Diagonal 7.857 mm (Type 1/2.3) 12.

3Mega-Pixel CMOS Image Sensor with Square Pixel

for Color Cameras

IMX477-AACK-C
Description

IMX477-AACK-C is a diagonal 7.857 mm (Type 1/2.3) 12.3 Mega-pixel CMOS active pixel type stacked image
sensor with a square pixel array. It adopts Exmor RS™ technology to achieve high speed image capturing by column
parallel A/D converter circuits and high sensitivity and low noise image (comparing with conventional CMOS image
sensor) through the backside illuminated imaging pixel structure. R, G, and B pigment primary color mosaic filter is
employed. It equips an electronic shutter with variable integration time. It operates with three power supply voltages:
analog 2.8 V, digital 1.05 V and 1.8 V for input/output interface and achieves low power consumption.
In addition, this product is designed for use in consumer use camcorder. When using this for another application,
Sony Semiconductor Solutions Corporation does not guarantee the quality and reliability of product.
Therefore, don't use this for applications other than consumer use camcorder.
In addition, individual specification change cannot be supported because this is a standard product.
Consult your Sony Semiconductor Solutions Corporation sales representative if you have any questions.

Features

◆ Back-illuminated and stacked CMOS image sensor Exmor RS

◆ Digital Overlap High Dynamic Range (DOL-HDR) mode with raw data output.
◆ High signal to noise ratio (SNR).
◆ Full resolution @60 frame/s (Normal), 4K2K @60 frame/s (Normal), 1080p @240 frame/s
Full resolution @40 frame/s (12 bit Normal), Full resolution @30 frame/s (DOL-HDR, 2 frame)
◆ Output video format of RAW12/10/8, COMP8.
◆ Power Save Mode
◆ Pixel binning readout and V sub-sampling function.
◆ Independent flipping and mirroring.
◆ Input clock frequency 6 to 27 MHz
◆ CSI-2 serial data output (MIPI 2lane/4lane, Max. 2.1 Gbps/lane, D-PHY spec. ver. 1.2 compliant)
◆ 2-wire serial communication.
◆ Two PLLs for independent clock generation for pixel control and data output interface.
◆ Ambient Light Sensor (ALS)
◆ Fast mode transition. (on the fly)
◆ Dual sensor synchronization operation (Multi camera compatible)
◆ 7 K bit of OTP ROM for users.
◆ Built-in temperature sensor
◆ 10-bit/12-bit A/D conversion on chip
◆ 92-pin high-precision ceramic package

Sony Semiconductor Solutions Corporation reserves the right to change products and specifications without prior notice.
This information does not convey any license by any implication or otherwise under any patents or other right.
Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony Semiconductor Solutions
Corporation cannot assume responsibility for any problems arising out of the use of these circuits.

1 E17203
 IMX477-AACK-C

Device Structure

◆ CMOS image sensor

◆ Image size : Diagonal 7.857 mm (Type 1/2.3)
◆ Total number of pixels : 4072 (H) × 3176 (V) approx. 12.93 M pixels
◆ Number of effective pixels : 4072 (H) × 3064 (V) approx. 12.47 M pixels
◆ Number of active pixels : 4056 (H) × 3040 (V) approx. 12.33 M pixels
◆ Chip size : 7.564 mm (H) × 5.476 mm (V)
◆ Unit cell size : 1.55 µm (H) × 1.55 µm (V)
◆ Substrate material : Silicon

Optical Black Array and Readout Scan Direction

(Top View)

M1 A1
Optical
Black
Array
V

M10 A10
H
Object Lens This sensor (Top view)

Note) Arrows in the figure indicate scanning direction during default readout in the vertical direction and the
horizontal direction.

Figure 1 Optical Black Array and Readout Scan Direction

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 IMX477-AACK-C

Absolute Maximum Ratings

Item Symbol Ratings Unit notes

Supply voltage (analog) VANA -0.3 to +3.3 V
Supply voltage (digital) VDIG -0.3 to +1.8 V
refer to
Supply voltage (interface) VIF -0.3 to +3.3 V
VSS level
Input voltage (digital) VI -0.3 to +3.3 V
Output voltage (digital) VO -0.3 to +3.3 V
Guaranteed operating temperature TOPR -20 to +75 ˚C
Guaranteed storage temperature TSTG -30 to +80 ˚C
Guaranteed performance temperature TSPEC -20 to +60 ˚C

