SIM65M-C Hardware Design V1.00 (240605)

++
SIM65M-C
Hardware Design
GNSS Module
SIMCom Wireless Solutions Limited

SIMCom Headquarters Building, Building 3, No. 289 Linhong
Road, Changning District, Shanghai P.R. China
Tel: 86-21-31575100
support@simcom.com
www.simcom.com
SIM65M-C Hardware Design V1.00
Document Title: SIM65M-C Hardware Design

Version: 1.00
Data 2024-06-05
Status: Released
GENERAL NOTES
SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE

APPLICATION AND ENFGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.
THE INFORMATION PROVIDED IS BASED ON THE REQUIREMENTS SPECIFICALLY FROM THE
CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL
RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMER’S
POSSESSION. FURTHERMORE, THE SYSTEM VALIDATION OF THE PRODUCT DESIGNED BY
SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE
CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED
HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE.
COPYRIGHT
THIS DOCUMENT CONTAINS THE PROPRIETARY TECHNICAL INFORMATION WHICH IS THE

PROPERTY OF SIMCOM LIMITED, COPYING OF THIS DOCUMENT, GIVING IT TO OTHERS, THE
USING OR COMMUNICATION OF THE CONTENTS THEREOF ARE FORBIDDEN WITHOUT THE
OFFICIAL AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF THE DAMAGES.
ALL RIGHTS ARE RESERVED IN THE EVENT OF GRANT OF A PATENT OR THE REGISTRATION OF
A UTILITY MODEL OR DESIGN. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO
CHANGE WITHOUT NOTICE.
SIMCom Wireless Solutions

SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai
P.R.China
Tel: +86 21 31575100
Email: simcom@simcom.com
For more information, please visit:

https://www.simcom.com/download/list-863-en.html
For technical support, or to report documentation errors, please visit:

https://www.simcom.com/ask/ Or email to: support@simcom.com
Copyright © 2024 SIMCom Wireless Solutions Limited All Rights Reserved.
www.simcom.com 2 / 48
Version History
Date Version Description of change Author

2024-06-05 V1.01 Origin Qiu Lei
Contents
1 Introduction ...................................................................................................................... 8
1.1 Documentation Overview .............................................................................................................. 8
1.2 Overview ....................................................................................................................................... 9
1.3 Key Features ................................................................................................................................. 9
1.4 SIM65M-C Functional Diagram................................................................................................... 10
1.5 GNSS Performance .................................................................................................................... 11
1.6 General features ......................................................................................................................... 12
1.7 Power consumption..................................................................................................................... 12
1.8 GNSS operating frequency ......................................................................................................... 13
1.9 A-GPS ......................................................................................................................................... 13
1.9.1 SBAS .................................................................................................................................. 13
1.9.2 RTCM.................................................................................................................................. 13
1.10 AIC .............................................................................................................................................. 14
1.11 Firmware update ......................................................................................................................... 14
2 Package Information.................................................................................................... 15
2.1 Pin out Diagram .......................................................................................................................... 15
2.2 Pin Description ............................................................................................................................ 15
2.3 Machine Dimensions ................................................................................................................... 17
3 Application Interface ................................................................................................... 19
3.1 Power Management .................................................................................................................... 19
3.1.1 Power Input......................................................................................................................... 19
3.1.2 Power on ............................................................................................................................. 20
3.1.3 Power off ............................................................................................................................. 21
3.1.4 Verification of SIM65M-C Start ........................................................................................... 21
3.1.5 Power Saving Modes .......................................................................................................... 21
3.2 Operating Mode .......................................................................................................................... 22
3.2.1 Full on Mode ....................................................................................................................... 22
3.2.2 Idle Mode ............................................................................................................................ 22
3.2.3 RTC mode .......................................................................................................................... 23
3.3 VDD_ANT.................................................................................................................................... 23
3.4 WAKEUP_OUT Signal ................................................................................................................ 24
3.5 UART Interface ........................................................................................................................... 24
3.6 Timemark Output ........................................................................................................................ 25
3.7 RESET_N .................................................................................................................................... 26
4 Antenna ........................................................................................................................ 27
4.1 Antenna Interface ........................................................................................................................ 27
4.2 Antenna Choice Consideration ................................................................................................... 27
4.2.1 Passive Antenna ................................................................................................................. 28
4.2.2 Active Antenna.................................................................................................................... 30
5 Coexistence application .............................................................................................. 31
5.1 In-band jamming ......................................................................................................................... 31
5.2 Out-of-band jamming .................................................................................................................. 32

5.3 Anti-Jamming design................................................................................................................... 32
6 Electrical Characteristics ............................................................................................ 33
6.1 Absolute Maximum Ratings ........................................................................................................ 33
6.2 Recommended Operating Conditions......................................................................................... 33
6.3 Electro-Static Discharge ............................................................................................................. 34
7 Manufacturing .............................................................................................................. 35
7.1 Top and bottom View of Modules ............................................................................................... 35
7.2 Label Description Information ..................................................................................................... 35
7.3 Recommended PCB Footprint .................................................................................................... 36
7.4 Recommended SMT Stencil ....................................................................................................... 36
7.5 Recommended reflow furnace temperature curve ..................................................................... 37
7.6 Moisture Sensitivity Level and Storage conditions ..................................................................... 38
7.7 Baking Requirements .................................................................................................................. 40
8 Packaging ..................................................................................................................... 41
8.1 Tray packaging............................................................................................................................ 41
8.2 Reel packaging ........................................................................................................................... 43
9 Reference Design......................................................................................................... 46
10 Appendix ................................................................................................................ 47
10.1 Related Documents..................................................................................................................... 47
10.2 Terms and Abbreviations ............................................................................................................ 47
10.3 Safety Caution............................................................................................................................. 48
Table Index
TABLE 1: DOCUMENTATION OVERVIEW .................................................................................................... 8

