system.

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User List Editor

User information in the User List can be modified when the security
is either disabled or enabled.

• If disabled, any user can modify the security information without

logging on.

• If enabled, the user must be logged on with the User privilege level
set to High.

The currently logged on user name is shown at the bottom of the

screen, see Brian in Figure 8-5.

The User List Editor is opened by selecting the Users option in the
Editor menu.

The User List Editor is shown in Figure 8-5.

Function keys in the User List Editor:

Edit user
By pressing <Enter> the highlighted user privilege levels can be
modified.
Enter
Insert new
A new user can be added by pressing <Ins> and typing a new name
Ins
and password.

Delete
The highlighted user can be deleted by pressing <Del> and
Del
confirming the deletion in a popup box, provided the user is not
currently logged on, which is indicated with an asterisk (*) in the
user list.

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* USER LIST EDITOR *

User
Bill Enter Edit user
*Brian Ins Insert new
David Del Delete
Eric F2 Change password
John

Name: Brian
Access rights
Layout: High Board: Standard
Component: High Package: High
Glue dot: High Fiducial marks: High
Magazine: Standard Tray type: High
Magazine kit: Low User: High
Switches: Low Mount/glue switch: High
Parameter: High Service: High
Management: High

Brian 12:16

Figure 8-5. User List Editor

Change password
The password for the highlighted user can be changed after pressing
F2
<F2>. Passwords are sensitive to upper/lower case.

Exit
Press <Esc> if you want to exit the User List Editor and return to
Esc
the main window.

Entries in the User List Editor:

User
The users defined in the system.

Use the arrow keys or <PgUp>, <PgDn>, <Home>, or <End> to

select user.

* A user currently logged on is marked with an asterisk (*). Only one

user can be logged on the system in on-line mode. Several users can,
however, be logged on the system in off-line mode.

Name
User name, which must be a unique name for each user.

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Access rights
Privilege levels for the highlighted user can be set individually for a
number of system actions, further described below.

The privilege levels are selected by pressing <Space>.

High and Low privilege levels can be chosen for most of the actions.
For some of the actions, an additional Standard privilege level can be
selected.

The three privilege levels are intended for the following purposes:

Low
Intended for minimal trained operators. It allows to run the
system, locate boards and re-load components, but it does not allow
to change any settings.

Standard
Intended for trained operators and it allows also to modify the
contents of the magazines, and to modify board positions in panels.

High
Intended for programmers and service personnel. It has no
limitations, that is any placement and system settings can be
changed.

Actions allowed for the three privilege levels are described below.
Standard points out only what is allowed in addition to the Low level.
High is not included since it has no limitations.

Layout: Low
Layout Editor. • Move the board position fiducial marks.

Board: Low
PCB Editor. • Toggle the 'D' and 'M' status in the Items list.
• All actions in the View position mode except for changing the
component position.

Board: Standard
PCB Editor. • Modify the component angle, position and local fiducial mark
positions.

• Modify the following PCB header information:

– Bad board mark pos.
– Mount tool test pos.
– Glue tool test pos.
Panel Editor. • Move the PCB position fiducial marks.
• Modify the following panel header information:
– Bad board mark pos.
– Mount tool test pos.
– Glue tool test pos.

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Component: Low
Component List Editor. • No modification is allowed, but the F6 feature can be used.

Package: Low
Package List Editor. • No modification is allowed.

Glue dot: Low

Glue Dot List Editor. • No modification is allowed, but you can apply and view a glue dot
using the Apply and view option in the menu.

Fiducial marks: Low

Fiducial Mark List Editor. • No modification is allowed but you can verify a fiducial mark using
the Verify option in the menu.

Magazine: Low
Magazine List Editor. • Perform the following magazine actions:
– Locate magazine
– Vibrate magazine
– Vibrate all magazines
Y-Wagon Magazine Editor. • Perform the following actions:
Tray Wagon Magazine Editor. – Reload
Pallet Magazine Editor. – Remove from magazine

• Modify the following tray information:

– Quantity
– Position
TEX List. • Perform the following actions:
– Locate pallet position
– Refill all trays
Tray Elevator. • No restrictions (the Tray Elevator is not controlled by the user
security feature). However, the pallet trays are restricted.

Magazine: Standard
Magazine List Editor. • Modify all feeder contents information accessed by selecting the
Edit feeder contents option in the menu.
Y-Wagon Magazine Editor. • Perform the following actions:
Tray Wagon Magazine Editor. – Insert new
Pallet Magazine Editor. – Delete
– Toggle sort order

• Modify the tray information, for instance Name/barcode, Comment

and Batch ID.
Magazine Kit List Editor. • Load a Magazine Kit into a Magazine List by selecting the Apply
option in the menu.

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Tray type: Low

Tray Type List Editor. No modification is allowed.

Magazine kit: Low

Magazine Kit Editor. • No modification is allowed, but you can change the sort order by
selecting the Toggle sort order option in the menu.

User: Low
User List Editor. • No modification is allowed, neither of any user privileges nor
passwords.

To avoid the risk of locking everyone out from the system, the
currently logged on user cannot set his own User level to Low.

Switches: Low
No modification is allowed of the switches accessed by selecting the
Switches option in the Production menu.

Mount/glue switch: Low

No modification is allowed of the mount and glue switches accessed
by selecting the Mount/Glue Switches in the Production menu.

Parameter: Low
Parameter List Editor. No modification is allowed of the parameters accessed by selecting
the Parameters option in the Editor menu.
Schedule Backup. No access is given to the Schedule Backup feature in the Utility
menu.

Service: Low
Service tools. No access is given to the Installation and Diagnostics service tools in
the Utility menu.

Management: Low
If this field is set to Low then the following actions are, contrary to
the above descriptions, not allowed to be performed:

• Clear the event log (the Clear Event Log option in the Utility
menu).

• Clear management data (the Clear Management Data option in the

Production menu).

• Delete management data (the Delete Management Data option in

the Utility menu).

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Security On/Off
The security can be switched on/off from the TPSys main menu in
on-line mode, provided the User privilege level is set to High for the
currently logged on user.

To enable or disable the feature, select the User Access System

option in the Utility menu ...

Utility
I Import
X Export
T Installation
D Diagnostics
M Re-Initiate Motor Controllers
O Re-Initiate Conveyor
C Conveyor Pass-Through Mode
G Login / Logout
A User Access System
W Web Interface Setup
E Clear Event Log
N Delete Management Data
-------------------------------
B Backup
R Restore
H Schedule Backup
S Save System Status
F Format DOS Diskette
U Units
L Language
K Desktop Resolution

... and the desired option for enabling or disabling the user security
feature ...

User Access System

N On
F Off

... then, enter your name in the popup box shown:

This dialog box is not shown if
a user with User privileges set
User with HIGH access right
to High disables the feature.
Name: Brian
Password: ******

Or, you can simply press <Enter> and select user from the list.
Enter the password and press <Enter>.

An information box will indicate that the user security feature is

switched on or off.

Note that only users for which the User privilege level is set to High
are allowed to switch the user security feature on or off.

Log On/Off
How to log on and log off is described in the User Access section in
Chapter 2 of the Operator's Manual.

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MYDATA automation AB Appendix A – Packages

Appendix A – Packages
The purpose of this appendix is to show the most common packages
and to be a guide for programming new packages.

The appendix contains a package survey over the most common

packages that are pre programmed as default in TPSys. It also
contains a description of how to program a new package.

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How To Program a New Package

The fastest way to program a new package is to follow the below
description and use the information on the following pages.

New package data can also be created automatically by using

Autoteach, described on page A-3.

1. Find the package type in the survey on page A-16.

2. Look up the page indicated for the found package type.
3. Insert the data of the new package, for instance the package size
and number of leads, in the ‘TPSys package name’ string.

4. In the Package List, select that package which is closest to the

new one, press <Ins> to create a new package with the same
data as the selected package, and enter a new name for the
package.

5. Finally, modify that package data which differ between the

selected package and the new package.

See also the programming hints on the following pages.

The TPSys Package List, opened by selecting the Packages option

in the Editor menu:

Editor
C Components
P Packages
----------------
L Layouts
A Panels
B PCBs
----------------
R Parameters
----------------
F Fiducial Marks
G Glue Dots
U Users

The TPSys Package List is described in the Programming Manual

Chapter 5.

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MYDATA automation AB Appendix A – Packages

Autoteach
Autoteach is a system tool which automatically creates package
definitions. It measure mechanical package data by taking an image
and analyzing it by means of automatic image analysis. On
components where the leads lie on a grid, Autoteach is able to analyze
the measured coordinates to find the pitch of the grid. The leads can
be adjusted to lie on the detected grid and the effect of measurement
errors eliminated.

Autoteach also makes it possible to automatically find good vision

settings for packages.

The user activates Autoteach by highlighting a package in the

F5
Package List Editor and then pressing <F5>. The Package List
Editor is described in Chapter 5.

A window with the Autoteach data is shown, see Figure A-1.

* AUTOTEACH PACKAGE 00-ABC *

Packages
00-ABC Enter Edit package F5 Autoteach
1206-12 Ins Insert new F6 Edit optical cent.
1206-16 data
1210-07 Del Delete F7 Edit lead groups
1210-12 F3 Edit accelerations F8 Edit centering phases
1505-10 F4 Test centering F9 Edit glue data
1805-07
1812-07
Pick Up Component
1812-12
1812-20 Package height: 2.35mm
1825-10 Tool: C23
218-18
AL-CAP Package type: Leaded device
BGA-13*13-P Teach: Geometrical data
BGA-14*14-C Pick from: Y wagon (0°)
BGA-15*15-P Feeder/Tray:
BGA-19*19-PE
M3216-16
M3528-19
M3819-16
Brian 14:16

Figure A-1. Autoteach window

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Entries in the Autoteach window:

Package height
The height of the package cannot be measured by Autoteach. It must
be entered manually before activating Autoteach.

Tool
The tool to be used when picking the package must be selected in the
Package List Editor before activating Autoteach. This information
cannot be changed in the Autoteach window.

Package type
Select from a list the type of package to be taught. Toggle between
Ball device, Leaded device, Outline or Chip by pressing <Space>.

Teach
Specifies which kind of data that shall be taught. Select if Autoteach
should learn:
– Geometrical and vision data. This alternative teach both
geometrical and vision data.
– Geometrical data. Autoteach will only measure the positions of
the leads, the dimension of the leads and so on.
– Vision data. Autoteach will only determine good vision settings
for the package.

Pick from
Choose if the component should be picked from the Y wagon or a
magazine. Toggle between Y wagon (0°), Y wagon (90°), Tray wagon
(0°), Tray wagon (90°), or Feeder/Tray,by pressing <Space>.

If Y wagon or Tray wagon is chosen, TPSys asks for three corners of

the component to be located. Center the cross hairs on them by using
the joystick. Autoteach assumes that the component lies in zero
degrees when picking a component from these magazines.

Picking the component from the Y wagon or Tray wagon is slightly

more robust than picking from a feeder. If the component is picked
from these magazines, Autoteach knows the extent of the component
in the image and does not have to detect this automatically.

Feeder/Tray
If the package is loaded into a magazine, specify which feeder or tray
to pick from if Feeder/Tray was chosen above.

Press <Enter> and a new pop-up window appears.

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Teach Types
It is possible to select if Autoteach should teach both geometrical and
vision data, only geometrical data or only vision data. If geometrical
data is chosen Autoteach will measure the positions of the leads, the
dimension of the leads etc. If vision data is chosen Autoteach will
determine good vision settings for the package.

Geometrical data
If only geometrical data is chosen, Autoteach will only measure the
mechanical data of the package. Illumination and vision settings for
the package will not be affected by this operation.

This is a good alternative when a similar package to the new one exist
in the package editor. A package for which vision centering works
well and that is similar in appearance to the new package. Make a
copy of the existing package and run Autoteach for only geometrical
data. Creating a package in this way saves the time spent trying to
find a good illumination. If the vision settings does not work well
enough for the new package, teach the vision data later.

Vision data
This alternative is used when the geometrical data for a package is
correct, but poor vision settings makes optical centering work poorly.
Running this alternative will leave all geometrical data unchanged,
except the lead dimension. The lead dimensions of the package may
have to be adjusted because the size of a lead in the image varies with
illumination.

Teaching both geometrical and vision data

It is possible to teach both geometrical and vision data in the same
run. Autoteach will first measure the geometrical data and show the
result. If the measured geometrical data is approved, Autoteach will
proceed to the teaching of vision data.

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Vision data and the DVC

If the DVC is used to teach vision data, TPSys must know the
position of the component in the image. Autoteach will show an
image of the component and asks for the location of the corners. Use
the trackball or the joystick to mark the corners.

On some machines part of the DVC image will be outside the screen.
This means that it is possible for a corner of the component to be
outside the visible part of the image. Move the image by using
<Ctrl> + arrow keys. Zoom in and out using <Ctrl> + <Page Up>
or <Ctrl> + <Page Down>.

Components picked from the Y-wagon are no problem. This because

three corners of the component must be located for the machine to be
able to pick it. Teaching both geometrical and vision data is also no
problem, since the position of the leads have already been detected.

Vision data for chip packages

For Chip component, optical centering can be performed either by
looking at the whole chip outline or looking at the leads only.
You will b asked to select the method to use before vision data
teaching is performed. You can select the following :
– STANDARD This will use the whole component outline.
– LEADS ONLY This means the vision system will only look at
the leads on the chip. This is useful when the whole component
outline is hard to see in the image.

Always select the camera that will be used for optical centering of the
package during production. Autoteach only sets up the vision data for
the selected camera. Illumination settings for other cameras are left
unchanged. Teaching a package in a Linescan camera for example,
will not automatically work for SVC or OVC.

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Autoteach of BGA Packages

If Ball device was chosen in Figure A-1 and teach Geometrical data,
the following window appears:

Autoteach parameters
Camera: Linescan
Number of leads: Auto
Lead type: Auto
Adjust to grid: Yes
X-wise pitch: Auto
Y-wise pitch: Auto
Algorithm: Auto
Dual shot: No
Illumination: Auto
Light level: ---
Dark field: ---
Ambient light: ---
Front light: ---

This window allows the following parameters to be set:

Camera
The camera that shall be used for the Autoteach procedure can be set.
The list contains all the available cameras in the machine except the
Hydra camera, which cannot be used to teach packages.

Always select the camera that will be used for optical centering of the
package during production.

Number of leads
If this field is set to Auto the function automatically tries to detect the
number of solder balls on the package. If one knows the number of
solder balls it can be entered directly into this field to help the
function.

Lead type
If this field is set to Auto the function automatically tries to detect
which type of lead the package has. The lead type can also be entered
directly into the field.

Adjust to grid
On most BGA components the solder balls lie on standardized grids.
This means that the measured coordinates of the solder balls can be
adjusted to lie on such a grid, thus eliminating the effect of
measurement errors. This is done if the field is set to Yes. If set to No
Autoteach treats every detected lead as a lead group and saves the
coordinates without adjustment.

