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Typical Application
Dropout Voltage
400
3.3V to 2.5V Regulator TJ = 25°C
350
300
DROPOUT VOLTAGE (mV)
2.5V
IN OUT
VIN > 3V + + 1.1A
250
TO 20V 10µF* LT1965-2.5 10µF*
200
SHDN SENSE
150
GND
*CERAMIC OR TANTALUM 100
1965 TA01
50
0
0 0.2 0.4 0.6 0.8 1 1.2
OUTPUT CURRENT (A) 1965 TA01b
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Pin Configuration
TOP VIEW
TOP VIEW
OUT 1 8 IN
OUT 1 8 IN
OUT 2 7 IN OUT 2 7 IN
9 9
SENSE/ADJ* 3 6 SHDN SENSE/ADJ* 3 6 SHDN
GND 4 5 GND
GND 4 5 GND
MS8E PACKAGE
8-LEAD PLASTIC MSOP
DD PACKAGE TJMAX = 125°C, θJA = 60°C/W, θJC = 10°C/W
8-LEAD (3mm × 3mm) PLASTIC DFN
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
TJMAX = 150°C, θJA = 65°C/W, θJC = 3°C/W *PIN 3 = SENSE FOR LT1965-1.5/LT1965-1.8/LT1965-2.5/LT1965-3.3
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB *PIN 3 = ADJ FOR LT1965
*PIN 3 = SENSE FOR LT1965-1.5/LT1965-1.8/LT1965-2.5/LT1965-3.3
*PIN 3 = ADJ FOR LT1965
Q PACKAGE T PACKAGE
5-LEAD PLASTIC DD-PAK 5-LEAD PLASTIC TO-220
TJMAX = 150°C, θJA = 30°C/W, θJC = 3°C/W TJMAX = 150°C, θJA = 50°C/W, θJC = 3°C/W
*PIN 5 = SENSE FOR LT1965-1.5/LT1965-1.8/LT1965-2.5/LT1965-3.3 *PIN 5 = SENSE FOR LT1965-1.5/LT1965-1.8/LT1965-2.5/LT1965-3.3
*PIN 5 = ADJ FOR LT1965 *PIN 5 = ADJ FOR LT1965
Order Information
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT1965EDD#PBF LT1965EDD#TRPBF LCXW 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965IDD#PBF LT1965IDD#TRPBF LCXW 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965EDD-1.5#PBF LT1965EDD-1.5#TRPBF LDKW 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965IDD-1.5#PBF LT1965IDD-1.5#TRPBF LDKW 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965EDD-1.8#PBF LT1965EDD-1.8#TRPBF LDKY 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965IDD-1.8#PBF LT1965IDD-1.8#TRPBF LDKY 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965EDD-2.5#PBF LT1965EDD-2.5#TRPBF LDMB 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965IDD-2.5#PBF LT1965IDD-2.5#TRPBF LDMB 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT1965EDD-3.3#PBF LT1965EDD-3.3#TRPBF LDMD 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
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Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 6: To satisfy minimum input voltage requirements, the LT1965
may cause permanent damage to the device. Exposure to any Absolute adjustable version is tested and specified for these conditions with an
Maximum Rating condition for extended periods may affect device external resistor divider (bottom 4.02k, top 4.32k) for an output voltage of
reliability and lifetime. 2.5V. The external resistor divider adds 300µA of output DC load current.
Note 2: Absolute maximum input to output differential voltage is not This external current is not factored into GND pin current.
achievable with all combinations of rated IN pin and OUT pin voltages. Note 7: Dropout voltage is the minimum input-to-output voltage
With the IN pin at 22V, the OUT pin may not be pulled below 0V. The total differential needed to maintain regulation at a specified output current. In
measured voltage from IN to OUT must not exceed ±22V. dropout, the output voltage equals: (VIN – VDROPOUT)
Note 3: The LT1965 regulators are tested and specified under pulse Note 8: GND pin current is tested with VIN = VOUT(NOMINAL) + 1V and a
load conditions such that TJ @ TA. The LT1965E regulators are 100% current source load. GND pin current increases slightly in dropout. For
tested at TA = 25°C and performance is guaranteed from 0°C to 125°C. the fixed output versions, an internal resistor divider will typically add
Performance of the LT1965E over the full –40°C to 125°C operating 100µA to the GND pin current. See GND pin current curves in the Typical
junction temperature range is assured by design, characterization and Performance Characteristics section.
correlation with statistical process controls. The LT1965I regulators are Note 9: ADJ pin bias current flows into the ADJ pin.
guaranteed over the full –40°C to 125°C operating junction temperature Note 10: SHDN pin current flows into the SHDN pin.
range. The LT1965H is tested at 150°C operating junction temperature.
