LTC3108

Ultralow Voltage Step-Up

Converter and Power Manager

FEATURES DESCRIPTION
nn Operates from Inputs of 20mV The LTC®3108 is a highly integrated DC/DC converter
nn Complete Energy Harvesting Power ideal for harvesting and managing surplus energy from
Management System extremely low input voltage sources such as TEGs (ther-
nn Selectable V
OUT of 2.35V, 3.3V, 4.1V or 5V moelectric generators), thermopiles and small solar cells.
nn LDO: 2.2V at 3mA The step-up topology operates from input voltages as
nn Logic Controlled Output low as 20mV. The LTC3108 is functionally equivalent to
nn Reserve Energy Output the LTC3108-1 except for its unique fixed VOUT options.
nn Power Good Indicator
nn Uses Compact Step-Up Transformers
Using a small step-up transformer, the LTC3108 provides
nn Small 12-Lead (3mm × 4mm) DFN or 16-Lead
a complete power management solution for wireless
sensing and data acquisition. The 2.2V LDO powers an
SSOP Packages
external microprocessor, while the main output is pro-
APPLICATIONS grammed to one of four fixed voltages to power a wire-
less transmitter or sensors. The power good indicator
nn Remote Sensors and Radio Power signals that the main output voltage is within regulation.
nn Surplus Heat Energy Harvesting A second output can be enabled by the host. A storage
nn HVAC Systems
capacitor provides power when the input voltage source
nn Industrial Wireless Sensing
is unavailable. Extremely low quiescent current and high
nn Automatic Metering
efficiency design ensure the fastest possible charge times
nn Building Automation
of the output reservoir capacitor.
nn Predictive Maintenance
The LTC3108 is available in a small, thermally enhanced
All registered trademarks and trademarks are the property of their respective owners.
12-lead (3mm × 4mm) DFN package and a 16-lead
SSOP package.

TYPICAL APPLICATION
Wireless Remote Sensor Application Powered From a Peltier Cell
VOUT Charge Time
1nF
1:100 5V
C1 VSTORE 1000
+
+ + 0.1F
VOUT = 3.3V
THERMOELECTRIC LTC3108 COUT = 470µF
220µF 330pF 6.3V
GENERATOR
C2 VOUT2 100
PGOOD
PGD µP
20mV TO 500mV 2.2V
SW VLDO
TIME (sec)

2.2µF SENSORS 10
3.3V
VS2 VOUT
+ RF LINK
470µF 1
1:100 Ratio
VS1 VOUT2_EN
1:50 Ratio
VAUX GND 3108 TA01a
1:20 Ratio
0
0 50 100 150 200 250 300 350 400
1µF
VIN (mV)
3108 TA01b

Rev. D

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LTC3108
ABSOLUTE MAXIMUM RATINGS (Note 1)

SW Voltage...................................................–0.3V to 2V VS1, VS2, VAUX, VOUT, PGD.........................–0.3V to 6V

C1 Voltage.....................................................–0.3V to 6V VLDO, VSTORE.............................................–0.3V to 6V
C2 Voltage (Note 5)..........................................–8V to 8V Operating Junction Temperature Range
VOUT2, VOUT2_EN...........................................–0.3V to 6V (Note 2)...................................................–40°C to 125°C
VAUX..................................................... 15mA into VAUX Storage Temperature Range...................–65°C to 125°C

PIN CONFIGURATION
TOP VIEW
TOP VIEW
GND 1 16 GND
VAUX 1 12 SW
VAUX 2 15 SW
VSTORE 2 11 C2
VSTORE 3 14 C2
VOUT 3 13 10 C1
VOUT 4 13 C1
GND
VOUT2 4 9 VOUT2_EN VOUT2 5 12 VOUT2_EN
VLDO 5 8 VS1 VLDO 6 11 VS1
PGD 6 7 VS2 PGD 7 10 VS2
GND 8 9 GND
DE PACKAGE
12-LEAD (4mm × 3mm) PLASTIC DFN
GN PACKAGE
TJMAX = 125°C, θJA = 43°C/W 16-LEAD PLASTIC SSOP NARROW
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB (NOTE 4)
TJMAX = 125°C, θJA = 110°C/W

ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3108EDE#PBF LTC3108EDE#TRPBF 3108 12-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C
LTC3108IDE#PBF LTC3108IDE#TRPBF 3108 12-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C
LTC3108EGN#PBF LTC3108EGN#TRPBF 3108 16-Lead Plastic SSOP –40°C to 125°C
LTC3108IGN#PBF LTC3108IGN#TRPBF 3108 16-Lead Plastic SSOP –40°C to 125°C
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.

ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are for TA = 25°C (Note 2). VAUX = 5V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Start-Up Voltage Using 1:100 Transformer Turns Ratio, VAUX = 0V 20 50 mV
No-Load Input Current Using 1:100 Transformer Turns Ratio; VIN = 20mV, VOUT2_ 3 mA
EN = 0V; All Outputs Charged and in Regulation
Input Voltage Range Using 1:100 Transformer Turns Ratio l VSTARTUP 500 mV

Rev. D

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 LTC3108
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are for TA = 25°C (Note 2). VAUX = 5V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Voltage VS1 = VS2 = GND l 2.30 2.350 2.40 V
VS1 = VAUX, VS2 = GND l 3.234 3.300 3.366 V
VS1 = GND, VS2 = VAUX l 4.018 4.100 4.182 V
VS1 = VS2 = VAUX l 4.90 5.000 5.10 V
VOUT Quiescent Current VOUT = 3.3V, VOUT2_EN = 0V 0.2 µA
VAUX Quiescent Current No Load, All Outputs Charged 6 9 µA
LDO Output Voltage 0.5mA Load l 2.134 2.2 2.266 V
LDO Load Regulation For 0mA to 2mA Load 0.5 1 %
LDO Line Regulation For VAUX from 2.5V to 5V 0.05 0.2 %
LDO Dropout Voltage ILDO = 2mA 100 200 mV
LDO Current Limit VLDO = 0V l 4 11 mA
VOUT Current Limit VOUT = 0V l 2.8 4.5 7.5 mA
VSTORE Current Limit VSTORE = 0V l 2.8 4.5 7.5 mA
VAUX Clamp Voltage Current into VAUX = 5mA l 5 5.25 5.60 V
VSTORE Leakage Current VSTORE = 5V 0.1 0.3 µA
VOUT2 Leakage Current VOUT2 = 0V, VOUT2_EN = 0V 0.1 µA
VS1, VS2 Threshold Voltage l 0.4 0.85 1.2 V
VS1, VS2 Input Current VS1 = VS2 = 5V 0.01 0.1 µA
PGOOD Threshold (Rising) Measured Relative to the VOUT Voltage –7.5 %
PGOOD Threshold (Falling) Measured Relative to the VOUT Voltage –9 %
PGOOD VOL Sink Current = 100µA 0.15 0.3 V
PGOOD VOH Source Current = 0 2.1 2.2 2.3 V
PGOOD Pull-Up Resistance 1 MΩ
VOUT2_EN Threshold Voltage VOUT2_EN Rising l 0.4 1 1.3 V
VOUT2_EN Pull-Down Resistance 5 MΩ
VOUT2 Turn-On Time 5 µs
VOUT2 Turn-Off Time (Note 3) 0.15 µs
VOUT2 Current Limit VOUT = 3.3V l 0.15 0.3 0.45 A
VOUT2 Current Limit Response Time (Note 3) 350 ns
VOUT2 P-Channel MOSFET On-Resistance VOUT = 3.3V (Note 3) 1.3 Ω
N-Channel MOSFET On-Resistance C2 = 5V (Note 3) 0.5 Ω

