Atl 431
Atl 431
Atl 431
ATL431, ATL432
SLVSCV5D – MARCH 2015 – REVISED OCTOBER 2016
IKA
1000
IKA(PA)
Vref STABLE
100
20
0.0001 0.001 0.01 0.1 1 10
CKA(PF) D001
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ATL431, ATL432
SLVSCV5D – MARCH 2015 – REVISED OCTOBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 11
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 12
3 Description ............................................................. 1 9 Application and Implementation ........................ 13
4 Revision History..................................................... 2 9.1 Application Information............................................ 13
9.2 Typical Applications ................................................ 14
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3 10 Power Supply Recommendations ..................... 18
6.1 Absolute Maximum Ratings ..................................... 3 11 Layout................................................................... 18
6.2 ESD Ratings.............................................................. 3 11.1 Layout Guidelines ................................................. 18
6.3 Recommended Operating Conditions....................... 3 11.2 Layout Example .................................................... 18
6.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 19
6.5 Electrical Characteristics, ATL431Ax, ATL432Ax ..... 4 12.1 Related Links ........................................................ 19
6.6 Electrical Characteristics, ATL431Bx, ATL432Bx ..... 4 12.2 Receiving Notification of Documentation Updates 19
6.7 Typical Characteristics .............................................. 5 12.3 Community Resources.......................................... 19
7 Parameter Measurement Information .................. 9 12.4 Trademarks ........................................................... 19
12.5 Electrostatic Discharge Caution ............................ 19
8 Detailed Description ............................................ 11
12.6 Glossary ................................................................ 19
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11 13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed Small-Signal Voltage Amplification vs Frequency with an updated graph to provide additional data .................... 6
• Changed Test Circuit for Phase and Gain Measurement with an updated schematic........................................................... 9
• Updated Comparator Mode specifications in Design Parameters........................................................................................ 14
• Added Receiving Notification of Documentation Updates section ....................................................................................... 19
• Changed ATL431AQ, ATL431BI and ATL431BQ status from PREVIEW to PRODUCTION. ............................................... 1
• Changed flyback schematic to represent a more robust design ......................................................................................... 13
• Added flyback supply reliability recommendation................................................................................................................. 18
CATHODE 1
REF 1
3 ANODE
3 ANODE
REF 2
CATHODE 2
Pin Functions
PIN
NO. I/O DESCRIPTION
NAME
ATL431x ATL432x
CATHODE 1 2 I/O Shunt Current/Voltage input
REF 2 1 I Threshold relative to common anode
ANODE 3 3 O Common pin, normally connected to ground
6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
(2)
VKA Cathode voltage 40 V
IKA Continuous cathode current –100 150 mA
II(ref) Reference input current –0.05 10 mA
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ANODE, unless otherwise noted.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
2520 0.04
Vref = 2485mV
2515 Vref = 2500mV
Vref = 2504mV 0.032
2510
2505
0.024
Vref (mV)
IREF (PA)
2500
2495
0.016
2490
2485 0.008
2480
2475 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (qC) TA (qC)
IKA=1mA
Figure 1. Reference Voltage vs Free-Air Temperature Figure 2. Reference Current vs Free-Air Temperature
100 40
TA = -40qC
80 TA = 25qC
60 TA = 85qC
30 TA = 125qC
40
20
IKA (mA)
IKA (PA)
0 20
-20
-40
10
-60
-80
-100 0
-1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3
VKA = VREF (V) D001 VKA = VREF (V) D001
Figure 3. Cathode Current vs Cathode Voltage Figure 4. Cathode Current vs Cathode Voltage
30 0.2
0.16
25
Ik(min)
0.12
IOFF (PA)
IKA (PA)
20
0.08
15
0.04
10 0
2.3 2.35 2.4 2.45 2.5 2.55 -40 -20 0 20 40 60 80 100 120 140
VKA = VREF (V) TA (qC)
Figure 5. Cathode Current vs Cathode Voltage Figure 6. Off-State Cathode Current vs Free-Air Temperature
'Vref/'Vka (mV)
-2 10V to 36V
-0.25
'Vref (mV)
-2.5
-3 -0.3
-3.5
-0.35
-4
-4.5 -0.4
-5
-0.45
-5.5
-6 -0.5
0 5 10 15 20 25 30 35 40 -40 -20 0 20 40 60 80 100 120 140
Vka (V) Temperature (qC) D001
IKA=1mA IKA=1mA
Figure 7. Delta Reference Voltage vs Cathode Voltage Figure 8. Delta Reference Voltage vs Cathode Voltage
900 180 Gain
160 Phase
840 140
Gain (dB) and Phase (ƒ)
120
Noise (nV/—Hz)
780 100
80
720 60
40
660 20
0
600 ±20
10 100 1000 10000 10 100 1000 10000 100000 1000000
Frequency (Hz) D001 Frequency (Hz) C001
0.8
0.7 0.06
0.6
0.5 0.04
0.4
0.3
0.02
0.2
0.1
0 0
100 1000 10000 100000 1000000 -40 -20 0 20 40 60 80 100 120 140
Frequency (Hz) TA (qC)
Figure 26 used for this measurement. Figure 26 used for this measurement.
