SPWF04SA, SPWF04SC

Standalone and Serial-to-Wi-Fi b/g/n intelligent modules

Datasheet - preliminary data

 TX power
 18.3 dBm @ 1 Mbps DSSS
 13.7 dBm @ 54 Mbps OFDM
 RX sensitivity
 -96.0 dBm @ 1 Mbps DSSS
 -74.5 dBm @ 54 Mbps OFDM
 19 configurable GPIOs available
 UART and SPI interface to host system
 Advanced low-power modes
 Standby with RTC: 43 µA
 Sleep = 3 mA
Features  Idle connected (DTIM=1) = 5 mA
 RX traffic 105 mA typical
 2.4 GHz IEEE 802.11 b/g/n transceiver
 TX traffic 260 mA typical @ 10 dBm
 High performance STM32F439
 AT command set interface through UART
 ARM® Cortex®-M4
 SPI interface with simple protocol
 256 KB SRAM
 Application subsystem
 2 MB embedded high-speed Flash
 Embedded real-time MicroPython
memory
environment for customer applications
 1 MB Flash memory for user storage,
and on-board development
extendable via SD/MMC interface or
 MicroPython API library for easy access
external SPI Flash
to Wi-Fi subsystem capabilities and
 Integrated TCP/IP protocol stack
device peripherals (i.e. UART, SPI, I²C)
 8 simultaneous TCP or UDP clients and
 Small form factor: 26.92 x 15.24 x 2.35 mm
2 socket servers (supporting up to 8
 Single voltage supply (3.3 V typical)
clients each)
 Antenna options: integrated antenna/U.FL
 Secured socket and upper layers (i.e.
connector
HTTPS) supporting up to TLS 1.2,
including AES (128, 256), hash (MD5,  Industrial temperature range: -40°C to 85°C
SHA-1, SHA-256) and RSA (1024,  FCC/CE/IC certified
2048)  RoHS compliant
 Web server supporting SSI
 Open, WEP, WPA2 PSK, WPA2 Enterprise Applications
 WPS for station  Smart appliances
 System modes: Station, IBSS, and miniAP  Industrial control and data acquisition
(supporting up to 5 Stations)  Home automation and security systems
 miniAP easily provisioned (SSID, PWD)  Wireless sensors
 Fast Wi-Fi re-association after reset  Cable replacement
 Secure Firmware and FileSystem updates  Medical equipment
Over The Air (OTA)  Machine-to-machine communication

March 2017 DocID029757 Rev 3 1/28

This is preliminary information on a new product now in development www.st.com
or undergoing evaluation. Details are subject to change without notice.
Contents SPWF04SA, SPWF04SC

Contents
1 Description....................................................................................... 5
2 Schematic diagram.......................................................................... 7
3 General electrical specifications .................................................... 8
4 Digital interface specifications ....................................................... 9
5 RF characteristics ......................................................................... 10
6 Pinout description ......................................................................... 11
7 Host interfaces .............................................................................. 14
7.1 UART interface................................................................................ 14
7.2 SPI interface.................................................................................... 14
8 Mechanical dimensions ................................................................ 18
9 Module reflow ................................................................................ 20
10 Regulatory compliance ................................................................. 21
10.1 RoHS compliance ........................................................................... 21
10.2 RF certifications .............................................................................. 21
10.2.1 FCC and IC ....................................................................................... 22
10.2.2 CE ..................................................................................................... 23

11 Module marking and traceability .................................................. 24

12 Ordering information..................................................................... 26
13 Revision history ............................................................................ 27

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SPWF04SA, SPWF04SC List of tables

List of tables
Table 1: Absolute maximum ratings ........................................................................................................... 8
Table 2: Operating conditions and input power specifications ................................................................... 8
Table 3: Digital interface specifications, I/O pins ........................................................................................ 9
Table 4: RF characteristics ....................................................................................................................... 10
Table 5: Pinout description ....................................................................................................................... 11
Table 6: GPIOs main and alternate functions ........................................................................................... 12
Table 7: SPI signals .................................................................................................................................. 15
Table 8: Soldering values ......................................................................................................................... 20
Table 9: RF certification summary ............................................................................................................ 21
Table 10: Antennas used for certification of SPWF04SC ......................................................................... 22
Table 11: Titanis antenna characteristics ................................................................................................. 22
Table 12: Module product ID .................................................................................................................... 25
Table 13: Ordering information ................................................................................................................. 26
Table 14: Document revision history ........................................................................................................ 27

