9

2
0
-
0
6
1
B
Portability
Modularity
Color imaging
Data storage
ULTRASOUND, UT PHASED ARRAY, EDDY CURRENT, AND EC ARRAY
See it all!
Omni Scan

MX
2
OmniScan

is the newest family of modular

and portable test units from R/D Tech. This
family includes the innovative phased array
and eddy current array test units, as well as
the newly introduced eddy current and con-
ventional ultrasound modules, all designed
to meet the most demanding requirements
of NDT. The OmniScan offers a high acquisi-
tion rate and powerful software features in
a portable, modular mainframe to ef-
ciently perform manual and automated
inspections.
Rugged, Portable, and
Battery-Operated
The OmniScan

is built to work in the

harshest eld conditions. Its solid polycar-
bonate-based casing and rubber bumpers
make it a rugged instrument that can with-
stand drops and shocks.
The OmniScan is so compact and light-
weight (only 4.6 kg) that it can be carried
easily and handled anywhere inside or out-
side. The OmniScan will run 6 hours with its
two Li-ion batteries.
User Interface
The highly legible 8.4-inch real-time display
(60-Hz A-scan refresh rate) with a SVGA
resolution of 800 x 600 allows you to clearly
see defects and details under any light
conditions. A scroll knob and function keys
make it easy to browse through and select
functions. A mouse and a keyboard can also
be plugged in for users looking for a more
PC-like interface.
Modular Platform
The instrument is a modular platform that
allows you to switch among its different
test modules on location. The platform
detects the new module and the technol-
ogy supported so that the conguration
and test environment are set automatically.
OmniScan Connector
The OmniScan connector has a probe ID
feature that enables physical detection and
recognition of the probe connected to the
mainframe.
Sets the probe to an appropriate fre-
quency to prevent probe damage.
Sets C-scan resolution of ECA probes.
Loads the correct probe parameters.
Microphone
Scanner interface
Alarm and I/O
SVGA output
Alarm indicator LEDs
Up/down keys
Menu keys
Help key Parameter keys

UT module Eddy current
array module
Phased array
module
Adapters to connect to probes from other
manufacturers are available.
On/off switch
Function keys
Control area
Tilt stand
Protective bumpers
USB connectors
Keyboard
Mouse
Printer
Ethernet

and serial ports

Storage and Report
Setup storage compatible with Microsoft Win-
dows (exportable using a CompactFlash card)
Complete report setup including reading congura-
tion, which can be customized using HTML page
layout
On-screen interactive help that can be customized
for procedure-oriented setups using HTML script
templates
Setup preview
Connectivity, Data Storage, and Imaging
The OmniScan

offers alarm outputs as well as

the standard PC ports: USB, RS-232, SVGA out, and
Ethernet

. It offers internal data storage capability

and extended storage via a CF (CompactFlash) card
slot or USB device.
3
Typical Applications
Girth Weld Inspection
R/D Tech has developed a circumferential weld inspection system based
on the OmniScan PA for the oil and gas industry. This phased array
system is qualied to inspect tube with diameters ranging from 48 mm
to 1524 mm and thicknesses from 5 mm to 25 mm in compliance with
ASME Boiler and Pressure Vessel Code Section V. The semiautomated
system offers better inspection speed and detection, and makes the
interpretation of the indications signicantly easier.
Inspection of Tee-Joint Welds on Bridge Structures
Automated welding used to build multiple parts of bridge structures
can generate cracks in the upper part of the weld of thin stiffeners.
The OmniScan allows simultaneous scanning from 40 to 70 degrees.
Users can inspect the complete volume of the weld in a single pass.
Compared to conventional UT, this technique enables an inspector,
with a few hours of training, to operate at least ve times faster and
present more reliable results.
Landing Gear Inspection
The OmniScan allows the complete inspection of a critical section
of the landing gear: a cylinder possessing three different diameters
in the zone of interest. The inspection is done in a single pass with
40- to 65-degree shear wave refracted angles in the part. With this
system, any inspector can perform the inspection faster, and with
better reliability.
Aircraft Fuselage Inspection
The OmniScan ECA provides the ability to detect hidden corrosion
in multilayer structures and especially in lap joints independently of
lack of sealant. Currently, material loss of 10% of the lap splice thick-
ness can be detected in aluminum at a depth of 0.2 inch. Surface and
subsurface cracks can be detected in the skin, at the fastener, or at
the lap joint edges.
4
Ul t rasound I nspect i on
General view of TOFD setup for linear weld inspection showing lateral wave, backwall
echo, and diffracted signals on the A-scan.
I
n
d
e
x

