Sony Imx415 Datasheet
Sony Imx415 Datasheet
Sony Imx415 Datasheet
IMX415-AAQR-C
Description
The IMX415-AAQR-C is a diagonal 6.4 mm (Type 1/2.8) CMOS active pixel type solid-state image sensor with a
square pixel array and 8.46 M effective pixels. This chip operates with analog 2.9 V, digital 1.1 V, and interface 1.8 V
triple power supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved
through the adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variable
charge-integration time.
(Applications: Surveillance cameras, FA cameras, Industrial cameras)
Features
Sony Semiconductor Solutions Corporation reserves the right to change products and specifications without prior notice.
This information does not convey any license by any implication or otherwise under any patents or other right.
Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony Semiconductor Solutions
Corporation cannot assume responsibility for any problems arising out of the use of these circuits.
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Copyright 2018 Sony Semiconductor Solutions Corporation E19504
IMX415-AAQR-C
Device Structure
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IMX415-AAQR-C
Application Conditions
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IMX415-AAQR-C
This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the
image sensor products ("Products") set forth in this specifications book. Sony Semiconductor Solutions
Corporation ("SSS") may, at any time, modify this Notice which will be available to you in the latest
specifications book for the Products. You should abide by the latest version of this Notice. If a SSS
subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will
additionally apply between you and the subsidiary or distributor. You should consult a sales representative of
the subsidiary or distributor of SSS on such a use restriction notice when you consider using the Products.
Use Restrictions
The Products are intended for incorporation into such general electronic equipment as office products,
communication products, measurement products, and home electronics products in accordance with
the terms and conditions set forth in this specifications book and otherwise notified by SSS from time
to time.
You should not use the Products for critical applications which may pose a life- or injury-threatening
risk or are highly likely to cause significant property damage in the event of failure of the Products. You
should consult your sales representative beforehand when you consider using the Products for such
critical applications. In addition, you should not use the Products in weapon or military equipment.
SSS disclaims and does not assume any liability and damages arising out of misuse, improper use,
modification, use of the Products for the above-mentioned critical applications, weapon and military
equipment, or any deviation from the requirements set forth in this specifications book.
Export Control
If the Products are controlled items under the export control laws or regulations of various countries,
approval may be required for the export of the Products under the said laws or regulations.
You should be responsible for compliance with the said laws or regulations.
No License Implied
The technical information shown in this specifications book is for your reference purposes only. The
availability of this specifications book shall not be construed as giving any indication that SSS and its
licensors will license any intellectual property rights in such information by any implication or otherwise.
SSS will not assume responsibility for any problems in connection with your use of such information or
for any infringement of third-party rights due to the same. It is therefore your sole legal and financial
responsibility to resolve any such problems and infringement.
Governing Law
This Notice shall be governed by and construed in accordance with the laws of Japan, without reference
to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating
to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the
court of first instance.
General-0.0.9
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IMX415-AAQR-C
Contents
Description ............................................................................................................................................................................. 1
Features ................................................................................................................................................................................. 1
Device Structure ..................................................................................................................................................................... 2
Absolute Maximum Ratings .................................................................................................................................................... 3
Application Conditions ............................................................................................................................................................ 3
USE RESTRICTION NOTICE ................................................................................................................................................ 4
Optical Center ........................................................................................................................................................................ 7
Pixel Arrangement .................................................................................................................................................................. 8
Block Diagram and Pin Configuration..................................................................................................................................... 9
Pin Description ......................................................................................................................................................................11
Electrical Characteristics ...................................................................................................................................................... 14
DC Characteristics ............................................................................................................................................................ 14
Current Consumption........................................................................................................................................................ 15
AC Characteristics ............................................................................................................................................................ 16
Master Clock Waveform (INCK) .................................................................................................................................... 16
System Clear (XCLR) .................................................................................................................................................... 17
XVS / XHS Input Characteristics in Slave Mode (Register XMASTER = 1) .................................................................. 18
XVS / XHS Input Characteristics in Master Mode (Register XMASTER = 0) ................................................................ 18
Serial Communication ................................................................................................................................................... 19
I/O Equivalent Circuit Diagram ............................................................................................................................................. 21
Spectral Sensitivity Characteristics ...................................................................................................................................... 22
Image Sensor Characteristics .............................................................................................................................................. 23
Image Sensor Characteristics Measurement Method........................................................................................................... 24
Measurement Conditions .................................................................................................................................................. 24
Color Coding of Physical Pixel Array ................................................................................................................................ 24
Definition of standard imaging conditions ......................................................................................................................... 24
Measurement Method ....................................................................................................................................................... 25
Setting Registers Using Serial Communication .................................................................................................................... 26
Description of Setting Registers (I2C) ............................................................................................................................... 26
Register Communication Timing (I2C) ............................................................................................................................... 27
Communication Protocol ................................................................................................................................................... 28
Register Write and Read (I2C) .......................................................................................................................................... 29
Single Read from Random Location ............................................................................................................................. 29
Single Read from Current Location ............................................................................................................................... 29
Sequential Read Starting from Random Location ......................................................................................................... 30
Sequential Read Starting from Current Location ........................................................................................................... 30
Single Write to Random Location .................................................................................................................................. 31
Sequential Write Starting from Random Location ......................................................................................................... 31
Register Map ........................................................................................................................................................................ 32
Readout Drive mode ............................................................................................................................................................ 48
Operating mode ................................................................................................................................................................ 48
Image Data Output Format (CSI-2 output)........................................................................................................................ 50
Frame Format ............................................................................................................................................................... 50
Frame Structure ............................................................................................................................................................ 50
Embedded Data Line .................................................................................................................................................... 51
Image Data Output Format ............................................................................................................................................... 53
All-pixel mode................................................................................................................................................................ 54
Horizontal/Vertical 2/2-line binning mode ...................................................................................................................... 57
Window Cropping Mode ................................................................................................................................................ 62
Description of Various Function ............................................................................................................................................ 64