Note 11: Reverse-output current is tested with the IN pin grounded and
High junction temperatures degrade operating lifetimes. Operating lifetime
the OUT pin forced to the rated output voltage. This current flows into the
is derated at junction temperatures greater than 125°C.
OUT pin and out of the GND pin.
Note 4: The LT1965 adjustable version is tested and specified for these
Note 12: For the LT1965, LT1965-1.5 and LT1965-1.8, the minimum input
conditions with the ADJ connected to the OUT pin.
voltage specification limits the dropout voltage under some output voltage/
Note 5: Maximum junction temperature limits operating conditions. The load conditions.
regulated output voltage specification does not apply for all possible
Note 13: This IC includes overtemperature protection that is intended
combinations of input voltage and output current. Limit the output current
to protect the device during momentary overload conditions. Junction
range if operating at the maximum input voltage. Limit the input-to-output
temperature will exceed 125°C (LT1965E, LT1965I) or 150°C (LT1965H)
voltage differential if operating at the maximum output current.
when overtemperature is active. Continuous operation above the specified
maximum operating junction temperature may impair device reliability.
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TJ = 125°C TJ = 125°C IL = 1A
350 350 350 IL = 1.1A
300 300 300
250 250 TJ = 25°C 250 IL = 500mA
200 200 200
TJ = 25°C
150 150 150 IL = 100mA
LT1965-2.5 Output Voltage LT1965-3.3 Output Voltage LT1965 ADJ Pin Voltage
2.540 3.350 1.218
IL = 1mA IL = 1mA IL = 1mA
2.532 3.340 1.214
2.524 3.330 1.210
OUTPUT VOLTAGE (V)
2.516
ADJ PIN VOLTAGE (V)
3.320
1.206
2.508 3.310
1.202
2.500 3.300
1.198
2.492 3.290
1.194
2.484 3.280
2.476 3.270 1.190
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3 3 6
2 2 4
LT1965-1.5 GND Pin Current LT1965-1.8 GND Pin Current LT1965-1.8 GND Pin Current
(Heavy Load) (Light Load) (Heavy Load)
25 5 25
TJ = 25°C TJ = 25°C TJ = 25°C
VSHDN = VIN VSHDN = VIN VSHDN = VIN
*FOR VOUT = 1.5V *FOR VOUT = 1.8V *FOR VOUT = 1.8V
20 4 20
GND PIN CURRENT (mA)
10 2 10
RL = 36Ω, IL = 50mA* RL = 3.6Ω, IL = 500mA*
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0 0 0
0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10
INPUT VOLTAGE (V) INPUT VOLTAGE (V) 1965 G20
INPUT VOLTAGE (V)
1965 G19 1965 G21
LT1965-3.3 GND Pin Current LT1965 GND Pin Current LT1965 GND Pin Current
(Heavy Load) (Light Load) (Heavy Load)
25 2.0 25
TJ = 25°C TJ = 25°C TJ = 25°C
VSHDN = VIN 1.8 VSHDN = VIN VSHDN = VIN
*FOR VOUT = 3.3V *FOR VOUT = 1.2V *FOR VOUT = 1.2V
20 1.6 20
RL = 24Ω, IL = 50mA*
5 0.4 5
RL = 33Ω, IL = 100mA* RL = 12Ω, IL = 100mA*
0.2
0 0 0
0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10
INPUT VOLTAGE (V) 1965 G22
INPUT VOLTAGE (V) 1965 G23
INPUT VOLTAGE (V) 1965 G24
17.5 0.7
15.0 0.6
12.5 0.5 ON TO OFF
10.0 0.4
7.50 0.3
5.00 0.2
2.50 0.1
0 0
0 0.2 0.4 0.6 0.8 1.0 1.2 –50 –25 0 25 50 75 100 125 150
LOAD CURRENT (A) 1965 G25
