Quectel EC200U Series Hardware Design V1.0

EC200U Series
Hardware Design
LTE Standard Module Series
Version: 1.0
Date: 2021-11-05
Status: Released
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EC200U_Series_Hardware_Design 1 / 94
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a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
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and exclude all liability for any loss or damage suffered in connection with the use of features and
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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should send the following safety information to users and operating personnel, and incorporate these
guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’
failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
About the Document
Revision History
Version Date Author Description
Kyle CHEN/
- 2021-10-08 Creation of the document
Nathan LIU
Kyle CHEN/
1.0 2021-11-05 First official release
Nathan LIU
Contents
Safety Information ....................................................................................................................................... 3

About the Document ................................................................................................................................... 4
Contents ....................................................................................................................................................... 5
Table Index ................................................................................................................................................... 7
Figure Index ................................................................................................................................................. 9
1 Introduction ........................................................................................................................................ 11
1.1. Special Marks .......................................................................................................................... 11
2 Product Overview .............................................................................................................................. 12
2.1. General Description ................................................................................................................. 12
2.2. Key Features ........................................................................................................................... 13
2.3. Functional Diagram ................................................................................................................. 15
2.4. EVB .......................................................................................................................................... 16
3 Application Interfaces ....................................................................................................................... 17
3.1. General Description ................................................................................................................. 17
3.2. Pin Assignment ........................................................................................................................ 18
3.3. Pin Description......................................................................................................................... 19
3.4. Operating Modes ..................................................................................................................... 29
3.5. Power Saving........................................................................................................................... 30
3.5.1. Sleep Mode .................................................................................................................... 30
3.5.1.1. UART Application ................................................................................................. 30
3.5.1.2. USB Application with USB Remote Wakeup Function* ....................................... 31
3.5.1.3. USB Application with USB Suspend/Resume and MAIN_RI Function* .............. 31
3.5.1.4. USB Application ................................................................................................... 32
3.5.2. Airplane Mode ................................................................................................................ 33
3.6. Power Supply........................................................................................................................... 34
3.6.1. Power Supply Pins ......................................................................................................... 34
3.6.2. Voltage Stability Requirements ...................................................................................... 34
3.6.3. Reference Design for Power Supply .............................................................................. 35
3.6.4. Monitor the Power Supply .............................................................................................. 36
3.7. Turn on/Turn off/Reset ............................................................................................................. 36
3.7.1. Turn on Module with PWRKEY ...................................................................................... 36
3.7.2. Turn off Module .............................................................................................................. 38
3.7.2.1. Turn off Module with PWRKEY ............................................................................ 39
3.7.2.2. Turn off Module with AT Command...................................................................... 39
3.7.3. Reset the Module ........................................................................................................... 40
3.8. (U)SIM Interfaces..................................................................................................................... 41
3.9. USB Interface .......................................................................................................................... 44
3.10. UART Interfaces ...................................................................................................................... 45
3.11. SPI Interface ............................................................................................................................ 47
3.12. I2C Interfaces .......................................................................................................................... 48
3.13. PCM Interface .......................................................................................................................... 48
3.14. Analog Audio Interfaces........................................................................................................... 49

3.14.1. Notes on Audio Interface Design ................................................................................... 50
3.14.2. Microphone Interface Circuit .......................................................................................... 51
3.14.3. Loudspeaker Interface Circuit ........................................................................................ 52
3.15. LCD Interface........................................................................................................................... 52
3.16. Matrix Keyboard Interface ....................................................................................................... 53
3.17. SD Card Interface .................................................................................................................... 54
3.18. WLAN Application Interface* ................................................................................................... 55
3.19. ADC Interfaces ........................................................................................................................ 56
3.20. Network Status Indication ........................................................................................................ 57
3.21. STATUS ................................................................................................................................... 58
3.22. Behaviors of MAIN_RI ............................................................................................................. 59
3.23. USB_BOOT Interface .............................................................................................................. 60
4 Antenna Interfaces............................................................................................................................. 62
4.1. Main Antenna and Wi-Fi Scan/Bluetooth Antenna Interfaces................................................. 62
4.1.1. Pin Definition .................................................................................................................. 62
4.1.2. Operating Frequency ..................................................................................................... 63
4.1.3. Reference Design of RF Antenna Interfaces ................................................................. 64
4.2. GNSS Antenna Interface ......................................................................................................... 65
4.3. Reference Design of RF Layout .............................................................................................. 66
4.4. Antenna Installation ................................................................................................................. 68
4.4.1. Antenna Requirement .................................................................................................... 68
4.4.2. Recommended RF Connector for Antenna Installation ................................................. 68
5 Electrical Characteristics, Radio and Reliability ............................................................................ 71
5.1. Absolute Maximum Ratings ..................................................................................................... 71
5.2. Power Supply Ratings ............................................................................................................. 72
5.3. Operating and Storage Temperatures ..................................................................................... 72
5.4. Power Consumption ................................................................................................................ 73
5.5. Tx Power .................................................................................................................................. 78
5.6. Rx Sensitivity ........................................................................................................................... 79
5.7. ESD.......................................................................................................................................... 81
6 Mechanical Information ..................................................................................................................... 82
6.1. Mechanical Dimensions........................................................................................................... 82
6.2. Recommended Footprint ......................................................................................................... 84
6.3. Top and Bottom Views ............................................................................................................. 85
7 Storage, Manufacturing & Packaging .............................................................................................. 86
7.1. Storage Conditions .................................................................................................................. 86
7.2. Manufacturing and Soldering .................................................................................................. 87
7.3. Packaging Specifications......................................................................................................... 88
7.3.1. Carrier Tape.................................................................................................................... 89
7.3.2. Plastic Reel .................................................................................................................... 89
7.3.3. Packaging Process ........................................................................................................ 90
8 Appendix References ........................................................................................................................ 91
Table Index
Table 1: Special Marks ................................................................................................................................11

Table 2: Frequency Bands of EC200U-CN Module ................................................................................... 12
Table 3: Frequency Bands of EC200U-EU Module ................................................................................... 12
Table 4: Key Features of EC200U Series Module ..................................................................................... 13
Table 5: I/O Parameters Definition ............................................................................................................. 19
Table 6: Pin Description ............................................................................................................................. 19
Table 7: Overview of Operating Modes ...................................................................................................... 29
Table 8: VBAT and GND Pins .................................................................................................................... 34
Table 9: Pin Description of PWRKEY......................................................................................................... 36
Table 10: Pin Description of RESET_N...................................................................................................... 40
Table 11: Pin Definition of (U)SIM1 Interface ............................................................................................. 41
Table 12: Pin Definition of (U)SIM2 Interface............................................................................................. 42
Table 13: Pin Description of USB Interface ................................................................................................ 44
Table 14: Pin Definition of Main UART Interface ....................................................................................... 45
Table 15: Pin Definition of Debug UART Interface..................................................................................... 46
Table 16: Pin Definition of Auxiliary UART Interface .................................................................................. 46
Table 17: Pin Definition of SPI interface..................................................................................................... 48
Table 18: Pin Definition of I2C Interfaces ................................................................................................... 48
Table 19: Pin Definition of PCM Interface .................................................................................................. 49
Table 20: Pin Definition of Analog Audio Interfaces ................................................................................... 50
Table 21: Pin Definition of LCD Interface ................................................................................................... 52
Table 22: Pin Definition of Matrix Keyboard Interface................................................................................ 53
Table 23: Pin Definition of SD Card Interface ............................................................................................ 54
Table 24: Pin Definition of WLAN Interface ................................................................................................ 55
Table 25: Pin Definition of ADC Interfaces ................................................................................................. 57
Table 26: Characteristic of ADC Interfaces ................................................................................................ 57
Table 27: Pin Definition of Network Connection Status/Activity Indicator .................................................. 57
Table 28: Working State of Network Connection Status/Activity Indicator ................................................ 58
Table 29: Pin Definition of STATUS............................................................................................................ 58
Table 30: Behaviors of the MAIN_RI .......................................................................................................... 60
Table 31: Pin Definition of USB_BOOT Interface ...................................................................................... 60
Table 32: Pin Definition of Antenna Interfaces ........................................................................................... 62
Table 33: EC200U-CN Operating Frequencies.......................................................................................... 63
Table 34: EC200U-EU Operating Frequencies .......................................................................................... 63
Table 35: Pin Definition of GNSS Antenna Interface ................................................................................. 65
Table 36: GNSS Frequency ....................................................................................................................... 65
Table 37: Antenna Requirements ............................................................................................................... 68
Table 38: Absolute Maximum Ratings ........................................................................................................ 71
Table 39: Power Supply Ratings ................................................................................................................ 72
Table 40: Operating and Storage Temperatures ........................................................................................ 73
Table 41: EC200U-CN Current Consumption ............................................................................................ 73
Table 42: EC200U-EU Current Consumption ............................................................................................ 75

Table 43: EC200U-CN RF Output Power................................................................................................... 78
Table 44: EC200U-EU RF Output Power ................................................................................................... 79
Table 45: EC200U-CN Conducted RF Receiving Sensitivity ..................................................................... 79
Table 46: EC200U-EU Conducted RF Receiving Sensitivity ..................................................................... 80
Table 47: Electrostatics Discharge Characteristics (25 ºC, 45 % Relative Humidity)................................ 81
Table 48: Recommended Thermal Profile Parameters .............................................................................. 88
Table 49: Carrier Tape Dimension Table (Unit: mm) .................................................................................. 89
Table 50: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 90
Table 51: Related Documents .................................................................................................................... 91
Table 52: Terms and Abbreviations ............................................................................................................ 91
Figure Index
Figure 1: Functional Diagram ..................................................................................................................... 16

Figure 2: Pin Assignment (Top View) ......................................................................................................... 18
Figure 3: Sleep Mode Application via UART .............................................................................................. 30
Figure 4: Sleep Mode Application with USB Remote Wakeup .................................................................. 31
Figure 5: Sleep Mode Application with MAIN_RI ....................................................................................... 32
Figure 6: Sleep Mode Application without Suspended Function ............................................................... 33
Figure 7: Power Supply Limits during Burst Transmission ........................................................................ 34
Figure 8: Star Configuration Routing of Power Supply .............................................................................. 35
Figure 9: Reference Circuit of Power Supply............................................................................................. 36
Figure 10: Turn on Module by Using Driving Circuit .................................................................................. 37
Figure 11: Turn on Module by Using Button............................................................................................... 37
Figure 12: Power-up Timing ....................................................................................................................... 38
Figure 13: Power-down Timing .................................................................................................................. 39
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit ......................................................... 40
Figure 15: Reference Circuit of RESET_N by Using Button...................................................................... 41
Figure 16: Timing of Resetting Module ...................................................................................................... 41
Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector ......................... 42
Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector ........................... 43
Figure 19: Reference Circuit of USB Application ....................................................................................... 44
Figure 20: Reference Circuit with Translator Chip ..................................................................................... 46
Figure 21: Reference Circuit with Transistor Circuit .................................................................................. 47
Figure 22: Reference Circuit of I2C and PCM Application with External Codec Chip ............................... 49
Figure 23: Reference Circuit of Microphone Interface ............................................................................... 51
Figure 24: Reference Circuit of Loudspeaker Interface ............................................................................. 52
Figure 25: Reference Circuit of SD Card Interface .................................................................................... 54
Figure 26: Reference Circuit of Network Indicator ..................................................................................... 58
Figure 27: Reference Circuit of STATUS ................................................................................................... 59
Figure 28: Reference Circuit of USB_BOOT Interface .............................................................................. 61
Figure 29: Reference Circuit of RF Antenna Interfaces ............................................................................. 64
Figure 30: Reference Circuit of GNSS Antenna ........................................................................................ 65
Figure 31: Microstrip Design on a 2-layer PCB ......................................................................................... 66
Figure 32: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 66
Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 67
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 67
Figure 35: Dimensions of U.FL-R-SMT Connector (Unit: mm) .................................................................. 69
Figure 36: Mechanicals of U.FL-LP Connectors ........................................................................................ 69
Figure 37: Space Factor of Mated Connector (Unit: mm).......................................................................... 70
Figure 38: Module Top and Side Dimensions ............................................................................................ 82
Figure 39: Module Bottom Dimensions ...................................................................................................... 83
Figure 40: Recommended Footprint (Top View) ........................................................................................ 84
Figure 41: Top & Bottom View of the Module............................................................................................. 85
Figure 42: Reflow Soldering Thermal Profile ............................................................................................. 87