Standby Mode................................................................................................................................................................... 64
Slave Mode and Master Mode .......................................................................................................................................... 65
Gain Adjustment Function ................................................................................................................................................. 67
Black Level Adjustment Function ...................................................................................................................................... 68
Normal Operation and Inverted Operation ........................................................................................................................ 69
Shutter and Integration Time Settings............................................................................................................................... 70
Example of Integration Time Setting ............................................................................................................................. 70
Normal Exposure Operation (Controlling the Integration Time in 1H Units) ...................................................................... 71
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IMX415-AAQR-C
Long Exposure Operation (Control by Expanding the Number of Lines per Frame) ......................................................... 72
Example of Integration Time Settings ............................................................................................................................... 73
Signal Output .................................................................................................................................................................... 74
CSI-2 output...................................................................................................................................................................... 74
MIPI Transmitter ............................................................................................................................................................... 76
Number of Internal A/D Conversion Bits Setting............................................................................................................ 77
Output Signal Range ..................................................................................................................................................... 77
INCK Setting ..................................................................................................................................................................... 78
Register Hold Setting ........................................................................................................................................................ 81
Mode Transitions .............................................................................................................................................................. 82
Other Function .................................................................................................................................................................. 83
Power-on and Power-off Sequence...................................................................................................................................... 84
Power-on sequence .......................................................................................................................................................... 84
Slew Rate Limitation of Power-on Sequence .................................................................................................................... 85
Power-off sequence .......................................................................................................................................................... 86
Sensor Setting Flow.......................................................................................................................................................... 87
Setting Flow in Sensor Slave Mode .............................................................................................................................. 87
Setting Flow in Sensor Master Mode ............................................................................................................................ 88
Peripheral Circuit .................................................................................................................................................................. 89
Spot Pixel Specifications ...................................................................................................................................................... 90
Zone Definition.................................................................................................................................................................. 90
Notice on White Pixels Specifications .................................................................................................................................. 91
Measurement Method for Spot Pixels .................................................................................................................................. 92
Spot Pixel Pattern Specification ........................................................................................................................................... 93
Marking ................................................................................................................................................................................ 94
Notes On Handling ............................................................................................................................................................... 95
Package Outline ................................................................................................................................................................... 97
List of Trademark Logos and Definition Statements ............................................................................................................. 98
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IMX415-AAQR-C
Optical Center
Top View
Package
12.0 ± 0.1 mm outline H
6.00 ± 0.075 mm direction
P1-Pin A1-Pin
4.65 ± 0.075 mm
Package
outline V
9.30 ± 0.10 mm
direction
P11-Pin A11-Pin
Sensor Sensor
scanning V scanning H
direction (normal) direction (normal)
Optical Center
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IMX415-AAQR-C
Pixel Arrangement
P1 pin A1 pin
1 Dummy
R G G R
G B 2 Effective pixel ignored area B G
R G G R
G B 9 Effective margin for color processing B G
Effective margin for color processing
2160
0 12 3840 13 0
Pixel Arrangement
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IMX415-AAQR-C
CDS/Column Circuit
Drive Circuit
Sensor
12/10 Bit digital Output
2/4 lane CSI-2 Output
Block Diagram
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IMX415-AAQR-C
Bottom View
A B C D E F G H J K L M N P
(GND) VDDLIF VSSLSC DMO3N DMO1N VSSLSC DCKN VSSLSC DMO2N DMO4N VSSLSC (GND)
1
NC VSSLSC VSSLSC DMO3P DMO1P VSSLSC DCKP VSSLSC DMO2P DMO4P VSSLSC NC
2
VDDLSC VSSLSC (GND) (GND) (GND) (GND) (GND) (GND) VSSLSC VDDLIF
3 NC NC NC NC NC NC
VDDMIO VSSLSC TVMON VSSHAN VDDHAN (GND) (GND) (GND) VSSLPL2 VDDLPL2
4 NC NC NC
VDDMIO VSSLSC (GND) VSSHPX VDDHAN VDDHAN VSSHPX (GND) VSSLPL1 VDDLPL1
5 NC NC
VDDLSC VSSLSC (GND) VSSHPX VDDHPX (GND) (GND) (GND) VSSLSC VDDLSC
6 NC NC NC NC
VDDLCN VSSLCN (GND) VSSHPX VDDHPX VDDHPX VSSHPX (GND) VSSLSC VDDMIO
7 NC NC
(GND) (GND) (GND) VSSHPX VDDHPX VDDHPX VSSHPX (GND) VSSLSC VDDLSC
8 NC NC NC NC
VRHT VSSHPX (GND) (GND) (GND) (GND) (GND) (GND) VSSLCN VDDLCN
9 NC NC NC NC NC NC
(GND) VSSHPX VSSHPX (GND) VSSLSC TENABLE SLAMODE0 SLAMODE1 SCL TOUT VSSLSC (GND)
10 NC
NC VRLRS VRLT (GND) VDDLSC VDDMIO XCLR SDA XVS XHS INCK NC
11 NC
Pin Configuration
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IMX415-AAQR-C
Pin Description
Analog
No. Pin No I/O Symbol Description
/ Digital
1 A1 ― ― N.C. GND connectable
2 A3 Power D VDDLSC 1.1 V power supply
3 A4 Power D VDDMIO 1.8 V power supply
4 A5 Power D VDDMIO 1.8 V power supply
5 A6 Power D VDDLSC 1.1 V power supply
6 A7 Power D VDDLCN 1.1 V power supply
7 A8 ― ― N.C. GND connectable
8 A9 O A VRHT Capacitor connection
9 A11 ― ― N.C. GND connectable
10 B3 GND D VSSLSC 1.1V GND
11 B4 GND D VSSLSC 1.1V GND
12 B5 GND D VSSLSC 1.1V GND
13 B6 GND D VSSLSC 1.1V GND
14 B7 GND D VSSLCN 1.1V GND
15 B8 ― ― N.C. GND connectable
16 B9 GND A VSSHPX 2.9V GND
17 C1 Power D VDDLIF 1.1 V power supply
18 C2 GND D VSSLSC 1.1V GND
19 C3 ― ― N.C. GND connectable
20 C4 O A TVMON TEST output pin, OPEN
21 C5 ― ― N.C. GND connectable
22 C6 ― ― N.C. GND connectable
23 C7 ― ― N.C. GND connectable
24 C8 ― ― N.C. GND connectable
25 C9 ― ― N.C. GND connectable
26 C10 GND A VSSHPX 2.9V GND
27 C11 O A VRLRS Capacitor connection
28 D1 GND D VSSLSC 1.1V GND
29 D2 GND D VSSLSC 1.1V GND
30 D3 ― ― N.C. GND connectable
31 D4 GND A VSSHAN 2.9V GND
32 D5 GND A VSSHPX 2.9V GND
33 D6 GND A VSSHPX 2.9V GND
34 D7 GND A VSSHPX 2.9V GND
35 D8 GND A VSSHPX 2.9V GND
36 D9 ― ― N.C. GND connectable
37 D10 GND A VSSHPX 2.9V GND
38 D11 O A VRLT Capacitor connection
39 E1 O D DMO3N CSI-2 output (data)
40 E2 O D DMO3P CSI-2 output (data)
41 E3 ― ― N.C. GND connectable
42 E4 Power A VDDHAN 2.9 V power supply
43 E5 Power A VDDHAN 2.9 V power supply
44 E6 Power A VDDHPX 2.9 V power supply
45 E7 Power A VDDHPX 2.9 V power supply
46 E8 Power A VDDHPX 2.9 V power supply
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IMX415-AAQR-C
Analog
No. Pin No I/O Symbol Description
/ Digital
47 E9 ― ― N.C. GND connectable
48 E10 ― ― N.C. GND connectable
49 E11 ― ― N.C. GND connectable
50 F1 O D DMO1N CSI-2 output (data)
51 F2 O D DMO1P CSI-2 output (data)
52 F10 GND D VSSLSC 1.1V GND
53 F11 Power D VDDLSC 1.1 V power supply
54 G1 GND D VSSLSC 1.1V GND
55 G2 GND D VSSLSC 1.1V GND
56 G10 I D TENABLE Test enable, OPEN
57 G11 Power D VDDMIO 1.8 V power supply
58 H1 O D DCKN CSI-2 output (clock)
59 H2 O D DCKP CSI-2 output (clock)
60 H10 I D SLAMODE0 Select slave address
61 H11 I D XCLR System clear
62 J1 GND D VSSLSC 1.1V GND
63 J2 GND D VSSLSC 1.1V GND
64 J10 I D SLAMODE1 Select slave address
65 J11 I/O D SDA Serial data communication
66 K1 O D DMO2N CSI-2 output (data)
67 K2 O D DMO2P CSI-2 output (data)
68 K3 ― ― N.C. GND connectable
69 K4 ― ― N.C. GND connectable
70 K5 Power A VDDHAN 2.9 V power supply
71 K6 ― ― N.C. GND connectable
72 K7 Power A VDDHPX 2.9 V power supply
73 K8 Power A VDDHPX 2.9 V power supply
74 K9 ― ― N.C. GND connectable
75 K10 I/O D SCL Serial clock input
76 K11 I/O D XVS Vertical sync signal
77 L1 O D DMO4N CSI-2 output (data)
78 L2 O D DMO4P CSI-2 output (data)
79 L3 ― ― N.C. GND connectable
80 L4 ― ― N.C. GND connectable
81 L5 GND A VSSHPX 2.9V GND
82 L6 ― ― N.C. GND connectable
83 L7 GND A VSSHPX 2.9V GND
84 L8 GND A VSSHPX 2.9V GND
85 L9 ― ― N.C. GND connectable
86 L10 I/O D TOUT Digital TEST output pin, OPEN
87 L11 I/O D XHS Horizontal sync signal
88 M1 GND D VSSLSC 1.1V GND
89 M2 GND D VSSLSC 1.1V GND
90 M3 ― ― N.C. GND connectable
91 M4 ― ― N.C. GND connectable
92 M5 ― ― N.C. GND connectable
93 M6 ― ― N.C. GND connectable
94 M7 ― ― N.C. GND connectable
95 M8 ― ― N.C. GND connectable
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IMX415-AAQR-C
Analog
No. Pin No I/O Symbol Description
/ Digital
96 M9 ― ― N.C. GND connectable
97 M10 GND D VSSLSC 1.1V GND
98 M11 I D INCK Master clock input
99 N3 GND D VSSLSC 1.1V GND
100 N4 GND A VSSLPL2 1.1V GND
101 N5 GND A VSSLPL1 1.1V GND
102 N6 GND D VSSLSC 1.1V GND
103 N7 GND D VSSLSC 1.1V GND
104 N8 GND D VSSLSC 1.1V GND
105 N9 GND D VSSLCN 1.1V GND
106 P1 ― ― N.C. GND connectable
107 P3 Power D VDDLIF 1.1 V power supply
108 P4 Power A VDDLPL2 1.1 V power supply
109 P5 Power A VDDLPL1 1.1 V power supply
110 P6 Power D VDDLSC 1.1 V power supply
111 P7 Power D VDDMIO 1.8 V power supply
112 P8 Power D VDDLSC 1.1 V power supply
113 P9 Power D VDDLCN 1.1 V power supply
114 P11 ― ― N.C. GND connectable
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IMX415-AAQR-C
Electrical Characteristics
DC Characteristics
XHS
XVS VIH 0.8 × OVDD ― ― V
XCLR XVS / XHS
Digital input voltage
INCK Slave Mode
SLAMODE0
SLAMODE1 VIL — ― 0.2 × OVDD V
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IMX415-AAQR-C
Current Consumption
IDVDD_STB - 15.1 mA
Operating current: (Typ.) Supply voltage 2.9 V / 1.8 V / 1.1 V, Tj = 25 ˚C, standard luminous intensity.