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List of figures SPWF04SA, SPWF04SC

List of figures
Figure 1: SPWF04S block diagram ............................................................................................................ 7
Figure 2: UART connection with host device ............................................................................................ 14
Figure 3: SPI connection with host device ................................................................................................ 15
Figure 4: Single 1 byte transaction ........................................................................................................... 16
Figure 5: TX master transaction ............................................................................................................... 16
Figure 6: RX master transaction ............................................................................................................... 16
Figure 7: Master RX multiple messages ................................................................................................... 17
Figure 8: Module dimensions .................................................................................................................... 18
Figure 9: Module footprint ......................................................................................................................... 19
Figure 10: Soldering profile ....................................................................................................................... 20
Figure 11: CE Label .................................................................................................................................. 23
Figure 12: SPWF04SA front side .............................................................................................................. 24
Figure 13: SPWF04SA bottom side .......................................................................................................... 24

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SPWF04SA, SPWF04SC Description

1 Description
The SPWF04SA and the SPWF04SC are ready-to-use Wi-Fi modules conceived for
Internet of Things (IoT) applications. The modules integrate a Cortex-M4-based STM32
microcontroller and a powerful Wi-Fi transceiver, compliant with IEEE 802.11 b/g/n
standard for the 2.4 GHz band.
The modules are cloud compatible thanks to the complete protocol package, which
includes application and security layers. They can operate in serial-to-Wi-Fi and standalone
mode, with customer applications developed in the subsystem based on the MicroPython
environment.
The modules are configured around a single-chip 802.11 transceiver with integrated PA
and comprehensive power management subsystem, and an STM32F4 microcontroller with
UART/SPI interface and an extensive GPIO suite; they also incorporate timing clocks and a
voltage regulator.
The SPWF04SA module is configured with a highly-efficient, embedded micro 2.4 GHz ISM
band antenna, or with an external U.FL antenna connector (SPWF04SC); both are certified
FCC/IC and CE.
With low power consumption and an ultra-compact (2.7 x 1.5 cm) footprint, the modules are
ideal for fixed and mobile wireless applications, as well as challenging battery-operated
applications.
The SPWF04Sx parts are released with an integrated full featured TCP/IP protocol stack
with added web server and additional application service capabilities, including REST API
for accessing files on servers in the cloud and support for dynamic web pages with SSI
functions to easily interact with the module and the host processor over the air. Application
note AN4965 on www.st.com provides details on HTTP server capabilities.
Multiple higher level protocols over TCP are supported by the module including: HTTP,
MQTT, SMTP, and WebSockets to easily connect application to the cloud. Multiple
protocols supported over UDP include: TFTP, SNTP and mDNS; the module also includes
IPv6 networking capabilities.
The SW package also has an AT command layer interface for user-friendly access to the
stack functionalities via the UART serial port and an SPI interface supporting master and
slave messages from and to the host processor respectively (see user manual UM2114 on
www.st.com).
The SPWF04Sx includes a MicroPython scripting engine to enable simple and fast custom
application development on the module MCU: no external MCU is needed and the
customer application runs directly on the module. The interpreter implementation is fully
compatible with the standard MicroPython version 1.6. In standalone mode, MicroPython
use Wi-Fi interfaces and MCU peripherals such as UART, SPI, I2C, GPIOs via standard
MicroPython APIs (see application note AN4964 on www.st.com).
1 MB of the internal Flash is dedicated to store the user file system while a hardware
interface allows the usage of an external memory via SPI/SDIO (Serial Flash/SD Card) to
further extend the file system storage capabilities.
The module supports WPA2-Personal and WPA2-Enterprise security and WPS (Wi-Fi
protected setup).
For secure end-to-end communication with the cloud, an SSL/TLS stack is embedded in
every module, with no licensing charge. See application note AN4963 on www.st.com for
details on security.

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Description SPWF04SA, SPWF04SC
The module firmware may be updated at any time via UART and over-the-air (FOTA); the
FOTA operation can be performed with different level of security, as described in AN4963.
ST may update the module firmware at any time; check regularly for documentation and
firmware updates on www.st.com/wifimodules.