a
x
i
s
Scan axis
45
Transmitter Receive
Lower tip
Upper tip
Lateral waves
Backwall reflection
Backwall (+) Lower tip (+) Upper tip (+) Lateral waves (+)
Backwall reflection
0-Degree Testing
(Immersion, Corrosion, Composite)
The 0-degree testing measures time-of-
ight and amplitude of ultrasonic echoes
reecting from the part into gates to detect
and measure defect s.
C-scan imaging
Full A-scan recording with C-scan post-
processing
Angle Beam Testing
Angle beam testing enables the detection
of vertical or thin defects that 0-degree
inspection might miss because of poor
sound reection. Angle beam testing uses
an angled wedge to create the desired
angle.
True depth conguration
Flaw sizing using tip diffraction technique
Raster scans (A, B, C, and D scans)
Built-in FFT for probe characterization
Time-of-Flight Diffraction (TOFD)
Testing
TOFD is a technique that uses two probes
in pitch-and-catch mode. TOFD detects and
records signals diffracted from defect tips
for both detection and sizing. The TOFD
data is displayed in a grayscale B-scan.
TOFD offers wide coverage and ampli-
tude-independent sizing compliant with
ASME-2235 code.
One-line scan for full-volume inspection
Setup independent of weld conguration
Very sensitive to all kinds of defects and
insensitive to defect orientation
Ultrasound Transducers
R/D Tech offers thousands of transducers in
standard frequencies, element diameters,
and connector styles.
Contact and immersion transducers
Dual transducers
Angle beam transducers and wedges
Replaceable delay line transducers
Protected-face transducers
Normal incidence shear wave transducers
TOFD Caliper
The TOFD caliper is small, lightweight, easily portable, and simple to use on a
variety of different inspections. The probe distances are easily adjusted, and
angles can be set to 45, 60, and 70. The TOFD caliper opens up new possi-
bilities for fast manual inspection with permanent record of the results.
5
Ul t rasound Sof t ware
Full-Featured C-Scan
Monitoring of amplitude, peak position, crossing level
position, and thickness on each gate
Automatic gate synchronizes from previous gate for
higher dynamic range of thickness.
A-scan data storage and C-scan postprocessing capa-
bilities
Optional IF gate for surface following synchronization
or measurement gate or TCG/DAC curves
Either positive or negative gate on RF signal (indepen-
dent for each gate)
Three alarms completely congurable on single gate
events or multiple gate events, lter for n occurrences
from one or multiple channels
Customizable color palette for amplitude and thick-
ness C-scan
2-axis mechanical encoder with data acquisition syn-
chronization on mechanical movement
Optional data library to access A-scan and/or C-scan
on PC for custom processing
60 Hz A-scan refresh rate with overlays of envelope
and peak inside the gate
Angle Beam Transducer for Weld Inspection
Trigonometric aw location with curvature correction
for angle beam transducer
Optional DAC and TCG curves for compensation of
material attenuation as well as beam spread
Assisted calibration for probe delay and sound veloc-
ity, as well as TCG and mechanical encoder
Support of pulse-echo, dual, or through-transmission
modes
Visual skip indicator for easy location of the defect
Full-Featured A-Scan
Color-selectable A-scan display
Reject mode
Hollow mode
Peak/hold mode (always keep the signal that shows
the maximum amplitude in gate A)
Gate threshold level crossing (changes the color of the
curve that is over the gate level)