Recommended Operating Voltage

Item Symbol Ratings Unit notes

*1
Supply voltage (analog) VANA 2.8 ± 0.1 V
*2 refer to
Supply voltage (digital) VDIG 1.05 ± 0.1 V
VSS level
*3
Supply voltage (interface) VIF 1.8 ± 0.1 V

*1
VANA: VDDSUB, VDDHAN, VDDHCM1 to 2, VDDHSN1 to 4 (2.8 V power supply)
*2
VDIG: VDDLSC1 to 4, VDDLCN1 to 2, VDDLPL1 to 2, VDDLIF (1.05 V power supply)
*3
VIF: VDDMIO1 to 2, VDDMIF (1.8 V power supply)

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 IMX477-AACK-C

USE RESTRICTION NOTICE

This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the
image sensor products ("Products") set forth in this specifications book. Sony Semiconductor Solutions
Corporation ("SSS") may, at any time, modify this Notice which will be available to you in the latest
specifications book for the Products. You should abide by the latest version of this Notice. If a SSS
subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will
additionally apply between you and the subsidiary or distributor. You should consult a sales representative of
the subsidiary or distributor of SSS on such a use restriction notice when you consider using the Products.

Use Restrictions
 The Products are intended for incorporation into such general electronic equipment as office products,
communication products, measurement products, and home electronics products in accordance with
the terms and conditions set forth in this specifications book and otherwise notified by SSS from time
to time.
 You should not use the Products for critical applications which may pose a life- or injury-threatening
risk or are highly likely to cause significant property damage in the event of failure of the Products. You
should consult your sales representative beforehand when you consider using the Products for such
critical applications. In addition, you should not use the Products in weapon or military equipment.
 SSS disclaims and does not assume any liability and damages arising out of misuse, improper use,
modification, use of the Products for the above-mentioned critical applications, weapon and military
equipment, or any deviation from the requirements set forth in this specifications book.

Design for Safety

 SSS is making continuous efforts to further improve the quality and reliability of the Products; however,
failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care
to ensure the safe design of your products such as component redundancy, anti-conflagration features,
and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or
other social damage as a result of such failure.

Export Control
 If the Products are controlled items under the export control laws or regulations of various countries,
approval may be required for the export of the Products under the said laws or regulations.
You should be responsible for compliance with the said laws or regulations.

No License Implied
 The technical information shown in this specifications book is for your reference purposes only. The
availability of this specifications book shall not be construed as giving any indication that SSS and its
licensors will license any intellectual property rights in such information by any implication or otherwise.
SSS will not assume responsibility for any problems in connection with your use of such information or
for any infringement of third-party rights due to the same. It is therefore your sole legal and financial
responsibility to resolve any such problems and infringement.

Governing Law
 This Notice shall be governed by and construed in accordance with the laws of Japan, without reference
to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating
to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the
court of first instance.

Other Applicable Terms and Conditions

 The terms and conditions in the SSS additional specifications, which will be made available to you when
you order the Products, shall also be applicable to your use of the Products as well as to this
specifications book. You should review those terms and conditions when you consider purchasing
and/or using the Products.

General-0.0.9

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Contents

Description ............................................................................................................................................................................. 1
Features ................................................................................................................................................................................. 1
Device Structure ..................................................................................................................................................................... 2
Optical Black Array and Readout Scan Direction ................................................................................................................... 2
Absolute Maximum Ratings .................................................................................................................................................... 3
Recommended Operating Voltage ......................................................................................................................................... 3
USE RESTRICTION NOTICE ................................................................................................................................................ 4
1. Optical Center ............................................................................................................................................................ 8
2. Pin Configuration ....................................................................................................................................................... 8
3. Pin Description........................................................................................................................................................... 9
4. Input / Output Equivalent Circuit .............................................................................................................................. 12
5. Peripheral Circuit Diagram ....................................................................................................................................... 13
5-1 Standard peripheral circuit diagram ..................................................................................................................... 13
5-2 Connecting for OIS compatible system................................................................................................................ 14
6. Functional Description ............................................................................................................................................. 15
6-1 System Outline .................................................................................................................................................... 15
6-2 Control register setting by the serial communication ........................................................................................... 16
6-2-1 2-wire Serial Communication Operation Specifications ................................................................................... 16
6-2-2 Communication Protocol ................................................................................................................................. 17
6-3 Clock generation and PLL ................................................................................................................................... 18
6-3-1 Clock System Diagram .................................................................................................................................... 18
6-4 Description of operation clocks ............................................................................................................................ 19
6-4-1 INCK ................................................................................................................................................................ 19
6-4-2 IVTCK, IOPCK (PLL output) ............................................................................................................................ 19
6-4-3 IVTPXCK Clock ............................................................................................................................................... 19
6-4-4 IOPPXCK Clock .............................................................................................................................................. 19
6-5 Image Readout Operation ................................................................................................................................... 20
6-5-1 Physical alignment of imaging pixel array........................................................................................................ 20
6-5-2 Color coding and order of reading image date ................................................................................................ 21
6-6 Output Image Format........................................................................................................................................... 21
6-6-1 Embedded Data Line control ........................................................................................................................... 22
6-6-2 Image size of mode ......................................................................................................................................... 22
6-6-3 Description about operation mode ................................................................................................................... 23
6-6-4 Image area control capabilities ........................................................................................................................ 24
6-6-5 Readout Scan Direction................................................................................................................................... 25
6-7 Gain setting ......................................................................................................................................................... 26
6-8 Image compensation function .............................................................................................................................. 26
6-8-1 Defect Pixel Correction .................................................................................................................................... 26

