Quectel_EC20_Hardware_Design_V1.3

EC20 Hardware Design
LTE Module Series
Rev. EC20_Hardware_Design_V1.3
Date: 2016-06-28
www.quectel.com
LTE Module Series
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.

Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
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http://www.quectel.com/support/salesupport.aspx
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For technical support, or to report documentation errors, please visit:
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http://www.quectel.com/support/techsupport.aspx
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Or email to: Support@quectel.com
GENERAL NOTES
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QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
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PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
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ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. THE INFORMATION SUPPLIED HEREIN IS SUBJECT TO
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CHANGE WITHOUT PRIOR NOTICE.
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COPYRIGHT
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THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS
DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT
PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS
ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL
OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2016. All rights reserved.
EC20_Hardware_Design Confidential / Released 1 / 84

LTE Module Series
About the Document
History
Revision Date
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Author Description
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Mountain ZHOU/
1.0 2015-02-13 Initial
Mike ZHANG
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1. Added UART interface pins
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2. Added FOTA upgrade mode
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3. Added EC20-CE info
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4. Updated module dimension information
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5. Updated EC20-C bands
1.1 2015-08-14 Mountain ZHOU
6. Updated functional diagram
7. Updated power supply reference circuit
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8. Updated description of UART interface
9. Updated current consumption
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10. Updated GNSS sensitivity
1. Added EC20-C ordering code notes
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2. Added EC20-CE sensitivity and current
3. Updated internet protocol
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4. Updated UART interface feature
1.2 2015-10-23 Mountain ZHOU
5. Updated functional diagram
6. Updated turning on timing
7. Updated GNSS performance
8. Released USIM_PRESENCE function
1. Added RF Receiving Sensitivity
2. Updated Temperature Range
3. Updated CDMA & TD-SCDMA power class
4. Added the note of Rx-diversity antenna
Wison HE/
1.3 2016-06-28 (ANT_DIV)
Mountain ZHOU
5. Updated USB test points figure
6. Modified PCM timing figure
7. Updated current consumption
8. Added reel packaging information.

LTE Module Series
Contents
About the Document ................................................................................................................................... 2

Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 5
Figure Index ................................................................................................................................................. 7
1 Introduction .......................................................................................................................................... 8
1.1. Safety Information...................................................................................................................... 8
2 Product Concept ................................................................................................................................ 10
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2.1. General Description ................................................................................................................. 10
2.2. Key Features ........................................................................................................................... 11
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2.3. Functional Diagram ................................................................................................................. 13
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2.4. Evaluation Board ..................................................................................................................... 14
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3 Application Interface ......................................................................................................................... 15
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3.2. Pin Assignment ........................................................................................................................ 16
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3.3. Pin Description......................................................................................................................... 17
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3.4. Operating Modes ..................................................................................................................... 22
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3.5. Power Saving........................................................................................................................... 23
3.5.1. Sleep Mode .................................................................................................................... 23
3.5.1.1. UART Application ................................................................................................. 23
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3.5.1.2. USB Application with USB Remote Wakeup Function ........................................ 24
3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 24
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3.5.1.4. USB Application without USB Suspend Function ................................................ 25
3.5.2. Airplane Mode ................................................................................................................ 26
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3.6. Power Supply........................................................................................................................... 26
3.6.1. Power Supply Pins ......................................................................................................... 26
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3.6.2. Decrease Voltage Drop .................................................................................................. 27
3.6.3. Reference Design for Power Supply .............................................................................. 28
3.6.4. Monitor the Power Supply .............................................................................................. 28
3.7. Turn on and off Scenarios ....................................................................................................... 29
3.7.1. Turn on Module Using the PWRKEY ............................................................................. 29
3.7.2. Turn off Module .............................................................................................................. 31
3.7.2.1. Turn off Module Using the PWRKEY Pin............................................................. 31
3.7.2.2. Turn off Module Using AT Command ................................................................... 31
3.8. Reset the Module..................................................................................................................... 31
3.9. USIM Card Interface ................................................................................................................ 33
3.10. USB Interface .......................................................................................................................... 35
3.11. UART Interface ........................................................................................................................ 37
3.12. PCM and I2C Interface ............................................................................................................ 39
3.13. ADC Function .......................................................................................................................... 42
3.14. Network Status Indication ........................................................................................................ 42

LTE Module Series
3.15. Operation Status Indication ..................................................................................................... 44

3.16. Behavior of the RI .................................................................................................................... 44
4 GNSS Receiver ................................................................................................................................... 46

4.2. GNSS Performance ................................................................................................................. 47
4.3. Layout Guideline ...................................................................................................................... 48
5 Antenna Interface ............................................................................................................................... 49

5.1. Main/Rx-diversity Antenna Interface........................................................................................ 49
5.1.1. Pin Definition .................................................................................................................. 49
5.1.2. Operating Frequency ..................................................................................................... 49
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5.1.3. Reference Design .......................................................................................................... 50
5.2. GNSS Antenna Interface ......................................................................................................... 51
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5.3. Antenna Installation ................................................................................................................. 52
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5.3.1. Antenna Requirement .................................................................................................... 52
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5.3.2. Install the Antenna with RF Connector .......................................................................... 53
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6 Electrical, Reliability and Radio Characteristics ............................................................................ 55
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6.1. Absolute Maximum Ratings ..................................................................................................... 55
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6.2. Power Supply Ratings ............................................................................................................. 55
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6.3. Temperature Range ................................................................................................................. 56
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6.4. Current Consumption .............................................................................................................. 57
6.5. RF Output Power ..................................................................................................................... 64
6.6. RF Receiving Sensitivity .......................................................................................................... 65
6.7. Electrostatic Discharge ............................................................................................................ 68
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7 Mechanical Dimensions .................................................................................................................... 69
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7.1. Mechanical Dimensions of the Module.................................................................................... 69
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7.2. Recommended Footprint ......................................................................................................... 71
7.3. Top and Bottom View of the Module........................................................................................ 74
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8 Storage, Manufacturing and Packaging .......................................................................................... 75
8.1. Storage..................................................................................................................................... 75
8.2. Manufacturing and Welding ..................................................................................................... 75
8.3. Packaging ................................................................................................................................ 76
9 Appendix A References..................................................................................................................... 78
10 Appendix B GPRS Coding Schemes ............................................................................................... 82
11 Appendix C GPRS Multi-slot Classes .............................................................................................. 83
12 Appendix D EDGE Modulation and Coding Schemes ................................................................... 84

LTE Module Series
Table Index
TABLE 1: EC20 SERIES FREQUENCY BANDS ...................................................................................... 10

TABLE 2: EC20 KEY FEATURES ...............................................................................................................11
TABLE 3: I/O PARAMETERS DEFINITION ............................................................................................... 17
TABLE 4: PIN DESCRIPTION ................................................................................................................... 17
TABLE 5: OVERVIEW OF OPERATING MODES ..................................................................................... 22
TABLE 6: VBAT AND GND PINS ............................................................................................................... 27
TABLE 7: PWRKEY PIN DESCRIPTION ................................................................................................... 29
TABLE 8: RESET_N PIN DESCRIPTION.................................................................................................. 32
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TABLE 9: PIN DEFINITION OF THE USIM INTERFACE .......................................................................... 33
TABLE 10: USB PIN DESCRIPTION ......................................................................................................... 35
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TABLE 11: PIN DEFINITION OF THE UART INTERFACE ....................................................................... 37
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TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ......................................................... 37
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TABLE 13: LOGIC LEVELS OF DIGITAL I/O............................................................................................. 38
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TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACE .................................................................. 41
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TABLE 15: PIN DEFINITION OF THE ADC ............................................................................................... 42
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TABLE 16: CHARACTERISTIC OF THE ADC........................................................................................... 42
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TABLE 17: PIN DEFINITION OF NETWORK INDICATOR ....................................................................... 43
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TABLE 18: WORKING STATE OF THE NETWORK INDICATOR ............................................................. 43
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TABLE 19: PIN DEFINITION OF STATUS ................................................................................................. 44
TABLE 20: BEHAVIOR OF THE RI ............................................................................................................ 45
TABLE 21: GNSS PERFORMANCE .......................................................................................................... 47
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TABLE 22: PIN DEFINITION OF THE RF ANTENNA ............................................................................... 49
TABLE 23: MODULE OPERATING FREQUENCIES ................................................................................ 49
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TABLE 24: PIN DEFINITION OF GNSS ANTENNA .................................................................................. 51
TABLE 25: GNSS FREQUENCY ............................................................................................................... 51
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TABLE 26: ANTENNA REQUIREMENTS .................................................................................................. 52
TABLE 27: ABSOLUTE MAXIMUM RATINGS........................................................................................... 55
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TABLE 28: MODULE POWER SUPPLY RATINGS ................................................................................... 55
TABLE 29: TEMPERATURE RANGE ........................................................................................................ 56
TABLE 30: EC20-A CURRENT CONSUMPTION ...................................................................................... 57
TABLE 31: EC20-C CURRENT CONSUMPTION ..................................................................................... 58
TABLE 32: EC20-CE CURRENT CONSUMPTION ................................................................................... 60
TABLE 33: EC20-E CURRENT CONSUMPTION...................................................................................... 62
TABLE 34: CONDUCTED RF OUTPUT POWER...................................................................................... 64
TABLE 35: EC20-A CONDUCTED RF RECEIVING SENSITIVITY .......................................................... 65
TABLE 36: EC20-C CONDUCTED RF RECEIVING SENSITIVITY .......................................................... 66
TABLE 37: EC20-CE CONDUCTED RF RECEIVING SENSITIVITY ....................................................... 66
TABLE 38: EC20-E CONDUCTED RF RECEIVING SENSITIVITY .......................................................... 67
TABLE 39: ELECTROSTATIC DISCHARGE CHARACTERISTICS.......................................................... 68
TABLE 40: REEL PACKAGING.................................................................................................................. 77
TABLE 41: RELATED DOCUMENTS ........................................................................................................ 78
TABLE 42: TERMS AND ABBREVIATIONS .............................................................................................. 78

LTE Module Series
TABLE 43: DESCRIPTION OF DIFFERENT CODING SCHEMES .......................................................... 82

TABLE 44: GPRS MULTI-SLOT CLASSES ............................................................................................... 83
TABLE 45: EDGE MODULATION AND CODING SCHEMES ................................................................... 84
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LTE Module Series
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ........................................................................................................ 14

FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ............................................................................................. 16
FIGURE 3: UART SLEEP MODE APPLICATION ...................................................................................... 23
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP............................................. 24
FIGURE 5: SLEEP MODE APPLICATION WITH RI ................................................................................. 25
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ........................................ 25
FIGURE 7: POWER SUPPLY LIMITS DURING TRANSMIT BURST ....................................................... 27
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY .................................................................... 28
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FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY ....................................................................... 28
FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ......................................................... 29
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FIGURE 11: TURN ON THE MODULE USING KEYSTROKE .................................................................. 30
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FIGURE 12: TIMING OF TURNING ON MODULE ................................................................................... 30
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FIGURE 13: TIMING OF TURNING OFF MODULE .................................................................................. 31
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FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT .............................. 32
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FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON .............................................. 32
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FIGURE 16: TIMING OF RESETTING MODULE ...................................................................................... 33
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FIGURE 17: REFERENCE CIRCUIT FOR 8-PIN USIM CONNECTOR ................................................... 34
FIGURE 18: REFERENCE CIRCUIT FOR 6-PIN USIM CONNECTOR ................................................... 34
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FIGURE 19: TEST POINTS FOR FIRMWARE UPGRADE....................................................................... 36
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP............................................................ 38
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT ...................................................... 39
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FIGURE 22: TIMING IN PRIMARY MODE ................................................................................................ 40
FIGURE 23: TIMING IN AUXILIARY MODE .............................................................................................. 40
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FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ............................ 41
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FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .................................................. 43
FIGURE 26: REFERENCE CIRCUIT OF THE STATUS............................................................................ 44
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FIGURE 27: REFERENCE CIRCUIT OF ANTENNA INTERFACE ........................................................... 50
FIGURE 28: REFERENCE CIRCUIT OF GNSS ANTENNA ..................................................................... 51
FIGURE 29: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ........................................ 53
FIGURE 30: MECHANICALS OF UF.L-LP CONNECTORS ..................................................................... 53
FIGURE 31: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ................................................... 54
FIGURE 32: MODULE TOP AND SIDE DIMENSIONS ............................................................................. 69
FIGURE 33: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ......................................................... 70
FIGURE 34: BOTTOM PADS DIMENSIONS (BOTTOM VIEW) ............................................................... 70
FIGURE 35: RECOMMENDED FOOTPRINT (TOP VIEW) ...................................................................... 71
FIGURE 36: RECOMMENDED STENCIL ................................................................................................. 72
FIGURE 37: RECOMMENDED FOOTPRINT WITH PINS 117~140......................................................... 73
FIGURE 38: TOP VIEW OF THE MODULE .............................................................................................. 74
FIGURE 39: BOTTOM VIEW OF THE MODULE ...................................................................................... 74
FIGURE 40: REFLOW SOLDERING THERMAL PROFILE ...................................................................... 76
FIGURE 41: CARRIER TAPE .................................................................................................................... 77

LTE Module Series
1 Introduction
This document defines the EC20 module, and describes its air interface and hardware interface which are
connected with your application.
This document can help you quickly understand module interface specifications, electrical and
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mechanical details, as well as other related information of EC20 module. Associated with application
notes and user guide, you can use EC20 module to design and set up mobile applications easily.
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1.1. Safety Information
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The following safety precautions must be observed during all phases of the operation, such as usage,
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service or repair of any cellular terminal or mobile incorporating EC20 module. Manufacturers of the cellular
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terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
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Full attention must be given to driving at all times in order to reduce the risk of an
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accident. Using a mobile while driving (even with a handsfree kit) causes
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distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
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Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care
facilities. These requests are desinged to prevent possible interference with
sentitive medical equipment.

LTE Module Series
Cellular terminals or mobiles operating over radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid SIM card. While you are in this condition and need emergent
help, please remember using emergency call. In order to make or receive a call,
the cellular terminal or mobile must be switched on and in a service area with
adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON ,

it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
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In locations with potencially explosive atmospheres, obey all posted signs to turn
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off wireless devices such as your phone or other cellular terminals. Areas with
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potencially exposive atmospheres include fuelling areas, below decks on boats,
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fuel or chemical transfer or storage facilities, areas where the air contains
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chemicals or particles such as grain, dust or metal powders.
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LTE Module Series
2 Product Concept
2.1. General Description
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EC20 is a series of LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/CDMA/GSM wireless communication
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module with receive diversity. It provides data connectivity on FDD-LTE, TDD-LTE, DC-HSPA+, HSPA+,
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HSDPA, HSUPA, WCDMA, TD-SCDMA, CDMA, EDGE and GPRS networks. It can also provide
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GPS/GLONASS1) and voice functionality2) to meet your specific application demands. EC20 contains four
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variants: EC20-A, EC20-C, EC20-CE and EC20-E. You can choose a dedicated type based on the region
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or operator. The following table shows the frequency bands of EC20.
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Table 1: EC20 Series Frequency Bands
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EC20-A EC20-C3) EC20-CE EC20-E
FDD-LTE
B2/B4/B5/B12/B17 B1/B3/B8 B1/B3 B1/B3/B5/B7/B8/B20
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(with Rx-diversity)
TDD-LTE
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Not supported B38/B39/B40/B41 B38/B39/B40/B41 Not supported
(with Rx-diversity)
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WCDMA
B2/B4/B5 B1/B8 B1 B1/B5/B8
(with Rx-diversity)
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TD-SCDMA
Not supported B34/B39 B34/B39 Not supported
(with Rx-diversity)
CDMA
Not supported Not supported BC0 Not supported
(with Rx-diversity)
GSM 850/1900 900/1800 900/1800 850/900/1800/1900
GNSS GPS+GLONASS GPS+GLONASS GPS+GLONASS GPS+GLONASS
NOTES
1)
1. GPS/GLONASS function is optional.
2)
2. EC20 series (EC20-A/EC20-C/EC20-CE/EC20-E) includes Data-only and Telematics versions.
Data-only version does not support voice function, while Telematics version supports it.
3)
3. EC20-C includes EC20CA-256-STD and EC20CD-256-STD (Ordering Code). EC20CD-256-STD

LTE Module Series
does not support Rx-diversity and GNSS function.
With a compact profile of 32.0mm × 29.0mm × 2.4mm, EC20 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security solutions, routers, wireless POS,
mobile computing devices, PDA phone, tablet PC, etc..
EC20 is an SMD type module, and can be embedded into applications through its 140-pin pads which
include 76 LCC signal pads and 64 other pads.
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2.2. Key Features
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The following table describes the detailed features of EC20 module.
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Table 2: EC20 Key Features
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Feature Details
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Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V
Class 4 (33dBm±2dB) for GSM850 and EGSM900

Class 1 (30dBm±2dB) for DCS1800 and PCS1900
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Class E2 (27dBm±3dB) for GSM850 and EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 and PCS1900 8-PSK
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Transmitting Power Class 3 (24dBm+6/-1dB) for CDMA BC0
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Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 2 (24dBm+1/-3dB) for TD-SCDMA bands
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Class 3 (23dBm±2dB) for LTE FDD bands
Class 3 (23dBm±2dB) for LTE TDD bands
Support 3GPP R9 CAT3 FDD and TDD
Support 1.4 to 20MHz RF bandwidth
LTE Features Support 2 × 2 MIMO in DL direction
FDD: Max 100Mbps (DL), 50Mbps (UL)
TDD: Max 61Mbps (DL), 18Mbps (UL)
Support 3GPP R8 DC-HSPA+
Support 16-QAM, 64-QAM and QPSK modulation
WCDMA Features
3GPP R6 HSUPA: Max 5.76Mbps (UL)
3GPP R8 DC-HSPA+: Max 42Mbps (DL)
Support 3GPP R8 1.28 TDD
TD-SCDMA Features
Max 4.2Mbps (DL), 2.2Mbps (UL)
Support 1x Advanced
CDMA Features
Max 14.7Mbps (UL), 5.4Mbps (DL)

LTE Module Series
R99: CSD: 9.6kbps, 14.4kbps

GPRS:
Support GPRS multi-slot class 12 (12 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Maximum of four Rx time slots per frame
GSM Features EDGE:
Support EDGE multi-slot class 12 (12 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
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Support TCP/UDP/PPP/FTP/HTTP/SMTP/MMS/NTP/PING/QMI protocols
Support the protocols PAP (Password Authentication Protocol) and CHAP
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Internet Protocol Features
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(Challenge Handshake Authentication Protocol) which are usually used for
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PPP connections
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Text and PDU mode
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Point to point MO and MT
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SMS
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SMS cell broadcast
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SMS storage: ME by default
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USIM Interface Support USIM/SIM card: 1.8V, 3.0V
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Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features 1) WCDMA: AMR/AMR-WB
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LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
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Used for audio function with external codec
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Support 8-bit A-law 2), μ-law 2) and 16-bit linear data formats
PCM Interface 1)
Support long frame sync and short frame sync
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Support master and slave mode, but must be the master in long frame sync
Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
USB Interface
output, software debugging and firmware upgrade
USB Driver: Windows XP, Windows Vista, Windows 7, Windows 8/8.1,
Window CE 5.0/6.0/7.0, Linux 2.6 or later, Android 2.3/4.0/4.2/4.4/5.0
Main UART:
Used for AT command communication and data transmission
Baud rate reach up to 921600bps; 115200bps by default
Support RTS and CTS hardware flow control
UART Interface
Support multiplexing function
Debug UART:
Used for Linux console, log and GNSS NMEA output
115200bps baud rate

LTE Module Series
Rx-diversity Support LTE/WCDMA/TD-SCDMA/CDMA Rx-diversity
gpsOne Gen8A of Qualcomm (GPS and GLONASS)

GNSS Features
Protocol: NMEA 0183
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
AT Commands
commands
Two pins including NET_MODE and NET_STATUS to indicate network
Network Indication
connectivity status
Including main antenna (ANT_MAIN), Rx-diversity antenna (ANT_DIV) and
Antenna Interface
GNSS antenna (ANT_GNSS)
Size: 32.0±0.15 × 29.0±0.15 × 2.4±0.2mm
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Physical Characteristics
Weight: approx. 4.9g
Operation temperature range3): -35℃ ~ +75℃
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Temperature Range
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Extended temperature range4): -40℃ ~ +85℃
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Firmware Upgrade USB interface and DFOTA
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RoHS All hardware components are fully compliant with EU RoHS directive
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NOTES
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1)
1. Audio (PCM) function is only supported on Telematics version.
2)
2. This function is under development.
3)
3. Within operation temperature range, the module is 3GPP compliant.
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4)
4. Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction; there are
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also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
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Pout might reduce in their value and exceed the specified tolerances. When the temperature returns
to the normal operating temperature levels, the module will meet 3GPP compliant again.
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2.3. Functional Diagram
The following figure shows a block diagram of EC20 and illustrates the major functional parts.
 Power management
 Baseband
 DDR+NAND flash
 Radio frequency
 Peripheral interface

LTE Module Series
ANT_MAIN ANT_GNSS ANT_DIV
Switch SAW Switch
Duplex LNA
SAW
VBAT_RF
PA SAW
APT
PRx DRx
Tx
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2G NAND
Transceiver 1G SDRAM
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IQ Control
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VBAT_BB
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PMIC
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Control
PWRKEY
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RESET_N
Baseband
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ADCs
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STATUS 19.2M
XO
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VDD_EXT USB USIM PCM I2C UART GPIOs
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Figure 1: Functional Diagram
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2.4. Evaluation Board
In order to help you develop applications with EC20, Quectel supplies an evaluation board (EVB), USB
data cable, earphone, antenna and other peripherals to control or test the module.