TOFD
A B-scan encoded data imaging and storage
Adjustable for brightness and contrast grayscale color
palette
100 MHz A-scan digitizing
TOFD calibration wizard online and ofine
Hyperbolic cursor and reading for TOFD sizing
Lateral wave resynchronization
Indoor/outdoor color schemes for improved readability in all condi-
tions.
10
Acquisition
Unit
Phased Array
Unit
Probes
Pulses
Incident wave front
Reflected wave front
Trigger
Acquisition
Unit
Phased Array
Unit
Flaw
Flaw
Echo signals
Emitting
Receiving
3
4
5
2 7
1
6
Phased Array Probes
R/D Techs standard phased array trans-
ducers are divided in four types:
Angle beam transducers with external
wedges (1) (2)
Angle beam transducers with internal
wedges (3)
Contact transducers (4)
Immersion transducers (5)
Water boxes for immersion transducers
are also available (6), as are numerous
accessories, such as encoders (7).
Phased Array Technology
Phased array technology generates an
ultrasonic beam with the capability of
setting beam parameters such as angle,
focal distance, and focal point size through
software. Furthermore, this beam can be
multiplexed over a large array. These capa-
bilities open a series of new possibilities.
For instance, it is possible to quickly vary
the angle of the beam to scan a part with-
out moving the probe itself. Phased arrays
also allow the replacement of multiple
probes and even mechanical components.
Inspecting a part with a variable-angle
beam also maximizes detection regardless
of the defect orientation, while optimizing
signal-to-noise ratio.
Benets of Phased Arrays
Phased array technology offers the follow-
ing capabilities:
Software control of beam angle, focal
distance, and spot size
Multiple-angle inspection with a
single, small, electronically controlled,
multielement probe
Greater exibility for the inspection of
complex geometry
High-speed scans with no moving parts
Phased Ar ray I nspect i on
The use of phased array probes can
eliminate one axis of a two-axis scan.
Scanning direction
Active group
128 1
16
11 angles
Wedge and
phased array
probe
Multiple-angle inspection with one
multielement probe.
Greater exibility for the inspection of complex
geometry.
High-speed scans with no moving parts.
Compared to a wide, single-element trans-
ducer, phased array technology offers a
much higher sensitivity due to the use of a
small focused beam.
To generate a beam, the various probe elements are pulsed at slightly different
times. By precisely controlling the delays between the probe elements, beams of
various angles, focal distances, and focal spot sizes can be produced. The echo from
the desired focal point hits the various transducer elements with a computable time
shift. The signals received at each transducer element are time-shifted before being
summed together.
6
11
Full-Featured A-Scan
User-selectable A-scan color
Reject mode
Hollow and lled display mode
Fast 60 Hz refresh rate for analog-like display
Full-Featured B-Scan
Easy-to-interpret cross-sectional view of inspected
part
Excellent presentation for corrosion mapping of pipes,
boilers, and storage tanks
Allows the operator to visually verify acquired thick-
ness points as well as zoom in on areas with critically
thin thickness values.
Encoded TOFD capability for amplitude-independent
defect sizing
Full-Featured C-Scan
Adjustable 256-level color palette
Encoded C-scan storage and imaging capabilities
Dual gate amplitude and measurement C-scan
Built-in measurement and analysis tools
Full-Featured Sectorial Scan
Real-time volume-corrected representation
Higher than 20 Hz refresh rate (up to 40 Hz)
Advanced Real-Time Data Processing
Real-time data interpolation to improve spatial repre-
sentation of defects during acquisition of data
User-selectable high- and low-pass lters to enhance
A-scan and imaging quality
Projection feature allows the operator to view verti-
cally positioned A-scan simultaneously with sectorial
scan image.
PC-Based Analysis Software: TomoView

OmniScan

data is compatible with R/D Tech s

TomoView

PC-based software platform.