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X-wise pitch
This field can only be edited if the Adjust to grid field above is set to
Yes. If the pitch field is set to Auto the function measures the x-wise
pitch of the package and compares it with known standardized
pitches. If one knows the pitch it can also be entered into the field.

Y-wise pitch
This field can only be edited if the Adjust to grid field above is set to
Yes. If the pitch field is set to Auto the function measures the y-wise
pitch of the package and compares it with known standardized
pitches. If one knows the pitch it can also be entered into the field.

Algorithm
This field specifies which algorithm should be used when locating the
solder balls:

Auto
Autoteach automatically chooses the algorithm that it thinks
will work best.

Bright on dark
Autoteach searches for bright solder balls on a dark component
body.

Bright on bright
Autoteach searches for bright solder balls on a bright component
body.

Dark on bright
Autoteach searches for dark solder balls on a bright component
body.

Flip chip
Works as Bright on dark but with some added robustness. If
Illumination (see below) is set to Auto illumination will be set to
a value appropriate for flip-chip components.

Dual shot
If this field is set to Yes two images will be taken of the component
and merged into one image that will be analyzed by Autoteach. This
enables the user to teach packages that are larger then the camera
Field of View.

Illumination
These fields only affects the illumination used for Autoteach and are
not stored in the Package list.

This field has the following two options:

– Auto
Autoteach will use the default illumination for the package type
that is defined in the Autoteach parameters.
– Manual
The illumination fields can be edited and one can specify the
illumination that Autoteach uses.

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* AUTOTEACH RESULT *
Number of leads 71 F1 Edit detected leads
X-wise pitch 0.8mm Enter Save package data
Y-wise pitch 0.8MM
Lead type PBGA

Figure A-2. Autoteach result

Leave the pop-up window by pressing <Enter> and the machine

picks the component and shows it to the specified camera. The image
is analyzed to locate the solder balls and the method measures pitch
and ball diameter. The result is shown in a window, see Figure A-2.

The detected solder balls are marked with red crosses. In the upper
left corner the system outputs the number of detected solder balls,
the measured pitch and the detected lead type.

Edit detected leads

F1
Press <F1> and a yellow cursor appears on the screen. The position
of the cursor is controlled by the joystick or the trackball. If
Autoteach has marked a feature that isn’t a lead, point at the mark
and pressing <Del> to delete the mark. If one or more leads are
missed they can be added by pointing with the cursor at the position
of the lead and pressing <Ins>. After leads have been edited, confirm
by selecting Ready in the upper left corner menu.

Save package data

The machine puts the component back and the result is exported to
Enter the Package List.

If the method failed to measure the package correctly, hit <Esc> and
Esc
the parameter window will reappear. Try changing one or several
parameters and teach the package again. For odd packages one may
have to set algorithm and illumination manually.

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Autoteach of Leaded Devices

If Leaded device was chosen as the package type in the Autoteach
window (Figure A-1) the following window appears:

Autoteach parameters
Camera: Standard
Adjustment of measured data: Auto
Assume leads on lines: ---
Distance between leads: ---
Pitch: ---
Fix package symmetries: ---
Lead type: GULLWING
Illumination: Auto
Light level: ---
Dark field: ---
Ambient light: ---
Front light: ---

This window allows the following parameters to be set:

Camera
Specify camera to be used. The list contains all the available cameras
in the machine except the Hydra camera, which cannot be used to
teach packages.

Always select the camera that will be used for optical centering of the
package during production.

Adjustment of measured data

Autoteach may not be able to measure the ideal position of each lead
due to measurement errors, slightly bent leads and such. Normally
leads of every lead group should lie on a straight line and the distance
between adjacent leads should be a multiple of the pitch. By using
this knowledge Autoteach can adjust the measured data to better
resemble an ideal package.

Auto
The default value of the field. Autoteach automatically decides
which assumptions seem to match the package currently being
taught. This setting works for a large majority of packages.

Custom
Manually controlling the assumptions made. If the field is set to
Custom the user will be able to edit the next four fields.

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Assume leads on lines

If set to Yes the detected leads will be adjusted to lie on straight lines
in 0°, 90°, 180° and –90°. This is the default value.

Distance between leads

Multiple of pitch
Distance between two neighboring leads will be adjusted to be
equal to a multiple of the pitch, this is the default value of the
field.

Arbitrary
Distance between the leads will not be adjusted.

Pitch
This field may be edited if Distance between leads above is set to
Multiple of pitch.

Enter the pitch of the package if it is known. Auto will measure the
pitch of the package and adjust it to the closest standardized pitch.
This is the default setting.

Fix package symmetries

Yes – Lead groups on opposite sides of the package will be adjusted
so that they have the same distance to the axis (‘1’ in
Figure A-3). Every lead group will also be adjusted so that
the distance from the two outer leads of the group to the axis
vertical to the group (2) is the same.

No – Symmetries will not be adjusted.

Figure A-3. Package symmetries

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Lead type
This field specifies the lead type of the package being taught. The
available lead types are GULLWING and J-BEND. You can toggle by
pressing <Space>.

Illumination
The last few fields control the illumination that is used when
teaching the package.

Auto
Autoteach will use the default illumination for leaded devices
that is defined in the parameters for Autoteach.

Manual
Illumination may be set manually for this field, and the
subsequent fields.

Press <Enter> and the result of Autoteach is shown on the screen

(see Figure below).

* AUTOTEACH RESULT *
Number of leads 36 F1 Edit detected leads
X-wise pitch 0.5mm Enter Save package data
Lead type GULLWING

Figure A-4. Autoteach result

If the parameters have to be edited, start by adjusting the parameter

that control the light level. This as the proportion of light from each
LED-group has been designed to fit the package type in question.

The detected solder balls are marked with red crosses. In the upper
left corner the system outputs the number of detected solder balls,
the measured pitch and the detected lead type.

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Edit detected leads

F1
Press <F1> and a yellow cursor appears on the screen. The position
of the cursor is controlled by the joystick or the trackball.

For leaded components the angle of the cursor is changed by pressing

the <+> or <–> key.

When adding to a leaded package, first align the direction of the

cursor to the angle of the lead that shall be added and then press
<Ins>. When deleting leads the angle doesn’t matter, just point the
tip of the cursor at the tip of the lead that shall be removed and press
<Del>.

After leads have been edited, confirm by selecting Ready in the

upper left corner menu.

It is also possible to abort the changes at any time during the

interactive add / remove by choosing cancel in the menu or by hitting
the Esc key.

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Autoteach of Chip and Outline Packages

Chip or Outline can be selected as the package type in the Autoteach
window (Figure A-1). Autoteach then only needs to know the length
and width of the package in order to create a package description.

– Picking from the Y wagon Three corners of the package must

be located if picked from the Y wagon. The component will not
be picked and shown to a camera if only Geometrical data is
taught. Only package length and width are reqiured by the
system, and these are calculated from the corners already
located. Mark the corners by using the joystick.

– Picking from a feeder A camera is neded to extract package

data if the component i picked from a feeder. The camera is
specified in a pop-up window. There is a list containing all the
available cameras in the machine. Press <Space> to see the list.
The machine picks the package and takes an image of it with the
specified camera. Autoteach will ask for the corners to be
located, which is done by using the joystick. The length and
width are then calculated from these marked corners.

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Error Messages for Autoteach

No leads found
You will get this message if Autoteach failed to find any solder balls
or leads. This may occur if the contrast between solder balls and the
component body is too small. Adjust the illumination and run
Autoteach again.

Leaded device
Need a high contrast between the lead and the background
around the lead.

Ball device
Try adjusting the Algorithm field (see page A-8) and run
Autoteach again. You can also specify the number of balls on the
package manually.

Failed to measure pitch

Autoteach failed to measure the pitch of the package.

The package may lack a grid or the method has not detected enough
balls or leads to measure the pitch.

If the pitch is known it can be entered manually in the Pitch field of

the Autoteach parameter window.

Unable to find more leads

Autoteach failed to add a lead when the <Ins> was pressed.

No more leads to remove

The <Del> was pressed in the result window but there were no more
leads to remove.

Unable to adjust the leads to a grid with the pitch x mm

The measured or manually entered pitch is out of range. If Pitch in
the parameter window was set to Auto try entering the pitch
manually.

Could not find all leads

This error occurs if the number of leads was set manually, but
Autoteach cannot find the number of specified leads.

Check that the number of entered leads is correct. Alternatively try

teaching the component using a better illumination, or using a
different algorithm.

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Package Survey
Those packages which are pre programmed and included in the
TPSys are shown below and are detailed on the following pages.

0201 to 2218 ................................................................................. A-17

Resistor Networks ........................................................................ A-19

BGA, CBGA, LBGA, MBGA, PBGA ............................................ A-21

CBGA, CCGA ................................................................................ A-23

M3216 to M8345 ........................................................................... A-25

MELF, Micro-MELF, Mini-MELF, Maxi-MELF ........................ A-28

PLCC ............................................................................................. A-30

CQFP, FQFP, LQFP, MQFP, PQFP, TQFP .............................. A-32

SO, SSOP ...................................................................................... A-34

SOD ............................................................................................... A-37

SOJ, LSOJ .................................................................................... A-39

SOT, SC ........................................................................................ A-41

TO ................................................................................................. A-44

TSOP, TSSOP .............................................................................. A-46

PLCC Socket ................................................................................. A-48

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0201 to 2412

Size coded packages

Two-pole flat chip packages used for passive and discrete
components.

Lead numbers and package angles in TPSys:

1 1 1
1 1
2 2 1
0° 90° 180° 270°

This package type can be placed by the HYDRA unit.

TPSys package name

YYXX-ZZ
YY Package length in 1/100 inch (Y-wise in 0°).
XX Package width in 1/100 inch (X-wise in 0°).
ZZ Package height in 1/10 mm, which should be measured carefully.

Example: 1206-06

Programming hints:
Main window. Mount tool: See table on page A-18.
Lead group window. Package Types: Two pole package
Lead type: CHIP
No. of image points: 40
Max cross-wise deviation: 0.2mm
Max length-wise deviation: 0.2mm
Centering phase window. Level: 1 or 11
Position: Upper
Force: Middle or High (High for 1812 or bigger).

HYDRA
Main window. HYDRA tools: See table on page A-18.
HYDRA angle: 90.00°
Accelerations. HYDRA theta
If the new package is higher than the selected package and the
component placement angle is incorrect, then you can try setting a
lower acceleration.
Lead group window. Lead type: CHIP
No. of image points: 40
Image points distribution: Standard
If the new package body is darker than the selected body and the
system rejects the component, then you can try setting this entry
to Leads only.

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Tool guide

Single Mount Hed

Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
A12 A13 A14S B12 B13 B14 C12 C13 C14
0201
0402
0603
0805
1206
1210
1812
1825
2010
2318
2412

HYDRA

Tool
Package H01 H02 H03 H04 H06
H00
(white) (yellow) (red) (blue) (brown)
0201
0402
0603
0805
1206
1210
1812
1825
2010
2318
2412

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Resistor network
Resistor Network components comprise a number of separate film
resistors contained within a single integrated package.

This package type can be placed by the HYDRA unit

TPSys package name

RNXX-YYYY
XX Total number of contact leads
YYYY Case size, e.g. 1206, 0804

Programming hints
Main window Mount tool: Same as for chips of same size, see page A-18.
Lead group window Package Types: Generic

The resistor network in the picture below has leads with two
different thicknesses and can be defined as a "Generic" package with
4 lead groups represented by the numbers and arrows in the picture.

1
G1 G4
3 8
G2 7 G3
2 5
G1 G4
Lead Group 1 (G1)
Lead type: GULLWING
Number of leads in group: 2
Number of first lead in group: 1
Offset X: Distance in X from the center of the package to the tip of
lead 1
Offset Y: Distance in Y from the center of the package to the tip of
lead 1
Angle: 180 degrees
Length: Length of the leads
Width: Width of leads 1-2
Pitch: Distance between leads 1 and 2
Lead Group 2 (G2)
Lead type: GULLWING
Number of leads in group: 2
Number of first lead in group: 3
Offset X: Distance in X from the center of the package to the tip of
lead 3
Offset Y: Distance in Y from the center of the package to the tip of
lead 3
Angle: 180 degrees
Length: Length of the leads
Width: Width of leads 3-4
Pitch: Distance between leads 3 and 4
Lead Group 3 (G3)
Lead type: GULLWING
Number of leads in group: 2

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Number of first lead in group: 5

Offset X: Distance in X from the center of the package to the tip of
lead 5
Offset Y: Distance in Y from the center of the package to the tip of
lead 5
Angle: 0 degrees
Length: Length of the leads
Width: Width of leads 5-6
Pitch: Distance between leads 5 and 6
Lead Group 4 (G4)
Lead type: GULLWING
Number of leads in group: 2
Number of first lead in group: 7
Offset X: Distance in X from the center of the package to the tip of
lead 7
Offset Y: Distance in Y from the center of the package to the tip of
lead 7
Angle: 0 degrees
Length: Length of the leads
Width: Width of leads 7-8
Pitch: Distance between leads 7 and 8
Optical centering window Use sub pixel: Yes
Coarse search method: Standard
Coarse search noise: 1000
Coarse search contrast: 30
Fine search noise: 1000
Fine search contrast: 30
Centering phase window Method: Optical
OVC light level: 50%
DVC Illumination
Light level: 50%
Pattern: Standard
Rel.
Dark field: 100 %
Ambient light: 100%
Front light: 100%l

LSC Illumination
Light level: 50%
Pattern: Standard
Rel.
Ambient light: 100%
Front light: 100%

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BGA, CBGA, LBGA, MBGA, PBGA

Ball grid array packages

Packages with solder ball leads arranged in any pattern.

For optical centering the lead pattern must fit within the camera
field of view (FOV).

BGA Ball Grid Array.

LBGA Low profile Ball Grid Array.
MBGA Micro Ball Grid Array.
PBGA Plastic Ball Grid Array.

Package angles in TPSys (top view):

0° 90° 180° 270°

This package type cannot be placed by the HYDRA unit.

TPSys package name

[Type]ZZ–YYxXX–QQQ
Type According to the list above (BGA refers to PBGA).
ZZ Number of leads.
YY Lead rows (Y-wise in 0°).
XX Lead columns (X-wise in 0°).
QQQ Lead pitch.

Example: BGA169–13x13–1.0
A PBGA package with 169 leads, 13 rows (Y-wise in 0°),
13 columns (X-wise in 0°), and 1.0mm lead pitch.

Programming hints:
Main window. Mount tool: See table on page A-22.
Pick wait time / Place wait time: 100ms for big package, 50ms for
small.
Hold until ready: Yes
Accelerations. Mount precision: High
Theta: Depends on the package size.
Y: Highest
X: Highest
Z: High
Optical centering window. Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 500
Coarse search contrast: 25 for LBGA and PBGA.
Fine search noise: 500
Fine search contrast: 25 for LBGA and PBGA.