LTE Module Series
3 Application Interface
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EC20 is equipped with 76-pin 1.3mm pitch SMT pads plus 64-pin ground pads and reserved pads that
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can be connect to cellular application platform. Sub-interfaces included in these pads are described in
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detail in the following chapters:
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 Power supply
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 USIM interface
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 USB interface
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 UART interface
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 PCM interface
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 ADC interface
 Status indication
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LTE Module Series
3.2. Pin Assignment
The following figure shows the pin assignment of EC20 module.
RESERVED
RESERVED
RESERVED
USB_VBUS
VBAT_RF
VBAT_BB
VBAT_BB
VBAT_RF
USB_DM
USB_DP
STATUS
GND
GND
DCD
RXD
DTR
CTS
TXD
RTS
RI
114
113
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
WAKEUP_IN 1 54 GND
AP_READY 2 53 GND
129 117
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RESERVED 3 52 GND
108 103 99 95 90 85
W_DISABLE# 4 130 118 51 GND
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NET_MODE 5 131 119 50 GND
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NET_STATUS 6 49 ANT_MAIN
l
132 120 109 104 100 96 91 86
c
VDD_EXT 7 48 GND
133 121
e a
82 79 76 73
i
134 122
GND 8 110 105 83 80 77 74 47 ANT_GNSS
t
92 87
135 123
u
GND 9 84 81 78 75 46 GND
USIM_GND 10 45 ADC0
n
136 124
DBG_RXD 11 44 ADC1
106 101 97 93 88
Q ide
137 125 111
DBG_TXD 12 43 RESERVED
USIM_PRESENCE 13 42 I2C_SDA
138 126
USIM_VDD 14 41 I2C_SCL
USIM_DATA 15 139 127 112 107 102 98 94 89 40 RESERVED
f
USIM_CLK 16 39 RESERVED
140 128
USIM_RST 17 38 RESERVED
n
RESERVED 18 37 RESERVED
116 RESERVED
115 RESERVED
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
o
RESET_N
PCM_IN※
PCM_OUT※
PCM_SYNC※
PCM_CLK※
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
PWRKEY
GND
GND
GND
ANT_DIV
C
Power Pins GND Pins Signal Pins RESERVED Pins
Figure 2: Pin Assignment (Top View)
NOTES
1. Keep all RESERVED pins and unused pins unconnected.

2. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84
should not be designed in schematic and PCB decal.
※
3. “ ” means these interface functions are only supported on Telematics version.

LTE Module Series
3.3. Pin Description
The following tables show the EC20’s pin definition.
Table 3: I/O Parameters Definition
Type Description
IO Bidirectional input/output
l
DI Digital input
e
DO Digital output
t l
PI Power input
c a
PO Power output
e t i
AI Analog input
u n
AO Analog output
Q ide
OD Open drain
f
Table 4: Pin Description
n
Power Supply
o
Pin Name Pin No. I/O Description DC Characteristics Comment
C
Power supply for Vmax=4.3V It must be able to
VBAT_BB 59, 60 PI module’s baseband Vmin=3.3V provide sufficient
part. Vnorm=3.8V current up to 0.8A.
It must be able to
Vmax=4.3V
Power supply for provide sufficient
VBAT_RF 57, 58 PI Vmin=3.3V
module’s RF part. current up to 1.8A in a
Vnorm=3.8V
transmitting burst.
Provide 1.8V power Power supply for
Vnorm=1.8V
VDD_EXT 7 PO supply for external external GPIO’s pull up
IOmax=50mA
circuit. circuits.
8, 9, 19,
22, 36, 46,
GND Ground.
48, 50~54,
56, 72,

LTE Module Series
85~112
Turn on/off
VIHmax=2.1V
Turn on/off the Pull-up to 1.8V
PWRKEY 21 DI VIHmin=1.3V
module. internally.
VILmax=0.5V
VIHmax=2.1V
Pull-up to 1.8V
RESET_N 20 DI Reset the module. VIHmin=1.3V
internally. Active low.
VILmax=0.5V
l
Status Indication
t e
c l
The drive current Require external
Indicate the module
a
STATUS 61 OD should be less than pull-up. If unused,
e i
operating status.
0.9mA. keep it open.
u t
Indicate the module 1.8V power domain.
VOHmin=1.35V
n
NET_MODE 5 DO network registration If unused, keep it
VOLmax=0.45V
mode. open.
Q ide
Indicate the module 1.8V power domain.
NET_ VOHmin=1.35V
6 DO network activity If unused, keep it
STATUS VOLmax=0.45V
status. open.
f
USB Interface
n
o
Vmax=5.25V
USB_VBUS 71 PI USB detection. Vmin=3.0V
C
Vnorm=5.0V
Compliant with USB
USB differential data Require differential
USB_DP 69 IO 2.0 standard
bus. impedance of 90ohm.
specification.
Compliant with USB
USB differential data Require differential
USB_DM 70 IO 2.0 standard
bus. impedance of 90ohm.
specification.
USIM Interface
Specified ground for

USIM_GND 10
USIM card.
Power supply for For 1.8V USIM: Either 1.8V or 3V is
USIM_VDD 14 PO
USIM card. Vmax=1.9V supported by the

LTE Module Series
Vmin=1.7V module automatically.
For 3.0V USIM:

Vmax=3.05V
Vmin=2.7V
IOmax=50mA
For 1.8V USIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
l
Data signal of USIM
USIM_DATA 15 IO
card.
For 3.0V USIM:
t e
VILmax=1.0V
l
VIHmin=1.95V
c
VOLmax=0.45V
a
VOHmin=2.55V
e t i
For 1.8V USIM:
u
VOLmax=0.45V
n
VOHmin=1.35V
Clock signal of USIM
Q ide
USIM_CLK 16 DO
card.
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
f
For 1.8V USIM:
n
VOLmax=0.45V
VOHmin=1.35V
Reset signal of
o
USIM_RST 17 DO
USIM card.
For 3.0V USIM:
C
VOLmax=0.45V
VOHmin=2.55V
VILmin=-0.3V
1.8V power domain.
USIM_PRE USIM card insertion VILmax=0.6V
13 DI If unused, keep it
SENCE detection. VIHmin=1.2V
open.
VIHmax=2.0V
UART Interface
1.8V power domain.

VOLmax=0.45V
RI 62 DO Ring indicator If unused, keep it
VOHmin=1.35V
open.
Data carrier VOLmax=0.45V 1.8V power domain.
DCD 63 DO
detection. VOHmin=1.35V If unused, keep it

LTE Module Series
open.
1.8V power domain.

VOLmax=0.45V
CTS 64 DO Clear to send. If unused, keep it
VOHmin=1.35V
open.
VILmin=-0.3V
1.8V power domain.
VILmax=0.6V
RTS 65 DI Request to send. If unused, keep it
VIHmin=1.2V
open.
VIHmax=2.0V
1.8V power domain.
VILmin=-0.3V Pull-up by default.
l
Data terminal ready, VILmax=0.6V Low level wakes up
DTR 66 DI
sleep mode control. VIHmin=1.2V the module.
e
VIHmax=2.0V If unused, keep it
t
open.
c l
1.8V power domain.
VOLmax=0.45V
a
TXD 67 DO Transmit data. If unused, keep it
e i
VOHmin=1.35V
open.
u t
VILmin=-0.3V
1.8V power domain.
n
VILmax=0.6V
RXD 68 DI Receive data. If unused, keep it
VIHmin=1.2V
Q ide
open.
VIHmax=2.0V
Debug UART Interface
f
n
1.8V power domain.
VOLmax=0.45V
DBG_TXD 12 DO Transmit data. If unused, keep it
o
VOHmin=1.35V
open.
VILmin=-0.3V
C
1.8V power domain.
VILmax=0.6V
DBG_RXD 11 DI Receive data. If unused, keep it
VIHmin=1.2V
open.
VIHmax=2.0V
ADC Interface
General purpose
Voltage range: If unused, keep it
ADC0 45 AI analog to digital
0.3V to VBAT_BB open.
converter.
General purpose
Voltage range: If unused, keep it
ADC1 44 AI analog to digital
0.3V to VBAT_BB open.
converter.
PCM Interface

LTE Module Series
VILmin=-0.3V
1.8V power domain.
VILmax=0.6V
PCM_IN 24 DI PCM data input. If unused, keep it
VIHmin=1.2V
open.
VIHmax=2.0V
1.8V power domain.
VOLmax=0.45V
PCM_OUT 25 DO PCM data output. If unused, keep it
VOHmin=1.35V
open.
VOLmax=0.45V 1.8V power domain.
VOHmin=1.35V In master mode, it is
l
VILmin=-0.3V an output signal. In
PCM data frame
PCM_SYNC 26 IO slave mode, it is an
sync signal. VILmax=0.6V input signal.
e
VIHmin=1.2V If unused, keep it
t
VIHmax=2.0V open.
c l
VOLmax=0.45V 1.8V power domain.
In master mode, it’s
a
VOHmin=1.35V
e i
an output signal. In
VILmin=-0.3V
t
PCM_CLK 27 IO PCM clock. slave mode, it is an
u
VILmax=0.6V input signal.
n
VIHmin=1.2V If unused, keep it
VIHmax=2.0V open.
Q ide
I2C Interface
f
External pull-up
n
resistor is required.
I2C_SCL 41 OD I2C serial clock.
1.8V only. If unused,
o
keep it open.
External pull-up
C
resistor is required.
I2C_SDA 42 OD I2C serial data.
1.8V only. If unused,
keep it open.
RF Interface
If unused, keep it
ANT_DIV 35 AI Diversity antenna. 50ohm impedance.
open.
ANT_MAIN 49 IO Main antenna. 50ohm impedance.
If unused, keep it
ANT_GNSS 47 AI GNSS antenna. 50ohm impedance.
open.
GPIO Pins

LTE Module Series
1.8V power domain.

VILmin=-0.3V
Pull-up by default.
VILmax=0.6V
WAKEUP_IN 1 DI Sleep mode control. Low level wakes up
VIHmin=1.2V
the module. If
VIHmax=2.0V
unused, keep it open.
1.8V power domain.
VILmin=-0.3V Pull-up by default.
Airplane mode VILmax=0.6V In low voltage level,
W_DISABLE# 4 DI
control. VIHmin=1.2V the module can enter
l
VIHmax=2.0V into airplane mode. If
unused, keep it open.
e
VILmin=-0.3V
t
Application 1.8V power domain.
VILmax=0.6V
l
AP_READY 2 DI processor sleep If unused, keep it
c
VIHmin=1.2V
state detection. open.
a
VIHmax=2.0V
e t i
RESERVED Pins
u n
Q ide
3, 18, 23,
28~34,
Keep these pins
RESERVED 37~40, 43, Reserved.
unconnected.
55, 73~84,
f
113~140
o n
3.4. Operating Modes
C
The table below briefly summarizes the various operating modes referred in the following chapters.
Table 5: Overview of Operating Modes
Mode Details
Software is active. The module has registered to the network, and the
Idle
Normal module is ready to send and receive data.
Operation Network connection is ongoing. In this mode, the power consumption is
Talk/Data
decided by network setting and data transfer rate.
Minimum AT+CFUN command can set the module to enter into a minimum functionality mode
Functionality without removing the power supply. In this case, both RF function and USIM card will be
Mode invalid.