Note 1: Stresses beyond those listed under Absolute Maximum Ratings temperature (TJ) is calculated from the ambient temperature (TA) and
may cause permanent damage to the device. Exposure to any Absolute power dissipation (PD) according to the formula: TJ = TA + (PD • θJA°C/W),
Maximum Rating condition for extended periods may affect device where θJA is the package thermal impedance.
reliability and lifetime. Note 3: Specification is guaranteed by design and not 100% tested in
Note 2: The LTC3108 is tested under pulsed load conditions such that TJ ≈ production.
TA. The LTC3108E is guaranteed to meet specifications from 0°C to 85°C Note 4: Failure to solder the exposed backside of the package to the PC
junction temperature. Specifications over the –40°C to 125°C operating board ground plane will result in a thermal resistance much higher than
junction temperature range are assured by design, characterization and 43°C/W.
correlation with statistical process controls. The LTC3108I is guaranteed Note 5: The absolute maximum rating is a DC rating. Under certain
over the full –40°C to 125°C operating junction temperature range. conditions in the applications shown, the peak AC voltage on the C2 pin
Note that the maximum ambient temperature is determined by specific may exceed ±8V. This behavior is normal and acceptable because the
operating conditions in conjunction with board layout, the rated thermal current into the pin is limited by the impedance of the coupling capacitor.
package thermal resistance and other environmental factors. The junction
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LTC3108
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.

IVOUT and Efficiency vs VIN,

IIN vs VIN, (VOUT = 0V) 1:20 Ratio Transformer
1000 4000 80
1:50 RATIO, C1 = 4.7n C1 = 10nF
1:100 RATIO, C1 = 1n 3500 70
1:20 RATIO, C1 = 10n IVOUT
3000 (VOUT = 0V) 60
100

EFFICIENCY (%)
2500 50

IVOUT (µA)
IIN (mA)

2000 EFFICIENCY IVOUT 40

(VOUT = 4.5V) (VOUT = 4.5V)
1500 30
10
1000 20

500 10

1 0 0
10 100 1000 0 100 200 300 400 500
VIN (mV) VIN (mV)
3108 G00
3108 G01

IVOUT and Efficiency vs VIN, IVOUT and Efficiency vs VIN,

1:100 Ratio Transformer 1:50 Ratio Transformer
1400 70 3200 80
C1 = 1nF C1 = 4.7nF IVOUT
1200 IVOUT 60 2800 (VOUT = 0V) 70
(VOUT = 0V)
2400 EFFICIENCY 60
1000 50 (VOUT = 4.5V)
EFFICIENCY

EFFICIENCY (%)
EFFICIENCY (%)

(VOUT = 4.5V) 2000 50

IVOUT (µA)
IVOUT (µA)

800 40
1600 IVOUT 40
(VOUT = 4.5V)
600 30
IVOUT 1200 30
(VOUT = 4.5V)
400 20
800 20

200 10 400 10

0 0 0 0
0 100 200 300 400 500 0 100 200 300 400 500
VIN (mV) VIN (mV)
3108 G03 3108 G02

Input Resistance vs VIN IVOUT vs VIN and Source Resistance,

(VOUT Charging) 1:20 Ratio
10 10000
C1 = 10nF
9
8 1:20 RATIO
1000
INPUT RESISTANCE (Ω)

7
6
IVOUT (µA)

5 100
1:50 RATIO
4
3
10 1Ω
2 1:100 RATIO
2Ω
1 5Ω
10Ω
0 0
0 100 200 300 400 500 0 100 200 300 400 500 600 700 800
VIN (mV) VIN OPEN-CIRCUIT (mV)
3108 G05
3108 G04

Rev. D

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 LTC3108
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.

IVOUT vs VIN and Source Resistance, IVOUT vs VIN and Source Resistance,
1:50 Ratio 1:100 Ratio
10000 1000
C1 = 4.7nF C1 = 1nF

1000

IVOUT (µA)
IVOUT (µA)

100 100

10 1Ω 1Ω
2Ω 2Ω
5Ω 5Ω
10Ω 10Ω
0 10
0 100 200 300 400 500 600 700 800 0 100 200 300 400 500
VIN OPEN-CIRCUIT (mV) VIN OPEN-CIRCUIT (mV)
3108 G06 3108 G07

IVOUT vs dT and TEG Size,

1:100 Ratio Resonant Switching Waveforms
10000
VOUT = 0V VIN = 20mV
1:100 RATIO TRANSFORMER
40mm
TEG
1000 C1 PIN
15mm 2V/DIV
TEG
C2 PIN
IVOUT (µA)

100 2V/DIV

SW PIN
50mV/
10 DIV
1:50 RATIO
1:100 RATIO 3108 G09

1:50 RATIO 10µs/DIV

1:100 RATIO
0
0.1 1 10 100
dT ACROSS TEG (°C)
3108 G08

LDO Load Regulation LDO Dropout Voltage

0.00 0.20
0.18
0.16
–0.25
DROPOUT VOLTAGE (V)

0.14
DROP IN VLDO (%)

0.12
–0.50 0.10
0.08
0.06
–0.75
0.04
0.02
–1.00 0.00
0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 2 2.5 3 3.5 4
LDO LOAD (mA) LDO LOAD (mA)
3108 G10 3108 G11

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LTC3108
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.

