CH Camera Module Ov7670 User Manual: Step 1: General Description
CH Camera Module Ov7670 User Manual: Step 1: General Description
CH Camera Module Ov7670 User Manual: Step 1: General Description
User Manual
Introduction:
Here we introduced OV7670 camera module , including the communication of camera module and
Arduino UNO, the using ways to take photo via camera module, and so on. This is an Arduino camera
module, adopted the Surveillance cameras digital image processing chip-OV0706, specially designed for
image acquisition and processing application, based on TTL communication interface, very convenient to
connect with Arduino controller, able to read image and data via UART serial port, and then perform some
image processing.
Hardware
SD Module
Arduino Uno
Jumper Wire
USB cable
OV7670 camera module
Software
Camera_VC0706_TEST
Arduino IDE(download it from official website)
Step 3: Hardware connection
TM
OV7670 CMOS VGA (640x480) C AMERACHIP with OmniPixel ® Technology
Product Package F1 F2 F3 F4 F5
Buffer Buffer
Test
Pattern
Generator
G
DSP Image Video
Analog FIFO
(Lens shading Scaler Port
Processing A/D correction, D[7:0]
de-noise, white/
R black pixel
50/60 Hz correction, auto
white balance,
Auto etc.)
B Detect
Image Array
(656 x 488)
Registers
SCCB
Clock Video Timing Generator
Interface
Exposure/Gain
Control
The OV7670/OV7171 sensor has an image array of The Test Pattern Generator features the following:
656 x 488 pixels for a total of 320,128 pixels, of which • 8-bar color bar pattern
640 x 480 pixels are active (307,200 pixels). Figure 3 • Fade-to-gray color bar pattern
shows a cross-section of the image sensor array.
• Shift "1" in output pin
Figure 3 Image Sensor Array
Microlens
Glass
Digital Signal Processor (DSP)
Pin Description
C1 DVDD Power Power supply (+1.8 VDC) for digital logic core
VDD-A 4.5 V
VDD-IO 4.5 V
NOTE: Exceeding the Absolute Maximum ratings shown above invalidates all AC and DC electrical specifications and may
result in permanent device damage.
tS:REG Settling time for register change (10 frames required) 300 ms
SCCB Timing (see Figure 4)
tF t HIGH tR
tLOW
SIO_C
t HD:STA t HD:DAT t SU:DAT
tSU:STA tSU:STO
SIO_D
IN
t BUF
tAA t DH
SIO_D
OUT
tPCLK
PCLK
t PHL tPHL
tSU
t HD
tPDV
510 x tLINE
VSYNC
480 x tLINE
3 x tLINE 17 tLINE
tLINE = 784 tP 10 tLINE
144 tP
HREF
640 tP
80 tP 45 tP 19 tP
HSYNC
P0 - P639
Row 0 Row 1 Row 2 Row 479
NOTE:
For Raw data, tP = tPCLK
For YUV/RGB, tP = 2 x tPCLK
Timing Specifications
VGA HREF
(see Figure 7,
VGA Frame Timing)
QVGA HREF
VGA HREF
(see Figure 7,
VGA Frame Timing)
QQVGA HREF
(1 from 4,
120 from 480)
VGA HREF
(see Figure 7,
VGA Frame Timing)
CIF HREF
(3 from 5)
QVGA HREF
(see Figure 7,
QVGA Frame Timing)
QCIF HREF
(3 from 5)
Figure 11 RGB 565 Output Timing Diagram
tPCLK
PCLK
t PHL tPHL
tSU
t HD
tPDV
tPCLK
PCLK
t PHL tPHL
tSU
t HD
tPDV
Register Set
Table 5 provides a list and description of the Device Control registers contained in the OV7670/OV7171. For all register
Enable/Disable bits, ENABLE = 1 and DISABLE = 0. The device slave addresses are 42 for write and 43 for read.
COM7[2] COM7[0]
YUV 0 0
RGB 1 0
Bayer RAW 0 1
Processed Bayer RAW 1 1
Common Control 8
Bit[7]: Enable fast AGC/AEC algorithm
Bit[6]: AEC - Step size limit
0: Step size is limited to vertical blank
1: Unlimited step size
Bit[5]: Banding filter ON/OFF - In order to turn ON the banding
filter, BD50ST (0x9D) or BD60ST (0x9E) must be set to a
13 COM8 8F RW non-zero value.
0: ON
1: OFF
Bit[4:3]: Reserved
Bit[2]: AGC Enable
Bit[1]: AWB Enable
Bit[0]: AEC Enable
Table 5 Device Control Register List (Continued)
Package Specifications
The OV7670/OV7171 uses a 24-ball Chip Scale Package 2 (CSP2). Refer to Figure 13 for package information, Table 6 for
package dimensions and Figure 14 for the array center on the chip.
Note: For OVT devices that are lead-free, all part marking letters are
lower case. Underlining the last digit of the lot number indicates CSP2 is
used.
A
S1 J1
1 2 3 4 5 S2 5 4 3 2 1
A A
B B
J2
B C C
wxyz
D D abcd
E E
F F
Glass
Die Part Marking Code:
w - OVT Product Version
C3 x - Year the part is assembled
C2 C y - Month the part is assembled
z - Wafer number
abcd - Last four digits of lot number
C1 Side View
A1 A2 A3 A4 A5
1756.8 µm
Sensor
Array
Array Center
(201.8 µm, 486.38 µm)
OV7670/OV7171
TOP VIEW
2. As most optical assemblies invert and mirror the image, the chip is typically mounted
with pins A1 to A5 oriented down on the PCB.
Package Specifications
Note: For OVT devices that are lead-free, all part marking letters are
lower case
260.0
240.0
220.0
200.0
180.0
Temperature (∞C )
160.0
140.0
120.0
100.0
80.0
60.0
40.0
20.0
0.0 0.6 1.1 1.6 2.2 2.8 3.3 3.9
0.0
-22 -2 18 38 58 78 98 118 138 158 178 198 218 238 258 278 298 318 338 358 369
Time (sec)
-0.3 -0.1 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9
Time (min.)
Condition Exposure
Average Ramp-up Rate (30°C to 217°C) Less than 3°C per second
> 100°C Between 330 - 600 seconds
> 150°C At least 210 seconds
> 217°C At least 30 seconds (30 ~ 120 seconds)
Peak Temperature 245°C
Cool-down Rate (Peak to 50°C) Less than 6°C per second
Time from 30°C to 255°C No greater than 390 seconds
How to open Software:
- Enter to http://www.ekt2.com/products/productdetails?ProductId=8219DE97-AE76-4B3B-A46F-
174A4AE4B88C