LTE Module Series
Airplane AT+CFUN command and W_DISABLE# pin can set the module to enter into airplane
Mode mode. In this case, RF function will be invalid.
In this mode, the current consumption of the module will be reduced to the minimal level.
Sleep Mode During this mode, the module can still receive paging message, SMS, voice call and
TCP/UDP data from the network normally.
In this mode, the power management unit shuts down the power supply. Software is not
Power Down
active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF
Mode
and VBAT_BB) remains applied.
l
3.5. Power Saving
t e
3.5.1. Sleep Mode
c l
EC20 is able to reduce its current consumption to a minimum value during the sleep mode. The following
a
section describes EC20’s power saving procedure.
u e
3.5.1.1. UART Application
n t i
Q ide
If host communicates with the module via UART interface, the following preconditions can let the module
enter into sleep mode.
f
 Execute AT command AT+QSCLK=1 to enable sleep mode.

n
Drive DTR to high level.
o
The following figure shows the connection between the module and the host.
C
Module Host
RXD TXD
TXD RXD
RI EINT
DTR GPIO
AP_READY GPIO
GND GND
Figure 3: UART Sleep Mode Application
 Driving host DTR to low level will wake up the module.

 When EC20 has URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details
about RI behavior.

LTE Module Series
 AP_READY will detect the sleep state of host (can be configured to high level or low level detection).
Refer to AT command AT+QCFG=“apready” for details.
3.5.1.2. USB Application with USB Remote Wakeup Function
If host supports USB suspend/resume and remote wakeup function, the following three preconditions
must be met to make the module enter into the sleep mode.
 Execute AT command AT+QSCLK=1 to enable the sleep mode.

 Ensure the DTR is held in high level or keep it open.
l
 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended
state.
t e l
e c ia
Module Host
u t
USB_VBUS VDD
n
USB_DP USB_DP
Q ide
USB_DM USB_DM
AP_READY GPIO
GND GND
n f
Figure 4: Sleep Mode Application with USB Remote Wakeup
o
 Sending data to EC20 through USB will wake up the module.
C
 When EC20 has URC to report, the module will send remote wake-up signals via USB BUS so as to
wake up the host.
3.5.1.3. USB Application with USB Suspend/Resume and RI Function
If host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is
needed to wake up the host.
There are three preconditions to let the module enter into the sleep mode.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended
state.

LTE Module Series
Module Host
USB_VBUS VDD
USB_DP USB_DP
USB_DM USB_DM
AP_READY GPIO
RI EINT
l
GND GND
t e
Figure 5: Sleep Mode Application with RI
c a l

e
Sending data to EC20 through USB will wake up the module.
i

t
When EC20 has URC to report, RI signal will wake up the host.
u
Q ide n
3.5.1.4. USB Application without USB Suspend Function
If host does not support USB suspend function, you should disconnect USB_VBUS with additional control
circuit to let the module enter into sleep mode.
n f
o
 Disconnect USB_VBUS.
C
Module Host
GPIO
Power
USB_VBUS Switch VDD
USB_DP USB_DP
USB_DM USB_DM
RI EINT
AP_READY GPIO
GND GND
Figure 6: Sleep Mode Application without Suspend Function

LTE Module Series
Opening power switch to supply power to USB_VBUS will wake up the module.
NOTE
You should pay attention to the level match shown in dotted line between the module and the host. Refer
to document [1] for more details about EC20 power management application.
3.5.2. Airplane Mode
When the module enters into airplane mode, the RF function will not work, and all AT commands
l
correlative with RF function will be inaccessible. This mode can be set with the following ways.
t e
Hardware:
c l
The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplane
mode.
e t ia
Software:
u n
Command AT+CFUN provides the choice of the functionality level <fun>=0, 1, 4.
Q ide
 AT+CFUN=0: Minimum functionality mode; both USIM and RF function are disabled.
 AT+CFUN=1: Full functionality mode (by default).
 AT+CFUN=4: Airplane mode. RF function is disabled.
n f
NOTES
o
1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT
command AT+QCFG=“airplanecontrol”. Refer to document [2] for details.
C
2. The execution of AT+CFUN command will not affect GNSS function.
3.6. Power Supply
3.6.1. Power Supply Pins
EC20 provides four VBAT pins for connection with the external power supply. There are two separate
voltage domains for VBAT.
 VBAT_RF with two pins for module RF part.

 VBAT_BB with two pins for module baseband part.
The following table shows the VBAT pins and ground pins.

LTE Module Series
Table 6: VBAT and GND Pins
Pin Name Pin No. Description Min. Typ. Max. Unit
Power supply for module RF

VBAT_RF 57, 58 3.3 3.8 4.3 V
part.
Power supply for module
VBAT_BB 59, 60 3.3 3.8 4.3 V
baseband part.
8, 9, 19, 22, 36,
GND 46, 48, 50~54, Ground. - 0 - V
56, 72, 85~112
l
3.6.2. Decrease Voltage Drop
t e
The power supply range of the module is from 3.3V to 4.3V. Make sure the input voltage will never drop
c l
below 3.3V. The following figure shows the voltage drop during transmitting burst in 2G network. The
a
voltage drop will be less in 3G and 4G networks.
u e t i
Transmit Transmit
n
burst burst
Q ide
f
VBAT Ripple
Drop
n
Min.3.3V
o
Figure 7: Power Supply Limits during Transmit Burst
C
To decrease voltage drop, a bypass capacitor of about 100µF with low ESR should be used. Multi-layer
ceramic chip (MLCC) capacitor can provide the best combination of low ESR. The main power supply
from an external application has to be a single voltage source and can be expanded to two sub paths with
star structure. The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace
should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be.
Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the VBAT pins. The
capacitors should be placed close to the VBAT pins. In addition, in order to get a stable power source, it is
suggested that you should use a zener diode of which reverse zener voltage is 5.1V and dissipation
power is more than 0.5W. The following figure shows the star structure of the power supply.

LTE Module Series
VBAT
VBAT_RF
VBAT_BB
+ +
D1 C1 C2 C3 C4 C5 C6 C7 C8
5.1V 100uF 100nF 33pF 10pF 100uF 100nF 33pF 10pF
Module
l
Figure 8: Star Structure of the Power Supply
c t e
3.6.3. Reference Design for Power Supply
l
e ia
The power design for the module is very important, as the performance of the module largely depends on
t
the power source. The power supply is capable of providing sufficient current up to 2A at least. If the
u n
voltage drop between the input and output is not too high, it is suggested that you should use a LDO to
supply power for module. If there is a big voltage difference between the input source and the desired
Q ide
output (VBAT), a buck converter is preferred to be used as a power supply.
The following figure shows a reference design for +5V input power source. The designed output for the
f
power supply is about 3.8V and the maximum load current is 3A.
n
MIC29302WU
o
DC_IN VBAT
2 4
IN OUT
C
GND
ADJ
EN
100K
1%
1
51K
4.7K 470R
470uF 100nF
470uF 100nF
47K
VBAT_EN 47K 1%
Figure 9: Reference Circuit of Power Supply
3.6.4. Monitor the Power Supply
You can use the AT+CBC command to monitor the VBAT_BB voltage value. For more details, please
refer to document [2].

LTE Module Series
3.7. Turn on and off Scenarios
3.7.1. Turn on Module Using the PWRKEY
The following table shows the pin definition of PWRKEY.
Table 7: PWRKEY Pin Description
Pin Name Pin No. Description DC Characteristics Comment
l
VIHmax=2.1V
PWRKEY 21 Turn on/off the module. VIHmin=1.3V Pull-up to 1.8V internally.
e
VILmax=0.5V
c t l
When EC20 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a
a
low level for at least 100ms. It is recommended to use an open drain/collector driver to control the
e i
PWRKEY. After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be
t
released. A simple reference circuit is illustrated in the following figure.
u n
PWRKEY
Q ide
≥ 100ms
4.7K
f
Turn on pulse
o n 47K
C
Figure 10: Turn on the Module Using Driving Circuit
The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic
strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the
button for ESD protection. A reference circuit is shown in the following figure.

LTE Module Series
S1
PWRKEY
TVS
Close to S1
l
Figure 11: Turn on the Module Using Keystroke
t e
The turn on scenarios is illustrated in the following figure.
c a l
NOTE
u e t i
VBAT ≥ 100ms
n
VIH ≥ 1.3V
Q ide
PWRKEY VIL ≤ 0.5V
RESET_N
f
≤ 0.5s
n
STATUS
(OD)
o
≥ 7.5s
UART Inactive Active
C
≥ 9s
USB Inactive Active
Figure 12: Timing of Turning on Module
NOTE
Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than
30ms.

LTE Module Series
3.7.2. Turn off Module
The following procedures can be used to turn off the module:
 Normal power down procedure: Turn off the module using the PWRKEY pin.
 Normal power down procedure: Turn off the module using command AT+QPOWD.
3.7.2.1. Turn off Module Using the PWRKEY Pin
Driving the PWRKEY to a low level voltage for at least 0.6s, the module will execute power-down
l
procedure after PWRKEY is released. The power-down scenario is illustrated in the following figure.
t e l
VBAT
c a
≥ 0.6s Log off from network in about 1~60s
u e t i
PWRKEY
n
STATUS
Q ide
(OD)
Module RUNNING Power-down procedure OFF

Status
n f
Figure 13: Timing of Turning off Module
Co
3.7.2.2. Turn off Module Using AT Command
It is also a safe way to use AT command AT+QPOWD to turn off the module, which is similar to turning off
the module via PWRKEY Pin.
Please refer to document [2] for details about the AT command AT+QPOWD.
3.8. Reset the Module
The RESET_N can be used to reset the module. You can reset the module by driving the RESET_N to a
low level voltage for more than 150ms and then releasing it.

LTE Module Series
Table 8: RESET_N Pin Description
Pin Name Pin No. Description DC Characteristics Comment
VIHmax=2.1V
Pull-up to 1.8V internally.
RESET_N 20 Reset the module. VIHmin=1.3V
Active low.
VILmax=0.5V
The recommended circuit is similar to the PWRKEY control circuit. You can use open drain/collector
driver or button to control the RESET_N.
RESET_N
el
≥ 150ms
t
4.7K
c l
Reset pulse
e ia
47K
u n t
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit
Q ide
S2
RESET_N
n f TVS
Co
Close to S2
Figure 15: Reference Circuit of RESET_N by Using Button
The reset scenario is illustrated in the following figure.

LTE Module Series
VBAT
≥150ms ≥ 9s
RESET_N VIH ≥ 1.3V

VIL ≤ 0.5V
Module RUNNING RESETTING RUNNING

Status
l
Figure 16: Timing of Resetting Module
t e l
NOTES
c
1. Use the RESET_N only when turning off the module by the command AT+QPOWD and the
e ia
PWRKEY pin failed.
t
2. Ensure that there is no large capacitance on the PWRKEY and RESET_N pins.
u
Q ide
3.9. USIM Card Interface
n
f
The USIM card interface circuitry meets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and
3.0V USIM cards are supported.
o n
Table 9: Pin Definition of the USIM Interface
C
Pin Name Pin No. I/O Description Comment
Either 1.8V or 3.0V is supported

USIM_VDD 14 PO Power supply for USIM card.
by the module automatically.
USIM_DATA 15 IO Data signal of USIM card.
USIM_CLK 16 DO Clock signal of USIM card.
USIM_RST 17 DO Reset signal of USIM card.

