GDM1602B-FL-YBW SPECIFICATIONS OF

LCD MODULE

1、Features
1. 5x8 dots
2. Built-in controller (S6A0069or equivalent)
3. +5.0V power supply
4. Display Mode: STN(Yellow-green), Transflective
5. 1/16 duty cycle
6. LED Back-light (yellow-green)
7. BKL to be driven by pin15, pin16
8. Viewing angle: 6:00 O’clock
2、Outline dimension

3、Absolute maximum ratings

Item Symbol Standard Unit

Power voltage VDD-VSS 0 - 7.0
V
Input voltage Vin VSS - VDD
Operating temperature range Vop -20 - +70
℃
Storage temperature range Vst -30 - +80
GDM1602B-FL-YBW
4、Block diagram

5、Interface pin description

External
Pin no. Symbol Function
connection
1 VSS Signal ground for LCM (GND)
2 VDD Power supply Power supply for logic (+5V) for LCM
3 V0 Contrast adjust
4 RS MPU Register select signal
5 R/W MPU Read/write select signal
6 E MPU Operation (data read/write) enable signal
Four low order bi-directional three-state data bus lines.
7~10 DB0~DB3 MPU Used for data transfer between the MPU and the LCM.
These four are not used during 4-bit operation.
Four high order bi-directional three-state data bus lines.
11~14 DB4~DB7 MPU
Used for data transfer between the MPU
15 LED+ LED BKL power Power supply for BKL (+5.0V)
16 LED- supply Power supply for BKL (GND)

6、Contrast adjust

VDD~V0: LCD Driving voltage

VR: 10k~20k

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7.Optical characteristics

θ1 φ1 φ2
θ2
12:00

9:00 3:00

6:00
STN type display module (Ta=25℃, VDD=5.0V)
Item Symbol Condition Min. Typ. Max. Unit
θ1 20
θ2 40
Viewing angle Cr≥3 deg
Φ1 35
Φ2 35
Contrast ratio Cr - 10 - -
Response time (rise) Tr - - 200 250
ms
Response time (fall) Tr - - 300 350

8.Electrical characteristics
LED Backlight circuit (color: Yellow-Green)

LED ratings
Item Symbol Min Typ. Max Unit
Forward Voltage Vf 3.8 4.0 4.2 v
Forward current If - 120 140 mA
Power P - - 0.6 W
Peak wave length λp - 571 - nm
Luminance Lv - 200 - Cd/m2
Operating temperature range Vop -20 - +70
℃
Storage temperature range Vst -25 - +80
DC characteristics
Parameter Symbol Conditions Min. Typ. Max. Unit
Supply voltage for LCD VDD-V0 Ta =25℃ - 4.5 - V
Input voltage VDD 4.7 5.0 5.5
Supply current IDD Ta=25℃, VDD=5.0V - 1.5 2.5 mA
Input leakage current ILKG - - 1.0 uA
“H” level input voltage VIH 2.2 - VDD
“L” level input voltage VIL Twice initial value or less 0 - 0.6
“H” level output voltage VOH LOH=-0.25mA 2.4 - - V
“L” level output voltage VOL LOH=1.6mA - - 0.4
Backlight supply voltage VAK R=6.8Ω - 4.0 -

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Write cycle
Parameter Symbol Test pin Min. Typ. Max. Unit
Enable cycle time tc 500 - -
Enable pulse width tw E 230 - -
Enable rise/fall time tr, tf - - 20
RS; R/W setup time tsu1 40 - - ns
RS; R/W
RS; R/W address hold time th1 10 - -
Data output delay tsu2 80 - -
DB0~DB7
Data hold time th2 10 - -

Write mode timing diagram

Read cycle (Ta=25℃, VDD=5.0V)

Parameter Symbol Test pin Min. Typ. Max. Unit
Enable cycle time tc 500 - -
Enable pulse width tw E 230 - -
Enable rise/fall time tr, tf - - 20
RS; R/W setup time tsu 40 - - ns
RS; R/W
RS; R/W address hold time th 10 - -
Data output delay td - - 120
DB0~DB7
Data hold time tdh 5 - -

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Read mode timing diagram

9. FUNCTION DESCRIPTION
Ø System Interface
This chip has all two kinds of interface type with MPU : 4-bit bus and 8-bit bus. 4-bit bus and 8-bit bus is
selected by DL bit in the instruction register.

