NATIONAL OPEN UNIVERSITY OF NIGERIA

University Village, Plot 91, Cadastral Zone, Nnamdi Azikiwe Express Way Jabi – Abuja

A Seminar Term Paper on:

POLYTRONICS, AN EMERGING
TECHNOLOGIES AND ITS APPLICATIONS

Presented By:

BIOSHOGUN ABIOLA YUSUF

Matric No: NOU201079664

Course Title: SEMINAR ON EMERGING TECHNOLOGIES

Course Code: CIT 403
Level/Semester: 400L/2023_2

B.SC COMPUTER SCIENCE

FACULTY OF SCIENCE
MUSHIN STUDY CENTRE

25th September 2023

 ABSTRACT

Polytronics involves the usage of electrically conducting polymer or plastics in making

electronic circuits. The plastic circuits are one alternative that would meet the future
technological needs in terms of latest devices which are characterized by their small size, low
power consumption, low cost and the ability to collect data from the environment and making
transmission wireless. Polytronics have some advantages over the silicon circuit technology
which was mainly used in the fabrication of electronics gadgets. Advantages of polytronics are: -
Easy manufacturability (mass production). – Low cost, - They can be recycled and reused
(decreases environmental stress), - Consumes less power, - They are mobile, small and light in
weight, - They are used to make display devices that have extraordinary picture quality. The
application of polytronics in inkjet printing technology in e-books, mobile phones watches etc
provides continuous production line of plastic circuits on plastic substrates and then cut into
individual units. Rubber circuit’s boards - the application of silicon rubber keypads include
remote controls for TV, video and HIFI units, electronics toys and games and industrial control
equipment. Plastic Batteries – polymer batteries can be recharged and reused a number of times
without loss of power. These don’t contain hazardous chemicals typically found in nickel-
cadmium cells and therefore environmentally safe. This paper briefly discusses its historical
background, the conceptual architecture, its methodology application areas and other areas of
emerging technological transformation of polymer electronics. Polytronics is going to change the
whole world of consumer electronics and form the principal root for the major advancement in
the design of electric circuits and manufacture of printed circuits boards (PCB).

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 1.0 INTRODUCTION

For so many years Plastics were well known merely as Insulators and were used predominantly
for shielding copper wires. Now the emerging new technology polytronics changes our
viewpoint in visualizing the conducting polymer as a materials of Microelectronics (Victor Druet
et al, 2023). Microelectronics technology in conjunction with Silicon is flexible enough to easy
rolling up of circuits that consume less power and above all they can be manufacture at a fraction
of cost involved in making semiconductor chips (Yunhua Wang et al, 2023). This technology has
number of upcoming areas of interest where lots of research is going on to Manufacture
Microelectronic components on plastic substrates which would allow manufacturing of gadgets
through just printing process (Young joo lee et al,2023).

In this paper I would like to impart ideas on Ink-jet Printing Technology which plays main role
in printing Polymer Circuits, Electronics Paper Construction and manufacturing of Plastic
Batteries. Medicinal Application of Polytronics using Rubber Circuits and Electra active
Polymer and Organic Led (OLED). If this technology emerges practically the world of electronic
will take a new leap (Asad Hanif, 2023). In today's world of ever expanding technology
polytronic is going to change the whole world of consumer electronics and from the principal
root for the major advancement in the design of electronic circuits and manufacture of printed
circuit boards (PCB) (Rineng, 2022). The era of polymer electronics has taken a great start and
all the technological companies have turned their research towards polytronics as the evolves of
polytronics had obtained circuits with better electrical conductivity and mechanical properties
which can be envisioned for viable method for a wide range of potential application that
welcome low cost, flexibility and disposable, sub wearable devices (Albrech, et al 2018), Sensor
Electrodes, Flexible Antennas (Alexi, Eng.J, 2022) and Flexible Electronic Components (K.Jean,
Yoan et al, 2019). The development of such trans-formative applications entails critical
requirements and challenges, including timely and reliable access to diagnostic information,
energy-efficient biosensor design, bio-compatibility, system integration, sensor miniaturization,
patient safety, emergency response, and detection. Groundbreaking technological developments
in antennas, electromagnetic, and materials can address these challenges and revolutionize
healthcare delivery and wellness management. This can be enabled through next-generation
implants and wearable that, in turn, enable emerging bio-electromagnetic applications such as
neuron-sensing, neuron-stimulation, and innovative imaging modalities, (Nano Energy, 2019).
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Indeed, disease detection and diagnosis using wireless medical devices is seen as a trans-
formative approach to healthcare, addressing the in-sustainability of current healthcare provision
models.