Figure 43: Carrier Tape Dimension Drawing .............................................................................................. 89
Figure 44: Plastic Reel Dimension Drawing .............................................................................................. 89
Figure 45: Packaging Process ................................................................................................................... 90
1 Introduction
This document defines the EC200U series module and describes its air interface and hardware interfaces
which are connected with your applications.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EC200U series module. To facilitate its
application in different fields, relevant reference design is also provided for customers’ reference.
Associated with application note and user guide, you can use EC200U series module to design and set
up wireless applications easily.
This document is applicable to the following variants:
⚫ EC200U-CN
⚫ EC200U-EU
1.1. Special Marks
Table 1: Special Marks
Mark Definition
When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
* argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
[…] type. For example, SDIO1_DATA[0:3] refers to all four SDIO1_DATA pins: SDIO1_DATA0,
SDIO1_DATA1, SDIO1_DATA2 and SDIO1_DATA3.
2 Product Overview
2.1. General Description
EC200U series is a wireless communication module, which supports LTE-FDD, LTE-TDD, GSM/GPRS
network data connection. It provides voice function for your special applications and also supports GNSS.
The following table shows the frequency bands of the module.
Table 2: Frequency Bands of EC200U-CN Module
Network Mode Frequency Band
LTE-FDD B1/B3/B5/B8
LTE-TDD B34/B38/B39/B40/B41
GSM 1 900/1800 MHz
2
GNSS GPS, GLONASS, BeiDou, Galileo, QZSS
3
Bluetooth and Wi-Fi Scan Support
Table 3: Frequency Bands of EC200U-EU Module
Network Mode Frequency Band
LTE-FDD B1/B3/B5/B7/B8/B20/B28
LTE-TDD B38/B40/B41
GSM 850/900/1800/1900 MHz
1 GSM is optional.
2 GNSS function is optional.
3 EC200U series supports Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the two functions
cannot be used at the same time; Bluetooth and Wi-Fi Scan functions are optional (supported or not supported
simultaneously), please contact Quectel Technical Supports for details.
GNSS 2 GPS, GLONASS, BeiDou, Galileo, QZSS
Bluetooth and Wi-Fi Scan 3 Support
With a compact profile of 28.0 mm × 31.0 mm × 2.4 mm, EC200U series can meet almost all
requirements for M2M applications such as automotive, metering, tracking system, security, router,
wireless POS, mobile computing device, PDA phone, tablet PC, etc.
EC200U series is an SMD type module which can be embedded into applications through 144 pins,
including 80 LCC pins and 64 LGA pins.
2.2. Key Features
Table 4: Key Features of EC200U Series Module
Feature Details
⚫ Supply voltage: 3.3–4.3 V

Power Supply
⚫ Typical supply voltage: 3.8 V
⚫ Class 4 for EGSM850
⚫ Class 4 for EGSM900
⚫ Class 1 for DCS1800
Transmitting Power
⚫ Class 1 for PCS1900
⚫ Class 3 for LTE-FDD bands
⚫ Class 3 for LTE-TDD bands
⚫ Supports Cat 1 FDD and TDD
⚫ Supports 1.4/3/5/10/15/20 MHz RF bandwidth
LTE Features
⚫ FDD: Max. 10 Mbps (DL), Max. 5 Mbps (UL)
⚫ TDD: Max. 8.96 Mbps (DL), Max. 3.1 Mbps (UL)
GPRS:
⚫ Supports GPRS multi-slot class 12
GSM Features
⚫ Coding scheme: CS-1, CS-2, CS-3 and CS-4
⚫ Max. 85.6 kbps (DL)/Max. 85.6 kbps (UL)
⚫ Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/
Internet Protocol
FTPS/SSL/FILE/MQTT/MMS protocols
Features
⚫ Supports PAP and CHAP for PPP connections
⚫ Text and PDU mode
⚫ Point to point MO and MT
SMS
⚫ SMS cell broadcast
⚫ SMS storage: Stored in (U) SIM card and ME, stored in ME by default
⚫ Supports USIM/SIM card: 1.8/3.0 V

(U)SIM Interface
⚫ Supports DSDS
⚫ Supports one analog audio input and one analog audio output
Audio Features ⚫ GSM: HR/FR/EFR/AMR/AMR-WB
⚫ Supports echo cancellation and noise suppression
⚫ Compliant with USB 2.0 specification (slave mode only); the data
transfer rate can reach up to 480 Mbps
⚫ Used for AT command communication, data transmission, software
USB Interface
debugging, firmware upgrade
⚫ Supports USB serial drivers for Windows 7/8/8.1/10, Linux 2.6–5.12,
Android 4.x–11.x, etc.
Main UART:
⚫ Used for AT command communication and data transmission
⚫ Baud rates reach up to 921600 bps; 115200 bps by default
⚫ Support MAIN_RTS and MAIN_CTS hardware flow control
UART Interfaces Debug UART:
⚫ Used for Linux console and log output
⚫ 921600 bps baud rates
⚫ Can only be used as a debugging UART, not a general UART
Auxiliary UART
I2C Interfaces ⚫ Two I2C interfaces
SPI Interface ⚫ SPI interface only supports master mode
SD Card Interface ⚫ SD 2.0 protocol compliant
WLAN Application
⚫ Supports SDIO 1.1 interface for WLAN function
Interface*
LCD Interface ⚫ LCD interface supporting SPI mode
Matrix keyboard
⚫ Support 4 × 4 matrix keyboard
Interfaces
ADC Interfaces ⚫ Three ADC interfaces
USB_BOOT Interface ⚫ Forced download interface
⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel

AT Commands
enhanced AT commands
Network Indication ⚫ NET_MODE and NET_STATUS to indicate network connectivity status
⚫ Main antenna interface (ANT_MAIN), Wi-Fi Scan/Bluetooth antenna

Antenna Interfaces interface (ANT_BT/WIFI_SCAN) and GNSS 4 antenna interface
(ANT_GNSS)
4 GNSS function is optional.
⚫ 50 Ω impedance
Location ⚫ Supports Wi-Fi Scan/GNSS 4
⚫ Size: (28.0 ±0.15) mm × (31.0 ±0.15) mm × (2.4 ±0.2) mm

Physical Characteristics
⚫ Weight: approx. 4.1 g
⚫ Operating temperature range: -35 °C to +75 °C 5
Temperature Ranges ⚫ Extended temperature range: -40 °C to +85 °C 6
⚫ Storage temperature range: -40 °C to +90 °C
Firmware Upgrade ⚫ USB interface or FOTA
RoHS ⚫ All hardware components are fully compliant with EU RoHS directive
2.3. Functional Diagram
The following figure shows a block diagram of EC200U series and illustrates the major functional parts.
⚫ Power management
⚫ Baseband
⚫ Flash
⚫ Radio frequency
⚫ Peripheral interfaces
5 Within operating temperature range, the module is 3GPP compliant.

6 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice,
SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced,
while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature
returns to the operating temperature range, the module meets 3GPP specifications again.
ANT_MAIN ANT_BT/WIFI_SCAN ANT_GNSS
SAW
PAM
SAW LNA
Duplex
GNSS
VBAT_RF APT
PA
PRx
Tx
MIC 26 MHz
DCXO Transceiver
LOUDSPK
32 kHz Clock
VBAT_BB
PMIC
Control Baseband
PWRKEY
SPI Nor Flash (64Mb)
RESET_N PSRAM (128Mb)
ADCs
VDD_EXT USB (U)SIMs SPI I2Cs PCM UARTs STATUS WLAN LCD Keypads SD
Card
Figure 1: Functional Diagram
2.4. EVB
In order to help customers to develop applications with EC200U series, Quectel provides an evaluation
board (UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antennas and other peripherals to
control or test the module. For more details, please refer to document [1].
3 Application Interfaces
3.1. General Description
EC200U series is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular
application platform. The subsequent chapters will provide detailed descriptions of the following
interfaces.
⚫ Power supply
⚫ (U)SIM interfaces
⚫ USB interface
⚫ UART interfaces
⚫ SPI interface
⚫ PCM and I2C interfaces
⚫ Analog audio interfaces
⚫ LCD interface
⚫ Matrix keyboard interface
⚫ SD card interface
⚫ WLAN application interface*
⚫ ADC interfaces
⚫ Status indications
⚫ USB_BOOT interface
3.2. Pin Assignment
The following figure shows the pin assignment of EC200U series module.
MAIN_DCD
RESERVED
MAIN_RXD
MAIN_DTR
MAIN_TXD
MAIN_RTS
MAIN_CTS
USB_VBUS
KEYOUT3
KEYOUT2
VBAT_BB
VBAT_RF
VBAT_BB
VBAT_RF
USB_DM
MAIN_RI
USB_DP
STATUS
114
113
GND
GND
72
70
69
68
67
66
65
64
63
62
61
59
58
56
71
60
57
55
1 54
WAKEUP_IN GND
2 53
AP_READY
129 117 GND
SDIO2_DATA3 RESERVED
3 52
SLEEP_IND GND
130 118 108 103 99 95 90 85

4 WLAN_SLP_ 51
W_DISABLE# SDIO2_DATA2 CLK GND
5 50
NET_MODE 131 119
LCD_FMARK
GND
SDIO2_DATA1
6 49
NET_STATUS ANT_MAIN
132 120
7
VDD_EXT
SDIO2_DATA0
LCD_RSTB
109 104 100 96 91 86 48
GND
141 133 121 144

I2C2_SCL GRFC2
SDIO2_CLK LCD_SEL
142 82 79 76 73 143
I2C2_SDA RESERVED KEYIN2 GND LOUDSPK GRFC1
8
134 122 _P
74 47
83 80 77
110 105
LCD_CS
92 87
SDIO2_CMD
GND KEYOUT0 KEYIN3 MIC_N LOUDSPK ANT_GNSS
_N
9
GND 135
WLAN_WAKE
123
LCD_CLK
84
KEYOUT1
81
RESERVED
78
KEYIN1
75
MIC_P
46
GND
10 45
USIM_GND ADC0
136 124
LCD_SDC
WLAN_EN
11 44
DBG_RXD ADC1
12 137 125 111 106 101 97 93 88 43

DBG_TXD AUX_RXD LCD_SI/O ADC2
13 42
USIM_DET
138
AUX_TXD
126
GPIO1
I2C_SDA
14 41
USIM_VDD I2C_SCL
15 139 127 98 94 89 40
USIM_DATA BT_EN
WLAN_PWR_
EN 112 107 102 SPI_CLK
16 39
USIM_CLK
140ISINK
128 SPI_MISO
USIM2_VDD
17 38
USIM_RST SPI_MOSI
18 37
RESERVED SPI_CS
SDIO1_DATA3
SDIO1_DATA2
SDIO1_DATA1
SDIO1_DATA0
ANT_BT/WIFI_
SDIO1_CMD
RESERVED
USB_BOOT
SDIO1_VDD
PCM_DOUT
PCM_SYNC
SDIO1_CLK
PCM_CLK
RESET_N
PCM_DIN
PWRKEY
SD_DET
116
115
SCAN
GND
GND
GND
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Power Pins GND Pins Signal Pins RESERVED Pins
Figure 2: Pin Assignment (Top View)
NOTE
1. USB_BOOT and KEYIN1 cannot be pulled up before the module’s successful startup.
2. Please keep all RESERVED and unused pins unconnected, and all GND pins are connected to
the ground.
3. Pin 85–112 should be connected to the ground.
3.3. Pin Description
The following tables show the pin definition of EC200U series module.
Table 5: I/O Parameters Definition
Type Description
AI Analog Input
AO Analog Output
AIO Analog Input/Output
DI Digital Input
DO Digital Output
DIO Digital Input/Output
OD Open Drain
PI Power Input
PO Power Output
Table 6: Pin Description
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
Power supply for

Vmax = 4.3 V It must be provided
module’s
VBAT_BB 59, 60 PI Vmin = 3.3 V with sufficient current
baseband part
Vnom = 3.8 V up to 1.5 A.
and RF part
Vmax = 4.3 V It must be provided
Power supply for
VBAT_RF 57, 58 PI Vmin = 3.3 V with sufficient current
module’s RF part
Vnom = 3.8 V up to 2 A.
GND 8, 9, 19, 22, 36, 46, 48, 50–54, 56, 72, 76, 85–112
Module Output Power
Power supply for

external GPIO’s
pull-up circuits. Add
Provide 1.8 V for Vnom = 1.8 V
VDD_EXT 7 PO 2.2 μF capacitor if
external circuit IOmax = 50 mA
used.
If unused, keep it
open.
Turn on/off
Turn on/off the

PWRKEY 21 DI VILmax = 0.5 V VBAT power domain
module
VBAT power domain.
RESET_N 20 DI Reset the module VILmax = 0.5 V If unused, keep it
open. Active low.
Status Indication
1.8 V power domain.