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Lead group window. Package Types: BGA package

Lead type: PBGA for LBGA and PBGA packages.
Staggered: No
Extra corner leads: 0
Leads per row in hole: 0
Leads per column in hole: 0
Lead diameter: 90% of the real diameter for DVC. Use 65% for LSC.
Max lead displacement: 0,2mm
Centering phases. Method: Optical

OVC light level: 57%

Rel.
Dark field: 100%
Ambient light: 100%
Front light: 100%

DVC Illumination
Light level: 57%
Pattern: BGA

LSC Illumination
Light level: 65%
Pattern: BGA
Rel.
Ambient light: 100%
Front light: 100%

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
C23 C23S
LBGA
BGA
CBGA
MBGA
PBGA

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CBGA, CCGA

Ceramic ball/column grid array packages

Packages with solder ball or column leads arranged in any pattern.

For optical centering the whole body and lead pattern must fit within
the camera field of view (FOV).

CBGA Ceramic Ball Grid Array.

CCGA Ceramic Column Grid Array.

Package angles in TPSys (top view):

This package type cannot be placed by the HYDRA unit.

TPSys package name

[Type]ZZ–YYxXX–QQQ
Type According to the list above.
ZZ Number of leads.
YY Lead rows (Y-wise in 0°).
XX Lead columns (X-wise in 0°).
QQQ Lead pitch.

Example: CBGA169–13x13–1.0
A CBGA package with 169 leads, 13 rows (Y-wise in 0°),
13 columns (X-wise in 0°), and 1.0mm lead pitch.

Programming hints:
Main window. Mount tool: See table on page A-24.
Pick wait time / Place wait time: 100ms for big package, 50ms for
small.
Hold until ready: Yes
Accelerations. Mount precision: High
Theta: Depends on the package size.
Y: Highest
X: Highest
Z: High
Optical centering window. Use sub pixel: No
Coarse search method: Outline
Coarse search noise: 500
Coarse search contrast: 20
Fine search noise: 500
Fine search contrast: 10

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Lead group window. Package Types: BGA package

Lead type:
CBGA for CBGA packages.
PBGA for CCGA packages.
Staggered: No
Extra corner leads: 0
Leads per row in hole: 0
Leads per column in hole: 0
Lead diameter:
CBGA 90% of the real diameter forg DVC. Use 65% for LSC.
CCGA always 100%.
Max lead displacement: 0,2mm
Centering phases. Method: Optical

CBGA

OVC light level: 57%

Rel.
Dark field: 100%
Ambient light: 100%
Front light: 100%
DVC Illumination
Light level: 57%
Pattern: Generic
LSC Illumination
Light level: 75%
Pattern: Generic
Rel.
Ambient light: 0%
Front light: 100%

CCGA

OVC light level: 100%

Rel.
Dark field: 0%
Ambient light: 0%
Front light: 100%
DVC Illumination
Light level: 100%
Pattern: Generic
LSC Illumination
Light level: 65%
Pattern: Generic
Rel.
Ambient light: 0%
Front light: 100%

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
C23 C23S
CBGA
CCGA

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M3216 to M8345

Metric size coded packages

Two-pole packages used for passive and discrete components, such as
tantalum capacitors.

Also called SD packages when used for tantalum capacitors. Meets

E.I.A./IECQ footprints.
Lead numbers and package angles in TPSys (top view):

1
1
1 1
2
1
0° 90° 180° 270°

1
1
1 1

2
1
0° 90° 180° 270°

Most of these packages can be placed by the HYDRA unit.

TPSys package name

MYYXX-ZZ
YY Package length in 1/10 mm (Y-wise in 0°).
XX Package width in 1/10 mm (X-wise in 0°).
ZZ Package height in 1/10 mm, which should be measured carefully.

Example: M3224-22

The following packages match the below EIA case types and have no
package height extension in TPSys:
M3216-A (height 1.6mm) matches A Case
M3528-B (height 1.9mm) matches B Case
M6032-C (height 2.5mm) matches C Case
M7343-D (height 2.8mm) matches D Case

Programming hints:
Main window. Mount tool: See table on page A-27.
Pick wait time / Place wait time: From 0 to 50ms.
Accelerations. Mount precision: Normal
Theta: From Highest to Low.
X: Highest
Y: Highest
Z: Highest

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Appendix A – Packages MYDATA automation AB

Lead group window. Package Types: Package

Lead type: CHIP
Image points distribution: Standard
Max cross-wise deviation: 0,2mm
Max length-wise deviation: 0,2mm
Optical centering window. Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 1000
Coarse search contrast: 30
Fine search noise: 1000
Fine search contrast: 30
Centering phase window. Method: Mechanical (two centering phases).
Angle: 90° in centering phase one and then 0° in phase two.
Level: 1 or 11
Position: Upper
Force: Middle or High
Verify mechanical: Yes
Verify electrical: No

HYDRA
Accelerations. HYDRA theta
If the new package is higher than the selected package and
the component placement angle is incorrect, then you can
try setting a lower acceleration.

HYDRA tools: See table on page A-27.

HYDRA angle: 90.00°
Lead group window. Lead type: CHIP
No. of image points: 40
Image points distribution: Standard
If the new package body is darker than the selected body and
the system rejects the component, then you can try setting
this entry to Leads only.

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MYDATA automation AB Appendix A – Packages

Tool guide

Single Mount Head

Mount tools to use are determined by the package size, form, weight
and centering method used.
Tool
Package
A12 A13 A14S A23 A23S A24 A24S
M10857
M20869
M3216
M3224
M3518
M3527
M3528
M4532
M4945
M4955
M5134
M6032
M6235
M7227
M7243
M7257
M7343
M7350
M7355
M7365
M7370
M9675
M9940

HYDRA
Tool
Package H01 H02
H00 H03 (red) H04 (blue)
(white) (yellow)
M10857
M20869
M3216
M3224
M3518
M3527
M3528
M4532
M4945
M4955
M5134
M6032
M6235
M7227
M7243
M7257
M7343
M7350
M7355
M7365

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Appendix A – Packages MYDATA automation AB

MELF, Micro-MELF, Mini-MELF, Maxi-MELF

Metal electrode face, or metal end long form

Two-pole, leadless cylindrical packages used for resistors, capacitors
and diodes.
Lead numbers and package angles in TPSys:

1 1 1
1 1
2 2 1
0° 90° 180° 270°

This package type can be placed by the HYDRA unit.

TPSys package name

MELFYYXX-ZZ
YY Package length in 1/10 mm (Y-wise in 0°).
XX Package diameter in 1/10 mm (X-wise in 0°).
ZZ Package height in 1/10 mm.

Example: MELF2012-12

MELF2012 in TPSys is equal to Micro-MELF or 0805-MELF.

MELF3514 in TPSys is equal to Mini-MELF or 1206-MELF.
MELF5922 in TPSys is equal to Maxi-MELF.

Programming hints:
Main window. Mount tool: See table on page A-29.
Pick wait time / Place wait time: 0
Vacuum test: No
Accelerations. Mount precision: Normal
Theta: High
X: Highest
Y: Highest
Z: Highest
Lead group window. Package Types: Two pole package
Lead type: CHIP
No. of image points: 40
Image points distribution: Standard
Max cross-wise deviation: 0.2mm
Max length-wise deviation: 0.2mm
Optical centering window. Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 1000
Coarse search contrast: 30
Fine search noise: 1000
Fine search contrast: 30

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MYDATA automation AB Appendix A – Packages

Centering phase window. Method: Mechanical

Angle: 90.00°
Level: 1 or 11
Position: Upper
Force: Middle
Verify mechanical: Yes
Verify electrical: Yes

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Single Mount Head

Tool
Package
A12 B13 A34 B23 B24 B34
1
Micro-MELF
Mini-MELF2 1.5mm
MELF 2.5mm 2.3mm 2.0mm
1
Micro-MELF or 0805-MELF is equal to MELF2012 in TPSys.
2 Mini-MELF or 1206-MELF is equal to MELF3514 in TPSys.

HYDRA

Tool
Package H01 H02
H00 H03 (red) H04 (blue)
(white) (yellow)
MELF3514

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Appendix A – Packages MYDATA automation AB

PLCC

Plastic leaded chip carrier

Packages with J-leads on four sides.

Package angles in TPSys (top view):

0° 90° 180° 270°

This package type cannot be placed by the HYDRA unit.

TPSys package name

PLCCXX
XX Total number of leads.

Example: PLCC44

Programming hints:
Main window. Mount tool: See table on page A-31.
Pick wait time / Place wait time: 100ms
Hold until ready: Yes for PLCC80 and bigger, all other No.
Accelerations. Theta: Highest for PLCC20 and PLCC28 all other Low or Lowest.
X: Highest
Y: Highest
Z: High
Lead group window. Package Types: Four symmetric lead groups
Lead type: J-BEND
Optical centering window. Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 200
Coarse search contrast: 20
Fine search noise: 200
Fine search contrast: 20
Centering phase window. Method: Mechanical, use two phases.
Angle:
Phase 1: 0.00°
Phase 2: 90.00°
Level: 1 or 11
Position: Upper
Force: High
Verify mechanical: Yes
Verify electrical: No

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MYDATA automation AB Appendix A – Packages

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
A24 A24S
PLCC
CLCC
MLCC

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Appendix A – Packages MYDATA automation AB

CQFP, FQFP, LQFP, MQFP, PQFP, TQFP

QFP package types (quad flat pack)

Packages with gull-wing leads on four sides.

CQFP Ceramic quad flat pack.

FQFP Fine pitch quad flat pack.
LQFP Low profile quad flat pack.
MQFP Metric plastic quad flat pack.
PQFP Plastic quad flat pack with bumpered corners.
TQFP Thin quad flat pack.

Package angles in TPSys (top view):

0° 90° 180° 270°

PQFP

0° 90° 180° 270°

These package types cannot be placed by the HYDRA unit.

TPSys package name

[Type]ZZ-YYxXX-QQQ(-H:WWW)
Type According to the list above.
ZZ Number of leads.
YY Number of leads Y-wise in 0° (rectangular packages only).
XX Number of leads X-wise in 0° (rectangular packages only).
QQQ Lead pitch.
WWW Package height (only stated when needed to distinguish
between otherwise identical packages).

Example: MQFP80-24x16-0.80-H:2.8
A MQFP package with 80 leads, 24 leads at the long side
(Y-wise in 0°), 16 leads at the short side (X-wise in 0°),
0.80mm lead pitch, and 2.8mm package height.

Programming hints
Main window. Body length: Without the Corner bumps for PQFP.
Mount tool: See table on page A-33.
Pick wait time / Place wait time:
100ms for big packages.
50ms for small packages.
Toggle leads: According to package geometry.
Hold until ready: No

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MYDATA automation AB Appendix A – Packages

Accelerations. Theta: Highest for the smaller packages like QFP80.

Low or Lowest for all other.

X: CQFP: Low
PQFP,TQFP,FQFP,MQFP: Highest

Y: Highest

Z: CQFP: Lowest
PQFP,TQFP,FQFP,MQFP: High
Lead group window. Package Types: Four symmetric lead groups
Lead type:
J-BEND for CQFP.
GULLWING for all other.
Max cross-wise deviation: Half the c-c distance.
Max length-wise deviation: Half the c-c distance.
Optical centering window. Use sub pixel: Yes
Coarse search noise / Fine search noise: 1000
Coarse search contrast / Fine search contrast: 30
Centering phase window. Method: Optical
Dimension: 0
Verify mechanical: No
Verify electrical: No
OVC light level: 85%
Pattern: Multiple Leads
Light level: 85%
Dark field:
100% for Rel.
Ambient light:
100% for Rel.
Front light:
100% for Rel.
DVC Illumination
Pattern: QFP

LSC Illumination
Light level: 65%
Pattern: QFP

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
A14S A23 A23S A24 A24S C23 C23S
All QFP20
All QFP24
All QFP32
All QFP36
All QFP40
All QFP44 – QFP80
All QFP100 – QFP376

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Appendix A – Packages MYDATA automation AB

SO, SSOP

Small outline packages

Packages with gull-wing leads on two sides.

SO Small outline.
SSOP Plastic shrink SO.

Package angles in TPSys (top view):

0° 90° 180° 270°

Some of these packages can be placed by the HYDRA unit, see below.

TPSys package name

SO packages:[Type]XX
SSOP packages:[Type]XX-YYY(-BW:ZZ)

Type According to the list above.

XX Number of leads.
YYY Lead pitch.
ZZ Package width (only stated when needed to distinguish
between otherwise identical packages).

Example: SO14
Example: SSOP24-0.65-BW:6.1

Programming hints
Main window. Mount tool: See table on page A-36.
Mount precision
Normal for mechanical centering.
High for optical centering.

Pick wait time / Place wait time:

100ms for big packages.
50ms for small packages.
Hold until ready: No
Accelerations. Theta: Depends on package size.
Y: Highest
X: Highest
Z: Highest
Lead group window. Package Types: Two symmetric lead groups
Lead type: GULLWING
Max cross-wise deviation: Half the c-c distance.
Max length-wise deviation: Half the c-c distance.
Max length-wise deformation: 0mm

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MYDATA automation AB Appendix A – Packages

Optical centering window. Use sub pixel: Yes

Coarse search noise / Fine search noise: 1000
Coarse search contrast / Fine search contrast: 30
Centering phase window. Method: Mechanical, use two phases. (Used for SO packages.)
Angle:
Phase 1: 90.00°
Phase 2: 90.00°.
Level: 1
Position: Upper
Force: High
Verify mechanical: Yes
Verify electrical: No

Method: Optical (Used for SSOP packages.)

Dimension: 0
Verify mechanical: No
Verify electrical: No
OVC light level: 67%
Pattern: Standard
Light level: 67%
LSC Illumination
Light level: 65%
Pattern: Standard
Dark field: 100%
Ambient light: 100%
Front light: 100%

HYDRA unit
Main window. Acceleration codes HYDRA theta
If the new package is higher than the selected package and
the component placement angle is incorrect, then you can
try setting a lower acceleration.

HYDRA tools:
H03 (Red) for SO8, SO14, SSOP24-0.65-BW:6.1,
SSOP28-0.50-BW:6.1, SSOP28-0.65-BW:6.1 and
SSOP28-0.65-BW:8.0

HYDRA angle: 0°

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Appendix A – Packages MYDATA automation AB

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Single Mount Head

Tool
Package
A14S A23 A23S A24 A24S C23 C23S
SO14
SO16
SO18
SO20
SO24
SO28
SSOP24-0.65-BW:6.1
SSOP28-0.50-BW_6.1
SSOP28-0.65-BW_8.0
SSOP30-0.65-BW_6.1
SSOP32-0.65-BW_6.1
SSOP32-0.65-BW_8.0
SSOP36-0.40-BW_6.1
SSOP36-0.50-BW_8.0
SSOP40-0.50-BW_6.1
SSOP40-0.50-BW_8.0
SSOP44-0.50-BW_6.1
SSOP48-0.40-BW_6.1
SSOP48-0.40-BW_8.0
SSOP52-0.40-BW_6.1
SSOP52-0.40-BW_8.0
SSOP56-0.40-BW_6.1
SSOP56-0.40-BW_8.0
SSOP56-0.50-BW_6.1
SSOP56-0.50-BW_8.0
SSOP60-0.40-BW_8.0
SSOP64-0.40-BW_6.1
SSOP64-0.40-BW_8.0
SSOP64-0.50-BW_6.1
SSOP68-0.40-BW_8.0
SSOP80-0.40-BW_6.1

HYDRA

Tool
Package H01 H02 H04
H00 H03 (red)
(white) (yellow) (blue)
SO8
SO14
SSOP24-0.65-BW:6.1
SSOP28-0.50-BW_6.1
SSOP28-0.65-BW:6.1
SSOP28-0.65-BW_8.0

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MYDATA automation AB Appendix A – Packages

SOD

Small outline diode

Two-pole cylindrical packages used for diodes.