There is no doubt that currently the electronic world is very much dominated by inorganic
materials, in particular silicon. This began early half of the nineteenth century with the invention
of the transistors; the field of electronics has undergone innumerable changes that have had
tremendous impact on the life of the common man. Be it education, entertainment or healthcare,
there is possibly no field where electronics has not made an impact. The new concept of
electronics is based on the reliability of a new power embedded PCB (Printed Circuit Board)
highly integrated into an electrical machine which offers an enhanced reliability based on the
manufacturing time optimization, the reduction of the process steps, the module functionality and
the feasibility (microrel, 2020).

In automotive industry, the trend is the significant integration of electrical solutions, as a result,
industries are faced with the need to provide devices, which are more reliable and more energy
efficient. These devices should fit in a limited space in the car. This internal space limitation with
increasing power density requires to enhance heat dissipation to improve performance while
reducing size. The PCB embedded technology can be a great solution to address these topics. It
improves power module performances by optimizing interconnections and reducing size and
weight towards miniaturization. The optimization leads to the reduction of parasitic inductance
and to get a better thermal management. An example of application chosen in this paper is the
Smart Belt-driven Starter Generator. For this application, we have processed a PCB embedded
technology (Tabiati et al, 2020).

Semiconductors are materials which have a conductivity between conductors (generally metals)
and nonconductors or insulators (such as most ceramics). Semiconductors can be pure elements,
such as silicon or germanium, or compounds such as Gallium Arsenide or Cadmium Selenide. In
a process called doping, small amounts of impurities are added to pure semiconductors causing
large changes in the conductivity of the material. (Till Huesgen, 2022) This report therefore
focuses on the embedded plastic circuit board which is the emerging innovation applicable in
polytronics technology and areas of power Technology, its application areas, Methodology and
fabrications.

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 2.0 LITERATURE REVIEW

2.1 Brief Historical Background of Polytronics Technology

The history of polymer electronics started more than 50 years ago – firstly conductors, then
semiconductors, transistors and fully functional polymer ICs (Hofstraat 2001).
In 1975 MacDiarmid (1927–2007) and Heeger were both professors at the University of
Pennsylvania, MacDiarmid in chemistry and Heeger in physics. An unusual polymer exhibiting
electrical properties had recently been reported in the chemical literature. This polymer,
polymeric Sulfur Nitride, or (SN)x, consisted of monomers made up of sulfur and nitrogen.
MacDiarmid had extensive experience working with sulfur nitride compounds, many of them
beautifully colored like polymeric Sulfur Nitride (SN) x, which had a metallic Gold color,
although it was not a metal. MacDiarmid and Heeger decided to work together to understand this
compound (Hofstraat 2001).

Previously MacDiarmid and Heeger had found that the conductivity of polymeric sulfur nitride
(SN)x increased 10-fold after adding bromine atoms in a doping procedure similar to that used in
silicon transistors (IEEE 2006.). Basically, doping is a way of making a substance conductive
through the introduction of an impurity (in this case the Bromine atoms). In the case of
Shirakawa’s polyacetylene the increase in conductivity after doping with bromine was 10 million
times higher than before doping.

