A7672X - Series - Hardware Design - V1.00

A7672X Series
Hardware Design
LTE Module
SIMCom Wireless Solutions Limited

SIMCom Headquarters Building, Building 3, No. 289 Linhong
Road, Changning District, Shanghai P.R. China
Tel: 86-21-31575100
support@simcom.com
www.simcom.com
A7672X Series Hardware Design V1.00
Document Title: A7672X Series Hardware Design

Version: V1.00
Date: 2021-03-30
Status: Released
GENERAL NOTES
SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.
THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO
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FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE
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OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS
SUPPLIED HEREIN ARE SUBJECT TO CHANGE.
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CHANGE WITHOUT NOTICE AT ANY TIME.
SIMCom Wireless Solutions Limited

SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R.
China
Tel: +86 21 31575100
Email: simcom@simcom.com
For more information, please visit:

https://www.simcom.com/download/list-863-en.html
For technical support, or to report documentation errors, please visit:

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Copyright © 2021 SIMCom Wireless Solutions Limited All Rights Reserved.
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Version History
Date Version Description of change Author
Zhongyou.chen
2021-03-30 1.00 Initial
Xuefeng.liu
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Contents
1 Introduction...................................................................................................................................................9
1.1 Product Outline........................................................................................................................................... 9
1.2 Hardware Interface Overview.................................................................................................................10
1.3 Hardware Block Diagram........................................................................................................................ 10
1.4 Functional Overview.................................................................................................................................11
2 Package Information................................................................................................................................ 13
2.1 Pin Assignment Overview....................................................................................................................... 13
2.2 Pin Description..........................................................................................................................................15
2.3 Mechanical Information........................................................................................................................... 22
2.4 Footprint Recommendation.................................................................................................................... 23
2.5 Recommend Stencil Size........................................................................................................................24
3 Interface Application................................................................................................................................ 25
3.1 Power Supply............................................................................................................................................ 25
3.1.1 Power Supply Design Guide.......................................................................................................... 26
3.1.2 Recommended Power Supply Circuit.......................................................................................... 27
3.1.3 Voltage Monitor................................................................................................................................ 28
3.2 Power On/ Off and Reset........................................................................................................................28
3.2.1 Power on........................................................................................................................................... 28
3.2.2 Power off............................................................................................................................................29
3.2.3 Reset Function................................................................................................................................. 31
3.3 UART Interface......................................................................................................................................... 32
3.3.1 UART Design Guide........................................................................................................................ 32
3.3.2 RI and DTR Behavior...................................................................................................................... 33
3.4 USB Interface............................................................................................................................................34
3.4.1 USB Reference Design...................................................................................................................34
3.4.2 USB_BOOT Interface......................................................................................................................35
3.5 USIM Interface.......................................................................................................................................... 36
3.5.1 SIM Application Guide.....................................................................................................................36
3.5.2 Recommend USIM Card Holder................................................................................................... 37
3.6 Analog audio interface.............................................................................................................................38
3.6.1 Analog audio reference design......................................................................................................38
3.7 Matrix keyboard interface........................................................................................................................39
3.8 GPIO Interface.......................................................................................................................................... 40
3.9 I2C Bus.......................................................................................................................................................40
3.10 Network status.......................................................................................................................................... 41
3.11 GNSS interface.........................................................................................................................................42
3.12 SPI LCD interface.....................................................................................................................................45
3.13 SPI camera interface............................................................................................................................... 46
3.14 Bluetooth interface................................................................................................................................... 47
3.15 Another interface...................................................................................................................................... 47
3.15.1 ADC..................................................................................................................................................47
3.15.2 LDO..................................................................................................................................................48
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4 RF Specifications...................................................................................................................................... 50
4.1 GSM/LTE Specifications......................................................................................................................... 50
4.2 GSM/LTE Antenna Requirements......................................................................................................... 52
4.3 GNSS Specifications............................................................................................................................... 52
4.4 GNSS Antenna Requirements............................................................................................................... 53
4.5 Bluetooth specifications.......................................................................................................................... 53
4.6 Antenna Reference Design.................................................................................................................... 54
4.6.1 Passive Antenna for GSM/LTE/GNSS/Bluetooth....................................................................... 54
4.6.2 Active Antenna for GNSS............................................................................................................... 55
4.7 PCB layout.................................................................................................................................................55
5 Electrical Specifications..........................................................................................................................56
5.1 Absolute maximum ratings..................................................................................................................... 56
5.2 Operating conditions................................................................................................................................56
5.3 Operating Mode........................................................................................................................................ 57
5.3.1 Operating Mode Definition..............................................................................................................57
5.3.2 Sleep mode....................................................................................................................................... 58
5.3.3 Minimum functionality mode and Flight mode............................................................................ 59
5.4 Current Consumption...............................................................................................................................59
5.5 ESD Notes.................................................................................................................................................60
6 SMT Production Guide.............................................................................................................................61

6.1 Top and Bottom View of A7672X........................................................................................................... 61
6.2 Label Information......................................................................................................................................62
6.3 Typical SMT Reflow Profile.....................................................................................................................63
6.4 Moisture Sensitivity Level (MSL)........................................................................................................... 63
7 Packaging....................................................................................................................................................65
8 Appendix..................................................................................................................................................... 68
8.1 Coding Schemes and Maximum Net Data Rates over Air Interface............................................... 68
8.2 Related Documents................................................................................................................................. 69
8.3 Terms and Abbreviations.........................................................................................................................71
8.4 Safety Caution.......................................................................................................................................... 73
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Table Index
Table 1: Module frequency bands................................................................................................................................ 9
Table 2: General features.............................................................................................................................................11
Table 3: Pin Description............................................................................................................................................... 14
Table 4: Pin parameter abbreviation..........................................................................................................................15
Table 5: 1.8V IO parameters definition......................................................................................................................16
Table 6: 3.3V IO parameters definition......................................................................................................................16
Table 7: Pin description................................................................................................................................................ 17
Table 8: VBAT pins electronic characteristic............................................................................................................ 25
Table 9: Recommended TVS diode list..................................................................................................................... 26
Table 10: Power on timing and electronic characteristic........................................................................................ 29
Table 11: Power off sequence parameters............................................................................................................... 30
Table 12: RESET pin electronic characteristic......................................................................................................... 31
Table 13: USB_BOOT description..............................................................................................................................35
Table 14: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)...................................................... 36
Table 15: USIM electronic characteristic 3.0V mode (USIM_VDD=3V).............................................................. 36
Table 16: Amphenol USIM socket pin description................................................................................................... 38
Table 17: MIC input ADC parameter list....................................................................................................................38
Table 18: Analog audio Parameter.............................................................................................................................38
Table 19: matrix keyboard PIN description............................................................................................................... 39
Table 20: Standard GPIO Resources of A7672X.................................................................................................... 40
Table 21: 2G mode NETLIGHT pin status................................................................................................................ 42
Table 22: LTE mode NETLIGHT pin status.............................................................................................................. 42
Table 23: GNSS interface description....................................................................................................................... 42
Table 24: LCD interface description...........................................................................................................................45

Table 25: SPI camera interface description..............................................................................................................46
Table 26: General ADC electronic characteristics................................................................................................... 47
Table 27: VBAT_ADC electronic characteristics......................................................................................................48
Table 28: VDD_1V8 Electrical characteristics..........................................................................................................48
Table 29: VDD_2V8 Electrical characteristics..........................................................................................................49
Table 30: Conducted transmission power.................................................................................................................50
Table 31: GSM Operating bands................................................................................................................................ 50
Table 32: E-UTRA operating bands........................................................................................................................... 50
Table 33: Conducted receive sensitivity....................................................................................................................51
Table 34: Reference sensitivity (QPSK)....................................................................................................................51
Table 35: GSM/LTE antenna requirements.............................................................................................................. 52
Table 36: GNSS operating bands...............................................................................................................................52
Table 37: GNSS performance..................................................................................................................................... 52
Table 38: Recommended Antenna Characteristics (GNSS)..................................................................................53
Table 39: Bluetooth performance............................................................................................................................... 53
Table 40: TVS part number list................................................................................................................................... 54
Table 41: Absolute maximum ratings.........................................................................................................................56
Table 42: Recommended operating ratings..............................................................................................................56
Table 43: 1.8V Digital I/O characteristics*................................................................................................................ 56
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Table 44: Operating temperature................................................................................................................................57