TEMPERATURE (°C) 1965 G26
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SHDN Pin Input Current SHDN Pin Input Current ADJ Pin Bias Current
6 6.0 4.5
VSHDN = 20V
5.9 4.0
5
SHDN PIN INPUT CURRENT (µA)
0.5
0.5 1
LT1965-2.5
LT1965-3.3
0 0 0
0 2 4 6 8 10 12 14 16 18 20 –50 –25 0 25 50 75 100 125 150 0 1 2 3 4 5 6 7 8 9
INPUT/OUTPUT DIFFERENTIAL (V) 1965 G30 TEMPERATURE (°C) 1965 G31
OUTPUT VOLTAGE (V) 1965 G32
50
LT1965-1.5/-1.8/-2.5/-3.3
0.3
40
LT1965
0.2 30
20 IL = 0.75A
0.1 COUT = 10µF CERAMIC
10 VIN = VOUT(NOMINAL)
+ 1V + 50mVRMS RIPPLE
0 0
–50 –25 0 25 50 75 100 125 150 10 100 1k 10k 100k 1M
TEMPERATURE (°C) FREQUENCY (Hz)
1965 G33 1965 G34
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–20 LT1965-2.5
60 1.5
IL = 500mA LT1965-3.3
50 IL = 100mA –25
40 1.0 –30
30 –35
VIN = VOUT(NOMINAL) + 1V
20 IL = 0.75A 0.5 –40 (LT1965-1.5/-1.8/-2.5/-3.3)
10 VIN = VOUT(NOMINAL) + 1V + 0.5P-P –45 VIN = 2.3V (LT1965)
RIPPLE AT f = 120Hz ∆IL = 1mA TO 1.1A
0 0 –50
–50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C) 1965 G35
TEMPERATURE (°C) 1965 G36
TEMPERATURE (°C) 1965 G37
COUT = 10µF
IL = 1.1A
70 IL = 1.1A
OUTPUT NOISE VOLTAGE (µVRMS)
LT1965-2.5 60
LT1965-3.3
LT1965-3.3 VOUT
50
LT1965-2.5 100µV/DIV
0.10 40
LT1965-1.8
LT1965 30
LT1965-1.8
LT1965-1.5 20
LT1965 1965 G40
LT1965-1.5 400µs/DIV
10
0.01 0
10 100 1k 10k 100k 0.0001 0.001 0.01 0.1 1 10
LOAD CURRENT (A)
FREQUENCY (Hz)
1965 G38 1965 G39
50 3.5
SHDN AND OUTPUT VOLTAGE (V)
0 SHDN
3.0
–50
2.5
–100
2.0
1.5
LOAD CURRENT (A)
VIN = 4.3V
CIN = 10µF CERAMIC 1.5
1.0 OUTPUT
COUT = 10µF CERAMIC
1.0
0.5 0.5
0 0
0 10 20 30 40 50 60 70 80 0 10 20 30 40 50 60 70 80 90 100
TIME (µs) 1965 G41 TIME (µs)
1965 G42
VIN = 3.3V
COUT = 10µF CERAMIC
RL = 2.5k, IL = 1mA FOR VOUT = 2.5V
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OUT (Pins 1, 2 / 1, 2 / 4 / 4): Output. This pin supplies SHDN (Pin 6 / 6 / 1 / 1): Shutdown. Pulling the SHDN pin
power to the load. Use a minimum output capacitor of low puts the LT1965 into a low power state and turns the
10µF to prevent oscillations. Large load transient applica- output off. Drive the SHDN pin with either logic or an open
tions require larger output capacitors to limit peak voltage collector/drain with a pull-up resistor. The resistor sup-
transients. See the Applications Information section for plies the pull-up current to the open collector/drain logic,
more information on output capacitance and reverse-output normally several microamperes and the SHDN pin current,
characteristics. typically less than 5.5µA. If unused, connect the SHDN pin
SENSE (Pin 3 / 3 / 5 / 5): Sense. For fixed voltage versions to VIN. The SHDN pin cannot be driven below GND unless
of the LT1965 (LT1965-1.5/LT1965-1.8/ LT1965-2.5/ it is tied to the IN pin. If the SHDN pin is driven below
LT1965-3.3), the SENSE pin is the input to the error am- GND while IN is powered, the output will turn on. SHDN
plifier. Optimum regulation is obtained when the SENSE pin logic cannot be referenced to a negative supply rail.
