SNUG Presentation On PPA

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Synopsys Fusion Compiler Enhancements for

Improved Out-of-the-box PPA with Intel 18A

Ahmet Ceyhan, Principal Engineer and Engineering Manager


Intel Foundry

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Agenda

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Agenda
Body Slide Subtitle

• Intel Foundry Offerings


• Intel 18A Ribbon FET and Power Via Technologies
• Differentiated Intel 18A PPA Enhancements and Results
– Recap of Differentiated PPA Phase 1 Details and Results
– Differentiated PPA Phase 2 Details and Results
– Future Enhancements
• Conclusions

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Intel Foundry Offerings
IDM2.0 Strategy and Roadmap

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Intel Foundry Technology Roadmap

RibbonFET &
Power Via

Ultimate FinFET
node

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Ribbon FET and Power Via Technologies
Biggest innovations since FinFET in 2011

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Angstrom Era Innovations
Ribbon FET Transistors and PowerVia Interconnects

Industry
First

Largest innovation in transistors since Intel Largest interconnect innovation since Cu


introduced FinFETs in 2011. wires in the late 1990s.

Better electrostatics compared to FinFETs. Improved density and cell utilization.

Optimized ribbon architecture for best Reduced resistive power delivery droop.
Perf/W & Vmin.
EDA tools fully enabled.
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Intel 18A market opportunity
Unprecedented levels of performance and density scaling

• Cloud/AI • AP/ModAP • Smart Home/City • Telematics • Avionics


• HPC • Modem • Smart Factory • Connectivity • Electronic Warfare
• Cryptography • GNSS • Gaming • HPC • Satcom/Milcom
• Networking • eCockpit • Radar
• Accelerators (DPU)

Breakthrough technology delivering unprecedented levels of performance and density scaling


for next gen applications.

Intel Foundry is heavily investing in enabling the full breadth of EDA tools across technology platforms.

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Intel Foundry PPA Team
Goals

• Evaluate Intel Foundry offerings from customer experience point of view.


– Industry standard process design kits (PDK),
– Block PPA analysis based on an understanding of customer market segment conditions and products,
– PPA infrastructure that provides max coverage without IDM methods.
• Development of key design flows and features with industry standard tooling.
– Enable the EDA ecosystem and optimize for Intel Foundry with reference flow development with
overrides to open exploration for PPA/DTCO activities.
– Create end to end flows.
• Implementing and analyzing a wide variety of blocks with node offerings.
– Understand deltas to customer expectations where applicable.
– Help co-optimize design and technology to meet customers at their segment.
– Push PPA, cost, runtime, manufacturability, ease-of-use.

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Intel 18A PPA Enhancements and Results
Phase 1 Recap and Phase 2 Summary

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Differentiated Intel18A PPA Overall Plan

• Identify key features of technology that can be leveraged best with algorithm
updates.
Stage Categories Opportunities Technologies Phase
Early Analysis Library Content Analysis New trade-offs and sensitivity analysis 1, 2
Logic Synthesis
Compile New design space with GAA cells EIO 1
Improvements
Compile Cell Selection Tune cost-based selection/sizing for Intel 18A EIO 1
Congestion/Placer Improved routing resource awareness
Compile/Clock Enhanced density 2
Analysis Refined cell and wire density thresholds
Layer Routing density, length sensitivity and
Compile/Clock EWI 1
Assignment/Promotion resource awareness tuned to 18A.
Route SI impact Mitigation Account for no frontside power grid accurately SI aware track_opt 2
Optimization Restrict flows applied during optimization Dynamic
Cell Selection 2
steps steps specific for Intel18A library content restriction
All Timing correlation Updated ML extraction models for Intel 18A Open