Indicate module’s
STATUS 61 DO If unused, keep it
operating status
open.
Indicate the
1.8 V power domain.
module's VOHmin = 1.35 V
NET_MODE 5 DO If unused, keep it
network activity VOLmax = 0.45 V
open.
status
Indicate the
1.8 V power domain.
module's VOHmin = 1.35 V
NET_STATUS 6 DO If unused, keep it
network registration VOLmax = 0.45 V
open.
mode
USB Interface
Vmax = 5.25 V Typical: 5.0 V

Used for USB
USB_VBUS 71 AI Vmin = 3.5 V If unused, keep it
detection
Vnom = 5.0 V open.
Require differential
USB differential data impedance of 90 Ω.
USB_DP 69 AIO
bus (+) USB 2.0 compliant. If
unused, keep it open.
USB differential data
USB_DM 70 AIO impedance of 90 Ω.
bus (-)
USB 2.0 compliant. If
unused, keep it open.
(U)SIM Interface
Connect to the GND

USIM_GND 10 (U)SIM1 card GND of (U)SIM card
connector.
IOmax = 50 mA
For 1.8 V (U)SIM:

Either 1.8 V or 3.0 V
Vmax = 1.9 V
(U)SIM1 card power can be recognized by
USIM_VDD 14 PO Vmin = 1.7 V
supply the module
automatically.
For 3.0 V (U)SIM:
Vmax = 3.05 V
Vmin = 2.7 V
For 1.8 V (U)SIM:
VILmax = 0.6 V
VIHmin = 1.2 V
VOLmax = 0.45 V
VOHmin = 1.35 V
USIM_DATA 15 DIO (U)SIM1 card data
For 3.0 V (U)SIM:
VILmax =1.0 V
VIHmin = 1.95 V
VOLmax = 0.45 V
VOHmin = 2.55 V
For 1.8 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 1.35 V
USIM_CLK 16 DO (U)SIM1 card clock
For 3.0 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 2.55 V
For 1.8 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 1.35 V
USIM_RST 17 DO (U)SIM1 card reset
For 3.0 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 2.55 V
USIM_DET 13 DI (U)SIM card VILmin = -0.3 V 1.8 V power domain.
hot-plug detect VILmax = 0.6 V If unused, keep it

VIHmin = 1.26 V open.
VIHmax = 2.0 V
IOmax = 50 mA
For 1.8 V (U)SIM:

Either 1.8 V or 3.0 V
Vmax = 1.9 V
(U)SIM2 card power can be recognized by
USIM2_VDD 128 PO Vmin = 1.7 V
supply the module
automatically.
For 3.0 V (U)SIM:
Vmax = 3.05 V
Vmin = 2.7 V
For 1.8 V (U)SIM:
VILmax = 0.6 V
VIHmin = 1.26 V
VOLmax = 0.45 V
VOHmin = 1.35 V
AP_READY 2 DIO (U)SIM card data The (U)SIM2 function
For 3.0 V (U)SIM: is optional. If the
VILmax = 1.0 V firmware version of
VIHmin = 1.95 V the module supports
VOLmax = 0.45 V the function of the
VOHmin = 2.55 V (U)SIM2 card, the
For 1.8 V (U)SIM: relevant functions of
VOLmax = 0.45 V the (U)SIM2 card can
VOHmin = 1.35 V be realized by
WAKEUP_IN 1 DO (U)SIM2 card clock multiplexing
For 3.0 V (U)SIM: AP_READY,
VOLmax = 0.45 V WAKEUP_IN,
VOHmin = 2.55 V SLEEP_IND, and
(U)SIM2 card W_DISABLE#. For
SLEEP_IND 3 DI VILmin = -0.3 V
hot-plug detect details, please
For 1.8 V (U)SIM: consult Quectel
VOLmax = 0.45 V Technical Supports.
VOHmin = 1.35 V
W_DISABLE# 4 DO (U)SIM2 card reset
For 3.0 V (U)SIM:
VOLmax = 0.45 V
VOHmin = 2.55 V
Main UART Interface
Main UART ring VOLmax = 0.45 V

MAIN_RI 62 DO 1.8 V power domain.
indication VOHmin = 1.35 V
If unused, keep it
Main UART data VOLmax = 0.45 V
MAIN_DCD 63 DO open.
carrier detect VOHmin = 1.35 V
Connect to DTE’s
CTS.
DTE clear to send VOLmax = 0.45 V
MAIN_CTS 64 DO 1.8 V power domain.
signal from DCE VOHmin = 1.35 V
If unused, keep it
open.
Connect to DTE’s
VILmin = -0.3 V
RTS.
DTE request to send VILmax = 0.6 V
MAIN_RTS 65 DI 1.8 V power domain.
signal to DCE VIHmin = 1.26 V
If unused, keep it
VIHmax = 2.0 V
open.
1.8 V power domain.
VILmin = -0.3 V Pull-up by default.
Main UART data VILmax = 0.6 V Low level wakes up
MAIN_DTR 66 DI
terminal ready VIHmin = 1.26 V the module.
VIHmax = 2.0 V If unused, keep it
open.
VOLmax = 0.45 V
MAIN_TXD 67 DO Main UART transmit
VOHmin = 1.35 V
1.8 V power domain.
VILmin = -0.3 V
If unused, keep it
VILmax = 0.6 V
MAIN_RXD 68 DI Main UART receive open.
VIHmin = 1.26 V
VIHmax = 2.0 V
Debug UART Interface
1.8 V power domain.

Debug UART VOLmax = 0.45 V
DBG_TXD 12 DO If unused, keep it
transmit VOHmin = 1.35 V
open.
VILmin = -0.3 V
1.8 V power domain.
Debug UART VILmax = 0.6 V
DBG_RXD 11 DI If unused, keep it
receive VIHmin = 1.26 V
open.
VIHmax = 2.0 V
Auxiliary UART Interface
VILmin = -0.3 V 1.8 V power domain.

Auxiliary UART
AUX_RXD 137 DI VILmax = 0.6 V If unused, keep it
receive
VIHmax = 2.0 V
1.8 V power domain.

Auxiliary UART VOLmax = 0.45 V
AUX_TXD 138 DO If unused, keep it
transmit VOHmin = 1.35 V
open.
ADC Interfaces
General-purpose Voltage range: Use 1 kΩ resistor in

ADC2 43 AI
ADC interface 0–VBAT_BB series.
General-purpose Voltage range: If unused, keep it
ADC1 44 AI
ADC interface 0–VBAT_BB open.
The external resistor
should be less than
General-purpose Voltage range:
ADC0 45 AI 100 kΩ when the
ADC interface 0–VBAT_BB
voltage divider
resistor applies.
Analog Audio Interface
Loudspeaker
LOUDSPK_P 73 AO differential output
(+)
Loudspeaker
LOUDSPK_N 74 AO If unused, keep them
differential output (-)
open.
Microphone analog
MIC_P 75 AI
input (+)
Microphone analog
MIC_N 77 AI
input (-)
I2C Interface
I2C_SCL 41 OD I2C serial clock

Require external
I2C_SDA 42 OD I2C serial data pull-up to 1.8 V if
used.
I2C2_SCL 141 OD I2C serial clock If unused, keep it
open.
I2C2_SDA 142 OD I2C serial data
PCM Interface
VILmin = -0.3 V
VILmax = 0.6 V
PCM_DIN 24 DI PCM data input VIHmin = 1.26 V 1.8 V power domain.
VIHmax = 2.0 V If unused, keep it
VOLmax = 0.45 V open.
PCM_DOUT 25 DO PCM data output
VOHmin = 1.35 V
PCM data frame VILmax = 0.6 V If unused, keep it
PCM_SYNC 26 DI VIHmin = 1.26 V
sync open. The PCM
VIHmax = 2.0 V
function only
VILmin = -0.3 V
VILmax = 0.6 V supports slave
PCM_CLK 27 DI PCM clock VIHmin = 1.26 V mode, not master
VIHmax = 2.0 V mode.
SPI Interface
VOLmax = 0.45 V
SPI_CS 37 DO SPI chip select If you use a module
VOHmin = 1.35 V
model that supports
SPI master mode VOLmax = 0.45 V
SPI_MOSI 38 DO GNSS function, the
output VOHmin = 1.35 V
SPI function of Pin
SPI master mode
SPI_MISO 39 DI 37–40 cannot be
input
used and needs to
VOLmax = 0.45 V
SPI_CLK 40 DO SPI clock be left unconnected.
VOHmin = 1.35 V
LCD Interface

VILmin = -0.3 V
LCD frame VILmax = 0.6 V
LCD_FMARK 119 DI
synchronization VIHmin = 1.26 V
VIHmax = 2.0 V
VOLmax = 0.45 V
LCD_RSTB 120 DO LCD reset
VOHmin = 1.35 V
LCD_SEL 121 - Reserved -
1.8 V power domain.
VOLmax = 0.45 V
LCD_CS 122 DO LCD chip select If unused, keep them
VOHmin = 1.35 V
VOLmax = 0.45 V open.
LCD_CLK 123 DO LCD clock
VOHmin = 1.35 V
LCD register VOLmax = 0.45 V
LCD_SDC 124 DO
selection VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.6 V
LCD_SI/O 125 DIO LCD data
VIHmin = 1.26 V
VIHmax = 2.0 V
ISINK 140 PI Sink current input. Imax = 200 mA It is driven by the
Backlight Configurable current current sink method,

adjustment and connected to the
backlight cathode,
the brightness can
be adjusted with
current control.
Matrix Keyboard Interface
It can be multiplexed
USB_BOOT 115 DI Matrix key input0 as KEYIN0 after
startup.
1.8 V power domain.
If unused, keep it
KEYIN1 78 DI Matrix key input1 open. The KEYIN1
cannot be pulled up
before startup.
KEYIN2 79 DI Matrix key input2
KEYIN3 80 DI Matrix key input3
KEYOUT0 83 DO Matrix key output0 1.8 V power domain.

If unused, keep them
KEYOUT1 84 DO Matrix key output1 open.
KEYOUT2 113 DO Matrix key output2
KEYOUT3 114 DO Matrix key output3
SD Card Interface
1.8 V power domain.

SD_DET 23 DI SD card detect If unused, keep it
open.
SDIO1_DATA3 28 DIO SDIO data bit 3
SDIO1_DATA2 29 DIO SDIO data bit 2 1.8/3.2 V power

domain.
SDIO1_DATA0 31 DIO SDIO data bit 0 open.
SDIO1_CLK 32 DO SDIO clock
SDIO1_CMD 33 DIO SDIO command
SDIO1_VDD 34 PO SDIO power supply
WLAN Interface*
WLAN_SLP_ If unused, keep it

118 DO WLAN sleep clock
CLK open.
1.8 V power domain.
WLAN_PWR_ WLAN power supply VOLmax = 0.45 V
127 DO If unused, keep it
EN enable control VOHmin = 1.35 V
open.
VOLmax = 0.45 V
VOHmin = 1.35 V
WLAN SDIO VILmin = -0.3 V
SDIO2_DATA3 129 DIO
data bit 3 VILmax = 0.6 V
VIHmin = 1.26 V
VIHmax = 2.0 V
VOLmax = 0.45 V
VOHmin = 1.35 V
SDIO2_DATA2 130 DIO
VIHmin = 1.26 V
VIHmax = 2.0 V
VOLmax = 0.45 V
1.8 V power domain.
VOHmin = 1.35 V
SDIO2_DATA1 131 DIO open.
VIHmin = 1.26 V
VIHmax = 2.0 V
VOLmax = 0.45 V
VOHmin = 1.35 V
SDIO2_DATA0 132 DIO
VIHmin = 1.26 V
VIHmax = 2.0 V
VOLmax = 0.45 V
SDIO2_CLK 133 DO WLAN SDIO CLK
VOHmin = 1.35 V
WLAN SDIO VOLmax = 0.45 V
SDIO2_CMD 134 DO
command VOHmin = 1.35 V
Wake up the module VILmin = -0.3 V 1.8 V power domain.
WLAN_WAKE 135 DI by an external Wi-Fi VILmax = 0.6 V If unused, keep it
module VIHmin = 1.26 V open.
VIHmax = 2.0 V
WLAN function VOLmax = 0.45 V