TABLE 2: GNSS PERFORMANCE ............................................................................................................... 11
TABLE 3: GENERAL FEATURES ................................................................................................................. 12
TABLE 4: IO FEATURES .............................................................................................................................. 12
TABLE 5: CONSUMPTION DATA (TYPICAL VALUE) ................................................................................. 12
TABLE 6: GNSS OPERATING FREQUENCIES........................................................................................... 13
TABLE 7: I/O PARAMETER DEFINITION .................................................................................................... 15
TABLE 8: PIN DESCRIPTION ....................................................................................................................... 16
TABLE 9: RECOMMENDED D1 AND D2 LIST............................................................................................. 20
TABLE 10: POWER SUPPLY AND CLOCK STATE ACCORDING TO OPERATION MODE ..................... 22
TABLE 11: HOST PORT FUNCTION PINS .................................................................................................. 24
TABLE 12: ANTENNA SPECIFICATIONS .................................................................................................... 28
TABLE 13: TVS RECOMMENDED LIST ...................................................................................................... 29
TABLE 14: INTERMODULATION DISTORTION(IMD) ................................................................................. 32
TABLE 15: ABSOLUTE MAXIMUM RATINGS ............................................................................................. 33
TABLE 16: SIM65M-C OPERATING CONDITIONS ..................................................................................... 33
TABLE 17: THE ESD CHARACTERISTICS (TEMPERATURE: 25℃, HUMIDITY: 45 %) ........................... 34
TABLE 18: LABEL DESCRIPTION OF MODULE INFORMATION .............................................................. 36
TABLE 19: THE MAIN BOARD REFLUX TEMPERATURE CURVE REQUIREMENTS (LEAD-FREE) ..... 37
TABLE 20: MSL LEVELS .............................................................................................................................. 39
TABLE 21: BAKING REQUIREMENTS......................................................................................................... 40
TABLE 22: TRAY SIZE .................................................................................................................................. 42
TABLE 23: SMALL CARTON SIZE ............................................................................................................... 42
TABLE 24: BIG CARTON SIZE ..................................................................................................................... 43
TABLE 25：REEL SIZE ................................................................................................................................ 44
TABLE 26：PACKING BOX SIZE ................................................................................................................. 45
TABLE 27：BIG CARTON SIZE ................................................................................................................... 45
TABLE 28: RELATED DOCUMENTS ........................................................................................................... 47
TABLE 29: TERMS AND ABBREVIATIONS ................................................................................................. 47
TABLE 30: SAFETY CAUTION ..................................................................................................................... 48
Figure Index
FIGURE 1: SIM65M-C FUNCTIONAL DIAGRAM ......................................................................................... 10
FIGURE 2: SIM65M-C PIN DIAGRAM (TOP VIEW) ..................................................................................... 15
FIGURE 3: SIM65M-C MECHANICAL DIMENSIONS (UNIT: MM) .............................................................. 17
FIGURE 4: POWER SUPPLY REFERENCE CIRCUIT ................................................................................ 19
FIGURE 5: V_BACKUP INPUT REFERENCE CIRCUIT .............................................................................. 20
FIGURE 6: TIMING SEQUENCE OF MODULE POWER-ON AND POWER-OFF ...................................... 21
FIGURE 7: ENTER AND EXIT RTC MODE .................................................................................................. 23
FIGURE 8: WAKEUP HOST.......................................................................................................................... 24
FIGURE 9: CONNECTION OF THE SERIAL INTERFACES ....................................................................... 25
FIGURE 10: TIMEMARK APPLICATION CIRCUIT ...................................................................................... 25
FIGURE 11: RESET RECOMMENDED CIRCUIT ........................................................................................ 26
FIGURE 12: SIM65M-C PASSIVE ANTENNA DESIGN ............................................................................... 28
FIGURE 13: SIM65M-C PASSIVE ANTENNA DESIGN (WITH EXTERNAL LNA AND SAW) .................... 29
FIGURE 14: SIM65M-C PASSIVE ANTENNA DESIGN(PRE-SAW)............................................................ 30
FIGURE 15: SIM65M-C ACTIVE ANTENNA DESIGN ................................................................................. 30
FIGURE 16: TOP AND BOTTOM VIEW OF SIM65M-C ............................................................................... 35
FIGURE 17: LABEL DESCRIPTION OF MODULE INFORMATION ............................................................ 35
FIGURE 18: RECOMMENDED PCB FOOTPRINT (TOP VIEW) (UNIT: MM) ............................................. 36
FIGURE 19: RECOMMENDED SMT STENCIL(TOP VIEW) ........................................................................ 37
FIGURE 20: RECOMMENDED REFLOW FURNACE TEMPERATURE CURVE (LEAD-FREE)................ 37
FIGURE 21: HUMIDITY CARD ..................................................................................................................... 39
FIGURE 22: PACKAGING DIAGRAM ........................................................................................................... 41
FIGURE 23: TRAY DRAWING ...................................................................................................................... 41
FIGURE 24: SMALL CARTON DRAWING ................................................................................................... 42
FIGURE 25: BIG CARTON DRAWING ......................................................................................................... 42
FIGURE 26：PACKAGING INTRODUCE .................................................................................................... 43
FIGURE 27：CARRIER TAPE DRAWING INTRODUCE............................................................................. 44
FIGURE 28：PACKING BOX DRAWING INTRODUCE .............................................................................. 45
FIGURE 29：BIG CARTON DRAWING INTRODUCE ................................................................................. 45
FIGURE 30: REFER SCHEMATIC................................................................................................................ 46
1 Introduction
This document describes the hardware interface of the SIMCom module SIM65-C.
This document can help you quickly understand the interface specifications, as well as electrical and
mechanical details of GNSS module. We also offer you other documents such as SIM65M-C protocol
specification and user guider. These documents ensure you can use SIM65M-C module to design and set
up mobile applications quickly.
1.1 Documentation Overview
Technical information for the module is primarily covered by the documents listed in Table 1. All documents
must be studied for a thorough understanding of the device and its applications.
Table 1: Documentation Overview
SN Document Name Remark

It mainly introduces hardware
components such as interface functions,
[1] SIM65M-C_Hardware_Design(this document) recommended circuits, PCB layout
guides, packaging, and software
instructions
Introduction to how to use the SIM65M
[2] SIM65M-EVB_User_Guide
with EVB
SIM65M-EVB schematic and PCB PDF
[3] SIM65M_EVB SCH&PCB
document
[4] MOD_SIM65M_18 SCH&PCB SIM65M module reference package
The SIM65M-C series software
[5] SIM65M-C Series_NMEA Message_User Guide instruction pole usage method is
introduced in detail
This paper mainly introduces the SMT p
rocess of module production, the requir
[6] Module Secondary SMT Process User Guide
ements of steel mesh production, reflow
welding, welding and repair
NOTE
NOTE
This current revision is an early release to support initial product developers. The content is subject to
change without advance notice.
1.2 Overview
SIM65M-C is a single-band, multi-satellite system small package GNSS positioning module with
independent GPS (support A-GPS)/GLONASS/BEIDOU/Galileo receiver, built-in LNA, no need for external
LNA. The SIM65M-C supports a wide range of positioning and navigation applications, including GPS,
GLONASS, BeiDou, Galileo, QZSS, and A-GPS.
1.3 Key Features
The SIM65M-C module provides customers with different power supply ranges with different options, and
can be adapted to a variety of customer application circuits. The SIM65M-C power supply range is 1.7V to
3.6V, and the modules communicate with the HOST through the UART interface.
SIM65M-C supports the following GNSS satellites:

⚫ GPS, BEIDOU, GLONASS, Galileo also supports QZSS , SBAS.
Besides, module provides the following services:

⚫ Small footprint: 10.1x 9.7 x 2.5mm, 18-pin LCC package
⚫ Support Jamming Removing (AIC)
⚫ Low-noise amplifier has been integrated (LNA)
⚫ Support AGNSS assisted positioning
⚫ Fixed update rate 1Hz to 5Hz1
⚫ Pulse-per-second (PPS) GPS time reference
1．Adjustable duty cycle
2.Typical accuracy: +/- 20ns
⚫ Interface: UART * 1
⚫ Operating temperature: -40 ~ +85ºC
NOTE
NOTE is 1 HZ.
Default
1.4 SIM65M-C Functional Diagram
The following figure shows a functional diagram of the SIM65M-C and illustrates the mainly functional parts:
⚫ The main chip

⚫ SAW filter
⚫ Integrated LNA
⚫ The antenna interface
⚫ The communication interface
⚫ The control signals
VDD_ANT 0R VCC
TCXO V_BACKUP
RTC Crystal RTC PMU
DC Block GPIO
RF_IN RF input SAW L1
DSP
matching
LNA
filter RF UART
MAIN CHIP BOOT_MODE
RESERVED
Flash
GPS/GLONASS/BEI
DOU/Galileo/QZSS
WAKEUP_OUT
Engine RAM RESET_N
ARM TIMEMARK
GPIO
Figure 1: SIM65M-C functional diagram
1.5 GNSS Performance
Table 2: GNSS Performance
Performance
Parameter Description
Min Type Max Unit
Horizontal Position Accuracy1 Automatic position 2 m
2
Velocity Accuracy 0.1 m/s
Timing Accuracy 20 ns
Maximum Altitude 18000 m
Dynamic Performance Maximum Velocity 500 m/s
Maximum Acceleration 4 G
Hot start 1 s
TTFF(without AGPS)3
Cold start 20 s
A-GPS TTFF Cold start 3.5 s
Autonomous
-149 dBm
Sensitivity acquisition(cold start)
(GPS+BD+GLO+GAL) Re-acquisition -159 dBm
Tracking -165 dBm
Channels L1:64
Update rate 1 5 Hz
Receiver
Tracking L1, CA Code
Protocol support NMEA-0183, ICOE Protocol
NOTE
NOTE
1. In all-satellite mode, CEP50 24hr static, -130dBm;
2. 50% at 30m/s;
3. GNSS signal level: -130dBm.
1.6 General features
Table 3: General features
Parameters Value
Supply voltage VCC +1.7V~+3.6V typical:3.3V
54 mV(RMS) max @ f = 0~3MHz
Supply voltage ripple VCC
15 mV(RMS) max @ f > 3 MHz
Storage temperature -45ºC~+95ºC
Operating temperature -40ºC~+85ºC
Host port UART0
NMEA; 8 bits, no parity, 1 stop bit; 115200
Serial port protocol (UART)
baud (configurable)
3D-FIXED 1 pulse per second,
synchronized at rising edge, The rising
TM output (1PPS) edge of the pulse is aligned with UTC
seconds, with an accuracy of about 20ns
pulse length 100ms
Table 4: IO features
Pin voltage domain Parameter Description Min Typ Max

VIL Active low-level input 0V - 0.3 V
1.53 V 1.8V
VIH Active high-level input VCC
3.0V 3.3V
I/O Signal Level (V)
VOL Low-level output range 0 - 0.4 V
1.53 V 1.8V
VOH High-level output range VCC
3.0V 3.3V
1.7 Power consumption
Table 5: Consumption data (typical value)
GPS+GLO+
Parameter Description GPS GPS+BD GPS+BD +GLO
GAL+BDS
Acquisition 38 mA 43 mA 43 mA 47 mA
Tracking @VCC=3.3V 29 mA 31 mA 31 mA 33 mA
IDLE 10 mA
Hardware RTC @V_BACKUP=3.3V 21 uA
1.8 GNSS operating frequency
The SIM65M-C is a single-band, multi-galaxy GNSS positioning module that can receive and track
multi-galaxy GNSS signals. The GNSS operating frequencies are shown in the following table:
Table 6: GNSS Operating frequencies
Type Frequecy (MHz)

GPS L1C/A 1575.42±1.023
GPS L1C* 1575.42±12.276
QZSS L1C/A 1575.42
GLONASS G1 1601.7±6.75
Galileo E1B/C 1575.42±1.023
BeiDou B1I 1561.098±2.046
BeiDou B1C* 1575.42±16.368
1.9 A-GPS
A-GPS is the meaning of Assisted GPS, which is a system that can under certain conditions improve the
startup performance, or time-to-first-fix (TTFF) of a GPS satellite-based positioning system. SIM65M-C
module supports SBAS and RTCM output.
1.9.1 SBAS
SBAS is the abbreviation of Satellite Based Augmentation System. The SBAS concept is based on the
transmission of differential corrections and integrity messages for navigation satellites that are within sight
of a network of reference stations deployed across an entire continent. SBAS messages are broadcast via
geostationary satellites able to cover vast areas.
Several countries have implemented their own satellite-based augmentation system. Europe has the
European Geostationary Navigation Overlay Service (EGNOS) which covers Western Europe and beyond.
The USA has its Wide Area Augmentation System (WAAS). Japan is covered by its Multi-functional
Satellite Augmentation System (MSAS). India has launched its own SBAS program named GPS and GEO
Augmented Navigation (GAGAN) to cover the Indian subcontinent.
1.9.2 RTCM
The module only supports software RTCM output and is not enabled by default. Customers who want to
apply RTCM in the design can contact SIMCom for supporting.
1.10 AIC
The module supports multi-tone AIC (Multi-tone AIC, Active Interference Cancellation) function, which can
effectively suppress or eliminate RF noise harmonics such as Wi-Fi, Bluetooth, and 2/3/4/5G.
NOTE
AIC is enabled by default, users can use the command to control the switch, please refer to "SIM65M-C
Series_NMEA Message_User Guide " for more information.
1.11 Firmware update
The module is shipped with firmware pre-installed. SIMCom may release firmware versions that contain bug
fixes or performance optimizations, so it is important to implement a firmware upgrade mechanism in the
client's system. A firmware upgrade is the process of transferring a binary image file to a receiver and
storing it in flash. For details on firmware upgrades, refer to the firmware upgrade manual.
2 Package Information
2.1 Pin out Diagram
SIM65M-C
GND 1 18 WAKEUP_OUT
TXD0 2 17 GPIO13
RXD0 3 16 BOOT_MODE
TIMEMARK 4 15 RESERVED2
Top View
RESERVED1 5 14 VDD_ANT
V_BACKUP 6 13 GPIO14
NC 7 12 GND
VCC 8 11 RF_IN
RESET_N 9 10 GND
Figure 2: SIM65M-C pin diagram (Top view)
2.2 Pin Description
Table 7: I/O parameter definition
Type Description
AI Analog Input
AO Analog Output
DI Digital Input
DO Digital Output
DIO Digital Input/Output
PI Power Input
PO Power Output
OD Open-drain
Table 8: Pin description
Pin name Pin number I/O Description Comment