(Max.) Supply voltage 3.0 V / 1.9 V / 1.2 V, Tj = 60 ˚C, worst state of internal circuit
operating current consumption,
Standby: (Max.) Supply voltage 3.0 V / 1.9 V / 1.2 V, Tj = 60 ˚C, INCK: 0 V, light-obstructed state.
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IMX415-AAQR-C
AC Characteristics
Master Clock Waveform (INCK)
1/fINCK
Tr_inck Tf_inck
0.8 × OVDD
tWHINCK
INCK 0.5 × OVDD
tWLINCK
0.2 × OVDD
tWP
tP
Duty Ratio = tWP / tP × 100
INCK clock frequency fINCK fINCK × 0.96 fINCK fINCK × 1.02 MHz
fINCK = 24 MHz, 27 MHz,
INCK Low level pulse width tWLINCK 4 ― ― ns 37.125 MHz, 72 MHz,
74.25 MHz
INCK High level pulse width tWHINCK 4 ― ― ns
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IMX415-AAQR-C
0.8 × OVDD
XCLR tWLXCLR
0.2 × OVDD
Tf_xclr Tr_xclr
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IMX415-AAQR-C
0.8 × OVDD
XVS
0.2 × OVDD
Tf_xhs Tr_xhs
tWLXHS tWHXHS
0.8 × OVDD
XHS
0.2 × OVDD
tHFDLY tVRDLY
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IMX415-AAQR-C
Serial Communication
I2C
VIH/VOH
SDA
VIL/VOL
tf tHD;DAT tSU;STA tBUF
tof
tLOW tSU;DAT tr
VIH
SCL
VIL
tHIGH
tHD;STA tr tHD;STA tSU;STO
I2C Specification
Low level output voltage VOL 0 — 0.2 × OVDD V OVDD < 2 V, Sink 3 mA
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IMX415-AAQR-C
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IMX415-AAQR-C
: External pin
VDDMIO VDDMIO
XVS 100 kΩ
TENABLE in XHS inout
100 kΩ TOUT
VSSLSC VSSLSC
VDDMIO VDDMIO
XCLR
INCK in SLAMODE1 in
SLAMODE2
VSSLPL VSSLSC
VDDMIO VSSHPX
SDA VRLRS
SCL inout VRLT
VSSLSC VRLx
VDDHAN VDDLIF
DMOPx
DMOPx
DMOMx DMCKP
TVMON in/out
DMCKP DMOMx
DMCKM DMCKM
VSSHAN VSSLIF
VRHx
VRHT
VSSHPX
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IMX415-AAQR-C
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
400 450 500 550 600 650 700 750 800 850 900 950 1000
Wave Length [nm]
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IMX415-AAQR-C
(AVDD = 2.9 V, OVDD = 1.8 V, DVDD = 1.1 V, Tj = 60 ˚C, All-pixel mode, 12 bit 30 frame/s, Gain: 0 dB)
Measurement
Item Symbol Min. Typ. Max. Unit Remarks
method
Note) 1. Converted value into mV using 1Digit = 0.1465 mV for 12-bit output and 1Digit = 0.5865 mV for 10-bit output.
2. The video signal shading is the measured value in the wafer status (including color filter) and does not
include characteristics of the seal glass.
3. The characteristics above apply to effective pixel area.
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IMX415-AAQR-C
Measurement Conditions
1. In the following measurements, the device drive conditions are at the typical values of the bias conditions and
clock voltage conditions.
2. In the following measurements, spot pixels are excluded and, unless otherwise specified, the optical black (OB)
level is used as the reference for the signal output.
Gb B Gb B
Vertical scan direction
R Gr R Gr
(Normal)
Gb B Gb B
R Gr R Gr
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IMX415-AAQR-C
Measurement Method
1. Sensitivity
Set the measurement condition to the standard imaging condition I. After setting the electronic shutter mode with
a shutter speed of 1/100 s, measure the Gr and Gb signal outputs (VGr, VGb) at the center of the screen, and
substitute the values into the following formula.
2. Sensitivity ratio
Set the measurement condition to the standard imaging condition II. After adjusting the average value of the Gr
and Gb signal outputs to 300 mV, measure the R signal output (VR [mV]), the Gr and Gb signal outputs (VGr,
VGb [mV]) and the B signal output (VB [mV]) at the center of the screen in frame readout mode, and substitute
the values into the following formulas.
VG = (VGr + VGb) / 2
RG = VR / VG
BG = VB / VG
3. Saturation signal
Set the measurement condition to the standard imaging condition II. After adjusting the luminous intensity to 20
times the intensity with the average value of the Gr and Gb signal outputs, 300 mV, measure the minimum values
of the Gr, Gb, R and B signal outputs.
5. Vertical Line
With the device junction temperature of 60 ˚C and the device in the light-obstructed state, calculates each
average output of Gr, Gb, R and B on respective columns. Calculates maximum value of difference with adjacent
column on the same color (VL [µV]).
6. Dark signal
With the device junction temperature of 60 ˚C and the device in the light-obstructed state, divide the output
difference between 1/30 s integration and 1/300 s integration by 0.9, and calculate the signal output converted to
1/30 s integration. Measure the average value of this output (Vdt [mV]).
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IMX415-AAQR-C
This sensor can write and read the setting values of the various registers shown in the Register Map by I2C
communication. See the Register Map for the addresses and setting values to be set.
SCL
Master Sensor
SDA
SLAVE Address
SLAMODE1 SLAMODE0
MSB LSB
pin pin
Low Low 0 0 1 1 0 1 0 R/W
Low High 0 0 1 0 0 0 0 R/W
High Low 0 1 1 0 1 1 0 R/W
High High 0 1 1 0 1 1 1 R/W
* R/W is data direction bit
R/W
R / W bit Data direction
0 Write (Master to Sensor)
1 Read (Sensor to Master)
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IMX415-AAQR-C
XVS
6XHS period 1XHS period
XHS
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Blank line
Data line
Data line
Data line
Data line
Data line
Data line
Data line
Data line
Data line
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IMX415-AAQR-C
Communication Protocol
I2C serial communication supports a 16-bit register address and 8-bit data message type.
Communication Protocol
―
Data is transferred serially, MSB first in 8-bit units. After each data byte is transferred, A (Acknowledge) / A
(Negative Acknowledge) is transferred. Data (SDA) is transferred at the clock (SCL) cycle. SDA can change only
while SCL is Low, so the SDA value must be held while SCL is High. The Start condition is defined by SDA changing
from High to Low while SCL is High. When the Stop condition is not generated in the previous communication phase
and Start condition for the next communication is generated, that Start condition is recognized as a Repeated Start
condition.
SCL
Start Condition
Bus free state
ACK/
SDA D5 D4 D3 D2 D1 D0 R/W NACK
P
SCL
Stop condition
Stop Condition
SCL
After transfer of each data byte, the Master or the sensor transmits an Acknowledge / Negative Acknowledge and
release (does not drive) SDA. When Negative Acknowledge is generated, the Master must immediately generate the
Stop Condition and end the communication.
SCL
SCL
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IMX415-AAQR-C
Index
Previous index value Index M
M+1
Index, value M
From Master to Slave S : Start Condition A : Acknowledge
Sr : Repeated Start Condition
From Slave to Master P : Stop Condition A : Negative Acknowledge
Index Index
Previous index value, K
K+1 K+2
Slave Slave
DATA DATA
S Address 1 A A P S Address 1 A A P
[7:0] [7:0]
[7:1] [7:1]
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IMX415-AAQR-C
Slave
DATA DATA DATA
S Address 1 A A A A A P
[7:0] [7:0] [7:0]
[7:1]
L bytes of data
From Master to Slave S : Start Condition A : Acknowledge
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IMX415-AAQR-C
Index
Previous index value Index M
M+1
Index, value M
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IMX415-AAQR-C
Register Map
This sensor has a total of 4352 bytes (256 × 17) of registers, composed of registers with LSB addresses 00h to FFh
that correspond to MSB address 30h to 40h. Use the initial values for empty address. Some registers must be
change from the initial values, so the sensor control side should be capable of setting 4352 bytes.