pin is connected to the OUT pin of the regulator. In criti- IN (Pins 7, 8 / 7, 8 / 2 / 2): Input. This pin supplies power
cal applications, small voltage drops are caused by the to the device. The LT1965 requires a bypass capacitor at
resistance (RP) of PCB traces between the regulator and IN if located more than six inches from the main input filter
the load. These drops may be eliminated by connecting capacitor. Include a bypass capacitor in battery-powered
the SENSE pin to the output at the load as shown in Figure circuits as a battery’s output impedance generally rises
1 (Kelvin Sense Connection). Note that the voltage drop with frequency. A bypass capacitor in the range of 1µF to
across the external PCB traces will add to the dropout 10µF suffices. The LT1965’s design withstands reverse
voltage of the regulator. The SENSE pin bias current is voltages on the IN pin with respect to ground and the
100µA at the nominal rated output voltage. OUT pin. In the case of a reversed input, which occurs if
ADJ (Pin 3 / 3 / 5 / 5): Adjust. This pin is the input to the a battery is plugged in backwards, the LT1965 behaves
error amplifier. It has a typical bias current of 1.3µA that as if a diode is in series with its input. No reverse current
flows into the pin. The ADJ pin voltage is 1.20V referenced flows into the LT1965 and no reverse voltage appears at
to ground. the load. The device protects itself and the load.
GND (Pins 4, 5 / 4, 5 / 3 / 3): Ground. For the adjustable Exposed Pad (Pin 9 / 9, DFN and MSOP Packages Only):
LT1965, connect the bottom of the resistor divider, setting Ground. Tie this pin directly to Pins 4 and 5 and the PCB
output voltage, directly to GND for optimum regulation. ground. This pin provides enhanced thermal performance
with its connection to the PCB ground. See the Applica-
tions Information section for thermal considerations and
calculating junction temperature.
IN OUT
RP
LT1965
LOAD
+ SHDN SENSE +
VIN
GND
RP
1965 F01
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20 40
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10µF 20
0
X5R X5R
CHANGE IN VALUE (%)
0
CHANGE IN VALUE (%)
–20
–20
–40
–40
Y5V
–60
–60
Y5V
–80 –80 BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10µF
–100 –100
0 2 4 6 8 10 12 14 16 –50 –25 0 25 50 75 100 125
DC BIAS VOLTAGE (V) 1965 F03
TEMPERATURE (°C) 1965 F04
Figure 3. Ceramic Capacitor DC Bias Characteristics Figure 4. Ceramic Capacitor Temperature Characteristics
1mV/DIV
1965 F05
VOUT = 1.3V 1ms/DIV
COUT = 10µF
ILOAD = 0
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6
TJ = 25°C
VIN = 0V
5 VOUT = VADJ (LT1965)
REVERSE OUTPUT CURRENT (mA)
2 LT1965-1.8
1
LT1965-2.5
LT1965-3.3
0
0 1 2 3 4 5 6 7 8 9
OUTPUT VOLTAGE (V) 1965 F06
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R1
0.01Ω 3.3V
IN OUT 2.2A
+ C1 LT1965-3.3
+ C2
VIN > 3.7V
100µF 22µF
SHDN SENSE
GND
R2
0.01Ω
IN OUT
R6
LT1965 6.65k
1%
SHDN SHDN ADJ
GND R7
R3 R4 R5 4.02k
2.2k 2.2k 3 8 10k 1%
+
1/2 1
2 LT1366
– C3
4 0.01µF
1965 TA03
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
4 1
0.25 ±0.05 0.200 REF 0.75 ±0.05 0.25 ±0.05
0.50 0.50 BSC
BSC 2.38 ±0.10
2.38 ±0.05 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 5. EXPOSED PAD SHALL BE SOLDER PLATED
2. DRAWING NOT TO SCALE 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
3. ALL DIMENSIONS ARE IN MILLIMETERS ON TOP AND BOTTOM OF PACKAGE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
1965fb
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev K)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
1 (.074) 0.29
1.88 ±0.102 1.68 REF
(.074 ±.004) 0.889 ±0.127
(.035 ±.005) (.066)
0.05 REF
5.10 DETAIL “B”
1.68 ±0.102 3.20 – 3.45 CORNER TAIL IS PART OF
(.201)
(.066 ±.004) (.126 – .136)
MIN DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
8
NO MEASUREMENT PURPOSE
3.00 ±0.102
0.65 0.52
0.42 ±0.038 (.118 ±.004)
(.0256)
(.0165 ±.0015) (NOTE 3) 8 7 6 5 (.0205)
BSC
TYP REF
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
4.90 ±0.152
DETAIL “A” (.118 ±.004)
0.254 (.193 ±.006)
(NOTE 4)
(.010)
0° – 6° TYP
GAUGE PLANE
1 2 3 4
0.53 ±0.152
(.021 ±.006) 1.10 0.86
(.043) (.034)
DETAIL “A” MAX REF
0.18
(.007)
SEATING
PLANE 0.22 – 0.38 0.1016 ±0.0508
(.009 – .015) (.004 ±.002)
0.65
TYP MSOP (MS8E) 0213 REV K
(.0256)
NOTE:
BSC
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
1965fb
Q Package
5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461 Rev F)
.060
(1.524) .390 – .415
.060 TYP (9.906 – 10.541) .165 – .180
.256
(6.502) (1.524) (4.191 – 4.572) .045 – .055
15° TYP (1.143 – 1.397)
+.008
.004 –.004
.060 .183 .059
( )
.330 – .370
(1.524) (4.648) (1.499) +0.203
(8.382 – 9.398) TYP 0.102 –0.102
.095 – .115
(2.413 – 2.921)
.075
(1.905) DETAIL A
.067 .050 ±.012
.300 +.012 .013 – .023
.143 –.020 (1.702) (1.270 ±0.305)
(7.620) (0.330 – 0.584)
.028 – .038 BSC
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
( +0.305
3.632 –0.508 ) (0.711 – 0.965)
TYP
COPPER HEAT SINK
DETAIL A
0° – 7° TYP 0° – 7° TYP
.420
.080
.420 .276
.350 .325
.205
.585 .585
.320
.090 .090
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T-Package
5-Lead Plastic TO-220 (Standard)
(Reference LTC DWG # 05-08-1421)
.230 – .270
(5.842 – 6.858)
.570 – .620
.620
.460 – .500 (14.478 – 15.748)
(15.75)
(11.684 – 12.700) TYP
.330 – .370
.700 – .728
(8.382 – 9.398)
(17.78 – 18.491)
.095 – .115
SEATING PLANE
(2.413 – 2.921)
.152 – .202
.260 – .320 (3.861 – 5.131) .155 – .195*
(6.60 – 8.13) (3.937 – 4.953)
.013 – .023
(0.330 – 0.584)
.067
BSC .028 – .038 .135 – .165
(1.70)
(0.711 – 0.965) (3.429 – 4.191) * MEASURED AT THE SEATING PLANE
T5 (TO-220) 0801
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R3
2k 2 R7
8
– 470Ω
1/2 1
LT1366 1965 TA04
3
C2
+ 4
NOTE: ADJUST R1 FOR 3.3µF
0A TO 1.1A CONSTANT-CURRENT
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LDO with Independent Inputs Low Noise < 20µVRMS , DFN and MS10 Packages
LT3028 Dual, 100mA/500mA, Low Noise VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.30V, IQ = 30µA, ISD = < 1µA,
Micropower, LDO with Independent Inputs Low Noise < 20µVRMS , DFN and TSSOP Packages
LT3080/ 1.1A Parallelable, Low Noise, Low Dropout 300mV Dropout Voltage (2-Supply Operation), Low Noise: 40µVRMS, VIN: 1.2V to 36V,
LT3080-1 Linear Regulator VOUT: 0V to 35.7V, Current-Based Reference with 1-Resistor VOUT Set; Directly Parallelable
(No Op Amp Required), Stable with Ceramic Caps, TO-220, SOT-223, MSOP and 3mm ×
3mm DFN Packages; LT3080-1 Version Has Integrated Internal Ballast Resistor
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