Power supply
Main power input, which will be
used to power the baseband and Provide clean and
RF section internally. stable power source to
VCC 8 PI Input voltage range: this pin. Add a 4.7uF
SIM65M-C: 1.7~3.6V, Typ: 3.3V capacitor to this pin for
The supply current requirement decoupling.
can reach 200mA.
If unused, keep open.
It is necessary to
ensure that the active
antenna used is
Internal power output to power the
powered within this
VDD_ANT 14 PO active antenna
range, otherwise it is
The output is typically VCC±0.1V
recommended to
additionally supply
power to the active
antenna
The backup battery input power
supply for RTC
V_BACKUP 6 PI The input voltage range is Must be connected.
1.70V~3.60V, the typical value is
3.3V
GND 1,10,12 - Ground GND
Communication interface
TXD0 2 DO
Voltage domain is VCC
NMEA serial output/ input
RXD0 3 DI If unused, keep open.
System control
Input pin, which is pulled below
0.4V and held for at least 100ms Internal default pulls
RESET_N 9 DI
before being released, can reset 3.3V
the module
GPIOs
WAKEUP_OUT 18 DO GNSS chip wakeup host High active
After successful
Timemark outputs timing pulse
TIMEMARK 4 DO positioning, the default
related to receiver time
output is 1Hz pulse.

GPIO13 17 DIO General purpose input/output
GPIO14 13 DIO General purpose input/output
Default high .
BOOT_MODE 16 DI Boot mode control
Keep floating.
RESERVED 5, 15 - Reserved pins, default high Keep floating.
NC 7 - - Keep floating.
RF interface
Impendence must be
RF_IN 11 AI Radio antenna connection
controlled to 50Ω.
2.3 Machine Dimensions
Following figure shows the Mechanical dimensions of SIM65M-C (top view, side view and bottom view).
Figure 3: SIM65M-C mechanical dimensions (Unit: mm)
NOTE
Outline dimensional tolerances do not include burr areas.
3 Application Interface
3.1 Power Management
3.1.1 Power Input
① VCC supply requirements
VCC is the power supply pin of the module, SIM65M-C power supply range: 1.7V~3.6V, typical value: 3.3V.
The power supply should be able to provide sufficient current up to 200mA. SIM65M-C positioning modules
require a stable power supply, consider the following points:
⚫ Wide power lines or even power planes are preferred.

⚫ VCC supply needs to add a 4.7uF and 100nF multi-layer ceramic chip (MLCC) capacitors with low ESR
in high frequency band, which can be used for EMC performance .
⚫ The ripple of the VCC supply cannot be higher than 15mV.
⚫ VCC supply needs a ESD and surge protection.
VCC
VCC
D1 D2
C1 C2 C3
SIM65M 33pF 100nF 4.7uF
5.1V 5V
GND
Figure 4: Power supply reference circuit
NOTE
D2 is used for ESD protection and D1 is used for surge protection.
Table 9: Recommended D1 and D2 list
No. Manufacturer Part number VRWM Package Ref. Designator

1 JCET ESDBW5V0A1 5V DFN1006-2L
D2
2 WAYON WS05DPF-B 5V DFN1006-2L
3 LRC LEDZ5.1BT1G 5.1V SOD-523
D1
4 Prisemi PZ5D4V2H 5.1V SOD-523
② Backup supply (V_BACKUP)
The V_BACKUP pin is backup power, and the power supply range is 1.7V~3.6V. By using valid time and
GNSS track data at start-up, the module enables hot (warm) start-up. When the module is turned on, the
V_BACKUP should be connected to the power supply and maintain the power supply all the time; If RTC
entry is required, power is maintained V_BACKUP VCC is maintained after sending a command to enter
RTC mode1.
1k
V_BACKUP 3.3V always
on power
C1 C2 C3 D2
SIM65M 33pF 100nF 4.7uF 5V Rechargeable
battery
GND
Figure 5: V_BACKUP input reference circuit
NOTE
1. The V_BACKUP voltage must not be lower than the minimum recommended operating voltage,
otherwise the module may operate abnormally.
2. If a battery is connected, it is recommended to use a rechargeable battery, and please select the
current limiting resistor according to the charging current requirements of the rechargeable battery
3.1.2 Power on
When power is first applied, SIM65M-C goes into operation mode. VCC should power up quickly within
50ms, and to ensure proper power-up sequencing, backup power should be started no later than VCC, so
V_BACKUP must be powered up before or at the same time as VCC. The module power-up and
disconnection timing diagram is shown in Figure 6.
3.1.3 Power off
When the power supply of the module VCC is disconnected, the voltage should be guaranteed to drop
rapidly within 50ms. In order to ensure that the power-on sequence is abnormal when the module is
powered on next time it is powered on and restarted, ensure that the module VCC is powered down to less
than 1V and maintained for at least 5s, and then perform power-on restart.
Power on Power off Power on

HD-RTC
V_BACKUP ＞0s
＞0s V_BACKUP＜1V 5s
＜50ms VCC＜1V 5s ＜50ms

VCC ＜50ms
Invalid Valid Invalid Valid

UART
Figure 6: Timing sequence of module power-on and power-off
3.1.4 Verification of SIM65M-C Start
System activity indication depends upon the chosen serial interface:

When it is activated, SIM65M-C will output messages at the selected UART speed, and message types.
The default baud rate is 115200bps.
3.1.5 Power Saving Modes
SIM65M-C supports power saving modes for reducing average power consumption like IDLE mode, RTC
mode.
⚫ Idle mode: In this mode, the module enters standby mode, retaining some peripherals. The host can
wake up the module by sending a wake-up command.
⚫ RTC mode: The host side sends instructions through the communication interface and enters the
software RTC mode.
NOTE
The modes mentioned above are operated by commands, users can refer to “SIM65M-C Series_NMEA
Message_User Guide” for more information.
3.2 Operating Mode
Table 10: Power supply and clock state according to operation mode
Power
Mode VCC V_BACKUP Internal LDO NMEA
consumption
Full mode on on on on High
Idle mode on on on off low
RTC mode off on off off lowest
3.2.1 Full on Mode
The module will enter full on mode after first power up with factory configuration settings. Power
consumption will vary depending on the amount of satellite acquisitions and number of satellites in track.
This mode is also referenced as full on, full power or navigation mode.
First positioning (different CN value, different positioning time), can download complete ephemeris data 15
minutes after positioning.
Navigation is available and any configuration settings are valid as long as the VCC power supply is active.
When the power supply is off, settings are reset to factory configuration and receiver performs a cold start
on next power up.
3.2.2 Idle Mode
Idle mode means that the power supply is in the low active state and RTC and backup RAM are enabled.
Inside the module, such as the baseband digital circuit part and the RF part, go to the standby. The power
management chip switches to low-power mode, where the power input VCC and V_BACKUP should
always remain powered. Commands can be sent through the UART interface to control the module to
enter/exit idle mode.
⚫ Entering into Idle mode:

Send the command $RESET,3,0, the module returns $OK*04, and then enter Idle mode.
⚫ Exiting sleep mode:

Send the command $RESET,0,0, the module returns $OK*04, and then exits Idle mode
3.2.3 RTC mode
The module provides lower power consumption than Idle mode and is suitable for applications that are idle
for long periods of time or where power consumption is sensitive. In RTC mode, the module stops capturing
and tracking satellite signals, and only the backup domain remains active, continuing to record time.
⚫ Enter hardware RTC mode

1. Disconnect the VCC separately and keep the V_BACKUP powered.
⚫ Exit hardware RTC Mode
1. Reconnect the VCC and module will exit RTC mode automaticly.
Enter RTC mode

RTC mode
Full on mode Exit RTC mode and enter Full
on mode
V_BACKUP
VCC
UART Valid Invalid Valid
Figure 7: Enter and Exit RTC Mode
3.3 VDD_ANT
VDD_ANT is a power output pin for powering an active antenna, the output voltage domain is VCC. For the
detail usage of VDD_ANT, customer can refer to section 9 for details.
NOTE
VDD_ANT must be connected in series with a current limiting resistor of 10 ohm.
3.4 WAKEUP_OUT Signal
The WAKEUP_OUT pin of the SIM65M-C can be used to wake up the host and GNSS interrupt to wake up
the master. The output level is low before positioning, and it will be automatically pulled up after positioning,
waking up the main control to receive data (no command response).
3D-FIX
1PPS
WAKEUP_OUT
Figure 8: Wakeup host
3.5 UART Interface
The SIM65M-C module provides a UART interface, and the default function configuration is as follows.
⚫ Serial communication
⚫ NMEA output
⚫ Command input.
⚫ Firmware upgrade.
Table 11: Host port function pins
Pin name Pin number I/O Description Comment

TXD0 2 DO Serial data output of NMEA
The voltage domain is
Serial data input for firmware VCC
RXD0 3 DI
update
NOTE
1. The default baud rate is 115200, if other baud rate required please contact SIMCom.
2. If the IO voltage of the MCU does not match the module, a level shifting circuit must be added.
The following figure shows the connection between module and client (DTE).
Module(DCE) Customer(DTE)
Serial Port Serial Port
TXD TXD
RXD RXD
GND GND
Figure 9: Connection of the serial interfaces
3.6 Timemark Output
The Timemark pin outputs pulse-per-second (PPS) pulse signal for precise timing purposes after the
position has been fixed. The Timemark signal can be provided through designated output pin for many
external applications. This pulse is not only limited to be active every second but also allowed to set the
required duration, frequency, and active high/low by programming user-defined settings.
PPS GPS time reference with adjustable duty cycle and +/- 20ns accuracy, support for time service
application, which is achieved by the PPS vs NMEA feature.
The following figure is the typical application of the TIMEMARK function.
Figure 10: TIMEMARK application circuit
3.7 RESET_N
Input enable pin, pull this pin low for 100ms and then release it, which can reset the module and can be
used to exit software RTC mode. This pin has been pulled up 10k resistors to VCC inside the module,
eliminating the need to add pull-up resistors outside the module. The recommended circuit is as
follows:
Module
VCC
Treset
10k
RESET Reset
Reset pulse logic
4.7k
47k
Figure 11: RESET recommended circuit
4 Antenna
The antenna is the most critical item for successful GPS/GLONASS/BEIDOU/Galileo reception in a weak
signal environment. Proper choice and placement of the antenna will ensure that satellites at all elevations
can be seen, and therefore, accurate fix measurements are obtained.
It is recommended to use an active GPS/GLONASS/BEIDOU/Galileo antenna. In a typical application,

SIM65M-C with an active antenna can get a tracking sensitivity about 3dB better than SIM65M-C with a
passive antenna.
4.1 Antenna Interface
The SIM65M-C receives L1 band signals from GPS/GLONASS/BEIDOU/Galileo satellites, The RF signal is
connected to the RF_IN pin. And the trace from RF_IN to antenna should be controlled to 50Ω impendence.
To suit the physical design of individual applications the RF interface pad can lead to two alternatives:
Recommended approach: solderable RF coaxial cable assembly antenna connector, such as HRS’
U.FL-R-SMT (10) connector or I-PEX’s 20279-001E-01 RF connector.
SMA connector.
4.2 Antenna Choice Consideration
To obtain excellent GNSS reception performance, a good antenna will always be required. Proper choice
and placement of the antenna will ensure that satellites at all elevations can be seen, and therefore,
accurate fix measurements are obtained.
The total noise figure should be well below 3 dB.
If a patch antenna is the preferred antenna, choose a patch of at least 15x15x4 mm for standalone.
GPS/QZSS, or choose a patch of at least 25x25x4 mm for GPS + GLONASS. For smaller antennas, an
LNA with a noise figure <2 dB is recommended.
⚫ Make sure the antenna is not located close to noisy parts of the circuitry (e.g. micro-controller or High
Power or display).
⚫ To optimize performance in environments with out-of-band jamming sources, use an additional SAW
filter.
⚫ The micro strip must be 50 Ω and be routed in a section of the PCB where minimal interference from
noise sources can be expected.
⚫ In case of a multi-layer PCB, use the thickness of the dielectric between the signal and the first GND
layer (typically the 2nd layer) for the micro strip calculation.
⚫ If the distance between the micro strip and the adjacent GND area (on the same layer) does not
exceed 5 times the track width of the micro strip.
⚫ Use an external LNA if your design does not include an active antenna when optimal performance is
important.
The suggested active antenna should be chosen as following:
Table 12: Antenna Specifications
Parameter Specification Passive and active antenna

