APW7142

3A, 12V, Synchronous-Rectified Buck Converter

Features General Description

• Wide Input Voltage from 4.3V to 14V The APW7142 is a 3A synchronous-rectified Buck con-
• Output Current up to 3A verter with integrated 70mΩ power MOSFETs. The
• Adjustable Output Voltage from 0.8V to VIN APW7142, designed with a current-mode control scheme,
- ±2% System Accuracy can convert wide input voltage of 4.3V to 14V to the output
voltage adjustable from 0.8V to VIN to provide excellent
• 70mΩ Integrated Power MOSFETs
output voltage regulation.
• High Efficiency up to 95%
For high efficiency over all load current range, the
- Automatic Skip/PWM Mode Operation
APW7142 is equipped with an automatic Skip/PWM mode
• Current-Mode Operation
operation. At light load, the IC operates in the Skip mode,
- Easy Feedback Compensation
which keeps a constant minimum inductor peak current,
- Stable with Low ESR Output Capacitors to reduce switching losses. At heavy load, the IC works in
- Fast Load/Line Transient Response PWM mode, which inductor peak current is programmed
• Power-On-Reset Monitoring by the COMP voltage, to provide high efficiency and excel-
• Fixed 500kHz Switching Frequency in PWM Mode lent output voltage regulation.
• Built-In Digital Soft-Start and Soft-Stop The APW7142 is also equipped with power-on-reset,
• Current-Limit Protection with Frequency Foldback soft-start, soft-stop, and whole protections (under-voltage,
• 123% Over-Voltage Protection over-voltage, over-temperature, and current-limit) into a
single package. In shutdown mode, the supply current
• Hiccup-Mode 50% Under-Voltage Protection
drops below 3µA.
• Over-Temperature Protection
This device, available in an 8-pin SOP-8 package, pro-
• <3µA Quiescent Current in Shutdown Mode
vides a very compact system solution with minimal exter-
• Small SOP-8 Package nal components and PCB area.
• Lead Free and Green Devices Available
(RoHS Compliant) 100
90

Applications 80
70
Efficiency (%)

60 VIN=5V, VOUT=3.3V, L1=2.2µF

• OLPC, UMPC
50
• Notebook Computer
40
• Handheld Portable Device VIN=12V, VOUT=5V, L1=6.8µF
30
• Step-Down Converters Requiring High Efficiency 20
VIN=12V, VOUT=3.3V, L1=4.7µF
and 3A Output Current
10
0
0.001 0.01 0.1 1 10
Output Current, IOUT(A)

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.

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Rev. A.5 - Mar., 2009
APW7142

Ordering and Marking Information

APW7142 Package Code
K : SOP-8
Assembly Material Operating Junction Temperature Range
Handling Code I : -40 to 85 oC
Handling Code
Temperature Range TR : Tape & Reel
Package Code Assembly Material
G : Halogen and Lead Free Device
APW7142
APW7142 K : XXXXX XXXXX - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).

Pin Configuration
APW7142
PGND 1 8 LX
VIN 2 7 LX
AGND 3 6 EN
FB 4 5 COMP
SOP-8
Top View

Absolute Maximum Ratings (Note 1)

Symbol Parameter Rating Unit
VIN VIN Supply Voltage (VIN to AGND) -0.3 ~ 15 V
> 100ns -1 ~ VIN+1
VLX LX to GND Voltage V
< 100ns - 5 ~ VIN+5
PGND to AGND Voltage -0.3 ~ +0.3 V
EN to AGND Voltage -0.3 ~ VIN+0.3 V
FB, COMP to AGND Voltage -0.3 ~ 6 V
PD Power Dissipation Internally Limited W
o
Maximum Junction Temperature 150 C
o
TSTG Storage Temperature -65 ~ 150 C
o
TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics
Symbol Parameter Typical Value Unit
Junction-to-Ambient Thermal Resistance in Free Air (Note 2)
θJA
o
80 C/W
SOP-8
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

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Rev. A.5 - Mar., 2009
APW7142

Recommended Operating Conditions (Note 3)

Symbol Parameter Range Unit
VIN VIN Supply Voltage 4.3 ~ 14 V
VOUT Converter Output Voltage 0.8 ~ VIN V
IOUT Converter Output Current 0~3 A
CIN Converter Input Capacitor (MLCC) 8 ~ 50 µF
Converter Output Capacitor 20 ~ 1000 µF
COUT
Effective Series Resistance 0 ~ 60 mΩ
LOUT Converter Output Inductor 1 ~ 22 µH
Resistance of the Feedback Resistor connected from FB to GND 1 ~ 20 kΩ
o
TA Ambient Temperature -40 ~ 85 C
o
TJ Junction Temperature -40 ~ 125 C

Note 3: Refer to the Typical Application Circuits

Electrical Characteristics
Refer to the typical application circuits. These specifications apply over VIN=12V, VOUT=3.3V and TA= -40 ~ 85°C, unless otherwise
specified. Typical values are at TA=25°C.

APW7142
Symbol Parameter Test Conditions Unit
Min. Typ. Max.
SUPPLY CURRENT
IVIN VIN Supply Current VFB = VREF +50mV, VEN=3V, LX=NC - 0.5 1.5 mA
IVIN_SD VIN Shutdown Supply Current VEN = 0V - - 3 µA
POWER-ON-RESET (POR) VOLTAGE THRESHOLD
VIN POR Voltage Threshold VIN rising 3.9 4.1 4.3 V
VIN POR Hysteresis - 0.5 - V
REFERENCE VOLTAGE
VREF Reference Voltage Regulated on FB pin - 0.8 - V
o
TJ = 25 C, IOUT=10mA, VIN=12V -1.0 - +1.0
Output Voltage Accuracy %
IOUT=10mA~3A, VIN=4.75~14V -2.0 - +2.0
Line Regulation VIN = 4.75V to 14V - +0.02 - %/V
Load Regulation IOUT = 0.5A ~ 3A - -0.04 - %/A
OSCILLATOR AND DUTY CYCLE
FOSC Oscillator Frequency TJ = -40 ~ 125oC, VIN = 4.75 ~ 14V 450 500 550 kHz
Foldback Frequency VOUT = 0V - 80 - kHz
Maximum Converter’s Duty - 99 - %
TON_MIN Minimum Pulse Width of LX - 150 - ns
CURRENT-MODE PWM CONVERTER
Gm Error Amplifier Transconductance VFB=VREF±50mV - 200 - µA/V
Error Amplifier DC Gain COMP = NC - 80 - dB

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Rev. A.5 - Mar., 2009
APW7142

Electrical Characteristics (Cont.)

Refer to the typical application circuits. These specifications apply over VIN=12V, VOUT=3.3V and TA= -40 ~ 85°C, unless otherwise
specified. Typical values are at TA=25°C.

APW7142
Symbol Parameter Test Conditions Unit
Min. Typ. Max.
CURRENT-MODE PWM CONVERTER (CONT.)
Current-Sense to COMP Voltage
- 0.048 - V/A
Transresistance
VIN = 5V, TJ=25°C - 90 110
High-side Switch Resistance mΩ
VIN = 12V, TJ=25°C - 70 90
VIN = 5V, TJ=25°C - 90 110
Low-side Switch Resistance mΩ
VIN = 12V, TJ=25°C - 70 90
PROTECTIONS
ILIM High-Side Switch Current-Limit Peak Current 4.0 5.5 7.0 A
VTH_UV FB Under-Voltage Threshold VFB falling 45 50 55 %
VTH_OV FB Over-Voltage Threshold VFB rising 118 123 128 %
FB Under-Voltage Debounce - 1 - µs
o
TOTP Over-Temperature Trip Point - 150 - C
o
Over-Temperature Hysteresis - 40 - C
TD Dead-Time VLX = -0.7V - 20 - ns
SOFT-START, SOFT-STOP, ENABLE AND INPUT CURRENTS
TSS Soft-Start / Soft-Stop Interval 1.5 2 2.5 ms
EN Shutdown Voltage Threshold VEN falling 0.5 - - V
EN Enable Voltage Threshold - - 2.1 V
High-Side Switch Leakage Current VEN = 0V, VLX = 0V - - 2 µA
IFB FB Pin Input Current -100 - +100 nA
IEN EN Pin Input Current VEN = 0V ~ VIN -100 - +100 nA

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Rev. A.5 - Mar., 2009
APW7142

Typical Operating Characteristics

(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)

Output Current vs. Efficiency Output Voltage vs. Output Current

100 3.4

90 3.38

Output Voltage, VOUT (V)

80 3.36
Efficiency (%)

70 3.34

60 3.32
VIN=5V, VOUT=3.3V, L1=2.2µF
50 3.3

40 3.28
VIN=12V, VOUT=5V, L1=6.8µF
30 3.26

20 3.24
VIN=12V, VOUT=3.3V, L1=4.7µF
10 3.22
0 3.2
0.001 0.01 0.1 1 10 0 1 2 3
Output Current, IOUT(A) Output Current, IOUT(A)

Current Limit Level (Peak Current)

vs. Junction Temperature Output Voltage vs. Supply Voltage
7 3.4
IOUT=500mA
3.38
Current Limit Level, ILIM(A)

Output Voltage, VOUT (V)

6.5 3.36

3.34

6 3.32
3.3

5.5 3.28

3.26

5 3.24
3.22

4.5 3.2
-40 -20 0 20 40 60 80 100 120 140 4 6 8 10 12 14
o
Junction Temperature, TJ ( C) Supply Voltage, VIN (V)

VIN Input Current vs. Supply Voltage Reference Voltage vs. Junction Temperature
2.0 0.816
VFB=0.85V
0.812
Reference Voltage, VREF (V)
VIN Input Current, I VIN(mA)

1.5 0.808

0.804

1.0 0.800

0.796

0.5 0.792

0.788

0.0 0.784
0 2 4 6 8 10 12 14 -50 -25 0 25 50 75 100 125 150

Supply Voltage, VIN (V) Junction Temperature, TJ (oC)

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Rev. A.5 - Mar., 2009
APW7142

Typical Operating Characteristics (Cont.)

(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)

Oscillator Frequency vs.

Junction Temperature
550
540
Oscillator Frequency, FOSC(kHz)

530
520
510

500

490
480
470
460

450
-50 -25 0 25 50 75 100 125 150
o
Junction Temperature, TJ ( C)

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Rev. A.5 - Mar., 2009
APW7142

Operating Waveforms
(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)

Power On Power Off

IOUT=3A IOUT=3A

VIN
VIN
1 1

VOUT VOUT
2 2

IL1 IL1
3 3

CH1 : VIN , 5V/div CH1 : VIN , 5V/div

CH2 : VOUT , 2V/div CH2 : VOUT , 2V/div
CH3 : IL1 , 2A/div CH3 : IL1 , 2A/div
Time : 1ms/div
Time : 10ms/div

Enable Shutdown

IOUT=3A IOUT=3A

VEN VEN
1 1

VOUT VOUT
2 2

IL1 IL1
3 3

CH1 : VEN , 5V/div CH1 : VEN , 5V/div

CH2 : VOUT , 2V/div CH2 : VOUT , 2V/div
CH3 : IL1 , 2A/div CH3 : IL1, 2A/div
Time : 1ms/div Time : 100µs/div

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Rev. A.5 - Mar., 2009
APW7142

Operating Waveforms (Cont.)