Table 45: Operating mode Definition......................................................................................................................... 57
Table 46: Current consumption on VBAT Pins (VBAT=3.8V)................................................................................ 59
Table 47: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.)..........................60
Table 48: The description of label information......................................................................................................... 62
Table 49: Moisture Sensitivity Level and Floor Life.................................................................................................63
Table 50: Tray size........................................................................................................................................................ 65
Table 51: Small Carton size.........................................................................................................................................66
Table 52: Big Carton size.............................................................................................................................................67
Table 53: Coding Schemes and Maximum Net Data Rates over Air Interface...................................................68
Table 54: Related Documents.....................................................................................................................................69
Table 55: Terms and Abbreviations............................................................................................................................ 71
Table 56: Safety Caution..............................................................................................................................................73
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Figure Index
Figure 1: A7672X block diagram................................................................................................................................ 11
Figure 2: Pin assignment overview for A7672X.......................................................................................................13
Figure 3: Dimensions (Unit: mm)................................................................................................................................22
Figure 4: Footprint recommendation (Unit: mm)..................................................................................................... 23
Figure 5: Recommend stencil dimension (Unit: mm)..............................................................................................24
Figure 6: VBAT voltage drop during burst emission (EDGE/GPRS)................................................................... 25
Figure 7: Power supply application circuit................................................................................................................ 26
Figure 8: Linear regulator reference circuit.............................................................................................................. 27
Figure 9: power supply reference circuit................................................................................................................... 27
Figure 10: Reference power on/off circuit.................................................................................................................28
Figure 11: Power on timing sequence.......................................................................................................................29
Figure 12: Power off timing sequence.......................................................................................................................30
Figure 13: Reference reset circuit.............................................................................................................................. 31
Figure 14: Serial port connection diagram (full-function mode)............................................................................32
Figure 15: Serial port connection diagram (NULL mode)...................................................................................... 32
Figure 16: Triode level conversion circuit................................................................................................................. 33
Figure 17: RI behaviour (SMS and URC report)..................................................................................................... 33
Figure 18: USB circuit diagram...................................................................................................................................34
Figure 19: Reference USB_BOOT circuit.................................................................................................................35
Figure 20: Force-download port................................................................................................................................. 35
Figure 21: SIM interface reference circuit.................................................................................................................36
Figure 22: SIM interface reference circuit (8PIN).................................................................................................... 37
Figure 23: Amphenol C707 10M006 512 USIM card socket.................................................................................37
Figure 24: Analog audio interface reference circuit................................................................................................ 39
Figure 25: Matrix keyboard interface reference circuit........................................................................................... 40
Figure 26: I2C reference circuit.................................................................................................................................. 41
Figure 27: NETLIGHT reference circuit.....................................................................................................................41
Figure 28: GNSS reference design（Non-standalone GNSS solution）............................................................44
Figure 29: GNSS reference design（standalone GNSS solution）.................................................................... 44
Figure 30: SPI LCD reference design....................................................................................................................... 46
Figure 31: SPI camera reference design.................................................................................................................. 47
Figure 32: VBAT_ADC reference design..................................................................................................................48
Figure 33: Passive antenna reference...................................................................................................................... 54
Figure 34: Active antenna reference..........................................................................................................................55
Figure 35: Reference PCB layout.............................................................................................................................. 55
Figure 36: Top and bottom view of A7672X.............................................................................................................61
Figure 37: Label information for A7672X.................................................................................................................. 62
Figure 38: The ramp-soak-spike reflow profile of A7672X.................................................................................... 63
Figure 39: packaging diagram.................................................................................................................................... 65
Figure 40: Tray drawing............................................................................................................................................... 65
Figure 41: Small carton drawing.................................................................................................................................66
Figure 42: Big carton drawing..................................................................................................................................... 66
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1 Introduction
This document describes the hardware interface of the module, which can help users quickly understand
the interface definition, electrical performance and structure size of the module. Combined with this
document and other application documents, users can understand and use A7672X module to design and
develop applications quickly. SIMCom provides a set of evaluation boards to facilitate A7672X module
testing and use. The evaluation board tools include an EVB board, a USB cable, an antenna, and other
peripherals.
1.1 Product Outline
Aimed at the global market, the module supports GSM, LTE-TDD and LTE-FDD. Users can choose the
module according to the wireless network configuration. The supported radio frequency bands are
described in the following table.
Table 1: Module frequency bands

Standard Frequency A7672S A7672E A7672SA
GSM 900MHz   
1800MHz   
LTE-FDD LTE-FDD B1   
LTE-FDD B2 
LTE-FDD B3   
LTE-FDD B4 
LTE-FDD B7  
LTE-FDD B20 
LTE-FDD B28 
LTE-FDD B66 
LTE-TDD LTE TDD B34 
LTE TDD B38 
LTE TDD B39 
LTE TDD B40 
LTE TDD B41 
Category CAT1 CAT1 CAT1
GNSS Optional Optional Optional
BlueTooth Optional Optional Optional
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With a small physical dimension of 24*24*2.4mm and with the functions integrated, the module can meet
almost any space requirement in users’ applications, such as smart phone, PDA, industrial handhold,
machine-to-machine and vehicle application, etc.
A7672X provides 124 pins, including 80 LCC pins in the outer ring and 44 LGA pins in the inner ring. This
document will introduce all the functional pins.
1.2 Hardware Interface Overview
The interfaces are described in detail in the next chapters include:

● Power Supply
● USB 2.0 Interface
● Three UART Interface, one full function serial port, one ordinary serial port and one debug serial port
● USIM Interface
● General ADC Interface
● VBAT ADC Interface
● 4*4 matrix keyboard
● Analog audio MIC input interface
● Analog audio SPK output interface
● SPI Interface
● LDO Power Output
● I2C Interface
● General input and output interfaces (GPIO)
● SPI LCD Interface
● SPI Camera Interface
● Antenna Interface
● USB_BOOT interface
● Network status indication interface
● Module operation status indication interface
1.3 Hardware Block Diagram
The block diagram of the A7672X module is shown in the figure below.
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Figure 1: A7672X block diagram
1.4 Functional Overview
Table 2: General features

Feature Implementation
Power supply VBAT: 3.4V ~4.2V, Recommended VBAT: 3.8V
Power saving Current in sleep mode: TBD
Radio frequency bands Please refer to the table 1
GSM/GPRS power level:
-- EGSM900: 4 (33dBm±2dB)
-- DCS1800: 1 (30dBm±2dB)
Transmitting power EDGE power level:
-- EGSM900: E2 (27dBm±3dB)
-- DCS1800 : E1 (26dBm+3dB/-4dB)
LTE power level: 3 (23dBm±2.7dB)
GPRS Multiple time slot level 12
Data Transmission
EDGE Multiple time slot level 12
Throughput
TDD/FDD-LTE category 1 : 10 Mbps (DL),5 Mbps (UL)
GSM/LTE antenna interface
Antenna GNSS antenna interface(optional)
Bluetooth antenna interface(optional)
MT, MO, CB, Text, PDU mode
SMS Short Message (SMS)storage device: USIM Card, CB does not
support saving in SIM Card
Support CS domain and PS domain SMS

USIM interface Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
USIM application toolkit
Support USAT
Phonebook management Support phonebook types: SM/FD/ON/AP/SDN
Audio feature Support analog audio interface
●Full function serial port
Baud rate support from 300bps to 3686400bps
AT command and data can be sent through serial port
Support RTS/CTS Hardware flow control
Support serial port multiplexing function conforming to GSM 07.10
UART interface
protocol
●Debug serial port
Support debug usage
●UART3 serial port
Ordinary serial port
USB 2.0 compliant, host mode not supported.
USB This interface can be used for AT command sending, data
transmission, software debugging and upgrading.
Firmware upgrade Firmware upgrade over USB interface
Size:24*24*2.4m
Physical characteristics
Weight:2.8±0.1g
Normal operation temperature: -30°C to +80°C
Temperature range Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
NOTE
Module is able to make and receive voice calls, data calls, SMS and make GPRS/LTE traffic in -40℃ ~
+85 ℃ . The performance will be reduced slightly from the 3GPP specifications if the temperature is
outside the normal operating temperature range and still within the extreme operating temperature
range.
2 Package Information
2.1 Pin Assignment Overview
The following Figure is a high-level view of the pin assignment of the module for A7672X.
Figure 2: Pin assignment overview for A7672X
Table 3: Pin Description

