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    C10200 (Cu-OF) : ) Incl. Ag

    Uploaded by

    Josue Crespo Gonzalez
    This technical datasheet provides information on oxygen-free high conductivity copper (Cu-OF). Some key points: - Cu-OF offers the advantages of both electrolytic tough pitch copper (ETP) and phosphor deoxidized copper, with a minimum of 99.95% copper and maximum of 10 ppm oxygen. - It has high electrical conductivity of 100% IACS and is not susceptible to hydrogen embrittlement due to the absence of oxides. - Cu-OF can withstand extra deep drawing and severe forming compared to Cu-ETP due to the absence of oxides.

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    C10200 (Cu-OF) : ) Incl. Ag

    Uploaded by

    Josue Crespo Gonzalez
    42 views2 pages
    This technical datasheet provides information on oxygen-free high conductivity copper (Cu-OF). Some key points: - Cu-OF offers the advantages of both electrolytic tough pitch copper (ETP) and phosphor deoxidized copper, with a minimum of 99.95% copper and maximum of 10 ppm oxygen. - It has high electrical conductivity of 100% IACS and is not susceptible to hydrogen embrittlement due to the absence of oxides. - Cu-OF can withstand extra deep drawing and severe forming compared to Cu-ETP due to the absence of oxides.

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    c10200-cu-of-us

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    This technical datasheet provides information on oxygen-free high conductivity copper (Cu-OF). Some key points: - Cu-OF offers the advantages of both electrolytic tough pitch copper (ETP) and phosphor deoxidized copper, with a minimum of 99.95% copper and maximum of 10 ppm oxygen. - It has high electrical conductivity of 100% IACS and is not susceptible to hydrogen embrittlement due to the absence of oxides. - Cu-OF can withstand extra deep drawing and severe forming compared to Cu-ETP due to the absence of oxides.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    42 views2 pages

    C10200 (Cu-OF) : ) Incl. Ag

    Uploaded by

    Josue Crespo Gonzalez
    This technical datasheet provides information on oxygen-free high conductivity copper (Cu-OF). Some key points: - Cu-OF offers the advantages of both electrolytic tough pitch copper (ETP) and phosphor deoxidized copper, with a minimum of 99.95% copper and maximum of 10 ppm oxygen. - It has high electrical conductivity of 100% IACS and is not susceptible to hydrogen embrittlement due to the absence of oxides. - Cu-OF can withstand extra deep drawing and severe forming compared to Cu-ETP due to the absence of oxides.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    Technical Datasheet C10200

    C10200 (Cu-OF) 18 08 US

    Comparable standards: UNS C10200 ● EN CW008A ● JIS C1020


    Aurubis designations: C102

    Description Oxygen-Free, High Conductivity Copper Cu-OF (99.95 % minimum Cu) offers the
    advantages of both Electrolytic Tough Pitch Copper (ETP) and Phosphor deoxidized Copper.
    The high purity and absence of deoxidizers accounts for electrical conductivity of 100 %
    IACS as well as no susceptibility for hydrogen embrittlement. Due to the absence of oxides in
    the structure, Cu-OF is capable of withstanding extra deep drawing and severe forming and
    is superior to Cu-ETP in this respect. Cu-OFE is favoured for very critical electrical, electronic
    and communication applications.

    Composition Cu* O2

    [%] (ppm)
    99.95 min 10 max
    *) Incl. Ag

    Physical Melting Density Specific Electrical Thermal Mod. of Coef. of


    properties point heat cap. cond. cond. at elasticity therm exp.
    at 20°C 20°C at 20°C
    [10-6/°F]
    [°F] [lb/in³] [Btu/lb°F] [%IACS] [Btu/ft h °F] x1000 ksi [10-6/K]
    [°C] [g/cm³] [kJ/kgK] [MS/m] [W/mK] [GPa]
    1981 0.323 0.092 100 226 17 9.8
    1083 8.90 0.394 58 391 117 17.6

    The specified conductivity applies to the soft condition only

    Mechanical Tensile Yield Elon- Hard-ness min bend min. bend


    properties strength strength gation 2” ratio ratio
    Rm Rp0.2 nominal 90° 180°
    nominal nominal HR30T
    [ksi] [ksi] HV GW BW GW BW
    [MPa] [MPa] [%]
    26-38 10
    Soft 35 0.0 0.0 0.0 0.0
    179-262 69
    37-46 37 50
    H02 (1/2H) 20 0.0 0.5 0.0 1.0
    255-317 255 90
    43-52 45 58
    H04 (H) 8 1.0 2.0 2.0 3.0
    297-359 310 100
    47-56 50 60
    H06 (EH) 3 2.0 3.0 2.5
    324-386 349 105
    50-58 52 63
    H08 (SH) 3 3.0 4.0
    345-400 359 110
    52 min 54 61 min
    H10 (ES) 2
    359 min 373 112 min

    Other tempers are available upon request.


    GW bend axis transverse to rolling direction. BW bend axis parallel to rolling direction

    This leaflet is for general information only. No claims can be derived from it unless there is evidence of intent or gross negligence. The data given are no
    warranty that the product is of a specified quality and they cannot replace expert advice or the customer’s own test.
    Aurubis.com
    Technical Datasheet C10200

    Fabrication Electrical and thermal conductivity superior


    properties Corrosion resistance excellent
    Resistance to hydrogen embrittlement good
    Cold formability good

    Typical uses Telecommunication cables, electrical and electronic conductors, contacts and terminals,
    printed circuits, carrier tapes, flexible circuits, terminal lugs

    Applicable ASTM B152, ASME SB152


    specifications

    This leaflet is for general information only. No claims can be derived from it unless there is evidence of intent or gross negligence. The data given are no
    warranty that the product is of a specified quality and they cannot replace expert advice or the customer’s own test.
    Aurubis.com

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