USIM_PRE
13 DI USIM card insertion detection.
SENCE
USIM_GND 10 Specified ground for USIM card.
EC20 supports USIM card hot-plug via the USIM_PRESENCE pin. It supports low level and high level

LTE Module Series
detection, which is disabled by default. Refer to document [2] about command AT+QSIMDET for details.
The following figure shows a reference design for an 8-pin USIM connector.
VDD_EXT USIM_VDD
51K 15K
USIM_GND 100nF USIM Connector
USIM_VDD
VCC GND
USIM_RST 22R
RST VPP
Module USIM_CLK
CLK IO
l
USIM_PRESENCE 22R
USIM_DATA 22R
t e
GND
33pF 33pF 33pF
e c ia l GND GND
u n t
Figure 17: Reference Circuit for 8-Pin USIM Connector
Q ide
If you do not need the USIM card detection function, keep USIM_PRESENCE unconnected. The
reference circuit for using a 6-pin USIM card connector is illustrated in the following figure.
f
USIM_VDD
n
15K
o
USIM_GND 100nF
USIM Connector
USIM_VDD
VCC GND
C
USIM_RST 22R
RST VPP
Module USIM_CLK
CLK IO
22R
USIM_DATA 22R
33pF 33pF 33pF
GND GND
Figure 18: Reference Circuit for 6-Pin USIM Connector
In order to enhance the reliability and availability of the USIM card in your application, please follow the
criteria below in the USIM circuit design:

LTE Module Series
 Keep layout of USIM card as close as possible to the module. Assure the length of the trace is less
than 200mm.
 Keep USIM card signal away from RF and VBAT alignment.
 Assure the ground between module and USIM connector short and wide. Keep the width of ground
and USIM_VDD no less than 0.5mm to maintain the same electric potential.
 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
 In order to offer good ESD protection, it is recommended to add TVS whose parasitic capacitance
should be less than 50pF. The 22ohm resistors should be added in series between the module and
the USIM card so as to suppress the EMI spurious transmission and enhance the ESD protection.
l
The 33pF capacitors are used for filtering interference of EGSM900. Please note that the USIM
peripheral circuit should be close to the USIM connector.
e
 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
t
and sensitive occasion are applied, and should be placed close to the USIM connector.
e c ia l
t
3.10. USB Interface
u
Q ide n
EC20 contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0
specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is
used for AT command communication, data transmission, GNSS NMEA sentences output, software
debugging and firmware upgrade. The following table shows the pin definition of USB interface.
n f
Table 10: USB Pin Description
o
C
Require differential
USB_DP 69 IO USB differential data bus (positive).
impedance of 90Ω.
Require differential
USB_DM 70 IO USB differential data bus (minus).
impedance of 90Ω.
Used for detecting the USB 3.0~5.25V
USB_VBUS 71 PI
connection. Typical 5.0V
GND 72 Ground
More details about the USB 2.0 specifications, please visit http://www.usb.org/home.
The USB interface is recommended to be reserved for firmware upgrade in your design. The following
figure shows the recommended test points.

LTE Module Series
Test Points
Minimize this stub
Module R3 NM_0R
MCU
VDD R4 NM_0R
USB_VBUS ESD Array
R1 0R USB_DM
USB_DM
R2 0R
USB_DP USB_DP
Close to Module
l
GND GND
c t e l
Figure 19: Test Points for Firmware Upgrade
e t ia
In order to meet USB data line signal integrity, components R1, R2, R3 and R4 must be placed close to
u
module, and also these resistors should be placed close to each other. The extra stubs of trace must be
n
as short as possible.
Q ide
Please comply with the following principles while designing USB interface.
 It is important to route the USB signal traces as differential pairs with total grounding. The impedance
f
of USB differential trace is 90ohm.

n
Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
o
and lower layer but also right and left sides.
 Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically,
C
the capacitance value should be less than 2pF.
 Keep the ESD components as close as possible to the USB connector.
NOTE
EC20 module can only be used as a slave device.

LTE Module Series
3.11. UART Interface
The module provides two UART interfaces: main UART interface and debug UART interface. The
following shows the distinct features of them.
 Main UART interface supports 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600bps
baud rate, the default is 115200bps. This interface can be used for data transmission and AT
command communication.
 Debug UART interface supports 115200bps baud rate. It can be used for Linux console, log output
and GNSS NMEA output.
l
The following tables show the pin definition.
c t e l
Table 11: Pin Definition of the UART Interface
e ia
u t
RI 62 DO Ring indicator 1.8V power domain
n
DCD 63 DO Data carrier detection 1.8V power domain
Q ide
CTS 64 DO Clear to send 1.8V power domain
RTS 65 DI Request to send 1.8V power domain
f
DTR 66 DI Sleep mode control 1.8V power domain
n
TXD 67 DO Transmit data 1.8V power domain
o
RXD 68 DI Receive data 1.8V power domain
C
Table 12: Pin Definition of the Debug UART Interface
DBG_TXD 12 DO Transmit data 1.8V power domain
DBG_RXD 11 DI Receive data 1.8V power domain
The logic levels are described in the following table.

LTE Module Series
Table 13: Logic Levels of Digital I/O
Parameter Min. Max. Unit
VIL -0.3 0.6 V
VIH 1.2 2.0 V
VOL 0 0.45 V
VOH 1.35 1.8 V
Module provides 1.8V UART interface. A level translator should be used if your application is equipped
l
with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is
e
recommended. The following figure shows a reference design.
c t l
VDD_EXT VCCA VCCB VDD_MCU
0.1uF
a
0.1uF
e i
OE GND
t
RI A1 B1 RI_MCU
u
DCD A2 B2
n
DCD_MCU
CTS A3 Translator B3 CTS_MCU
Q ide
RTS A4 B4 RTS_MCU
DTR A5 B5 DTR_MCU
TXD A6 B6 TXD_MCU
A7 B7
f
RXD RXD_MCU
51K 51K
A8 B8
o n
Figure 20: Reference Circuit with Translator Chip
C
Please visit http://www.ti.com for more information.
Another example with transistor translation circuit is shown as below. The circuit design of dotted line
section can refer to the design of solid line section, in terms of both module input and output circuit
designs; but please pay attention to the direction of connection.

LTE Module Series
4.7K
VDD_EXT VDD_EXT
1nF
MCU/ARM Module
10K
/TXD RXD
/RXD TXD
1nF
10K
VDD_EXT
VCC_MCU 4.7K
/RTS RTS
/CTS CTS
GPIO DTR
l
EINT RI
GPIO DCD
GND GND
c t e l
Figure 21: Reference Circuit with Transistor Circuit
u e t ia
NOTE
n
Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.
Q ide
f
3.12. PCM and I2C Interface
n
EC20 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the
o
following modes:
C
 Primary mode (short sync, works as both master and slave)
 Auxiliary mode (long sync, works as master only)
In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge; the PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128, 256, 512,
1024 and 2048kHz for different speech codecs.
In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge; while the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a
128kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only.
EC20 supports 8-bit A-law and μ-law, and also 16-bit linear data formats. The following figures show the
timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well as the timing
relationship in auxiliary mode with 8kHz PCM_SYNC and 128kHz PCM_CLK.

LTE Module Series
125us
PCM_CLK 1 2 255 256
PCM_SYNC
MSB LSB MSB
PCM_OUT
l
MSB LSB MSB
PCM_IN
c t e l
a
Figure 22: Timing in Primary Mode
u e n t i
Q ide
125us
PCM_CLK 1 2 15 16
f
PCM_SYNC
n
MSB LSB
o
PCM_OUT
C
MSB LSB
PCM_IN
Figure 23: Timing in Auxiliary Mode
The following table shows the pin definition of PCM and I2C interface which can be applied on audio
codec design.

LTE Module Series
Table 14: Pin Definition of PCM and I2C Interface
PCM_IN 24 DI PCM data input 1.8V power domain
PCM_OUT 25 DO PCM data output 1.8V power domain
PCM_SYNC 26 IO PCM data frame sync signal 1.8V power domain
PCM_CLK 27 IO PCM data bit clock 1.8V power domain
I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V
el
I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8V
c t l
Clock and mode can be configured by AT command, and the default configuration is master mode using
short sync data format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC20’s firmware has
e ia
integrated the configuration on ALC5616 application with I2C interface. Refer to document [2] about the
t
command AT+QDAI for details.
u n
The following figure shows a reference design of PCM interface with an external codec IC.
Q ide
MICBIAS
f
INP
BIAS
PCM_CLK BCLK
INN
PCM_SYNC LRCK
n
PCM_OUT DAC
o
PCM_IN ADC
LOUTP
C
I2C_SCL SCL
I2C_SDA SDA LOUTN
2.2K
2.2K
Module ALC5616
1.8V
Figure 24: Reference Circuit of PCM Application with Audio Codec
NOTES
1. It is recommended to reserved RC (R=22ohm, C=22pF) circuit on the PCM lines, especially for
PCM_CLK.
2. EC20 works as a master device pertaining to I2C interface.

LTE Module Series
3.13. ADC Function
The module provides two analog-to-digital converters (ADC) to digitize the analog signal to 15-bit digital
data such as battery voltage, temperature and so on. Using AT command AT+QADC=0 can read the
voltage value on ADC0 pin. Using AT command AT+QADC=1 can read the voltage value on ADC1 pin.
For more details of these AT commands, please refer to document [2].
In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.
l
Table 15: Pin Definition of the ADC
e
Pin Name Pin No. Description
t l
ADC0 45 General purpose analog to digital converter
c a
ADC1 44 General purpose analog to digital converter
u e t i
The following table describes the characteristic of the ADC function.
Q ide n
Table 16: Characteristic of the ADC
Parameter Min. Typ. Max. Unit
f
ADC0 Voltage Range 0.3 VBAT_BB V
n
ADC1 Voltage Range 0.3 VBAT_BB V
o
ADC Resolution 15 bits
NOTES
1.
2. C
Do not input analog voltage directly to ADC pins when there is no power supply for module.
It is recommended to use resistor divider input for ADC pins.
3.14. Network Status Indication
The network indication pins can be used to drive a network status indicator LED. The module provides
two network indication pins: NET_MODE and NET_STATUS. The following tables describe pin definition
and logic level changes in different network status.