Ofine analysis A, B, C, D, and sectorial scans (S-scan)
Measurement utilities, zooming, and customizable
color palette
Compatible with advanced focal law calculator
A-scan display
B-scan display
Phased Ar ray Sof t ware
Data on OmniScan can
easily be downloaded to
TomoView.
C-scan display on OmniScan PA.
Sectorial scan display
Real-time data processing
7
Eddy Current I nspect i on
Probes used to perform eddy current inspections are made with a copper wire wound
to form a coil. The coil shape can vary to better suit specic applications.
a- The alternative current owing through the coil at a chosen frequency generates a
magnetic eld around the coil.
b- When the coil is placed close to an electrically conductive material, eddy current is
induced in the material.
c- If a aw in the conductive material disturbs the eddy current circulation, the
magnetic coupling with the probe is changed and a defect signal can be read by
measuring the coil impedance variation.
8
Eddy Current Technology
Eddy current (ECT) technology is a
noncontact method for the inspection of
metallic parts. In this technique, the probe,
which is excited with an alternative current,
induces eddy current in the part under
inspection. Any discontinuities or material
property variations that change the eddy
current ow in the part are detected by the
probe as a potential defect.
Over the years, probe technology and data
processing have continuously progressed
so that the eddy current technique is now
recognized to be fast, simple, and accurate.
This is why the technique is widely used in
the aerospace, automotive, petrochemical,
and power generation industries for the
detection of surface or near-surface defects
in material such as aluminum, stainless
steel, copper, titanium, brass, Inconel, and
even carbon steel (surface defect only).
Benets of Eddy Current
Eddy current offers the following capabilities:
Quick, simple, and reliable inspection tech-
nique to detect surface and near-surface
defects on conductive material
Can be used to measure material electri-
cal conductivity.
Measurement of nonconductive coating
Hole inspection with the use of high-
speed rotating scanner and surface probe
Eddy Current Probes
R/D Techs standard eddy current probes are
available in different congurations:
Bolt hole probes
Surface probes, in various shapes and
congurations
Low-frequency Spot and Ring type probes
Sliding probes
Wheel probes
Conductivity probes
Speciality probes made for specic appli-
cations
Reference standards with EDM notches can
be manufactured according to the applica-
tion specications.
Surface preparation is minimal. Unlike liquid penetrant or magnetic particle inspec-
tion, it is unnecessary to remove the paint from the surface to inspect the parts.
Eddy Current Sof t ware
9
Impedance Plane and Strip Chart Display
User-selectable screen persistency
Two-frequency operation and automatic mixing capa-
bility
Reference signal overlay can be kept on the screen for
easier signal interpretation.
Freeze mode allows signal rotation and gain adjust-
ment without having to hold the probe on the part.
Zoom and Best Fit functions
Conductivity and Thickness Measurement
Mode
Simple step-by-step calibration procedure
Material conductivity or coating thickness are dis-
played with very large numerals.
Impedance plane display for signal representation
during measurement
Instruction window guides the operator during the
measurement process.
Adjustable threshold represents the measurement
values in blue, green, or red.
Measurements can be stored in a tabular report.
Rotating Probe Operation
Impedance plane with synchronized sweep trace
displayed simultaneously
Adjustable impedance plane persistency to show one
or several probe rotations on the screen
Scrolling C-scan display to represent the inspected
area in a 2-D color map
High acquisition rate allows smooth signal represen-
tation and high-speed rotation.
Real-time data interpolation or compression to com-
pensate for rotation speed variation
Full data recording capability
Special median high-pass lter provides a stable trace.
C-Scan Surface Mapping
Support of two encoder inputs to connect various
scanners
Real-time C-scan mapping display with impedance
plane and strip chart view
Advanced Real-Time Data Processing
Three alarms can be dened with various shapes to
activate LED, buzzer, or TTL output.
High-pass, low-pass, and specialized lters
Alarm zone in impedance plane on OmniScan ECT.
Conductivity and thickness
measurement
Bolt hole inspection using
C-scan display or conven-
tional sweep mode
10
Eddy Current Array Technology
Eddy current array (ECA) technology allows
to electronically drive and read several eddy
current sensors positioned side-by-side in
the same probe assembly. Data acquisition
is made possible through the use of multi-
plexing, which avoids mutual inductance
between the individual sensors.
The OmniScan