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 IMX477-AACK-C

6-9 Miscellaneous functions....................................................................................................................................... 27

6-9-1 Thermal Meter ................................................................................................................................................. 27
6-9-2 Test pattern output and type of test pattern ..................................................................................................... 27
6-9-3 Long Exposure Setting .................................................................................................................................... 27
6-9-4 OTP (One Time Programmable Read Only Memory) ...................................................................................... 27
6-9-5 Dual sensor synchronization operation (Multi camera compatible) ................................................................. 27
6-9-6 Flash light control sequence ............................................................................................................................ 27
6-9-7 Monitor terminal settings ................................................................................................................................. 27
6-9-8 Pulse for OIS driver ......................................................................................................................................... 27
6-9-9 Power Save Mode ........................................................................................................................................... 27
6-9-10 Digital Overlap High Dynamic Range (DOL-HDR) .......................................................................................... 28
6-9-11 Ambient Light Sensor (ALS) ............................................................................................................................ 28
6-10 Image signal interface.......................................................................................................................................... 28
6-10-1 MIPI transmitter ............................................................................................................................................... 28
7. How to operate ........................................................................................................................................................ 29
7-1 Power on Reset ................................................................................................................................................... 29
7-2 Power on sequence ............................................................................................................................................. 29
7-2-1 Power on slew rate .......................................................................................................................................... 29
7-2-2 Startup sequence with 2-wire serial communication (external reset)............................................................... 30
7-3 Power down sequence ........................................................................................................................................ 32
7-3-1 Power down sequence with 2-wire serial communication (external reset)....................................................... 32
7-4 Register Map ....................................................................................................................................................... 32
8. Electrical Characteristics.......................................................................................................................................... 33
8-1 DC characteristics ............................................................................................................................................... 33
8-2 AC Characteristics ............................................................................................................................................... 34
8-2-1 Master Clock Waveform Diagram .................................................................................................................... 34
8-2-2 PLL block characteristics ................................................................................................................................. 34
8-2-3 Definition of settling time of PLL block ............................................................................................................. 36
8-2-4 2-wire serial communication block characteristics ........................................................................................... 36
8-2-5 Gyro Control Interface ..................................................................................................................................... 38
8-2-6 Current consumption and standby current....................................................................................................... 39
9. Spectral Sensitivity Characteristic............................................................................................................................ 40
10. Image Sensor Characteristics .................................................................................................................................. 41
10-1 Image Sensor Characteristics.............................................................................................................................. 41
10-2 Zone Definition used for specifying image sensor characteristics ....................................................................... 41
11. Measurement Method for Image Sensor Characteristics ......................................................................................... 42
11-1 Measurement conditions...................................................................................................................................... 42
11-2 Color Coding of this Image Sensor and Readout ................................................................................................ 42
11-3 Definition of Standard Imaging Conditions........................................................................................................... 42
11-3-1 Standard imaging condition I ........................................................................................................................... 42

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 IMX477-AACK-C

11-3-2 Standard imaging condition II.......................................................................................................................... 42