SOD-80 is also called SM1 and LL41.

Lead numbers and package angles in TPSys (top view):

2
0° 90° 180° 270°

This package type can be placed by the HYDRA unit.

TPSys package name

SOD-80 is the only preprogrammed SOD package in TPSys.

Programming hints, Single Mount Head

Main window. Mount tool: See table on page A-38.
Pick wait time / Place wait time: 0
Vacuum test: No
Accelerations. Mount precision: Normal
Theta: High
X: Highest
Y: Highest
Z: Highest
Lead group window. Package Types: Two pole package
Lead type: CHIP
No. of image points: 40
Image points distribution: Standard
Max cross-wise deviation: 0.2mm
Max length-wise deviation: 0.2mm
Optical centering window. Use sub pixel: No
Coarse search method: Standard
Coarse search noise: 1000
Coarse search contrast: 30
Fine search noise: 1000
Fine search contrast: 30
Centering phase window. Method: Mechanical
Angle: 90.00°
Level: 1 or 11
Position: Upper
Force: Middle
Verify mechanical: Yes
Verify electrical: Yes

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Appendix A – Packages MYDATA automation AB

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Single Mount Head

Tool
Package
A34
SOD-80

HYDRA

Tool
Package H01 H02
H00 H03 (red) H04 (blue)
(white) (yellow)
SOD-80

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MYDATA automation AB Appendix A – Packages

SOJ, LSOJ

Small outline J-lead packages

Packages with J-leads on two sides.

SOJ Small outline J-lead.

LSOJ Low profile SO.

SO packages with gull-wing leads are found on page A-34.

Package angles in TPSys (top view):

0° 90° 180° 270°

This package type cannot be placed by the HYDRA unit.

TPSys package name

SOJ packages:[Type]XX(-BW:ZZ)
LSOJ packages:[Type]XX-YYY(-BW:ZZ)

Type According to the list above.

XX Number of leads.
YYY Lead pitch.
ZZ Package width (only stated when needed to distinguish
between otherwise identical packages).

Example: SOJ28-BW:7.52
Example: LSOJ28-1.27

Programming hints
SOJ, LSOJ packages are to a great extent programmed in the same
way as SO, SSOP packages (see page A-34). Here we will only discuss
the differences.
Main window. Mount tool: See table on page A-40.
Lead group window. Lead type: J-BEND
Centering phase window. Method: Mechanical, use two phases.
Angle:
Phase 1: 90.00°
Phase 2: 90.00°
Level: 1
Position: Upper
Force: High
Verify mechanical: Yes
Verify electrical: No

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Appendix A – Packages MYDATA automation AB

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
A23 A23S A24 A24S C23 C23S
LSOJ28-1.27
SOJ14-BW_7.52
SOJ16-BW_7.52
SOJ18-BW_7.52
SOJ20-BW_7.52
SOJ24-BW_7.52
SOJ26-BW_7.62
SOJ26-FOUR-LEAD-GROUPS
SSOJ28-BW:10.16
SOJ28-BW_7.52
SOJ28-BW_7.62
SOJ28-BW_8.38
SOJ28-BW_8.89
SOJ32-BW_10.16
SOJ32-BW_7.62
SOJ32-BW_8.38
SOJ34-BW_10.16
SOJ36-BW_8.38
SOJ40-BW_10.16
SOJ42-BW_10.16
SOJ44-BW_10.16
SOJ50-BW_10.15
SOJ64-BW_12.0
SOJ70-BW_10.15
SOJ70-BW_12.7

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MYDATA automation AB Appendix A – Packages

SOT, SC

Small outline transistor

Any of various plastic packages designed for semiconductors, such as
transistors and diodes.

Packages with lead numbers and angles in TPSys (top view):

SOT-23JEDEC
SOT-323

0° 90° 180° 270°

SOT-89JEDEC

0° 90° 180° 270°

SOT-143JEDEC

0° 90° 180° 270°

SOT-223JEDEC

0° 90° 180° 270°

These package types can be placed by the HYDRA unit, see below.

TPSys package name

SOT-23-E1JEDEC and SOT-89-E1JEDEC
Transistor with emitter to lead 1.

SOT-23-B1JEDEC and SOT-89-B1JEDEC

Transistor with base to lead 1.

SC-59 Japanese version of SOT-23.

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Appendix A – Packages MYDATA automation AB

Programming hints

Number Lead Height

Package Length Width
of leads pitch overall
SC-59 3 1.90mm 2.90mm 1.60mm 1.10mm
SOT-143JEDEC 4 1.92mm 2.92mm 1.30mm 1.00mm
SOT-223JEDEC 4 2.30mm 6.50mm 3.50mm 1.70mm
SOT-23-B1JEDEC 3 1.90mm 2.90mm 1.30mm 1.00mm
SOT-23-E1JEDEC 3 1.90mm 2.90mm 1.30mm 1.00mm
SOT-23JEDEC 3 1.90mm 2.90mm 1.30mm 1.00mm
SOT-323_SC-70 3 1.30mm 2.00mm 1.25mm 0.90mm
SOT-89JEDEC 3 1.50mm 4.50mm 2.45mm 1.50mm
SOT-89-B1JEDEC 3 1.50mm 4.50mm 2.45mm 1.50mm
SOT-89-E1JEDEC 3 1.50mm 4.50mm 2.45mm 1.50mm

Main window. Mount tool: See table on page A-43.

Pick wait time / Place wait time: 0
Accelerations.Theta: Low
X: Highest
Y: Highest
Z: Highest
Lead group window. Package Types: Three pole package
Lead type: GULLWING
Max cross-wise deviation: 0.25mm
Max length-wise deviation: 0.25mm
Max length-wise deformation: 0.2mm
Lead group window. Package Types: Generic
Lead type: GULLWING or FLAT
Offset X:
The distance between the package center and the outside of the
first lead.
Offset Y:
The distance between the center of the package and the centerline
on the first lead.
Angle:
The location of the single lead, 0° if it is on the right side of the
package, 180° if it is on the left side.

Max cross-wise deviation: 0.2mm

Max length-wise deviation: 0.2mm
Max length-wise deformation: 0mm
Optical centering window. Use sub pixel: Yes
Coarse search noise / Fine search noise: 1000
Coarse search contrast / Fine search contrast: 20

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MYDATA automation AB Appendix A – Packages

Centering phase window. Method: Mechanical, use two phases.

Angle:
Phase 1: 90.00°
Phase 2: 0.00° or 180°. If electric test is used the angle must be 180°.
Level: 1 or 11
Position: Upper
Force: Middle
Verify mechanical: Yes
Verify electrical:
Phase 1: No
Phase 2: Yes, if SOT23,SOT89, all other No.

Programming hints, HYDRA unit

Main window. Acceleration codes HYDRA theta
If the new package is higher than the selected package and the
component placement angle is incorrect, then you can try setting a
lower acceleration.

HYDRA tools: See table below.

HYDRA angle: 0°

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Single Mount Head

Tool
Package
A12 A13 A14S
SC-59
SOT23
SOT89
SOT143
SOT223
SOT323

HYDRA

Tool
Package H01 H02
H00 H03 (red) H04 (blue)
(white) (yellow)
SC-59
SOT23
SOT89
SOT143
SOT223
SOT323

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Appendix A – Packages MYDATA automation AB

TO

Transistor outline
Four-pole packages, used for transistors.

Package angles in TPSys (top view):

0° 90° 180° 270°

This package type cannot be placed by the HYDRA unit.

TPSys package name

TO packages preprogrammed in TPSys are named in accordance
with the E.I.A./JEDEC standard.

Examples: TO-252_DPAK, TO-263, TO-268.

Programming hints
Use the Generic lead group for this package and set two leads in the
group with 180° between lead 1 and lead 2 (even though this is a
package with four leads).

WOL
OX

OY
PL LB

WL

LL WB

The letters below refer to the figure.

Main window. Body length: LB
Body width: WB
Width overall: WOL
Mount tool: See table on page A-45.
Pick wait time / Place wait time: 0
Toggle leads: According to geometry of the package.
Accelerations. Theta: Low
X: Highest
Y: Highest
Z: Highest

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MYDATA automation AB Appendix A – Packages

Lead group window. Package Types: Generic

Lead type: GULLWING
Number of leads in group: 2
Number of first lead in group: 1
Offset X: Ox
Offset Y: Oy
Angle: 180.00°
Length: LL
Width: WL
Pitch: PL
Max cross-wise deviation: 0.2mm
Max length-wise deviation: 0.2mm
Max length-wise deformation: 0mm
Optical centering window. Use sub pixel: Yes
Coarse search noise / Fine search noise: 1000
Coarse search contrast / Fine search contrast: 20
Centering phase window. Method: Mechanical, use two phases.
Angle:
Phase 1: 90.00°
Phase 2: 0.00°
Level: 1 or 11
Position: Upper
Force: Middle
Verify mechanical: Yes
Verify electrical: No

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
A23 A23S A24 A24S
TO-252 DPAK
TO-263
TO-268

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Appendix A – Packages MYDATA automation AB

TSOP, TSSOP

Thin small outline package

Thin packages with gull-wing leads on two sides.

TSOP Thin SO.

TSSOP Plastic thin shrink SO.
Type I.

Type I packages have leads extending from the narrow sides of the
body, see the figure.

Type II packages have leads protruding from the wide sides of the
body, see the figure.
Type II.
Package angles in TPSys for type I (top view):

0° 90° 180° 270°

And type II:

0° 90° 180° 270°

These package types cannot be placed by the HYDRA unit.

TPSys package name

TSOP packages:[Type]XX(-BW:ZZ)
TSSOP packages:[Type]XX-YYY(-BW:ZZ)

Type According to the list above.

XX Number of leads.
YYY Lead pitch.
ZZ Package width (only stated when needed to distinguish
between otherwise identical packages).

Example: TSOP24-BW:14.4
Example: TSSOP28-0.50-BW:6.1

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MYDATA automation AB Appendix A – Packages

Programming hints
PSOP, TSSOP packages are to a great extent programmed in the
same way as SO, SSOP packages (see page A-34). Here we will only
discuss the differences.
Main window. Mount tool: See table below
Optical centering window. Use sub pixel: Yes
Coarse search noise / Fine search noise: 1000
Coarse search contrast / Fine search contrast: 30
Centering phase window. Method: Optical
Dimension: 0
Verify mechanical: No
Verify electrical: No
OVC light level: 67%
Pattern: Standard
Light level: 67%
LSC Illumination
Light level: 65%
Pattern: Standard
Dark field: 100%
Ambient light: 100%
Front light: 100%

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Package Tool
A23 A23S A24 A24S C23 C23S
TSOP24-BW_12.4
TSOP24-BW_18.4
TSOP32-BW_12.4
TSOP40-BW_12.4
TSOP56-BW_14.4
TSSOP100-0.40-BW_6.1
TSSOP28-0.65-BW_8.0
TSSOP30-0.65-BW_6.1
TSSOP32-0.65-BW_6.1
TSSOP32-0.65-BW_8.0

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Appendix A – Packages MYDATA automation AB

PLCC Socket
Packages where the inner tips of the contact leads must be detected
instead of outer ones.

TpSys package name

PLCCXX-socket

XX Total number of contact leads.

Programming hints
Lead group window Package Types: Generic

In the PLCC28 in the picture below we want to locate the inner tips
of the leads. To do so we need to define the package as "Generic" and
increasing lead numbers advancing in a clockwise direction, as
shown by the arrows in the picture.

G2 90° 15
G3

0° 180°

G1
1 -90/270° G4
22

Lead Group 1 (G1)

Lead type: GULLWING
Number of leads in group: 7
Number of first lead in group: 1
Offset X: Distance in X from the center of the package to the tip of
lead 1
Offset Y: Distance in Y from the center of the package to the tip of
lead 1
Angle: 0 degrees

Lead Group 2 (G2)

Lead type: GULLWING
Number of leads in group: 7
Number of first lead in group: 8
Offset X: Distance in X from the center of the package to the tip of
lead 8
Offset Y: Distance in Y from the center of the package to the tip of
lead 8
Angle: 90 degrees

Lead Group 3 (G3)

Lead type: GULLWING
Number of leads in group: 7
Number of first lead in group: 15
Offset X: Distance in X from the center of the package to the tip of
lead 15
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MYDATA automation AB Appendix A – Packages

Offset Y: Distance in Y from the center of the package to the tip of

lead 15
Angle: 180 degrees

Lead Group 4 (G4)

Lead type: GULLWING
Number of leads in group: 7
Number of first lead in group: 22
Offset X: Distance in X from the center of the package to the tip of
lead 22
Offset Y: Distance in Y from the center of the package to the tip of
lead 22
Angle: -90 degrees
Main window Mount tool: See table on page A-49.
Tool to top offset: The height difference from the socket leads to the
top of the package.
Optical centering window Use sub pixel: Yes
Coarse search method: Multiple Leads
Coarse search noise: 1000
Coarse search contrast: 30
Fine search noise: 1000
Fine search contrast: 30
Centering phase window Method: Optical
OVC light level: 50%
DVC Illumination
Light level: 50%
Pattern: Standard
Rel.
Dark field: 100 %
Ambient light: 100%
Front light: 100%l
LSC Illumination
Light level: 65%
Pattern: Standard
Rel.
Ambient light: 100%
Front light: 100%

Tool guide
Mount tools to use are determined by the package size, form, weight
and centering method used.

Tool
Package
A24 A24S
PLCC
CLCC
MLCC

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Appendix A – Packages MYDATA automation AB

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Appendix B – Menu Reference Guide

Appendix A contains:

– Shortcuts

– Hot menu

– Main menu

– Switches

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Appendix B – Menu Reference Guide MYDATA automation AB

Shortcuts
F1
Shows the last camera image.

Opens a hot menu, see the next section. You can press <F10> only
F10
as well.

Starts stepper mode. If the access system is on, then the user must
S
Ctrl have the Service access right set to High to be able to invoke the
stepper mode.

Removes text from the screen. Useful when inspecting camera

T
Ctrl images. Reset by pressing <Esc>.

Moves the Y wagon to the front or back position. Press twice if not
Y
Ctrl used for the last five seconds.

F1
Alt Switches to the TPSys on-line terminal, tty1.