ECA test conguration

supports 32 sensor coils (up to 64 with an
external multiplexer) working in bridge
or transmit-receive mode. The operating
frequency ranges from 20 Hz to 6 MHz with
the option of using multiple frequencies in
the same acquisition.
Benets of Eddy Current Arrays
Compared to single-channel eddy current
technology, eddy current array technology
provides the following benets:
Drastically reduces inspection time.
Covers a large area in one single pass.
Reduces the complexity of mechanical
and robotic scanning systems.
Provides real-time cartography of the
inspected region, facilitating data inter-
pretation.
Is well suited for complex part geom-
etries.
Improves reliability and probability of
detection (POD).
Eddy Current Array Probes
R/D Tech manufactures ECA probes for a
wide range of applications. Probes can be
designed to detect a specic type of aw or
to follow the shape of the part to inspect.
Standard designs are available to detect
defects such as cracks and pitting, and
subsurface defects like cracks in multilayer
structures as well as corrosion.
Single coil =
raster scan
Multiple coils =
one-line scan
Eddy Current Array I nspect i on
Eddy current array probes can replace one axis of a two-axis scan and offer greater
exibility in the eddy current setup.
Transmit-receive probe for corrosion detection down to
6 mm (0.125 in.) in aluminum.
Probes can be made in different shapes and sizes to better follow the contour of the
part to inspect.
Multiplexing principle between elements.
Absolute probe for surface crack detection.
Transmit-receive probe for surface crack
detection shown with optional encoder.
11
Simple Acquisition and Analysis Displays
Data acquisition in a C-scan view for quick and ef-
cient defect detection
Data selection in analysis mode to review the signal in
the impedance plane and strip charts
Amplitude, phase, and position measurement
Adjustable color palette
Large impedance plane and strip chart views to
accommodate conventional single-channel ECT probe
inspection
Calibration Wizard
Step-by-step process
All the channels of a group are calibrated simultane-
ously, each channel having its own gain and rotation.
Amplitude and phase can be set on different reference
aws.
Alarms
Three alarm outputs can combine LED, buzzer, and TTL
output.
Various alarm zone shapes can be dened in the
impedance plane (sector, rectangular, ring, etc.).
Automatic Probe Detection and Conguration
C-scan parameters and multiplexing sequence are
automatically set when the probe is connected.
Frequency range protection to avoid probe damage
Subtraction Tools in Analysis Mode
This function can be used to remove the lift-off variation
that can be seen between adjacent channels.
Advanced Real-Time Data Processing
Real-time data interpolation to improve the spatial
representation of the defects
When working with two frequencies, a MIX signal can
be generated to remove unwanted signals (like lift-off,
fastener signals, etc.).
Several lters can be applied to the data such as high-
pass, low-pass, median, and averaging. The gures
above represent an application where the cracks are
located at the edge of a lap-joint, which has a sharp
thickness variation. The ltered data may improve
detection, especially for small cracks.
Acquisition display
Analysis display
Before interpolation
After interpolation
Without lter
With high-pass
digital ltering
Fastener inspection using two frequencies and dual C-scan display.
Eddy Current Array Sof t ware
Omniscan MX Specifications
Overall dimensions 321 mm x 209 mm x 125 mm (12.6 in. x 8.2
in. x 5 in.)
Weight 4.6 kg (10.1 lb) (including test module and
one battery)
Data storage
Storage devices CompactFlash card, most standard USB
storage device, or through fast Ethernet

Internal 32 MB DiskOnChip
Data le size 200 MB
I/O ports
USB ports 3
Speaker out Yes
Microphone input Yes
Video output Video out (SVGA)
Video input Video input (NTSC/PAL)
Ethernet

10/100 Mb/s
I/O lines
Encoder 2-axis encoder line (quadrature or clock/
direction)
Digital input 2 digital inputs TTL, 5 V
Digital output 4 digital outputs TTL, 5 V, 10 mA
Remote communication Remote communication RS-232 or RS485
Acquisition on/off switch Remote acquisition enable TTL, 5 V
Power output line 5 V, 500 mA power output line (short-
circuit-protected)
Alarms 3 TTL, 5 V, 10 mA
Analog output 2 analog outputs (12 bits) 5 V in 10 k
Pace input 5 V TTL pace input
Display
Display size 8.4 in. (diagonal)
Resolution 800 x 600 pixels
Number of colors 16 million
Type TFT LCD
Power supply
Battery type Smart Li-ion battery
Number of batteries 1 or 2 (battery chamber accommodates two
hot-swappable batteries)
Battery life Minimum 6 hours with two batteries;
minimum of 3 hours per battery in normal
operation conditions
DC-in voltage 15 V 18 V (min. 50 W)
Environmental specications
Operating temperature 0C to 45C
Storage temperature 20C to 70C
Relative humidity 095% non condensing. No air intake,
splashproof design.
Ultrasound Module Specications
Overall dimensions 244 mm x 182 mm x 57 mm
(9.6 in. x 7.1 in. x 2.1 in.)
Weight 1 kg (2.2 lb)
Connectors LEMO 00 (2)
Pulser/Receiver
Number of pulsers/receivers 2
Pulser
Pulse output 50 V, 100 V, 200 V 10% (variable pulse
width)
Pulse width Adjustable from 30 ns to 500 ns 10%,
resolution of 2.5 ns
Fall time Less than 10 ns
Pulse shape Negative square wave
Output impedance Less than 4
Receiver
Receiver gain range 0100 dB, by steps of 0.1 dB
Maximum input signal 14 V p-p (screen at 128%)
Minimum sensibility 140 V p-p (screen at 128%)
Noise referred to input 140 V p-p (23 V RMS) (128%)
Input impedance 50
Input lter
(100% bandwidth) Centered at 1 MHz (1.5 MHz), centered at 2
MHz (2.25 MHz), centered at 5 MHz (4 MHz),
centered at 10 MHz (12 MHz), centered at
15 MHz, 0.252.5 MHz, 1035 MHz 10%
HP, 225 MHz BB
Bandwidth of the system 0.2535 MHz (3 dB)
Rectier Both, positive, negative
Mode P-P, P-R, T-T (through-transmission),
maximum of 2 channels in P-P, maximum of
1 channel in P-R,
(ex.: P1P2)
Smoothing Digital
DAC
Number of points 16
DAC range Up to 40 dB
Maximum gain slope 20 dB/s
Data acquisition
A-scan acquisition rate 6000 A-scans/s (512-point A-scan)
Maximum pulsing rate 1 channel at 10 kHz (C-scan)
Data processing
Real-time averaging 2, 4, 8, 16
Gates
Quantity 3: I (synchro), A and B (measure)
Synchronization I, A, B referenced on main bang, A and B
referenced on gate I (post-synchronization)
Data storage
A-scan recording (TOFD) 6000 A-scans/s (512-point A-scan)
(3 MB/s transfer rate)
C-scan type data recording 20,000 (A1, A2, A3, T1, T2, T3) (3 gates)
10 kHz (lower frequency for corrosion
mapping)
Data visualization
Refresh rate 60 Hz
Data synchronization
On time 10 HZ10 kHz
External Yes
On encoder On 1 or 2 axes divided into 1 to 65,536 steps
Alarms
Number 3
Conditions Any logical combination of gates
Signal Amplitude or time of ight of gate A or B
Frequency Up to 10 kHz
13
Phased Array Module Specications
Overall dimensions 244 mm x 182 mm x 57 mm
(9.6 in. x 7.1 in. x 2.1 in.)
Weight 1.2 kg (2.6 lb)
Connectors 1 OmniScan connector for phased-array
probes
2 BNC connectors (1 pulser/receiver,
1 receiver for conventional UT)
Number of focal laws 256
Probe recognition Automatic probe recognition and setup
Pulser/Receiver
Aperture 16 elements
Number of elements 128 elements
Pulser
Voltage 80 V per element
Pulse width Adjustable from 30 ns to 500 ns,
resolution of 2.5 ns
Fall time Less than 10 ns
Pulse shape Negative square wave
Output impedance Less than 25
Receiver
Gain 074 dB maximum input signal
1.32 V p-p
Input impedance 75
System bandwidth 0.7518 MHz (3 dB)
Beam forming
Scan type Azimuthal and linear
Active elements 16
Elements 128
Delay range transmission 010 s in 2.5-ns increments
Delay range reception 010 s in 2.5-ns increments
Data acquisition
Digitizing frequency 100 MHz (10 bits)
Maximum pulsing rate Up to 20 kHz (C-scan)
Acquisition depth 59.8 meters in steel (L-wave), 10 ms
with compression. 0.49 meter in steel
(L-wave), 81.9 s without compression
Data processing
Number of data points Up to 8000
Real-time averaging 2, 4, 8, 16
Rectier RF, full wave, halfwave +, halfwave
Filtering Low-pass (adjusted to probe frequency),
digital ltering (bandwidth, frequency
range)
Video ltering Smoothing (adjusted to probe
frequency range)
Data storage
A-scan recording (TOFD) 5000 A-scans per second (512-point
8-bit A-scan)
C-scan type data recording I, A, B, up to 20 kHz (amplitude or TOF)
Maximum le size Limited by memory size
Data visualization
A-scan refresh rate Real-time: 60 Hz
Volume-corrected S-scan Up to 40 Hz
Data synchronization
On internal clock 1 Hz 20 kHz
External pace Yes
On encoder On 1 or 2 axes
Programmable time-corrected gain (TCG)
Number of points 16 (1 TCG curve per channel for focal
laws)
Alarms
Number of alarms 3
Conditions Any logical combination of gates
Analog outputs 2
Eddy Current Modules Specications
EC Array Eddy Current
Overall dimensions 244 mm x 182 mm x 57 mm
(9.6 in. x 7.1 in. x 2.1 in.)
Weight 1.2 kg (2.6 lb)
Connectors 1 OmniScan connector
for eddy current array
probes
N/A
1 19-pin Fischer eddy current probe connector
1 BNC connector
Number of channels 32 channels with
internal multiplexer
64 channels with
external multiplexer
4 channels
Probe recognition Automatic probe recognition and setup
Generator
Number of generators 1 (with internal electronic reference)
Maximum voltage 12 V p-p into 10
Operating frequency 20 Hz 6 MHz
Bandwidth 8 Hz 5 kHz (in single coil). Inversely
proportional to the time slot duration and set by
the instrument in multiplexed mode.
Receiver
Number of receivers 1 to 4
Maximum input signal 1 V p-p
Gain 2868 dB
Internal multiplexer
Number of generators 32 (4 simultaneously
on 8 time slots; up
to 64 with external
multiplexer)
N/A
Maximum voltage 12 V p-p into 50
Number of receivers 4 differential receivers
(8 time slots each)
Maximum input signal 1 V p-p
Data acquisition
Digitizing frequency 40 MHz
Acquisition rate 1 Hz 15 kHz (in single coil). The rate can
be limited by the instruments processing
capabilities or by delays set by the multiplexed
excitation mode.
A/D resolution 16 bits
Data processing
Phase rotation 0 to 360 with increments of 0.1
Filtering FIR low-pass, FIR high-pass, FIR band-pass, FIR
band-stop (adjustable cutoff frequency), median
lter (variable from 2 to 200 points), mean lter
(variable from 2 to 200 points)
Channel processing Mixing
Interpolation
Data storage
Maximum le size Limited by memory size
Data synchronization
On internal clock 1 Hz 15 kHz (single coil)
External pace Yes
On encoder On 1 or 2 axes
Alarms
Number of alarms 3
Alarm zone shape Pie, inverted pie, box, inverted box, and ring
Output type Visual, audio, and TTL signals
Analog outputs 1 (X or Y)
www.rd-tech.com
Head Ofce
Qubec, Canada
Tel.: (1) (418) 872-1155
Fax: (1) (418) 872-5431
USA
Waltham, MA
Tel.: (1) (781) 419-3900
Houston, TX
Tel.: (1) (281) 922-9300
France
Tel.: (33) (0) 1 39 13 82 36
United Kingdom
Tel.: (44) 1709 83 61 15
Germany
Tel.: (49) (0) 61 31 90 66 30
Japan
Tel.: (81) (0) 35 614 4330
China
Tel.: (86) (10) 6439 2069
R/D Tech has representatives in more than 40 countries. Consult the Web to see the complete list.
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R/D Tech and the R/D Tech logo are registered trademarks, and OmniScan, the OmniScan logo, and TomoView are trademarks of R/D Tech inc. in Canada, the United
States, and/or other countries. Bluetooth, CompactFlash, DiskOnChip, Ethernet, Fischer, Inconel, Microsoft, and Windows are trademarks and registered trademarks
of their respective owners.
Continuous Innovation
The OmniScan

is another milestone in the R/D Techs tradition for innovation.

Its modular concept propels the OmniScan ahead of all other NDT products. The OmniScan
platform allows our customers to build for the future by adding modules as the need arises.
Take part in the future of NDT now!
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