The transistors with a poly aniline/poly-amide composite result on/off ratios up to about 4.7·103
(Schrödner, 2021). Nevertheless, the use of polymer transistors in ICs is still in its infancy.
The second branch of active polymers is related to photon applications. It was discovered
thirteen years ago that some conjugated polymers exhibit electro-luminescence. The potential of
this discovery for novel lighting concepts was recognized almost immediately (Schrödner et al
2022). As the result of researcher centers and industry, a polymer LED, (named also as OLED by
using a “Organic” modifier) displays appeared. Devices for use in a passive matrix Organic light
emitting diode OLED display (mobile phones e.g.) require a low forward voltage, high
luminance efficiency, and low reverse current. They usually consist of multi-layered structures to
facilitate charge injection from the contacts as well as carrier transport into the emitting layer
The luminance efficiency can be increased by doping the emitting layer with special dye
molecules (Kowalsky W. Becker E. Benstem T. Dobbertin T. Heithecker D. Johannes H.-H.
Metzdorf D. and Neuner H 2018). In bi-layer devices, the electrode-luminescence can be
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controlled by thickness optimization of the different emitting layers up to white emission (Wedel
2017).
Polymers in electronics are widely used as passive materials. There are etching and soldering
resists, dielectrics, boards, materials for encapsulating, defiling and coating, electrically and
thermally conductive adhesives for electronic interconnecting (Kowalsky 2016).

2.2 Recent Trends in Polymer Electronics

More recently, researchers and engineers have investigated the use of Plastic Circuit Boards
(PCB) embedding for higher power applications covering voltage ratings up to 1200 V and
power levels up to 100 kW. One of the main drivers of this development has been the
electrification of passenger vehicles, which demands highly efficient power converters with
high volumetric and gravimeter power density at low costs (Grubl et al., 2018; Ostmann et al.,
2022). Due to the possibility to minimize the package parasitic, PCB embedding is particularly
beneficial in combination with fast-switching wide-bandgap power semiconductors, such
as silicon carbide (SiC) MOSFET or gallium nitride (GaN) HEMT. These devices demand low
commutation loop inductance for clean and efficient switching (Kaminski, 2017).

This article reviews the scientific literature on Plastic Circuit Boards (PCB) embedding of
power semiconductors for mid-power applications as exemplified by (Buttay et al., 2018). The
paper is structured as follows: Firstly, briefly introduces the power semiconductor devices
which are embedded into circuit board. Next, the fabrication technology is presented with focus
on mainstream industrial processes for miniaturization of recent electronics. Moreover, the paper
covers unconventional approaches, often investigated by academic researchers.

2.3 Power semiconductors and conventional packaging

Power electronic converters are based on switch-mode operation and, therefore, require
semiconductor transistors as switching elements (Kaminski, 2017). Silicon metal-oxide-
semiconductor field-effect transistors (MOSFET) are typically used for low-voltage applications
of up to about 600 V. For higher voltages insulated-gate bipolar transistors (IGBT) present the
standard solution (Wintrich et al., 2015). However, they require a separate
antiparallel freewheeling diode in most applications. New semiconductor devices based on wide
band gap materials are becoming increasingly popular, due to their higher efficiency, especially

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in fast-switching applications. Prominent examples are Gallium Nitride (GaN) high-electron-
mobility transistors (HEMT) and silicon carbide (SiC) MOSFET. GaN HEMT serve applications
with voltages up to 650 V, whereas SiC MOSFET are applied for higher voltages. In contrast to
microelectronics, where usually millions of transistors are integrated into a single semiconductor
chip, these power devices contain one single transistor per chip only. The current rating of the
device scales with its footprint area Achip. For MOSFET and IGBT, a vertical structure is used,
with gate and source (or emitter in case of the IGBT) on the top side of the chip and the drain (or
collector) on the bottom side (ABB, 2013). GaN HEMT are horizontal devices, with all
functional contacts on the chip top side. However, its substrate requires a defined potential and
therefore contains a separate contact on the chip bottom side. Consequently, any packaging
technology for power semiconductors needs to establish electrical connections on the top and the
bottom side of the semiconductor chip (Kaminski, 2017).

In conventional packages, the semiconductor is attached bottom down to a conductive substrate,

either a metal lead frame in case of discrete packages or a copper cladded ceramic substrate in
case of multi-chip power modules. To enable solder die-attach, a silver surface is used for the
bottom metallization of the die. The top side contacts are formed with thick aluminum bond
wires and require an aluminum-based metallization. For protection and to provide sufficient
isolation, the devices are encapsulated in epoxy molding compound or by potting in silicone gel.
In conventional power circuits, the packaged semiconductors are electrically connected to other
components of the circuit by printed circuit boards or bus bars. PCB embedding provides an
alternative approach—that of embedding the power semiconductor chip into the circuit board
(Kaminski, 2017).