LTE Module Series
Table 17: Pin Definition of Network Indicator
Indicate the module network registration

NET_MODE 5 DO 1.8V power domain
mode.
Indicate the module network activity
NET_STATUS 6 DO 1.8V power domain
status.
Table 18: Working State of the Network Indicator
l
Pin Name Status Description
e
Always High Registered in LTE network
t
NET_MODE
c l
Always Low Others
e ia
Flicker Slowly (200ms High/1800ms Low) Network searching
u t
Flicker Slowly (1800ms High/200ms Low) Idle
n
NET_STATUS
Flicker Quickly (125ms High/125ms Low) Data transfer is ongoing
Q ide
Always High Voice calling
f
A reference circuit is shown in the following figure.
n
VBAT
o
Module
C
2.2K
Network 4.7K
Indicator
47K
Figure 25: Reference Circuit of the Network Indicator

LTE Module Series
3.15. Operation Status Indication
The STATUS pin is an open drain output for indicating the module’s operation status. You can connect it
to a GPIO of DTE with a pull up resistor, or as the LED indication circuit shown below. When the module is
turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present
high-impedance state.
Table 19: Pin Definition of STATUS
l
e
STATUS 61 OD Indicate the module operation status Require external pull-up
c t l
The following figure shows different design circuits of STATUS, you can choose either one according to
a
your application demands.
e t i
VBAT
u
VDD_MCU
Q ide n
10K
2.2K
STATUS MCU_GPIO STATUS
n f
Module Module
o
Figure 26: Reference Circuit of the STATUS
C
3.16. Behavior of the RI
You can use command AT+QCFG=“risignaltype”,“physical” to configure RI behavior:
No matter which port URC is presented on, URC will trigger the behavior on RI pin.
NOTE
URC can be output from UART port, USB AT port and USB modem port by command AT+QURCCFG.
The default port is USB AT port.

LTE Module Series
In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below.
Table 20: Behavior of the RI
State Response
Idle RI keeps high level
URC RI outputs 120ms low pulse when new URC returns
The RI behavior can be changed by command AT+QCFG=“urc/ri/ring”, refer to document [2] for
l
details.
c t e l
u e t ia
Q ide n
n f
Co

LTE Module Series
4 GNSS Receiver
l
EC20 includes a fully integrated global navigation satellite system solution that supports gpsOne Gen8A
e
of Qualcomm (GPS and GLONASS). Compared with GPS only, dual systems increase usable
t
constellation, reduce coverage gaps and TTFF, and increase positioning accuracy, especially in rough
l
urban environments.
e c ia
EC20 works in standalone mode. It allows device to demodulate GNSS assistance data and calculate
t
position without any assistance from the network. It is thus suitable for various applications needing
u
lowest-cost and accurate position determination. EC20 supports Qualcomm gpsOneXTRA technology
n
(one kind of A-GNSS), which allows to download XTRA file from the internet server to enhance the TTFF.
Q ide
XTRA file contains predicted GPS and GLONASS satellite coordinates and clock biases valid for up to
7days. It is the best if XTRA file is downloaded every 1-2 days. EC20 also supports SBAS (including
WAAS, EGNOS and MSAS), which will improve fix accuracy.
f
EC20 provides a power-saving solution named DPO (Dynamic Power Optimization) which attempts to
n
turn off GNSS RF parts. The solution reduces current consumption by 50% at most while without impact
on TTFF, which effectively extends battery life, and maximizes talk and standby time as well.
o
EC20 supports standard NMEA-0183 protocol, and outputs NMEA sentences with 1Hz via USB interface
C
by default.
By default, EC20 GNSS engine is switched off. It has to be switched on with AT command. For more
details about GNSS engine technology and configurations, please refer to document [3].

LTE Module Series
4.2. GNSS Performance
The following table shows EC20 GNSS performance.
Table 21: GNSS Performance
Parameter Description Conditions Typ. Unit
Cold start Autonomous -146 dBm
l
Sensitivity
Reacquisition Autonomous -156 dBm
(GNSS)
e
Tracking Autonomous -157 dBm
c t l
Autonomous 35 s
Cold start
a
@open sky
e i
XTRA enabled 22 s
u t
Autonomous 30 s
TTFF Warm start
n
(GNSS) @open sky
XTRA enabled 3.5 s
Q ide
Autonomous 2 s
Hot start
@open sky
XTRA enabled 1.5 s
f
Accuracy Autonomous
n
CEP-50 <1.5 m
(GNSS) @open sky
o
NOTES
C
1. Tracking sensitivity: the lowest GPS signal value at the antenna port for which the module can keep
on positioning for 3 minutes.
2. Reacquisition sensitivity: the lowest GPS signal value at the antenna port for which the module can
fix position again within 3 minutes after loss of lock.
3. Cold start sensitivity: the lowest GPS signal value at the antenna port for which the module fixes
position within 3 minutes after executing cold start command.

LTE Module Series
4.3. Layout Guideline
The following layout guideline should be taken into account in your design.
 Maximize the distance between the GNSS antenna, the main antenna and the Rx-diversity antenna.
 Noisy digital circuits such as the USIM card, USB interface, Camera module, Display connector and
SD card should be kept away from the antenna.
 Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar
isolation and protection.
 Keep 50ohm characteristic impedance of the ANT_GNSS trace.
l
Refer to Chapter 5 for GNSS reference design and antenna consideration.
c t e l
u e t ia
Q ide n
n f
Co

LTE Module Series
5 Antenna Interface
EC20 antenna interface includes a main antenna, an Rx-diversity antenna which is used to resist the fall
of signals caused by high speed movement and multipath effect, and a GNSS antenna. The antenna
interface has an impedance of 50ohm.
el
5.1. Main/Rx-diversity Antenna Interface
c t l
5.1.1. Pin Definition
e ia
The main antenna and Rx-diversity antenna pins definition are shown below.
u n t
Table 22: Pin Definition of the RF Antenna
Q ide
ANT_MAIN 49 IO Main antenna 50ohm impedance
f
ANT_DIV 35 AI Receive diversity antenna 50ohm impedance
o n
5.1.2. Operating Frequency
C
Table 23: Module Operating Frequencies
3GPP Band Transmit Receive Unit
B1 1920 ~ 1980 2110 ~ 2170 MHz
B2 (1900) 1850 ~ 1910 1930 ~ 1990 MHz
B3 (1800) 1710 ~ 1785 1805 ~ 1880 MHz
B4 1710 ~ 1755 2110 ~ 2155 MHz
B5 (850/BC0) 824 ~ 849 869 ~ 894 MHz
B7 2500 ~ 2570 2620 ~ 2690 MHz

LTE Module Series
B8 (900) 880 ~ 915 925 ~ 960 MHz
B12 699 ~ 716 728 ~ 746 MHz
B17 704 ~ 716 734 ~ 746 MHz
B20 832 ~ 862 791 ~ 821 MHz
B34 2010 ~ 2025 2010 ~ 2025 MHz
B38 2570 ~ 2620 2570 ~ 2620 MHz
B39 1880 ~ 1920 1880 ~ 1920 MHz
l
B40 2300 ~ 2400 2300 ~ 2400 MHz
t e
B41 2555 ~ 2655 2555 ~ 2655 MHz
e
5.1.3. Reference Design
c ia l
u t
The reference design of ANT_MAIN and ANT_DIV antenna is shown as below. It is recommended to
n
reserve a π-type matching circuit for better RF performance. The capacitors are not mounted by default.
Q ide
Main
Module antenna
R1 0R
ANT_MAIN
n f
C1 C2
NM NM
o
Diversity
antenna
C
R2 0R
ANT_DIV
C3 C4
NM NM
Figure 27: Reference Circuit of Antenna Interface
NOTES
1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the
receiving sensitivity.
2. ANT_DIV function is enabled by default. Use AT command AT+QCFG=“diversity”,0 can disable

LTE Module Series
receive diversity.
3. When receive diversity is enabled without the Rx-diversity antenna (ANT_DIV), the signal will be
decreased and connection problems may be caused.
5.2. GNSS Antenna Interface
The following tables show the GNSS antenna pin definition and frequency specification.
l
Table 24: Pin Definition of GNSS Antenna
t e
c l
ANT_GNSS 47 AI GNSS antenna 50ohm impedance
u e
Table 25: GNSS Frequency
t ia
Q ide n
Type Frequency Unit
GPS 1575.42 ± 1.023 MHz
f
GLONASS 1597.5 ~ 1605.8 MHz
n
A reference design of GNSS antenna is shown as below.
o
VDD
C
GNSS
0.1uF
Antenna 10R
Module
47nH
100pF
ANT_GNSS
NM NM
Figure 28: Reference Circuit of GNSS Antenna

LTE Module Series
NOTES
1. An external LDO can be selected to supply power according to the type of active antenna.
2. If the module is designed with passive antenna, the VDD circuit is not needed.
5.3. Antenna Installation
5.3.1. Antenna Requirement
l
The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
t e l
Table 26: Antenna Requirements
c a
Type Requirements
e t i
Frequency range: 1565 - 1607MHz
u
Polarization: RHCP or linear
n
VSWR: < 2 (Typ.)
Q ide
Passive antenna gain: > 0dBi
GNSS
Active antenna noise figure: < 1.5dB
Active antenna gain: > -2dBi
Active antenna embedded LNA gain: 20dB (Typ.)
f
Active antenna total gain: > 18dBi (Typ.)
n
VSWR: ≤ 2
Gain (dBi): 1
o
Max Input Power (W): 50
Input Impedance (ohm): 50
C
Polarization Type: Vertical
Cable Insertion Loss: < 1dB
GSM/WCDMA/TD-SCDMA/
(GSM850/900, WCDMA B5/B8, CDMA BC0, LTE B5/B8/B12/B17/
CDMA/LTE
B20)
Cable Insertion Loss: < 1.5dB
(GSM1800/1900, WCDMA B1/B2/B3/B4, TD-SCDMAB34/B39, LTE
B1/B2/B3/B4/B39)
Cable insertion loss < 2dB
(LTE B7/B38/B40/B41)

LTE Module Series
5.3.2. Install the Antenna with RF Connector
The following figure is the antenna installation with RF connector provided by HIROSE. The
recommended RF connector is UF.L-R-SMT.
t el
e c ia l
u n t
Q ide
Figure 29: Dimensions of the UF.L-R-SMT Connector (Unit: mm)
n f
U.FL-LP serial connector listed in the following figure can be used to match the UF.L-R-SMT.
Co
Figure 30: Mechanicals of UF.L-LP Connectors

LTE Module Series
The following figure describes the space factor of mated connector.
t el
e c ia l
u n t
Q ide
Figure 31: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://www.hirose.com.
n f
Co

LTE Module Series
6 Electrical, Reliability and Radio

Characteristics
l
6.1. Absolute Maximum Ratings
t e
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
c l
listed in the following table.
e t ia
Table 27: Absolute Maximum Ratings
u n
Parameter Min. Max. Unit
Q ide
VBAT_RF/VBAT_BB -0.3 4.7 V
USB_VBUS -0.3 5.5 V
f
Peak Current of VBAT_BB 0 0.8 A
n
Peak Current of VBAT_RF 0 1.8 A
o
Voltage at Digital Pins -0.3 2.3 V
C
Voltage at ADC0 0 VBAT_BB V
Voltage at ADC1 0 VBAT_BB V
6.2. Power Supply Ratings
Table 28: Module Power Supply Ratings
Parameter Description Conditions Min. Typ. Max. Unit
VBAT_BB and Voltage must stay within the

VBAT 3.3 3.8 4.3 V
VBAT_RF min/max values, including

LTE Module Series
Parameter Description Conditions Min. Typ. Max. Unit
voltage drop, ripple and

spikes.
Maximum power control
Voltage drop during
level on GSM850 and 400 mV
transmitting burst
EGSM900.
Peak supply current Maximum power control
IVBAT (during transmission level on GSM850 and 1.8 2.0 A
slot) EGSM900.
USB_VBUS USB detection 3.0 5.0 5.25 V
t el
l
6.3. Temperature Range
e c ia
The operating temperature is listed in the following table.
u
Table 29: Temperature Range
n t
Q ide
Parameter Min. Typ. Max. Unit
Operation temperature
f
-35 +25 +75 ºC
range1)
n
Extended temperature
-40 +85 ºC
range2)
NOTES
1.
2.
1)
2)
Co
Within operation temperature range, the module is 3GPP compliant.
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction; there are
also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
Pout might reduce in their value and exceed the specified tolerances. When the temperature returns
to the normal operating temperature levels, the module will meet 3GPP compliant again.