Switch between virtual terminals. Fn being <F2> to <F6> as

Fn
Alt <Alt>+<F1> always contains the online TPSys terminal.

If TPSys is running in high-resolution mode <Alt>+<F2> contains

a graphical terminal. It then gives access to a web interface,
PDF-reader and a calculator. In standard resolution mode
<Alt>+<F2> to<Alt>+<F6> gives access Linux terminals for
Linux usage or for running off-line TPSys terminals.

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MYDATA automation AB Appendix B – Menu Reference Guide

For machines with CP5/VVG hardware or later

Pans the camera image. Select pan direction by using the
Ctrl corresponding arrow key.

Pans the camera image quickly. Select pan direction by using the
Ctrl corresponding arrow key.

Ctrl PgDn Zooms in (requires VVG2 board).

Ctrl PgUp Zooms out (requires VVG2 board).

Ctrl Home Resets to default zoom and panning.

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Appendix B – Menu Reference Guide MYDATA automation AB

Hot Menu
A hot menu containing a number of the most used options is opened
F10
by pressing <Shift>+<F10>, or just <F10> in TPSys.

Hot Menu
Reset Magazine Errors
Package List Editor
Component List Editor
Magazine List Editor
Parameter Editor
Switches
Mount/Glue Switches
Fiducial Mark List Editor
Y Wagon Magazine
Pallet Magazine
TEX List Editor
Tray Wagon Magazine
View Messages
Set Message Time Mark
HYDRA Tool Utility

All the options in the popup menu may not be shown due to that the
feature is not installed or cannot be selected.

The options in the hot menu refer to main menu options or sub
options. The following table shows where in the main menu the hot
menu options are found.

Hot menu option Main menu Page

Reset Magazine Errors Magazine B-9
Package List Editor Editor B-12
Component List Editor Editor B-12
Magazine List Editor Magazine B-8
Parameter Editor Editor B-12
Switches Production B-6
Mount/Glue Switches Production B-6
Fiducial Mark List Editor Editor B-13
Y Wagon Magazine Magazine B-9
Pallet Magazine Magazine B-10
TEX List Editor Magazine B-11
Tray Wagon Magazine Magazine B-10
View Messages Production B-6
Set Message Time Mark Production B-6
HYDRA Tool Utility Utility/Installation B-17

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Main Menu

Production
Production
A Assemble
T Locate Boards (Auto)
M Locate Boards (Manual)
S Clear Layout Status
D Clear Management Data
------------------------
L Load Layout
E Edit Layout
U Unload Layout
X Layout Status
------------------------
V View Messages
- Set Message Time Mark
W Switches
I Mount/Glue Switches
------------------------
Y Move Y Wagon
C Conveyor Control
O Leave Tool

Some of these options cause machine movements. Before entering

such commands, check the following:

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

Assemble
Assembly start command, which is followed by a dialog box for layout
name, batch name and quantity.

See the Assembling the Layout section in Chapter 3 of the Operator's

Manual.

Locate Boards (Auto)

Causes machine movement. Locates boards using automatic fiducial mark search.

See the Board Location section in Chapter 8 of the Operator's

Manual.

Locate Boards (Manual)

Causes machine movement. Locates boards using manual fiducial mark search.

See the Board Location section in Chapter 8 of the Operator's

Manual.

Clear Layout Status

Clears layout status for the currently loaded layout.

See the Clearing Status section in Chapter 8 of the Operator's

Manual.

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Clear Management Data

Clears management data for the currently loaded layout.

See also Delete Management Data on page B-19.

See the Clearing Management Data section in Chapter 8 of the

Operator's Manual.

Load Layout
Shows a list of available layouts to be selected and loaded.

See the Loading Layout section in Chapter 3 of the Operator's

Manual.

Edit Layout
If a layout is loaded, it is opened in the Layout Editor.

If no layout is loaded, then you can select a layout to edit.

See the Mount List Structure Diagram section in Chapter 7 of the

Programming Manual.

Unload Layout
Unloads the currently loaded layout.

Layout Status
Opens the Layout Status Editor.

See the Layout Status section in Chapter 8 of the Operator's Manual.

View Messages
Enlarges the message box to a full screen size message window.

See the Messages section in Chapter 2 of the Operator's Manual.

Set Message Time Mark

Sets a time stamp as a message line in the message log. This feature
is intended for troubleshooting (to mark the time for a certain
activity to be able to see if the problem remains after the time stamp).

Switches
Makes a number of production switches accessible.

See the Switches section in this appendix.

Mount/Glue Switches
Makes global switches for component mounting and glue application
accessible.

See the Mount and Glue Switches section in Chapter 8 of the

Operator's Manual.

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MYDATA automation AB Appendix B – Menu Reference Guide

Move Y Wagon
Moves the Y wagon (and the Tray Wagon Magazine, if used) to the
front or back position. Select position from the menu:
Causes machine movement.
Y Wagon Move
F Front
B Back

Conveyor Control
Manual loading and unloading of boards from a conveyor. Select
action from the menu:

Conveyor Control
L Conveyor Load/Grab
R Conveyor Release & Unload
W Set Conveyor Width

• Conveyor Load/Grab
Loads a new board, adjusts the position (for automatic fiducial
mark search), and grabs the board.

• Conveyor Release & Unload

Releases the board and moves it out of the machine.

• Set Conveyor Width

This feature affects only the Y-wagon conveyor on the machine.
Surrounding conveyor system is not affected. The feature is used
to:

– Read off the current conveyor width, which is shown after

selecting this menu option. If a layout is loaded, the board width
is shown (zero is shown for a board which has no board size set).

– Set the conveyor width by typing the conveyor width in the

dialog box and confirming it. The conveyor will change to the
new width after emptying present boards, if not empty.

The 0092.0031 Automatic width parameter must be set to Yes to get

this feature available.

Leave Tool
Current tool is placed in the tool bank after confirming the tool leave
in the following popup box:
Causes machine movement.

OK to leave tool?
OK

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Appendix B – Menu Reference Guide MYDATA automation AB

Magazine
Magazine
F Adjust Feeder Positions
M Magazines
A Locate All Magazines
G Removable Feeders
---------------------------
R Reset Magazine Errors
T Tray Type
Y Y Wagon Magazine
W Tray Wagon Magazine
P Pallet Magazine
X TEX
---------------------------
K Magazine Kits
C Create Magazine Kit
H HYDRA Preparation

Some of these options cause machine movements. Before entering

such commands, check the following:

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

Adjust Feeder Positions

Causes machine movement. In order to calibrate tape and vibratory magazine feeder pick
positions, this option makes it possible to center the cross hairs on
the component pick positions by using the trackball or joystick.

See the Manually Calibrating Pick Positions section in Chapter 5 of

the Operator's Manual.

The X-axis position only can be adjusted using this procedure. The
Y-axis position is adjusted mechanically, see the Machine Manual.

For Agilis see the Pick Line Adjustment – Agilis AM8 section in
Chapter 5 of the Operator's Manual.

Magazines
Opens the Magazine List Editor for tape and vibratory magazines.

See the Tape and Vibratory Magazine List section in Chapter 6 of the
Programming Manual.

Removable Feeders
Opens the Removable Feeder List Editor.

See the Removable Feeder List Editor section in Chapter 6 of the

Programming Manual.

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MYDATA automation AB Appendix B – Menu Reference Guide

Locate All Magazines

Causes machine movement. In order to calibrate the magazine X positions, this option centers
magazine fiducial marks automatically, provided the 0084.0302 Use
magazine fiducial mark parameter is set to Yes. If the automatic
fiducial mark search fails, then you can center the fiducial mark
using the trackball or joystick.
A magazine fiducial mark consists of a black sticker with a white line
and it is attached on the left side of the magazine frame, in the pick
line.

Tape magazines are provided with fiducial mark stickers. If you use
vibratory magazines, you can attach fiducial mark stickers (see the
figure) to get full advantage of the automatic location feature.

The fiducial mark sticker part # is D-014-0819.

Press the sticker down
properly when attaching it.

Reset Magazine Errors

Clears magazine errors for all magazines.

See the Magazine Errors section in Chapter 5 of the Operator's

Manual.

Tray Type
Opens the Tray Type List Editor.

See the Tray Type List section in Chapter 6 of the Programming

Manual.

Y Wagon Magazine
The following sub menu is shown:

Y Wagon Magazine
T Trays
P Tray Positions

• Trays
Opens the Y-Wagon Magazine List, used for trays placed on the
assembly table.

See the Y-Wagon Magazine List section in Chapter 6 of the

Programming Manual.

• Tray Positions
Opens the Y-Wagon Position List, used for trays placed on the
assembly table.

See the Y-Wagon Position List section in Chapter 6 of the

Programming Manual.

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Tray Wagon Magazine

The following sub menu is shown:

Tray Wagon Magazine

T Trays
P Tray Positions

• Trays
Opens the Tray Wagon Magazine List, used for trays placed on the
Tray Wagon Magazine.

See the Tray Wagon Magazine List section in Chapter 6 of the

Programming Manual.

• Tray Positions
Opens the Tray Wagon Position List, used for trays placed on the
Tray Wagon Magazine.

See the Tray Wagon Position List section in Chapter 6 of the

Programming Manual.

Pallet Magazine
The following sub menu is shown:

Pallet Magazine
L Pallets
T Trays
P Tray Positions

• Pallets
Opens the Pallet List, used for pallets in the TEX.

See the Pallet List section in Chapter 6 of the Programming

Manual.

• Trays
Opens the Pallet Magazine List editor, used for trays placed on
pallets in the TEX.

See the Pallet Magazine List section in Chapter 6 of the

Programming Manual.

• Tray Positions
Opens the Pallet Position List, used for pallets in the TEX.

See the Pallet Position List section in Chapter 6 of the

Programming Manual.

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TEX
Opens the TEX List Editor, used for selecting TEX unit, locating
pallet position and refilling trays.

See the TEX List section in Chapter 5 of the Operator's Manual.

Magazine Kits
Opens the Magazine Kit List Editor which contains all the Magazine
Kits stored in the system.

See the Magazine Kit List Editor section in Chapter 5 of the

Operator's Manual.

Create Magazine Kit

Creates a Magazine Kit for the currently loaded layout.

See the Creating a Magazine Kit section in Chapter 5 of the

Operator's Manual.

HYDRA Preparation
Composes a magazine load list that is optimized for mounting a
layout using the HYDRA unit.

See the HYDRA Preparation section in Chapter 6 of the

Programming Manual.

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Appendix B – Menu Reference Guide MYDATA automation AB

Editor
Editor
C Components
P Packages
----------------
L Layouts
A Panels
B PCBs
----------------
R Parameters
----------------
F Fiducial Marks
G Glue Dots
U Users

Components
Opens the Component List Editor.

See the Component List Editor section in Chapter 4 of the

Programming Manual.

Packages
Opens the Package List Editor.

See the Package List Editor section in Chapter 5 of the Programming

Manual.

Layouts
Opens the Layout List Editor.

See the Layout List Editor section in Chapter 7 of the Programming

Manual.

Panels
Opens the Panel List Editor.

See the Panel List section in Chapter 7 of the Programming Manual.

PCBs
Opens the PCB List Editor.

See the PCB List section in Chapter 7 of the Programming Manual.

Parameters
Opens the Parameter Editor.

See the Parameter Editor section in Chapter 4 of the Software

Manual.

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MYDATA automation AB Appendix B – Menu Reference Guide

Fiducial Marks
Opens the Fiducial Mark List Editor.

See the Fiducial Mark List section in Chapter 8 of the Programming

Manual.

Glue Dots
Opens the Glue Dot List Editor.

See the Glue Dot List section in Chapter 8 of the Programming

Manual.

Users
Opens the User List Editor.

See the User List section in Chapter 8 of the Programming Manual.

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Appendix B – Menu Reference Guide MYDATA automation AB

Print
Print
C Component
P Package
M Magazine
B PCB
Y Components In Layout
E Messages
R Parameters
-----------------------
N Management Data
O Magazine Optimization
K Magazine Kit
L Layout Preparation
T Removable Feeder
-----------------------
A Cancel All Printouts

Component
Selected component data or the complete Component List can be
printed out.

Package
Selected package data or the complete Package List can be printed
out.

Magazine
Selected magazine contents or the complete Magazine List can be
printed out.

PCB
Data for a selected PCB or all PCBs can be printed out.

Components In Layout
A component list for the selected layout is printed out.

Messages
All messages or those with a maximum age of what is stated as Enter
time in minutes can be printed out or saved as a file on a floppy disk
or on the local or host hard disk.

See the Messages section in Chapter 2 of the Operator's Manual.

Parameters
Selected parameter or all parameters can be printed out.

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Management Data
Management data for the selected layout is printed out.

See the Management Data section in Chapter 8 of the Operator's

Manual.

Magazine Optimization
Creates and prints a list of possible magazine combinations for the
selected layout.

See the Magazine Optimization section in Chapter 5 of the Operator's

Manual.

Magazine Kit
Selected Magazine Kit or all the Magazine Kits can be printed out.

See the Printing a Magazine Kit section in Chapter 5 of the

Operator's Manual.

Layout Preparation
Creates and prints out a list of components which cannot be mounted
in the selected layout.

See the Layout Preparation section in Chapter 8 of the Operator's

Manual.

Cancel All Printouts

This command cancels all current print processes.

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Appendix B – Menu Reference Guide MYDATA automation AB

Utility

Utility
I Import
X Export
T Installation
D Diagnostics
M Re-Initiate Motor Controllers
O Re-Initiate Conveyor
C Conveyor Pass-Through Mode
G Login / Logout
A User Access System
W Web Interface Setup
E Clear Event Log
N Delete Management Data
-------------------------------
B Backup
R Restore
H Schedule Backup
S Save System Status
F Format DOS Diskette
U Units
L Language
K Desktop Resolution

Some of these options cause machine movements. Before entering

such commands, check the following:

Ensure that there are no foreign objects on the assembly table, near the
tool bank, or within the X wagon, Y wagon, or Tray Wagon Magazine
moving areas, and that the standard tool head and the HYDRA tools
are in their upper positions.

Import
Import command for TPSys and Directline format data, such as
layout, panel, PCB, component, and package.

See the Importing Data section in Chapter 6 of the Software Manual.

Export
Export command for TPSys and Directline format data, such as
layout, panel, PCB, component, and package.

See the Exporting Data section in Chapter 6 of the Software Manual.

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MYDATA automation AB Appendix B – Menu Reference Guide

Installation
Software installation tools for adjusting and calibrating various
functions.

The following sub menu is shown:

Causes machine movement.
Installation
X X-Wagon Camera Calibration
C Centering Base Level Measurement
P Place Area Calibration
N Extended X Calibration
W Tray Wagon Installation/Removal
O Z-Unit Offset Measurement
S Adjust Slot Position
T Tool Installation
V Optical Centering Calibration
F Centering Camera Fine Tune
H HYDRA
R Cable Resistance Measurement
L Test Place Area Calibration

• Tray Wagon Installation/Removal

Installs and uninstalls the Tray Wagon Magazine.