6/28 DocID029757 Rev 3

SPWF04SA, SPWF04SC Schematic diagram

2 Schematic diagram
Figure 1: SPWF04S block diagram
3.3 V

CW1100
A
UART/SPI
b/g/n
STM32F4 Tx/Rx
GPIOs/Peripherals Integrated Filter
Switch
120 MHZ PA
Ext. Serial Memory Flash: 2 MB
Boot0 RAM: 256 kB C
38 MHz
Reset

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General electrical specifications SPWF04SA, SPWF04SC

3 General electrical specifications

Table 1: Absolute maximum ratings
Rating Min. Typ. Max. Unit
Voltage supply -0.3 - 4.0 V
Vin for 5 V tolerant pins -0.3 - 5.5 V
Vin for all other pins -0.3 - 3.6 V
Storage temperature range -55 - 105 °C

Table 2: Operating conditions and input power specifications

Parameter Test condition Min. Typ. Max. Unit
Operating temperature range Industrial -40 85 °C
Input supply
3.3 V supply input 3.1 3.3 3.6 V
voltage
Both the STM32 and the
Standby radio are in standby power 43 µA
states
The STM32 is in stop power
Sleep state and the radio is in sleep 3 mA
power state
The STM32 is active and the
Low power state 33 mA
radio is in sleep power state
3.3 V supply
802.11b 1 Mbps DSSS 360 mA
6 Mbps 350 mA
TX (@ max 802.11g
54 Mbps 290 mA
power)
MCS0 350 mA
802.11n
MCS7 280 mA
802.11b 105 mA
RX 802.11g 105 mA
802.11n 105 mA

Note: Measure preformed at Ta = 25 °C, VDD = 3.3 V on channel 1.

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SPWF04SA, SPWF04SC Digital interface specifications

4 Digital interface specifications

Table 3: Digital interface specifications, I/O pins
Parameter Test condition Min. Typ. Max. Unit
VIH 2.3 3.6 V
Inputs
VIL 0 0.9 V
-
VOH IOH=4 mA 2.4 3.6 V
Outputs
VOL IOL=4 mA 0 0.4 V

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RF characteristics SPWF04SA, SPWF04SC

5 RF characteristics
Table 4: RF characteristics
Parameter Test condition Value Unit
11b, 1 Mbps -96 dBm
11b, 2 Mbps -93 dBm
11b, 5.5 Mbps -91 dBm
11b, 11 Mbps -87 dBm
11g, 9 Mbps -89.5 dBm
11g, 18 Mbps -86 dBm
RX sensitivity (1)
11g, 36 Mbps -80 dBm
11g, 54 Mbps -74.5 dBm
11n, MCS1, 13 Mbps -86.5 dBm
11n, MCS3, 26 Mbps -81.5 dBm
11n, MCS5, 52 Mbps -74 dBm
11n, MCS7, 65 Mbps -71 dBm
Channel-to-channel
CH1 to 14 11g, 54 Mbps, 10%PER 1 dB
de-sensitivity
Maximum input signal CH7 11g, 54 Mbps -20 dBm
11Mbps 38 dBc
9 Mbps 20 dBc
Adjacent channel
54 Mbps 4 dBc
rejection
MCS1 24 dBc
MCS7 3 dBc
11b, 1 Mbps 18.3 dBm
@ 11b spectral mask
11b, 11 Mbps 18.3 dBm
Max TX output power 11g, 9 Mbps @ 11g spectral mask 18.3 dBm
(1)
11g, 54 Mbps EVM = -27 dB, 4.5% 13.7 dBm
11n, MCS0 @ 11n spectral mask 18.3 dBm
11n, MCS7 EVM = -27 dB 13.5 dBm
On-board antenna gain Average -1.2 dBi

Notes:
(1)Output power and sensitivities are measured with a 50 Ω connection at the antenna port.

