Mpq7200gle Aec1

MPQ7200
42V, 1.2A Buck-Boost or 3A Buck

Synchronous LED Driver,
AEC-Q100 Qualified
DESCRIPTION FEATURES
The MPQ7200 is a high-frequency, constant- • Wide 6V to 42V Operating Input Voltage
current, buck-boost LED driver with integrated Range
power MOSFETs. It offers a very compact • 44mΩ/40mΩ Low RDS(ON) Internal Power
solution to achieve up to 1.2A of continuous MOSFETs
output current, with excellent load and line • High-Efficiency Synchronous Operation
regulation across a wide input supply range. The • Configurable 1.2A Buck-Boost Mode or 3A
MPQ7200 can also be configured for buck mode Buck Mode
to provide up to 3A of constant load current. • Configurable LED Current without Sensing
Constant frequency hysteretic control provides Resistor
extremely fast transient response without loop • Default 2.3MHz Switching Frequency for
compensation. The switching frequency can be Buck Mode and 1.15MHz Switching
fixed up to 2.3MHz in buck mode to reduce the Frequency for Buck-Boost Mode with
current ripple and improve EMI. It can also be Spread Spectrum
configured to as low as 1.15MHz for optimized • PWM Dimming (Dimming Frequency from
efficiency and thermal performance in buck- 100Hz to 2kHz)
boost mode. • Internal 500Hz Two-Step Dimming with
Configurable Duty Cycle
Full protection features include over-current
protection (OCP), output over-voltage protection • Fault Indication for LED Short (to GND and
(OVP) and under-voltage protection (UVP), Battery) or Open Fault, Output Over-Voltage
thermal derating (TD), and thermal shutdown Protection (OVP), and Thermal Shutdown
(TSD). The fault indicator outputs an active logic (TSD)
low signal if a fault condition occurs. • Over-Current Protection (OCP) with Latch
Functionality
The MPQ7200 requires a minimal number of • Configurable Thermal Derating via NTC
readily available, standard external components, Remote Temperature Sensing
and is available in a space-saving QFN-19 • EMI Reduction Technique
(3mmx4mm) package. • Available in a QFN-19 (3mmx4mm)
Wettable Flank Package
• Available in AEC-Q100 Grade 1
APPLICATIONS
• Turn Indicator Lights
• Daytime Running Lights (DRLs)
• Fog Lights
• Rear Lights
All MPS parts are lead-free, halogen-free, and adhere to the RoHS directive.
For MPS green status, please visit the MPS website under Quality
Assurance. “MPS”, the MPS logo, and “Simple, Easy Solutions” are
trademarks of Monolithic Power Systems, Inc. or its subsidiaries.
MPQ7200 Rev. 1.1 www.MonolithicPower.com 1

2/22/2023 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2023 MPS. All Rights Reserved.
MPQ7200 – 42V, 1.2A, BUCK-BOOST OR 3A BUCK SYNC LED DRIVER, AEC-Q100
TYPICAL APPLICATION
VIN IN BST
MPQ7200
INGND SW
EN/DIM EN/DIM IREF

FAULT ISET
DUTY VCC
NTC AGND PGND
Figure 1: Buck-Boost Topology (RIREF ≤ 9.09kΩ)
VIN IN BST
MPQ7200
EN/DIM EN/DIM SW LED+
VCC
IREF
ISET
FAULT
LED-
INGND
DUTY
NTC AGND PGND
Figure 2: Buck Topology (RIREF ≥ 14.7kΩ)

ORDERING INFORMATION
Part Number* Package Top Marking MSL Rating**
MPQ7200GLE***
QFN-19 (3mmx4mm) See Below 1
MPQ7200GLE-AEC1***
* For Tape & Reel, add suffix -Z (e.g. MPQ7200GLE-AEC1-Z).
** Moisture Sensitivity Level Rating
*** Wettable Flank
TOP MARKING
MP: MPS prefix

Y: Year code
W: Week code
7200: First four digits of the part number
LLL: Lot number
E: Wettable flank
PACKAGE REFERENCE
TOP VIEW
NTC ISET IREF
19 18 17
DUTY 1 16 VCC
NC 2 15 AGND
EN/DIM 3 14 INGND
VIN 4 13 VIN
PGND 5 12 PGND
PGND 6 11 PGND
BST 7 10 FAULT
8 9
SW SW
QFN-19 (3mmx4mm)

PIN FUNCTIONS
Pin # Name Description
Two-step dimming duty set. Connect a resistor (RDUTY) between DUTY and AGND to set the
duty cycle for two-step dimming (or disable two-step dimming). The two-step dimming duty cycle
1 DUTY can be set between 5% and 15% with 1% steps (see the Two-Step Dimming section on page 43
for more details). If the DUTY pin is shorted to ground or an open fault is detected before start-
up, the part latches off and FAULT is asserted.
2 NC No connection. Leave the NC pin floating.
Enable/dimming control. When the two-step dimming function is not active (RDUTY = 4.87kΩ),
pull (VEN/DIM - VINGND) above 2.5V to turn the device on; pull (VEN/DIM - VINGND) below 1.58V
for >25ms to turn the device off and reset FAULT. Apply an external clock (100Hz to 2kHz) to the
3 EN/DIM EN/DIM pin for PWM dimming. Connect the EN/DIM and VIN pins using a resistor for automatic
start-up (once VIN and VCC exceed their respective UVLO thresholds). In two-step dimming mode,
EN control and PWM dimming function is disabled. Pull EN/DIM high for 100% dimming duty; pull
it low to select dimming duty set by DUTY pin (see Table 2 on page 44 for more details).
Supply voltage. The MPQ7200 operates from a 6V to 42V input rail. Use a capacitor (CIN) to
4, 13 VIN
decouple the input rail. Connect VIN to the input rail using a wide PCB trace.
Power ground. PGND is the reference ground of the power device, including the configuration
5, 6,
PGND pins (i.e. NTC), so it requires careful consideration when designing the PCB layout. PGND can
11, 12
be used to dissipate thermal heat.
Bootstrap. Connect a capacitor between the SW and BST pins to form a floating supply across
7 BST the high-side MOSFET driver. Place a resistor between the SW pin and BST capacitor to reduce
SW voltage spikes and improve EMI performance.
Switch output. This pin is the middle point between the high-side and low-side MOSFETs.
8, 9 SW Connect this pin using a wide trace with a small SW node to reduce noise coupling and improve
EMI.
Fault indicator. FAULT is an open-drain output with an internal 300kΩ pull-up resistor connected
to VIN, and a 4MΩ pull-down resistor connected to INGND. FAULT is pulled low if any of the
10 FAULT following faults occur: LED short, LED open, over-temperature protection (OTP), false mode
detection, and over-current protection (OCP). FAULT can be connected to VIN using a pull-up
resistor.
VIN, EN/DIM, and FAULT ground for buck-boost topologies. If using a buck topology, connect
14 INGND
the INGND pin to PGND or AGND.
15 AGND Analog ground. Logic circuit reference ground. Connect AGND and PGND with an external trace.
Internal bias supply. VCC supplies power to the internal control circuit and gate drivers. Place a
16 VCC ≥3µF decoupling capacitor close to VCC and connect it to ground. Considering the capacitance
derating, it is recommended to use a 10µF/10V or 16V X7R capacitor.
Mode selection and NTC reference current setting. Connect a ≤9.09kΩ resistor to IREF to set
the MPQ7200 to buck-boost mode; connect a ≥14.7kΩ resistor to IREF to set the MPQ7200 buck
mode. The IREF voltage is 0.57V. Connect a resistor (RIREF) from IREF to GND to get a reference
17 IREF current (0.57V / RIREF). If the IREF pin is shorted to ground or an open fault is detected, the part
latches off and asserts FAULT. In buck mode, the current on the NTC pin is 50 times that of the
reference current on IREF. In buck-boost mode, the current on the NTC pin is 5 times that of the
reference current on IREF.
LED current setting. Connect an external resistor from ISET to ground to set the average LED
18 ISET current. If the ISET pin is shorted to ground or an open fault is detected, the part latches off and
asserts FAULT.
Remote temperature sense. Connect NTC to a resistor or to a resistor network connected from
19 NTC NTC pin to PGND to configure the temperature derating starting point. The device provides
protections for the following conditions: NTC shorted to PGND, AGND, INGND, or the battery.

ABSOLUTE MAXIMUM RATINGS (1) Thermal Resistance θJA θJC

VIN - VPGND/AGND ..............................-0.3V to +50V QFN-19 (3mmx4mm)
VIN - VINGND ....................................-0.3V to +50V JESD51-7 ............................... 48 ...... 11°C/W (3)
VINGND - VPGND/AGND .........................-0.3V to +50V EVQ7200-L-00A ..................... 32 ....... 6. °C/W (4)
VFAULT - VINGND ...............................-0.3V to +50V
VEN/DIM - VINGND..............................-0.3V to +5.5V Notes:
VSW - VPGND/AGND -0.3V to VIN - VPGND/AGND + 0.3V 1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
VBST ................................................... VSW + 5.5V maximum junction temperature, TJ (MAX), the junction-to-
VNTC - VPGND/AGND ...........................-0.3V to +50V ambient thermal resistance, θJA, and the ambient temperature,
TA. The maximum allowable continuous power dissipation at
All other pins - VPGND/AGND .............-0.3V to +5.5V any ambient temperature is calculated by PD (MAX) = (TJ
Continuous power dissipation (TA = 25°C) (2) (4) (MAX) - TA) / θJA. Exceeding the maximum allowable power
QFN-19 (3mmx4mm) ................................. 3.9W dissipation can cause excessive die temperature, and the
regulator may go into thermal shutdown. Internal thermal
Junction temperature ................................150°C shutdown circuitry protects the device from permanent
Lead temperature .....................................260°C damage.
Storage temperature ................ -65°C to +150°C 3) Measured on JESD51-7, 4-layer PCB. The values given in this
table are only valid for comparison with other packages and
cannot be used for design purposes. These values were
ESD Ratings calculated in accordance with JESD51-7, and simulated on a
Human body model (HBM) ........................ ±2kV specified JEDEC board. They do not represent the
performance obtained in an actual application, the value of θJC
Charged device mode (CDM) ................. ±750V shows the thermal resistance from junction-to-case bottom.
4) Measured on the MPS standard EVB for the MPQ7200, 2oz.,
Recommended Operating Conditions 4-layer PCB.
Supply voltage (VIN - VPGND) ................ 6V to 42V
LED current (ILED) buck-boost mode .. Up to 1.2A
LED current (ILED) buck mode ............... Up to 3A
Operating junction temp (TJ)…. -40°C to +150°C

ELECTRICAL CHARACTERISTICS
VIN = 13.5V, VEN = 2V, TJ = -40°C to +125°C, typical values are at TJ = 25°C, buck mode, unless
otherwise noted.
Parameter Symbol Condition Min Typ Max Units
Shutdown supply
IIN VEN = 0V 30 80 μA
current
VEN = 2V, no switching, IREF float
Quiescent supply 1.2 2 mA
IQ (excluding IREF and the NTC current)
current
FAULT latch 2 mA
HS switch on VBST-SW = 5V, RISET = 13.3kΩ 44 75 mΩ
HSRDS(ON)
resistance VBST-SW = 5V, RISET = 40.2kΩ 85 150 mΩ
VCC = 5.2V, RISET = 13.3kΩ 40 70 mΩ
LS switch on resistance LSRDS(ON)
VCC = 5.2V, RISET = 40.2kΩ 80 140 mΩ
VEN = 0V, VSW = 13.5V, TJ = 25°C 1 μA
Switch leakage SWLKG
VEN = 0V, VSW = 13.5V 5 μA
RISET = 40.2kΩ 2.65 3.15 3.65 A
Peak current limit (5) ILIMIT_PEAK
RISET = 13.3kΩ 5.3 6.3 7.3 A
Zero-current detection
(5) 50 mA
Oscillator frequency fSW 2000 2300 2600 kHz

Minimum on time (5) tON_MIN 55 80 ns
Minimum off time (5) tOFF_MIN 75 100 ns
Maximum duty cycle (5) DMAX Low-dropout mode 95 98 %
Spread spectrum
15 kHz
frequency (5)
Spread spectrum ±10%
kHz
frequency range (5) x fSW
RISET = 13.3kΩ, TJ = 25°C to 100°C -5% 1.2 +5%
LED current ILED A
RISET = 13.3kΩ -15% +15%
LED current threshold
for MOSFET cutoff
ILED_CUT 600 700 mA
ISET voltage VISET IISET = 45μA 0.578 0.592 0.606 V

ISET current threshold ILED < ILED_CUT 80 120 160 μA
for pin short fault ILED > ILED_CUT 180 220 260 μA
ISET current threshold
0.5 1.4 5 μA
for pin open fault
EN rising threshold VEN_RISING VEN - VINGND 1.2 1.67 2.5 V
EN falling threshold VEN_FALLING VEN - VINGND 1 1.58 2.2 V
EN threshold hysteresis VEN_HYS VEN - VINGND 100 mV
VEN - VINGND = 2V 2 8 μA
EN input current IEN
VEN - VINGND = 0V 0 0.2 μA