(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)

Short Circuit Short Circuit

IOUT =3~7A VOUT is shorted to GND by a short wire

VLx
1 VLX
1

VOUT
VOUT
2 2

IL1 IL1
3 3

CH1 : VLX , 10V/div CH1 : VLX , 5V/div

CH2 : VOUT , 2V/div CH2 : VOUT , 200mV/div
CH3 : IL1 , 5A/div CH3 : IL1 , 5A/div
Time : 20µs/div Time : 5ms/div

Load Transient Response Load Transient Response

IOUT= 50mA-> 3A ->50mA IOUT= 0.5A-> 3A ->0.5A

IOUT rising/falling time=10µs IOUT rising/falling time=10µs
VOUT VOUT
1 1

IL1 IL1

2 2

CH1 : VOUT , 200mV/div CH1 : VOUT , 100mV/div

CH2 : IL1 , 2A/div CH2 : IL1 , 2A/div
Time : 100µs/div Time : 100µs/div

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Rev. A.5 - Mar., 2009
APW7142

Operating Waveforms (Cont.)

(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)

Switching Waveform Switching Waveform

IOUT=0.2A VLX VLX

IOUT=3A

1 1
IL1

IL1
2 2

CH1 : VLX , 5V/div CH1 : VLX , 5V/div

CH2 : IL1 , 2A/div CH2 : IL1 , 2A/div
Time : 1µs/div Time : 1µs/div

Line Transient Over Voltage Protection

VIN rising/falling time=20µs VIN

VIN= 5~12V

VIN VOUT

1 1
VOUT VLX
2 2

IL1 3
IL1
4

3
IOUT=-1A

CH1 : VIN , 5V/div CH1 : VIN , 5V/div

CH2 : VOUT , 50mV/div (Voffset=3.3V) CH2 : VOUT , 2V/div
CH3 : IL1 , 2A/div CH3 : VLX , 5V/div
Time : 100µs/div CH4 : IL1 , 5A/div
Time : 20µs/div

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Rev. A.5 - Mar., 2009
APW7142

Pin Description
PIN
FUNCTION
NO. NAME
Power Ground of the APW7142, which is the source of the N-channel power MOSFET.
1 PGND
Connect this pin to system ground with lowest impedance.
Power Input. VIN supplies the power (4.3V to 14V) to the control circuitry, gate drivers
and step-down converter switches. Connecting a ceramic bypass capacitor and a
2 VIN
suitably large capacitor between VIN and both of AGND and PGND eliminates switching
noise and voltage ripple on the input to the IC.
3 AGND Ground of MOSFET Gate Drivers and Control Circuitry.
Output feedback Input. The APW7142 senses the feedback voltage via FB and
4 FB regulates the voltage at 0.8V. Connecting FB with a resistor-divider from the converter’s
output sets the output voltage from 0.8V to VIN.
Output of the error amplifier. Connect a series RC network from the COMP to the GND to
5 COMP compensate the regulation control loop. In some cases, an additional capacitor from the
COMP to the GND is required.
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn
6 EN
on the regulator, drive it low to turn it off. Connect this pin to the VIN if it is not used.
Power Switching Output. LX is the junction of the high-side and low-side power
7, 8 LX
MOSFETs to supply power to the output LC filter.

Block Diagram
VIN

Current Sense
Amplifier VIN
Power-On- Current
Reset Limit

Zero-Crossing
POR Comparator

UG
OVP
123%VREF Soft-Start /
Soft-Stop Gate
and Driver
50%VREF UVP Fault Logic
Soft-Start /
Soft-Stop Inhibit
Gate LX
FB Control VIN
Gm

VREF Error LG
Amplifier Current Gate
Compartor Driver
COMP PGND
Slope
Compensation

Oscillator AGND
EN Enable Over
500kHz
1.5V Temperature FB
Protection

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Rev. A.5 - Mar., 2009
APW7142

Typical Application Circuits

1. 4.3~14V Single Power Input Step-Down Converter (with a Ceramic Output Capacitor)

VIN

2 C1
VIN
L1
Enable
6
EN LX 8 VOUT
Shutdown U1 LX 7
APW7142
PGND 1 C2
5 COMP R1
R3 4 ±1%
FB
±5%

C3 AGND R2
±30% 3 ±1% C4
±30%, Optional

a. Cost-effective Feedback Compensation (C4 is not connected)

VIN(V) VOUT(V) L1(µH) C2(µF) C2 ESR(mΩ) R1(kΩ) R2(kΩ) R3(kΩ) C3(pF)
12 5 6.8 22 5 63.0 12 10.0 1500
12 5 6.8 44 3 63.0 12 20.0 1500