Ø Busy Flag (BF)

When BF = "High", it indicates that the internal operation is being processed. So during this time the next
instruction cannot be accepted. BF can be read, when RS = Low and R/W = High (Read Instruction Operation),
through DB7 port. Before executing the next instruction, be sure that BF is not high.

Ø Address Counter (AC)

Address Counter (AC) stores DDRAM/CGRAM address, transferred from IR. After writing into (reading from)
DDRAM/CGRAM, AC is automatically increased (decreased) by 1. When RS = "Low" and R/W = "High", AC
can be read through DB0 - DB6 ports.
Ø Display Data RAM (DDRAM)
DDRAM stores display data of maximum 80 x 8 bits (80 characters). DDRAM address is set in the address
counter (AC) as a hexadecimal number.

Display position 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DDRAM address 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
DDRAM address 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F

Ø CGROM (Character Generator ROM)

CGROM has a 5 x 8 dots 204 characters pattern and a 5 x 10 dots 32 characters pattern. CGROM has
204 character patterns of 5 x 8 dots.
Ø CGRAM (Character Generator RAM)
CGRAM has up to 5 × 8 dot, 8 characters. By writing font data to CGRAM, user defined characters can be
used.

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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns (CGRAM Data)
Notes:
1. Character code bits 0 to 2 correspond to CGRAM address bits 3 to 5 (3 bits: 8 types).
2. CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the cursor position
and its display is formed by a logical OR with the cursor. Maintain the 8th line data, corresponding to the cursor
display position, at 0 as the cursor display. If the 8th line data is 1, 1 bit will light up the 8th line regardless of
the cursor presence.
3. Character pattern row positions correspond to CGRAM data bits 0 to 4 (bit 4 being at the left).
4. As shown Table, CGRAM character patterns are selected when character code bits 4 to 7 are all 0. However,
since character code bit 3 has no effect, the R display example above can be selected by either character code
00H or 08H.
5. 1 for CGRAM data corresponds to display selection and 0 to non-selection.
“-“: Indicates no effect.

Ø Cursor/Blink Control Circuit

It controls cursor/blink ON/OFF at cursor position.

10.Instruction description
Outline
To overcome the speed difference between the internal clock of S6A0069 and the MPU clock, S6A0069 performs
internal operations by storing control in formations to IR or DR. The internal operation is determined according to the
signal from MPU, composed of read/write and data bus (Refer to Table7).
Instructions can be divided largely into four groups:
1) S6A0069 function set instructions (set display methods, set data length, etc.)
2) Address set instructions to internal RAM
3) Data transfer instructions with internal RAM
4) Others
The address of the internal RAM is automatically increased or decreased by 1.

Note: during internal operation, busy flag (DB7) is read “High”.