ELECTRICAL CHARACTERISTICS (continued)

otherwise noted.
EN turn-off delay tEN-D-OFF 10 25 45 ms
VIN under-voltage lockout
INUVVTH_R VIN - VINGND 5.75 6 6.25 V
rising threshold
INUVVTH_F VIN - VINGND 4.5 4.9 5.2 V
falling threshold
INUVHYS VIN - VINGND 1.1 V
threshold hysteresis
VCC under-voltage lockout V
VCC_VTH VCC - VAGND 4.4 4.7 5
rising threshold
VCC under-voltage lockout V
VCC - VAGND 3.4 4.05 4.7
falling threshold
VCC under-voltage lockout
VCC_HYS VCC - VAGND 650 mV
VCC regulator VCC ICC = 0mA 4.9 5.1 5.3 V
VCC load regulation ICC = 20mA 4.7 V
VCC = VCC_UVLO + 100mV,
VCC max current ability 50 80 120 mA
no switching
VCC source current ability
(5) VCC = VCC_UVLO + 100mV, switching 25 mA
IDUTY1 40 45 50 μA
DUTY source current IDUTY
IDUTY2 550 600 650 μA
VDUTY threshold maxim IDUTY1 and IDUTY2 3.287 3.355 3.422 V
VDUTY threshold minimum (5) IDUTY1 and IDUTY2 0.28 0.302 0.33 V
Two-step dimming
500 Hz
frequency (5)
Output over-voltage
OVVTH 16.5 18 19 V
threshold
Output under-voltage
UVVTH 0.6 1.1 1.7 V
threshold
ILED_SETTING < ILED_CUT 45 60 75 mA
LED low-current threshold
ILED_SETTING > ILED_CUT 100 120 150 mA
FAULT assertion delay time
tFT-D-START 25 35 40 ms
during start-up
FAULT assertion deglitch
tFT-D 20 μs
time after start-up (5)
FAULT assertion low sink- VFAULT = 12V 10 30 50 mA
IFAULT_SINK
current capability VFAULT = 0.2V 5 12 mA
FAULT pull-up resistor 100 300 500 kΩ
FAULT pull-down resistor 2000 4000 6000 kΩ
IREF current for mode
200 240 280 μA
detection


otherwise noted.
VIREF threshold for mode
2.6 2.7 2.8 V
detection
IREF voltage VIREF IREF = 20µA 0.50 0.57 0.63 V
IREF current threshold for
60 90 120 μA
pin short detection
3 6 μA
pin open detection
INTC1 4.5 7.6 10 μA
NTC source current
INTC2 VNTC = 1.25V, IREF = 20μA 980 1020 1060 μA
NTC voltage for current ILED = 98% of nominal -2.5% 1.25 +2.5% V
derating ILED = 58% of nominal -2.5% 0.65 +2.5% V
VNTC OV threshold VNTC1 1.8 2 2.2 V
VNTC threshold for OTP VNTC2 0.2 0.38 0.48 V
VNTC deglitch time for OTP VNTC = 0.3V 180 256 320 μs
VNTC UV threshold VNTC2 0.14 0.18 0.22 V
Thermal shutdown (5) 155 170 185 °C


VIN = 13.5V, VEN = 2V, TJ = -40°C to +125°C, typical values are at TJ = 25°C, buck-boost mode, unless
otherwise noted.
Shutdown supply current IIN VEN = 0V 30 80 μA
VEN = 2V, no switching, IREF floating
IQ 1.2 2 mA
Quiescent supply current (excluding IREF and the NTC current)
FAULT latch 2 mA
HS switch on resistance HSRDS(ON) VBST-SW = 5V, RISET = 13.3kΩ 44 75 mΩ
LS switch on resistance LSRDS(ON) VCC = 5.2V,RISET = 13.3kΩ 40 70 mΩ
VEN = 0V, VSW = 13.5V, TJ = 25°C 1 μA
Switch leakage SWLKG
VEN = 0V, VSW =13.5V 5 μA
Peak current limit (5) ILIMIT_PEAK 5.3 6.3 7.3 A
Zero-current detection (5) 50 mA
Oscillator frequency fSW 920 1150 1380 kHz
Minimum on time (5) tON_MIN 55 80 ns
Minimum off time (5) tOFF_MIN 75 100 ns
Maximum duty cycle (5) DMAX Low dropout 95 98 %
Spread spectrum
15 kHz
frequency (5)
Spread spectrum ±10%
kHz
frequency range (5) x fSW
RISET = 21.5kΩ, TJ = 25°C to 100°C -7% 0.75
+7%
A
RISET = 21.5kΩ -15% +15%
LED current ILED
RISET = 13.3kΩ, TJ = 25°C to 100°C -5% 1.2 +5%
A
RISET = 13.3kΩ -15% +15%
ISET voltage VISET IISET = 45μA 0.578 0.592 0.606 V
VIN = 6.6V, VISET with respect to the
91.5 95 98.5 %
nominal voltage
Power derating ratio
VIN = 5.3V, VISET with respect to the
72.5 76 79.5 %
nominal voltage
ISET current threshold for
90 110 130 μA
pin short
ISET current threshold for
0.5 1.4 5 μA
pin open
EN rising threshold VEN_RISING VEN - VINGND 1.2 1.67 2.5 V
EN falling threshold VEN_FALLING VEN - VINGND 1.0 1.58 2.2 V
EN threshold hysteresis VEN_HYS VEN - VINGND 100 mV


otherwise noted.
IEN VEN = 2V 2 8 μA
EN input current
VEN = 0V 0 0.2 μA
EN turn-off delay tEN-TD-OFF 10 25 45 ms
INUVVTH_R VIN - VINGND 5.75 6 6.25 V
rising threshold
INUVVTH_F VIN - VINGND 4.5 4.9 5.2 V
falling threshold
INUVHYS VIN - VINGND 1.1 V
VCC_VTH VCC - VAGND 4.4 4.7 5 V
rising threshold
VCC - VAGND 3.4 4.05 4.7 V
falling threshold
VCC_HYS VCC - VAGND 650 mV
VCC regulator VCC ICC = 0mA 4.9 5.1 5.3 V
VCC load regulation ICC = 20mA 4.7 V
VCC max current ability VCC = VCC UVLO + 100mV, no switching 50 80 120 mA
VCC source current ability
(5) VCC = VCC UVLO + 100mV, switching 25 mA
IDUTY1 40 45 50 μA
DUTY source current IDUTY
IDUTY2 550 600 650 μA
VDUTY threshold max IDUTY1 and IDUTY2 3.287 3.355 3.422 V
(5)
VDUTY threshold min IDUTY1 and IDUTY2 0.28 0.302 0.33 V
Two-step dimming
500 Hz
frequency (5)
Output over-voltage
OVVTH VINGND - VAGND 17 18 19 V
threshold
Output under-voltage
UVVTH VINGND - VAGND 1 1.35 1.7 V
threshold
VIN load dump protection
38 40 42 V
threshold
37 39 41 V
falling threshold
1 V
hysteresis
Output discharge current VINGND - VPGND > 5V 40 100 180 mA
for load dump protection VINGND - VPGND = 1V 20 45 90 mA
FAULT assertion delay
tFT-TD_START 25 35 40 ms
time during start-up
FAULT assertion deglitch
tFT-D 20 μs
time after start-up


otherwise noted.
FAULT assertion low sink IFAULT_SINK VFAULT = 12V 10 30 50 mA
current capability VFAULT = 0.2V 5 12 mA
FAULT pull-up resistor 100 300 500 kΩ
FAULT pull-down resistor 2000 4000 6000 kΩ
IREF current for mode
200 240 280 μA
detection
VIREF threshold for mode
2.6 2.7 2.8 V
detection
IREF voltage VIREF IREF = 20µA 0.50 0.57 0.63 V
600 900 1200 μA
pin short detection
40 70 μA
pin open detection
INTC1 4.5 7.6 10 μA
NTC source current
INTC2 VNTC = 1.25V, IREF = 200μA 980 1020 1060 μA
NTC voltage for current ILED = 98% of nominal -2.5% 1.25 +2.5% V
derating ILED = 58% of nominal -2.5% 0.65 +2.5% V
VNTC over-voltage
VNTC1 1.8 2 2.2 V
threshold
VNTC threshold for OTP VNTC2 0.2 0.38 0.48 V
VNTC deglitch time for OTP VNTC = 0.3V 180 256 320 μs
VNTC under-voltage
VNTC2 0.14 0.18 0.22 V
threshold
Thermal shutdown (5) 155 170 185 °C
Note:
5) Not tested in production. Guaranteed by over-temperature correlation.

TYPICAL CHARACTERISTICS
VIN = 12V, TJ = -40°C to +125°C, unless otherwise noted
Shutdown Current vs. Quiescent Current vs.

Temperature Temperature
40 1.6
35 1.4
30 1.2
ISHDN (μA)
IQ (mA)
25 1.0
20 0.8
15 0.6
10 0.4
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
TEMPERATURE (oC) TEMPERATURE (oC)
VIN UVLO Threshold vs. EN UVLO Threshold vs.

7.0 1.9
6.5 1.8
6.0 1.7
VIN_UVLO (V)
VEN_UVLO (V)
5.5 1.6
5.0 1.5
Rising
Rising 1.4
4.5 Falling
Falling
4.0 1.3
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
VCC UVLO Threshold vs.

VCC Voltage vs. Temperature Temperature
5.4 5.6
5.3 5.2
5.2 4.8
VCC_UVLO (V)
VCC (V)
5.1 4.4
5.0 4.0
I_VCC=0mA
Rising
4.9 3.6
I_VCC=20mA Falling
4.8 3.2
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130

TYPICAL CHARACTERISTICS (continued)

Current Limit with MOSFETs Current Limit with MOSFETs

Fully On vs. Temperature Half On vs. Temperature
7.5 3.6
7.0 3.4
6.5 3.2
ILIMIT_PEAK (A)
ILIMIT_PEAK (A)
6.0 3.0
5.5 2.8
5.0 2.6
4.5 2.4
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
TEMPERATURE (oC) TEMPERATURE ( C) o
VIREF vs. Temperature VISET vs. Temperature

0.8 0.8
0.7 0.7
0.6 0.6
VIREF (V)
VISET (V)
0.5 0.5
0.4 0.4
0.3 0.3
0.2 0.2
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
VNTC UV Threshold vs. VNTC OV Threshold vs.

0.22 2.3
2.2
0.2
2.1
VNTC_UV (V)
VNTC_OV (V)
0.18
2
0.16
1.9
0.14
1.8
0.12 1.7
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
o
TEMPERATURE (oC) TEMPERATURE ( C)

TYPICAL CHARACTERISTICS (continued)

Switching Frequency vs. Switching Frequency vs.
Buck mode Buck-boost mode
2550 1400
2450 1300
2350 1200
fSW (kHz)
fSW (kHz)
2250 1100
2150 1000
2050 900
1950 800
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
VOUT UV Threshold vs. VOUT UV Threshold vs.

1.4 1.6
1.3 1.5
1.2 1.4
VOUT (V)
VOUT (V)
1.1 1.3
1.0 1.2
0.9 1.1
0.8 1
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130
VOUT OVP Threshold vs. VOUT OVP Threshold vs.

20 21
19 20
18 19
VOUT (V)
VOUT (V)
17 18
16 17
15 16
14 15
-50 -30 -10 10 30 50 70 90 110 130 -50 -30 -10 10 30 50 70 90 110 130

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Buck mode, 2 LEDs (VLED = 6V), VIN = 13.5V, fSW = 2.3MHz, L = 4.7µH, TA = 25°C, unless otherwise
noted.
ILED Part-to-Part Variation ILED Part-to-Part Variation
TJ = 25°C to 100°C TJ = -40°C to +150°C
25% 35%
PRECISION W/ PART-TO-PART
20%
700mA 25%
15% 700mA
10% 15%
VARIATION
VARIATION
5%
5%
0% MOSFET cutoff transition
MOSFET cutoff transition
-5% -5%
-10% -15%
-15% 700mA
-25%
-20%
700mA
-25% -35%
200 600 1000 1400 1800 2200 2600 3000 200 600 1000 1400 1800 2200 2600 3000
LED CURRENT (mA)
LED CURRENT (mA)
ILED Precision vs. Input Voltage ILED Precision vs. Input Voltage
L = 4.7µH, ILED = 1.2A, VIN ramping up L = 4.7µH, ILED = 1.2A, VIN ramping down
3% 3%
LED CURRENT PRECISION
2%
2%
1%
1%
0%
0% -1%
-2%
-1%
2 LEDs(VLED=6V) -3% 2 LEDs(VLED=6V)
-2% 1LED(VLED=3V) -4% 1LED(VLED=3V)
-3% -5%
8 10 12 14 16 18 20 8 10 12 14 16 18 20
INPUT VOLTAGE (V) INPUT VOLTAGE (V)
L = 3.3µH, ILED = 2A, VIN ramping up L = 3.3µH, ILED = 2A, VIN ramping down
3% 2%
2% 1%
0%
1%
-1%
0%
-2%
-1%
-3%
1LED(VLED=3V)
1 LED(VLED=3V)
-2% -4% 2 LEDs(VLED=6V)
2LEDs(VLED=6V)
-3% -5%
8 10 12 14 16 18 20 8 10 12 14 16 18 20


noted.
1% 2%
0% 1%

0%
-1%
-1%
-2%
-2%
-3%
-3%
2LEDs(VLED=6V) 2 LEDs(VLED=6V)
-4%
-4%
1 LED(VLED=3V) 1LED(VLED=3V)
-5% -5%
8 10 12 14 16 18 20 8 10 12 14 16 18 20
L = 10µH, ILED = 0.35A, VIN ramping up L = 10µH, ILED = 0.35A, VIN ramping down
3% 1.5%
2% 1.0%
1% 0.5%
0% 0.0%
-1% -0.5%
-2% -1.0%
1 LED(VLED=3V) 1LED(VLED=3V)
-3% -1.5%
8 10 12 14 16 18 20 8 10 12 14 16 18 20
2% 2%
1% 1%
0% 0%
-1% -1%
-2% -2%
-3% -3%
-4% -4% 1LED(VLED=3V)
1 LED(VLED=3V)
-5% -5%
8 10 12 14 16 18 20 8 10 12 14 16 18 20


noted.
ILED Precision vs. Inductor Value ILED Precision vs. Inductor Value
Variation Variation
VIN = 13.5V, 2 LEDs (VLED = 6V) VIN = 13.5V, 1 LED (VLED = 3V)
3% 3.0%
2.0%