11-3-3 Standard imaging condition III ........................................................................................................................ 42
11-4 Measurement Method .......................................................................................................................................... 43
11-4-1 Sensitivity ........................................................................................................................................................ 43
11-4-2 Sensitivity ratio ................................................................................................................................................ 43
11-4-3 Saturation signal .............................................................................................................................................. 43
11-4-4 Video signal shading ....................................................................................................................................... 43
11-4-5 Dark signal ...................................................................................................................................................... 43
12. Spot Pixel Specification ........................................................................................................................................... 44
12-1 Zone Definition for spot pixel specification........................................................................................................... 44
12-2 Notice on White Pixels Specifications .................................................................................................................. 45
12-3 Measurement Method for Spot Pixels .................................................................................................................. 46
12-4 Spot Pixel Pattern Specifications ......................................................................................................................... 46
12-4-1 Black or white pixels at high light ..................................................................................................................... 46
12-4-2 White pixels in the dark ................................................................................................................................... 46
13. CRA Characteristics of Recommended Lens ........................................................................................................... 47
14. Marking .................................................................................................................................................................... 48
15. Notes on Handling ................................................................................................................................................... 49
16. Package Outline ...................................................................................................................................................... 51
17. List of Trademark Logos and Definition Statements ................................................................................................ 52

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 IMX477-AACK-C

1. Optical Center

(Top View)
Package outline
10.70 ± 0.1 mm

5.374 ± 0.075 mm
PKG A1 pin

M1 A1

4.172 ± 0.075 mm
Vertical readout direction

8.50 ± 0.1 mm
Optical
center
(Default)

4056 pixel

Active image area

Horizontal readout direction

(Default)
M10 A10

Note) The optical center is the center of the active image area 4056 (H) × 3040 (V) pixel.
Please refer to “Figure 12 Physical alignment of the imaging pixel array (Top View) ” for active image area.

Figure 2 Optical Center

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 IMX477-AACK-C

3. Pin Description

Table 1 Pin Description

Pin
Symbol I/O A/D Pin description Remarks
No.
Digital I/O Used as a vertical synchronizing
A2 XVS I/O D
(Vertical sync signal) signal of dual sensor application
Digital GND
(When using OIS combined system,
A3 GYINT I D Digital input
this pin has the function of the Gyro
interrupt)
NC
(When using OIS combined system,
A4 SCK O D Digital output
this pin has the function of the Gyro
control clock)
Digital GND
(When using OIS combined system,
A5 SDI I/O D Digital I/O
this pin has the function of the Gyro
data input)
A6 VDDLCN1 Power D VDIG power supply
A7 SDA I/O D Digital I/O I2C communication data input/output
A8 SLASEL I D Digital input I2C slave address select (Pull-down)
A9 GPO O D Digital output
B1 VDDLSC1 Power D VDIG power supply
B2 VSSLSC1 GND D VDIG GND
Digital GND
(When using OIS combined system,
B3 TEST3/SDIC I D Digital input
this pin has the function of the SPI
Communication for OIS control)
NC
(When using OIS combined system,
B4 SCSB O D Digital output
this pin has the function of the Gyro
chip select)
NC
(When using OIS combined system,
B5 SDO O D Digital output
this pin has the function of the Gyro
data output)
B6 VSSLCN1 GND D VDIG GND
B7 SCL I/O D Digital I/O I2C communication clock input
B8 TENABLE I D Digital input NC (Pull-down)
B9 VSSLSC2 GND D VDIG GND
B10 VDDLSC2 Power D VDIG power supply
C1 VDDMIO1 Power D VIF power supply
C2 VSSLSC3 GND D VDIG GND
C3 VDDHSN1 Power A VANA power supply
C4 VSSHSN1 GND A VANA GND
Capacitor connection
C5 VRLRD Minus A Analog input (see Figure 5. Peripheral Circuit
Diagram)
Capacitor connection
C6 VRL Minus A Analog input (see Figure 5. Peripheral Circuit
Diagram)
C7 VSSHSN2 GND A VANA GND
Capacitor connection
C8 VPI Power A Analog input (see Figure 5. Peripheral Circuit
Diagram)

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 IMX477-AACK-C

Pin
Symbol I/O A/D Pin description Remarks
No.
Digital GND
(When using OIS combined system,
D1 TEST1/CSBC I D Digital input
this pin has the function of the SPI
Communication for OIS control)