PIN NO PIN NAME PIN NO PIN NAME
1 PWRKEY 2 GND
3 DTR 4 RI
5 DCD 6 USB_BOOT●
7 CTS 8 RTS
9 TXD 10 RXD
11 SPI_CLK 12 SPI_CS
13 SPI_MOSI 14 SPI_MISO
15 VDD _1V8 16 RESET
17 GND 18 GND
19 GPIO1 20 MK_IN_3
21 MK_OUT_3 22 UART_LOG_RX
23 UART_LOG_TX 24 VBUS
25 ADC 26 GPIO2
27 USB_DP 28 USB_DM
29 GND 30 USIM1_VDD
31 USIM1_DATA 32 USIM1_CLK
33 USIM1_RST 34 USIM1_DET
35 MK_OUT_6/I2C3_SDA 36 MK_IN_6/I2C3_SCL
37 I2C_SDA 38 I2C_SCL
39 GND 40 EAR_P
41 EAR_N 42 MIC_P
43 MIC_N 44 MK_OUT_2
45 GND 46 GND
47 MK_IN_2 48 GPIO3
49 UART3_RXD 50 UART3_TXD
51 VBAT_ADC 52 NETLIGHT
53 GPIO4 54 GND
55 VBAT 56 VBAT
57 VBAT 58 GND
59 GND 60 RF_ANT
61 GND 62 GND
63 GND 64 GND
65 GND 66 STATUS
67 MK_OUT_5 68 MK_IN_5
69 GND 70 GND
71 GND 72 GND
73 GND 74 GND
75 GND 76 GND
77 GND 78 GND
79 GND 80 GND
81 GND 82 GND
83 GND 84 GND
85 GND 86 GND
87 GND 88 GND
89 GND 90 GNSS_ANT
91 GND 92 GND
93 BT_ANT 94 GND
95 GNSS_TXD 96 GNSS_RXD
97 1V8_GNSS 98 GNSS_PWRCTL
99 VDD_2V8 100 1PPS
101 LCD_BL_PWM 102 LCD_SPI_CLK
103 LCD_SPI_TXD 104 LCD_SPI_RXD
105 LCD_SPI_CS 106 LCD_RST
107 LCD_DCX 108 USIM2_DATA
109 USIM2_CLK 110 USIM2_VDD
111 USIM2_RST 112 USIM2_DET
113 NC 114 NC
115 NC 116 GNSS_VBKP
117 CAM_I2C_SDA 118 CAM_I2C_SCL
119 CAM_PWDN 120 CAM_RST
121 CAM_MCLK 122 CAM_SPI_D0
123 CAM_SPI_D1 124 CAM_SPI_CLK
NOTE
' ● ' Indicates that these Pins cannot be pulled down before the module powered up, otherwise it will
affect the normal start-up of the module.
2.2 Pin Description
Table 4: Pin parameter abbreviation

Pin type Description
PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output

DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down
Table 5: 1.8V IO parameters definition

Power
Parameter Description Min Typ. Max
Domain
VIH High level input VCC * 0.7 1.8V VCC + 0.2
VIL Low level input -0.3V 0V VCC *0.3
Rpu Pull up resistor 55KΩ 79 KΩ 121 KΩ
Rpd Pull down resistor 51 KΩ 87 KΩ 169 KΩ
Input leakage
IIL - - 10uA
current
VOH Output level range VCC - 0.2 - -
VOL Output low range - - 0.2V
Maximum current
IOL driving capacity at - - 13mA
low level output
Maximum current
driving capacity at
IOH - - 11mA
high level output
Vpad=VCC-0.2V
Table 6: 3.3V IO parameters definition

Power
Parameter Description Min Typ. Max
Domain
VIH High level input 2V 1.8V VCC + 0.3
VIL Low level input -0.3V 0V 0.8V
Rpu Pull up resistor 26KΩ 47 KΩ 72 KΩ
Rpd Pull down resistor 27 KΩ 54 KΩ 267 KΩ
Input leakage
IIL - - 10uA
current
3.3V VOH Output level range 2.4V - -
VOL Output low range - - 0.4V
Maximum current
IOL driving capacity at - - 7mA
low level output
Maximum current
driving capacity at
IOH - - 7mA
high level output
Vpad=VCC-0.5V
Table 7: Pin description
Pin parameter
Pin
Pin name Description Note
No. Power
Type
domain
Power supply
Module input voltage ranges
55,56, from 3.4V to 4.2V, Typical
VBAT - PI
57 values is 3.8V. and the peak
current value can reach 2A.
1.8V power output, output
Can provide 1V8
current up to 50 mA. Cannot
power supply for
VDD_1V8 15 - PO provide to high power load,
GNSS. If unused,
can provide power for level
keep it open.
conversion circuit, etc.
VDD_2V8 99 - PO Can provide 2V8
Internal 2.8V power output,
power supply for
output current up to 50 mA.
LCD VCC_2V8. If
Cannot provide to high power
unused, keep it
load.
open.
2,17,1
8,
29,39,
45,46,
54,58,
59,61,
62,63,
64,65,
69,70,
71,72,
GND - - Ground
73,74,
75,76,
77,78,
79,80,
81,82,
83,84,
85,86,
87,88,
89,91,
92,94
System Control
PWRKEY has
Power ON/OFF input, active been internally
low. pulled-up to VBAT
PWRKEY 1 - DI,PU
VIH: 0.7*VBAT with 50KΩ
VIL: 0.3*VBAT resistor, default
high.
RESET has been
System reset control input,
pulled-up to VBAT
active low.
RESET 16 - DI,PU with 50KΩ
VIH: 0.7*VBAT
(typical) resistor,
VIL: 0.3*VBAT
default high.
USIM interface
USIM bus data, this pin has
USIM1_DATA 31 1.8/3.0V I/O,PU been pull-up with 4.7KΩ
resistor to USIM1_VDD.
USIM1_RST 33 1.8/3.0V I/O,PU USIM bus reset output.
USIM1_CLK 32 1.8/3.0V I/O,PU USIM bus clock output.
USIM card power supply
output, supports 1.8v/3.0v
USIM1_VDD 30 1.8/3.0V PO output according to the card
type, its output current is up
to 50mA.
USIM insert detect, it can be
set to high/low active with the
USIM1_DET 34 1.8V I/O,PU
AT command, refer to
Document [25]
USIM2_DATA 108 1.8/3.0V I/O,PU USIM bus data, this pin need
pull-up with 4.7KΩ resistor to
USIM2_VDD externally.
USIM2_RST 111 1.8/3.0V I/O,PU USIM bus reset output.
USIM2_CLK 109 1.8/3.0V I/O,PU USIM bus clock output.
USIM2_VDD 110 1.8/3.0V PO USIM card power supply
output, supports 1.8v/3.0v
output according to the card
type, its output current is up
to 50mA.
USIM2_DET 112 1.8V DI,PD USIM insert detect, it can be
set to high/low active with the
AT command, refer to
Document [25]
USB interface
Valid USB detection input.
VBUS 24 - AI Active high, Vmax(valid)=3.0V,
Vmax(detection)=5.2V
Negative line of the differential,
USB_DM 28 - I/O
bi-directional USB signal.
Positive line of the differential,
USB_DP 27 - I/O
bi-directional USB signal.
Full function UART interface
RTS 8 1.8V DI RTS input
CTS 7 1.8V DO CTS output
RXD 10 1.8V DI Data input
If unused, keep it
TXD 9 1.8V DOH Data output
open.
RI 4 1.8V DO Ringing indicator
DCD 5 1.8V DO Carrier detection
DTR 3 1.8V DI DTE Ready
Debug UART
UART_LOG_TXD 23 1.8V DOH Log output Default used as
UART_LOG_RXD 22 1.8V DI Log input debug port.
Serial Port UART3
UART3_TXD 50 1.8V DOH Log output Two-wire serial

UART3_RXD 49 1.8V DI Log input port
I2C interface
If unused, keep it
I2C_SCL 38 1.8V DO I2C clock output
open. Need pull
up to VDD_1V8
I2C_SDA 37 1.8V I/O I2C data I/O
externally.
SPI interface
SPI_CLK 11 1.8V I/O,PD SPI clock
SPI_CS 12 1.8V I/O,PD SPI chip selection If unused, keep it
SPI_MOSI 13 1.8V DO,PD SPI Main output slave input open.
SPI_MISO 14 1.8V DI,PD SPI Main input slave output
Analog audio interface
EAR_P 40 1.8V AIO Earphone output positive
EAR_N 41 1.8V AIO Earphone output negative If unused, keep it
MIC_P 42 1.8V AIO MIC input positive open.
MIC_N 43 1.8V AIO MIC input negative
GPIO
GPIO1 19 1.8V IO,PU If unused, keep it
General purple I/O
open.
GPIO2 26 1.8V IO,PD If unused, keep it
General purple I/O
open.
GPIO3 48 1.8V IO,PD If unused, keep it
General purple I/O
open.
GPIO4 53 1.8V IO,PU If unused, keep it
General purple I/O
open.
GNSS Interface
GNSS_PWRCTL 98 1.8V DI The enable control PIN of
Active high.
GNSS power supply.
Module VDD_1V8
The power input for GNSS, the
(PIN 15) can be
1V8_GNSS 97 - PI input voltage must not be less
used for this
than 1.8V.
power supply
GNSS VRTC power input, If unused, keep it
GNSS_VBKP 116 - PI
input voltage 1.4V~3.6V open.
If unused, keep it
1PPS 100 1.8V DO 1PPS signal output
open.
Connect to MCU
UART_TX;
GNSS_RXD 96 1.8V DI GNSS UART RX Or use 10K
resistors in series
in module
UART3_TX (pin
50).
Connect to MCU
UART_RX;
Or use 10K
GNSS_TXD 95 1.8V DO GNSS UART TX resistors in series
in module
UART3_RX (pin
49).
SPI LCD Interface

LCD_BL_PWM 101 1.8V DO LCD backlight adjusting PWM
LCD_SPI_CLK 102 1.8V DO SPI clock
LCD_SPI_TXD 103 1.8V DI，DO SPI DATA(Bidirectional)
If unused, keep it
LCD_SPI_RXD 104 1.8V DI SPI DATA
open.
LCD_SPI_CS 105 1.8V DO SPI CS
LCD_RST 106 1.8V DO LCD Reset
LCD_DCX 107 1.8V DO Command/parameter selection
SPI CAMERA Interface

CAM_I2C_SDA 117 1.8V DI, DO Camera I2C data
CAM_I2C_SCL 118 1.8V DO Camera I2C clock
CAM_PWDN 119 1.8V DO Camera power down
CAM_RST 120 1.8V DO Camera reset If unused, keep it
CAM_MCLK 121 1.8V DO Camera main clock open.
CAM_SPI_D0 122 1.8V DI Camera SPI D0
CAM_SPI_D1 123 1.8V DI Camera SPI D1
CAM_SPI_CLK 124 1.8V DO Camera SPI clock
ANT interface
RF_ANT 60 - AIO Main antenna
GNSS_ANT 90 - AIO GNSS antenna
BT_ANT 93 - AIO Bluetooth antenna
Other pins
If unused, keep it
ADC 25 - AI General Purpose ADC
open.
If unused, keep it
VBAT_ADC 51 - AI VBAT ADC
open.
Network registration status
indicator (LED).
NETLIGHT 52 1.8V DO
For more detail, please refer
the chapter 3.12.
STATUS 66 1.8V DO Module status indicator (LED).
USB_BOOT 6 1.8V DI Firmware download guide Do place 2 test
control input. when pull-up to points for debug.