2.4 Polytronics Technology In The Nearest Future

A broad application field for full polymeric circuits is expected for the low-cost integration of
simple data processing functions on flexible film substrates (Figure 1). Such products must be
produced in very high volume. For this reason, many of the traditional wafer based
manufacturing tools used in the traditional electronics manufacturing will have to be changed.
Compared to the subtractive manufacturing sequence of layer deposition, lithography and
etching processes, which are used in the wafer-based processes, the organic materials mostly
make additive patterning techniques possible like the different printing method.

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3.0 METHODOLOGY AND CONCEPTUAL FRAMEWORK

3.1 Mainstream embedding processes

In Polytronics, Fabrication of PCB-embedded power devices essentially means building a

circuit board around the semiconductor die (Kaminski, 2017). This section presents the three
most common fabrication processes, which are commercially available from various PCB
manufacturers. Fig.1 schematically illustrates the basic process steps, showing (a) the “Chip-on-
Substrate” process, (b) the “Chip-in-Cavity” process, and (c) “Double-side Microvia” process.
The Chip-on-Substrate process was invented by Fraunhofer IZM in 1999 (Jung, et al., 2020).
In a first step, the semiconductor die is attached to a “PCB bottom layer”. This bottom layer is
either a Cu substrate (Link et al., 2021), an insulated metal substrate (IMS) (Ostmann et al.,
2012), or a copper-cladded ceramic substrate such as direct copper bonded (DCB) (Hoene et al.,
2013; Huesgen et al., 2021). Several prepregs (a glass fiber fabric, pre-impregnated with
partially cured resin, known as FR4 in PCB industry) are stacked on top. The first prepreg layers
have cutouts, to accommodate the semiconductor chip, while upper layers cover the full area.
A copper foil covers the stack. The thickness and resin content of the prepregs requires careful
consideration, as the free volume of the geometry is filled by a resin flow from the prepregs
(Munding et al., 2017). The stack is laminated in a vacuum press at a temperature in the range
of 180…200°C and a pressure of 1…3 MPa for 60…180 min. The exact process conditions
depend on the resin type and exact geometry. Microvias are drilled using a laser process,
stopping on the top side chip metallization. The top side contacts are established by Cu
electroplating and subsequent structuring of the top side trace. The plating process requires a
copper metallization on the chip, which is uncommon today, as most semiconductor chips have
an Al-based metallization for wire bonding.

An optical micrograph of a cross-section through an Si diode that has been embedded by the
Chip-on-Substrate process is shown Fig.1 (a).

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Fig.1 Illustration of the PCB embedding process flows: (a) Chip-on-Substrate, (b) Chip-in-
Cavity, and (c) Double-side Microvia. Source: https://www.sciencedirect.com

Fig.2 Microscopic cross section of different PCB embedding approaches (a) Chip-on-
Substrate, (b) Chip-in-Cavity [courtsey of Schweizer Electronic AG], and (c) Double-side
Microva . Source: https://www.sciencedirect.com

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The Chip-in-cavity process is outlined in Fig.2 (b). The substrate, typically a thick Cu plate,
features a cavity, where the semiconductor die is placed. The cavity depth equals the chip and
die-attach bond line thickness, so that the top metallization of the chip is level with the substrate
surface. Subsequently, unstructured prepregs and a Cu foil are stacked on top. There is no need
to work with structured prepregs, which facilitates stacking of the laminate. The subsequent steps
of the process are identical to those of the Chip-on-Substrate process and require vacuum
lamination, laser drilling, Cu plating and structuring of the top trace. This technology is available
from PCB suppliers, such as Schweizer Electronic AG, Germany (known as p²
Pack® technology) (Gottwald & Roessle, 2014; Gottwald & Roessle, 2018) or Advanced
Semiconductor Engineering ASE Inc (here known as embedded active system integration eASI)
(Essig et al., 2016; Essig et al., 2017). Fig.2 (b) shows a cross-sectional view of an embedded
package fabricated with the p² Pack technology