Digital GND
(When using OIS combined system,
D2 TEST2/SCKC I D Digital input
this pin has the function of the SPI
Communication for OIS control)
D3 VDDHAN Power A VANA power supply
D8 VDDHSN2 Power A VANA power supply
E1 FSTROBE O D Digital output Flash strobe
E3 VSSHAN GND A VANA GND
E8 VDDHCM1 Power A VANA power supply
F3 TVMON O A Analog output NC
F8 VDDLPL1 Power D VDIG power supply
G3 TVCDSIN I A Analog input NC
G8 VSSLPL1 GND D VDIG GND
G9 VSSLCN2 GND D VDIG GND
G10 VDDLCN2 Power D VDIG power supply
H1 VDDLSC3 Power D VDIG power supply
H2 VSSLSC4 GND D VDIG GND
H8 VDDLPL2 Power D VDIG power supply
H9 SWDIO I/O D Digital I/O NC (Pull-up)
H10 SWTCK I D Digital input NC (Pull-down)
J1 VDDLIF Power D VDIG power supply
J2 VSSLSC5 GND D VDIG GND
J8 VSSLPL2 GND D VDIG GND
J9 XCLR I D Digital input Chip clear (Pull-down)
J10 VDDMIO2 Power D VIF power supply
K1 VDDMIF Power D VIF power supply
K2 VSSLSC6 GND D VDIG GND
K3 VDDHSN3 Power A VANA power supply
K4 VSSHSN3 GND A VANA GND
K5 VDDSUB Power A VANA power supply
K6 VDDHSN4 Power A VANA power supply
K7 VSSHSN4 GND A VANA GND
K8 VDDHCM2 Power A VANA power supply
K9 VSSLSC7 GND D VDIG GND
K10 INCK I D Digital input
L1 VSSLSC8 GND D VDIG GND
L2 DMO3P O D Digital output MIPI output (DATA+)
L3 DMO1P O D Digital output MIPI output (DATA+)
L4 VSSLSC9 GND D VDIG GND
L5 DCKP O D Digital output MIPI output (CLK+)
L6 VSSLSC10 GND D VDIG GND
L7 DMO2P O D Digital output MIPI output (DATA+)
L8 DMO4P O D Digital output MIPI output (DATA+)
L9 VSSLSC11 GND D VDIG GND

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 IMX477-AACK-C

Pin
Symbol I/O A/D Pin description Remarks
No.
L10 VDDLSC4 Power D VDIG power supply
M2 DMO3N O D Digital output MIPI output (DATA–)
M3 DMO1N O D Digital output MIPI output (DATA–)
M4 VSSLSC12 GND D VDIG GND
M5 DCKN O D Digital output MIPI output (CLK–)
M6 VSSLSC13 GND D VDIG GND
M7 DMO2N O D Digital output MIPI output (DATA–)
M8 DMO4N O D Digital output MIPI output (DATA–)

M9 VSSLSC14 GND D VDIG GND

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 IMX477-AACK-C

4. Input / Output Equivalent Circuit

Symbol Equivalent Circuit Symbol Equivalent Circuit

Digital VIF
Input Schmitt Buffer
Digital VIF
XCLR, Input
INCK SLASEL

DGND DGND

Schmitt Buffer VIF Schmitt Buffer

Digital I/O Digital I/O VIF

SCL,
XVS
SDA

DGND DGND

VIF VIF

GPO,
Digital Digital
FSTROBE, VIF Schmitt Buffer
Output Input
SDO, GYINT
SCK,
SCSB

DGND DGND

VIF Schmitt Buffer

Digital I/O VIF

SDI

DGND

VIF: 1.8 V power supply

DGND: VDIG GND
VDDLSC1, VDDLSC2, VDDLSC3 and VDDLSC4 are internally connected.
VSSLSC1 to 14 are internally connected.
VDDMIO1 and VDDMIO2 are internally connected.
VDDHCM1 and VDDHCM2 are internally connected.
VDDHSN1, VDDHSN2, VDDHSN3 and VDDHSN4 are internally connected.
VSSHSN1, VSSHSN2, VSSHSN3 and VSSHSN4 are internally connected.

Figure 4 Input / Output Equivalent Circuit

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 IMX477-AACK-C

5. Peripheral Circuit Diagram

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 IMX477-AACK-C

5-2 Connecting for OIS compatible system

IMX477-AACK-C can connect with OIS controller using SPI bypass function. When the bypass mode set to enable,
OIS controller can get the gyro data through IMX477-AACK-C. Each terminal also requires 1.8 V I/O voltage level
when connect with OIS controller and gyro LSI. See software reference manual for details.