GND and press Do not pull down
PWRKEY,module will access USB_BOOT
in USB download mode. during normal
power up !
NOTE
Please reserve a test point for USB_BOOT, VDD_EXT and UART_LOG_TX. If there is no USB
connector, please also reserve a test point for USB_VBUS, USB_DP, and USB_DM for Firmware
upgrade.
2.3 Mechanical Information
The following figure shows the package outline drawing of A7672X.
Figure 3: Dimensions (Unit: mm)
NOTE
The side length dimension is 24.00±0.15mm excluding the burr area.
2.4 Footprint Recommendation
Figure 4: Footprint recommendation (Unit: mm)
2.5 Recommend Stencil Size
Recommend stencil thickness≥0.12mm and <0.15mm.
Figure 5: Recommend stencil dimension (Unit: mm)
3 Interface Application
3.1 Power Supply
A7672X offers 3 power supply pins (55, 56, 57) as VBAT power input pin. A7672X use these three pins
supply the internal RF and baseband circuit.
When the module is at the maximum power in GSM TX mode, the peak current can reach 2A (peak
current), which results in a large voltage drop on Vbat. In order to ensure that the voltage drop is less than
300mV, the power supply capacity of external power supply must be no less than 2A.
Figure 6: VBAT voltage drop during burst emission (EDGE/GPRS)
NOTE
Test condition: VBAT power supply 3.8V, the module is tested on EVB board, and the power input has a
330UF tantalum capacitor.
Table 8: VBAT pins electronic characteristic

Parameter Description Min Typ. Max Unit
VBAT Module supply voltage 3.4 3.8 4.2 V
IVBAT (peak) Module consumption peak current - 2 - A
IVBAT Module average consumption current (normal
(average) mode)
Refer to Table 46
Module average consumption current (sleep
IVBAT (sleep)
mode)
IVBAT Module average consumption current (off leakage
- 20 - uA
(power-off) current)
3.1.1 Power Supply Design Guide
In the user's design, special attention must be paid to the design of the power supply. If the voltage drops
below 3.4V, the RF performance of the module will be affected, the module will shut down if the voltage is
too low. It is recommended to select an LDO or DC-DC chip with an enable pin, and the enable pin is
controlled by the MCU.
NOTE
When the power supply can provide a peak current of 2A, the total capacity of the external power
supply capacitance is recommended to be no less than 300uF. If the peak current of 2A cannot be
provided, the total capacity of the external capacitance is recommended to be no less than 600uf to
ensure that the voltage drop on the Vbat pin at any time is not more than 300mV.
It is recommended to place four 33pF/10pF/0.1uF/1uF ceramic capacitors near Vbat to improve RF

performance and system stability. At the same time, it is recommended that the Vbat layout routing width
from the power supply on the PCB to the module be at least 3mm. Reference design recommendations are
as follows:
If the Vbat input contains high-frequency interference, it is recommended to add magnetic beads for filtering.
The recommended types of magnetic beads are BLM21PG300SN1D and MPZ2012S221A.
Figure 7: Power supply application circuit
In addition, in order to prevent the damage of A7672X caused by surge and overvoltage, it is recommended
to parallel one TVS on the Vbat pin of the module.
Table 9: Recommended TVS diode list
No. Manufacturer Part Number VRWM Package

1 JCET ESDBW5V0A1 5V DFN1006-2L
2 WAYON WS05DPF-B 5V DFN1006-2L
3 WILL ESD5611N 5V DFN1006-2L
4 WILL ESD56151W05 5V SOD-323
NOTE
When selecting TVS by customer, it is necessary to pay attention to the clamping voltage in the case of
surge protection. The clamping voltage should not be higher than 10V when 100V surge input.
3.1.2 Recommended Power Supply Circuit
The MCU must have the function to power off the module, but the module cannot be shut down or restarted
normally. Only when the module is abnormal and cannot be shut down or restarted normally can the module
be powered off. When the input power is greater than 9V, the DCDC chip is recommended. When the input
is less than 9V, it is recommended to use LDO power supply. If you use the module's OPEN LINUX
secondary development function, because there is no MCU, you can add a low-cost single-chip
microcomputer to play the role of hardware watchdog to pull POWERKEY to boot and can be powered off.
It is recommended that a switching mode power supply or a linear regulator power supply is used. The
following figure shows the linear regulator reference circuit:
Figure 8: Linear regulator reference circuit
The following figure shows the DC-DC regulator reference circuit:
Figure 9: power supply reference circuit
3.1.3 Voltage Monitor
AT command ‘AT+CBC’ can be used to monitor VBAT voltage.

AT command ‘AT+CVALARM’ can be used to set high/low voltage alarm, When the actual voltage
exceeds the preset range, a warning message will be reported through the AT port.
AT command ‘AT+CPMVT’ can be used to set high/low voltage power off, When the actual voltage
exceeds the preset range, the module will shut down automatically.
NOTE
Voltage monitor function under debugging, Overvoltage alarm and overvoltage shutdown are off by
default. For details of at commands, please refer to document [1].
3.2 Power On/ Off and Reset
3.2.1 Power on
Customer can power on the module by pulling down the PWRKEY pin. This pin has been pulled up inside
the module to Vbat.
It is recommended that when using the module, adding TVS diode at the module pin can effectively
enhance the ESD performance.
The recommended circuit is as follows:
Figure 10: Reference power on/off circuit
NOTE
Do not parallel capacitors which the value is exceed 100nF on PWRKEY or RESET pin. It will cause
module power on automatically when VBAT powered.
It is forbidden to pull down both RESET key and PWRKEY to power on the module at the same time.
Figure 11: Power on timing sequence
Table 10: Power on timing and electronic characteristic

Symbol Parameter Min. Typ. Max. Unit
The time of active low-level impulse of PWRKEY pin
Ton - 50 - ms
to power on module
The time from power-on issue to STATUS pin output
Ton(status) - 6 - s
high level (indicating power up ready)
Ton(uart) The time from power-on issue to UART port ready - 8 - s
Ton(usb) The time from power-on issue to USB port ready - 9 - s
0.7*
VIH Input high level voltage on PWRKEY pin - VBAT V
VABT
0.3*
VIL Input low level voltage on PWRKEY pin 0 0 V
VBAT
3.2.2 Power off
A7672X has the following shutdown methods:

● Power off by pulling the PWRKEY# pin down to a low level.
● Power off Module by AT command ‘AT+CPOF’.
● Over-voltage or under-voltage automatic power off.
● Over-temperature or under-temperature automatic power off.
It is strongly recommended that the customer use PWRKEY or ‘AT+CPOF’ to shut down, and then power off
Vbat (especially when the module does not need to work). In addition, the customer cannot shut down Vbat
by disconnecting it, which may cause damage to flash.
NOTE
when the temperature exceeds the range of - 30 ~ + 80 ℃ , A7672X will report warning information
through AT port. When the temperature exceeds the range of - 40 ~ + 85 ℃, A7672X will shut down
automatically. For a detailed description of ‘AT+ CPOF’ and ‘AT+ CPMVT’, please refer to document [1].
PWRKEY can be used to power off the module, power off sequence see the following figure:
Figure 12: Power off timing sequence
Table 11: Power off sequence parameters

