msp430g2231 Ep PDF

MSP430G2231-EP
www.ti.com SLAS862 JUNE 2012
MIXED SIGNAL MICROCONTROLLER

1
FEATURES
Low Supply-Voltage Range: 1.8 V to 3.6 V Ultra-Low Power Consumption Active Mode: 220 A at 1 MHz, 2.2 V Standby Mode: 0.5 A Off Mode (RAM Retention): 0.1 A Five Power-Saving Modes Ultra-Fast Wake-Up From Standby Mode in Less Than 1 s 16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time Basic Clock Module Configurations Internal Frequencies up to 16 MHz With One Calibrated Frequency Internal Very Low Power Low-Frequency (LF) Oscillator 32-kHz Crystal (1) External Digital Clock Source 16-Bit Timer_A With Two Capture/Compare Registers Universal Serial Interface (USI) Supporting SPI and I2C (See Table 1) Brownout Detector 10-Bit 200-ksps A/D Converter With Internal Reference, Sample-and-Hold, and Autoscan (See Table 1) Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse
Crystal oscillator cannot be operated beyond 105C
On-Chip Emulation Logic With Spy-Bi-Wire Interface For Family Members Details, See Table 1 and Available in a 14-Pin Plastic Small-Outline Thin Package (TSSOP) (PW) For Complete Module Descriptions, See the MSP430x2xx Family Users Guide (SLAU144)
SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS

Controlled Baseline One Assembly/Test Site One Fabrication Site Available in Extended (40C/125C) Temperature Range (2) Extended Product Life Cycle Extended Product-Change Notification Product Traceability
(1)
(2)
Custom temperature ranges available
DESCRIPTION
The MSP430G2231 is an ultra-low-power microcontroller consisting of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 s. The MSP430G2231 has a 10-bit A/D converter and built-in communication capability using synchronous protocols (SPI or I2C). For configuration details, see Table 1. Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2012, Texas Instruments Incorporated
MSP430G2231-EP
SLAS862 JUNE 2012 www.ti.com
Table 1. Available Options

Device MSP430G2231 BSL EEM 1 Flash (KB) 2 RAM (B) 128 Timer_A 1x TA2 USI 1 ADC10 Channel 8 Clock LF, DCO, VLO I/O 10 Package Type 14-TSSOP
Table 2. ORDERING INFORMATION (1)

TA 40C to 125C (1) PACKAGE TSSOP - PW ORDERABLE PART NUMBER MSP430G2231QPW1EP TOP-SIDE MARKING G2231EP VID NUMBER V62/12621-01XE
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.
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MSP430G2231-EP
Device Pinout
PW PACKAGE (TOP VIEW)
DVCC P1.0/TA0CLK/ACLK/A0
14
13 12
11 10
9
8
2 3
P1.1/TA0.0/A1 P1.2/TA0.1/A2 P1.3/ADC10CLK/A3/VREF-/VEREFP1.4/SMCLK/A4/VREF+/VEREF+/TCK P1.5/TA0.0/A5/SCLK/TMS
4 5
DVSS XIN/P2.6/TA0.1 XOUT/P2.7 TEST/SBWTCK RST/NMI/SBWTDIO P1.7/A7/SDI/SDA/TDO/TDI P1.6/TA0.1/A6/SDO/SCL/TDI/TCLK
NOTE: See port schematics in Application Information for detailed I/O information.
Functional Block Diagram

XIN XOUT DVCC DVSS P1.x 8 ACLK Clock System ADC SMCLK Flash 2kB 1kB RAM 128B 10-Bit 8 Ch. Autoscan 1 ch DMA Port P1 8 I/O Interrupt capability pull-up/down resistors Port P2 2 I/O Interrupt capability pull-up/down resistors P2.x 2
MCLK
16MHz CPU incl. 16 Registers
MAB
MDB
Emulation 2BP JTAG Interface Spy-Bi Wire RST/NMI Brownout Protection
USI Watchdog WDT+ 15-Bit Timer0_A2 2 CC Registers Universal Serial Interface SPI, I2C
MSP430G2231-EP
Table 3. Terminal Functions

TERMINAL NAME P1.0/ TA0CLK/ ACLK/ A0 P1.1/ TA0.0/ A1 P1.2/ TA0.1/ A2 P1.3/ ADC10CLK/ A3/ VREF-/VEREF P1.4/ SMCLK/ A4/ VREF+/VEREF+/ TCK P1.5/ TA0.0/ A5/ SCLK/ TMS P1.6/ TA0.1/ A6/ SDO/ SCL/ TDI/TCLK P1.7/ A7/ SDI/ SDA/ TDO/TDI (2) XIN/ P2.6/ TA0.1 XOUT/ P2.7 RST/ NMI/ SBWTDIO TEST/ SBWTCK DVCC DVSS QFN Pad (1) (2) (3) NO. 2 I/O General-purpose digital I/O pin Timer0_A, clock signal TACLK input ACLK signal output ADC10 analog input A0 (1) General-purpose digital I/O pin Timer0_A, capture: CCI0A input, compare: Out0 output ADC10 analog input A1 (1) General-purpose digital I/O pin Timer0_A, capture: CCI1A input, compare: Out1 output ADC10 analog input A2 (1) General-purpose digital I/O pin ADC10, conversion clock output (1) ADC10 analog input A3 (1) ADC10 negative reference voltage (1) General-purpose digital I/O pin SMCLK signal output ADC10 analog input A4 (1) ADC10 positive reference voltage (1) JTAG test clock, input terminal for device programming and test General-purpose digital I/O pin Timer0_A, compare: Out0 output ADC10 analog input A5 (1) USI: clock input in I2C mode; clock input/output in SPI mode JTAG test mode select, input terminal for device programming and test General-purpose digital I/O pin Timer0_A, capture: CCI1A input, compare: Out1 output ADC10 analog input A6 (1) USI: Data output in SPI mode USI: I2C clock in I2C mode JTAG test data input or test clock input during programming and test General-purpose digital I/O pin ADC10 analog input A7 (1) USI: Data input in SPI mode USI: I2C data in I2C mode JTAG test data output terminal or test data input during programming and test Input terminal of crystal oscillator General-purpose digital I/O pin Timer0_A, compare: Out1 output Output terminal of crystal oscillator (3) General-purpose digital I/O pin Reset Nonmaskable interrupt input Spy-Bi-Wire test data input/output during programming and test Selects test mode for JTAG pins on Port 1. The device protection fuse is connected to TEST. Spy-Bi-Wire test clock input during programming and test Supply voltage Ground reference QFN package pad connection to VSS recommended. DESCRIPTION
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
13 12 10 11 1 14 -
I/O I/O I I NA NA NA
MSP430G2x31 only TDO or TDI is selected via JTAG instruction. If XOUT/P2.7 is used as an input, excess current will flow until P2SEL.7 is cleared. This is due to the oscillator output driver connection to this pad after reset.
MSP430G2231-EP
SHORT-FORM DESCRIPTION CPU

The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instructions, are performed as register operations in conjunction with seven addressing modes for source operand and four addressing modes for destination operand. The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock. Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant generator, respectively. The remaining registers are general-purpose registers. Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all instructions. The instruction set consists of the original 51 instructions with three formats and seven address modes and additional instructions for the expanded address range. Each instruction can operate on word and byte data.
Program Counter Stack Pointer Status Register Constant Generator General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register General-Purpose Register PC/R0 SP/R1 SR/CG1/R2 CG2/R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15
Instruction Set
The instruction set consists of 51 instructions with three formats and seven address modes. Each instruction can operate on word and byte data. Table 4 shows examples of the three types of instruction formats; Table 5 shows the address modes.
Table 4. Instruction Word Formats