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 IMX477-AACK-C

6. Functional Description

6-1 System Outline

IMX477-AACK-C is a CMOS active pixel type image sensor which adopts the Exmor RS technology to achieve high
sensitivity, low noise, and high speed image capturing. It is embedded with backside illuminated imaging pixel, low
noise analog amplifier, column parallel A/D converters which enables high speed capturing, digital amplifier, image
binning circuit, timing control circuit for imaging size and frame rate, CSI2 image data high speed serial interface, PLL
oscillator, and serial communication interface to control these functions. When Gyro function is enabled, Gyro control
block in IMX477-AACK-C is processed based on the input data from Gyro IC.
Several additional image processing functions and peripheral circuits are also included for easy system optimization
by the users.
A onetime programmable memory is embedded in the chip for storing the user data. It has 7 K-bit for users,
16 K-bit as a whole.

Flash
FSTROBE
Strobe
Timing generator XVS
Row decoder

Imaging GPO
Pixel
array Test
OB Reference
Pattern
clamp Voltage
generator
Image
Process
Image
block CSI2
Analog AD Digital data
Column analog block serial
gain converter gain trans-
output
mitter
Column logic block

Gyro Serial
Bias PLL Control/status Micro
control OTP communication
registers processor
block block

SCK SDO SCL SDA

SDI SCSB

Figure 6 Overview of functional block diagram

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 IMX477-AACK-C

6-2 Control register setting by the serial communication

The IMX477-AACK-C can use the 2-wire serial communication method for sensor control. These specifications are
described for sensor control using the 2-wire serial communication as follows. See Software reference manual for
more details of each function beyond the following description.

SCL

Master IMX477
SDA

Figure 7 2-wire serial communication

6-2-1 2-wire Serial Communication Operation Specifications

2
The 2-wire serial communication method conforms to the Camera Control Instance (CCI). CCI is an I C fast-mode
2
compatible interface, and the data transfer protocol is I C standard.
This 2-wire serial communication circuit can be used to access the control-registers and status-registers of
IMX477-AACK-C.

Table 2 Description of 2-wire Serial Communication Pins

Pin name Description

SDA Serial data input/output pin

SCL Serial clock input pin

The control registers and status registers of IMX477-AACK-C are mapped on the 16-bit address space and the
register categories shown as below. Detail register information is shown in Register Map.

Table 3 Specification of register address map for 2-wire serial communication

Address range Description

Configuration register
0000h to 0FFFh
Read Only and Read/Write Dynamic register
I2C register

1000h to 1FFFh Reserved

2000h to 2FFFh Reserved

3000h to FFFFh Manufacture specific register

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 IMX477-AACK-C

6-2-2 Communication Protocol

2-wire serial communication supports a 16-bit register address and 8-bit data message type.

Slave Address Register Address Register Address DATA

R/W

A/A
S A A A P
[7:1] [15:8] [7:0] [7:0]

From Master to Slave S = Start Condition A = Acknowledge

(Sr : Repeated Start Condition) A = Negative Acknowledge
Direction depend on operation
P = Stop Condition
From Slave to Master

Figure 8 2-wire serial communication protocol

IMX477-AACK-C has a default slave address shown as below.

The slave address is selectable by pin connection of SLASEL pin (A8 pin).
When called by the selected slave address, serial communication interface is activated.
Duplication of the address on the same bus must be prevented.
*For other slave address options, refer to Software reference manual.

Slave Address (Read or Write) SLASEL pin

* See Table 4 for R/W bit (A8 pin)
R/W

Slave Address MSB LSB L or NC

[7:1] 0 0 1 1 0 1 0 R/W

MSB LSB H
0 0 1 0 0 0 0 R/W
R/W shows the direction of communication.

Figure 9 Slave address

Table 4 R/W bit

R/W bit Direction of communication

0 Write (Master → Sensor)

1 Read (Sensor → Master)

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 IMX477-AACK-C

6-3 Clock generation and PLL

IMX477-AACK-C equips embedded PLL to generate the necessary internal clocks and CSI2 transmission clocks. Set
the related registers according to the operation condition. See Software reference manual for more details of each
function.