Busy flag check must be preceded by the next instruction.
Instruction Table
Instruction Instruction code Description Execution
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time (fosc=
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
270 KHZ
Clear Write “20H” to DDRA and set
0 0 0 0 0 0 0 0 0 1 DDRAM address to “00H” from 1.53ms
Display AC
Set DDRAM address to “00H”
Return From AC and return cursor to
0 0 0 0 0 0 0 0 1 - Its original position if shifted. 1.53ms
Home The contents of DDRAM are not
changed.
Entry mode Assign cursor moving direction
0 0 0 0 0 0 0 1 I/D SH And blinking of entire display 39us
Set
Display ON/ Set display (D), cursor (C), and
0 0 0 0 0 0 1 D C B
Blinking of cursor (B) on/off
OFF control Control bit.
Set cursor moving and display
Cursor or Shift control bit, and the
0 0 0 0 0 1 S/C R/L - - Direction, without changing of
39us
Display shift
DDRAM data.
Set interface data length (DL: 8-
Bit/4-bit), numbers of display
Function set 0 0 0 0 1 DL N F - - Line (N: =2-line/1-line) and,
39us
Display font type (F: 5x11/5x8)
Set CGRAM Set CGRAM address in address
0 0 0 1 AC5 AC4 AC3 AC2 AC1 AC0 Counter. 39us
Address
Set DDRAM Set DDRAM address in address
0 0 1 AC6 AC5 AC4 AC3 AC2 AC1 AC0 Counter. 39us
Address
Read busy Whether during internal
Operation or not can be known
Flag and 0 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC0 By reading BF. The contents of 0us
Address Address counter can also be read.
Write data to Write data into internal RAM
1 0 D7 D6 D5 D4 D3 D2 D1 D0 (DDRAM/CGRAM). 43us
Address
Read data Read data from internal RAM
1 1 D7 D6 D5 D4 D3 D2 D1 D0 (DDRAM/CGRAM). 43us
From RAM

NOTE:
When an MPU program with checking the busy flag (DB7) is made, it must be necessary 1/2fosc is
necessary for executing the next instruction by the falling edge of the “E” signal after the busy flag (DB7)
goes to “Low”.

Contents
1) Clear display

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 0 0 0 0 0 1

Clear all the display data by writing “20H” (space code) to all DDRAM address, and set DDRAM
address to “00H” into AC (address counter).
Return cursor to the original status, namely, bring the cursor to the left edge on the fist line of the
display.
Make the entry mode increment (I/D=“High”).

2) Return home

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 0 0 0 0 1 -

Return home is cursor return home instruction.

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Set DDRAM address to “00H” into the address counter.
Return cursor to its original site and return display to its original status, if shifted.
Contents of DDRAM does not change.

3) Entry mode set

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 0 0 0 1 I/D SH

Set the moving direction of cursor and display.

I/D: increment / decrement of DDRAM address (cursor or blink)

When I/D=“high”, cursor/blink moves to right and DDRAM address is increased by 1.
When I/D=“Low”, cursor/blink moves to left and DDRAM address is increased by 1.
*CGRAM operates the same way as DDRAM, when reading from or writing to CGRAM.
SH: shift of entire display
When DDRAM read (CGRAM read/write) operation or SH=“Low”, shifting of entire display is not
performed. If SH =“High” and DDRAM write operation, shift of entire display is performed according to
I/D value. (I/D=“high”. shift left, I/D=“Low”. Shift right).

4) Display ON/OFF control

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 0 0 1 D C B
Control display/cursor/blink ON/OFF 1 bit register.

D: Display ON/OFF control bit

When D=“High”, entire display is turned on.
When D=“Low”, display is turned off, but display data remains in DDRAM.

C: cursor ON/OFF control bit

When D=“High”, cursor is turned on.
When D=“Low”, cursor is disappeared in current display, but I/D register preserves its data.

B: Cursor blink ON/OFF control bit

When B=“High”, cursor blink is on, which performs alternately between all the “High” data and display
characters at the cursor position.
When B=“Low”, blink is off.

5) Cursor or display shift

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 0 1 S/C R/L - -

Shifting of right/left cursor position or display without writing or reading of display data.
This instruction is used to correct or search display data.
During 2-line mode display, cursor moves to the 2nd line after the 40th digit of the 1st line.
Note that display shift is performed simultaneously in all the lines.
When display data is shifted repeatedly, each line is shifted individually.
When display shift is performed, the contents of the address counter are not changed.