Toff Power off low level pulse width 2.5 - - s
Power off time (according to status
Toff(status) - 2 - s
interface)
Power off time (according to UART
Toff(uart) - 2 - s
interface)
Power off time (according to USB
Toff(usb) - 2 - s
interface)
Toff-on Power off - power on buffer time 2 - - s
NOTE
The status pin can be used to judge whether the module is powered on or not. When the module is
powered on and initialization is completed, the status outputs a high level, otherwise the low level will
be maintained all the time.
3.2.3 Reset Function
A7672X can restart the module by pulling down the reset pin of the module. Reset pin also has the
function of power on when PMU first time be given a valid supply voltage (active low, but this key has no
shutdown function). After first time power on, some register of this pin will be written then it will lose this
function, so it is recommended to use PWRKEY to power on the module and RESET key only used as
reset function.
A 50K Ω resistor is used to pull-up to VBAT inside the module, so it is no need to add pull-up resistor
outside. The recommended circuit is showed as follows:
Figure 13: Reference reset circuit
Table 12: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit
The active low level time impulse on RESET pin to
Treset 2 2.5 - S
reset module
0.7*
VIH Input high level voltage - VBAT V
VBAT
0.3*
VIL Input low level voltage 0 0 V
VBAT
NOTE
It is recommended to use the reset pin only in case of emergency, such as the module is not
responding. The reset time is recommended to be 2.5s.
3.3 UART Interface
A7672X provides three serial ports, the main communication serial port is UART, one ordinary serial port,
and the UART_LOG dedicate to printing log.
3.3.1 UART Design Guide
When using uses full-function serial port, please refer to the following connection mode:
Figure 14: Serial port connection diagram (full-function mode)
When using 2-wire serial port, please refer to the following connection mode:
Figure 15: Serial port connection diagram (NULL mode)
The following figure shows the use of triode for level shifter circuits. The circuit with dotted line can refer to
the circuit with solid line TXD and RXD, and attention shall be paid to the direction of signal.
The recommended triode model is MMBT3904.
Figure 16: Triode level conversion circuit
NOTE
1. Main UART supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400,
57600, 115200, 230400, 460800, 921600, 1842000, 3686400. The default baud rate is 115200bps.
2. The maximum baud rate supported by A7672X ordinary serial port is 921600.
3. The parasitic capacitance of the transistor will affect the edge of the high-speed digital signal. It is
not recommended to use this circuit when the signal speed is higher than 115200bps.
3.3.2 RI and DTR Behavior
RI usually keeps high level output. When receiving a short message or URC report, RI outputs a low level
for 120ms (short message)/60ms (URC), and then returns to a high-level state; RI will output a low level,
when receiving a phone call as the called party. After outputting low level, RI will remain low until the host
accepts the call using the "ATA" command or the caller stops calling RI, in the end, it will become high level.
Figure 17: RI behaviour (SMS and URC report)
After setting the AT command “AT+CSCLK=1”, and then pulling up the DTR pin, Module will enter sleep
mode when module is in idle mode. In sleep mode, the UART is unavailable. When A7672X enters sleep
mode, pulling down DTR can wakeup module.
After setting the AT command “AT+CSCLK=0”, A7672X Series will do nothing when the DTR pin is pulling
up.
3.4 USB Interface
The A7672X contains a USB interface compliant with the USB2.0 specification as a peripheral, but does not
support USB charging function and does not support USB HOST mode.
USB is the main debugging port and software upgrade interface. It is recommended that customers reserve
USB test points during design. If a main control chip is connected, 0R resistors must be reserved for
switching external test points during design, as shown in the figure below.
3.4.1 USB Reference Design
A7672X can be used as a USB slave device. The recommended connection circuit diagram is as follows:
Figure 18: USB circuit diagram
Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction
capacitance of the ESD component on USB data lines. On USB_VBUS line, customers should pay
attention to the selection of the D3 device when using it. It is recommended to choose an anti-static and
anti-surge two-in-one device.
NOTE
1. The USB data cable must be strictly routed in 90Ω +/- 10% differential. The TVS devices D1 and D2
on the data line must be selected with equivalent capacitance less than 1pF. The TVS device should be
placed near the USB connector or test point, recommended models ESD73011N and WS05DUCFM.
2. The detection of USB2.0 speed is determined automatically by the USB protocol. The customer does
not need to pull up the DP external, otherwise it may affect the device USB enumeration.
3.4.2 USB_BOOT Interface
A7672X provides one forced download boot interface ‘USB_BOOT’.
Table 13: USB_BOOT description

Pin Power Default
Pin name I/O Description Remark
number domain state
Force downloads
6 USB_BOOT DI 1.8V B-PU
boot port
If the module upgrade fails to boot, you can force upgrade through the USB_BOOT port.
Before the module is powered on, pull the USB_BOOT pin to GND, then apply VBAT power to the module,
and press RESET to enter the download mode. After entering the download mode, you need to release
USB_BOOT and remove the pull-up.
Figure 19: Reference USB_BOOT circuit
Customers will see the download port in the device manager port of the windows system.
Figure 20: Force-download port
NOTE
USB_BOOT only has the function of forcing download and booting before booting (it cannot be pulled
down).
3.5 USIM Interface
A7672X supports both 1.8V and 3.0V USIM Cards. The interface power of the USIM card is provided by the
voltage regulator inside the module, and the normal voltage value is 3V or 1.8V.
Table 14: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

USIM_VDD LDO power output voltage 1.62 1.8 1.98 V
VIH High-level input voltage 0.7*USIM_VDD - USIM_VDD +0.4 V
VIL Low-level input voltage -0.4 0 0.25*USIM_VDD V
VOH High-level output voltage USIM_VDD -0.4 - USIM_VDD V
VOL Low-level output voltage 0 0 0.2 V
Table 15: USIM electronic characteristic 3.0V mode (USIM_VDD=3V)

USIM_VDD LDO power output voltage 2.7 3 3.3 V
VIH High-level input voltage 0.7*USIM_VDD - USIM_VDD +0.4 V
VIL Low-level input voltage -0.4 0 0.25*USIM_VDD V
VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V
VOL Low-level output voltage 0 0 0.3 V
3.5.1 SIM Application Guide
It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com) or SMF15C produced by ON SEMI (www.onsemi.com). Note that the USIM peripheral
circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder
reference circuit.
The following figure shows the 6-pin SIM card holder reference circuit.
Figure 21: SIM interface reference circuit
Figure 22: SIM interface reference circuit (8PIN)
NOTE
1. USIM1_DATA has been pulled up with a 4.7KΩ resistor to USIM1_VDD in module. A 100nF
capacitor on USIM_VDD is used to reduce interference. For more details of AT commands about
USIM, please refer to document [1].
2. USIM2_DATA has no pull resistor, need to add 4.7KΩ resistor pulled up to USIM2_VDD externally.
3.5.2 Recommend USIM Card Holder
It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User
can visit http://www.amphenol.com for more information about the holder.
Figure 23: Amphenol C707 10M006 512 USIM card socket
Table 16: Amphenol USIM socket pin description

Pin Signal Description
C1 USIM_VDD USIM Card Power supply.
C2 USIM_RST USIM Card Reset.
C3 USIM_CLK USIM Card Clock.
C5 GND Connect to GND.
C6 VPP NC
C7 USIM_DATA USIM Card data I/O.
3.6 Analog audio interface
A7672X modules integrate audio codec and audio front end, provide 1 channel of analog audio MIC input
interface and 1 channel of analog audio SPK output interface, customers can connect to the external phone
handle for voice calls.
ADC: 90dB SNR@20~20kHz
DAC: 95dB SNR@20~20kHz
(Class-AB): THD<-85dB@32-ohm
Table 17: MIC input ADC parameter list

Parameter MIN Type MAX Unit
Clock frequency - 6.144 - MHz
Table 18: Analog audio Parameter
Parameter 条件 DR（Type.） THD+N（Type.） MAX Power

-96dB(@vout
ADC RL=10K 101dBA 1.59Vp
-2dBv)
Mono,32Ω -90dB(0.00316%)
Class-AB 100dBA 37mW
Difference (@20mW output)
3.6.1 Analog audio reference design
The analog audio recommendation circuit is as follows:
Figure 24: Analog audio interface reference circuit
3.7 Matrix keyboard interface
A7672X provides a 4*4 matrix keyboard interface.
Table 19: matrix keyboard PIN description

PIN Name Multiplex Function PIN NO. I/O 描述
GPIO8 MK_IN2 47 DI Matrix keyboard input
GPIO3 MK_IN3 20 DI
GPIO10 MK_IN5 68 DI
GPIO6 MK_IN6 36 DI
GPIO7 MK_OUT2 44 DO Matrix keyboard output
GPIO4 MK_OUT3 21 DO
GPIO9 MK_OUT5 67 DO
GPIO5 MK_OUT6 35 DO
The matrix keyboard interface recommendation circuit is as follows:
Figure 25: Matrix keyboard interface reference circuit
3.8 GPIO Interface
A7672X module provides multiple GPIOs.
Table 20: Standard GPIO Resources of A7672X

AT command Pad
Pin Pin Power Default
Pin No. operation GPIO Edge
name typ. domain function
number wakeup
19 GPIO1 GPIO1 IO 1.8V PU Yes
26 GPIO2 GPIO2 IO 1.8V PD Yes
48 GPIO3 GPIO3 IO 1.8V PD No
53 GPIO4 GPIO4 IO 1.8V PU Yes
3.9 I2C Bus
The module provides two sets of I2C interfaces, support standard speed clock frequency 100Kbps, support
high speed clock frequency 400Kbps, its operation voltage is 1.8V.
Figure 26: I2C reference circuit
NOTE
SCL and SDA have no pull-up resistor inside, external resistor is needed and the pulled power source
must be VDD_1V8 output from the module.
3.10 Network status
The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following
figure.
Figure 27: NETLIGHT reference circuit
NOTE
The value of the resistor named “R” depends on the LED characteristic.
The NETLIGHT signal is used to control the LED lights that indicate the status of the network. The working
status of this pin is shown in the table below.
Table 21: 2G mode NETLIGHT pin status