Do not perform communication to addresses not listed in the Register Map. Doing so may result in operation errors.
However, other registers that requires communication to address not listed above may be added, so addresses up to
FFh should be supported for LSB address; 3000h to 40FFh.
* For the register that is writing " * " to the setting value in description (Indicated by red letter), change the value
from the default value after the reset.
** In Gain setting only, it is reflected on the next frame which was settings.
*** Setting except for the setting values described in the description column is prohibited.
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IMX415-AAQR-C
Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 LSB
1
2
3
3008h FFh
4 BCWAIT_TIME The value is set according to INCK.
0FFh S
5 [9:0] Refer to “INCK setting”
6
7
0
1 MSB
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
3009h 00h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 LSB
1
2
3
300Ah B6h
4 CPWAIT_TIME The value is set according to INCK.
0B6h S
5 [9:0] Refer to “INCK setting”
6
7
0
1 MSB
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
300Bh A0h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “1h” 1h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “1h” 1h ―
0 Window mode setting
1 WINMODE 0: All-pixel mode, Horizontal/Vertical
0h V
2 [3:0] 2/2-line binning
3 4: Window cropping mode
301Ch 00h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
Mode setting
0 HADD 0h: All-pixel mode 0h S
1h: Horizontal 2 binning
1 ― Fixed to “0h” 0h ―
2 ― Fixed to “0h” 0h ―
3020h 00h
3 ― Fixed to “0h” 0h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
Mode setting
0 VADD 0h: All-pixel mode 0h S
1h: Vertical 2 binning
1 ― Fixed to “0h” 0h ―
2 ― Fixed to “0h” 0h ―
3021h 00h
3 ― Fixed to “0h” 0h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 Mode setting
ADDMODE
0h: All-pixel mode 0h S
1 [1:0]
1h: Horizontal/Vertical 2/2-line binning
2 ― Fixed to “0h” 0h ―
3022h 3 ― Fixed to “0h” 0h 00h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 LSB
1
2
3
3024h CAh
4
5
6
When sensor master mode vertical
7
span setting.
0
1 VMAX
For details, see the item of 008CAh V
2 [19:0]
“Slave Mode and Master Mode”
3
3025h in the section of 08h
4
“Description of Various Functions”.
5
6
7
0
1
2
3 MSB
3026h 00h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 LSB
1
2
3
3028h 26h
4
When sensor master mode horizontal
5
span setting.
6
7 HMAX
For details, see the item of 0226h V
0 [15:0]
“Slave Mode and Master Mode”
1
in the section of
2
“Description of Various Functions”.
3
3029h 02h
4
5
6
7 MSB
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IMX415-AAQR-C
Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
Horizontal direction
Readout inversion control
0 HREVERSE 0h V
0: Normal
1: Inverted
Vertical direction
Readout inversion control
1 VREVERSE 0h V
0: Normal
3030h 00h
1: Inverted
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 AD conversion bits setting
ADBIT
0: AD 10 bit 1h S
1 [1:0]
1: AD 12 bit ( 11 bit + digital dither )
2 ― Fixed to “0h” 0h ―
3031h 3 ― Fixed to “0h” 0h 01h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
Number of output bit setting
0 MDBIT 0: 10 bit 1h S
1: 12 bit
1 ― Fixed to “0h” 0h ―
2 ― Fixed to “0h” 0h ―
3032h 01h
3 ― Fixed to “0h” 0h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 Output IF mode setting
1 0: 2376 Mbps
2 2: 2079 Mbps
SYS_MODE 4: 1782 Mbps
4h S
[3:0] 5: 891 Mbps
3 7: 594 Mbps
3033h 04h
8: 1140 / 1485 Mbps
9: 720 Mbps
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 LSB
1
2
3
3040h 00h
4 In window cropping mode
5 Start position
PIX_HST
6 (Horizontal direction) 0000h V
[12:0]
7
0 Multiples of 2
1
2
3
3041h 00h
4 MSB
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 LSB
1
2
3
3042h 18h
4 In window cropping mode
5 Cropping width
PIX_HWIDTH
6 (Horizontal direction) 0F18h V
[12:0]
7
0 Multiples of 24
1
2
3
3043h 0Fh
4 MSB
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 LSB
1
2
3
3044h In window cropping mode 00h
4
Start position
5
PIX_VST (Vertical direction)
6 0000h V
[12:0]
7
Designated in Line ×2,
0
Multiples of 4
1
2
3
3045h 00h
4 MSB
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 LSB
1
2
3
3046h In window cropping mode 20h
4
Cropping width
5
PIX_VWIDTH (Vertical direction)
6 1120h V
[12:0]
7
Designated in Line × 2,
0
Multiples of 4
1
2
3
3047h 11h
4 MSB
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 LSB
1
2
3
3050h 66h
4
5
6
7
0
1 SHR0 Storage time adjustment
00066h V
2 [19:0] Designated in line units.
3
3051h 00h
4
5
6
7
0
1
2
3 MSB
3052h 00h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
3081h [7:0] ― Fixed to “00h” 00h 00h S
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 LSB
1
2
3
3090h GAIN_PCG_0 Gain setting 00h
4 000h V
[8:0] (0.0dB to 72.0dB / 0.3dB step)
5
6
7
0 MSB
1 ― Fixed to “0h” 0h ―
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
3091h 00h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 XVS pin setting in master mode
XVSOUTSEL
0: Fixed to Low 2h I
1 [1:0]
2: VSYNC output
2 XHS pin setting in master mode
XHSOUTSEL
0: Fixed to Low 2h I
30C0h 3 [1:0] 2Ah
2: HSYNC output
4
― Fixed to “2h” 2h ―
5
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 XVS pin setting
XVS_DRV
0: XVS output (Master mode) 3h S
1 [1:0]
3: HiZ (Slave mode)
2 XHS pin setting
XHS_DRV
0: XHS output (Master mode) 3h S
30C1h 3 [1:0] 0Fh
3: HiZ (Slave mode)
4
― Fixed to “0h” 0h ―
5
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 ― Fixed to “0h” 0h ―
1 ― Fixed to “0h” 0h ―
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
4 XVS pulse width setting
in master mode.
30CCh 00h
XVSLNG 0: 1H
0h I
5 [1:0] 1: 2H
2: 4H
3: 8H
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 ― Fixed to “0h” 0h ―
1 ― Fixed to “0h” 0h ―
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
4 XHS pulse width setting
in master mode.
30CDh 00h
XHSLNG 0: 16clock
0h I
5 [1:0] 1: 32clock
2: 64clock
3: 128clock
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 The value is set according to Readout
1 mode.
DIG_CLP_VSTART
2 2: Horizontal / Vertical 2/2-line binning 06h S
[4:0]
3 mode
30D9h 06h
4 6: All-pixel scan mode
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
0 The value is set according to Readout
mode.
DIG_CLP_VNUM
1: Horizontal / Vertical 2/2-line binning 2h S
1 [1:0]
mode
2: All-pixel scan mode
30DAh 2 ― Fixed to “0h” 0h 02h ―
3 ― Fixed to “0h” 0h ―
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Default value
Register after reset Reflection
Address bit Description
name By By timing
register address
0 LSB
1
2
3 Black level offset value setting
30E2h 32h
4 BLKLEVEL
032h I
5 [9:0] 10-bit readout mode: 1digit/1h
6 12-bit readout mode: 4digit/1h
7
0
1 MSB
2 ― Fixed to “0h” 0h ―
3 ― Fixed to “0h” 0h ―
30E3h 00h
4 ― Fixed to “0h” 0h ―
5 ― Fixed to “0h” 0h ―
6 ― Fixed to “0h” 0h ―
7 ― Fixed to “0h” 0h ―
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Operating mode
The table below shows the operating modes available with this sensor.
These frame rates indicate the maximum rates for each mode. When using a typical frame rate, please refer to the
“List of Setting Register” at section “Image Data Output Format”.