Double-side Microvia embedding is shown in Fig.2 (c). Here, the chip is attached by a (non-
conductive) adhesive to a thin Cu foil. Multiple layers of prepreg, with and without cutout, and a
final Cu foil are stacked on top. The stack is vacuum laminated before microvia are laser drilled
on the top and bottom side of the device. That way all electrical connections are established by
Cu plating, avoiding any potentially critical die-attach layer. This process is known as Embedded
Component Package ECP® from AT&S, Austria (Stahr, 2021),
or MICROVIA.embedding technology from Würth Electronic, Germany (Wolf, 2021). A cross-
sectional micrograph of a GaN Systems GS61008T package, which is fabricated by ECP
technology, is shown in Fig.2 (c). The basic Double-side Microvia process can be modified by
introducing a full area plating on the chip backside, to improve heat removal from the embedded
component. AT&S labels this process variation PARSEC (PlAnaR Surface Embedded
Components) technology (Stahr & Morianz, 2019).

The embedding technologies described above can be applied for two different integration
concepts, as illustrated in Fig.3. In the first concept, embedding is used as device-level
fabrication technology to generate PCB power packages. These are attached as surface mount
device SMD components to the main circuit board. Embedding provides an alternative solution
to the classical leadframe-based discrete packages. The GaN Systems GaN PX package is a good
example of such a PCB power package (GaN Systems, 2022).

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Fig.3. Illustration of integration concepts for PCB embedding (a) PCB power packages are
used as SMD, and (b) an embedded intelligent power module (IPM) or System-in-Board.
Source: https: www.researchgate.com

The second concept utilizes PCB embedding for both, device level packaging and board-level
packaging. This requires additional lamination steps after embedding, to add more routing layers
and to provide electrical insulation on the bottom side of the package where the heat sink is
attached. To enable efficient heat removal, thermally conductive, electrically insulating prepreg
materials are required. A printed circuit board with multiple embedded power semiconductors
and internal electrical isolation will be labeled as PCB power module (Huesgen et al., 2021).

3.2 Advantages of Polytronics Technology

The study of usage of polymeric materials in electronics is termed as “Polytronics”.This
polytronics has some advantages. They are;
1. Easy Manufacturability (mass production).
2. Low cost.
3. They can be recycled and reused (decreases environmental stress).
4. Consumes less power.
5. They are mobile, small, and light in weight.
6. They are used to make display devices that have extraordinary picture quality.
The feasibility of developing entire electronic components on basis of polymers is met by “inkjet
printing technology” and is illustrated by several applications such as electronic paper, plastic
batteries, etc DB. Ahn, et al, (2020).

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 4.0 APPLICATIONS OF POLYTRONICS

This chapter presents the current application of polytronics in emerging technology as seen in:
Inkjet Printing Technology, Rubber Circuit Boards, Plastic Batteries, Electronic Papers and so
on.

4.1 Inkjet Printing Technologies

Printed flexible electronics have been extensively studied for their potential use in various
applications. In this paper, a simple, low-cost, high-conductivity (0.2Ω/sq) flexible electronic
circuit fabrication method is demonstrated (Apl.Mater,2019.,Nano-Energy,2019). The
commercial PET film is used as a flexible substrate, and then nanoparticle silver ink was inkjet
printed on its surface, and then the flexible Ag circuit was obtained after sintering with 150 °C
hot air. Although the conductance is somewhat reduced, the electronic circuits made in this way
remain functional even under different folding angles or after repeated folding (J.Sci et al, 2022)
The proposed development technique allows cheap, efficient, and large-scale production of
flexible electronic circuits with excellent mechanical and electrical properties.