12 3.3 4.7 22 5 46.9 15 10.0 1500

12 3.3 4.7 44 3 46.9 15 22.0 1500

12 2 3.3 22 5 30.0 20 10.0 1500

12 2 3.3 44 3 30.0 20 20.0 1500
12 1.2 2.2 22 5 7.5 15 8.2 1800
12 1.2 2.2 44 3 7.5 15 16.0 1800

5 3.3 2.2 22 5 46.9 15 8.2 680

5 3.3 2.2 44 3 46.9 15 20.0 680

5 1.2 2.2 22 5 7.5 15 3.0 1800

5 1.2 2.2 44 3 7.5 15 7.5 1800

b. Fast-Transient-Response Feedback Compensation (C4 is connected)

VIN(V) VOUT(V) L1(µH) C2(µF) C2 ESR(mΩ) R1(kΩ) R2(kΩ) C4(pF) R3(kΩ) C3(pF)

12 5 6.8 22 5 63.0 12 47 33.0 470

12 5 6.8 44 3 63.0 12 47 68.0 470

12 3.3 4.7 22 5 46.9 15 47 22.0 680

12 3.3 4.7 44 3 46.9 15 47 47.0 680

12 2 3.3 22 5 30.0 20 47 13.0 1200

12 2 3.3 44 3 30.0 20 47 27.0 1200

12 1.2 2.2 22 5 7.5 15 150 7.5 2200

12 1.2 2.2 44 3 7.5 15 150 15.0 2200

5 3.3 2.2 22 5 46.9 15 56 20.0 220

5 3.3 2.2 44 3 46.9 15 56 43.0 220

5 1.2 2.2 22 5 7.5 15 330 3.3 1800

5 1.2 2.2 44 3 7.5 15 330 8.2 1500

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Rev. A.5 - Mar., 2009
APW7142

Typical Application Circuits (Cont.)

2. +12V Single Power Input Step-Down Converter (with an Electrolytic Output Capacitor)

VIN
C1 C5 12V
2
2.2µF 470µF
VIN
L1
Enable 4.7µH /3A VOUT
6 8 3.3V/3A
EN LX
Shutdown U1 LX 7
APW7142 C2
PGND 1 470µF
R1
5 COMP (ESR=30mΩ)
46.9K
R3 ±1%
FB 4
62K
±5%
R2
AGND
C3 15K
3 C4
680pF ±1%
±30% 47pF
±30%

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Rev. A.5 - Mar., 2009
APW7142

Function Description
VIN Power-On-Reset (POR)