See the Tray wagon magazines section in Chapter 5 of the

Operator's Manual.

• All other options

All the other options in this menu are detailed in the Machine
Manual.

Diagnostics
Software diagnostic tools for various functions.

The following sub menu is shown:

Causes machine movement.
Diagnostics
T Toggle X Wagon Position
F Fetch Standard Tool
E Fetch HYDRA Tools
C Cycle Standard Tool
Y Cycle HYDRA Tools
H Hysteresis Test
V Vacuum Test
P Prepare To Grab Images
I Copy Last Images

• Toggle X Wagon Position

Moves the X wagon to the outermost positions.

See the Moving X Wagon To Outermost Positions section in

Chapter 8 of the Operator's Manual.

• All other options

All the other options in this menu are detailed in the Machine
Manual.

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Re-Initiate Motor Controllers

Causes machine movement. Initiates the motor controllers and hardware without exiting TPSys.

The procedure should be performed if you suspect any trend of

measuring error or abnormal movements.

Re-Initiate Conveyor
Causes conveyor movement. Initiates the Y-wagon conveyor, that is to measure the mechanical
end position and update the software.

Do not re-initiate the conveyor width if any board is left in the

placement area.

Conveyor Pass-Through Mode

Sets the machine in a pass-through mode so that boards can pass
through the machine without being assembled. This option is
intended for in-line machines temporarily not used.

Login / Logout
Allows an operator to log on to the system with a personal password
and individual privileges.

To avoid leaving the system open for non-authorized persons, the

operator can also log off by selecting this menu option.

User Access System

Switches the security feature on or off. This feature can only be
switched on or off by a user for witch the User privilege level is set to
High.

See the User List section in Chapter 8 of the Programming Manual.

Web Interface Setup

Used to select security levels in the WWW-set up.

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Clear Event Log

Clears all data in the event log for the machine selected in a dialog
box shown.

The event log is a database where system events (for instance

start/stop, logon/logoff, magazine insert/extract, components
mounted, tool information and errors) are stored. By using the
TPSys Export feature this database can be used for evaluation of
management and quality data outside TPSys.

Delete Management Data

Deletes the management data for a selected layout. The management
data for the currently loaded layout cannot be deleted.

This command is intended to be used when cleaning up the system.

If you want to clear the management data only for the currently
loaded layout, then use the Clear Management Data option in the
Production menu instead, see page B-6.

See the Deleting Management Data section in Chapter 8 of the

Operator's Manual.

Backup
Backup is a feature for backing up most of the data stored in the
various databases in TPSys.

See the Backing Up section in Chapter 5 of the Software Manual.

Restore
Restore is used for restoring data backed up with the previous
feature.

See the Restoring section in Chapter 5 of the Software Manual.

Schedule Backup
Opens a dialog box in which scheduled automatic backup can be
configured.

See the Scheduled Backup section in Chapter 5 of the Software

Manual.

Save System Status

Saves numerous status parameters and settings, which can be
interpreted by MYDATA technicians only. The function is intended
for fault tracing and the command should be given immediately after
a fault has occurred. The result can then be sent to MYDATA for
evaluation.

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Format DOS Diskette

Disks can be DOS formatted by TPSys in the machine disk drive by
using this command.

See the Disk Formatting section in Chapter 3 of the Programming

Manual.

Units
The measuring units can be selected to Metric or Inch.

Language
You can select language from a menu. After changing to another
language, TPSys is exited and restarted.

Desktop Resolution
Select the desktop resolution to use from a pop-up window. The
choices are Standard resolution or High resolution. The resolution
must be set to high if the web interface is to be used.

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Exit

Exit
S Shutdown
R Restart TPSys
X Exit TPSys
M Exit To Service

Shutdown
System shutdown is selected prior to switching off the power. When
this option is selected, you exit both the MYDATA TPSys and Linux.
After receiving the following message you can safely switch the
power off:

System halted
The system can now be re-booted by pressing the key combination
<Ctrl>+<Alt>+<Del>.

Restart TPSys
TPSys and Linux are exited and then restarted again.

Exit TPSys
Exits TPSys and returns you to the Linux operating system.
To restart TPSys, type ’go’ and press <Enter> at the Linux prompt.

Exit To Service
Exits TPSys and starts the Service Program.

The Service Program is described in the Machine Manual.

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Appendix B – Menu Reference Guide MYDATA automation AB

About...
About...
M This Machine
T TPSys
D Databases
S System Statistics
E Temp. Statistics
C Motor Controllers

This Machine
Shows the machine name and number, and available options, which
can look like this:

Machine name: my15n123

Machine No.: 15123

Options active:
* Digitizer
* Electrical two-pole test
* Electrical transistor test
* Optical centering
* Bar code reader
* Conveyor
* Shared databases
* HYDRA
* Electrical measurement
* Z High Speed
* HYDRA High Speed
* Autoteach
* MYSpeed

User access system is on

OK

TPSys
Shows TPSys version and revision trace information, which can look
like this:

TPSys by MYDATA automation

Version 2.3.x for Linux

OK

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Databases
Opens a popup menu for selecting status or size.

A Status The Status option shows database status, that is local or shared
I Size databases:

Database status:

Component data: Shared with tp94n124

Magazine data: Shared with tp94n124
Package data: Shared with tp94n124
Mount data: Local
User data: Local
OK

A Status The Size option shows the database size for all databases, that is the
I Size number of entries in the databases:

Number of items:

439 Magazines 2 Y-Wagon Trays

1156 Packages 1 Y-Wagon Tray Positions
848 Components 0 Tray Wagon Trays
115 Layouts 0 Tray Wagon Tray Positions
39 Panels 10 Pallet Trays
50 PCBs 5 Pallet Tray Positions
6 Users 54 Tray Types
213 Pallets 16 Fiducial Mark Types
4 TEXs 8 Glue Dots
33 Kit Lists
OK

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Appendix B – Menu Reference Guide MYDATA automation AB

System Statistics
Shows system statistics, which can look like this for machines which
are not equipped with the HYDRA system ...

System Statistics
Total up time: 29 days 10 hours 37 minutes 39
seconds
Total assembly time: 12 minutes 23 seconds
Total glue time: ---

Total mounted with Z: 24

Total glued: 0
OK

... and like this for machines equipped with the HYDRA system:

System Statistics
Total up time: 15 days 4 hours 34 minutes 45 seconds
Total assembly time: 45 minutes 17 seconds
Total glue time: ---

Total mounted with Z: 215

Total glued: 0
Total HYDRA cycles: 640
Tool: 1 2 3 4 5 6 7 8
Mounted: 625 618 614 620 623 525 417 607
Fail: 23 24 30 25 24 27 23 37

Total mounted: 4964

Total X cycles: 955
OK

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MYDATA automation AB Appendix B – Menu Reference Guide

Temp. Statistics
This option shows also system statistics, but this statistics can be
reset by using the Reset command in online mode. The feature is
intended for temporary statistics. It can look like this for machines
which are not equipped with the HYDRA system ...

Temporary System Statistics

Up time: 26 days 1 hours 46 minutes 9
seconds
Assembly time: 12 minutes 23 seconds
Glue time: 2 seconds

Mounted with Z: 659

Glued: 0

OK Reset

... and like this for machines equipped with the HYDRA system:

Temporary System Statistics

Total up time: 15 days 4 hours 34 minutes 45 seconds
Total assembly time: 45 minutes 17 seconds
Total glue time: ---

Total mounted with Z: 215

Total glued: 0
HYDRA cycles: 640
Tool: 1 2 3 4 5 6 7 8
Mounted: 625 618 614 620 623 525 417 607
Fail: 23 24 30 25 24 27 23 37

Mounted: 4964
X cycles: 955
OK Reset

Motor Controllers
Shows the motor controller software versions like this:

Servo release: 7.4c

Controller C: C2d9ab 980120

Controller M: m31r 990922
Controller X: xD32DJ 960524
Controller Y: ym20hg 970423
Controller Z: zs25CA 971202
Controller TEX: zs25CA 990309
OK

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Appendix B – Menu Reference Guide MYDATA automation AB

Switches
Four groups of production switches can be accessed by selecting the
Switches option in the Production menu:

Production
A Assemble
T Locate Boards (Auto)
M Locate Boards (Manual)
S Clear Layout Status
D Clear Management Data
------------------------
L Load Layout
E Edit Layout
U Unload Layout
X Layout Status
------------------------
V View Messages
- Set Message Time Mark
W Switches
I Mount/Glue Switches
------------------------
Y Move Y Wagon
C Conveyor Control
O Leave Tool

The four switch groups are:

Parameter Groups
1001 Test switches
1002 Assembly switches
1003 Bad board search
1004 Conveyor switches

By pressing <F7> you can print the highlighted switch group.

F7

By pressing <F8> you can print out all the switch groups.
F8

Press <Enter> to modify the highlighted switch group, see the next
page.
Enter Information about maximum and minimum values for those entries
that are asked for values are shown in the information field.

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MYDATA automation AB Appendix B – Menu Reference Guide

1001 Test switches

1001.0003 Mechanical
test.......................... Yes
1001.0004 Test of Z level when place...............
No
1001.0005 Test of Z level when pick................
Yes
1001.0006 Test of Z vacuum.........................
Yes
Electrical test
0001 Test................................... Yes
0008 Perform test after magazine inserted... No
0002 No. of successful test before HYDRA.... 5
0020 Measure component after test........... No

– Select the desired switch by using the arrow keys.

– Select Yes or No by pressing <Space>.
– Confirm by highlighting Save and exit and pressing <Enter>.

Password may be required to save modifications made.

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Appendix B – Menu Reference Guide MYDATA automation AB

The following switches are included in the switch groups:

1001 Test switches

1001.0003 Mechanical test............................
Yes
1001.0004 Test of Z level when place.................
No
1001.0005 Test of Z level when pick..................
Yes
1001.0006 Test of Z vacuum...........................
Yes
Electrical test:
0001 Test..................................... Yes
0008 Perform test after magazine inserted..... No
0002 No. of successful test before HYDRA...... 5
0020 Measure component after test............. No
1001.0007 Lamp timeout...............................
90s

1002 Assembly switches

Bad board test:
0002 Automatic.................................. No
0001 Check panels for bad boards................ No
0010 Use bad board mark on panel................ No
Present board detection:
0014 Automatic.................................. No
0013 Remember non-present board flags........... Yes
Locate boards:
0003 Automatic fiducial mark search............. Yes
0007 Locate all boards on a panel............... No
0008 Accepted fiducial mark distance error (%).. 0.125
0009 Max accepted board angle deformation....... 0.50°
Serial start:
0006 Mode....................................... Off
0023 Wait for layout name before load........... Yes
PCB id:
0024 Auto mode.................................. Off
0025 Accept manual.............................. No
0027 Auto generate on panels.................... No
Warning switches:
0019 Min component distance in PCB editor....... 1mm
0021 Overlapping board warning.................. Yes
Measure board level:
0011 Always..................................... Yes
0012 When new layout is loaded.................. Yes
Assemble:
0004 Use local fiducial marks................... Yes
0005 Invert meaning of comp. mount/glue flags... No
0020 Max component height on PCB................ 15mm

1003 Bad board search

0001 Contrast level............................. 50
0010 Bad board area
0011 X size................................... 2mm
0012 Y size................................... 2mm
0021 Contrast means board OK.................... Yes

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MYDATA automation AB Appendix B – Menu Reference Guide

The switches included in the four switch groups are described below
in the same order as in the previous table.

1001 Test switches

1001.0003 Mechanical test

Yes – Components with the Verify mechanical entry set to Yes in
the Package List are verified mechanically.

No – No components are verified mechanically.

1001.0004 Test of Z level when place

Yes – A plausibility check of the height level is performed and the
actual placement height is compared to the package Height
overall level in the Package List. This comparison also
consider the 0021.0305 Place level tolerance parameter to
compensate the height of solder paste under the component.

This feature detects if a component was never picked up

from the magazine, has dropped from the mount tool or was
placed on top of another component.

No – The height level is not measured when placing components.

1001.0005 Test of Z level when pick

Yes – The same function as the previous switch, but in this case it
is checked if the component pick from magazine feeder or
tray is done within the height limits. The limits are set by
the package Height overall entry in the Package List and the
0021.0105 Pick level tolerance parameter.

This feature detects if a component for instance is missed in

the magazine.

No – The height level is not measured when picking components.

1001.0006 Test of Z vacuum

Yes – The vacuum in the mount tool is checked to confirm that a
component is held by the tool. This applies to all components
except those for which the Vacuum test is set to No in the
Package List.

No – No vacuum test is performed.

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Appendix B – Menu Reference Guide MYDATA automation AB

Electrical test

0001 Test
Yes – Electrical verification is performed on components for which
electrical verification (Test 1, Test 2 Type) is defined in the
Component List. It is also required that:

1.There is a centering phase defined in the package list

which has the same angle as the test specified in the
Component List.
2.The package is set to Verify electrical Yes for this centering
phase in the package list.

No – No components are verified electrically.

0008 Perform test after magazine inserted

Yes – If a magazine is removed and then inserted again, then it
resets the counter used by the 0002 No. of successful test
before HYDRA test switch. This counter sets how many
components to be tested with the standard mount tool,
before HYDRA mounting is started.

No – If a magazine is removed and then inserted again, then the

counter used by the 0002 No. of successful test before
HYDRA test switch continues from the current value. If a
sufficient number of components already had been tested by
the standard mount tool before the magazine was removed,
then the HYDRA mounting will continue immediately as the
magazine is inserted again.

0002 No. of successful test before HYDRA

Defines a number of HYDRA mountable components which will be
picked with the standard mount tool, tested with the centering jaws,
and mounted on the board before the HYDRA unit continuous
mounting the components.

The number applies to each magazine feeder that holds HYDRA

mountable components. If, for example, there are 16 feeders that
hold HYDRA mountable components and this parameter is set to 2,
then 32 components will be tested and mounted with the standard
mount tool before the HYDRA starts mounting the components.

This parameter affects HYDRA mountable components only, that is

components for which a tool is specified in the HYDRA tools field in
the Package List.

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MYDATA automation AB Appendix B – Menu Reference Guide

0020 Measure component after test

Yes – After passing the electrical verification, a new electrical
measurement is performed on the component and the
measured value from this measurement is stored in the
event log.

This feature requires also that:

1.The Save electric value entry in the PCB editor is set to

Yes.
2.The 0024 Electrical measurement parameter in the 0191
Options parameter group is set to Yes.

3.The magic word includes this optional feature.

No – No electrical measurement of the component is performed.

1001.0007 Lamp timeout

Sets the camera light idle time when, for instance, centering fiducial
marks and positioning components. If the machine is left during such
a procedure, the light is switched off after the time set. Pressing a key
on the keyboard or moving the trackball or joystick turns it on again.

The time unit is seconds.

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Appendix B – Menu Reference Guide MYDATA automation AB

1002 Assembly switches

Bad board test

0002 Automatic
This switch has effect only if the previous switch named Check panels
for bad boards is set to Yes.

Yes – An automatic bad board search is performed, that is the

camera is moved to the position specified for bad board
marks and searches for a mark.