2%
1% 1.0%
0% 0.0%
-1% -1.0%
ILED=1.2A, L=4.7µH ILED=1.2A, L=4.7µH

-2% -2.0%
ILED=2A, L=3.3µH ILED=2A, L=3.3µH
-3% -3.0%
0.7 0.8 0.9 1 1.1 1.2 1.3 0.7 0.8 0.9 1 1.1 1.2 1.3
RATIO TO NORMALIZED INDUCTOR RATIO TO NORMALIZED INDUCTOR
ILED Precision vs. HS-FET ILED Precision vs. LS-FET

Temperature Sense Temperature Sense
2 LEDS (VLED = 6V) 2 LEDs (VLED = 6V)
2% 3%
1% 2%
1%
0%
0%
-1%
-1%
-2%
-2%
-3%
ILED=1.2A, L=4.7µH -3% ILED=1.2A, L=4.7µH
-4% ILED=0.35A, L=10µH -4% ILED=0.35A, L=10µH
-5% -5%
-40 -20 0 20 40 60 80 100 120 140 160 -40 -20 0 20 40 60 80 100 120 140 160
o
TJ ( C) TJ (oC)
VIN Slow Ramp Up and Down VIN Slow Ramp Up and Down
2 LEDs (VLED = 6V), ILED = 1.2A, 1 LED (VLED = 3V), ILED = 1.2A,
VIN = 0V to 20V, 0.001V/ms VIN = 0V to 20V, 0.001V/ms
CH3: VIN CH3: VIN

5V/div. 5V/div.
CH4: ILED CH4: ILED
0.2A/div. 0.2A/div.
4s/div. 4s/div.


Buck mode, VIN = 12V, 2 LEDs in series (VLED = 6V), ILED = 3A, L = 4.7μH, fSW = 2.3MHz, with EMI
filters, TA = 25°C, unless otherwise noted. (6)
CISPR25 Class 5 Peak Conducted CISPR25 Class 5 Average Conducted

Emissions Emissions
150kHz to 108MHz 150kHz to 108MHz
75 75
CISPR25 CLASS 5 LIMITS 70
70
65 65
60 60
CISPR25 CLASS 5 LIMITS
AVERAGE CONDUCTED EMI (dBµV)

55
PEAK CONDUCTED EMI (dBµV)
55
50 50
45 45
40 40
35 35
30 30
25 25
20 20
15 15
10 10
5 5
NOISE FLOOR
0 0
-5 -5
-10 -10
NOISE FLOOR
-15 -15
-20 -20
0.1 1 Frequency (MHz) 10 Frequency (MHz) 108
0.1 1 10
CISPR25 Class 5 Peak Radiated CISPR25 Class 5 Average Radiated

Emissions Emissions
60 60
55 55
50 CISPR25 CLASS 5 LIMITS
50
PEAK RADIATED EMI (dBµV/m)
45 45
AVERAGE RADIATED EMI (dBµV/m)
40 40
35 35
30 CISPR25 CLASS 5 LIMITS
30
25
25
20
20
15
15
10
10
5 NOISE FLOOR
5
0
0
-5
-5 NOISE FLOOR
-10
-10
-15
0.1 1 Frequency (MHz) 10 30 -15
0.1 1 Frequency (MHz) 10 30

Emissions Emissions
Horizontal, 30MHz to 200MHz Horizontal, 30MHz to 200MHz
55 55
HORIZONTAL POLARIZATION HORIZONTAL POLARIZATION
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
5
NOISE FLOOR 5 NOISE FLOOR
0
0
-5
-5
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
Frequency (MHz) 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
Frequency (MHz)


Buck mode, VIN = 12V, 2 LEDs in series (VLED = 6V), ILED = 3A, L = 4.7μH, fSW = 2.3MHz, with EMI
filters, TA = 25°C, unless otherwise noted. (6)

Emissions Emissions
Vertical, 30MHz to 200MHz Vertical, 30MHz to 200MHz
55 55
VERTICAL POLARIZATION VERTICAL POLARIZATION
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
5 NOISE FLOOR NOISE FLOOR
5
0 0
-5
-5
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
Frequency (MHz)
Frequency (MHz)

Emissions Emissions
Horizontal, 200MHz to 1GHz Horizontal, 200MHz to 1GHz
55 55
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
NOISE FLOOR
5 5
0 0
NOISE FLOOR
-5 -5
200 300 400 500 600 700 800 900 1000 200 300 400 500 600 700 800 900 1000
Frequency (MHz) Frequency (MHz)

Emissions Emissions
Vertical, 200MHz to 1GHz Vertical, 200MHz to 1GHz
55 55
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
NOISE FLOOR
5 5
0 0
NOISE FLOOR
-5 -5
200 300 400 500 600 700 800 900 1000 200 300 400 500 600 700 800 900 1000
Note:
6) The MPQ7200 buck mode EMC test results are based on the application circuit with EMI filters in Figure 10 on page 54.


Buck mode, 2 LEDs in series (VLED = 6V), VIN = 13.5V, fSW = 2.3MHz, L = 4.7µH, TA = 25°C, unless
otherwise noted.
Efficiency with 2 LEDs Efficiency with 1 LED
2 LEDs (VLED = 6V), RBST = 0Ω, 1 LED (VLED = 3V), RBST = 0Ω,
MOSFETs cut off when ILED = 0.5A MOSFETs cut off when ILED = 0.5A
96 7.0 94 7.0
ILED=3A
93 6.0 90 ILED=2A 6.0
ILED=1.2A
POWER LOSS (W)

ILED=0.75A
POWER LOSS (W)

EFFICIENCY (%)
90 5.0 86 5.0
EFFICIENCY (%)
ILED=0.5A
87 ILED=3A 4.0 82 4.0
ILED=2A
ILED=1.2A
84 ILED=0.75A 3.0 78 3.0
ILED=0.5A
81 2.0 74 2.0
78 1.0 70 1.0
75 0.0 66 0.0
8 10 12 14 16 18 20 8 10 12 14 16 18 20
Case Temperature Rise with 2 LEDs Case Temperature Rise with 1 LED
2 LEDs (VLED = 6V), RBST = 0Ω 1 LED (VLED = 3V), RBST = 0Ω
MOSFETs cut off when ILED = 0.5A MOSFETs cut off when ILED = 0.5A
120 120
CASE TEMPERATURE RISE
CASE TEMPERATURE RISE
ILED=3A ILED=3A
100 ILED=2A 100 ILED=2A
ILED=1A ILED=1A
80 ILED=0.75A 80 ILED=0.75A
(oC)
(oC)
60 60
40 40
20 20
0 0
8 10 12 14 16 18 20 8 10 12 14 16 18 20
Steady State Start-Up through VIN

ILED = 3A ILED = 3A
VIN
CH2: 10V/div.
VLED+ - CH2:
VLED- VLED+ -
VLED-
5V/div.
CH3: 5V/div.
ILED CH3: ILED
1A/div. 2A/div.
CH4: IL
1A/div. CH4: IL
CH1: 2A/div.
VSW CH1: VSW
5V/div. 5V/div.
400ns/div. 2ms/div.


noted.
Shutdown through VIN Start-Up through EN

ILED = 3A ILED = 3A
VIN VEN/DIM
10V/div. 2V/div.
CH2:
CH2: VLED+ - VLED-
VLED+ - VLED- 5V/div.
10V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div. CH1: VSW
CH1: VSW 5V/div.
5V/div.
4ms/div. 1ms/div.
Shutdown through EN PWM Dimming Steady State

ILED = 3A Dimming frequency = 100Hz
VFAULT
VEN/DIM 10V/div.
2V/div.
CH2:
CH2: VLED+ - VLED-
VLED+ - VLED- 5V/div.
5V/div. CH3: ILED
CH3: ILED 2A/div.
2A/div.
CH4: IL
CH4: IL 2A/div.
2A/div.
CH1: VSW CH1: VSW
5V/div. 5V/div.
2μs/div. 4ms/div.
PWM Dimming in Steady State PWM Dimming

Dimming frequency = 500Hz Start-up through VIN
VFAULT
CH1:
10V/div.
VEN/DIM
CH2:
2V/div.
VLED+ - VLED-
CH2: VIN
5V/div.
10V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
CH1: VSW
VSW
5V/div.
10V/div.
1ms/div. 10ms/div.


noted.
PWM Dimming Two-Step Dimming
Shutdown through VIN Steady state
VFAULT
CH1: VEN/DIM
10V/div.
2V/div.
CH2:
CH2: VIN
VLED+ - VLED-
10V/div.
5V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
VSW CH1: VSW
10V/div. 5V/div.
10ms/div. 1ms/div.
Two-Step Dimming Two-Step Dimming

Start-up through VIN Shutdown through VIN
CH2:
VLED+ - VLED-
VIN
5V/div.
10V/div.
VIN CH2:
10V/div. VLED+ - VLED-
CH3: ILED 5V/div.
2A/div. CH3: ILED
2A/div.
CH4: IL
2A/div. CH4: IL
2A/div.
CH1: VSW
5V/div. CH1: VSW
5V/div.
2ms/div. 4ms/div.
No Dimming No Dimming
LED open start-up LED open entry
CH2:
VFAULT
CH3: VIN 10V/div.
10V/div.
CH2: VFAULT CH3: ILED
10V/div. 2A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW

10V/div. 10V/div.
10ms/div. 40μs/div.


noted.
PWM Dimming PWM Dimming

CH2:
VFAULT
CH3: VIN 10V/div.
10V/div.
CH3: ILED
CH2: VFAULT
2A/div.
10V/div.
CH4: IL
2A/div. CH4: IL
2A/div.
CH1: VSW
10V/div. CH1: VSW
10V/div.
20ms/div. 10ms/div.

CH2:
VFAULT
CH3: VIN 10V/div.
5V/div. CH3: ILED
2A/div.
CH2: VFAULT
5V/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW
10V/div. CH1: VSW
10V/div.
10ms/div. 2ms/div.
LED+ short to LED- start-up LED+ short to LED- entry
VFAULT
CH3: VIN 10V/div.
CH2:
10V/div.
VLED+ - VLED-
5V/div.
CH2: VFAULT
10V/div. CH3: ILED
2A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW

10V/div. 10V/div.


noted.

VFAULT
CH3: VIN 10V/div.
CH2:
10V/div.
VLED+ - VLED-
10V/div.
CH2: VFAULT
10V/div. CH3: ILED
2A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW

10V/div. 10V/div.
20ms/div. 10ms/div.

CH3: VIN CH2:

VFAULT
10V/div.
10V/div.
CH2: VFAULT
10V/div. CH3: ILED
2A/div.
CH4: IL
2A/div. CH4: IL
2A/div.
CH1: VSW
CH1: VSW 10V/div.
5V/div.
10ms/div. 2ms/div.
IREF Short Fault before IC Starts Up IREF Open Fault before IC Starts Up
CH3: VIN
CH3: VIN 10V/div.
10V/div. CH2:
CH2: VFAULT VFAULT
10V/div. 10V/div.
CH4: IREF CH4: IREF

2V/div.
2V/div.
CH1: VSW
CH1: VSW
10V/div.
10V/div.
10ms/div. 10ms/div.


noted.
IREF Short Fault after IC Starts Up IREF Open Fault after IC Starts Up
CH2: VFAULT CH2:

VFAULT
10V/div.
10V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
CH1: VSW
CH1: VSW 5V/div.
5V/div.
2μs/div. 2μs/div.
IREF Short Fault after IC Starts Up IREF Open Fault after IC Starts Up
PWM dimming PWM dimming
CH2: VFAULT CH2:

VFAULT
10V/div.
10V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
CH1: VSW
CH1: VSW
5V/div.
5V/div.
2ms/div. 2ms/div.
ISET Short Fault before IC Starts Up ISET Open Fault before IC Starts Up
CH3: VIN CH3: VIN

10V/div. 10V/div.
CH2: VFAULT CH2:
VFAULT
10V/div.
10V/div.
CH4: ISET
CH4: ISET
2V/div.
2V/div.
CH1: VSW
10V/div. CH1: VSW
10V/div.
10ms/div. 10ms/div.


noted.
ISET Short Fault after IC Starts Up ISET Open Fault after IC Starts Up
CH2: VFAULT CH2:

VFAULT
10V/div.
10V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
CH1: VSW
CH1: VSW 5V/div.
5V/div.
4μs/div. 4μs/div.
ISET Short Fault after IC Starts Up ISET Open Fault after IC Starts Up
CH2: VFAULT CH2:

VFAULT
10V/div.
10V/div.
CH3: ILED
CH3: ILED
2A/div.
2A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
CH1: VSW
CH1: VSW
5V/div.
5V/div.
2ms/div. 2ms/div.
DUTY Short Fault before IC Starts DUTY Open Fault before IC Starts
Up Up
CH3: VIN CH3: VIN

10V/div. 10V/div.
CH2: VFAULT CH2:
VFAULT
10V/div.
10V/div.
CH4: DUTY
CH4: DUTY
2V/div.
2V/div.
CH1: VSW
10V/div. CH1: VSW
10V/div.
10ms/div. 10ms/div.


noted.
Incorrect Mode Detection during

VIN Start-Up
CH3: VIN
10V/div.
CH2: VFAULT
10V/div.
CH4: IL
5A/div.
CH1: VSW
5V/div.
10ms/div.