Shift patterns according to S/C and R/L bits

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S/C R/L Operation

0 0 Shift cursor to the left, AC is decreased by 1
0 1 Shift cursor to the right, AC is increased by 1
1 0 Shift all the display to the left, cursor moves according to the display
1 1 Shift all the display to the right, cursor moves according to the display

6) Function set

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 1 DL N F - -

DL: Interface data length control bit

When DL=“High”, it means 8-bit bus mode with MPU.
When DL=“Low”, it means 4-bit bus mode with MPU. Hence, DL is a signal to select 8-bit or 4-bit bus
mode.
When 4-but bus mode, it needs to transfer 4-bit data twice.
N: Display line number control bit
When N=“Low”, 1-line display mode is set.
When N=“High”, 2-line display mode is set.
F: Display line number control bit
When F=“Low”, 5x8 dots format display mode is set.
When F=“High”, 5x11 dots format display mode.

7) Set CGRAM address

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 1 AC5 AC4 AC3 AC2 AC1 AC0

Set CGRAM address to AC.

The instruction makes CGRAM data available from MPU.

8) Set DDRAM address

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 1 AC6 AC5 AC4 AC3 AC2 AC1 AC0

Set DDRAM address to AC.

This instruction makes DDRAM data available form MPU.
When 1-line display mode (N=LOW), DDRAM address is form “00H” to “4FH”.In 2-line display mode
(N=High), DDRAM address in the 1st line form “00H” to “27H”, and DDRAM address in the 2nd line is
from “40H” to “67H”.
9) Read busy flag & address

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC0

This instruction shows whether S6A0069 is in internal operation or not.

If the resultant BF is “High”, internal operation is in progress and should wait BF is to be LOW, which by
then the nest instruction can be performed. In this instruction you can also read the value of the address
counter.
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10) Write data to RAM

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

1 0 D7 D6 D5 D4 D3 D2 D1 D0
Write binary 8-bit data to DDRAM/CGRAM.
The selection of RAM from DDRAM, and CGRAM, is set by the previous address set instruction
(DDRAM address set, CGRAM address set).
RAM set instruction can also determine the AC direction to RAM.
After write operation. The address is automatically increased/decreased by 1, according to the entry
mode.

11) Read data from RAM

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

1 1 D7 D6 D5 D4 D3 D2 D1 D0

Read binary 8-bit data from DDRAM/CGRAM.

The selection of RAM is set by the previous address set instruction. If the address set instruction of
RAM is not performed before this instruction, the data that has been read first is invalid, as the direction
of AC is not yet determined. If RAM data is read several times without RAM address instructions set
before, read operation, the correct RAM data can be obtained from the second. But the first data would be
incorrect, as there is no time margin to transfer RAM data.
In case of DDRAM read operation, cursor shift instruction plays the same role as DDRAM address
set instruction, it also transfers RAM data to output data register.
After read operation, address counter is automatically increased/decreased by 1 according to the
entry mode.
After CGRAM read operation, display shift may not be executed correctly.

NOTE: In case of RAM write operation, AC is increased/decreased by 1 as in read operation.

At this time, AC indicates next address position, but only the previous data can be read by the read
instruction.

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Standard character pattern

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11.QUALITY SPECIFICATIONS
11.1 Standard of the product appearance test
Manner of appearance test: The inspection should be performed in using 20W x 2 fluorescent lamps.
Distance between LCM and fluorescent lamps should be 100 cm or more. Distance between LCM and
inspector eyes should be 25 cm or more.
Viewing direction for inspection is 35° from vertical against LCM.

LCM

Definition of zone:

A Zone

B Zone
A Zone: Active display area (minimum viewing area).
B Zone: Non-active display area (outside viewing area).

11.2 Specification of quality assurance

AQL inspection standard
Sampling method: GB2828-87, Level II, single sampling
Defect classification (Note: * is not including)
Classify Item Note AQL
Major Display state Short or open circuit 1 0.65
LC leakage
Flickering
No display
Wrong viewing direction
Contrast defect (dim, ghost) 2
Back-light 1,8
Non-display Flat cable or pin reverse 10
Wrong or missing component 11
Minor Display Background color deviation 2 1.0
state Black spot and dust 3
Line defect, Scratch 4
Rainbow 5
Chip 6
Pin hole 7
Protruded 12
Polarizer Bubble and foreign material 3
Soldering Poor connection 9
Wire Poor connection 10
TAB Position, Bonding strength 13