No – The system does not perform automatic bad board search.

0001 Check panels for bad boards

Yes – The system searches for bad board marks on the PCBs
included in the panel.

No – The system does not search for bad board marks.

0010 Use bad board mark on panel

In order to save time, this feature makes it possible to mark a panel
to indicate that there are at least one bad PCB in the panel. Panels
and bad boards are marked using bad board marks.

Yes – The system checks if there are bad board marks on panels.

If a bad board mark is found on a panel, all the PCBs

included in the panel are checked.

If no bad board is found on a panel, the next board in the

layout is checked. If there are no more boards, then the bad
board search procedure is finished.

No – The system does not check if there are bad board marks on
panels, but on all included PCBs.

This feature saves most time when there are many PCBs included in
the panels and bad boards are of rare occurrence.

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MYDATA automation AB Appendix B – Menu Reference Guide

Present board detection

0014 Automatic
Automatic non-present board marking.

The 0013 Remember non-present board flags switch should be set to

No if this switch is set to Yes.

See the Automatic Non-Present Board Detection and Board Location

Switches sections in Chapter 8 of the Operator's Manual.

0013 Remember non-present board flags

Sets whether non-present board marks remain or are cleared after
mounting.

See the Marking Board As Non-Present and Board Location Switches

sections in Chapter 8 of the Operator's Manual.

Locate boards

0003 Automatic fiducial mark search

Yes – Automatic fiducial mark search is on.
No – Automatic fiducial mark search is off.

See the Board Location Switches section in Chapter 8 of the

Operator's Manual.

0007 Locate all boards on a panel

Yes – When locating panels, all PCBs in the panel are subjected to
individual fiducial mark search in addition to the panel
itself.

No – Only the panel itself is subjected to fiducial mark search.

0008 Accepted fiducial mark distance error (%)

See the Fiducial Mark Deviation section in Chapter 8 of the
Operator's Manual.

0009 Max accepted board angle deformation

See the Fiducial Mark Deviation section in Chapter 8 of the
Operator's Manual.

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Appendix B – Menu Reference Guide MYDATA automation AB

Serial start

0006 Mode
Automatic start mode is intended for systems equipped with
conveyor and barcode reader or other detection device.

Off
Automatic start mode is off.

Latest read
The latest layout name read from the defined serial port is
loaded and assembled (no queuing).

FIFO
Queues up layout names in the order they are read from the
defined serial port. As the boards are transported into the
machine, the layouts are loaded and assembled in the queue
order.

0023 Wait for layout name before load

Yes – If serial start is used, that is the previous switch is set to
Latest read or FIFO, then TPSys will not load the next board
until it has got the next layout name from the serial link.

No – The next layout is loaded without waiting for the next layout
name from the serial link.

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MYDATA automation AB Appendix B – Menu Reference Guide

PCB id
For tracing components from a feeder to a PCB. The ‘PCB id’ is
written into the event log in a PCB identity entry.

0024 Auto mode

Sets whether the ‘PCB id’ is taken from the serial line or not.

Off
The ‘PCB id’ is not taken from the serial line.

Latest read, serial line

The most recent ‘PCB id’ is taken from the serial line.

FIFO, serial line

‘PCB id’ is taken from the serial line in the order they appear,
that is the oldest first.

0025 Accept manual

If switch 0024 Auto mode is set to Off, then a pop-up box is shown
asking for the ‘PCB id’ for each PCB.

Yes – The ‘PCB id’ can be entered manually by typing it, or by

using the hand-held barcode reader.

No – The ‘PCB id’ cannot be entered manually.

0027 Auto generate on panels

Yes – The system accepts only one identity code per panel. From
this identity code it generates identities for all the PCBs in
the panel. The syntax of the generated identity codes is
‘panelId_boardNo’ where ‘boardNo’ is the board number in
the panel.

No – The system does not generate identities for the PCBs in the
panel.

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Appendix B – Menu Reference Guide MYDATA automation AB

Warning switches

0019 Min component distance in PCB editor

If the center-to-center distance between two components that are to
be placed on a PCB is below what is specified by this switch, then a
warning is shown.

0021 Overlapping board warning

Yes – Warns when the location of two boards on the assembly
table are calculated to overlap each other (if you, for
instance, have located two boards on the same fiducial
marks).

No – No warning is shown for overlapping boards on the assembly

table.

Measure board level

0011 Always
Switch for board level measurement.

Do not mix boards of different thickness in the same layout.

Yes – The board level is measured once for each time the layout is
assembled.

No – The board level can be measured according to the next

switch 0012 When new layout is loaded.

0012 When new layout is loaded

Switch for board level measurement.

This switch has effect only if the previous switch 0011 Always is set
to No.

Yes – The board level is measured only once after changing to a

new layout.

No – The board level is measured only once.

If the board thickness differ from layout to layout, this switch should
be set to Yes.

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MYDATA automation AB Appendix B – Menu Reference Guide

Assemble

0004 Use local fiducial marks

Yes – Local fiducial mark search is performed automatically for
components prior to placing, provided the Local fiducial
marks in the PCB Editor is set to 1, 2, or 3.

No – Local fiducial mark search is off.

See the PCB Editor section in Chapter 7 of the Programming

Manual.

0005 Invert meaning of comp. mount/glue flags

Yes – Only components for which Mount is set to No in the
Component List are mounted. This switch inverts thus the
function of the Mount field in the Component List.

No – Components for which Mount is set to No in the Component

List are not mounted.

See the Mount and Glue Switches section in Chapter 8 of the

Operator's Manual.

0020 Max component height on PCB

Using this switch, the operator can inform the system about the
maximum height of components on the PCB that are not included in
the current mount lists and thus not known by the system.

Normally the system knows the height and position of every

component on the PCB from the package database and from the
mount lists. This is important for optimizing the speed and allowing
simultaneous X and Z movement, without hitting components on the
PCB.

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Appendix B – Menu Reference Guide MYDATA automation AB

1003 Bad board search

1003.0001 Contrast level

Sets a limit, above which the detected contrast is regarded as high.
The value must be set so that the program can differentiate between
the label and the background (one is detected as ’low’, the other as
’high’).

The contrast level must not be confused with light intensity level.
High contrast means big difference in light intensity between the
lightest and the darkest parts of an area.

For safe detection of bad board labels, there must be significant

contrast difference between the labels and the backgrounds.

This figure shows a contrast level diagram for a scanned line. The
R2 diagram shows that the label has low contrast and is placed on a high
contrast area. The 1003.0001 Contrast level parameter can be set
rather low. The 1003.0021 Contrast means board OK parameter
should be set to Yes to detect a bad board label.

This figure shows a label with high contrast, placed on a board with
R2 low contrast. The 1003.0001 Contrast level parameter can be set
rather high. The 1003.0021 Contrast means board OK parameter
should be set to No to detect a bad board label.
Y

X
Bad board area

0011 X size
The distance between the two X coordinates of the area in which a
R2 bad board mark is searched for.

Y Should be smaller than the label size.

0012 Y size
X The distance between the two Y coordinates of the area in which a
bad board mark is searched for.

Should be smaller than the label size.

0021 Contrast means board OK

Yes – If the contrast for the bad board mark search area is high
(higher than the level set in the 1003.0001 Contrast level
parameter), then the board is good and will be mounted.

This is the normal setting and means that the bad board
label has less contrast than the board, for instance a white
label.

No – Inverted contrast, a high-contrast search area means a bad

board.

This setting can be used if you mount boards with no

contrast. You can attach high-contrast labels to mark bad
boards, or simply mark bad boards with black ink directly on
the board.

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MYDATA automation AB Appendix B – Menu Reference Guide

1004 Conveyor switches

0001 Conveyor fetch

Yes – New boards are fetched automatically by the conveyor.

No – Boards are not fetched by the conveyor.

0002 Conveyor leave

Yes – Assemblies are transported away automatically by the
conveyor.

No – Assemblies are not removed by the conveyor.

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Appendix B – Menu Reference Guide MYDATA automation AB

B - 40 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

MYDATA automation AB Appendix C – About the Documentation

Appendix C – About the Documentation

The documentation of the MYDATA Component Placement
Machines comprises the following parts:

• Operator’s Manual
• Programming Manual
• Machine Manual
• Maintenance Guide
• Software Manual
• Spare Parts Catalog
The manual structure in Figure C-1 show the intended user for each
manual.

User's Manual

CADConversion 4.0
MY Series & TP Se ries
Compo nent Placeme nt Machi nes
En gli sh

For a fast changing world MYDATA

Operator's Manual
Operator Programmer Programming Manual
CADConversion
TPSys Version 2.3
MY Series & TP Se ries
Compo nen t Place me nt Mach ine s
TPSys Version 2.3 Engli sh

MY Seri es & TP Serie s

C ompone nt Pl acement Machin es
Engl ish

For a fast changing world

MYDATA

For a fast changing world MYDATA

Operator’s Manual Programming Manual

Software Manual

User's Manual
Spare Parts Catalog
MYLabel 2.0 TPSys Version 2.3
MY Series & TP Series
MY Serie s & TP Series
Compon ent Placement Machines
Co mpone nt Pla cement Ma chin es
English
Engl ish

For a f ast changing wo rld

MYDATA
For a fast changing world
MYDATA

Spare Parts

MYLabel
For MYDATA SMD Placement Machines

Maintenance
Software Manual Guide
For a fast changing world MYDATA

Machine Manual

MYSpeed User's Manual

MY Series
MY9 – MY12 – MY15 – MY19
Compon ent Placement Machines
English
MYLabel 2.0
MY Se ri es & TP Series
Component Placement Machines
English
For a f ast changing w orld MYDATA

For a fast changing wo rld MYDATA

Machine Manual

Process engineer (with operations Certified or authorized maintenance

planning) engineer

Figure C-1. Manual structure

P-020-0024-EN Programming Manual Rev. 0000 2004-01 C-1

Appendix C – About the Documentation MYDATA automation AB

Operator's Manual
An Operator’s Manual for TPSys version 2.4 covers all the MYDATA
machine types.

This manual is provided with each machine.

The Operator’s Manual is available in a number of languages.

The Operator’s Manual contains information to assist the operator to

start and operate the system, load components and handle magazines
For a fast changing world MYDATA
and trays.

Information about safety, daily maintenance, HYDRA, TEX and

Tray Wagon operation is also included in the Operator's Manual.

Programming Manual
A Programming Manual for TPSys version 2.4 covers all the
MYDATA machine types.

This manual is provided with each machine.

The Programming Manual is available in the most common

languages.

The Programming Manual contains basic information about the

MYDATA
machine movements, coordinates, fiducial marks, angles, centering,
verification, and how to program boards, create mount lists,
For a fast changing world

maintain and complete component and package lists, etc.

Information about safety, pre programmed packages, HYDRA, TEX

and Tray Wagon programming is also included in the Programming
Manual.

C-2 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

MYDATA automation AB Appendix C – About the Documentation

Machine Manual
A Machine Manual is available for each of the machine series. There
are thus two different Machine Manuals for the two current machine
series:
Machine Manual
• MY9, MY12, MY15 and MY19
• TP9-2U
MY Series
MY9 – MY12 – MY15 – MY19
Component Placement Machines
Applicable manual is provided with each machine.
English

For
For aa fast
fast changing
changing world
world MYDATA The Machine Manual is available in English only.

The Machine Manual contains descriptions, service instructions and

calibration guidelines for the machine.

Information about safety, maintenance and common optional devices

and systems are also included in the Machine Manual.

The Machine Manual has an index tag for the machine test protocol.

Maintenance Guide
Maintenance Guide A Maintenance Guide is available for each of the machine series.
There are thus two different Maintenance Guides for the two current
Maintenance Guide for the MY The warranty on the machine and parts applies only if all the
series of placement machines. maintenance instructions are followed.

For further information about the maintenance, refer to the

Maintenance chapter in the Machine Manual.

Emergency stop button

WARNING
Before commencing any maintenance, press an emergency stop
button down or turn the power off.

Use Shell Tellus oil and OKS 270 grease, unless other lubricant to
machine series:
be used is put in brackets.

• MY9, MY12, MY15 and MY19.

Oil and grease should be applied in small amounts, just to give a
thin film.

Optional units
For machines equipped with optional units, instructions under the
corresponding headlines are to be followed.

HYDRA ATE stands for HYDRA Automatic Tool Exchanger.

• TP9-2U.
Daily
1. Inspect the mount tools.
2. Clean the centering jaws.
3. Clean the machine and the magazines.
4. Inspect the magazine connectors.
5. Empty the reject bins.
6. Inspect the warning signs.

Applicable guide is provided with each machine.

Glue Device 7. Clean the glue tools.
8. Clean the glue tool verification points (at tool bank and glue
station).
9. Clean under the tool bank.
HYDRA Unit 10. Inspect the HYDRA mount tools.
11. Remove components from the HYDRA camera glass.
Linescan System 12. Remove components from the Linescan camera glass.

P-040-0010-EN – Maintenance Guide Rev. 0002 2001-12 Page 1

The Maintenance Guide is available in the most common languages.

The Maintenance Guide contains service instructions and guidelines

for the machine.

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Appendix C – About the Documentation MYDATA automation AB

Software Manual
A Software Manual for TPSys version 2.4 covers all the MYDATA
machines running TPSys version 2.4.

Software Manual
The Software Manual is available in English only.

The Software Manual contains a system overview, Linux description,

import/export information, back up/restore instructions and
TPSys Version 2.3
communications.
Component Placement Machines
English

MYDATA
In an appendix there is also a message reference guide, containing
those TPSys messages that can be displayed by TPSys, and
For a fast changing world

descriptions of the messages.

Spare Parts Catalog

A Spare Parts Catalog, containing information, figures and part
numbers on the most common spare and consumable parts, is
available from MYDATA.
Spare Parts
For MYDATA SMD Placement Machines
The Spare Parts Catalog is available in English only.

For
For aa fast
fast changing
changing world
world MYDATA

C-4 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

MYDATA automation AB Appendix C – About the Documentation

Supplementary software
MYDATA provide supplementary software which facilitate the
programming work in TPSys.

This software may be mentioned in this manual but will not be

described here. We refer you to their respective manuals.

CAD Conversion
CAD Conversion is a software package used to convert CAD files
containing placement data to TPSys in order to use the data for
CAD-File TPSys-File component placing.

The CAD Conversion software package includes a comprehensive

CAD Conversion
CADConversion User's Manual.

MYSpeed
MYSpeed is a software package used to calculate assembly time for
boards that have not yet been assembled in order to get information
for quotations and production planning. This software can also
balance jobs between different machines or machine lines.

The MYSpeed software package includes a comprehensive

MYSpeed MYSpeed User's Manual.

MYLabel
MYLabel keeps track of component carriers (tapes, sticks) used in
production with MYDATA machines, by use of bar codes. MYLabel
use an identification bar code linked to a database with component
names, quantities and batch information on tape reels to be used by
TPSys. The database also contains information related to the
component, such as stock location and owner.
MYLabel
The MYLabel software package includes a comprehensive
MYLabel User's Manual.

