Data Sheet

ADAR5001
10 GHz to 40 GHz, 2-Way RF Splitter Combiner

FEATURES FUNCTIONAL BLOCK DIAGRAM

► 2-way RF splitter combiner
► Frequency range: 10 GHz to 40 GHz
► Insertion loss (excess of 3 dB):
► −1 dB from 10 GHz to 18 GHz
► −1.1 dB from 18 GHz to 27 GHz
► Return loss (Port S1):
► −15 dB from 10 GHz to 18 GHz
► −12 dB from 18 GHz to 27 GHz
► Isolation:
► −20 dB at 10 GHz to 18 GHz
► −23 dB from 18 GHz to 27 GHz
► 1.460 mm × 1.460 mm × 0.500 mm, wafer level chip-scale Figure 1. Functional Block Diagram
package (WLCSP)
APPLICATIONS
► General-purpose microwave signal distribution
► Phased-array satellite communication (SATCOM) systems
► Phased-array radar systems

GENERAL DESCRIPTION
The ADAR5001 is a 1-to-2 Wilkinson power splitter that is designed
for space-constrained microwave signal distribution applications.
Excess insertion loss ranges from −1.0 dB (from 10 GHz to 18
GHz) and −1.1 dB (from 18 GHz to 27 GHz). The two outputs are
matched in both phase and amplitude, making the ADAR5001 ideal
for signal distribution applications requiring low time skew between
channels. The ADAR5001 can also be used as a combiner, combin-
ing input signals at the P1 and P2 ports to an output at the S1
port. The ADAR5001 is housed in a compact, 1.460 mm × 1.460
mm × 0.500 mm WLCSP, which makes it ideal for use in planar,
phased-array antenna systems that require a tight pitch between
elements.
The ADAR5001 is fabricated on a passive silicon process, and it is
specified to operate from −40°C to +85°C.

Rev. 0
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Data Sheet ADAR5001
TABLE OF CONTENTS

Features................................................................ 1 Pin Configuration and Function Descriptions........ 5

Applications........................................................... 1 Interface Schematics..........................................5
General Description...............................................1 Typical Performance Characteristics..................... 6
Functional Block Diagram......................................1 Theory of Operation...............................................8
Specifications........................................................ 3 Outline Dimensions............................................... 9
Absolute Maximum Ratings...................................4 Ordering Guide...................................................9
Electrostatic Discharge (ESD) Ratings...............4 Evaluation Boards.............................................. 9
ESD Caution.......................................................4

REVISION HISTORY

3/2024—Revision 0: Initial Version

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Data Sheet ADAR5001
SPECIFICATIONS

Source and load impedance = 50 Ω, and TA = 25°C, unless otherwise noted.

Table 1. Specifications
Parameter Test Conditions/Comments Min Typ Max Unit
OPERATING CONDITIONS
Frequency Range 10 40 GHz
INSERTION LOSS (Excess of 3.0 dB) S1 to P1, P2
10 GHz to 18 GHz −1.0 dB
18 GHz to 27 GHz −1.1 dB
27 GHz to 38 GHz −1.4 dB
38 GHz to 40 GHz −2.0 dB
INSERT LOSS FLATNESS S1 to P1, P2
10 GHz to 18 GHz 0.4 dB
18 GHz to 27 GHz 0.5 dB
27 GHz to 38 GHz 0.3 dB
38 GHz to 40 GHz 1.0 dB
INSERTION LOSS MISMATCH P1 to P2
10 GHz to 18 GHz 0.04 dB
18 GHz to 27 GHz 0.03 dB
27 GHz to 38 GHz 0.08 dB
38 GHz to 40 GHz 0.25 dB
INSERTION PHASE MISMATCH P1 to P2
10 GHz to 18 GHz 0.2 dB
18 GHz to 27 GHz 0.2 dB
27 GHz to 38 GHz 0.5 dB
38 GHz to 40 GHz 2.5 dB
RETURN LOSS All other ports terminated
S1
10 GHz to 18 GHz −15 dB
18 GHz to 27 GHz −12 dB
27 GHz to 38 GHz −14 dB
38 GHz to 40 GHz −20 dB
P1, P2
10 GHz to 18 GHz −11 dB
18 GHz to 27 GHz −15 dB
27 GHz to 38 GHz −20 dB
38 GHz to 40 GHz −8 dB
ISOLATION P1 to P2, P2 to P1
10 GHz to 18 GHz −20 dB
18 GHz to 27 GHz −23 dB
27 GHz to 38 GHz −15 dB
38 GHz to 40 GHz −10 dB

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Data Sheet ADAR5001
ABSOLUTE MAXIMUM RATINGS

Table 2. Absolute Maximum Ratings Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
Parameter Rating
Maximum Input Power (Any Port) 34 dBm ESD Ratings for the ADAR5001
Maximum Total Power (S1 Port) 37 dBm Table 3. ADAR5001, 8-Ball WLCSP
Temperature
ESD Model Withstand Threshold (V) Class
Operating Range −40°C to +85°C
Storage Range −40°C to +150°C HBM 2000 2

Stresses at or above those listed under Absolute Maximum Ratings ESD CAUTION
may cause permanent damage to the product. This is a stress ESD (electrostatic discharge) sensitive device. Charged devi-
rating only; functional operation of the product at these or any other ces and circuit boards can discharge without detection. Although
conditions above those indicated in the operational section of this this product features patented or proprietary protection circuitry,
specification is not implied. Operation beyond the maximum operat- damage may occur on devices subjected to high energy ESD.
ing conditions for extended periods may affect product reliability. Therefore, proper ESD precautions should be taken to avoid
ELECTROSTATIC DISCHARGE (ESD) RATINGS performance degradation or loss of functionality.

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

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Data Sheet ADAR5001
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 2. Pin Configuration (Top View)

Table 4. Pin Function Descriptions

Pin No. Mnemonic Description
A1, A3, B1, B3, C2 GND Ground. Connect to a low impedance ground plane on the printed circuit board (PCB).
A2 S1 Sum and/or Split. The input port when the device is used as a splitter, and the output port when the device is used as a combiner.
S1 is AC-coupled in the signal path but has a DC path to ground.
C1 P2 Port 2. The RF output when the device is used as a splitter, and the RF input when the device is used as a combiner. P2 has a
DC path to ground.
C3 P1 Port 1. The RF output when the device is used as a splitter, and the RF input when the device is used as a combiner. P1 has a
DC path to ground.

INTERFACE SCHEMATICS

Figure 3. S1 Interface Schematic

Figure 4. P1, P2 Interface Schematic

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Data Sheet ADAR5001
TYPICAL PERFORMANCE CHARACTERISTICS

Figure 5. Insertion Loss vs. Frequency Figure 8. Insertion Loss P1 vs. Frequency and Temperature

Figure 6. Insertion Loss Mismatch vs. Frequency and Temperature, Figure 9. S1 Input Return Loss vs. Frequency and Temperature
Normalized to P1 at Same Temperature

Figure 10. Output Return Loss vs. Frequency (P1, P2)

Figure 7. Insertion Phase Mismatch vs. Frequency and Temperature,
Normalized to P1 at Same Temperature

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Data Sheet ADAR5001
TYPICAL PERFORMANCE CHARACTERISTICS

Figure 11. Output Return Loss P1 vs. Frequency and Temperature

Figure 12. Isolation P2 to P1 vs. Frequency and Temperature

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Data Sheet ADAR5001
THEORY OF OPERATION

The ADAR5001 is a 1-to-2 Wilkinson power splitter and combiner.

While the S1 port is AC-coupled in the signal path, it has a DC path
to ground.
The P1 and P2 ports also have DC paths to ground. As a result, if
the DC bias level on any of the ports is not equal to zero, the ports
must be externally AC-coupled.

Figure 13. ADAR5001 Simplified Block Diagram

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Data Sheet ADAR5001
OUTLINE DIMENSIONS

1.500
1.460 SQ
1.420
0.35 3 2 1
REF

A
BALL A1
IDENTIFIER 0.80
REF B

C
0.40
BSC
TOP VIEW BOTTOM VIEW
(BALL SIDE DOWN) (BALL SIDE UP)

0.330
0.560
0.300
0.500 SIDE VIEW
0.270
0.440
COPLANARITY
0.05
SEATING 0.300 0.230
PLANE Ø 0.260 0.200

10-13-2021-B
0.220 0.170
PKG-000000

Figure 14. 8-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-8-8)
Dimensions shown in millimeters

Updated: February 17, 2024

ORDERING GUIDE
Package
Model1 Temperature Range Package Description Packing Quantity Option
ADAR5001ACBZ −40°C to +85°C CHIPS W/SOLDER BUMPS/WLCSP Reel, 1 CB-8-8
ADAR5001ACBZ-R7 −40°C to +85°C CHIPS W/SOLDER BUMPS/WLCSP Reel, 3000 CB-8-8
1 Z = RoHS Compliant Part.

EVALUATION BOARDS

Table 5. Evaluation Boards

Model1 Description
ADAR5001-EVALZ Evaluation Board

1 Z = RoHS Compliant Part.

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