The inkjet printing technology provides continuous production line of plastic circuits on plastic
substrates and then cut into individual units (A. Nathan,et al, 2022) The substrates are made of
acetate material that is as transparent as Vu-graph sheets. This printing technology plays a major
role in the development of “flat screen” displays

4.2 Plastic Batteries

Printed batteries are emerging as ideal candidates to meet the challenges facing the next
generation of small portable electronics, wearable, and Internet-of-Things (IoT) devices. In
recent years, printed batteries have sparked great interest in the research community and have
been reviewed several times Apl.Mater,(2019). Conventional batteries with their rigid casings
cannot satisfactorily meet the mechanical requirements of the new generation of flexible devices.
Their form factor is limited, and they cannot be integrated monolithically into electronic devices.
In contrast, printed batteries show potential for aesthetic versatility, flexibility, and monolithic
integration (Nano Energy, (2019). Multiple printing techniques have been developed over the
centuries to pattern ink slurry onto various substrate materials, including organic (e.g., polymers)
and inorganic (e.g., metals) materials (J.Sci Adv.Mater,Devices,(2022). Using similar printing
11
methods, electroactive and conductive materials can be layered onto a flexible substrate to
produce patterned flexible batteries A. Nathan, et al (2012). Many of the applications that can
accommodate printed batteries possess functionalities that are also printable, such as energy-
harvesting, displays, and sensors BMu,XWang X.zhang, YXiao2022. Batteries can be potentially
printed alongside the other components of an electronic device to produce a so-called
monolithically integrated device. The production throughput is amplified if all the components
can be printed on the same assembly line by roll-to-roll (R2R) technology. Consequently, printed
batteries are often associated with cost-effective manufacturing. M.Cheng, et al, (2020) Energy
densities at sub-millimeter thicknesses that are superior to those of competing technologies such
as lithium polymer batteries or ceramic batteries have also been reported, C.M. Costa, et al
(2020)

The technical achievements of printed batteries reported to date in terms of their main benefits:
① Unprecedented form-factor freedom, ② Flexibility, ③ Increased energy density at sub-
millimeter thicknesses, ④ Cost-effective manufacture, and ⑤ Monolithic integrability. These
batteries are lightweight and can be molded into any size and shape for use in satellites and
important military equipment. Scientists are planning practical applications of plastic batteries by
linking them with solar cell charging system to power space satellites when they are in orbit,
Y.Liang, et al. (2019).

Tests at the Hopkin’s lab have yielded positive results. Polymer batteries can be recharged and
reused a number of times without loss of power. Besides these don’t contain hazardous
chemicals typically found in nickel-cadmium cells and are therefore environmentally safe.

4.3 Printing of Circuits

Electrosynthesis of conductive polymer films has been of considerable interest for decades for a
host of catalytic, senor, and biomedical applications, Adv.Mater.Technol,(2019).
Electropolymerization of conductive polymer films has been studied extensively at solid
electrode/electrolyte interfaces using aniline pyrrole or thiophenes as electroactive monomers.
Recently, growth of 2D and 3D structures at the interface between two immiscible electrolyte
solutions (ITIES) has gained attention, J.Kim, et al (2017).

Fabrication of microelectronic components would allow manufacture of complete gadgets

through just printing process in the near future, Adv.Mater, (2019) Such a technology is being

12
developed by the University of California. The technology would focus on building any
electronic device from bottom up gradually, so, instead of building a device by adding new
components through the regular “assemble and build” technique, the entire product would come
out of the printer complete with electronic circuitry embedded in the product itself.

Fig: 4.0 - microelectronic device, Source: University of California scientific journal

The structural, mechanical and electronic elements would be indicated using 3D printing
techniques, in three simple steps: using a CAD software tool think of a design, take the necessary
ingredients and insert them inside the printer and finally print. Technologists point out that for
the process to succeed in major applications two main criteria have to be fulfilled: “Basically, the
material viscosity must be low enough to allow controlled ejection from the inkjet during
fabrication. Secondly, the material must remain a liquid for a sufficient time before jetting so as
to not clog the printing orifice, yet solidify within a reasonable time after jetting”. With these two
things in place it would be possible to print almost anything from a combination of polymer and
oligomer solutions, polymer resins, molten solders and Nano-particle suspensions.

4.4 Rubber Microelectronics

Electric power devices may require good radiation resistance and electromagnetic compatibility
Manuf, (2021). Polymeric materials with low dielectric constants Technol, (2019), for example,
room temperature vulcanizable silicone rubbers (SR), are widely used in electronic packaging
under-fill process for fast signal transmission Manuf, (2018). To improve the mechanical
properties, fillers are used to reinforce SR for satisfying diversified applications in electronic
industry, aerospace, and other fields Compos, Commum, (2020). Strategies for homogeneous
dispersion and alignment of fillers are developed to tailor the mechanical strength, thermal
conductivity, electromagnetic interference shielding and electrostatic discharge protection

13
performances of the composite. However, the introduction of filler usually causes improvements
of dielectric constant of the composites and leakage current and heat generation of integrated
circuits.

With the miniaturization of electronic products with continuously improving performance, the
signals transmission, reception, shielding and enhancement become particularly important, which
calls for reduction of dissipation under electromagnetic fields. To reduce the weight of electronic
products, organic and green fillers are appealing in preparing composites.

4.5 Electronic Paper

A semiconductor microchip or chip is made of three types of materials: an electrical conductor,

an electrical semiconductor, and an electrical insulator. It is fabricated with iterative processes of
depositing materials, patterning (lithography and reactive ion etching) the thin layers of these
materials to form three-dimensional (3D) Y.Kim (2022), functional and interconnected devices
that acquire, store, compute, transmit and display data or information. The relentless pursuit for
miniaturization of semiconductor devices, thus packing ever increasing numbers of transistors on
a single chip, has led to enhanced device performance at steadily reduced price per transistor for
over sixty years K. Christopher et al (2023).

The sophisticated and ubiquitous semiconductor chips have fundamentally changed how people
live, work, learn, communicate, do business, and interact with government. The paper and pulp
industry which produces huge amounts of inorganic pollutants such as Sulphide, bleaching
liquors and organic pollutants like cellulose fibers, bark, wood, sugars, organic acids etc, which
leads to various forms of pollution.

Fig 4.2 - Graphical paper display interface. Source: Philips science journals & articles
https://www.sciencedirect.com

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An E-paper can be continuously updated via the Internet and even used as an innovative display
that can be rolled up tightly without any damage. These display devices are produced using
direct inkjet printing technology as it is quite economical and the circuit is a part of the whole
display package itself X.L LiLi et al (2017) The display typically uses E-ink, which is activated
by electric charge to update the content.

4.6 Plastic Recycling

Plastic pollution is serious enough to warrant a binding international agreement (Ammendolia

and Walker, 2022). Macro-plastics and micro-plastics can pollute marine and terrestrial
ecosystems (Wong et al., 2020) while smaller particles of nanoplastics can degrade air quality
(Prata, 2018). Ingestion or inhalation of these particles can have adverse impacts on health (Prata
et al., 2020). Plastic fragments in the environment also degrade into smaller particles at varying
rates (Plohl et al., 2022). There are still many barriers to the recycling of waste plastic as a key
strategy for managing plastic pollution (Rudolph et al., 2020). For example, in fiber reinforced
composites for high-performance applications, the separation of the polymer matrix from fibers
is problematic (Cao et al., 2022). Human behavior introduces additional complications. In
developing countries it remains common practice to use open burning to reduce the volume of
plastic-bearing municipal solid waste (Velis, 2022), while poor segregation hinders recycling
with processes that are more suited for pure polymers (Hahladakis and Iacovidou, 2019). Mixing
can result in contamination of polyolefin streams with oxygen-rich polymers like polyethylene
terephthalate (PET) and biodegradable plastics such as polylactic acid (PLA). Incorrect sorting
of plastic waste is partly due to insufficient knowledge on the types of plastics and proper
segregation practices (Nemat et al., 2022). Consumer ability to properly identify packaging
materials so they can correctly dispose them is crucial to recycling, and persists to be a barrier in
recycling behavior. Inconvenience or perceived difficulty in sorting also drive them away from
engaging in recycling efforts (Fogt Jacobsen et al., 2022). Since the ability to correctly recognize
plastics is linked to proper sorting, packaging information as well as visual cues can enhance
recycling. In addition, consumer education, effective communication, label design enhancements
to include sorting information, and procedural improvements to make it convenient for
consumers to consistently engage in recycling are some initiatives that can be implemented
(Nemat et al., 2022). Gamification also proves to be a promising tool in consumer engagement
and behavior change with respect to environmental issues (Hsu and Chen, 2021) and specifically
recycling (Hsu, 2022). Even marginal improvements in sorting efficiency can have a large effect
15
on the profitability of plastics recycling due to the increase of output stream quality (Lim et al.,
2022).