27, 37.125,
2376 10 10 90.9 365 (*1)
74.25
10 10 82.9 27, 37.125, 400 (*1)
All pixel 2079 3840 2160 2238
12 12 60.3 74.25 550 (*1)
27, 37.125,
1485 10 10 61.6 538 (*1)
74.25
4
10 10 60.4 532 (*2)
1440 24, 72
12 12 51.1 629 (*2)
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27, 37.125,
594 10 12 42.4 782 (*1)
74.25
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DATA Type
Setting register
Header [5:0] Name Description
(I2C)
00h Frame Start Code N/A FS
01h Frame End Code N/A FE
10h NULL N/A Invalid data
12h Embedded Data N/A Embedded data
2Bh RAW10 Address: 3032h 0A0Ah
2Ch RAW12 MDBIT [0] 0C0Ch
37h OB Data N/A Vertical OB line data
Frame Structure
FS
PH EBD(Embedded data)
Ignored OB
PH Vertical effective OB
Ignored OB
Dummy
RG RG
GB GB
PF
RG RG
GB GB
Dummy FE
Frame blanking
FS Next Frame
PH EBD(Embedded data) PF
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Packet Header A5h Tag Data Tag Data Tag Data Tag Data Tag Data 07h 07h Packet Footer
RAW10
Packet Header A5h Tag Data Tag 55h Data Tag Data Tag 55h Data Tag Data 07h 55h Packet Footer
RAW12
Packet Header A5h Tag 55h Data Tag 55h Data Tag 55h Data Tag 55h Data 07h 55h Packet Footer
A5h Tag
[3:0] [3:0]
The end of the address and the register value is determined according to the tags embedded in the data.
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All-pixel mode
List of Setting Register
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XHS
Horizontal read out direction
FS 1
XVS PH 1 EBD(Embedded data)
17 Ignored OB
PH 18 Vertical effective OB
1 Ignored OB
1 Dummy
RG RG
GB 12 Ignored area of effective pixel GB
Vertical read out direction
Horizontal blanking
Effective margin
Effective margin
PF
PH 2160
Recording pixel area
12 3840 12 HB
RG RG
GB GB
8 Effective margin for color processing
RG RG
GB 2 Ignored area of effective pixel GB
1 Dummy FE
VB Vertical blanking
XVS
XHS
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XHS XHS
Horizontal read out direction
FS 1
XVS
PH 1 EBD(Embedded data)
11 Ignored OB
PH 6 Vertical effective OB
1 Ignored OB
1 Dummy
RG RG
GB 6 Ignored area of effective pixel GB
Vertical read out direction
Horizontal blanking
Effective margin
Effective margin
PF
Dummy
PH 1080
Recording pixel area
HB 6 1920 6 12 HB
RG RG
GB GB
4 Effective margin for color processing
RG RG
GB 1 Ignored area of effective pixel GB
1 Dummy FE
VB Vertical blanking
XVS
XHS
In "2/2 binning", pixels binning by normal direction and inverted direction are shifted by the same color one pixel.
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Cropping position is set, regarding effective pixel with dummy start position as origin (0, 0) in normal mode
direction. That is a start point which is an offset from the origin and cropping width.
Cropping is available from each driving mode and horizontal period is fixed to the value at same as the mode
before window cropping. Pixels cropped by horizontal cropping setting are output with left shifted and that extends
the horizontal blanking period.
Window position and size is used fixed value. (An ignore frame is output when it is changed.)
FS FS
PH EBD(Embedded data) PH EBD(Embedded data)
17 Ignored OB 17 Ignored OB
PH 18 Vertical effective OB PH 18 Vertical effective OB
1 Ignored OB 1 Ignored OB
GB 1 Dummy 1 Dummy
RG
GB (0, 0) 12 Ignored area of effective pixel
(PIX_HST+PIX_HWIDTH, (PIX_VST+PIX_VWIDTH+20)/2)
(PIX_HST, PIX_VST/2)
GB GB
RG RG
13 effective pixel GR GR
BG 3 effective pixel BG
RG RG BG BG
for color processing
GB PIX_VWIDTH/2 GB GR GR
Horizontal blanking
Horizontal blanking
Effective margin
Effective margin
Effective margin for color processing Effective margin for color processing PIX_VWIDTH/2
PH PF PH PF
+ Recording pixel + Recording pixel
PIX_HWIDTH PIX_HWIDTH
RG RG BG BG
GB GB GR GR
Supplement) The first readout pixel color is “G” at windows cropping mode in inverted direction.
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◆ PIX_VST, PIX_VWIDTH
Set PIX_VST, PIX_VWIDTH to a multiple of 4.
PIX_VST = n1×4
PIX_VWIDTH = n2×4
Cropped starting position and width is set multiple of 2 addresses, because PIX_VST, PIX_VWIDTH is internal
V address unit.
Cropped area is needed to set pre 13 pixel, rear 3 pixel for signal processing.
◆ PIX_HST, PIX_HWIDTH
Set PIX_HST to a multiple of 2.
Set PIX_HWIDTH to a multiple of 24.
PIX_HST = n3×2
PIX_VWIDTH = n4×24
VTTL ≥ 1222
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Standby Mode
This sensor stops its operation and goes into standby mode which reduces the power consumption by writing “1” to
the standby control register STANDBY. Standby mode is also established after power-on or other system reset
operation.
The serial communication registers hold the previous values. However, the address registers transmitted in standby
mode are overwritten. The serial communication block operates even in standby mode, so standby mode can be
canceled by setting the STANDBY register to “0”. Some time is required for sensor internal circuit stabilization after
standby mode is canceled. After standby mode is canceled, a normal image is output from the 9 frames after internal
regulator stabilization 24 ms or more.
For details of the sequence of setting and cancel standby mode, see the sensor setting flow after power on.
Initial regulator
Register Standby
stabilization period
initial settings cancel
24 ms
SDA
SCL
XVS
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Input a vertical sync signal to XVS and input a horizontal sync signal to XHS when a sensor is in slave mode.
For sync signal interval, input data lines to output for vertical sync signal and 1H period designated in each operating
mode for horizontal sync signal. See the section of "Operating mode" for the number of output data line and 1H
period.
Set the XMSTA register 0h in order to start the operation after setting to master mode. In addition, set the count
number of sync signal in vertical direction by the VMAX [19:0] register and the clock number in horizontal direction by
the HMAX [15:0] register. See the description of Operation Mode for details of the section of “Operating Modes”.
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XVS
XVSLNG = 0d: 1H width
XHS
XHS
XHSLNG = 0
XHSLNG = 1
XHS
XHSLNG = 2
XHSLNG = 3
System delay
DataOut PH
The XVS and XHS are output in timing that set 0 to the register XMSTA. If set 0 to XMSTA during standby, the XVS
and XHS are output just after standby is released. The XVS and XHS are output asynchronous with other input or
output signals. In addition, the output signals are output with an undefined latency time (system delay) relative to the
XHS. Therefore, refer to the sync codes output from the sensor and perform synchronization.
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The value which is 10/3 times the gain is set to register. (0.3 dB step)
Example)
When set to 6 dB: 6 × 10/3 = 20d; GAIN_PCG_0 = 14h
When set to 12.6 dB: 12.6 × 10/3 = 42d; GAIN_PCG_0 = 2Ah
Analog Gain
Analog + Digital Gain
72.0
66.0
60.0
54.0
48.0
42.0
Gain [dB]
36.0
30.0
24.0
18.0
12.0
6.0
0.0
A0h
B4h
F0h
0h
14h
28h
3Ch
50h
64h
78h
8Ch
C8h
DCh
Register setting Value [Hex]
The gain setting is reflected at the next frame that the communication is performed as shown below.
Communication period
Register Communication
Time base
XVS
Output Signal Frame Frame Frame Frame Frame Frame Frame Frame
Gain 6dB
setting 0dB
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Register details
Register Initial value Setting value
Address bit
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Register details
Register Initial value Setting value
Address bit
0h: Normal
HREVERSE [0] 0h
1h: Inverted
3030h
0h: Normal
VREVERSE [1] 0h
1h: Inverted
V (+) V (+)
H (+) H (+)
V (+) V (+)
H (+) H (+)
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Note) For integration time control, an image which reflects the setting is output from the frame after the setting
changes.
Where Toffset is 1.79 [μs] at AD 10bit mode and 2.68 [μs] at AD 12bit mode.
*1 The frame period is determined by the input XVS when the sensor is operating in slave mode, or the register
VMAX value in master mode. The frame period is designated in 1H units, so the time is determined by
(Number of lines × 1H period).
*2 See “Operating Modes” for the 1H period.
In this section, the shutter operation and storage time are shown as in the figure below with the time sequence on the
horizontal axis and the vertical address on the vertical axis. For simplification, shutter and readout operation are
noted in line units.
XHS
CSI-2
N frame N+1 frame
Packet
Chip top side
Last line
Last-1 line
Last-2 line
Sensor
4 line
3 line
2 line
1 line
Chip bottom side
Output
blanking effective signal blanking effective signal blanking
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Register details
Register Initial value Setting value
Address bit
3050h [7:0]
Sets the shutter sweep time.