Figure 11. Output Impedance vs Frequency Figure 12. DC Output Impedance vs Temperature
1000
Unstable
STABLE
IKA(PA)
100
STABLE
20
0.0001 0.001 0.01 0.1 1 10
CKA(PF) D001
ESR < 20 mΩ Figure 27 used to verify stability.
IKA = 100 µA Figure 28 used for this measurement.
Figure 13. Pulse Response Figure 14. Low IKA (VKA = 2.5 V) Stability Boundary
Conditions all ATL43xx Devices
2000 2000
Unstable
1000 1000
Unstable
STABLE STABLE
IKA(PA)
IKA(PA)
100 100
STABLE STABLE
20 20
0.0001 0.001 0.01 0.1 1 10 0.0001 0.001 0.01 0.1 1 10
CKA(PF) D001 CKA(PF) D001
ESR < 20 mΩ Figure 27 used to verify stability. ESR < 20 mΩ Figure 27 used to verify stability.
Figure 15. Low IKA (VKA = 5.0 V) Stability Boundary Figure 16. Low IKA (VKA = 10.0 V) Stability Boundary
Conditions all ATL43xx Devices Conditions all ATL43xx Devices
2000 100
1000
Unstable
IKA(mA)
IKA(PA)
10
STABLE
100
Stable
20 1
0.0001 0.001 0.01 0.1 1 10 0.0001 0.001 0.01 0.1 1 10
CKA(PF) D001 CKA(uF) D001
ESR < 20mΩ Figure 27 used to verify stability. ESR < 20 mΩ Figure 27 used to verify stability.
Figure 17. Low IKA (VKA = 15.0 V) Stability Boundary Figure 18. High IKA (VKA = 2.5 V) Stability Boundary
Conditions all ATL43xx Devices Conditions all ATL43xx Devices
Stable
IKA(mA)
IKA(mA)
10 10 Stable
Unstable Unstable
1 1
0.0001 0.001 0.01 0.1 1 10 0.0001 0.001 0.01 0.1 1 10
CKA(uF) D001 CKA(uF) D001
ESR < 20 mΩ Figure 27 used to verify stability. ESR < 20 mΩ Figure 27 used to verify stability.
Figure 19. High IKA (VKA = 5.0 V) Stability Boundary Figure 20. High IKA (VKA = 10.0 V) Stability Boundary
Conditions all ATL43xx Devices Conditions all ATL43xx Devices
100
IKA(mA)
10
Stable
1
0.0001 0.001 0.01 0.1 1 10
CKA(uF) D001
ESR < 20 mΩ Figure 27 used to verify stability.
Figure 21. High IKA (VKA = 15.0 V) Stability Boundary Conditions all ATL43xx Devices
αVref is positive or negative, depending on whether minimum Vref or maximum Vref, respectively, occurs at the
lower temperature.
∆VKA
|zKA| =
The dynamic impedance is defined as: ∆I KA
When the device is operating with two external resistors (see Figure 23), the total dynamic impedance of the
|z'| = ∆V (
|zKA| 1 + R1 (
circuit is given by: ∆I which is approximately equal to R2
R1 Iref
Vref R2 Vref æ R1 ö
VKA = Vref ç 1 + ÷ + Iref × R1
è R2 ø
Figure 22. Test Circuit for VKA = Vref Figure 23. Test Circuit for VKA > Vref
Input VKA
Ioff
IK= 1mA
15 kQ
2.5 k
100 µF
VDC = 7.57 V
15 kQ
Figure 24. Test Circuit for Ioff Figure 25. Test Circuit for Phase and Gain Measurement
IK
+
R1 = 10NŸ
+
CL Vbat
-
R2
>250Ÿ
IK
+
CL Vbat
-
25NŸ
OUTPUT
IK
Pulse
Generator 50 Ÿ
F = 100kHz
GND
8 Detailed Description
8.1 Overview
ATL43x is a low power counterpart to TL431 and TLV431, having lower minimum cathode current (Ik(min) = 35
µA). Like TL431, ATL43x is used in conjunction with it's key components to behave as a single voltage
reference, error amplifier, voltage clamp or comparator with integrated reference.