The APW7142 keeps monitoring the voltage on VIN pin to The under-voltage threshold is 50% of the nominal out-
prevent wrong logic operations which may occur when put voltage. The under-voltage comparator has a built-in
VIN voltage is not high enough for the internal control 2µs noise filter to prevent the chips from wrong UVP shut-
circuitry to operate. The VIN POR has a rising threshold of down being caused by noise. The under-voltage protec-
4.1V (typical) with 0.5V of hysteresis. tion works in a hiccup mode without latched shutdown.
During startup, the VIN voltage must exceed the enable The IC will initiate a new soft-start process at the end of
voltage threshold. Then, the IC starts a start-up process the preceding delay.
and ramps up the output voltage to the voltage target.
Over-Voltage Protection (OVP)
Digital Soft-Start The over-voltage function monitors the output voltage by
The APW7142 has a built-in digital soft-start to control the FB pin. When the FB voltage increases over 123% of the
rise rate of the output voltage and limit the input current reference voltage due to the high-side MOSFET failure or
surge during start-up. During soft-start, an internal volt- for other reasons, the over-voltage protection comparator
age ramp (VRAMP), connected to one of the positive inputs will force the low-side MOSFET gate driver high. This ac-
of the error amplifier, rises up from 0V to 0.95V to replace tion actively pulls down the output voltage and eventually
the reference voltage (0.8V) until the voltage ramp reaches attempts to blow the internal bonding wires. As soon as
the reference voltage. the output voltage is within regulation, the OVP compara-
During soft-start without output over-voltage, the APW7142 tor is disengaged. The chip will restore its normal
converter’s sinking capability is disabled until the output operation. This OVP scheme only clamps the voltage
voltage reaches the voltage target. overshoot, and does not invert the output voltage when
otherwise activated with a continuously high output from
Digital Soft-Stop
low-side MOSFET driver - a common problem for OVP
At the moment of shutdown controlled by EN signal, un- schemes with a latch.
der-voltage event or over-temperature protection, the
Over-Temperature Protection (OTP)
APW7142 initiates a digital soft-stop process to discharge
the output voltage in the output capacitors. Certainly, the The over-temperature circuit limits the junction tempera-
load current also discharges the output voltage. ture of the APW7142. When the junction temperature ex-
During soft-stop, the internal voltage ramp (VRAMP) falls ceeds TJ = +150oC, a thermal sensor turns off the both
down rises from 0.95V to 0V to replace the reference power MOSFETs, allowing the devices to cool. The ther-
voltage. Therefore, the output voltage falls down slowly at mal sensor allows the converters to start a start-up pro-
the light load. After the soft-stop interval elapses, the soft- cess and to regulate the output voltage again after the
stop process ends and the the IC turns on the low-side junction temperature cools by 40oC. The OTP is designed
power MOSFET. with a 40 oC hysteresis to lower the average TJ during
continuous thermal overload conditions, increasing life-
Output Under-Voltage Protection (UVP)
time of the APW7142.
In the operational process, if a short-circuit occurs, the
Enable/Shutdown
output voltage will drop quickly. Before the current-limit
circuit responds, the output voltage will fall out of the re- Driving EN to the ground initiates a soft-stop process and
quired regulation range. The under-voltage continually then places the APW 7142 in shutdown. W hen in
monitors the FB voltage after soft-start is completed. If a shutdown, after the soft-stop process is completed, the
load step is strong enough to pull the output voltage lower internal power MOSFETs turn off, all internal circuitry shuts
than the under-voltage threshold, the IC shuts down down and the quiescent supply current reduces to less
converter’s output. than 3µA.

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Rev. A.5 - Mar., 2009
APW7142

Function Description (Cont.)

Current-Limit Protection

The APW7142 monitors the output current, flows through

the high-side power MOSFET, and limits the current peak
at current-limit level to prevent loads and the IC from dam-
aging during overload or short-circuit conditions.
Frequency Foldback

The foldback frequency is controlled by the FB voltage.

When the output is shortened to the ground, the frequency
of the oscillator will be reduced to 80kHz. This lower fre-
quency allows the inductor current to safely discharge,
thereby preventing current runaway. The oscillator’s fre-
quency will gradually increase to its designed rate when
the feedback voltage on the FB again approaches 0.8V.

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Rev. A.5 - Mar., 2009
APW7142

Application Information
Setting Output Voltage T=1/FOSC

The regulated output voltage is determined by:

R1 VLX
VOUT = 0.8 × (1 + ) (V) DT I
R2
IOUT
Suggested R2 is in the range from 1k to 20kΩ. For por-
IL
table applications, a 10k resistor is suggested for R2. To
prevent stray pickup, please locate resistors R1 and R2 IOUT
close to APW7142. IQ1
Input Capacitor Selection I
ICOUT
Use small ceramic capacitors for high frequency
VOUT
decoupling and bulk capacitors to supply the surge cur-
rent needed each time the P-channel power MOSFET (Q1)
turns on. Place the small ceramic capacitors physically VOUT
close to the VIN and between the VIN and the GND. Figure 1 Converter Waveforms
The important parameters for the bulk input capacitor are
the voltage rating and the RMS current rating. For reliable Output Capacitor Selection
operation, select the bulk capacitor with voltage and cur- An output capacitor is required to filter the output and sup-
rent ratings above the maximum input voltage and larg- ply the load transient current. The filtering requirements
est RMS current required by the circuit. The capacitor volt- are the function of the switching frequency and the ripple
age rating should be at least 1.25 times greater than the current (∆I). The output ripple is the sum of the voltages,
maximum input voltage and a voltage rating of 1.5 times having phase shift, across the ESR, and the ideal output
is a conservative guideline. The RMS current (IRMS) of the capacitor. The peak-to-peak voltage of the ESR is calcu-
bulk input capacitor is calculated as the following equation: lated as the following equations:

IRMS= IOUT× D×(1- D) VOUT ........... (1)

(A) D=
VIN
where D is the duty cycle of the power MOSFET.
VOUT ·(1 - D) ........... (2)
For a through hole design, several electrolytic capacitors ∆I =
may be needed. For surface mount designs, solid tanta- FOSC ·L
lum capacitors can be used, but caution must be exer- VESR = ∆I. ⋅ ESR ........... (3)
cised with regard to the capacitor surge current rating.
The peak-to-peak voltage of the ideal output capacitor is
VIN calculated as the following equations:
VIN
IQ1 CIN ∆I
∆VCOUT = (V) ........... (4)
8 ⋅ FOSC ⋅ COUT
Q1
IL IOUT For the applications using bulk capacitors, the ∆VCOUT is
VOUT much smaller than the VESR and can be ignored. Therefore,
LX L
ESR the AC peak-to-peak output voltage (∆VOUT ) is shown as
Q2 ICOUT
below:
COUT
∆VOUT = ∆ I ⋅ ESR (V) ........... (5)

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Rev. A.5 - Mar., 2009
APW7142

Application Information (Cont.)

Output Capacitor Selection (Cont.)
where VIN = VIN(MAX)
For the applications using ceramic capacitors, the VESR is
Layout Consideration
much smaller than the ∆V COUT and can be ignored.
Therefore, the AC peak-to-peak output voltage (∆VOUT ) is In high power switching regulator, a correct layout is im-
close to ∆VCOUT . portant to ensure proper operation of the regulator. In
The load transient requirements are the function of the general, interconnecting impedance should be minimized
slew rate (di/dt) and the magnitude of the transient load by using short and wide printed circuit traces. Signal and
current. These requirements are generally met with a mix power grounds are to be kept separating and finally com-
of capacitors and careful layout. High frequency capaci- bined using the ground plane construction or single point
tors initially supply the transient and slow the current load grounding. Figure 2 illustrates the layout, with bold lines
rate seen by the bulk capacitors. The bulk filter capacitor indicating high current paths. Components along the bold
values are generally determined by the ESR (Effective lines should be placed close together. Below is a check-
Series Resistance) and voltage rating requirements rather list for your layout:
than actual capacitance requirements. 1. Firstly, to initial the layout by placing the power
High frequency decoupling capacitors should be placed components. Orient the power circuitry to achieve a
as close to the power pins of the load as physically clean power flow path. If possible, make all the con-
possible. Be careful not to add inductance in the circuit nections on one side of the PCB with wide and copper
board wiring that could cancel the usefulness of these filled areas.
low inductance components. An aluminum electrolytic
+
capacitor’s ESR value is related to the case size with lower VIN
2

ESR available in larger case sizes. However, the Equiva- -

VIN C1 L1
lent Series Inductance (ESL) of these capacitors increases
8
LX
with case size and can reduce the usefulness of the ca- 6 LX 7 +
EN
pacitor to the high slew-rate transient loading. U1 C2 Load
VOUT
Compensation APW7142
Inductor Value Calculation Network
-
1
5 COMP PGND
The operating frequency and inductor selection are inter-
4 R1
related in that higher operating frequencies permit the R3 FB

use of a smaller inductor for the same amount of inductor Feedback

AGND R2
C3 Divider
ripple current. However, this is at the expense of efficiency C4
3