Frequency range L1 1560～1609MHz
Active Antenna Polarization RHCP
Recommendations Gain >25dB
Noise Figure <1.5 dB
4.2.1 Passive Antenna
Passive antenna contains only the radiating element, e.g. the ceramic patch, the helix structure,and chip
antennas. Sometimes it also contains a passive matching network to match the electrical connection to 50
Ohms impedance.
The most common antenna type for GPS/GLONASS/BEIDOU/Galileo application is the patch antenna.
Patch antennas are flat, generally have a ceramic and metal body and are mounted on a metal base plate.
Figure 12 shows a minimal setup for a GPS/GLONASS/BEIDOU receiver with SIM65M-C module.
GND 1 18 WAKEUP_OUT
2
TXD0 17 RXD2/SCL passive
SIM65M
RXD0 3 16 TXD2/SDA
antenna
4
Top View 15
TIMEMAKE GPIO1
EINT_IN 5 14 VDD_ANT
NC 7 12 GND
0R
VCC 8 11 RF_IN
RESET_N 9 10 GND C1 C2 D1
NC NC
Figure 12: SIM65M-C passive antenna design
NOTE
TVS requires ultra-low junction capacitance, less than 0.3 pF is recommended.
Table 13: TVS recommended list
Clamping Junction
No Vendor Device Package
Voltage Capacitance
1 Prisemi PESDEC2XD5VBF 15V 0.15pF DFN0603-2L
2 WAYON WE05DGCF-B 20V 0.18pF DFN0603-2L
3 WAYON WE05DGCMS-BH 20V 0.15pF DFN0603-2L
4 INPAQ TVC5VB1SD-DFN0603-2L 4.7V 0.18pF DFN0603-2L
For better performance with passive antenna designs user can use an external LNA to increase the
sensitivity up 3~4 dB. Please see Figure 13.
GND 1 18 WAKEUP_OUT
2 17
TXD0 RXD2/SCL Passive antenna
SIM65M
RXD0 3 16 TXD2/SDA
4
Top View 15
TIMEMAKE GPIO1
NC 7 12 GND SAW LNA
VCC 8 11 RF_IN
9 10 GND
RESET_N
Figure 13: SIM65M-C passive antenna design (with external LNA and SAW)
For best performance, user can add an external saw based on Figure 12 design to avoid interference,
please see Figure 14.
GND 1 18 WAKEUP_OUT
2 17
Passive antenna
TXD0 RXD2/SCL
SIM65M
RXD0 3 16 TXD2/SDA
4
Top View 15
TIMEMAKE GPIO1
NC 7 12 GND SAW
VCC 8 11 RF_IN
9 10 GND
RESET_N
Figure 14: SIM65M-C passive antenna design(pre-saw)
4.2.2 Active Antenna
Active antenna has an integrated Low-Noise Amplifier (LNA). Active antenna needs a power supply that
will contribute to GNSS system power consumption.
Usually, the supply voltage is fed to the antenna through the coaxial RF cable shown as Figure 15. For the
output voltage of pin 14, refer to the specific module model used. If the output voltage of pin 14 meets the
supply voltage of the active antenna, PIN 14 VDD_ANT can be connected to RF_IN as figure 16 shows. If
the requirements are not met, other power should be connected to RF_IN.
GND 1 18 WAKEUP_OUT
2
TXD0 17 RXD2/SCL Active
SIM65M
RXD0 3 16 TXD2/SDA antenna
4
Top View 15
TIMEMAKE GPIO1
10R
5 14 VDD_ANT
EINT_IN
6 13
C4 C5
V_BACKUP GPIO14
100nF 100pF 68nH
NC 7 12 GND R1
8 11 RF_IN
0R
VCC
RESET_N 9 10 GND C1 C2 C3
NC NC 100pF
Figure 15: SIM65M-C active antenna design
If the customer’s design is for automotive applications, then an active antenna can be used and located on
top of the car in order to guarantee the best signal quality.
GNSS antenna choice should base on the designing product and other conditions. For detailed Antenna
designing consideration, please refer to related antenna vendor’s design recommendation. The antenna
vendor will offer further technical support and tune their antenna characteristic to achieve successful GNSS
reception performance depending on the customer’s design.
5 Coexistence application
GNSS receivers typically receive signals below -130dBm and are susceptible to noise sources in the
environment. The 3GPP protocol specifies that the maximum transmission power of LTE and NR PC3 is
about 23dBm, and the maximum transmission power of NR PC2 is about 26dBm, when the GNSS receiver
and wireless communication module coexist, the system needs to be optimized to avoid GNSS signal
interference.
In the system where GNSS receivers and wireless communication modules coexist, both in-band and
out-of-band jamming signals can occur, and this section will introduce the sources and effects of jamming
signals, and propose anti-jamming design schemes.
5.1 In-band jamming
When the frequency of an interfering signal is within the GNSS operating band, it is called in-band jamming.
In-band jamming is often generated by adjacent RF transceivers, such as in vehicle tracking and connected
car solutions, where cellular communication modules used in combination with GNSS receivers are prone
to jamming signals.
Because RF jamming reduces the quality of the GNSS signal and prolongs the search time, it will take
longer for the GNSS receiver to achieve the first position. Because the power consumption for the first fix is
significantly greater than the power consumption required for tracking after the first position, RF jamming
can lead to increased power consumption, ultimately reducing battery life. Therefore, reducing RF jamming
is especially important in power-constrained applications, such as battery-powered GNSS location trackers.
In some cases, RF jamming can cause GNSS signal loss, and while newer GNSS receivers can track
multiple satellites in multiple GNSS constellations simultaneously, the loss of some useful signals can still
lead to reduced positioning accuracy, or in the worst case, complete loss of positioning.
In the case of GPS L1, the band has a center frequency of 1575.42 MHz and a bandwidth of 2.046 MHz.
When the 4G/5G communication module in the system is operating, it may generate jamming signals with
frequencies between 1574.4MHz ~ 1576.4MHz, and the jamming signal power will be higher than the actual
received GPS signal.
Common types of RF jamming are high-order harmonics and intermodulation distortion, which refers to the
combination of frequencies of several signals of different frequencies that are the same or similar to the
frequency of the useful signal when they pass through a nonlinear circuit, thereby causing jamming to the
GNSS receiver. The second harmonic of LTE Band 14 and the in-band jamming caused by the
intermodulation distortion of the two different signals are listed in the table below.
Table 14: Intermodulation distortion(IMD)
Intermodulation
Signal S1 Signal S2 IM
distortion products
LTE Band 14 N/A 2 × S1 (788 MHz) 2nd harmonic = 1576 MHz
Wi-Fi 2.4 2nd order intermodulation =
LTE Band 5 S1 (2412 MHz) - S2 (836.5 MHz)
GHz 1575.5MHz
3rd order intermodulation =
LTE Band 3 LTE Band 2 2 × S1 (1727.5 MHz) - S2 (1880 MHz)
1575 MHz
3rd order intermodulation =
Wi-Fi 5 GHz LTE Band 2 S1 (5295 MHz) - 2 × S2 (1860 MHz)
1575 MHz
5.2 Out-of-band jamming
When the frequency of an interfering signal is outside the GNSS operating band, it is called out-of-band
jamming. Out-of-band jamming can leak into the GNSS receiver's spectrum. When the out-of-band signal is
strong, it is important to suppress the out-of-band signal in advance, because the GNSS module's low-noise
amplifier (LNA) has a maximum output limit, and the strong signal flow transmitted by other communication
systems may cause the LNA to saturate, reduce the gain, pre-filter the out-of-band signal, and the useful
signal can obtain better gain. Therefore, band-pass filters can be used to reject signals outside the
frequency band used.
In practical applications, common strong jamming signals usually come from wireless communication
modules, such as LTE, NR, Wi-Fi signals, etc.
5.3 Anti-Jamming design
In order to reduce the influence of interference signals on GNSS reception performance, the following
anti-interference design scheme is proposed:
⚫ The receiving antenna of the GNSS module should be as far away as possible from the transmitting
antenna of the cellular communication module, and it is recommended that the isolation between the
antennas be greater than 15dB.
⚫ When the GNSS module and the wireless communication module coexist, the interference source
usually has RF power amplifier, single-chip microcomputer, crystal, etc., in the PCB ornament and layout,
the interference source should be far away from the GNSS module, the use of shielding frame and shielding
cover to ensure sufficient grounding, can effectively prevent strong signal interference.
⚫ Using a narrowband antenna, tuning the antenna to only receive the working band of GNSS can filter
out a part of the out-of-band noise and interference signals;
⚫ Refer to Figure 14, the additional use of surface acoustic wave filters (SAWs) can effectively suppress
out-of-band interference and improve the signal-to-noise ratio.
6 Electrical Characteristics
6.1 Absolute Maximum Ratings
The absolute maximum ratings stated in Table 15 are stress ratings under non-operating conditions.
Stresses beyond any of these limits will cause permanent damage to SIM65M-C.
Table 15: Absolute maximum ratings
Parameter Min Max Unit