WLAN_EN 136 DO
enable control VOHmin = 1.35 V
Antenna Interface
Bluetooth and Wi-Fi

Scan cannot be
used
simultaneously;
The shared antenna Wi-Fi Scan antenna
ANT_BT/WIFI_ interface of can
35 AIO
SCAN Bluetooth and Wi-Fi only receive but not
Scan transmit.
50 Ω characteristic
impedance.
If unused, keep it
open.
50 Ω characteristic
GNSS antenna impedance. If
ANT_GNSS 47 AI
interface unused, keep it
open.
Main antenna 50 Ω characteristic
ANT_MAIN 49 AIO
interface impedance.
USB_BOOT
1.8 V power domain,

VILmin = -0.3 V
Control pin for the a circuit design for
VILmax = 0.6 V
USB_BOOT 115 DI module to enter entering download
VIHmin = 1.26 V
download mode mode should be
VIHmax = 2.0 V
reserved.
Other Interface

VILmax = 0.6 V Pull-up by default.
WAKEUP_IN 1 DI Wake up the module
VIHmin = 1.26 V If unused, keep it
VIHmax = 2.0 V open.
Application VILmin = -0.3 V 1.8 V power domain.
AP_READY 2 DI
processor ready VILmax = 0.6 V If unused, keep it

VIHmax = 2.0 V
1.8 V power domain.
VOLmax = 0.45 V
SLEEP_IND 3 DO Sleep indicator If unused, keep it
VOHmin = 1.35 V
open.
1.8 V power domain.
Pull-up by default.
VILmin = -0.3 V Driving the pin low
Airplane mode VILmax = 0.6 V can make the
W_DISABLE# 4 DI
control VIHmin = 1.26 V module enter the
VIHmax = 2.0 V airplane mode.
If unused, keep it
open.
It can output CP log,
and only 8 Mbps
baud rate is
GPIO1 126 DO CP log
supported, and test
points should be
reserved.
BT_EN 139 Reserved
Generic RF
GRFC1 143 DIO
controller
Generic RF
GRFC2 144 DIO
controller
Reserved Pins
Pin Name Pin No. Comment

Keep these pins
RESERVED 18, 55, 81, 82, 116, 117
open.
3.4. Operating Modes
Table 7: Overview of Operating Modes
Mode Details
Software is active. The module has registered on the network, and it is

Idle
Normal ready to send and receive data.
Operation Network connection is ongoing. In this mode, the power consumption is
Talk/Data
decided by network setting and data transfer rate.
Minimum
AT+CFUN=0 can set the module to a minimum functionality mode without removing
Functionality
the power supply. In this case, RF function will be invalid.
Mode
AT+CFUN=4 or W_DISABLE# can set the module to airplane mode. In this case, RF
Airplane Mode
function will be invalid.
In this mode, the current consumption of the module will be reduced to the minimal
Sleep Mode level. In this mode, the module can still receive paging message, SMS, voice call and
TCP/UDP data from the network normally.
In this mode, the power management unit (PMU) shuts down the power supply.
Power Down
Software is not active, the serial interface is not accessible, while operating voltage
Mode
(connected to VBAT_RF and VBAT_BB) remains applied.
3.5. Power Saving
3.5.1. Sleep Mode
The module is able to reduce its current consumption to a minimum value in sleep mode. The following
section describes power saving procedures of the module.
3.5.1.1. UART Application
If the host communicates with module via UART interface, the following preconditions should be met to let
the module enter sleep mode.
⚫ Execute AT+QSCLK=1 to enable sleep mode.

⚫ Drive MAIN_DTR to high level.
The following figure shows the connection between the module and the host.
Module Host
MAIN_RXD TXD
MAIN_TXD RXD
MAIN_RI EINT
MAIN_DTR GPIO
AP_READY GPIO
GND GND
Figure 3: Sleep Mode Application via UART
⚫ Driving MAIN_DTR to low level by the host can wake up the module.
⚫ When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please
refer to Chapter 3.22 for details about MAIN_RI behavior.
3.5.1.2. USB Application with USB Remote Wakeup Function*
If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions
must be met to make the module enter sleep mode.

⚫ Ensure the MAIN_DTR is held at high level, or keep it open.
⚫ The host’s USB bus, which is connected with the module’s USB interface, enters suspended state.
Module Host
USB_VBUS VDD
USB_DP USB_DP
USB_DM USB_DM
AP_READY GPIO
GND GND
Figure 4: Sleep Mode Application with USB Remote Wakeup
⚫ Sending data to the module through USB can wake up the module.
⚫ When the module has a URC to report, the module will send remote wakeup signals via USB bus so
as to wake up the host.
NOTE
1. USB suspend is supported on Linux system but not supported on Windows system.
2. Pay attention to the level match shown in dotted line between the module and the host.
3.5.1.3. USB Application with USB Suspend/Resume and MAIN_RI Function*
If the host supports USB suspend/resume but does not support remote wakeup function, the MAIN_RI
signal is needed to wake up the host.
In this case, three preconditions can make the module enter the sleep mode.

⚫ Ensure the host’s USB bus, which is connected with the module’s USB interface, enters suspended
state.
Module Host
USB_VBUS VDD
USB_DP USB_DP
USB_DM USB_DM
AP_READY GPIO
MAIN_RI EINT
GND GND
Figure 5: Sleep Mode Application with MAIN_RI
⚫ Sending data to the module through USB can wake up the module.
⚫ When the module has a URC to report, the URC will trigger the behaviors of MAIN_RI pin.
NOTE
1. USB suspend is supported on Linux system but not supported on Windows system.
2. Pay attention to the level match shown in dotted line between the module and the host.
3.5.1.4. USB Application
If the host does not support USB suspend function, USB_VBUS should be disconnected via an external
control circuit of USB_VBUS to let the module enter sleep mode.

⚫ Disconnect USB_VBUS.
Module Host
GPIO
Power
USB_VBUS Switch VDD
USB_DP USB_DP
USB_DM USB_DM
MAIN_RI EINT
AP_READY GPIO
GND GND
Figure 6: Sleep Mode Application without Suspended Function
The module will be wakened up when USB_VBUS is restored to be powered.
NOTE
Please pay attention to the level match shown in dotted line between the module and the host.
3.5.2. Airplane Mode
When the module enters airplane mode, the RF function does not work, and all AT commands related to
RF function will be not accessible. This mode can be set via the following ways.
Hardware:
The W_DISABLE# is pulled up by default. Its control function for airplane mode, which is disabled by
default in software, can be enabled through AT+QCFG=“airplanecontrol”,1. When such a control
function is enabled, you can drive W_DISABLE# to low level to make the module enter airplane mode.
Software:
AT+CFUN = <fun> provides the choice of the functionality level through setting <fun> into 0, 1 or 4.
⚫ AT+CFUN=0: Minimum functionality mode (RF functions are disabled).

⚫ AT+CFUN=1: Full functionality mode (by default).
⚫ AT+CFUN=4: RF function is disabled (Airplane mode).
3.6. Power Supply
3.6.1. Power Supply Pins
The module provides four VBAT pins for connection with the external power supply. There are two
separate voltage domains for VBAT.
⚫ Two VBAT_RF pins for module’s RF part.

⚫ Two VBAT_BB pins for module’s baseband part and RF part.
Table 8: VBAT and GND Pins
Pin Name Pin No. Description Min. Typ. Max. Unit
Power supply for module’s

VBAT_RF 57, 58 3.3 3.8 4.3 V
RF part
Power supply for module‘s
VBAT_BB 59, 60 3.3 3.8 4.3 V
baseband part and RF part
GND 8, 9, 19, 22, 36, 46, 48, 50–54, 56, 72, 76, 85–112
3.6.2. Voltage Stability Requirements
The power supply range of the module is from 3.3 V to 4.3 V. Please make sure that the input voltage will
never drop below 3.3 V. The following figure shows the voltage drop during burst transmission in 2G
network. The voltage drop will be less in 4G networks.
Burst Burst
Transmission Transmission
VBAT Ripple
Drop
Figure 7: Power Supply Limits during Burst Transmission
To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be
used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low
ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC
array, and place these capacitors close to VBAT_BB and VBAT_RF. The main power supply from an
external application has to be a single voltage source and can be expanded to two sub paths with star
configuration routing. The width of VBAT_BB trace should be no less than 2 mm; and the width of
VBAT_RF trace should be no less than 2.5 mm. In principle, the longer the VBAT trace is, the wider it will
be.
In addition, in order to ensure the stability of power source, it is suggested that a TVS diode of which
reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used.
The following figure shows the star configuration routing of the power supply.
VBAT
VBAT_RF
VBAT_BB
+ +
D1 C1 C2 C3 C4 C5 C6 C7 C8
WS4.5D3HV 100 μF 100 nF 33 pF 10 pF 100 μF 100 nF 33 pF 10 pF
Module
Figure 8: Star Configuration Routing of Power Supply
3.6.3. Reference Design for Power Supply
Power design for the module is very important, as the performance of the module largely depends on the
power source. The power supply should be able to provide sufficient current up to 2.0 A to the module that
only supports LTE network, while 3.0 A at least should be provided for GSM network. If the voltage drop
between the input and output is not too high, it is suggested that an LDO should be used to supply power
for the module. If there is a big voltage difference between the input source and the desired output (VBAT),
use a buck converter as the power supply.
The following figure shows a reference design for +5 V input power source. The typical output of the
power supply is about 3.8 V and the maximum load current is 3.0 A.
MIC29302WU
DC_IN VBAT
2 4
IN OUT
GND
ADJ
EN
100K
1%
5
51K
4.7K 470R
470 μF 100 nF
470 μF 100 nF
47K
VBAT_EN 47K 1%
Figure 9: Reference Circuit of Power Supply
3.6.4. Monitor the Power Supply
You can use AT+CBC to monitor the VBAT_BB voltage value. For more details, see document [2].
3.7. Turn on/Turn off/Reset
3.7.1. Turn on Module with PWRKEY
Table 9: Pin Description of PWRKEY
Pin Name Pin No. I/O Description Comment
PWRKEY 21 DI Turn on/off the module VBAT power domain
When the module is in power-off mode, it can be turned on to normal mode by driving PWRKEY to a low
level for at least 2 s. It is recommended to use an open drain/collector driver to control the PWRKEY. A
simple reference circuit is illustrated in the following figure.
PWRKEY
≥ 2 s
4.7K
10 nF
Turn-on pulse
47K
Figure 10: Turn on Module by Using Driving Circuit
Another way to control the PWRKEY is to use a button directly. When pressing the button, electrostatic
strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the
button for ESD protection.
A reference circuit is shown in the following figure.
S1
PWRKEY
TVS
Close to S1
Figure 11: Turn on Module by Using Button
The power-up scenario is illustrated in the following figure.
NOTE1
VBAT ≥2s
PWRKEY VIL ≤ 0.5 V
About 1.15 s
VDD_EXT
RESET_N
≥ 5.05 s
STATUS
(DO)
≥4s
UART Inactive Active
≥ 2.23 s
USB Inactive Active
Figure 12: Power-up Timing
NOTE
1. Please make sure that VBAT is stable before PWRKEY is pulled down. It is recommended that the
time interval between powering up VBAT and pulling down PWRKEY is no less than 30 ms.
2. PWRKEY can be pulled down directly to GND with a recommended 1 kΩ resistor if the module
needs being powered on automatically and shutdown is not needed.
3.7.2. Turn off Module
The following ways can be used to turn off the module:
⚫ Turn off the module with PWRKEY.

