SM15TxxA, SM15TxxCA

Datasheet

1500 W TVS in SMC

Features
• Peak pulse power:
– 1500 W (10/1000 μs)
– up to 10 kW (8/20 μs)
• Stand-off voltage range from 5 V to 188 V
• Unidirectional and bidirectional types
• Low leakage current: 0.2 µA at 25 °C
• Operating Tj max: 150 °C
• High power capability at Tj max.: up to 1250 W (10/1000 µs)
• Lead finishing: matte tin plating

Complies with the following standards

• UL94, V0
• J-STD-020 MSL level 1
• J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
• JESD-201 class 2 whisker test
• IPC7531 footprint and JEDEC registered package outline
Product status link • UL 497B file number: QVGQ2.E136224
SM15T6V8A , SM15T6V8CA , • IEC 61000-4-4 level 4:
SM15T7V5A , SM15T7V5CA ,
– 4kV
SM15T10A , SM15T10CA ,
SM15T12A , SM15T12CA , • IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4:
SM15T15A , SM15T15CA , – 30 kV (air discharge)
SM15T18A , SM15T18CA ,
SM15T22A , SM15T22CA , – 30 kV (contact discharge)
SM15T24A , SM15T24CA ,
SM15T27A , SM15T27CA ,
SM15T SM15T30A , SM15T30CA ,
Description
SM15T33A , SM15T33CA ,
SM15T36A , SM15T36CA , The SM15T TVS series is designed to protect sensitive equipment against
SM15T39A , SM15T39CA , electrostatic discharges according to IEC 61000-4-2, MIL STD 883 Method 3015,
SM15T68A , SM15T68CA , and electrical overstress such as IEC 61000-4-4 and 5. They are used for surges
SM15T75A , SM15T75CA , below 1500 W 10/1000 μs.
SM15T100A , SM15T100CA ,
SM15T150A , SM15T150CA , This planar technology makes it compatible with high-end equipment and SMPS
SM15T200A , SM15T200CA , where low leakage current and high junction temperature are required to provide
SM15T220A , SM15T220CA reliability and stability over time.

DS0683 - Rev 8 - May 2022 www.st.com

For further information contact your local STMicroelectronics sales office.
 SM15TxxA, SM15TxxCA
Characteristics

1 Characteristics

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

IEC 61000-4-2 (C = 150 pF, R = 330 Ω)

VPP Peak pulse voltage Contact discharge 30 kV
Air discharge 30
PPP Peak pulse power dissipation Tj initial = Tamb 1500 W

Tstg Storage temperature range -65 to +150 °C

Tj Operating junction temperature range -55 to +150 °C

TL Maximum lead temperature for soldering during 10 s 260 °C

Figure 1. Electrical characteristics - parameter definitions

Figure 2. Pulse definition for electrical characteristics

DS0683 - Rev 8 page 2/12

 SM15TxxA, SM15TxxCA
Characteristics

Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)

10 / 1000 µs 8 / 20µs
IRM max at VRM VBR at IBR (1) αT
VCL(2)(3) IPP(4) RD VCL(2)(3) IPP(4) RD
Type
25 °C 85 °C Min. Typ. Max. Max. Max. Max. Max. Max.