VOUT and PGD Response

Start-Up Voltage Sequencing During a Step Load
VIN = 50mV 50mA LOAD STEP
1:100 RATIO TRANSFORMER CH1 COUT = 220µF
COUT = 220µF VSTORE
CSTORE = 470µF 1V/DIV
CLDO = 2.2µF CH2
CH2, VOUT VOUT
1V/DIV 1V/DIV
CH3, VLDO
1V/DIV CH1
PGD
1V/DIV

3108 G12 3108 G13

10sec/DIV 5ms/DIV

VOUT Ripple LDO Step Load Response

30µA LOAD
COUT = 220µF

VLDO
20mV/
20mV/DIV
DIV

ILDO
5mA/DIV

3108 G14
3108 G15
100ms/DIV 200µs/DIV
0mA TO 3mA LOAD STEP
CLDO = 2.2µF

Enable Input and VOUT2 Running on Storage Capacitor

CSTORE = 470µF
CH3 VOUT LOAD = 100µA
VSTORE
1V/DIV

CH2, VOUT2 CH2, VOUT

1V/DIV 1V/DIV
CH4, VLDO
1V/DIV
CH1 CH1, VIN
VOUT2_EN 50mV/DIV
1V/DIV
3108 G16 3108 G17
1ms/DIV 5sec/DIV
10mA LOAD ON VOUT2
COUT = 220µF

Rev. D

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 LTC3108
PIN FUNCTIONS (DFN/SSOP)

VAUX (Pin 1/Pin 2): Output of the Internal Rectifier Circuit VS1 (Pin 8/Pin 11): VOUT Select Pin 1. Connect this pin
and VCC for the IC. Bypass VAUX with at least 1µF of to ground or VAUX to program the output voltage (see
capacitance. An active shunt regulator clamps VAUX to Table 1).
5.25V (typical). VOUT2_EN (Pin 9/Pin 12): Enable Input for VOUT2. VOUT2
VSTORE (Pin 2/Pin 3): Output for the Storage Capacitor will be enabled when this pin is driven high. There is an
or Battery. A large capacitor may be connected from this internal 5M pull-down resistor on this pin. If not used,
pin to GND for powering the system in the event the input this pin can be left open or grounded.
voltage is lost. It will be charged up to the maximum VAUX C1 (Pin 10/Pin 13): Input to the Charge Pump and
clamp voltage. If not used, this pin should be left open Rectifier Circuit. Connect a capacitor from this pin to the
or tied to VAUX. secondary winding of the step-up transformer.
VOUT (Pin 3/Pin 4): Main Output of the Converter. The C2 (Pin 11/Pin 14): Input to the N-Channel Gate Drive
voltage at this pin is regulated to the voltage selected by Circuit. Connect a capacitor from this pin to the secondary
VS1 and VS2 (see Table 1). Connect this pin to an energy winding of the step-up transformer.
storage capacitor or to a rechargeable battery.
SW (Pin 12/Pin 15): Drain of the Internal N-Channel
VOUT2 (Pin 4/Pin 5): Switched Output of the Converter. Switch. Connect this pin to the primary winding of the
Connect this pin to a switched load. This output is open transformer.
until VOUT2_EN is driven high, then it is connected to
VOUT through a 1.3Ω P-channel switch. If not used, this GND (Pins 1, 8, 9, 16) SSOP Only: Ground
pin should be left open or tied to VOUT. The peak current GND (Exposed Pad Pin 13) DFN Only: Ground. The DFN
in this output is limited to 0.3A typical. exposed pad must be soldered to the PCB ground plane.
VLDO (Pin 5/Pin 6): Output of the 2.2V LDO. Connect a It serves as the ground connection, and as a means of
2.2µF or larger ceramic capacitor from this pin to GND. conducting heat away from the die.
If not used, this pin should be tied to VAUX. Table 1. Regulated Voltage Using Pins VS1 and VS2
PGD (Pin 6/Pin 7): Power Good Output. When VOUT is VS2 VS1 VOUT

within 7.5% of its programmed value, PGD will be pulled GND GND 2.35V
up to VLDO through a 1MΩ resistor. If VOUT drops 9% GND VAUX 3.3V
below its programmed value PGD will go low. This pin VAUX GND 4.1V
can sink up to 100µA. VAUX VAUX 5V

VS2 (Pin 7/Pin 10): VOUT Select Pin 2. Connect this pin
to ground or VAUX to program the output voltage (see
Table 1).

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LTC3108
BLOCK DIAGRAM

LTC3108
VOUT2
1.3Ω
ILIM VOUT2

VOUT2_EN
OFF ON
1.2V
SYNC RECTIFY REFERENCE VREF 5M
C1 VOUT
VIN 1:100 C1 VOUT

CIN 5.25V COUT

C2 +
C2 VS1
–
SW SW VOUT CHARGE
VOUT
CONTROL VS2
VSTORE PROGRAM

0.5Ω VREF

VLDO

1M
PGD
–
PGOOD
+
VAUX VSTORE
VBEST LDO
VOUT VREF
1µF CSTORE
GND (SSOP) EXPOSED PAD (DFN) VLDO

3108 BD

2.2V
2.2µF

OPERATION (Refer to the Block Diagram)

The LTC3108 is designed to use a small external step-up average power draw is very low, but there may be peri-
transformer to create an ultralow input voltage step-up odic pulses of higher load current required. This is typi-
DC/DC converter and power manager. It is ideally suited cal of wireless sensor applications, where the quiescent
for low power wireless sensors and other applications power draw is extremely low most of the time, except for
in which surplus energy harvesting is used to generate transmit bursts when circuitry is powered up to make
system power because traditional battery power is incon- measurements and transmit data.
venient or impractical. The LTC3108 can also be used to trickle charge a standard
The LTC3108 is designed to manage the charging and capacitor, supercapacitor or rechargeable battery, using
regulation of multiple outputs in a system in which the energy harvested from a Peltier or photovoltaic cell.

Rev. D

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 LTC3108
OPERATION
Oscillator Synchronous Rectifiers
The LTC3108 utilizes a MOSFET switch to form a resonant Once VAUX exceeds 2V, synchronous rectifiers in parallel
step-up oscillator using an external step-up transformer with each of the internal diodes take over the job of rectify-
and a small coupling capacitor. This allows it to boost ing the input voltage, improving efficiency.
input voltages as low as 20mV high enough to provide
multiple regulated output voltages for powering other cir- Low Dropout Linear Regulator (LDO)
cuits. The frequency of oscillation is determined by the The LTC3108 includes a low current LDO to provide a
inductance of the transformer secondary winding and is regulated 2.2V output for powering low power processors
typically in the range of 10kHz to 100kHz. For input volt- or other low power ICs. The LDO is powered by the higher
ages as low as 20mV, a primary-secondary turns ratio of of VAUX or VOUT. This enables it to become active as soon
about 1:100 is recommended. For higher input voltages, as VAUX has charged to 2.3V, while the VOUT storage
this ratio can be lower. See the Applications Information capacitor is still charging. In the event of a step load on
section for more information on selecting the transformer. the LDO output, current can come from the main VOUT
capacitor if VAUX drops below VOUT. The LDO requires
Charge Pump and Rectifier a 2.2µF ceramic capacitor for stability. Larger capacitor
The AC voltage produced on the secondary winding of values can be used without limitation, but will increase
the transformer is boosted and rectified using an external the time it takes for all the outputs to charge up. The LDO
charge pump capacitor (from the secondary winding to output is current limited to 4mA minimum.
pin C1) and the rectifiers internal to the LTC3108. The
VOUT
rectifier circuit feeds current into the VAUX pin, provid-
ing charge to the external VAUX capacitor and the other The main output voltage on VOUT is charged from the
outputs. VAUX supply, and is user programmed to one of four
regulated voltages using the voltage select pins VS1 and
VAUX VS2, according to Table 2. Although the logic threshold
The active circuits within the LTC3108 are powered from voltage for VS1 and VS2 is 0.85V typical, it is recom-
mended that they be tied to ground or VAUX.
VAUX, which should be bypassed with a 1µF capacitor.
Larger capacitor values are recommended when using Table 2. Regulated Voltage Using Pins VS1 and VS2
turns ratios of 1:50 or 1:20 (refer to the Typical Application VS2 VS1 VOUT
examples). Once VAUX exceeds 2.5V, the main VOUT is GND GND 2.35V
allowed to start charging. GND VAUX 3.3V
VAUX GND 4.1V
An internal shunt regulator limits the maximum voltage
VAUX VAUX 5V
on VAUX to 5.25V typical. It shunts to GND any excess
current into VAUX when there is no load on the converter
When the output voltage drops slightly below the regu-
or the input source is generating more power than is
lated value, the charging current will be enabled as long
required by the load.
as VAUX is greater than 2.5V. Once VOUT has reached the
Voltage Reference proper value, the charging current is turned off.

The LTC3108 includes a precision, micropower reference, The internal programmable resistor divider sets VOUT,
for accurate regulated output voltages. This reference eliminating the need for very high value external resis-
becomes active as soon as VAUX exceeds 2V. tors that are susceptible to board leakage.

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LTC3108
OPERATION
In a typical application, a storage capacitor (typically a few The VOUT2 enable input has a typical threshold of 1V
hundred microfarads) is connected to VOUT. As soon as with 100mV of hysteresis, making it logic-compatible. If
VAUX exceeds 2.5V, the VOUT capacitor will be allowed to VOUT2_EN (which has an internal pull-down resistor) is
charge up to its regulated voltage. The current available low, VOUT2 will be off. Driving VOUT2_EN high will turn on
to charge the capacitor will depend on the input voltage the VOUT2 output.
and transformer turns ratio, but is limited to about 4.5mA Note that while VOUT2_EN is high, the current limiting cir-
typical. cuitry for VOUT2 draws an extra 8µA of quiescent current
from VOUT. This added current draw has a negligible effect
PGOOD
on the application and capacitor sizing, since the load on
A power good comparator monitors the VOUT voltage. the VOUT2 output, when enabled, is likely to be orders of
The PGD pin is an open-drain output with a weak pull-up magnitude higher than 8µA.
(1MΩ) to the LDO voltage. Once VOUT has charged to
within 7.5% of its regulated voltage, the PGD output will VSTORE
go high. If VOUT drops more than 9% from its regulated The VSTORE output can be used to charge a large stor-
voltage, PGD will go low. The PGD output is designed age capacitor or rechargeable battery after VOUT has
to drive a microprocessor or other chip I/O and is not reached regulation. Once VOUT has reached regulation, the
intended to drive a higher current load such as an LED. VSTORE output will be allowed to charge up to the VAUX
Pulling PGD up externally to a voltage greater than VLDO voltage. The storage element on VSTORE can be used
will cause a small current to be sourced into VLDO. PGD to power the system in the event that the input source
can be pulled low in a wire-OR configuration with other is lost, or is unable to provide the current demanded by
circuitry. the VOUT, VOUT2 and LDO outputs. If VAUX drops below
VSTORE, the LTC3108 will automatically draw current
VOUT2
from the storage element. Note that it may take a long
VOUT2 is an output that can be turned on and off by the time to charge a large capacitor, depending on the input
host, using the VOUT2_EN pin. When enabled, VOUT2 is energy available and the loading on VOUT and VLDO.
connected to VOUT through a 1.3Ω P-channel MOSFET Since the maximum current from VSTORE is limited to a
switch. This output, controlled by a host processor, can few milliamps, it can safely be used to trickle-charge NiCd
be used to power external circuits such as sensors and or NiMH rechargeable batteries for energy storage when
amplifiers, that do not have a low power sleep or shut- the input voltage is lost. Note that the VSTORE capacitor
down capability. VOUT2 can be used to power these cir- cannot supply large pulse currents to VOUT . Any pulse
cuits only when they are needed. load on VOUT must be handled by the VOUT capacitor.
Minimizing the amount of decoupling capacitance on
VOUT2 will allow it to be switched on and off faster, allow- Short-Circuit Protection
ing shorter burst times and, therefore, smaller duty cycles All outputs of the LTC3108 are current limited to protect
in pulsed applications such as a wireless sensor/transmit- against short-circuits to ground.
ter. A small VOUT2 capacitor will also minimize the energy
that will be wasted in charging the capacitor every time Output Voltage Sequencing
VOUT2 is enabled.
A timing diagram showing the typical charging and
VOUT2 has a soft-start time of about 5µs to limit capacitor voltage sequencing of the outputs is shown in Figure 1.
charging current and minimize glitching of the main out- Note: time not to scale.
put when VOUT2 is enabled. It also has a current limiting
circuit that limits the peak current to 0.3A typical.