(Optional)
due to an increase in MOSFET gate charge losses. The
equation (2) shows that the inductance value has a direct
effect on ripple current. 2. In Figure 2, the loops with same color bold lines con-
Accepting larger values of ripple current allows the use of duct high slew rate current. These interconnecting im-
low inductances, but results in higher output voltage ripple pedances should be minimized by using wide and
and greater core losses. A reasonable starting point for short printed circuit traces.
setting ripple current is ∆I ≤ 0.4x IOUT(MAX) . Remember, the 3. Keep the sensitive small signal nodes (FB, COMP)
maximum ripple current occurs at the maximum input away from switching nodes (LX or others) on the PCB.
voltage. The minimum inductance of the inductor is cal- Therefore place the feedback divider and the feedback
culated by using the following equation: compensation network close to the IC to avoid switch-
VOUT ·(VIN - VOUT) ing noise. Connect the ground of feedback divider di-
≤ 1.2 rectly to the AGND pin of the IC using a dedicated
500000 ·L ·VIN
ground trace.
VOUT ·(VIN - VOUT )
L≥ (H) ........... (6)
600000 ·VIN

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Rev. A.5 - Mar., 2009
APW7142

Application Information (Cont.)

Layout Consideration (Cont.)

4. Place the decoupling ceramic capacitor C1 near the

VIN as close as possible. Use a wide power ground
plane to connect the C1 and C2 to provide a low im-
pedance path between the components for large and
high slew rate current.

C2

C1
L1 VOUT
VIN 1 8 V
LX
SOP-8

2 7
3 6
Ground 4 5

APW7142

Ground

Figure 3 Recommended Layout Diagram

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Rev. A.5 - Mar., 2009
APW7142

Package Information
SOP-8
D

SEE VIEW A

E1

h X 45

e b c
A2

0.25
A

GAUGE PLANE
SEATING PLANE
A1

L
VIEW A

S SOP-8
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.

A 1.75 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 0.049
b 0.31 0.51 0.012 0.020
c 0.17 0.25 0.007 0.010
D 4.80 5.00 0.189 0.197
E 5.80 6.20 0.228 0.244
E1 3.80 4.00 0.150 0.157
e 1.27 BSC 0.050 BSC
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
0 0° 8° 0° 8°

Note: 1. Follow JEDEC MS-012 AA.

2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.

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Rev. A.5 - Mar., 2009
APW7142

Carrier Tape & Reel Dimensions

OD0 P0 P2 P1 A

E1
F

W
B0

K0 A0 OD1 B A
B

SECTION A-A

T
SECTION B-B

d
H
A

T1

Application A H T1 C d D W E1 F
12.4+2.00 13.0+0.50
330.0±2.00 50 MIN. 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
-0.00 -0.20
SOP-8 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 8.0±0.10 2.0±0.05 1.5 MIN. 6.40±0.20 5.20±0.20 2.10±0.20
-0.00 -0.40

(mm)

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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Rev. A.5 - Mar., 2009
APW7142

Taping Direction Information

SOP-8

USER DIRECTION OF FEED

Classification Profile

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Rev. A.5 - Mar., 2009
APW7142

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
100 °C 150 °C
Temperature min (Tsmin)
150 °C 200 °C
Temperature max (Tsmax)
60-120 seconds 60-120 seconds
Time (Tsmin to Tsmax) (ts)

Average ramp-up rate

3 °C/second max. 3°C/second max.
(Tsmax to TP)
Liquidous temperature (TL) 183 °C 217 °C
Time at liquidous (tL) 60-150 seconds 60-150 seconds
Peak package body Temperature
See Classification Temp in table 1 See Classification Temp in table 2
(Tp)*
Time (tP)** within 5°C of the specified
20** seconds 30** seconds
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3 3
Package Volume mm Volume mm
Thickness <350 ≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
3 3 3
Package Volume mm Volume mm Volume mm
Thickness <350 350-2000 >2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C

Reliability Test Program

Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
ESD MIL-STD-883-3015.7 VHBM≧2KV, VMM≧200V
Latch-Up JESD 78 10ms, 1tr≧100mA

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Rev. A.5 - Mar., 2009
APW7142

Customer Service

Anpec Electronics Corp.

Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050

Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838

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Rev. A.5 - Mar., 2009