LTE Module Series
6.4. Current Consumption
The typical current consumption of EC20 module are shown below.
Table 30: EC20-A Current Consumption
OFF state Power down 20 uA
l
AT+CFUN=0 (USB disconnected) 1.05 mA
e
GSM DRX=2 (USB disconnected) 3.7 mA
t l
Sleep state GSM DRX=9 (USB disconnected) 1.8 mA
c a
WCDMA DRX=6 (USB disconnected) 2.8 mA
e t i
u n
GSM850 4DL/1UL PCL=5 233 mA
Q ide
f
GPRS data transfer GSM850 1DL/4UL PCL=5 510 mA
n
IVBAT (GNSS off) PCS1900 4DL/1UL PCL=0 198 mA
o
PCS1900 3DL/2UL PCL=0 333 mA
C

EDGE data transfer
(GNSS off)

LTE Module Series
WCDMA B2 HSDPA @max power 496 mA
WCDMA B2 HSUPA @max power 498 mA
WCDMA data transfer WCDMA B4 HSDPA @max power 442 mA

(GNSS off) WCDMA B4 HSUPA @max power 465 mA
l
LTE-FDD B2 @max power 584 mA
t e
c l
LTE data transfer
LTE-TDD B5 @max power 521 mA
(GNSS off)
e ia
u t
n
GSM850 @PCL=5 247 mA
Q ide
GSM voice call
PCS1900 @PCL=0 207 mA
WCDMA B2 @max power 470 mA
f
WCDMA voice call WCDMA B4 @max power 429 mA
n
Parameter
Co
Table 31: EC20-C Current Consumption
Description
OFF state
Conditions
Power down
AT+CFUN=0 (USB disconnected)

Typ.
20
0.9
Unit
uA
mA
IVBAT GSM DRX=9 (USB disconnected) 1.8 mA

Sleep state
LTE DRX=5 (USB disconnected) 5.2 mA

LTE Module Series
AT+CFUN=0 (USB disconnected) 17 mA
AT+CFUN=0 (USB connected) 32 mA
GSM DRX=5 (USB disconnected) 20 mA
Idle state GSM DRX=5 (USB connected) 35 mA

(GNSS off) WCDMA DRX=6 (USB disconnected) 20 mA
WCDMA DRX=6 (USB connected) 34 mA
l
LTE DRX=6 (USB disconnected) 25 mA
t e
LTE DRX=6 (USB connected) 38 mA
c l
EGSM900 4DL/1UL PCL=5 285 mA
e ia
u t
n
Q ide
GPRS data transfer
(GNSS off) DCS1800 4DL/1UL PCL=0 230 mA
DCS1800 3DL/2UL PCL=0 318 mA
f
n
o
C
EDGE data transfer EGSM900 1DL/4UL PCL=8 503 mA



LTE Module Series
TD-SCDMA data TD-SCDMA Band 34 @max Power 120 mA

transfer (GNSS off) TD-SCDMA Band 39 @max Power 110 mA
LTE data transfer LTE-TDD B38 @max power 422 mA
l
(GNSS off) LTE-TDD B39 @max power 354 mA
t e
c l
e ia
EGSM900 @PCL=5 285 mA
t
GSM voice call
u
DCS1800 @PCL=0 215 mA
n
Q ide
WCDMA voice call
f
Table 32: EC20-CE Current Consumption
n
o
C
Sleep state WCDMA DRX=6 (USB disconnected) 2.9 mA

IVBAT
GPRS data transfer EGSM900 4DL/1UL PCL=5 275 mA

(GNSS off) EGSM900 3DL/2UL PCL=5 488 mA

LTE Module Series
l
t e
c l
e ia
u t
n
Q ide
f
WCDMA data transfer
n
TD-SCDMA Band 34 @max Power 118 mA
o
TD-SCDMA data
transfer (GNSS off) TD-SCDMA Band 39 @max Power 107 mA
C
CDMA data transfer
CDMA BC0 @max Power 520 mA
(GNSS off)
1X EVDO data
1X EVDO BC0 @max Power 550 mA
transfer (GNSS off)
LTE data transfer LTE-TDD B38 @max power 374 mA

(GNSS off) LTE-TDD B39 @max power 328 mA

LTE Module Series

GSM voice call
DCS1800 @PCL=0 197 mA
Table 33: EC20-E Current Consumption
l
t e
c l
Sleep state GSM DRX=9 (USB disconnected) 2.02 mA
e ia
u t
Q ide n
AT+CFUN=0 (USB disconnected) 19 mA
AT+CFUN=0 (USB connected) 34 mA
f
GSM DRX=5 (USB disconnected) 23 mA
n
Idle state GSM DRX=5 (USB connected) 38 mA
IVBAT
(GNSS off)
o
WCDMA DRX=6 (USB disconnected) 21 mA
WCDMA DRX=6 (USB connected) 36 mA
C
LTE DRX=6 (USB disconnected) 26 mA
LTE DRX=6 (USB connected) 39 mA
GPRS data transfer GSM850 2DL/3UL PCL=5 550 mA

(GNSS off) GSM850 1DL/4UL PCL=5 638 mA

LTE Module Series
l
t e
c l
e ia
u t
n
Q ide
f
n
o
C

LTE Module Series
l
LTE data transfer LTE-FDD B5 @max power 520 mA
t e
(GNSS off) LTE-FDD B7 @max power 558 mA
c l
e ia
u t
GSM850 @PCL=5 289 mA
n
Q ide
GSM voice call
DCS1800 @PCL=0 255 mA
PCS1900 @PCL=0 265 mA
f
n
o
C
6.5. RF Output Power
The following table shows the RF output power of EC20 module.
Table 34: Conducted RF Output Power
Frequency Max. Min.
GSM850/EGSM900 33dBm±2dB 5dBm±5dB
DCS1800/PCS1900 30dBm±2dB 0dBm±5dB

LTE Module Series
GSM850/EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB
DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB
WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB <-50dBm
TD-SCDMA B34/B39 24dBm+1/-3dB <-50dBm
CDMA BC0 24dBm+6/-1dB <-50dBm
LTE FDD B1/B2/B3/B4/B5/B7/B8/B12/B17/B20 23dBm±2dB <-44dBm
LTE TDD B38/B39/B40/B41 23dBm±2dB <-44dBm
NOTE
t el
c l
In GPRS 4 slots TX mode, the maximum output power is reduced by 2.5dB. This design conforms to the
a
GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
u e n
6.6. RF Receiving Sensitivity
t i
Q ide
The following table shows the conducted RF receiving sensitivity of EC20 module.
n f
Table 35: EC20-A Conducted RF Receiving Sensitivity
o
Sensitivity (Typ.)
Frequency
Primary Diversity SIMO 3GPP(SIMO)
C
GSM850 -111dBm NA NA -102dBm
PCS1900 -110dBm NA NA -102dBm
WCDMA B2 -111dBm NA NA -104.7dBm
LTE FDD B2 (10M) -97dBm -98dBm -100.5dBm -94.3dBm
LTE FDD B4 (10M) -99dBm -97dBm -101.5dBm -96.3dBm
LTE FDD B5 (10M) -97dBm -99dBm -101dBm -94.3dBm

LTE Module Series
Table 36: EC20-C Conducted RF Receiving Sensitivity
Sensitivity(Typ.)
Frequency
EGSM900 -109dBm NA NA -102dBm
l
DCS1800 -109dBm NA NA -102dBm
t e
WCDMA Band1 -110dBm -109dBm NA -106.7dBm
c l
e ia
TD-SCDMA Band34 -109dBm NA NA -108dBm
u t
Q ide n
LTE-FDD B1(10M) -98dBm -97dBm -100.5dBm -96.3dBm
LTE-FDD B8(10M) -98dBm -99dBm -102dBm -93.3dBm
f
LTE-TDD B38(10M) -97dBm -95dBm -100dBm -96.3dBm
n
LTE-TDD B39(10M) -98dBm -96dBm -100.5dBm -96.3dBm
o
C
Table 37: EC20-CE Conducted RF Receiving Sensitivity
Sensitivity(Typ.)
Frequency

LTE Module Series
CDMA BC0 -107dBm -107dBm NA -104dBm
l
t e
e c ia l
Table 38: EC20-E Conducted RF Receiving Sensitivity
u t
Sensitivity(Typ.)
n
Frequency
Q ide
GSM850 -111dBm NA NA -102dBm
f
n
PCS1900 -109dBm NA NA -102dBm
o
C
LTE FDD B7 (10M) -97.5dBm -96dBm -99dBm -94.3dBm
LTE FDD B20 (10M) -96.5dBm -97.5dBm -100dBm -93.3dBm

LTE Module Series
6.7. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module’s electrostatic discharge characteristics.
l
Table 39: Electrostatic Discharge Characteristics
e
Tested Points Contact Discharge Air Discharge Unit
t l
VBAT, GND ±5 ±10 kV
c a
All Antenna Interfaces ±4 ±8 kV
e t i
Other Interfaces ±0.5 ±1 kV
u
Q ide n
n f
Co

LTE Module Series
7 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.
l
7.1. Mechanical Dimensions of the Module
t e
(32+/-0.15)
c l
2.4+/-0.2
u e t ia
n
(29+/-0.15)
Q ide
n f
o
0.8
C
Figure 32: Module Top and Side Dimensions

LTE Module Series
32.0
29.0
t el
e c ia l
u n t
Q ide Figure 33: Module Bottom Dimensions (Bottom View)
n f
Co
Figure 34: Bottom Pads Dimensions (Bottom View)

LTE Module Series
7.2. Recommended Footprint
l
Keepout area
e
29.0
t
Keepout area
e c ia l
u n t
Q ide
f
32.0
o n
Figure 35: Recommended Footprint without WLAN Function (Top View)
C
NOTES
1. It is recommended to keep out the blue area for pins 117~140, if WLAN function is not needed.
2. For easy maintenance of the module, please keep about 3mm between the module and other
components in the host PCB.

LTE Module Series
t el
e c ia l
u n t
Q ide
n f
o
Figure 36: Recommended Stencil
C
NOTES
1. The thickness of stencil for the pads at the bottom of module is recommended as 0.18mm, and the
thickness of LCC pins is recommended as 0.2mm.
2. For better SMT solder, the GND pad at the bottom of the module is divided into four small pads.
3. The red areas are recommended footprint shown in Figure 35.