µA µA V V mA V A Ω V A Ω 10-4/°C

SM15T6V8A/CA 500 2000 5.8 6.45 6.8 7.14 10 10.5 143 0.023 13.4 746 0.008 5.7
SM15T7V5A/CA 250 1000 6.4 7.13 7.5 7.88 10 11.3 132 0.026 14.5 690 0.010 6.1
SM15T10A/CA 10 50 8.55 9.5 10 10.5 1 14.5 103 0.039 18.6 538 0.015 7.3
SM15T12A/CA 0.2 1 10.2 11.4 12 12.6 1 16.7 90 0.046 21.7 461 0.020 7.8
SM15T15A/CA 0.2 1 12.8 14.3 15 15.8 1 21.2 71 0.076 27.2 368 0.031 8.4
SM15T18A/CA 0.2 1 15.3 17.1 18 18.9 1 25.2 59.5 0.106 32.5 308 0.044 8.8
SM15T22A/CA 0.2 1 18.8 20.9 22 23.1 1 30.6 49 0.153 39.3 254 0.064 9.2
SM15T24A/CA 0.2 1 20.5 22.8 24 25.2 1 33.2 45 0.178 42.8 234 0.075 9.4
SM15T27A/CA 0.2 1 23.1 25.7 27 28.4 1 37.5 40 0.228 48.3 207 0.096 9.6
SM15T30A/CA 0.2 1 25.6 28.5 30 31.5 1 41.5 36 0.278 53.5 187 0.12 9.7
SM15T33A/CA 0.2 1 28.2 31.4 33 34.7 1 45.7 33 0.333 59.0 169 0.14 9.8
SM15T36A/CA 0.2 1 30.8 34.2 36 37.8 1 49.9 30 0.403 64.3 156 0.17 9.9
SM15T39A/CA 0.2 1 33.3 37.1 39 41.0 1 53.9 28 0.461 69.7 143 0.20 10.0
SM15T68A/CA 0.2 1 58.1 64.6 68 71.4 1 92 16.3 1.26 121 83 0.60 10.4
SM15T75A/CA 0.2 1 64.1 71.3 75 78.8 1 103 14.6 1.66 134 75 0.74 10.5
SM15T100A/CA 0.2 1 85.5 95.0 100 105 1 137 11 2.91 178 56 1.30 10.6
SM15T150A/CA 0.2 1 128 143 150 158 1 207 7.2 6.81 265 38 2.82 10.8
SM15T200A/CA 0.2 1 171 190 200 210 1 274 5.5 11.6 353 28 5.11 10.8
SM15T220A/CA 0.2 1 188 209 220 231 1 328 4.6 21.1 388 26 6.04 10.8

1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25))

2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCL max versus IPPappli: VCLmax = VCL - RD x (IPP - IPPappli) where IPP appli is the surge current in the application
4. Surge capability given for both directions for unidirectional (A type) and bidirectional (CA type) devices

DS0683 - Rev 8 page 3/12

 SM15TxxA, SM15TxxCA
Characteristics (curves)

1.1 Characteristics (curves)

Figure 3. Maximum peak power dissipation versus initial Figure 4. Maximum peak pulse power versus exponential
junction temperature pulse duration

Ppp (W) PPP (W)

2000 100000
10/1000 µs Tj initial = 25 °C

1500

10000

1000

1000

500

Tj (°C) tp (ms)
0 100
0 25 50 75 100 125 150 175 0.001 0.01 0.1 1 10 100

Figure 5. Maximum peak pulse current versus clamping

Figure 6. Dynamic resistance versus pulse duration
voltage
RD (Ω)
IPP (A) 1000
10000
A
A/C
8/20 µs 220
15T
100 SM
10/1000 µs
1000 A/ CA
100
15T
SM
10

100
A/CA
5T30
1 SM1
/CA
T15A
10 SM15
0,1
SM15T6V8A/CA

SM15T220A/CA

A
SM15T100A/CA

6V8A/C
SM15T30A/CA
SM15T15A/CA

SM15T
1 0,01

tp (ms)
VCL (V) 0,001
0,1 0,01 0,1 1 10 100
1 10 100 1000

Figure 7. Junction capacitance versus reverse applied Figure 8. Junction capacitance versus applied voltage
voltage (unidirectional type) (bidirectional type)
C (nF) C (nF)
10 10
f=1MHz f=1MHz
Vosc =30mVRMS Vosc =30mVRMS
SM15T6V8A Tj=25°C Tj=25°C
SM15T6V8CA

SM15T15A
SM15T15CA
1 1

SM15T30A SM15T30CA

SM15T100CA
SM15T100A
0,1 0,1

SM15T220CA
SM15T220A

VR (V) VR (V)
0,01 0,01
1 10 100 1000 1 10 100 1000

DS0683 - Rev 8 page 4/12

 SM15TxxA, SM15TxxCA
Characteristics (curves)

Figure 10. Peak forward voltage drop versus peak forward

Figure 9. Leakage current versus junction temperature
current
IR (nA)
IF (A)
100000 100

VR = VRM single pulse

10000 VRM < 10 V

10
Tj=125 °C
1000

Tj=25 °C
100 VRM ≥ 10 V

10

T j (°C) VF (V)
1
25 50 75 100 125 150 175 0,1
0 0,5 1 1,5 2 2,5 3

Figure 11. Thermal impedance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus
pulse duration copper area under each lead
Zth(j-a) (°C/W) Rth(j-a) (°C/W)
1000 120
Single pulse on recommended footprint. Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness Epoxy printed circuit board FR4, 70 µm Cu thickness
100

100 80

60

10
40

20

tp (s)
1 SCu (cm²)
0.1 1 10 100 1000 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

DS0683 - Rev 8 page 5/12

 SM15TxxA, SM15TxxCA
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 SMC package information

Figure 13. SMC package outline

E1

A1

C A2

E2 L b

Table 3. SMC package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008
b 2.90 3.20 0.114 0.126
c 0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.060

DS0683 - Rev 8 page 6/12

 SM15TxxA, SM15TxxCA
SMC package information

Figure 14. Footprint recommendation Figure 15. Marking layout

1.54 5.11 1.54

(0.061) (0.201) (0.061)

3.14
(0.124)

8.19
(0.323)
millimeters
(inches)

Figure 16. Package orientation in reel Figure 17. Tape and reel orientation

Figure 18. 13'' reel dimension values (mm) Figure 19. Inner box dimension values (mm)

DS0683 - Rev 8 page 7/12

 SM15TxxA, SM15TxxCA
SMC package information

Figure 20. Tape outline

Table 4. Tape dimension values

Dimensions

Ref. Millimeters

Min. Typ. Max.

D0 1.4 1.5 1.6

D1 1.5
F 7.4 7.5 7.6
K0 2.39 2.49 2.59
P0 3.9 4.0 4.1
P1 7.9 8.0 8.1
P2 1.9 2.0 2.1
W 15.7 16 16.3

DS0683 - Rev 8 page 8/12

 SM15TxxA, SM15TxxCA
Reflow profile

2.2 Reflow profile

Figure 21. ST ECOPACK recommended soldering reflow profile for PCB mounting

Temperature (°C) 240-245 °C

250 -2 °C/s
2 - 3 °C/s

200 60 sec
(90 max) -3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)

0 30 60 90 120 150 180 210 240 270 300

Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.

DS0683 - Rev 8 page 9/12

 SM15TxxA, SM15TxxCA
Ordering information

3 Ordering information

Table 5. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

SM15TxxA/CA-TR(1) See Table 6. Marking SMC 0.25 g 2500 Tape and reel

1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version.

Table 6. Marking

Order code Marking Order code Marking

SM15T6V8A MDE SM15T6V8CA BDE

SM15T7V5A MDG SM15T7V5CA BDG
SM15T10A MDP SM15T10CA BDP
SM15T12A MDT SM15T12CA BDT
SM15T15A MDX SM15T15CA BDX
SM15T18A MEE SM15T18CA BEE
SM15T22A MEK SM15T22CA BEK
SM15T24A MEM SM15T24CA BEM
SM15T27A MEP SM15T27CA BEP
SM15T30A MER SM15T30CA BER
SM15T33A MET SM15T33CA BET
SM15T36A MEV SM15T36CA BEV
SM15T39A MEX SM15T39CA BEX
SM15T68A MFP SM15T68CA BFP
SM15T75A MFO SM15T75CA BFO
SM15T100A MFX SM15T100CA BFX
SM15T150A MGK SM15T150CA BGK
SM15T200A MGV SM15T200CA BGV
SM15T220A MGX SM15T220CA BGX

DS0683 - Rev 8 page 10/12

 SM15TxxA, SM15TxxCA

Revision history
Table 7. Document revision history

Date Version Changes

September-2001 3B Last issue

19-Feb-2007 4 Peak pulse power Figure 4 on page 4 updated.
Updated ECOPACK statement. Added RD columns in Table 3. Updated
04-Feb-2009 5
characteristic curves, Figure 3 to Figure 11.
17-Sep-2009 6 Document updated for low leakage current.
Removed figure 12. Minor text changes to improve the readability of the
24-Apr-2020 7
document.
16-May-2022 8 Updated Figure 6, Figure 7, Figure 8 and Figure 9.

DS0683 - Rev 8 page 11/12

 SM15TxxA, SM15TxxCA

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