INSTRUCTION FORMAT Dual operands, source-destination Single operands, destination only Relative jump, un/conditional SYNTAX ADD R4,R5 CALL R8 JNE OPERATION R4 + R5 ---> R5 PC -->(TOS), R8--> PC Jump-on-equal bit = 0
Table 5. Address Mode Descriptions (1)

ADDRESS MODE Register Indexed Symbolic (PC relative) Absolute Indirect Indirect autoincrement Immediate (1) S = source, D = destination S D SYNTAX MOV Rs,Rd MOV X(Rn),Y(Rm) MOV EDE,TONI MOV &MEM,&TCDAT MOV @Rn,Y(Rm) MOV @Rn+,Rm MOV #X,TONI MOV @R10,Tab(R6) MOV @R10+,R11 MOV #45,TONI EXAMPLE MOV R10,R11 MOV 2(R5),6(R6) OPERATION R10 -- --> R11 M(2+R5) -- --> M(6+R6) M(EDE) -- --> M(TONI) M(MEM) -- --> M(TCDAT) M(R10) -- --> M(Tab+R6) M(R10) -- --> R11 R10 + 2-- --> R10 #45 -- --> M(TONI)
MSP430G2231-EP
Operating Modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt event can wake up the device from any of the low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program. The following six operating modes can be configured by software: Active mode (AM) All clocks are active Low-power mode 0 (LPM0) CPU is disabled ACLK and SMCLK remain active, MCLK is disabled Low-power mode 1 (LPM1) CPU is disabled ACLK and SMCLK remain active, MCLK is disabled DCO's dc generator is disabled if DCO not used in active mode Low-power mode 2 (LPM2) CPU is disabled MCLK and SMCLK are disabled DCO's dc generator remains enabled ACLK remains active Low-power mode 3 (LPM3) CPU is disabled MCLK and SMCLK are disabled DCO's dc generator is disabled ACLK remains active Low-power mode 4 (LPM4) CPU is disabled ACLK is disabled MCLK and SMCLK are disabled DCO's dc generator is disabled Crystal oscillator is stopped
MSP430G2231-EP
Interrupt Vector Addresses

The interrupt vectors and the power-up starting address are located in the address range 0FFFFh to 0FFC0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence. If the reset vector (located at address 0FFFEh) contains 0FFFFh (for example, flash is not programmed) the CPU goes into LPM4 immediately after power-up. Table 6. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE Power-Up External Reset Watchdog Timer+ Flash key violation PC out-of-range (1) NMI Oscillator fault Flash memory access violation INTERRUPT FLAG PORIFG RSTIFG WDTIFG KEYV (2) NMIIFG OFIFG ACCVIFG (2) (3) SYSTEM INTERRUPT WORD ADDRESS PRIORITY
Reset
0FFFEh
31, highest
(non)-maskable (non)-maskable (non)-maskable
0FFFCh 0FFFAh 0FFF8h 0FFF6h
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 to 0, lowest
Watchdog Timer+ Timer_A2 Timer_A2
WDTIFG TACCR0 CCIFG

(4)
maskable maskable maskable
0FFF4h 0FFF2h 0FFF0h 0FFEEh 0FFECh
TACCR1 CCIFG, TAIFG (2) (4)
ADC10 USI I/O Port P2 (two flags) I/O Port P1 (eight flags)
ADC10IFG
(4)
maskable maskable maskable maskable
0FFEAh 0FFE8h 0FFE6h 0FFE4h 0FFE2h 0FFE0h
USIIFG, USISTTIFG (2) (4) P2IFG.6 to P2IFG.7 (2) (4) P1IFG.0 to P1IFG.7
(2) (4)
See (1) (2) (3) (4) (5)
(5)
0FFDEh to 0FFC0h
A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h to 01FFh) or from within unused address ranges. Multiple source flags (non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot. Interrupt flags are located in the module. The interrupt vectors at addresses 0FFDEh to 0FFC0h are not used in this device and can be used for regular program code if necessary.
MSP430G2231-EP
Special Function Registers (SFRs)

Most interrupt and module enable bits are collected into the lowest address space. Special function register bits not allocated to a functional purpose are not physically present in the device. Simple software access is provided with this arrangement.
Legend rw: rw-0,1: rw-(0,1): Bit can be read and written. Bit can be read and written. It is reset or set by PUC. Bit can be read and written. It is reset or set by POR. SFR bit is not present in device.
Table 7. Interrupt Enable Register 1 and 2

Address 00h 7 6 5 ACCVIE rw-0 WDTIE OFIE NMIIE ACCVIE Address 01h 4 NMIIE rw-0 3 2 1 OFIE rw-0 0 WDTIE rw-0
Watchdog Timer interrupt enable. Inactive if watchdog mode is selected. Active if Watchdog Timer is configured in interval timer mode. Oscillator fault interrupt enable (Non)maskable interrupt enable Flash access violation interrupt enable 7 6 5 4 3 2 1 0
Table 8. Interrupt Flag Register 1 and 2

Address 02h 7 6 5 4 NMIIFG rw-0 WDTIFG OFIFG PORIFG RSTIFG NMIIFG Address 03h 3 RSTIFG rw-(0) 2 PORIFG rw-(1) 1 OFIFG rw-1 0 WDTIFG rw-(0)
Set on watchdog timer overflow (in watchdog mode) or security key violation. Reset on VCC power-on or a reset condition at the RST/NMI pin in reset mode. Flag set on oscillator fault. Power-On Reset interrupt flag. Set on VCC power-up. External reset interrupt flag. Set on a reset condition at RST/NMI pin in reset mode. Reset on VCC power-up. Set via RST/NMI pin 7 6 5 4 3 2 1 0
MSP430G2231-EP
Memory Organization
Table 9. Memory Organization
MSP430G2231 Memory Main: interrupt vector Main: code memory Information memory RAM Peripherals Size Flash Flash Size Flash Size 16-bit 8-bit 8-bit SFR 2kB 0xFFFF to 0xFFC0 0xFFFF to 0xF800 256 Byte 010FFh to 01000h 128B 027Fh to 0200h 01FFh to 0100h 0FFh to 010h 0Fh to 00h
Flash Memory
The flash memory can be programmed via the Spy-Bi-Wire/JTAG port or in-system by the CPU. The CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include: Flash memory has n segments of main memory and four segments of information memory (A to D) of 64 bytes each. Each segment in main memory is 512 bytes in size. Segments 0 to n may be erased in one step, or each segment may be individually erased. Segments A to D can be erased individually or as a group with segments 0 to n. Segments A to D are also called information memory. Segment A contains calibration data. After reset segment A is protected against programming and erasing. It can be unlocked but care should be taken not to erase this segment if the device-specific calibration data is required.
MSP430G2231-EP
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all instructions. For complete module descriptions, see the MSP430x2xx Family User's Guide (SLAU144). Oscillator and System Clock The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal oscillator, an internal very-low-power low-frequency oscillator and an internal digitally controlled oscillator (DCO). The basic clock module is designed to meet the requirements of both low system cost and low power consumption. The internal DCO provides a fast turn-on clock source and stabilizes in less than 1s. The basic clock module provides the following clock signals: Auxiliary clock (ACLK), sourced either from a 32768-Hz watch crystal or the internal LF oscillator. Main clock (MCLK), the system clock used by the CPU. Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules. Table 10. DCO Calibration Data (Provided From Factory In Flash Information Memory Segment A)
DCO FREQUENCY 1 MHz CALIBRATION REGISTER CALBC1_1MHZ CALDCO_1MHZ SIZE byte byte ADDRESS 010FFh 010FEh
Brownout The brownout circuit is implemented to provide the proper internal reset signal to the device during power on and power off. Digital I/O There is one 8-bit I/O port implementedport P1and two bits of I/O port P2: All individual I/O bits are independently programmable. Any combination of input, output, and interrupt condition is possible. Edge-selectable interrupt input capability for all the eight bits of port P1 and the two bits of port P2. Read/write access to port-control registers is supported by all instructions. Each I/O has an individually programmable pull-up/pull-down resistor. WDT+ Watchdog Timer The primary function of the watchdog timer (WDT+) module is to perform a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the module can be disabled or configured as an interval timer and can generate interrupts at selected time intervals.
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MSP430G2231-EP
Timer_A2 Timer_A2 is a 16-bit timer/counter with two capture/compare registers. Timer_A2 can support multiple capture/compares, PWM outputs, and interval timing. Timer_A2 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 11. Timer_A2 Signal Connections Device With ADC10
INPUT PIN NUMBER 2 - P1.0 DEVICE INPUT SIGNAL TACLK ACLK SMCLK 2 - P1.0 3 - P1.1 TACLK TA0 ACLK (internal) VSS VCC 4 - P1.2 8 - P1.6 TA1 TA1 VSS VCC MODULE INPUT NAME TACLK ACLK SMCLK INCLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCR1 TA1 4 - P1.2 8 - P1.6 13 - P2.6 CCR0 TA0 3 - P1.1 7 - P1.5 Timer NA MODULE BLOCK MODULE OUTPUT SIGNAL OUTPUT PIN NUMBER
USI The universal serial interface (USI) module is used for serial data communication and provides the basic hardware for synchronous communication protocols like SPI and I2C. ADC10 (MSP430G2x31 only) The ADC10 module supports fast, 10-bit analog-to-digital conversions. The module implements a 10-bit SAR core, sample select control, reference generator and data transfer controller, or DTC, for automatic conversion result handling, allowing ADC samples to be converted and stored without any CPU intervention.
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MSP430G2231-EP
Peripheral File Map Table 12. Peripherals With Word Access

