HEAT AND MASS TRANSFER (EME 504) VTH SEM MECHANICAL

Prepared By: Krishna Kumar Karothiya (Asstt. Prof.) Mechanical Engineering Department
ABES , ENGG. COLLEGE GHAZIABAD

UNIT-1
Introduction to Heat Transfer, Conduction, Steady State one-dimensional Heat conduction

What is Heat Transfer

Energy in transit due to temperature difference.

Thermodynamics tells us:

How much heat is transferred (dQ) How much work is done (dW) Final state of the system

Heat transfer tells us:

How (with what modes) dQ is transferred At what rate dQ is transferred Temperature distribution inside the body

MODES
Conduction
needs matter Molecular phenomenon (diffusion process) Without bulk motion of matter

Convection
Heat carried away by bulk motion of fluid Needs fluid matter

Radiation
Does not needs matter Transmission of energy by electromagnetic waves

APPLICATIONS OF HEAT TRANSFER

Energy production and conversion
Steam power plant, solar energy conversion etc

Refrigeration and air conditioning Domestic applications

ovens, stoves, toaster

Cooling of electronic equipment Manufacturing / materials processing

welding, casting, soldering, laser machining

Automobiles / aircraft design Nature (weather, climate etc)

Conduction
(Needs medium, Temperature gradient)

RATE: q(W) or (J/s) (heat flow per unit time)

Conduction
Rate equations (1D conduction): Differential Form

Difference Form

(negative sign denotes heat transfer in the direction of decreasing temperature)

CONVECTION
MOVING FLUID

Energy transferred by diffusion + bulk motion of fluid

Rate equation (convection)

h=heat transfer coefficient (W /m 2 K) (not a property) depends on geometry ,nature of flow, thermodynamics properties etc Ts= surface temp. T = Ambient temperature

Convection

Convection (contd)
Typical values of h (W/m 2 K) Free convection gases: 2 -25 liquid: 50 -100 Forced convection gases: 25- 250 liquid: 50 -20,000 Boiling/Condensation 2500 -100,000

RADIATION

Rate equations (Radiation)

RADIATION: Heat Transfer by electromagnetic waves or photons( no medium required. ) Emissive power of a surface (energy released per unit area)

e= emissivity s=Stefan Boltzmann constant

Rate equations (Contd.)

ONE DIMENSIONAL STEADY STATE HEAT CONDUCTION

Objectives of conduction analysis

To determine the temperature field, T(x,y,z,t), in a body(i.e. how temperature varies with position within the body) T(x,y,z,t) depends on:
Boundary conditions initial condition Material properties (k, c p , r ) Geometry of the body (shape, size)

why we need T(x,y,z,t) ?

To compute heat flux at any location (using Fouriers eqn.) Compute thermal stresses, expansion, deflection due to temp. etc. Design insulation thickness Chip temperature calculation Heat treatment of metals

Unidirectional heat conduction (1D)

Unidirectional heat conduction (1D)

First Law (energy balance) (Ein- E )+E . = Est
out gen

-+ + A q=

Unidirectional heat conduction (1D)(contd

Unidirectional heat conduction (1D)(contd

For T to rise, LHS must be positive (heat input is positive) For a fixed heat input, T rises faster for higher In this special case, heat flow is 1D. If sides were not insulated, heat flow could be 2D, 3D.

Boundary and Initial conditions

The objective of deriving the heat diffusion equation is to determine the temperature distribution within the conducting body. We have set up a differential equation, with T as the dependent variable. The solution will give us T(x,y,z). Solution depends on boundary conditions (BC) and initial conditions (IC).

Boundary and Initial conditions (contd)

How many BCs and ICs ?
Heat equation is second order in spatial coordinate. Hence, 2 BCs needed for each coordinate.
1D problem: 2 BC in xdirection 2D problem: 2 BC in xdirection, 2 in ydirection 3D problem: 2 in xdir., 2 in ydir., and 2 in zdir.

Heat equation is first order in time. Hence one IC needed

1Dimensional Heat Conduction

Thermal resistance (electrical analogy)

Thermal Analogy to Ohms Law

1 D Heat Conduction through a Plane Wall

Resistance expressions

Composite Walls

Overall Heat transfer Coefficient

Series Parallel

1 D Conduction(Radial conduction in a composite cylinder)

Critical Insulation Thickness

Critical Insulation Thickness (contd)

Maximum Minimum problem

Critical Insulation Thickness (contd)

Minimum q at r 0 =(k/h)=r c r (critical radius)

I D CONDUCTION IN SPHERE

Conduction with Thermal Energy Generation

=

= Energy generation per unit volume

Conduction with Thermal Energy Generation

Conduction With Thermal Energy Generation (contd)

Conduction with Thermal Energy Generation (cont..)