6-3-1 Clock System Diagram

IMX477-AACK-C is equipped with two PLL, One outputs IVTCK for image processing, the other is IOPCK for MIPI
output.
Based on the clock that is input in the range of 6 to 27 MHz, output of 1800 to 2100 MHz can be of the PLL for
IVTCK, PLL of IOPCK for is capable of outputting 1200 to 2100 MHz.
It is possible to divide the range of 1/1 to 1/4 of the PLL IVTCK, and to multiply in the range of 150 to 350.
It is possible to divide the range of 1/1 to 1/4 of the PLL IOPCK, and to multiply in the range of 100 to 350.

Typically, IMX477-AACK-C can be driven from the dual PLL mode to operate the both of PLLs, but it also supports
single PLL mode to move only one side of the PLL.

In PLL single mode, IOP_PREPLLCK_DIV and IOP_PLL _MPY are ignored.

Block diagram Data Flow

DMO[1/2/3/4][P/N]
MIPI
Charge
ADC PipeLine FIFO DPHY
Pump DCK[P/N]
serializer
ADCK(auto setting)

IVTPXCK

IOPPXCK
IVTPXCK
CPCK

IOPCK
DIVIDER ADCK

Div_CP CPCK
Clock tree [div：2]
Div_AD

PLL_MULT_DRIV Div_IVT_
cont HCLK
PLL
[div：2]
INCK PreDiv_IVT MPY_IVT IVTCK
IVT_PREPLLCK_DIV IVT_PLL_MPY 1
EXCK_FREQ Div_IVT_px IVTPXCK
SEL
IVT_SYCK_DIV × IVT_PXCK_DIV
0

PreDiv_IOP MPY_IOP IOPCK Div_IOP_px IOPPXCK

IVT_PREPLLCK_DIV IVT_PLL_MPY IOP_SYCK_DIV × IOP_PXCK_DIV

Figure 10 Clock System Diagram (PLL single mode)

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 IMX477-AACK-C

Block diagram Data Flow

DMO[1/2/3/4][P/N]
MIPI
Charge
ADC PipeLine FIFO DPHY
Pump DCK[P/N]
serializer

ADCK(auto setting)

IOPPXCK
IVTPXCK

IVTPXCK
CPCK

IOPCK
DIVIDER ADCK

Div_CP CPCK
Clock tree [div：2]
Div_AD

PLL_MULT_DRIV Div_IVT_
cont HCLK
PLL
[div：2]
INCK PreDiv_IVT MPY_IVT IVTCK
EXCK_FREQ IVT_PREPLLCK_DIV IVT_PLL_MPY 1
Div_IVT_px IVTPXCK
SEL
IVT_SYCK_DIV × IVT_PXCK_DIV
0

PreDiv_IOP MPY_IOP IOPCK Div_IOP_px IOPPXCK

IOP_PREPLLCK_DIV IOP_PLL_MPY IOP_SYCK_DIV × IOP_PXCK_DIV

Figure 11 Clock System Diagram (PLL dual mode)

6-4 Description of operation clocks

The following are general descriptions for each clock. See “Clock generation and PLL” of Software reference manual
for more detail.

6-4-1 INCK
INCK is an external input clock (6 to 27 MHz). See “AC characteristics” for electrical requirements to INCK.

6-4-2 IVTCK, IOPCK (PLL output)

These clocks are the root of all the operation clocks in IMX477-AACK-C and it designates the data rate.
DCKP/DCKN; CSI2 interface clock is generated from IOPCK by dividing into 1/2, 1/4 or 1/8 frequency since the
interface is operated in double data rate format.

6-4-3 IVTPXCK Clock

The clock for internal image processing is used as the base of integration time, frame rate, and etc.

6-4-4 IOPPXCK Clock

The clock for internal image processing is designating the pixel rate and etc.

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 IMX477-AACK-C

6-5 Image Readout Operation

By setting the parameters of PLL, image size, start/end position of the imaging area, direction of reading image,
binning, shutter mode, integration time, gain, and output format via 2-wire serial communication, IMX477-AACK-C
outputs the image data.

See Software reference manual for more details of each function.

6-5-1 Physical alignment of imaging pixel array

The figure below shows the physical alignment of the imaging pixel array with A1 pin located at the upper right
corner.

64 OPB dummy
16 OPB effective
32 OPB dummy
8 Opened dummy

32 OB Side Ignored Area

Total image area : 4072 (H) × 3176 (V) approx. 12.93 M pixels
Effective image area : 4072 (H) × 3064 (V) approx. 12.47 M pixels
Active image area : 4056 (H) × 3040 (V) approx. 12.33 M pixels
8 Opened dummy

8 Opened dummy
Vertical Readout Direction (default)

3176

3064

3040

4056

4072

16 Opened dummy

Horizontal Readout Direction (default)

Figure 12 Physical alignment of the imaging pixel array (Top View)

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 IMX477-AACK-C

6-5-2 Color coding and order of reading image date

The original color filter arrangement of the sensor is shown in the figure below. Gr and Gb are the G signals shown
at the same line as R signals and B signals, respectively. The line with R & Gr signals and the line with Gb & B
signals are output one after the other alternatively.

Gb B Gb B Gb B

R Gr R Gr R Gr

Gb B Gb B Gb B

R Gr R Gr R Gr

Gb B Gb B Gb B

R Gr R Gr R Gr

Default readout direction

Figure 13 Color coding alignment

6-6 Output Image Format

This is the output image diagram of full pixel output mode, Image data is output from the upper left corner of the
diagram.

FS
Embedded data lines
2

R G R G
G B G B

PF FRM_LENGTH_LINES
Long Packet
3040

PH Active image area

Line
Blanking

4056

R G R G

G B G B

Gyro data(Size is determined automatically by the system.) FE

1

Frame
Blanking

Figure 14 Full pixel output mode data structure

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 IMX477-AACK-C

6-6-1 Embedded Data Line control

It is possible to output certain 2-wire serial register contents on the 2 lines just after the FS sync code of the frame.
The corresponding registers are indicated by “EDL” column of the Register Map.
An unfixed value is output when not outputting embedded data.

See Software reference manual for contents and output sequence of Embedded Data Lines.

6-6-2 Image size of mode

IMX477-AACK-C can capture and output full size, cropped/scaled image in combination with the normal mode.
Examples are shown in the table below. Definitions of each parameter are shown in the below figure.

FS
Embedded data lines
R G R G
G B G B

Vertical pixel number of active image area

8
Vertical line number of imaging area

Long Packet
Active image area
PH PF Line
Blanking

Horizontal pixel number of active image area

R G R G

G B G B

Gyro data FE

Frame
Blanking

Figure 15 Image size parameter definition

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 IMX477-AACK-C

Table 5 Typical image output of main capture mode

Modes
Normal Operation Normal Operation DOL-HDR
Full resolution 2 Binning (V:1/2, H:1/2) Full resolution
10 bit / 12 bit 10 bit 10 bit / 12 bit
Number of vertical lines in
3044 1524
imaging area
*1
Number of horizontal pixels in
4056 2028
active area
Number of lines and Start Number Start Number Start Number
start position position of lines position of lines position of lines

Frame start 1 1 1 1
Name of the areas

Embedded data lines 2 2 2 2

Number of vertical pixels

3 3040 3 1520 *1
in active area

Gyro Data 3044 1 1524 1

Frame end 3044 1 1524 1

*1
See DOL-HDR manual for details.

6-6-3 Description about operation mode

IMX477-AACK-C has 4 modes that Full resolution (10 bit), Full resolution (12 bit), Full resolution (DOL-HDR)
and 2 Binning (V:1/2, H:1/2).

See “Description of mode operation” of Software reference manual for details.

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 IMX477-AACK-C

6-6-4 Image area control capabilities

As control function for image's viewing area and /or image size, IMX477-AACK-C has capability of analog crop,
digital crop, scaling and output crop. The relation of image output size and the resister is shown below.
analog crop

(X_ADD_MIN, Y_ADD_MIN)

(X_ADD_STA, Y_ADD_STA)

(X_ADD_END, Y_ADD_END)

(X_ADD_MAX, Y_ADD_MAX))

Binning/
sub-sampling

digital crop
DIG_CROP_Y_OFFSET

DIG_CROP_IMAGE_WIDTH

DIG_CROP_IMAGE_HEIGHT

DIG_CROP_X_OFFSET

scaling

SCALE_MODE
SCALE_M

output crop
X_OUT_SIZE

Y_OUT_SIZE

final image

Figure 16 Image area control capabilities

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 IMX477-AACK-C

9. Spectral Sensitivity Characteristic

(Includes neither lens characteristics nor light source characteristics.)

1.0

0.9 G
0.8
B R
0.7
Relative Response [a.u.]

0.6

0.5

0.4

0.3

0.2

0.1

0.0
400 450 500 550 600 650 700
WaveLength[nm]

Figure 26 Spectral sensitivity characteristics

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