Buck-boost mode, 4 LEDs (VLED = 12V), VIN = 13.5V, fSW = 1.15MHz, L = 4.7µH, TA = 25°C, unless
otherwise noted.
ILED Part-to-Part Variation ILED Part-to-Part Variation

TJ = 25°C to +100°C TJ = -40°C to +150°C
12.00% 25%
9.00% 20%
15%
6.00%
10%
VARIATION
VARIATION
3.00% 5%
0.00% 0%
-5%
-3.00%
-10%
-6.00% -15%
-9.00% -20%
-25%
-12.00%
400 500 600 700 800 900 1000 1100 1200
400 500 600 700 800 900 1000 1100 1200
LED CURRENT (mA) LED CURRENT (mA)
3% 3%
2% 2%
1% 1%
0% 0%
-1% -1%
4 LEDs(VLED=12V)
4 LEDs(VLED=12V)
-2% -2%
3LEDs(VLED=9V) 3LEDs(VLED=9V)
-3% -3%
8 10 12 14 16 18 20 8 10 12 14 16 18 20
3% 3%
2% 2%
1% 1%
0% 0%
-1% -1%
-2% -2% 4 LEDs(VLED=12V)
4 LEDs(VLED=12V)
-3% -3%
8 10 12 14 16 18 20 8 10 12 14 16 18 20


otherwise noted.
L = 4.7µH, ILED = 1A, VIN ramping up L = 4.7µH, ILED = 1A, VIN ramping down
3% 3%
2% 2%

1% 1%
0% 0%
-1% -1%
4 LEDs(VLED=12V) 4 LEDs(VLED=12V)
-2% -2%
-3% -3%
8 10 12 14 16 18 20 8 10 12 14 16 18 20
3% 3.0%
2% 2.0%
1% 1.0%
0% 0.0%
-1% -1.0%
4 LEDs(VLED=12V)
-2%
4 LEDs(VLED=12V)
3LEDs(VLED=9V) -2.0%
3LEDs(VLED=9V)
-3% -3.0%
8 10 12 14 16 18 20 8 10 12 14 16 18 20
3% 3%
2%
2%
1% 1%
0% 0%
-1% -1%
4 LEDs(VLED=12V)
4 LEDs(VLED=12V)
-2% -2%
-3% -3%
8 10 12 14 16 18 20 8 10 12 14 16 18 20


otherwise noted.
ILED Precision vs. Inductor Value ILED Precision vs. Inductor Value
Variation Variation
VIN = 13.5V, 4 LEDs (VLED = 12V) VIN = 13.5V, 3 LEDs (VLED = 9V)
2% 3%
2%

1%
1%
0%
0%
-1%
ILED=1.2A, L=3.3µH -1%
ILED=1.2A, L=3.3µH
-2% ILED=0.75A, L=6.8µH -2%
ILED=0.75A, L=6.8µH
-3% -3%
0.7 0.8 0.9 1 1.1 1.2 1.3 0.7 0.8 0.9 1 1.1 1.2 1.3
RATIO TO NORMALIZED INDUCTOR RATIO TO NORMALIZED INDUCTOR
ILED Precision vs. HS-FET ILED Precision vs. LS-FET Temperature

Temperature Sense Sense
4 LEDs (VLED = 12V) 4 LEDs (VLED = 12V)
2% 3%
2%
1%
1%
0%
0%
-1%
-1%
-2%
-2%
-3% -3%
ILED=1.2A, L=3.3µH ILED=1.2A, L=3.3µH
-4% -4% ILED=0.4A, L=10µH
ILED=0.4A, L=10µH
-5% -5%
-40 -20 0 20 40 60 80 100 120 140 160 -40 -20 0 20 40 60 80 100 120 140 160
TJ (oC)
TJ (oC)
VIN Slow Ramp Up and Down VIN Slow Ramp Up and Down
4 LEDs (VLED = 12V), ILED = 1.2A, 3 LEDs (VLED = 9V), ILED = 1.2A,
VIN = 0V to 20V, 0.001V/ms VIN = 0V to 20V, 0.001V/ms
CH3: VIN CH3: VIN

5V/div. 5V/div.
CH4: ILED CH4: ILED
0.2A/div. 0.2A/div.
4s/div. 4s/div.

TYPICAL PERFORMANCE CHARACTERISTICS(continued)

Buck-boost mode, VIN = 12V, 4 LEDs in series (VLED = 12V), ILED = 1.2A, L = 4.7μH, fSW = 1.15MHz,
with EMI filters, TA = 25°C, unless otherwise noted. (7)
CISPR25 Class 5 Peak Conducted CISPR25 Class 5 Average Conducted

Emissions Emissions
75 75
70 70
65 65
60 60
AVERAGE CONDUCTED EMI (dBµV)

PEAK CONDUCTED EMI (dBµV)
55 55
50 50
45 45
40 40
35 35
30 30
25 25
20 20
15 15
10 10
5 5 NOISE FLOOR
0 0
-5 -5
-10 -10
NOISE FLOOR
-15 -15
-20 -20
0.1 1 Frequency (MHz) 10 108 1 Frequency (MHz) 108
0.1 10

Emissions Emissions
60 60
55 55
50 CISPR25 CLASS 5 LIMITS 50
45 45
40 40
35 35
30 30 CISPR25 CLASS 5 LIMITS
25 25
20 20
15 15
10 10
5 NOISE FLOOR 5
0 0
-5 -5 NOISE FLOOR
-10 -10
-15 -15
1 Frequency (MHz)
0.1 Frequency (MHz) 10 30 0.1 1 10 30

Emissions Emissions
Horizontal, 30MHz to 200MHz Horizontal, 30MHz to 200MHz
55 55
50 50
45 45
40 40
35 35
30 30
25 25
20 20
15 15
10 10
5 NOISE FLOOR 5 NOISE FLOOR
0 0
-5 -5
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200


Buck-boost mode, VIN = 12V, 4 LEDs in series (VLED = 12V), ILED = 1.2A, L = 4.7μH, fSW = 1.15MHz,
with EMI filters, TA = 25°C, unless otherwise noted. (7)

Emissions Emissions
Vertical, 30MHz to 200MHz Vertical, 30MHz to 200MHz
55 55
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
NOISE FLOOR NOISE FLOOR
5 5
0 0
-5
-5
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
Frequency (MHz)
Frequency (MHz)

Emissions Emissions
Horizontal, 200MHz to 1GHz Horizontal, 200MHz to 1GHz
55 55
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
NOISE FLOOR
5 5
0 0
NOISE FLOOR
-5 -5
200 300 400 500 600 700 800 900 1000 200 300 400 500 600 700 800 900 1000

Emissions Emissions
Vertical, 200MHz to 1GHz Vertical, 200MHz to 1GHz
55 55
50 50
45 45

40 40
35 35
30 30
25 25
20 20
15 15
10 10
NOISE FLOOR
5 5
0 0
NOISE FLOOR
-5 -5
200 300 400 500 600 700 800 900 1000 200 300 400 500 600 700 800 900 1000
Notes:
7) The MPQ7200 buck-boost mode EMC test results are based on the application circuit with EMI filters in Figure 11 on page 54.


otherwise noted.
Efficiency with 3 LEDs Efficiency with 4 LEDs

3 LEDs (VLED = 9V), RBST = 0Ω 4 LEDs (VLED = 12V), RBST = 0Ω
93 2.8 93 3.5
90 2.4 90 3.0
POWER LOSS (W)

POWER LOSS (W)
EFFICIENCY (%)
87 2.0 87 2.5
EFFICIENCY (%)
84 1.6 84 2.0
81 1.2 81 1.5
78 0.8 78 1.0
ILED=1.2A ILED=1.2A
75 ILED=1.0A 0.4 75 ILED=1.0A 0.5
ILED=0.75A ILED=0.75A
72 0.0 72 0.0
8 10 12 14 16 18 20 8 10 12 14 16 18 20
Case Temperature Rise with 3 LEDs Case Temperature Rise with 4 LEDs
3LEDs (VLED = 9V), RBST = 0Ω 4LEDs (VLED = 12V), RBST = 0Ω
60 100
CASE TEMPERATURE RISE (oC)
CASE TEMPERATURE RISE (oC)
90 ILED=1.2A
50 ILED=1A
80
40 70 ILED=0.75A
60
30 50
40
20
ILED=1.2A 30
10 ILED=1A 20
ILED=0.75A 10
0 0
8 10 12 14 16 18 20 8 10 12 14 16 18 20
INPUT VOLTAGE (V) INPUT VOLTAGE(V)
Steady State Start-Up through VIN

ILED = 1.2A ILED = 1.2A
VIN
CH2: 10V/div.
VLED+ - CH2:
VLED- VLED+ - VLED-
5V/div. 10V/div.
CH3: ILED CH3: ILED
500mA/div. 1A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW
10V/div.
10V/div.
1μs/div. 2ms/div.

otherwise noted.
Shutdown through VIN Start-Up through EN

ILED = 1.2A ILED = 1.2A
VIN VEN/DIM
5V/div. 2V/div.
CH2: CH2:
VLED+ - VLED- VLED+ - VLED-
10V/div. 5V/div.
CH3: ILED CH3: ILED
1A/div. 1A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW
10V/div. 10V/div.
4ms/div. 1ms/div.
Shutdown through EN PWM Dimming in Steady State

ILED = 1.2A Dimming frequency = 100Hz
VEN/DIM VFAULT
2V/div. 10V/div.
CH3: ILED CH2:
VLED+ - VLED-
1A/div.
2V/div.
CH2:
VLED+ - VLED- CH3: ILED
5V/div. 1A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW
10V/div. 10V/div.
4μs/div. 4ms/div.
PWM Dimming in Steady State PWM Dimming

Dimming frequency = 500Hz Start-up through VIN
CH2: VIN
VFAULT
10V/div.
10V/div.
CH1:
CH2: VEN/DIM
VEN/DIM
5V/div.
5V/div.
CH3: ILED
1A/div. CH3: ILED
CH4: IL 1A/div.
2A/div. CH4: IL
CH1: VSW
2A/div.
10V/div.
VSW
10V/div.
1ms/div. 10ms/div.


otherwise noted.
PWM Dimming Two-Step Dimming

Shutdown through VIN Steady state
CH2: VIN
VFAULT
10V/div.
10V/div.
CH1: VEN/DIM CH3: ILED
5V/div. 1A/div.
CH3: ILED CH2:
VLED+ - VLED-
1A/div.
10V/div.
CH4: IL CH4: IL
2A/div. 2A/div.
VSW CH1: VSW
10V/div. 10V/div.
10ms/div. 1ms/div.

Start-up through VIN Shutdown through VIN
CH2: VIN CH2: VIN

5V/div. 5V/div.
CH3: ILED CH3: ILED
1A/div. 1A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW

10V/div. 10V/div.
2ms/div. 2ms/div.
LED open VIN start-up LED open entry
VFAULT
10V/div.
CH3: VIN
CH3: ILED
5V/div.
1A/div.
CH1: VFAULT
CH2:
5V/div. VLED+ - VLED-
CH2:
10V/div.
VLED+ - VLED-
10V/div. CH4: IL
2A/div.
CH4: IL
CH1: VSW
5A/div.
10V/div.
VSW
20V/div.


otherwise noted.

CH1:
CH3: VIN
VLED+ - VLED-
10V/div. 10V/div.
CH1: VFAULT CH2:
10V/div. VFAULT
CH2: 10V/div.
VLED+ - VLED-
CH3: ILED
10V/div.
1A/div.
CH4: IL
CH4: IL
2A/div.
2A/div.
VSW
VSW
20V/div.
20V/div.
20ms/div. 10ms/div.

CH2:
CH3: VIN
VFAULT
10V/div. 10V/div.
CH1: VFAULT
CH3: ILED
10V/div.
CH2: 1A/div.
VLED+ - VLED- CH4: IL
10V/div.
2A/div.
CH4: IL CH1:
2A/div. VLED+ - VLED-
VSW 10V/div.
20V/div.
10ms/div. 2ms/div.
LED+ short to LED-, VIN start-up LED+ short to LED- entry
VFAULT
10V/div.
CH3: VIN CH2:
VLED+ - VLED-
5V/div.
10V/div.
CH2:
VFAULT CH3: ILED
5V/div. 1A/div.
CH4: IL CH4: IL
1A/div. 2A/div.
CH1: VSW
CH1: VSW 10V/div.
5V/div.


otherwise noted.

VFAULT
10V/div.
CH2:
VLED+ - VLED-
CH3: VIN 10V/div.
5V/div. CH3: ILED
CH2: VFAULT 1A/div.
5V/div.
CH4: IL
CH1: VSW
2A/div.
5V/div.
CH1: VSW
CH4: IL 10V/div.
1A/div.
10ms/div. 10ms/div.

CH2:
VLED+ - VLED-
10V/div.
CH3: VIN CH3: ILED
5V/div. 1A/div.
CH2: VFAULT
5V/div. CH4: IL
CH1: VSW 2A/div.
5V/div. CH1: VSW
CH4: IL 10V/div.
1A/div.
10ms/div. 2ms/div.
IREF Short Fault before VIN Start-

IREF Open Fault before VIN Start-Up
Up
CH3: VIN CH3: VIN

10V/div. 10V/div.
CH2: VFAULT CH2:

VFAULT
10V/div. 10V/div.
CH4: IREF CH4: IREF

2V/div. 2v/div.
CH1: VSW CH1: VSW
10V/div. 10V/div.
10ms/div. 10ms/div.


otherwise noted.
IREF Short Fault after VIN Start-Up IREF Open Fault after VIN Start-Up
CH2:
CH2: VFAULT VFAULT
10V/div. 10V/div.
CH3: ILED CH3: ILED

1A/div. 1A/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW

10V/div. 10V/div.
4μs/div. 10μs/div.
ISET Short Fault before VIN Start-

ISET Open Fault before VIN Start-Up
Up
CH3: VIN CH3: VIN

10V/div. 10V/div.
CH2: VFAULT CH2:

VFAULT
10V/div. 10V/div.
CH4: ISET CH4: ISET

2V/div. 2V/div.
CH1: VSW CH1: VSW
10V/div. 10V/div.
10ms/div. 10ms/div.
ISET Short Fault after VIN Start-Up ISET Open Fault after VIN Start-Up
CH2: VFAULT CH2:

VFAULT
10V/div. 10V/div.
CH3: ILED
CH3: ILED 1A/div.
1A/div. CH4: IL
CH4: IL 2A/div.
2A/div.
CH1: VSW CH1: VSW
10V/div. 10V/div.
2μs/div. 4μs/div.


otherwise noted.
IDUTY Short Fault before VIN Start- IDUTY Open Fault before VIN Start-
Up Up
CH3: VIN CH3: VIN

10V/div. 10V/div.
CH2: VFAULT CH2:

VFAULT
10V/div.
10V/div.
CH4: IL CH4: IL
2A/div. 2A/div.
CH1: VSW CH1: VSW
10V/div. 10V/div.
10ms/div. 10ms/div.
Wrong Mode Detection during VIN

Start-Up
CH3: VIN
10V/div.
CH2: VFAULT
10V/div.
CH4: IL
1A/div.
CH1: VSW
10V/div.
10ms/div.

FUNCTIONAL BLOCK DIAGRAM

VCC IN
VIN
EN/DIM Shutdown VCC
Logic
VCC Bootst rap
INGND 2-Step Regulator Regulator
ING ND DIM
FAULT Low
IDU TY BST
2-Step HS
DUTY Dim ming Driver
Detect ion Osc illa tor Com pa rat or SW
0.57V HSCS On Time
IREF MODE
Control and VCC
(Buck/Buck-Boost)
MODE Logic
IREF Detect ion Consta nt Control
0.592V Fre quency Band-to- LS
Band Control Driver
ISET VREF
LSCS
IREF
INTC Power
Derating
ILED - LC
NTC 60mA/120mA +
OT 165°C
LPF
VIN 3.15A/6.3A - OC TJ
HSCS +
UV/MODE
300kΩ DUTY Fault Indic ator Fault 1.35V
Pin
Logic Buck
IRE F Short/Open
FAULT Detect ion
ISET
Buck MODE OV Buck-

4MΩ
Fault Boo st
ING ND + 18V
1.35V -
AGND PGND
Figure 1: Functional Block Diagram

OPERATION
The MPQ7200 is a high-frequency, synchronous mode). A duty cycle hysteresis (DTH_HYS, 10% in
rectified, buck-boost or buck, switch-mode LED buck mode or 20% in buck-boost mode) is used
driver with built-in power MOSFETs. It offers a to frequently avoid the current-sense switches
very compact solution to achieve up to 1.2A of between the HS-FET and LS-FET at the critical
continuous output current in buck-boost duty cycle.
topologies and 3A in buck topologies, with
excellent load and line regulation across a 6V to Sense FET
42V input supply range. HS-FET Sense
Fixed-Frequency Band-to-Band Control

The MPQ7200 uses fixed-frequency band-band
control and a spread spectrum technique to
reduce EMC noise. Compared to fixed- LS-FET Sense DTH_HYS
frequency PWM control, band-to-band control Duty
DTH_L DTH_H Cycle
offers the advantage of a simpler control loop
and faster transient response. Even without an Figure 2: Current-Sense MOSFET vs. Duty Cycle
output capacitor, the loop is stable. Band-band
control compares the inductor current to the The LED current is equal to ILMID in buck
internal thresholds (IBANDPEAK and IBANDVALLEY). topologies, but is equal to ILMID x VIN / (VIN + VOUT)
in buck-boost topologies.
If the inductor current exceeds IBANDPEAK, the
high-side MOSFET (HS-FET) turns off. If the Buck and Buck-Boost Mode Selection
inductor current drops below IBANDVALLEY, the HS- The MPQ7200 can be configured to a buck or
FET turns on. (IBANDPEAK + IBANDVALLEY) / 2 is buck-boost topology by connecting a different
controlled by a PID loop to regulate the LED resistor at the IREF pin (RIREF). The middle point
current. IBANDPEAK - IBANDVALLEY is controlled by a of the inductor current (ILMID) is sensed through a
PLL loop to regulate the switching frequency to sensing FET. The LED current is equal to ILMID in
be 2.3MHz in buck mode or 1.15MHz in buck- buck topologies, but is equal to ILMID x VIN / (VIN +
boost mode. If the minimum on time (tON_MIN) or VOUT) in buck-boost topologies.
minimum off time (tOFF_MIN) are triggered, the
Mode detection starts when VCC reaches its
switching frequency is extended and the real
under-voltage lockout (UVLO) threshold (4.7V).
switching frequency is D / tON_MIN, or (1 - D) /
A 240µA current source (IREF_DET) flows out of the
tOFF_MIN, where D is the required duty cycle and
IREF pin to detect the resistor voltage value on
tON_MIN and tOFF_MIN are both 80ns maximum.
the pin when the device powers on. If the voltage
The additional spread spectrum uses a 15kHz generated by IREF_DET x RIREF is below 2.6V, buck-
modulation frequency with a triangular profile to boost mode is selected. If IREF_DET x RIREF
spread the internal oscillator frequency over a exceeds 2.8V, buck mode is selected. This
±10% nominal switching frequency window means the corresponding RIREF for buck-boost
(1.15MHz in buck mode or 2.3MHz in buck-boost mode is ≤9.09kΩ and ≥14.7kΩ for buck mode.
mode). To avoid triggering a short on IREF in buck-boost
mode, or an open fault on IREF in buck mode,
Middle-Point Inductor Current Sense
the IREF resistor should be set between 1.05kΩ
The MPQ7200 senses the LED current by and 9.09kΩ for buck-boost mode, and between
sensing the middle point of the inductor current 14.7kΩ and 80.6kΩ for buck mode.
(ILMID). ILMID is sensed through the HS-FET or low-
side MOSFET (LS-FET) depending on the duty Once the detection finishes, the mode is latched
cycle. ILMID is sensed through the HS-FET when and IREF becomes 0.57V / RIREF, which is the
the duty cycle exceeds DTH_H (55% in buck mode reference for the NTC pin current. The latched
or 60% in buck-boost mode), and is sensed mode signal is reset by the VCC under-voltage
through the LS-FET when the duty cycle is below lockout (UVLO) threshold, but cannot be reset by
DTH_L (45% in buck mode or 40% in buck-boost EN/DIM going low. An internal 1MHz filter and
250µs deglitch time protect the part from false

mode detection caused by noise coupling at the Enable (EN) Control

pin. To ensure that the detected mode is When two-step dimming is not active (see the
consistent with the real topology connection, the Two-Step Dimming section on page 43), EN/DIM
INGND - PGND voltage is monitored. If INGND - is the control pin that turns the LED driver on and
PGND exceeds 1.35V in buck mode, or INGND off. Drive (VEN/DIM - VINGND) above 2.5V to turn the
- PGND is below 1.35V in buck-boost mode device on; drive it below 1.58V for >25ms to turn
(detected as an output under-voltage condition), the device off and reset FAULT. The MPQ7200
the part latches off and asserts FAULT. starts thermal detection at the first positive edge
Internal Regulator of the EN/DIM signal, which causes an about
0.9ms delay between when EN/DIM turns on and
The 5.1V internal regulator (VCC) powers most
when the device starts operating.
of the internal circuitries. VCC is ready once VIN
reaches its rising UVLO threshold, regardless of When two-step dimming is active, the MPQ7200
whether EN is high or low. VCC is the reference automatically turns on once VIN and VCC exceed
for PGND and AGND, but not INGND. In buck- their respective UVLO thresholds, and EN is
boost mode, VCC cannot have the same ground configured to be the two-step dimming control
level as INGND. In buck-boost mode, the device pin. Driving EN/DIM high selects a 100%
takes either VIN or VINGND as the input. If (VINGND dimming duty, and driving it low selects an
- VPGND) < 5.1V, VCC is powered from VIN. If adjustable dimming duty set by the DUTY pin.
(VINGND - VPGND) > 5.1V, the input of the VCC EN cannot reset the FAULT pin in two-step
regulator switches to VINGND to reduce power dimming mode.
loss.
An internal 1MΩ resistor between the EN/DIM
Once the power of VCC switches to INGND, VIN and INGND pins allows EN/DIM to be floated to
will not power VCC until VINGND - VPGND drops shut down the chip. An integrated Zener diode is
below 4.8V. A small VCC capacitor causes VCC in parallel with the EN/DIM pin to clamp EN/DIM
voltage ringing, and the switch may become to about 7V (see Figure 3). EN/DIM can be
unstable. To address this, a ≥3µF decoupling connected to VIN using a pull-up resistor in both
ceramic capacitor should be placed close to the buck mode and buck-boost mode, or to VCC in
VCC pin. When selecting a VCC capacitor, buck mode for automatic start-up (once VIN and
consider the capacitance derating to ensure that VCC exceed their respective UVLO thresholds). It
the real capacitance ≥3µF. It is recommended to is recommended to use a 100kΩ resistor to limit
use a 10µF X7R capacitor with ≥10V DC rated the EN/DIM input current to be below 1mA.
voltage. VCC has its own UVLO, with a 4.7V
rising and 4.05V falling threshold. In addition to EN/DIM
powering the internal circuitries, VCC can also
power external circuitries in the system, with a EN/DIM
7V 1MΩ
Logic
current capability of 25mA.
INGND
Continuous Conduction Mode (CCM) and
Discontinuous Conduction Mode (DCM)
Figure 3: Internal EN/DIM Circuit
The MPQ7200 uses continuous conduction
mode (CCM) to ensure that the part works with ISET
fixed frequency from minimum loads to full loads. The average LED current can be configured by
The advantage of CCM is its controllable connecting a resistor (RISET) at the ISET pin. The
frequency and lower output ripple at light-load. If LED current can be calculated with Equation (1):
IBANDVALLEY = 0A, the MPQ7200 enters
discontinuous current mode (DCM), the LS-FET ILED (A) = 16 / RISET (kΩ) (1)
acts as an ideal diode. Select an inductor that The nominal voltage of the ISET pin (VISET) is
ensures that the part does not enter DCM, even 0.592V. VISET can be set below 0.592V to
during power or thermal derating. Otherwise, the decrease the LED current in the event of power
LED current precision is not guaranteed. derating or thermal derating.

During the mode detection period during start-up The IREF pin is also continuously monitored to
in buck mode, the ISET current is monitored to detect open and short-to-GND conditions.
detect if the LED current is set above or below
If the IREF current exceeds 90µA in buck mode
600mA. If IISET > 22.2µA during this period, the
(corresponding to a 6.3kΩ resistor) or 900µA in
LED current setting is detected as >600mA, and
buck-boost mode (corresponding to a 0.63kΩ
the MOSFETs fully turn on. If the LED current
resistor), the pin detects a short to GND. If the
setting is detected as <600mA, then half the
IREF current is below 3µA in buck mode
MOSFETs are cut off to improve current-sense
(corresponding to a 190kΩ resistor) or 40µA in
accuracy. When half the MOSFETs are cut off,
buck-boost mode (corresponding to a 14.3kΩ
the current limit drops from 6.3A to 3.15A. The
resistor), the pin detects an open fault.
signal to indicate if the LED current is above or
below 600mA is latched once detection finishes, If a fault is detected, the part latches off,
and only can be reset by VCC UVLO. After LED regardless of whether the FAULT pin asserts.
current detection, the MOSFET’s RDS(ON) does FAULT asserts low immediately if the pin
not change, even if the current setting exceeds experiences a short or an open fault after start-
or falls below 600mA. up. During start-up, there is a 25ms-to-40ms
delay for FAULT assertion.
During normal operation, the ISET pin is
continuously monitored to detect open or short- Pulse-Width Modulation (PWM) Dimming
to-GND conditions. If the ISET current exceeds When two-step dimming is disabled (RDUTY =
a specific value, a pin short to GND is detected. 4.87kΩ), an external 100Hz to 2kHz PWM
In buck-boost mode, the MOSFET is always on, waveform can be applied to the EN/DIM pin for
regardless of the current. PWM dimming. In external PWM dimming mode,
If the LED current is set below 600mA, the ISET the part stops switching when EN/DIM drops
current threshold for short detection is 120µA below 1.58V and the LED current is 0A. The part
(corresponding to a 4.9kΩ resistor or 3.24A ILED). resumes normal operation with a nominal LED
If the LED current is set above 600mA, the current when EN/DIM exceeds 2.5V. The
threshold is 220µA (corresponding to a 2.7kΩ average LED current is proportional to the PWM
resistor or 5.9A ILED). duty, and its accuracy can be up to ±15% when
VIN = 13.5V ± 0.5V and TJ is between 25°C and
If the ISET current drops below 1.4µA 100°C.
(corresponding to 428kΩ resistor or 37.3mA ILED),
a pin open fault is detected. The EN/DIM high voltage period should always
be longer than 100µs. Otherwise, the MPQ7200
The part latches off if an open or short fault is may stop switching and not latch if an LED open
detected on the ISET pin, regardless of whether fault is detected.
FAULT is asserted. FAULT is asserted if the
ISET pin experiences a short or open fault after To avoid the part going into shutdown mode, the
start-up. There is a 25ms-to-40ms delay for EN/DIM pin should not go low for longer than
FAULT assertion during start-up. 10ms (the EN turn-off delay).
IREF If a PWM signal is applied to EN/DIM once
The IREF pin configures the device for buck or EN/DIM turns on, there is an about 0.9ms delay
buck-boost mode (see the Buck and Buck-Boost (due to thermal detection) before the MPQ7200
Mode Selection section on page 41), and starts switching and the following the PWM
afterward sets the current in the external NTC. dimming signal.
After the mode is detected, the voltage of the Two-Step Dimming
IREF pin (VIREF) is set to 0.57V with a 10.5% When VCC reaches its UVLO rising threshold
tolerance. Connect a resistor between IREF and (typically 4.7V), two-step dimming detection is
AGND (RIREF) to get a current (IREF) equal to activated on the DUTY pin. First, a 45μA current
0.57V / RIREF. This current is used as the source (IDUTY1) with a ±11% tolerance flows
reference current for the NTC’s current source. through the resistor between the DUTY pin and
The NTC current is 50 times that of IREF in buck GND.
mode and 5 times that of IREF in buck-boost mode.

If the generated voltage (VDUTY) exceeds 3.347V, tolerance. This starts another round of VDUTY
an open fault is detected; then the part latches detection. If VDUTY > 2.235V in this round, two-
off and FAULT is asserted. If 0.302V < VDUTY < step dimming is disabled. Then the part can be
3.347V, the two-step dimming functionality is turned on/off through EN/DIM, or can work in
activate. Table 1 shows the available two-step normal PWM dimming by applying a dimming
dimming duty cycles. signal at EN/DIM. If VDUTY < 0.302V, a pin short
fault is detected; then and the part latches off
If VDUTY is below 0.302V, DUTY’s current source
and FAULT asserts.
increases to 600µA (IDUTY2), with a ±8.75%
If 0.302V < VDUTY < 2.235V, then two-step <100% dimming is implemented as PWM
dimming is enabled, and the two-step dimming dimming, but not analog dimming. When two-
duty cycle is determined by the detailed VDUTY. step dimming is activated at IDUTY1, the dimming
After duty detection finishes, the duty is not duty can be set between 10% and 15%, with a
affected by changing VDUTY, even if the DUTY pin 1% step. VDUTY is between 0.302V and 3.347V,
experiences an open or short-to-GND fault. with a 33% reduction for each step. When two-
step dimming is activated at IDUTY2, the dimming
Once two-step dimming is enabled, PWM
duty can be set between 5% and 9%, with a 1%
dimming is disabled. Then the EN/DIM pin is
step. VDUTY is between 0.302V and 2.235V, with
used as the input pin to select no dimming or low
a 33% reduction for each step. Table 1 shows
dimming. When the EN/DIM pin is high, a 100%
the relationship between two-step dimming duty
dimming duty cycle is selected; when EN/DIM is
and the VDUTY window while considering different
low, there is an adjustable dimming duty cycle
VDUTY tolerance thresholds.
determined by IDUTY and VDUTY (see Table 1). The
device can switch between different dimming
values in less than 20ms.
Table 1: Two-Step Dimming Duty vs. VDUTY Window
Corresponding VDUTY Window
Two-Step Dimming Duty
VDUTY_H VDUTY_L
IDUTY1 IDUTY2 Min Typ Max Min Typ Max
Latch No two-step 4.018 4.100 4.182 3.280 3.347 3.414
15% dimming 3.280 3.347 3.414 2.190 2.235 2.279
14% 9% 2.190 2.235 2.279 1.460 1.489 1.519
13% 8% 1.460 1.489 1.519 0.969 0.989 1.009
12% 7% 0.969 0.989 1.009 0.634 0.653 0.673
11% 6% 0.634 0.653 0.673 0.407 0.428 0.449
10% 5% 0.407 0.428 0.449 0.28 0.302 0.33
To IDUTY2 Latch 0.28 0.302 0.33 N/A
Ensure that the VDUTY window is between VDUTY_H 9% 3090

and VDUTY_L when selecting RDUTY to remove 8% 2050
potential for error. To select a precise dimming 7% 1370
value, use an E96 series resistor (see Table 2). 6% 887
5% 576
Table 2: Two-Step Dimming Duty vs. RDUTY
Two-Step Dimming Duty RDUTY (Ω) Table 2 shows the proposed RDUTY in E96 series
15% 61900 for different two-step dimming duties. These
14% 41200 values consider the IDUTY tolerance and ±3%
13% 27400 resistor tolerance.
12% 18200 If VCC drops below 4.05V before two-step
11% 12100 dimming detection is finished, two-step dimming
10% 7870
detection stops. Two-step dimming does not
PWM dimming (two-step
dimming inactivated)
4870 restart unless VCC rises to 4.7V. The two-step
dimming signal and two-step dimming duty are

latched once detection finishes, and only can be in buck-boost mode, then the VIN - INGND
reset by VCC under-voltage lockout (UVLO), not voltage is below its UV threshold, and the FAULT
EN shutdown. The two-step dimming frequency signal cannot be asserted. If LED- (PGND) is
is typically about 500Hz (±50Hz). shorted to INGND, then the INGND voltage is
below the INGND UV threshold and FAULT is
Under-Voltage Lockout (UVLO)
asserted. If LED is open, then INGND exceeds
Under-voltage lockout (UVLO) protects the chip its OV threshold and FAULT is asserted.
from operating at an insufficient supply voltage.
Both VIN - VINGND and VCC have UVLO At high temperatures, the part operates normally
thresholds. VIN - VINGND has a 6V rising UVLO with a reduced current level. The parts only stops
threshold with a 1.1V hysteresis, while VCC has operating if the internal temperature reaches
a 4.7V rising UVLO threshold with a 0.65V 170°C. Then over-temperature protection (OTP)
hysteresis. VIN and VCC UVLO do not trigger a is triggered, and FAULT is asserted.
fault. If any fault occurs, the part stops switching, then
Fault Detection Indicator the FAULT output asserts in 20μs, and the part
is latched off. While the part is latched off, VCC is
The MPQ7200 has fault indication (see Table 3
still present and the part consumes a <2mA
on page 46). The FAULT pin is the open drain of
current.
a MOSFET. FAULT is internally pulled up to VIN
through a 300kΩ resistor, and pulled down to FAULT can be reset by VCC UVLO. If the device
IGND with a 4MΩ resistor. The FAULT pin is is not operating with two-step dimming mode, an
pulled high during normal operation. FAULT is EN shutdown (EN being driven low for longer
pulled low if any of the following faults occur: than 25ms) can also reset the FAULT pin.
LED short or open, thermal shutdown, false While the device powers on, the FAULT pin may
mode detection, or over-current protection stay inactive for about 25ms, but it is active by
(OCP). This indicates a fault status. If the ISET 40ms. During PWM dimming, the FAULT
or IREF pin experiences a short or open fault counter works only when the dimming signal is
after the chip starts up, the FAULT pin can be high, so the inactive time is 30ms/PWM dimming
asserted. If there is a short or open fault on the duty. This prevents false system functions when
IDUTY pin, FAULT only asserts if the fault is multiple parts have connected FAULT pins and
detected before start-up. share the same EN signal. However, individual
The MPQ7200 senses the output by monitoring parts are self-protected and latch off immediately
the average voltage on SW in buck mode, and if a fault condition is detected, regardless of
the INGND voltage in buck-boost mode. If LED+ whether FAULT asserts.
shorts to LED- or PGND, or if the output voltage The FAULT pin can withstand a 30mA current
drops below the under voltage (UV) threshold, and protect itself even if the pin shorts to a high
then a short circuit is detected and FAULT voltage (e.g. the battery voltage). If FAULT is low
asserts. If an LED open fault occurs, output over- (<1.6V), FAULT’s sink current increases to
voltage (OV) conditions are detected in buck- enhance the pull-down capability. Figure 4
boost mode, or a low HS-FET current is detected shows a detailed FAULT sink current when the
in buck mode, then FAULT asserts. FAULT pin is pulled low to a different voltage.
The low-current rising threshold is 82mA, with a 100
22mA hysteresis if the LED current is falling and
below 600mA, or is 166mA with a 46mA 80
hysteresis if the LED current is falling and
60
exceeds 600mA in buck mode. The low-current
IFAULT (mA)
rising threshold is 166mA with a 46mA 40

hysteresis if the LED current is falling in buck-
boost mode. In buck mode, low-current detection 20
is disabled when VIN drops below 7.5V to stop
0
the part from latching under cold-crank 0.1 1 10 100
conditions. If LED+ (INGND) shorts to the battery VFAULT (V)

Figure 4: FAULT Sink Current vs. FAULT Voltage

During PWM dimming or two-step dimming, fault
conditions may not be properly detected when
the dimming on time is shorter than 100μs.
Ensure that the dimming on time is always longer
than 100μs so that fault detection operates
correctly.

Table 3: Fault Detection (8)

Detection
Fault Condition
Buck Buck-Boost
INGND UV (VINGND - VPGND <
LED+ shorted to LED- VOUT under-voltage (UV) (VOUT < 1.1V)
1.35V) (9)
LED+ shorted to PGND VOUT UV (VOUT < 1.1V)
1.35V)
LED+ shorted to INGND VOUT UV (VOUT < 1.1V) Normal conditions
Cannot assert FAULT due to
LED+ shorted to battery Low LED current
VIN - VINGND UVLO
LED- shorted to INGND Normal conditions
1.35V)
LED- shorted to battery Cannot assert FAULT due to VIN - VINGND UVLO N/A (10)
INGND OV (VINGND - VPGND >
LED open fault Low LED current
18V)
MODE detection INGND UV (VINGND - VPGND <
VINGND - VPGND > 1.35V
Is incorrect 1.35V)
Over-temperature
TJ > 170°C, or 0.18V < VNTC < 0.38V for longer than 256µs
protection (OTP)
(IISET > 120µA when ILED_SETTING < 600mA)
ISET short fault (11) IISET > 110µA
(IISET > 220µA when ILED_SETTING > 600mA)
ISET open fault (11) IISET < 1.4µA
(11)
IREF short IIREF > 90µA IIREF > 900µA
IREF open fault (11) IIREF < 3µA IIREF < 40µA
(12)
DUTY open fault VDUTY1 > 3.355V
(12)
DUTY short fault VDUTY2 < 0.302V
Over-current protection
Current limit triggered 3 consecutive times
(OCP)
ILED_RISIING < 82mA with a 22mA hysteresis if the
LED current is falling when ILED_SETTING < 600mA; ILED_RISING < 166mA with a
Low LED current
46mA hysteresis if the LED
protection (13) ILED_RISING < 166mA with a 46mA hysteresis if the current is falling
LED current is falling when ILED_SETTING > 600mA
Notes:
8) If a fault mentioned in this table is detected, the part latches off and FAULT is asserted.
9) The FAULT pin may not work correctly if INGND - PGND is pulled below -0.3V or if an LED+ short to LED- occurs with a long cable.
10) Not applicable. If an LED- short to battery in buck-boost mode occurs, the negative voltage (VINGND-PGND) may cause damage to the IC.
11) The part latches off and FAULT asserts if the ISET or IREF pins experience a short or open fault before or after start-up.
12) The part latches off and FAULT asserts if an IDUTY pin short or open fault occurs before start-up. After start-up, an IDUTY short or open
fault cannot be detected.
13) To avoid unintentionally triggering low LED current protection, the LED current should not be set below the low LED current rising threshold.
The LED current also should not be below the low LED current rising threshold while power derating is active in buck-boost mode.

Over-Current Protection (OCP) NTC Thermal Derating

The MPQ7200 has cycle-by-cycle peak current Connect an NTC resistor network to the NTC pin
limit protection. The inductor current is monitored to reduce the output current via analog dimming.
while the HS-FET is on. If the inductor current This is especially useful when the sensed
exceeds the current limit value (about 6.3A when temperature exceeds the configured value. The
the LED current is set above 600mA, and 3.15A LED current drops as the temperature rises. The
when the LED current is set below 600mA, the activation of NTC and the dimming ratio are
HS-FET turns off immediately. Then the LS-FET determined by the three-step NTC voltage (VNTC)
turns on to discharge the energy, and the detection (see Figure 5).
inductor current decreases. The HS-FET INTC
remains off unless the inductor current falls to 0A,
250µs 250µs 400µs
at which point another HS-FET on cycle starts. If 5 or 50 x
the over-current (OC) condition is still present IREF INTC2
after three consecutive retries, the part latches INTC1

7.6µA
off and reports a failure as the FAULT pin is
asserted.
VNTC
Load Dump Protection VNTC2
The MPQ7200’s internal MOSFETs have a 50V
absolute maximum rating, and a maximum 42V VNTC1
operating voltage. In buck topologies, this
maximum voltage can handle load dump t1 t2 t3
Open Short VNTC Sense for
conditions up to 42V. Detection Detection Thermal Derating
Figure 5: INTC Timing

In buck-boost topologies, the voltage difference
between VIN and PGND is the sum of the car At t1 and t2, the voltage on the NTC pin is
battery’s voltage plus the LED voltage. Under detected to determine if the NTC is enabled. t1
load dump conditions, the MPQ7200 can exceed and t2 both last for 250µs. At t3, VNTC is sensed.
its maximum value. The dimming ratio is generated at the end of t3.
t3 lasts for 400µs.
To protect the part under load dump conditions
in buck-boost mode, the MPQ7200 stops During t1, the detection current (INTC1) is 7.6µA;
switching if VIN - VPGND exceeds 40V. A 100mA during t2, it is 50 times IREF (in buck mode) or 5
sink current at INGND is activated to discharge (in buck-boost mode) times IREF (INTC2). To
the output voltage, so the MOSFET only detects activate NTC thermal derating, the NTC voltage
the VIN voltage stress. The part automatically should be below 2V (with a <263kΩ resistor)
restarts when VIN - VPGND drops back to 39V. during t1 (VNTC1), and above 0.38V (with a
Load dump protection does not always trigger a resistor that is based on the values of VNTC2 and
fault, and it is not active in buck mode. Load INTC2) during t2. If VNTC1 exceeds 2V during t1, an
dump protection can reset the FAULT status open pin fault is detected. If VNTC2 falls below
caused by other fault conditions, but it cannot 0.18V during t2, a short fault is detected. An
reset the MPQ7200 if the part is latched. open or short fault deactivates NTC thermal
derating.
Power Derating
If VIN is below a specific voltage (typically 7V) in To avoid triggering an open fault, VNTC1 must be
buck-boost mode, the power derating starts. The below 2V, even if the NTC value is large at low
LED current drops linearly with VIN due to analog temperatures. To avoid triggering a short fault,
dimming. Derating continues until VIN reaches VNTC2 must exceed 0.18V, even if the NTC
the under-voltage lockout (UVLO) threshold, resistor is small at high temperatures.
then the LED current drops by 29% . During If NTC thermal derating is activated at the end of
start-up, power derating is enabled in buck-boost t2, VNTC2 is sensed during t3 to indicate the real
mode. Power derating is always disabled in buck temperature and determine the dimming ratio.
mode.

The dimming ratio decreases as VNTC2 Floating Driver and Bootstrap Charging
decreases, starting when VNTC2 drops below An external bootstrap capacitor powers the
1.25V. The dimming ratio decreases by a step of floating power MOSFET driver. The bootstrap
2% if VNTC2 drops by 30mV. If VNTC2 falls to 0.5V, capacitor voltage is charged to about 5V from
the dimming ratio decreases to 50%. This means VCC through a pass transistor when the LS-FET
the LED average current also falls to 50% of the is on.
set LED current.
This floating driver has its own under-voltage
If VNTC2 continues to drop, and is between 0.5V lockout (UVLO) protection, with a rising
and 0.38V, the thermal derating stays at 50%. If threshold of 2.5V and hysteresis of 700mV. If the
VNTC2 is between 0.38V and 0.18V, the part BST-to-SW voltage drops to 2.2V, the LS-FET
latches off due to a thermal shutdown event and turns on to refresh the BST voltage. It is
the device asserts the FAULT pin. The device recommended to use a 47nF to 220nF ceramic
restarts only after it is turned off then on again, capacitor for the bootstrap capacitor. Consider
or if EN is reset. If the voltage drops below 0.18V, the capacitor’s DC voltage and temperature
the NTC pin is considered shorted to PGND, and derating when selecting the capacitor to ensure
the NTC circuitry is deactivated. that the real capacitance is between 47nF and
If the NTC pin is floating or connected to PGND, 200nF. A maximum 22Ω resistor can be placed
the LED current decreases to 50% of the set in series with the bootstrap capacitor to reduce
LED current. Connect a 10kΩ resistor between SW voltage spikes.
the NTC and PGND pins to disable the NTC The part integrates BST capacitor open
thermal derating function. detection functionality. When VIN and VCC
Thermal Shutdown (TSD) reach their under-voltage lockout (UVLO) rising
thresholds, the BST capacitor is charged after
Thermal shutdown prevents the chip from
the 1ms thermal derating finishes. If the voltage
operating at exceedingly high temperatures. If
on the BST capacitor reaches the UVLO rising
the die temperature exceeds 170°C, the entire
threshold in 45µs, the part detects a BST open
chip shuts down, and FAULT is asserted. The
fault and latches off. If VIN restarts frequently,
device restarts only after being turned off then on
the BST capacitor may not be able to discharge
again, or if EN is reset.
sufficiently, and an open fault may be
mistriggered. To avoid a mistrigger, place a
small BST capacitor and a bleeding resistor in
parallel with the BST capacitor. This ensures that
the BST capacitor voltage is sufficiently low after
a restart. It is recommended to use a 22nF
capacitor and 15kΩ resistor (see Figure 7 on
page 52).

APPLICATION INFORMATION
Selecting Buck or Buck-Boost Mode
700
The device can be configured for buck or buck-
boost mode by connecting a different resistor at 650
the IREF pin (RIREF). Select a 1.05kΩ ≤ RIREF ≤ 600
9.09kΩ resistor for buck-boost mode, and a
ILED (mA)
14.7kΩ ≤ RIREF ≤ 80.6kΩ resistor for buck mode. 550
Dimming Mode Selection 500
The dimming mode can be configured by 450

connecting a different resistor at the IDUTY pin 400
(RIDUTY). Select a 4.87kΩ resistor to disable the 20.0 25.0 30.0 35.0 40.0
internal PWM dimming function and enable RISET (kΩ)
external PWM dimming. Table 2 on page 44 lists Figure 6: ILED vs. RISET in BBI Mode when ILED ≤
resistors for two-step dimming, if that function is 700mA
required.
Set the LED current above 300mA in BBI mode.
Setting the LED Current If ILED_SETTING is below 600mA, set the LED
The external resistor connected to the ISET pin current above 60mA. If ILED_SETTING exceeds
sets the LED current. The value of the external 600mA, set the LED current to 120mA. This is to
resistor can be calculated with Equation (2): avoid triggering low LED current latch protection.
16 Selecting the Inductor
R3 = (k) (2)
ILED ( A ) For most applications, it is recommended to use
an inductor between 2.2µH and 33µH with a DC
If ILED is below 0.7A in buck-boost mode, certain
current rating that exceeds the maximum
resistors are recommended (see Table 4).
inductor current. Include the DC resistance of the
Table 4: Resistor Selection when ILED ≤700mA in inductor when estimating the output current and
Buck-Boost Mode the inductor’s power consumption.
ILED (A) RISET (kΩ) For buck mode, the required inductance value
0.7 22.6 can be estimated with Equation (3):
0.65 24.2 VOUT  (VIN − VOUT )
0.6 26.1 L= (3)
VIN  IL  fSW
0.55 23.2
Choose an inductor ripple current that exceeds
0.5 30.9
20% of the LED current. The inductor peak
0.45 34.0 current can be calculated with Equation (4):
0.4 37.4
ΔIL
Figure 6 shows the relationship between ILED and IL_PEAK = IL_AVG + (4)
2
RISET in buck-boost mode.
Where IL_AVG is the average current through the
inductor. In buck mode, IL_AVG is equal to the
output load current (LED current). Under light-
load conditions, use a larger-value inductor to
improve efficiency and current precision. Table 5
lists the recommended inductor values for
common LED currents in buck mode.

Table 5: Buck Mode Inductor Values for Common are highly recommended because of their low
LED Currents ESR and small temperature coefficients.
Recommended
ILED (A) For most applications, use a 4.7µF to 22µF
Inductor Value (µH)
capacitor. The input capacitor can be electrolytic,
[2A, 3A] 3.3 tantalum, or ceramic. When using electrolytic or
[0.8A, 2A) 4.7 tantalum capacitors, it is strongly recommended
[0.4A, 0.8A) 6.8 to use an additional lower-value capacitor (e.g.
[0.3A, 0.4A] 10 0.1µF) with a small package size (0603) to
absorb high-frequency switching noise. Place
For buck-boost applications, estimate the the smaller capacitor as close to VIN and GND
required inductance value with Equation (5): (INGND = PGND in buck mode, for both INGND
and PGND in buck-boost mode) as possible.
VOUT  VIN
L= (5)
( VOUT + VIN )  IL  fSW Since CIN absorbs the input switching current in
buck mode, the device requires an adequate
Where IL is the inductor’s peak-to-peak current ripple current rating. The RMS current in the
ripple. input capacitor can be estimated with Equation
(8):
IL should exceed 25% of the inductor average
current when ILED > 0.7A. Select IL to exceed VOUT V
20% of the inductor average current when ILED < ICIN = ILOAD   (1 − OUT ) (8)
0.7A. IL_AVG can be calculated with Equation (6): VIN VIN
IL _ AVG = ILED  (1 +
VOUT
) (6) The worst-case condition occurs at VIN = 2VOUT,
VIN calculated with Equation (9):
The peak inductor current can be calculated with ILOAD
ICIN = (9)
Equation (7): 2
ΔI L For simplification, choose an input capacitor with
IL_PEAK = IL_AVG + (7)
2 an RMS current rating greater than half of the
maximum load current. The input voltage ripple
Under light-load conditions, use a larger-value caused by the capacitance can be estimated
inductor to improve efficiency and current with Equation (10):
precision. Table 6 lists the recommended
inductor values for common ILED currents in buck- ILOAD V V (10)
VIN =  OUT  (1 − OUT )
boost mode. fSW  CIN VIN VIN
Table 6: Buck-Boost Mode Inductor Values for If IBANDVALLEY ≥ ILED in buck-boost mode, the
Common ILED Currents capacitance can be calculated with Equation
Recommend (11):
ILED (A)
Inductor Value (µH)
ILED  VOUT
(1A, 1.2A] 3.3 ΔVIN = (11)
(0.8A, 1A] 4.7 (VIN + VOUT )  fSW  CIN
(0.6A, 0.8A] 6.8 In buck-boost mode, consider the capacitor
[0.4A,0.6A] 10 between VIN and PGND for VCC regulator
stability and improved EMC performance. If
Selecting the Input Capacitor (VINGND - VPGND) > 5.1V, the input of the VCC
The device has a discontinuous input current in regulator switches to VINGND to reduce power
both buck and buck-boost mode, and requires a loss. Place a 0.44µF to 1.2µF ceramic capacitor
capacitor to supply AC current to the converter between VIN and PGND to stabilize VCC when
while maintaining the DC input voltage. For the the VCC charging source changes from VIN to
best performance, use low-ESR capacitors. INGND. Two symmetric (0.1µF + 0.47µF) / 50V
Ceramic capacitors with X5R or X7R dielectrics

X7R ceramic capacitors can be placed between Selecting the Diode from PGND to INGND in
VIN and PGND. Buck-Boost Mode
Selecting the Output Capacitor If the device is operating in buck-boost mode,
place a Schottky diode between INGND and
The output capacitor maintains the DC output
PGND to direct the charge current of the
voltage. Ceramic, tantalum, or low-ESR
capacitor connected between VIN and PGND,
electrolytic capacitors are recommended. For
especially when the VIN slew rate is high. When
the best results, use low-ESR capacitors to keep (VINGND - VPGND) < 5.1V, VCC is powered by VIN.
the output voltage ripple low. The VCC charge current flows from the VCC
In buck mode, the output voltage ripple can be capacitor to PGND, then back to INGND and
estimated with Equation (12): then the car battery. For this application, it is
recommended to use a Schottky diode with a low
VOUT V 1
ΔVOUT =  (1 - OUT )  (RESR + ) (12) forward voltage (VF) of about 0.32V, with a 1A
fSW  L VIN 8  fsw  COUT
current rating and >20V VRRM voltage. A
Where L is the inductor value, and RESR is the PMEG2010EPAS Schottky diode is
equivalent series resistance (ESR) value of the recommended.
output capacitor. Selecting the VCC Capacitor
For ceramic capacitors, the capacitance A small VCC capacitor causes ringing on VCC,
dominates the impedance at the switching and makes the MOSFET unstable. It is
frequency, and the capacitance causes the recommended to place a ≥3µF decoupling
majority of the output voltage ripple. For ceramic capacitor at the VCC pin. When
simplification, the output voltage ripple can be selecting a capacitor, consider the capacitance
estimated with Equation (13): derating to ensure that the real capacitance is at
least 3µF. A 10µF X7R with a ≥10V DC rated
VOUT V
VOUT =  (1 − OUT ) (13) voltage capacitor is recommend. VCC is the
8  fSW  L  COUT
2
VIN reference to PGND/AGND.
For tantalum or electrolytic capacitors, the ESR Selecting the BST Resistor and Capacitor
dominates the impedance at the switching It is recommended to place a resistor in series
frequency. For simplification, the output ripple with the BST capacitor to reduce the SW spike
can be estimated with Equation (14): voltage. A higher resistance reduces SW spikes,
but it also reduces efficiency. It is recommended
VOUT V to use a 22nF to 220nF ceramic capacitor with
VOUT =  (1 − OUT )  RESR (14)
fSW  L VIN 10/16V DC derating.
Consider efficiency and EMI performance when
If IBANDVALLEY ≥ ILED in buck-boost applications, the
choosing a resistor. Choose a maximum 22Ω
output capacitor can be calculated with Equation
resistor with a 0603/0402 package, as a large
(15):
package is not required. During normal
ΔVOUT = ILED  (RESR +
VOUT
) (15)
operation, the average current flowing through
fsw  COUT  (VIN + VOUT ) the bootstrap resistor is about 20mA in buck
mode and 10mA in buck-boost mode. If the
For tantalum or electrolytic capacitors, the ESR capacitor is shorted, the current inside the
dominates the impedance at the switching resistor is limited by the internal LDO. The device
frequency. For simplification, the output ripple can quickly detect a failure if the LED current
can be estimated with Equation (16): falls below its low limit. Then the part latches off,
ΔVOUT = ILED  RESR (16) and current is no longer sourced to the resistor.
A 0402 package can handle power dissipation
A 10µF to 22µF ceramic capacitor is sufficient for on the bootstrap resistor.
most applications. Two symmetric 4.7µF/25V
X7R ceramic capacitors can be placed between The part integrates BST capacitor open
LED+ and LED-. detection functionality. When VIN and VCC
reach their under-voltage lockout (UVLO) rising

thresholds, the BST capacitor is charged after

the 1ms thermal derating finishes. If the voltage
on the BST capacitor reaches the UVLO rising
threshold in 45µs, the part detects a BST open
fault and latches off. If VIN restarts frequently,
the BST capacitor may not be able to discharge
sufficiently, and an open fault may be
mistriggered. To avoid a mistrigger, place a
small BST capacitor and a bleeding resistor in
parallel with the BST capacitor. This ensures that
the BST capacitor voltage is sufficiently low after
a restart. It is recommended to use a 22nF
capacitor and 15kΩ resistor (see Figure 7).
BST
RBST
CBST R
BST Logic
22nF 15kΩ
SW
L
Figure 7: Recommended BST Circuitry for a VIN

Hot-Plug Application

PCB Layout Guidelines (14) (15)

Efficient PCB layout, especially input capacitor
placement, is critical for stable operation. A 4-
layer layout is strongly recommended to improve
thermal performance. For the best results, refer
to Figure 8 and Figure 9, and follow the
guidelines below:
1. Place the symmetric ceramic input capacitor,
Top Layer
especially the small package (0603) input
bypass capacitor, as close to the VIN and
PGND pins as possible to reduce high-
frequency noise. Keep the connection
between the input capacitor and VIN as
short and wide as possible.
2. Directly connect the PGND pin to a large
ground plane on the PCB.
3. If the bottom layer is a ground plane, add Mid-Layer 1
vias near PGND.
4. Ensure that the high-current paths at PGND
and VIN have short, direct, and wide traces.
5. Make the connection between the input
capacitor and VIN as short and wide as
possible.
6. Place the VCC capacitor as close to VCC
and PGND as possible.
Mid-Layer 2
7. Route SW and BST away from sensitive
analog areas.
8. Use multiple vias to connect the power
planes to the internal layers.
Bottom Layer
Figure 8: Recommended PCB Layout for Buck
Mode (14)
Notes:
14) The recommended PCB layout for buck mode is based on
Figure 10.
15) The recommended layout for buck-boost mode is based on
Figure 11 on page 55.

Top Layer Mid-Layer 1
Mid-Layer 2 Bottom Layer

Figure 9: Recommended PCB Layout for Buck-Boost Mode (15)

TYPICAL APPLICATION CIRCUITS

R7
CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIN7 C1A C1B C1C C1D 20Ω
22nF/ 22nF/ 22nF/ 22nF/ 10µF/10µF/ L1 47µF 10µF/ 10µF/ 0.1µF/ 0.1µF/ C2
50V 50V 50V 50V 50V 50V 4.7µH 50V 50V 50V 50V 50V 7 0.1µF
0603 0603 0603 0603 1210 1210 1210 1210 0603 0603
VBATT1 IN BST
XEL4030- 4,13
XEL4030-
472MEB 472MEB
MPQ7200 L2 ILED = 3A
14 8,9 LED+
GND INGND
R1 SW
4.7µH
100kΩ 3
EN/DIM IREF 17 C2A C2B C2C C2D
EN/DIM 10
2.2µF 2.2µF 1nF 1nF
18
FAULT ISET 25V 25V 25V 25V
R2 19 16 1206 1206 0603 0603
NTC VCC
100kΩ C1 R5 R6
FAULT 2 LED-
NC
DUTY AGND PGND
R4 1 15 5,6 10µF 5.36kΩ 23.2kΩ
R3 11,12
10k
4.87kΩ
Figure 10: Typical Application Circuit (Buck Mode, ILED = 3A, No Two-Step Dimming)
R7
CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIN7 C1A C1B C1C C1D
20Ω
22nF/ 22nF/ 22nF/ 22nF/ 10µF/10µF/ L1 47µF/ 4.7µF/4.7µF/0.1µF/ 0.1µF/ C2
50V 50V 50V 50V 50V 50V 4.7µH 50V 50V 50V 50V 50V 7
0603 0603 0603 0603 1210 1210 1210 1210 0603 0603 0.1µF
VIN BST
IN
4,13
XAL4030- XAL4030-
472MEB 472MEB
MPQ7200 L2 ILED = 1.2A
14 LED+
GND INGND 8,9
R1 SW
4.7µH
100kΩ 3
EN/DIM IREF 17 C2A C2B C2C C2D C2E C2F
EN/DIM 10
FAULT ISET
18 4.7µF 4.7µF 1nF 1nF 1nF 1nF
25V 25V 25V 25V 25V 25V
R2 19 16 1206 1206 0603 0603 0603 0603
FAULT NTC VCC
100kΩ L3
2 NC C1 R5 R6 LED-
220nH
DUTY AGND PGND
10µF 13.3kΩ 2.32kΩ
R4 1 15 5,6
R3 11,12
10k
4.87kΩ
C5A C5B C5C C5D

0.47µF/ 0.47µF/ 0.1µF/ 0.1µF/ D1
50V 50V 50V 50V B140
1206 1206 0603 0603
Figure 11: Typical Application Circuit (Buck-Boost Mode, ILED = 1.2A, No Two-Step Dimming)
R4
20Ω
CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 L1 CIN7 C1A C1B C1C C1D 7
22nF 22nF 22nF 22nF 10µF 10µF 47µF 4.7µF 4.7µF 0.1µF 0.1µF C2
VIN BST
4.7µH 4,13 IN 0.1µF
MPQ7200 L2
14 8,9
ILED = 1.2A
GND R1 INGND SW
100kΩ 4.7µH
3 EN IREF 17 C2A C2B LED+
EN/DIM 10
FAULT ISET 18 4.7µF 4.7µF
R2 19 VCC 16
FAULT NTC
100kΩ C1 R5 R6
2 NC
DUTY AGND PGND
10µF 13.3kΩ 2.32kΩ R8 LED-
1 15 5,6
R3 11,12
100kΩ
4.87kΩ
C5A C5B C5C C5D R7
0.47µF 0.47µF 0.1µF 0.1µFNTC D4
B140
Figure 12: Typical Application Circuit (Buck-Boost Mode, ILED = 1.2A, LED+ Short to Battery Protection)

PACKAGE INFORMATION
QFN-19 (3mmx4mm)
Wettable Flank
PIN 1 ID
MARKING
PIN 1 ID
INDEX AREA
TOP VIEW BOTTOM VIEW
SIDE VIEW SECTION A-A
NOTE:
1) ALL DIMENSIONS ARE IN MILLIMETERS.

2) EXPOSED PADDLE SIZE DOES NOT INCLUDE
MOLD FLASH.
3) LEAD COPLANARITY SHALL BE 0.08
MILLIMETERS MAX.
4) JEDEC REFERENCE IS MO-220.
5) DRAWING IS NOT TO SCALE.
RECOMMENDED LAND PATTERN

CARRIER INFORMATION
Pin1 1 1 1 1
ABCD ABCD ABCD ABCD
Feed Direction
Package Quantity/ Quantity/ Quantity/ Reel Carrier Carrier

Part Number
Description Reel Tube Tray Diameter Tape Width Tape Pitch
MPQ7200GLE- QFN-19
5000 N/A N/A 13in 12mm 8mm
AEC1-Z (3mmx4mm)

REVISION HISTORY
Revision # Revision Date Description Pages Updated
1.0 10/9/2020 Initial Release -
Added the new part number (MPQ7200GLE) to the
Ordering Information section; updated the “–Z” suffix to “- 3
Z”
Updated the EN/DIM pin description 4
Grammar and formatting revisions 12–14
Added the number of LEDs to the conditions of the
20
Efficiency with 2 LEDs and Efficiency with 1 LED curves
Updated the VFAULT channel name to “VFAULT 10V/div.” for
22
the first Two-Step Dimming waveform
Updated the VFAULT channel name to “VFAULT 10V/div.” for
24
the second Two-Step Dimming waveform
Added the number of LEDs to the conditions of the
33
Efficiency with 3 LEDs and Efficiency with 4 LEDs curves
Updated the Enable (EN) Control section 42
1.1 2/22/2023 Updated the Pulse-Width Modulation (PWM) Dimming
43
section
Updated the Fault Detection Indicator section 45
Updated Table 3; updated the Notes section 47
Updated the Power Derating section 48
Updated the NTC Thermal Derating section 49
Updated the Setting the LED Current section; updated
50
Figure 6
Updated the PCB Layout Guidelines section; updated the
54–55
Notes section; updated Figure 8; updated Figure 9
Updated Figure 11; updated the figure titles for Figure 10,
56
Figure 11, and Figure 12
Updated the Package Information section 57
Updated the “–Z” suffix to “-Z” 58
Notice: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third-party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.


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MPQ7200

42V, 1.2A Buck-Boost or 3A Buck

MPQ7200 Rev. 1.1 www.MonolithicPower.com 1

EN/DIM EN/DIM IREF

NTC AGND PGND

Figure 1: Buck-Boost Topology (RIREF ≤ 9.09kΩ)

Figure 2: Buck Topology (RIREF ≥ 14.7kΩ)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 2

MP: MPS prefix

MPQ7200 Rev. 1.1 www.MonolithicPower.com 3

MPQ7200 Rev. 1.1 www.MonolithicPower.com 4

ABSOLUTE MAXIMUM RATINGS (1) Thermal Resistance θJA θJC

MPQ7200 Rev. 1.1 www.MonolithicPower.com 5

Oscillator frequency fSW 2000 2300 2600 kHz

ISET voltage VISET IISET = 45μA 0.578 0.592 0.606 V

MPQ7200 Rev. 1.1 www.MonolithicPower.com 6

ELECTRICAL CHARACTERISTICS (continued)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 7

ELECTRICAL CHARACTERISTICS (continued)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 8

ELECTRICAL CHARACTERISTICS (continued)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 9

ELECTRICAL CHARACTERISTICS (continued)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 10

ELECTRICAL CHARACTERISTICS (continued)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 11

Shutdown Current vs. Quiescent Current vs.

TEMPERATURE (oC) TEMPERATURE (oC)

VIN UVLO Threshold vs. EN UVLO Threshold vs.

VCC UVLO Threshold vs.

TEMPERATURE (oC) TEMPERATURE (oC)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 12

TYPICAL CHARACTERISTICS (continued)

Current Limit with MOSFETs Current Limit with MOSFETs

VIREF vs. Temperature VISET vs. Temperature

TEMPERATURE (oC) TEMPERATURE (oC)

VNTC UV Threshold vs. VNTC OV Threshold vs.

MPQ7200 Rev. 1.1 www.MonolithicPower.com 13

TYPICAL CHARACTERISTICS (continued)

VOUT UV Threshold vs. VOUT UV Threshold vs.

VOUT OVP Threshold vs. VOUT OVP Threshold vs.

TEMPERATURE (oC) TEMPERATURE (oC)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 14

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

INPUT VOLTAGE (V) INPUT VOLTAGE (V)

INPUT VOLTAGE (V) INPUT VOLTAGE (V)

MPQ7200 Rev. 1.1 www.MonolithicPower.com 15

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LED CURRENT PRECISION

LED CURRENT PRECISION

MPQ7200 Rev. 1.1 www.MonolithicPower.com 16

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LED CURRENT PRECISION

ILED=1.2A, L=4.7µH ILED=1.2A, L=4.7µH

RATIO TO NORMALIZED INDUCTOR RATIO TO NORMALIZED INDUCTOR

ILED Precision vs. HS-FET ILED Precision vs. LS-FET

LED CURRENT PRECISION

CH3: VIN CH3: VIN

MPQ7200 Rev. 1.1 www.MonolithicPower.com 17