MODULE ADC10 REGISTER DESCRIPTION ADC data transfer start address ADC control 0 ADC control 1 ADC memory Timer_A Capture/compare register Capture/compare register Timer_A register Capture/compare control Capture/compare control Timer_A control Timer_A interrupt vector Flash Memory Flash control 3 Flash control 2 Flash control 1 Watchdog Timer+ Watchdog/timer control REGISTER NAME ADC10SA ADC10CTL0 ADC10CTL0 ADC10MEM TACCR1 TACCR0 TAR TACCTL1 TACCTL0 TACTL TAIV FCTL3 FCTL2 FCTL1 WDTCTL OFFSET 1BCh 01B0h 01B2h 01B4h 0174h 0172h 0170h 0164h 0162h 0160h 012Eh 012Ch 012Ah 0128h 0120h
Table 13. Peripherals With Byte Access

MODULE ADC10 REGISTER DESCRIPTION ADC analog enable ADC data transfer control 1 ADC data transfer control 0 USI USI control 0 USI control 1 USI clock control USI bit counter USI shift register Basic Clock System+ Basic clock system control 3 Basic clock system control 2 Basic clock system control 1 DCO clock frequency control Port P2 Port P2 resistor enable Port P2 selection Port P2 interrupt enable Port P2 interrupt edge select Port P2 interrupt flag Port P2 direction Port P2 output Port P2 input REGISTER NAME ADC10AE0 ADC10DTC1 ADC10DTC0 USICTL0 USICTL1 USICKCTL USICNT USISR BCSCTL3 BCSCTL2 BCSCTL1 DCOCTL P2REN P2SEL P2IE P2IES P2IFG P2DIR P2OUT P2IN OFFSET 04Ah 049h 048h 078h 079h 07Ah 07Bh 07Ch 053h 058h 057h 056h 02Fh 02Eh 02Dh 02Ch 02Bh 02Ah 029h 028h
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MSP430G2231-EP
Table 13. Peripherals With Byte Access (continued)

MODULE Port P1 REGISTER DESCRIPTION Port P1 resistor enable Port P1 selection Port P1 interrupt enable Port P1 interrupt edge select Port P1 interrupt flag Port P1 direction Port P1 output Port P1 input Special Function SFR interrupt flag 2 SFR interrupt flag 1 SFR interrupt enable 2 SFR interrupt enable 1 REGISTER NAME P1REN P1SEL P1IE P1IES P1IFG P1DIR P1OUT P1IN IFG2 IFG1 IE2 IE1 OFFSET 027h 026h 025h 024h 023h 022h 021h 020h 003h 002h 001h 000h
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MSP430G2231-EP
Absolute Maximum Ratings (1)

Voltage applied at VCC to VSS Voltage applied to any pin (2) Diode current at any device pin Storage temperature range, Tstg (1) (2) (3)
(3)
0.3 V to 4.1 V 0.3 V to VCC + 0.3 V 2 mA Unprogrammed device Programmed device 55C to 150C 55C to 150C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse. Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions

MIN VCC VSS TA Supply voltage Supply voltage Operating free-air temperature VCC = 1.8 V, Duty cycle = 50% 10% fSYSTEM Processor frequency (maximum MCLK frequency) (1) (2) VCC = 2.7 V, Duty cycle = 50% 10% VCC = 3.3 V, Duty cycle = 50% 10% (1) (2) 40 dc dc dc During program execution During flash programming 1.8 2.2 0 125 6 12 16 MHz NOM MAX 3.6 3.6 UNIT V V C
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency. Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
Legend : 16 MHz
System Frequency - MHz
Supply voltage range , during flash memory programming 12 MHz Supply voltage range , during program execution 6 MHz
1.8 V
2.7 V 2.2 V Supply Voltage - V
3.3 V 3.6 V
Note:
Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC of 2.2 V.
Figure 1. Safe Operating Area
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MSP430G2231-EP
A. B. C.
See data sheet for absolute maximum and minimum recommended operating conditions. Silicon operating life design goal is 10 years at 110C junction temperature (does not include package interconnect life). The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the dominant failure mechanism affecting device wearout for the specific device process and design characteristics.
Figure 2. Operating Life Derating Chart
THERMAL INFORMATION
MSP430G2231 THERMAL METRIC (1) JA JCtop JB JT JB JCbot (1) (2) (3) (4) (5) (6) (7) Junction-to-ambient thermal resistance (2) Junction-to-case (top) thermal resistance (3) Junction-to-board thermal resistance
(4)
PW 14 PINS 102.5 31.4 45.0 1.8 44.4 N/A
UNITS
Junction-to-top characterization parameter (5) Junction-to-board characterization parameter (6) Junction-to-case (bottom) thermal resistance
(7)
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, JT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining JA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining JA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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MSP430G2231-EP
Electrical Characteristics Active Mode Supply Current Into VCC Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS fDCO = fMCLK = fSMCLK = 1 MHz, fACLK = 32768 Hz, Program executes in flash, BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0 VCC 2.2 V MIN TYP 220 A MAX UNIT
IAM,1MHz
Active mode (AM) current (1 MHz)
3V
300
390
(1)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
Typical Characteristics Active Mode Supply Current (Into VCC)

5.0 4.0
4.0 Active Mode Current mA
f DCO = 16 MHz Active Mode Current mA 3.0
TA = 85 C TA = 25 C
3.0 f DCO = 12 MHz 2.0
2.0
VCC = 3 V TA = 85 C TA = 25 C
1.0
f DCO = 8 MHz f DCO = 1 MHz
1.0 VCC = 2.2 V 0.0 0.0
0.0 1.5
2.0
2.5
3.0
3.5
4.0
4.0
8.0
12.0
16.0
VCC Supply Voltage V
f DCO DCO Frequency MHz
Figure 3. Active Mode Current vs VCC, TA = 25C
Figure 4. Active Mode Current vs DCO Frequency
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MSP430G2231-EP
Low-Power Mode Supply Currents (Into VCC) Excluding External Current

PARAMETER TEST CONDITIONS fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz, fACLK = 32768 Hz, BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 fMCLK = fSMCLK = 0 MHz, fDCO = 1 MHz, fACLK = 32768 Hz, BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 fDCO = fMCLK = fSMCLK = 0 MHz, fACLK from internal LF oscillator (VLO), CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 0 Hz, CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 TA VCC MIN TYP MAX UNIT
ILPM0,1MHz
Low-power mode 0 (LPM0) current (2)
25C
2.2 V
65
25C 2.2 V
22 A
ILPM2
125C
46
25C 125C 25C 125C 25C 85C 125C 2.2 V 2.2 V 2.2 V
0.7 3 0.5 2 0.1 0.8 2
1.5 21 0.7 9.3 0.5 1.5 7.1 A A A
ILPM3,LFXT1
ILPM3,VLO
Low-power mode 3 current, (LPM3) (3)
ILPM4
(1) (2) (3) (4)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. Current for brownout and WDT clocked by SMCLK included. Current for brownout and WDT clocked by ACLK included. Current for brownout included.
Typical Characteristics Low-Power Mode Supply Currents

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
3.00 2.75
2.50
ILPM3 Low-Power Mode Current A
2.50 2.25 2.00 1.75 1.50 1.25 Vcc = 3 V 1.00 0.75 0.50 0.25 0.00 -40 -20 0 20 40 Vcc = 1.8 V Vcc = 2.2 V Vcc = 3.6 V
ILPM4 Low-Power Mode Current A
2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -40 Vcc = 1.8 V -20 0 20 40 60 80 Vcc = 3.6 V Vcc = 3 V Vcc = 2.2 V
60
80
TA Temperature C
TA Temperature C
Figure 5. LPM3 Current vs Temperature
Figure 6. LPM4 Current vs Temperature
17
MSP430G2231-EP
Schmitt-Trigger Inputs Ports Px

over recommended ranges of supply voltage and up to operating free-air temperature, TA = 105C (unless otherwise noted)
PARAMETER VIT+ VIT Vhys RPull CI Positive-going input threshold voltage Negative-going input threshold voltage Input voltage hysteresis (VIT+ VIT) Pullup/pulldown resistor Input capacitance For pullup: VIN = VSS For pulldown: VIN = VCC VIN = VSS or VCC TEST CONDITIONS VCC 3V 3V 3V 3V MIN 0.45 VCC 1.35 0.25 VCC 0.75 0.3 20 35 5 TYP MAX 0.75 VCC 2.25 0.55 VCC 1.65 1 50 UNIT V V V k pF
Leakage Current Ports Px

PARAMETER Ilkg(Px.y) (1) (2) High-impedance leakage current (1) (2) TEST CONDITIONS TA = -40C to 105C TA = 125C VCC 3V 3V MIN MAX 50 120 UNIT nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted. The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is disabled.
Outputs Ports Px
PARAMETER VOH VOL (1) High-level output voltage Low-level output voltage TEST CONDITIONS I(OHmax) = 6 mA (1) I(OLmax) = 6 mA
(1)
VCC 3V 3V
MIN
TYP VCC 0.3 VSS + 0.3
MAX
UNIT V V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 48 mA to hold the maximum voltage drop specified.
Output Frequency Ports Px

PARAMETER fPx.y fPort_CLK (1) (2) Port output frequency (with load) Clock output frequency TEST CONDITIONS Px.y, CL = 20 pF, RL = 1 k Px.y, CL = 20 pF (2)
(1) (2)
VCC 3V 3V
MIN
TYP 12 16
MAX
UNIT MHz MHz
A resistive divider with 2 0.5 k between VCC and VSS is used as load. The output is connected to the center tap of the divider. The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
18
MSP430G2231-EP
Typical Characteristics Outputs

TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE
30 I OL Typical Low-Level Output Current mA I OL Typical Low-Level Output Current mA VCC = 2.2 V P1.7 25 TA = 85C TA = 25C 50 VCC = 3 V P1.7 40 TA = 85C 30 TA = 25C
TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE
20
15
20
10
10
0 0 0.5 1 1.5 2 2.5 VOL Low-Level Output Voltage V
0 0 0.5 1 1.5 2 2.5 3 3.5 VOL Low-Level Output Voltage V
Figure 7. TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE

0 I OH Typical High-Level Output Current mA I OH Typical High-Level Output Current mA VCC = 2.2 V P1.7 5 0 VCC = 3 V P1.7 10
Figure 8. TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE
10
20
15 TA = 85C 20
30 TA = 85C 40 TA = 25C 50 0 0.5 1 1.5 2 2.5 3 3.5
25 0
TA = 25C 0.5 1 1.5 2 2.5 VOH High-Level Output Voltage V
VOH High-Level Output Voltage V
Figure 9.
Figure 10.
19
MSP430G2231-EP
POR/Brownout Reset (BOR) (1)

PARAMETER VCC(start) V(B_IT) Vhys(B_IT) td(BOR) t(reset) (1) See Figure 11 See Figure 11 through Figure 13 See Figure 11 See Figure 11 Pulse length needed at RST/NMI pin to accepted reset internally 2.2 V/3 V 2 TEST CONDITIONS dVCC/dt 3 V/s dVCC/dt 3 V/s dVCC/dt 3 V/s VCC MIN TYP 1.35 130 2000 MAX UNIT V V mV s s 0.7 V(B_IT)
The current consumption of the brownout module is already included in the ICC current consumption data. The voltage level V(B_IT) + Vhys(B_IT)is 1.8 V.
VCC Vhys(B_IT) V(B_IT) VCC(start)
0 t d(BOR)
Figure 11. POR/Brownout Reset (BOR) vs Supply Voltage
20
MSP430G2231-EP
Typical Characteristics POR/Brownout Reset (BOR)

2 VCC = 3 V Typical Conditions VCC(drop) V 1.5 1 0.5 0 0.001 VCC(drop) VCC 3V t pw
1 t pw Pulse Width s
1000 1 ns 1 ns t pw Pulse Width s
Figure 12. VCC(drop) Level With a Square Voltage Drop to Generate a POR/Brownout Signal
VCC 2 VCC = 3 V VCC(drop) V 1.5 1 VCC(drop) 0.5 0 0.001 t f = tr 1 t pw Pulse Width s 1000 tf tr Typical Conditions 3V t pw
t pw Pulse Width s
Figure 13. VCC(drop) Level With a Triangle Voltage Drop to Generate a POR/Brownout Signal
21
MSP430G2231-EP
Main DCO Characteristics

All ranges selected by RSELx overlap with RSELx + 1: RSELx = 0 overlaps RSELx = 1, ... RSELx = 14 overlaps RSELx = 15. DCO control bits DCOx have a step size as defined by parameter SDCO. Modulation control bits MODx select how often fDCO(RSEL,DCO+1) is used within the period of 32 DCOCLK cycles. The frequency fDCO(RSEL,DCO) is used for the remaining cycles. The frequency is an average equal to:
faverage = 32 fDCO(RSEL,DCO) fDCO(RSEL,DCO+1) MOD fDCO(RSEL,DCO) + (32 MOD) fDCO(RSEL,DCO+1)
DCO Frequency
PARAMETER RSELx < 14 VCC fDCO(0,0) fDCO(0,3) fDCO(1,3) fDCO(2,3) fDCO(3,3) fDCO(4,3) fDCO(5,3) fDCO(6,3) fDCO(7,3) fDCO(8,3) fDCO(9,3) fDCO(10,3) fDCO(11,3) fDCO(12,3) fDCO(13,3) fDCO(14,3) fDCO(15,3) fDCO(15,7) SRSEL SDCO Duty cycle Supply voltage DCO frequency (0, 0) DCO frequency (0, 3) DCO frequency (1, 3) DCO frequency (2, 3) DCO frequency (3, 3) DCO frequency (4, 3) DCO frequency (5, 3) DCO frequency (6, 3) DCO frequency (7, 3) DCO frequency (8, 3) DCO frequency (9, 3) DCO frequency (10, 3) DCO frequency (11, 3) DCO frequency (12, 3) DCO frequency (13, 3) DCO frequency (14, 3) DCO frequency (15, 3) DCO frequency (15, 7) Frequency step between range RSEL and RSEL+1 Frequency step between tap DCO and DCO+1 RSELx = 14 RSELx = 15 RSELx = 0, DCOx = 0, MODx = 0 RSELx = 0, DCOx = 3, MODx = 0 RSELx = 1, DCOx = 3, MODx = 0 RSELx = 2, DCOx = 3, MODx = 0 RSELx = 3, DCOx = 3, MODx = 0 RSELx = 4, DCOx = 3, MODx = 0 RSELx = 5, DCOx = 3, MODx = 0 RSELx = 6, DCOx = 3, MODx = 0 RSELx = 7, DCOx = 3, MODx = 0 RSELx = 8, DCOx = 3, MODx = 0 RSELx = 9, DCOx = 3, MODx = 0 RSELx = 10, DCOx = 3, MODx = 0 RSELx = 11, DCOx = 3, MODx = 0 RSELx = 12, DCOx = 3, MODx = 0 RSELx = 13, DCOx = 3, MODx = 0 RSELx = 14, DCOx = 3, MODx = 0 RSELx = 15, DCOx = 3, MODx = 0 RSELx = 15, DCOx = 7, MODx = 0 SRSEL = fDCO(RSEL+1,DCO)/fDCO(RSEL,DCO) SDCO = fDCO(RSEL,DCO+1)/fDCO(RSEL,DCO) Measured at SMCLK output 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 8.6 15.25 21 1.35 1.08 50 4.3 7.8 13.9 0.8 1.6 2.3 3.4 4.25 7.3 TEST CONDITIONS VCC MIN 1.8 2.2 3 0.096 0.12 0.15 0.21 0.30 0.41 0.58 0.80 1.5 TYP MAX 3.6 3.6 3.6 UNIT V V V MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz ratio ratio %
22
MSP430G2231-EP
Calibrated DCO Frequencies Tolerance

PARAMETER 1-MHz tolerance over temperature (1) 1-MHz tolerance over VCC TEST CONDITIONS BCSCTL1= CALBC1_1MHz, DCOCTL = CALDCO_1MHz, calibrated at 30C and 3 V BCSCTL1= CALBC1_1MHz, DCOCTL = CALDCO_1MHz, calibrated at 30C and 3 V BCSCTL1= CALBC1_1MHz, DCOCTL = CALDCO_1MHz, calibrated at 30C and 3 V TA -40C to 105C VCC 3V MIN -3 TYP 0.5 MAX +3 UNIT %
30C
1.8 V to 3.6 V
-3
+3
1-MHz tolerance overall (1)
-40C to 105C
1.8 V to 3.6 V
-6
+6
This is the frequency change from the measured frequency at 30C over temperature.
Wake-Up From Lower-Power Modes (LPM3/4) Electrical Characteristics

PARAMETER tDCO,LPM3/4 tCPU,LPM3/4 (1) (2) DCO clock wake-up time from LPM3/4 (1) CPU wake-up time from LPM3/4 (2) TEST CONDITIONS BCSCTL1= CALBC1_1MHz, DCOCTL = CALDCO_1MHz VCC 3V MIN TYP 1.5 1/fMCLK + tClock,LPM3/4 MAX UNIT s
The DCO clock wake-up time is measured from the edge of an external wake-up signal (for example, port interrupt) to the first clock edge observable externally on a clock pin (MCLK or SMCLK). Parameter applicable only if DCOCLK is used for MCLK.
Typical Characteristics DCO Clock Wake-Up Time From LPM3/4
10.00 DCO Wake Time s
RSELx = 0...11 1.00 RSELx = 12...15
0.10 0.10
1.00 DCO Frequency MHz
10.00
Figure 14. DCO Wake-Up Time From LPM3 vs DCO Frequency
23
MSP430G2231-EP
Crystal Oscillator, XT1, Low-Frequency Mode (1)

over recommended ranges of supply voltage and operating free-air temperature, TA = 105C (unless otherwise noted)
PARAMETER fLFXT1,LF fLFXT1,LF,logic LFXT1 oscillator crystal frequency, LF mode 0, 1 TEST CONDITIONS XTS = 0, LFXT1Sx = 0 or 1 VCC 1.8 V to 3.6 V 1.8 V to 3.6 V 10000 MIN TYP 32768 32768 50000 MAX UNIT Hz Hz
LFXT1 oscillator logic level square wave input frequency, XTS = 0, XCAPx = 0, LFXT1Sx = 3 LF mode LFXT1 oscillator logic level XTS = 0, XCAPx = 0, LFXT1Sx = 3, square wave input frequency, TA = -40C to 125C LF mode Oscillation allowance for LF crystals XTS = 0, LFXT1Sx = 0, fLFXT1,LF = 32768 Hz, CL,eff = 6 pF XTS = 0, LFXT1Sx = 0, fLFXT1,LF = 32768 Hz, CL,eff = 12 pF XTS = 0, XCAPx = 0 XTS = 0, XCAPx = 1 XTS = 0, XCAPx = 2 XTS = 0, XCAPx = 3 Duty cycle, LF mode XTS = 0, Measured at P2.0/ACLK, fLFXT1,LF = 32768 Hz XTS = 0, XCAPx = 0, LFXT1Sx = 3 (4)
fLFXT1,LF,logic
1.8 V to 3.6 V
32768 500
Hz
OALF
k 200 1 5.5 8.5 11 2.2 V 2.2 V 30 10 50 70 10000 % Hz pF
CL,eff
Integrated effective load capacitance, LF mode (2)
fFault,LF (1)
Oscillator fault frequency, LF mode (3)
(2)
(3) (4)
To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter. Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)

PARAMETER fVLO dfVLO/dT VLO frequency VLO frequency temperature drift TA -40C to 85C 125C -40C to 125C 25C VCC 3V 3V 1.8 V to 3.6 V MIN 4 TYP 12 0.5 4 MAX 20 23 UNIT kHz %/C %/V
dfVLO/dVCC VLO frequency supply voltage drift
Timer_A
PARAMETER fTA tTA,cap Timer_A input clock frequency Timer_A capture timing TEST CONDITIONS Internal: SMCLK, ACLK External: TACLK, INCLK Duty cycle = 50% 10% TA0, TA1 3V 20 VCC MIN TYP fSYSTEM MAX UNIT MHz ns
24
MSP430G2231-EP
USI, Universal Serial Interface

PARAMETER fUSI VOL,I2C USI clock frequency Low-level output voltage on SDA and SCL TEST CONDITIONS External: SCLK, Duty cycle = 50% 10%, SPI slave mode USI module in I2C mode, I(OLmax) = 1.5 mA 3V VSS VCC MIN TYP fSYSTEM VSS + 0.4 MAX UNIT MHz V
Typical Characteristics USI Low-Level Output Voltage on SDA and SCL

5.0 VCC = 2.2 V I OL Low-Level Output Current mA 4.0 IOL Low-Level Output Current mA TA = 25C 4.0 5.0 VCC = 3 V TA = 25C
3.0 TA = 85C 2.0
3.0
TA = 85C
2.0
1.0
1.0
0.0 0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.0
0.2
0.4
0.6
0.8
1.0
VOL Low-Level Output Voltage V
VOL Low-Level Output Voltage V
Figure 15. USI Low-Level Output Voltage vs Output Current
Figure 16. USI Low-Level Output Voltage vs Output Current
25
MSP430G2231-EP
10-Bit ADC, Power Supply and Input Range Conditions

PARAMETER VCC VAx Analog supply voltage Analog input voltage
(2)
TEST CONDITIONS VSS = 0 V All Ax terminals, Analog inputs selected in ADC10AE register fADC10CLK = 5.0 MHz, ADC10ON = 1, REFON = 0, ADC10SHT0 = 1, ADC10SHT1 = 0, ADC10DIV = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REF2_5V = 0, REFON = 1, REFOUT = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REF2_5V = 1, REFON = 1, REFOUT = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REFON = 1, REF2_5V = 0, REFOUT = 1, ADC10SR = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REFON = 1, REF2_5V = 0, REFOUT = 1, ADC10SR = 1 Only one terminal Ax can be selected at one time 0 V VAx VCC
TA
VCC
MIN 2.2
TYP
MAX 3.6 VCC
UNIT V V
3V -40C to 125C
IADC10
ADC10 supply current
(3)
3V
0.6
1.64
mA
0.25 -40C to 125C 3V 0.25 -40C to 85C -40C to 125C -40C to 85C -40C to 125C -40C to 125C -40C to 125C 1.1 3V
0.84 mA 0.84 1.4 mA 3.8
IREF+
Reference supply current, reference buffer disabled (4)
IREFB,0
Reference buffer supply current with ADC10SR = 0 (4)
IREFB,1
Reference buffer supply current with ADC10SR = 1 (4)
0.5 3V
0.7 mA 0.9
CI RI (1) (2) (3) (4)
Input capacitance Input MUX ON resistance
3V 3V 1000
27 2000
pF
The leakage current is defined in the leakage current table with Px.y/Ax parameter. The analog input voltage range must be within the selected reference voltage range VR+ to VR for valid conversion results. The internal reference supply current is not included in current consumption parameter IADC10. The internal reference current is supplied via terminal VCC. Consumption is independent of the ADC10ON control bit, unless a conversion is active. The REFON bit enables the built-in reference to settle before starting an A/D conversion.
26
MSP430G2231-EP
10-Bit ADC, Built-In Voltage Reference

PARAMETER VCC,REF+ VREF+ ILD,VREF+ Positive built-in reference analog supply voltage range Positive built-in reference voltage Maximum VREF+ load current (1) (2) IVREF+ = 500 A 100 A, Analog input voltage VAx 0.75 V, REF2_5V = 0 IVREF+ = 500 A 100 A, Analog input voltage VAx 1.25 V, REF2_5V = 1 IVREF+ = 100 A900 A, VAx 0.5 VREF+, Error of conversion result 1 LSB, ADC10SR = 0 IVREF+ 1 mA, REFON = 1, REFOUT = 1 IVREF+ = const with 0 mA IVREF+ 1 mA IVREF+ = 0.5 mA, REF2_5V = 0, REFON = 0 1 IVREF+ = 0.5 mA, REF2_5V = 1, REFON = 1, REFBURST = 1, ADC10SR = 0 TEST CONDITIONS IVREF+ 1 mA, REF2_5V = 0 IVREF+ 1 mA, REF2_5V = 1 IVREF+ IVREF+max, REF2_5V = 0 IVREF+ IVREF+max, REF2_5V = 1 3V 3V VCC MIN 2.2 3 1.4 2.34 1.5 2.5 1.59 2.65 1 TYP MAX UNIT V
V mA
2 3V 2 LSB
VREF+ load regulation
(1)
VREF+ load regulation response time (1) (2) Maximum capacitance at pin VREF+ (1) (2) Temperature coefficient Settling time of internal reference voltage to 99.9% VREF (1) (2) Settling time of reference buffer to 99.9% VREF (1) (2)
3V
400
ns
CVREF+ TCREF+ tREFON
3V 3V
100 190
pF ppm/ C s
3.6 V
30
tREFBURST
3V
(1) (2)
Minimum and maximum parameters are characterized up to TA = 105C, unless otherwise noted. Characterized at TA = -40C to 105C only.
27
MSP430G2231-EP
10-Bit ADC, External Reference (1)

over recommended ranges of supply voltage and operating free-air temperature, TA = 105C (unless otherwise noted)
PARAMETER Positive external reference input voltage range (2) Negative external reference input voltage range (4) Differential external reference input voltage range, VEREF = VEREF+ VEREF TEST CONDITIONS VEREF+ > VEREF, SREF1 = 1, SREF0 = 0 VEREF VEREF+ VCC 0.15 V, SREF1 = 1, SREF0 = 1 (3) VEREF+ > VEREF VEREF+ > VEREF
(5)
VCC
MIN 1.4 1.4 0 1.4
TYP
MAX VCC
UNIT
VEREF+
V 3 1.2 VCC 1 A 3V 3V 0 1 A V V
VEREF VEREF
IVEREF+
Static input current into VEREF+
0 V VEREF+ VCC, SREF1 = 1, SREF0 = 0 0 V VEREF+ VCC 0.15 V 3 V, SREF1 = 1, SREF0 = 1 (3) 0 V VEREF VCC
3V
IVEREF (1) (2) (3) (4) (5)
Static input current into VEREF
The external reference is used during conversion to charge and discharge the capacitance array. The input capacitance, CI, is also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the recommendations on analog-source impedance to allow the charge to settle for 10-bit accuracy. The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced accuracy requirements. Under this condition the external reference is internally buffered. The reference buffer is active and requires the reference buffer supply current IREFB. The current consumption can be limited to the sample and conversion period with REBURST = 1. The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits the minimum external differential reference voltage. Lower differential reference voltage levels may be applied with reduced accuracy requirements.
10-Bit ADC, Timing Parameters

PARAMETER fADC10CLK fADC10OSC ADC10 input clock frequency ADC10 built-in oscillator frequency TEST CONDITIONS For specified performance of ADC10 linearity parameters ADC10SR = 0 ADC10SR = 1 VCC 3V 3V 3V MIN 0.45 0.45 3.7 2.06 13 ADC10DIV 1/fADC10CLK 100 TYP MAX 6.3 1.5 6.3 3.51 s UNIT MHz MHz
ADC10DIVx = 0, ADC10SSELx = 0, fADC10CLK = fADC10OSC ADC10 built-in oscillator, ADC10SSELx = 0, fADC10CLK = fADC10OSC
tCONVERT
Conversion time
fADC10CLK from ACLK, MCLK, or SMCLK, ADC10SSELx 0

(1)
tADC10ON (1)
Turn-on settling time of the ADC
ns
The condition is that the error in a conversion started after tADC10ON is less than 0.5 LSB. The reference and input signal are already settled.
10-Bit ADC, Linearity Parameters

PARAMETER EI ED EO EG ET Integral linearity error Differential linearity error Offset error Gain error Total unadjusted error Source impedance RS < 100 TEST CONDITIONS VCC 3V 3V 3V 3V 3V 1.1 2 MIN TYP MAX 1 1 1 2 5 UNIT LSB LSB LSB LSB LSB
28
MSP430G2231-EP
10-Bit ADC, Temperature Sensor and Built-In VMID

PARAMETER ISENSOR TCSENSOR tSensor(sample) IVMID VMID tVMID(sample) (1) (2) Sample time required if channel 10 is selected (3) Current into divider at channel 11 VCC divider at channel 11 Sample time required if channel 11 is selected (5) Temperature sensor supply current (1) TEST CONDITIONS REFON = 0, INCHx = 0Ah, TA = 25C ADC10ON = 1, INCHx = 0Ah
(2)
VCC 3V 3V 3V 3V 3V 3V
MIN
TYP 60 3.55
MAX
UNIT A mV/C s
ADC10ON = 1, INCHx = 0Ah, Error of conversion result 1 LSB ADC10ON = 1, INCHx = 0Bh ADC10ON = 1, INCHx = 0Bh, VMID 0.5 VCC ADC10ON = 1, INCHx = 0Bh, Error of conversion result 1 LSB
30
(4)
A V ns
1.5 1220
(3) (4) (5)
The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is high). When REFON = 1, ISENSOR is included in IREF+. When REFON = 0, ISENSOR applies during conversion of the temperature sensor input (INCH = 0Ah). The following formula can be used to calculate the temperature sensor output voltage: VSensor,typ = TCSensor (273 + T [C] ) + VOffset,sensor [mV] or VSensor,typ = TCSensor T [C] + VSensor(TA = 0C) [mV] The typical equivalent impedance of the sensor is 51 k. The sample time required includes the sensor-on time tSENSOR(on). No additional current is needed. The VMID is used during sampling. The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
Flash Memory
PARAMETER VCC(PGM/ERASE) fFTG IPGM IERASE tCPT tCMErase Program and erase supply voltage Flash timing generator frequency Supply current from VCC during program Supply current from VCC during erase Cumulative program time
(1)
TEST CONDITIONS
VCC
MIN 2.2 257
TYP
MAX 3.6 476
UNIT V kHz mA mA ms ms
3V 3V 2.2 V/3.6 V 2.2 V/3.6 V -40C TJ 105C TJ = 25C

(2) (2) (2) (2) (2) (2)
1 1 20 104 15 30 25 18 6 10593 4819 105
5 7 10
Cumulative mass erase time Program/erase endurance
cycles years tFTG tFTG tFTG tFTG tFTG tFTG
tRetention tWord tBlock,

0
Data retention duration Word or byte program time Block program time for first byte or word Block program time for each additional byte or word Block program end-sequence wait time Mass erase time Segment erase time
tBlock, 1-63 tBlock,

End
tMass Erase tSeg Erase (1) (2)
The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming methods: individual word/byte write and block write modes. These values are hardwired into the Flash Controller's state machine (tFTG = 1/fFTG).
29
MSP430G2231-EP
RAM
PARAMETER V(RAMh) (1) RAM retention supply voltage
(1)
TEST CONDITIONS CPU halted
MIN 1.6
MAX
UNIT V
This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface

PARAMETER fSBW tSBW,Low tSBW,En tSBW,Ret fTCK RInternal (1) (2) Spy-Bi-Wire input frequency Spy-Bi-Wire low clock pulse length Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge (1)) Spy-Bi-Wire return to normal operation time TCK input frequency (2) Internal pulldown resistance on TEST TA = -40C to 105C TA = -40C to 105C TEST CONDITIONS VCC 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 2.2 V 3V 2.2 V/3 V 15 0 0 25 60 MIN 0 0.025 TYP MAX 20 15 1 100 5 10 90 UNIT MHz s s s MHz MHz k
Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWCLK pin high before applying the first SBWCLK clock edge. fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse (1)

TA = 25C, over recommended ranges of supply voltage (unless otherwise noted)
PARAMETER VCC(FB) VFB IFB tFB (1) Supply voltage during fuse-blow condition Voltage level on TEST for fuse blow Supply current into TEST during fuse blow Time to blow fuse TEST CONDITIONS MIN 2.5 6 7 100 1 MAX UNIT V V mA ms
Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to bypass mode.
30
MSP430G2231-EP
APPLICATION INFORMATION Port P1 Pin Schematic: P1.0 to P1.2, Input/Output With Schmitt Trigger
To ADC10 INCHx
ADC10AE0.y
PxSEL.y PxDIR.y 1 0
Direction 0: Input 1: Output
PxREN.y
PxSEL.y
DVSS DVCC
0 1 1
PxOUT.y ACLK
0 1 Bus Keeper EN P1.0/TA0CLK/ACLK/A0 P1.1/TA0.0/A1 P1.2/TA0.1/A2
PxIN.y
To Module
PxIE.y PxIRQ.y Q Set PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select EN
Table 14. Port P1 (P1.0 to P1.2) Pin Functions

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.0/ TA0CLK/ ACLK/ A0 P1.1/ TA0.0/ A1 1 0 x P1.x (I/O) TA0.TACLK ACLK A0 P1.x (I/O) TA0.0 TA0.CCI0A A1 FUNCTION P1DIR.x I: 0; O: 1 0 1 X I: 0; O: 1 1 0 X P1SEL.x 0 1 1 X 0 1 1 X ADC10AE.x (INCH.y = 1) 0 0 0 1 (y = 0) 0 0 0 1 (y = 1)
31
MSP430G2231-EP
Table 14. Port P1 (P1.0 to P1.2) Pin Functions (continued)

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.2/ TA0.1/ A2/ 2 x P1.x (I/O) TA0.1 TA0.CCI1A A2 FUNCTION P1DIR.x I: 0; O: 1 1 0 X P1SEL.x 0 1 1 X ADC10AE.x (INCH.y = 1) 0 0 0 1 (y = 2)
32
MSP430G2231-EP
Port P1 Pin Schematic: P1.3, Input/Output With Schmitt Trigger

SREF2 To ADC10 VREF0 1 VSS
To ADC10 INCHx = y
ADC10AE0.y
PxSEL.y
PxDIR.y
1 0
PxREN.y
PxSEL.y
DVSS DVCC
0 1 1
PxOUT.y ADC10CLK
0 1 Bus Keeper EN
P1.3/ADC10CLK/A3/VREF-/VEREF-
PxIN.y EN To Module D PxIE.y PxIRQ.y Q Set PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select EN
Table 15. Port P1 (P1.3) Pin Functions

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.3/ ADC10CLK/ A3/ VREF-/ VEREF3 x P1.x (I/O) ADC10CLK A3 VREFVEREFFUNCTION P1DIR.x I: 0; O: 1 1 X X X P1SEL.x 0 1 X X X ADC10AE.x (INCH.x = 1) 0 0 1 (y = 3) 1 1
33
MSP430G2231-EP

To ADC10 VREF+ To ADC10 INCHx = y
ADC10AE0.y PxSEL.y
PxDIR.y
1 0
PxREN.y
PxSEL.y
DVSS DV CC
0 1 1
PxOUT.y SMCLK
0 1 Bus Keeper EN
P1.4/SMCLK/A4/VREF+/VEREF+/TCK
PxIN.y
To Module PxIE.y PxIRQ.y EN Q Set PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select
From JTAG
To JTAG

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.4/ SMCLK/ A4/ VREF+/ VEREF+/ TCK 4 x P1.x (I/O) SMCLK A4 VREF+ VEREF+ TCK FUNCTION P1DIR.x I: 0; O: 1 1 X X X X P1SEL.x 0 1 X X X X ADC10AE.x (INCH.x = 1) 0 0 1 (y = 4) 1 1 0 JTAG Mode 0 0 0 0 0 1
34
MSP430G2231-EP

To ADC10 INCHx ADC10AE0.y PxSEL.y
PxDIR.y
1 0
PxREN.y
PxSEL.y
DVSS DVCC
0 1 1
PxOUT.y From Module
0 1 Bus Keeper EN P1.5/TA0.0/A5/TMS
PxIN.y
To Module PxIE.y PxIRQ.y Q Set PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select EN
From JTAG
To JTAG

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.5/ TA0.0/ A5/ SCLK/ TMS 5 x P1.x (I/O) TA0.0 A5 SCLK TMS FUNCTION P1DIR.x I: 0; O: 1 1 X X X P1SEL.x 0 1 X X X USIP.x 0 0 X 1 0 ADC10AE.x (INCH.x = 1) 0 0 1 (y = 5) 0 0 JTAG Mode 0 0 0 0 1
35
MSP430G2231-EP

To ADC10 INCHx ADC10AE0.y USIPE6
PxDIR.y from USI
1 0
PxREN.y
PxSEL.y or USIP E6
DVSS DV CC
0 1 1
PxOUT.y From USI
0 1 Bus Keeper EN PxSEL.y P1.6/TA0.1/SDO/SCL/A6/TDI
PxIN.y
To Module
PxIE.y PxIRQ.y Q Set PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select EN
From JTAG
To JTAG
USI in I2C mode: Output driver drives low level only. Driver is disabled in JTAG mode.

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.6/ TA0.1/ A6/ SDO/ TDI/TCLK 6 x P1.x (I/O) TA0.1 TA0.CCR1B A6 SDO TDI/TCLK FUNCTION P1DIR.x I: 0; O: 1 1 0 X X X P1SEL.x 0 1 1 X X X USIP.x 0 0 0 0 1 0 ADC10AE.x (INCH.x = 1) 0 0 0 1 (y = 6) 0 0 JTAG Mode 0 0 0 0 0 1
36
MSP430G2231-EP

To ADC10 INCHx ADC10AE0.y USIPE7
PxDIR.y from USI
1 0
PxSEL.y PxREN.y
PxSEL.y or USIPE7
DVSS DVCC
0 1 1
PxOUT.y From USI
0 1 Bus Keeper EN PxSEL.y P1.7/SDI/SDA/A7/TDO/TDI
PxIN.y
To Module
PxIE.y PxIRQ.y EN Q Set PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select
From JTAG
To JTAG From JTAG
To JTAG
USI in I2C mode: Output driver drives low level only. Driver is disabled in JTAG mode.

CONTROL BITS / SIGNALS PIN NAME (P1.x) P1.7/ A7/ SDI/SDO TDO/TDI 7 x P1.x (I/O) A7 SDI/SDO TDO/TDI FUNCTION P1DIR.x I: 0; O: 1 X X X P1SEL.x 0 X X X USIP.x 0 0 1 0 ADC10AE.x (INCH.x = 1) 0 1 (y = 7) 0 0 JTAG Mode 0 0 0 1
37
MSP430G2231-EP
XOUT/P2.7 LF off PxSEL.6 PxSEL.7
BCSCTL3.LFXT1Sx = 11 LFXT1CLK 0
PxSEL.6
PxDIR.y
1 0
PxREN.y
PxSEL.6
DV SS DV CC
0 1 1
PxOUT.y from Module
0 1 Bus Keeper EN
XIN/P2.6/TA0.1
PxIN.y
To Module

PIN NAME (P2.x) XIN P2.6 TA0.1 (1) 6 x XIN P2.x (I/O) TA0.1 (1) FUNCTION CONTROL BITS / SIGNALS P2DIR.x 0 I: 0; O: 1 1 P2SEL.6 1 0 1 P2SEL.7 1 X X
BCSCTL3.LFXT1Sx = 11 is required.
38
MSP430G2231-EP
XIN/P2.6/TA0.1 LF off PxSEL.6 PxSEL.7
BCSCTL3.LFXT1Sx = 11 LFXT1CLK 0
PxSEL.7
from P2.6/XIN
PxDIR.y
1 0
PxREN.y
PxSEL.7
DVSS DV CC
0 1 1
PxOUT.y from Module
0 1 Bus Keeper EN
XOUT/P2.7
PxIN.y
To Module

PIN NAME (P2.x) XOUT P2.7 x 7 XOUT P2.x (I/O) FUNCTION CONTROL BITS / SIGNALS P2DIR.x 1 I: 0; O: 1 P2SEL.6 1 X P2SEL.7 1 0
39
PACKAGE OPTION ADDENDUM
www.ti.com
27-Feb-2013
PACKAGING INFORMATION
Orderable Device MSP430G2231QPW1EP MSP430G2231QPW1REP V62/12621-01XE-T
(1)
Status
(1)
Package Type Package Pins Package Qty Drawing TSSOP TSSOP TSSOP PW PW PW 14 14 14 90 2000 90
Eco Plan
(2)
Lead/Ball Finish Call TI Call TI Call TI
MSL Peak Temp

(3)
Op Temp (C) -40 to 125 -40 to 125 -40 to 125
Top-Side Markings
(4)
Samples
ACTIVE PREVIEW ACTIVE
TBD TBD TBD
Call TI Call TI Call TI
G2231EP G2231EP G2231EP
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Only one of markings shown within the brackets will appear on the physical device.
(4)
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MSP430G2231-EP :
Catalog: MSP430G2231
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Feb-2013
Automotive: MSP430G2231-Q1
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. 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MSP430G2231-EP

www.ti.com SLAS862 JUNE 2012

MIXED SIGNAL MICROCONTROLLER

SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS

Custom temperature ranges available

Copyright 2012, Texas Instruments Incorporated

Table 1. Available Options

Table 2. ORDERING INFORMATION (1)

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P1.1/TA0.0/A1 P1.2/TA0.1/A2 P1.3/ADC10CLK/A3/VREF-/VEREFP1.4/SMCLK/A4/VREF+/VEREF+/TCK P1.5/TA0.0/A5/SCLK/TMS

DVSS XIN/P2.6/TA0.1 XOUT/P2.7 TEST/SBWTCK RST/NMI/SBWTDIO P1.7/A7/SDI/SDA/TDO/TDI P1.6/TA0.1/A6/SDO/SCL/TDI/TCLK

Functional Block Diagram

16MHz CPU incl. 16 Registers

Emulation 2BP JTAG Interface Spy-Bi Wire RST/NMI Brownout Protection

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Table 3. Terminal Functions

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SHORT-FORM DESCRIPTION CPU

Table 4. Instruction Word Formats

Table 5. Address Mode Descriptions (1)

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Interrupt Vector Addresses

(non)-maskable (non)-maskable (non)-maskable

0FFFCh 0FFFAh 0FFF8h 0FFF6h

Watchdog Timer+ Timer_A2 Timer_A2

WDTIFG TACCR0 CCIFG

maskable maskable maskable

0FFF4h 0FFF2h 0FFF0h 0FFEEh 0FFECh

TACCR1 CCIFG, TAIFG (2) (4)

maskable maskable maskable maskable

0FFEAh 0FFE8h 0FFE6h 0FFE4h 0FFE2h 0FFE0h

See (1) (2) (3) (4) (5)

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Special Function Registers (SFRs)

Table 7. Interrupt Enable Register 1 and 2

Table 8. Interrupt Flag Register 1 and 2

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Peripheral File Map Table 12. Peripherals With Word Access

Table 13. Peripherals With Byte Access

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Table 13. Peripherals With Byte Access (continued)

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Absolute Maximum Ratings (1)