NETLIGHT pin status Module status
Always On Searching Network
200ms ON, 200ms OFF Data Transmit
800ms ON, 800ms OFF Registered network
OFF Power off / Sleep
Table 22: LTE mode NETLIGHT pin status

NETLIGHT pin status Module status
Always On Searching Network
200ms ON, 200ms OFF Data Transmit/Registered
OFF Power off / Sleep
3.11 GNSS interface
A7672X support GNSS function interface. GNSS provides 2 power supply input interfaces, 1 GNSS power
enable control switch, 1 UART interface and 1 pulse synchronous clock signal interface, which are
described in detail as follows.
Table 23: GNSS interface description
PIN
PIN Name I/O Description Note
NO
Power supply range
GNSS_VBKP 116 PI GNSS backup power input
1.4V~3.6V。
The supply voltage shall not

be less than 1.8V, and
1V8_GNSS 97 PI GNSS Vcore、VDDIO input
routing width should more
than 0.5mm.
Active high。
GNSS Vcore、VDDIO power enable
GNSS_PWRCTL 98 DI
control Solution 1：Connect to
GPIO，recommend use
MK_IN_3(PIN20)。
Solution 2：Connect to MCU
GPIO。
1.8V power domain。
Solution 1：Use 10K resistor
to connect UART3_TXD
GNSS_RXD 96 DI GNSS UART RX （PIN50）of the module in
series。
Solution2:Connect to MCU
UART_TX。
1.8V power domain。
Solution 1：Use 10K resistor
to connect UART3_RXD
GNSS_TXD 95 DO GNSS UART TX （PIN49）of the module in
series。
Solution2：Connect to MCU
UART_RX
GNSS pulse synchronous clock
1PPS 100 DO If unused, keep it open.
signal
GNSS recommended reference design solution 1:

A7672X module itself provides power, power enable and UART transmission to GNSS, the recommended
reference design as follow:
Figure 28: GNSS reference design（Non-standalone GNSS solution）
GNSS recommended reference design solution 2:

The external MCU provides power, power enable and UART transmission to GNSS, this solution is used for
scenarios where GNSS can work standalone without the module powering up. The recommended
reference design as follow:
Figure 29: GNSS reference design（standalone GNSS solution）
NOTE
1. Please series in 10K resistors for serial communication lines with non-standalone GNSS solution to
prevent leakage current to the serial ports of GNSS chip.
2. The standalone GNSS reference design is only applicable to 1.8V power domain MCU. If the MCU
is not 1.8V power domain, a level shift circuit should be added.
3. The Vcore power for GNSS 1V8_GNSS has higher requirements for power supply, PCB routing
should as short as possible, and the routing width is required to be at least 0.5mm
3.12 SPI LCD interface
A7672X module provides a set of SPI LCD interface, which only supports LCD module of 1 data line. The
LCD interface of the module does not have specified LCD_TE signal pin. If necessary, you can choose
GPIO to simulate the use of LCD_TE signal. It is recommended to use module pin 44 (MK_OUT_2) as the
LCD_TE signal.
It is recommended to reserve decoupling capacitor on the power supply for LCD, and reserve 0 Ω resistor in
series for debugging. At the same time, 0 Ω in series is reserved on the data line to facilitate the adjustment
of signal quality and prevent signal reflection, overshoot.
Table 24: LCD interface description

PIN Name PIN NO I/O Description Note
LCD_BL_PWM 101 DO LCD backlight PWM signal
LCD_SPI_CLK 102 DO SPI clock
LCD_SPI_TXD 103 DO, DI SPI data (Bidirectional)
LCD_SPI_RXD 104 DI SPI data
LCD_SPI_CS 105 DO SPI CS
LCD_RST 106 DO LCD reset
LCD command/parameter
LCD_DCX 107 DO
selection
The recommended reference design of SPI LCD as follow:
Figure 30: SPI LCD reference design
3.13 SPI camera interface
A7672X only supports SPI camera interface, supports up to 0.3MP pixel encoding, does not support video
mode.
Table 25: SPI camera interface description

PIN Name PIN NO I/O Description Note
CAM_I2C_SDA 117 DI, DO CAM I2C data
CAM_I2C_SCL 118 DO CAM I2C clock
CAM_PWDN 119 DO CAM power down
CAM_RST 120 DO CAM reset
CAM_MCLK 121 DO CAM main clock
CAM_SPI_D0 122 DI CAM SPI DATA 0
CAM_SPI_D1 123 DI CAM SPI DATA 1
CAM_SPI_CLK 124 DO CAM SPI clock
The recommended reference design of SPI camera as follow:
Figure 31: SPI camera reference design
3.14 Bluetooth interface
A7672X module has integrated Bluetooth function inside, and only one BT antenna is left on the module
interface. A7672X Support BT5.0 protocol specification, compatible with BLE low power mode and
traditional BT mode; It only supports Bluetooth data transmission and does not support VoiceOverPCM &
VoHCI.
3.15 Another interface
3.15.1 ADC
A7672X have 1 general ADC and 1 dedicated VBAT_ADC pins. VABT_ADC just available for digitizing
battery voltage. These electronic specifications are shown in the following table.
Table 26: General ADC electronic characteristics

Characteristics Min. Typ. Max. Unit
Resolution – 9 - Bits
Input Range 0 - 1.8 V
Table 27: VBAT_ADC electronic characteristics

Characteristics Min. Typ. Max. Unit
Resolution – 9 - Bits
Input Range 0 - 1.8 V
NOTE
“AT+CADC” can be used to read the voltage of the ADC pin, for more details, please refer to document
[1].
The recommended reference design of VBAT_ADC as follow:
Figure 32: VBAT_ADC reference design
3.15.2 LDO
A7672X has 2 LDO outputs：VDD_1V8 and VDD_2V8.
VDD_1V8 is the module's system IO power supply, which can only provide a current capacity of 50mA. It
cannot be used as a high current drive source. It can be used as a power supply for module 1V8_GNSS
（PIN97）.
VDD_2V8 is the module 2.8V LDO power output, which can only provide a current capacity of 50mA. It
cannot be used as a high current drive source. It can be used as a power supply for LCD VCC_2V8.
Table 28: VDD_1V8 Electrical characteristics

VVDD_1V8 Output voltage - 1.8 - V
IO Output current - - 50 mA
Table 29: VDD_2V8 Electrical characteristics

VVDD_2V8 Output voltage - 2.8 - V
IO Output current - - 50 mA
NOTE
VDD_1V8 is the system power supply. If the damage will affect the system startup, it is recommended
that customers add TVS protection. The recommended model is ESD56051N.
4 RF Specifications
4.1 GSM/LTE Specifications
Table 30: Conducted transmission power
Frequency Power Min.

EGSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
EGSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
LTE-FDD B1 23dBm +/-2.7dB <-40dBm
LTE-TDD B34 23dBm +/-2.7dB <-40dBm
Table 31: GSM Operating bands
Frequency Receiving Transmission

EGSM900 925～960MHz 880～915 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
Table 32: E-UTRA operating bands
E-UTRA UL Freq. DL Freq. Duplex Mode

1 1920~1980 MHz 2110~2170 MHz FDD
2 1850~1910MHz 1930~1990MHz FDD
3 1710~1785 MHz 1805~1880 MHz FDD
4 1710~1755MHz 2110~2155MHZ FDD

5 824～849 MHz 869～894MHz FDD
7 2500~2570MHz 2620~2690MHz FDD
8 880~915 MHz 925~960 MHz FDD
20 832~862MHz 791~821MHz FDD
28 703~748MHz 758~803MHz FDD
66 1710~1780MHz 2110~2200MHz FDD
34 2010~2025MHz 2010~2025MHz TDD
38 2570~2620 MHz 2570~2620 MHz TDD
39 1880~1920 MHz 1880~1920 MHz TDD
40 2300~2400 MHz 2300~2400 MHz TDD
41 2535~2655 MHz 2535~2655 MHz TDD
Table 33: Conducted receive sensitivity
Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)

EGSM900 < -109dBm 3GPP
DCS1800 < -108dBm 3GPP
LTE FDD/TDD See table 34. 3GPP
Table 34: Reference sensitivity (QPSK)
E-UTRA 3GPP standard Actual Duplex

Band 1.4 MHz 3MHz 5MHz 10MHz 15 MHz 20 MHz 10 MHz Mode
1 - - -100 -97 -95.2 -94 -98.5 FDD

