MC74HC4316A Quad Analog Switch/ Multiplexer/Demultiplexer with Separate Analog and Digital Power Supplies

HighPerformance SiliconGate CMOS

The MC74HC4316A utilizes silicongate CMOS technology to achieve fast propagation delays, low ON resistances, and low OFFchannel leakage current. This bilateral switch/multiplexer/ demultiplexer controls analog and digital voltages that may vary across the full analog powersupply range (from VCC to VEE). The HC4316A is similar in function to the metalgate CMOS MC14016 and MC14066, and to the HighSpeed CMOS HC4066A. Each device has four independent switches. The device control and Enable inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The device has been designed so that the ON resistances (RON) are much more linear over input voltage than RON of metalgate CMOS analog switches. Logiclevel translators are provided so that the On/Off Control and Enable logiclevel voltages need only be VCC and GND, while the switch is passing signals ranging between VCC and VEE. When the Enable pin (activelow) is high, all four analog switches are turned off.
Features http://onsemi.com MARKING DIAGRAMS
16 16 1 PDIP16 N SUFFIX CASE 648 1 16 16 1 SOIC16 D SUFFIX CASE 751B 1 HC139AG AWLYWW MC74HC139AN AWLYYWWG

16 16 1 SOEIAJ16 F SUFFIX CASE 966 1 A L, WL Y, YY W, WW G = Assembly Location = Wafer Lot = Year = Work Week = PbFree Package 74HC139A ALYWG

LogicLevel Translator for On/Off Control and Enable Inputs Fast Switching and Propagation Speeds High ON/OFF Output Voltage Ratio Diode Protection on All Inputs/Outputs Analog PowerSupply Voltage Range (VCC VEE) = 2.0 to 12.0 V Digital (Control) PowerSupply Voltage Range (VCC GND) = 2.0 V to 6.0 V, Independent of VEE Improved Linearity of ON Resistance Chip Complexity: 66 FETs or 16.5 Equivalent Gates PbFree Packages are Available*

ORDERING INFORMATION
Device MC74HC4316AN MC74HC4316ANG MC74HC4316ADR2 MC74HC4316ADR2G MC74HC4316AFEL MC74HC4316AFELG Package PDIP16 PDIP16 (PbFree) SOIC16 Shipping 500 Units / Box 500 Units / Box 2500/Tape&Reel

SOIC16 2500/Tape&Reel (PbFree) SOEIAJ16 SOEIAJ16 (PbFree) 50/Tape&Reel 50/Tape&Reel

*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

June, 2005 Rev. 4

Publication Order Number: MC74HC4316A/D

MC74HC4316A
XA YA YB XB B ON/OFF CONTROL C ON/OFF CONTROL ENABLE GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC A ON/OFF CONTROL D ON/OFF CONTROL XD YD YC XC VEE

FUNCTION TABLE
Inputs Enable L L H X = Dont Care. On/Off Control H L X State of Analog Switch On Off Off

Figure 1. Pin Assignment

XA A ON/OFF CONTROL

1 15 LEVEL TRANSLATOR

ANALOG SWITCH

YA

XB B ON/OFF CONTROL

4 5 LEVEL TRANSLATOR

ANALOG SWITCH

YB ANALOG OUTPUTS/INPUTS

XC C ON/OFF CONTROL

10 6 LEVEL TRANSLATOR

ANALOG SWITCH

11

YC

PIN 16 = VCC PIN 8 = GND PIN 9 = VEE GND VEE

XD D ON/OFF CONTROL ENABLE

13 14 7 LEVEL TRANSLATOR

ANALOG SWITCH

12

YD

ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD

Figure 2. Logic Diagram

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MAXIMUM RATINGS
Symbol VCC VEE VIS Vin I Parameter Value Unit V V V V Positive DC Supply Voltage (Ref. to GND) (Ref. to VEE) 0.5 to + 7.0 0.5 to + 14.0 7.0 to + 0.5 VEE 0.5 to VCC + 0.5 Negative DC Supply Voltage (Ref. to GND) Analog Input Voltage DC Input Voltage (Ref. to GND) 0.5 to VCC + 0.5 25 750 500 450 DC Current Into or Out of Any Pin Power Dissipation in Still Air mA PD Plastic DIP* EIAJ/SOIC Package* TSSOP Package* mW Tstg TL Storage Temperature 65 to + 150 260 C C Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *Derating Plastic DIP: 10 mW/C from 65 to 125C EIAJ/SOIC Package: 7 mW/C from 65 to 125C TSSOP Package: 6.1 mW/C from 65 to 125C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus.

RECOMMENDED OPERATING CONDITIONS

Symbol VCC VEE VIS Vin Parameter

Min 2.0

Max 6.0

Unit V V V V V

Positive DC Supply Voltage (Ref. to GND)

Negative DC Supply Voltage (Ref. to GND) Analog Input Voltage

6.0 VEE

GND VCC VCC 1.2

Digital Input Voltage (Ref. to GND)

GND

VIO* TA

Static or Dynamic Voltage Across Switch

Operating Temperature, All Package Types Input Rise and Fall Time (Control or Enable Inputs) (Figure 10)

55 0 0 0 0

+ 125 1000 600 500 400

C ns

tr, tf

VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V

*For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.

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MC74HC4316A

Guaranteed Limit v 85C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 Symbol VIH Parameter Test Conditions VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 6.0 55 to 25C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 v 125C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 Unit V Minimum HighLevel Voltage, Control or Enable Inputs Ron = Per Spec VIL Maximum LowLevel Voltage, Control or Enable Inputs Ron = Per Spec V Iin Maximum Input Leakage Current, Control or Enable Inputs Vin = VCC or GND VEE = 6.0 V 0.1 1.0 1.0 mA mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND VEE = GND VIO = 0 V VEE = 6.0 6.0 6.0 2 4 20 40 40 160 NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

DC ELECTRICAL CHARACTERISTICS Digital Section (Voltages Referenced to GND) VEE = GND Except Where Noted

DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to VEE)

Guaranteed Limit v 85C 200 110 110 115 90 90 25 20 20 Symbol Ron Parameter Test Conditions VCC V 2.0* 45 4.5 6.0 2.0 4.5 4.5 6.0 2.0 4.5 4.5 6.0 6.0 VEE
V

55 to 25C 160 90 90 90 70 70 20 15 15

v 125C 240 130 130 140 105 105 30 25 25

Unit W

Maximum ON Resistance

Vin = VIH VIS = VCC to VEE IS v 2.0 mA (Figures 1, 2)

0.0 0.0 4.5 6.0 0.0 0.0 4.5 6.0 0.0 0.0 4.5 6.0 6.0

Vin = VIH VIS = VCC or VEE (Endpoints) IS v 2.0 mA (Figures 1, 2) Vin = VIH VIS = 1/2 (VCC VEE) IS v 2.0 mA Vin = VIL VIO = VCC or VEE Switch Off (Figure 3) Vin = VIH VIS = VCC or VEE (Figure 4)

DRon

Maximum Difference in ON Resistance Between Any Two Channels in the Same Package Maximum OffChannel Leakage Current, Any One Channel Maximum OnChannel Leakage Current, Any One Channel

Ioff

0.1

0.5

1.0

mA

Ion

6.0

6.0

0.1

0.5

1.0

mA

NOTE:

Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D). *At supply voltage (VCC VEE) approaching 2.0 V the analog switchon resistance becomes extremely nonlinear. Therefore, for lowvoltage operation, it is recommended that these devices only be used to control digital signals.

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MC74HC4316A

Guaranteed Limit v 85C 50 8 7 Symbol tPLH, tPHL tPLZ, tPHZ tPZL, tPZH C Parameter Maximum Propagation Delay, Analog Input to Analog Output (Figures 8 and 9) VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 55 to 25C 40 6 5 v 125C 60 9 8 Unit ns Maximum Propagation Delay, Control or Enable to Analog Output (Figures 10 and 11) Maximum Propagation Delay, Control or Enable to Analog Output (Figures 10 and 11) Maximum Capacitance 130 40 30 140 40 30 10 160 50 40 175 50 40 10 200 60 50 250 60 50 10 ns ns ON/OFF Control and Enable Inputs pF Control Input = GND Analog I/O 35 35 35 Feedthrough 1.0 1.0 1.0 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V 15 Power Dissipation Capacitance (Per Switch) (Figure 13)* pF CPD *Used to determine the noload dynamic power consumption: P D = CPD V CC2 f + ICC VCC . For load considerations, see Chapter 2of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Control or Enable tr = tf = 6 ns, VEE = GND)

Symbol BW Parameter Test Conditions VCC V VEE V Limit* 25C 150 160 160 Unit Maximum OnChannel Bandwidth or Minimum Frequency Response (Figure 5) OffChannel Feedthrough Isolation (Figure 6) fin = 1 MHz Sine Wave Adjust fin Voltage to Obtain 0 dBm at VOS Increase fin Frequency Until dB Meter Reads 3 dB RL = 50 W, CL = 10 pF fin  Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 W, CL = 50 pF fin = 1.0 MHz, RL = 50 W, CL = 10 pF 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 2.25 4.50 6.00 MHz 50 50 50 40 40 40 60 130 200 30 65 100 dB Feedthrough Noise, Control to Switch (Figure 7) Vin v 1 MHz Square Wave (tr = tf = 6 ns) Adjust RL at Setup so that IS = 0 A RL = 600 W, CL = 50 pF RL = 10 kW, CL = 10 pF mVPP Crosstalk Between Any Two Switches (Figure 12) fin  Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 W, CL = 50 pF fin = 1.0 MHz, RL = 50 W, CL = 10 pF 70 70 70 80 80 80 dB THD Total Harmonic Distortion (Figure 14) fin = 1 kHz, RL = 10 kW, CL = 50 pF THD = THDMeasured THDSource VIS = 4.0 VPP sine wave VIS = 8.0 VPP sine wave VIS = 11.0 VPP sine wave % 2.25 4.50 6.00 2.25 4.50 6.00 0.10 0.06 0.04 *Limits not tested. Determined by design and verified by qualification.

ADDITIONAL APPLICATION CHARACTERISTICS (GND = 0 V)

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MC74HC4316A

TBD

TBD

Figure 1a. Typical On Resistance, VCC VEE = 2.0 V

Figure 1b. Typical On Resistance, VCC VEE = 4.5 V

TBD

TBD

Figure 1c. Typical On Resistance, VCC VEE = 6.0 V

Figure 1d. Typical On Resistance, VCC VEE = 9.0 V

PLOTTER

PROGRAMMABLE POWER SUPPLY

MINI COMPUTER

DC ANALYZER

TBD

+ DEVICE UNDER TEST ANALOG IN

VCC

COMMON OUT

GND

VEE

Figure 1e. Typical On Resistance, VCC VEE = 12.0 V http://onsemi.com

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Figure 2. On Resistance Test SetUp

MC74HC4316A
VCC

VEE VCC A OFF

16

VCC

VCC A O/I VEE ON

16

VCC N/C

VIL 7 8 9 VEE SELECTED CONTROL INPUT VEE 7 8 9 SELECTED CONTROL INPUT

VIH

Figure 3. Maximum Off Channel Leakage Current, Any One Channel, Test SetUp

Figure 4. Maximum On Channel Leakage Current, Test SetUp

VIS VCC 16 fin 0.1 mF ON RL VCC SELECTED CONTROL INPUT C L* VCC RL TO dB METER 16 fin 0.1 mF RL OFF RL C L* VCC TO dB METER

7 8 9 VEE

7 8 9 VEE

SELECTED CONTROL INPUT

*Includes all probe and jig capacitance.

*Includes all probe and jig capacitance.

Figure 5. Maximum OnChannel Bandwidth Test SetUp

Figure 6. OffChannel Feedthrough Isolation, Test SetUp

VCC 16 TEST POINT ANALOG IN tPLH 50% 50% GND tPHL

RL 7 8 9 VEE CONTROL

ON/OFF RL SELECTED CONTROL INPUT C L*

VCC

ANALOG OUT

*Includes all probe and jig capacitance.

Figure 7. Feedthrough Noise, Control to Analog Out, Test SetUp

Figure 8. Propagation Delays, Analog In to Analog Out

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MC74HC4316A
VCC 16 ANALOG I/O ON ANALOG O/I 50 pF* TEST POINT ENABLE 50% CONTROL tPZL 7 8 9 SELECTED CONTROL INPUT VCC ANALOG OUT 50% tPZH 50% *Includes all probe and jig capacitance. tPHZ 10% 90% tPLZ tr tf VCC GND HIGH IMPEDANCE VOL VOH HIGH IMPEDANCE

Figure 9. Propagation Delay Test SetUp

Figure 10. Propagation Delay, ON/OFF Control to Analog Out

POSITION 1 WHEN TESTING tPHZ AND tPZH 1 2 VCC 1 2 CONTROL OR ENABLE 8 9 VEE ON/OFF 50 pF* POSITION 2 WHEN TESTING tPLZ AND tPZL VCC 16 1 kW TEST POINT fin 0.1 mF RL

VIS VCC 16 ON RL C L* TEST POINT RL VCC SELECTED CONTROL INPUT C L*

ANALOG I/O OFF 7 8 9

*Includes all probe and jig capacitance.

*Includes all probe and jig capacitance.

Figure 11. Propagation Delay Test SetUp

Figure 12. Crosstalk Between Any Two Switches, Test SetUp (Adjacent Channels Used)

VCC A 16 N/C ON/OFF N/C 10 mF fin ON RL 7 8 9 VEE CONTROL SELECTED CONTROL INPUT VEE C L* VIS

VCC 16

VOS TO DISTORTION METER

7 8 9

SELECTED CONTROL INPUT

VCC

*Includes all probe and jig capacitance.

Figure 13. Power Dissipation Capacitance Test SetUp

Figure 14. Total Harmonic Distortion, Test SetUp

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MC74HC4316A
APPLICATIONS INFORMATION
0 10 20 30 dBm 40 50 60 70 80 90 100 1.0 2.0 FREQUENCY (kHz) 3.0 DEVICE SOURCE FUNDAMENTAL FREQUENCY

Figure 15. Plot, Harmonic Distortion

The Enable and Control pins should be at VCC or GND logic levels, VCC being recognized as logic high and GND being recognized as a logic low. Unused analog inputs/outputs may be left floating (not connected). However, it is advisable to tie unused analog inputs and outputs to VCC or VEE through a low value resistor. This minimizes crosstalk and feedthrough noise that may be picked up by the unused I/O pins. The maximum analog voltage swings are determined by the supply voltages VCC and VEE. The positive peak analog voltage should not exceed VCC. Similarly, the negative peak analog voltage should not go below VEE. In the example below, the difference between VCC and VEE is 12 V.

Therefore, using the configuration in Figure 16, a maximum analog signal of twelve volts peaktopeak can be controlled. When voltage transients above VCC and/or below VEE are anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure 17. These diodes should be small signal, fast turnon types able to absorb the maximum anticipated current surges during clipping. An alternate method would be to replace the Dx diodes with MOSORBs (MOSORBt is an acronym for high current surge protectors). MOSORBs are fast turnon devices ideally suited for precise dc protection with no inherent wear out mechanism.

VCC = 6 V +6V 6 V +6V SELECTED CONTROL INPUT VEE 8 6 V ANALOG I/O 16 ON ANALOG O/I +6V 6 V Dx

VCC 16 ON Dx VEE VCC SELECTED CONTROL INPUT VEE

VCC Dx

Dx VEE ENABLE CONTROL INPUTS (VCC OR GND)

ENABLE CONTROL INPUTS (VCC OR GND)

Figure 16.

Figure 17. Transient Suppressor Application

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MC74HC4316A
VCC = 5 V +5 V

ANALOG SIGNALS R* R* R* R* R*

16

ANALOG SIGNALS VEE = 0 TO 6 V LSTTL/ NMOS

ANALOG SIGNALS HCT BUFFER 5 6 14 15

16

ANALOG SIGNALS VEE = 0 TO 6 V

HC4316A TTL 7 5 6 14 15 R* = 2 TO 10 kW ENABLE AND CONTROL 9 INPUTS 8

HC4016A

CONTROL INPUTS 9 7

a. Using PullUp Resistors

b. Using HCT Buffer Figure 18. LSTTL/NMOS to HCMOS Interface

VCC = 12 V 12 V POWER SUPPLY R1 GND = 6 V R2 VEE = 0 V R1 = R2 VCC ANALOG INPUT SIGNAL C R3 R4 VEE ANALOG OUTPUT SIGNAL 12 V 0

12 VPP

1 OF 4 SWITCHES R1 = R2 R3 = R4

Figure 19. Switching a 0to12 V Signal Using a Single Power Supply (GND 0 V)

CHANNEL 4

1 OF 4 SWITCHES 1 OF 4 SWITCHES COMMON I/O 1 OF 4 SWITCHES 1 OF 4 SWITCHES INPUT 1 OF 4 SWITCHES + 0.01 mF 1 2 3 4 CONTROL INPUTS LF356 OR EQUIVALENT OUTPUT

CHANNEL 3

CHANNEL 2

CHANNEL 1

Figure 20. 4Input Multiplexer

Figure 21. Sample/Hold Amplifier

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PACKAGE DIMENSIONS

PDIP16 N SUFFIX CASE 64808 ISSUE T

A
16 9

B
1 8

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.

F S

T H G D
16 PL

SEATING PLANE

J T A
M

0.25 (0.010)

DIM A B C D F G H J K L M S

INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040

MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01

SOIC16 D SUFFIX CASE 751B05 ISSUE J

A
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019

B
1 8

8 PL

0.25 (0.010)

G F

K C T
SEATING PLANE

X 45 _

M D
16 PL M

0.25 (0.010)

T B

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MC74HC4316A
PACKAGE DIMENSIONS
SOEIAJ16 F SUFFIX CASE 96601 ISSUE O

16

LE Q1 E HE M_ L DETAIL P

Z D e A VIEW P

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 0.78 INCHES MIN MAX 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 0.031

b 0.13 (0.005)
M

A1 0.10 (0.004)

MOSORB is a trademark of Semiconductor Components Industries, LLC (SCILLC).

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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MC74HC4316A/D