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Note on defect classification

No. Item Criterion

1 Short or open circuit Not allow

LC leakage

Flickering

No display

Wrong viewing direction

Wrong Back-light
2 Contrast defect Refer to approval sample
Backgroundcolor
deviation

3 Point defect, Point Acceptable Qty.

Y
Black spot, dust Size
(including Polarizer) X φ<0.10 Disregard
0.10<φ≤0.15 2
0.15<φ≤0.25 1
φ = (X+Y)/2 φ>0.25 0

Unit：Inch2

4 Line defect,
W
Line Acceptable Qty.
Scratch L W
L --- 0.05>W
3.0>L 0.1>W>0.05 Disregard
2.0>L 0.15≥W>0.1

Unit: mm

5 Rainbow Not more than two color changes across the viewing area.

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No Item Criterion

6 Chip
Acceptable criterion
X Y Z
Remark:
< L /8 0.5mm ≤t/2
X: Length
direction
Y: Short
direction
Z: Thickness
direction
Acceptable criterion
t: Glass X Y X Y Z
thickness
≤2 0.5mm ≤t
W: Terminal
Width
L:Glass Z
length

Acceptable criterion
X Y Z
≤3 ≤2 ≤t
Y shall not reach to ITO

Acceptable criterion
W
Y X Y Z
Disregard ≤0.2 ≤t
Z
X

Y Acceptable criterion
X Y Z
≤5 ≤2 ≤t/3

Z
X

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No. Item Criterion

7 Segment (1) Pin hole

pattern
φ < 0.10mm is acceptable.
W = Segment width
φ = (X+Y)/2 X
X
Point Size Acceptable Qty
Y φ≤1/4W Disregard
Y 1/4W< φ≤1/2W 1
φ＞1/2W 0
W Unit: mm

8 Back-light
(1) The color of backlight should correspond
its specification.
(2) Not allow flickering
9 Soldering
(1) Not allow heavy dirty and solder ball
on PCB.
(The size of dirty refer to point and dust defect)
(2) Over 50% of lead should be
soldered on Land.
Lead

Land

50% lead

10 Wire
(1) Copper wire should not be rusted
(2) Not allow crack on copper wire connection.
(3) Not allow reversing the position of the flat cable.
(4) Not allow exposed copper wire inside the flat cable.
11* PCB
(1) Not allow screw rust or damage.
(2) Not allow missing or wrong putting of component.

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No Item Criterion

12 Protruded

W: Terminal Width Acceptable criteria:

W Y ≤ 0.4
Y

13 TAB
1. Position
W
W1
ITO W1≤1/3W
H H1≤1/3H
H1 TAB

2 TAB bonding strength test

TAB

P (=F/TAB bonding width) ≥650gf/cm ,(speed rate: 1mm/min)

5pcs per SOA (shipment)

14 Total no. of acceptable

A. Zone
Defect
Maximum 2 minor non-conformities per one unit.
Defect distance: each point to be separated over 10mm

B. Zone

It is acceptable when it is no trouble for quality and assembly

in customer’s end product.

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11.3 Reliability of LCM
Reliability test condition:

Item Condition Time (hrs) Assessment

High temp. Storage 80°C 48

High temp. Operating 70°C 48

No abnormalities
Low temp. Storage -30°C 48
in functions
Low temp. Operating -20°C 48
and appearance
Humidity 40°C/ 90%RH 48

Temp. Cycle 0°C ← 25°C →50°C 10cycles

(30 min ← 5 min → 30min)

Recovery time should be 24 hours minimum. Moreover, functions, performance and appearance shall be free
from remarkable deterioration within 50,000 hours under ordinary operating and storage conditions room
temperature (20+8°C), normal humidity (below 65% RH), and in the area not exposed to direct sun light.

11.4 Precaution for using LCD/LCM

LCD/LCM is assembled and adjusted with a high degree of precision. Do not attempt to make
any alteration or modification. The followings should be noted.

General Precautions:
1. LCD panel is made of glass. Avoid excessive mechanical shock or applying strong
pressure onto the surface of display area.
2. The polarizer used on the display surface is easily scratched and damaged. Extreme care
should be taken when handling. To clean dust or dirt off the display surface, wipe gently
with cotton, or other soft material soaked with isoproply alcohol, ethyl alcohol or
trichlorotriflorothane, do not use water, ketone or aromatics and never scrub hard.
3. Do not tamper in any way with the tabs on the metal frame.
4. Do not make any modification on the PCB without consulting XIAMEM OCULAR
5. When mounting a LCM, make sure that the PCB is not under any stress such as bending
or twisting. Elastomer contacts are very delicate and missing pixels could result from
slight dislocation of any of the elements.
6. Avoid pressing on the metal bezel, otherwise the elastomer connector could be deformed
and lose contact, resulting in missing pixels and also cause rainbow on the display.
7. Be careful not to touch or swallow liquid crystal that might leak from a damaged cell. Any liquid crystal
adheres to skin or clothes, wash it off immediately with soap and water.

Static Electricity Precautions:

1. CMOS-LSI is used for the module circuit; therefore operators should be grounded whenever
he/she comes into contact with the module.
2. Do not touch any of the conductive parts such as the LSI pads; the copper leads on the PCB and
the interface terminals with any parts of the human body.
3. Do not touch the connection terminals of the display with bare hand; it will cause disconnection or

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defective insulation of terminals.
4. The modules should be kept in anti-static bags or other containers resistant to static for storage.
5. Only properly grounded soldering irons should be used.
6. If an electric screwdriver is used, it should be grounded and shielded to prevent sparks.
7. The normal static prevention measures should be observed for work clothes and working
benches.
8. Since dry air is inductive to static, a relative humidity of 50-60% is recommended.

Soldering Precautions:
1. Soldering should be performed only on the I/O terminals.
2. Use soldering irons with proper grounding and no leakage.
3. Soldering temperature: 280°C+10°C
4. Soldering time: 3 to 4 second.
5. Use eutectic solder with resin flux filling.
6. If flux is used, the LCD surface should be protected to avoid spattering flux.
7. Flux residue should be removed.

Operation Precautions:
1. The viewing angle can be adjusted by varying the LCD driving voltage Vo.
2. Since applied DC voltage causes electro-chemical reactions, which deteriorate the
display, the applied pulse waveform should be a symmetric waveform such that no DC
component remains. Be sure to use the specified operating voltage.
3. Driving voltage should be kept within specified range; excess voltage will shorten display
life.
4. Response time increases with decrease in temperature.
5. Display color may be affected at temperatures above its operational range.
6. Keep the temperature within the specified range usage and storage. Excessive temperature
and humidity could cause polarization degradation, polarizer peel-off or generate bubbles.
7. For long-term storage over 40°C is required, the relative humidity should be kept below 60%,
and avoid direct sunlight.

Limited Warranty
XIAMEM OCULAR LCDs and modules are not consumer products, but may be incorporated by XIAMEM
OCULAR ’s customers into consumer products or components thereof, XIAMEM OCULAR does not warrant
that its LCDs and components are fit for any such particular purpose.

1. The liability of XIAMEM OCULAR is limited to repair or replacement on the terms set forth below.
XIAMEM OCULAR will not be responsible for any subsequent or consequential events or injury or
damage to any personnel or user including third party personnel and/or user. Unless otherwise agreed in
writing between XIAMEM OCULAR and the customer, XIAMEM OCULAR will only replace or repair
any of its LCD which is found defective electrically or visually when inspected in accordance with XIAMEM
OCULAR general LCD inspection standard . (Copies available on request)
2. No warranty can be granted if any of the precautions state in handling liquid crystal display above
has been disregarded. Broken glass, scratches on polarizer mechanical damages as well as defects that
are caused accelerated environment tests are excluded from warranty.
3. In returning the LCD/LCM, they must be properly packaged; there should be detailed description of
the failures or defect.

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