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 LTC3108
OPERATION

5.0
VSTORE (V)
2.5
0
3.0
2.0
PGD (V)
1.0
0
5.0
VOLTAGE (V)

2.5 VOUT (V)

0
3.0
2.0
VLDO (V)
1.0
0

5.0 VAUX (V)

2.5

0
0 10 20 30 40 50 60 70 80

TIME (ms)
3108 F01a

Figure 1. Output Voltage Sequencing with VOUT Programmed for 3.3V (Time Not to Scale)

Rev. D

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LTC3108
APPLICATIONS INFORMATION
Introduction Refer to the IIN vs VIN curves in the Typical Performance
Characteristics section to see what input current is
The LTC3108 is designed to gather energy from very
required from the source for a given input voltage.
low input voltage sources and convert it to usable output
voltages to power microprocessors, wireless transmitters For a given transformer turns ratio, there is a maximum
and analog sensors. Such applications typically require recommended input voltage to avoid excessively high
much more peak power, and at higher voltages, than secondary voltages and power dissipation in the shunt
the input voltage source can produce. The LTC3108 is regulator. It is recommended that the maximum input volt-
designed to accumulate and manage energy over a long age times the turns ratio be less than 50.
period of time to enable short power bursts for acquiring
Note that a low ESR bulk decoupling capacitor will usu-
and transmitting data. The bursts must occur at a low
ally be required across the input source to prevent large
enough duty cycle such that the total output energy dur-
voltage droop and ripple caused by the source’s ESR
ing the burst does not exceed the average source power
and the peak primary switching current (which can reach
integrated over the accumulation time between bursts.
hundreds of milliamps). The time constant of the filter
For many applications, this time between bursts could be
capacitor and the ESR of the voltage source should be
seconds, minutes or hours.
much longer than the period of the resonant switching
The PGD signal can be used to enable a sleeping micro- frequency.
processor or other circuitry when VOUT reaches regula-
tion, indicating that enough energy is available for a burst. Peltier Cell (Thermoelectric Generator)

Input Voltage Sources A Peltier cell (also known as a thermoelectric cooler) is

made up of a large number of series-connected P-N junc-
The LTC3108 can operate from a number of low input tions, sandwiched between two parallel ceramic plates.
voltage sources, such as Peltier cells, photovoltaic cells Although Peltier cells are often used as coolers by apply-
or thermopile generators. The minimum input voltage ing a DC voltage to their inputs, they will also generate
required for a given application will depend on the trans- a DC output voltage, using the Seebeck effect, when the
former turns ratio, the load power required, and the inter- two plates are at different temperatures. The polarity of
nal DC resistance (ESR) of the voltage source. Lower ESR the output voltage will depend on the polarity of the tem-
will allow the use of lower input voltages, and provide perature differential between the plates. The magnitude of
higher output power capability. the output voltage is proportional to the magnitude of the

1000 100
TEG: 30mm
127 COUPLES VOC
TEG MAXIMUM POUT —IDEAL (mW)

R = 2Ω
TEG VOPEN_CIRCUIT (mV)

100 10

MAX POUT
(IDEAL)
10 1

1 0.1
1 10 100
dT (°C)
3108 F02

Figure 2. Typical Performance of a Peltier Cell Acting as a Thermoelectric Generator

Rev. D

12 For more information www.analog.com

 LTC3108
APPLICATIONS INFORMATION
temperature differential between the plates. When used in source resistance will always provide more output current
this manner, a Peltier cell is referred to as a thermoelectric capability by providing a higher input voltage under load.
generator (TEG).
Peltier Cell (TEG) Suppliers
The low voltage capability of the LTC3108 design allows
it to operate from a TEG with temperature differentials as Peltier cells are available in a wide range of sizes and
low as 1°C, making it ideal for harvesting energy in appli- power capabilities, from less than 10mm square to over
cations in which a temperature difference exists between 50mm square. They are typically 2mm to 5mm in height.
two surfaces or between a surface and the ambient tem- A list of Peltier cell manufacturers is given in Table 3.
perature. The internal resistance (ESR) of most cells is Table 3. Peltier Cell Manufacturers
in the range of 1Ω to 5Ω, allowing for reasonable power CUI, Inc.
transfer. The curves in Figure 2 show the open-circuit www.cui.com (Distributor)
Fujitaka
output voltage and maximum power transfer for a typi- www.fujitaka.com/pub/peltier/english/thermoelectric_power.html
cal Peltier cell (with an ESR of 2Ω) over a 20°C range of Ferrotec
temperature differential. www.ferrotec.com/products/thermal/modules
Kryotherm
TEG Load Matching www.kryothermusa.com
Laird Technologies
The LTC3108 was designed to present a minimum input www.lairdtech.com
resistance (load) in the range of 2Ω to 10Ω, depending Marlow Industries
www.marlow.com
on input voltage and transformer turns ratio (as shown Micropelt
in the Typical Performance Characteristics curves). For www.micropelt.com
a given turns ratio, as the input voltage drops, the input Nextreme
resistance increases. This feature allows the LTC3108 to www.nextreme.com
TE Technology
optimize power transfer from sources with a few ohms of www.tetech.com/Peltier-Thermoelectric-Cooler-Modules.html
source resistance, such as a typical TEG. Note that a lower Tellurex
www.tellurex.com

Table 4. Recommended TEG Part Numbers by Size

MANUFACTURER 15mm × 15mm 20mm × 20mm 30mm × 30mm 40mm × 40mm
CUI Inc. (Distributor) CP60133 CP60233 CP60333 CP85438
Ferrotec 9501/031/030 B 9501/071/040 B 9500/097/090 B 9500/127/100 B
Fujitaka FPH13106NC FPH17106NC FPH17108AC FPH112708AC
Kryotherm TGM-127-1.0-0.8 LCB-127-1.4-1.15
Laird Technology PT6.7.F2.3030.W6 PT8.12.F2.4040.TA.W6
Marlow Industries RC3-8-01 RC6-6-01 RC12-8-01LS
Tellurex C2-15-0405 C2-20-0409 C2-30-1505 C2-40-1509
TE Technology TE-31-1.0-1.3 TE-31-1.4-1.15 TE-71-1.4-1.15 TE-127-1.4-1.05

