Scribd Logo
Upload

Welcome to Scribd!

  • 28 views

    C1990-EH（HC）ver 1 0英文

    Uploaded by

    顏健軒
    This document introduces the high conductivity titanium copper alloy C1990-EH(HC) developed by JX Nippon Mining & Metals Co. C1990-EH(HC) has electrical conductivity and strength similar to beryllium copper but better stress relaxation resistance at high temperatures. It also avoids inclusion of toxic elements. The alloy has applications in electronic components like switches and connectors requiring long-term maintenance of contact force.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    C1990-EH（HC）ver 1 0英文

    Uploaded by

    顏健軒
    28 views6 pages
    This document introduces the high conductivity titanium copper alloy C1990-EH(HC) developed by JX Nippon Mining & Metals Co. C1990-EH(HC) has electrical conductivity and strength similar to beryllium copper but better stress relaxation resistance at high temperatures. It also avoids inclusion of toxic elements. The alloy has applications in electronic components like switches and connectors requiring long-term maintenance of contact force.

    Original Title

    C1990-EH（HC）ver.1.0英文

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    This document introduces the high conductivity titanium copper alloy C1990-EH(HC) developed by JX Nippon Mining & Metals Co. C1990-EH(HC) has electrical conductivity and strength similar to beryllium copper but better stress relaxation resistance at high temperatures. It also avoids inclusion of toxic elements. The alloy has applications in electronic components like switches and connectors requiring long-term maintenance of contact force.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    28 views6 pages

    C1990-EH（HC）ver 1 0英文

    Uploaded by

    顏健軒
    This document introduces the high conductivity titanium copper alloy C1990-EH(HC) developed by JX Nippon Mining & Metals Co. C1990-EH(HC) has electrical conductivity and strength similar to beryllium copper but better stress relaxation resistance at high temperatures. It also avoids inclusion of toxic elements. The alloy has applications in electronic components like switches and connectors requiring long-term maintenance of contact force.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    You are on page 1of 6

    Hi-Performance Alloy Series

    Technical Data

    High Conductivity 3%-Titanium Copper

    C1990-EH(HC)

    JX Nippon Mining & Metals Co.,Ltd.


    1. Introduction
    JX Nippon Mining & Metals has been supplying numbers of copper alloys. Recently, NMM has
    developed new series of copper alloys, which were named Hi-Performance Alloy Series.
    On this brochure, High conductivity Titanium Copper Alloy (C1990-EH(HC)) in the series is
    introduced.
    C1990-EH(HC) has same strength, electrical conductivity and bend formability as mill-hardened
    beryllium copper(C1720-HM) and it has good stress relaxation resistance. You will be satisfied, we
    are sure, to find excellent characteristics of C1990-EH(HC) for electronic materials such as switches,
    connectors, relays etc.
    ＊This data included are nominal numbers.

    2. Features
    （１） C1990-EH(HC) has almost as same yield strength, electrical conductivity and bend formability
    as C1720-HM.
    （２） C1990-EH(HC) has better stress relaxation resistance than C1720-HM.
    （３） Same chemical composition as conventional titanium copper means easy scrap control and
    including no poison elements.

    3. Chemical Composition

    Table 1. Typical chemical composition of C1990-EH(HC) （wt%）


    Ti Cu + Ti
    Typical 2.9 ~ 3.5 ≧99.5

    4. Physical Properties

    Table 2. Physical Properties of C1990-EH(HC)


    Electric Conductivity 20 %IACS（＠20℃）
    Specific Resistance 86 nΩ・m （＠20℃）
    Thermal Conductivity 84 W/mK
    Thermal Expansion Coefficient 18.6 ×10−6 /K（20 to 450℃）
    Young’s Modulus 127 GPa
    Density 8.70 g/cm3

    −2−
    5. Mechanical Properties

    Table 3. Mechanical Properties of C1990-EH(HC)


    0.2% offset
    TensileStrength Elongation Vickers
    Temper Yield Strength
    (MPa) (%) hardness
    (MPa)
    EH(HC) 950 900 2.0 300

    6. Bend Formability
    “W” shaped bending test was performed to evaluate bend formability. The minimum bend radius
    (MBR) without surface crack is determined. Table 4 shows MBR/t value, while Fig. 1 shows outside
    surface and cross section.

    Table 4. Minimum Bend Radius (MBR) of C1990-EH(HC)


    MBR/t
    Temper good way bad way
    EH(HC) 0 0
    ＊ MBR/t value of C1990-EH(HC) is bending test result of 0.1mm thickness.

    Good way Bad way


    appearance
    Surface

    200 µm
    Cross section

    100 µm

    C1990-EH(HC), Specimen size ： 0.1mmt×10mmw, R/t=0


    90° “W” shaped bending test (According to JIS-H-3130)
    Fig. 1 Surface appearance and cross section of “W” shaped bending test specimen

    −3−
    7. Stress Relaxation Resistance
    For connector system application, it becomes very important to maintain contact force over long
    period at elevated temperature. Fig.2 shows data of stress relaxation test to evaluate materials’ such
    ability(heating temperature:150℃). It is apparent that C1990-EH(HC) gives much better stress
    relaxation resistance than C1720-HM.

    100

    95
    Stress Remaining (%)

    90

    85 C1990-EH(HC)

    C1720-HM
    80

    Applied stress = 80% of 0.2% yield strength


    75
    1 10 100 1000
    Time (hours)

    Fig.2 Stress relaxation of C1990-EH(HC) at 150℃

    −4−
    8. Stress-Strain Curve
    Fig. 3 shows stress-strain curves of C1990-EH(HC).

    1200

    1000
    Nominal Stress (MPa)

    800

    600

    400

    200

    0
    0.00 0.01 0.02 0.03 0.04 0.05
    Nominal Strain (ΔL/L 0 )

    S-S curve (Longitudinal Direction)

    1200
    Nominal Stress (MPa)

    1000

    800

    600
    400

    200

    0
    0.00 0.01 0.02 0.03 0.04 0.05 0.06
    Nominal Strain (∆L/L0 )

    S-S curve (Transverse Direction)

    Tensile test (according to JIS-Z-2241)


    Specimen : JIS-Z-2201#13B tensile test specimen

    Fig. 3 Stress-Strain Curves of C1990-EH(HC)

    −5−
    ＜Further Information＞

    JX Nippon Mining & Metals Corporation


    Electronic Materials Group
    Functional Material Division
    Rolled & Fabricated Products Dept.
    6-3, Otemachi 2-chome, Chiyoda-ku, Tokyo 100-8164 JAPAN
    Phone : +81-03-5299-7253
    Fax : +81-03-5299-7356

    Ver.1.0

    −6−

    You might also like