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SPWF04SA, SPWF04SC Pinout description

6 Pinout description
Table 5: Pinout description
Pin
Signal name Type Function Notes
number
GPIOs - general purpose input/output
See Table 6: "GPIOs main and alternate functions" for
GPIO[0] – GPIO[18] I/O
corresponding pin numbers, main and alternate functions
Host interface (1)
RXD/MOSI I 8 5 V tolerant
TXD/MISO O 6 5 V Tolerant
CTS/nCS I 9 Active low, 5 V tolerant
RTS/CLK O 10 5 V tolerant
Reset (2)
Active low for 5 ms with pull
RESETn I 3 Reset input up to 2.5 VDC. Not 5 V
tolerant
Bootloader
BOOT0 I 2 Boot loader (3)
External memory interface (4)
SDIO CLK / SPI CLK 31
SDIO D0 / SPI MISO 32
SDIO CMD / SPI MOSI 33
Other pins
Decouple with 10 µF
VCC (3.3 V) 24 Voltage Supply
capacitor
Ground 23 Ground
Add plenty of Ground vias
Ground Paddle 25 Ground for thermal dissipation and
ground
LSE 34
HSE 35
SWD I/O 26
SWD CLK 29

Notes:
(1)See Section 7: "Pinout description" for a UART and SPI selection modes and interface details.

(2)In
order to recover from unexpected behavior, the HOST processor, when connected, could conveniently
control the RESETn pin of the module.
(3)Toenable the firmware download, pin BOOT0 needs to be high during power up. RESETn needs to be
pulled low at least 5 ms to initiate the firmware download sequence.
(4)Automatic detection via the configuration variable ext_volume.

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Pinout description SPWF04SA, SPWF04SC
Table 6: GPIOs main and alternate functions
Alternate function
Signal Pin MicroPytho
Main Function (1) System function Peripheral Electrical notes
name n° n Interfaces
(2) driver (3) (4)

General Purpose Restore to factory Input pull down

GPIO[0] 16 ADC
input/output setting (5) and 5 V tolerant
General Purpose Input pull down
GPIO[1] 17 ADC
input/output and 5 V tolerant
General Purpose Floating and 5 V
GPIO[2] 19 PWM TX UART
input/output tolerant
General Purpose Ext memory: Input pull down
GPIO[3] 1
input/output SPI_CS and 5 V tolerant
General Purpose
GPIO[4] 18 I2C SDA
input/output
General Purpose
GPIO[5] 20 I2C SCL
input/output
General Purpose WakeUp sleep Input pull down
GPIO[6] 22
input/output Inhibit (6) and 5 V tolerant
MiniAP: General
purpose STA/MiniAP switch
GPIO[7] 13 RTS UART
input/output STA: (startup) (7)
WPS PushButton
General Purpose MicroPython
GPIO[8] 4
input/output selection mode (8)
SPI HOST
General Purpose
GPIO[9] 7 interface: SPI
input/output
nHostInterrupt (9)
GPIO[1 General Purpose LED Drive: module
5
0] input/output running (10)
GPIO[1 General Purpose
11 RX UART
1] input/output
GPIO[1 General Purpose
12 CTS UART
2] input/output
GPIO[1 LED Drive: Wi-Fi
15 MISO SPI
3] Link Up
GPIO[1 LED Drive: power
14 MOSI SPI
4] Up
GPIO[1 General Purpose
21 DAC SCK SPI
5] input/output
GPIO[1 General Purpose
27 ADC
6] input/output
GPIO[1 General Purpose
28
7] input/output
GPIO[1 General Purpose
30
8] input/output

Notes:
(1)Main Function is set at the module initialization when "factory" configuration is used. The GPIOs are all set as input pull down

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SPWF04SA, SPWF04SC Pinout description
with the exception of GPIO7 that is set as input pull up.
(2)Alternate System Functions are activated when the related pin is connected or when the command/specific configuration is
used.
(3)Alternate Peripheral Drivers are activated when the corresponding peripheral command is used.
(4)Alternate MicroPython Functions are activated when the related class is initialized.
(5)To perform the restore of the factory variable set, the pin GPIO0 must be high during powerup.
(6)This alternate function is running when low power mode variable is enabled. Ext. RC is suggested in order to stabilize the
signal. The value is high to wakeup the module.
(7)To enable the STA or MiniAP switch, the GPIO[7] needs to be low together with the HW reset.
(8)When this GPIO is high at the startup the module enters the MicroPython mode.
(9)To select the SPI as host interface, this GPIO must be driven high at the reset time.
(10)Selected by using the configuration variable Blink_led.

Note: Use an external pull up/pull down connected to a given GPIO to prevent unwanted
behavior.

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Host interfaces SPWF04SA, SPWF04SC

7 Host interfaces
SPWF04S supports UART and SPI interfaces for connecting the module with a host
processor. The pins to be used in the two possible configurations are indicated in the Table
5: "Pinout description". By default, SPWF04S works using the UART port with AT
commands. To switch SPI on, the pin corresponding to GPIO[9] must be driven low during
boot to force the device to handle incoming commands over SPI instead of UART.

7.1 UART interface

The SPWF04S can be interfaced with an external host using the UART interface shown in
Figure 2: "UART connection with host device". This configuration is used by default, with
four signals including RTS and CTS for HW flow control. The UART baud rate is
configurable in the 1200-921600 range. The default configuration is 115200/8/n/1 with flow
control disabled.
Figure 2: UART connection with host device

7.2 SPI interface

The SPWF04S can be interfaced as a slave with an external host by using the SPI
interface as shown in Figure 3: "SPI connection with host device". There are four SPI
signals and an additional host interrupt signal. SPI signals are detailed in the Table 7: "SPI
signals". This Interrupt signal allows the SPI slave to alert the SPI master that it has data to
send. In turn, the SPI master needs to assert the GPIO connected to the SPWF04S chip
select and to start the CLK signal to send data to the slave.

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SPWF04SA, SPWF04SC Host interfaces
Figure 3: SPI connection with host device

Table 7: SPI signals

SPWF04S signal name Description
RTS/Clk Clock (up to 22 MHz) from MCU to SPWF04S
Active Low indicates the selection of the slave
CTS/nCS
before a data transmission from the Master
nHostInt. Interrupt sent from the SPWF04S to
GPIO[9] (nHostInt) the host to indicate the transmission of data
from the slave
RXD/MOSI Data from Host to SPWF04S
TXD/MISO Data from SPWF04S to the Host

The host SPI can work up to the speed of 22 MHz. The communication between host and
SPWF04S is handled in half duplex.
Data is transmitted and received with the most significant bit first (SPI mode 0). That
means the clock polarity (CPOL) and the clk phase (CPHA) used to configure SPI are both
set to zero. The mode0 is commonly used as default for microcontrollers.
Figures from Figure 4: "Single 1 byte transaction" to Figure 7: "Master RX multiple
messages" detail the signaling over the SPI. In particular, Figure 4: "Single 1 byte
transaction" shows a single 1-byte transaction in mode 0. Tlead should be at least half a
clock cycle long, and so its value depends on the host clock frequency. SPI data is latched
by the master and slave using the CLK signal. So, when data needs to be transferred, the
MISO and MOSI signals change between each clock. After each single request sent from
master to the slave, the Master MUST wait for a confirmation message sent from the slave.
The message is notified to the master using the nHost Irq. All the data transferred in both
directions are packed using a well defined packet format described in the User Manual.

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Host interfaces SPWF04SA, SPWF04SC
Figure 4: Single 1 byte transaction

The Figure 5: "TX master transaction", Figure 6: "RX master transaction" and Figure 7:
"Master RX multiple messages" show a Master TX transaction and a Master RX
transaction, respectively. The communication starts with the host sending the write SYNC
word (0x02), followed by header information, and then payload, when applicable. Once the
command has been analyzed by the device, it asserts the IRQ interrupt line. Then the host
detects the interrupts and then writes the read SYNC word (0x02) and starts to generate
the clock. The device then clears the interrupt line and prepares the response. The host
then reads continuously until the SYNC pattern is detected. All data until that point is
discarded. The SYNC word is then followed by headers and then payload, when
applicable.
Figure 5: TX master transaction

Figure 6: RX master transaction

In case of multiple messages sent from slave to master, the nHost Irq line is asserted low
until the slave has data to be sent, as shown in Figure 7: "Master RX multiple messages".

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SPWF04SA, SPWF04SC Host interfaces
Figure 7: Master RX multiple messages

Refer to the UM2114 for a complete description of the SPI packets used in SPWF04S.

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Mechanical dimensions SPWF04SA, SPWF04SC

8 Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 8: Module dimensions

Note: An antenna area of 217 x 520 mils must be free of any ground metalization or traces
under the unit. The area extending away from the antenna should be free from metal on the
PCB and housing to meet expected performance levels. Pin 25 is the required paddle
ground and is not shown in this diagram.

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SPWF04SA, SPWF04SC Mechanical dimensions
Figure 9: Module footprint

Note: PCB design requires a detailed review of the center exposed pad. This pad requires
good thermal conductivity. Soldering coverage should be maximized and checked via x-ray
for proper design. There is a trade-off between providing enough soldering for conductivity
and applying too much, which allows the module to "float" on the paddle creating reliability
issues. ST recommends two approaches, a large center via that allows excess solder to
flow down into the host PCB with smaller vias around it, or many smaller vias with just
enough space for the viscosity of the chosen solder/flux to allow some solder to flow into
the smaller vias.
Either of these approaches must result in 60% or more full contact solder coverage on the
paddle after reflow. ST strongly encourages PCB layout teams to work with their EMS
providers to ensure vias and solder paste designs that will result in satisfactory
performance.

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Module reflow SPWF04SA, SPWF04SC

9 Module reflow
The SPWF04SA and SPWF04SC are surface mount modules with a 6-layer PCB. The
recommended final assembly reflow profiles are indicated below.
The soldering phase must be executed with care: in order to prevent an undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on the IPC/JEDEC J-
STD-020C, July 2004 recommendations.
Table 8: Soldering values
Profile feature PB-free assembly
Average ramp-up rate (TSMAX to TP) 3 °C/sec max
Preheat:
150 °C
Temperature min. (Ts min.)
200 °C
Temperature max. (Ts max.)
60 - 100 sec
Time (Ts min. to Ts max) (ts)
Critical zone:
217 °C
Temperature TL
60 - 70 sec
Time TL
Peak temperature (TP) 240 + 0 °C
Time within 5 °C of actual peak temperature (TP) 10 - 20 sec
Ramp-down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max.

Figure 10: Soldering profile

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SPWF04SA, SPWF04SC Regulatory compliance

10 Regulatory compliance
10.1 RoHS compliance
In order to meet environmental requirements, ST defines different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
SPWF04S modules comply with the ECOPACK2 level of RoHS compliance grade.
The material declaration file is available at: www.st.com.

10.2 RF certifications
The RF certifications obtained for the SPWF04S modules are summarized below.
Table 9: RF certification summary
Directives ID Certified Rules and STD Notes
ID that applies to the version
SPWF04SA and SPWF04SC when
this is used with the antennas
FCC S9NSPWFS04 FCC part 15 specified in the Table 8: "Soldering
values". Both versions are modular
approved in the meaning defined by
FCC
ID that applies to the version
SPWF04SA and SPWF04SC when
this is used with the antennas
8976C-
IC IC RSS-247 specified in the Table 8: "Soldering
SPWFS04
values". Both versions are modular
approved in the meaning defined by
IC
ETSI EN 300 328 V1.9.1:2015
EN 301 489-1 V1.9.2: ID that applies to the version
2011 + EN 301 489-17 V2.2.1:2012 + SPWF04SA and SPWF04SC when
ETSI Compliant EN 301 489-1 V1.8.1:2008 this is used with the antennas
EN 60950-1:2006 + A11:2009 + specified in the Table 8: "Soldering
A1:2010 + A12:2011 + A2:2013 values"
EN 62479:2010

The certifications of the version SPWF04SC that has an integrated U.FL connector applies
when the module is connected with the antenna specified in the Table 8: "Soldering
values".

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Regulatory compliance SPWF04SA, SPWF04SC
Table 10: Antennas used for certification of SPWF04SC
Product name
2010B4844-01 (Standard)
Article No.
2010B6090-01 (Reverse thread)
Frequency 2.4 - 2.5 GHz
Polarization Linear
Titanis 2.4 GHz
Operating temperature -40 to +85 degC
Impedance 50 Ω
Weight 7.4 g
Antenna Type Swivel