SHR0 [19:0] 3051h [7:0] 00066h 8 to (Number of lines per frame - 4)
* Others: Setting prohibited
3052h [3:0]
XVS
SHR0=α SHR0=β
XHS
CSI-2 Packet
α Frame2
integration time
β Frame3
integration time
β Frame4
integration time
β Frame5
integration time
…
Output timimg V-BLK Frame1 V-BLK Frame2 V-BLK Frame3 V-BLK Frame4 V-BLK Frame5
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Long Exposure Operation (Control by Expanding the Number of Lines per Frame)
Long exposure operation can be performed by lengthening the frame period.
When the sensor is operating in slave mode, this is done by lengthening the input vertical sync signal (XVS) pulse
interval.
When the sensor is operating in master mode, it is done by designating a larger register VMAX [19:0] value
compared to normal operation. When the integration time is extended by increasing the number of lines, the rear V
blanking increases by an equivalent amount.
Although the maximum value of long exposure operation changes in each mode, the maximum of long time exposure
is approximately 1 s.
When set to a number of V lines or more than that noted for each operating mode, the imaging characteristics are not
guaranteed during long exposure operation.
XHS
CSI-2 Packet
Output timimg V-BLK Frame1 V-BLK Frame2 V-BLK Frame3 V-BLK Frame4
Image Drawing of Long Integration Time Control by Adjusting the Frame Period
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…
All-pixel scan mode 2250 N (2250 - N) H + Toffset
…
8 2242H + Toffset
Where Toffset is 1.79 [μs] at AD 10bit mode and 2.68 [μs] at AD 12bit mode.
* In sensor master mode. In slave mode, the interval is the same as XVS input.
** The SHR0 setting value (N) is set between “8” and “the VMAX value (M) – 4”.
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Signal Output
CSI-2 output
The output formats of this sensor support the following modes.
The 2 Lane / 4 Lane serial signal output method using this sensor is described below.
Complied with the CSI-2, data is output using 2 Lane / 4 Lane. The image data is output from the CSI-2 output pin.
The DMO1P / DMO1N are called the Lane1 data signal, the DMO2P / DMO2N are called the Lane2 data signal, the
DMO3P / DMO3N are called the Lane3 data signal, the DMO4P / DMO4N are called the Lane4 data signal. In
addition, the clock signals are output from DCKP / DCKN of the CSI-2 pins.
In 2 Lane mode, data is output from Lane1 and Lane2. In 4 Lane mode, data is output from Lane1, Lane2, Lane3 and
Lane4.
The bit rate maximum value is 2376 Mbps / Lane in 4 Lane mode and 2079 Mbps / Lane in 2 Lane mode.
The select of RAW10 / RAW12 is set by the register: MDBIT [0]. The number of output lanes is set by the register:
LANEMODE [2:0].
Unused lanes output signals conformed to MIPI standard.
P0 P1 P2 P3
→ RAW12 Format
P0 P1 P1 P0 P2 P3 P3 P2
[11:4] [11:4] [3:0] [3:0] [11:4] [11:4] [3:0] [3:0] …
→ RAW10 Format
P0 P1 P2 P3 P3 P2 P1 P0 P4
[9:2] [9:2] [9:2] [9:2] [1:0] [1:0] [1:0] [1:0] [9:2] …
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a) 2 Lane-RAW12
Sensor
Lane1
P1 P5
(DMO1P/DMO1N) P0 [3:0] P3 P4 [3:0]
P0 P1 P2 P3 … PH PH [11:4] P0 [11:4] [11:4] P4 …
[3:0] [3:0]
Lane2
P3
(DMO2P/DMO2N) P1 P2 [3:0] P5 P6
PH PH [11:4] [11:4] P2 [11:4] [11:4] …
[3:0]
b) 2 Lane-RAW10
Sensor
Lane1
P3[1:0]
(DMO1P/DMO1N) P0 P2 P2[1:0] P5 P7
P0 P1 P2 P3 … PH PH [9:2] [9:2] P1[1:0] [9:2] [9:2] …
P0[1:0]
Lane2
P7[1:0]
(DMO2P/DMO2N) P1 P3 P4 P6 P6[1:0]
PH PH [9:2] [9:2] [9:2] [9:2] P5[1:0] …
P4[1:0]
c) 4 Lane-RAW12
Sensor
Lane1
P5 P13
(DMO1P/DMO1N) P0 P3 [3:0] P8 P11 [3:0]
P0 P1 P2 P3 … PH [11:4] [11:4] P4 [11:4] [11:4] P12 …
[3:0] [3:0]
Lane2
P3 P11
(DMO2P/DMO2N) P1 [3:0] P6 P9 [3:0] P14
PH [11:4] P2 [11:4] [11:4] P10 [11:4] …
[3:0] [3:0]
Lane3
P1 P9
(DMO3P/DMO3N) [3:0] P4 P7 [3:0] P12 P15
PH P0 [11:4] [11:4] P8 [11:4] [11:4] …
[3:0] [3:0]
Lane4
P7 P15
(DMO4P/DMO4N) P2 P5 [3:0] P10 P13 [3:0]
PH [11:4] [11:4] P6 [11:4] [11:4] P14 …
[3:0] [3:0]
d) 4 Lane-RAW10
Sensor
Lane1
P3[1:0]
(DMO1P/DMO1N) P0 P2[1:0] P7 P10 P13 P16
P0 P1 P2 P3 … PH [9:2] P1[1:0] [9:2] [9:2] [9:2] [9:2] …
P0[1:0]
Lane2
P7[1:0]
(DMO2P/DMO2N) P1 P4 P6[1:0] P11 P14 P17
PH [9:2] [9:2] P5[1:0] [9:2] [9:2] [9:2] …
P4[1:0]
Lane3 P11[1:0]
(DMO3P/DMO3N) P2 P5 P8 P10[1:0] P15 P18
PH [9:2] [9:2] [9:2] P9[1:0] [9:2] [9:2] …
P8[1:0]
Lane4 P15[1:0]
(DMO4P/DMO4N) P3 P6 P9 P12 P14[1:0] P19
PH [9:2] [9:2] [9:2] [9:2] P13[1:0] [9:2] …
P12[1:0]
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IMX415-AAQR-C
MIPI Transmitter
Output pins (DMOP1, DMOM1, DMOP2, DMOM2, DMOP3, DMOM3, DMOP4, DMOM4, DCKP, DCKM) are
described in this section.
Sensor
DMO1P F2 +
Data Lane 1
DMO1N F1
-
DMO2P K2 +
Data Lane 2
DMO2N K1
-
DMO3P E2 +
Data Lane 3
DMO3N E1
-
DMO4P L2 +
Data Lane 4
DMO4N L1
-
DCKP H2 +
Clock Lane
DCKN H1
-
The pixel signals are output by the CSI-2 High-speed serial interface.
See the MIPI Standard
・MIPI Alliance Standard for Camera Serial Interface 2 (CSI-2) Version 1.20.00
・MIPI Alliance Specification for D-PHY Version 1.20.00
The CSI-2 transfers one bit with a pair of differential signals. The transmitter outputs differential current signal after
converting pixel signals to it. Insert external resistance in differential pair in a series or use cells with a built-in
resistance on the Receiver side. When inserting an external resistor, as close as possible to the Receiver. The
differential signals maintain a constant interval and reach the receiver with the shortest wiring length possible to
avoid malfunction. The maximum bit rate of each Lane is 2376 Mbps / Lane.
Dp
Clock
LP-Tx
Lane Control Dn
Data and Tx
Interface Logic
Control HS-Tx
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Register details
Register Initial value Setting value
Address bit
0: 10 bit
ADBIT 3031h [0] 1h
1: 12 bit
In CSI-2 output mode, the sensor output has either a 10 bit or 12 bit gradation, and the maximum output value is the
3FFh value (10 bit output) and the FFFh one (12 bit output).
The output range for each output gradation is shown in the table below.
Output value
Output gradation
Min. Max.
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INCK Setting
The available operation mode varies according to INCK frequency. Input either 24 MHz, 27 MHz, 37.125 MHz, 72
MHz or 74.25 MHz for INCK frequency. The INCK setting register and the list of INCK setting are shown in the table
below.
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IMX415-AAQR-C
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Register details
Register Initial value Setting value
Address bit
0: Invalid
REGHOLD 3001h [0] 0h
1: Valid (Register hold)
: Communication period
XVS
REGHOLD = 1 REGHOLD = 0
Register setting A Register setting B Register setting C Register setting D
XHS
Register
Hold
Register A Register B Register C
is not reflected. is not reflected. is not reflected.
Register A
Register B
Register C
Register D
are reflected.