VCC @SIM65M-C - 3.6 V
V_BACKUP - 3.6 V
Storage temperature -45 +95 ℃
Operating temperature -40 +85 ℃
6.2 Recommended Operating Conditions
Table 16: SIM65M-C operating conditions
Parameter Symbol Min Typ Max Unit

Operating temperature range -40 +25 +85 ℃
Main supply voltage VCC @SIM65M-C 1.7 3.3 3.6 V
VDD_ANT Active antenna VDD_ANT - - VCC V
supply voltage output Imax - - Ivcc mA
Backup battery voltage V_BACKUP 1.7 3.3 3.6 V
6.3 Electro-Static Discharge
The GPS engine is not protected against Electrostatic Discharge (ESD) in general. Therefore, it is subject to
ESD handing precautions that typically apply to ESD sensitive components. Proper ESD handing and
packaging procedures must be applied throughout the processing, handing and operation of any application
using a SIM65M-C module.
Table 17: The ESD characteristics (Temperature: 25℃, Humidity: 45 %)
Pin Contact discharge Air discharge

VCC ± 4 kV ± 8 kV
GND ± 4 kV ± 8 kV
VDD_ANT ± 4 kV ± 8 kV
RF_IN ± 4 kV ± 8 kV
NOTE
Test conditions:
1. The external of the module has surge protection diodes and ESD protection diodes.
2. The data in Table 17 were tested using SIMCom EVB.
7 Manufacturing
7.1 Top and bottom View of Modules
Figure 16: Top and bottom view of SIM65M-C
7.2 Label Description Information
Figure 17: Label description of module information
Table 18: Label description of module information
No. Description
A Logo
B Project name
C Authentication
D 1 pin identification
E QR code, Contains P/N, SN and SW information
NOTE
The above is the design effect diagram of the module for reference. The actual appearance is subject to
the actual product.
7.3 Recommended PCB Footprint
The following figure shows the PCB footprint of the modules:
Figure 18: Recommended PCB footprint (top view) (Unit: mm)
7.4 Recommended SMT Stencil
The following figure shows the SMT stencil of SIM65M-C. Suggested solder paste stencil height is
120um~150um minimum to ensure sufficient solder volume.
Figure 19: Recommended SMT stencil(top view)
7.5 Recommended reflow furnace temperature curve
The following figure is the Ramp-Soak-Spike Reflow Profile of SIM65M-C:
Figure 20: Recommended reflow furnace temperature curve (lead-free)
Table 19: The main board reflux temperature curve requirements (lead-free)
Zone Time Parameter

Preheat Zone (Room temperature~150℃) NA Heating rate: 1~2℃/s
T1 (150~180℃) 60~120s /
T2 (180~220℃) 15~20s /
T3 (≥220℃) 40~60s Peak temperature: 240~245℃
Cooling Zone NA Cooling rate: -2~-5℃/s
NOTE
⚫ Recommended lead-free process.

⚫ In the table above, the temperature testing location includes the solder mask of the module MCU
pins, bottom LGA pins, and external LCC pins.
⚫ The actual welding temperature is affected by other external factors, such as the presence of furnace
carriers, solder paste, size and thickness of the substrate, and component resistance. Thermal
requirements and panel design, etc. Please confirm with our engineering and technical personnel in
time if the recommended parameters cannot be reached. Otherwise, the module may be damaged.
⚫ For boards with thickness less than 1.2mm, it is recommended to use board supported by furnace
carrier or high Tg to prevent warping and PCB when heated. Deformation, thus affecting module
welding. For modules larger than 35.0 mm *35.0 mm and 5G products, it is recommended to use the
furnace carrier to pass through the furnace to reduce the cause of the bottom plate and mold. Due
to the difference of Tg value of block, the phenomenon of unbalanced thermal stress appears in the
process of high temperature welding reflow, resulting in the defect rate of virtual welding and little
tin.
⚫ After the module is welded, X-ray and optical inspection methods shall be used to check the welding
quality. For specific standards, please refer to relevant standards of IPC-A-610H.
⚫ For more information about shipping and manufacturing, please refer to “Module Secondary SMT
Process User Guide”.
⚫ Due to the complexity of the SMT process, in case of uncertainty or processes not mentioned in this
document (such as selective wave soldering, ultrasonic welding), please contact SIMCom support
team before SMT process starts.
7.6 Moisture Sensitivity Level and Storage conditions
Modules are shipped in vacuum-sealed aluminum foil bag bags, vacuum packaging according to
IPC/JEDEC standard J-STD-020C specification.
⚫ Recommended storage conditions: temperature 23℃± 5℃, and relative humidity 35%~60%.
⚫ Storage period: 12 months (Under recommended storage conditions and in sealed vacuum
packaging).
The module meets the humidity sensitivity level 3 (MSL-3), and the storage period after unpacking is
shown in table below.
The out-of-bag floor life of the module with MSL-3 is 168 hours. If the workshop temperature is 23℃±5℃
and the relative humidity is less than 60%, the module needs to be unpacked within 168 hours of reflux
production or other high temperature operations. Otherwise, the module shall be stored in an environment
with relative humidity less than 10% (for example, a moisture-proof cabinet) to keep the product dry.
Table 20: MSL levels
MSL Out-of-bag floor life Comment

1 Unlimited ≤+30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
≤+30℃/60% RH
4 72 hours
5 48 hours
5a 24 hours
Mandatory bake before use. After bake, it must be
6
reflowed within the time limit specified on the label.
Before use, it is necessary to confirm whether the package is in good condition; After unpacking, check the
status of humidity indicator card in vacuum bag (Figure 21). The module needs to be baked before use if any
of the following conditions occur.
⚫ Explanation Humidity indicator card: 30%, 40%, and 50% of any indicator circle has discolouring
⚫ The module has been un-packed and the module exceeds the humidity sensitivity level corresponding
to the exposed workshop time. For example, MSL=3 is 168.
⚫ Packed，but the Shelf Life exceeds 12 months；
⚫ Exceeds the Floor Life；
⚫ Unable to track and determine the status of the module.
Figure 21: Humidity card
The following conditions also need to be pre-baked.