ATL43x can be operated and adjusted to cathode voltages from 2.5 V to 36 V, making this part optimum for a
wide range of end equipments in industrial, auto, telecom and computing. In order for this device to behave as a
shunt regulator or error amplifier, > 35 µA (Imin(max)) must be supplied in to the cathode pin. Under this
condition, feedback can be applied from the Cathode and Ref pins to create a replica of the internal reference
voltage.
Various reference voltage options can be purchased with initial tolerances (at 25°C) of 0.5% and 1.0%. These
reference options are denoted by B (0.5%) and A (1.0%) after the ATL43x.
The ATL43xxI devices are characterized for operation from –40°C to +85°C, and the ATL43xxQ devices are
characterized for operation from –40°C to +125°C.
CATHODE
REF +
Vref
ANODE
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
VI
120 V
Vo=24 V
Ibias
Gate Drive
VCC
Controller
VFB
Current
Sense
GND
ATL431
Rsup
Vout
CATHODE
R1
VL
RIN
VIN REF
+
R2
2.5V
ANODE
9.2.1.2.2 Overdrive
Slow or inaccurate responses can also occur when the reference pin is not provided enough overdrive voltage.
This is the amount of voltage that is higher than the internal virtual reference. The internal virtual reference
voltage will be within the range of 2.5 V ±(0.5% or 1.0%) depending on which version is being used.
The more overdrive voltage provided, the faster the ATL43x will respond.
For applications where ATL43x is being used as a comparator, it is best to set the trip point to greater than the
positive expected error (that is, +1.0% for the A version). For fast response, setting the trip point to > 10% of the
internal Vref should suffice. Figure 31 shows the transition from VOH to VOL based on the input voltage and can be
used as a guide for selecting the overdrive voltage.
For minimal voltage drop or difference from Vin to the ref pin, it is recommended to use an input resistor < 1 MΩ
to provide Iref.
3.75
3.5
3.25
3
2.75
2.5
2.25
2
1.75
1.5
2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3
VIN (V) D001
VREF REF
ATL431
CL
R2 ANODE
0.1%
• |zKA| - Dynamic impedance, causing a change in cathode voltage with cathode current
Worst case cathode voltage can be determined taking all of the variables in to account. Setting the Shunt
Voltage on an Adjustable Shunt, SLVA445, assists designers in setting the shunt voltage to achieve optimum
accuracy for this device.
9.2.2.2.3 Stability
Though ATL43x is stable with no capacitive load, the device that receives the shunt regulator's output voltage
could present a capacitive load that is within the ATL43x region of stability, shown in Figure 14 through
Figure 21. Also, designers may use capacitive loads to improve the transient response or for power supply
decoupling.
Figure 14 through Figure 21 should be used as a guide for capacitor selection and compensation. It is
characterized using ceramic capacitors with very-low ESR. When it is desirable to use a capacitor within the
unstable region, higher ESR capacitors can be used to stabilize ATL43x or an external series resistance can be
added. For more information and guidance on ESR values, see Designing with the "Advanced" TL431, ATL431,
SLVA685.
Unlike TL431, the stability boundary is characterized and determined with resistors 250 Ω and greater. Which is
more suitable for low cathode current applications.
Figure 33. ATL43x Start-up Response IKA = 50 µA Figure 34. ATL43x Start-up Response IKA = 1 mA
11 Layout
CL
GND
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
ATL431AIDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 (ZCKS, ZCR3)
ATL431AQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (ZCLS, ZCS3)
ATL431BIDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 (ZCMS, ZCT3)
ATL431BQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (ZCJS, ZCU3)
ATL432AIDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 (ZCNS, ZCV3)
ATL432AQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (ZCOS, ZCW3)
ATL432BIDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 (ZCPS, ZCX3)
ATL432BQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (ZCQS, ZCY3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Feb-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Feb-2018
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA
0.95
3.04
1.9 2.80
3
2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01
0.25
GAGE PLANE 0.20
TYP
0.08
0.6
TYP SEATING PLANE
0 -8 TYP 0.2
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
(R0.05) TYP
(2.1)
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214838/C 04/2017
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
(R0.05) TYP
(2.1)
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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