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Differentiated Intel18A PPA Phase 1 Recap
Enhanced Initial Opto (EIO)
PPA improvement • Take advantage of richness of Intel
– bottleneck-based pin selection 18A cell library content.
– bottleneck-based costing tuned for Intel 18A
– enhanced pre-conditioning sizing engine Sensitivity-based Global Costing
– composite costing added to all initial_opto/final_opto
delay loops based on library content
– high-effort area-driven restructuring updated for Intel
18A (HET-only)
New cost-based sizing
– Cost all sizes for delay, slew, area, leakage and
pick the best size based on composite cost. No VT
dependency.
Bottleneck Driver Selector
– Shows good improvement in area/leakage/timing

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Differentiated Intel18A PPA Phase 1 Recap
Wire Optimization
• Pre-route and routing key improvements compile_fusion
• Integrated layer-promotion and
auto-NDR with rebuffering
• Layer/NDR demotion
– Congestion modeling and RDE-GR handshake
– Realization of NDRs in GR and DR CTS
– Hybrid GRE Via Ladder (VL) flow • GRE layer promotion, concurrent
– Improved GR extraction (ML-GR OBD in 22.03) clock_opt (GRE) auto-NDR & VLO runs with
reroute and rebuffering

• Improved realization of timing


• Post-route key improvements TA/DR driven NDR/VL constraints
• Improved SI closure
– NDR through rerouting and rebuffering,
– New post-route VL optimization (VLO) engine, • Improved post route closure using
– Timing aware VL implementation in ECO-DR. route_opt re-routing and rebuffering
• Post-route VLO

• Intel 18A specific binning, congestion and resource remodeling, length tuning,
pruning, promotion/demotion, power-aware NDR optimization. SNUG SILICON VALLEY 2024 14
Differentiated Intel18A PPA Phase 1 Recap
ML-GR Extraction for GR/DR Correlation – Retrained for Intel 18A features

• ML Track Spacing
– The track-spacing model depends on layer distribution and local layer density.
– Denser top layer usage enabled by Intel 18A was not covered in previously available training data.
– Additional incremental model training with backside PG routing carried out to enhance routing behavior
predictability of track spacing.
• ML Detour
– Intel 18A implementations yield different detour and layer variation behavior due to backside PG routing.
– Detours improve considering extra amount of routing resources for signal routing.
– Models were updated with additional training to predict the detours in Intel 18A.
• ML Via
– Extra signal resources affects via count on signal routing as well.
– Pre-trained model updated with additional training to account for these effects.

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Differentiated Intel18A PPA Phase 1 Recap
Results

• Differentiated PPA results compared to a PPA-optimized design using reference


methodology (RM) flow.

IP Features Optimization D-PPA Improvement


Arm Core Sub-hierarchy High cell density Highest frequency +4.5%
Arm Core Sub-hierarchy Interconnect dominated Highest frequency +4.7%
Graphics High cell density, low voltage range Iso-power performance +4%
RISC-V Core High performance Iso-power performance +4.5%
IDM Block High crosstalk Iso-power performance +4.3%
IDM Block Interconnect dominated Iso-power performance +4.2%

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Differentiated Intel18A PPA Phase 2
Auto Density Control Enhanced (ADCe)
Retune ADCe for Intel18A with updated default settings for the following:
 Target routing density (TRD)
– TRD is a route density threshold for congestion hot spots.
– Default settings tuned for technologies with frontside PG. Default values improve without hurting
routability in Intel18A.
– Monitored effect on post-route SI while increasing route density.
– Intel 18A enables less expansion considering the extra signal resources advantage.
– Both timing and power improve.
 Max density and congestion response
– Changed the way cell density responds to congested areas in a design.
– Intel 18A can tolerate higher densities when backside PG is considered.
– Tuned algorithm with awareness of sizing/buffering requirements while pushing cell density.
– A higher density can improve wirelength, which helps both timing and power.