4.7 Wearable Ultra Micro Computers

The rapid development of smart wearable electronics (e.g., watches, textiles, tattoos, e-skin
sensors and healthcare devices), has led to a greater demand for the fabrication of more advanced
devices with multiple functions M.Liu et al, (2022). To achieve lightweight, miniaturized and
multifunctional wearable electronics, stable and high-performance energy harvesting/storage
modules are required to be integrated to enable self-charge and self-sustainable L. Fagiolary et
al, (2022). Among various energy storage devices, micro-super-capacitors (MSCs) have aroused
significant research attention due to their high power density M. Yuan et al, (2021), ultra-fast
charge/discharge rate, super long lifespan and good safety W. Fu et al (2021). More importantly,
MSCs possess unique merits of lightweight, small size and flexibility C. Li et al (2021), which
can be easily integrated with wearable electronics C, Zhu et al (2020).

Polytronics may be one technology besides other for future electronic systems. It will provide a
cheap method for the fabrication of simple low-cost electronic, but in most cases these circuits
have to be integrated in a system H. Liu et al (2022) which may combine different technologies
(e.g. a polymer display must be integrated with pixel drivers, processor, power supply, memory
I/O-circuits etc.) or different functions (e.g. electronics, sensors and actuators are combined for
an intelligent medical plaster). Development task of the system integration is to tune the different
circuits or subsystems to each other, so that the whole system can operate. Polymer circuits will
cause effects on peripheral devices, which must be identified and adopted.

16
Fig 4.3 - wearable Electronic Smart Devices. Source: The Environment Management and
Policy Research Institute, www. Resaearchgate.org

17
 5.0 CONCLUSION

In this paper we have explained in detail some of the recent breakthroughs in the field of micro-
electronics via “polytronics”. When implemented properly, polytronics can bring about a
revolution in the life of common man.
We would like to conclude the paper by highlighting some of the importance of polytronics in
fact the question to be answered at this stage is “Why Polytronics?” Apart from the exciting
features that we have discussed so far such as printing of circuits, electronic paper, OLED’s,
rubber electronics etc. Polytronics has a major role to play in protecting our environment. With
efficient use and reuse of such products we can go a step ahead in the issue of electronic waste.
Apart from safe guarding the environment in which we live, use of plastics in the manufacture of
electronic products bring down the cost involved in production, thereby safeguarding the interest
of the economy as well. The aim of Polytronics is to build products that can reach the substratum
of the society, to build a better society in which each and every individual has access to the
features that it has to offer.

The age of polymer electronic has begun. It is not primarily a replacement for existing electronic
technologies, but opens up the prospect of completely new applications that combine the features
of transistor, LED, detector and interconnect devices with the freedom of design, flexibility and
low cost of plastics. In the scope of these new findings it seems possible that polytronics may
solve present and coming problems and add new functionality to microelectronic circuits and
systems. Polytronics creates a new and very promising technological area with new applications
and products. The polytronics concept opens a new domain of commercial and defense
applications. For example:- Polytronics provides a new way to obtain circuits with one or more
conceived “extra” functions in addition to the “main” function of the circuit. The “extras” can be
activated under certain conditions or can coexist. Possible uses of the “extras”: an authentication
signature / watermark, extra protection from reverse engineering (the real operational function of
the circuit shows up only in special conditions), protection from unauthorized usage by
incorporating biometric info part of circuit design, providing an additional communication
channel. This technology could be used as a non-traditional technique for insertion of sensors
into denied areas and facilities, data-filtration from denied areas and facilities, innovative tagging
technology, etc.

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