⚫ Turn off the module by using AT+QPOWD.
3.7.2.1. Turn off Module with PWRKEY
Driving PWRKEY low for at least 3 s and releasing it, the module executes power-down procedure.
The power-down scenario is illustrated in the following figure.
VBAT
≥ 3 s ≥ 30 s
PWRKEY
STATUS
(DO)
Module Running Power-down procedure OFF

Status
Figure 13: Power-down Timing
3.7.2.2. Turn off Module with AT Command
It is also a safe way to use AT+QPOWD to turn off the module, which is similar to the procedure of turning
off the module via PWRKEY.
Please refer to document [2] for details about AT+QPOWD.
NOTE
1. In order to avoid damaging internal flash, please do not switch off the power supply when the
module works normally. Only after the module is shut down by PWRKEY or AT command, can the
power supply be cut off.
2. When keeping the PWRKEY to the ground, the module can only be forced to turn off by cutting off
the VBAT power supply considering that the module cannot be turned off with AT command.
Therefore, it is recommended that you can turn on or turn off the module by pulling up and pulling
down the PWEKEY instead of keeping the PWRKEY to the ground.
3. When being turned off, the module will log out of the network. The time for logging out relates to its
network status. Thus, please pay attention to the shutdown time in your design because the actual
shutdown time varies with the network status.
3.7.3. Reset the Module
The RESET_N can be used to reset the module. The module can be reset by driving RESET_N low for at
least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is
recommended to route the trace as short as possible and surround it with ground.
Table 10: Pin Description of RESET_N
RESET_N 20 DI Reset the module VBAT power domain
The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button
can be used to control the RESET_N.
RESET_N
≥ 100 ms
4.7K
Reset pulse
47K
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit
S2
RESET_N
TVS
Close to S2
Figure 15: Reference Circuit of RESET_N by Using Button
The timing of resetting module is illustrated in the following figure.
VBAT
≥ 100 ms
RESET_N
VIL ≤ 0.5 V
Module Running Baseband resetting Baseband restart

Status
Figure 16: Timing of Resetting Module
NOTE
1. Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N.

2. It is recommended to use RESET_N only when the module cannot be turned off by AT+QPOWD or
PWRKEY.
3.8. (U)SIM Interfaces
The module provides two (U)SIM interfaces, and it supports DSDS function. The (U)SIM interfaces meet
ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported.
Table 11: Pin Definition of (U)SIM1 Interface
Either 1.8 V or 3.0 V (U)SIM card

USIM_VDD 14 PO (U)SIM card power supply is supported and can be identified
automatically by the module.
USIM_DATA 15 DIO (U)SIM card data
USIM_CLK 16 DO (U)SIM card clock
USIM_RST 17 DO (U)SIM card reset
1.8 V power domain.

USIM_DET 13 DI (U)SIM card hot-plug detect
If unused, keep it open.
USIM_GND 10 (U)SIM card GND
Table 12: Pin Definition of (U)SIM2 Interface
Pin
Pin Name I/O Description Comment
No.
USIM2_VDD 128 PO (U)SIM2 card power supply The (U)SIM2 function is optional. If
the firmware version of the module
AP_READY 2 DIO (U)SIM2 card data supports the function of the
(U)SIM2 card, the relevant
WAKEUP_IN 1 DO (U)SIM2 card clock functions of the (U)SIM2 card can
be realized by multiplexing
W_DISABLE# 4 DO (U)SIM2 card reset
AP_READY, WAKEUP_IN,
SLEEP_IND, and W_DISABLE#
SLEEP_IND 3 DI (U)SIM2 card hot-plug detect pins. For details, please consult
Quectel Technical Supports.
The module supports (U)SIM card hot-plug via the USIM_DET, and both high and low level detections are
supported. By default, the function is disabled, and it can be enabled by AT+QSIMDET. Please see
document [2] for more details about the AT+QSIMDET.
The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
VDD_EXT USIM_VDD
51K 10 K
USIM_GND 100 nF (U)SIM Card Connector
USIM_VDD
VCC GND
USIM_RST 0R
RST VPP
Module USIM_CLK
CLK Switch IO
USIM_DET 0R
USIM_DATA 0R
GND
33 pF 33 pF 33 pF
GND GND
Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector
If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit
for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
USIM_VDD
10 K
USIM_GND 100 nF
(U)SIM Card Connector
USIM_VDD
VCC GND
USIM_RST 0R
RST VPP
Module USIM_CLK
CLK IO
0R
USIM_DATA 0R
33 pF 33 pF 33 pF
GND GND
Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector
In order to enhance the reliability and availability of the (U)SIM card in your applications, please follow the
criteria below in (U)SIM circuit design:
⚫ Place (U)SIM card connector as close to the module as possible. Keep the trace length less than 200
mm as far as possible.
⚫ Keep (U)SIM card signals away from RF and VBAT traces.
⚫ Keep the trace between the ground of (U)SIM card connector and USIM_GND short and wide. Keep
the trace width of USIM_GND and USIM_VDD no less than 0.5 mm to maintain the same electric
potential. If the ground is complete on your PCB, USIM_GND can be connected to PCB ground
directly.
⚫ To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
⚫ In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic
capacitance should not be more than 15 pF. The 0 Ω resistors should be added in series between the
module and the (U)SIM card to facilitate debugging. The 33 pF capacitors on USIM_DATA,
USIM_CLK and USIM_RST are used for filtering interference of EGSM900. Please note that the
(U)SIM peripheral circuit should be close to the (U)SIM card connector.
⚫ The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the
(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to
add a pull-up resistor near the (U)SIM card connector.
3.9. USB Interface
The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB
2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB
interface only supports USB slave mode and it can be used for AT command communication, data
transmission, software debugging and firmware upgrade.
Table 13: Pin Description of USB Interface
USB_DP 69 AIO USB differential data bus (+)
impedance of 90 Ω
USB_DM 70 AIO USB differential data bus (-)
impedance of 90 Ω
Typical 5.0 V,
USB_VBUS 71 AI USB connection detect
Minimum 3.5 V
GND 72 Ground
For more details about the USB 2.0 specifications, please visit http://www.usb.org/home.
Reserve test points for debugging and firmware upgrade in your design. The following figure shows a
reference circuit of USB interface.
Test Points
Minimize these stubs
Module MCU
R3 NM_0R
VDD R4 NM_0R
USB_VBUS ESD Array
L1 USB_DM
USB_DM
USB_DP USB_DP
Close to Module GND

GND
Figure 19: Reference Circuit of USB Application
A common mode choke L1 is recommended to be added in series between the module and your MCU in
order to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added
in series between the module and the test points so as to facilitate debugging, and the resistors are not
mounted by default. In order to ensure the integrity of USB data line signal, L1, R3 and R4 components
must be placed close to the module, and also these resistors should be placed close to each other. The
extra stubs of trace must be as short as possible.
The following principles should be complied with when designing the USB interface, so as to meet USB
2.0 specification.
⚫ Route the USB signal traces as differential pairs with ground surrounded. The impedance of USB
differential trace is 90 Ω.
⚫ Do not route signal traces under crystals, oscillators, magnetic device and RF signal traces. It is
recommended to route the USB differential traces in inner-layer of the PCB and to surround the
traces with ground on that layer and with ground planes above and below.
⚫ Pay attention to the influence of junction capacitance of ESD protection components on USB data
lines. Typically, the capacitance value should be less than 2.0 pF, and keep the ESD protection
components to the USB connector as close as possible.
3.10. UART Interfaces
The module provides three UART interfaces: the main UART interface, the debug UART interface and
auxiliary UART Interface. The following shows their features.
⚫ Main UART interface: The main UART interface supports 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800 and 921600 bps baud rates, and the default is 115200 bps. This interface is used for
data transmission and AT command communication and supports RTS and CTS hardware flow
control.
⚫ Debug UART interface: Only supports 921600 bps baud rate, used for the output of partial logs.
⚫ Auxiliary UART Interface
Table 14: Pin Definition of Main UART Interface
MAIN_RI 62 DO Main UART ring indication
Main UART data carrier

MAIN_DCD 63 DO 1.8 V power domain.
detect
If unused, keep them open.
DTE clear to send signal
MAIN_CTS 64 DO from DCE (Connect to
DTE’s CTS)
DTE request to send signal

MAIN_RTS 65 DI to DCE (Connect to DTE’s
RTS)
Main UART data terminal
MAIN_DTR 66 DI
ready
MAIN_TXD 67 DO Main UART transmit
MAIN_RXD 68 DI Main UART receive
Table 15: Pin Definition of Debug UART Interface
DBG_TXD 12 DO Debug UART transmit

1.8 V power domain. If unused,
keep them open.
DBG_RXD 11 DI Debug UART receive
Table 16: Pin Definition of Auxiliary UART Interface
AUX_TXD 138 DO Auxiliary UART transmit

1.8 V power domain. If unused,
keep them open.
AUX_RXD 137 DI Auxiliary UART receive
The module provides 1.8 V UART interface. Use a level shifter if the application is equipped with a 3.3 V
UART interface. A level shifter TXS0108EPWR provided by Texas Instruments is recommended. The
following figure shows a reference design.
VDD_EXT VCCA VCCB VDD_MCU

0.1 μF 0.1 μF
10K
120K
OE GND
MAIN_RI A1 B1 RI_MCU
MAIN_DCD A2 B2 DCD_MCU
MAIN_CTS A3 Translator B3 CTS_MCU
MAIN_RTS A4 B4 RTS_MCU
MAIN_DTR A5 B5 DTR_MCU
MAIN_TXD A6 B6 RXD_MCU
MAIN_RXD A7 B7 TXD_MCU
51K 51K
A8 B8
Figure 20: Reference Circuit with Translator Chip
Please visit http://www.ti.com for more information.
Another example with transistor circuit is shown as below. For the design of circuits shown in dotted lines,
see that shown in solid lines, but pay attention to the direction of connection.
4.7K
VDD_EXT VDD_EXT
1 nF
MCU/ARM Module
10K
TXD MAIN_RXD
RXD MAIN_TXD
1 nF
10K
VDD_EXT
VCC_MCU 4.7K
RTS MAIN_RTS
CTS MAIN_CTS
GPIO MAIN_DTR
EINT MAIN_RI
GPIO MAIN_DCD
GND GND
Figure 21: Reference Circuit with Transistor Circuit
NOTE
1. Triode level transistor circuit solution is not suitable for applications with baud rates exceeding 460
kbps.
2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected
to the host RTS.
3.11. SPI Interface
The SPI interface of EC200U series module only supports master mode. It allows the full duplex
synchronous communication between module and peripherals. Its working voltage is 1.8 V, and the
maximum clock frequency is 25 MHz. If a universal 4-wire SPI interface is used to connect to Nor Flash, it
provides the basic Flash operation including reading, writing and erasing, and does not support the file
system.
Table 17: Pin Definition of SPI interface
SPI_CS 37 DO SPI chip select If you use a module model

SPI master mode that supports GNSS
SPI_MOSI 38 DO
output function, the SPI function of
Pin 37–40 cannot be used
SPI_MISO 39 DI SPI master mode input
and needs to be left
SPI_CLK 40 DO SPI clock unconnected.
3.12. I2C Interfaces
The module provides two I2C interfaces.
Table 18: Pin Definition of I2C Interfaces
I2C_SCL 41 OD I2C serial clock
I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8 V

if used.
I2C2_SCL 141 OD I2C serial clock If unused, keep it open.
I2C2_SDA 142 OD I2C serial data
NOTE
The I2C bus supports simultaneous connection of multiple peripherals except for codec IC. In other
words, if a codec IC has been mounted on the I2C bus, no other peripherals can be mounted. If there is
no codec IC on the bus, multiple peripherals can be mounted.
3.13. PCM Interface
The module provides one PCM interface which only supports slave mode.
Table 19: Pin Definition of PCM Interface

1.8 V power domain.
PCM_DIN 24 DI PCM data input
1.8 V power domain.
PCM_DOUT 25 DO PCM data output
PCM_SYNC 26 DI PCM data frame sync 1.8 V power domain.

