hc32lf3
hc32lf3
hc32lf3
PUMP
FEATURES
• Completely lead-free
FLIP type solder bath, high precision preheat.
• Standard gear for spot cooler!!
Optimum soldering has been realized.
• Secondary nozzle former remote adjustable mechanism
Remote control with note-type personal computer. (Option)
• Central control with touch panel
• Automatic adjustment of preheating temperature of the printed circuit board.
• Reduce solder dross with local N2 hood
STANDARD FUNCTIONS
Clamp washer
120
100
温度[℃]
250
80
60 200
40
150
温度[℃]
20
B面
0
100
40 50 60 70 80 90 100 110 120
时间[sec] A面
50
0
0 30 60 90 120 150 180
时间[sec]
22
HC33-32LF3
Available to set up between 4~5˚ (Standard 4.5˚) Available to set up between 4~5˚ (Standard 4.5˚) Available to set up between 4~5˚ (Standard 4.5˚) Available to set up between 4~5˚ (Standard 4.5˚)
Available to set up between 4~5˚ (Standard 4.5˚) Available to set up between 4~5˚ (Standard 4.5˚) Available to set up between 4~5˚ (Standard 4.5˚) Available to set up between 4~5˚ (Standard 4.5˚)
380
495 3200 (1370)
1600±20
1530±20
1070
700~1050
750±20
130±20
23