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Differentiated Intel18A PPA Phase 2
Auto Density Control Enhanced (ADCe)
Intel 18A BS power enables an opportunity to pack more cells together before
any convergence issues arise in timing or routability.
Opportunity to retune ADCe for Intel18A with updated default density settings:
 Target routing density (TRD) for congestion estimation and cell expansion
– TRD is a route density threshold for congestion hot spots.
– Default settings tuned for technologies with frontside PG.
– Careful monitoring of the impact on post-route SI critical while increasing route density.
– Intel 18A enables less expansion considering the extra signal resources advantage.
– Both timing and power improve.
 Cell density and layer specific congestion response optimization
– Changed the way cell density responds to congested areas in a design for Intel 18A layer stack.
– Intel 18A can tolerate higher densities when backside PG is considered.
– Tuned algorithm with awareness of sizing/buffering requirements while pushing cell density.
– A higher density can improve wirelength, which helps both timing and power.
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Differentiated Intel18A PPA Phase 2
Auto Density Control Enhanced (ADCe)
• Efficient distribution of density demonstrating reduced >90% density areas at iso-
block area.
– Better handling of 80-90% density area improves overall resource usage and improves PPA.
– Enables area reduction.

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Differentiated Intel18A PPA Phase 2
Cell Selection Updates – Restrict flow
• The restrict flow contains several improvements during optimization:
– Classification of equivalent lib cells based on power characteristics into multiple sets.
– Dynamically restrict high power lib cells during certain optimization steps based on these sets.
– Controlled power thresholds when optimizing area.
– Library cell groups are tuned to accommodate the richness of the Intel18A library content.

• Restrictions are removed in certain phases and delay optimization steps:


– In route-opt, after first pass/phase, remove any restrictions.
– Add a non restricted delay pass in each delay step.

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Differentiated Intel18A PPA Phase 2
Enhanced SI optimization for BS PG

clock_opt (GRE)
• Additional track availability with Intel18A provides more opportunities
for SI aware optimization engines to make changes to design before
route_opt. Track-Assign
• New SI closure flow using track-based SI optimization.
– TR to DR handshake improvement in SI awareness. Track-Based Opt
– Enhanced SI prevention during track assignment/detail route. Incr-Track-Assign
– Leverage track-based optimization to clean-up easy delta delay
nets. Detail Route
– Improved delta-delay distribution allow better SI closure in
route_opt.
– Allow track/detail route to focus on harder to fix delta delay nets. route_opt

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Differentiated Intel18A PPA Phase 2
Results

IP Features Optimization D-PPA Improvement


+3%
Iso-power performance
Arm Core Sub-hierarchy Crosstalk driven -7%
Iso-frequency power
-2% util at iso-area
+2%
Iso-power performance
Arm Core Sub-hierarchy Interconnect dominated -5%
Iso-frequency power
-1% util at iso-area
+4%
Iso-power performance
Graphics High cell density, low voltage range -10%
Iso-frequency power
-3% util at iso-area

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Differentiated Intel 18A PPA
Future Development

Categories Opportunities/Potential Challenges Technologies


The design space enabled by the rich Intel 18A content
Library cell selection Dynamic cell filtering
has room to squeeze more PPA
Utilize Intel18A library content more efficiently
Spacing aware full flow solution CLO, legal_opt
Reduce any legalization displacements
Tune algorithms for Intel18A stack with detailed RC
Layer assignment and promotion
profile analysis
Early GR for SI
SI Mitigation Improved SI awareness earlier in flow for improved PPA awareness tuned to Intel
18A route resources
Layer resource handling with backside PG still has room MLGR new proposal for
Timing correlation
to squeeze more PPA with better correlation Intel18A

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Conclusions

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Conclusions

• Intel 18A Ribbon FET and Power Via technologies open a new design space that
needs to be navigated efficiently through early EDA engagement.
• Intel Foundry is heavily investing in enabling full breadth of EDA tools for
customers to achieve the best PPA with its technology offerings out of the box.
• Intel 18A specific feature development and tuning in Fusion Compiler yielded
differentiated PPA results across a variety of benchmark blocks.
• Phase 1 results we summarized, and Phase 2 results were demonstrated.
• Future phases of developing differentiated technology will work to push the
boundaries even further.

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YOUR

THANK YOU INNOVATION


YOUR
COMMUNITY

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