SNUG Presentation On PPA
SNUG Presentation On PPA
SNUG Presentation On PPA
RibbonFET &
Power Via
Ultimate FinFET
node
Industry
First
Optimized ribbon architecture for best Reduced resistive power delivery droop.
Perf/W & Vmin.
EDA tools fully enabled.
SNUG SILICON VALLEY 2024 8
Intel 18A market opportunity
Unprecedented levels of performance and density scaling
Intel Foundry is heavily investing in enabling the full breadth of EDA tools across technology platforms.
• Identify key features of technology that can be leveraged best with algorithm
updates.
Stage Categories Opportunities Technologies Phase
Early Analysis Library Content Analysis New trade-offs and sensitivity analysis 1, 2
Logic Synthesis
Compile New design space with GAA cells EIO 1
Improvements
Compile Cell Selection Tune cost-based selection/sizing for Intel 18A EIO 1
Congestion/Placer Improved routing resource awareness
Compile/Clock Enhanced density 2
Analysis Refined cell and wire density thresholds
Layer Routing density, length sensitivity and
Compile/Clock EWI 1
Assignment/Promotion resource awareness tuned to 18A.
Route SI impact Mitigation Account for no frontside power grid accurately SI aware track_opt 2
Optimization Restrict flows applied during optimization Dynamic
Cell Selection 2
steps steps specific for Intel18A library content restriction
All Timing correlation Updated ML extraction models for Intel 18A Open
• Intel 18A specific binning, congestion and resource remodeling, length tuning,
pruning, promotion/demotion, power-aware NDR optimization. SNUG SILICON VALLEY 2024 14
Differentiated Intel18A PPA Phase 1 Recap
ML-GR Extraction for GR/DR Correlation – Retrained for Intel 18A features
• ML Track Spacing
– The track-spacing model depends on layer distribution and local layer density.
– Denser top layer usage enabled by Intel 18A was not covered in previously available training data.
– Additional incremental model training with backside PG routing carried out to enhance routing behavior
predictability of track spacing.
• ML Detour
– Intel 18A implementations yield different detour and layer variation behavior due to backside PG routing.
– Detours improve considering extra amount of routing resources for signal routing.
– Models were updated with additional training to predict the detours in Intel 18A.
• ML Via
– Extra signal resources affects via count on signal routing as well.
– Pre-trained model updated with additional training to account for these effects.
clock_opt (GRE)
• Additional track availability with Intel18A provides more opportunities
for SI aware optimization engines to make changes to design before
route_opt. Track-Assign
• New SI closure flow using track-based SI optimization.
– TR to DR handshake improvement in SI awareness. Track-Based Opt
– Enhanced SI prevention during track assignment/detail route. Incr-Track-Assign
– Leverage track-based optimization to clean-up easy delta delay
nets. Detail Route
– Improved delta-delay distribution allow better SI closure in
route_opt.
– Allow track/detail route to focus on harder to fix delta delay nets. route_opt
• Intel 18A Ribbon FET and Power Via technologies open a new design space that
needs to be navigated efficiently through early EDA engagement.
• Intel Foundry is heavily investing in enabling full breadth of EDA tools for
customers to achieve the best PPA with its technology offerings out of the box.
• Intel 18A specific feature development and tuning in Fusion Compiler yielded
differentiated PPA results across a variety of benchmark blocks.
• Phase 1 results we summarized, and Phase 2 results were demonstrated.
• Future phases of developing differentiated technology will work to push the
boundaries even further.