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®

RT9018A/B

Maximum 3A, Ultra Low Dropout Regulator


General Description Features
The RT9018A/B is a high performance positive voltage z Maximum 3A Low-Dropout Voltage Regulator
regulator designed for use in applications requiring very z High Accuracy Output Voltage ±1.5%
low Input voltage and very low dropout voltage at up to z Typically 210mV Dropout at 3A
3A(Peak). It operates with a VIN as low as 1.4V and VDD z Power Good Output
voltage 3V with output voltage programmable as low as z Output Voltage Pull Low Resistance when Disable
0.8V. The significant feature includes ultra low dropout, z Thermal and Over Current Protection
ideal for applications where VOUT is very close to VIN. z RoHS Compliant and 100% Lead (Pb)-Free
Additionally, there is an enable pin to further reduce power
dissipation while shutdown. The RT9018A/B provides Applications
excellent regulation over variations in line, load and z Front Side Bus VTT (1.2V/3A)
temperature. and provides a power OK signal to indicate z NoteBook PC Applications
if the voltage level of Vo reaches 90% of its rating value. z Motherboard Applications

The RT9018A/B is available in the SOP-8 (Exposed Pad)


Marking Information
and WDFN-10L 3x3 packages with 1V, 1.05V, 1.2V, 1.5V,
1.8V and 2.5V internally preset outputs that are also For marking information, contact our sales representative
adjustable using external resistors. directly or through a Richtek distributor located in your
area.
Ordering Information
RT9018A/B-
Pin Configurations
Package Type (TOP VIEW)
SP : SOP-8 (Exposed Pad-Option 1)
QW : WDFN-10L 3x3 PGOOD 8 GND
Lead Plating System EN 2 7 ADJ
GND
P : Pb Free VIN 3 6 VOUT
9
G : Green (Halogen Free and Pb Free) VDD 4 5 NC
Z : ECO (Ecological Element with
Halogen Free and Pb free) SOP-8 (Exposed Pad)
Output Voltage
10 : 1V/Adj
VOUT 1 10 VDD
1K : 1.05V/Adj VOUT 2 9 VIN
12 : 1.2V/Adj VOUT 3 GND 8 VIN
ADJ 4 7 VIN
15 : 1.5V/Adj PGOOD 5 11 9
EN
18 : 1.8V/Adj
25 : 2.5V/Adj WDFN-10L 3x3
Enable Pin Function
A : Internal Pull High
B : Internal Pull Low
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.

Copyright © 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

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1
RT9018A/B
Typical Application Circuit
VOUT = 0.8 × R1 + R2
R2
VIN VIN VOUT VOUT VIN VIN VOUT VOUT
10µF CDummy R1
RT9018A/B 10µF 10µF RT9018A/B 10µF
Chip Enable Chip Enable
EN ADJ ADJ
EN
PGOOD PGOOD R2
VDD VDD VDD VDD
GND 100k GND 100k
1µF 1µF
VOUT VOUT

Figure 1. Fixed Voltage Regulator Figure 2. Adjustable Voltage Regulator

Function Pin Description


Pin No.
Pin
SOP-8 Pin Function
WDFN-10L 3x3 Name
(Exposed Pad)
3 7, 8, 9 VIN Supply Input Voltage.
2 6 EN Chip Enable (Active-High).
4 10 VDD Supply Voltage of Control Circuitry.
1 5 PGOOD Power Good Open Drain Output.
Set the output voltage by the internal feedback resistors when
7 4 ADJ ADJ is grounded. If external feedback resistors is used, V OUT =
0.8V x (R1 + R2)/R2.
6 1, 2, 3 VOUT Output Voltage.
5 -- NC No Internal Connection.
8, Ground. The exposed pad must be soldered to a large PCB
11 (Exposed Pad) GND
9 (Exposed Pad) and connected to GND for maximum power dissipation.

Function Block Diagram

VIN VOUT

OCP
Driver

Error
OTP Amplifier
+
-

EN POR Mode ADJ


VDD 0.8V PGOOD
-
0.72V +
GND

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RT9018A/B
Absolute Maximum Ratings (Note 1)
z Supply Voltage, VIN ------------------------------------------------------------------------------------------------------ 1V to 6V
z Control Voltage, VDD ----------------------------------------------------------------------------------------------------- 3V to 6V
z Output Voltage, VOUT --------------------------------------------------------------------------------------------------- 0.8 to 6V
z Power Dissipation, PD @ TA = 25°C
SOP-8 (Exposed Pad) --------------------------------------------------------------------------------------------------- 1.33W
WDFN-10L 3x3 ------------------------------------------------------------------------------------------------------------- 1.67W
z Package Thermal Resistance (Note 2)
SOP-8 (Exposed Pad), θJA ---------------------------------------------------------------------------------------------- 75°C/W
SOP-8 (Exposed Pad), θJC --------------------------------------------------------------------------------------------- 15°C/W
WDFN-10L 3x3, θJA ------------------------------------------------------------------------------------------------------- 60°C/W
z Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
z Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V

Recommended Operating Conditions (Note 4)


z Supply Voltage, VIN ------------------------------------------------------------------------------------------------------- 1.4V to 5.5V
z Control Voltage, VDD (VDD > VOUT + 1.5V) -------------------------------------------------------------------------- 3V to 5.5V
z Control Voltage with PGOOD, VDD (Note 8) ----------------------------------------------------------------------- 4.5V to 5.5V
z Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
z Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = VOUT + 500mV, VEN = VDD = 5V, CIN = COUT = 10μF, TA = TJ = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
POR Threshold 2.4 2.7 3 V
POR Hysteresis 0.15 0.2 -- V
Adjustable Pin Threshold VTH_ADJ IOUT = 1mA -- 0.2 0.4 V
Reference Voltage (ADJ Pin Voltage) VADJ IOUT = 1mA 0.788 0.8 0.812 V
Fixed Output Voltage Range ΔVOUT −1.5 0 1.5 %
VIN = VOUT + 0.5V to 5V,
Line Regulation (VIN) ΔVLINE_IN -- 0.2 0.6 %
IOUT = 1mA
VIN = VOUT + 1V,
Load Regulation (Note 5) ΔVLOAD -- 0.2 1 %
IOUT = 1mA to 3A
IOUT = 2A -- 150 250
Dropout Voltage (Note 6) VDROP mV
IOUT = 3A -- 210 350
Quiescent Current (Note 7) IQ VDD = 5.5V -- 0.6 1.2 mA
Current Limit ILIM 3.2 4.5 -- A

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RT9018A/B
Parameter Symbol Test Conditions Min Typ Max Unit
Short Circuit Current VOUT < 0.2V 0.5 1.8 -- A
In-rush Current COUT = 10μF, Enable Start-up -- 0.6 -- A
VOUT Pull Low Resistance VEN = 0V -- 150 -- Ω
Chip Enable
EN Input Bias Current IEN VEN = 0V -- 12 -- μA
VDD Shutdown RT9018A -- 10 20
ISHDN VEN = 0V μA
Current RT9018B -- -- 1
Logic-Low VENL VDD = 5V -- -- 0.7
EN Threshold Voltage V
Logic-High VENH VDD = 5V 1.2 -- --
Power Good
PGOOD Rising Threshold -- 90 93 %
PGOOD Hysteresis 3 10 -- %
PGOOD Sink Capability IPGOOD = 10mA -- 0.2 0.4 V
PGOOD Delay 0.5 1.5 5 ms
Thermal Protection
Thermal Shutdown Temperature TSD -- 160 -- °C
Thermal Shutdown Hysteresis ΔTSD -- 30 -- °C
Thermal Shutdown Temperature
VOUT < 0.4V -- 110 -- °C
Fold-back

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 3A.
Note 6. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) - 100mV.
Note 7. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under no
load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Note 8. The control voltage must within 4.5V to 5.5V when using PGOOD function.

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RT9018A/B
Typical Operating Characteristics
Load Transient Response Load Transient Response
VDD = 5V, VIN = 1.8V, VOUT = 1.2V VDD = 5V, VIN = 1.8V, VOUT = 1.2V

VOUT VOUT
(20mV/Div) (20mV/Div)

IOUT IOUT
(1A/Div) (1A/Div)

Time (2.5ms/Div) Time (2.5ms/Div)

VIN Line Transient Response VIN Line Transient Response


VDD = 5V, VOUT = 1.2V, IOUT = 0A VDD = 5V, VOUT = 1.2V, IOUT = 2A

3 3
VIN VIN
2 2

VOUT VOUT
(20mV/Div) (20mV/Div)

Time (250μs/Div) Time (250μs/Div)

VDD Line Transient Response VDD Line Transient Response


VIN = 1.8V, VOUT = 1.2V, IOUT = 0A VIN = 1.8V, VOUT = 1.2V, IOUT = 2A

5 5
VDD VDD
4 4

VOUT VOUT
(20mV/Div) (20mV/Div)

Time (250μs/Div) Time (250μs/Div)

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RT9018A/B

Dropout Voltage vs. Load Current Start Up from Enable


400
IOUT = 3A
350
125°C
Dropout Voltage (mV)

300
EN
250 25°C (1V/Div)

200 VOUT
(1V/Div)
150 PGOOD
-40°C (1V/Div)
100
I IN
50 (2A/Div)
0
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 Time (500μs/Div)
Load Current (A)

Start Up from VIN Start Up from VDD


IOUT = 3A IOUT = 3A

VIN VDD
(1V/Div) (5V/Div)
VOUT VOUT
(1V/Div) (1V/Div)
PGOOD PGOOD
(1V/Div) (1V/Div)

I IN I IN
(2A/Div) (2A/Div)

Time (1ms/Div) Time (500μs/Div)

Short Circuit Protection Short Circuit Current vs. Temperature


2.6
VDD = 5V, VIN = 1.8V, VOUT = 1.2V
Short Circuit Current Ishort (A)

2.4

2.2

2.0

1.8

1.6

1.4
IOUT
(1A/Div) 1.2

1.0
Time (100μs/Div) -40 -20 0 20 40 60 80 100
Temperature (°C)

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RT9018A/B

VDD Standby Current vs. Temperature Quiescent Current vs. Temperature


32 1200
1.2
VIN = 3.3V, VEN = 0V, VDD = 5V VIN = 1.8V, VOUT = 1.2V, IOUT = 0A
1100
1.1
28
VDD Standby Current (μA)1

1000
1.0

(uA)
Current(mA)
24
900
0.9
20 800
0.8

QuiescentCurrent
700
0.7
16 RT9018A
600
0.6
12 500
0.5

Quiescent
8 400
0.4
300
0.3
4
RT9018B 200
0.2
0 100
0.1
-4 00
-50 -25 0 25 50 75 100 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

Reference Voltage vs. Temperature Output Voltage vs. Temperature


0.84 1.25
VIN = 1.8V, VADJ = 0V, IOUT = 0A
1.24
0.83
1.23
Reference Voltage (V)

0.82
Output Voltage (V)

1.22
0.81 1.21
0.80 1.20

0.79 1.19
1.18
0.78
1.17
0.77
1.16
0.76 1.15
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

VDD POR Threshold Voltage vs. Temperature ADJ Threshold Voltage vs. Temperature
3.00 0.30
ADJ Threshold Voltage Range (V)

2.95 0.28
2.90
0.26
2.85
Rising 0.24
POR Voltage (V)

2.80
2.75 0.22
2.70 0.20
2.65 0.18
Falling
2.60
0.16
2.55
0.14
2.50
2.45 0.12
2.40 0.10
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

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RT9018A/B

Over Current Protection Fold Back


3
VIN = VEN = 3.3V, VDD = 5V

2.5
Output Voltage VOUT (V)

1.5

0.5

0
0 0.5 1 1.5 2 2.5 3 3.5 4
Loading Current I OUT (A)

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RT9018A/B
Application Information
Adjustable Mode Operation Power Good
The output voltage of RT9018A/B is adjustable from 0.8V The power good function is an open-drain output. Connects
to (VIN - VDROP) by external voltage divider resisters as 100kΩ pull up resistor to VOUT to obtain an output voltage.
shown in Typical Application Circuit (Figure 2). The value The PGOOD pin will output high immediately after the
of resisters R1 and R2 should be more than 10kΩ to output voltage arrives 90% of normal output voltage. The
reduce the power loss. The VDD must be greater than PGOOD pin will output high with typical 1.5ms delay time.
(VOUT + 1.5V).
Thermal-Shutdown Protection
Enable
Thermal protection limits power dissipation to prevent IC
The RT9018A/B goes into shutdown mode when the EN over temperature in RT9018A/B. When the operation
pin is in the logic low condition. During this condition, the junction temperature exceeds 160°C, the over-temperature
pass transistor, error amplifier, and band gap are turned protection circuit starts the thermal shutdown function
off, reducing the supply current to 10μA typical. The and turns the pass transistor off. The pass transistor turn
RT9018A/B goes into operation mode when the EN pin is on again after the junction temperature cools by 30°C.
in the logic high condition. If the EN pin is floating, NOTE RT9018A/B lowers its OTP trip level from 160°C to 110°C
that the RT9018A/B internal initial logic level. For RT9018A, when output short circuit occurs (VOUT < 0.4V). It limits
the EN pin function pulls high level internally. So the IC case temperature under 100°C and provides maximum
regulator will be turn on when EN pin is floating. For safety to customer while output short circuit occurring.
RT9018B, the EN pin function pulls low level internally.
So the regulator will be turn off when EN pin is floating. Power Dissipation
For continuous operation, do not exceed absolute
Output Capacitor
maximum operation junction temperature 125°C. The
The RT9018A/B is specifically designed to employ ceramic power dissipation definition in device is :
output capacitors as low as 10μF. The ceramic capacitors
PD = (VIN − VOUT) x IOUT + VIN x IQ
offer significant cost and space savings, along with high
frequency noise filtering. The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
Input Capacitor surroundings airflow and temperature difference between
Good bypassing is recommended from input to ground to junctions to ambient. The maximum power dissipation can
help improve AC performance. A 10μF input capacitor or be calculated by following formula :
greater located as close as possible to the IC is PD(MAX) = (TJ(MAX) − TA) / θJA
recommended.
Where T J(MAX) is the maximum operation junction
Current Limit temperature 125°C, TA is the ambient temperature and the
The RT9018A/B contains an independent current limit and θJA is the junction to ambient thermal resistance.
the short circuit current protection to prevent unexpected For recommended operating conditions specification,
applications. The current limit monitors and controls the where TJ (MAX) is the maximum junction temperature of
pass transistor’ s gate voltage, limiting the output current the die (125°C) and T A is the maximum ambient
to higher than 4.5A typical. When the output voltage is temperature. The junction to ambient thermal resistance
less than 0.4V, the short circuit current protection starts for SOP-8 (Exposed Pad) package is 75°C/W on the
the current fold back function and maintains the loading standard JEDEC 51-7 (4 layers, 2S2P) thermal test board.
current 1.8A. The output can be shorted to ground The copper thickness is 2oz. The maximum power
indefinitely without damaging the part. dissipation at TA = 25°C can be calculated by following
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9
RT9018A/B
formula :
PD (MAX) = (125°C − 25°C) / (75°C/W) = 1.33W (SOP-8
Exposed Pad on the minimum layout)

Layout Considerations
The thermal resistance θJA of SOP-8 (Exposed Pad) is
determined by the package design and the PCB design. Figure 3 (d). Copper Area = 50mm2, θJA = 51°C/W
However, the package design had been designed. If
possible, it’ s useful to increase thermal performance by
the PCB design. The thermal resistance θJA can be
decreased by adding a copper under the exposed pad of
SOP-8 (Exposed Pad) package.
As shown in Figure 3, the amount of copper area to which
the SOP-8 (Exposed Pad) is mounted affects thermal
performance. When mounted to the standard SOP-8
(Exposed Pad) pad (Figure 3.a), θJA is 75°C/W. Adding Figure 3 (e). Copper Area = 70mm2, θJA = 49°C/W
copper area of pad under the SOP-8 (Exposed Pad) Figure
3.b) reduces the θJA to 64°C/W. Even further, increasing Figure 3. Thermal Resistance vs. Different Cooper Area
the copper area of pad to 70mm2 (Figure 3.e) reduces the Layout Design
θJA to 49°C/W.

The maximum power dissipation depends on operating


ambient temperature for fixed T J(MAX) and thermal
resistance θJA . The Figure 4 of de-rating curves allows
the designer to see the effect of rising ambient temperature
on the maximum power allowed.
2.2
Copper Area
2
Figure 3 (a). Minimum Footprint, θJA = 75°C/W 70mm2
1.8
Power Dissipation (W)

50mm2
1.6
30mm2
1.4
10mm2
1.2
Minimum Layout
1
0.8
0.6
0.4
Figure 3 (b). Copper Area = 10mm2, θJA = 64°C/W
0.2
JEDEC 4-Layers PCB
0
0 20 40 60 80 100 120 140
Ambient Temperature (°C)

Figure 4. De-rating Curves

Figure 3 (c). Copper Area = 30mm2, θJA = 54°C/W

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RT9018A/B
Outline Dimension

H
A

EXPOSED THERMAL PAD Y


(Bottom of Package)
J X B

C
I
D

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 4.000 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.510 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.000 0.152 0.000 0.006
J 5.791 6.200 0.228 0.244
M 0.406 1.270 0.016 0.050
X 2.000 2.300 0.079 0.091
Option 1
Y 2.000 2.300 0.079 0.091
X 2.100 2.500 0.083 0.098
Option 2
Y 3.000 3.500 0.118 0.138

8-Lead SOP (Exposed Pad) Plastic Package

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11
RT9018A/B

D2
D

E E2

SEE DETAIL A
1
2 1 2 1
e
b
A DETAIL A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.180 0.300 0.007 0.012
D 2.950 3.050 0.116 0.120
D2 2.300 2.650 0.091 0.104
E 2.950 3.050 0.116 0.120
E2 1.500 1.750 0.059 0.069
e 0.500 0.020
L 0.350 0.450 0.014 0.018

W-Type 10L DFN 3x3 Package

Richtek Technology Corporation


5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

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