2 -102.7 -99.7 -98 -95 -93.2 -92 TBD FDD
3 -101.7 -98.7 -97 -94 -92.2 -91 -98.1 FDD
4 -104.7 -101.7 -100 -97 -95.2 -94 TBD FDD
5 -103.2 -100.2 -98 -95 - - -98.6 FDD
7 -98 -95 -93.2 -92 -98 FDD
8 -102.2 -99.2 -97 -94 - - -98.1 FDD
20 -97 -94 -91.2 -90 -99 FDD
28 -100.2 -98.5 -95.5 -93.7 -91 TBD FDD
66 -104.2 -101.2 -99.5 -96.5 -94.7 -93.5 TBD FDD
34 - - -100 -97 -95.2 - -97.5 TDD
38 - - -100 -97 -95.2 -94 -98.6 TDD
39 - - -100 -97 -95.2 -94 -97.8 TDD
40 - - -100 -97 -95.2 -94 -98.2 TDD
41 - - -98 -95 -93.2 -92 -98.6 TDD
4.2 GSM/LTE Antenna Requirements
For better overall performance, it is recommended that the antenna design refer to the index requirements
in the following table.
Table 35: GSM/LTE antenna requirements
Passive Recommended standard

Operating band
See table 31 and table 32
Direction omnidirectional
Gain > -3dBi (Avg)
Input impedance 50 ohm
Efficiency > 50 %
Maximum input power 50W
VSWR <2
Isolation >20dB
PCB insertion loss(<1GHz) <0.5dB
PCB insertion loss(1GHz~2.2GHz) <1dB
PCB insertion loss(2.3GHz~2.7GHz) <1.5dB
4.3 GNSS Specifications
Table 36: GNSS operating bands
Type Frequency
GPS 1575.42±1.023MHz
GLONASS 1597.5~1605.8MHz
BeiDou 1561.098±2.046MHz
Table 37: GNSS performance
GNSS GPS BeiDou GLONASS
Tracking sensitivity -160dBm -159.5dBm -153dBm

Capture sensitivity -154dBm -154dBm -152dBm
Hot start TTFF <1s
Cold start TTFF <40s
Accuracy <2m
4.4 GNSS Antenna Requirements
Table 38: Recommended Antenna Characteristics (GNSS)
Passive Recommended standard

L1: 1559~1609MHZ
operating band
Direction Hemisphere, face to sky
Input impedance 50 ohm
Maximum input power 50W
VSWR <2
Plan category RHCP or Linear
Passive antenna gain 0dBi
Active antenna gain -2dBi
Active antenna noise figure < 1.5
Built-in antenna LNA gain 20dB(Typ.)
Total antenna gain < 18 dB
Coaxial insertion loss <1.5dB
4.5 Bluetooth specifications
A7672X Support BT5.0 protocol specification, compatible with BLE low power mode and traditional BT
mode.
Table 39: Bluetooth performance
Frequency
2.402GHz~2.483GHz
TX performance
TX Power DH5 2DH5 3DH5
6 TBD TBD dBm
RX performance
RX sensitivity DH5 2DH5 3DH5

-93 -93 -87 dBm
4.6 Antenna Reference Design
4.6.1 Passive Antenna for GSM/LTE/GNSS/Bluetooth
Figure 33: Passive antenna reference
NOTE
GNSS active antenna design is default solution. Strongly suggest to cut off GNSS active antenna
supply by AT+CVAUXS=0, if customer design is passive antenna for GNSS.
In above figure, the component R1/R2/C1/C2 is reserved for antenna matching, the value of components
can only be got after the antenna tuning, usually provided by the antenna factory. Among them, R1 and R2
paste 0Ω, C1 and C2 do not paste by default. The component D1 is a Bidirectional ESD Protection device,
which is suggested to add to protection circuit, the recommended Part Numbers of the TVS are listed in the
following table:
Table 40: TVS part number list
Package Type Supplier

0201 CE0201S05G01R SOCAY
0402 PESD0402-03 PRISEMI
4.6.2 Active Antenna for GNSS
Default power supply value is controlled by AT+CVAUXV, default is 3V, which should meet the antenna
requirement. For example, “AT+CVAUXV=2800” sets power supply 2.8V.
Figure 34: Active antenna reference
4.7 PCB layout
Users should pay attention to the impedance design of PCB layout from the module ANT port to the
antenna connector, and the length of the PCB trance should be within 20 mm, and far away from
interference signals such as power & clock. It is recommended to reserve RF Switch Connector for
conduction test. The reference model of RF Switch Connector is: ECT 818011998.
Figure 35: Reference PCB layout
5 Electrical Specifications
5.1 Absolute maximum ratings
Absolute maximum rating for digital and analog pins of A7672X are listed in the following table, exceeding
these limits may cause permanent damage to the module.
Table 41: Absolute maximum ratings

Parameter Min. Typ. Max. Unit
Voltage on VBAT -0.5 - 4.8 V
Voltage on USB_VBUS -0.5 - 5.4 V
Voltage at digital pins
-0.3 - 2.0 V
(GPIO, I2C, UART,PCM)
Voltage at lO pins -0.3 - 2.0 V
(USIM) -0.3 - 3.9 V
Voltage at PWRKEY, RESET -0.3 - 4.8 V
5.2 Operating conditions
Table 42: Recommended operating ratings

Voltage at VBAT 3.4 3.8 4.2 V
Voltage at USB_VBUS 3.0 5.0 5.4 V
Table 43: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit
VIH High-level input voltage VCC*0.7 1.8 VCC+0.2 V
VIL Low-level input voltage -0.3 0 VCC*0.3 V
VOH High-level output voltage VCC-0.2 - - V
VOL Low-level output voltage 0 - 0.2 V
High-level output current (no pull
IOH - - 13 mA
down resistor)
Low-level output current (no pull
IOL - - 13 mA
up resistor)
Input high leakage current (no
IIH - - 10 uA
pull-down resistor)
Input low leakage current (no pull
IIL -10 - - uA
up resistor)
NOTE
These parameters are for digital interface pins, such as GPIO, I2C, UART, and USB_BOOT.
The operating temperature of A7672X is listed in the following table.
Table 44: Operating temperature

Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 90 ℃
NOTE
The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the
normal operating temperature range and still within the extreme operating temperature range.
5.3 Operating Mode
5.3.1 Operating Mode Definition
The table below summarizes the various operating modes of A7672X product.
Table 45: Operating mode Definition

Mode Function
In this case, the current consumption of module will be reduced
GSM/ LTE Sleep to the minimal level and the module can still receive paging
message and SMS.
Software is active. Module is registered to the network, and the
GSM/LTE Idle
module is ready to communicate.
Normal
Connection between two subscribers is in progress. In this
operation
case, the power consumption depends on network settings
GSM/ LTE Talk
such as DTX off/on, FR/EFR/HR, hopping sequences, and
antenna.
Module is ready for data transmission, but no data is currently
GSM/LTE Standby
sent or received. In this case, power consumption depends on
network settings.
There is data transmission in progress. In this case, power

GPRS/EDGE/LTE
consumption is related to network settings (e.g., power control
Data transmission
level); uplink/downlink data rates, etc.
AT command ‘AT+CFUN=0’ AT+CSCLK=1 can be used to set
the module to a minimum functionality mode without removing
the power supply. In this mode, the RF part of the module will
Minimum functionality mode
not work and the USIM card will not be accessible, but the
serial port and USB port are still accessible. The power
consumption in this mode is lower than normal mode.
AT command ‘AT+CFUN=4’ or pulling down the
FLIGHTMODE pin can be used to set the module to flight
mode without removing the power supply. In this mode, the RF
Flight mode
part of the module will not work, but the serial port and USB
port are still accessible. The power consumption in this mode
is lower than normal mode.
Module will go into power off mode by sending the AT
command ‘AT+CPOF’ or pull down the PWRKEY pin, normally.
Power off In this mode the power management unit shuts down the
power supply, and software is not active. The serial port and
USB are is not accessible.
5.3.2 Sleep mode
In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still
receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let A7672X enter sleep
mode:
 USB condition
 Software condition
 UART condition
NOTE
Before designing, pay attention to how to realize sleeping/waking function and refer to Document [24]
for more details.
5.3.3 Minimum functionality mode and Flight mode
Minimum functionality mode ceases majority function of the module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.
 AT+CFUN=0: Minimum functionality

 AT+CFUN=1: Full functionality (Default)
 AT+CFUN=4: Flight mode
If A7672X has been set to minimum functionality mode, the RF function and SIM card function will be closed.
In this case, the serial port and USB are still accessible, but RF function and SIM card will be unavailable.
If A7672X has been set to flight mode, the RF function will be closed. In this case, the serial port and USB
are still accessible, but RF function will be unavailable.
When A7672X is in minimum functionality or flight mode, it can return to full functionality by the AT
command “AT+CFUN=1”.
5.4 Current Consumption
The current consumption is listed in the table below.
Table 46: Current consumption on VBAT Pins (VBAT=3.8V)

