For Operating Voltage of 5V and Below Ultra Low Capacitance: 0.5pF Typical
For Operating Voltage of 5V and Below Ultra Low Capacitance: 0.5pF Typical
For Operating Voltage of 5V and Below Ultra Low Capacitance: 0.5pF Typical
Line-2 2 9 NC
GND 3 8 GND
1 2 4 5
Line-3 4 7 NC
3,8 Line-4 5 6 NC
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATING UNITS
Peak Pulse Current (tp =8/20µs) IPP 3.5 A
Peak Pulse Power (tp =8/20µs) PPP 30 W
Operating Voltage (I/O pin-GND) VDC (GND – 0.5) to 6 V
ESD per IEC 61000-4-2 (Air) 15
VESD kV
ESD per IEC 61000-4-2 (Contact) 10
o
Lead Soldering Temperature TSOL 260 (10 sec.) C
o
Operating Temperature TOP -55 to +85 C
o
Storage Temperature TSTO -55 to +150 C
ELECTRICAL CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Reverse Stand-Off
VRWM Pin-1,-2,-4,-5 to pin-3,-8, T=25 oC 5 V
Voltage
Channel Leakage
ICH-Leak VPin-1,-2,-4,-5 = 5V, VPin-3,-8 = 0V, T=25 oC 1.5 µA
Current
Reverse Breakdown IBV = 1mA, T=25 oC, Pin-1,-2,-4,-5 to
VBV 6 V
Voltage pin-3,-8
IF = 15mA, T=25 oC, pin-3,-8 to
Forward Voltage VF 0.9 1.1 V
pin-1,-2,-4,-5
ESD Clamping IEC 61000-4-2 +6kV,T=25 oC,
Vclamp 12 V
Voltage Contact mode, any I/O pin to Ground
ESD Dynamic IEC 61000-4-2, 0~+6kV,T=25 oC,
Rdynamic 0.3 Ω
Turn-on Resistance Contact mode, any I/O pin to Ground
Channel Input Vpin-3,-8 = 0V,VIN = 2.5V,f = 1MHz,T=25
CIN o
0.5 0.65 pF
Capacitance C, any I/O pin to Ground
Channel to Channel Vpin-3,-8 = 0V, VIN = 2.5V, f = 1MHz,
CCROSS 0.04 0.08 pF
Input Capacitance T=25 oC , between I/O pins
Typical Characteristics
Typical Variation of CIN vs. VIN Typical Variation of CIO-to-IO vs. VIN
1.0 0.10
0.9 0.09
0.8 0.08
Input Capacitance (pF)
-6
Insertion Loss (dB)
-9 -10
-12 -20
-15 -30
-18 -40
-21 -50
-24 -60
3GHz: -0.92dB
-27 4.3GHz: -3dB -70
-30 -80
1e+8 1e+9 1e+8 1e+9
Frequency (Hz) Frequency (Hz)
18
16
14
V_pulse
12 Pulse from a
transmission line
TLP_I
10 100ns +
TLP_V DUT
8 -
4
I/O to GND
2
0
0 2 4 6 8 10 12 14
Transmission Line Pulsing (TLP) Voltage (V)
Applications Information
A. Device Connection
The AZ1045-04F is designed to protect four These pins should be directly connected to the
data lines from transient over-voltage (such as GND rail of PCB (Printed Circuit Board). To get
ESD stress pulse). The device connection of minimum parasitic inductance, the path length
AZ1045-04F is shown in the Fig. 1. In Fig. 1, the should keep as short as possible.
four protected data lines are connected to the AZ1045-04F can provide ESD protection for
ESD protection pins (pin1, pin2, pin4, and pin5) 4 I/O signal lines simultaneously. If the number of
of AZ1045-04F. The ground pins (pin3 and pin8) I/O signal lines is less than 4, the unused I/O pins
of AZ1045-04F are the negative reference pins. can be simply left as NC pins.
GND GND
3 8
Line-3
4 7 NC
Line-4
5 6 NC
I/O 3 I/O 3
To To
data line Protected
I/O-port
Connector IC
I/O 4 data line I/O 4
discharges (>15kV air discharge) as outlined in pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For
IEC 61000-4-2. Therefore, it is possible to make example, line 1 enters at pin 1 and exits at Pin 10
none adjustment to the board layout parameters and the PCB trace connects pin 1 and 10
to compensate for the added capacitance of the together. Lines 2, 3, and 4 have the same way of
AZ1045-04F. Figure 2 shows how to implement connection. The ground pins (pin3 and pin8) of
the AZ1045-04F in a HDMI application. AZ1045-04F are the negative reference pins.
The AZ1045-04F is designed for allowing the These pins should be directly connected to the
traces to run straight through the device to GND plane of PCB. To get minimum parasitic
simplify the PCB layout. As shown in Figure 2, inductance, the path length should keep as short
the best way to design the PCB trace is using the as possible. In Figure 2, the none-TMDS
flow through layout. The solid line represents the signals, DDC_CLK, DDC_DAT, CE_REMOTE,
PCB trace. Note that the PCB traces are used to and HOTPLUG_DET, can be protected with
connect the pin pairs for each line (pin 1 to pin 10, another low cost part, e.g., AZC199-04S.
TMDS_D2+
TMDS_D2+ Line -1 1 10 NC
TMDS_D2-
Line -2 2 9 NC
AZ1045-04F
TMDS_GND
TMDS_D1+ Line -3 4 7 NC
TMDS_D1+
TMDS_GND Line -4 5 6 NC
TMDS_D1-
TMDS_D1-
TMDS_D0+
TMDS_D0+ Line-1 1 10 NC
TMDS_D0-
Line-2 2 9 NC
AZ1045-04F
TMDS_GND
TMDS_GND Line-4 5 6 NC
TMDS_CK-
TMDS_CK-
CE_REMOTE
CE_REMOTE
Via hole to GND
N/C
GND DDC_CLK
3 2 1
DDC_CLK
AZC199-04S
DDC_DAT
4 5 6
GND +5V DDC_DAT
Via hole to +5V
+5V OUT
Via hole to GND
C=100nF
HOTPLUG_DET
HOTPLUG_DET (optional)
HDMI
Connector
Fig. 3a The test board for measuring the Fig. 3b The test board for measuring the
differential impedance of a HDMI port without differential impedance of a HDMI port with using
using ESD protection array. ESD protection array, AZ1045-04F.
Fig. 4a The measured differential impedance of Fig. 4b The measured differential impedance of
Data0- and Data0+ (103.3Ω without ESD Data1- and Data1+ (102.7Ω without ESD
protection array, and 89.1Ω with AZ1045-04F). protection array, and 89.1Ω with AZ1045-04F).
Fig. 4c The measured differential impedance of Fig. 4d The measured differential impedance of
Data2- and Data2+ (104.2Ω without ESD Clock- and Clock+ (101.7Ω without ESD
protection array, and 90.8Ω with AZ1045-04F). protection array, and 88.9Ω with AZ1045-04F).
Fig. 5 the HDMI Eye Diagram performance when the AZ1045-04F is under used. No apparent affection
is shown due to the low capacitance feature of the AZ1045-04F.
PACKAGE OUTLINE
(DFN2510P10E)
Millimeters Inches
Symbol
min max min max
A 0.40 0.55 0.016 0.022
A1 0.00 0.05 0.000 0.002
A3 0.152REF. 0.006 BSC
D 2.45 2.55 0.096 0.100
E 0.95 1.05 0.037 0.041
D1 0.35 0.45 0.014 0.018
E1 0.35 0.45 0.014 0.018
b 0.15 0.25 0.006 0.010
e 0.5 BSC 0.019 BSC
L1 0.075 REF 0.0029 REF
L2 0.05 REF 0.0019 REF
b2 0.20 0.30 0.0079 0.012
L 0.35 0.45 0.014 0.018
LAND LAYOUT
D D1
Dimensions
Index Millimeter Inches
A B F
A 0.875 0.034
B 0.20 0.008
E C 0.50 0.02
C1 1.00 0.039
C
D 0.25 0.01
C1 D1 0.4 0.016
E 0.675 0.027
Notes: F 1.55 0.061
This LAND LAYOUT is for reference
purposes only. Please consult your
manufacturing partners to ensure your
company’s PCB design guidelines are met.
MARKING CODE
Ordering Information
Revision History