LTE Module Series
If WLAN function is needed, then pins 117~140 should be designed, and the following footprint is
recommended.
t el
29.0
Keepout area
e c ia l
u n t
Q ide
f
32.0
o n Figure 37: Recommended Footprint with WLAN Function
C
NOTES
1. The purple red area should be kept out.

2. The blue area is reserved for pins 117~140. It is recommended to keep out the area if WLAN function
is not needed.
3. For convenient maintenance of the module, keep about 3mm between the module and other
components in the host PCB.

LTE Module Series
7.3. Top and Bottom View of the Module
t el
e c ia l
Figure 38: Top View of the Module
u n t
Q ide
n f
Co Figure 39: Bottom View of the Module
NOTE
These are design effect drawings of EC20 module. For more accurate pictures, please refer to the
module that you get from Quectel.

LTE Module Series
8 Storage, Manufacturing and

Packaging
l
8.1. Storage
t e
EC20 is stored in a vacuum-sealed bag. The restrictions of storage condition are shown as below.
c a l
1. Shelf life in sealed bag is 12 months at < 40ºC/90%RH.
u e t i
2. After this bag is opened, devices that will be subjected to reflow soldering or other high temperature
n
processes must be:
 Mounted within 72 hours at factory conditions of ≤ 30ºC/60%RH.
Q ide
 Stored at <10% RH.
3. Devices require baking before mounting, if:
f
 Humidity indicator card is >10% when ambient temperature is 23ºC±5ºC.
 Mounting cannot be finished within 72 hours at factory conditions of ≤ 30ºC/60% RH.
n
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
NOTE
Co
As plastic package cannot be subjected to high temperatures, the package must be removed from
devices before high temperature (125ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
8.2. Manufacturing and Welding
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil at the hole of the module pads should be 0.18mm. For details, please refer to

LTE Module Series
document [4].
It is suggested that the peak reflow temperature is from 235 to 245ºC (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
ºC
Preheat Heating Cooling
250
l
Liquids Temperature
217
e
200
200 ºC
t
40s~60s
c l
160 ºC
a
Temperature
e i
150
t
70s~120s
u
Q ide n
100
Between 1~3 ºC/s
f
50
o
50
n 100 150 200 250 300 s
C
Time
Figure 40: Reflow Soldering Thermal Profile
8.3. Packaging
EC20 is packaged in tape and reel carriers. One reel is 11.53m long and contains 250pcs modules. The
figure below shows the packaging details, measured in mm.

LTE Module Series
1.75±0.1
44.00±0.1 1
0.
2.00±0.1 4.00±0.1 50± 0.35±0.05
1.
20.20±0.15
29.3±0.15
30.3±0.15
30.3±0.15
44.00±0.3
32.5±0.15 4.2±0.15
33.5±0.15 3.1±0.15
el
32.5±0.15
t
33.5±0.15
c a l
48.5
e i
Cover tape
u n t
13
Q ide
Direction of feed
100
n f 44.5+0.20
-0.00
Co
Figure 41: Carrier Tape
Table 40: Reel Packaging
Model Name MOQ for MP Minimum Package: 250pcs Minimum Package×4=1000pcs
Size: 250mmx175mmx128mm Size: 367mmx269mmx275mm

EC20 250pcs N.W: 1.25kg N.W: 5kg
G.W: 2.05kg G.W: 8.8kg

LTE Module Series
9 Appendix A References
Table 41: Related Documents
SN Document Name Remark
l
Quectel_EC20_Power_Management_Application_ EC20 Power Management Application
[1]
e
Note Note
t
[2] Quectel_EC20_AT_Commands_Manual EC20 AT Commands Manual
c l
[3] Quectel_EC20_GNSS_AT_Commands_Manual EC20 GNSS AT Commands Manual
e t ia
[4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide
u
Q ide n
Table 42: Terms and Abbreviations
Abbreviation Description
f
AMR Adaptive Multi-rate
n
bps Bits Per Second
o
CHAP Challenge Handshake Authentication Protocol
C
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear To Send
DC-HSPA+ Dual-carrier High Speed Packet Access
DFOTA Delta Firmware Upgrade Over The Air
DL Downlink
DTR Data Terminal Ready
DTX Discontinuous Transmission

LTE Module Series
EFR Enhanced Full Rate
EGSM Extended GSM900 band (includes standard GSM900 band)
ESD Electrostatic Discharge
FDD Frequency Division Duplex
FR Full Rate
GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global

GLONASS
Navigation Satellite System
l
GMSK Gaussian Minimum Shift Keying
e
GNSS Global Navigation Satellite System
c t l
GPS Global Positioning System
e a
GSM Global System for Mobile Communications
u t i
HR Half Rate
n
HSPA High Speed Packet Access
Q ide
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
f
I/O Input/Output
n
Inorm Normal Current
o
LED Light Emitting Diode
C
LNA Low Noise Amplifier
LTE Long Term Evolution
MIMO Multiple Input Multiple Output
MO Mobile Originated
MS Mobile Station (GSM engine)
MT Mobile Terminated
PAP Password Authentication Protocol
PCB Printed Circuit Board

LTE Module Series
PDU Protocol Data Unit
PPP Point-to-Point Protocol
QAM Quadrature Amplitude Modulation
QPSK Quadrature Phase Shift Keying
RF Radio Frequency
RHCP Right Hand Circularly Polarized
l
Rx Receive
e
SIM Subscriber Identification Module
t l
SMS Short Message Service
c a
TDD Time Division Duplexing
e t i
TDMA Time Division Multiple Access
u n
TD-SCDMA Time Division-Synchronous Code Division Multiple Access
Q ide
TX Transmitting Direction
UL Uplink
f
UMTS Universal Mobile Telecommunications System
n
URC Unsolicited Result Code
o
USIM Universal Subscriber Identity Module
C
Vmax Maximum Voltage Value
Vnorm Normal Voltage Value
Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value

LTE Module Series
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output High Level Voltage Value
VOHmin Minimum Output High Level Voltage Value
VOLmax Maximum Output Low Level Voltage Value
VOLmin Minimum Output Low Level Voltage Value
VSWR Voltage Standing Wave Ratio
l
WCDMA Wideband Code Division Multiple Access
c t e l
u e t ia
Q ide n
n f
Co

LTE Module Series
10 Appendix B GPRS Coding Schemes

Table 43: Description of Different Coding Schemes
Scheme CS-1 CS-2 CS-3 CS-4
l
Code Rate 1/2 2/3 3/4 1
t e
USF 3 3 3 3
c l
Pre-coded USF 3 6 6 12
e t ia
Radio Block excl.USF and BCS 181 268 312 428
u n
BCS 40 16 16 16
Q ide
Tail 4 4 4 -
Coded Bits 456 588 676 456
f
Punctured Bits 0 132 220 -
n
Data Rate Kb/s 9.05 13.4 15.6 21.4
Co

LTE Module Series
11 Appendix C GPRS Multi-slot Classes

Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot
classes are product dependent, and determine the maximum achievable data rates in both the uplink and
downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,
while the second number indicates the amount of uplink timeslots. The active slots determine the total
l
number of slots the GPRS device can use simultaneously for both uplink and downlink communications.
t e
The description of different multi-slot classes is shown in the following table.
e c a l
Table 44: GPRS Multi-slot Classes
u t i
Multislot Class Downlink Slots Uplink Slots Active Slots
n
1 1 1 2
Q ide
2 2 1 3
3 2 2 3
f
4 3 1 4
o n
5 2 2 4
6 3 2 4
C
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5

LTE Module Series
12 Appendix D EDGE Modulation and

Coding Schemes
l
Table 45: EDGE Modulation and Coding Schemes
e
Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot
t l
CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps
c a
u e t i
n
Q ide
MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps
MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps
f
MCS-3 GMSK A 14.8kbps 29.6kbps 59.2kbps
n
MCS-4 GMSK C 17.6kbps 35.2kbps 70.4kbps
o
MCS-5 8-PSK B 22.4kbps 44.8kbps 89.6kbps
C
MCS-6 8-PSK A 29.6kbps 59.2kbps 118.4kbps
MCS-7 8-PSK B 44.8kbps 89.6kbps 179.2kbps

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EC20 Hardware Design

LTE Module Series

Quectel Wireless Solutions Co., Ltd.

Or our local office. For more information, please visit:

EC20_Hardware_Design Confidential / Released 1 / 84

About the Document

EC20_Hardware_Design Confidential / Released 2 / 84

About the Document ................................................................................................................................... 2

2 Product Concept ................................................................................................................................ 10

EC20_Hardware_Design Confidential / Released 3 / 84

3.15. Operation Status Indication ..................................................................................................... 44

4 GNSS Receiver ................................................................................................................................... 46

5 Antenna Interface ............................................................................................................................... 49

EC20_Hardware_Design Confidential / Released 4 / 84

TABLE 1: EC20 SERIES FREQUENCY BANDS ...................................................................................... 10

EC20_Hardware_Design Confidential / Released 5 / 84

TABLE 43: DESCRIPTION OF DIFFERENT CODING SCHEMES .......................................................... 82

EC20_Hardware_Design Confidential / Released 6 / 84

FIGURE 1: FUNCTIONAL DIAGRAM ........................................................................................................ 14

EC20_Hardware_Design Confidential / Released 7 / 84

EC20_Hardware_Design Confidential / Released 8 / 84

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON ,

EC20_Hardware_Design Confidential / Released 9 / 84

2.1. General Description

GNSS GPS+GLONASS GPS+GLONASS GPS+GLONASS GPS+GLONASS

EC20_Hardware_Design Confidential / Released 10 / 84

does not support Rx-diversity and GNSS function.

Class 4 (33dBm±2dB) for GSM850 and EGSM900

EC20_Hardware_Design Confidential / Released 11 / 84

R99: CSD: 9.6kbps, 14.4kbps

EC20_Hardware_Design Confidential / Released 12 / 84

Rx-diversity Support LTE/WCDMA/TD-SCDMA/CDMA Rx-diversity

gpsOne Gen8A of Qualcomm (GPS and GLONASS)

EC20_Hardware_Design Confidential / Released 13 / 84

ANT_MAIN ANT_GNSS ANT_DIV

Switch SAW Switch

EC20_Hardware_Design Confidential / Released 14 / 84

3.1. General Description

EC20_Hardware_Design Confidential / Released 15 / 84

3.2. Pin Assignment

The following figure shows the pin assignment of EC20 module.

Figure 2: Pin Assignment (Top View)

1. Keep all RESERVED pins and unused pins unconnected.

EC20_Hardware_Design Confidential / Released 16 / 84

3.3. Pin Description

The following tables show the EC20’s pin definition.

Table 3: I/O Parameters Definition

EC20_Hardware_Design Confidential / Released 17 / 84

Pin Name Pin No. I/O Description DC Characteristics Comment

Pin Name Pin No. I/O Description DC Characteristics Comment

Specified ground for

EC20_Hardware_Design Confidential / Released 18 / 84

Vmin=1.7V module automatically.

For 3.0V USIM:

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

EC20_Hardware_Design Confidential / Released 19 / 84

1.8V power domain.

Debug UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment