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    snapdragonadp_specshe

    Uploaded by

    singhastitvavikram
    Hh

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    © All Rights Reserved
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    QUALCOMM® SNAPDRAGON™

    AUTOMOTIVE DEVELOPMENT PLATFORM

    The Qualcomm® Snapdragon™ Automotive FEATURES


    Development Platform is designed to allow Qualcomm Snapdragon 602A Automotive-Grade
    automakers, Tier-1 suppliers and developers Processor
    to rapidly innovate, test and deploy + 1.5GHz Quad-Core Krait™ CPU, Adreno™ 320 GPU for
    next-generation connected infotainment superior graphics, and embedded Hexagon™ QDSP6 DSP
    for efficient multimedia processing
    applications and experiences.
    + Advanced Audio playback, Audio effects, Echo
    Cancellation/Noise Suppression, HD voice, Multi-format
    INTEGRATED PLATFORM FOR audio decoding, Video functions, 2D to 3D auto-
    INTEGRATED SOLUTIONS conversion, Augmented reality processing

    The Snapdragon Automotive Development Platform offers the + Multi-media Open Framework support for Graphics, Audio,
    multiple integrated capabilities of the optimized Qualcomm Video, Camera including OpenGL, OpenCL, OpenMAX,
    V4L2, ALSA
    Technologies production-grade solutions in an integrated
    single-board platform. With production quality, optimized + The Snapdragon 602A has been specifically designed to
    software supporting BSPs, OSs, stacks and frameworks, meet stringent automotive industry standards including
    infotainment system integrators can significantly reduce AEC-Q100 grade 3 and TS16949
    their software development time and risk and begin final Qualcomm® Gobi™ 9x15 Multimode 3G/4G LTE
    production software qualification earlier.
    + Gobi 9x15 modem provides a 3G/4G + integrated GNSS
    + Fully integrated and tested suite of Qualcomm solution for virtually ubiquitous multimode connectivity
    Technologies and third party components to cloud-based services, audio/video streaming and web
    + Available with support for Android and QNX operating browsing
    systems, including comprehensive software suite up to the + Mature and proven 3G/4G LTE modem designed for
    application layer wider bandwidth to support up to LTE CAT 3 (100 Mbps
    + Complies with automotive requirements for fast boot of downlink) ideally suited for feature-rich connected
    critical services, power and system optimized graphics, infotainment system programs
    audio and video frameworks as well as simultaneous dual + Qualcomm Technologies’ 2nd generation Category 3
    mode (STA, AP) support for 802.11ac Wi-Fi and automotive LTE/3G modem capable of up to 100Mbps DL 50 Mbps UL
    Bluetooth host profiles such as A2DP-SNK, AVRCP, HFP-
    + Supports FDD/TDD LTE, TD-SCDMA, 3G DC-HSPA+/HSPA,
    HS, PBAP-PCE and MAP-MCE
    3G CDMA EV-DOrB/rA, 3G CDMA 1x EDGE/GPRS/GSM
    + Integrated support for vehicle telematics such as
    + Integrated Cortex ARM A5 @ 550 MHz running Linux OS
    emergency assistance, safety and security, remote
    and QNX
    monitoring and diagnostics, and energy management
    + Support for eCall, application processing for telematics
    services suite

    Qualcomm VIVE™ Wi-Fi® and Bluetooth


    + Dual-band 802.11ac for high performance Wi-Fi®
    communication including Simultaneous Station, Access
    Point, and Point-to-Point operation
    + Supports Miracast™ wireless display, MirrorLink™ 1.2
    wireless control, and Bluetooth Low Energy Profile 4.0
    for seamless integration of vehicle/device applications
    and control
    + High-performance 2x2 MIMO design reduces signal loss,
    while shared antennas and advanced coexistence mitigate
    Wi-Fi/Bluetooth/LTE interference; support for 802.11p for
    DSRC and V2V safety applications
    HARDWARE SPECIFICATIONS
    Chipset WWAN
    + S602A 23x23, PMM8920, QCA6574, RGR7640 + MDM9x15 LTE module
    Memory/Storage Wired Connectivity
    + 4GB(3GB accessible)/2GB DDR3L-1066 + Atmel SAM4E/SAMV71 Network processor
    + 64 GB eMMC + Ethernet AVB support (limited function with SAM4E)
    + 64MB SPI NOR Flash + CAN interface x2, LIN interface x1
    + One SD card slot
    Hard Keys
    Three Display Outputs + Four SW definable buttons
    + LVDS to FPDLINK III + Power and reset buttons
    + HDMI
    Main Board Connectors
    + DSI to HDMI
    + 12V DC jack
    + Touch screen on FDPLINK III display
    + USB2.0: One micro OTG, three host type-A;
    + Additional touch screen on USB interface
    + One SD card slot
    Wireless Connectivity + One SIM card slot
    + WLAN: 802.11ac, 2.5GHz/5GHz, + One SATA connector
    + BT 4.0, + JTAG, USB to UART debug connector
    + GPS + Display: FDPLINK III x1, HDMI x2 (1080p x1, 720p x1)
    Camera Inputs + Camera: FPDLINK II x1, CVBS in x 3 (2 concurrent)
    + FPD-LINK II Input + Antenna: 2 WAN, 2 WLAN/BT, 1 GPS
    + CVBS video input + RCM connector

    Audio Radio Board Connectors


    + NXP Dirana3 car audio and radio system + Speaker amp DC power input
    + 6-ch audio output (speaker x4, line out x2) + Speaker output x4, Line output x2
    + 4 microphone input + Microphone input x4
    + MDM modem audio support + Aux audio input jack
    + Early sound play with analog audio from the + Radio antenna connectors
    network processor + JTAG

    Sensors Network Board Connectors


    + Accelerometer, Compass + Ethernet socket x1
    + CAN connector x2, LIN connector x1
    + 12V permanent power connector
    + JTAG

    To learn more visit qualcomm.com/solutions/automotive

    © 2014 Qualcomm Technologies, Inc. All rights reserved. Qualcomm, Qualcomm Snapdragon, Qualcomm Gobi, Hexagon, Adreno, FlexRender and Krait are products of Qualcomm Technologies,
    Inc. registered in the United States and other countries. Qualcomm VIVE and Qualcomm IZat are trademarks of Qualcomm Atheros, Inc. Trademarks of Qualcomm Incorporated are used with
    permission. Other products and brand names may be trademarks or registered trademarks of their respective owners.

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