Rev. D

For more information www.analog.com 13

LTC3108
APPLICATIONS INFORMATION
Thermopile Generator these applications the C2 and SW pins are not used and
can be grounded or left open.
Thermopile generators (also called powerpile generators)
are made up of a number of series-connected thermo- Examples of such input sources would be piezoelectric
couples enclosed in a metal tube. They are commonly transducers, vibration energy harvesters, low current
used in gas burner applications to generate a DC output generators, a stack of low current solar cells or a 60Hz
of hundreds of millivolts when exposed to the high tem- AC input.
perature of a flame. Typical examples are the Honeywell A series resistance of at least 100Ω/V should be used
CQ200 and Q313. These devices have an internal series to limit the maximum current into the VAUX shunt
resistance of less than 3Ω, and can generate as much regulator.
as 750mV open-circuit at their highest rated tempera-
ture. For applications in which the temperature rise is too
high for a solid-state thermoelectric device, a thermopile COMPONENT SELECTION
can be used as an energy source to power the LTC3108.
Step-Up Transformer
Because of the higher output voltages possible with a
thermopile generator, a lower transformer turns ratio can The step-up transformer turns ratio will determine how
be used (typically 1:20, depending on the application). low the input voltage can be for the converter to start.
Using a 1:100 ratio can yield start-up voltages as low as
Photovoltaic Cell 20mV. Other factors that affect performance are the DC
The LTC3108 converter can also operate from a single resistance of the transformer windings and the inductance
photovoltaic cell (also known as a PV or solar cell) at of the windings. Higher DC resistance will result in lower
light levels too low for other low input voltage boost con- efficiency. The secondary winding inductance will deter-
verters to operate. However, many variables will affect mine the resonant frequency of the oscillator, according
the performance in these applications. Light levels can to the following formula.
vary over several orders of magnitude and depend on 1
lighting conditions (the type of lighting and indoor versus Frequency = Hz
2 • π • L(sec) • C
outdoor). Different types of light (sunlight, incandescent,
fluorescent) also have different color spectra, and will Where L is the inductance of the transformer secondary
produce different output power levels depending on which winding and C is the load capacitance on the secondary
type of photovoltaic cell is being used (monocrystalline, winding. This is comprised of the input capacitance at pin
polycrystalline or thin-film). Therefore, the photovoltaic C2, typically 30pF, in parallel with the transformer sec-
cell must be chosen for the type and amount of light avail- ondary winding’s shunt capacitance. The recommended
able. Note that the short-circuit output current from the resonant frequency is in the range of 10kHz to 100kHz.
cell must be at least a few milliamps in order to power See Table 5 for some recommended transformers.
the LTC3108 converter
Table 5. Recommended Transformers
Non-Boost Applications VENDOR PART NUMBER
Coilcraft LPR6235-752SML (1:100 Ratio)
The LTC3108 can also be used as an energy harvester www.coilcraft.com LPR6235-253PML (1:20 Ratio)
and power manager for input sources that do not require LPR6235-123QML (1:50 Ratio)
boosting. In these applications the step-up transformer Würth 74488540070 (1:100 Ratio)
can be eliminated. www.we-online 74488540120 (1:50 Ratio)
74488540250 (1:20 Ratio)
Any source whose peak voltage exceeds 2.5V AC or 5V
DC can be connected to the C1 input through a current-
limiting resistor where it will be rectified/peak detected. In
Rev. D

14 For more information www.analog.com

 LTC3108
APPLICATIONS INFORMATION
C1 Capacitor Using External Charge Pump Rectifiers
The charge pump capacitor that is connected from the The synchronous charge pump rectifiers in the LTC3108
transformer’s secondary winding to the C1 pin has an (connected to the C1 pin) are optimized for operation from
effect on converter input resistance and maximum output very low input voltage sources, using typical transformer
current capability. Generally, a minimum value of 1nF is step-up ratios between 1:100 and 1:50, and typical C1
recommended when operating from very low input volt- charge pump capacitor values less than 10nF.
ages using a transformer with a ratio of 1:100. Too large a
Operation from higher input voltage sources (typically
capacitor value can compromise performance when oper-
250mV or greater, under load), allows the use of lower
ating at low input voltage or with high resistance sources.
For higher input voltages and lower turns ratios, the value transformer step-up ratios (such as 1:20 and 1:10) and
of the C1 capacitor can be increased for higher output larger C1 capacitor values to provide higher output current
current capability. Refer to the Typical Applications sche- capability from the LTC3108. However, due to the result-
matic examples for the recommended value for a given ing increase in rectifier currents and resonant oscillator
turns ratio. frequency in these applications, the use of external charge
pump rectifiers is recommended for optimal performance.
Squegging In applications where the step-up ratio is 1:20 or less, and
Certain types of oscillators, including transformer-cou- the C1 capacitor is 10nF or greater, the C1 pin should be
pled oscillators such as the resonant oscillator of the grounded and two external rectifiers (such as 1N4148 or
LTC3108, can exhibit a phenomenon called squegging. 1N914 diodes) should be used. These are available as dual
This term refers to a condition that can occur which diodes in a single package. Avoid the use of Schottky rec-
blocks or stops the oscillation for a period of time much tifiers, as their lower forward voltage drop increases the
longer than the period of oscillation, resulting in bursts of minimum start-up voltage. See the Typical Applications
oscillation. An example of this is the blocking oscillator, schematics for an example.
which is designed to squegg to produce bursts of oscilla-
tion. Squegging is also encountered in RF oscillators and VOUT and VSTORE Capacitor
regenerative receivers. For pulsed load applications, the VOUT capacitor should
In the case of the LTC3108, squegging can occur when a be sized to provide the necessary current when the load
charge builds up on the C2 gate coupling capacitor, such is pulsed on. The capacitor value required will be dictated
that the DC bias point shifts and oscillation is extinguished by the load current, the duration of the load pulse, and
for a certain period of time, until the charge on the capaci- the amount of voltage droop the circuit can tolerate. The
tor bleeds off, allowing oscillation to resume. It is difficult capacitor must be rated for whatever voltage has been
to predict when and if squegging will occur in a given selected for VOUT by VS1 and VS2.
application. While squegging is not harmful, it reduces the ILOAD(mA) • tPULSE (ms)
COUT (µF) ≥
average output current capability of the LTC3108. VOUT (V)
Squegging can easily be avoided by the addition of a Note that there must be enough energy available from
bleeder resistor in parallel with the coupling capacitor on the input voltage source for VOUT to recharge the capacitor
the C2 pin. Resistor values in the range of 100k to 1MΩ during the interval between load pulses (to be discussed
are sufficient to eliminate squegging without having any in the next example). Reducing the duty cycle of the load
negative impact on performance. For the 330pF capacitor pulse will allow operation with less input energy.
used for C2 in most applications, a 499k bleeder resistor
is recommended. See the Typical Applications schematics The VSTORE capacitor may be of very large value (thou-
for an example. sands of microfarads or even Farads), to provide holdup
Rev. D