⚫ The storage temperature and humidity do not meet the recommended storage conditions.
⚫ Vacuum sealed bag leak, bulk materials
⚫ Before repairing the module.
⚫ After unpacking, the module failed to complete production or storage under the control of humidity
sensitive level 3.
7.7 Baking Requirements
If baking is required, proceed according to the requirements in the table below. Preferentially choose a
nitrogen-filled oven.
Table 21: Baking requirements
Baking conditions Baking time Comment

120°C±5°C, <5% RH 8 hours Not applicable to original packaging pallets
NOTE
⚫ In order to prevent and reduce the occurrence of poor welding caused by moisture, such as foaming
and delamination, the module should be strictly controlled. It is not recommended to expose the
module to air for a long time after unpacking the vacuum package。
⚫ Before baking, it is necessary to remove the module from the package and place the bare module
on the high temperature resistant device to avoid high temperature damage to the plastic tray or
coil; The modules for secondary baking must be welded within 24 hours after baking, otherwise they
need to be stored in vacuum packaging or in a drying oven.
⚫ Please pay attention to ESD protection when unpacking and placing modules, such as wearing
anti-static gloves.
8 Packaging
Module support tray and reel packaging. The module is packaged in trays by default, select REEL if reel
packaging is required.
8.1 Tray packaging
Figure 22: packaging diagram
Module tray drawing：
Figure 23: Tray drawing
Table 22: Tray size
Length（±3mm） Width（±3mm） Module number

242.0 161.0 50
Small carton drawing：
Internal
Figure 24: Small carton drawing
Table 23: Small Carton size
Length（±10mm） Width（±10mm） Height（±10mm） Module number

270 180 120 50*20=1000
Big carton drawing：
Internal
Figure 25: Big carton drawing
Table 24: Big Carton size

380 280 280 1000*4=4000
8.2 Reel packaging
Figure 26：Packaging introduce
Carrier tape drawing：
Figure 27：Carrier tape drawing introduce
Table 25：Reel size
External Diameter Inside Diameter

Width（mm） Module number
（mm）（mm）
330.0 24.0 100.0 1000
Packing box drawing：
Figure 28：Packing box drawing introduce
Table 26：Packing box size

345 340 60 1000
Big carton drawing：
Figure 29：Big carton drawing introduce
Table 27：Big carton size

380 275 380 1000*4=4000
9 Reference Design
Following figure is the typical application of SIM65M-C with active antenna which supplied by VDD_ANT. If
customer applies other kind of active antenna, keep PIN 14 floating and connect other voltage to the R125.
Figure 30: Refer schematic
NOTE
Please note the I/O level of the SIM65M-C, and users should pay attention to level matching when
using it.
10 Appendix
10.1 Related Documents
Table 28: Related documents
SN Document name Remark

[1] SIM65M-C_Hardware_Design(this document)
[2] SIM65M-EVB_User_Guide
[3] SIM65M_EVB SCH&PCB
[4] MOD_SIM65M_18 SCH&PCB
[5] SIM65M-C Series_NMEA Message_User Guide
[6] Module Secondary SMT Process User Guide
10.2 Terms and Abbreviations
Table 29: Terms and abbreviations
Abbreviation Description
A-GPS Assisted- Global Positioning System
CMOS Complementary Metal Oxide Semiconductor
DGPS Difference Global Positioning System
EASY Embedded Assist System
EGNOS Euro Geostationary Navigation Overlay Service
EPO Extended Prediction Orbit
ESD Electrostatic Sensitive Devices
FSM Finite State Machine
GAGAN The GPS Aided Geo Augmented Navigation
GPS Global Positioning System
GNSS Global Navigation Satellite System
I/O Input/Output
Inorm Normal Current
Imax Maximum Load Current
kbps Kilo bits per second
LNA Low Noise Amplifier
MSAS Multi-Functional Satellite Augmentation

MSL moisture sensitive level
NMEA National Marine Electronics Association
QZSS Quasi-Zenith Satellites System
RTCM Radio Technical Commission for Maritime Services
SBAS Satellite Based Augmentation Systems
WAAS Wide Area Augmentation System
10.3 Safety Caution
Table 30: Safety caution
Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Mobiles operate over radio frequency signals and cellular networks and cannot be
guaranteed to connect in all conditions, especially with a mobile fee or an invalid
(U)SIM card. While you are in this condition and need emergent help, please
remember to use emergency calls. In order to make or receive calls, the cellular
terminal or mobile must be switched on and in a service area with adequate cellular
signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid (U)SIM card be properly inserted in the
cellular terminal or mobile.

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SIMCom Wireless Solutions Limited

Document Title: SIM65M-C Hardware Design

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE

THIS DOCUMENT CONTAINS THE PROPRIETARY TECHNICAL INFORMATION WHICH IS THE

SIMCom Wireless Solutions

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Copyright © 2024 SIMCom Wireless Solutions Limited All Rights Reserved.

Date Version Description of change Author

5.2 Out-of-band jamming .................................................................................................................. 32

TABLE 1: DOCUMENTATION OVERVIEW .................................................................................................... 8

1.1 Documentation Overview

Table 1: Documentation Overview

SN Document Name Remark

1.3 Key Features

SIM65M-C supports the following GNSS satellites:

Besides, module provides the following services:

1.4 SIM65M-C Functional Diagram

⚫ The main chip

RTC Crystal RTC PMU

Figure 1: SIM65M-C functional diagram

1.5 GNSS Performance

Table 2: GNSS Performance

1.6 General features

Table 3: General features

Pin voltage domain Parameter Description Min Typ Max

1.7 Power consumption

Table 5: Consumption data (typical value)

1.8 GNSS operating frequency

Table 6: GNSS Operating frequencies

Type Frequecy (MHz)

1.11 Firmware update

2.1 Pin out Diagram

Figure 2: SIM65M-C pin diagram (Top view)

2.2 Pin Description

Table 7: I/O parameter definition

Table 8: Pin description

Pin name Pin number I/O Description Comment

Voltage domain is VCC

2.3 Machine Dimensions

Figure 3: SIM65M-C mechanical dimensions (Unit: mm)

Outline dimensional tolerances do not include burr areas.

3.1 Power Management

3.1.1 Power Input

① VCC supply requirements

⚫ Wide power lines or even power planes are preferred.

Figure 4: Power supply reference circuit

D2 is used for ESD protection and D1 is used for surge protection.

Table 9: Recommended D1 and D2 list

No. Manufacturer Part number VRWM Package Ref. Designator

② Backup supply (V_BACKUP)

Figure 5: V_BACKUP input reference circuit

3.1.3 Power off

Power on Power off Power on

＜50ms VCC＜1V 5s ＜50ms

Invalid Valid Invalid Valid

Figure 6: Timing sequence of module power-on and power-off

3.1.4 Verification of SIM65M-C Start