Use boundary conditions to find C1 and C2

Cylinder with heat source

Cylinder With Heat Source

Summary of Electrical Analogy

SOME ANIMATIONS
Conduction Wall http://www.rpaulsingh.com/animated%20figures/ fig4_16.htm http://www.rpaulsingh.com/animated%20figures/ fig4_17.htm http://www.rpaulsingh.com/animated%20figures/ fig4_18.htm

UNIT-2 EXTENTED SURFACE (FINS)HEAT TRANSFER

EXTENDED SURFACES / FINS

Convection: Heat transfer between a solid surface and a moving fluid is governed by the Newtons cooling law: q = hA(Ts -T). Therefore, to increase the convective heat transfer, one can Increase the temperature difference (Ts -T) between the surface and the fluid. Increase the convection coefficient h. This can be accomplished by increasing the fluid flow over the surface since h is a function of the flow velocity and the higher the velocity, the higher the h. Example: a cooling fan. Increase the contact surface area A. Example: a heat sink with fins

Extended Surface Analysis

Extended Surface Analysis

A second-order, ordinary differential equation

Equation Define a new variable

so that

Characteristics equation with two real roots: +m & -mThe general solution is of the form To evaluate the two constants C1 and C2 we need to specify two boundary conditions: The first one is obvious: the base temperature is known as T(0)=Tb The second condition will depend on the end condition of the tip

Extended Surface Analysis

Temperature distribution for fins of different configurations

Example
An Aluminium pot is used to boil water as shown below. The handle of the pot is 20-cm long, 3-cm wide, and 0.5-cm thick. The pot is exposed to room air at 250C, and the convection coefficient is 5 W/m2 0C. Question: can you touch the handle when the water is boiling? (k for aluminum is 237 W/m 0C).

Example
We can model the pot handle as an extended surface. Assume that there is no heat transfer at the free end of the handle. The condition matches that specified in the fins Table, case B. Use the following data.

Example
Plot the temperature distribution along the pot handle

As shown in the figure, temperature drops off but not very steeply. This is because k of aluminium is fairly high. At the midpoint, T(0.1)=90.40C. At the end T(0.2)=87.30C. Therefore, it should not be safe to touch the end of the handle.The end condition is insulated, hence the gradient is zero.

Fin Design
Total heat loss: qf =Mtanh(mL) for an adiabatic fin, or qf =Mtanh(mLC ) if there is convective heat transfer at the tip

Use the thermal resistance concept

where Rt .f is the thermal resistance of the fin.For a fin with an adiabatic tip, the fin

Fin Effectiveness
How effective a fin can enhance heat transfer is characterized by the fin effectiveness (f Ratio of fin heat transfer and the heat transfer without the fin. For an adiabatic fin:
)

If the fin is long enough, mL>2, tanh(mL)1, it can be considered an infinite fin

Fin Effectiveness (contd...)

To increase f , the fins material should have higher thermal conductivity, k. It seems to be counterintuitive that the lower convection coefficient, h, the higher f . But it is not because if h is very high, it is not necessary to enhance heat transfer by adding heat fins. Therefore, heat fins are more effective if h is low. Observation: If fins are to be used on surfaces separating gas and liquid. Fins are usually placed on the gas side. (Why?)

Fin Effectiveness (contd...)

P/AC should be as high as possible. Use a square fin with a dimension of W by W as an example: P=4W, AC=W2, P/AC=(4/W). The smaller W, the higher the P/AC, and the higher f. Conclusion: It is preferred to use thin and closely spaced (to increase the total number) fins.

Fin Effectiveness (contd...)

Fin Efficiency

Fin Efficiency (contd)

Fin Efficiency (cont.)

Overall Fin Efficiency

Overall fin efficiency for an array of fins

Overall Fin Efficiency (contd)

Heat Transfer from a Fin Array

Thermal Resistance Concept

UNSTEADY STATE HEAT TRANSFER

UNSTEADY HEAT TRANSFER

Many heat transfer problems require the understanding of the complete time history of the temperature variation. For example, in metallurgy, the heat treating process can be controlled to directly affect the characteristics of the processed materials. Annealing (slow cool) can soften metals and improve ductility. On the other hand, quenching (rapid cool) can harden the strain boundary and increase strength. In order to characterize this transient behavior, the full unsteady equation is needed

UNSTEADY HEAT TRANSFER

Biot No. Bi
Defined to describe the relative resistance in a thermal circuit of
the convection compared.

Lc is a characteristic length of the body Bi0: No conduction resistance at all. The body is isothermal. Small Bi: Conduction resistance is less important. The body may still be approximated as isothermal Lumped capacitance analysis can be performed. Large Bi: Conduction resistance is significant. The body cannot be treated as isothermal.

Lumped Parameter Analysis

Lumped Parameter Analysis

To determine the temperature at a given time, or To determine the time required for the temperature to reach a specified value

Note: Temperature function only of time and not of space!

Lumped Parameter Analysis

Lumped Parameter Analysis

Define Fo as the Fourier number (dimensionless time)

The temperature variation can be expressed as

THANK YOU