For more information www.analog.com 15

LTC3108
APPLICATIONS INFORMATION
at times when the input power may be lost. Note that this Due to the very low input voltage the circuit may operate
capacitor can charge all the way to 5.25V (regardless of from, the connections to VIN, the primary of the trans-
the settings for VOUT), so ensure that the holdup capacitor former and the SW and GND pins of the LTC3108 should
has a working voltage rating of at least 5.5V at the tem- be designed to minimize voltage drop from stray resis-
perature for which it will be used. The VSTORE capacitor tance and able to carry currents as high as 500mA. Any
can be sized using the following: small voltage drop in the primary winding conduction path
will lower efficiency and increase capacitor charge time.
CSTORE ≥
[6µA + IQ + ILDO+ (IBURST • t • f)] • TSTORE
5.25 − VOUT Also, due to the low charge currents available at the out-
puts of the LTC3108, any sources of leakage current on
Where 6µA is the quiescent current of the LTC3108, IQ is the output voltage pins must be minimized. An example
the load on VOUT in between bursts, ILDO is the load on board layout is shown in Figure 3.
the LDO between bursts, IBURST is the total load during
VIN
the burst, t is the duration of the burst, f is the frequency
of the bursts, TSTORE is the storage time required and
VOUT is the output voltage required. Note that for a pro-
grammed output voltage of 5V, the VSTORE capacitor
cannot provide any beneficial storage time.
To minimize losses and capacitor charge time, all capaci-
tors used for VOUT and VSTORE should be low leakage.
VAUX SW
See Table 6 for recommended storage capacitors. VSTORE
1 12
C2
2 11
VOUT
Storage capacitors requiring voltage balancing are not VOUT
VOUT2
3 10
C1
VOUT2_EN
recommended due to the current draw of the balancing VOUT2 VLDO
4 9
VS1
resistors. VLDO PGD
5 8
VS2
PGOOD 6 7

Table 6. Recommended Storage Capacitors GND

3108 FO3

VENDOR PART NUMBER/SERIES

VIAS TO GROUND PLANE
AVX BestCap Series
www.avx.com TAJ and TPS Series Tantalum
Figure 3. Example Component Placement
Cap-XX GZ Series for Two-Layer PC Board (DFN Package)
www.cap-xx.com
Cooper/Bussmann KR Series
www.bussmann.com/3/PowerStor.html P Series Design Example 1
Vishay/Sprague Tantamount 592D
www.vishay.com/capacitors 595D Tantalum
This design example will explain how to calculate the nec-
150CRZ/153CRV Aluminum essary storage capacitor value for VOUT in pulsed load
013 RLC (Low Leakage) applications, such as a wireless sensor/transmitter. In
these types of applications, the load is very small for a
PCB Layout Guidelines majority of the time (while the circuitry is in a low power
Due to the rather low switching frequency of the resonant sleep state), with bursts of load current occurring peri-
converter and the low power levels involved, PCB layout odically during a transmit burst. The storage capacitor
is not as critical as with many other DC/DC converters. on VOUT supports the load during the transmit burst, and
There are, however, a number of things to consider. the long sleep time between bursts allows the LTC3108
to recharge the capacitor. A method for calculating the

Rev. D

16 For more information www.analog.com

 LTC3108
APPLICATIONS INFORMATION
maximum rate at which the load pulses can occur for a Therefore, in this application example, the circuit can sup-
given output current from the LTC3108 will also be shown. port a 1ms transmit burst every 1.5 seconds.
In this example, VOUT is set to 3.3V, and the maximum It can be determined that for systems that only need to
allowed voltage droop during a transmit burst is 10%, or transmit every few seconds (or minutes or hours), the
0.33V. The duration of a transmit burst is 1ms, with a total average charge current required is extremely small, as
average current requirement of 40mA during the burst. long as the sleep current is low. Even if the available
Given these factors, the minimum required capacitance charge current in the example above was only 10µA and
on VOUT is: the sleep current was only 5µA, it could still transmit a
40mA • 1ms burst every ten seconds.
COUT (µF) ≥ = 121µF
0.33V The following formula enables the user to calculate the
time it will take to charge the LDO output capacitor and
Note that this equation neglects the effect of capacitor
the VOUT capacitor the first time, from 0V. Here again,
ESR on output voltage droop. For most ceramic or low
ESR tantalum capacitors, the ESR will have a negligible the charge current available from the LTC3108 must be
effect at these load currents. known. For this calculation, it is assumed that the LDO
output capacitor is 2.2µF.
A standard value of 150µF or larger could be used for
COUT in this case. Note that the load current is the total 2.2V • 2.2µF
tLDO =
current draw on VOUT, VOUT2 and VLDO, since the cur- ICHG − ILDO
rent for all of these outputs must come from VOUT during
a burst. Current contribution from the holdup capacitor If there were 50µA of charge current available and a 5µA
on VSTORE is not considered, since it may not be able load on the LDO (when the processor is sleeping), the
to recharge between bursts. Also, it is assumed that the time for the LDO to reach regulation would be 107ms.
charge current from the LTC3108 is negligible compared If VOUT were programmed to 3.3V and the VOUT capacitor
to the magnitude of the load current during the burst. was 150µF, the time for VOUT to reach regulation would be:
To calculate the maximum rate at which load bursts 3.3V • 150µF
can occur, determine how much charge current is t VOUT = + tLDO
ICHG − IVOUT − ILDO
available from the LTC3108 VOUT pin given the input
voltage source being used. This number is best found If there were 50µA of charge current available and 5µA of
empirically, since there are many factors affecting the load on VOUT, the time for VOUT to reach regulation after
efficiency of the converter. Also determine what the total the initial application of power would be 12.5 seconds.
load current is on VOUT during the sleep state (between
bursts). Note that this must include any losses, such as Design Example 2
storage capacitor leakage. In many pulsed load applications, the duration, magnitude
Assume, for instance, that the charge current from the and frequency of the load current bursts are known and
LTC3108 is 50µA and the total current drawn on VOUT in fixed. In these cases, the average charge current required
the sleep state is 17µA, including capacitor leakage. In from the LTC3108 to support the average load must be
addition, use the value of 150µF for the VOUT capacitor. calculated, which can be easily done by the following:
The maximum transmit rate (neglecting the duration of IBURST • t
the transmit burst, which is typically very short) is then ICHG ≥ IQ +
T
given by:
150µF • 0.33V Where IQ is the sleep current on VOUT required by the
t= = 1.5sec or fMAX = 0.666Hz external circuitry in between bursts (including cap leak-
(50µA − 17µA) age), IBURST is the total load current during the burst, t is
Rev. D

For more information www.analog.com 17

LTC3108
APPLICATIONS INFORMATION
the duration of the burst and T is the period of the transmit hour. It can be determined that the sleep current of 5µA
burst rate (essentially the time between bursts). is the dominant factor because the transmit duty cycle is
In this example, IQ = 5µA, IBURST = 100mA, t = 5ms and so small (0.00014%). Note that for a VOUT of 3.3V, the
T = one hour. The average charge current required from average power required by this application is only 17µW
the LTC3108 would be: (not including converter losses).
100mA • 0.005sec Note that the charge current available from the LTC3108
ICHG ≥ 5µA + = 5.14µA has no effect on the sizing of the VOUT capacitor (if it is
3600 sec
assumed that the load current during a burst is much
Therefore, if the LTC3108 has an input voltage that allows larger than the charge current), and the VOUT capacitor
it to supply a charge current greater than 5.14µA, the has no effect on the maximum allowed burst rate.
application can support 100mA bursts lasting 5ms every