GSM sleep/idle mode
Current under CFUN=0, CSCLK=1 TBD
GSM supply current Sleep mode@BS_PA_MFRMS=2 Typical: TBD
(GNSS off，without USB connection) Idle mode@BS_PA_MFRMS=2 Typical: TBD
LTE sleep/idle mode
LTE supply current Sleep mode@DRX=0.32STypical: TBD
(GNSS off，without USB connection) Idle mode @DRX=0.32STypical: TBD
GSM Talk
EGSM 900 @power level #5 Typical: 320 mA
DCS1800 @power level #5 Typical: 262 mA
GPRS
EGSM900( 2 Rx,4 Tx ) @power level #5 Typical: 630mA
DCS1800( 2 Rx,4 Tx ) @power level #0Typical:395mA
EGSM900( 3Rx, 2 Tx ) @power level #5 Typical:370mA
DCS1800( 3Rx, 2 Tx ) @power level #0Typical:275mA
EDGE
EGSM900( 2 Rx,4 Tx ) @power level #8Typical:460mA
DCS1800( 2 Rx,4 Tx ) @power level #2Typical:300mA
EGSM900( 3Rx, 2 Tx ) @power level #8Typical: 336mA
DCS1800( 3Rx, 2 Tx ) @power level #2Typical:208mA
LTE Cat1
LTE-FDD B1 @10MHz 23dBm Typical :600 mA
LTE-FDD B2 @10MHz 23dBm Typical :TBD
LTE-FDD B7 @10MHz 23dBm Typical :540mA
LTE-TDD B34 @10MHz 23dBm Typical :260mA
LTE-TDD B38 @10MHz 23dBm Typical :340 mA
LTE-TDD B39 @10MHz 23dBm Typical :260 mA
5.5 ESD Notes
A7672X is sensitive to ESD in the process of storage, transporting, and assembling. When A7672X is
mounted on the users’ mother board, the ESD components should be placed beside the connectors which
human body may touch, such as SIM card holder, audio jacks, switches, keys, etc. The following table
shows the A7672X ESD measurement performance without any external ESD component.
Table 47: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.)
Part Contact discharge Air discharge
VBAT, GND +/-5K +/-10K
Antenna port +/-5K +/-10K
USB interface +/-4K +/-8K
UART interface +/-4K +/-6K
Other PADs +/-1K +/-2K
NOTE
Test conditions: The module is on the SIMCom development board (the development board has the
necessary ESD protection devices)
6 SMT Production Guide

6.1 Top and Bottom View of A7672X
Figure 36: Top and bottom view of A7672X
NOTE
The above is the design effect diagram of the module for reference. The actual appearance is subject to
the actual product.
6.2 Label Information
Figure 37: Label information for A7672X
Table 48: The description of label information

No. Description
A Project name
B Part number
C Serial number
D IMEI number
E QR code
6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore, the soldering profile shown below is only a generic
recommendation and should be adjusted to the specific application and manufacturing constraints.
Figure 38: The ramp-soak-spike reflow profile of A7672X
NOTE
For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
A7672X is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
The following table shows the features of Moisture Sensitivity Level (MSL). After seal off, storage conditions
must meet the following table. If the storage time was expired, module must be baking before SMT.
Table 49: Moisture Sensitivity Level and Floor Life

Moisture Sensitivity Floor Life (out of bag) at factory ambient≤30°C/60% RH or
Level (MSL) as stated
1 Unlimited at ≦30℃/85% RH
2 1 year at≦30℃/60% RH
2a 4 weeks at ≦30℃/60% RH
3 168 hours at ≦30℃/60% RH
4 72 hours at ≦30℃/60% RH
5 48 hours at ≦30℃/60% RH
5a 24 hours at ≦30℃/60% RH
Mandatory bake before use. After bake, it must be reflowed within the
6
time limit specified on the label.
NOTE
IPC / JEDEC J-STD-033standard must be followed for production and storage.
7 Packaging
A7672X module support tray packaging.
Figure 39: packaging diagram
Module tray drawing：
Figure 40: Tray drawing
Table 50: Tray size

Length（±3mm） Width（±3mm） Module number
242.0 161.0 20
Small carton drawing：
Figure 41: Small carton drawing
Table 51: Small Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number
270 180 120 20*20=400
Big carton drawing：
Figure 42: Big carton drawing
Table 52: Big Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number
380 280 280 400*4=1600
8 Appendix
8.1 Coding Schemes and Maximum Net Data Rates over Air Interface
Table 53: Coding Schemes and Maximum Net Data Rates over Air Interface
Multislotdefinition(GPRS/EDGE)
Active slot
Slot class DL slot number UL slot number
number
1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5
GPRS coding scheme Max data rata（4 slots） Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
EDGE coding scheme Max data rata（4 slots） Modulation type
MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK
MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK
LTE-FDD device category
Max data rate（peak） Modulation type
(Downlink)
Category M1 1Mbps QPSK/16QAM

LTE-FDD device category
Max data rate（peak） Modulation type
(Uplink)
Category M1 375kbps QPSK/16QAM
8.2 Related Documents
Table 54: Related Documents

NO. Title Description
A7600 Series AT Command
[1] AT Command Manual
Manual _V1.00.04
ITU-T Draft new
[2] Serial asynchronous automatic dialing and control
recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command
[3] GSM 07.07
set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
[5] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS) and
Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
[6] GSM 11.14 Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
[7] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
[8] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
[9] GSM 11.10 Mobile Station (MS) conformance specification ； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
[10] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals and
[11] 3GPP TS 34.124
ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals and
[12] 3GPP TS 34.121
ancillary equipment.
Technical Specification Group Radio Access Network;
[13] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[14] 3GPP TS 34.123-3
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
[15] EN 301 908-02 V2.2.1
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
[16] EN 301 489-24 V1.2.1 (ERM); Electromagnetic Compatibility (EMC) standard for
radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and

portable (UE) radio and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
[18] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain
[20] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)
Module
[21] Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
A7600Series_UART_Applicati This document describes how to use UART interface of
[22]
on Note_V1.xx SIMCom modules.
Antenna design guidelines for
[23] Antenna design guidelines for diversity receiver system
diversity receiver system
A7600
[24] Series_SleepMode_Applicatio Sleep Mode Application Note
n Note_V1.xx
A7600 Series_UIM HOT
This document introduces UIM card detection and UIM hot
[25] SWAP_Application
swap.
Note_V1.00
8.3 Terms and Abbreviations
Table 55: Terms and Abbreviations

Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BD BeiDou
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
DAM Downloadable Application Module
DPO Dynamic Power Optimization
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global Standard for Mobile Communications
HR Half Rate
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
NMEA National Marine Electronics Association

PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
SIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter
PSM Power saving mode
FD SIM fix dialing phonebook
LD SIM last dialing phonebook (list of numbers most recently dialed)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ON SIM (or ME) own numbers (MSISDNs) list
RC Mobile Equipment list of received calls
SM SIM phonebook
NC Not connect
8.4 Safety Caution
Table 56: Safety Caution

Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

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A7672X Series

SIMCom Wireless Solutions Limited

Document Title: A7672X Series Hardware Design

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY

SIMCom Wireless Solutions Limited

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Copyright © 2021 SIMCom Wireless Solutions Limited All Rights Reserved.

6 SMT Production Guide.............................................................................................................................61

Table 23: GNSS interface description....................................................................................................................... 42

Table 24: LCD interface description...........................................................................................................................45

Table 44: Operating temperature................................................................................................................................57

1.1 Product Outline

Table 1: Module frequency bands

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

1.3 Hardware Block Diagram

Figure 1: A7672X block diagram

1.4 Functional Overview

Table 2: General features

Support CS domain and PS domain SMS

Figure 2: Pin assignment overview for A7672X

Table 3: Pin Description

2.2 Pin Description

Table 4: Pin parameter abbreviation

I/O Bidirectional input /output

Table 5: 1.8V IO parameters definition

Table 6: 3.3V IO parameters definition

Table 7: Pin description

UART3_TXD 50 1.8V DOH Log output Two-wire serial

SPI LCD Interface

SPI CAMERA Interface

control input. when pull-up to points for debug.

2.3 Mechanical Information

The following figure shows the package outline drawing of A7672X.

Figure 3: Dimensions (Unit: mm)

The side length dimension is 24.00±0.15mm excluding the burr area.

2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

2.5 Recommend Stencil Size

Recommend stencil thickness≥0.12mm and <0.15mm.

Figure 5: Recommend stencil dimension (Unit: mm)

Figure 6: VBAT voltage drop during burst emission (EDGE/GPRS)

330UF tantalum capacitor.

Table 8: VBAT pins electronic characteristic

3.1.1 Power Supply Design Guide

It is recommended to place four 33pF/10pF/0.1uF/1uF ceramic capacitors near Vbat to improve RF

Figure 7: Power supply application circuit

Table 9: Recommended TVS diode list

No. Manufacturer Part Number VRWM Package

4 WILL ESD56151W05 5V SOD-323

3.1.2 Recommended Power Supply Circuit

Figure 8: Linear regulator reference circuit

The following figure shows the DC-DC regulator reference circuit:

Figure 9: power supply reference circuit

3.1.3 Voltage Monitor

AT command ‘AT+CBC’ can be used to monitor VBAT voltage.

3.2 Power On/ Off and Reset