If unused, keep it open. The PCM
PCM_CLK 27 DI PCM clock function only supports slave mode.
The following figure shows the reference design of PCM and I2C interface with external Codec chip:
External 26MHz Crystal NM 0R

MICBIAS
MAIN_DCD MCLK
0R INP
BIAS
PCM_CLK BCLK
INN
PCM_SYNC LRCK
PCM_DOUT DAC
PCM_DIN ADC
LOUTP
I2C_SCL SCL
I2C_SDA SDA LOUTN
4.7K
4.7K
Module Codec
1.8 V
Figure 22: Reference Circuit of I2C and PCM Application with External Codec Chip
NOTE
It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuit on the PCM traces, especially for

PCM_CLK.
3.14. Analog Audio Interfaces
The module provides one analog audio input channel and one analog audio output channel. The pin
definition is shown in the table below.
Table 20: Pin Definition of Analog Audio Interfaces
Interface Pin Name Pin No. I/O Description
Loudspeaker differential
LOUDSPK_P 73 AO
output (+)
AOUT
Loudspeaker differential
LOUDSPK_N 74 AO
output (-)
MIC_P 75 AI Microphone analog input (+)

AIN
MIC_N 77 AI Microphone analog input (-)
⚫ AIN channel is a differential input channel, which can be applied for input of microphone (usually an
electret microphone).
⚫ The AOUT channel is a differential output with a built-in power amplifier. The default configuration of
power amplifier is Class AB and the maximum driving power is 500 mW for 8 Ω load. When PA is
configured as Class D, the maximum driving power is 800 mW for 8 Ω load.
3.14.1. Notes on Audio Interface Design
It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) for
filtering out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied for filtering out RF
interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise
could be heard. The 10 pF capacitor here is used for filtering out RF interference at DCS1800. Please
note that the resonant frequency point of a capacitor largely depends on the material and production
technique. Therefore, you would have to discuss with their capacitor vendors to choose the most suitable
capacitor for filtering out high-frequency noises.
The severity degree of the RF interference in the voice channel during GSM transmitting largely depends
on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases,
DCS1800 TDD noise is more obvious. Therefore, a suitable capacitor can be selected based on the test
results. The filter capacitors on the PCB should be placed as close to the audio devices or audio
interfaces as possible, and the traces should be as short as possible. They should go through the filter
capacitors before arriving at other connection points.
In order to decrease radio or other signal interference, RF antennas should be placed away from audio
interfaces and audio traces. Power traces cannot be parallel with and also should be far away from the
audio traces.
The differential audio traces must be routed according to the differential signal layout rule.
3.14.2. Microphone Interface Circuit
The reference circuit of the microphone interface is shown in the figure below:
Close to Module Close to

Microphone
GND GND GND GND
10 pF 33 pF
0603 0603 Differential
layout 10 pF 33 pF
0603 ESD
0603
MIC_P
10 pF 33 pF 10 pF 33 pF
0603 0603 0603
Module 0603
MIC_N Electret
Microphone
10 pF 33 pF ESD
0603 0603
10 pF 33 pF
0603 0603
GND GND GND GND
Figure 23: Reference Circuit of Microphone Interface
NOTE
MIC channel is sensitive to ESD, so it is not recommended to remove the ESD components used for
protecting the MIC.
3.14.3. Loudspeaker Interface Circuit
Close to Speaker
GND GND GND
Differential
layout
10 pF 33 pF ESD
0603 0603
0R
LODUSPK_P
Module 10 pF 33 pF
0603 0603
LOUDSPK_N 0R 8Ω
10 pF 33 pF ESD
0603 0603
GND GND GND
Figure 24: Reference Circuit of Loudspeaker Interface
3.15. LCD Interface
The LCD interface of the module supports a liquid crystal display with a maximum resolution of 320 × 240
and DMA transmission, 16-bit RGB565 and YUV formats.
Table 21: Pin Definition of LCD Interface
LCD frame
LCD_FMARK 119 DI
synchronization
LCD_RSTB 120 DO LCD reset
LCD_SEL 121 - Reserved 1.8 V power domain.

LCD_CS 122 DO LCD chip select
LCD_CLK 123 DO LCD clock
LCD_SDC 124 DO LCD register selection
LCD_SI/O 125 DIO LCD data
Imax = 200 mA
It is driven by the current
Sink current input. sink method, and connected
ISINK 140 PI
Backlight adjustment to the backlight cathode, the
brightness can be adjusted
with current control.
3.16. Matrix Keyboard Interface
The module provides one keyboard interface. It supports 4 × 4 matrix keyboard.
Table 22: Pin Definition of Matrix Keyboard Interface
1.8 V power domain.

The USB_BOOT cannot be
USB_BOOT 115 DI Matrix keyboard input0
pulled up before startup and
it can be used as KEYIN0
after startup.
1.8 V power domain.
If unused, keep it open. The
KEYIN1 78 DI Matrix keyboard input1
KEYIN1 cannot be pulled up
before startup.
KEYOUT0 83 DO Matrix keyboard output0

1.8 V power domain.
3.17. SD Card Interface
The module supports SDIO 2.0 interface for SD card.
Table 23: Pin Definition of SD Card Interface
1.8 V power domain.

SD_DET 23 DI SD card detect

1.8/3.2V power domain.
SDIO1_CLK 32 DO SDIO clock
SDIO1_CMD 33 DIO SDIO command
SDIO1_VDD 34 PO SDIO power supply
The following figure shows a reference design of SD card interface.
Module VDD_3V SD Card Connector

SDIO1_VDD VDD
+
C10 C9 C8 C7
R7 R8 R9 R10 R11 100 μF 100 nF 33 pF 10 pF
NM NM NM NM NM
R1 0R
SDIO1_DATA3 CD/DAT3
R2 0R
SDIO1_DATA2 DAT2
R3 0R
SDIO1_DATA1 DAT1
R4 0R
SDIO1_DATA0 DAT0
R5 0R
SDIO1_CLK CLK
R6 0R
SDIO1_CMD CMD
SD_DET DETECTIVE
C1 D1 C2 D2 C3 D3 C4 D4 C5 D5 D7 C6 D6
NM NM NM NM NM NM VSS
Figure 25: Reference Circuit of SD Card Interface
In SD card interface design, in order to ensure good communication performance with SD card, the
following design principles should be complied with:
⚫ The voltage range of SD card power supply VDD_3 V is 2.7–3.6 V and a sufficient current up to 0.8 A
should be provided. As the maximum output current of SDIO1_VDD is 150 mA which can only be
used for SDIO pull-up resistors, an externally power supply is needed for SD card.
⚫ To avoid jitter of bus, resistors R7–R11 are needed to pull up the SDIO to SDIO1_VDD. Value of
these resistors is among 10–100 kΩ and the recommended value is 100 kΩ. SDIO1_VDD should be
used as the pull-up power.
⚫ In order to adjust signal quality, it is recommended to add 0 Ω resistors R1–R6 in series between the
module and the SD card. The bypass capacitors C1–C6 are reserved and not mounted by default. All
resistors and bypass capacitors should be placed close to the module.
⚫ In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near
the SD card connector with junction capacitance less than 15 pF.
⚫ Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals,
etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
⚫ It is important to route the SDIO signal surrounded with ground on the layer and ground planes above
and below. The impedance of SDIO data trace is 50 Ω ±10 %.
⚫ Make sure the adjacent trace spacing is more than two times of the trace width and the load
capacitance of SDIO bus should be less than 15 pF.
⚫ It is recommended to keep the trace length difference between SDIO1_CLK and SDIO1_DATA [0:3]/
SDIO1_CMD less than 1 mm and the total routing length less than 50 mm.
3.18. WLAN Application Interface*
The module provides an SDIO 1.1 standard WLAN application interface.
Table 24: Pin Definition of WLAN Interface
WLAN_SLP_CLK 118 DO WLAN sleep clock If unused, keep it open.
WLAN power supply enable

WLAN_PWR_EN 127 DO
control
SDIO2_DATA3 129 DIO WLAN SDIO data bit 3

1.8 V power domain.
SDIO2_DATA2 130 DIO WLAN SDIO data bit 2 If unused, keep them open.
SDIO2_CLK 133 DO WLAN SDIO CLK
SDIO2_CMD 134 DO WLAN SDIO command
Wake up the module by an

WLAN_WAKE 135 DI
external Wi-Fi module 1.8 V power domain.
WLAN function enable If unused, keep them open.
WLAN_EN 136 DO
control
The SDIO interface rate is very high. To ensure that the interface design complies with the SDIO 1.1
specification, the following principles are recommended:
⚫ It is important to route the SDIO signal surrounded with ground on the layer and ground planes above
and below. The impedance of SDIO data trace is 50 Ω ±10 %.
⚫ Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals,
etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
⚫ It is recommended to keep the trace length difference between WLAN_SDIO_CLK and
WLAN_SDIO_DATA [0:3]/ WLAN_SDIO_CMD less than 1 mm and the total routing length less than
50 mm.
⚫ Make sure the adjacent trace spacing is more than two times of the trace width and the load
capacitance of SDIO bus should be less than 15 pF.
NOTE
WLAN application interface conflicts with other functions, and please consult Quectel Technical
Supports for details.
3.19. ADC Interfaces
The module provides three ADC interfaces. AT+QADC=0 can be used to read the voltage value on ADC0
pin. AT+QADC=1 can be used to read the voltage value on ADC1 pin. AT+QADC=2 can be used to read
the voltage value on ADC2 pin. For more details about AT+QADC, please refer to document [2].
In order to improve the accuracy of ADC, the trace of ADC should be surrounded with ground.
Table 25: Pin Definition of ADC Interfaces
Pin Name Pin No. Description Comment
ADC0 45 General-purpose ADC interface

Use a 1 kΩ resistor in series if
ADC1 44 General-purpose ADC interface used.
ADC2 43 General-purpose ADC interface
Table 26: Characteristic of ADC Interfaces
Parameter Min. Typ. Max. Unit
ADC0 Voltage Range 0 - VBAT_BB V
ADC Resolution - 12 - bits
NOTE
The external resistor should be less than 100 kΩ when the voltage divider resistor applies.
3.20. Network Status Indication
The network indication pins can be used to drive network status indication LEDs. The module has
NET_MODE and NET_STATUS for network status indication. The following tables describe pin definition
and logic level changes in different network status.
Table 27: Pin Definition of Network Connection Status/Activity Indicator
Indicate the module's network activity

NET_MODE 5 DO 1.8 V power domain.
status
Indicate the module's network
NET_STATUS 6 DO open.
registration mode
Table 28: Working State of Network Connection Status/Activity Indicator
Pin Name Logic Level Changes Network Status
Always high Registered on LTE network

NET_STATUS
Always low Others
Flicker slowly (200 ms high/1800 ms low) Network searching
Flicker quickly (234 ms high/266 ms low) Idle

NET_MODE
Flicker rapidly (62 ms high/63 ms low) Data transfer is ongoing
Always high Voice calling
Module VBAT
2.2K
Network 4.7K
Indicator
47K
Figure 26: Reference Circuit of Network Indicator
3.21. STATUS
The STATUS pin is an output for module’s operation status indication. When the module is turned on
normally, the STATUS outputs high level.
Table 29: Pin Definition of STATUS
1.8 V power domain.

STATUS 61 DO Indicate the module's operation status
Module VBAT
2.2K
4.7K
STATUS
47K
Figure 27: Reference Circuit of STATUS
NOTE
The STATUS cannot be used as the indication of power-down state when VBAT doesn’t supply power to
the module.
3.22. Behaviors of MAIN_RI
AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors.
No matter on which port a URC is presented, the URC will trigger the behavior of MAIN_RI pin.
NOTE
The AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC
output port. The USB AT port is used to send AT commands by default.
In addition, MAIN_RI behaviors can be configured flexibly. The default behaviors of the MAIN_RI are
shown as below.
Table 30: Behaviors of the MAIN_RI
State Response
Idle MAIN_RI keeps at high level
URC MAIN_RI outputs 120 ms low pulse when a new URC returns
The MAIN_RI behavior can be configured by AT+QCFG="urc/MAIN_RI/ring" and see document [2] for
details.
3.23. USB_BOOT Interface
The module provides a USB_BOOT pin. You can pull up USB_BOOT to 1.8 V before VDD_EXT is
powered up, and the module will enter download mode when it is powered on. In this mode, the module
can upgrade firmware over USB interface.
If your application has a scan key, you can also press the "USB_BOOT + KEYOUT0" scan key before
powering on the module, and the module will enter the download mode when it is turned on.
Table 31: Pin Definition of USB_BOOT Interface
1.8 V power domain.

Control pin for the module to Active high.
USB_BOOT 115 DI
enter download mode The download control circuit must
be reserved.
The following figure shows a reference circuit of USB_BOOT interface.
MODULE MODULE
S1
KEYOUT0
VDD_EXT
Test points
2 1 4.7K
USB_BOOT USB_BOOT
3
GND
TVS TVS TVS
Close to test points
Close to test points
Figure 28: Reference Circuit of USB_BOOT Interface
NOTE
Please make sure that VBAT is stable before PWRKEY is pulled down. It is recommended that the time
interval between powering up VBAT and pulling down PWRKEY is no less than 30 ms.
4 Antenna Interfaces
EC200U series module provides a main antenna interface, a Wi-Fi Scan/Bluetooth antenna interface and
a GNSS antenna interface. The antenna ports have an impedance of 50 Ω.
4.1. Main Antenna and Wi-Fi Scan/Bluetooth Antenna Interfaces
4.1.1. Pin Definition
The pin definition of main antenna and Wi-Fi Scan/Bluetooth antenna interfaces is shown below.
Table 32: Pin Definition of Antenna Interfaces
ANT_MAIN 49 AIO Main antenna interface 50 Ω impedance.
The shared antenna interface of Wi-Fi

Scan/Bluetooth; Bluetooth and Wi-Fi
ANT_BT/WIFI 50 Ω impedance.
35 AIO Scan cannot be used simultaneously;
_SCAN If unused, keep it open.
Wi-Fi Scan antenna can only receive
but not transmit.
NOTE
EC200U series supports Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the
two functions cannot be used at the same time; Bluetooth and Wi-Fi Scan functions are optional
(supported or not supported simultaneously), please contact Quectel Technical Supports for details.
4.1.2. Operating Frequency
Table 33: EC200U-CN Operating Frequencies
3GPP Band Transmit Receive Unit
EGSM900 880–915 925–960 MHz
DCS1800 1710–1785 1805–1880 MHz
LTE-FDD B1 1920–1980 2110–2170 MHz
LTE-FDD B3 1710–1785 1805–1880 MHz
LTE-FDD B5 824–849 869–894 MHz
LTE-FDD B8 880–915 925–960 MHz
LTE-TDD B34 2010–2025 2010–2025 MHz
LTE-TDD B38 2570–2620 2570–2620 MHz
LTE-TDD B39 1880–1920 1880–1920 MHz
LTE-TDD B40 2300–2400 2300–2400 MHz
LTE-TDD B41 2535–2675 2535–2675 MHz
NOTE
The GSM network access technology of EC200U-CN is optional. If the module that you select doesn’t
support GSM network access technology, there is no corresponding frequency band.
Table 34: EC200U-EU Operating Frequencies
3GPP Band Transmit Receive Unit
GSM850 824–849 869–894 MHz
EGSM900 880–915 925–960 MHz
DCS1800 1710–1785 1805–1880 MHz
PCS1900 1850–1910 1930–1990 MHz
LTE-FDD B1 1920–1980 2110–2170 MHz
LTE-FDD B3 1710–1785 1805–1880 MHz
LTE-FDD B5 824–849 869–894 MHz
LTE-TDD B7 2500–2570 2620–2690 MHz
LTE-FDD B8 880–915 925–960 MHz
LTE-TDD B20 832–862 791–821 MHz
LTE-TDD B28 703–748 758–803 MHz
LTE-TDD B38 2570–2620 2570–2620 MHz
LTE-TDD B40 2300–2400 2300–2400 MHz
LTE-TDD B41 2496–2690 2496–2690 MHz
4.1.3. Reference Design of RF Antenna Interfaces
A reference design of ANT_MAIN and ANT_BT/WIFI_SCAN is shown as below. A π-type matching circuit
should be reserved for better RF performance. The capacitors are not mounted by default.
Main
Module antenna
R1 0R
ANT_MAIN
C1 C2
NM NM
Wi-Fi Scan/
Bluetooth
antenna
R2 0R
ANT_BT/WIFI
_SCAN
C3 C4
NM NM
Figure 29: Reference Circuit of RF Antenna Interfaces
NOTE
1. In order to improve the receiving sensitivity, it is necessary to ensure the proper distance between
the main antenna and Wi-Fi Scan/Bluetooth receiving antenna.
2. Place the π-type matching components (R1 & C1 & C2 and R2 & C3 & C4) as close to the antenna
as possible.
4.2. GNSS Antenna Interface
The following tables list the pin definition and frequency characteristics of the GNSS antenna interface
respectively.
Table 35: Pin Definition of GNSS Antenna Interface
50 Ω impedance.
ANT_GNSS 47 AI GNSS antenna interface
Table 36: GNSS Frequency
Type Frequency Unit
GPS 1575.42 ±1.023 MHz
GLONASS 1597.5–1605.8 MHz
Galileo 1575.42 ±2.046 MHz
BeiDou (Compass) 1561.098 ±2.046 MHz
QZSS 1575.42 MHz
A reference design of GNSS antenna is shown as below:
VDD
0.1 uF GNSS
10R
Antenna
Module
47 nH
0R 100 pF
ANT_GNSS
NM NM
Figure 30: Reference Circuit of GNSS Antenna
NOTE
1. An external LDO can be selected to supply power according to the active antenna requirement.
2. The VDD circuit is not needed if you select a passive antenna.
4.3. Reference Design of RF Layout
For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,
height from the reference ground to the signal layer (H), and the space between the RF trace and the
ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic
impedance. The following figures are reference designs of microstrip or coplanar waveguide with different
PCB structures.
Figure 31: Microstrip Design on a 2-layer PCB
Figure 32: Coplanar Waveguide Design on a 2-layer PCB
Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:
⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.
⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
⚫ The distance between the RF pins and the RF connector should be as short as possible, and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
⚫ There should be clearance area under the signal pin of the antenna connector or solder joint.
⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W).
⚫ Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.
For more details about RF layout, please refer to document [3].
4.4. Antenna Installation
4.4.1. Antenna Requirement
The following table shows the requirements of main antenna.
Table 37: Antenna Requirements
Type Requirements
Frequency range: 1559–1609 MHz

Polarization: RHCP or linear
VSWR: < 2 (typ.)
GNSS Passive antenna gain: > 0 dBi
Active antenna noise factor: < 1.5 dB
Active antenna gain: > 0 dBi
Active antenna internal LNA gain: < 17 dB
VSWR: ≤ 2
Efficiency: > 30 %
Max input power: 50 W
GSM/LTE Input impedance: 50 Ω
< 1 dB: LB (< 1 GHz)
< 1.5 dB: MB (1–2.3 GHz)
< 2 dB: HB (> 2.3 GHz)
4.4.2. Recommended RF Connector for Antenna Installation
If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector

provided by Hirose.
Figure 35: Dimensions of U.FL-R-SMT Connector (Unit: mm)
U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
Figure 36: Mechanicals of U.FL-LP Connectors
The following figure describes the space factor of mated connector.
Figure 37: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://hirose.com.
5 Electrical Characteristics, Radio and

Reliability
5.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.
Table 38: Absolute Maximum Ratings
Parameter Min. Max. Unit
VBAT_RF/VBAT_BB -0.3 6.0 V
USB_VBUS -0.3 5.5 V
Peak Current of VBAT_BB - 1.5 A
Peak Current of VBAT_RF - 2.0 A
Voltage at Digital Pins -0.3 2.3 V
Voltage at ADC0 0 VBAT_BB V
5.2. Power Supply Ratings
Table 39: Power Supply Ratings
Parameter Description Conditions Min. Typ. Max. Unit
The actual input

VBAT_BB and voltages must be kept
3.3 3.8 4.3 V
VBAT_RF between the minimum
VBAT
and maximum value.
Voltage drop during Maximum power control
400 mV
burst transmission level on EGSM900.
Peak supply current
Maximum power control
IVBAT (during transmission 1.8 2.0/3.0 A
level on EGSM900.
slot)
USB_VBUS USB detection 3.5 5.0 5.25 V
NOTE
The power supply should be able to provide sufficient current up to 2.0 A to the module that only
supports LTE network, while 3.0 A at least should be provided for GSM network.
5.3. Operating and Storage Temperatures
The operating and storage temperatures are listed in the following table.
Table 40: Operating and Storage Temperatures
Parameter Min. Typ. Max. Unit
7
Operating Temperature Range -35 +25 +75 ºC
8
Extended Temperature Range -40 +85 ºC
Storage Temperature Range -40 +90 ºC
5.4. Power Consumption
Table 41: EC200U-CN Current Consumption
Description Conditions Typ. Unit
OFF state Power down 31 μA
AT+CFUN=0 (USB disconnected) 1.126 mA
EGSM900 @ DRX = 2 (USB disconnected) 3.271 mA
EGSM900 @ DRX = 5 (USB suspend) 4.105 mA
Sleep state DCS1800 @ DRX = 2 (USB disconnected) 3.265 mA
DCS1800 @ DRX = 5 (USB disconnected) 2.637 mA
DCS1800 @ DRX = 5 (USB suspend) 4.206 mA
LTE-FDD @ PF = 32 (USB disconnected) 2.515 mA
7 Within the operating temperature range, the module meets 3GPP specifications.
8 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice,
SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced,
while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature
returns to the operating temperature range, the module meets 3GPP specifications again.
LTE-FDD @ PF = 64 (USB suspend) 3.152 mA
LTE-TDD @ PF = 32 (USB disconnected) 2.581 mA
LTE-TDD @ PF = 64 (USB suspend) 3.217 mA
EGSM900 @ DRX = 5 (USB connected) 29.89 mA

Idle state
LTE-FDD @ PF = 64 (USB connected) 29.88 mA
LTE-TDD @ PF = 64 (USB connected) 29.88 mA
EGSM900 4DL/1UL @ 33.2 dBm 231 mA
EGSM900 3DL/2UL @ 31.3 dBm 344.7 mA
EGSM900 2DL/3UL @ 29.2 dBm 395.6 mA
EGSM900 1DL/4UL @ 28.3 dBm 406.9 mA

GPRS data transfer
DCS1800 4DL/1UL @ 30.1 dBm 156 mA
DCS1800 3DL/2UL @ 28.5 dBm 213.7 mA
DCS1800 2DL/3UL @ 26.4 dBm 244.9 mA
DCS1800 1DL/4UL @ 25.1 dBm 252 mA
LTE-FDD B1 @ 23.2 dBm 662.1 mA
LTE data transfer LTE-FDD B3 @ 23.5 dBm 566 mA
LTE-TDD B34 @ 23.01 dBm 287.1 mA
LTE-TDD B38 @ 23.1 dBm 343.9 mA
LTE-TDD B39 @ 22.95 dBm 294.6 mA
LTE-TDD B40 @ 23.12 dBm 306.4 mA
LTE-TDD B41 @ 23.37 dBm 393.3 mA
EGSM900 PCL = 5 @ 33.27 dBm 250 mA
EGSM900 PCL = 12 @ 19.42 dBm 92.2 mA
EGSM900 PCL = 19 @ 6.21 dBm 62.8 mA

GSM voice call
DCS1800 PCL = 0 @ 30.24 dBm 175 mA
DCS1800 PCL = 7 @ 16.2 dBm 75.4 mA
DCS1800 PCL = 15 @ 0.87 dBm 57.7 mA
NOTE
support GSM network access technology, there is no corresponding current consumption.
Table 42: EC200U-EU Current Consumption
Description Conditions Typ. Unit
OFF state Power down 40 μA
AT+CFUN = 0 (USB disconnected) 1.139 mA
GSM850 @ DRX = 2 (USB disconnected) 2.078 mA

Sleep state
GSM850 @ DRX = 5 (USB suspend) 2.739 mA
DCS1800 @ DRX = 5 (USB suspend) 2.778 mA
LTE-FDD @ PF = 64 (USB suspend) 3.099 mA
LTE-TDD @ PF = 64 (USB suspend) 3.086 mA
EGSM900 @ DRX = 5 (USB connected) 28.94 mA

Idle state
LTE-FDD @ PF = 64 (USB connected) 27.92 mA
LTE-TDD @ PF = 64 (USB connected) 27.95 mA
GSM850 4DL/1UL @ 32.89 dBm 254 mA
GSM850 3DL/2UL @ 30.9 dBm 383 mA
GSM850 2DL/3UL @ 28.67 dBm 431 mA
GPRS data transfer GSM850 1DL/4UL @ 26.54 dBm 448 mA
EGSM900 4DL/1UL @ 32.55 dBm 231 mA
EGSM900 3DL/2UL @ 31.3 dBm 344.7 mA
EGSM900 2DL/3UL @ 29.2 dBm 395.6 mA
EGSM900 1DL/4UL @ 28.3 dBm 406.9 mA
DCS1800 4DL/1UL @ 30.1 dBm 156 mA
DCS1800 3DL/2UL @ 28.5 dBm 213.7 mA
DCS1800 2DL/3UL @ 26.4 dBm 244.9 mA
DCS1800 1DL/4UL @ 25.1 dBm 252 mA
PCS1900 4DL/1UL @ 29.93 dBm 153 mA
PCS1900 3DL/2UL @ 27.99 dBm 219 mA
PCS1900 2DL/3UL @ 25.94 dBm 249 mA
PCS1900 1DL/4UL @ 23.87 dBm 261 mA
LTE-FDD B1 @ 23.4 dBm 607 mA
LTE-FDD B5 @ 23 dBm 492 mA
LTE-FDD B7 @ 22.8dBm 709 mA

LTE data transfer
LTE-FDD B20 @ 23 dBm 576 mA
LTE-TDD B38 @ 23.1 dBm 320.9 mA
LTE-TDD B40 @ 23.12 dBm 286 mA
LTE-TDD B41 @ 23.37 dBm 317 mA
GSM850 PCL = 5 @ 33 dBm 246 mA
GSM850 PCL = 12 @ 19.8 dBm 95 mA
GSM850 PCL = 19 @ 6.7 dBm 64 mA

GSM voice call
EGSM900 PCL = 5 @ 33.27 dBm 250 mA
EGSM900 PCL = 12 @ 19.42 dBm 92.2 mA
EGSM900 PCL = 19 @ 6.21 dBm 62.8 mA
DCS1800 PCL = 0 @ 30.24 dBm 175 mA
DCS1800 PCL = 7 @ 16.2 dBm 75.4 mA
DCS1800 PCL = 15 @ 0.87 dBm 57.7 mA
PCS1900 PCL = 0 @ 29.8 dBm 168 mA
PCS1900 PCL = 7 @ 16.6 dBm 78 mA
PCS1900 PCL = 15 @ 0.8 dBm 59 mA
5.5. Tx Power
The following table shows the RF output power of EC200U series module.
Table 43: EC200U-CN RF Output Power
Frequency Bands Max. RF Output Power Min. RF Output Power
EGSM900 33 dBm ±2 dB 5 dBm ±5 dB
DCS1800 30 dBm ±2 dB 0 dBm ±5 dB
LTE-FDD B1/B3/B5/B8 23 dBm ±2 dB < -39 dBm
LTE-TDD B34/B38/B39/B40/B41 23 dBm ±2 dB < -39 dBm
NOTE
support GSM network access technology, there is no corresponding RF output power.
Table 44: EC200U-EU RF Output Power
Frequency Bands Max. RF Output Power Min. RF Output Power
GSM850 33 dBm ±2 dB 5 dBm ±5 dB
EGSM900 33 dBm ±2 dB 5 dBm ±5 dB
DCS1800 30 dBm ±2 dB 0 dBm ±5 dB
PCS1900 30 dBm ±2 dB 0 dBm ±5 dB
LTE-FDD
23 dBm ±2 dB < -39 dBm
B1/B3/B5/B7/B8/B20/B28
LTE-TDD B38/B40/B41 23 dBm ±2 dB < -39 dBm
NOTE
In GPRS 4 slots TX mode, the maximum output power is reduced by 6 dB. The design conforms to the
GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
5.6. Rx Sensitivity
The following tables show conducted RF receiving sensitivity of EC200U series module.
Table 45: EC200U-CN Conducted RF Receiving Sensitivity
Receiving Sensitivity (Typ.)

Frequency 3GPP
Primary
EGSM900 -109.5 dBm -102.0 dBm
DCS1800 -109.5 dBm -102.0 dBm
LTE-FDD B1 (10 MHz) -98.5 dBm -96.3 dBm
LTE-TDD B34 (10 MHz) -99.2 dBm -96.3 dBm
NOTE
support GSM network access technology, there is no corresponding RF receiving sensitivity data.
Table 46: EC200U-EU Conducted RF Receiving Sensitivity
Receiving Sensitivity (Typ.)

Frequency 3GPP
Primary
GSM850 -109.5 dBm -102.0 dBm
EGSM900 -109.5 dBm -102.0 dBm
DCS1800 -109 dBm -102.0 dBm
PCS1900 -109 dBm -102.0 dBm
LTE-FDD B7 (10 MHz) -97 dBm -94.3 dBm
LTE-FDD B20 (10 MHz) -98 dBm -93.3 dBm
LTE-TDD B41 (10 MHz) -98 dBm -94.3 dBm
5.7. ESD
If the static electricity generated by various ways discharges to the module, the module maybe damaged
to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example,
wearing anti-static gloves during the development, production, assembly and testing of the module;
adding ESD protective components to the ESD sensitive interfaces and points in the product design.
The following table shows the module electrostatics discharge characteristics.
Table 47: Electrostatics Discharge Characteristics (25 ºC, 45 % Relative Humidity)
Tested Interfaces Contact Discharge Air Discharge Unit
VBAT, GND ±5 ±10 kV
Antenna Interfaces ±4 ±8 kV
Other Interfaces ±0.5 ±1 kV
6 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimeter. The tolerances for dimensions without tolerance values are ±0.2 mm.
6.1. Mechanical Dimensions
Figure 38: Module Top and Side Dimensions
Figure 39: Module Bottom Dimensions
NOTE
The package warpage level of the module conforms to the JEITA ED-7306 standard.
6.2. Recommended Footprint
Figure 40: Recommended Footprint (Top View)
NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
6.3. Top and Bottom Views
Figure 41: Top & Bottom View of the Module
NOTE
Images above are for illustration purpose only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel.
7 Storage, Manufacturing & Packaging
7.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.
2. Storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours9 in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
⚫ The module is not stored in Recommended Storage Condition;

⚫ Violation of the third requirement above occurs;
⚫ Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫ Before module repairing.
5. If needed, the pre-baking should follow the requirements below:

⚫ The module should be baked for 8 hours at 120 ±5 °C;
⚫ All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
9 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the
solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or
are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not
ready for soldering.
NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them
in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking
procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
7.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18–0.20 mm. For more details, please refer to
document [4].
It is suggested that the peak reflow temperature is 235–246 ºC, and the absolute maximum reflow
temperature is 246 ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
Reflow Zone
Max slope: Cooling down slope:
2~3 °C/s C -1.5 ~ -3 °C/s
246
235
217
B D
200
Soak Zone
150 A
100
Max slope: 1~3 °C/s
Figure 42: Reflow Soldering Thermal Profile
Table 48: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max. slope 1 to 3 °C/sec
Soak time (between A and B: 150 °C and 200 °C) 70 to 120 sec
Reflow Zone
Max. slope 2 to 3 °C/sec
Reflow time (D: over 217 °C) 40 to 70 sec
Max. temperature 235 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max. reflow cycle 1
NOTE
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the QR code is still readable, although white rust may be found.
3. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
4. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance
for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [4].
7.3. Packaging Specifications
The module adopts carrier tape packaging and details are as follow:
7.3.1. Carrier Tape
Dimension details are as follow:
Figure 43: Carrier Tape Dimension Drawing
Table 49: Carrier Tape Dimension Table (Unit: mm)
W P T A0 B0 K0 K1 F E
44 40 0.4 31.5 28.5 3.0 5.6 20.2 1.75
7.3.2. Plastic Reel
Figure 44: Plastic Reel Dimension Drawing
Table 50: Plastic Reel Dimension Table (Unit: mm)
øD1 øD2 W
330 100 44.5
7.3.3. Packaging Process
Place the module into the carrier tape and use

the cover tape to cover them; then wind the
heat-sealed carrier tape to the plastic reel and
use the protective tape for protection. One
plastic reel can load 250 modules.
Place the packaged plastic reel, humidity

indicator card and desiccant bag into a vacuum
bag, then vacuumize it.
Place the vacuum-packed plastic reel into a

pizza box.
Put 4 pizza boxes into 1 carton and seal it. One

carton can pack 1000 modules.
Figure 45: Packaging Process
8 Appendix References
Table 51: Related Documents
Document Name
[1] Quectel_UMTS&LTE_EVB_User_Guide
[2] Quectel_EC200U&EG915U_Series_AT_Commands_Manual
[3] Quectel_RF_Layout_Application_Note
[4] Quectel_Module_SMT_User_Guide
Table 52: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AMR Adaptive Multi-Rate
bps Bits Per Second
CHAP Challenge Handshake Authentication Protocol
CMUX Connection Multiplexing
CS Coding Scheme
CTS Clear to Send
DFOTA Delta Firmware Upgrade Over-The-Air
DL Downlink
DMA Direct Memory Access
DSDS Dual SIM Dual Standby
DTE Data Terminal Equipment
DTR Data Terminal Ready
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMI Electromagnetic Interference
ESD Electrostatic Discharge
ESR Equivalent Series Resistance
EVB Evaluation Board
FDD Frequency Division Duplex
FR Full Rate
FTP File Transfer Protocol
FTPS FTP-over-SSL
GND Ground
GSM Global System for Mobile Communications
HR Half Rate
HTTP Hypertext Transfer Protocol
HTTPS Hypertext Transfer Protocol Secure
LED Light Emitting Diode
LTE Long Term Evolution
MCU Microcontroller Unit/Microprogrammed Control Unit
ME Mobile Equipment
MMS Multimedia Messaging Service
MQTT Message Queuing Telemetry Transport
MSL Moisture Sensitivity Level
NITZ Network Identity and Time Zone
NTP Network Time Protocol
PAP Password Authentication Protocol
PCB Printed Circuit Board
PDA Personal Digital Assistant
PDU Protocol Data Unit
PF Paging Frame
POS Point of Sale
PPP Point-to-Point Protocol
RF Radio Frequency
RGB Red, Green, Blue
SM Smart Media
SMS Short Message Service
SMTP Simple Mail Transfer Protocol
SSL Secure Sockets Layer
TCP Transmission Control Protocol
TDD Time Division Duplexing
UART Universal Asynchronous Receiver &Transmitter
UDP User Datagram Protocol
UL Uplink
UMTS Universal Mobile Telecommunications System
URC Unsolicited Result Code
(U)SIM (Universal) Subscriber Identity Module
Vmax Maximum Voltage Value
Vnom Nominal Voltage Value
Vmin Minimum Voltage Value
VIHmax Maximum High-level Input Voltage
VIHmin Minimum High-level Input Voltage
VILmax Maximum Low-level Input Voltage
VILmin Minimum Low-level Input Voltage
VOHmax Maximum High-level Output Voltage
VOHmin Minimum High-level Output Voltage
VOLmax Maximum Low-level Output Voltage
VOLmin Minimum Low-level Output Voltage
VSWR Voltage Standing Wave Ratio
WCDMA Wideband Code Division Multiple Access
WLAN Wireless Local Area Network

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Safety Information ....................................................................................................................................... 3

3.14. Analog Audio Interfaces........................................................................................................... 49

Table 1: Special Marks ................................................................................................................................11

Table 42: EC200U-EU Current Consumption ............................................................................................ 75

Figure 1: Functional Diagram ..................................................................................................................... 16

Figure 42: Reflow Soldering Thermal Profile ............................................................................................. 87

This document is applicable to the following variants:

1.1. Special Marks

Table 1: Special Marks

2.1. General Description

Table 2: Frequency Bands of EC200U-CN Module

Network Mode Frequency Band

GSM 1 900/1800 MHz

Table 3: Frequency Bands of EC200U-EU Module

Network Mode Frequency Band

GSM 850/900/1800/1900 MHz

GNSS 2 GPS, GLONASS, BeiDou, Galileo, QZSS

Bluetooth and Wi-Fi Scan 3 Support

2.2. Key Features

Table 4: Key Features of EC200U Series Module

⚫ Supply voltage: 3.3–4.3 V

⚫ Supports USIM/SIM card: 1.8/3.0 V

I2C Interfaces ⚫ Two I2C interfaces

SPI Interface ⚫ SPI interface only supports master mode

SD Card Interface ⚫ SD 2.0 protocol compliant

LCD Interface ⚫ LCD interface supporting SPI mode

ADC Interfaces ⚫ Three ADC interfaces

USB_BOOT Interface ⚫ Forced download interface

⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel

Network Indication ⚫ NET_MODE and NET_STATUS to indicate network connectivity status

⚫ Main antenna interface (ANT_MAIN), Wi-Fi Scan/Bluetooth antenna

4 GNSS function is optional.

Location ⚫ Supports Wi-Fi Scan/GNSS 4

⚫ Size: (28.0 ±0.15) mm × (31.0 ±0.15) mm × (2.4 ±0.2) mm

Temperature Ranges ⚫ Extended temperature range: -40 °C to +85 °C 6

⚫ Storage temperature range: -40 °C to +90 °C

Firmware Upgrade ⚫ USB interface or FOTA

2.3. Functional Diagram

5 Within operating temperature range, the module is 3GPP compliant.

ANT_MAIN ANT_BT/WIFI_SCAN ANT_GNSS

Figure 1: Functional Diagram

3.1. General Description

3.2. Pin Assignment

130 118 108 103 99 95 90 85

141 133 121 144

12 137 125 111 106 101 97 93 88 43

Power Pins GND Pins Signal Pins RESERVED Pins

Figure 2: Pin Assignment (Top View)

3.3. Pin Description

Table 5: I/O Parameters Definition