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Appendix C – About the Documentation MYDATA automation AB

C-6 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

MYDATA automation AB Index

Index
A
Accelerations
acceleration codes 5-11
entries 5-10
HYDRA theta 5-12
HYDRA Z 5-12
mount precision 5-10
Z up distance 5-13
Z up speed 5-13
Automatic board location 3-22
Autoteach
ball device A-7
BGA packages A-7
Cannot find all leads A-15
entries A-4
Failed to measure pitch A-15
leaded device A-10
No leads found A-15
No more leads to remove A-15
Unable to adjust the leads to a grid with the pitch A-15
Unable to find more leads A-15
C
C movement 3-3
Centering phase
Ambient light - Abs. 5-76
Ambient light - Rel. 5-76
Dark field - Abs. 5-76
Dark field - Rel. 5-76
Dimension 5-73
entries 5-71
Force 5-73
Front light - Abs. 5-76
Front light - Rel. 5-76
function keys 5-70
Level 5-72
Light Level 5-74
method 5-71
Pattern 5-75
Position 5-72
Verify electrical 5-74
Verify mechanical 5-73
Change lead group 5-66
Change lead type 5-67
Component List Editor
electrical verification type 4-6
entries 4-3
feeder type 4-5
function keys 4-2
magazine type 4-4
Reject pos. 4-6
search magazines 4-8
Create Fiducial mark 3-14
Create layout, board and fiducial mark 3-13
D
Defining fiducial marks 3-16
Diodes back to front 3-29

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Index MYDATA automation AB

E
Entering fiducial mark coordinate from keyboard 3-7
F
Fiducial mark
create 3-14
design 3-7
entering coordinates manually 3-16
entering from keyboard 3-7
Locate Boards (Auto) 3-22
Locate Boards (Manual) 3-21
machine coordinates 3-12
measuring board angle 3-17
panel coordinates 3-10
PCB coordinates 3-8
PCB without mark 3-7
teaching TPSys 3-14
Fiducial Mark Editor
Circle contrast 8-7
Correlation 8-7
Diameter 8-7
Diameter tolerance 8-7
entries 8-4
Fiducial mark type 8-4
function keys 8-2
Mark taught 8-4
not filled 8-6
Object filter size 8-6
pixel grid size 8-6
Symmetric mark 8-5
symmetrical but unusual shape 8-6
Teach area X size 8-6
usual shapes 8-6
White on black 8-5
Fiducial Mark List 8-2
G
Generic BGA editor
editing commands 5-54
Editing symmetry 5-51
entries 5-49
Lead diameter 5-50
Lead pitch 5-50
Lead type 5-49
Max lead displacement 5-50
No. of leads 5-52
Offset 5-53
Position 5-52
Size 5-52
View 5-51
Glue Dot Editor
Dip depth in glue 8-10
entries 8-9
Find a place to measure board level on 8-12
function keys 8-8
Slow up dist. from glue 8-10
Slow up dist. from PCB 8-11
Slow up force from glue 8-10
Slow up force from PCB 8-11
Slow up speed from glue 8-10
Slow up speed from PCB 8-11
verify 8-12
Wait time b/a X run 8-11
Wait time on PCB 8-11
Glue dots
I-2 Rev. 0000 2004-01 P-020-0024-EN Programming Manual
MYDATA automation AB Index

entries 5-79
function keys 5-78
H
How to
add components to PCB 2-20
add panel to layout 2-40
add PCB to layout 2-8
create layout 2-46
create new layout 2-6
inser PCB in panel 2-35
locate new PCB 2-8
program panel 2-27
program panel header 2-34
program PCB header information 2-11
HYDRA
edit preparation values 6-57
entries in HYDRA Preparation editor 6-53
function keys in the HYDRA preparation editor 6-51
preparation 6-50
preparation editor 6-52
HYDRA preparation
change values 6-57
edit values 6-57
entris in values box 6-57
Maximum computation time 6-57
No. of available magazines 6-57
Trade-off number of picks 6-57
HYDRA preparation editor
Available feeders 6-55
Components in layout 6-53
Components per pick 6-55
Count/Feeders Components 6-53
entries 6-53
Feeders to use 6-55
Feeders used 6-54
function keys 6-51
HYDRA components 6-53
Magazines used 6-54
Skipped components 6-54
Total No. of picks 6-55
Wrong feeder type 6-54
I
Illumination 5-76
K
Keyboard
shortcuts B-2
shortcuts for machines with CP5/VVG hardware B-3
L
Layout
barcode for serial start 7-12
conveyor board type 7-13
conveyor width 7-12
Glue Dot Editor entries 8-9
Layout Editor entries 7-11
Panel Editor entries 7-16
Panel List Editor entries 7-41
PCB Editor entries 7-26
PCB List Editor entries 7-43
position component on PCB 7-32
Layout Editor
entries 7-11
function keys 7-10
P-020-0024-EN Programming Manual Rev. 0000 2004-01 I-3
Index MYDATA automation AB

Layout header
bar code 7-12
conveyor board type 7-13
conveyor width 7-12
Layout List Editor
entries 7-9
function keys 7-8
Lead group type
BGA package 5-44
editor for generic BGA 5-49
flip-chip 5-58
Four lead groups on two sides 5-40
Four symmetric lead groups 5-34
Generic 5-60
Generic BGA package 5-48
Outline package 5-58
SOT-223 5-60
Three pole package 5-30
Two plus two symmetric lead groups 5-36
Two pole package 5-28
Two symmetric lead groups 5-32
M
Machine coordinates 3-2, 3-12
Machine movement
C 3-3
Theta 3-3
X 3-2
Y 3-4
Z 3-2
Magazine types 6-2
Magazines
Agilis contents 6-14
Locate magazine 6-7
locating pallet magazines 6-35
locating tray wagon magazines 6-31
locating Y-wagon magazines 6-23
magazine contents entries 6-12
magazine list entries 6-9
Pallet list entries 6-37
Pallet magazine entries 6-35
removable feeder entries 6-5
removable feeders 6-4
TEX 6-34
Tray elevator 6-34
Tray type list entries 6-43
tray wagon entries 6-31
types 6-2
vibratory magazine contents 6-16
Y-wagon magazine entries 6-19
Manual board location 3-21
Measuring board angle 3-17
Modify user list 8-14
O
Optical centering
CBGA lead types 5-22
CCGA lead types 5-23
CGA lead types 5-23
Coarse search 5-15
Coarse search contrast 5-17
Coarse search noise 5-16
Corner contrast 5-18
Corner variance 5-18
entries 5-14
I-4 Rev. 0000 2004-01 P-020-0024-EN Programming Manual
MYDATA automation AB Index

Fine search contrast 5-17

Fine search noise 5-17
HYDRA camera light levels 5-21
Index area offset 5-18
Index area size 5-18
Index type 5-18
Linescan illum. for HYDRA 5-21
Mark contrast 5-19
PBGA lead types 5-22
Unusable cameras 5-21
Usable cameras 5-19
Usable HYDRA cameras 5-21
Use best fit 5-14
Use sub pixel 5-14
Orientation
SOT23 Base to lead 1 - PNP or NPN 3-39
SOT23 Dual parallel diodes 3-37
SOT23 Dual serial diodes 3-36
SOT23 Emitter to lead 1 - PNP or NPN 3-38
SOT23 Single diode, anode to lead 3 3-34
SOT23 Single diode, cathode to lead 3 3-35
SOT89 Base to lead 1 - PNP or NPN 3-41
SOT89 Emitter to lead 1 - PNP or NPN 3-40
P
Package list
acceleration entries 5-10
alternate tool 5-5
autoteach entries A-4
Body length 5-4
Body width 5-4
centering phase entries 5-71
change lead group 5-66
change lead type 5-67
entries 5-4
function keys 5-2
glue dot entries 5-79
Height overall 5-4
Hold until ready 5-7
HYDRA tools 5-8
illumination 5-76
insert new A-2
Length overall 5-4
optical centering CBGA lead types 5-22
optical centering CCGA lead types 5-23
optical centering CGA lead types 5-23
optical centering entries 5-14
optical centering PBGA lead types 5-22
Pick wait time 5-5
Place force offset 5-6
Place wait time 5-6
Test centering entries 5-24
Tool to top off. 5-6
Width overall 5-4
Packages
BGA A-21, A-23
CBGA A-21, A-23
chip A-17
CQFP A-32
cylindrical two-pole A-37
FQFP A-32
LBGA A-21, A-23
LQFP A-32
LSOJ A-39
MBGA A-21, A-23
MELF A-28
P-020-0024-EN Programming Manual Rev. 0000 2004-01 I-5
Index MYDATA automation AB

MQFP A-32
PBGA A-21, A-23
PLCC A-30
PQFP A-32
QFP A-32
SC A-41
SD A-25
SO A-34
SOD A-37
SOJ A-39
SOT A-41
SSOP A-34
tantalum capacitors A-25
TO A-44
TQFP A-32
TSOP A-46
TSSOP A-46
Pallet magazines
entries 6-35
locating 6-35
Pallet list entries 6-37
Position list 6-39
reduce locating time 6-39
TEX 6-34
Tray elevator 6-34
Panel coordinates 3-10
Panel Editor
entries 7-16
function keys 7-14
insert matrix of PCB 7-19
insert PCB 7-18
PCB status 7-16
Panel List Editor
entries 7-41
function keys 7-40
PCB coordinates 3-8
PCB Editor
entries 7-26
PCB header entries 7-37
position component 7-32
PCB List Editor
entries 7-43
function keys 7-42
PCB status in panel 7-16
Programming hints
BGA A-21, A-23
CBGA A-21, A-23
chip A-17
CQFP A-32
cylindrical two-pole A-37
FQFP A-32
LBGA A-21, A-23
LQFP A-32
LSOJ A-39
MBGA A-21, A-23
MELF A-28
MQFP A-32
PBGA A-21, A-23
PLCC A-30
PQFP A-32
QFP A-32
SC A-41
SD packages A-25
SO A-34
SOD A-37
I-6 Rev. 0000 2004-01 P-020-0024-EN Programming Manual
MYDATA automation AB Index

SOJ A-39
SOT A-41
SSOP A-34
tantalum capacitors A-25
TO A-44
TQFP A-32
TSOP A-46
TSSOP A-46
two-pole flat chip A-17
R
Removable feeder list
entries 6-5
function keys 6-4
Restart TPSys B-21
S
Search magazines 4-8
Shutdown TPSys B-21
T
Teaching the fiducial mark 3-14
Test centering
entries 5-24
TEX 6-34
Theta movement 3-3
TPSys
exit B-21
restart B-21
shutdown B-21
Tray elevator 6-34
Tray type list entries 6-43
Tray wagon
entries 6-31
locating 6-31
Position List 6-32
reduce locating time 6-32
U
User List Editor
Access rights 8-16
entries 8-15
function keys 8-14
modify 8-14
User Access System 8-19
V
View
Angle 7-34
Current lead 7-33
Delta pos. 7-34
glue dot 8-12
Hide/show text 7-36
position component 7-32
Rotate component 7-36
Toggle component outline 7-35
Toggle lead 7-35
X
X movement 3-2
Y
Y movement 3-4
Y-wagon magazines
entries 6-19

P-020-0024-EN Programming Manual Rev. 0000 2004-01 I-7

Index MYDATA automation AB

locating trays 6-23

position list entries 6-26
reduce locating time 6-25
Y-wagon position 6-25
Z
Z movement 3-2

I-8 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

MYDATA automation AB Questionnaire

Questionnaire
The intention with this manual is to guide you in the MYDATA pick
and place system and to answer questions that may turn up.

To ensure that we provide appropriate information for these

purposes, we would appreciate your views and suggestions on how to
improve the manual in this direction.

Please, fill out the following questionnaire and send it by mail, or fax
it to +46 8 475 55 01.

P-020-0024-EN Programming Manual Rev. 0000 2004-01 Q-1

Questionnaire MYDATA automation AB

Thanks for your kind help.

It's very valuable to us.

Q-2 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

MYDATA automation AB Questionnaire

Title (Mr./Ms/Other): ________________________ Initial: _____________________________________________________

Surname: __________________________________ Job title: ___________________________________________________

Company: __________________________________ Address: ___________________________________________________

City: _______________________________________ Country: _____________________ Phone: _____________________

Have you read entire sections or do you use the manual to look up
specific information when needed?

q Read entire sections. q Look up specific information.

Comments: __________________________________________________

_____________________________________________________________

_____________________________________________________________

Do you think the information is easy to find and understand?

q Yes q No

Comments: __________________________________________________

_____________________________________________________________

_____________________________________________________________

Do you find any feature in MYDATA’s system hard to understand, a

feature that should be subjected to more detailed description?

q Yes q No

If yes, which one: ____________________________________________

_____________________________________________________________

_____________________________________________________________

Do you have any suggestions on how we can improve this manual?

_____________________________________________________________

_____________________________________________________________

P-020-0024-EN Programming Manual Rev. 0000 2004-01 Q-3

Questionnaire MYDATA automation AB

POSTAGE
STAMP

MYDATA automation AB
Dokumentationsavdelningen
Adolfsbergsvägen 11
S-168 66 Bromma
Sweden

If you prefer to send by mail, fold here and tape. No envelope required.

If you prefer to send by fax, use this number: +46 8 475 55 01

Q-4 Rev. 0000 2004-01 P-020-0024-EN Programming Manual

 SWEDEN JAPAN UK
®
MYDATA automation AB MYDATA automation K.K. MYDATA automation Ltd.
Adolfsbergsvägen 11 Okura bldg., No. 3, 1st floor 14 Wessex Trade Center
168 66 Bromma 2-17-7, Nihonbashi Kayabacho, Ringwood Road
Sweden Chuo-ku, Tokyo 103-0025 Poole, BH123 3PQ
Tel: + 46 8 475 55 00 Japan England
Fax: + 46 8 475 55 01 Tel: + 81 3 3661 7714 Tel: + 44 1202 723 585
Fax: + 81 3 3661 7715 Fax: + 44 1202 723 269

FRANCE SINGAPORE
MYDATA automation S.A. MYDATA Asia Pte Ltd.
13 Rue de Norvége BP122 Asiawide Industrial Building www.mydata.com
91944 Courtaboeuf Cedex 5 Pereira Road, #01-01 info@mydata.se
France Singapore 368 025
Tel: + 33 1 69 59 24 34 Tel: + 65 281 7997
Fax: + 33 1 69 28 71 00 Fax: + 65 281 7667

BENELUX USA
MYDATA automation B.V. MYDATA automation, Inc.
Schakelplein 10 320 Newburyport Turnpike
5651 GR Eindhoven Rowley MA 01969-2002
Netherlands USA
Tel: + 31 40 262 06 67 Tel: + 1 978 948 6919
Fax: + 31 40 262 06 68 Fax: + 1 978 948 6915
MYDATA automation AB