10.2.1 FCC and IC

The device SPWF04S has been tested and complies with the FCC part 15 and IC RSS-247
regulations. These limits are designed to provide reasonable protection against harmful
interference in approved installations. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following
two conditions:
 The device must not cause harmful interference.
 The device must accept any interference received, including interference that may
cause undesired operation.
Modifications or changes to this equipment not expressly approved by the party
responsible for compliance may render void the user's authority to operate this equipment.
The module has been approved by Industry Canada to operate with the antenna type listed
in Table 10: "Antennas used for certification of SPWF04SC" with the maximum possible
gain there indicated. Antenna types not included in Table 10: "Antennas used for
certification of SPWF04SC" and that have a gain greater than the maximum gain indicated
for that type in the Table 11: "Titanis antenna characteristics", are strictly prohibited for use
with this module.
Table 11: Titanis antenna characteristics
Characteristics
Conditions (1)
Min. Typ. Max.
Peak Gain 4.0 dBi 4.1 dBi 4.4 dBi Frequency 2.4 – 2.5 GHz, measured in 3D
Efficiency 80% 85% 90% chamber (near field)

Frequency 2.4 – 2.5 GHz, measured in Network

VSWR 1.1:1 1.2:1 1.3:1
Analyzer

Notes:
(1)Note all data provided in this table are based on the Antenova reference board.

The safe user distance, for RF exposure, is ≥ 50 mm (in compliance with 447498 D01
General RF Exposure Guidance v06 and RSS-102 Issue 5).

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SPWF04SA, SPWF04SC Regulatory compliance
Modular approval, FCC and IC
 FCC ID: S9NSPWFS04
 IC: 8976C-SPWFS04
In accordance with FCC part 15, the modules SPWF04SA and SPWF04SC are listed
above as a modular transmitter device.

Labeling instructions
When integrating the SPWF04SA and SPWF04SC into the final product, it must be
ensured that the FCC labeling requirements specified below are satisfied. Based on the
Public Notice from FCC, the product into which the ST transmitter module is installed must
display a label referring to the enclosed module. The label should use wording like the
following:
Contains Transmitter Module
 FCC ID: S9NSPWFS04
 IC: 8976C-SPWFS04
Any similar wording that expresses the same meaning may also be used.

10.2.2 CE
This module complies with the following European EMI/EMC and safety directives and
standards:
 Radio Spectrum ETSI EN 300 328 V1.9.1:2015
 EMC EN 301 489-1 V1.9.2:2011 + EN 301 489-1 V1.8.1:2008 +
 EN 301 489-17 V2.2.1:2012
 Safety EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013
 Health EN 62479:2010
Figure 11: CE Label

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Module marking and traceability SPWF04SA, SPWF04SC

11 Module marking and traceability

The SPWF04Sx top-side contains the following information:
 CE label printed on the shield
Figure 12: SPWF04SA front side

The SPWF04x bottom-side contains the following information:

 Model number indicating the RF module family: SPWF04Sx
 FCC USA certification number: FCC ID: S9NSPWFS04
 IC Canada certification number: IC: 8976C-SPWFS04
 2D laser data matrix
Figure 13: SPWF04SA bottom side

The 2D data matrix laser marked stores a serial number codified in the following format:
WW YY K PP NNN, where:
 WW - Week
 YY - Year
 K - Product ID (refer to follows table)
 PP - Internal ST use only
 NNN - Internal ST use only

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SPWF04SA, SPWF04SC Module marking and traceability
Table 12: Module product ID
K Product family identification
< SPWF04SA
> SPWF04SC

Every module is completely traceable thanks to the following applied rules:

 Each module bulk package is identified by a bulk ID
 The bulk ID and module 2D data matrix are linked by a reciprocal traceability link
 The module 2D data matrix traces the lot number of any raw material used

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Ordering information SPWF04SA, SPWF04SC

12 Ordering information
Table 13: Ordering information
Order codes Description
SPWF04SA Wi-Fi module with integrated antenna and protocol stack
SPWF04SC Wi-Fi module with integrated U.FL connector and protocol stack

Note: Refer to the UM2114 for a complete list of stack features and commands.

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SPWF04SA, SPWF04SC Revision history

13 Revision history
Table 14: Document revision history
Date Revision Changes
04-Oct-2016 1 Initial release.
Updated features and description on the cover page.
10-Feb-2017 2
Added Section 12: "Module marking and traceability".
06-Mar-2017 3 Updated Figure 9: "Module footprint".

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 SPWF04SA, SPWF04SC

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