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Mode Transitions
The Mode transition between operations is shown below. These examples shown in case that setting is completed
within one communication timing.
Transition State
Horizontal direction normal → Horizontal direction inverted Via the Standby state
Horizontal direction inverted → Horizontal direction normal is unnecessary.
*1 When changing input INCK frequency, care should be taken not to be input pulses whose width are shorter than
the High / Low level width in front and behind of the INCK pulse at the frequency change. If the pulses above
generate at the frequency change, change INCK frequency during system reset in the state of XCLR = Low, and
then perform system clear in the state of XCLR = High following the item of "Power on sequence" in the section of
"Power on / off sequence". Execute initial setting again because the register settings become default state after
system clear.
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Other Function
This sensor has the function as below. About detail, refer to each application note.
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Power-on sequence
1. Turn On the power supplies so that the power supplies rise in order of 1.1 V power supply (DVDD) →1.8 V power
supply (OVDD) → 2.9 V power supply (AVDD). In addition, all power supplies should finish rising within 200 ms.
2. The register values are undefined immediately after power-on, so the system must be cleared. Hold XCLR at Low
level for 500 ns or more after all the power supplies have finished rising. (The register values after a system clear
are the default values.)
3. The system clear is applied by setting XCLR to High level. The maser clock input after setting the XCLR pin to High
level.
4. Make the sensor setting by register communication after the system clear.
T2 2.9 V power supply (AVDD)
T0 T1
1.8 V power supply (OVDD)
TLOW
XCLR
T3
INCK
XVS
XHS TSYNC
Slave mode : XVS and XHS must not be over OVDD
Master mode : Depend on the rising of 1.8V power supply
Power-on Sequence
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DVDD
100%
OVDD
DVDD
SR = ΔV/Δt
OVDD
AVDD AVDD ΔV
Δt
0V
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Power-off sequence
Turn Off the power supplies so that the power supplies fall in order of 2.9 V power supply (AVDD) → 1.8 V power
supply (OVDD) → 1.1 V power supply (DVDD). In addition, all power supplies should be falling within 200 ms. Set each
digital input pin (INCK, SDA, SCL, XCLR, XVS, XHS) to 0 V before the 1.8 V power supply (OVDD) falls.
T7
2.9 V power supply (AVDD)
T5 T6
1.8 V power supply (OVDD)
Fixed to 0 before
INCK OVDD supplies have finished fowling.
Power-off Sequence
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Start
Pin settings
Power-on
System clear
XCLR pin : Low → High
INCK input
Standby cancel
XVS and XHS input stop
STANDBY=0
Register changes
Shutter
Gain Operation
Other
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Start
Pin settings
Power-on
System clear
XCLR pin : Low High
INCK input
Register changes
Shutter
Gain
Operation
Other
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IMX415-AAQR-C
Peripheral Circuit
0.01uF
0.01uF
0.1uF
0.1uF
4.7uF
1.0uF
1.0uF
1.0uF
0.1uF
1.0uF
4.7uF
1.0uF
4.7uF
0.1uF
0.1uF
0.1uF
E4 E5 K5 E6 E7 E8 K7 K8 A4 A5 G11 P7 A7 P9 A3 A6 F11 P6 P8 C1 P3 P5 P4
VDDLSC
VDDHAN
VDDHAN
VDDHAN
VDDHPX
VDDHPX
VDDHPX
VDDHPX
VDDHPX
VDDMIO
VDDMIO
VDDMIO
VDDMIO
VDDLCN
VDDLCN
VDDLSC
VDDLSC
VDDLSC
VDDLSC
VDDLIF
VDDLIF
VDDLPL1
VDDLPL2
IMX415
VSSLPL1
VSSLPL2
VSSHAN
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSHPX
VSSLCN
VSSLCN
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
VSSLSC
D4 B9 C10 D5 D6 D7 D8 D10 L5 L7 L8 B7 N9 B3 B4 B5 B6 C2 D1 D2 F10 G1 G2 J1 J2 M1 M2 M10 N3 N6 N7 N8 N5 N4
Common
GND
OVDD
1.8V
IMX415 IMX415 IMX415 MIPI Rx
DCKP H2
1kΩ
1kΩ
Application circuits shown are typical examples illustrating the operation of the devices.
Sony Semiconductor Solutions Corporation cannot assume responsibility for any problems arising out of the use
of these circuits or for any infringement of third party and other right due to same.
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IMX415-AAQR-C
(AVDD = 2.9 V, OVDD = 1.8 V, DVDD = 1.1 V, Tj = 60 ˚C, 30 frame/s, Gain: 0 dB)
Zone Definition
2176
3864
(3864, 2225)
2 Ignored area of effective pixel (3864, 2227)
1 Dummy (3864, 2228)
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After delivery inspection of CMOS image sensors, particle radiation such as cosmic rays etc. may distort pixels of
CMOS image sensors, and then distorted pixels may cause white point effects in dark signals in picture images.
(Such white point effects shall be hereinafter referred to as "White Pixels".)
Unfortunately, it is not possible with current scientific technology for CMOS image sensors to prevent such White
Pixels. It is recommended that when you use CMOS image sensors, you should consider taking measures against
such White Pixels, such as adoption of automatic compensation systems for White Pixels in dark signals and
establishment of quality assurance standards.
Unless the Seller's liability for White Pixels is otherwise set forth in an agreement between you and the Seller,
Sony Semiconductor Solutions Corporation or its distributors (hereinafter collectively referred to as the "Seller")
will, at the Seller's expense, replace such CMOS image sensors, in the event the CMOS image sensors delivered
by the Seller are found to be to the Seller's satisfaction, to have over the allowable range of White Pixels as set forth
above under the heading "Spot Pixels Specifications", within the period of three months after the delivery date of
such CMOS image sensors from the Seller to you; provided that the Seller disclaims and will not assume any liability
after you have incorporated such CMOS image sensors into other products.
Please be aware that Seller disclaims and will not assume any liability for (1) CMOS image sensors fabricated,
altered or modified after delivery to you, (2) CMOS image sensors incorporated into other products, (3) CMOS
image sensors shipped to a third party in any form whatsoever, or (4) CMOS image sensors delivered to you
over three months ago. Except the above mentioned replacement by Seller, neither Sony Semiconductor Solutions
Corporation nor its distributors will assume any liability for White Pixels. Please resolve any problem or trouble arising
from or in connection with White Pixels at your costs and expenses.
The chart below shows the predictable data on the annual number of White Pixels occurrence in a single-story
building in Tokyo at an altitude of 0 meters. It is recommended that you should consider taking measures against
the annual White Pixels, such as adoption of automatic compensation systems appropriate for each annual
number of White Pixels occurrence.
The data in the chart is based on records of past field tests, and signifies estimated number of White Pixels
calculated according to structures and electrical properties of each device. Moreover, the data in the chart is
for your reference purpose only, and is not to be used as part of any CMOS image sensor specifications.
Note 1) The above data indicates the number of White Pixels occurrence when a CMOS image sensor is left
for a year.
Note 2) The annual number of White Pixels occurrence fluctuates depending on the CMOS image sensor storage
environment (such as altitude, geomagnetic latitude and building structure), time (solar activity effects)
and so on. Moreover, there may be statistic errors. Please take notice and understand that this is an
example of test data with experiments that have being conducted over a specific time period and in
a specific environment.
Note 3) This data does not guarantee the upper limits of the number of White Pixels occurrence.
Material_No.03-0.0.10
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After setting to standard imaging condition II, and the device driver should be set to meet bias and clock voltage
conditions. Configure the drive circuit according to the example and measure.
Spot pixel level D = ((ViB or ViK) / Average value of Vi) × 100 [%]
White pixel
ViB
ViK
Vi (i = R, G, B, VG = 300 mV )
Black pixel
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White Pixel, Black Pixel and Bright Pixel are judged from the pattern whether they are allowed or rejected, and
counted.
R G
White pixel
No. Pattern Black pixel
G B
Bright pixel
1 ● ● Rejected
●
2 Rejected
●
Note) 1.”●” shows the position of white pixel, black pixel and bright pixel.
White pixel, black pixel and bright pixel are specified separately according the pattern.
(Example: If a black pixel and a white pixel is in the pattern No.1 respectively, they are not judged to
be rejected.)
2. When one or more spot pixels indicated “Rejected” is selected and removed.
3. Spot pixels other than described in the table above are all counted including the number of allowable
spot pixels by zone.
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Marking
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Notes On Handling
3. Installing (attaching)
(1) If a load is applied to the entire surface by a hard component, bending stress may be generated
and the package may fracture, etc., depending on the flatness of the bottom of the package.
Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive.
(2) The adhesive may cause the marking on the rear surface to disappear.
(3) If metal, etc., clash or rub against the package surface, the package may chip or fragment and
generate dust.
(4) Acrylate anaerobic adhesives are generally used to attach this product. In addition, cyanoacrylate
instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives to hold
the product in place until the adhesive completely hardens. (Reference)
(5) Note that the sensor may be damaged when using ultraviolet ray and infrared laser for mounting it.
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Temperature
Peak 240 ± 5 °C
230 °C
Max. 5 °C/s
180 °C – 6 °C/s or less
10 to 30 s
150 °C
+4 °C/s
or less 60 to 120 s
Preheating Reflow
Time
5. Others
(1) Do not expose to strong light (sun rays) for long periods, as the color filters of color devices will
be discolored.
(2) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage
or use in such conditions.
(3) This product is precision optical parts, so care should be taken not to apply excessive mechanical
shocks or force.
(4) Note that imaging characteristics of the sensor may be affected when approaching strong
electromagnetic wave or magnetic field during operation.
(5) Note that image may be affected by the light leaked to optical black when using an infrared cut
filter that has transparency in near infrared ray area during shooting subjects with high luminance.
(6) Please perform the tilt adjustment for the optical axis in your company as required.
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Package Outline
(Unit: mm)
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IMX415-AAQR-C
* STARVIS is a trademark of Sony Corporation. The STARVIS is back-illuminated pixel technology used in CMOS image sensors
2
for surveillance camera applications. It features a sensitivity of 2000 mV or more per 1 μm (color product, when imaging
2
with a 706 cd/m light source, F5.6 in 1 s accumulation equivalent), and realizes high picture quality in the visible-light and
near infrared light regions.
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Revision History
Date of
Ver. Page Contain of Change
change
2018 / 08 / 09 0.1 ─ First Edition
2018 / 11 / 20 0.2 2 Added: Image size, Diagonal
8 Correction: Fig. Pixel Arrangement
10 Correction: Fig. Pin Configuration;
Pin name: A7, P9, B7, N9, N5
Pin color: A4, A5, G11, P7, A9
12 Correction: Pin No. K2; Analog/Digital “―” to D
13 Correction: Pin No. P7 Description; 1.1V to 1.8V
14 Deleted: pins SDA, SCL
27 Correction: Immediately -> “I”, Reconsideration of sentences
28 Correction: SDL -> SCL
34 Correction:
CPWAIT_TIME; Default Value 0h -> 0B6h
WINMODE; Horizontal/Vertical 2/2-line binning setting 1 -> 0
35, 37, 44 Correction: Reflection timing V -> S
HADD, VADD, ADDMODE, ADBIT, MDBIT, ADBIT1
41, 55, 57 Add: Register DIG_CLP_VSTART, DIG_CLP_VNUM
42 Correction: Reflection timing V -> I
BLKLEVEL
44, 45 Added: Register address
358Ah, 35A1h, 36BCh, 36CCh-36CEh, 36D0h-36D2h, 36D4h,
36D6h-36D8h, 36DAh, 36DBh, 3724h, 3726h, 3734h, 3736h,
38CCh, 38CDh, 395Ch, 3A4Ch, 3AE0h, 3B00h, 3B06h
Deleted: Register address
35A0h
47 Correction: All pixel 4Lane 720Mbps/lane 12bit; 30.01fps -> 25fps
49, 54, 59, Correction: Fig. Image Drawing; “FE” position
60
53 Correction:
[1485Mbps/lane];
TCLKPOST: 0007h -> 00A7h, TCLKTRAIL: 00h5F -> 005Fh
[2376Mbps/lane]; 60fps -> 90fps, 7.5us -> 5.0us,
HMAX: 226h -> 16Eh, ADBIT/MDBIT: 1h -> 0h, TCLKPOST: 009Fh
-> 00E7h, TCLKPREPARE: 0057h -> 008Fh, TCLKTRAIL: 0057h ->
008Fh, TCLKZERO: 0187h -> 027Fh, THSPREPARE: 005Fh ->
0097h, THSZERO: 00A7h -> 010Fh, THSTRAIL: 005Fh -> 0097h,
THSEXIT: 0097h -> 00F7h, TLPX: 004F -> 007Fh
54, 59 Correction: Fig. Drive Timing Chart for All pixel mode,
Pixel Array Image Drawing in Horizontal /Vertical 2/2-line binning
mode
65 Correction: 3091h [1] -> [0]
76 - 78 Correction: bit length SYS_MODE, INCKSEL4, INCKSEL5
87 Correction: Peripheral Circuit;
Pin D11(VRLT) Capacitor value 10uF -> 4.7uF
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Date of
Ver. Page Contain of Change
change
2019 / 02 / 18 0.3 1 Correction: Description, 8.42 M effective pixels -> 8.46 M
1 Update: Readout rate, CDS/PGA function TBD
15 Update: Current Consumption
24 Correction: Color Coding Diagram; added scan direction
27 Correction: Register Communication Timing, description
37 Update: SYS_MODE 2376Mbps TBD
39 Correction: PIX_VWIDTH Description
40, 66 Update: GAIN_PGC_0 TBD
43 - 46 Added: Register address
3081h, 32D4h, 32ECh, 3452h, 3453h, 3732h, 3742h, 3862h, 3A42h,
3B98h, 3B99h, 3B9Bh, 3B9Ch, 3B9Dh, 3B9Eh, 3BA1h - 3BA9h,
3BACh - 3BB8h, 3BBAh, 3BBCh, 3BBEh, 3BC0h, 3BC2h, 3BC4h,
3BC8h, 3BCAh
48 Update: Data rate 2376Mbps/Lane TBD
50 Correction: MDBIT address
55 Correction: Fig. Pixel Array Image Drawing in All pixel mode; added
read out direction,
Fig. Drive Timing Chart; inverted operation
60 Correction: Fig. Drive Timing Chart for Horizontal /Vertical 2/2-line
binning mode; added read out direction,
Fig. Drive Timing Chart; 1 XHS/Line -> 2 XHS/Line, inverted
operation
62 Correction: Restriction on Window cropping mode, added VTTL
63, 86, 87 Update: After standby mode, Time TBD
66 Correction: Fig. GAIN Reflection Timing, GAIN -> GAIN_PCG_0
69 Correction: Formula Integration time, added Toffset
71 Update: the maximum of long time exposure TBD
75 Correction: Fig. Relationship between Pin Name and MIPI Output
Lane, DCKM -> DCKN
80 Correction: Resister Hold Setting
83 Update: TSYNC TBD
95 Update: Notes On Handling; added 5. (6)
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Date of
Ver. Page Contain of Change
change
2019 / 03 / 28 0.4 1 Correction: Maximum frame rate, 12bit 60 frame/s -> 60.3, 10bit 90 ->
90.9
1 Update: List analog and digital gain respectively
15 Update: Current Consumption
19 Correction: Standard mode, Fast mode -> Standard-mode,
20 Fast-mode ; Fast mode + -> Fast-mode Plus
22 Update: Spectral Sensitivity Characteristics (TBD)
23 Update: Image Sensor Characteristics from TBD
25 Update: Measurement Method 2. 3. 4. from TBD
25 Correction: Measurement Method 3.
measure the average values -> measure the minimum values
39 Correction: register 3081h Set to “02h” -> Fixed to “00h”
48, 49 Update: updated to expression of maximum frame rate
53 Added: frame rate formula
54, 55, 57, Added: 3500h to 3BFFh -> 3200h to 3BFFh
59
63 Correction: 1H period description at Window cropping mode
73 Correction: Integration time, added Toffset
77 Correction: Output Signal Range
Deleted “but output is not performed over the full range,”
78 Added: the initial deskew burst
90 Update: Spot Pixel Specifications from TBD
91 Update: Example of Annual Number of Occurrence from TBD
92 Correction: Measurement Method for Spot Pixels
Incorrect form corrected
Update: Measurement Method for Spot Pixels from TBD mV
2019 / 05 / 21 E19504 ─ First Edition (Official Edition)
7 Update: Optical Center tolerance from TBD
22 Update: Spectral Sensitivity Characteristics from TBD
24 Correction: Measurement Condition 2. Sentence reconsidered
27 Correction: Description and figure of “communication prohibited
period”
62 Correction: Description and figure of inverted mode
63 Correction: 1farame -> 1frame
64 Correction: a normal image is output from the 8 frames -> 9 frames
67 Added: Gain graph
94 Update: Marking from TBD
97 Update: Package Outline from TBD
101