TYPICAL APPLICATIONS

Peltier-Powered Energy Harvester for Remote Sensor Applications

COOPER BUSSMAN PB-5ROH104-R

1:100 1nF 5V OR KR-5R5H104-R
VSTORE
T1 + CSTORE
C1 0.1F
+ 3.3V
THERMOELECTRIC
+ 6.3V VOUT2
CIN 330pF VOUT2
GENERATOR
PGOOD
C2 PGD SENSORS
LTC3108 2.2V µP
∆T = 1°C TO 20°C SW VLDO
2.2µF XMTR
3.3V
VOUT
+
VS2 COUT*

VS1 VOUT2_EN
VAUX GND
OFF ON
T1: COILCRAFT LPR6235-752SML
*COUT VALUE DEPENDENT ON
THE MAGNITUDE AND DURATION 1µF
OF THE LOAD PULSE 3108 TA02

Rev. D

18 For more information www.analog.com

 LTC3108
TYPICAL APPLICATIONS
Li-Ion Battery Charger and LDO Powered by a Solar Cell

T1 0.01µF
1:20
C1 VSTORE
+ +
SOLAR CELL* 220µF VOUT2
330pF
– LTC3108
C2 PGD
2.2V
SW VLDO VLDO
4.1V
VOUT VOUT
VS2 2.2µF
Li-Ion
* 2" DIAMETER MONOCRYSTALLINE CELL VS1 VOUT2_EN
LIGHT LEVEL ≥ 900 LUX
VAUX GND
T1: COILCRAFT LPR6235-253PML

4.7µF

3108 TA03

Supercapacitor Charger and LDO Powered by a Thermopile Generator

HONEYWELL T1 4.7nF
CQ200 1:50
THERMOPILE C1 VSTORE
+
220µF VOUT2
330pF
LTC3108
C2 PGD PGOOD
2.2V
SW VLDO VLDO
2.35V
VOUT VOUT
VS2
+ 150mF 2.2µF
T1: COILCRAFT LPR6235-123QML VS1 VOUT2_EN 2.5V
VAUX GND
CAP-XX GZ115F
2.2µF

3108 TA04

DC Input Energy Harvester and Power Manager AC Input Energy Harvester and Power Manager

RIN RIN CIN

RIN > 100Ω/ V 5V RIN > 100Ω / V 5V
C1 VSTORE C1 VSTORE
+ +
+ VIN CSTORE CSTORE
AC VIN
– VIN > 5V
VOUT2 VOUT2
VIN > 5VP-P
VOUT2 VOUT2

C2 PGD PGOOD - PIEZO PGD PGOOD

LTC3108 - 60Hz LTC3108
2.2V 2.2V
SW VLDO VLDO C2 VLDO VLDO
3.3V 2.2µF 5V 2.2µF
VS2 VOUT VOUT SW VOUT VOUT
+ +
COUT COUT
VS2

VS1 VOUT2_EN VOUT2_ENABLE VS1 VOUT2_EN VOUT2_ENABLE

VAUX GND VAUX GND

3108 TA05 3108 TA06

2.2µF 2.2µF

Rev. D

For more information www.analog.com 19

LTC3108
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641 Rev B)

.045 ±.005 .189 – .196*

(4.801 – 4.978)
.009
(0.229)
16 15 14 13 12 11 10 9 REF

.254 MIN .150 – .165

.229 – .244 .150 – .157**

(5.817 – 6.198) (3.810 – 3.988)

.0165 ±.0015 .0250 BSC

RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8

.015 ±.004
× 45° .0532 – .0688 .004 – .0098
(0.38 ±0.10)
(1.35 – 1.75) (0.102 – 0.249)
.007 – .0098
0° – 8° TYP
(0.178 – 0.249)

.016 – .050 .008 – .012 .0250

(0.406 – 1.270) (0.203 – 0.305) (0.635) GN16 REV B 0212

NOTE: TYP BSC

1. CONTROLLING DIMENSION: INCHES
INCHES *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
2. DIMENSIONS ARE IN
(MILLIMETERS) SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
3. DRAWING NOT TO SCALE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)

4.00 ±0.10 R = 0.115 0.40 ±0.10

(2 SIDES) TYP
7 12
0.70 ±0.05 R = 0.05
TYP

3.30 ±0.05 3.30 ±0.10

3.60 ±0.05 3.00 ±0.10
2.20 ±0.05 1.70 ±0.05 (2 SIDES) 1.70 ±0.10
PIN 1 PIN 1 NOTCH
TOP MARK R = 0.20 OR
PACKAGE (NOTE 6) 0.35 × 45°
OUTLINE CHAMFER
6 1 (UE12/DE12) DFN 0806 REV D

0.25 ±0.05 0.200 REF 0.75 ±0.05 0.25 ±0.05

0.50 BSC 0.50 BSC
2.50 REF 2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE

Rev. D

20 For more information www.analog.com

 LTC3108
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 04/10 Updated front page text and Typical Appliction 1
Updated Absolute Maximum Ratings and Order Information sections 2
Updated Electrical Characteristics 3
Added graph (3108 G00) to Typical Performance Characteristics 4
Updated Block Diagram 8
Text added to Operation section 9
Changes to Applications Information section 12-18
Updated Typical Applications 18, 19, 22
Updated Related Parts 22
B 06/13 Added vendor information to Table 5 14
C 08/13 Changed Würth transformer part numbers 14
D 03/19 Electrical Characteristics. LDO Dropout Voltage Temperature Range changed from Over Temperature to TA = 25°C, 3
VOUT, Current Limit Max & VSTORE Current Limit Max changed from 7V to 7.5V; VAUX Clamp Voltage Max changed
from 5.55V to 5.6V

Rev. D

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For more by
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 21
LTC3108
TYPICAL APPLICATION
Dual TEG Energy Harvester Operates from Temperature Differentials of Either Polarity
1nF
1:100 5V
HOT C1 VSTORE
+ +
THERMOELECTRIC CSTORE
VOUT2 VOUT2
GENERATOR 330pF
LTC3108
COLD C2 PGD PGOOD
2.2V
SW VLDO VLDO
3.3V
VS2 VOUT VOUT
LPR6235-752SML VS1 VOUT2_EN
+ 2.2µF
COUT
VAUX GND
OFF ON

1µF

VAUX
1nF
1:100
COLD C1 VSTORE
+
THERMOELECTRIC VOUT2
GENERATOR 330pF
LTC3108
HOT C2 PGD
SW VLDO
VS2 VOUT
LPR6235-752SML VS1 VOUT2_EN
VAUX GND

3108 TA07

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Rev. D

22
03/19
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